PowerFLOW

Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.

Kombyne™ is an innovative new SaaS high-performance computing (HPC) workflow tool, initially developed for customers in the defense, automotive, and aerospace industries and academic research. It allows users to subscribe to a range of workflow solutions for HPC CFD jobs, from on-the-fly extract generation and rendering to simulation steering. Interactive monitoring and control are also available, all with minimal simulation disruption and no reliance on VTK. The need for large files is eliminated via extract workflows and real-time visualization. An in-transit workflow uses a separate process that quickly receives data from the solver code and performs visualization and analysis without interfering with the running solver. This process, called an endpoint, can directly output extracts, cutting planes or point samples for data science and can render images as well. The Endpoint can also act as a bridge to popular visualization codes.