Introduction to Material

Science and Engineering

g g
Lec (1) Introduction
Lec.

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 Acknowledgement

This material is prepared with aid of

several internet sources to whom our
thanks are due, among which are:
• Materials Science and Engineering: An
Introduction,, W.D. Callister,, Jr.,,
educational website.
• Material from University of Virginia
website.
• And others. I. El Mahallawi; Material Science,
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I. El Mahallawi; Material Science,
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 Structure, Processing,
g & Properties
p
• Properties depend on structure
ex: hardness vs structure of steel

(d)
600
30 µm
500 (c)
Data obtained from Figs. 10.30(a)
N)
ess (BHN

400 (b) andd 10.32

10 32 withith 4 wt%
t% C composition,
iti
(a) and from Fig. 11.14 and associated
4 µm discussion, Callister 7e.
300 Micrographs adapted from (a) Fig.
10.19; ((b)) Fig.
g 9.30;(c)
( ) Fig.
g 10.33;
30 µm
Hardne

30 µm and (d) Fig. 10.21, Callister 7e.

200
100
0 01 0.1
0.01 01 1 10 100 1000
Cooling Rate (ºC/s)
• Processing
g can change
g structure
ex: structure vsI. cooling rate of steel
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 Types
ypes o
of Materials
ate a s
• Metals:
– Strong, ductile
– high thermal & electrical conductivity
– opaque, reflective.

• Polymers/plastics: Covalent bonding Æ sharing of e’s

– Soft, ductile, low strength, low density
– thermal & electrical insulators
– Optically translucent or transparent.

• Ceramics: ionic bonding (refractory) – compounds of metallic

& non-metallic elements (oxides, carbides, nitrides, sulfides)
– Brittle,
Brittle glassy
glassy, elastic
– non-conducting (insulators)

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 The Materials Selection
P
Process
Pick Application Determine required Properties
1.
Properties: mechanical, electrical, thermal,
magnetic, optical, deteriorative.

Properties Identify candidate Material(s)

2.
Material: structure, composition.

Material Identify required Processing

3
3.
Processing: changes structure and overall shape
ex: casting
casting, sintering
sintering, vapor deposition
deposition, doping
forming, joining, annealing.

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 ELECTRICAL
C C
• Electrical Resistivity of Copper:

6 Adapted from Fig. 18.8, Callister 7e.

(Fig. 18.8 adapted from: J.O. Linde,
5 Ann Physik 5, 219 (1932); and
C.A. Wert and R.M. Thomson,
Ph i off S
Physics Solids
lid , 2nd
2 d edition,
diti
Ohm-m)

4 McGraw-Hill Company, New York,

Resistivvity, ρ

1970.)

3
(10-8 O

2
1
0 T ((°C)
C)
-200
200 -100
100 0
• Adding “impurity” atoms to Cu increases resistivity.
• Deforming Cu increases resistivity.
resistivity
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 THERMAL
• Space Shuttle Tiles: • Thermal Conductivity
--Silica fiber insulation of Copper:
offers low heat conduction. --It decreases when
you add zinc!
Adapted from chapter-
opening photograph,
Chapter 19, Callister 7e.
(C t
(Courtesy off Lockheed
L kh d 400

nductivity
Missiles and Space
Company, Inc.)
300

(W/m--K)
Therrmal Con
200

100
0
0 10 20 30 40
Composition (wt% Zinc)
Adapted from
f Adapted from
f Fig. 19.4, Callister
C 7e.
Fig. 19.4W, Callister (Fig. 19.4 is adapted from Metals Handbook:
6e. (Courtesy of Properties and Selection: Nonferrous alloys and
Lockheed Aerospace Pure Metals, Vol. 2, 9th ed., H. Baker,
Ceramics Systems,
y , ((Managing
g g Editor),), American Society y for Metals,,
Sunnyvale, CA) 1979, p. 315.)
(Note: "W" denotes fig.
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 MAGNETIC
G C
• Magnetic Storage:
• Magnetic Permeability
--Recording medium vs. Composition:
is magnetized by --Adding 3 atomic % Si
recording head. makes Fe a better
recording medium!

gnetization
Fe+3%Si

Fe

Mag
Magnetic Field
Adapted from C.R. Barrett, W.D. Nix, and
Fig. 20.23, Callister 7e. A.S. Tetelman, The Principles of
(Fig. 20.23 is from J.U. Lemke, MRS Bulletin, Engineering Materials, Fig. 1-7(a), p. 9,
Vol. XV, No. 3, p. 31, 1990.) 1973. Electronically reproduced
by permission of Pearson Education
Education, Inc
Inc.,
Upper Saddle River, New Jersey.
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 OPTICAL
O C
• Transmittance:
--Aluminum oxide may be transparent, translucent, or
opaque depending on the material structure.

polycrystal: polycrystal:
single crystal low porosity high porosity

Adapted from Fig

Fig. 1.2,
12
Callister 7e.
(Specimen preparation,
P.A. Lessing; photo by S.
Tanner.)

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 M h i lP
Mechanical Properties
ti
• Mechanical properties of material describe the
behaviour of materials when subjected to loading
conditions: static tensile, static compressive,
bending, shear, torsion, or dynamic, at low, room, or
high temperatures.
• These properties usually express the material
behaviour categorized mainly under two distinct
properties: Strength, or Toughness.

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I. El Mahallawi; Material Science,
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 DETERIORATIVE
O
• Stress & Saltwater... • Heat treatment: slows
--causes cracks! crack speed
p in salt water!

ed (m/s)
10-8 “as-is”
“held at
160ºC
160 C for 1 hr

crrack spee
before testing”
10-10 Alloy 7178 tested in
saturated aqueous NaCl
solution at 23ºC

i
increasing
i lload
d
Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation and
Fracture Mechanics of Engineering Materials" (4th ed.), p. 505, John
Adapted
p from chapter-opening
p p gpphotograph,
g p Wiley and Sons, 1996. (Original source: Markus O. Speidel, Brown
Chapter 17, Callister 7e. Boveri Co.)
(from Marine Corrosion, Causes, and
Prevention, John Wiley and Sons, Inc., 1975.) 4 µm
--material:
7150-T651
7150 T651 Al "alloy"
alloy
(Zn,Cu,Mg,Zr)

Adapted from FigFig. 11.26,

11 26
Callister 7e. (Fig. 11.26 provided courtesy of G.H.
Narayanan
I. El Mahallawi; Material and A.G. Miller, Boeing Commercial
Science,
Airplane
BUE Company.)