ESP-WROOM-32 Datasheet

Espressif Systems
October 29, 2016
About This Guide
This document lists the specifications for the ESP-WROOM-32 module.
The document structure is as follows:
Chapter Title Subject
Chapter 1 Preface A preview of ESP-WROOM-32
Chapter 2 Pin Definitions Device pinout and pin descriptions
Chapter 3 Functional Description Description of major functional modules and protocols
Chapter 4 Electrical Characteristics Electrical characteristics and specifications for ESP-WROOM-32
Chapter 5 Schematics The schematics of ESP-WROOM-32

Release Notes
Date Version Release notes
2016.08 V1.0 First release
2016.09 V1.1 Updated Chapter 5: Schematics

Disclaimer and Copyright Notice

Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS
PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABIL-
ITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE
ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this docu-
ment is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights
are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective
owners, and are hereby acknowledged.
Copyright © 2016 Espressif Inc. All rights reserved.
 Contents

1 Preface 1

2 Pin Definitions 3
2.1 Pin Layout 3
2.2 Pin Description 4
2.3 Strapping Pins 5

3 Functional Description 6
3.1 CPU and Internal Memory 6
3.2 External Flash and SRAM 6
3.3 Crystal Oscillators 6
3.4 Power Consumption 7
3.5 Peripheral Interface Description 8

4 Electrical Characteristics 13
4.1 Absolute Maximum Ratings 13
4.2 Recommended Operating Conditions 13
4.3 Digital Terminal Characteristics 13
4.4 Wi-Fi Radio 14
4.5 Bluetooth LE Radio 14
4.5.1 Receiver 14
4.5.2 Transmit 15
4.6 Reflow Profile 15

5 Schematics 16
List of Tables
1 ESP-WROOM-32 Specifications 2
2 ESP-WROOM-32 Dimensions 3
3 ESP-WROOM-32 Pin Definitions 4
4 Strapping Pins 5
5 Power Consumption by Power Modes 7
6 Interface Description 8
7 Absolute Maximum Ratings 13
8 Recommended Operating Conditions 13
9 Digital Terminal Characteristics 13
10 Wi-Fi Radio Characteristics 14
11 Receiver Characteristics - BLE 14
12 Transmit Characteristics - BLE 15
13 Reflow Profile 15
List of Figures
1 Top and Side View of ESP-WROOM-32 3
2 ESP-WROOM-32 Schematics 16
 1 PREFACE

1. Preface
ESP-WROOM-32 is a powerful, generic WiFi-BT-BLE MCU module that targets a wide variety of applications
ranging from low power sensor networks to the most demanding tasks such as voice encoding, music streaming
and MP3 decoding.

At the core of this module is the ESP32 chip, which is designed to be scalable and adaptive. There are 2 CPU cores
that can be individually controlled or powered, and the clock frequency is adjustable from 80 MHz to 240 MHz. The
user may also power off the CPU and make use of the low power coprocessor to constantly monitor the peripherals
for changes or crossing of thresholds. ESP32 integrates a rich set of peripherals, ranging from capacitive touch
sensors, Hall sensors, low noise sense amplifiers, SD card interface, Ethernet, high speed SDIO/SPI, UART, I2S
and I2C.

The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that it is future proof: using Wi-Fi allows a large physical range and direct connection to the internet through a
Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast low energy
beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for battery
powered and wearable electronics applications. ESP-WROOM-32 supports data rates up to 150 Mbps, and 22
dBm output power at the PA to ensure the widest physical range. As such the chip does offer industry leading
specifications and the best optimized performance for electronic integration, range and power consumption, and
connectivity.

The operating system chosen for ESP32 is freeRTOS with LWIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that developers can continually upgrade
their products even after their release. The software releases are covered under the ESP32 bug bounty program
and any bugs can be reported to [email protected]. As the SDK of ESP-WROOM-32 or ESP32 is open-
source, the user can build his own platforms and operating systems. For more in-depth discussion of this, the
developer can contact [email protected].

ESP-WROOM-32 has Espressif’s long term support — ESP32 will be covered under Espressif’s longevity program
and be available for the next 12 years. The design of ESP-WROOM-32 will be open-source when it has been fully
optimized. Feedbacks about the module, chip, API or firmware can be sent to [email protected].

Table 1 provides the specifications of ESP-WROOM-32.

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 1 PREFACE

Table 1: ESP-WROOM-32 Specifications

Categories Items Specifications

Standards FCC, CE, TELEC, KCC
802.11 b/g/n/d/e/i/k/r (802.11n up to 150 Mbps)
Wi-Fi Protocols A-MPDU and A-MSDU aggregation and 0.4 µs
guard interval support
Frequency range 2.4 ~ 2.5 GHz
Protocols Bluetooth v4.2 BR/EDR and BLE specification
NZIF receiver with -98 dBm sensitivity
Bluetooth Radio Class-1, class-2 and class-3 transmitter
AFH
Audio CVSD and SBC
SD card, UART, SPI, SDIO, I2C, LED PWM, Motor
PWM, I2S, I2C, IR
Module interface
GPIO, capacitive touch sensor, ADC, DAC, LNA
pre-amplier
On-chip sensor Hall sensor, temperature sensor
Hardware On-board clock 26 MHz crystal, 32 kHz crystal
Operating voltage 2.2 ~ 3.6V
Operating current Average: 80 mA
Operating temperature range -40°C ~ 85°C *
Ambient temperature range Normal temperature
Package size 18 mm x 20 mm x 3 mm
Wi-Fi mode Station/softAP/SoftAP+station/P2P
Security WPA/WPA2/WPA2-Enterprise/WPS
Encryption AES/RSA/ECC/SHA
UART Download / OTA (via network) / download
Firmware upgrade
Software and write firmware via host
Supports Cloud Server Development / SDK for
Software development
custom firmware development
Network protocols IPv4, IPv6, SSL, TCP/UDP/HTTP/FTP/MQTT
User configuration AT instruction set, cloud server, Android/iOS App

Note:
* ESP-WROOM-32 with high temperature range option (-40°C ~ 125°C) is available for custom order.

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2.1 Pin Layout 2 PIN DEFINITIONS

2. Pin Definitions

2.1 Pin Layout

18.00

6.00
Keepout Zone

1.50

1 GND GND 38
1.27
2 3V3 IO23 37

3 EN IO22 36
6.00

4 SENSOR_VP TXD0 35
25.50
5 SENSOR_VN RXD0 34

6 IO34 IO21 33
6.30
7 IO35 1:GND 6.00
NC 32

8 IO32 IO19 31

9 IO33 IO18 30

10 IO25 IO5 29
11 IO26 IO17 28
12 IO27 7.30 IO16 27

13 IO14 IO4 26
CMD

IO15
SD0
GND

SD3
SD2
IO13

CLK

SD1

IO2

0.90 14 IO12 IO0 25

Unit: mm
20

24
23
22
18
16

19

21
15

17
0.45

3.30 1.27 3.30

2.00 Shielding 6.00

0.80 ± 0.10 PCB

25.50

Figure 1: Top and Side View of ESP-WROOM-32

Table 2: ESP-WROOM-32 Dimensions

Length Width Height PAD size (bottom) Pin pitch Shielding can height PCB thickness
18 mm 25.5 mm 2.8 ± 0.1 mm 0.45 mm x 0.9 mm 1.27 mm 2 mm 0.8 ± 0.1 mm

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2.2 Pin Description 2 PIN DEFINITIONS

2.2 Pin Description

ESP-WROOM-32 has 38 pins. See pin definitions in Table 3.

Table 3: ESP-WROOM-32 Pin Definitions

Name No. Function

GND 1 Ground
3V3 2 Power supply.
EN 3 Chip-enable signal. Active high.
SENSOR_VP 4 GPI36, SENSOR_VP, ADC_H, ADC1_CH0, RTC_GPIO0
SENSOR_VN 5 GPI39, SENSOR_VN, ADC1_CH3, ADC_H, RTC_GPIO3
IO34 6 GPI34, ADC1_CH6, RTC_GPIO4
IO35 7 GPI35, ADC1_CH7, RTC_GPIO5
GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
IO32 8
TOUCH9, RTC_GPIO9
GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5,
IO33 9
TOUCH8, RTC_GPIO8
IO25 10 GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 11 GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK,
IO14 13
SD_CLK, EMAC_TXD2
GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2,
IO12 14
SD_DATA2, EMAC_TXD3
GND 15 Ground
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3,
IO13 16
SD_DATA3, EMAC_RX_ER
SHD/SD2 17 GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SWP/SD3 18 GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
SCS/CMD 19 GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
SCK/CLK 20 GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SDO/SD0 21 GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SDI/SD1 22 GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD,
IO15 23
SD_CMD, EMAC_RXD3
GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
IO2 24
SD_DATA0
IO0 25 GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
IO4 26
SD_DATA1, EMAC_TX_ER
IO16 27 GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17 28 GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5 29 GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 30 GPIO18, VSPICLK, HS1_DATA7
IO19 31 GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC 32 -

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2.3 Strapping Pins 2 PIN DEFINITIONS

Name No. Function

IO21 33 GPIO21, VSPIHD, EMAC_TX_EN
RXD0 34 GPIO3, U0RXD, CLK_OUT2
TXD0 35 GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 GPIO23, VSPID, HS1_STROBE
GND 38 Ground

2.3 Strapping Pins

ESP32 has 6 strapping pins. Software can read the value of these 6 bits from the register ”GPIO_STRAPPING”.
During the chip power-on reset, the latches of the strapping pins sample the voltage level as strapping bits of ”0”
or ”1”, and hold these bits until the chip is powered down or shut down.

Each strapping pin is connected with its internal pull-up/pull-down during the chip reset. Consequently, if a strap-
ping pin is unconnected or the connected external circuit is high-impendence, the internal weak pull-up/pull-down
will determine the default input level of the strapping pins.

To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or apply the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.

After reset, the strapping pins work as the normal functions pins.

Refer to Table 4 for detailed boot modes configuration by strapping pins.

Table 4: Strapping Pins

Voltage of Internal LDO (VDD_SDIO)

Pin Default 3.3V 1.8V
MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Flash Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Debugging Log on U0TXD During Booting
Pin Default U0TXD Toggling U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
Falling-edge Input Falling-edge Input Rising-edge Input Rising-edge Input
Pin Default
Falling-edge Output Rising-edge Output Falling-edge Output Rising-edge Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1

Note:
Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing of SDIO
Slave” after booting.

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 3 FUNCTIONAL DESCRIPTION

3. Functional Description
This chapter describes the modules and functions implemented in ESP-WROOM-32.

3.1 CPU and Internal Memory

ESP32 contains two low-power Xtensa® 32-bit LX6 microprocessors. The internal memory includes:

• 448 KBytes ROM for booting and core functions.

• 520 KBytes on-chip SRAM for data and instruction.

• 8 KBytes SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor
during the Deep-sleep mode.

• 8 KBytes SRAM in RTC, which is called RTC FAST Memory and can be used for data storage and accessed
by the main CPU during RTC Boot from the Deep-sleep mode.

• 1 Kbit of EFUSE, of which 256 bits are used for the system (MAC address and chip configuration) and the
remaining 768 bits are reserved for customer applications, including Flash-Encryption and Chip-ID.

3.2 External Flash and SRAM

ESP32 supports 4 x 16 MBytes of external QSPI flash and SRAM with hardware encryption based on AES to
protect developer’s programs and data.

ESP32 accesses external QSPI flash and SRAM by the high-speed caches. Up to 16 MBytes of external flash are
memory mapped into the CPU code space, supporting 8, 16 and 32-bit access. Code execution is supported.
Up to 8 MBytes of external SRAM are memory mapped into the CPU data space, supporting 8, 16 and 32-bit
access. Data read is supported on the flash and SRAM. Data write is supported on the SRAM.

3.3 Crystal Oscillators

The frequencies of the main crystal oscillator supported include 40 MHz, 26 MHz and 24 MHz. The accuracy of
crystal oscillators applied should be ±10 PPM, and the operating temperature range -40°C to 85°C.

When using the downloading tools, remember to select the right crystal oscillator type. In circuit design, capacitors
C1 and C2 that connect to the earth, are added to the input and output terminals of the crystal oscillator respectively.
The values of the two capacitors can be flexible, ranging from 6 pF to 22 pF. However, the specific capacitive values
of C1 and C2 depend on further testing and adjustment of the overall performance of the whole circuit. Normally,
the capacitive values of C1 and C2 are within 10 pF if the crystal oscillator frequency is 26 MHz, while 10 pF<C1
and C2<22 pF if the crystal oscillator frequency is 40 MHz.

The frequency of the RTC crystal oscillator is typically 32 kHz or 32.768 kHz. The accuracy can be out of the range
of ±20 PPM, since the internal calibration is applied to correct the frequency offset. When the chip operates in low
power modes, the application chooses the external low speed (32 kHz) crystal clock rather than the internal RC
oscillators to achieve the accurate wakeup time.

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3.4 Power Consumption 3 FUNCTIONAL DESCRIPTION

3.4 Power Consumption

With the advanced power management technology, ESP32 can switch between different power modes as fol-
lows:

• Power mode

– Active mode: chip radio is powered on. The chip can receive, transmit, or listen.

– Modem-sleep mode: the CPU is operational and the clock is configurable. Wi-Fi / Bluetooth baseband
and radio are disabled.

– Light-sleep mode: the CPU is paused. The RTC and ULP-coprocessor are running. Any wake-up
events (MAC, host, RTC timer, or external interrupts) will wake up the chip.

– Deep-sleep mode: Only RTC is powered on. Wi-Fi and Bluetooth connection data are stored in RTC
memory. The ULP-coprocessor can work.

– Hibernation mode: The internal 8MHz oscillator and ULP-coprocessor are disabled. The RTC recovery
memory are power-down. Only one RTC timer on the slow clock and some RTC GPIOs are active. The
RTC timer or the RTC GPIOs can wake up the chip from the Hibernation mode.

• Sleep Pattern

– Association sleep pattern: The power mode switches between the active mode and Modem-sleep/Light-
sleep mode during this sleep pattern. The CPU, Wi-Fi, Bluetooth, and radio wake up at pre-determined
intervals to keep Wi-Fi / BT connections alive.

– ULP sensor-monitored pattern: The main CPU is in the Deep-sleep mode. The ULP co-processor does
sensor measurements and wakes up the main system, based on the measured data from sensors.

The power consumption varies with different power modes/sleep patterns and work status of functional modules
(see Table 5).

Table 5: Power Consumption by Power Modes

Power mode Comment Power consumption

Wi-Fi Tx packet 13 dBm ~ 21 dBm 160 ~ 260 mA
Wi-Fi / BT Tx packet 0 dBm 120 mA
Active mode (RF working)
Wi-Fi / BT Rx and listening 80 ~ 90 mA
Association sleep pattern (by Light- 0.9 mA@DTIM3, 1.2 mA@DTIM1
sleep)
Max speed: 20 mA
Modem-sleep mode The CPU is powered on. Normal: 5 ~ 10 mA
Slow speed: 3 mA
Light-sleep mode - 0.8 mA
The ULP-coprocessor is powered on. 0.15 mA
Deep-sleep mode ULP sensor-monitored pattern 25 µA @1% duty
RTC timer + RTC memories 20 µA
Hibernation mode RTC timer only 2.5 µA

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3.5 Peripheral Interface Description 3 FUNCTIONAL DESCRIPTION

3.5 Peripheral Interface Description

Table 6: Interface Description

Interface Signal Pin Function

ADC1_CH0 SENSOR_VP
ADC1_CH3 SENSOR_VN
ADC1_CH4 IO32
ADC1_CH5 IO33
ADC1_CH6 IO34
ADC1_CH7 IO35
ADC2_CH0 IO4
ADC ADC2_CH1 IO0 Two 12-bit SAR ADCs
ADC2_CH2 IO2
ADC2_CH3 IO15
ADC2_CH4 IO13
ADC2_CH5 IO12
ADC2_CH6 IO14
ADC2_CH7 IO27
ADC2_CH8 IO25
ADC2_CH9 IO26
Ultra Low Noise SENSOR_VP IO36 Provides about 60dB gain by using larger
Analog Pre-Amplifier SENSOR_VN IO39 capacitors on PCB
DAC_1 IO25
DAC Two 8-bit DACs
DAC_2 IO26
TOUCH0 IO4
TOUCH1 IO0
TOUCH2 IO2
TOUCH3 IO15
TOUCH4 IO13
Touch Sensor Capacitive touch sensors
TOUCH5 IO12
TOUCH6 IO14
TOUCH7 IO27
TOUCH8 IO33
TOUCH9 IO32
HS2_CLK MTMS
HS2_CMD MTDO
SD / SDIO / MMC HS2_DATA0 IO2
Supports SD memory card V3.01 standard
Host Controller HS2_DATA1 IO4
HS2_DATA2 MTDI
HS2_DATA3 MTCK

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3.5 Peripheral Interface Description 3 FUNCTIONAL DESCRIPTION

Interface Signal Pin Function

PWM0_OUT0~2
PWM1_OUT_IN0~2
Three channels of 16-bit timers generate
PWM0_FLT_IN0~2
PWM waveforms; each has a pair of
PWM1_FLT_IN0~2
Motor PWM Any GPIO output signals. Three fault detection
PWM0_CAP_IN0~2
signals. Three even capture signals. Three
PWM1_CAP_IN0~2 sync signals.
PWM0_SYNC_IN0~2
PWM1_SYNC_IN0~2
ledc_hs_sig_out0~7 16 independent channels @80MHz
LED PWM Any GPIO
ledc_ls_sig_out0~7 clock/RTC CLK. Duty accuracy: 16bits.
U0RXD_in
U0CTS_in
U0DSR_in
U0TXD_out
U0RTS_out
U0DTR_out
U1RXD_in Two UART devices with hardware
UART Any GPIO
U1CTS_in flow-control and DMA

U1TXD_out
U1RTS_out
U2RXD_in
U2CTS_in
U2TXD_out
U2RTS_out
I2CEXT0_SCL_in
I2CEXT0_SDA_in
I2CEXT1_SCL_in
I2CEXT1_SDA_in
I2C Any GPIO Two I2C devices in slave or master modes
I2CEXT0_SCL_out
I2CEXT0_SDA_out
I2CEXT1_SCL_out
I2CEXT1_SDA_out

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3.5 Peripheral Interface Description 3 FUNCTIONAL DESCRIPTION

Interface Signal Pin Function

I2S0I_DATA_in0~15
I2S0O_BCK_in
I2S0O_WS_in
I2S0I_BCK_in
I2S0I_WS_in
I2S0I_H_SYNC
I2S0I_V_SYNC
I2S0I_H_ENABLE
I2S0O_BCK_out
I2S0O_WS_out
I2S0I_BCK_out
I2S0I_WS_out
Stereo input and output from/to the audio
I2S I2S0O_DATA_out0~23 Any GPIO
codec, and parallel LCD data output
I2S1I_DATA_in0~15
I2S1O_BCK_in
I2S1O_WS_in
I2S1I_BCK_in
I2S1I_WS_in
I2S1I_H_SYNC
I2S1I_V_SYNC
I2S1I_H_ENABLE
I2S1O_BCK_out
I2S1O_WS_out
I2S1I_BCK_out
I2S1I_WS_out
I2S1O_DATA_out0~23
RMT_SIG_IN0~7 Eight channels of IR transmitter and
Remote Controller Any GPIO
RMT_SIG_OUT0~7 receiver for various waveforms

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3.5 Peripheral Interface Description 3 FUNCTIONAL DESCRIPTION

Interface Signal Pin Function

SPIHD SHD/SD2
SPIWP SWP/SD3
SPICS0 SCS/CMD
SPICLK SCK/CLK
SPIQ SDO/SD0
SPID SDI/SD1
HSPICLK IO14
HSPICS0 IO15 Supports Standard SPI, Dual SPI, and
Parallel QSPI HSPIQ IO12 Quad SPI that can be connected to the
HSPID IO13 external flash and SRAM
HSPIHD IO4
HSPIWP IO2
VSPICLK IO18
VSPICS0 IO5
VSPIQ IO19
VSPID IO23
VSPIHD IO21
VSPIWP IO22
HSPIQ_in/_out
Standard SPI consists of clock,
HSPID_in/_out
chip-select, MOSI and MISO. These SPIs
HSPICLK_in/_out
can be connected to LCD and other
HSPI_CS0_in/_out
external devices. They support the
HSPI_CS1_out
following features:
General Purpose HSPI_CS2_out Any GPIO (a) both master and slave modes;
SPI VSPIQ_in/_out (b) 4 sub-modes of the SPI format transfer
VSPID_in/_out that depend on the clock phase (CPHA)
VSPICLK_in/_out and clock polarity (CPOL) control.;
VSPI_CS0_in/_out (c) CLK frequencies by a divider;
VSPI_CS1_out (d) up to 64byte FIFO and DMA.
VSPI_CS2_out
MTDI IO12
MTCK IO13
JTAG JTAG for software debugging
MTMS IO14
MTDO IO15

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3.5 Peripheral Interface Description 3 FUNCTIONAL DESCRIPTION

Interface Signal Pin Function

SD_CLK IO6
SD_CMD IO11
SDIO interface that conforms to the
SD_DATA0 IO7
SDIO Slave industry standard SDIO 2.0 card
SD_DATA1 IO8
specification.
SD_DATA2 IO9
SD_DATA3 IO10
EMAC_TX_CLK IO0
EMAC_RX_CLK IO5
EMAC_TX_EN IO21
EMAC_TXD0 IO19
EMAC_TXD1 IO22
EMAC_TXD2 IO14
EMAC_TXD3 IO12
EMAC_RX_ER IO13
EMAC_RX_DV IO27
EMAC_RXD0 IO25
EMAC Ethernet MAC with MII/RMII interface
EMAC_RXD1 IO26
EMAC_RXD2 TXD
EMAC_RXD3 IO15
EMAC_CLK_OUT IO16
EMAC_CLK_OUT_180 IO17
EMAC_TX_ER IO4
EMAC_MDC_out Any GPIO
EMAC_MDI_in Any GPIO
EMAC_MDO_out Any GPIO
EMAC_CRS_out Any GPIO
EMAC_COL_out Any GPIO

Note:
Functions of Motor PWM, LED PWM, UART, I2C, I2S, general purpose SPI and Remote Controller can be configured to
any GPIO.

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4.3 Digital Terminal Characteristics 4 ELECTRICAL CHARACTERISTICS

4. Electrical Characteristics
Note:
The specifications in this chapter are tested with general condition: VBAT = 3.3V, TA = 27°C, unless otherwise specified.

4.1 Absolute Maximum Ratings

Table 7: Absolute Maximum Ratings

Rating Condition Value Unit

Storage temperatue - -40 ~ 85 °C
Maximum soldering temperature - 260 °C
Supply voltage IPC/JEDEC J-STD-020 +2.2 ~ +3.6 V

4.2 Recommended Operating Conditions

Table 8: Recommended Operating Conditions

Operating condition Symbol Min Typ Max Unit

Operating temperature - -40 20 85 °C
Supply voltage VDD 2.2 3.3 3.6 V

4.3 Digital Terminal Characteristics

Table 9: Digital Terminal Characteristics

Terminals Symbol Min Typ Max Unit

Input logic level low VIL -0.3 - 0.25VDD V
Input logic level high VIH 0.75VDD - VDD+0.3 V
Output logic level low VOL N - 0.1VDD V
Output logic level high VOH 0.8VDD - N V

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4.5 Bluetooth LE Radio 4 ELECTRICAL CHARACTERISTICS

4.4 Wi-Fi Radio

Table 10: Wi-Fi Radio Characteristics

Description Min Typical Max Unit

General Characteristics
Input frequency 2412 - 2484 MHz
Input impedance - 50 - Ω
Input reflection - - -10 dB
Output power of PA 15.5 16.5 21.5 dBm
Sensitivity
DSSS, 1 Mbps - -98 - dBm
CCK, 11 Mbps - -90 - dBm
OFDM, 6 Mbps - -93 - dBm
OFDM, 54 Mbps - -75 - dBm
HT20, MCS0 - -93 - dBm
HT20, MCS7 - -73 - dBm
HT40, MCS0 - -90 - dBm
HT40, MCS7 - -70 - dBm
MCS32 - -91 - dBm
Adjacent Channel Rejection
OFDM, 6 Mbps - 37 - dB
OFDM, 54 Mbps - 21 - dB
HT20, MCS0 - 37 - dB
HT20, MCS7 - 20 - dB

4.5 Bluetooth LE Radio

4.5.1 Receiver

Table 11: Receiver Characteristics - BLE

Parameter Conditions Min Typ Max Unit

Sensitivity @0.1% BER - - -98 - dBm
Maximum received signal @0.1% BER - 0 - - dBm
Co-channel C/I - - +10 - dB
F = F0 + 1 MHz - -5 - dB
F = F0 - 1 MHz - -5 - dB
F = F0 + 2 MHz - -25 - dB
Adjacent channel selectivity C/I
F = F0 - 2 MHz - -35 - dB
F = F0 + 3 MHz - -25 - dB
F = F0 - 3 MHz - -45 - dB
30 MHz - 2000 MHz -10 - - dBm
2000 MHz - 2400 MHz -27 - - dBm
Out-of-band blocking performance
2500 MHz - 3000 MHz -27 - - dBm
3000 MHz - 12.5 GHz -10 - - dBm
Intermodulation - -36 - - dBm

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4.6 Reflow Profile 4 ELECTRICAL CHARACTERISTICS

4.5.2 Transmit

Table 12: Transmit Characteristics - BLE

Parameter Conditions Min Typ Max Unit

RF transmit power - - +7.5 +10 dBm
RF power control range - - 25 - dB
F = F0 + 1 MHz - -14.6 - dBm
F = F0 - 1 MHz - -12.7 - dBm
F = F0 + 2 MHz - -44.3 - dBm
F = F0 - 2 MHz - -38.7 - dBm
Adjacent channel transmit power
F = F0 + 3 MHz - -49.2 - dBm
F = F0 - 3 MHz - -44.7 - dBm
F = F0 + > 3 MHz - -50 - dBm
F = F0 - > 3 MHz - -50 - dBm
∆ f1avg - - - 265 kHz
∆ f2max - 247 - - kHz
∆ f2avg /∆ f1avg - - -0.92 - -
ICFT - - -10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz

4.6 Reflow Profile

Table 13: Reflow Profile

Item Value
Ts max to TL (Ramp-up Rate) 3°C/second max
Preheat
Temperature Min. (Ts Min.) 150°C
Temperature Typ. (Ts Typ.) 175°C
Temperature Min. (Ts Max.) 200°C
Time (Ts ) 60 ~ 180 seconds
Ramp-up rate (TL to TP ) 3°C/second max
Time maintained above: –Temperature (TL )/Time (TL ) 217°C/60 ~ 150 seconds
Peak temperature (TP ) 260°C max, for 10 seconds
Target peak temperature (TP Target) 260°C +0/-5°C
Time within 5°C of actual peak (tP ) 20 ~ 40 seconds
TS max to TL (Ramp-down Rate) 6°C/second max
Tune 25°C to Peak Temperature (t) 8 minutes max

Note:
The 32 kHz crystal is internally connected to ESP32’s GPIO32 and GPIO33. To use ADC, Touch or GPIO functions of
IO32 and IO33, please remove the 32 kHz crystal and its capacitors — C13 and C17, and solder the 0ohm resistors —
R5 and R6.

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Espressif Systems

5. Schematics
J1 J2 J3
1 GND 1 1

D1
CON1 CON1 CON1
ESD3.3V88D-LCDN
J4 J5 GND J6 GND
GND 1 VDD33 1 GPIO13 1 GPIO23

CON1 CON1 CON1

J7 J8 J9

3
U1
GND GND 1 CHIP_PU 1 SWP/SD2 1 GPIO22

GND

GND XOUT
CON1 CON1 CON1

XIN
C1 C2
J10 J11 J12
22pF 22pF
VDD33 GND 1 SENSOR_VP 1 SHD/SD3 1 U0TXD

2
C3 C20 C4 CON1 CON1 CON1
GND VDD33 J13 J14 J15
100pF 1uF GND 0.1uF
40MHz+/-10ppm 1 SENSOR_VN 1 SCS/CMD 1 U0RXD
R1 20K
VDD33 GND GND C5 GPIO21
10nF C6 3.3nF U0TXD CON1 CON1 CON1
J16 J17 J18
U0RXD
C9 GPIO22 1 GPIO34 1 SCK/CLK 1 GPIO21
0.1uF GPIO19
GND CON1 CON1 CON1
VDD33 GND
49

48
47
46
45
44
43
42
41
40
39
38
37
J19 J20 J21
GND 1 GPIO35 1 SDO/SD0 1

XTAL_N

U0TXD
U0RXD

VDD3P3_CPU
VDDA
XTAL_P

VDDA
GPIO21

GPIO22
GPIO19
CAP1
CAP2
C11 C12 C13 C10 VDD_SDIO
1uF 10uF 10uF 0.1uF CON1 CON1 CON1
J22 J23 J24
1 GPIO32 1 SDI/SD1 1 GPIO19
ANT1
GND GND GND GND 1 36 GPIO23
1 C14 3.9pF 2 VDDA GPIO23 35 GPIO18
LNA_IN GPIO18 CON1 CON1 CON1

8
2 3 34 GPIO5 U3
16

C16 4 VDD3P3 GPIO5 33 SDI/SD1 SCS/CMD 1 5 SDI/SD1

VCC
SENSOR_VP 5 VDD3P3 SD_DATA_1 /CS DI J25 J26 J27
C15 L4 32 SDO/SD0
PCB ANT 2.4pF 2.7nH 270pF 6 SENSOR_VP SD_DATA_0 31 SCK/CLK SCK/CLK 6 2 SDO/SD0 1 GPIO33 1 GPIO15 1 GPIO18
7 SENSOR_CAPP SD_CLK 30 SCS/CMD CLK DO

GND
C17 SENSOR_VN 8 SENSOR_CAPN SD_CMD 29 SWP/SD3 SHD/SD2 7 3 SWP/SD3
CHIP_PU 9 SENSOR_VN SD_DATA_3 28 SHD/SD2 /HOLD /WP CON1 CON1 CON1
10 CHIP_PU SD_DATA_2 27
GND GND 270pF GPIO34 GPIO17 FLASH
J28 J29 J30
VDET_1 GPIO17

4
GPIO35 11 26
GPIO32 12 VDET_2 VDD_SDIO 25 GPIO16 1 GPIO25 1 GPIO2 1 GPIO5
GPIO33 32K_XP GPIO16
VDD3P3_RTC

GND
VDD_SDIO CON1 CON1 CON1
J31 J32
C18
32K_XN
GPIO25
GPIO26
GPIO27

GPIO2
GPIO0
GPIO4
MTMS

MTDO
MTCK

1uF 1 GPIO26 1 GPIO17

MTDI

ESP32 U2 CON1 CON1

J33 J34
13
14
15
16
17
18
19
20
21
22
23
24

GND
VDD33 1 GPIO27 1 GPIO16

C19 CON1 CON1

GPIO25
GPIO26
GPIO27
GPIO14
GPIO12

GPIO13
GPIO15
GPIO2
GPIO0
GPIO4

0.1uF J35 J36

1 GPIO14 1 GPIO4

GND
CON1 CON1

J37 J38
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1 GPIO12 1 GPIO0

CON1 CON1

Figure 2: ESP-WROOM-32 Schematics

5 SCHEMATICS
Note:
The capacitance of C1 and C2 varies with the selection of the crystal.