SEMINAR REPORT 2010- FLIP
2011 CHIP
(MANAGED BY IHRD, AFFILIATED TO UNIVERSITY OF CALICUT)
OLLEGE OF APPLIED SCIENCE
VADAKKENCHERRY CERTIFICATE
This is to certify that the seminar Report entitled as
“flip chip technology”
Is Submitted to College of Applied Science, Vadakkencherry
for the award of the degree of
BACHELOR OF SCIENCE IN ELECTRONICS
is a record of seminar done by
JIJI.P.POULOSE
REG NO: 12208
during the period of her study under our supervision and guidance.
HEAD OF DEPARTMENT SEMINAR CO-ORDINATOR
MR.SUBI.T.S MR.MADHAVADAS.C
(H.O.D, Electronics dept.) (Lecturer in Electronics)
DEPARTMENT OF ELECTRONICS IHRD, CAS VDY
SEMINAR REPORT 2010- FLIP
2011 CHIP
ACKNOWLEDGEMENT
It is a pleasant task to express my thanks to all the persons who
had helped in the successful completion of this seminar. First of all, I express my
sincere gratitude to Mr.Pradip Somasundaran, The principal of the college, for
providing me all the facilities with which I was able to do this seminar.
I express my profound thanks to our H.O.D, Mr.Subi.T.S
and seminar coordinator Mr.Madhavadas.C (Lecturer in electronics) for providing
me information on contemporary developments in the vast field of electronics and
helping to select this topic.
I would also like to thank all lecturers of electronics for clearing
my doubts and for providing me moral support. Further I would like to thank my
friends for their constant support and encouragement.
And above all I express my deep sense of gratitude to `God the
Almighty’ who gave me immense strength and showed me the path to make this
seminar victorious.
JIJI. P. POULOSE.
DEPARTMENT OF ELECTRONICS IHRD, CAS VDY
SEMINAR REPORT 2010- FLIP
2011 CHIP
Abstract
The intense competition in the electronics industry generally serves to
drive down the size and cost of electronic products while improving their performance,
flexibility, and reliability. As a part of this effort, packaging methods are constantly being
improved and new, innovative methods are being developed. One area of focus is highly
integrated chip-level electronics assembly, using multiple unpackaged dies and electrical
components in a single package. One of the most popular methods is known as flip chip
assembly.
Advancements in the packaging of semiconductor devices traditionally
use wire bonds to provide the interconnection from device to substrate or to other active
devices. Flip chip offers advantages over traditional interconnect schemes. A smaller overall
footprint can be realized, better thermal heat transfer, and improved performance especially at
higher frequencies are all enabled through the use of flip chip technology.
The assembly process has proliferated in many applications, including
automotive electronics, smart cards, radio frequency identification (RFID) cards
etc………………………!
DEPARTMENT OF ELECTRONICS IHRD, CAS VDY
SEMINAR REPORT 2010- FLIP
2011 CHIP
CONTENTS
1. INTRODUCTION…………………………………………..……01.
2. FLIP CHIP…………………………………………............…..…02.
3. REASONS FOR USE OF FLIP CHIP……………………..……03.
4. HISTORY.................……………………………………..…….…04.
5. FLIPCHIP PROCESS………………………………….…...……13.
6. BUMPING……………………………………………………..….14.
7. FLIP CHIP ASSEMBY……………………………..……….……17.
8. FLIPCHIP JOINING..............................................................…...19.
9. VARIOUS FLIPCHIP ASSEMBLIES……………….…….……22.
10. COMPARISON OF MOUNTING TECHNOLOGIES………….26.
11. ADVANTAGES……………………………………………………
30.
12. DISADVANTAGES…………………...………………………….31.
13. CONCLUTION…………………………………………….….…31.
14. BIBLIOGRAPHY………………………………………………..32.
DEPARTMENT OF ELECTRONICS IHRD, CAS VDY
