COMMON MODE CHOKES PWC0603ST SERIES

Introduction

This specification is applicable to chip type wire wounded common mode chokes. The PWC series
are widely used in USB 2.0, IEEE 1394, LVDS and etc. The wire wound features advance in lower DC
resistance and higher current tolerance, and much stable performance.

Features

* Operating temperature -40°C to +85°C.

* Excellent solderability and resistance to soldering heat.
* Suitable for flow and reflow soldering.
* Good dimensions, high reliability, and easy surface mount assembly.

Part Number Code

PWC 0603 S T 900 S - □□

(1) (2) (3) (4) (5) (6) (7)

(1) Chip Common Mode Choke Coil

(2) Chip Size
(b) (b)

(a)

(a)

CODE Length (L) Width (W) Thickness (H) (a) ref. (b) ref. UNIT
EIA 0.063 ± 0.004 0.033 ± 0.004 0.043 ± 0.004 0.010 0.013 Inch
JIS 1.60 ± 0.10 0.85 ± 0.10 1.10 ± 0.10 0.25 0.33 mm

(3) General Characteristics

(4) Taped in reel
(5) Impedance
900 = 90Ω 181 = 180Ω
(6) Tolerance
S = ±25%
(7) Internal Code

Material Structure

1
CHIP INDUCTOR SPECIFICATIONS

1. Scope
This specification applies to wired wounded chip common mode choke of the following types
used in electronic equipment.
Material : Ferrite

2. Construction
Configuration
& Dimension : Please refer to the attached figures and tables.

Terminals : Consist of Ag alloy followed by Nickel, then Au plating.

3. Operating Temperature Range

Operating Temperature Range is the scope of ambient temperature at which the common mode
choke can be operated continuously at rated current.

Temp. Range : -40°C to +85°C

4. Recommended Soldering Conditions

Peak : 250 +5/-0°C

230°C or higher
2 to 6°C/s
3 to 6°C/s
Pre-heating Zone
180°C

150°C
90 ± 30s
2 to 4°C/s 30 ± 10s
Soldering Zone
Heating Time

5. Characteristics

Standard Atmospheric Conditions

Unless otherwise specified, the standard range of atmospheric conditions for making
measurements and tests are as follows :

Ambient Temperature : 25°C ± 2°C

Relative Humidity : 60% to 70%
Air Pressure : 86 kPa to 106 kPa

2
COMMON MODE CHOKE

WIRE WOUND TYPE

PWC0603ST (1608) SERIES

Specification

1 2
Common Mode Rated Withstanding Rated DC Insulation
Part Number Impedance (W) Voltage Voltage Current Resistance Resistance
at 100MHz V (DC) V (DC) max (mA) max (Ω) min (MΩ)

PWC0603ST220S-□□ 22 50 125 500 0.080 10

PWC0603ST450S-□□ 45 50 125 500 0.110 10
PWC0603ST900S-□□ 90 50 125 500 0.145 10
PWC0603ST121S-□□ 120 50 125 500 0.175 10
PWC0603ST181S-□□ 180 50 125 500 0.210 10
PWC0603ST251S-□□ 250 50 125 400 0.280 10

1. Impedance is measured in HP4287A or equivalent.

2. For 15˚C rise.

3
RELIABILITY TEST

ITEM CONDITION SPECIFICATION

Common Mode Measuring Equipment : HP-4287A or Within ± 25%
Impedance (Zc) equivalent.
and Measuring Frequency : 100 ± 1MHz
Tolerance Measuring Temperature : 25 ± 5°C
(Refer to Measurement Diagram )
Insulation Measuring Voltage : Rated Voltage 10 megaohms minimum
Resistance Measuring Time : 1 minute max.
(Refer to Measurement Diagram )
Electrical Dielectric Test Voltage : 2.5 times to Rated Voltage No damage occurs when
Characteristics Withstanding Time : 1 to 5 seconds. the test voltage is applied.
Voltage Charge current : 1mA max.
(Refer to Measurement Diagram )
Rated Current Test Current : Rated Current Temperature Rise :  15°C
(Refer to Measurement Diagram )
DC Resistance Measured with current of 100mA max. Within Specified Tolerance.
(RDC) In case of doubt, measured by four
terminal method.
(Refer to Measurement Diagram )
Flexure Strength
Change In Appearance
Without distinct damage

Change In Common Mode Impedance:

Within ± 20%
Drop Test Components shall be dropped three times
on a concrete or steel board at height of
1m naturally at any directions. Insulation Resistance:
Vibration Components shall be randomly vibrated at 10MW min
(Random) amplitude of 1.5mm and frequency of
10 - 55 Hz: 0.04 G / Hz, 1 minute at a
Mechanical
period of 2 hours in each of the three Withstanding Voltage:
Characteristics
mutually perpendicular directions. No damaged
Resistance to Preheat components at 80 to 120°C for
Soldering Heat 1 minute. Dip components into flux and
then into a melted solder bath at
260 ± 5°C for 5 ± 1 seconds.
Then components are to be tested after
4-48 hours at room temperature.
Solderability Dip pads in flux and then in a solder bath A minimum of 80% of the metalized area
at 240 ± 5°C for 5 seconds. must be covered with new solder.
Component Components shall be reflow solder onto Components must withstand a minimum
Adhesion a P.C. Board (240 ± 5°C for 20 seconds). force of 0.5kg without any failure of the
(Push Test) Then a dynometer force gauge shall be termination to component attachment.
applied to any side of the component.

4
RELIABILITY TEST

ITEM CONDITION SPECIFICATION

Cold Temperature Components shall be stored at temperature
Storage of -40 ± 2°C for 1000 (+48 hours -0 hour).
Then components shall be subjected to Change In Appearance
standard atmospheric conditions for Without distinct damage
4-48 hours. After that, measurement
shall be made.
High Temperature Components shall be stored at temperature Change In Common Mode
Storage +85 ± 2°C for 1000 (+48 hours -0 hour). Impedance:
Then components shall be subjected to Within ± 20%
standard atmospheric conditions for
4-48 hours. After that, measurement
shall be made. Insulation Resistance:
Moisture Components shall be stored in the chamber 10MW min
Resistance at 40°C at 90-95% R. H. for 1000
(+48 hours -0 hour). Then components are
Endurance
to be tested after 4-48 hours at room Withstanding Voltage:
Characteristics
temperature. No damaged
Temperature Each cycle shall consist of 30 minutes at
Cycle -40°C followed by 30 minutes at +85°C
with a 10-15 minutes maximum transition
time between temperature extremes.
Test duration is 100 cycles, then
components are to be tested after
4-48 hours at room temperature.
High Temperature Components shall be stored at temperature
With Loaded of +85 ± 2°C for 1000 (+48 hours -0 hour).
( Rated Current ) with rated current applied.
Then components shall be subjected to
standard atmospheric conditions for
4-48 hour. After that, measurement
shall be made.

5
MEASUREMENT DIAGRAM

EQUIVALENT CIRCUIT

(1) (2)

(4) (3)

No polarity

Terminal to be Tested
When measuring and supplying the voltage, the following terminal is applied.

No. Item Terminal to be Tested

1 Common Mode Impedance Terminal Terminal

( Measurement Terminal )

2 Withstanding Voltage
Terminal
( Measurement Terminal )
Terminal

3 DC Resistance
( Measurement Terminal
Terminal Terminal

4 Rated Current

5 Insulation Resistance Terminal

Terminal

6
PACKING INFORMATION

Packing Quantity
Type Pcs / Reel
PWC0603 2,000

Ø60 Ø178

1.
0
9.0

Dimensions (unit : mm)

Chip Insert Tape
Type Cavity Pitch Thickness W
A B F K T
PWC0603 1.05 1.85 4.00 1.15 0.23 8.00

Blank
Portions Chip Cavity Leader
Top Tape Strength

The top tape requires a peel-off force of 0.2 to 0.7N

in the direction of the arrow as illustrated below.

Top Tape
0~15°

80mm min. 160mm min.

Base Tape
Direction of tape feed

Recommended PCB Pattern (unit : mm)

2.30

0.25 0.75

0.85 0.60 0.85

7
SAFETY NOTES & PRECAUTION

1. Products may not be used in applications that directly affect the personal safety or cause significant
impacts and losses to society. If you apply to these applications, please be sure to contact us at first to confirm.

2. The storage period is less than 12 months. Ensure to follow the storage conditions (Temperature: 5 to 30°C,
Humidity: 10 to 65% RH or none). If the storage period is exceeded the limit, the electrodes might be
deteriorate/oxidized and affect soldering. Solderability should be checked if this period is exceeded.
Other storage precaution:
a) Products should be stored on the pallet for the prevention of the influence from humidity, dust and so on.
b) Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
c) Do not unpack the minimum package until immediately before use. After unpacking, re-seal promptly or store in
desiccator with a desiccant.
d) Do not store product in bulk to prevent coils and parts being damaged.

3. Do not use or store in locations where there are corrosive gases (salt, acid, alkali, etc.).

4. Soldering condition for mounting should be within the specification range.

If overheated, a short circuit, performance deterioration, or lifespan shortening may occur.

5. When using, try to avoid excessive mechanical impact on the product such as collision / drop…etc.

6. When assembling a printed circuit board with a new mounted chip, be careful to avoid assembly deformation of the
circuit board that may cause the overall or partial distortion of the circuit board such as at screw tightening position.

7. Self heating (temperature increase) occurs when the power is turned ON, so the tolerance should be sufficient
for the thermal design.

8. Do not expose the products to magnets or magnetic fields.

9. If you would like to use this products for more stringent safety or reliability of performance and/or quality requirements,
or its failure, malfunction or trouble may cause serious damage to society, individuals or property, or you have special
requirement beyond the specification or condition in the catalogue, please contact us.

10. PCB should be designed so that products are not subjected to the mechanical stress caused by warping of the board as
shown below. Bending and twisting of PCB will cause excessive mechanical stress and lead to crack in the product as well.

11. Cleaning brush shall not touch the winding portion of the product to prevent the breaking of wire. Cleaning could cause
failure and degradation of a product.

12. Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. Product
could be damaged by external mechanical pressure, stacked under heavy object, as well as strong shaking and drop.