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LAB 2-Integrated Circuits ICs 2

This lab document provides information on integrated circuits (IC), including their construction, operation, and applications. It describes the 11-step process for IC fabrication and gives examples of common ICs like microcontrollers and operational amplifiers. In conclusion, the document states that ICs are fundamental electronic components that have revolutionized industries by making electronics smaller, cheaper, and more powerful.

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Astro Lee
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0% found this document useful (0 votes)
59 views6 pages

LAB 2-Integrated Circuits ICs 2

This lab document provides information on integrated circuits (IC), including their construction, operation, and applications. It describes the 11-step process for IC fabrication and gives examples of common ICs like microcontrollers and operational amplifiers. In conclusion, the document states that ICs are fundamental electronic components that have revolutionized industries by making electronics smaller, cheaper, and more powerful.

Uploaded by

Astro Lee
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd

College of Telecommunications

Engineering Technology

Lab 2 - INTRODUCTION TO IC (INTEGRATED


CIRCUITS)

Name: Esra Alzahar Student ID: 60101757

Partner Name: Fatima Al-Saleh Student ID: 60304317

Instructor Name: David Smicer


Lab Date: 6th of September, 2023

Due date: 12th of September, 2023 Total Mark: __________/10


Lab 2- Introduction to Integrated Circuits (IC)

Integrated Circuit

Fig 1-1 Custom IC Fit to Me? - Alpha Pacific Technologies Co., Ltd.

2.1 Objectives
 What is an IC(Integrated Circuit)
 Construction of an IC
 Operation of IC
 Applications/Examples of IC

2.2 Introduction to integrated circuit

2.2.1 Information of IC

An integrated circuit is a small electronic circuit that made of a transistor, resistor, capacitor,
diodes, and other electronic components that have been combined into a signal semiconductor
substrate. The IC has been created to carry out particular tasks like amplification, signal,
processing, or data storage, depending on their storage.
Fig 1-2 Basic Knowledge of Integrating Circuit

2.2.2 Construction of an IC

An integrated circuit (IC) construction involves several steps, including circuit design, silicon
wafer fabrication, and IC packaging. Here some brief overview of the building process:

1. Designing the electronic circuit


Engineers lay out the IC parts, connection, and functions by using computer-aided design (CAD)
software. The design phase is crucial in degerming the IC process and performance.

2. Lithography and Masking


The circuit layout is transferred onto a silicon water using during the photolithography process.
Also, UV light is used to reveal the pattern via the masks after applying a photosensitive layer on
the water.

3. Chemical etching
The areas that are not protected by the patterned photoresist are selectively removed. The
elements and connections of the circuit are described on the wafer in this step.

4. Doping
Introduce some chemicals like boron and phosphorus, into the silicon wafer through a diffusion
or ion implantation process. Transistors, diodes, and other electrical characteristics.

5. Thin-Film Deposition
By using techniques like chemical vapor deposition (CVD) or physical vapor deposition (PVD),
the thin films of the various materials like insulators, conductors, etc. are deposition onto the
wafer surface. These films are crucial for connecting components and providing insulation
between them.
6. Metallization
To form the connection between the components, by deposition and etching a layer of metal like
aluminum or copper. In this step transistors, capacitors, and other components are connect by
wires.

7. Testing
To ensure that each IC operates properly, rigorous testing is necessary at different stages of the
IC production. Also, electrical tests and visual inspections are both included in this step.

8. Packaging
After all the components on the wafer are fabricated and connected, the wafer is divided into
individual integrated circuits, or dice. These dice are placed in packaging that serves both
protection for the IC from environmental factors, and provide electrical connection to the outside
world.

9. Final testing
The ICs are tested one more time after packaging to ensure their operation. That’s include testing
various inputs and outputs to make sure they meet the specified performance criteria.

10. Quality control


To get rid of the faulty units, ICs are out through quality control process. This ensures that only
functional ICs are shipped to customers

11. Distribution
Finally, the ICs are sent to manufactures who used them to create electronic products like
cellphone, computers, or consumer electronic.

The construction process is intricate and involves a multitude of additional steps and advanced
technologies to create the complex and densely packed circuits found in modern integrated
circuits.

2.2.3 Operation of IC

Integrated circuits need electricity, just like machines. They get this power from the outside via
specialist pins. ICs may receive analog or digital input signals using input pins. They process
these signals internally by carrying out mathematical operations or data storage, depending on
the purpose.

Output pins provide access to the output signals, which are the results of this processing. ICs
typically require clock signals to maintain time, much like the conductor in a band. Moreover,
ICs come in several types to fit various roles. Some devices ensure stable electricity, some
operate machinery, and some store data. For various roles, many types of ICs are available.
Others store information, ensure dependable power, or enable wireless connectivity, while some
act as the brains or computers of their specific devices.

2.2.4 Applications/Examples of IC

IC has many examples like microcontroller .The brains of many electronics, these
microcontrollers can carry out a variety of tasks with ease. They resemble small, narrowly
focused computers that can only do certain tasks.

Operational amplifiers are yet another essential kind of IC. These parts are essential in systems
like sensors and audio amplifiers because of their strong signal amplification abilities.
Operational amplifiers are comparable to sound amplifiers in that they both enhance sounds and
assist sensors in identifying changes in their environment.

Fig 1-3 Integrated Circuits | Classification, Fabrication - M-Physics Tutorial

Furthermore, Radio Frequency Is (RFICs) are necessary for wireless communication. They let
devices connect wirelessly to the internet, joining distant places like a bridge. Due to RFICs'
function as an intermediate, devices can broadcast and receive signals through airways.

Fig 1-4 IC Package Types | DIP, SMD, QFP, BGA, SOP, SOT, SOIC
2.2.5 Conclusion
Integrated circuits (ICs), also known as microchips or simply "chips," are fundamental
components of modern electronics. These miniature circuits consist of multiple electronic
components (transistors, resistors, capacitors, etc.) etched onto a single semiconductor substrate,
typically silicon. ICs revolutionized electronics by dramatically reducing size, cost, and power
consumption while increasing performance and reliability. They power everything from
smartphones and computers to medical devices and spacecraft. ICs are classified into various
types, including analog and digital, and can range from simple logic gates to complex
microprocessors. Their versatility and scalability continue to drive innovation across countless
industries.

2.2.6 Reference

Chat GPT

Fig 1-1 Custom IC Fit to Me? - Alpha Pacific Technologies Co., Ltd.
https://www.alpha-pacific.com/en/why-asic-fits-me

Fig 1-2 Basic Knowledge of Integrating Circuit


https://www.toppr.com/ask/content/concept/basic-knowledge-of-integrated-circuits-210450/

Fig 1-3 Integrated Circuits | Classification, Fabrication - M-Physics Tutorial


https://www.mphysicstutorial.com/2020/12/integrated-circuits-classification-and.html

Fig 1-4 IC Package Types | DIP, SMD, QFP, BGA, SOP, SOT, SOIC
https://www.electronicsforu.com/resources/dip-smd-qfp-bga-ic-packages

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