MMBT3906L, SMMBT3906L

General Purpose Transistor

PNP Silicon

Features
• S Prefix for Automotive and Other Applications Requiring Unique www.onsemi.com
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable COLLECTOR
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS 3
Compliant
1
BASE

MAXIMUM RATINGS
2
Rating Symbol Value Unit EMITTER
Collector −Emitter Voltage VCEO −40 Vdc
Collector −Base Voltage VCBO −40 Vdc 3
Emitter −Base Voltage VEBO −5.0 Vdc
1
Collector Current − Continuous IC −200 mAdc 2
Collector Current − Peak (Note 3) ICM −800 mAdc
SOT−23 (TO−236)
THERMAL CHARACTERISTICS
CASE 318
Characteristic Symbol Max Unit STYLE 6
Total Device Dissipation FR− 5 Board PD
(Note 1) @ TA = 25°C 225 mW
MARKING DIAGRAM
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction−to−Ambient RqJA 556 °C/W
Total Device Dissipation Alumina PD 2A M G
Substrate, (Note 2) @ TA = 25°C 300 mW G
Derate above 25°C 2.4 mW/°C
1
Thermal Resistance, Junction−to−Ambient RqJA 417 °C/W
2A = Specific Device Code
Junction and Storage Temperature TJ, Tstg −65 to +150 °C M = Date Code*
Stresses exceeding those listed in the Maximum Ratings table may damage the G = Pb−Free Package
device. If any of these limits are exceeded, device functionality should not be (Note: Microdot may be in either location)
assumed, damage may occur and reliability may be affected. *Date Code orientation and/or overbar may
1. FR− 5 = 1.0  0.75  0.062 in. vary depending upon manufacturing location.
2. Alumina = 0.4  0.3  0.024 in. 99.5% alumina.
3. Reference SOA curve.
ORDERING INFORMATION
Device Package Shipping†
MMBT3906LT1G SOT−23 3,000 / Tape &
(Pb−Free) Reel
MMBT3906LT3G SOT−23 10,000 / Tape &
(Pb−Free) Reel
SMMBT3906LT1G SOT−23 3,000 / Tape &
(Pb−Free) Reel
SMMBT3906LT3G SOT−23 10,000 / Tape &
(Pb−Free) Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.

© Semiconductor Components Industries, LLC, 1994 1 Publication Order Number:

August, 2017 − Rev. 13 MMBT3906LT1/D
 MMBT3906L, SMMBT3906L

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector −Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = −1.0 mAdc, IB = 0) −40 −

Collector −Base Breakdown Voltage V(BR)CBO Vdc

(IC = −10 mAdc, IE = 0) −40 −

Emitter −Base Breakdown Voltage V(BR)EBO Vdc

(IE = −10 mAdc, IC = 0) −5.0 −

Base Cutoff Current IBL nAdc

(VCE = −30 Vdc, VEB = −3.0 Vdc) − −50

Collector Cutoff Current ICEX nAdc

(VCE = −30 Vdc, VEB = −3.0 Vdc) − −50

ON CHARACTERISTICS (Note 4)
DC Current Gain HFE −
(IC = −0.1 mAdc, VCE = −1.0 Vdc) 60 −
(IC = −1.0 mAdc, VCE = −1.0 Vdc) 80 −
(IC = −10 mAdc, VCE = −1.0 Vdc) 100 300
(IC = −50 mAdc, VCE = −1.0 Vdc) 60 −
(IC = −100 mAdc, VCE = −1.0 Vdc) 30 −

Collector −Emitter Saturation Voltage VCE(sat) Vdc

(IC = −10 mAdc, IB = −1.0 mAdc) − −0.25
(IC = −50 mAdc, IB = −5.0 mAdc) − −0.4
Base −Emitter Saturation Voltage VBE(sat) Vdc
(IC = −10 mAdc, IB = −1.0 mAdc) −0.65 −0.85
(IC = −50 mAdc, IB = −5.0 mAdc) − −0.95
SMALL− SIGNAL CHARACTERISTICS
Current −Gain − Bandwidth Product fT MHz
(IC = −10 mAdc, VCE = −20 Vdc, f = 100 MHz) 250 −

Output Capacitance Cobo pF

(VCB = −5.0 Vdc, IE = 0, f = 1.0 MHz) − 4.5

Input Capacitance Cibo pF

(VEB = −0.5 Vdc, IC = 0, f = 1.0 MHz) − 10

Input Impedance hie kW

(IC = −1.0 mAdc, VCE = −10 Vdc, f = 1.0 kHz) 2.0 12

Voltage Feedback Ratio hre X 10− 4

(IC = −1.0 mAdc, VCE = −10 Vdc, f = 1.0 kHz) 0.1 10

Small −Signal Current Gain hfe −

(IC = −1.0 mAdc, VCE = −10 Vdc, f = 1.0 kHz) 100 400

Output Admittance hoe mmhos

(IC = −1.0 mAdc, VCE = −10 Vdc, f = 1.0 kHz) 3.0 60

Noise Figure NF dB
(IC = −100 mAdc, VCE = −5.0 Vdc, RS = 1.0 kW, f = 1.0 kHz) − 4.0

SWITCHING CHARACTERISTICS
Delay Time (VCC = −3.0 Vdc, VBE = 0.5 Vdc, td − 35
ns
Rise Time IC = −10 mAdc, IB1 = −1.0 mAdc) tr − 35
Storage Time (VCC = −3.0 Vdc, IC = −10 mAdc, ts − 225
ns
Fall Time IB1 = IB2 = −1.0 mAdc) tf − 75
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.

www.onsemi.com
2
 MMBT3906L, SMMBT3906L

3V 3V
+9.1 V < 1 ns

275 275
< 1 ns
+0.5 V 10 k 10 k
0
CS < 4 pF* 1N916 CS < 4 pF*
10.6 V
300 ns 10 < t1 < 500 ms
DUTY CYCLE = 2% t1 10.9 V
DUTY CYCLE = 2%

* Total shunt capacitance of test jig and connectors

Figure 1. Delay and Rise Time Figure 2. Storage and Fall Time
Equivalent Test Circuit Equivalent Test Circuit

TYPICAL TRANSIENT CHARACTERISTICS

TJ = 25°C
TJ = 125°C

10 5000
VCC = 40 V
3000
7.0 IC/IB = 10
2000
CAPACITANCE (pF)

5.0 Cobo
Q, CHARGE (pC)

1000
700
Cibo
3.0 500

300
2.0 200 QT
QA
100
70
1.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
REVERSE BIAS (VOLTS) IC, COLLECTOR CURRENT (mA)

Figure 3. Capacitance Figure 4. Charge Data

500 500
IC/IB = 10 VCC = 40 V
300 300
IB1 = IB2
200 200
IC/IB = 20
t f , FALL TIME (ns)

100 100
70 70
TIME (ns)

50 tr @ VCC = 3.0 V 50

30 15 V 30
20 20 IC/IB = 10
40 V
10 2.0 V 10
7 td @ VOB = 0 V 7
5 5
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)

Figure 5. Turn −On Time Figure 6. Fall Time

www.onsemi.com
3
 MMBT3906L, SMMBT3906L

TYPICAL AUDIO SMALL−SIGNAL CHARACTERISTICS

NOISE FIGURE VARIATIONS
(VCE = − 5.0 Vdc, TA = 25°C, Bandwidth = 1.0 Hz)
5.0 12
SOURCE RESISTANCE = 200 W f = 1.0 kHz IC = 1.0 mA
IC = 1.0 mA
10
4.0 IC = 0.5 mA
SOURCE RESISTANCE = 200 W
NF, NOISE FIGURE (dB)

NF, NOISE FIGURE (dB)

IC = 0.5 mA 8
3.0
SOURCE RESISTANCE = 2.0 k
IC = 50 mA 6
2.0
4 IC = 50 mA

1.0 SOURCE RESISTANCE = 2.0 k IC = 100 mA

IC = 100 mA 2

0 0
0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100
f, FREQUENCY (kHz) Rg, SOURCE RESISTANCE (k OHMS)

Figure 7. Figure 8.

h PARAMETERS
(VCE = − 10 Vdc, f = 1.0 kHz, TA = 25°C)

300 100
hoe, OUTPUT ADMITTANCE (m mhos)

70

50
h fe , DC CURRENT GAIN

200

30

100 20

70
10
50
7

30 5
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)

Figure 9. Current Gain Figure 10. Output Admittance

20 10
h re , VOLTAGE FEEDBACK RATIO (X 10 -4 )

7.0
h ie , INPUT IMPEDANCE (k OHMS)

10
7.0 5.0
5.0

3.0 3.0

2.0 2.0

1.0
0.7
1.0
0.5
0.7
0.3
0.2 0.5
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)

Figure 11. Input Impedance Figure 12. Voltage Feedback Ratio

www.onsemi.com
4
 MMBT3906L, SMMBT3906L

TYPICAL STATIC CHARACTERISTICS

1000
VCE = 1 V
TJ = 150°C
hFE, DC CURRENT GAIN

25°C

-55°C
100

10
1.0 10 100 1000
IC, COLLECTOR CURRENT (mA)
Figure 13. DC Current Gain
VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)

1.0
TJ = 25°C
0.8
IC = 1.0 mA 10 mA 30 mA 100 mA

0.6

0.4

0.2

0
0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
IB, BASE CURRENT (mA)

Figure 14. Collector Saturation Region

www.onsemi.com
5
 MMBT3906L, SMMBT3906L

0.50 1.4
0.45 IC/IB = 10 IC/IB = 10
VCE(sat), COLLECTOR−EMITTER
SATURATION VOLTAGE (V) 150°C

SATURATION VOLTAGE (V)

1.2
0.40

VBE(sat), BASE−EMITTER
25°C
0.35
−55°C 1.0
0.30
−55°C
0.25 0.8
25°C
0.20
0.6
0.15
150°C
0.10
0.4
0.05
0 0.2
0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1
IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)
Figure 15. Collector Emitter Saturation Voltage Figure 16. Base Emitter Saturation Voltage vs.
vs. Collector Current Collector Current

1.4 1000
VBE(on), BASE−EMITTER VOLTAGE (V)

VCE = 1 V

fT, CURRENT−GAIN−BANDWIDTH
VCE = 2 V
1.2 TA = 25°C

1.0 PRODUCT (MHz)

−55°C
0.8 100
25°C
0.6

150°C
0.4

0.2 10
0.0001 0.001 0.01 0.1 1 0.1 1 10 100 1000
IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (mA)
Figure 17. Base Emitter Voltage vs. Collector Figure 18. Current Gain Bandwidth vs.
Current Collector Current
1.0 1
q V , TEMPERATURE COEFFICIENTS (mV/ °C)

1 ms
1s
0.5 100 ms 10 ms
qVC FOR VCE(sat) +25°C TO +125°C
Thermal Limit
0 0.1
-55°C TO +25°C
IC (A)

-0.5
+25°C TO +125°C
-1.0 0.01
-55°C TO +25°C
-1.5 qVB FOR VBE(sat)
Single Pulse Test
@ TA = 25°C
-2.0 0.001
0 20 40 60 80 100 120 140 160 180 200 0.01 0.1 1 10 100
IC, COLLECTOR CURRENT (mA) VCE (Vdc)
Figure 19. Temperature Coefficients Figure 20. Safe Operating Area

www.onsemi.com
6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS

SOT−23 (TO−236)
CASE 318−08
ISSUE AS
DATE 30 JAN 2018
SCALE 4:1
D NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
0.25 MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
3 THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
E HE T PROTRUSIONS, OR GATE BURRS.
1 2
MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
L A 0.89 1.00 1.11 0.035 0.039 0.044
3X b A1 0.01 0.06 0.10 0.000 0.002 0.004
L1 b 0.37 0.44 0.50 0.015 0.017 0.020
e VIEW C c 0.08 0.14 0.20 0.003 0.006 0.008
TOP VIEW D 2.80 2.90 3.04 0.110 0.114 0.120
E 1.20 1.30 1.40 0.047 0.051 0.055
e 1.78 1.90 2.04 0.070 0.075 0.080
L 0.30 0.43 0.55 0.012 0.017 0.022
L1 0.35 0.54 0.69 0.014 0.021 0.027
A HE 2.10 2.40 2.64 0.083 0.094 0.104
T 0° −−− 10 ° 0° −−− 10°
A1 SIDE VIEW SEE VIEW C c
GENERIC
END VIEW
MARKING DIAGRAM*
RECOMMENDED
SOLDERING FOOTPRINT XXXMG
G
1
3X
2.90 0.90 XXX = Specific Device Code
M = Date Code
G = Pb−Free Package

*This information is generic. Please refer to

3X 0.80 0.95 device data sheet for actual part marking.
PITCH Pb−Free indicator, “G” or microdot “ G”,
DIMENSIONS: MILLIMETERS may or may not be present.

STYLE 1 THRU 5: STYLE 6: STYLE 7: STYLE 8:

CANCELLED PIN 1. BASE PIN 1. EMITTER PIN 1. ANODE
2. EMITTER 2. BASE 2. NO CONNECTION
3. COLLECTOR 3. COLLECTOR 3. CATHODE

STYLE 9: STYLE 10: STYLE 11: STYLE 12: STYLE 13: STYLE 14:
PIN 1. ANODE PIN 1. DRAIN PIN 1. ANODE PIN 1. CATHODE PIN 1. SOURCE PIN 1. CATHODE
2. ANODE 2. SOURCE 2. CATHODE 2. CATHODE 2. DRAIN 2. GATE
3. CATHODE 3. GATE 3. CATHODE−ANODE 3. ANODE 3. GATE 3. ANODE

STYLE 15: STYLE 16: STYLE 17: STYLE 18: STYLE 19: STYLE 20:
PIN 1. GATE PIN 1. ANODE PIN 1. NO CONNECTION PIN 1. NO CONNECTION PIN 1. CATHODE PIN 1. CATHODE
2. CATHODE 2. CATHODE 2. ANODE 2. CATHODE 2. ANODE 2. ANODE
3. ANODE 3. CATHODE 3. CATHODE 3. ANODE 3. CATHODE−ANODE 3. GATE

STYLE 21: STYLE 22: STYLE 23: STYLE 24: STYLE 25: STYLE 26:
PIN 1. GATE PIN 1. RETURN PIN 1. ANODE PIN 1. GATE PIN 1. ANODE PIN 1. CATHODE
2. SOURCE 2. OUTPUT 2. ANODE 2. DRAIN 2. CATHODE 2. ANODE
3. DRAIN 3. INPUT 3. CATHODE 3. SOURCE 3. GATE 3. NO CONNECTION

STYLE 27: STYLE 28:

PIN 1. CATHODE PIN 1. ANODE
2. CATHODE 2. ANODE
3. CATHODE 3. ANODE

Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98ASB42226B Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DESCRIPTION: SOT−23 (TO−236) PAGE 1 OF 1

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.

© Semiconductor Components Industries, LLC, 2019 www.onsemi.com

 onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT: TECHNICAL SUPPORT
Email Requests to: [email protected] North American Technical Support: Europe, Middle East and Africa Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 00421 33 790 2910
onsemi Website: www.onsemi.com Phone: 011 421 33 790 2910 For additional information, please contact your local Sales Representative

◊
Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

onsemi:
MMBT3906LT1 MMBT3906LT1G MMBT3906LT3 MMBT3906LT3G SMMBT3906LT3G SMMBT3906LT1G