FA77-B7119

Service Engineer’s Manual

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 PREFACE

Copyright
This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced
without written consent of manufacturer.

Copyright 2018 MITAC COMPUTING TECHNOLOGY CORPORATION. All

®
rights reserved. TYAN is a registered trademark of MITAC COMPUTING
TECHNOLOGY CORPORATION.

Version 1.0b

Disclaimer
Information contained in this document is furnished by MITAC COMPUTING
TECHNOLOGY CORPORATION and has been reviewed for accuracy and
reliability prior to printing. MITAC assumes no liability whatsoever, and
®
disclaims any express or implied warranty, relating to sale and/or use of TYAN
products including liability or warranties relating to fitness for a particular
purpose or merchantability. MITAC retains the right to make changes to
produce descriptions and/or specifications at any time, without notice. In no
event will MITAC be held liable for any direct or indirect, incidental or
consequential damage, loss of use, loss of data or other malady resulting from
errors or inaccuracies of information contained in this document.

Trademark Recognition
All registered and unregistered trademarks and company names contained in
this manual are property of their respective owners including, but not limited to
the following.
®
TYAN is a trademark of MITAC COMPUTING TECHNOLOGY
CORPORATION.
Intel® is a trademark of Intel® Corporation.
AMI®, AMIBIOS® and combinations thereof are trademarks of AMI
Technologies.
Microsoft®, Windows® are trademarks of Microsoft Corporation.
® ® ® ®
IBM , PC , AT and PS/2 are trademarks of IBM Corporation.
®
Winbond is a trademark of Winbond Electronics Corporation.
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● FCC Declaration

Notice for the USA

Compliance Information Statement (Supplier's Declaration of Conformity, SDoC)
FCC Part 15: This device complies with part 15 of the FCC Rules.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following conditions:
‧This device may not cause harmful interference.
‧This device must accept any interference received, including interference that may
cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful
interference in which case the user will be required to correct the interference at his
own expense.

Notice for Canada

This Class A digital apparatus complies with Canadian ICES-003. Cet appareil
numérique de la Classe A est conforme à la norme NMB-003 du Canada.

● Notice for Europe (CE Mark)

This product is in conformity with the Council Directive 2014/30/EU and 2014/35/EU.

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Warning
This equipment is compliant with Class A of CISPR 32. In a residential environment
this equipment may cause radio interference.

CAUTION
Lithium battery included with this board. Do not puncture, mutilate, or dispose of
battery in fire. There will be danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by manufacturer.
Dispose of used battery according to manufacturer instructions and in accordance
with your local regulations.

● VCCI-A
この装置は、クラスＡ情報技術装置です。この装置を家庭環境で使用すると電波妨
害を引き起こすことがあります。この場合には使用者が適切な対策を講ずるよう要
求されることがあります。

● Safety: EN/IEC 60950-1

This equipment is compliant with CB/LVD of Safety: EN/IEC 60950-1.

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About this Manual

This manual is intended for trained service technician/personnel with hardware

knowledge of personal computers.
It is aimed to provide you with instructions on installing your TYAN FA77-B7119.

How this guide is organized

This guide contains the following parts:

Chapter 1: Overview
This chapter provides an introduction to the TYAN FA77-B7119 barebones and
standard parts list, describes the external components, gives an overview of the
product from different angles.

Chapter 2: Setting Up
This chapter covers procedures on installing the processors, memory modules, hard
drivers and other optional parts.

Chapter 3: Replacing the Pre-installed Components

This chapter covers the removal and replacement procedures for pre-installed
components.

Chapter 4: Motherboard Information

This chapter lists the hardware setup procedures that you need to abide by when
installing system components. It includes description of the jumpers and connectors
on the motherboard.

Chapter5: BIOS Setup

This chapter tells how to change system settings through the BIOS setup menu.
Detailed descriptions of the BIOS parameters are also provided.

Chapter 6: Diagnostics
This chapter introduces some BIOS codes and technical terms to provide better
service for the customers.

Appendix:
This chapter provides the cable connection table, the FRU parts list for reference of
system setup, and technical support in case a problem arises with your system.

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Safety and Compliance Information
Before installing and using TYAN FA77-B7119, take note of the following
precautions:

·Read all instructions carefully.

·Do not place the unit on an unstable surface, cart, or stand.
·Do not block the slots and opening on the unit, which are provided for
ventilation.
· Only use the power source indicated on the marking label. If you are not
sure, contact the power company.

·The unit uses a three-wire ground cable, which is equipped with a third pin to
ground the unit and prevent electric shock. Do not defeat the purpose of this
pin. If your outlet does not support this kind of plug, contact your electrician
to replace your obsolete outlet.

·Do not place anything on the power cord. Place the power cord where it will
not be in the way of foot traffic.
·Follow all warnings and cautions in this manual and on the unit case.

·Do not push objects in the ventilation slots as they may touch high voltage
components and result in shock and damage to the components.

·When replacing parts, ensure that you use parts specified by the
manufacturer.

·When service or repairs have been done, perform routine safety checks to
verify that the system is operating correctly.

·Avoid using the system near water, in direct sunlight, or near a heating
device.
·Cover the unit when not in use.

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Safety Information
Retain and follow all product safety and operating instructions provided
with your equipment. In the event of a conflict between the instructions in
this guide and the instructions in equipment documentation, follow the
guidelines in the equipment documentation.
Observe all warnings on the product and in the operating instructions. To
reduce the risk of bodily injury, electric shock, fire and damage to the
equipment, observe all precautions included in this guide.
You must become familiar with the safety information in this guide before
you install, operate, or service TYAN products.

Symbols on Equipment
Caution. This symbol indicates a potential hazard.
The potential for injury exists if cautions are not
observed. Consult equipment documentation for
specific details.

Caution. Slide-mounted equipment is not to be

used as a shelf or a work space.

Warning. This symbol indicates the presence of

hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified personnel.
Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.
To reduce risk of injury from a hot component,
allow the surface to cool before touching.

General Precautions
· Follow all caution and warning instructions marked on the equipment and
explained in the accompanying equipment documentation.

Machine Room Environment

· This device is for use only in a machine room or IT room.
 · Make sure that the area in which you install the system is properly
ventilated and climate-controlled.

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· Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating label of the
equipment.
· Do not install the system in or near a plenum, air duct, radiator, or heat
register.
· Never use the product in a wet location.

Equipment Chassis
· Do not block or cover the openings to the system.
· Never push objects of any kind through openings in the equipment.
Dangerous voltages might be present.
· Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.
· Lift equipment using both hands and with your knees bent.

Equipment Racks
To avoid injury or damage to the equipment:
· Observe local occupational health and safety requirements and guidelines
for manual materials handling.
· Do not attempt to move a rack by yourself; a minimum of two people are
needed to move a rack.
· Do not attempt to move a fully loaded rack. Remove equipment from the
rack before moving it.
· Do not attempt to move a rack on an incline that is greater than 10 degrees
from the horizontal.
· Make sure the rack is properly secured to the floor or ceiling.
· Make sure the stabilizing feet are attached to the rack if it is a single-rack
installation.
· Make sure racks are coupled together if it is a multiple-rack installation.
· Make sure the rack is level and stable before installing an appliance in the
rack.
· Make sure the leveling jacks are extended to the floor.

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· Make sure the full weight of the rack rests on the leveling jacks.
· Always load the rack from the bottom up. Load the heaviest component in
the rack first.
· Make sure the rack is level and stable before pulling a component out of the
rack.
· Make sure only one component is extended at a time. A rack might become
unstable if more than one component is extended.

To avoid damage to the equipment:

· The rack width and depth must allow for proper serviceability and cable
management.
· Ensure that there is adequate airflow in the rack. Improper installation or
restricted airflow can damage the equipment.
· The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to ensure
adequate air flow to the system.
· If you install the Model in a rack, do not place equipment on top of the unit.
It will cause restricted airflow and might cause damage to the equipment.
· Make sure the product is properly matted with the rails. Products that are
improperly matted with the rails might be unstable.
· Verify that the AC power supply branch circuit that provides power to the
rack is not overloaded. This will reduce the risk of personal injury, fire, or
damage to the equipment. The total rack load should not exceed 80 percent
of the branch circuit rating. Consult the electrical authority having jurisdiction
over your facility wiring and installation requirements.

Equipment Power Cords

· Use only the power cords and power supply units provided with your
system. The system might have one or more power cords.
· Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.
· In all European electrical environments, you must ground the Green/Yellow
tab on the power cord. If you do not ground the Green/Yellow tab, it can
cause an electrical shock due to high leakage currents.
· Do not place objects on AC power cords or cables. Arrange them so that no
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one might accidentally step on or trip over them.
· Do not pull on a cord or cable. When unplugging from the electrical outlet,
grasp the cord by the plug.
· To reduce the risk of electrical shock, disconnect all power cords before
servicing the appliance.

Equipment Batteries
· The system battery contains lithium manganese dioxide. If the battery pack
is not handled properly, there is risk of fire and burns.
· Do not disassemble, crush, puncture, short external contacts, or dispose of
the battery in fire or water.
· Do not expose the battery to temperatures higher than 60°C (140°F).
· The system battery is not replaceable. If the battery is replaced by an
incorrect type, there is danger of explosion. Replace the battery only with a
spare designated for your product.
· Do not attempt to recharge the battery.
· Dispose of used batteries according to the instructions of the manufacturer.
Do not dispose of batteries with the general household waste. To forward
them to recycling or proper disposal, use the public collection system or return
them to TYAN, your authorized TYAN partner, or their agents.

Equipment Modifications
· Do not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compliance of TYAN equipment that has been
modified.

Equipment Repairs and Servicing

· The installation of internal options and routine maintenance and service of
this product should be performed by trained service technician/personnel who
are knowledgeable about the procedures, precautions, and hazards
associated with equipment containing hazardous energy levels.
· Do not exceed the level of repair specified in the procedures in the product
documentation. Improper repairs can create a safety hazard.
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· Allow the product to cool before removing covers and touching internal
components.
· Remove all watches, rings, or loose jewelry when working before removing
covers and touching internal components.
· Do not use conductive tools that could bridge live parts.
· Use gloves when you remove or replace system components; they can
become hot to the touch.
· If the product sustains damage requiring service, disconnect the product
from the AC electrical outlet and refer servicing to an authorized service
provider. Examples of damage requiring service include:
– The power cord, extension cord, or plug has been damaged.
– Liquid has been spilled on the product or an object has fallen into the
product.
– The product has been exposed to rain or water.
– The product has been dropped or damaged.
– The product does not operate normally when you follow the operating
instructions.

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NOTE

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 Table of Contents

Chapter 1: Overview....................................................................... 17
1.1 About the TYAN FA77-B7119 ................................................ 17
1.2 Product Models ....................................................................... 18
1.3 Features.................................................................................. 19
1.4 Standard Parts List ................................................................. 30
1.4.1 Box Contents ................................................................... 30
1.5 About the Product ................................................................... 31
1.5.1 System Front View ........................................................... 31
1.5.2 System Rear View ........................................................... 34
1.5.3 OCP Option Area............................................................. 36
1.5.4 System Top View............................................................. 38
Chapter 2: Setting Up..................................................................... 41
2.0.1 Before you Begin ............................................................. 41
2.0.2 Work Area ........................................................................ 41
2.0.3 Tools ................................................................................ 41
2.0.4 Precautions ...................................................................... 42
2.1 Installing Motherboard Components ...................................... 43
2.1.1 Removing the Chassis Cover .......................................... 43
2.1.2 Installing the CPU and Heat sink ..................................... 45
2.1.3 Installing the Memory ...................................................... 48
2.1.4 Installing the Expansion Card (PCIE Board) ................... 53
2.1.5 Installing the Expansion Card (OCP Riser Card) ............ 61
2.1.6 Installing Hard Drives ...................................................... 62
2.1.7 Installing Hard Drives (optional) ...................................... 63
2.2 Rack Mounting ........................................................................ 66
2.2.1 Installing the Server in a Rack ......................................... 66
2.2.2 Installing the inner Rails to the Chassis .......................... 67
2.2.3 Installing the Outer Rails to the Rack .............................. 69
2.2.4 Rack mounting the Server ............................................... 70
Chapter 3: Replacing Pre-Installed Components ........................ 73
3.1 Introduction ............................................................................. 73
3.2 Disassembly Flowchart........................................................... 73
3.3 Removing the Cover ............................................................... 74
3.4 Replacing the Power Supply .................................................. 74
3.5 Replacing the Front Panel Board ........................................... 75
3.5.1 Front Panel Board Features ............................................ 77
3.6 Replacing the Fan Board ........................................................ 78
3.6.1 Fan Board Features......................................................... 80
3.7 Replacing the HDD Backplane Board .................................... 81

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 3.7.1 HDD BP Board Features ................................................. 85
3.8 Replacing PCIE Board............................................................ 87
3.8.1 PCIE Board Features ...................................................... 89
3.9 Replacing the IO Bridge Board ............................................... 91
3.9.1 IO Bridge Board Features................................................ 92
3.10 Replacing the Rear IO Board ................................................. 93
3.10.1 Rear IO Board Features .................................................. 95
3.11 Replacing the OCP Riser Card .............................................. 96
3.11.1 OCP Riser Card Features ............................................... 97
3.12 Replacing the Motherboard .................................................... 98
Chapter 4: Motherboard Information .......................................... 101
4.1 Board Image ......................................................................... 102
4.2 Block Diagram ...................................................................... 103
4.3 Motherboard Mechanical Drawing ........................................ 104
4.4 Board Parts, Jumpers and Connectors ................................ 105
4.5 Thermal Interface Material.................................................... 112
4.6 Tips on Installing Motherboard in Chassis ........................... 113
4.7 Installing the Memory ........................................................... 115
4.8 Finishing Up .......................................................................... 118
Chapter 5: BIOS Setup ................................................................. 119
5.1 About the BIOS ..................................................................... 119
5.1.1 Setup Basics .................................................................. 119
5.1.2 Getting Help ................................................................... 120
5.1.3 In Case of Problems ...................................................... 120
5.1.4 Setup Variations ............................................................ 120
5.2 Main Menu ............................................................................ 121
5.3 Advanced Menu .................................................................... 123
5.3.1 iSCSI Configuration ....................................................... 125
5.3.2 Intel® Virtual RAID on CPU ........................................... 131
5.3.3 Trusted Computing ........................................................ 139
5.3.4 ACPI Settings ................................................................ 140
5.3.5 S5 RTC Wake Settings.................................................. 141
5.3.6 Serial Port Console Redirection .................................... 142
5.3.7 SIO Configuration .......................................................... 148
5.3.8 Option ROM Dispatch Policy ......................................... 150
5.3.9 PCI Subsystem Settings ................................................ 151
5.3.10 Network Stack Configuration ......................................... 152
5.3.11 CSM Configuration ........................................................ 154
5.3.12 USB Configuration......................................................... 156
5.3.13 Hardware Health Configuration ..................................... 158
5.3.14 NVDIMM ADR Configuration ......................................... 160
5.3.15 OnBoard Device Configuration ..................................... 161
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 5.4 Platform Configuration .......................................................... 162
5.4.1 PCH Configuration......................................................... 163
5.4.2 Miscellaneous Configuration ......................................... 172
5.4.3 Server ME Configuration ............................................... 173
5.5 Socket Configuration ............................................................ 174
5.5.1 Processor Configuration ................................................ 175
5.5.2 Common RefCode Configuration .................................. 177
5.5.3 UPI Configuration .......................................................... 179
5.5.4 Memory Configuration ................................................... 181
5.5.5 IIO Configuration ........................................................... 185
5.5.6 Advanced Power Management Configuration ............... 198
5.6 Server Management ............................................................. 205
5.6.1 System Event Log ......................................................... 207
5.6.2 BMC Network Configuration .......................................... 208
5.7 Security ................................................................................. 209
5.7.1 Secure Boot ................................................................... 210
5.8 Boot ...................................................................................... 214
5.8.1 Delete Boot Option ........................................................ 216
5.9 Save & Exit ........................................................................... 217
Chapter 6: Diagnostics ................................................................ 219
6.1 Flash Utility ........................................................................... 219
6.2 AMIBIOS Post Code (Aptio) ................................................. 220
Appendix I: How to recover UEFI BIOS ...................................... 229
Appendix II: How to install Power Wire Clip .............................. 231
Appendix III: Cable Connection Tables ...................................... 233
Appendix IV: Fan and Temp Sensors ......................................... 237
Appendix V: FRU Parts Table ...................................................... 243
Appendix VI: Technical Support ................................................. 245

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NOTE

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 Chapter 1: Overview

1.1 About the TYAN FA77-B7119

®
Congratulations on your purchase of the TYAN FA77-B7119, a highly optimized 4U
rack-mountable barebone system. The FA77-B7119 is designed to support dual
Intel® Xeon® Scalable Processor Families and up to 768GB RDIMM / 1536GB
LRDIMM / 3072GB RDIMM 3DS / LRDIMM 3DS, providing a rich feature set and
®
incredible performance. Leveraging advanced technology from Intel , the
FA77-B7119 server system is capable of offering scalable 32 and 64-bit computing,
high bandwidth memory design, and lightning-fast PCI-E bus implementation. The
FA77-B7119 not only empowers your company in nowadays IT demand but also
offers a smooth path for future application usage.

®
TYAN also offers the FA77-B7119 in a version that can support up to fourteen (14)
®
internal hot-swappable 2.5” SATA HDD/SSD or NVMe SSD with Intel RSTe 5.0
support. The FA77-B7119 uses TYAN’s latest chassis featuring a robust structure
and a solid mechanical enclosure. All of this provides FA77-B7119 the power and
flexibility to meet the needs of nowadays server application.

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1.2 Product Models
The system board within the Tyan Barebone is defined by the following models:
B7119F77V10E4HR-2T-N: Intel-based platform
B7119F77V14HR-2T-N: Intel-based platform
B7119F77V4HR-2T-N: Intel-based platform

Fabric CPU
Model SKU Internal HDD Bays
support

(10)2.5" H-S SATA

FA77-B7119 B7119F77V10E4HR-2T-N NO
+(4)H-S NVMe SSD

FA77-B7119 B7119F77V14HR-2T-N (14) H-S 2.5"SATA NO

FA77-B7119 B7119F77V4HR-2T-N (4) 3.5" H-S SATA HDD NO

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1.3 Features
TYAN FA77-B7119 (B7119F77V4HR-2T-N)
Form Factor 4U Rackmount
Chassis Model FA77
30.31" x 17.24" x 6.93"
Dimension (D x W x H)
System (770 x 438 x 176mm)
Motherboard S7119GMRE
Gross Weight 43.5 kg (95.9 lbs)
Net weight 27.5 kg (60.6 lbs)

(1) RST, (1) NMI, (1) ID,

Buttons
(1) PWR w/ LED
(1) HDD, (1) ID, (1) Warning,
Front Panel LEDs
(3) LAN
(1) VGA port, (2) USB 3.0 port,
I/O Ports
(1) COM Port

Type / Q'ty 3.5"/2.5" Hot-Swap SSD/HDD, (4)

HDD backplane
SAS 12Gb/s, SATA 6Gb/s
Internal Drive Bay support
Supported HDD
(4) SATA 6Gb/s
Interface
System Cooling
FAN (5+1) hot-swap 12cm fans
Configuration
Type RPSU
AC 100-127V/12A ,
Input Range
AC 200-240V/9.48A
Frequency 47-63 Hz
Max. 3,000 Watts for 100-127V AC
input,
Output Watts
Max. 4,800 Watts for 200-240V AC
Power Supply input
Efficiency PFC, 80 plus Platinum
3+1
NOTE: When use 100-127V AC
input, the system does not support
Redundancy
redundant PSU operation if the total
system load exceeds 30A (3000
Watts).

Socket Type / Q'ty LGA3647 / (2)

Processor Supported CPU
Intel Xeon Scalable Processor
Series

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 Thermal Design
Max up to 205W
Power (TDP) wattage
Up to 10.4/9.6 GT/s with Intel
System Bus UltraPath Interconnect (UPI)
support

PCH Intel C621

Chipset
Switch IC (2) PLX PEX8796

Supported DIMM Qty (12)+(12) DIMM slots

DDR4 RDIMM/RDIMM 3DS /
DIMM Type / Speed
LRDIMM/LRDIMM 3DS 2666
Up to 768GB RDIMM/ 1,536GB
Memory LRDIMM/ 3,072GB RDIMM 3DS /
Capacity
LRDIMM 3DS *Follow latest Intel
DDR4 Memory POR
Memory channel 6 Channels per CPU
Memory voltage 1.2V

(11) PCI-E Gen3 x16 slots,

(1) PCI-E Gen3 x16 Tyan
PCI-E Mezzanine slot,
Expansion Slots (1) PCI-E Gen3 x16 slot (OCP 2.0
slot)
Pre-install TYAN
M2217-L16-IO
Riser Card

(2) 10GbE ports,

Port Q'ty
(1) GbE port dedicated for IPMI
LAN
Controller Intel X540-BT2
PHY Realtek RTL8211E

(2) Mini-SAS HD
Connector
(8-ports)
Controller Intel C621
SATA
Speed 6.0 Gb/s
RAID 0/1/10/5 (Intel
RAID
RSTe)
Storage (2) SATA-III,
Connector (1) Mini-SAS HD (4
ports)
sSATA Controller Intel C621
Speed 6.0 Gb/s
RAID 0/1/10/5 (Intel
RAID
RSTe)

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 Connector type D-Sub 15-pin
Graphic Resolution Up to 1920x1200
Chipset Aspeed AST2500

(2) USB3.0 ports (at rear),

USB
(2) USB3.0 ports (at front)
COM (1) DB-9 COM port (at front)
I/O Ports
VGA (1) D-Sub 15-pin port (at front)
(2) 10GbE ports,
RJ-45
(1) GbE dedicated for IPMI

Please refer to our TPM supported

TPM (Optional) TPM Support
list.

Chipset Aspeed AST2500

Monitors temperature for CPU &
Temperature
memory & system environment
Monitors voltage for CPU, memory,
Voltage
System Monitoring chipset & power supply
Over temperature warning
LED indicator, Fan & PSU fail LED
indicator
Others Watchdog timer support

Onboard Chipset Onboard Aspeed AST2500

IPMI 2.0 compliant baseboard
AST2500 iKVM management controller (BMC),
Feature Supports storage over IP and remote
Server Management
platform-flash, USB 2.0 virtual hub
24-bit high quality video
AST2500 IPMI
compression, 10/100/1000 Mb/s
Feature
MAC interface

Brand / ROM size AMI, 32MB

Hardware Monitor, SMBIOS
3.0/PnP/Wake on LAN, Boot from
BIOS USB device/PXE via LAN/Storage,
Feature
User Configurable FAN PWM Duty
Cycle, Console Redirection, ACPI
sleeping states S4,S5, ACPI 6.1

Please refer to our AVL support

Operating System OS supported list
lists.

CE (DoC) Class A
Regulation
VCCI Class A

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 CB/LVD Yes
RCM Class A
FCC (SDoC) Class A

Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
Operating Environment
In/Non-operating
90%, non-condensing at 35° C
Humidity

RoHS RoHS 6/6 Compliant Yes

Manual (1) Quick Installation Guide

Installation CD (1) TYAN Device Driver CD
Package Contains
(1) FA77-B7119 w/NV Tesla-aware
Barebone
FW Barebone

TYAN FA77-B7119 (B7119F77V10E4HR-2T-N)

Form Factor 4U Rackmount
Chassis Model FA77
30.31" x 17.24" x 6.93"
Dimension (D x W x H)
System (770 x 438 x 176mm)
Motherboard S7119GMRE
Gross Weight 43.5 kg (95.9 lbs)
Net weight 27.5 kg (60.6 lbs)

(1) RST, (1) NMI, (1) ID,

Buttons
(1) PWR w/ LED
(1) HDD, (1) ID, (1) Warning,
Front Panel LEDs
(3) LAN
(1) VGA port, (2) USB 3.0 port,
I/O Ports
(1) COM Port

Type / Q'ty 2.5" Hot-Swap SSD/HDD/ (14)

HDD backplane
SAS 12Gb/s, SATA 6Gb/s/NVMe
Internal Drive Bay support
Supported HDD
(10) SATA 6Gb/s + (4) NVMe
Interface
System Cooling
FAN (5+1) hot-swap 12cm fans
Configuration
Type RPSU
Power Supply
Input Range AC 100-127V/12A ,

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 AC 200-240V/9.48A
Frequency 47-63 Hz
Max. 3,000 Watts for 100-127V AC
input,
Output Watts
Max. 4,800 Watts for 200-240V AC
input
Efficiency PFC, 80 plus Platinum
3+1
NOTE: When use 100-127V AC
input, the system does not support
Redundancy
redundant PSU operation if the total
system load exceeds 30A (3000
Watts).

Socket Type / Q'ty LGA3647/ (2)

Supported CPU
Intel Xeon Scalable Processor
Series
Processor Thermal Design
Max up to 205W
Power (TDP) wattage
Up to 10.4/9.6 GT/s with Intel
System Bus UltraPath Interconnect (UPI)
support

PCH Intel C621

Chipset
Switch IC (2) PLX PEX8796

Supported DIMM Qty (12)+(12) DIMM slots

DDR4 RDIMM/RDIMM 3DS /
DIMM Type / Speed
LRDIMM/LRDIMM 3DS 2666
Up to 768GB RDIMM/ 1,536GB
Memory LRDIMM/ 3,072GB RDIMM 3DS /
Capacity
LRDIMM 3DS *Follow latest Intel
DDR4 Memory POR
Memory channel 6 Channels per CPU
Memory voltage 1.2V

(11) PCI-E Gen3 x16 slots,

(1) PCI-E Gen3 x16 Tyan
PCI-E Mezzanine slot,
Expansion Slots (1) PCI-E Gen3 x16 slot (OCP 2.0
slot)
Pre-install TYAN
M2217-L16-IO
Riser Card

LAN (2) 10GbE ports,

Port Q'ty
(1) GbE port dedicated for IPMI

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 Controller Intel X540-BT2
PHY Realtek RTL8211E

(2) Mini-SAS HD
Connector
(8-ports)
Controller Intel C621
SATA
Speed 6.0 Gb/s
RAID 0/1/10/5 (Intel
RAID
RSTe)
Storage Connector (2) SATA-III
Controller Intel C621
sSATA Speed 6.0 Gb/s
RAID 0/1/10/5 (Intel
RAID
RSTe)
Connector (2) SFF-8612 for (4)
NVMe
(OCuLink) NVMe ports

Connector type D-Sub 15-pin

Graphic Resolution Up to 1920x1200
Chipset Aspeed AST2500

(2) USB3.0 ports (at rear),

USB
(2) USB3.0 ports (at front)
COM (1) DB-9 COM port (at front)
I/O Ports
VGA (1) D-Sub 15-pin port (at front)
(2) 10GbE ports,
RJ-45
(1) GbE dedicated for IPMI

Please refer to our TPM supported

TPM (Optional) TPM Support
list.

Chipset Aspeed AST2500

Monitors temperature for CPU &
Temperature
memory & system environment
Monitors voltage for CPU, memory,
Voltage
System Monitoring chipset & power supply
Over temperature warning
LED indicator, Fan & PSU fail LED
indicator
Others Watchdog timer support

Onboard Chipset Onboard Aspeed AST2500

Server Management AST2500 iKVM IPMI 2.0 compliant baseboard
Feature management controller (BMC),

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 Supports storage over IP and remote
platform-flash, USB 2.0 virtual hub
24-bit high quality video
AST2500 IPMI
compression, 10/100/1000 Mb/s
Feature
MAC interface

Brand / ROM size AMI, 32MB

Hardware Monitor, SMBIOS
3.0/PnP/Wake on LAN, Boot from
BIOS USB device/PXE via LAN/Storage,
Feature
User Configurable FAN PWM Duty
Cycle, Console Redirection, ACPI
sleeping states S4,S5, ACPI 6.1

Please refer to our AVL support

Operating System OS supported list
lists.

CE (DoC) Class A
VCCI Class A
Regulation CB/LVD Yes
RCM Class A
FCC (SDoC) Class A

Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
Operating Environment
In/Non-operating
90%, non-condensing at 35° C
Humidity

RoHS RoHS 6/6 Compliant Yes

Manual (1) Quick Installation Guide

Installation CD (1) TYAN Device Driver CD
Package Contains
(1) FA77-B7119 w/NV Tesla-aware
Barebone
FW Barebone

FA77-B7119 (B7119F77V14HR-2T-N)
Form Factor 4U Rackmount
Chassis Model FA77
30.31" x 17.24" x 6.93"
Dimension (D x W x H)
System (770 x 438 x 176mm)
Motherboard S7119GMRE
Gross Weight 43.5 kg (95.9 lbs)
Net weight 27.5 kg (60.6 lbs)

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 (1) RST, (1) NMI, (1) ID,
Buttons
(1) PWR w/ LED
(1) HDD, (1) ID, (1) Warning,
Front Panel LEDs
(3) LAN
(1) VGA port, (2) USB 3.0 port,
I/O Ports
(1) COM Port

Type / Q'ty 2.5" Hot-Swap SSD/HDD/ (14)

HDD backplane
SAS 12Gb/s, SATA 6Gb/s
Internal Drive Bay support
Supported HDD
(14) SATA 6Gb/s
Interface
System Cooling
FAN (5+1) hot-swap 12cm fans
Configuration
Type RPSU
AC 100-127V/12A,
Input Range
AC 200-240V/9.48A
Frequency 47-63 Hz
Max. 3,000 Watts for 100-127V AC
input,
Output Watts
Max. 4,800 Watts for 200-240V AC
Power Supply input
Efficiency PFC, 80 plus Platinum
3+1
NOTE: When use 100-127V AC
input, the system does not support
Redundancy
redundant PSU operation if the total
system load exceeds 30A (3000
Watts).

Socket Type / Q'ty LGA3647/ (2)

Supported CPU
Intel Xeon Scalable Processor
Series
Processor Thermal Design
Max up to 205W
Power (TDP) wattage
Up to 10.4/9.6 GT/s with Intel
System Bus UltraPath Interconnect (UPI)
support

PCH Intel C621

Chipset
Switch IC (2) PLX PEX8796

Supported DIMM Qty (12)+(12) DIMM slots

Memory DDR4 RDIMM/RDIMM 3DS /
DIMM Type / Speed
LRDIMM/LRDIMM 3DS 2666

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 Up to 768GB RDIMM/ 1,536GB
LRDIMM/ 3,072GB RDIMM 3DS /
Capacity
LRDIMM 3DS *Follow latest Intel
DDR4 Memory POR
Memory channel 6 Channels per CPU
Memory voltage 1.2V

(11) PCI-E Gen3 x16 slots,

(1) PCI-E Gen3 x16 Tyan
PCI-E Mezzanine slot,
Expansion Slots (1) PCI-E Gen3 x16 slot (OCP 2.0
slot)
Pre-install TYAN
M2217-L16-IO
Riser Card

(2) 10GbE ports,

Port Q'ty
(1) GbE port dedicated for IPMI
LAN
Controller Intel X540-BT2
PHY Realtek RTL8211E

(2) Mini-SAS HD
Connector
(8-ports)
Controller Intel C621
SATA
Speed 6.0 Gb/s
RAID 0/1/10/5 (Intel
RAID
RSTe)
Storage (2) SATA-III,
Connector (1) Mini-SAS HD
(4-ports)
sSATA Controller Intel C621
Speed 6.0 Gb/s
RAID 0/1/10/5 (Intel
RAID
RSTe)

Connector type D-Sub 15-pin

Graphic Resolution Up to 1920x1200
Chipset Aspeed AST2500

(2) USB3.0 ports (at rear),

USB
(2) USB3.0 ports (at front)
COM (1) DB-9 COM port (at front)
I/O Ports
VGA (1) D-Sub 15-pin port (at front)
(2) 10GbE ports,
RJ-45
(1) GbE dedicated for IPMI

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 Please refer to our TPM supported
TPM (Optional) TPM Support
list.

Chipset Aspeed AST2500

Monitors temperature for CPU &
Temperature
memory & system environment
Monitors voltage for CPU, memory,
Voltage
System Monitoring chipset & power supply
Over temperature warning
LED indicator, Fan & PSU fail LED
indicator
Others Watchdog timer support

Onboard Chipset Onboard Aspeed AST2500

IPMI 2.0 compliant baseboard
AST2500 iKVM management controller (BMC),
Feature Supports storage over IP and remote
Server Management
platform-flash, USB 2.0 virtual hub
24-bit high quality video
AST2500 IPMI
compression, 10/100/1000 Mb/s
Feature
MAC interface

Brand / ROM size AMI, 32MB

Hardware Monitor, SMBIOS
3.0/PnP/Wake on LAN, Boot from
BIOS USB device/PXE via LAN/Storage,
Feature
User Configurable FAN PWM Duty
Cycle, Console Redirection, ACPI
sleeping states S4,S5, ACPI 6.1

Please refer to our AVL support

Operating System OS supported list
lists.

CE (DoC) Class A
VCCI Class A
Regulation CB/LVD Yes
RCM Class A
FCC (SDoC) Class A

Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
Operating Environment
In/Non-operating
90%, non-condensing at 35° C
Humidity

RoHS RoHS 6/6 Compliant Yes

Package Contains Manual (1) Quick Installation Guide

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 Installation CD (1) TYAN Device Driver CD
(1) FA77-B7119 w/NV Tesla-aware
Barebone
FW Barebone

NOTE:
1. The specifications are subject to change without prior notice.
2. Please visit our Web site for the latest specifications.

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1.4 Standard Parts List
This section describes FA77-B7119 package contents and accessories. Open the
box carefully and ensure that all components are present and undamaged. The
product should arrive packaged as illustrated below.

1.4.1 Box Contents

FA77-B7119 Chassis Kit

1. 4U chassis
2. (3+1) 4,800W (80+ Platinum) power Supply
3. (6) 120X120X38MM FAN
4. (1) S7119 Motherboard
5. M1713F77C-FPB Front Panel board
6. M1284F77D-BP12E-14 HDD Backplane
7. M1291F77D-BP12E-4 HDD Backplane (for B7119F77V4HR-2T-N SKU only)
8. M7119FA77-IO PCIE board
9. M7119FA77-RIO Rear IO board
10. M2218-GF16 IO Bridge
11. M2217-L16-IO OCP riser card
12. M1809F77A-FB FAN board
13. M7076-X540-2T LAN card

FA77-B7119 Accessory Kit

1. CPU heatsink *2
2. Rail Kit *1
3. Quick Installation Guide *1
4. Driver CD*1
5. Mounting ear kit*1
6. AC Power code (US) *4
7. AC Power code (EU) *4
8. 2*4P GPU Power Cable*10
9. Air duct*1
10. CPU CLIP*2
11. Screw Pack *1

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1.5 About the Product
The following views show you the product.

1.5.1 System Front View

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M1713F77C-FPB Front Panel LED Control Board

Switch and LED Indication

LED
Item Status Behavior Note
Color
5. LAN1
6. LAN2 NA NA NA No Function
7. LAN3
Power On Green Solid On
8. Power
Power Off Green Off
Located Blue Solid On
9. ID
Free Blue Off
10. HDD Activity Access Green Blinking
BMC & HWM system
Normal Amber Off
alert event
11. Warning
(＊) N+1 Redundant
Alert Amber Solid On
PSU Indication

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HDD LED Indications

For 2.5” Device SKU (M1284F77D-BP12E-14 HDD BP pre-installed)

Drive State Active LED (Green) Status LED (Red)

Drive Present, not Active Solid On Off
Drive Present, Active Blinking Off
Drive Failure Off Solid On
RAID Rebuild Blinking Blinking @ 4 Hz
Drive Locate Identifier Blinking Blinking @ 1 Hz

For 2.5”/3.5” Device SKU (M1291F77D-BP12E-4 HDD BP pre-installed)

LED Color State Description

NVME/SATA/SAS HDD
HDD Fail LED ON
Red Failed
(Status LED)
OFF No failure found
NVME/SATA/SAS HDD
ON
Ready
HDD Power/Access LED NVME/SATA/SAS HDD
Green Blinking
(Active LED) Access Activity
OFF Power Disconnected

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1.5.2 System Rear View

No. Description
1 PSU0
2 PSU1
3 PSU2
4 PSU3
5 PSU LED
6 Power Wire Clip Jack
OCP Option Area (M7119FA77-RIO pre-installed)
7
(M7076-X540-2T LAN Card pre-installed in this picture)
8 PCIE Gen3 x16 Slots

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PSU LED Definitions

Dual-color
Power Supply Condition Green LED Amber LED
No AC power to all power supplies OFF OFF
Power supply critical event causing
a shutdown; failure, OCP, OVP, OFF Amber
Fan Fail, OTP, UVP
Power supply warning events
where the power supply continues
to operate; high temp (inlet
temperature >54 Deg (PMBus 0.5Hz
OFF
reading), or hot spot temperature Blinking Amber
>105 deg (PMBus reading), high
power, high current, slow fan
(<1200rpm)
AC present only 12VSB on (PS off) 0.5Hz
OFF
or PS in Smart Redundant state Blinking Green
Output ON and OK ON OFF
AC cord unplugged or AC power
lost, with a second power supply in OFF Amber
parallel still with AC input power
2Hz
FW Update Mode OFF
Blinking Green

Warning: All PSUs have to be AC-ON at the same time before you power on the
system.

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1.5.3 OCP Option Area

1. LAN1: from Realtek RTL8211E PHY for IPMI

2. USB3.0 Ports
3. Other: via PCIE x16 OCP2.0 Slot, add 2 SFP+ or 2 RJ45 Ports.
NOTE:
1. M7119FA77-RIO is pre-installed.
2. M7076-X540-2T LAN Card is pre-installed in this picture.

LAN LED Definitions

10Gbps LAN Port LAN Indication

10Gbps LAN Link/Activity LED Scheme

Left LED Right LED

(Link/Activity) (Speed)
LED Color: Green LED Color: Yellow

No Link OFF OFF

Link Green Solid On Green Solid On
100 Mbps
Active Green Blinking Green Solid On
1000 Mbps Link Green Solid On Yellow Solid On
(1Gbps) Active Green Blinking Yellow Solid On
Link Yellow Solid On Yellow Solid On
10 Gbps
Active Yellow Blinking Yellow Solid On

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1Gbps LAN Port LAN Indication

1Gbps LAN Link/Activity LED Scheme

Left LED Right LED

(Link/Activity) (Speed)
LED Color: Green LED Color: Amber

No Link OFF OFF

Link Green Solid On OFF
10 Mbps
Active Green Blinking OFF
Link Green Solid On Green Solid On
100 Mbps
Active Green Blinking Green Solid On
1000 Mbps Link Green Solid On Amber Solid On
(1Gbps) Active Green Blinking Amber Solid On

NOTE: “Left” and “Right” are viewed from the rear panel.

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1.5.4 System Top View

HDD Configurations
1. (14) SATA (#1~#14)
2. (10) SATA (#1~#2, #7~#14) + (4) NVMe (#3~#6)

B7119F77V10E4HR-2T-N & B7119F77V14HR-2T-N

No. Description
(14) 2.5” HDDs/SSDs (HDD0 ~ HDD13) w/
1~14
M1284F77D-BP12E-14 HDD BP Board pre-installed
15 M1713F77C-FPB Front Panel Board
16 System Fans
17 CPU0
18 CPU1
PCIE Gen3 x16 OCP2.0 Slot for SAS Card (from CPU#1,
19
M2217-L16-IO pre-installed)
20~24 PCIE Gen3 x16 Slots (FH/FL, GPU#1 ~ GPU#5)
25 PCIE Gen3 x16 Slot (FH/FL)
26~30 PCIE Gen3 x16 Slots (FH/FL, GPU#6 ~ GPU#10)
31 M7119FA77-IO PCIE Board
NOTE: The system is pre-installed with S7119 motherboard.
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HDD Configurations
1. (4) SATA (#1~#4)

B7119F77V4HR-2T-N
No. Description
(4) 2.5” / 3.5” HDDs/SSDs (HDD0 ~ HDD3) w/
1~4
M1291F77D-BP12E-4 HDD BP Board pre-installed
5 M1713F77C-FPB Front Panel Board
6 System Fans
7 CPU0
8 CPU1
PCIE Gen3 x16 OCP2.0 Slot for SAS Card (from CPU#1,
9
M2217-L16-IO pre-installed)
10~14 PCIE Gen3 x16 Slots (FH/FL, GPU#1 ~ GPU#5)
15 PCIE Gen3 x16 Slot (FH/FL)
16~20 PCIE Gen3 x16 Slots (FH/FL, GPU#6 ~ GPU#10)
21 M7119FA77-IO PCIE Board
NOTE: The system is pre-installed with S7119 motherboard.

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NOTE

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 Chapter 2: Setting Up

2.0.1 Before you Begin

This chapter explains how to install the CPUs, CPU heatsinks, memory
modules, and hard drives. Instructions on inserting add on cards are
also given.

2.0.2 Work Area

Make sure you have a stable, clean working environment. Dust and dirt
can get into components and cause malfunctions. Use containers to
keep small components separated. Putting all small components in
separate containers prevents them from becoming lost. Adequate
lighting and proper tools can prevent you from accidentally damaging
the internal components.

2.0.3 Tools

The following procedures require only a few tools, including the

following:

 A cross head (Phillips) screwdriver

 A grounding strap or an anti-static pad
 A T30 Security Torx screwdriver
 A Hex screwdriver

Most of the electrical and mechanical connections can be disconnected

using your fingers. It is recommended that you do not use needle-nosed
pliers to remove connectors as these can damage the soft metal or
plastic parts of the connectors.

Caution!
1. To avoid damaging the motherboard and associated
components, use torque force within the range 5~7
kgf/cm (4.35 ~ 6.09 lb/in) on each mounting screw
for motherboard installation.
2. Do not apply power to the board if it has been
damaged.

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2.0.4 Precautions

Components and electronic circuit boards can be damaged by

discharges of static electricity. Working on a system that is connected to
a power supply can be extremely dangerous. Follow the guidelines
below to avoid damage to FA77-B7119 or injury to yourself.

 Ground yourself properly before removing the top cover of the

system. Unplug the power from the power supply and then touch a
safely grounded object to release static charge (i.e. power supply
case). If available, wear a grounded wrist strap. Alternatively,
discharge any static electricity by touching the bare metal chassis
of the unit case, or the bare metal body of any other grounded
appliance.

 Avoid touching motherboard components, IC chips, connectors,

memory modules, and leads.

 The motherboard is pre-installed in the system. When removing

the motherboard, always place it on a grounded anti-static surface
until you are ready to reinstall it.

 Hold electronic circuit boards by the edges only. Do not touch the
components on the board unless it is necessary to do so. Do not
flex or stress circuit boards.

 Leave all components inside the static-proof packaging that they

ship with until they are ready for installation.

 After replacing optional devices, make sure all screws, springs, or

other small parts are in place and are not left loose inside the case.
Metallic parts or metal flakes can cause electrical shorts.

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2.1 Installing Motherboard Components
This section describes how to install components on to the motherboard, including
CPUs, memory modules and Add-on cards.

2.1.1 Removing the Chassis Cover

Follow these instructions to remove FA77-B7119 chassis cover.

1. Loosen 2 thumb screws and 2 screws on the rear top cover.

2． Slide to lift up the rear top cover.

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3． Unscrew the front top cover.

4. Release the latch to lift up the front top cover from the chassis.

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2.1.2 Installing the CPU and Heat sink

Follow the steps below on installing CPUs and CPU heatsinks.

1. Align and install the processor on the carrier.

2. Carefully flip the heatsink. Then install the carrier assembly on the bottom of
the heatsink and make sure the guide pin is located in the correct direction.

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3. Always start with CPU0 first. Remove the CPU Socket protection cap. Locate
the CPU socket’s gold arrow (guide pin).

NOTE: A new heatsink comes with pre-applied thermal grease.

Once the heatsink has been removed from the processor, you need to clean the
processor and heatsink using an alcohol solvent. Then apply new thermal grease
before reinstalling the heatsink.

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4. Carefully flip the heatsink. Align the heatsink with the CPU socket by the guide
pins and make sure the guide pin is located in the correct direction. Then place the
heatsink onto the top of the CPU socket.

5. To secure the heatsink, use a T30 Security Torx to tighten the screws in a
sequential order (1234).
NOTE: When disassembling the heatsink, loosen the screws in reverse order
(4321).
6. Repeat the procedures described earlier to install the second processor and
heatsink.

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2.1.3 Installing the Memory

Follow these instructions to install the memory modules onto the motherboard.

1. Press the memory slot locking levers in the direction of the arrows as shown in
the following illustration.

2. Align the memory module with the slot. When inserted properly, the memory
slot locking levers lock automatically onto the indentations at the ends of the module.

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DIMM Location

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Recommended Memory Population Table

Quantity of
Single CPU Installed
memory installed
(CPU0 only)
1 2 3 4 5 6 7 8 9 10 11 12
CPU0_DIMM_A0 √ √ √ √ √ √ √ √ √ √ √ √
CPU0_DIMM_A1 √ √ √ √ √ √
CPU0_DIMM_B0 √ √ √ √ √ √ √ √ √ √ √
CPU0_DIMM_B1 √ √ √ √ √
CPU0_DIMM_C0 √ √ √ √ √ √ √ √ √ √
CPU0_DIMM_C1 √ √ √ √
CPU0_DIMM_D0 √ √ √ √ √ √ √ √ √
CPU0_DIMM_D1 √ √ √
CPU0_DIMM_E0 √ √ √ √ √ √ √ √
CPU0_DIMM_E1 √ √
CPU0_DIMM_F0 √ √ √ √ √ √ √
CPU0_DIMM_F1 √
CPU1_DIMM_A0
CPU1_DIMM_A1
CPU1_DIMM_B0
CPU1_DIMM_B1
CPU1_DIMM_C0
CPU1_DIMM_C1
CPU1_DIMM_D0
CPU1_DIMM_D1
CPU1_DIMM_E0
CPU1_DIMM_E1
CPU1_DIMM_F0
CPU1_DIMM_F1

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 Quantity of
Dual CPU Installed
memory installed
(CPU0 and CPU1)
2 4 6 8 10 12 14 16 18 20 22 24
CPU0_DIMM_A0 √ √ √ √ √ √ √ √ √ √ √ √
CPU0_DIMM_A1 √ √ √ √ √ √
CPU0_DIMM_B0 √ √ √ √ √ √ √ √ √ √ √
CPU0_DIMM_B1 √ √ √ √ √
CPU0_DIMM_C0 √ √ √ √ √ √ √ √ √ √
CPU0_DIMM_C1 √ √ √ √
CPU0_DIMM_D0 √ √ √ √ √ √ √ √ √
CPU0_DIMM_D1 √ √ √
CPU0_DIMM_E0 √ √ √ √ √ √ √ √
CPU0_DIMM_E1 √ √
CPU0_DIMM_F0 √ √ √ √ √ √ √
CPU0_DIMM_F1 √
CPU1_DIMM_A0 √ √ √ √ √ √ √ √ √ √ √ √
CPU1_DIMM_A1 √ √ √ √ √ √
CPU1_DIMM_B0 √ √ √ √ √ √ √ √ √ √ √
CPU1_DIMM_B1 √ √ √ √ √
CPU1_DIMM_C0 √ √ √ √ √ √ √ √ √ √
CPU1_DIMM_C1 √ √ √ √
CPU1_DIMM_D0 √ √ √ √ √ √ √ √ √
CPU1_DIMM_D1 √ √ √
CPU1_DIMM_E0 √ √ √ √ √ √ √ √
CPU1_DIMM_E1 √ √
CPU1_DIMM_F0 √ √ √ √ √ √ √
CPU1_DIMM_F1 √

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NOTE:
1. √ indicates a populated DIMM slot.
2. Use paired memory installation for max performance.
3. Populate the same DIMM type in each channel, specifically
- Use the same DIMM size
- Use the same # of ranks per DIMM
4. Always install with CPU0 Socket and CPU0_DIMM_A0 Slot first, following the
alphabetical order.

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2.1.4 Installing the Expansion Card (PCIE Board)

Follow these instructions to install the PCIE cards.

Installing Expansion Cards

1. Unscrew to remove the GPU Bracket.

2. Locate the PCI-E Gen.3 x16 slot on the motherboard. Unscrew to take out
the dummy brackets.

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3. Insert the expansion card into the PCIE Gen. 3 slot and screw it to the chassis.
Connect the PWR cable to the expansion card and motherboard.

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4. Secure the GPU Bracket to the chassis with 4 screws.

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Optional GPU Extend Kit

FA77-B7119 provides optional GPU extend kits FRU-SM-9050 for customers.

Follow the instructions to install the expansion cards with card brackets or card
guides.

With Card Bracket

1. Unscrew to remove the Linkbar and GPU Bracket.

2. Loosen three screws on the motherboard.

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3. Insert the GPU Linkbard into the chassis and secure it to the chassis with
seven screws (3 to the motherboard, 2 on each side of the Linkbar to the chassis).

4. Locate the PCI-E Gen.3 x16 slot on the motherboard. Unscrew to take out
the dummy brackets.

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5. Screw the GPU card bracket to the GPU card.

6. Insert the GPU card into the PCIE Gen. 3 slot and screw the GPU card to the
chassis. Connect the GPU PWR cable to the GPU card and motherboard.

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With Card Guide
1. Unscrew to remove the brackets from the Linkbar.

2. Insert the card guide onto the Linkbar.

3. Screw the Linkbar to the chassis.

4. Align the expansion card with the card guide and insert the card onto the PCIE
slot as shown.

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5. Screw the expansion card to the chassis.

6. Connect the power cable to the expansion card and the motherboard.

7. Replace the 4.5U rear top cover.

NOTE: Please contact your local dealer for 4.5U rear top cover (FRU-ST-9010) and Power
Cable (FRU-CS-0310) for GTX card support.

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2.1.5 Installing the Expansion Card (OCP Riser Card)

Follow these instructions to install the M7076-3008-8I onto the OCP Riser Card Slot.

1. Locate the OCP Riser Card Slot.

2. Insert the M7076-3008-8I onto the OCP Riser Card Slot and use 4 screws to
secure it to the chassis.

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2.1.6 Installing Hard Drives
The FA77-B7119 supports fourteen 2.5” HDD/SSD. Follow these instructions to
install a hard drive.

1. Pull the HDD tray out from the chassis.

2. Remove 4 screws to detach the HDD tray bracket.

3. Place a HDD/SSD into the drive tray. Use four screws to secure the HDD/SSD.

4. Reinsert the HDD tray into the HDD cage.

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2.1.7 Installing Hard Drives (optional)

The B7119F77V4HR-2T-N SKU supports four 2.5”/3.5” HDD/SSD. Follow these

instructions to install a hard drive.

3.5” Hard Disk Drive

1. Push the latches to pull the HDD tray out.

2. Adjusting the 4 HDD locks to the 3.5” location.

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3. Place a 3.5” HDD into the HDD tray.

4. Reinsert the HDD tray into the chassis.

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2.5” Hard Disk Drive

1. Adjusting the 4 HDD locks to the 2.5” location.

2. Secure the 2 standoffs to the 2.5” HDD.

3. Insert the HDD into the HDD tray.

4. Reinsert the HDD tray into the chassis.

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2.2 Rack Mounting

After installing the necessary components, FA77-B7119 can be

mounted in a rack using the supplied rack mounting kit.

Rack mounting kit

Rail with Bracket x 2
Mounting Ears x 2
Screw Sack x 2
NOTE: The users have to prepare two screws and two nuts on their own
for rack mounting.

2.2.1 Installing the Server in a Rack

Follow these instructions to mount the FA77-B7119 into an industry
standard 19” rack.

Note:
Before mounting FA77-B7119 in a rack, ensure that all
internal components have been installed and that the unit
has been fully tested.

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2.2.2 Installing the inner Rails to the Chassis
1. Screw the mounting ear to each side of FA77-B7119 as shown using 4 screws
from the supplied screws kit.

2. Press the latch key to draw out the inner rails from sliding rails.

3. Secure inner rails to both sides of the chassis. Be sure the mounting holes are
correctly matched.

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4. Secure the screws to both sides of the chassis.

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2.2.3 Installing the Outer Rails to the Rack

1. Please note to prepare two nuts and two screws before you start the work.

2. Secure the outer rails to the rack.

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2.2.4 Rack mounting the Server
1. Lift the chassis and then insert the inner slide rails into the outer rails.

2. Push the chassis in.

3. Screw the mounting ears of chassis to the rack.

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4. Press the latch keys on both sides simultaneously to pull the system out.

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NOTE

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 Chapter 3: Replacing Pre-Installed Components
3.1 Introduction
This chapter explains how to replace the pre-installed components, including the
S7119 Motherboard, M1713F77C-FPB Front Panel Board, M1809F77A-FB Fan
Board, M2217-L16-IO OCP Riser Card, M1284F77D-BP12E-14 /
M1291F77D-BP12E-4 HDD Backplane Board, M7119FA77-IO PCIE Board,
M7119FA77-RIO Rear IO Board, M2218-GF16 IO Bridge, System Fan and Power
Supply etc.

3.2 Disassembly Flowchart

The following flowchart outlines the disassembly procedure.

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3.3 Removing the Cover
Follow Chapter 2.1.1 to remove the cover of FA77-B7119.

3.4 Replacing the Power Supply

To replace the power supply follow these instructions.

1. First pull up the lever and press the tab as shown to pull out the power
supply module.

2. Replace a new single power and reinsert it into the power cage following
the above steps in reverse.

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3.5 Replacing the Front Panel Board
Follow these instructions to replace the M1713F77C-FPB Front Panel Board.

1. Disconnect the USB3.0 and Front Panel Cable.

2. Unscrew to remove the front panel board module.

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3. Loosen three screws to take out the front panel board. Remove the ID Button
cap, LED sponge and LED Lens to reinstall in the new Front Panel Board.

4. Follow the steps described earlier in reverse order to reinstall the front panel
board module.

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3.5.1 Front Panel Board Features

M1713F77C-FPB Front Panel Board

 SSI 24-pin front panel I/O connector to MB
 (1) 20-pin front panel USB3.0 connector to MB
 BTN: PWR BTN w/LED, Reset BTN, ID BTN, NMI
BTN
Specifications
 LED: PWR LED (green), Warning LED (amber), ID
LED (blue), HDD LED (green), LAN active LED (green)
 I/O: (2) Type-A USB3.0 Connector
 Temperature sensor inlet build-in

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3.6 Replacing the Fan Board
Follow these instructions to replace the M1809F77A-FB Fan Board.

1. Remove all Fan modules.

2. Unscrew the fan cage.

3. Lift up the fan cage.

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4. Disconnect all cables from the Fan Board.

5. Unscrew to replace with a new Fan Board. Follow the steps in reverse order
to reinstall the Fan Board.

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3.6.1 Fan Board Features

M1809F77A-FB Fan Board

Support (6) 120x38 mm system FAN
(4) 4-pin B4P RA PWR Connector (run DC+12V)
Specifications
(6) 4-pin Hot-swap FAN Connector
(1) 20-pin barebone system FAN connector to MB

FAN Sequence

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3.7 Replacing the HDD Backplane Board
Follow these instructions to replace the M1284F77D-BP12E-14 HDD Backplane
Board.

1. Remove the screws on both sides of the chassis.

2. Remove all HDD trays from the HDD cage.

3. Refer to Section 3.5 Replacing the Front Panel Board to take out the Front
Panel Board Tray.

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4. Unscrew the Front COM and VGA Ports.

5. Disconnect the COM and VGA cables.

6. Unscrew to release the HDD Cage.

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7. Lift up the HDD cage from the chassis

8. Disconnect all cables connected to the HDD BP Board.

NVME SKU (R) SATA SKU (R)

NVME & SATA SKU (L)

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9. Unscrew the HDD BP Board from the chassis.

10. Take out the HDD BP Board to replace with a new one. Follow the
procedures described earlier in reverse order to reinstall the HDD BP Board
and HDD cage.

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3.7.1 HDD BP Board Features

M1284F77D-BP12E-14 HDD Backplane Board

Support 14 hot-swappable 2.5” HDD/SSD or NVMe SSD,
speed up to 12Gb/s
Onboard HDD LED indication for HDD status
(Active/Status)
Specifications
(3) B4P HDD PWR Connector
(2) 7-pin SATA Connector
(3) Mini-SAS HD Connector
(2) SFF-8611 OCuLink connectors

HDD/SSD sequence

Port
0 1 2 3 4 5 6 7 8 9 10 11 12 13
#
sSATA4 sSATA5 sSATA0~3 SATA0~7

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 M1291F77D-BP12E-4 HDD Backplane Board
 Support (4) swappable 2.5”/3.5” HDD/SSD
 Speed up to SATA 6G/s, SAS 12G/s, NVMe 8G/s
 Onboard HDD LED indication for HDD status
(Active/Status)
Specifications  (2) B4P HDD power connector (PW1, PW2)
 (2) OCULink connector (J1, J2)
 (1) Mini-SAS HD connector (SATA0_3)
 (4) SFF-8639 connector (HDD0, HDD1, HDD2,
HDD3)
NOTE: This HDD BP Board is pre-installed for B7119F77V4HR-2T-N only.

HDD/SSD sequence

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3.8 Replacing PCIE Board
Follow these instructions to replace the M7119FA77-IO PCIE Board.

1. Unscrew to remove the GPU Bracket.

2. Disconnect all cables connected to the PCIE Board.

3. Unscrew to lift up the PCIE Board Bracket (totally 16 screws).

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4. Unscrew the PCIE Board from the M2218-GF16 IO Bridge Bracket.

5. Replace the PCIE Board with a new one. Follow the steps described earlier in
reverse order to reinstall the PCIE Board Bracket.

NOTE:
Please refer to the thermal condition table below for GPU card support limitation.
SKU Name V100 P100 P40 P4
B7119F77V14HR- 10 pcs. @ 30℃ 10 pcs. @ 30℃ 8 pcs. @ 35℃ 20 pcs. @ 35℃
2T-N 2x SFF(HDD0,1) 2x SFF(HDD0,1) #2，4，6，8， Except slot #11
B7119F77V10E4 15，17，19，21
HR-2T-N
B7119F77V4HR-2 10 pcs. @ 30℃ 10 pcs. @ 30℃ 8 pcs. @ 35℃ 20 pcs. @ 35℃
T-N 4x LFF 4x LFF #2，4，6，8， Except slot #11
15，17，19，21

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3.8.1 PCIE Board Features

Front View

M7119FA77-IO PCIE Board

Dual PCIE x24 lanes input and expansion to
(1) PCIEx16 + (10) DW PCIE x16 slots or
(1) PCIE x16 + (20) PCIE x8 slots
NOTE: There are 10 PCIE Card Jumpers on the PCIE Board.

PCIE x8/x16 Select Jumper:

3PHD_1, 3PHD_3, 3PHD_5, 3PHD_7, 3PHD_9, 3PHD_12,
Specifications 3PHD_14, 3PHD_16, 3PHD_18, 3PHD_20

Pin 1-2 closed: Normal Mode (default)

Pin 2-3 closed: Insert PCIE x16 card to x8 slot.
PCI-E #1: 3PHD_1 PCI-E #12: 3PHD_12
PCI-E #3: 3PHD_3 PCI-E #14: 3PHD_14
PCI-E #5: 3PHD_5 PCI-E #16: 3PHD_16
PCI-E #7: 3PHD_7 PCI-E #18: 3PHD_18
PCI-E #9: 3PHD_9 PCI-E #20: 3PHD_20

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Rear View

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3.9 Replacing the IO Bridge Board
Follow these instructions to replace the M2218-GF16 IO Bridge Board.

1. Unscrew the M7119FA77-IO PCIE Board Bracket.

2. Flip the IO Bridge Bracket over and unscrew to replace the M2218-GF16 IO
Bridge Boards.

3. Follow the steps described earlier in reverse order to reinstall the IO Bridge
Bracket.

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3.9.1 IO Bridge Board Features

Front View

M2218-GF16 IO Bridge Board

PCIE x24 lanes bridge board between S7119 and

Specifications
M7119FA77-IO PCIE Board

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3.10 Replacing the Rear IO Board
Follow these instructions to replace the M7119FA77-RIO Rear IO Board.

1. Unscrew the Rear IO Bracket.

2. Push both latches to pull the Rear IO Bracket out.

3. Unscrew to remove the iron bracket.

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4. Unscrew to lift up the pre-installed M7076-X540-2T LAN card.

5. Replace with a new Rear IO Board.

6. Follow the steps described earlier in reverse order to reinstall the Rear IO
Bracket.

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3.10.1 Rear IO Board Features

Front View

M7119FA77-RIO Rear IO Board

 Rear I/O card for FA77-B7119

 Provide (1) 1G RJ-45 port for IPMI + (2) USB3.0
ports + (1) ID BTN w/ blue LED
Specifications
 (1) FCI Board to board connector to mainboard
 (1) OCP type-A + (1) OCP type-B connector for NIC
OCP card

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3.11 Replacing the OCP Riser Card
Follow these instructions to replace the M2217-L16-IO OCP Riser Card.

1. Unscrew to lift up the M2217-L16-IO OCP Riser Card and replace with a new
one.

2. Follow the steps described earlier in reverse order to reinstall the OCP Riser
Card.

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3.11.1 OCP Riser Card Features

Front View

M2217-L16-IO OCP Riser Card

Specifications  PCIE x16 support (1) OCPA slot + (1) OCPB slot

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3.12 Replacing the Motherboard
After removing all of the aforementioned cables and components, follow these
instructions to remove the motherboard from the chassis.

1. Lift up the PSU0 air duct.

2. Refer to 3.10 Replacing the Rear IO Board to remove the Rear IO Board
Bracket. Unscrew to lift up the Linkbar.
3. Use a hex screwdriver and Phillips screwdriver to loosen screws.

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4. Disconnect all cables on the motherboard.

5. Unscrew the motherboard to lift it up for replacement.

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NOTE

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 Chapter 4: Motherboard Information

You are now ready to install your motherboard.

How to install our products right… the first time

The first thing you should do is read this user’s manual. It contains important
information that will make configuration and setup much easier. Here are some
precautions you should take when installing your motherboard:

(1) Ground yourself properly before removing your motherboard from the
antistatic bag. Unplug the power from your computer power supply and
then touch a safely grounded object to release static charge (i.e. power
supply case). For the safest conditions, MITAC recommends wearing a
static safety wrist strap.
(2) Hold the motherboard by its edges and do not touch the bottom of the
board, or flex the board in any way.
(3) Avoid touching the motherboard components, IC chips, connectors,
memory modules, and leads.
(4) Place the motherboard on a grounded antistatic surface or on the antistatic
bag that the board was shipped in.
(5) Inspect the board for damage.

The following pages include details on how to install your motherboard into your
chassis, as well as installing the processor, memory, disk drives and cables.

Caution!
1. To avoid damaging the motherboard and associated
components, use torque force within the range 5~7
kgf/cm (4.35 ~ 6.09 lb/in) on each mounting screw
for motherboard installation.
2. Do not apply power to the board if it has been
damaged.

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4.1 Board Image

S7119

This picture is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above picture.

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4.2 Block Diagram

S7119 Block Diagram

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4.3 Motherboard Mechanical Drawing

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4.4 Board Parts, Jumpers and Connectors

This diagram is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above diagram. The
DIMM slot numbers shown above can be used as a reference when reviewing the
DIMM population guidelines shown later in the manual. For the latest board
revision, please visit our web site at http://www.tyan.com.

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Jumpers & Connectors

Connectors
19. SATA Connector
1. COM2 Header (HD_COM2)
(PCH_SATA_0123)
2. Power connector connect to 20. SATA Connector
PCIE BOARD (PE_PW9) (PCH_SATA_4567)
3. Power connector connect to 21. Power connector connect to
PCIE BOARD (PE_PW8) PCIE BOARD (PE_PW6)
4. Power connector connect to 22. Power connector connect to
GPU Card (PE_PW5) GPU Card (PE_PW16)
5. Power connector connect to 23. USB Front panel Connector
GPU Card (PE_PW18) (USB3_FPIO1)
6. Power connector connect to 24. USB TYPEA Connector
GPU Card (PE_PW17) (TYPEA_USB3)
7. Power connector connect to 25. SSATA SGPIO Connector
GPU Card (PE_PW11) (SSATA_SGPIO1)
8. Power connector connect to
26. VROC header (J51)
GPU Card (PE_PW14)
27. Power connector connect to
9. ITP Header (XDP1)
HDD BP (D4P_PW1)
10. CPU0 FAN Header 28. Power connector connect to
(CPU0_FAN_1) HDD BP (D4P_PW3)
11. TPM and Port 80 Header 29. Power connector connect to
(DBG_HD1) HDD BP (D4P_PW2)
12. Power connector connect to 30. Power connector connect to
GPU Card (PE_PW15) HDD BP (PE_PW7)
13. Power connector connect to 31. CPU1 FAN Header
GPU Card (PE_PW12) (CPU1_FAN_1)
14. Power connector connect to
32. IPMB Header (IPMB_HD1)
GPU Card (PE_PW4)
15. Power connector connect to
33. Front panel Connector (FPIO_1)
GPU Card (PE_PW13)
16. SSATA Connector 34. Front panel VGA Header
(PCH_SSATA_5) (FPIO_VGA2)
17. SSATA Connector
35. COM1 Header (HD_COM3)
(PCH_SSATA_4)
18. SSATA Connector 36. System FAN Connector for
(PCH_SSATA_0123) Barebone (J35)

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 Jumpers
a ME Recovery Mode Jumper
(3PHD2)
Slots
A PCIE Slots (x24) connect to PCIE
D OCULink (x8) (J8)
Board (J1)
B PCIE slots (x24) connect to PCIE
E OCULink (x8) (J9)
Board (J7)
C PCIE slots (x16) connecto to
PCIE riser card (PEIC_5)

Jumper Legend

OPEN - Jumper OFF Without jumper cover

CLOSED - Jumper ON With jumper cover

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CPU0_FAN_1/CPU1_FAN_1: 4-Pin CPU FAN Connector

Pin 1 2 3 4

Signal GND P12V FAN_TACH FAN_PWM

Use this header to connect the cooling fan to your motherboard to keep the
system stable and reliable.
CPU0_FAN_1: CPU0 FAN Connector
CPU1_FAN_1: CPU1 FAN Connector

HD_COM3 / HD_COM2: COM Port Header

Signal Pin Pin Signal

COM2_DCD 1 2 COM2_DSR
COM2_RXD 3 4 COM2_RTS
COM2_TXD 5 6 COM2_CTS
COM2_DTR 7 8 COM2_NRI
GND 9 10 NC

FPIO_1: Front Panel Header

Signal Pin Pin Signal

PW_LED+ 1 2 FP_PWER(3.3V)
KEY 3 4 FP_ID_LED_PWR
PW_LED- 5 6 FP_ID_LED_N
HD_LED+ 7 8 HWM_FAULT_LED-
HD_LED- 9 10 SYS_FAULT_LED-
PW_SW# 11 12 LAN1_ACTLED+
GND 13 14 LAN1_ACTLED-
RST_SW# 15 16 SDA
GND 17 18 SCL
FP_ID_LED_BTN_N 19 20 INTRUDER#
FPIO_TEMP_IN 21 22 LAN2_ACTLED+
NMI_SW# 23 24 LAN2_ACTLED-
®
J51: VROC Header (full featured RAID 0, 1, 10, 5, using Intel VROC, for NVMe
SSD SKU)

Pin 1 2 3 4

Signal GND VCC3_AUX GND PCH_SATA_RAID_KEY

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IPMB_HD1: IPMB Header

Signal Pin Pin Signal

SMB_SDA2 1 2 GND
SMB_SCL2 3 4 NC

USB3_FPIO1: Front USB3.0 Header

Signal Pin Pin Signal

+5V 1 20 KEY
P0_RX_N 2 19 +5V
P0_RX_P 3 18 P1_RX_N
GND 4 17 P1_RX_P
P0_TX_N 5 16 GND
P0_TX_P 6 15 P1_TX_N
GND 7 14 P1_TX_P
P0_N 8 13 GND
P0_P 9 12 P1_N
OC_N 10 11 P1_P

TYPEA_USB3: Vertical Type-A USB3.0 Connector

Signal Pin Pin Signal

SSRX- 5 1 +5V
SSRX+ 6 2 USB DATA2-
GND 7 3 USB DATA2+
SSTX- 8 4 GND
SSTX+ 9

SSATA_SGPIO1: SSATA SGPIO Pin Header

Signal Pin Pin Signal

SCL 1 2 SSDATA IN
SDA 3 4 SSDATA OUT
GND 5 6 SSLOAD
KEY 7 8 SSCLOCK
P3V3_AUX 9 10 NA

FPIO_VGA2: Front Panel VGA Header

Signal Pin Pin Signal

GND 1 2 VGA_5V
GND 3 4 HD_VGA_R
GND 5 6 HD_VGA_G
GND 7 8 HD_VGA_B

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 GND 9 10 HD_VGA_DAT
HD_VGA_HS 11 12 KEY
HD_VGA_CLK 13 14 HD_VGA_VS

J35: Front Fan Connector (Reserved for Barebone Fan Board)

Signal Pin Pin Signal

TACH1 1 2 TACH6
TACH2 3 4 TACH7
TACH3 5 6 TACH8
TACH4 7 8 TACH9
TACH5 9 10 TACH10
GND 11 12 KEY
PWM2 13 14 PWM1
TACH11 15 16 SDA
TACH12 17 18 SCL
V3AUX1 19 20 PWM3

DBG_HD1: TYAN Module Header

Signal Pin Pin Signal

P3V3 1 2 FRAME_N
LAD0 3 4 KEY
LAD1 5 6 PLT_RST_N
LAD2 7 8 GND
LAD3 9 10 CLK_33M
DBG_SERIRQ 11 12 GND
DBG_PRES_N 13 14 VCC3_AUX
TPM_ADDR_MB 15 16 PCH_TPM_PP_EN

3PHD2: ME Recovery Mode Jumper

Pin 1-2 Closed: Normal (Default)

Pin 2-3 Closed: ME Recovery Mode

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D4P_PW1 / D4P_PW2 / D4P_PW3: 4-pin Power Connector to HDD BP

Pin 1 2 3 4

Signal P12V_IN GND GND VCC5

PE_PW7: 8-pin Power Connector to HDD BP

Signal Pin Pin Signal

GND 1 5 P12V_IN
GND 2 6 P12V_IN
GND 3 7 P12V_IN
GND 4 8 P12V_IN

PE_PW6/PE_PW8/PE_PW9: 8-pin Power Connector to PCIE Board

Signal Pin Pin Signal

GND 1 5 P12V_IN
GND 2 6 P12V_IN
GND 3 7 P12V_IN
GND 4 8 P12V_IN

PE_PW4 / PE_PW5 / PE_PW11 / PE_PW12 / PE_PW13 / PE_PW14 / PE_PW15 /

PE_PW16 / PE_PW17 / PE_PW18: 8-pin Power Connector to GPU Card

Signal Pin Pin Signal

GND 1 5 P12V_IN
GND 2 6 P12V_IN
GND 3 7 P12V_IN
GND 4 8 P12V_IN

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4.5 Thermal Interface Material
There are two types of
thermal interface materials
designed for use with the
processors.

The most common material

comes as a small pad
attached to the heat sink at
the time of purchase. There
should be a protective cover
over the material. Take care
not to touch this material.
Simply remove the protective
cover and place the heat sink
on the processor.

The second type of interface

material is usually packaged
separately. It is commonly
referred to as ‘thermal
compound’. Simply apply a
thin layer on to the CPU lid
(applying too much will
actually reduce the cooling).

NOTE: Always check with the manufacturer of the heat sink & processor to
ensure that the thermal interface material is compatible with the processor and
meets the manufacturer’s warranty requirements.

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4.6 Tips on Installing Motherboard in Chassis
Before installing your motherboard, make sure your chassis has the necessary
motherboard support studs installed. These studs are usually metal and are gold in
color. Usually, the chassis manufacturer will pre-install the support studs. If you are
unsure of stud placement, simply lay the motherboard inside the chassis and align
the screw holes of the motherboard to the studs inside the case. If there are any
studs missing, you will know right away since the motherboard will not be able to be
securely installed.

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NOTE: Be especially careful to look for extra stand-offs. If there are any stand-offs
present that are not aligned with a mounting hole on the motherboard, it will likely
short components on the back of the motherboard when installed. This will cause
malfunction and/or damage to your motherboard.

Some chassis include plastic studs instead of metal. Although the plastic studs are
usable, MITAC recommends using metal studs with screws that will fasten the
motherboard more securely in place.

Below is a chart detailing what the most common motherboard studs look like and
how they should be installed.

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4.7 Installing the Memory
Before installing memory, ensure that the memory you have is compatible with the
motherboard and processor. Check the TYAN Web site at http://www.tyan.com for
details of the type of memory recommended for your motherboard.

 This platform supports (12)+(12) DDR4 RDIMM/RDIMM

3DS/LRDIMM/LRDIMM3DS 2666
 Up to 768GB RDIMM/ 1,536GB LRDIMM/ 3,072GB RDIMM 3DS/LRDIMM
3DS are supported
 1.2V DDR4 DIMMs are supported
 All installed memory will automatically be detected. No jumpers or settings
need to be changed for memory detection.
 All memory must be of the same type and density. Different memory types
can NOT be mixed and matched on the same motherboard.

DIMM Location

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Recommended Memory Population Table

Quantity of
Single CPU Installed
memory installed
(CPU0 only)
1 2 3 4 5 6 7 8 9 10 11 12
CPU0_DIMM_A0 √ √ √ √ √ √ √ √ √ √ √ √
CPU0_DIMM_A1 √ √ √ √ √ √
CPU0_DIMM_B0 √ √ √ √ √ √ √ √ √ √ √
CPU0_DIMM_B1 √ √ √ √ √
CPU0_DIMM_C0 √ √ √ √ √ √ √ √ √ √
CPU0_DIMM_C1 √ √ √ √
CPU0_DIMM_D0 √ √ √ √ √ √ √ √ √
CPU0_DIMM_D1 √ √ √
CPU0_DIMM_E0 √ √ √ √ √ √ √ √
CPU0_DIMM_E1 √ √
CPU0_DIMM_F0 √ √ √ √ √ √ √
CPU0_DIMM_F1 √
CPU1_DIMM_A0
CPU1_DIMM_A1
CPU1_DIMM_B0
CPU1_DIMM_B1
CPU1_DIMM_C0
CPU1_DIMM_C1
CPU1_DIMM_D0
CPU1_DIMM_D1
CPU1_DIMM_E0
CPU1_DIMM_E1
CPU1_DIMM_F0
CPU1_DIMM_F1

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 Quantity of
Dual CPU Installed
memory installed
(CPU0 and CPU1)
2 4 6 8 10 12 14 16 18 20 22 24
CPU0_DIMM_A0 √ √ √ √ √ √ √ √ √ √ √ √
CPU0_DIMM_A1 √ √ √ √ √ √
CPU0_DIMM_B0 √ √ √ √ √ √ √ √ √ √ √
CPU0_DIMM_B1 √ √ √ √ √
CPU0_DIMM_C0 √ √ √ √ √ √ √ √ √ √
CPU0_DIMM_C1 √ √ √ √
CPU0_DIMM_D0 √ √ √ √ √ √ √ √ √
CPU0_DIMM_D1 √ √ √
CPU0_DIMM_E0 √ √ √ √ √ √ √ √
CPU0_DIMM_E1 √ √
CPU0_DIMM_F0 √ √ √ √ √ √ √
CPU0_DIMM_F1 √
CPU1_DIMM_A0 √ √ √ √ √ √ √ √ √ √ √ √
CPU1_DIMM_A1 √ √ √ √ √ √
CPU1_DIMM_B0 √ √ √ √ √ √ √ √ √ √ √
CPU1_DIMM_B1 √ √ √ √ √
CPU1_DIMM_C0 √ √ √ √ √ √ √ √ √ √
CPU1_DIMM_C1 √ √ √ √
CPU1_DIMM_D0 √ √ √ √ √ √ √ √ √
CPU1_DIMM_D1 √ √ √
CPU1_DIMM_E0 √ √ √ √ √ √ √ √
CPU1_DIMM_E1 √ √
CPU1_DIMM_F0 √ √ √ √ √ √ √
CPU1_DIMM_F1 √

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 NOTE:
1. √ indicates a populated DIMM slot.
2. Use paired memory installation for max performance.
3. Populate the same DIMM type in each channel, specifically
- Use the same DIMM size
- Use the same # of ranks per DIMM
4. Always install with CPU0 Socket and CPU0_DIMM_A0 Slot first, following the
alphabetical order.

4.8 Finishing Up
Congratulations on making it this far! You have finished setting up the hardware
aspect of your computer. Before closing up your chassis, make sure that all cables
and wires are connected properly, especially SATA cables and most importantly,
jumpers. You may have difficulty powering on your system if the motherboard
jumpers are not set correctly.
In the rare circumstance that you have experienced difficulty, you can find help by
asking your vendor for assistance. If they are not available for assistance, please
find setup information and documentation online at our website or by calling your
vendor’s support line.

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 Chapter 5: BIOS Setup
5.1 About the BIOS
The BIOS is the basic input/output system, the firmware on the motherboard that
enables your hardware to interface with your software. The BIOS determines what a
computer can do without accessing programs from a disk. The BIOS contains all the
code required to control the keyboard, display screen, disk drives, serial
communications, and a number of miscellaneous functions. This chapter describes
the various BIOS settings that can be used to configure your system.

The BIOS section of this manual is subject to change without notice and is provided
for reference purposes only. The settings and configurations of the BIOS are current
at the time of print and are subject to change, and therefore may not match exactly
what is displayed on screen.

This section describes the BIOS setup program. The setup program lets you modify
basic configuration settings. The settings are then stored in a dedicated,
battery-backed memory (called NVRAM) that retains the information even when the
power is turned off.

To start the BIOS setup utility:

1. Turn on or reboot your system.
2. Press <Del> or <F2> during POST (Del on remote console) to start the BIOS
setup utility.

5.1.1 Setup Basics

The table below shows how to navigate in the setup program using the keyboard.

Key Function
Left/Right Arrow Keys Change from one menu to the next
Up/Down Arrow Keys Move between selections
Enter Open highlighted section
PgUp/PgDn Keys Change pages
+/- Change options
ESC Exit

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5.1.2 Getting Help
Pressing [F1] will display a small help window that describes the appropriate
keys to use and the possible selections for the highlighted item. To exit the Help
Window, press [ESC] or the [Enter] key again.

5.1.3 In Case of Problems

If you have trouble booting your computer after making and saving the changes with
the BIOS setup program, you can restart the computer by holding the power button
down until the computer shuts off (usually within 4 seconds); resetting by pressing
CTRL-ALT-DEL; or clearing the CMOS.
The best advice is to only alter settings that you thoroughly understand. In particular,
do not change settings in the Chipset section unless you are absolutely sure of what
you are doing. The Chipset defaults have been carefully chosen either by MITAC or
your system manufacturer for best performance and reliability. Even a seemingly
small change to the Chipset setup options may cause the system to become
unstable or unusable.

5.1.4 Setup Variations

Not all systems have the same BIOS setup layout or options. While the basic look
and function of the BIOS setup remains more or less the same for most systems, the
appearance of your Setup screen may differ from the charts shown in this section.
Each system design and chipset combination requires a custom configuration. In
addition, the final appearance of the Setup program depends on the system
designer. Your system designer may decide that certain items should not be
available for user configuration, and remove them from the BIOS setup program.

NOTE: The following pages provide the details of BIOS menu. Please be noticed
that the BIOS menu are continually changing due to the BIOS updating. The BIOS
menu provided are the most updated ones when this manual is written. Please visit
TYAN’s website at http://www.tyan.com for the information of BIOS updating.

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5.2 Main Menu
In this section, you can alter general features such as the date and time.
Note that the options listed below are for options that can directly be changed within
the Main Setup screen.

BIOS Information
It displays BIOS related information.

Platform Information
This displays CPU related information.

Memory Information
This displays the total memory size.

System Date
Set the Date. Use Tab to switch between Date elements. Default Ranges:
Year: 2005-2099
Months: 1-12
Days: dependent on month

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System Time
Set the Time. Use Tab to switch between Time elements.

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5.3 Advanced Menu
This section facilitates configuring advanced BIOS options for your system.

iSCSI Configuration
Configure the iSCSI parameters.

Intel® Virtual RAID on CPU

This formset allows the user to manage Intel® Virtual RAID on CPU.

Trusted Computing
Trusted Computing Settings.

ACPI Settings
System ACPI Parameters.

S5 RTC Wake Settings

Enable system to wake from S5 using RTC alarm.

Serial Port Console Redirection

Serial Port Console Redirection.

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SIO Configuration
System Super IO Chip Parameters.

Option ROM Dispatch Policy

Option ROM Dispatch Poligy.

PCI Subsystem Settings

PCI, PCI-X and PCI Express Settings.

Network Stack Configuration

Network Stack Settings.

CSM Configuration
CSM configuration: Enable/Disable, Option ROM execution settings, etc.

USB Configuration
USB Configuration Parameters.

Hardware Health Configuration

Hardware Health Configuration.

PCIe Slot Configuration

Onboard PCIe Slot Configuration.

NVDIMM ADR Configuration

NVDIMM ADR Configuration.

OnBoard Device Configuration

OnBoard Device and Function Configuration.

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5.3.1 iSCSI Configuration

Please follow the instructions to initiate the iSCSI function.

Step 1.
Select Advanced  CSM Configuration  Network  [UEFI].
Step 2.
Select Advanced  Network Stack Configuration  Network Stack  [Enabled]
Step 3.
Save changes and reboot.

iSCSI Initiator Name

The worldwide unique name of iSCSI Initiator. Only IQN format is accepted.
Enter [iqn.xxx]. xxx ranges from 4 to 223.

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5.3.1.1 Add an Attempt

Read only.

NOTE: Only LAN1 supports iSCSI function.

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5.3.1.1.1 MAC 34:12:78:56:00:00

iSCSI Mode
Disabled, Enabled, Enabled for MPIO.
Disabled / Enabled / Enabled for MPIO

Internet Protocol
Initiator IP address is system assigned in IP6 mode. In Autoconfigure mode, iSCSI
driver will attempt to connect iSCSI target via IPv4 stack, if failed then attempt IPv6
stack.
IP4 / IP6 / Autoconfigure

Connection Retry Count

The minimum value is 0 and the maximum is 16. 0 means no retry.

Connection Establishing Timeout

The timeout value in milliseconds. The minimum value is 100 milliseconds and the
maximum is 20 seconds.

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Configure ISID
OUI-format ISID in 6 bytes, default value is derived from MAC address. Only last 3
bytes are configurable. Example: update 0ABBCCDDEEFF to OABBCCF07901 by
input F07901.

Enable DHCP
Enable DHCP.
Disabled / Enabled

Initiator IP Address
Enter IP address in dotted-decimal notation.

Initiator Subnet Mask

Enter IP address in dotted-decimal notation.

Gateway
Enter IP address in dotted-decimal notation.

Target Name
The worldwide unique name of the target. Only iqn. format is accepted.
iqu. xxx

Target IP Address
Enter IP address in dotted-decimal notation.

Target Port
Target Port.

Boot LUN
Hexadecimal representation of the LU number. Examples are:
4752-3A4F-6b7e-3F99, 6734-9-156f-127, 4186-9.

Authentication Type
Authentication method: CHAP, Kerberos, or None.
CHAP / None

Save Changes
Must reboot system manually for changes to take place.

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5.3.1.2 Delete Attempts

Attempt 1
MAC: 34:12:78:56:00:00, PFA: Bus 1/ Dev 0 / Func 0, iSCSI mode: Disabled, IP
version: IP4.
Disabled / Enabled

Commit Changes and Exit

Commit Changes and Exit.

Discard Changes and Exit

Discard Changes and Exit.

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5.3.1.3 Change Attempt Order

Change Attempt Order

Change the order of Attempts using +/- keys. Use arrow keys to select the attempt
then press +/- to move the attempt up/down in the attempt order list.
Attempt 1 / Attempt #

Commit Changes and Exit

Commit Changes and Exit.

Discard Changes and Exit

Discard Changes and Exit.

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5.3.2 Intel® Virtual RAID on CPU

Please follow the instructions to initiate the Intel Virtual RAID on CPU function.
Step 1.
Select Socket Configuration  IIO Configuration  Intel® VMD technology 
Intel® VMD for Volume Management Device on Socket 0 (for CPU0) / Socket 1
(for CPU1)  Intel® VMD for Volume Management Device for PStack0 (Slot 1~4)
/ PStack1 (Slot 5~8) / PStack2 (Slot 9~12)
Step 2.
Suppose the card is installed in CPU0 Slot 3, then Intel® VMD for Volume
Management Device for PStack0 will be set to [Enabled].
Step 3.
Save changes and reboot.

All Intel VMD Controllers

Select to see more information about the Intel VMD Controllers.

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5.3.2.1 All Intel VMD Controllers

Create RAID Volume

This page allows you to create a RAID volume.

Non-RAID Physical Disks

Read only.

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5.3.2.1.1 Create RAID Volume

Name
Enter a unique volume name that has no special characters and is 16 characters or
less.
Volume0

RAID Level
Select RAID Level.
RAID0 (Stripe)

Enable RAID spanned over VMD Controllers

Enter RAID spanned over VMD Controllers.
blank / X

Port 0, VMD0, INTEL SSDPE2MD400G4

X – to Select Disk.
blank / X

Port 1, VMD1, INTEL SSDPEDME400G4

X – to Select Disk.
blank / X

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Strip Size
Strip size help.
4KB / 8KB / 16KB / 32KB / 64KB / 128KB

Capacity (MB)
Capacity in MB. Enter desired volume size. Maximum size=763099.

Create Volume
Create a volume with the settings specified above.

NOTE: For Create Volume to be configurable, the following items Enable RAID
spanned over VMD Controllers, Port 0, VMD0, INTEL SSDPE2MD400G4 and
Port 1, VMD1, INTEL SSDPEDME400G4 must be set to [X].

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5.3.2.1.1.1 Create Volume

Press ‘y’ to create, ‘n’ to discard.

Volume0, RAID0(Stripe), 708.0GB, Normal

Select to see more information about the RAID volume.

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5.3.2.1.1.1.1 Volume0, RAID0(Stripe), 708.0GB, Normal

Read only.

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5.3.2.1.1.1.1.1 Delete

Delete the RAID Volume

Deleting a volume will reset the disks to non-RAID.
Yes / No

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5.3.2.1.2 Port 0, VMD0, INTEL SSDPE2MD400G4 SN: xxxx, …
Port 1, VMD1, INTEL SSDPEDMD400G4 SN: xxxx, ….

Read only.

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5.3.3 Trusted Computing

Security Device Support

Enables or Disables BIOS support for security device. O.S. will not show Security
Device. TCG EFI protocol and INT1A interface will not be available.
Enabled / Disabled

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5.3.4 ACPI Settings

Enable ACPI Auto Configuration

Enable or disable BIOS ACPI Auto Configuration.
Disabled / Enabled

Enable Hibernation
Enable or disable System ability to Hibernate (OS/S4 Sleep State). This option may
not be effective with some OS.
Disabled / Enabled

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5.3.5 S5 RTC Wake Settings

Wake system from S5

Enable or disable System wake on alarm event. Select Fixed Time, system will wake
on the hr:min:sec specified. Select Dynamic Time, system will wake on the current
time + increase minute(s).
Disabled / Fixed Time / Dynamic Time

When Wake system from S5 is set to [Fixed Time]

Wake up hour
Select 0-23. For example enter 3 for 3am and 15 for 3pm.

Wake up minute
Select 0-59 for Minute.

Wake up second
Select 0-59 for Second.

When Wake system from S5 is set to [Dynamic Time]

Wake up Minute increase
1-5.

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5.3.6 Serial Port Console Redirection

COM1 / COM2 / Serial Port for Out-Of-Band Management/Windows Emergency

Services (EMS)
Console Redirection
Console redirection enable or disable.
Disabled / Enabled

COM1 / COM2 / Serial Port for Out-Of-Band Management/Windows Emergency

Services (EMS)
Console Redirection Settings
The settings specify how the host computer (which the user is using) will exchange
data. Both computers should have the same or compatible settings.

Legacy Console Redirection Settings

Legacy Console redirection settings.

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5.3.6.1 COM1 / COM2 Console Redirection Settings

Terminal Type
Emulation: ANSI: Extended ASCII char set. VT100: ASCII char set.
VT100+: Extends VT100 to support color, function keys, etc.
VT-UTF8: Uses UTF8 encoding to map Unicode chars onto 1 or more bytes.
VT100+ / VT100 / VT-UTF8 / ANSI

Bits per Second

Select serial port transmission speed. The speed must be matched on the other side.
Long or noisy lines may require lower speeds.
38400 / 9600 / 19200 / 57600 / 115200

Data Bits
8/7

Parity
A parity bit can be sent with the data bits to detect some transmission errors. Even:
parity bit is 0 if the num of 1’s in the data bits is even. Odd: parity bit is 0 if the num of
1’s in the data bits is odd. Mark: parity bit is always 1. Space: parity bit is always 0.
Mark and Space parity do not allow for error detection.
None / Even / Odd / Mark / Space

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Stop Bits
Stop bits indicate the end of a serial data packet. (A start bit indicates the beginning).
The standard setting is 1 stop bit. Communication with slow devices may require
more than 1 stop bit.
1/2

Flow Control
Flow Control can prevent data loss from buffer overflow. When sending data, if the
receiving buffers are full, a ‘stop’ signal can be sent to stop the data flow. Once the
buffers are empty, a ‘start’ signal can be sent to restart the flow. Hardware flow
control uses two wires to send start/stop signal.
None / Hardware RTS/CTS

VT-UTF8 Combo Key Support

Enable VT-UTF8 Combination Key Support for ANSI/VT100 terminals.
Enabled / Disabled

Recorder Mode
On this mode enabled only text will be sent. This is to capture Terminal data.
Disabled / Enabled

Resolution 100x31
Enable or disable extended terminal resolution.
Disabled / Enabled

Legacy OS Redirection Resolution

On Legacy OS, the number of rows and columns supported redirection.
80x24 / 80x25

Putty KeyPad
Select FunctionKey and KeyPad on Putty.
VT100 / LINUX / XTERMR6 / SCO / ESCN / VT400

Redirection after BIOS POST

The settings specify if BootLoader is selected than Legacy console redirection is
disabled before booting to Legacy OS. Default value is Always Enable which means
Legacy Console Redirection is enabled for Legacy OS.
Always Enable / BootLoader

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5.3.6.2 Legacy Console Redirection Settings

Legacy Serial Redirection Port

Select a COM port to display redirection of Legacy OS and Legacy OPROM
Messages.
COM1 / COM2

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5.3.6.3 Serial Port for Out-Of-Band Management/Windows Emergency
Services (EMS) Console Redirection Settings

Out-of-Band Mgmt Port

Microsoft Windows Emergency Management Services (EMS) allows for remote
management of a Windows Server OS through a serial port.
COM1

Terminal Type
VT-UTF8 is the preferred terminal type for out-of-band management. The next best
choice is VT100+ and then VT100. See above, in Console Redirection Settings page,
for more Help with Terminal Type/Emulation.
VT-UTF8 / VT100 / VT100+ / ANSI

Bits per Second

Select serial port transmission speed. The speed must be matched on the other side.
Long or noisy lines may require lower speeds.
115200 / 9600 / 19200 / 57600

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Flow Control
Flow Control can prevent data loss from buffer overflow. When sending data, if the
receiving buffers are full, a ‘stop’ signal can be sent to stop the data flow. Once the
buffers are empty, a ‘start’ signal can be sent to restart the flow. Hardware flow
control uses two wires to send start/stop signal.
None / Hardware RTS/CTS / Software Xon/Xoff

Data Bits / Parity / Stop Bits

Read only.

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5.3.7 SIO Configuration

Super IO Chip
Read only.

[*Active*] Serial Port 1

View and Set Basic properties of the SIO Logical device. Like IO Base, IRQ Range,
DMA Channel and Device Mode.

[*Active*] Serial Port 2

View and Set Basic properties of the SIO Logical device. Like IO Base, IRQ Range,
DMA Channel and Device Mode.

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5.3.7.1 Serial Port 1 / 2 Configuration

Use This Device

Enable or disable this Logical Device.
Enabled / Disabled

Logical Device Settings

Read only.

Possible
Allows the user to change the device resource settings. New settings will be
reflected on this setup page after system restarts.
Use Automatic Settings /
IO=3F8h; IRQ=4; DMA; /
IO=3F8h, IRQ=3, 4, 5, 7, 9, 10, 11, 12; DMA; /
IO=2F8h; IRQ=3, 4, 5, 7, 9, 10, 11, 12; DMA; /
IO=3E8h, IRQ=3, 4, 5, 7, 9, 10, 11, 12; DMA; /
IO=2E8h, IRQ=3, 4, 5, 7, 9, 10, 11, 12; DMA; /

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5.3.8 Option ROM Dispatch Policy

Restore if Failure
If system fails to boot and this option is set to ‘Enabled’, software will reset settings
of this page as well as CSM page to its default values automatically.
Disabled / Enabled

PCIE_1 Empty / PCIE_23 Empty

Enable or Disable Option ROM execution for selected Slot.
Disabled / Enabled

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5.3.9 PCI Subsystem Settings

Above 4G Decoding
Enables or Disables 64bit capable Devices to be Decoded in Above 4G Address
Space (Only if System Supports 64 bit PCI Decoding).
Enabled / Disabled

SR-IOV Support
If system has SR-IOV capable PCIe Devices, this option Enables or Disables Single
Root IO Virtualization Support.
Enabled / Disabled

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5.3.10 Network Stack Configuration

NOTE: The BIOS will automatically read the onboard LAN controller.

Network Stack
Enable/Disable UEFI Network Stack.
Enabled / Disabled

When Network Stack is set to [Enabled]

Ipv4 PXE Support
Enable Ipv4 PXE Boot Support. If disabled IPV$ PXE boot option will not be created.
Disabled / Enabled

Ipv4 HTTP Support

Enable Ipv4 HTTP Boot Support. If disabled IPV4 HTTP boot option will not be
created.
Disabled / Enabled

Ipv6 PXE Support

Enable Ipv6 PXE Boot Support. If disabled IPV6 PXE boot option will not be created.
Disabled / Enabled

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Ipv6 HTTP Support
Enable Ipv6 HTTP Boot Support. If disabled IPV6 HTTP boot option will not be
created.
Disabled / Enabled

PXE boot wait time

Wait time to press ESC key to abort the PXE boot.
0

Media detect count

Number of times presence of media will be checked.
1

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5.3.11 CSM Configuration

CSM Support
Enable/Disable CSM Support.
Enabled / Disabled

Option ROM Messages

Set display mode for Option ROM.
Force BIOS / Keep Current

Boot option filter

This option controls Legacy/UEFI ROMs priority.
UEFI and Legacy / Legacy only / UEFI only

Network
Controls the execution of UEFI and Legacy PXE OpROM.
Legacy / Do not launch / UEFI

Storage
Controls the execution of UEFI and Legacy Storage OpROM.
Legacy / Do not launch / UEFI

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Video
Controls the execution of UEFI and Legacy Video OpROM
Legacy / Do not launch / UEFI

Other PCI Devices

Determines OpROM execution policy for devices other than Network, Storage, or
Video.
Legacy / Do not launch / UEFI

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5.3.12 USB Configuration

USB Controllers / USB Devices

Read only.

Legacy USB Support

Enable USB legacy support. AUTO option disables legacy support if no USB devices
are connected. DISABLE option will keep USB devices available only for EFI
applications.
Enabled / Disabled / Auto

XHCI Hand-off
This is a workaround for OSes without XHCI hand-off support. The XHCI ownership
change should be claimed by XHCI driver.
Enabled / Disabled

USB Mass Storage Driver Support

Enable/Disable USB Mass Storage Driver Support.
Enabled / Disabled

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Port 60/64 Emulation
Enables I/O Port 60h/64h emulation support. This should be enabled for the
complete USB keyboard legacy support for non-USB aware OSes.
Enabled / Disabled

USB transfer time-out

The time-out value for Control, Bulk and Interrupt transfers.
1 sec / 5 sec / 10 sec / 20 sec

Device reset time-out

USB mass storage device Start Unit command time-out.
10 sec / 20 sec / 30 sec / 40 sec

Device power-up delay

Maximum time the device will take before it properly reports itself to the Host
Controller. ‘AUTO’ uses default value: for a Root port it is 100 ms, for a Hub port the
delay is taken from Hub descriptor.
Auto / Manual

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5.3.13 Hardware Health Configuration

Auto Fan Control

Automatic Fan Control.
Disabled: Fan speed full on.
Enabled: Automatic fan speed control by temperature.
Disabled / Enabled

BMC Alert Beep

Enable/Disable BMC Alert Beep.
On / Off

PMBus Support
PMBus Support.
Enabled / Disabled

Number of PSU
Number of PSU.
1 / 1+1 / 3 / 3+1

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5.3.13.1 Sensor Data Register Monitoring

When you enter the Sensor Data Register Monitoring submenu, you will see the
following dialog window pop out. Please wait 8~10 seconds.

NOTE: SDR can not be modified. Read only.

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5.3.14 NVDIMM ADR Configuration

Assert ADR on Reset

Assert ADR on Reset.
Disabled / Enabled

Assert ADR on Shutdown

Assert ADR on Shutdown.
Disabled / Enabled

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5.3.15 OnBoard Device Configuration

Onboard VGA
Enable or disable onboard VGA.
Disabled / Enabled

Chassis Intrusion detect

ENABLED: when a chassis open event is detected, the BIOS will record the event.
Disabled / Enabled

NMI Function
Enable or Disable NMI function.
Disabled / Enabled

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5.4 Platform Configuration

PCH Configuration
Displays and provides option to change the PCH Settings.

Server ME Configuration
Configure Server ME Technology Parameters.

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5.4.1 PCH Configuration

PCI Express Configuration

PCI Express Configuration settings.

PCH SATA Configuration

SATA devices and settings.

PCH sSATA Configuration

sSATA devices and settings.

USB Configuration
USB Configuration Settings.

PCH DFX Configuration

PCH DFX Configuration Options.

PCH state after G3

Select S0/S5 for ACPI state after a G3.
S0 / S5 / Last State

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5.4.1.1 PCI Express Configuration

PCI Express Root Port 1

Control the PCI Express Root Port.
Disabled / Enabled

PCIE ASPM
PCI Express Root port ASPM Setting.
Disabled ASPM / ASPM L1 / ASPM Auto

L1 Substates
PCI Express L1 Substates settings.
Disabled / L1.1 / L1.2 / L1.1 & L1.2

PCIe Speed
Configure PCIe Speed.
Auto / Gen1 / Gen2 / Gen3

Max Payload Size

PCIE Max Payload Size Selection.
MPL 128B / MPL 256B

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5.4.1.2 PCH SATA Configuration

SATA Controller
Enable or Disable SATA Controller.
Enabled / Disabled

Configure SATA as
Determines how SATA controller(s) operate.
AHCI / RAID

SATA Port 0/1/2/3/4/5/6/7 & Software Preserve

Read Only

Port 0
Enable or Disable SATA Port.
Disabled / Enabled

Hot Plug
Designates this port as Hot Pluggable.
Disabled / Enabled

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Configure as eSATA
Configures port as External SATA (eSATA).
Disabled / Enabled

Spin Up Device
If enabled for any of ports Staggered Spin Up will be performed and only the drives
witch have this option enabled will spin up at boot. Otherwise all drives spin up at
boot.
Disabled / Enabled

SATA Device Type

Identify the SATA port is connected to Solid State Drive or Hard disk Drive.
Hard Disk Drive / Solid State Drive

SATA Topology
Identify the SATA Topology if it is Default or ISATA or Flex or DirectConnect or M2.
Unknown / ISATA / Direct Connect / Flex / M2

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5.4.1.3 PCH sSATA Configuration

sSATA Controller
Enable or Disable SATA Controller.
Enabled / Disabled

Configure sSATA as
Determines how SATA controller(s) operate.
AHCI / RAID

sSATA Port 0/1/2/3/4/5 & Software Preserve

Read Only

Port 0
Enable or Disable SATA Port.
Disabled / Enabled

Hot Plug
Designates this port as Hot Pluggable.
Disabled / Enabled

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Configure as eSATA
Configures port as External SATA (eSATA).
Disabled / Enabled

Spin Up Device
If enabled for any of ports Staggered Spin Up will be performed and only the drives
witch have this option enabled will spin up at boot. Otherwise all drives spin up at
boot.
Disabled / Enabled

SATA Device Type

Identify the SATA port is connected to Solid State Drive or Hard disk Drive.
Hard Disk Drive / Solid State Drive

SATA Topology
Identify the SATA Topology if it is Default or ISATA or Flex or DirectConnect or M2.
Unknown / ISATA / Direct Connect / Flex / M2

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5.4.1.4 USB Configuration

XHCI Idle L1
Enabled XHCI Idle L1. Disabled to workaround USB3 hot plug will fail after 1 hot plug
removal. Please put the system to G3 for the new settings to take effect.
Enabled / Disabled

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5.4.1.5 PCH DFX Configuration

Enable/Disable ADR
Enable or disable Automatic DIMM Refresh (ADR)
Enabled / Disabled

ADR GPIO
Select between GPIO_B or GPIO_C
GPIO B / GPIO C

Host Partition Reset ADR Enable

Enables/Disables ADR on Host Partition Reset
Enabled / Disabled

Enable/Disable ADR Timer

Held-off for DEBUG PURPOSES ONLY!
Enabled / Held-off

ADR timer expire time

Select proper ADR timer value: 25uS,50uS,100uS or 0.
25 uS / 50 uS / 100 uS / 0 uS

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ADR timer multiplier
Select proper ADR timer multiplier: x1,8,24,40,56,64,72,80,88,96.
x1 / x8 / x24 / x40 / x56 / x64 / x72 / x80 / x88 /x96

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5.4.2 Miscellaneous Configuration

Active Video
Select active video type.
Auto / Onboard Device / Offboard Device

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5.4.3 Server ME Configuration

Read only.

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5.5 Socket Configuration

Processor Configuration
Displays and provides option to change the Processor Settings.

Common RefCode Configuration

Displays the provides option to change the Common RefCode Settings.

UPI Configuration
Displays and provides option to change the UPI Settings.

Memory Configuration
Displays and provides option to change the Memory Settings.

IIO Configuration
Displays and provides option to change the IIO Settings.

Advanced Power Management Configuration

Displays and provides option to change the Power Management Settings.

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5.5.1 Processor Configuration

Hyper-Threading [ALL]
Enables Hyper Threading (Software Method) to Enable/Disable Logical Processor
threads.
Disabled / Enabled

Max CPUID Value Limit

This should be enabled in order to boot legacy OSes that cannot support CPUs with
extended CPUID functions.
Disabled / Enabled

Execute Disable Bit

When disabled, forces the XD feature flag to always return 0.
Disabled / Enabled

Enable Intel® TXT

Enables Intel® TXT.
Disabled / Enabled

VMX
Enables the Vanderpool Technology, takes effect after reboot.
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 Disabled / Enabled

Enable SMX
Enables Safer Mode Extensions.
Disabled / Enabled

Lock Chipset
Lock or Unlock chipset.
Disabled / Enabled

Hardware Prefetcher
MLC Streamer Prefetcher (MSR 1A4h Bit[0]).
Enabled / Disabled

Adjacent Cache Prefetch

MLC Spatial Prefetcher (MSR 1A4h Bit[1]).
Enabled / Disabled

Extended APCI
Enable/Disable extended APIC support.
Disabled / Enabled

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5.5.2 Common RefCode Configuration

MMCFG
Select MMCFG Base.
1G / 1.5G / 1.75G / 2G / 2.25G / 3G

MMCFG Size
Select MMCFG Size.
64M / 128M / 256M / 512M / 1G / 2G

MMIO High Base

Select MMIO High Base.
56T / 40T / 24T / 16T / 4T / 3T / 2T / 1T

MMIO High Granularity Size

Selects the allocation size used to assign mmioh resources. Total mmioh space can
be up to 32xgranularity.
Per stack mmioh resource assignments are multiples of the granularity where 1 unit
per stack is the default allocation.
1G / 4G / 16G / 64G / 256G / 1024G

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Numa
Enable or Disable Non uniform Memory Access (NUMA).
Disabled / Enabled

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5.5.3 UPI Configuration

Link Speed Mode

Select the UPI link speed as either the POR speed (Fast) or default speed (Slow).
Slow / Fast

Link Frequency Select

Allows for selecting the UPI Link Frequency.
9.6GB/s / 10.4GB/s / Auto / Use Per Link Setting

Link L0p Enable

Disabled / Enable / Auto

Link L1 Enable
Disabled / Enable / Auto

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5.5.3.1 UPI Status

Read only

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5.5.4 Memory Configuration

Enforce POR
Enable --- Enforces Plan Of Record restrictions for DDR4 frequency and voltage
programming. Disable --- disables this feature. Auto --- Sets it to the MRC default
setting; current default is Enable.
Auto / POR / Disable

Memory Frequency
Maximum Memory Frequency Selections in Mhz. Do not select Reserved.
Auto / 1866 / 2133 / 2400 / 2666

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5.5.4.1 Memory Topology

Read only.

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5.5.4.2 Memory RAS Configuration

Mirror Mode
Mirror Mode will set entire 1LM/2LM memory in system to be mirrored, consequently
reducing the memory capacity by half. Mirror Enable will disable XPT Prefetch.
Disabled / Mirror Mode 1LM / Mirror Mode 2LM

Mirror TAD0
Enable Mirror on entire memory for TAD0.
Enabled / Disabled

Enable Partial Mirror

Partial mirror mode will enable the required size of memory to be mirrored. If rank
sparing is enabled partial mirroring will not take effect. Mirror Enable will disable XPT
Prefetch.
Disabled / Partial Mirror mode 1LM / Partial Mirror mode 2LM

Memory Rack Sparing

Enable/Disable Memory Rank Sparing.
Disabled / Enabled

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Correctable Error Threshold
Correctable Error Threshold (1 – 32767) used for sparing, tagging, and leaky bucket.
10

SDDC Plus One

Enable/Disable SDDC Plus One.
Disabled / Enabled

ADDDC Sparing
Enable/Disable ADDDC Sparing.
Disabled / Enabled

Patrol Scrub
Enable/Disable Patrol Scrub.
Disabled / Enabled

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5.5.5 IIO Configuration

Intel® VT for Directed I/O (VT-d)

Press <Enter> to bring up the Intel® VT for Directed I/O (VT-d) Configuration menu.

Intel® VMD Technology

Press <Enter> to bring up the Intel® VMD for Volume Management Device
Configuration menu.

PCIe Hot Plug

Enable/Disable PCIe Hot Plug globally.
Disabled / Enabled / Auto / Manual

PCIe ACPI Hot Plug

Enable/Disable PCIe ACPI Hot Plug globally, or allow per-port control. When
Disabled, MSI is generated on HP event. When Enabled, _HPGPE message is
generated.
Disabled / Enable / Per-Port

PCIe Access Control Services

Enable/Disable Access Control Services.
Enable / Disabled
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5.5.5.1 Socket 0 Configuration

IDU0 (IIO PCIe Br1)

Selects PCIe port Bifurcation for selected slot(s).
x4x4x4x4 / x4x4x8 / x8x4x4 / x8x8 / x16 / Auto

IDU1 (IIO PCIe Br2)

Selects PCIe port Bifurcation for selected slot(s).
x4x4x4x4 / x4x4x8 / x8x4x4 / x8x8 / x16 / Auto

IDU2 (IIO PCIe Br3)

Selects PCIe port Bifurcation for selected slot(s).
x4x4x4x4 / x4x4x8 / x8x4x4 / x8x8 / x16 / Auto

Socket 0 PcieBr1D00F0 – Port 1A

Settings related to PCI Express Ports
(0/1A/1B/1C/1D/2A/2B/2C/2D/3A/3B/3C/3D/4A/5A).

Socket 0 PcieBr2D00F0 – Port 2A

Settings related to PCI Express Ports
(0/1A/1B/1C/1D/2A/2B/2C/2D/3A/3B/3C/3D/4A/5A).

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Socket 0 PcieBr3D00F0 – Port 3A
Settings related to PCI Express Ports
(0/1A/1B/1C/1D/2A/2B/2C/2D/3A/3B/3C/3D/4A/5A).

Socket 0 PcieBr4D00F0 – MCP 0

Settings related to PCI Express Ports
(0/1A/1B/1C/1D/2A/2B/2C/2D/3A/3B/3C/3D/4A/5A).

Socket 0 PcieBr5D00F0 – MCP 1

Settings related to PCI Express Ports
(0/1A/1B/1C/1D/2A/2B/2C/2D/3A/3B/3C/3D/4A/5A).

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5.5.5.1.1 Socket 0 Port 1A/2A/3A/MCP 0/MCP 1

PCI-E Port
In auto mode the BIOS will remove the EXP port if there is no device or errors on
that device and the device is not HP capable. Disable is used to disable the port and
hide its CFG space.
Auto / Disabled / Enabled

Hot Plug Capable

This option specifies if the link is considered Hot Plug capable.
Disabled / Enabled

PCI-E Port Link

This option disables the link so that the no training occurs but the CFG space is still
active.
Enabled / Disabled

Link Speed
Choose Link Speed for this PCIe port.
Auto / Gen 1 (2.5 GT/s) / Gen 2 (5 GT/s) / Gen 3 (8 GT/s)

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PCI-E ASPM Support
This option enables/disables the ASPM (L1) support for the downstream devices.
Auto / L1 Only / Disabled

L0s Support
When disabled, IIO never puts its transmitter in L0s state.
Disabled / Enabled

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5.5.5.2 Socket 1 Configuration

IDU0 (IIO PCIe Br1)

Selects PCIe port Bifurcation for selected slot(s).
x4x4x4x4 / x4x4x8 / x8x4x4 / x8x8 / x16 / Auto

IDU1 (IIO PCIe Br2)

Selects PCIe port Bifurcation for selected slot(s).
x4x4x4x4 / x4x4x8 / x8x4x4 / x8x8 / x16 / Auto

IDU2 (IIO PCIe Br3)

Selects PCIe port Bifurcation for selected slot(s).
x4x4x4x4 / x4x4x8 / x8x4x4 / x8x8 / x16 / Auto

Socket 0 PcieBr1D00F0 – Port 1A

Settings related to PCI Express Ports
(0/1A/1B/1C/1D/2A/2B/2C/2D/3A/3B/3C/3D/4A/5A).

Socket 0 PcieBr2D00F0 – Port 2A

Settings related to PCI Express Ports
(0/1A/1B/1C/1D/2A/2B/2C/2D/3A/3B/3C/3D/4A/5A).

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Socket 0 PcieBr3D00F0 – Port 3A
Settings related to PCI Express Ports
(0/1A/1B/1C/1D/2A/2B/2C/2D/3A/3B/3C/3D/4A/5A).

Socket 0 PcieBr3D00F0 – Port 3B

Settings related to PCI Express Ports
(0/1A/1B/1C/1D/2A/2B/2C/2D/3A/3B/3C/3D/4A/5A).

Socket 0 PcieBr3D00F0 – Port 3C

Settings related to PCI Express Ports
(0/1A/1B/1C/1D/2A/2B/2C/2D/3A/3B/3C/3D/4A/5A).

Socket 0 PcieBr3D00F0 – Port 3D

Settings related to PCI Express Ports
(0/1A/1B/1C/1D/2A/2B/2C/2D/3A/3B/3C/3D/4A/5A).

Socket 0 PcieBr4D00F0 – MCP 0

Settings related to PCI Express Ports
(0/1A/1B/1C/1D/2A/2B/2C/2D/3A/3B/3C/3D/4A/5A).

Socket 0 PcieBr5D00F0 – MCP 1

Settings related to PCI Express Ports
(0/1A/1B/1C/1D/2A/2B/2C/2D/3A/3B/3C/3D/4A/5A).

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5.5.5.2.1 Socket 1 Port 1A/2A/3A/3B/3C/3D/MCP 0/MCP 1

PCI-E Port
In auto mode the BIOS will remove the EXP port if there is no device or errors on
that device and the device is not HP capable. Disable is used to disable the port and
hide its CFG space.
Auto / Disabled / Enabled

Hot Plug Capable

This option specifies if the link is considered Hot Plug capable.
Disabled / Enabled

PCI-E Port Link

This option disables the link so that the no training occurs but the CFG space is still
active.
Enabled / Disabled

Link Speed
Choose Link Speed for this PCIe port.
Auto / Gen 1 (2.5 GT/s) / Gen 2 (5 GT/s) / Gen 3 (8 GT/s)

PCI-E ASPM Support

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This option enables/disables the ASPM (L1) support for the downstream devices.
Auto / L1 Only / Disabled

L0s Support
When disabled, IIO never puts its transmitter in L0s state.
Disabled / Enabled

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5.5.5.3 Intel® VT for Directed I/O (VT-d)

Intel® VT for Directed I/O (VT-d)

Enable/Disable Intel® Virtualization Technology for Directed I/O (VT-d) by reporting
the I/O device assignment to VMM through DMAR ACPI Tables.
Enabled / Disabled

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5.5.5.4 Intel® VMD Technology

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5.5.5.4.1 Intel VMD for Volume Management for Socket 0

Intel® VMD for Volume Management Device for PStack0

Enable/Disable Intel® Volume Management Device Technology in this Stack.
Disabled / Enabled

Intel® VMD for Volume Management Device for PStack1

Enable/Disable Intel® Volume Management Device Technology in this Stack.
Disabled / Enabled

Intel® VMD for Volume Management Device for PStack2

Enable/Disable Intel® Volume Management Device Technology in this Stack.
Disabled / Enabled

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5.5.5.4.2 Intel VMD for Volume Management for Socket 1

Intel® VMD for Volume Management Device for PStack0

Enable/Disable Intel® Volume Management Device Technology in this Stack.
Disabled / Enabled

Intel® VMD for Volume Management Device for PStack1

Enable/Disable Intel® Volume Management Device Technology in this Stack.
Disabled / Enabled

Intel® VMD for Volume Management Device for PStack2

Enable/Disable Intel® Volume Management Device Technology in this Stack.
Disabled / Enabled

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5.5.6 Advanced Power Management Configuration

CPU P State Control

P State Control Configuration Sub Menu, include Turbo, XE and ete.

Hardware PM State Control

Hardware P-State setting.

CPU C State Control

CPU C State setting.

Package C State Control

Package C State setting.

CPU T State Control

CPU T State setting.

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3.5.5.5.1 CPU P State Control

SpeedStep (Pstates)
Enable/Disable EIST (P-States).
Disabled / Enabled

Boot performance mode

Select the performance state that the BIOS will set before OS hand off.
Max Performance / Max Efficient / Set by Intel Node Manager

Energy Efficient Turbo

Energy Efficient Turbo Disable, MSR 0x1FC [19].
Enabled / Disabled

Turbo Mode
Enable/Disable processor Turbo Mode (requires EMTTM enabled too).
Disabled / Enabled

CPU Flex Ratio Override

Enable/Disable CPU Flex Ratio Programming.
Disabled / Enabled

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NOTE: When CPU Flex Ratio Override set to [Enabled], the following item can be
configured.

CPU Core Flex Ratio

Non-Turbo Mode Processor Core Ratio Multiplier.
23

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3.5.5.5.2 Hardware PM State Control

Hardware P-States
Disable: Hardware chooses a P-state based on OS Request (Legacy P-States).
Native Mode: Hardware chooses a P-state based on OS guidance.
Out of Band Mode: Hardware autonomously chooses a P-state (no OS guidance).
Disabled / Native Mode / Out of Band Mode / Native Mode with NO Legacy
Support

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3.5.5.5.3 CPU C State Control

CPU C6 report
Enable/Disable CPU C6 (ACPI C3) report to OS.
Disabled / Enabled / Auto

Enhanced Halt State (C1E)

Core C1E auto promotion Control. Takes effect after reboot.
Disabled / Enabled

OS ACPI Cx
Report CC3/CC6 to OS ACPI C2 or ACPI C3.
ACPI C2 / ACPI C3

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3.5.5.5.4 Package C State Control

Package C State
Package C State limit.
C0/C1 state / C2 state / C6 (non Retention) state / C6 (Retention) state / No
Limit / Auto

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3.5.5.5.5 CPU T State Control

Software Controlled T-States

Enable/Disable Software Controlled T-States.
Disabled / Enabled

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5.6 Server Management

FRB-2 Timer
Enable or Disable FRB-2 timer (POST timer).
Disabled / Enabled

FRB-2 Timer timeout

Enter value Between 3 to 6 min for FRB-2 Timer Expiration value.
3 minutes / 4 minutes / 5 minutes / 6 minutes

FRB-2 Timer Policy

Configure how the system should respond if the FRB-2 Timer expires. Not available
if FRB-2 Timer is disabled.
Do Nothing / Reset / Power Down / Power Cycle

OS Watchdog Timer
If enabled, starts a BIOS timer which can only be shut off by Management Software
after the OS loads. Helps determine that the OS successfully loaded or follows the
OS Boot Watchdog Timer policy.
Enabled / Disabled

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OS Wtd Timer timeout
Configure the length of the OS Boot Watchdog Timer. Not available if OS Boot
Watchdog timer is disabled.
5 minutes / 10 minutes / 15 minutes / 20 minutes

OS Wtd Timer Policy

Configure how the system should respond if the OS Boot Watchdog Timer expires.
Not available if OS Boot Watchdog timer is disabled.
Do Nothing / Reset / Power Down / Power Cycle

BMC Logo
Enable or Disable BMC Logo.
Enabled / Disabled

System Event Log

Press <Enter> to change the SEL event log configuration.

BMC network configuration

Configure BMC network parameters.

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5.6.1 System Event Log

SEL Components
Change this to enable or disable all features of System Event Logging during boot.
Disabled / Enabled
NOTE: When SEL Components is set to [Disabled], the following items are read
only.

Erase SEL
Choose options for erasing SEL.
No / Yes, on next reset / Yes, on every reset

When SEL is Full

Choose options for reactions to a full SEL.
Do Nothing / Erase Immediately

Log EFI Status Codes

Disable the logging of EFI Status Codes or log only error code or only progress code
or both.
Disabled / Both / Error Code / Progress Code

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5.6.2 BMC Network Configuration

Configuration Address Source

Select the configure LAN channel parameters statically or dynamically (by BIOS or
BMC). Unspecified option will not modify any BMC network parameters during BIOS
phase.
Unspecified / Static / DynamicBmcDhcp / DynamicBmcNonDhcp

Management Port 2
Enable/Disable BMC Share Nic.
Enabled / Disabled

IPV6 Support
Enable or Disable LAN1 IPV6 Support.
Enabled / Disabled

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5.7 Security

Administrator Password
Set administrator password in the Create New Password window. After you key in
the password, the Confirm New Password window will pop out to ask for
confirmation.

User Password
Set user password in the Create New Password window. After you key in the
password, the Confirm New Password window will pop out to ask for confirmation.

Secure Frozen Mode

Disable means Hard Drive on Non-frozen mode. Enable means Hard Drive on
Frozen mode.
Disabled / Enabled

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5.7.1 Secure Boot

Attempt Secure Boot

Secure boot activated when Platform Key (PK) is enrolled, System mode is
User/Deployed, and CSM function is disabled.
Disabled / Enabled

Secure Boot Mode

Secure Boot mode selector: Standard/Custom. In Custom mode Secure Boot
Variables can be configured without authentication.
Standard / Custom

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5.7.1.1 Key Management

Provision Factory Default keys

Allow to provision factory default Secure Boot keys when System is in Setup Mode.
Disabled / Enabled

Install Factory Default Keys

Force System to User Mode – install all Factory Default Keys. Press “Yes” to install
factory default keys.

Enroll Efi Image

Allow the image to run in Secure Boot mode. Enroll SHA256 has of the binary into
Authorized signature Database (db).

Save All Secure Boot Variables

Save NVRAM content of all Secure Boot variables to the files
(EFI_SIGNATURE_LIST data format) in root folder on a target file system device.

Platform Key (PK)

Enroll Factory Defaults or load certificates from a file:
1. Public Key Certificate in:

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 a) EFI_SIGNATURE_LIST
b) EFI_CERT_X509 (DER encoded)
c) EFI_CERT_RSA2048 (bin)
d) EFI_CERT_SHA256, 384, 512 (bin)
2. Authenticated UEFI Variable
3. EFI PE/C0FF Image (SHA256)
Key source: Default, External, Mixed, Test
Set New

Key Exchange Keys

Enroll Factory Defaults or load certificates from a file:
1. Public Key Certificate in:
a) EFI_SIGNATURE_LIST
b) EFI_CERT_X509 (DER encoded)
c) EFI_CERT_RSA2048 (bin)
d) EFI_CERT_SHA256, 384, 512 (bin)
2. Authenticated UEFI Variable
3. EFI PE/C0FF Image (SHA256)
Key source: Default, External, Mixed, Test
Set New / Append

Authorized Signatures
Enroll Factory Defaults or load certificates from a file:
1. Public Key Certificate in:
a) EFI_SIGNATURE_LIST
b) EFI_CERT_X509 (DER encoded)
c) EFI_CERT_RSA2048 (bin)
d) EFI_CERT_SHA256, 384, 512 (bin)
2. Authenticated UEFI Variable
3. EFI PE/C0FF Image (SHA256)
Key source: Default, External, Mixed, Test
Set New / Append

Forbidden Signatures
Enroll Factory Defaults or load certificates from a file:
1. Public Key Certificate in:
a) EFI_SIGNATURE_LIST
b) EFI_CERT_X509 (DER encoded)
c) EFI_CERT_RSA2048 (bin)
d) EFI_CERT_SHA256, 384, 512 (bin)
2. Authenticated UEFI Variable
3. EFI PE/C0FF Image (SHA256)
Key source: Default, External, Mixed, Test
Set New / Append

Authorized TimeStamps
Enroll Factory Defaults or load certificates from a file:

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1. Public Key Certificate in:
a) EFI_SIGNATURE_LIST
b) EFI_CERT_X509 (DER encoded)
c) EFI_CERT_RSA2048 (bin)
d) EFI_CERT_SHA256, 384, 512 (bin)
2. Authenticated UEFI Variable
3. EFI PE/C0FF Image (SHA256)
Key source: Default, External, Mixed, Test
Set New / Append

OsRecovery Signatures
Enroll Factory Defaults or load certificates from a file:
1. Public Key Certificate in:
a) EFI_SIGNATURE_LIST
b) EFI_CERT_X509 (DER encoded)
c) EFI_CERT_RSA2048 (bin)
d) EFI_CERT_SHA256, 384, 512 (bin)
2. Authenticated UEFI Variable
3. EFI PE/C0FF Image (SHA256)
Key source: Default, External, Mixed, Test
Set New / Append

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5.8 Boot

Setup Prompt Timeout

Number of seconds to wait for setup activation key. 65535 (0xFFFF) means
indefinite waiting.
1

Bootup NumLock State

Select the keyboard NumLock state.
Off / On

Quiet Boot
Enable or disable Quiet Boot option.
Disabled / Enabled

Wait for ‘ESC’ If Error

Wait for ‘ESC’ key to be pressed if error occurs.
Disabled / Enabled

Endless Boot
Enable or disable Endless Boot.
Disabled / Enabled

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Boot Option Priorities
Boot Option #1
Select the first/second boot device.
Device Name / Disabled

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5.8.1 Delete Boot Option

Delete Boot Option

Remove an EFI boot option from the boot order.
Select one to delete / UEFI: Built-in EFI Shell

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5.9 Save & Exit

Save Changes and Exit

Exit system setup after saving the changes.

Discard Changes and Exit

Exit system setup without saving any changes.

Save Changes and Reset

Reset the system after saving the changes.

Discard Changes and Reset

Reset system setup without saving any changes.

Save Changes
Save changes done so far to any of the setup options.

Discard Changes
Discard changes done so far to any of the setup options.

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Restore Defaults
Restore/Load Default values for all the setup options.

Save as User Defaults

Save the changes done so far as User Defaults.

Restore User Defaults

Restore the User Defaults to all the setup options.

Boot Override
Read only.

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 Chapter 6: Diagnostics

NOTE: if you experience problems with setting up your system, always check the
following things in the following order:

Memory, Video, CPU

By checking these items, you will most likely find out what the problem might have
been when setting up your system. For more information on troubleshooting, check
the TYAN website at http://www.tyan.com.

6.1 Flash Utility

Every BIOS file is unique for the motherboard it was designed for. For Flash
Utilities, BIOS downloads, and information on how to properly use the Flash Utility
with your motherboard, please check the TYAN web site at http://www.tyan.com

NOTE: Please be aware that by flashing your BIOS, you agree that in the
event of a BIOS flash failure, you must contact your dealer for a replacement
BIOS. There are no exceptions. TYAN does not have a policy for replacing
BIOS chips directly with end users. In no event will TYAN be held
responsible for damages done by the end user.

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6.2 AMIBIOS Post Code (Aptio)

The POST code checkpoints are the largest set of checkpoints during the BIOS
pre-boot process. The following table describes the type of checkpoints that may
occur during the POST portion of the BIOS:
Checkpoint Ranges
Status Code Range Description
0x01 – 0x0B SEC execution

0x0C – 0x0F SEC errors

0x10 – 0x2F PEI execution up to and including memory detection

0x30 – 0x4F PEI execution after memory detection

0x50 – 0x5F PEI errors

0x60 – 0x8F DXE execution up to BDS

0x90 – 0xCF BDS execution

0xD0 – 0xDF DXE errors

0xE0 – 0xE8 S3 Resume (PEI)

0xE9 – 0xEF S3 Resume errors (PEI)

0xF0 – 0xF8 Recovery (PEI)

0xF9 – 0xFF Recovery errors (PEI)

Standard Checkpoints
SEC Phase
Status Code Description
0x00 Not used

Progress Codes
0x01 Power on. Reset type detection (soft/hard).

0x02 AP initialization before microcode loading

0x03 North Bridge initialization before microcode loading

0x04 South Bridge initialization before microcode loading

0x05 OEM initialization before microcode loading

0x06 Microcode loading

0x07 AP initialization after microcode loading

0x08 North Bridge initialization after microcode loading

0x09 South Bridge initialization after microcode loading

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Status Code Description
0x0A OEM initialization after microcode loading

0x0B Cache initialization

SEC Error Codes

0x0C – 0x0D Reserved for future AMI SEC error codes

0x0E Microcode not found

0x0F Microcode not found

SEC Beep Codes

None

PEI Phase
Status Code Description
Progress Codes
0x10 PEI Core is started

0x11 Pre-memory CPU initialization is started

0x12 Pre-memory CPU initialization (CPU module specific)

0x13 Pre-memory CPU initialization (CPU module specific)

0x14 Pre-memory CPU initialization (CPU module specific)

0x15 Pre-memory North Bridge initialization is started

0x16 Pre-Memory North Bridge initialization (North Bridge module specific)

0x17 Pre-memory North Bridge initialization (North Bridge module specific)

0x18 Pre-Memory North Bridge initialization (North Bridge module specific)

0x19 Pre-memory South Bridge initialization is started

0x1A Pre-Memory South Bridge initialization (South Bridge module specific)

0x1B Pre-memory South Bridge initialization (South Bridge module specific)

0x1C Pre-Memory South Bridge initialization (South Bridge module specific)

0x1D – 0x2A OEM pre-memory initialization codes

0x2B Memory initialization. Serial Presence Detect (SPD) data reading

0x2C Memory initialization. Memory presence detection

0x2D Memory initialization. Programming memory timing information

0x2E Memory initialization. Configuring memory

0x2F Memory initialization (other)

0x30 Reserved for ASL (see ASL Status Codes section below)

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Status Code Description
0x31 Memory Installed

0x32 CPU post-memory initialization is started

0x33 CPU post-memory initialization. Cache initialization

0x34 CPU post-memory initialization. Application Processor(s) (AP) initialization

0x35 CPU post-memory initialization. Boot Strap Processor (BSP) selection

0x36 CPU post-memory initialization. System Management Mode(SMM) initialization

0x37 Post-Memory North Bridge initialization is started

0x38 Post-Memory North Bridge initialization (North Bridge module specific)

0x39 Post-Memory North Bridge initialization (North Bridge module specific)

0x3A Post-Memory North Bridge initialization (North Bridge module specific)

0x3B Post-Memory South Bridge initialization is started

0x3C Post-Memory South Bridge initialization (South Bridge module specific)

0x3D Post-Memory South Bridge initialization (South Bridge module specific)

0x3E Post-Memory South Bridge initialization (South Bridge module specific)

0x3F – 0x4E OEM post memory initialization codes

0x4F DXE IPL is started

PCI Error Codes

0x50 Memory initialization error. Invalid memory type or incompatible memory speed

0x51 Memory initialization error. SPD reading has failed

0x52 Memory initialization error. Invalid memory size or memory modules do not match

0x53 Memory initialization error. No usable memory detected

0x54 Unspecified memory initialization error

0x55 Memory not installed

0x56 Invalid CPU type or speed

0x57 CPU mismatch

0x58 CPU self test failed or possible CPU cache error

0x59 CPU microcode is not found or microcode update is failed

0x5A Internal CPU error

0x5B Reset PPI is not available

0x5C – 0x5F Reserved for future AMI error codes

S3 Resume Progress Codes

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Status Code Description
0xE0 S3 Resume is started (S3 Resume PPI is called by the DXE IPL)

0xE1 S3 Boot Script execution

0xE2 Video repost

0xE3 OS S3 wake vector call

0xE4 – 0xE7 Reserved for future AMI progress codes

S3 Resume Error Codes

0xE8 S3 Resume Failed

0xE9 S3 Resume PPI not Found

0xEA S3 Resume Boot Script Error

0xEB S3 OS Wake Error

0xEC – 0xEF Reserved for future AMI error codes

Recovery Progress Codes

0xF0 Recovery condition triggered by firmware (Auto recovery)

0xF1 Recovery condition triggered by user (Forced recovery)

0xF2 Recovery process started

0xF3 Recovery firmware image is found

0xF4 Recovery firmware image is loaded

0xF5 – 0xF7 Reserved for future AMI progress codes

Recovery Error Codes

0xF8 Recovery PPI is not available

0xF9 Recovery capsule is not found

0xFA Invalid recovery capsule

0xFB – 0xFF Reserved for future AMI error codes

PEI Beep Codes

# of Beeps Description
1 (repeatedly) Memory not installed

1 Memory was installed twice (InstallPEIMemory routine in PEI Core called twice)

2 Recovery started

3 DXEIPL was not found

3 DXE Core Firmware Volume was not found

4 Recovery failed

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# of Beeps Description
4 S3 Resume failed

7 Reset PPI is not available

DXE Phase
Status Code Description
0x60 DXE Core is started

0x61 NVRAM initialization

0x62 Installation of the South Bridge Runtime Services

0x63 CPU DXE initialization is started

0x64 CPU DXE initialization (CPU module specific)

0x65 CPU DXE initialization (CPU module specific)

0x66 CPU DXE initialization (CPU module specific)

0x67 CPU DXE initialization (CPU module specific)

0x68 PCI host bridge initialization

0x69 North Bridge DXE initialization is started

0x6A North Bridge DXE SMM initialization is started

0x6B North Bridge DXE initialization (North Bridge module specific)

0x6C North Bridge DXE initialization (North Bridge module specific)

0x6D North Bridge DXE initialization (North Bridge module specific)

0x6E North Bridge DXE initialization (North Bridge module specific)

0x6F North Bridge DXE initialization (North Bridge module specific)

0x70 South Bridge DXE initialization is started

0x71 South Bridge DXE SMM initialization is started

0x72 South Bridge devices initialization

0x73 South Bridge DXE initialization (South Bridge module specific)

0x74 South Bridge DXE initialization (South Bridge module specific)

0x75 South Bridge DXE initialization (South Bridge module specific)

0x76 South Bridge DXE initialization (South Bridge module specific)

0x77 South Bridge DXE initialization (South Bridge module specific)

0x78 ACPI module initialization

0x79 CSM initialization

0x7A – 0x7F Reserved for future AMI DXE codes

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Status Code Description
0x80 – 0x8F OEM DXE initialization codes

0x90 Boot Device Selection (BDS) phase is started

0x91 Driver connecting is started

0x92 PCI Bus initialization is started

0x93 PCI Bus Hot Plug Controller initialization

0x94 PCI Bus Enumeration

0x95 PCI BUS Request Resources

0x96 PCI Bus Assign Resources

0x97 Console Output devices connect

0x98 Console Input devices connect

0x99 Super IO initialization

0x9A USB initialization is started

0x9B USB Reset

0x9C USB Detect

0x9D USB Enable

0x9E -0x9F Reserved for future AMI codes

0xA0 IDE initialization is started

0xA1 IDE Reset

0xA2 IDE Detect

0xA3 IDE Enable

0xA4 SCSI initialization is started

0xA5 SCSI Reset

0xA6 SCSI Detect

0xA7 SCSI Enable

0xA8 Setup Verifying Password

0xA9 Start of Setup

0xAA Reserved for ASL (see ASL Status Codes section below)

0xAB Setup Input Wait

0xAC Reserved for ASL (see ASL Status Codes section below)

0xAD Ready To Boot event

0xAE Legacy Boot event

0xAF Exit Boot Services event

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Status Code Description
0xB0 Runtime Set Virtual Address MAP Begin

0xB1 Runtime Set Virtual Address MAP End

0xB2 Legacy Option ROM initialization

0xB3 System Reset

0xB4 USB hot plug

0xB5 PCI bus hot plug

0xB6 Clean-up of NVRAM

0xB7 Configuration Reset (reset of NVRAM settings)

0xB8 – 0xBF Reserved for future AMI codes

0xC0 – 0xCF OEM BDS initialization codes

DXE Error Codes

0xD0 CPU initialization error

0xD1 North Bridge initialization error

0xD2 South Bridge initialization error

0xD3 Some of the Architectural Protocols are not available

0xD4 PCI resource allocation error. Out of Resources

0xD5 No Space for Legacy Option ROM

0xD6 No Console Output Devices are found

0xD7 No Console Input Devices are found

0xD8 Invalid password

0xD9 Error loading Boot Option (LoadImage returned error)

0xDA Boot Option is failed (StartImage returned error)

0xDB Flash update is failed

0xDC Reset protocol is not available

DXE Beep Codes

# of Beeps Description
1 Invalid password

4 Some of the Architectural Protocols are not available

5 No Console Output Devices are found

5 No Console Input Devices are found

6 Flash update is failed

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# of Beeps Description
7 Reset protocol is not available

8 Platform PCI resource requirements cannot be met

ACPI/ASL Checkpoints
Status Code Description
0x01 System is entering S1 sleep state

0x02 System is entering S2 sleep state

0x03 System is entering S3 sleep state

0x04 System is entering S4 sleep state

0x05 System is entering S5 sleep state

0x10 System is waking up from the S1 sleep state

0x20 System is waking up from the S2 sleep state

0x30 System is waking up from the S3 sleep state

0x40 System is waking up from the S4 sleep state

0xAC System has transitioned into ACPI mode. Interrupt controller is in PIC mode.

0xAA System has transitioned into ACPI mode. Interrupt controller is in APIC mode.

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NOTE

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 Appendix I: How to recover UEFI BIOS

Important Notes:

The emergency UEFI BIOS Recovery process is only used to rescue a system with
a failed or corrupted BIOS image that fails to boot to an OS. It is not intended to be
used as a general purpose BIOS flashing procedure and should not be used as such.
Please do not shutdown or reset the system while the BIOS recovery process is
underway or there is risk of damage to the UEFI recovery bootloader that would
prevent the recovery process itself from working. In no event shall Tyan be liable for
direct, indirect, incidental, special or consequential damages arising from the BIOS
update or recovery.

The BIOS Recovery file is named xxxx.cap, where the 'xxxx' portion is the
motherboard model number. Examples: 5630.cap, 7106.cap, 7109.cap, etc. Please
make sure that you are using the correct BIOS Recovery file from Tyan's web site.

BIOS Recovery Process

1. Place the recovery BIOS file (xxxx.cap) in the root directory of a USB disk.
2. Ensure that the system is powered off.
3. Insert the USB disk to any USB port on the motherboard or chassis.
4. Power the system on while pressing “Ctrl” and “Home” simultaneously on the
keyboard. Continue to hold these keys down until the following Tyan screen is
displayed on the monitor:

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5. The system will boot to BIOS setup. A new menu item will appear at the far
right of the screen. Scroll to the 'Recovery' tab, move the curser to “Proceed with
flash update” and press the "Enter" key on the keyboard to start the BIOS recovery
process.

6. IMPORTANT: Do not power off or reboot the server during the BIOS recovery
process. This can damage the BIOS recovery bootloader and prevent it from loading
a subsequent time.
7. Wait for the BIOS recovery procedure to complete. Completion is signified with
the message “Flash update completed. Press any key to reset the system” displayed
on screen.
8. Remove the USB disk and reboot.

If your system does not have video output or the POST code halts at “FF” on the
right-lower portion of the screen, please contact Tyan representatives for RMA
service.

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 Appendix II: How to install Power Wire Clip

Follow these instructions to install the Power Wire Clip.

1. Press the lever to pull the clip to the right.

2. Insert the Power Wire Clip into the Power Wire Clip Jack.

3. Plug in the AC Power Cord.

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4. Press to lock the clip and push the clip forwards.

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 Appendix III: Cable Connection Tables

1. Fan Ctrl & Fan PWR Cable

M1809F77A FAN board to S7119 MB
Fan board Connect to S7119 M/B
J8 → J35
J7 →
J9 → PE_PW7
J10 →
J11 →

2. FP Ctrl & USB Cable

M1713 FP board to S7119 MB
M1713 FP board Connect to S7119 M/B
J3_SSI_FP (FP Cable) → FPIO_1
J1_USB_IN (USB Cable) → USB3_FPIO1

3. VGA & COM port Cable

Front BKT to S7119 MB
Front BKT Connect to S7119 M/B
VGA Cable → FPIO_VGA2
COM port Cable → HD_COM3

4. 2x4P PWR Cable

M7119FA77-IO to S7119 MB
M7119FA77-IO Connect to S7119 M/B
2x4P PWR Cable-1 PW1 → PE_PW6
2x4P PWR Cable-2 PW2 → PE_PW9
2x4P PWR Cable-3 PW3 → PE_PW8

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5. SATA & Mini-SAS HD & B4P PWR Cable (B7119F77V14HR-2T-N)
M1284F77D HDD BP to S7119 MB
HDD BP Connect to S7119 M/B
SATA0 (SATA Cable-1) → PCH_SSATA_4
SATA1 (SATA Cable-2) → PCH_SSATA_5
SATA2~5
(Mini-SAS HD Cable-1) → PCH_SSATA_0123
SATA6~9
(Mini-SAS HD Cable-2) → PCH_SATA_0123
SATA10~13
(Mini-SAS HD Cable-3) → PCH_SATA_4567

PW1(B4P PWR Cable-1) → M/B D4P_PW1

PW2(B4P PWR Cable-2) → M/B D4P_PW2
PW3(B4P PWR Cable-3) → M/B D4P_PW3

6. SATA & Mini-SAS HD & Oculink & SGPIO & B4P PWR Cable (B7119F77V10E4HR-2T-N)
M1284F77D HDD BP to S7119 MB
HDD BP Connect to S7119 M/B
SATA0 (SATA Cable-1) → PCH_SSATA_4
SATA1 (SATA Cable-2) → PCH_SSATA_5
SGPIO1 (SGPIO Cable) → SSATA_SGPIO1
NVME01
(Oculink Cable-1) → J9
NVME23
(Oculink Cable-2) → J8
SATA6~9
(Mini-SAS HD Cable-2) → PCH_SATA_0123
SATA10~13
(Mini-SAS HD Cable-3) → PCH_SATA_4567

PW1(B4P PWR Cable-1) → M/B D4P_PW1

PW2(B4P PWR Cable-2) → M/B D4P_PW2
PW3(B4P PWR Cable-3) → M/B D4P_PW3

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7. Mini-SAS HD & B4P PWR Cable (B7119F77V4HR-2T-N)
M1291F77D HDD BP to S7119 MB
HDD BP Connect to S7119 M/B
SATA0~3
Mini-SAS HD Cable → PCH_SSATA_0123

PW1(B4P PWR Cable-1) → MB D4P_PW1

PW2(B4P PWR Cable-2) → MB D4P_PW2

8. GPU PWR Cable

S7119 MB to GPU Card
S7119 M/B Connect to GPU Card
GPU PWR Cable-1
PE_PW16 → GPU1
GPU PWR Cable-2
PE_PW13
→ GPU2
GPU PWR Cable-3
PE_PW4
→ GPU3
GPU PWR Cable-4
PE_PW12
→ GPU4
GPU PWR Cable-5
PE_PW15
→ GPU5
GPU PWR Cable-6
PE_PW14
→ GPU6
GPU PWR Cable-7
PE_PW11
→ GPU7
GPU PWR Cable-8
PE_PW17
→ GPU8
GPU PWR Cable-9
PE_PW18
→ GPU9
GPU PWR Cable-10
PE_PW5
→ GPU10

NOTE: Please note the thermal design power (TDP) of GPU must be less than
300W or OCP (over current protect) will occur.

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NOTE

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 Appendix IV: Fan and Temp Sensors

This section aims to help readers identify the locations of some specific FAN and
Temp Sensors on the motherboard. A table of BIOS Temp sensor name
explanation is also included for readers’ reference.

Figure 1: Sensor Location

NOTE: The red spot indicates the sensor.

Fan and Temp Sensor Location:

1. Fan Sensor: It is located in the third pin of the fan connector, which detects the
fan speed (rpm)
2. Temp Sensor: refer to Figure 1: Sensor Location. They detect the system
temperature around.

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BIOS Temp Sensor Name Explanation:

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 239
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BIOS Temp Sensor Name Explanation
P0_DTS_Temp Temperature of the CPU0 Digital Temperature Sensor
P1_DTS_Temp Temperature of the CPU1 Digital Temperature Sensor
P0_PECI_Value Temperature of the CPU0 Platform Environment Control Interface
P1_PECI_Value Temperature of the CPU1 Platform Environment Control Interface
PCH_Temp Temperature of the PCH
PSU0_Air_Inlet Temperature of the PSU0 Air Inlet Area
PSU1_Air_Inlet Temperature of the PSU1 Air Inlet Area
MB_Air_Inet Temperature of the M/B Air Inlet Area
SYS_Air_Inlet Temperature of the SYS Air Inlet Area
P0_MOSFET The Max Temperature of CPU0 MOSFET
P1_MOSFET The Max Temperature of CPU1 MOSFET
P0_DIMM_MOSFET_1 The Max Temperature of P0 DIMM Area1 MOSFET
P0_DIMM_MOSFET_2 The Max Temperature of P0 DIMM Area2 MOSFET
P1_DIMM_MOSFET_1 The Max Temperature of P1 DIMM Area1 MOSFET
P1_DIMM_MOSFET_2 The Max Temperature of P1 DIMM Area2 MOSFET
P0_MC0_DIM_CH_A The Max Temperature of P0_MC0_ DIM_ A Slot
P0_MC0_DIM_CH_B The Max Temperature of P0_MC0_ DIM_ B Slot
P0_MC0_DIM_CH_C The Max Temperature of P0_MC0_ DIM_ C Slot
P0_MC1_DIM_CH_D The Max Temperature of P0_MC1_ DIM_ D Slot
P0_MC1_DIM_CH_E The Max Temperature of P0_MC1_ DIM_ E Slot
P0_MC1_DIM_CH_F The Max Temperature of P0_MC1_ DIM_ F Slot
P1_MC0_DIM_CH_A The Max Temperature of P1_MC0_ DIM_ A Slot
P1_MC0_DIM_CH_B The Max Temperature of P1_MC0_ DIM_ B Slot
P1_MC0_DIM_CH_C The Max Temperature of P1_MC0_ DIM_ C Slot
P1_MC1_DIM_CH_D The Max Temperature of P1_MC1_ DIM_ D Slot
P1_MC1_DIM_CH_E The Max Temperature of P1_MC1_ DIM_ E Slot
P1_MC1_DIM_CH_F The Max Temperature of P1_MC1_ DIM_ F Slot
GPU0_Core_TEMP Temperature of GPU0 Core Slot
GPU1_Core0_ TEMP Temperature of GPU1 Core0 Slot
GPU1_Core1_ TEMP Temperature of GPU1 Core1 Slot
GPU2_Core_ TEMP Temperature of GPU2 Core Slot
GPU3_Core0_ TEMP Temperature of GPU3 Core0 Slot
GPU3_Core1_ TEMP Temperature of GPU3 Core1 Slot
GPU4_Core_ TEMP Temperature of GPU4 Core Slot
GPU5_Core0_ TEMP Temperature of GPU5 Core0 Slot
GPU5_Core1_ TEMP Temperature of GPU5 Core1 Slot
GPU6_Core_ TEMP Temperature of GPU6 Core Slot

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GPU7_Core0_ TEMP Temperature of GPU7 Core0 Slot
GPU7_Core1_ TEMP Temperature of GPU7 Core1 Slot
GPU8_Core_ TEMP Temperature of GPU8 Core Slot
GPU9_Core0_ TEMP Temperature of GPU9 Core0 Slot
GPU9_Core1_ TEMP Temperature of GPU9 Core1 Slot
GPU10_Core_ TEMP Temperature of GPU10 Core Slot
GPU11_Core0_ TEMP Temperature of GPU11 Core0 Slot
GPU11_Core1_ TEMP Temperature of GPU11 Core1 Slot
GPU12_Core_ TEMP Temperature of GPU12 Core Slot
GPU13_Core0_ TEMP Temperature of GPU13 Core0 Slot
GPU13_Core1_ TEMP Temperature of GPU13 Core1 Slot
GPU14_Core_ TEMP Temperature of GPU14 Core Slot
GPU15_Core0_ TEMP Temperature of GPU15 Core0 Slot
GPU15_Core1_ TEMP Temperature of GPU15 Core1 Slot
GPU16_Core_ TEMP Temperature of GPU16 Core Slot
GPU17_Core0_ TEMP Temperature of GPU17 Core0 Slot
GPU17_Core1_ TEMP Temperature of GPU17 Core1 Slot
GPU18_Core_ TEMP Temperature of GPU18 Core Slot
GPU19_Core0_ TEMP Temperature of GPU19 Core0 Slot
GPU19_Core1_ TEMP Temperature of GPU19 Core1 Slot
SYS_FAN_1 Fan speed of SYS_FAN_1
SYS_FAN_2 Fan speed of SYS_FAN_2
SYS_FAN_3 Fan speed of SYS_FAN_3
SYS_FAN_4 Fan speed of SYS_FAN_4
SYS_FAN_5 Fan speed of SYS_FAN_5
SYS_FAN_6 Fan speed of SYS_FAN_6

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NOTE

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 Appendix V: FRU Parts Table

FA77-B7119 FRU Parts

Item Model Number Part Number Picture Description

Air Duct FRU-TA-0060 343T56800003 Air Duct

PWR Cord; US, 125V, 16

FRU-CS-0330 332810000514
AWG(1.31mm²),1800MM

POWER CORD;EU,250 V,16

FRU-CS-0460 332810000515
AWG(1.0mm²),1800mm

750 mm, OCuLink 8X 80P/OCuLink 8X

FRU-CS-0710 422T57200005
Cable 80P,Reversed Signal

250MM, GPU PWR CABLE,

FRU-CS-0310 422T45900007 2*4P(M),P4.2/GPU 2*4P(M),P4.2/GPU

2*3P(M), P4.2

150MM, GPU POWER CABLE

FRU-CS-0840 422794300006
2*4P(M),P4.2/2*4P(M),P4.2

FRU-NC-9060 5412T5770006 M7062-I599-2T W/Bracket

FRU-NC-9080 5412T5770008 M7076-X540-2T W/ Bracket

Compatible
FRU-NC-9090 5412T5770009 M7076-I350 W/ Bracket
Accessories

FRU-NC-9100 5412T5770010 M7086-X710-2F W/ Bracket

M2217-L16-IO 411T57700034 OCP Riser Card

PASSIVE HEATSINK, 1A0-D042800991,

CPU Heatsink FRU-TH-0220 343T56600001
108.0X78.0X64.0MM

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 FAN FRU-TS-0040 5412T4760009 120X120X38MM W/ holding Bracket

M1284F77D-BP12E-14
5412T5680014 HDD Backplane
HDD FRU-BP-9020
Backplane M1291F77D-BP12E-4
5412T5680013 HDD Backplane
FRU-BP-9200

FRU-SM-9050 5412T5770005 GPU Card Extend Kit

ME Parts

FRU-ST-9010 5412T5770004 REAR TOP COVER,4.5U

1600 W,DELTA,DPS-1600EB B,(S0F),1U

Power Supply FRU-PS-0130 471100000193
MODULE,REV.S0F

Rack
Mounting
FRU-AS-0050 452T52800001 Slide Rail Kit
Kit

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 Appendix VI: Technical Support

If a problem arises with your system, you should first turn to your dealer for direct
support. Your system has most likely been configured or designed by them and they
should have the best idea of what hardware and software your system contains.
Hence, they should be of the most assistance for you. Furthermore, if you purchased
your system from a dealer near you, take the system to them directly to have it
serviced instead of attempting to do so yourself (which can have expensive
consequence).

If these options are not available for you then MITAC COMPUTING TECHNOLOGY
CORPORATION can help. Besides designing innovative and quality products for
over a decade, MITAC has continuously offered customers service beyond their
expectations. TYAN’s website (http://www.tyan.com) provides easy-to-access
resources such as in-depth Linux Online Support sections with downloadable Linux
drivers and comprehensive compatibility reports for chassis, memory and much
more. With all these convenient resources just a few keystrokes away, users can
easily find their latest software and operating system components to keep their
systems running as powerful and productive as possible. MITAC also ranks high for
its commitment to fast and friendly customer support through email. By offering
plenty of options for users, MITAC serves multiple market segments with the
industry’s most competitive services to support them.

Please feel free to contact us directly for this service at [email protected]

Help Resources:

1. See the beep codes section of this manual.

2. See the TYAN’s website for FAQ’s, bulletins, driver updates, and other
information: http://www.tyan.com
3. Contact your dealer for help before calling TYAN.

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Returning Merchandise for Service
During the warranty period, contact your distributor or system vendor FIRST for any
product problems. This warranty only covers normal customer use and does not
cover damages incurred during shipping or failure due to the alteration, misuse,
abuse, or improper maintenance of products.

NOTE:
A receipt or copy of your invoice marked with the date of
purchase is required before any warranty service can be
rendered. You may obtain service by calling the
manufacturer for a Return Merchandise Authorization
(RMA) number. The RMA number should be prominently
displayed on the outside of the shipping carton and the
package should be mailed prepaid.
TYAN will pay to have the board shipped back to you.

TYAN® FA77-B7119 Service Engineer’s Manual V1.0b

Document No.: D2415-100

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