OMB
Hardware Description
Issue 04
Date 2020-12-29
HUAWEI TECHNOLOGIES CO., LTD.
Copyright © Huawei Technologies Co., Ltd. 2021. All rights reserved.
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Huawei Technologies Co., Ltd.
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Email: [email protected]
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Hardware Description Contents
Contents
1 OMB Hardware Description.................................................................................................. 1
1.1 Changes in OMB Hardware Description..........................................................................................................................2
1.2 Exterior of the OMB (Ver.C)................................................................................................................................................ 4
1.3 Components in OMBs (Ver.C)............................................................................................................................................. 4
1.4 OMB (Ver.C) Engineering Specifications......................................................................................................................... 7
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Hardware Description 1 OMB Hardware Description
1 OMB Hardware Description
Overview
This document describes the exteriors, components, and engineering specifications
of the OMB (Ver.C).
The RF modules for distributed base stations in this document include RRUs and
AAUs. The application scenarios, power distribution schemes, cable connections,
and cable installation of the RRUs and AAUs are the same. The following uses the
RRUs as an example.
The exteriors of components or cables in this document are for reference only. The
actual exteriors may be different.
NOTE
● Unless otherwise specified, in this document, LTE and eNodeB always include FDD, NB-IoT,
and TDD. In scenarios where they need to be distinguished, LTE FDD, LTE NB-IoT, and LTE
TDD are used. The same rules apply to eNodeB.
● Unless otherwise specified, in this document, NR and gNodeB always include FDD and TDD.
In scenarios where they need to be distinguished, NR FDD and NR TDD are used. The same
rules apply to gNodeB.
● In this document, "G" is short for GSM, "U" for UMTS, "L" for LTE FDD, "T" for LTE TDD, "M"
for LTE NB-IoT, and "N" for NR. In addition, "N (FDD)" is short for NR FDD and "N (TDD)" is
short for NR TDD.
● For details about the LampSite solution, see LampSite Base Station Hardware Description.
● For details about the power requirements and power distribution schemes of OMB cabinets,
see corresponding "Power Requirements" and "Power Distribution Schemes" sections in base
station model sections.
Product Versions
The following table lists the product versions related to this document.
Product Name Solution Version Product Version
3900 series base stations SRAN8.0 and later V100R008C00 and later
5900 series base stations
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Hardware Description 1 OMB Hardware Description
Unless otherwise specified, cabinets, components, and RATs involved in this
document are supported in V100R008C00 and later versions. The following table
lists the special cases.
Item Solution Version Product Version
● EPU02D SRAN12.1/GBSS19.1/ V100R012C10 and later
● EPU02D-02 RAN19.1/eRAN12.1/
eRAN TDD 12.1 and later
DCDU16D SRAN15.1/GBSS21.1/ V100R015C10 and later
RAN21.1/eRAN15.1/
eRAN TDD 15.1 and later
EPU02S SRAN16.0/GBSS22.0/ V100R016C00 and later
RAN22.0/eRAN16.0/
eRAN TDD 16.0 and later
● EPU02B SRAN16.1/GBSS22.1/ V100R016C10 and later
● EPU02S-02 RAN22.1/eRAN16.1/
eRAN TDD 16.1 and later
DCDU16D-02 SRAN17.0/GBSS23.0/ V100R017C00 and later
RAN23.0/eRAN17.0/
eRAN TDD 17.0 and later
Intended Audience
This document is intended for:
● System engineers
● Base station installation engineers
● Site maintenance engineers
Organization
1.1 Changes in OMB Hardware Description
This section describes the changes in OMB Hardware Description.
1.2 Exterior of the OMB (Ver.C)
This section describes the exterior and dimensions of the OMB (Ver.C).
1.3 Components in OMBs (Ver.C)
This section describes modules and boards in OMBs (Ver.C).
1.4 OMB (Ver.C) Engineering Specifications
This section describes the engineering specifications of an OMB (Ver.C), including
input power specifications, equipment specifications, environmental specifications,
and compliance standards.
1.1 Changes in OMB Hardware Description
This section describes the changes in OMB Hardware Description.
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04 (2020-12-29)
This is the fourth commercial release.
Compared with Issue 03 (2020-10-10), this issue does not include any new topics
or exclude any topics.
Compared with Issue 03 (2020-10-10), this issue includes the following changes.
Topic Change Description
Entire document Deleted descriptions of the OMB,
HEUA, EPS30-4815AF, and DCDU-03B.
03 (2020-10-10)
This is the third commercial release.
Compared with Issue 02 (2020-07-31), this issue does not include any new topics
or exclude any topics.
Compared with Issue 02 (2020-07-31), this issue includes the following changes.
Topic Change Description
1.3 Components in OMBs (Ver.C) Deleted the DCDU16D-02S description.
02 (2020-07-31)
This is the second commercial release.
Compared with Issue 01 (2020-01-20), this issue does not include any new topics
or exclude any topics.
Compared with Issue 01 (2020-01-20), this issue includes the following changes.
Topic Change Description
1.3 Components in OMBs (Ver.C) Added the descriptions of
DCDU16D-02 and DCDU16D-02S.
01 (2020-01-20)
This is the first commercial release.
This document is separated from the 3900 & 5900 Series Base Station Hardware
Description document and its content derives from the section "OMB Description."
Compared with the section "OMB Description" in 3900 & 5900 Series Base Station
Hardware Description of Issue 18 (2019-03-25), this issue does not include any
new topics or changes, or exclude any topics.
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Hardware Description 1 OMB Hardware Description
Before the separation, compared with Issue 17 (2018-12-31), Issue 18
(2019-03-25) does not include any new topics or changes, or exclude any topics.
1.2 Exterior of the OMB (Ver.C)
This section describes the exterior and dimensions of the OMB (Ver.C).
The following figure shows the exterior of the OMB (Ver.C).
Figure 1-1 Exterior of the OMB (Ver.C)
The following figure shows the dimensions of the OMB (Ver.C).
Figure 1-2 Dimensions of the OMB (Ver.C)
1.3 Components in OMBs (Ver.C)
This section describes modules and boards in OMBs (Ver.C).
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Components in OMBs (Ver.C)
The OMB (Ver.C) is classified into the AC OMB (Ver.C) and the DC OMB (Ver.C).
The following figure shows the components in OMBs (Ver.C).
Figure 1-3 Components in OMBs (Ver.C)
The following table lists the components in the cabinet.
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Table 1-1 Components in OMBs (Ver.C)
No. Modul Manda Maximu Remarks
e/ tory/ m
Board Option Quantity
al in a
Cabinet
1 ELU Manda 1 An electronic label unit (ELU) reports
tory the cabinet type automatically to
facilitate troubleshooting.
2 PMU Manda 1 A PMU 11A/PMU 11B manages a power
11A or tory system, monitors power distribution,
PMU and reports alarms.
11B
3 HEUB Manda 1 An HEUB provides power for fans,
tory monitors the status of fans, collects
cabinet environment monitoring
information and power surge protection
alarm information, and reports the
collected information to a BBU.
4 PSU Manda 2 A power supply unit (PSU) converts 110
(R4850 tory V AC or 220 V AC power into -48 V DC
G2) power.
5 BBU Manda 1 A BBU processes baseband signals and
tory enables the base station to interact with
the base station controller. For details,
see BBU3900 and BBU3910 Hardware
Description.
The BBUs applicable to an OMB (Ver.C)
include the BBU3900 and BBU3910.
6 FAU01 Manda 2 FAUs dissipate heat from a cabinet.
D-01 tory FAUs are located on the inner upper left
wall and the inner lower left wall of an
OMB.
7 PDU10 Manda 1 A power distribution unit 10D-01
D-01 tory (PDU10D-01) distributes -48 V DC
power to other components in a
cabinet.
8 SPD Manda 1 A surge protection device (SPD) provides
tory surge protection for AC input power.
9 ETP481 Manda 1 An embedded telecommunication power
00-A1 tory 48100-A1 (ETP48100-A1) converts
external AC input power into DC power.
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No. Modul Manda Maximu Remarks
e/ tory/ m
Board Option Quantity
al in a
Cabinet
10 EPU02 Option 1 An EPU02D/EPU02D-02/EPU02B/
D/ al EPU02S/EPU02S-02 is a voltage
EPU02 boosting power distribution unit, which
D-02/ distributes -57 V DC power to other
EPU02 components in a cabinet.
B/
EPU02
S/
EPU02
S-02
11 DCDU1 Option 1 A DCDU16D/DCDU16D-02 provides -48
6D/ al V power for the RRUs.
DCDU1
6D-02
1.4 OMB (Ver.C) Engineering Specifications
This section describes the engineering specifications of an OMB (Ver.C), including
input power specifications, equipment specifications, environmental specifications,
and compliance standards.
Input Power Specifications
The input power specifications of an OMB (Ver.C) are listed as follows.
Table 1-2 Input power specifications of an OMB (Ver.C)
Item Power Input Type Voltage Range
Input power 220 V AC single-phase Rated voltage: 200 V AC
specifications to 240 V AC
Operating voltage: 176 V
AC to 290 V AC
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Item Power Input Type Voltage Range
110 V AC dual-live-wire Rated voltage:
● Phase voltage: 100 V
AC to 120 V AC
● Line voltage: 200 V AC
to 240 V AC
Operating voltage:
● Phase voltage: 90 V
AC to 135 V AC
● Line voltage: 180 V AC
to 270 V AC
-48 V DC -38.4 V DC to -57 V DC
Equipment Specifications
The equipment specifications of an OMB (Ver.C) are listed as follows.
Table 1-3 Equipment specifications of an OMB (Ver.C)
Item Specifications
Dimensions (H x W x D) Cabinet: 600 mm x 240 mm x 430 mm
(23.62 in. x 9.45 in. x 16.93 in.)
Weight AC OMB: ≤ 30 kg (66.15 lb)
DC OMB: ≤ 21 kg (46.31 lb)
Heat dissipation capability of the The maximum heat dissipation
cabinet capability is 650 W when the ambient
temperature is 50°C (122°F).
Environmental Specifications
The environmental specifications of an OMB (Ver.C) are listed as follows.
Table 1-4 Environmental specifications of an OMB (Ver.C)
Item Specifications
Operating temperaturea -33°C to +50°C (-27.4°F to +122°F)
Relative humidity 5% RH to 100% RH
Altitude ≤ 4000 m (13123.36 ft)
Ingress protection rating IP55
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Item Specifications
Noise sound power level Complies with the ETS 300 751 4.1E
standard.
● ≤ 6.6 bels@+25°C (77°F)
● ≤ 7.6 bels@+45°C (113°F)
Storage environment ETSI EN300019-1-1 V2.1.4 (2003-04)
Class 1.2 "Weatherprotected, not
temperature-controlled storage
locations"
a: The lower temperature alarm threshold is -33°C (-27.4 °F).
Compliance Standards
The compliance standards for an OMB (Ver.C) are listed as follows.
Table 1-5 Compliance standards for an OMB (Ver.C)
Item Standard
Security standards ● IEC/EN/UL 62368-1
● IEC/EN/UL60950-1
● IEC/EN/UL60950-22
● GB 4943.1
● GB 4943.22
Operating environment ETS 300 019-1-4 Class 4.1
Transportation environment ETSI EN 300019-1-2 class 2.3 "Public
transportation"
Shockproof protection ● YD5083
● ETSI 300 019-2-3
● GR-63 Zone4
● NTT
EMCa ● ETSI EN300 386
● CISPR 32
● EN55032
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Item Standard
Surge protection ● IEC 62305-1 Protection against
lightning - Part 1: General principles
● IEC 62305-3 Protection against
lightning - Part 3: Physical damage
to structures and life hazard
● IEC 62305-4 Protection against
lightning - Part 4: Electrical and
electronic systems within structures
● ITU-T K.35 Bonding configurations
and earthing at remote electronic
sites
● ITU-T K.56 Protection of radio base
stations against lightning discharges
● ITU-T K.97 Lightning protection of
distributed base stations
● ETSI EN 300 253 Environmental
Engineering(EE): Earthing and
bonding configuration inside
telecommunications centers
● YD/T 2324-2011: Lightning
protection requirements and test
methods for radio base stations
● GB 50689-2011: Code for design of
lightning protection and earthing
engineering for telecommunication
bureaus (stations)
a: If interference exists because the cabinet is installed near antennas or other
wireless receivers, you are advised to extend the distance between them or
adjust the location and direction of antennas.
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