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EMIR

Electromigration and IR drop are important reliability concerns for semiconductor designs. Electromigration is the gradual movement of metal ions caused by high current density, which can lead to voids or hillocks causing open or short circuits. IR drop refers to voltage drop across interconnects due to resistance, which can impact timing. Design techniques like increasing wire width and stacking, parallel routing, and via usage can help mitigate electromigration and IR drop issues. Tools are used to simulate and check for electromigration and IR drop violations during design.

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harish
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1K views18 pages

EMIR

Electromigration and IR drop are important reliability concerns for semiconductor designs. Electromigration is the gradual movement of metal ions caused by high current density, which can lead to voids or hillocks causing open or short circuits. IR drop refers to voltage drop across interconnects due to resistance, which can impact timing. Design techniques like increasing wire width and stacking, parallel routing, and via usage can help mitigate electromigration and IR drop issues. Tools are used to simulate and check for electromigration and IR drop violations during design.

Uploaded by

harish
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
  • Electromigration and IR
  • What is Electromigration?
  • Failure Mechanism
  • Electromigration Dependency on Physical Effects
  • Electromigration Impact in Design
  • Types of EM Checks
  • EM Remedies and Precautions
  • IR Drop
  • IR Drop Analysis
  • Mitigation Strategies for EM and IR Drop
  • Tools for EM IR Checks
  • Conclusion and Questions

Electromigration and IR

By
Harish
What is Electromigration?


Gradual displacement of metal atoms in a semiconductor

when the current density is high enough to cause the drift of
metal ions in the direction of the electron flow

Depends on the magnitude of forces that tend to hold the ions
in place

nature of the conductor, crystal size and interface

current density, temperature and mechanical stresses
Failure Mechanism


There are two different EM failure mechanisms that occur
due to asymmetry in the ion flow.

A void where the outgoing ion flux exceeds the incoming
ion flux: open circuit
Failure Mechanism


A hillock where the incoming ion flux exceeds the
outgoing ion flux: short circuit
Electromigration Dependency on Physical
Effects


Wire Width

By increasing the wire width, current density is reduced and
susceptibility to EM is reduced


Wire Length

a lower limit for the length of interconnect that will be subjected
to the effects of electron migration
Electromigration Dependency on Physical
Effects


Impact of Physical Layout

Interconnect layout has an impact on electron migration and
current density

90° corners and rapid wire width reduction should be avoided

current crowding and rapid increase in current density
exacerbate EM
IR Drop

 Every chip will have IR Drop



Designers need to understand impact of IR drop on
functionality

Functional (Logic level) change due to noise margin
reduction

10% IR drop may increase delay up to 8%

Timing failures due to circuit slow down or speed-up
IR Drop
 For EM :
 Increasing the metal width
 Metal slotting
 Metal stacking
 Parallel routing
 More vias.

 For IR drop :
 Going for higher metal (wider width)
 Parallel routing
Tools for EM IR checks

 Samsung -- Totem tool 10nm for EMIR


 EM will be 2 types 1) signal EM 2) power EM
 In every company they will follow some percentage levels for
EM and IR.
 While running in tool after simulation it will highlight that
particular area where we are getting violations.
 For example in some particular company they will allow up
to 100% for EMIR if we are getting more that percentage(i.e.
required) we have to fix those nets.
 Intel -- Genesys 10nm 14nm.
 For EM we will use RV calculator and for verification we
will go for RV CHECK

 SONY -- Red hawk (schematic designer will run after


submitting the layout )

 Synopsys -- Custom sim


 Cadence -- Volcus
 Mentor graphics -- Apache totem
Thank you
questions

 Extension file ?
 Metal slotting?
 Static and dynamic drop?

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