CVD vs PVD
• * CVD - Chemical Vapor Deposition Technique
* PVD - Physical Vapor Deposition Technique
PVD
A method that utilizes the condensation of vapor on the substrate
surface under :
High temperature – Vacuum
&
Low pressure Vapor conditions
Working Mechanism of PVD
1-Evaporation 3-Condensation
2-Transportation
PVD Techniques
• Thermal evaporation
• Molecular Beam Epitaxy
Evaporation • Pulsed Laser Deposition
• Electron Beam deposition
• DC Sputtering
Sputtering • RF Sputtering
• Magnetron Sputtering
Advantages & Disadvantages of
PVD
Advantages Disadvantages
• Excellent Process Control • High capital cost due to Vacuum
processes involved
• Low Deposition Temperature
• Cooling Systems required
• Dense Adherent Coatings
• Slow rate of coating deposition
• Elemental, alloy and compound
coatings possible • Treatable component size is limited
• Extremely hard, corrosion-resistant • Line of sight technique
coating
• High-temperature tolerance and
superior ablation resistance
• Environment friendly
CVD
• In this process the depositing species are inlet into the
coating chamber in a gaseous or vapor form.
• It involves a chemical reaction at the substrate
surface in order to form the thin film.
Working Mechanism of CVD
• Mass Transportation of reactants
from source to substrate.
• Adsorption of reactants on substrate
surface.
• Chemical reaction on substrate
surface.
• Desorption of by-products from
substrate surface
• Pumping away of by-products & un-
reacted reactants
Types of CVD
• Hot-Wall thermal CVD (batch operation type)
• Plasma assisted CVD
• APCVD – Atmospheric pressure CVD – CVD process at atmospheric pressure
• LPCVD – Low pressure CVD
CVD process at sub-atmospheric pressure, as reduced pressure tend to reduce unwanted gas-phase reactions and improve film uniformity across the wafer.
• UHVCVD – Ultrahigh vacuum CVD
CVD process at very low pressure, typically below Pa. (Note that in other fields, a lower division between high and ultra-high vacuum is common, often Pa.
• AACVD - Aerosol assisted CVD
• DLICVD – Direct liquid injection CVD
• MPCVD – Microwave Plasma-assisted CVD
• PECVD – Plasma-enhanced CVD
• RPECVD – Remote plasma-enhanced CVD
• ALCVD - Atomic layer CVD
• CCVD – Combustion CVD
• HWCVD – Hot wire CVD
• HPCVD - Hybrid Physical CVD
• MOCVD – Metalorganic CVD
• RTCVD – Rapid thermal CVD
Advantages & Disadvantages of
CVD
Advantages Disadvantages
• High growth rates possible • High temperature process
• High coating hardness • Sharp edge Coating is difficult
• Good adhesion • Not so environment friendly
• Can deposit materials which are hard to
evaporate
• Good reproducibility
• Can grow epitaxial films
Comparison between PVD and CVD
CVD
PVD
• CVD primarily uses chemical
• PVD involves physical processes only processes
• PVD typically uses a pure material • CVD uses a mixed source material
• High deposition rates (evaporation/MBE
=750,000 A/min) • Moderate deposition rates ( almost
2500 A/min)
• Deposition species are atoms, ions
(MBE, evaporation, sputtering) and • Deposition species are precursor
atoms, ions , clusters (PLD) molecules which dissociates into
atoms
• Limited substrate size in case of PLD
• Substrate size is large
Comparison between PVD and CVD
CVD
PVD
• Can evenly coat irregular surfaces
• Line of sight coating process (thin (thick coating to protect against heat)
coating with sharp edges)
• CVD is applied usually in roughings
• PVD is applied to finishing tools
• Coating is bonded to the surface during
• Less adhesion the reaction so superior adhesion
• Relatively less expensive
• Expensive technique due to high vacuum • Not so environment friendly due to
• Environment friendly release of corrosive & toxic gases
Types of
CVD
