DEC50143 : CMOS IC

DESIGN & FABRICATION

Evaluation
Course Work – 60%
Theory Test (1) : 10%
Quiz (2) : 10%
Practical Work(6):25%
End of Chapter (1): 10%
Essay Question (1) : 2.5%

Final Exam – 40%

 EXPECTATIONS

Attend classes and labs.

 Find out what you’ve missed if you’re absent.
Come earlier than the lecturer.
Ask lecturer whenever have any
problems related with the subject.
INTRODUCTION TO
INTERGRATED
CIRCUIT(IC)
 WHAT IS IC?

IC Package
ICs on PCB

Inside IC
Wafer
 =

IC Layout

IC Schematic
 INTRODUCTION TO IC
Definition of Integrated circuit
IC is a complex set of tiny components and their
interconnections that are imprinted onto a tiny slice of
semiconductor material (e.g silicon). Integrated circuits are
usually called ICs or chips.
History of Semiconductor Industry
History of Semiconductor Industry
History of Semiconductor Industry
 Functions of IC
Most electronic equipment today use integrated circuit, for
example:
 Computer / Server / workstation
 TV / Radio / Video
 Cell Phones
 Digital Clock
 Robotic Systems
 Telecommunication System
 Automotive
 Medical Equipment
 Aerospace
 Children's Toys
 Military Field
 Missile System
 etc.
What is Discrete
component
• Discrete component include
individual electronic
components including
resistors, capacitors, and
diodes, as opposed to
integrated circuits (ICs),
which include these
components on a chip.
Discrete components are
widely used in amplifiers and
other electronic products
that use large amounts of
current.
 Advantages of IC over
discrete component.

i. Small
ii. Low Cost
iii. Very Low Weight
iv. Low power consumption
v. High reliability
vi. Easy replacement
 IC PACKAGING
TECHNOLOGY
Functions of integrated circuit (IC) packages:

Provides signal and power distribution.

Provides mechanical support.
Provides protection from the environment.
Transfer information into and out of the Chip
to the PCB
Draws heat away from the Chip
Components in IC
package

Gold wire Chip Capsule

Mounting pad Chip seal Metal frame

Cross section of IC in dual- in line packages

(DIP)
Components in IC package

Gold wire Chip Capsule

A Chip seal B

Cross section of IC in dual- in line packages

(DIP)
Components in IC
package
 COMPONENTS IN IC PACKAGE
PACKAGES DIAGRAM

Die
Moulding compound
Bond wire

Bonding pad Leadframe

Pin tip
TYPES OF IC PACKAGING MATERIAL
TYPES OF IC PACKAGING MATERIAL

1. Plastic
 – Low cost
 – Typically requires a custom‐designed
package
2.Ceramic
 – Better heat transfer characteristics
 – Generally more reliable (kebolehpercayaan tinggi)
 - Good for research and prototyping

Plastic Packaging and Ceramic Packaging also Known as

Traditional Packaging
 TYPES OF IC PACKAGING MATERIAL

• PLASTIC
 DIP  dual in-line package
 SIP  single in-line package
 TSOP  Thin small outline package
 QFP  Quad flat package
 PLCC  Plastic leaded chip carrier
 LCC  Leadless chip carrier
• CERAMIC
 CERDIP
 pin grid array.
 Typical IC Packages

Dual in-line package Single in-line package Thin small outline package
(DIP) (SIP) (TSOP)

Quad flat pack Plastic leaded chip carrier Leadless chip carrier
(QFP) (PLCC) (LCC)
INTEGRATED CIRCUIT PACKAGING
TECHNOLOGY
TYPES OF CERAMIC PACKAGES - CERDIP
Plane of cross-section

Chip on Cross-
Indexing epoxy and section
notch leadframe
Ceramic lid

Glass seal

Ceramic
base
Metal lead

(CERamic Dual In-line Package) A type of ceramic DIP chip. It uses a

ceramic lid that is bonded to the chip with a glass seal.
INTEGRATED CIRCUIT PACKAGING
TECHNOLOGY
TYPES OF CERAMIC PACKAGES – PIN GRID ARRAY
 IC PACKAGING TECHNOLOGY

IC packaging technology:

i. Through-hole Technology (THT)

ii. Surface Mount Technology (SMT)
INTEGRATED CIRCUIT PACKAGING
TECHNOLOGY
PIN THROUGH HOLE TECHNOLOGY
The mounting of IC or printed
circuit board (PCB) by
inserting the IC leads into
holes drilled on the PCB &
soldered to pads on the
opposite side of the PCB
 Fig. 2.1 Hole Mounting
(insertion-) Technology Printed
Circuit Board

• Fig. 2.1: Hole

mounting
(insertion-)
technology
printed
circuit board.
INTEGRATED CIRCUIT PACKAGING
TECHNOLOGY
SURFACE MOUNT TECHNOLOGY (SMT)

The mounting of IC directly onto

the surface of a PCB without holes
drilled. SMT packaging has either
smaller leads of various styles, flat
contacts, a matrix of solder balls or
no leads at all.
 Fig. 2.2 Surface Mount
Technology Printed Circuit
Board

• Fig. 2.2:
Surface
mount
technology
printed
circuit
board.
 Green IC Packaging and RoHS
Restriction on the use of hazardous substances in electrical and
electronic equipment

Background
 As electronics have
become more common
throughout the world,
concerns have developed
as to what the effect is of
filling landfills with
electronics products.
 Many of these electronic
products contain
hazardous substances.
 Therefore, product based
environmental
regulations are becoming
more common worldwide.
 Green IC Packaging and RoHS
Restriction on the use of hazardous substances in electrical and
electronic equipment
RoHS (Directive) (Directive 2002/95/EC on the) restriction of the use of
certain hazardous substances in electrical and electronic equipment
 Green IC Packaging and RoHS
Restriction on the use of hazardous substances in electrical and
electronic equipment
Examples of components that have contained lead
include:

•paints and pigments

•PVC (vinyl) cables as a stabiliser (e.g., power cords, USB cables)
•solders
•printed circuit board finishes, leads, internal and external
interconnects
•glass in television and photographic products (e.g., CRT television
screens and camera lenses)
•metal parts
•lamps and bulbs
•batteries
•integrated circuits or microchips
Green IC Packaging and RoHS
Green IC packaging

• Lead-free interconnects and halide-free substrates are the essential

ingredients of the “green” IC package.

Lead-free IC Packages

•In electronics manufacturing, board assembly represents a larger

lead issue than IC packages, but packaging is a part of the total
lead-free story. Recent efforts have been concentrated on the tin-
lead plating on the lead frames in packages, such as quad flat
packs (QFPs), small-outline packages (SOPs), and in the lead
content of the balls on area-array packages.

•On lead frames, nickel-palladium with a gold flash has historically

been the most common substitute for solder lead plating.
 IC Integration Scales

18
In 1975, he
updated his
prediction to
once every 18-
24 months.
IC Integration Scales
 Factors that contribute to the accuracy of
Moore’s Law

 Miniaturization size of
transistor from 10µm
(micron) to submicron.
Nowadays, the
smallest transistor is
45nm (0.045µm).

 The law is still

disputed because the
linear growth starts to
decline; the number of
transistors should
increase linearly, but
it starts to decrease
after 1970.
 Microelectronics
Year
Evolution
Technology No. of Example
transistors
1947-1950 Transistor 1 -
1951 -1960 Discrete Component 1 FET, Diode

1961 -1966 SSI 10 Logic Gates, Flip-flop

- Small scale integration
1967-1971 MSI 100 – 1000 Counter, Multiplexer
- Medium scale integration
1972-1980 LSI 1000 – 20,000 RAM, Microprocessor
- Large scale integration
1981 -1990 VLSI 20,000 – 1,000,000 16 bits and 32 bits
Microprocessor
- Very large scale integration

1990-2000 ULSI 1,000,000 – Graphic microprocessor

10,000,000
- Ultra large scale integration

2000 - GSI > 10,000,000 -

nowadays
- Giga scale integration
 Classification of Integrated
Circuit
In general, IC can be classified into FOUR
(4) categories :

• Classification based on circuits function

• Classification based on the fabrication
method
• Classification based on transistor type
• Classification based on design methodology
(to be discussed in the topic 4)
Classification Based on Circuits Function
Integrated Circuit

Linear / Analog
Digital
Integrated circuits that operate with
Integrated circuits that operate with
analogue signal at the input and output -
digital signal at the input and output –
continuous sine wave signal .
Discrete square wave signal
Examples:
Examples:
i. Op-Amp
i. Logic gates
ii. Power Amplifier
ii. Flip-flop
iii. Multiplier
iii. Counter
iv. Comparator
iv. Calculator chips
v. Voltage Regulator
v. Memory
vi. Microprocessor
What is a
Semiconductor?
• Low resistivity => “conductor”
• High resistivity => “insulator”
• Intermediate resistivity =>
“semiconductor” – conductivity lies
between that of conductors and
insulators
– generally crystalline in structure
for IC devices
• In recent years, however, non-
crystalline semiconductors have
become commercially very
important
 Gallium Arsenide
(GaAs) & Indium
• Gallium phosphide (InP)
Arsenide (GaAs) and Indium phosphide (InP) are
compound semiconductor material for its high speed and
high-density integrated circuits.
• GaAs and InP are direct band gap material.
• Application : Fabricating high-speed Electronic devices.
Ex: GaAs FET Inverter Switch , InP -Metal insulator
Semiconductor (MIS) capacitor for Bio-electrodes in
Medical applications
*The wider energy gap of GaAs (1.43 eV) and InP (1.34 eV) makes it attractive
for operation at higher temperatures. GaAs and InP has high electron mobility
(4500 cm2 / V.sec) and high velocity overshoot effects than Silicon.
 Classification Based on
Fabrication Method

IC Classification based on
fabrication method:
a. Monolithic
b. Film
c. Hybrid
 Classification Based on
Fabrication Method
a. Monolithic

The word ‘monolithic’ is derived from the Greek

word monos, meaning ’single’ and lithos, meaning
‘stone’.

A monolithic IC is a miniaturized electronic circuit

including both active and passive components
and their interconnections are being manufactured
in the surface of a thin substrate of semiconductor
material.
Monolithic IC
 Monolithic IC

-Advantages of monolithic IC:

-- most popular because of low cost.
- high reliability.

Disadvantages of monolithic IC:

- isolation weakness
- limited range of passive components.
- circuit design is not flexible.
 Classification Based on
Fabrication Method
b. Film
Film components are made of either
conductive or nonconductive material that is
deposited in desired patterns on a ceramic or
glass substrate.

Film can only be used as passive circuit

components, such as resistors and capacitors.
Transistors and/or diodes are added to the
substrate to complete the circuit.
Film IC
 Classification Based on
Fabrication Method
c. Hybrid IC

Hybrid integrated circuit technology is the

combination of monolithic circuits and film technology.

The active components are monolithic transistors or

diodes. The passive components may be group of
monolithic resistors or capacitors on a single chip, or
they may be thin-film components. Wiring or a
metallized pattern provides connections between
chips.
 Hybrid IC

Hybrids ICs are widely used for high power audio amplifier
applications from 5 W to more than 50 W.
 Hybrid IC
Hybrid ICs usually have better
performance than monolithic ICs.

However, the process is too expensive for

mass production. Thus, multi-chip
techniques are quite economical for small
quantity production and are more often
used as prototypes for monolithic ICs.
 Fabrication Method
Comparison
Characteristics Monolithic Technology Film Technology Hybrid Technology

Type of Active and passive Passive (Resistor Active and

components & Capacitor) passive

Substrate material Silicon (Si) Conduction layer Silicon and

Germanium(Ge) on insulator insulator
Gallium Arsenide (glass, ceramic)
(GaAs)
Interconnection On substrate surface Metal (Al or gold) Interconnection of
method two or more chips

Technology BJT, MOS,GaAs Thin film = 0.5m Combination of

method Thick film = monolithic and
25m film
Size Medium Small Large
Classification of IC based
on transistor type

Types of transistor

MOS BiCMOS

PMOS
NMOS
CMOS
VMOS
 Bipolar Junction
Transistor (BJT)

NPN PNP
Cross section and Symbol Cross section and Symbol
 Bipolar Junction
Transistor (BJT)
• Advantages Of BJT:
i. High switching speed
ii. High durability
iii. High power handling capability

• Disadvantages Of BJT:
i. High power dissipation
ii. Large chip size
iii. Temperature sensitive
 BJT Digital Logic
Families
• A logic family of monolithic digital integrated
circuit devices is a group of electronic logic
gates constructed using one of several different
designs.
• The most popular BJT digital logic families are:
i. Transistor-Transistor Logic (TTL) 4
ii. Emitter-Coupled Logic (ECL)
iii. Integrated Injection Logic (IIL @ I2L)
 Transistor–transistor
logic (TTL)
• TTL ICs are also known as "74" series because
all TTL ICs have the prefix number of 74.
• For examples:
 MOS IC
• MOS transistor is known as MOSFET (metal
oxide semiconductor field-effect transistor).
• MOSFET is widely used nowadays in electronic
equipment, e.g. mobile phone, computer,
medical electronic equipment, etc.
• Examples of MOS technology are:
i. PMOS
ii. NMOS
iii. CMOS
iv. VMOS
PMOS & NMOS

PMOS Symbol
PMOS Cross Section

NMOS Symbol
NMOS Cross Section
 CMOS

CMOS Cross
Section :

2-input NAND gate symbol

Schematic diagram of 2-
input NAND gate using
CMOS
 VMOS

• One of the disadvantages of CMOS

technology is the disability of handling
high power.
• VMOS is invented to overcome the
problem. VMOS has the capability to
operate in high current and voltage.
 VMOS

• VMOS is the acronym of Vertical Metal

Oxide Semiconductor.
• VMOS has the V shape gate to conduct
more carriers vertically from SOURCE
G
to DRAIN. S S

+ +

P P

D
 BiCMOS
• BiCMOS is the acronym of bipolar complementary
metal oxide semiconductor , the technology that
combines BJT and CMOS on the same chip to
generate high speed and high concentration
circuit.
 Advantages &
Disadvantages of MOS
technology
MOS Advantage Disadvantage
Transistor
Types
i. Low fabrication cost. i. Low circuit performance (slow).
PMOS ii. Simple fabrication method. This is because the hole current
mobility is two times slower than
electron.
i. Smaller size compared to PMOS. i. Fabrication process is more difficult
NMOS ii. High circuit performance. compare to PMOS.

i. Low power dissipation. i. Larger size compared to PMOS and

CMOS NMOS.
i. High circuit performance (high i. Larger chip size.
BiCMOS speed). ii. Complex fabrication process.
ii. Low power dissipation. iii. High fabrication cost.
i. Capable of operating in high i. Complex fabrication process.
VMOS current and voltage. ii. High fabrication cost.
ii. High circuit performance (high
speed).