Simon Chaput

Going to FPGAworld in Stockholm tomorrow to present ‘An AXI-stream testbench example, first dead simple, then advanced ’ https://fpgaworld.com/ Do you want to see how easily you can verify your FPGA or ASIC? Join in to see this exemplified with a testbench for an AXI-stream based data flow design – using UVVM, which is currently used by more than one third of all FPGA VHDL designers world-wide. Most testbenches verifying a complex DUT are relatively unstructured and difficult to understand, modify, extend, maintain and reuse. You can often quickly reduce the verification time by at least a factor of two by having a well structured and uncomplicated test harness, and writing commands at a higher abstraction level – allowing a good and complete testcase overview by just looking at a single, simple test sequencer with easy to understand high-level commands. This presentation will first show how interface handling procedures (BFMs) can be applied in a very simple way to verify a DUT. Then we will show how a more advanced testbench using verification components, models, scoreboards and high-level transactions will allow more thorough verification of more complex DUT scenarios in a very structured and simple way.  #FPGA #Verification #UVVM #EmLogic

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Analog to Digital Converters (ADCs) Some are embedded in MCUs. Others are standalone. But when it’s time to choose one, how do you know which is right for your design? This book dives deep into the world of ADCs: * Types of ADC Architectures * Internal Circuit Design * Error Sources & Accuracy Trade-offs * Advanced Concepts & Selection Tips For More Books: https://lnkd.in/dByRyA3h #TechBook #BoardDesign #HardwareEngineering #ADC #AnalogDesign

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𝗪𝗵𝗲𝗻 𝗱𝗲𝘀𝗶𝗴𝗻𝗶𝗻𝗴 𝗮 𝗣𝗖𝗕, 𝗯𝗲𝗴𝗶𝗻𝗻𝗲𝗿𝘀 𝗼𝗳𝘁𝗲𝗻 𝘁𝗵𝗶𝗻𝗸 𝗼𝗳 𝘁𝗿𝗮𝗰𝗲𝘀 𝗮𝘀 𝘀𝗶𝗺𝗽𝗹𝗲 𝗰𝗼𝗻𝗻𝗲𝗰𝘁𝗶𝗼𝗻𝘀. 𝗕𝘂𝘁 𝗶𝗻 𝗿𝗲𝗮𝗹𝗶𝘁𝘆, 𝗲𝘃𝗲𝗿𝘆 𝘁𝗿𝗮𝗰𝗲 𝗰𝗮𝗿𝗿𝗶𝗲𝘀 𝘀𝗶𝗴𝗻𝗮𝗹𝘀 𝘁𝗵𝗮𝘁 𝗯𝗲𝗵𝗮𝘃𝗲 𝗹𝗶𝗸𝗲 𝘁𝗿𝗮𝘃𝗲𝗹𝗲𝗿𝘀 𝗼𝗻 𝗮 𝗵𝗶𝗴𝗵𝘄𝗮𝘆. This is where Signal Integrity (SI) comes in. Poorly designed traces can cause: -) 𝗥𝗲𝗳𝗹𝗲𝗰𝘁𝗶𝗼𝗻𝘀 – 𝗹𝗶𝗸𝗲 𝗲𝗰𝗵𝗼𝗲𝘀 𝗼𝗻 𝘁𝗵𝗲 𝗹𝗶𝗻𝗲, 𝗱𝗶𝘀𝘁𝗼𝗿𝘁𝗶𝗻𝗴 𝘆𝗼𝘂𝗿 𝘀𝗶𝗴𝗻𝗮𝗹𝘀. -)) 𝗖𝗿𝗼𝘀𝘀𝘁𝗮𝗹𝗸 – 𝘄𝗵𝗲𝗻 𝘀𝗶𝗴𝗻𝗮𝗹𝘀 𝗶𝗻 𝗼𝗻𝗲 𝘁𝗿𝗮𝗰𝗲 “𝗹𝗲𝗮𝗸” 𝗶𝗻𝘁𝗼 𝗮𝗻𝗼𝘁𝗵𝗲𝗿. -) 𝗜𝗺𝗽𝗲𝗱𝗮𝗻𝗰𝗲 𝗺𝗶𝘀𝗺𝗮𝘁𝗰𝗵𝗲𝘀 – 𝘀𝗹𝗼𝘄𝗶𝗻𝗴 𝗱𝗼𝘄𝗻 𝗼𝗿 𝗱𝗶𝘀𝘁𝗼𝗿𝘁𝗶𝗻𝗴 𝗵𝗶𝗴𝗵-𝘀𝗽𝗲𝗲𝗱 𝗱𝗮𝘁𝗮. Good PCB design isn’t just about connecting components; it’s about ensuring those signals arrive cleanly, quickly, and reliably. 𝗛𝗲𝗿𝗲 𝗮𝗿𝗲 𝟰 𝘀𝗶𝗺𝗽𝗹𝗲 𝗴𝘂𝗶𝗱𝗲𝘀 𝘁𝗼 𝗶𝗺𝗽𝗿𝗼𝘃𝗲 𝗦𝗶𝗴𝗻𝗮𝗹 𝗜𝗻𝘁𝗲𝗴𝗿𝗶𝘁𝘆: 1. Control trace impedance – Match the trace impedance to the source/load to reduce reflections. 2. Keep traces short & direct – Long traces act like antennas, increasing noise and delay. 3. Use proper spacing – Separate high-speed or sensitive signals to reduce crosstalk. 4. Solid ground planes – Always provide a clean return path to stabilize signals and minimize noise. 𝗛𝗼𝘄 𝘄𝗮𝘀 𝘆𝗼𝘂𝗿 𝗲𝘅𝗽𝗲𝗿𝗶𝗲𝗻𝗰𝗲 𝗱𝗲𝘀𝗶𝗴𝗻𝗶𝗻𝗴 𝘆𝗼𝘂𝗿 𝗳𝗶𝗿𝘀𝘁 𝗣𝗖𝗕 ? Open to Collaboration. #PCBDesign #SignalIntegrity #ElectronicsDesign #Hardware PCB Mentor

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2-layer display board with GD32F470ZKT6 microcontroller (I) Signal Precisely calculate trace width, spacing, and other parameters to ensure signal impedance matching and reduce signal reflections, crosstalk, and other issues. Fully utilize the space on both sides of the 2-layer board, using one layer primarily as a ground plane and the other layer to rationally plan power and signal traces. (II) Layout Place the microcontroller in the center of the PCB to facilitate signal connections with surrounding modules. Layout the display module, communication module, power module, and other components around the microcontroller to keep signal paths as short as possible, minimizing signal transmission loss and interference. Keep the microcontroller at an appropriate distance from other components that generate relatively little heat to avoid heat concentration. Ensure adequate heat dissipation paths on the PCB, such as by widening the power supply lines. (III) Wiring The display data transmission lines between the microcontroller and the display module should avoid being crossed or interfered with by other low-speed signal traces. Keep traces short and straight to reduce signal transmission delay and electromagnetic radiation. For traces that must run long distances, we use methods such as serpentine routing to ensure equal lengths and timing consistency for differential signal pairs. Rationally plan via placement to avoid signal interference caused by concentrated vias. (I) Electromagnetic Compatibility (EMC) We implemented multiple EMC measures during PCB design. We rationally separated the digital ground and analog ground (if analog is present) and connected them at a single point using appropriate methods to avoid ground loop interference. We shielded or grounded high-frequency signals to reduce electromagnetic radiation. Furthermore, we placed appropriate filter capacitors at the edges of the PCB to filter out external interference signals. (II) Reliability Design Select high-quality components. Consider soldering operability during PCB design. The component pin spacing and packaging should be suitable for production soldering processes to reduce solder joint defects such as cold and false solder joints. Overcurrent and overvoltage protection devices, such as fuses and TVS diodes, are installed at key PCB interfaces (such as power input and communication interfaces) to prevent damage to the PCB due to external abnormalities.

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