Lars Reger

20 years of sensing the future Bosch Sensortec GmbH 🚀What began as a start-up has grown into a global company shipping over 1 billion intelligent #sensors each year. 🌍✨Over the years technologies, markets, and customer needs have evolved - and so has our business and product portfolio. Mobile Revolution & Smartphones: As smartphones began to change the world, this also marked the starting point of Bosch Sensortec. With deep technical expertise, experimental spirit and perseverance, we developed our first pressure sensor in 2005. Wearables & Health-Tech: Over the years, our sensors have become key components in smartwatches and fitness trackers, making health management accessible to everyone. As a result, we expanded our portfolio to include gyroscopes, IMUs, and absolute orientation sensors. Smart Home & IoT: As homes grew increasingly smart and connected, with thermostats, security cameras, robotic vacuums and more, we responded by adding environmental sensors like humidity and gas sensors to our portfolio. True Wireless Audio: With the rapid rise of wireless in-ear headphones, these devices required ultra-compact #SensingSolutions. Our sensors are now only slightly larger than a grain of sand, and we have expanded our expertise in micro acoustics. AI and Smart Algorithms: As devices become smarter and more connected, we deliver intelligent sensing systems combining #MEMS, embedded software, and Edge AI. Our sensors process data on-device, ensuring privacy, longer battery life, and features such as gesture control or indoor navigation. Behind these innovations is deep engineering expertise and a team of experts from over 50 nationalities across 17 locations, united to improve lives with cutting-edge sensor technology. I’m excited to see which innovations the future will bring. ✨Learn more: https://lnkd.in/eaKmJ-DZ

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Ever wonder what solar panels could do if they had brains? That’s basically what HTEC and Infineon Technologies pulled off. Their AI-powered system, running on Infineon’s PSOC™ Edge platform, uses real-time voltage, current, and temperature data to tweak power output on the fly—no fancy irradiance sensors needed. ⚡ 23× faster response 🔋 42× less energy used 🔧 Built-in predictive maintenance Smarter energy. Less waste. More uptime. This is the kind of tech that moves us forward. Curious how it works? 🔗 Check out the whitepaper: https://lnkd.in/gKqhM_F4

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UBM (Under Bump Metallization) Purpose: UBM is a critical layer in advanced semiconductor packaging, enabling reliable electrical and mechanical connections between the chip and solder bumps or copper pillars. Functions: Provides electrical interconnection, wetting for solder, diffusion barrier, and mechanical support. Prevents failures like delamination, solder voids, and electromigration. Applications: Used in Flip-Chip, Wafer-Level Packaging (WLP), Fan-Out WLP, 2.5D/3D IC stacking, and high-end 3D packaging (e.g., HBM, CoWoS). Materials: Multi-layer stacks: adhesion (Ti, TiW, Ta), seed/conductor (Cu), barrier (TiN, Ta, Ni), wetting (Au, Ag), and solder (Sn, SnAgCu). Etching: Selective etchants are used for each metal layer (e.g., HF+H₂O₂ for Ti, H₃PO₄+H₂O₂ for Cu, KI/I₂ for Au). Process control is crucial to avoid over-etching and ensure pad accuracy. Trends: Moving toward finer pitches (<50 μm), eco-friendly chemistries, cost reduction (less Au), and dry/plasma etching for better precision. Conclusion: UBM is foundational for next-gen semiconductor reliability, yield, and performance, especially as packaging becomes more complex and dense.

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Is There Still A Future For Hard Disk Drives? The cost of HDDs and SSDs will continue to fall, while capacity will continue to increase in both. The capacity for solid state drives (#SSDs) keeps going up while the price per terabyte keeps falling, sometimes raising questions about the future for hard disk drives (#HDDs). Will the cost of #SSDs per TB eventually become so low that they will totally displace HDDs? Barry Pangrle decided to ask a couple of experts in the field, Jim Handy from Objective Analysis and Thomas Coughlin of Coughlin Associates. He was looking for a comparison projection for HDDs and SSDs that would go about five years out into the future. Jim had performed such an exercise back in 2017, WDC: No SSD/HDD Crossover,but I needed something more recent. Jim had his SSD forecast data, shown in red in Figure 1 and Tom provided the HDD data shown in blue. The slope is steeper for the #SSD data, but it does not look like we’ll see a crossover in the next 5 years. The green $4.75/TB point was placed there by Barry to show readers where that falls on the plot and to use again later in another chart.... A very big thank you to Barry Pangrle , Jim Handy , Thomas Coughlin and Semiconductor Engineering for this very interesting full comparison/article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eKTxfR7P #semiconductorindustry #semiconductor #technology #tech #chip #chips #it #datacenter #technology #memory #storage #computer #ssd #hdd

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🔍 Silicon vs. Germanium Wafers: Shaping Semiconductor Tech in 2025 🚀 As we step into the weekend, one of the core questions in semiconductor innovation remains: what wafer material best drives performance and efficiency? While #silicon dominates as the industry’s workhorse, #germanium is carving out a role in specialized, high-performance applications. At ATPION we believe that understanding material trade-offs is key to unlocking the future of chips—whether for #AI, #telecom, #quantum, or #photonics. ⸻ ⚡ Key Differences: Silicon vs. Germanium 1️⃣ Electrical Properties • Silicon: Wide bandgap (1.12 eV), stable up to 150°C → ideal for mainstream CPUs, GPUs, and memory. • Germanium: Narrow bandgap (0.66 eV), ~2.5x higher electron mobility → perfect for high-frequency and optoelectronic devices. 2️⃣ Manufacturing & Cost • Silicon: Mature ecosystem, abundant, scalable → 300mm wafers cost ~$1,500–$2,000. • Germanium: Scarce, purification-intensive → 200mm wafers can cost $5,000–$10,000. 3️⃣ Thermal & Mechanical Traits • Silicon: Strong, large-scale wafers, lower conductivity (149 W/m·K). • Germanium: Softer, higher expansion, excels in cryogenic and quantum environments. 4️⃣ Applications • Silicon: 90% of global chips (Intel Corporation CPUs, TSMC 2nm, Micron Technology memory). • Germanium: Infrared sensors, high-speed transistors, photonics (5G lasers, SiGe alloys). ⸻ 🌍 2025 Outlook • Silicon remains king for AI, memory, and general-purpose chips, with USMCA and CHIPS Act reshaping supply chains. • Germanium gains momentum in niche applications like quantum and optoelectronics, with SiGe alloys driving photonic integration. ⸻ 💡 At ATPION, we are committed to enabling the industry’s evolution by fostering synergies with research centers and partners. Our role is to help bridge the gap between scalable silicon technologies and specialized materials like germanium that push performance boundaries. The future of semiconductors isn’t about choosing one material—it’s about orchestrating the right material for the right application. 👉 Which do you think will power the next breakthrough: cost-effective silicon or specialized germanium? Let’s connect and discuss. #ATPION #Semiconductors #Silicon #Startup #Germanium #AdvancedMaterials #Tech2025 #Osat #Mexico #USA #MadeinAmerica #supplychain #venturecapital

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Infineon Technologies has just raised the bar in #SiC innovation with the expansion of its #CoolSiC™ #MOSFETs 400 V G2 portfolio — now featuring: 🔹 Top-side cooled TOLT package 🔹 TO-247-3 & TO-247-4 packages 🔹 New TOLL devices rated at 440 V (continuous) and 455 V (transient) The new CoolSiC™ MOSFETs deliver: ✅ 50% lower conduction losses at 120 °C vs. Si tech (250–300 V class) ✅ 5x lower reverse recovery charge for superior switching ✅ 0.4% higher PSU efficiency in advanced topologies → translating into ~15% lower system losses These devices are tailor-made for the most power-hungry and compute-intensive applications of our time: ⚡ AI server power supplies ☀️ Solar inverters 🔋 UPS systems 🎶 Class D audio amplifiers ⚙️ Motor drives 🔒 Solid-state circuit breakers 🔗 Infineon’s CoolSiC™ G2 400 V is here to shape the future of energy-efficient, high-performance systems - https://lnkd.in/d_PNFFzX

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🤝 STMicroelectronics and Morse Micro will be hosting a live joint webinar on 17 September 2025 on how to unlock #IoT 2.0 with Wi-Fi #HaLow and #STM32. 💡 In this webinar, ST and Morse Micro will deep dive into the MM6108-EKH05-05US, a powerful Wi-Fi HaLow (IEEE 802.11ah) development board purpose-built for a wide range of IoT applications. Combining Morse Micro’s #MM6108 Wi-Fi HaLow chip with ST’s advanced components, including the #STM32U5 ultra-low-power MCU, BlueNRG-M2 Bluetooth® module, and the #IIS328DQ 3-axis accelerometer, this development board is ready to power smart cities, industrial monitoring, building automation, and more. Key topics/learnings: ----------------------- 🌟 What defines IoT 2.0 and, more importantly, why traditional wireless tech is no longer enough 🌟 Why Wi-Fi HaLow is the key to long-range, high-throughput IoT 2.0 applications 🌟 ST's role is supporting next gen IoT development and platforming 🌟 How to get started with the MM6108-EKH05-05US dev board for rapid prototyping (whether you’re designing a next-gen asset tracker or a connected environmental sensor) 🌟 Application examples across industrial, smart building, and urban IoT use cases (e.g. camera) Register today via https://lnkd.in/gDksyUxq

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