基于 MSP430 单片机的温度 PID 算法设计
目 录
1 引言.........................................................................................................................................1
1.1 单片机温度 PID 算法的发展现状 ......................................1
1.2 本课题的研究意义及前景 ............................................1
1.3 论文组织结构 ......................................................1
2 系统整体方案设计与关键技术分析.....................................................................................2
2.1 系统主要工作原理 ..................................................2
2.2 系统整体设计方案 ..................................................3
2.2.1 温度信号采集设计方案.................................................................................3
2.2.2 单片机程序设计方案.....................................................................................3
3 系统硬件电路的选型及设计.................................................................................................5
3.1 单片机的选型 ......................................................5
3.2 开关电源模块设计 ..................................................6
3.3 前向模拟通道设计 ..................................................7
3.3.1 前置放大器.....................................................................................................8
3.3.2 采样保持器.....................................................................................................8
3.4 输出驱动模块设计 ..................................................8
4 系统软件设计.........................................................................................................................8
4.1 软件开发平台 ......................................................8
4.2 温度控制程序设计 .................................................10
4.2.1 主程序...........................................................................................................10
4.2.2 PID 算法程序................................................................................................11
4.2.3 ADC 模数转换程序........................................................................................13
4.2.4 定时器设置程序...........................................................................................13
4.2.5 异步通讯程序...............................................................................................14
4.2.6 温度拟合程序...............................................................................................15
5 系统调试及结果分析...........................................................................................................16
5 .1 系统整体的调试和结果 ............................................16
5.1.1 MODBUS-ASCII 的调试..................................................................................16
5.1.2 上位机监控画面...........................................................................................17
5.2 结果分析...........................................................................................................................18
结束语.......................................................................................................................................19
