[
Renesas Flash Programmer V3.11
F
lash memory programming software
User’s Manual
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
Rev. 1.00 Oct 2022
www.renesas.com
© 2022 Renesas Electronics Corporation. All rights reserved.
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(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.5.0-1 October 2020)
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General Precautions in the Handling of Microprocessing Unit and Microcontroller
Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products
covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1. Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not be
touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.
2. Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of
register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset
pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in
a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the level
at which resetting is specified.
3. Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements.
Follow the guideline for input signal during power-off state as described in your product documentation.
4. Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of
the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal
become possible.
5. Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal produced
with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.
6. Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between V
IL
(Max.)
and V
IH
(Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the input level
is fixed, and also in the transition period when the input level passes through the area between V
IL
(Max.) and V
IH
(Min.).
7. Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these
addresses as the correct operation of the LSI is not guaranteed.
8. Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms of
internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system-
evaluation test for the given product.
How to Use This Manual
1. Purposes and Target Readers
The purpose of this manual is to give users an understanding of the basic specifications and correct use of the
Renesas Flash Programmer. This manual is intended for users who are using the flash programmer in
designing and developing a system that employs a Renesas Electronics microcontroller equipped with on-chip
flash memory.
It is assumed that the readers of this manual have a basic knowledge of microcontrollers, Windows, and
Linux, and some knowledge of electrical and logic circuits.
Use this software after sufficiently confirming the manual of the microcontroller in use.
2. Conventions
• Note: Footnote for item marked with “Note” in the text.
• Caution: Information requiring particular attention
• Remark: Supplementary information
• Numeral representations: Binary ... xxxx or xxxxB
Decimal ... xxxx
Hexadecimal ... 0xXXXX or xxxxH
• “ ”: Any character or item on the screen that can be selected or input
• : Name of a button
• [ ]: Name of a command, dialog box, tabbed page, option, or area on the screen
3. Terminology
The meanings of the terms used in the Renesas Flash Programmer manual are as follows.
(1/2)
Term
Meaning
RFP
Abbreviation of “Renesas Flash Programmer”, software for programming flash
memory
E1/E20/E2/E2 Lite
Abbreviation of “the E1, E20, E2, or E2 emulator Lite”
J-Link
SEGGER-produced debug probe for MCUs
Tool used
General term for the tool used by the customer, whether an E1, E20, E2, E2 Lite, or
J-Link.
MCU Abbreviation of “microcontroller unit”
Target device
The Renesas Electronics MCU with on-chip flash memory which is in use by the user
Target system
User-designed board on which the target device is mounted
Input clock A clock from an oscillator or a resonator which is externally input to the target device
Project file
Project files hold the data required to write programs. In the RFP, a project file holds
the settings related to the programming environment, such as target device settings
and command option specifications. Project files have the filename extension *.rpj.
Parameter file
Parameter files include information required to program the flash memory of the
target device, and are created by acquiring information from the MCU. Parameter
files have the extension *.fcf.
ID code
Authentication code used in flash programming and in on-chip debugging. For
details, refer to the user’s manual of the target device.
Lock bit
One of the safety functions of the MCU. For details, refer to the user’s manual of the
target device.
HEX file Program file without flash option data
RPI file
RPI files are image files generated by the RFP that combine usable HEX files and
flash options data.
RPE file
An encrypted program file that has been generated by the encryption utility program
Program file
“Program file” refers to a file that contains a program to be written to the MCU. The
RFP supports the following program file formats.
a. HEX files in Intel HEX format
b. HCUHEX files in Intel HEX format
c. HEX files in Motorola S format
d. HCUHEX files in Motorola S format
e. RPI files
Refer to section 1.5.1, RPI File.
The only supported character code is ASCII (one byte). Unicode (two bytes) is not
supported.
f. RPE files
Refer to section 1.5.2, RPE File.
COMx COMx is a serial interface port of the host PC.
When writing data to the target system by using a serial interface of the host PC,
select COMx as the tool to be used. Any value from 1 to 256 can be specified for x.
