December 2014
We, Samsung, declare that our component Chip Resistor is produced
in accordance with EU RoHS directive.
1.RoHS Compliance and restriction of Br
The following restricted materials are not used in packaging materials as well as products in compliance with the law and restriction.
- Cd, Pb, Hg, Cr6+, As, Br and the compounds, PCB, asbestos
- Bromic materials : PBBs, PBBOs, PBDO, PBDE, PBB
2.No use of materials breaking Ozone layer
The following ODS materials are not used in our fabrication process.
- ODS material : Freon, Haron, 1-1-1 TCE, CCl4, HCFC
If you want more detailed Information,Please Visit Samsung Electro-mechanics Website
[http://www.sem.samsung.com, http://www.semlcr.com]
CONTENTS
Operation Notes
Example of land Pattern Design
Recommended Soldering Conditions
General Structure
General
Low ohms(RUT Series)
Ultra Low ohms(RU Series)
Ultra Low Ohms(RUK Series)
Ultra Low Ohms(RJ Series)
Arrays(Convex Type)
Arrays(Concave Type)
Arrays(Flat Type)
Anti-Sulfur Resistors
Anti-Sulfur Resistor Arrays(Convex Type)
Anti-Sulfur Resistor Arrays(Concave Type)
Anti-Sulfur Resistor Arrays (Flat Type)
Automotive Anti-sulfur
Automotive Anti-sulfur Arrays (Convex Type)
Attenuator
Characteristics Performance
Packaging
Standard Resistance Value
4
5
6
7
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
Low ohms
(RUT Series)
Ultra Low ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RJ Series)
Arrays
(Convex Type)
Arrays
(Concave Type)
Arrays
(FlatType)
Anti-Sulfur
Resistors
Anti-Sulfur Resistor
Arrays(Convex Type)
Anti-Sulfur Resistor
Arrays(Concave Type)
Anti-Sulfur Resistor
Arrays (Flat Type)
Automotive
Anti-sulfur
Automotive Anti-sulfur
Arrays (Convex Type)
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value
To maintain proper quality of chip components, the following
precautions are required for storage environment, method and
period.
ҟStorage Environment
- Make sure that the ambient temperature is within 5℃ ~40℃
and the ambient humidity is within 20~70%RH.
- Chip components may be deformed, if the temperature of
packaged components exceeds 40℃ .
- Do not store where the soldering properties can be
deteriorated by harmful gas such as sulphurous gas,
chlorine gas, etc.
- Bulk packed chip components should be used as soon as
the seal is opened, thus preventing the solderability from
deteriorating.
- The remaining unused chips should be put in the original
bag and sealed again or store in a desiccator containing a
desiccating agent.
ҟStorage Time Period
Stored chip components should be used within 6 months
after receiving the components. If 6 months or more have
elapsed, please check the solderability before actually using.
ҟChip resistors are designed for general electronic devices
such as home appliances, computer, mobile communications,
digital circuit, etc. If you require our products with high
reliability-performing at more than 125℃ or below -55℃ - for
medical equipments, aircrafts, high speed machines, military
usage, and items that can affect human life or if you need to
use in specific conditions (corrosive gas atmosphere like H
2S
etc.), please contact us beforehand.
ҟNormal operation temperature ranges (℃ ): -55℃ ~+155℃
ҟOthers (small sizes and flat type arrays) : -55℃ ~+125℃
ҟAlthough resistor body is coated, sharp excessive impact
should be avoided to prevent damages and adverse effects
on characteristics (resistor value, open circuited, T.C.R.).
Applications
Please give more attention not to press the chip owing to the
nozzle's improper height when it is mounted on PCB.
(Excessive pressure may cause exterior damage, change in
resistance, circuit open, etc.)
Mounting
Storage
ҟThese products are designed and produced for applying
to the ordinary electronic equipments.
(AV equipment, OA equipment,Telecommunication
equipment, etc)
ҟConsult with our sales department before applying
in the devices that require extremely high
reliability such as medical equipments, transport
equipments, aircrafts/spacecrafts, nuclear power
controllers, fuel controllers, car equipments including
car accessories and other safety devices.
ҟFollowing special environments, and such
environmental conditions may affect the performance
of the product. Please verify the performance
and reliability thoroughly prior to use.
a) Using in various type of Liquid including water,
oil, organic solvent and other chemicals.
b) Using in the places where the products are exposed
to direct sunlight, sea wind, corrosive
gases (including Cl
2, H2S, NH3, SO2, NO2),
static electricity, electromagnetic waves and dusty air.
c) Using close to heat generating components or
other flammable items.
d) Using in the places that is sealed or coated
with resins or other coating materials after
soldering.
e) Using in places subject to dew condensation.
ҟThese products are not radiation resistant.
ҟThe company is not responsible for any problems
resulting from using of the products under the
conditions not recommended herein.
ҟThe company should notify any safety issues of the
products to the customer. And the safety of the
products should be monitored by the customer
periodically.
Safety precautions
After Soldering Cleaning, soldering flux & Ionic cleaning
liquid should be avoided on product.
If any possibility on product, please take a test before usage.
Cleaning
ҟManual work
Whenever separating chip resistor from PCB, do not re-use
the chip resistor for circuit safety.
Electrical specification of chip resistors can be changed
by soldering iron after separation.
Re-use of separated chip resistor should be prohibited.
ҟDo not use more than rated voltage.
(Please check the contents of each product)
Others
Chip resistor installation on PCB is a similar phenomenon on
to a chocolate chip on top of a cake.
PCB has enough flexibility on outer force but Chip resistor
can be defected without any bending.
(By chip resistor use of Ceramic, solder, metal)
Therefore, when separating a Chip resistor from a PCB,
beware of any crack on the chip.
Caution for Chip Resistor
Seperation from PCB.
Operation Notes
4
5
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
Low ohms
(RUT Series)
Ultra Low ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RJ Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Anti-Sulfur
Resistors
Anti-Sulfur Resistor
Arrays(Convex Type)
Anti-Sulfur Resistor
Arrays(Concave Type)
Anti-Sulfur Resistor
Arrays (Flat Type)
Automotive
Anti-sulfur
Automotive Anti-sulfur
Arrays (Convex Type)
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value
When designing P.C.B, the shape and size of the solder lands must allow a proper amount of solder to form under the resistor.
The amount of solder formed at the end terminations has direct effect on the possibility of chip crack.
The more the amount of solder and stress, the more the possibilities of chip crack.
Type A B 2A+B C
*0816
1220
1632
2037
*3264
0.5
0.7
1.1
1.4
2.0
0.3
0.4
0.6
1.2
1.6
1.3
1.8
2.8
4.0
5.6
1.6
2.0
3.3
3.8
6.5
(UNIT: mm)
Type A B 2A+B C
0402
0603
1005
1608
2012
3216
3225
5025
6432
0.17
0.37
0.6
0.8
0.9
1.3
1.3
1.4
1.4
0.20
0.28
0.5
0.8
1.4
1.8
1.8
3.3
4.6
0.54
1.02
1.7
2.4
3.2
4.4
4.4
6.1
7.4
0.18
0.29
0.5
0.8
1.2
1.5
2.4
2.4
3.0
Type A B C D E P1 P2
062P
064P
10AT
102P
104P
164P
0.20
0.20
0.4
0.4
0.5
0.7
0.20
0.20
0.4
0.4
0.3
0.5
0.30
0.20
0.25
0.25
0.2
0.3
0.30
0.30
0.5
0.5
0.5
0.9
0.30
0.30
0.5
0.5
0.5
0.8
0.50
0.40
0.65
0.65
0.55
0.9
-
0.40
-
0.5
0.8
A
B
A
C
: Land Pattern
: Chip Resistor
: Land Pattern
: Chip Resistor
A
P
2 P1 P
B C
D
E
ҟ
Convex type
ҟReflow Soldering
(RJ, RW)
ҟReflow Soldering
(RC, RCA, RCM, RUT)
Type A B 2A+B C
1005
1608
2012
3216
3225
5025
6432
0.8
0.8
0.9
1.7
1.7
2.15
2.3
0.5
0.5
0.8
1.2
1.2
1.8
3.0
2.1
2.1
2.6
4.6
4.6
6.1
7.6
0.5
0.8
1.2
1.4
2.4
2.6
3.3
ҟReflow Soldering
(RU, RUK)
ҟ
This is the recommended land pattern for designing PCB.
This pattern does not guarantee any characteristic of other product.
A B C
D
E
ҟ
Concave type
Example of Land Pattern Design
For Chip Type
For Array Type
Type A B C D E P
102P
104P
0.3
0.3
0.3
0.3
0.2
0.2
0.5
0.5
0.4
0.4
0.5
0.5
(UNIT: mm)
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
Example of Land
Pattern Design
- 1
- 2
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