S29GL512PDF_29GL512几个数据资源-CSDN下载

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S29GL512 PDF所介绍的内容涉及到NAND Flash存储器技术的一个产品系列，该系列包括了容量分别为128、256、512和1024 Mbit的多种型号，具体型号包括S29GL128、S29GL256、S29GL512和S29GL01GS。这些设备属于GL-SMirrorBit® Eclipse™ Flash非易失性存储器家族。知识点一：NAND Flash存储器 NAND Flash是一种非易失性存储技术，广泛应用于USB闪存驱动器、固态硬盘（SSD）、数码相机存储卡等。其特点是高存储密度、快速读写速度，以及可以进行多通道数据传输。NAND Flash通常用于存储大量数据，且由于其快速擦写能力，也非常适合进行频繁的数据更新操作。知识点二：GL-SMirrorBit® Eclipse™ Flash GL-SMirrorBit® Eclipse™ Flash是Spansion公司推出的一种高密度NAND Flash存储器系列。其中，“MirrorBit”技术是指在单个存储单元中存储两个逻辑位的技术，这一技术大幅提高了存储密度。Eclipse™则是该系列产品的代号。知识点三：存储容量与型号文章中提到的S29GL128、S29GL256、S29GL512和S29GL01GS，分别代表了不同的存储容量：S29GL128是128 Mbit，S29GL256是256 Mbit，S29GL512是512 Mbit，S29GL01GS是1024 Mbit（1 Gbit），也就是128Mbyte、256Mbyte、512Mbyte和1Gbit。存储容量表示了存储设备可以存放数据的大小。知识点四：CMOS 3.0V内核和多功能I/O 这些NAND Flash产品采用CMOS 3.0V内核技术，并具有多功能I/O（输入/输出），这意味着它们可以在多种电压条件下运行，并且能与多种设备接口标准兼容，从而实现了良好的灵活性和互操作性。知识点五：数据表和产品生命周期阶段 Spansion公司在其数据表中提供了三种不同的产品生命周期阶段的标注：预发布信息（Advance Information）、初步信息（Preliminary）和全生产（Full Production）。预发布信息表示产品正在开发中，但尚未承诺进入生产阶段，信息可能变更，开发可能会停止。初步信息表示产品开发已足够成熟，承诺进入生产阶段，包括产品资格认证、初始生产和实现全生产的后续制造过程阶段。全生产阶段则意味着产品已完全投入市场。为了确保设计的准确性，读者在设计最终方案之前被鼓励确认获取了最新的信息。知识点六：电源电压和数据存储这些NAND Flash存储器的电源电压为3.0伏特核心电压，适用于不同的应用场景和设备，如固态硬盘、嵌入式系统等。它们的数据存储能力分别是128Mbyte、256Mbyte、512Mbyte和1Gbit，支持在多种电子设备中进行高效的数据存储与快速访问。知识点七：数据表的版本与更新在所描述的文档中，提到了特定的文档版本：文档编号S29GL_128S_01GS_00，修订版本为08，发行日期为2013年10月9日。版本的更新通常包含对产品的技术规格、封装信息、电气特性等的修正或更新，因此用户在使用前应确保获取到最新的数据表版本。以上内容详细地概述了S29GL512 PDF文档中所涵盖的NAND Flash存储器的关键知识点，对设计和应用这类存储器的工程师和技术人员有着重要的参考价值。

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Publication Number S29GL_128S_01GS_00 Revision 08 Issue Date October 9, 2013

GL-S MirrorBit

Eclipse

™

Flash

Non-Volatile Memory Family

GL-S MirrorBit

Family Cov er Sheet

S29GL01GS 1 Gbit (128 Mbyte)

S29GL512S 512 Mbit (64 Mbyte)

S29GL256S 256 Mbit (32 Mbyte)

S29GL128S 128 Mbit (16 Mbyte)

CMOS 3.0 Volt Core with Versatile I/O

Data Sheet

Notice to Readers: This document states the current technical specifications regarding the Spansion

product(s) described herein. Each product described herein may be designated as Advance Information,

Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.

2 GL-S MirrorBit

Family S29GL_128S_01GS_00_08 October 9, 2013

Data Sheet

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of

product information or intended specifications throughout the product life cycle, including development,

qualification, initial production, and full production. In all cases, however, readers are encouraged to verify

that they have the latest information before finalizing their design. The following descriptions of Spansion data

sheet designations are presented here to highlight their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion Inc. is developing one or more specific

products, but has not committed any design to production. Information presented in a document with this

designation is likely to change, and in some cases, development on the product may discontinue. Spansion

Inc. therefore places the following conditions upon Advance Information content:

“This document contains information on one or more products under development at Spansion Inc.

The information is intended to help you evaluate this product. Do not design in this product without

contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a commitment

to production has taken place. This designation covers several aspects of the product life cycle, including

product qualification, initial production, and the subsequent phases in the manufacturing process that occur

before full production is achieved. Changes to the technical specifications presented in a Preliminary

document should be expected while keeping these aspects of production under consideration. Spansion

places the following conditions upon Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. The Preliminary status of this document indicates that product qualification has been

completed, and that initial production has begun. Due to the phases of the manufacturing process that

require maintaining efficiency and quality, this document may be revised by subsequent versions or

modifications due to changes in technical specifications.”

Combination

Some data sheets contain a combination of products with different designations (Advance Information,

Preliminary, or Full Production). This type of document distinguishes these products and their designations

wherever necessary, typically on the first page, the ordering information page, and pages with the DC

Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first

page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal changes

are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include

those affecting the number of ordering part numbers available, such as the addition or deletion of a speed

option, temperature range, package type, or V

range. Changes may also include those needed to clarify a

description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following

conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s)

described herein. Spansion Inc. deems the products to have been in sufficient production volume such

that subsequent versions of this document are not expected to change. However, typographical or

specification corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local sales office.

This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient pro-

duction volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid com-

binations offered may occur.

Publication Number S29GL_128S_01GS_00 Revision 08 Issue Date October 9, 2013

General Description

The Spansion

S29GL01G/512/256/128S are MirrorBit Eclipse flash products fabricated on 65 nm process technology. These

devices offer a fast page access time as fast as 15 ns with a corresponding random access time as fast as 90 ns. They feature

a Write Buffer that allows a maximum of 256 words/512 bytes to be programmed in one operation, resulting in faster effective

programming time than standard programming algorithms. This makes these devices ideal for today’s embedded applications

that require higher density, better performance and lower power consumption.

Distinctive Characteristics

 65 nm MirrorBit Eclipse Technology

 Single supply (V

) for read / program / erase (2.7V to 3.6V)

 Versatile I/O Feature

– Wide I/O voltage range (V

): 1.65V to V

 x16 data bus

 Asynchronous 32-byte Page read

 512-byte Programming Buffer

– Programming in Page multiples, up to a maximum of 512 bytes

 Single word and multiple program on same word options

 Sector Erase

– Uniform 128-kbyte sectors

 Suspend and Resume commands for Program and Erase

operations

 Status Register, Data Polling, and Ready/Busy pin methods

to determine device status

 Advanced Sector Protection (ASP)

– Volatile and non-volatile protection methods for each sector

 Separate 1024-byte One Time Program (OTP) array with two

lockable regions

 Common Flash Interface (CFI) parameter table

 Temperature Range

– Industrial (-40°C to +85°C)

– In-Cabin (-40°C to +105°C)

 100,000 erase cycles for any sector typical

 20-year data retention typical

 Packaging Options

– 56-pin TSOP

– 64-ball LAA Fortified BGA, 13 mm x 11 mm

– 64-ball LAE Fortified BGA, 9 mm x 9 mm

– 56-ball VBU Fortified BGA, 9 mm x 7 mm

GL-S MirrorBit

Eclipse

™

Flash

Non-Volatile Memory Family

S29GL01GS 1 Gbit (128 Mbyte)

S29GL512S 512 Mbit (64 Mbyte)

S29GL256S 256 Mbit (32 Mbyte)

S29GL128S 128 Mbit (16 Mbyte)

CMOS 3.0 Volt Core with Versatile I/O

Data Sheet

October 9, 2013 S29GL_128S_01GS_00_08 GL-S MirrorBit

Family 5

Data Sheet

Table of Contents

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Distinctive Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Performance Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

1. Product Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Software Interface

2. Address Space Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2.1 Flash Memory Array. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2.2 Device ID and CFI (ID-CFI) ASO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

2.3 Status Register ASO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

2.4 Data Polling Status ASO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

2.5 Secure Silicon Region ASO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

2.6 Sector Protection Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3. Data Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.1 Device Protection Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.2 Command Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.3 Secure Silicon Region (OTP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.4 Sector Protection Methods. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4. Read Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

4.1 Asynchronous Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

4.2 Page Mode Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5. Embedded Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.1 Embedded Algorithm Controller (EAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.2 Program and Erase Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

5.3 Command Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

5.4 Status Monitoring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

5.5 Error Types and Clearing Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

5.6 Embedded Algorithm Performance Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

6. Software Interface Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

6.1 Command Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

6.2 Device ID and Common Flash Interface (ID-CFI) ASO Map . . . . . . . . . . . . . . . . . . . . . . . . . 60

Hardware Interface

7. Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

7.1 Address and Data Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

7.2 Input/Output Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

7.3 Versatile I/O Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

7.4 Ready/Busy# (RY/BY#) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

7.5 Hardware Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

8. Signal Protocols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

8.1 Interface States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

8.2 Power-Off with Hardware Data Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

8.3 Power Conservation Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

8.4 Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

8.5 Write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

9. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

9.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

9.2 Latchup Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

9.3 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

9.4 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

9.5 Capacitance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

10. Timing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

10.1 Key to Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

10.2 AC Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

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