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ESD S20.20 2021 中文翻译版 ESD S20.20 2021 中文翻译版是 ANSI（American National Standards Institute，美国国家标准学会）发布的一份 Electrostatic Discharge（静电放电）控制程序标准。该标准涵盖了制造、加工、组装、安装、运输、包装、标签、服务、测试、检查或以其他方式处理电气或电子部件、组件、设备时，静电放电控制程序的必要要求。该标准的主要内容包括： 1. 静电放电控制程序的建立、实施和维护：该标准规定了静电放电控制程序的要求，以保护电气或电子部件、组件、设备免受静电放电的损害。 2. 静电放电敏感项目的处理：该标准涵盖了静电放电敏感项目的处理要求，包括电气或电子部件、组件、设备的制造、加工、组装、安装、运输、包装、标签、服务、测试、检查等。 3. 静电放电控制原则：该标准规定了静电放电控制原则，包括：所有导体在环境中的绑定或电气耦合，所有隔离导体的绑定或电气耦合，人员和设备的静电放电保护，静电放电敏感项目的标签和记录等。 4. 静电放电测试和验证：该标准规定了静电放电测试和验证的要求，包括人体模型（HBM）和充电设备模型（CDM）测试等。 5. 静电放电控制程序的实施和维护：该标准规定了静电放电控制程序的实施和维护要求，包括静电放电控制程序的评估、改进和记录等。该标准的应用范围很广，涵盖了电子制造、组装、测试、服务等多个领域，对于保护电气或电子部件、组件、设备免受静电放电的损害具有重要意义。知识点： 1. 静电放电控制程序的重要性：静电放电控制程序是保护电气或电子部件、组件、设备免受静电放电的损害的关键。 2. 静电放电敏感项目的处理：静电放电敏感项目的处理是保护电气或电子部件、组件、设备免受静电放电的损害的重要步骤。 3. 静电放电控制原则：静电放电控制原则是静电放电控制程序的基础，包括所有导体在环境中的绑定或电气耦合，所有隔离导体的绑定或电气耦合，人员和设备的静电放电保护，静电放电敏感项目的标签和记录等。 4. 静电放电测试和验证：静电放电测试和验证是确保静电放电控制程序的有效性和可靠性的重要步骤。 5. 静电放电控制程序的实施和维护：静电放电控制程序的实施和维护是保护电气或电子部件、组件、设备免受静电放电的损害的长期任务。

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王世鸿翻译 13763182531

ANSI/ESD S20.20:2021 中文翻译版

FOREWORD 前言

This standard covers the requirements necessary to establish, implement, and maintain an electrostatic discharge (ESD) control program for

activities that manufacture, process, assemble, install, transport, package, label, service, test, inspect, or otherwise handle electrical or

electronic parts, assemblies, and equipment susceptible to damage by electrostatic discharges greater than or equal to 100 volts human body

model (HBM) and 200 volts charged device model (CDM). The CDM voltage level used in this document is based on managing process essential

insulators to mitigate field-induced voltages on devices that could lead to damage.本标准涵盖了建立、实施和维护静电放电(ESD)控制程序的必要要

求，这些控制程序用于制造、加工、组装、安装、运输、包装、标签、服务、测试、检查或以其他方式处理电气或电子部件、组件、以及易受大于或

等于 100 伏特的人体模型(HBM)和 200 伏特的充电设备模型(CDM)损坏的设备。本文档中使用的 CDM 电压级别是基于对工艺必要绝缘体的管理，以减

轻可能导致损坏的设备上的场感应电压。

This standard also defines the requirements for isolated conductors. The reference to machine model (MM) is retained in this standard for the

historical association to the MM robustness of devices to isolated conductors.本标准还规定了孤立导体的要求。本标准保留了机器模型(MM)的参

考资料，以说明设备对孤立导体的 MM 持续稳定性的历史关联。

HBM and CDM fully characterize the ESD robustness of devices. Therefore, MM testing is no longer required to qualify devices, and test data

may not be available.HBM 和 CDM 充分表征了器件的 ESD 稳定性。因此，MM 测试不再需要用设备验证，和测试数据可能不需要在使用。

This document covers the ESD control program requirements for establishing a program to handle ESD sensitive (ESDS) items based on

the historical experience of both military and commercial organizations. References include EOS/ESD Association, U.S. Military, and ANSI

approved standards for material properties and test methods. The fundamental ESD control principles that form the basis of this

document are:

本标准根据军队和商业机构的历史经验，涵盖了建立 ESD 敏感(ESDS)项目处理程序的 ESD 控制程序要求。参考资料包括 EOS/ESD 协

会，美国军事，ANSI 批准的材料性能和测试方法标准。构成本文件基础的 ESD 基本控制原则如下:

All conductors in the environment, including personnel, shall be bonded or electrically connected and attached to a known ground

or contrived ground (as on shipboard or aircraft). This attachment creates an equipotential balance between all items and

personnel. Electrostatic protection can be maintained at a potential above a "zero" voltage ground potential if all items in the

system are at the same potential.

所有在管控环境里的导体，包括人员，必须直接连接或链接到厂房设计接地系统或非传统接地系统（如在船

上或太空船上），使上述物件和人员处于等电位状态。只要系统里所有物件处于等电位状态，即便对地电位水平不是零伏特，该静电防护系统依

然能达到应有效果。

Process essential insulators in the environment cannot lose their electrostatic charge by attachment to ground. Ionization systems

provide neutralization of charge on these process essential insulators (circuit board materials and some device packages are

examples of necessary insulators). Assessment of the ESD hazard created by electrostatic charge on the process essential insulators

in the workplace is required to ensure that appropriate actions are implemented, commensurate with the risk to ESDS items.

系统里

不可排除的非导体，即制程中必需用到的绝缘体（如线路板和芯片封装材料等），不能通过接地起到静电防护作用，此时需靠离子静电消除器中

和部分绝缘体的静电荷。因此，对区域内每个必用绝缘体进行风险评估是必须的，以便对 ESDS 物品有针对性的选择合理的静电防护措施。

C. Transportation of ESDS items necessitates enclosures in protective materials, although the type of material depends on the

situation and destination. While these materials are not discussed in the document, it is important to recognize the differences in

applications. For more clarification, see ANSI/ESD S541.

运送 ESDS 物品至 EPA（ESD 防护区）外时必须使用静电防护包装材料，但该包装材

料需依据应用情况和目的地而合理选择。在 EPA 内，抗静电和耗散性包装材料也许可提供足够的防护，但在 EPA 外，建议使用抗静电和静电屏蔽

包装材料。虽然本文没具体描述这些材料，但对它们在应用上的差异需有充分地识别。有关详细信息可参见 ANSI/ESD S541。

Any relative motion and physical separation of materials or flow of solids, liquids, or particle-laden gases can generate an electrostatic

charge. Common sources of electrostatic charge include personnel, items made from common polymeric materials, and processing

equipment. ESD damage can occur in several ways, including

:任何固体，液体或含颗粒的气体间的摩擦或者分离都会产生静电。比较常见的 ESD

事故源于操作人员，一般的高分子材料和生产加工设备。ESD 引起的破坏可由多种方式产生，包括：

A charged object (including a person) coming into contact with an ESDS item.

带电物体（如人体）接触 ESDS 物品。

A charged ESDS item making contact with ground or another conductive object at a different potential.

带电的 ESDS 物品与接地

系统或处于不同电位的导体接触。

3) An ESDS item making contact with ground or another conductive object while exposed to an electrostatic field.

对暴露于静电电

场中的 ESDS 物品接地。

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王世鸿翻译 13763182531

Examples of ESDS items include, but are not limited to, microcircuits, discrete semiconductors, thick and thin film resistors, hybrid

devices, printed circuit boards, and piezoelectric crystals. It is possible to determine device and item susceptibility by exposing the item

to simulated ESD events. The level of sensitivity, determined by testing using simulated ESD events, may not necessarily relate to the

level of sensitivity in a real-life situation. However, the sensitivity levels are used to establish a baseline of susceptibility data to compare

devices with equivalent part numbers from different manufacturers. Two different models are used for the characterization of electronic

items: HBM and CDM.

微电路、分立的半导体器件、厚膜和薄膜电阻、混合型装置、印刷线路板及压电晶体等，都属于 ESDS 物品。这些物品的 ESD

敏感度可通过一些模拟的静电放电模型来确定。虽说模拟测试并不一定能完全代表实际应用情况，但这些模拟测试得来的数据可用于对同类产品性能

的比较。用于定义电子元器件敏感度的两个放电模型是 HBM 和 CDM。

For more information on the requirements in this standard, there is a technical report, ESD TR20.20 – ESD Association Technical Report –

Handbook for the Development of an Electrostatic Discharge Control Program for the Protection of Electronic Parts, Assemblies, and

Equipment. Compliance with this standard can be demonstrated through third-party certification. The certification process is like any

quality management system certification such as ISO 9001. Information on the certification process can be obtained by contacting an

EOS/ESD Association, Inc. approved certification body. For a list of EOS/ESD Association, Inc. approved certification bodies, see

www.esda.org.

就如 ISO 9001 一样，本标准也能通过第三方的认证。相关的认证程序和信息可向 ESD 协会指定的认证单位咨询。有关 ESD 协会指定

的认证单位的名单，详见 ESD 协会官方网站 www.esda.org

This standard1 was originally designated ANSI/ESD S20.20-1999 and was approved on August 4, 1999. ANSI/ESD S20.20-2007 was a

revision of ANSI/ESD S20.20-1999 and was approved on February 11, 2007. ANSI/ESDS20.20-2014 is a revision of ANSI/ESD S20.20-2007

and was approved on March 25, 2016. ANSI/ESD S20.20-2021 is a revision of ANSI/ESDS20.20-2014 and was approved on October 28,

2021

.本标准(1)的首版为 ANSI/ESD S20.20-1999 并于 1999 年 8 月 4 日发布。ANSI/ESD S20.20-2007 是 ANSI/ESD S20.20-1999 的修订版本并于 2007

年 2 月 11 日发布。 ANSI/ESD S20.20-2014 是 ANSI/ESD S20.20-2007 的修订版本并于 2014 年 6 月 11 日发布，ANSI/ESD S20.20-2021 是 ANSI/ESD

S20.20-2021 的修订版本并于 2021 年 10 月 28 日获批。

王世鸿翻译 13763182531

TABLE OF CONTENTS 目录

1.0 PURPOSE 目的..................................................................................................................................................................................1

2.0 SCOPE 范围 .....................................................................................................................................................................................1

3.0 REFERENCED PUBLICATIONS 参考出版物........................................................................................................................................1

4.0 DEFINITIONS 定义.............................................................................................................................................................................2

5.0 PERSONNEL SAFETY 人员安全..........................................................................................................................................................2

6.0 ESD CONTROL PROGRAM 静电控制方案..........................................................................................................................................2

6.1 ESD CONTROL PROGRAM REQUIREMENTS 静电控制方案要求..............................................................................................2

6.2 ESD CONTROL PROGRAM MANAGER OR COORDINATOR 静电控制方案之经理或协调员 ...................................................3

6.3 TAILORING 修正.......................................................................................................................................................................3

7.0 ESD CONTROL PROGRAM ADMINISTRATIVE REQUIREMENTS 静电控制方案之行政要求............................................................. .3

7.1 ESD CONTROL PROGRAM PLAN 静电控制方案计划................................................................................................................3

7.2 TRAINING PLAN 培训方案........................................................................................................................................................3

7.3 PRODUCT QUALIFICATION PLAN 产品认证计划......................................................................................................................3

7.4 COMPLIANCE VERIFICATION PLAN.符合性验证计划.............................................................................................................4

8.0 ESD CONTROL PROGRAM PLAN TECHNICAL REQUIREMENTS 静电控制方案之技术要求................................................................4

8.1 GROUNDING/EQUIPOTENTIAL BONDING SYSTEMS 接地/等电位系统...................................................................................4

8.2 PERSONNEL GROUNDING 人员接地 ......................................................................................................................................5

8.3 ESD PROTECTED AREAS (EPAS)静电保护区..............................................................................................................................6

8.3.1 Insulators 绝缘体...........................................................................................................................................................6

8.3.2 Isolated Conductors 孤立导体 .....................................................................................................................................7

8.4 PACKAGING 包装 ...................................................................................................................................................................10

8.4.1 United States Department of Defense (DoD) Packaging Requirements 美国国防部(DoD)包装要求...........................10

8.5 MARKING 标记.................................................................................................................... ............................................ .......10

Annexes 附录

Annex A (Informative): Additional Process Considerations 额外关注过程...................................................................................11

Annex B (Informative): ESD Sensitivity Testing 静电敏感元器件测试 ......................................................................................... 12

Annex C (Informative): Tailoring 删减说明....................................................................................................................................14

Annex D (Informative): Related Documents 相关文件......................................................................................................... ........16

Annex E (Informative): Statement of Direction 声明指引 .................................................................................................. ........18

Annex F (Informative): Revision History for ANSI/ESD S20.20 ANSI/ESD S20.20 修订历史 .................................................... ...19

Tables 附表

Table 1: Grounding / Equipotential Bonding Requirements 接地及等电位连接要求 ................................................................. 5

Table 2: Personnel Grounding Requirement 人员接地之要求...................................................................................................... 5

Table 3: EPA ESD Control Items 静电防护区管控项目................................................................................................................... 8

Table 4: Packaging Requirements 包装材料要求......................................................................................................................... 10