没有合适的资源?快使用搜索试试~ 我知道了~
32-site microelectrode modified with Pt black for neural recordi...
0 下载量 14 浏览量
2021-02-09
18:35:01
上传
评论
收藏 839KB PDF 举报
温馨提示
Multi-electrode array is an important tool in the study of neural-network, cognition, remembrance, as well as brain-computer-interface, etc. Fork-like 32-site microelectrodes are developed with silicon. By use of integrated circuit technology, the length of the electrodes, the area of the recording sites, as well as the spaces between the sites are closely controlled. SiO2/SiNx/SiO2 composite dielectric membrane and Pt black are introduced to improve the characteristics of the electrodes. The wh
资源推荐
资源详情
资源评论
























.
RESEARCH PAPER
.
SCIENCE CHINA
Information Sciences
doi: 10.1007/s11432-013-4846-1
c
Science China Press and Springer-Verlag Berlin Heidelberg 2013 info.scichina.com www.springerlink.com
32-site microelectrode modified with Pt black
for neural recording fabricated with thin-film
silicon membrane
CHEN SanYuan
1
, PEI WeiHua
1 ∗
,ZHAOHui
1
,GUIQiang
1
, TANG RongYu
1
,
CHEN YuanFang
1
, FANG XiaoLei
2
,HONGBo
2
, GAO XiaoRong
2
& CHEN HongDa
1
1
State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors,
Chinese Academy of Sciences, Beijing 100083,China;
2
Institute of Neural Engineering, Department of Biomedical Engineering, Tsinghua University,
Beijing 100084,China
Received May 2, 2012; accepted August 9, 2012
Abstract Multi-electrode array is an important tool in the study of neural-network, cognition, remembrance,
as well as brain-computer-interface, etc. Fork-like 32-site microelectrodes are developed with silicon. By use
of integrated circuit technology, the length of the electrodes, the area of the recording sites, as well as the
spaces between the sites are closely controlled. SiO
2
/SiNx/SiO
2
composite dielectric membrane and Pt black
are introduced to improve the characteristics of the electrodes. The whole thickness of the thin-film probe
was 21 µm. By combining the modifying process with the micro-fabrication method, this kind of silicon based
microelectrode satisfies high-density recording and the performance characterization is evaluated by test in vitro
and in vivo.
Keywords microelectrode, brain-computer interface, thin-film Si, Pt black, neural recording
Citation Chen S Y, Pei W H, Zhao H, et al. 32-site microelectrode modified with Pt black for neural recording
fabricated with thin-film silicon membrane. Sci China Inf Sci, 2013, 56, doi: 10.1007/s11432-013-4846-1
1 Introduction
Characteristics of silicon-based neural probes such as the length of needles, the area of recording sites
and spacing between the sites can be precisely controlled by MEMS fabricating technology. In addition,
more than one recording site can be arranged on one shank. With these merits, silicon based neural
probes play a very important role in multi-site recording, especially high density recording. A lot of
silicon-based multi-site neural probes have been fabricated with different shapes, dimensions and sites
arrangement to satisfy different requirements correspondingly [1–5]. In order to achieve high-density
neural signal recording, the area of recording sites should be reduced to similar size of single neuron,
which is on the order of tens of micron [6]. However, along with the decreasing area and increasing
density of recording sites, the impedance characteristics and robustness of the electrode will deteriorate.
∗

2 ChenSY,et al. Sci China Inf Sci
Figure 1 Four layers structure of microelectrodes (down to top): substrate layer, lower dielectric layer, metal layer and
upper dielectric layer.
For example, complex wiring layout makes the electrodes vulnerable to leakage [7]. Thermal noise, which
is directly proportional to the impedance, will affect the recording sensitivity or even submerge neuronal
signal. Thus there is an optimization among high-density, sensitivity and robustness.
In this work, a 32-site fork-like neural probe is developed by deep ICP etching combing with SOI
substrate. Compared to boron doping process of defining thickness of Michigan microelectrode [8], SOI
substrate in our process can form an arbitrary thickness by defining device layer thickness. Besides,
both the device layer surface and side remain smooth without changing with the high depth-to-width
ratio of ICP etching, which will reduce damage to brain tissue. Avoiding boron diffusion process can
maintain silicon lattice structure and keep the robustness of silicon. A composite membrane composed
of SiO
2
/SiN
X
/SiO
2
is adopted as upper dielectric layer to improve the passivation of dielectric layer and
robustness of the probes. Pt black is modified on the 30 µm recording sites by electrodeposition to lower
the impedance. Many ways have been used to improve the adhesion between coatings and substrate
situation such as ultrasonication [9] and pulse current [10].
2 Materials and methods
2.1 Design
SOI wafer was used in the fabrication process due to its well-defined thickness of device layer, which
functioned as the substrate of microelectrode [11]. The device was composed by four layers: the substrate
layer which supported all the structures; the lower dielectric layer which insulated the conductive layer
from the substrate; the metal layer as the conductive layer and the upper dielectric layer as insulation
from outside, which can be seen in Figure 1. In order to penetrate into tissues, the microelectrode should
taper toward the tip properly. Four 6 mm-long shanks spacing 285 µm were designed. 8 sites lined up
on each shank and each site was 30 µm in diameter. The spacing between recording sites in one shank
was 200 µm. All the parameters were designed to suit the size and space of neurons.
2.2 Fabrication
A 4-inch double-side polished SOI silicon wafer was used in this study. The thickness of the de-
vice/box/substrate layer is 30/1.5/200 µm. the fabrication process of the microelectrodes was illustrated
in Figure 2 and explained as follows.
Before being applied, the electrode must be packaged to link the minor pad to a common connector.
The electrode was detached from the frame and stuck on a custom made PCB. Gold wire bonding was
used to connect the pads. Silica gel was applied to protect the bond area (Figure 3(b)).
剩余6页未读,继续阅读
资源评论


weixin_38642864
- 粉丝: 2
上传资源 快速赚钱
我的内容管理 展开
我的资源 快来上传第一个资源
我的收益
登录查看自己的收益我的积分 登录查看自己的积分
我的C币 登录后查看C币余额
我的收藏
我的下载
下载帮助


最新资源
- 基于MATLAB的数字通信系统仿真方案设计书.doc
- 大数据集群-hadoop的安全防护.docx
- 普通高中计算机信息安全实践教学研究.docx
- 计算机网络信息安全及对策.doc
- 简论信息化对社会经济的影响.docx
- 论大数据下企业财务会计向管理会计的转型.docx
- 中小型企业实施网络精准营销的方法研究-上下文推广.docx
- 虚拟化技术在计算机机房管理中的应用策略分析.docx
- 基于网络化的职业英语教学模式探索.docx
- 智能家居防盗报警系统设计方案-智建社区.docx
- PLC的花样喷泉控制系统设计方案PLC的花样喷泉控制.doc
- VB程序设计第四章-基本的控制结构.ppt
- SCLCD控制器控制TFT彩屏接口设计.ppt
- 单片机控制无刷直流电机驱动系统设计方案新.doc
- 实验室管理经验交流材料信息与通信工程科技专业资料.ppt
- 模糊层次分析法在计算机网络安全评价中的运用.doc
资源上传下载、课程学习等过程中有任何疑问或建议,欢迎提出宝贵意见哦~我们会及时处理!
点击此处反馈



安全验证
文档复制为VIP权益,开通VIP直接复制
