Jacob Levy

UBM (Under Bump Metallization) Purpose: UBM is a critical layer in advanced semiconductor packaging, enabling reliable electrical and mechanical connections between the chip and solder bumps or copper pillars. Functions: Provides electrical interconnection, wetting for solder, diffusion barrier, and mechanical support. Prevents failures like delamination, solder voids, and electromigration. Applications: Used in Flip-Chip, Wafer-Level Packaging (WLP), Fan-Out WLP, 2.5D/3D IC stacking, and high-end 3D packaging (e.g., HBM, CoWoS). Materials: Multi-layer stacks: adhesion (Ti, TiW, Ta), seed/conductor (Cu), barrier (TiN, Ta, Ni), wetting (Au, Ag), and solder (Sn, SnAgCu). Etching: Selective etchants are used for each metal layer (e.g., HF+H₂O₂ for Ti, H₃PO₄+H₂O₂ for Cu, KI/I₂ for Au). Process control is crucial to avoid over-etching and ensure pad accuracy. Trends: Moving toward finer pitches (<50 μm), eco-friendly chemistries, cost reduction (less Au), and dry/plasma etching for better precision. Conclusion: UBM is foundational for next-gen semiconductor reliability, yield, and performance, especially as packaging becomes more complex and dense.

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𝐍𝐕𝐈𝐃𝐈𝐀 𝐈𝐬 𝐆𝐞𝐭𝐭𝐢𝐧𝐠 𝐒𝐞𝐫𝐢𝐨𝐮𝐬 𝐀𝐛𝐨𝐮𝐭 𝐈𝐒𝐑𝐀𝐄𝐋 Source: By Claus Aasholm via Semiconductor Business Intelligence (https://lnkd.in/d2ZXMHjw) Today, it was NVIDIA's job openings by country. The green giants' focus on Israel is now becoming very tangible. In the last two months, the job openings in Israel have doubled, and it is now the second most important recruitment country for #Nvidia. While the sizable investment in #Israel is aimed at R&D, there will also be significant #investments in hardware. Hundreds of liquid-cooled #Blackwell Servers will be included. Over the last 4 quarters, Nvidia #CapEx has grown from $1.2B in the period before to $4.1B, more than all other #fabless #semiconductors combined. While this is still less than the large cloud companies, it is worth noting that the #Nvidia cost of a #Blackwell server is a quarter of the cost to its #customers. Also, it is obvious that Nvidia has not lost its #China ambitions. Job openings are a leading indicator that gives insights into the sentiment of companies. If you think that #Nvidia is resting on its laurels, think again. Over the last three months, #Nvidia has increased the number of job openings by 60% while AMD is virtually flat. Intel has decreased (surprise?) the number of job openings from #Nvidia's current level to 15% of what it was 3 months ago.

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📈 Tower Semiconductor Beats Q2 Expectations, Forecasts Strong Q3 Growth Tower Semiconductor (TSEM.TA), an Israeli contract chipmaker, has projected Q3 revenue of $395 million ±5%, exceeding Wall Street expectations of $392.5 million (LSEG). In Q2, Tower reported $372.1 million in revenue, a 6% YoY increase, slightly above the consensus estimate of $371.6 million. Growth is being driven by continued demand in the automotive and industrial sectors, along with rising adoption of its advanced chip technologies in optical fiber communications, especially for AI and data center infrastructure. CEO Russell Ellwanger noted strong momentum in RF infrastructure, underpinned by customer forecasts tied to AI and cloud network expansion. Tower’s analog and mixed-signal ICs are increasingly vital to high-speed data transfer in today's digital ecosystems. The company’s U.S.-listed shares rose 5% following the announcement. As AI and connectivity demands rise, will Tower’s niche in RF and optical solutions position it for broader market gains? Thanks again to Reuters for the full article with more background and insights click the source link in the comments below. #Semiconductors #TowerSemiconductor #AI #DataCenters #ChipIndustry #Earnings #AutomotiveTech #IndustrialTech

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