Applied Materials

From atomic scale to immense results, our Material Innovation 101 series wraps up with a deep dive into semiconductor chip creation. This work cannot be done without the unique and connected portfolio from Applied Materials. #MakeItMaterial

We’re thrilled to share that Applied Materials has received the SEMI Foundation Excellence in Achievement Award, a recognition that celebrates outstanding contributions to workforce development and fostering a culture of belonging in the global microelectronics industry. This award highlights the leadership, innovation, mentorship, and team-building efforts that define our people. Thank you to the SEMI Foundation for this meaningful recognition, and to Alasdair Dent, Curtis Geroy, Josh Hanna and Erika Gabrielle Hansen who helped make this achievement possible! SEMI Americas #SEMICONWest

Paul’s experience at Applied Materials exemplifies our spirit of learning and development—one that’s amplified by a robust support system and fuels success. Join our field service team and discover what you can achieve when you’re surrounded by opportunities. #LifeatApplied https://bit.ly/4h6ODCI

ICYMI: This week we announced three new products: ✅ Kinex integrated die-to-wafer hybrid bonding system ✅ Centura Xtera epi system ✅ PROVision 10 eBeam metrology system These new semiconductor manufacturing systems boost the performance of advanced logic and memory chips foundational to AI computing. They target three critical areas in the race to deliver ever more powerful AI chips: ✅ leading-edge logic including Gate-All-Around transistors ✅ high-performance DRAM including high-bandwidth memory ✅ advanced packaging to create highly integrated systems-in-a-package that optimize chip performance, power consumption and cost. Read more: https://bit.ly/48gjoCJ #MakeItMaterial

Today, together with Arizona State University, we marked the official opening of the Materials-to-Fab Center, a shared world-class $270 million research, development and prototyping facility inside the university’s MacroTechnology Works at ASU’s Research Park in Tempe. Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials, said, “Universities are the foundation of America’s semiconductor innovation pipeline, and we look forward to bringing together ASU’s world-class engineering teams with Applied Materials technologists and ecosystem partners at the Materials-to-Fab Center. These collaborations will focus on accelerating development of new chip technologies that are crucial to U.S. leadership in AI, high-performance computing and other megatrends shaping the future.” Read more: https://bit.ly/3IOmlAb State of Arizona, Arizona Commerce Authority

🧠 We think our latest Material Innovation 101 video is fab, and we hope you do too! Fabs are large semiconductor fabrication factories used to manufacture integrated circuits. These integrated circuits bring you the electronic devices you use every day. 🏭#MakeItMaterial

We celebrate all of the skilled, driven professionals powering innovation at Applied. Here, your manufacturing career isn’t just supported—it thrives. Join a team that’s fueled by curiosity and energized by exciting challenges. #MakeItMaterial https://bit.ly/4o2N2zR

Advanced packaging and hybrid bonding are increasingly vital as the semiconductor industry seeks to improve performance, power, area, and cost (PPAC). Our Kinex system is the industry’s first fully integrated chiplet hybrid bonding (HB) platform, marking a critical inflection in the HB equipment market. Our strategic collaboration with Besi gives us a unique advantage: control of the full-stack bonding process from materials through integration. Learn more from the analysis by The Futurum Group https://bit.ly/4q0Yyh6

To optimize performance and power efficiency, today’s leading GPUs and high-performance computing (HPC) chips use advanced packaging schemes to combine multiple chiplets into complex systems. Hybrid bonding is an emerging chip-stacking technology that uses direct copper-to-copper bonds, resulting in significant improvements in overall performance, power consumption and cost. To accelerate the use of hybrid bonding in advanced logic and memory chips, Applied Materials, in collaboration with BE Semiconductor Industries N.V. (Besi), developed the Kinex™ Bonding system – the industry’s first integrated die-to-wafer hybrid bonder. The system brings together Applied’s expertise in front-end wafer and chip processing with high levels of bonding accuracy and speed from Besi’s leading die placement, interconnect and assembly solutions. #MakeItMaterial Learn More: https://bit.ly/46CDkP0

Moving the industry forward requires bringing leading experts together to drive transformative innovation—and high-velocity collaboration will be the key to the next breakthrough. We extend our sincere appreciation to James Chambers, Vice President of Silicon Engineering & Sourcing at NVIDIA, and Rose Castanares, President of TSMC Arizona, for their partnership and for sharing their perspectives on the dynamic world of AI during our Technology Breakfast at #SEMICONWest. #MakeItMaterial