Lam Research

The first DRAM chips stored just a few kilobits of data — but they ran faster and cost less than magnetic storage. See how DRAM evolved into standardized SIMMs and DIMMs, powering the technology we use today.

For Bring Our Children to Work Day, we handed the mic to our employees’ kids and let them explain life at Lam in their own words. Sometimes the simplest answers are the best.

In the latest interview from Bob O'Donnell at TECHnalysis, he talks with Audrey Charles, SVP of Corporate Strategy and Advanced Packaging at Lam Research, and they break down why advanced packaging has become one of the most critical enablers of AI performance.      Check out the five biggest insights from the discussion:   1️⃣ Advanced packaging is now fundamental to AI compute — bringing GPUs and high bandwidth memory (HBM) closer together unlocks the speed, power efficiency, and throughput required for today’s large language models (LLMs).  2️⃣Interconnect is everything — and Lam’s core strength. From through-silicon vias (TSVs) to copper interconnects to hybrid bonding structures, precision etch and deposition are essential to forming the dense, reliable electrical pathways AI chips depend on.  3️⃣ Chiplets are transforming system designs. Advanced packaging allows mixing nodes, customizing architectures, and scaling performance in new ways. Lam’s “close to the customer” model provides repeatability and precision our customers need to maintain yield.  4️⃣ HBM is indispensable for AI. As memory stacks grow taller and more complex, TSV etch, atomic layer deposition (ALD) liners, and copper plating are critical to ensure uniformity, reliability, and device performance.  5️⃣ The next wave is already here. From panel size packaging and photonics to 3D hybrid bonding, we are continuing to invest ahead of customer roadmaps to support larger, faster, more interconnected AI systems.  Curious to learn more? Explore the full interview:  

Within wafer variations remain one of the ongoing challenges in semiconductor manufacturing. Differences in etch rate or film thickness across a wafer can impact device characteristics, drive yield loss, and increase process variability. In our latest Semiverse® Solutions article, we explore how virtual fabrication and digital twins provide a new way to predict these variations, simulate thousands of scenarios, and identify process sensitivities before a physical wafer is touched. It also shows how data-driven modeling can evaluate recipe changes, optimize device performance, and improve across wafer controls. https://bit.ly/3ZmIFWd

Memory like you’ve never seen it before. 🧠 By refining high aspect ratio etch, enabling atomic layer deposition of new materials, and transitioning from 2D to 3D architectures, we help the industry overcome the physical limits of memory scaling. The result? Higher density, lower resistance, and a new generation of performance possibilities. Watch the video.

Lam has been named to Fortune's World’s Most Admired Companies list for 2026, ranking fourth in the semiconductor industry. This recognition reflects our reputation across leadership, innovation, financial strength, and social responsibility as evaluated by industry peers. Learn more about how Fortune assesses corporate reputations and why our continued presence on the list demonstrates the strength of our culture and long-term performance. https://bit.ly/4a9ZOHt

We are pleased to welcome Dr. Anirudh Devgan to our board of directors. Learn more about the deep semiconductor ecosystem and technology expertise Dr. Devgan brings to the board. https://bit.ly/4a8qlVB

Applications for the 4th Lam Capital Venture Competition are open! Startups working at the intersection of AI and semiconductors are invited to apply, and the winning team will receive a $250,000 investment from Lam Capital. Submit your application by March 15, 2026. ➡️ https://bit.ly/3NR6umw

As architectures evolve and dimensions shrink, molybdenum plays a key role in enabling reliable, high-performing memory and logic. This edition of the IMOA Moly Review takes a closer look at how molybdenum contributes to the technologies behind today’s AI-driven devices. Tap the link to learn more. https://bit.ly/4q4VYFC

Precision matters at every scale — and this week’s Word of the Week, patterning, shows why. By combining advanced lithography, deposition, and etch techniques, our solutions enable the ultra-small, tightly packed features that make next-generation chips possible. Learn more about our patterning solutions. https://bit.ly/45nsJ9x