Alphawave Semi tapes out UCIe 3D IP on TSMC SoIC-X

Video: "#UCIe™ Chiplet IP on #TSMC #3DFabric® Platform" By Archana P Cheruliyil, Principal Product Marketing Manager, Alphawave Semi https://lnkd.in/egxZetvF Alphawave Semi has announced the successful tape-out of its cutting edge UCIe™ 3D IP on the advanced TSMC SoIC® (SoIC-X) technology in the 3DFabric platform.  This achievement builds on Alphawave Semi’s established baseline of leading UCIe™ IP subsystems and presents a significant evolution in the company’s chiplet integration capabilities. By leveraging TSMC’s SoIC-X advanced 3D packaging technology, Alphawave Semi continues to push the boundaries of power, performance efficiency and bandwidth for next generation datacenter, AI, and HPC applications. The IP supports face-to-face (F2F) configurations and provides a 10x improvement in power efficiency over traditional 2.5D die-to-die interfaces. It also delivers up to a 5x increased signal density. Watch now at https://lnkd.in/egxZetvF #semiIP #IPcores #semiconductor 

📽️ Watch the Highlights: 𝗠𝗮𝗿𝘃𝗲𝗹𝗹 𝗮𝘁 𝗢𝗖𝗣 𝟮𝟬𝟮𝟱 – Powering the Future of AI Infrastructure At the OCP Global Summit 2025, Marvell showcased how open collaboration and silicon innovation are shaping the future of AI and cloud data infrastructure. From 𝗰𝘂𝘀𝘁𝗼𝗺 𝘀𝗶𝗹𝗶𝗰𝗼𝗻 𝗮𝗻𝗱 𝗰𝗵𝗶𝗽𝗹𝗲𝘁 𝗶𝗻𝘁𝗲𝗴𝗿𝗮𝘁𝗶𝗼𝗻 to 𝗖𝗫𝗟 𝗺𝗲𝗺𝗼𝗿𝘆 and 𝗰𝗼-𝗽𝗮𝗰𝗸𝗮𝗴𝗲𝗱 𝗼𝗽𝘁𝗶𝗰𝘀, Marvell experts shared next-generation solutions that make AI systems more scalable, energy-efficient, and connected. Key highlights included: 🔹 Launch of 𝗔𝗰𝘁𝗶𝘃𝗲 𝗖𝗼𝗽𝗽𝗲𝗿 𝗖𝗮𝗯𝗹𝗲 (𝗔𝗖𝗖) 𝗹𝗶𝗻𝗲𝗮𝗿 𝗲𝗾𝘂𝗮𝗹𝗶𝘇𝗲𝗿𝘀 for longer-reach, power-efficient interconnects 🔹 Collaboration with Infraeo on a breakthrough 𝟵𝗺 𝟴𝟬𝟬𝗚 𝗮𝗰𝘁𝗶𝘃𝗲 𝗲𝗹𝗲𝗰𝘁𝗿𝗶𝗰𝗮𝗹 𝗰𝗮𝗯𝗹𝗲 (𝗔𝗘𝗖) demonstration 🔹 Live demos of 𝗦𝘁𝗿𝘂𝗰𝘁𝗲𝗿𝗮𝗧𝗠 𝗖𝗫𝗟, 𝗔𝗹𝗮𝘀𝗸𝗮® 𝗣 𝗣𝗖𝗜𝗲 𝟲 𝗿𝗲𝘁𝗶𝗺𝗲𝗿𝘀, 𝗔𝗿𝗮 𝟮𝟬𝟬𝗚/𝗹𝗮𝗺𝗯𝗱𝗮 𝟭.𝟲𝗧 𝗣𝗔𝗠𝟰 𝗼𝗽𝘁𝗶𝗰𝗮𝗹 𝗗𝗦𝗣𝘀, 𝗮𝗻𝗱 𝗧𝗲𝗿𝗮𝗹𝘆𝗻𝘅® 𝘁𝗲𝗹𝗲𝗺𝗲𝘁𝗿𝘆 𝗔𝗣𝗜𝘀 Marvell continues to lead through open, standards-based innovation, driving the evolution of AI and cloud data centers. #OCP2025 #Marvell #AIInfrastructure #DataCenter #Networking #Semiconductors #CXL #OpticalDSP #Chiplets #AIEra

🚀 Alphawave Semi hits a new milestone in chiplet innovation Last week, Alphawave Semi unveiled its UCIe™ 3D IP on TSMC’s SoIC® (SoIC-X) — part of the 3DFabric™ platform — marking a breakthrough in advanced 3D chiplet integration. 💡 Key Highlights 🔗 Up to 10× higher power efficiency and 5× greater signal density in face-to-face (F2F) configurations ⚙️ Built for AI, data center, and HPC architectures requiring extreme bandwidth and low latency 🧩 Strengthens UCIe™ leadership in enabling multi-die systems on cutting-edge TSMC nodes This collaboration brings chiplet ecosystems closer to reality — redefining performance, scalability, and efficiency for the next generation of compute. #Chiplets #UCIe #TSMC #SoIC #3DFabric #AI #DataCenter #HPC #Semiconductors #Connectivity #Innovation

At the Open Compute Project (OCP) 2025 Global Summit, Broadcom introduced Ethernet Scale Up Networking (ESUN), a groundbreaking approach designed to advance Ethernet-based AI infrastructure. As AI workloads continue to expand, modern data centers require networks that can handle massive bandwidth, ultra-low latency, and efficient data movement between thousands of GPUs. ESUN addresses this challenge by redefining how Ethernet can scale vertically within AI clusters. Unlike traditional Ethernet designs optimized for general-purpose connectivity, ESUN is built specifically for scale-up AI systems. It enables direct, high-bandwidth communication between accelerators while maintaining the open and interoperable nature of Ethernet. This innovation helps bridge the gap between proprietary interconnects and open networking standards, making AI clusters more flexible, efficient, and cost-effective to deploy. Broadcom’s ESUN integrates advanced features such as adaptive routing, congestion control, and precise flow management, ensuring predictable performance even under intense AI workloads. By leveraging Broadcom’s extensive silicon and networking expertise, ESUN provides the scalability needed for next-generation training and inference environments. As AI continues to reshape industries, from cloud computing to semiconductor design, open innovation through OCP and technologies like ESUN will be crucial in accelerating adoption while reducing infrastructure complexity. Ethernet, now more than ever, stands at the center of scalable AI networking, enabling organizations to build faster, smarter, and more sustainable data centers. Related News: https://lnkd.in/g53re7vG #Broadcom #2025OCP #Ethernet #AIInfrastructure #DataCenter #Networking #AI #CloudComputing #Semiconductors #Innovation #ESUN #EthernetScaleUpNetworking

Broadcom’s new Tomahawk Ultra processor marks a major step forward in AI-era networking. Unveiled in July 2025, the Tomahawk Ultra is designed to accelerate large-scale chip-to-chip communication — a critical bottleneck in modern AI infrastructure. The processor enables higher bandwidth efficiency inside data centers, connecting more chips simultaneously while reducing latency across high-performance computing systems. In the AI acceleration race, compute power alone is not enough — network efficiency now defines real performance. Broadcom’s latest innovation reinforces the importance of interconnect technologies that bind the next generation of GPUs and accelerators together. Connectivity is becoming the new frontier of computation. #AI #Semiconductors #Broadcom #Networking #DataCenters #HPC #Innovation

Modern data centers are evolving fast - driven by the demands of AI, sustainability, and performance at scale. Dell Technologies is leading this shift with next-gen infrastructure optimized for energy efficiency, workload flexibility, and AI readiness. At the heart of this evolution are Intel® Xeon® processors, powering the compute needed for today’s complex, data-intensive environments. 🔍 Explore how Dell and Intel are shaping the future of the data center: https://shr.bi/MbNSTtpl #DellTechnologies #Intel #IntelXeon #DataCenter #AIInfrastructure #ModernIT #SustainableIT #ITInnovation #AITech #DellInfrastructure

Leveraging our cutting-edge silicon photonics technology, the 800G OSFP DR8 delivers low-latency, highly-reliable connectivity for AI networks and data centers. Compatible with InfiniBand and Ethernet, it supports up to 500m reach for high-speed connections. #800G #DataCenter #OpticalTransceivers #Networking 

🚀 GIGABYTE is ready to deliver end-to-end solutions for the Intel Gaudi 3 AI Accelerator. 💡 We offer both OAM and PCIe-based solutions for Intel Gaudi 3: 🔹 G893-SG1-AAX1 – the flagship 8U air-cooled server featuring an optimized thermal design that delivers the robust infrastructure needed for high-performance AI acceleration. 🔹 G494-SB0-AAP2 – a PCIe-based platform that integrates seamlessly into existing infrastructures, optimizing rack space and reducing operational overhead. From design to deployment, our optimized server platforms ensure seamless scalability and rapid time-to-value — empowering businesses to deploy AI infrastructure. 👉 Learn more : https://gct.pse.is/8akxex #GIGABYTE #GIGABYTEGroup #GigaComputing #serversolutions #Intel #Gaudi3 #AIInfrastructure #DataCenter #AI #Acceleration Intel Corporation

The Next Leap in #AI #Networking: Co-Packaged Optics As AI factories scale, #NVIDIA Photonics is redefining #datacenter networking by: ✅ Removing the need for pluggable transceivers ✅ Delivering more resilient and energy-efficient networks ✅ Enabling co-packaged optics for both #Quantum #InfiniBand and Spectrum-X #Ethernet The result? Faster time to first token and scalable, sustainable infrastructure to power the era of agentic AI. 👉 Watch the NVIDIA Quantum-X $Photonics switch come to life in an #AIFactory: https://bit.ly/4mWFZrG #AIFactory #Networking #DataCenter

AMD Eyes AI Edge Revolution. AMD is betting big on edge computing with its Xilinx-powered FPGAs, enabling fast, low-latency AI on devices. While Nvidia dominates cloud AI, AMD is quietly positioning as a long-term AI backbone. #AMD #AI #EdgeComputing #FPGAs #Semiconductors #TechStocks #Innovation #TECHi Read Full Article Here :- https://lnkd.in/eAsra_i6