Cadence and TSMC Collaborate on AI and 3DFabric Innovations

Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies:   * AI flows for TSMC N2 and A16 process technologies   * EDA flow for TSMC A14 with its first PDK to be released later this year    * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities   * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency.  Read more https://ow.ly/mzkX30sQ2js #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements

Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies:   * AI flows for TSMC N2 and A16 process technologies   * EDA flow for TSMC A14 with its first PDK to be released later this year    * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities   * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency.  Read more https://ow.ly/sBmQ30sQ1k7 #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements

Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies:   * AI flows for TSMC N2 and A16 process technologies   * EDA flow for TSMC A14 with its first PDK to be released later this year    * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities   * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency.  Read more https://ow.ly/QB7w30sQpoS #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements

Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies:   * AI flows for TSMC N2 and A16 process technologies   * EDA flow for TSMC A14 with its first PDK to be released later this year    * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities   * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency.  Read more https://ow.ly/98WS30sQpoR #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements

Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies:   * AI flows for TSMC N2 and A16 process technologies   * EDA flow for TSMC A14 with its first PDK to be released later this year    * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities   * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency.  Read more https://ow.ly/tT9s30sQ3w0 #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements

Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies:   * AI flows for TSMC N2 and A16 process technologies   * EDA flow for TSMC A14 with its first PDK to be released later this year    * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities   * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency.  Read more https://ow.ly/IzZ130sQ8EG #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements

Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies:   * AI flows for TSMC N2 and A16 process technologies   * EDA flow for TSMC A14 with its first PDK to be released later this year    * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities   * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency.  Read more https://ow.ly/VFV330sQ1ka #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements

Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies:   * AI flows for TSMC N2 and A16 process technologies   * EDA flow for TSMC A14 with its first PDK to be released later this year    * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities   * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency.  Read more https://ow.ly/24sx30sQ1Mk #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements

TSMC Seeks Approval for $49B A14 Chip Fab in Central Taiwan to Accelerate AI Innovation TechShots I Adding Intelligence to Enterprise Information Technology Buying #TSMC #Chip #Innovation https://lnkd.in/e8zRXwFx

Today at #SEMICONWest we introduced new semiconductor manufacturing systems that boost the performance of advanced logic and memory chips foundational to AI computing. The new products target three critical areas in the race to deliver ever more powerful AI chips: leading-edge logic including Gate-All-Around (GAA) transistors, high-performance DRAM including high-bandwidth memory (HBM), and advanced packaging to create highly integrated systems-in-a-package that optimize chip performance, power consumption and cost. SEMI Americas #MakeItMaterial Read more: https://bit.ly/4q36OgK