Introducing 800G OSFP DR8: High-speed connectivity for AI networks and data centers

GF’s collaboration with Corning Optical Communications marks an important step forward in delivering next-generation connectivity solutions for AI demand. By integrating Corning’s connector and fiber technology with our silicon photonics platform, we are enabling the performance and flexibility required for high-density optical packaging in AI datacenters. As demand from AI and advanced computing continues to accelerate, these innovations are essential to meeting industry demand head on. #Globalfoundries #Corning #siliconphotonics #GFFotonix #datacentr https://lnkd.in/gER5dszC

UALink and Ultra Ethernet are two of the latest standards for scaling up and scaling out #AI infrastructure. Under the hood, 224G SerDes IP is powering these high-speed interconnects in the most demanding conditions. Learn how Cadence ensures this crucial technology will perform and interoperate as designed in emerging 800G and 1.6T networks: https://lnkd.in/gVmYDR2T

At the Open Compute Project (OCP) 2025 Global Summit, Broadcom introduced Ethernet Scale Up Networking (ESUN), a groundbreaking approach designed to advance Ethernet-based AI infrastructure. As AI workloads continue to expand, modern data centers require networks that can handle massive bandwidth, ultra-low latency, and efficient data movement between thousands of GPUs. ESUN addresses this challenge by redefining how Ethernet can scale vertically within AI clusters. Unlike traditional Ethernet designs optimized for general-purpose connectivity, ESUN is built specifically for scale-up AI systems. It enables direct, high-bandwidth communication between accelerators while maintaining the open and interoperable nature of Ethernet. This innovation helps bridge the gap between proprietary interconnects and open networking standards, making AI clusters more flexible, efficient, and cost-effective to deploy. Broadcom’s ESUN integrates advanced features such as adaptive routing, congestion control, and precise flow management, ensuring predictable performance even under intense AI workloads. By leveraging Broadcom’s extensive silicon and networking expertise, ESUN provides the scalability needed for next-generation training and inference environments. As AI continues to reshape industries, from cloud computing to semiconductor design, open innovation through OCP and technologies like ESUN will be crucial in accelerating adoption while reducing infrastructure complexity. Ethernet, now more than ever, stands at the center of scalable AI networking, enabling organizations to build faster, smarter, and more sustainable data centers. Related News: https://lnkd.in/g53re7vG #Broadcom #2025OCP #Ethernet #AIInfrastructure #DataCenter #Networking #AI #CloudComputing #Semiconductors #Innovation #ESUN #EthernetScaleUpNetworking

Gemtek Technology Co. Ltd announces OMDN-107 800Gbps LPO transceiver using NewPhotonics tech for AI data centers, enhancing efficiency, performance, and scalability - https://lnkd.in/gJ4z8krP "As hyperscalers demand faster, more efficient connectivity, our 800G LPO transceiver extends Gemtek's leadership in pluggable solutions for AI and data center networks," said James Lee, President, Gemtek. #Gemtek #NewPhotonics #LPOTransceiver #800G #SiliconPhotonics #AIDataCenters #OpticalConnectivity #TechIntelPro

Cadence tapes out its next-generation 32G UCIe advanced package IP subsystem on TSMC's 3nm process, offering: • Enhanced high-speed die-to-die connectivity with flexible data rates up to 32Gbps • Universal interoperability • Self-calibration, hardware-based bring-up • Robust performance across industrial condition • Protocol support to meet the demands of AI/ML, HPC, and datacenter applications. Learn more here: https://ow.ly/mKm330sQ3wj

Broadcom Unveils Tomahawk 6 – Davisson: 102.4 Tbps CPO Ethernet Switch Broadcom’s Tomahawk® 6 – Davisson delivers 102.4 Tbps, doubling bandwidth while cutting optical interconnect power consumption by 70%. Designed for AI networking, it integrates Co-Packaged Optics (CPO) for high efficiency, improved link stability, and seamless scalability in hyperscale and AI data centers. This next-gen switch sets a new standard for performance, energy efficiency, and reliability. #Broadcom #AI #DataCenter #Networking #CoPackagedOptics https://lnkd.in/g_m3yEEk

Cadence tapes out its next-generation 32G UCIe advanced package IP subsystem on TSMC's 3nm process, offering: • Enhanced high-speed die-to-die connectivity with flexible data rates up to 32Gbps • Universal interoperability • Self-calibration, hardware-based bring-up • Robust performance across industrial condition • Protocol support to meet the demands of AI/ML, HPC, and datacenter applications. Learn more here: https://ow.ly/2EWV30sPYVU

Cadence tapes out its next-generation 32G UCIe advanced package IP subsystem on TSMC's 3nm process, offering: • Enhanced high-speed die-to-die connectivity with flexible data rates up to 32Gbps • Universal interoperability • Self-calibration, hardware-based bring-up • Robust performance across industrial condition • Protocol support to meet the demands of AI/ML, HPC, and datacenter applications. Learn more here: https://ow.ly/svQf30sPSiA

Cadence tapes out its next-generation 32G UCIe advanced package IP subsystem on TSMC's 3nm process, offering: • Enhanced high-speed die-to-die connectivity with flexible data rates up to 32Gbps • Universal interoperability • Self-calibration, hardware-based bring-up • Robust performance across industrial condition • Protocol support to meet the demands of AI/ML, HPC, and datacenter applications. Learn more here: https://ow.ly/8omF30sPVKN

Alphawave Semi announces the successful tape-out of its cutting edge UCIe™ 3D IP on the advanced TSMC SoIC® (SoIC-X) technology in the 3DFabric platform. This achievement builds on Alphawave Semi’s established baseline of leading UCIe™ IP subsystems and presents a significant evolution in the company’s chiplet integration capabilities. By leveraging TSMC’s SoIC-X advanced 3D packaging technology, Alphawave Semi continues to push the boundaries of power, performance efficiency and bandwidth for next generation datacenter, AI, and HPC applications. "By combining our high-speed 3D UCIe IP with TSMC's groundbreaking SoIC-X technology, we are directly addressing the memory and bandwidth bottlenecks that limit our customers' next-generation AI and HPC applications.” - Mohit Gupta, Executive Vice President & General Manager, Alphawave Semi. To read the full announcement, visit: https://lnkd.in/ebFDHUC2 #AlphawaveSemi #3DIP #DataCenter #AI #HPC #NextGenerationAI #UCle