imec’s Post

Press release - at the IEEE ECTC 2025 conference, imec showcases its high-performance, flexible 300mm RF silicon interposer platform. It enables seamless integration of RF-to-sub-THz CMOS and III/V chiplets on a single carrier, achieving a record-low insertion loss of 0.73dB/mm up to 325GHz—advancing compact, low-loss, scalable RF and mixed-signal systems. Read more: https://lnkd.in/ej6gB3T2