Intel Foundry: How we're pushing chipmaking limits

Ten years in, chiplets are redefining what’s possible in semiconductor design. What began as a solution to rising design costs and yield challenges has evolved into one of the most transformative architectures in modern compute. By breaking large, monolithic chips into smaller specialized dies, chiplets have unlocked new levels of flexibility, power efficiency and performance. They’ve also accelerated collaboration across the semiconductor ecosystem, from integrating memory and optics to exploring advanced 4D packaging and system-level co-design. As Michael Kanellos, head of influencer relations at Marvell, explores in his blog “Chiplets Turn 10: Here Are Ten Things to Know,” this modular approach isn’t just reshaping silicon. It’s redefining how the industry builds for the next decade of AI and data-centric computing. Read more: https://mrvl.co/4mIa3HP

This week at #SEMICONWest Applied Materials introduced new semiconductor manufacturing systems that boost the performance of advanced logic and memory chips foundational to AI computing. The new products target three critical areas in the race to deliver ever more powerful AI chips: leading-edge logic including Gate-All-Around (GAA) transistors, high-performance DRAM including high-bandwidth memory (HBM), and advanced packaging to create highly integrated systems-in-a-package that optimize chip performance, power consumption and cost. #MakeItMaterial Read more: https://bit.ly/4q36OgK

This week at #SEMICONWest Applied Materials introduced new semiconductor manufacturing systems that boost the performance of advanced logic and memory chips foundational to AI computing. The new products target three critical areas in the race to deliver ever more powerful AI chips: leading-edge logic including Gate-All-Around (GAA) transistors, high-performance DRAM including high-bandwidth memory (HBM), and advanced packaging to create highly integrated systems-in-a-package that optimize chip performance, power consumption and cost. #MakeItMaterial Read more: https://bit.ly/4q36OgK

Last week at #SEMICONWest Applied Materials introduced new semiconductor manufacturing systems that boost the performance of advanced logic and memory chips foundational to AI computing. The new products target three critical areas in the race to deliver ever more powerful AI chips: leading-edge logic including Gate-All-Around (GAA) transistors, high-performance DRAM including high-bandwidth memory (HBM), and advanced packaging to create highly integrated systems-in-a-package that optimize chip performance, power consumption and cost. #MakeItMaterial Read more: https://bit.ly/4q36OgK

Last week at #SEMICONWest Applied Materials introduced new semiconductor manufacturing systems that boost the performance of advanced logic and memory chips foundational to AI computing. The new products target three critical areas in the race to deliver ever more powerful AI chips: leading-edge logic including Gate-All-Around (GAA) transistors, high-performance DRAM including high-bandwidth memory (HBM), and advanced packaging to create highly integrated systems-in-a-package that optimize chip performance, power consumption and cost. #MakeItMaterial Read more: https://bit.ly/4q36OgK

Today at #SEMICONWest, Applied Materials unveiled cutting-edge semiconductor manufacturing systems designed to elevate the performance of advanced logic and memory chips that power AI computing. These innovations address three pivotal areas in the development of next-generation AI chips: - Leading-edge logic, including Gate-All-Around (GAA) transistors - High-performance DRAM, such as high-bandwidth memory (HBM) - Advanced packaging, enabling highly integrated systems-in-a-package that optimize performance, power efficiency, and cost Applied Materials continues to push the boundaries of what's possible in semiconductor technology, accelerating the future of AI. 🔗 Read more: https://bit.ly/4q36OgK #SemiconductorInnovation #AIComputing #HBM #GAA #AdvancedPackaging #SystemsInPackage #TechNews #AppliedMaterials #MakeItMaterial #SEMICONWest2025 #FutureOfAI #ChipDesign #SemiconductorManufacturing

Semiconductor Engineering has over 500 Tech Talk videos to learn from. https://lnkd.in/gbHAnMDT Hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, DRAM, manufacturing and test, and much more. Let us know what other topics are of interest. #techtalks #semiconductor #EDA #AgenticAI #chiplets #semiconductormanufacturing

🌟 New Blog Just Published! 🌟 📌 Export Controls Reshaping AI Chip Design 🚀 ✍️ Author: Hiren Dave 📖 Since the United States imposed unprecedented export restrictions on AI-related semiconductors in October 2022-and tightened them again in 2023 and 2024-chip architects can no longer ignore...... 🕒 Published: 2025-10-02 📂 Category: Tech 🔗 Read more: https://lnkd.in/d2DRRPen 🚀✨ #aichips #exportcontrols #semiconductordesig