Marvell showcases AI innovations at OCP 2025

Leading the future of AI infrastructure at OCP 2025. Last week, Marvell joined the global technology community at the Open Compute Project Foundation Global Summit to showcase how open collaboration and innovation are redefining data infrastructure for the AI era. Throughout the week, Marvell experts presented across executive, networking, memory, AI, and security tracks, sharing advancements in custom silicon, chiplet integration, CXL memory, and co-packaged optics that are enabling scalable and energy-efficient AI systems. Marvell also announced new active copper cable (ACC) linear equalizers, expanding its connectivity portfolio with longer-reach, power-efficient copper solutions for high-speed, scale-up interconnects. In collaboration with Infraeo, Marvell demonstrated a 9-meter 800G active electrical cable (AEC), a breakthrough in copper technology that extends connectivity to row-scale distances and enables low-latency interconnects for next-generation AI infrastructure. In the Expo Hall, attendees experienced several additional demonstrations, including: ✔️ Structera™ CXL near-memory acceleration and expansion ✔️ Alaska® P PCIe 6 retimers for AI scale-up ✔️ Ara 200G/lambda 1.6T PAM4 optical DSPs for AI scale-out ✔️ Teralynx® switch telemetry APIs for real-time network visibility Together, these innovations highlight Marvell leadership in open, standards-based collaboration and its role in driving the future of AI and cloud data centers. Watch the highlights from OCP 2025: https://mrvl.co/4nWJMXf

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We at Infraeo are proud of our collaboration and look forward to more of ‘AI network connectivity disrutption’.

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