📢 NEWS! proteanTecs Silicon-Proven on TSMC N2P We’re excited to announce that proteanTecs is silicon-proven at TSMC’s 2nm (N2P) technology node and validated in a customer device for high-performance applications. Chief Technology Officer, proteanTecs Evelyn Landman highlights, “Our close collaboration with TSMC enables us to support our mutual customers effectively, empowering them with critical insights and robust technology solutions for their projects that leverage TSMC’s advanced process technology." We are building advanced power reduction, health monitoring and predictive insights directly into the chip, empowering customers to scale faster with higher performance, efficiency, and reliability at 2nm and beyond. 👉 Read more here: https://lnkd.in/gEJ6xqAG #proteanTecs #TSMC #N2P #semiconductors #onchipmonitors #2nm #LVTS
proteanTecs silicon-proven on TSMC N2P, enables high-performance apps
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proteanTecs announced their silicon-proven validation of its IP-based health and performance monitoring technology at TSMC’s 2nm (N2P) process node, demonstrating immediate applicability for high-volume. According to proteanTecs’ CTO Evelyn Landman, “Achieving silicon-proven status at 2nm process underscores our leadership in providing the semiconductor industry with essential analytics and monitoring solutions,” enabling semiconductor and system manufacturers to accelerate time-to-market, improve power efficiency, and reduce costs. Read more about the milestone below. #Silicon #Semiconductor #Hardware
📢 NEWS! proteanTecs Silicon-Proven on TSMC N2P We’re excited to announce that proteanTecs is silicon-proven at TSMC’s 2nm (N2P) technology node and validated in a customer device for high-performance applications. Chief Technology Officer, proteanTecs Evelyn Landman highlights, “Our close collaboration with TSMC enables us to support our mutual customers effectively, empowering them with critical insights and robust technology solutions for their projects that leverage TSMC’s advanced process technology." We are building advanced power reduction, health monitoring and predictive insights directly into the chip, empowering customers to scale faster with higher performance, efficiency, and reliability at 2nm and beyond. 👉 Read more here: https://lnkd.in/gEJ6xqAG #proteanTecs #TSMC #N2P #semiconductors #onchipmonitors #2nm #LVTS
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Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies: * AI flows for TSMC N2 and A16 process technologies * EDA flow for TSMC A14 with its first PDK to be released later this year * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency. Read more https://ow.ly/UsS330sPZYx #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements
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Program Management Director * Project Management * *Release Management * Multi-Lingual * LGBTQ+ ERG Inclusion Group Lead * Swiss-American * Non profit board experience * Local government experience
Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies: * AI flows for TSMC N2 and A16 process technologies * EDA flow for TSMC A14 with its first PDK to be released later this year * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency. Read more https://ow.ly/sBmQ30sQ1k7 #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements
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Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies: * AI flows for TSMC N2 and A16 process technologies * EDA flow for TSMC A14 with its first PDK to be released later this year * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency. Read more https://ow.ly/24sx30sQ1Mk #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements
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Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies: * AI flows for TSMC N2 and A16 process technologies * EDA flow for TSMC A14 with its first PDK to be released later this year * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency. Read more https://ow.ly/QB7w30sQpoS #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements
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Sr. IP Account Executive with a long experience in multiple high tech industries. Background in Software Development, Real-Time, Embedded Systems, Processors, Avionics, IoT, EDA and CAD.
Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies: * AI flows for TSMC N2 and A16 process technologies * EDA flow for TSMC A14 with its first PDK to be released later this year * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency. Read more https://ow.ly/IzZ130sQ8EG #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements
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Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies: * AI flows for TSMC N2 and A16 process technologies * EDA flow for TSMC A14 with its first PDK to be released later this year * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency. Read more https://ow.ly/TK4W30sPUhA #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements
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Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies: * AI flows for TSMC N2 and A16 process technologies * EDA flow for TSMC A14 with its first PDK to be released later this year * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency. Read more https://ow.ly/6BNN50X0AkO #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements
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A global leader and manager with a strong business acumen across various industries and regions | Relationship Builder | Sales Strategist | Team Development | Business Adviser | Global Tech Innovation
Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies: * AI flows for TSMC N2 and A16 process technologies * EDA flow for TSMC A14 with its first PDK to be released later this year * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency. Read more https://ow.ly/esvK30sPYVT #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements
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A global leader and manager with a strong business acumen across various industries and regions | Relationship Builder | Sales Strategist | Team Development | Business Adviser | Global Tech Innovation
Driving N2, A16, and 3DFabric Innovation with TSMC Cadence partners with TSMC to power next-generation innovations using AI flows and IP for TSMC advanced nodes and 3DFabric. Together we’re enabling advanced process technologies: * AI flows for TSMC N2 and A16 process technologies * EDA flow for TSMC A14 with its first PDK to be released later this year * Comprehensive support for latest TSMC 3DFabric die stacking configurations and advanced packaging capabilities * Silicon-proven IP including HBM4 and LPDDR6/5x on TSMC N3P, enabling next-gen AI infrastructure With these advancements, we’re enabling semiconductor design teams to break barriers and achieve new levels of innovation, productivity, and efficiency. Read more https://ow.ly/HcZm30sQ20P #TSMC #TSMCOIP2025 #ProliferatingAIAdvancements
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