From silicon design to advanced packaging, Intel Foundry partners with fabless companies to bring their innovations to life. Hear more in this discussion from the #GSAWomenInLeadership event with Intel Foundry’s Pam Fulton. 👇 #IntelFoundry #Semiconductors
New at #IntelFoundry: Leveraging advanced packaging to enable the silicon to talk to the outside world 🌐 Tune in NOW for expert insights! theCUBE.net #theCUBE’s John Furrier brings you exclusive coverage of the #GSAWomenInLeadership event in collaboration with NYSE Wired. In this segment Furrier sits down with Intel Corporation's Pam Fulton, ASE Global's Cherry Ooi and Teradyne's Nitza Basoco to discuss semiconductor innovation and how Intel Foundry helps fabless companies with silicon design and advanced packaging. “To manufacture semiconductors, you need a few things. Number one, you need silicon. There are a few big silicon foundries in the world. Number one is TSMC, similarly is Intel. We manufacture all of the silicon. There are a lot of integrations happening at the silicon level. All of the design for the computer architecture goes into the silicon itself. Advanced packaging comes in where you have to connect the silicon to the outside world, whether it's to a motherboard that goes into a PC, a data center or something like that,” Fulton shares. “Advanced packaging enables not just the silicon to talk to the outside world, but also to talk to memory and other components. All of the fabless companies do their silicon design and then they work with a foundry or an OSAT like ASC or Intel in order to design their packaging, something that will complement the silicon as well as their end use application,” she adds. 📺 Tune in NOW! https://lnkd.in/gMaWRPKA #SemiconductorInnovation #AdvancedPackaging #SiliconDesign #EnterpriseAI