FAST AND LS TTL

Package Information
Including
Surface Mount

BIPOLAR LOGIC SURFACE MOUNT

Surface Mount components are sent directly to the assembly

line, eliminating an intermediate step.
Automatic placement equipment is available that can place
Surface Mount components at the rate of a few thousand per
hour to hundreds of thousands of components per hour.
Surface Mount Technology is cost effective, allowing the
manufacturer the opportunity to produce smaller units and/or
offer increased functions with the same size product.

WHY SURFACE MOUNT?

Surface Mount Technology is now being utilized to offer

answers to many problems that have been created in the use
of insertion technology.
Limitations have been reached with insertion packages and
PC board technology. Surface Mount Technology offers the
opportunity to continue to advance the State-of-the-Art
designs that cannot be accomplished with Insertion
Technology.
Surface Mount Packages allow more optimum device
performance with the smaller Surface Mount configuration.
Internal lead lengths, parasitic capacitance and inductance
that placed limitations on chip performance have been
reduced.
The lower profile of Surface Mount Packages allows more
boards to be utilized in a given amount of space. They are
stacked closer together and utilize less total volume than
insertion populated PC boards.
Printed circuit costs are lowered with the reduction of the
number of board layers required. The elimination or reduction
of the number of plated through holes in the board, contribute
significantly to lower PC board prices.
Surface Mount assembly does not require the preparation
of components that are common on insertion technology lines.

SURFACE MOUNT AVAILABILITY

Bipolar Logic is currently offering LS-TTL and FAST-TTL in
production quantities in SOIC packages.
Refer to the following Selector Guide (SG366/D) which indicate availability and package type for these families.
These families may be ordered in rails or on Tape and Reel.
Refer to Tape and Reel information for ordering details.
THERMAL DATA
The power dissipation of surface mount packages is dependent on many factors that must be taken into consideration in
the initial board design. The board material, the board surface
metal thickness, pad area and the proximity to other heat
generating components all have a bearing on the device
dissipation capability.

200

180

C/W
JA

160

MIN DIE SIZE

2K MILS2

140

120
SEE FIG. 2 FOR
HEAT SINK DETAIL

100
SO-8
(.090 x .110)

MAX DIE SIZE

8K MILS2

LEADFRAME
SO-14
METAL = COPPER (.090 x .170)

SO-16
(.090 x .170)
NARROW

PACKAGE STYLE
DATA TAKEN USING PHILIPS SO TEST BOARD # 7322-078, 80873

Figure 2-1. Thermal Resistance, Junction-To-Ambient (C/W)

Measurement specimens are solder mounted on printed

circuit card 19 mm 28 mm 1.5 mm in still air. No auxiliary
thermal condition aids are used.

This data was collected using thermal test die in 20-pin PLCC
packages on PLCC test boards (2.24 x 2.24 x .062 glass
epoxy, type FR-4, with solder coated 1 oz./sq. ft. copper).

FAST AND LS TTL DATA

7-2

TAPE AND REEL

STANDARD BIPOLAR LOGIC INTEGRATED CIRCUITS
Motorola has now added the convenience of Tape and Reel
packaging for our growing family of standard Integrated Circuit
products. The packaging fully conforms to the latest EIA

RS-481A specification. The antistatic embossed tape

provides a secure cavity sealed with a peel-back cover tape.

MECHANICAL POLARIZATION
SOIC DEVICES
Typical

View is from tape side

Linear direction of travel

GENERAL INFORMATION
Reel Size
13 inch (330 mm) Suffix R2
Tape Width
12 mm to 24 mm (see table)
Units/Reel
(see table)
No Partial Reel Counts Available and Minimum Lot Size is Per Table
ORDERING INFORMATION
To order devices which are to be delivered in Tape and Reel, add the suffix R2 to the device number being ordered.
TABLE 2.1 Tape and Reel Data
Device Type
SO-8
SO-14
SO-16
SO-16 Wide
SO-20 Wide

Tape Width
(mm)

Device/Reel

Reel Size
(inch)

Min Lot Size Per Part No.

Tape and Reel

12
16
16
16
24

2,500
2,500
2,500
1,000
1,000

13
13
13
13
13

5,000
5,000
5,000
5,000
5,000

FAST AND LS TTL DATA

7-3

PACKAGE OUTLINES
SOIC
Case 751A-02 D Suffix
14-Pin Plastic
SO-14

NOTES:
1. DIMENSIONS A AND B ARE DATUMS AND
T IS A DATUM SURFACE.
2. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3. CONTROLLING DIMENSION: MILLIMETER.
4. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
6. 751A-01 IS OBSOLETE, NEW STANDARD
751A-02.

-A14

0.25 (0.010)

-B-

7 PL

R X 45

SEATING
PLANE

D 14 PL
0.25 (0.010)

T B

DIM
A
B
C
D
F
G
J
K
M
P
R

Case 751B-03 D Suffix

16-Pin Plastic
SO-16

-A-

16

0.25 (0.010)

-B-

8 PL

R X 45
G

-T-

SEATING
PLANE

D 16 PL

0.25 (0.010)

T B

Case 751D-03 DW Suffix

20-Pin Plastic
SO-20 (WIDE)

11

10

-B-

0.25 (0.010)

R X 45
C

-T-

SEATING
PLANE

M
K

D 20 PL
M

T B

MILLIMETERS
MIN
MAX
9.80 10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0
7
5.80
6.20
0.25
0.50

INCHES
MIN
MAX
0.386 0.393
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0
7
0.229 0.244
0.010 0.019

10 PL

0.25 (0.010)

DIM
A
B
C
D
F
G
J
K
M
P
R

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. 751D-01, AND -02 OBSOLETE, NEW STANDARD
751D-03.

-A20

INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
7
0
0.229 0.244
0.010 0.019

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. 751B-01 IS OBSOLETE, NEW STANDARD
751B-03.

MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0
7
5.80
6.20
0.25
0.50

FAST AND LS TTL DATA

7-4

DIM
A
B
C
D
F
G
J
K
M
P
R

MILLIMETERS
MIN
MAX
12.65 12.95
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0
7
10.05 10.55
0.25
0.75

INCHES
MIN
MAX
0.499 0.510
0.292 0.299
0.093 0.104
0.014 0.019
0.020 0.035
0.050 BSC
0.010 0.012
0.004 0.009
0
7
0.395 0.415
0.010 0.029

PACKAGE OUTLINES
SOIC (continued)
Case 751E-03 DW Suffix
24-Pin Plastic
SO-24 (WIDE)

-A24

13

12

-B-

0.25 (0.010)

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. 751E-01 AND -02 OBSOLETE, NEW STANDARD
751E-03.

12 PL

G
R X 45
C

-T-

D 24 PL
0.25 (0.010)

SEATING
PLANE

T B

FAST AND LS TTL DATA

7-5

DIM
A
B
C
D
F
G
J
K
M
P
R

MILLIMETERS
MIN
MAX
15.25 15.54
7.40
7.60
2.35
2.65
0.35
0.49
0.41
0.90
1.27 BSC
0.229 0.317
0.127 0.292
0
8
10.05 10.55
0.25
0.75

INCHES
MIN
MAX
0.601 0.612
0.292 0.299
0.093 0.104
0.014 0.019
0.016 0.035
0.050 BSC
0.0090 0.0125
0.0050 0.0115
0
8
0.395 0.415
0.010 0.029

PACKAGE OUTLINES
CERAMIC DUAL IN-LINE
Case 632-08 J Suffix
14-Pin Ceramic Dual In-Line
-A14

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
THE LEAD ENTERS THE CERAMIC BODY.
5. 632-01 THRU -07 OBSOLETE, NEW STANDARD
632-08.

-BC

-T-

SEATING
PLANE

N
J 14 PL

D 14 PL
0.25 (0.010)

T A

0.25 (0.010)

Case 620-09 J Suffix

16-Pin Ceramic Dual In-Line

-A16

-BL

-TK

SEATING
PLANE

E
F

J 16 PL

G
D 16 PL
0.25 (0.010)

0.25 (0.010)
M

T A

T B

DIM
A
B
C
D
F
G
J
K
L
M
N

MILLIMETERS
MIN
MAX
19.05 19.94
7.11
6.23
5.08
3.94
0.50
0.39
1.65
1.40
2.54 BSC
0.38
0.21
4.31
3.18
7.62 BSC
15
0
0.51
1.01

INCHES
MIN
MAX
0.750 0.785
0.245 0.280
0.155 0.200
0.015 0.020
0.055 0.065
0.100 BSC
0.008 0.015
0.125 0.170
0.300 BSC
0
15
0.020 0.040

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
THE LEAD ENTERS THE CERAMIC BODY.
5. 620-01 THRU -08 OBSOLETE, NEW STANDARD
620-09.

DIM
A
B
C
D
E
F
G
J
K
L
M
N

MILLIMETERS
MIN
MAX
19.05 19.55
7.36
6.10
4.19

0.53
0.39
1.27 BSC
1.77
1.40
2.54 BSC
0.27
0.23
5.08

7.62 BSC
15
0
0.39
0.88

INCHES
MIN
MAX
0.750 0.770
0.240 0.290

0.165
0.015 0.021
0.050 BSC
0.055 0.070
0.100 BSC
0.009
0.011

0.200
0.300 BSC
0
15
0.015 0.035

Case 732-03 J Suffix

20-Pin Ceramic Dual In-Line

20

11

10

NOTES:
1. LEADS WITHIN 0.25 mm (0.010) DIA., TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIM L TO CENTER OF LEADS WHEN FORMED
PARALLEL.
3. DIM A AND B INCLUDES MENISCUS.

DIM
A
B
C
D
F
G
H
J
K
L
M
N

N
H

SEATING
PLANE

J
M

FAST AND LS TTL DATA

7-6

MILLIMETERS
MIN
MAX
23.88 25.15
6.60
7.49
3.81
5.08
0.38
0.56
1.40
1.65
2.54 BSC
0.51
1.27
0.20
0.30
3.18
4.06
7.62 BSC
15
0
1.02
0.25

INCHES
MIN
MAX
0.940 0.990
0.260 0.295
0.150 0.200
0.015 0.022
0.055 0.065
0.100 BSC
0.020 0.050
0.008 0.012
0.125 0.160
0.300 BSC
15
0
0.010 0.040

PACKAGE OUTLINES
CERAMIC DUAL IN-LINE (continued)
Case 758-01 J Suffix
24-Pin Ceramic Dual In-Line

24

13

12

NOTES:
1. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
2. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1973.

-A-

-T-

SEATING
PLANE

K
P

G
D 20 PL
0.25 (0.010)

T A

DIM
A
B
C
D
F
G
J
K
L
N
P

MILLIMETERS
MIN
MAX
31.50 32.64
7.24
7.75
3.68
4.44
0.38
0.53
1.14
1.57
2.54 BSC
0.20
0.33
2.54
4.19
7.62
7.87
0.51
1.27
9.14 10.16

INCHES
MIN
MAX
1.240 1.285
0.285 0.305
0.145 0.175
0.015 0.021
0.045 0.062
0.100 BSC
0.008 0.013
0.100 0.165
0.300 0.310
0.020 0.050
0.360 0.400

INSIDE OF LEADS

Case 623-05 J Suffix

24-Pin Ceramic Dual In-Line
(WIDE BODY)
24

NOTES:
1. DIM L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
2. LEADS WITHIN 0.13 mm (0.005) RADIUS OF
TRUE POSITION AT SEATING PLANE AT
MAXIMUM MATERIAL CONDITION. (WHEN
FORMED PARALLEL).

13

B
1

12
DIM
A
B
C
D
F
G
J
K
L
M
N

A
F

SEATING PLANE

L
N

MILLIMETERS
MIN
MAX
31.24 32.77
12.70 15.49
4.06
5.59
0.41
0.51
1.27
1.52
2.54 BSC
0.20
0.30
3.18
4.06
15.24 BSC
15
0
1.27
0.51

INCHES
MIN
MAX
1.230 1.290
0.500 0.610
0.160 0.220
0.016 0.020
0.050 0.060
0.100 BSC
0.008 0.012
0.125 0.160
0.600 BSC
15
0
0.020 0.050

Case 740-03 J Suffix

48-Pin Ceramic Dual In-Line
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIM L TO CENTER OF LEAD WHEN FORMED
PARALLEL.

-A48

25

-B1

DIM
A
B
C
D
E
F
G
J
K
L
M
N

24

N
C
K

-TSEATING
PLANE

E
F

D 48 PL
0.25 (0.010)

T A

J
0.25 (0.010)

FAST AND LS TTL DATA

7-7

T B

MILLIMETERS
MIN
MAX
60.36 61.56
14.64 15.34
3.05
4.31
0.381 0.533
1.27 BSC
0.762 1.397
2.54 BSC
0.204 0.330
2.54
4.19
15.24 BSC
0
10
1.016 1.524

INCHES
MIN
MAX
2.376 2.424
0.576 0.604
0.120 0.170
0.015 0.021
0.050 BSC
0.030 0.055
0.100 BSC
0.008 0.013
0.100 0.165
0.600 BSC
0
10
0.040 0.060

PACKAGE OUTLINES
PLASTIC
Case 646-06 N Suffix
14-Pin Plastic

14

NOTES:
1. LEADS WITHIN 0.13 mm (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
5. 646-05 OBSOLETE, NEW STANDARD 646-06.

NOTE 4

DIM
A
B
C
D
F
G
H
J
K
L
M
N

L
C
J

N
G

SEATING
PLANE

Case 648-08 N Suffix

16-Pin Plastic

DIM
A
B
C
D
F
G
H
J
K
L
M
S

S
-T-

SEATING
PLANE

H
G

D 16 PL
0.25 (0.010)

T A

Case 738-03 N Suffix

20-Pin Plastic

11

10

B
C

-T-

SEATING
PLANE

E
G

M
J 20 PL

F
D 20 PL
0.25 (0.010)

0.25 (0.010)
M

T A

FAST AND LS TTL DATA

7-8

MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
10
0.51
1.01

INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040 0.070
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0
10
0.020 0.040

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
5. 738-02 OBSOLETE, NEW STANDARD 738-03.

-A20

INCHES
MIN
MAX
0.715 0.770
0.240 0.260
0.145 0.185
0.015 0.021
0.040 0.070
0.100 BSC
0.052 0.095
0.008 0.015
0.115 0.135
0.300 BSC
0
10
0.015 0.039

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
5. ROUNDED CORNERS OPTIONAL.
6. 648-01 THRU -07 OBSOLETE, NEW STANDARD
648-08.

-A16

MILLIMETERS
MIN
MAX
18.16 19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
10
0
0.39
1.01

DIM
A
B
C
D
E
F
G
J
K
L
M
N

MILLIMETERS
MIN
MAX
25.66 27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
15
0
1.01
0.51

INCHES
MIN
MAX
1.010 1.070
0.240 0.260
0.150 0.180
0.015 0.022
0.050 BSC
0.050 0.070
0.100 BSC
0.008 0.015
0.110 0.140
0.300 BSC
15
0
0.020 0.040

PACKAGE OUTLINES
PLASTIC (continued)
Case 724-03 N Suffix
24-Pin Plastic
NOTES:
1. CHAMFERRED CONTOUR OPTIONAL.
2. DIM L TO CENTER OF LEADS WHEN FORMED
PARALLEL.
3. DIMENSIONS AND TOLERANCES PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.

-A24

13

12

-BL

C
-T-

SEATING
PLANE

NOTE 1

E
G

M
J 24 PL
0.25 (0.010)

F
D 24 PL
0.25 (0.010)

T A

T B

Case 649-03 N Suffix

24-Pin Plastic
Wide Body

DIM
A
B
C
D
E
F
G
J
K
L
M
N

24

B
1

DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
Q

12

H
F

N
K
D

SEATING
PLANE

INCHES
MIN
MAX
1.230 1.265
0.250 0.270
0.145 0.175
0.015 0.020
0.050 BSC
0.040 0.060
0.100 BSC
0.007 0.012
0.110 0.140
0.300 BSC
0
15
0.020 0.040

NOTES:
1. LEADS WITHIN 0.13 mm (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. 649-02 OBSOLETE, NEW STD 649-03 SEE ISSUE
C FOR REFERENCE.

13

MILLIMETERS
MIN
MAX
31.25
32.13
6.35
6.85
3.69
4.44
0.38
0.51
1.27 BSC
1.02
1.52
2.54 BSC
0.18
0.30
2.80
3.55
7.62 BSC
15
0
0.51
1.01

MILLIMETERS
MIN
MAX
31.50 32.13
13.21 13.72
4.70
5.21
0.38
0.51
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.30
2.92
3.43
14.99 15.49

10
1.02
0.51
0.38
0.13
0.76
0.51

INCHES
MIN
MAX
1.240 1.265
0.520 0.540
0.185 0.205
0.015 0.020
0.040 0.060
0.100 BSC
0.065 0.085
0.008 0.012
0.115 0.135
0.590 0.610

10
0.020 0.040
0.005 0.015
0.020 0.030

Case 711-03 N Suffix

40-Pin Plastic

40

NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 mm (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO SEATING
PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

21

B
1

20

C
N
J

SEATING
PLANE

FAST AND LS TTL DATA

7-9

DIM
A
B
C
D
F
G
H
J
K
L
M
N

MILLIMETERS
MIN
MAX
51.69 52.45
13.72 14.22
3.94
5.08
0.36
0.56
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.38
2.92
3.43
15.24 BSC
0
15
0.51
1.02

INCHES
MIN
MAX
2.035 2.065
0.540 0.560
0.155 0.200
0.014 0.022
0.040 0.060
0.100 BSC
0.065 0.085
0.008 0.015
0.115 0.135
0.600 BSC
0
15
0.020 0.040

PACKAGE OUTLINES
PLASTIC (continued)
Case 767-02 N Suffix
48-Pin Plastic
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
5. 767-01 OBSOLETE. NEW STANDARD 767-02.

-A48

25

-B1

TIP TAPER
DETAIL X

24

C
-TSEATING
PLANE

DETAIL X

48 PL

48 PL

0.25 (0.010)
0.51 (0.020)

T A

T B

FAST AND LS TTL DATA

7-10

DIM
A
B
C
D
F
G
H
J
K
L
M
N

MILLIMETERS
MIN
MAX
61.34 62.10
13.72 14.22
3.94
5.08
0.36
0.55
1.02
1.52
2.54 BSC
1.79 BSC
0.20
0.38
2.92
3.81
15.24 BSC
0
0
0.51
1.01

INCHES
MIN
MAX
2.415 2.445
0.540 0.560
0.155 0.200
0.014 0.022
0.040 0.060
0.100 BSC
0.070 BSC
0.008 0.015
0.115 0.150
0.600 BSC
0
0
0.020 0.040

PACKAGE OUTLINES
PLCC
Case 775-02 FN Suffix
20-Pin Plastic

0.18 (0.007)

Y BRK

-N-

T N

0.18 (0.007)

T N

L
P

-M-

-L-

Z1

20

-P-

G1
0.25 (0.010)

VIEW D-D
A

0.18 (0.007)

T L

0.18 (0.007)

T L

T N

-T-

SEATING
PLANE

DETAIL S
S

T L

T L
T N

0.18 (0.007)
0.18 (0.007)

M
M

T L
T N

DETAIL S

G1
0.25 (0.010)

DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
Z1

S
S

M
P

S
S

N
L

S
S

P
M

S
S

0.10 (0.004)
J

0.18 (0.007)
0.18 (0.007)

K1

E
G

MILLIMETERS
MIN
MAX
9.78 10.03
9.78 10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51

0.64

8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42

0.50
2
10
7.88
8.38
1.02

2
10

INCHES
MIN
MAX
0.385 0.395
0.385 0.395
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
0.026 0.032
0.020

0.025

0.350 0.356
0.350 0.356
0.042 0.048
0.042 0.048
0.042 0.056

0.020
2
10
0.310 0.330
0.040

2
10

NOTES:
1. DATUMS -L-, -M-, -N-, AND -P- DETERMINED
WHERE TOP OF LEAD SHOULDER EXIT PLASTIC
BODY AT MOLD PARTING LINE.
2. DIM GI, TRUE POSITION TO BE MEASURED AT
DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE MOLD PROTRUSION
IS 0.25 (0.010) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. 775-01 IS OBSOLETE, NEW STANDARD 775-02.

FAST AND LS TTL DATA

7-11

S
S

M
P

S
S

N
L

S
S

P
M

S
S

PACKAGE OUTLINES
PLCC (continued)
Case 776-02 FN Suffix
28-Pin Plastic

Y BRK

-N-

0.18 (0.007)

D
-L-

0.18 (0.007)

P
T N

S
S

-M-

28
LEADS
ACTUAL

28

T N

Z1

W
D

-P-

G1
0.25 (0.010)

V
X

T N

VIEW D-D
A

0.18 (0.007)

T L

0.18 (0.007)

T L

-T-

SEATING
PLANE

DETAIL S
T L

DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
Z1

0.18 (0.007)
0.18 (0.007)

DETAIL S

G1
S

M
M

T L
T N

S
S

M
P

S
S

N
L

S
S

P
M

S
S

0.10 (0.004)

0.25 (0.010)

0.18 (0.007)
0.18 (0.007)

K1

E
G

MILLIMETERS
MIN
MAX
12.32 12.57
12.32 12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51

0.64

11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42

0.50
2
10
10.42 10.92
1.02

2
10

INCHES
MIN
MAX
0.485 0.495
0.485 0.495
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
0.026 0.032
0.020

0.025

0.450 0.456
0.450 0.456
0.042 0.048
0.042 0.048
0.042 0.056

0.020
2
10
0.410 0.430
0.040

2
10

NOTES:
1. DUE TO SPACE LIMITATION, CASE 776-02 SHALL
BE REPRESENTED BY A GENERAL (SMALLER)
CASE OUTLINE DRAWING RATHER THAN
SHOWING ALL 28 LEADS.
2. DATUMS -L-, -M-, -N-, AND -P- DETERMINED
WHERE TOP OF LEAD SHOULDER EXIT PLASTIC
BODY AT MOLD PARTING LINE.
3. DIM G1, TRUE POSITION TO BE MEASURED AT
DATUM -T-, SEATING PLANE.
4. DIM R AND U DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE MOLD PROTRUSION
IS 0.25 (0.010) PER SIDE.
5. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
6. CONTROLLING DIMENSION: INCH.
7. 776-01 IS OBSOLETE, NEW STANDARD 776-02.

FAST AND LS TTL DATA

7-12

M
M

T L
T N

S
S

M
P

S
S

N
L

S
S

P
M

S
S

PACKAGE OUTLINES
PLCC (continued)
Case 779-02 FN Suffix
68-Pin Plastic

-N-

0.18 (0.007)

Y BRK
D

-L-

T N

0.18 (0.007)

P
T N

S
S

L
P

-M-

68
LEADS
ACTUAL

Z1

W
D

68

-P-

G1
0.25 (0.010)

V
X

T N

T L
T N

N
L

VIEW D-D
A

0.18 (0.007)

T L

0.18 (0.007)

T L

Z
H

0.18 (0.007)
0.18 (0.007)

M
M

M
P

S
S

P
M

S
S

K1

E
K

0.10 (0.004)
-T-

SEATING
PLANE

DETAIL S

DETAIL S

G1
0.25 (0.010)

T L

DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
Z1

0.18 (0.007)
0.18 (0.007)

MILLIMETERS
MIN
MAX
25.02 25.27
25.02 25.27
4.57
4.20
2.79
2.29
0.48
0.33
1.27 BSC
0.81
0.66

0.51

0.64
24.13 24.28
24.13 24.28
1.21
1.07
1.21
1.07
1.42
1.07
0.50

10
2
23.12 23.62
1.02

2
10

INCHES
MIN
MAX
0.985 0.995
0.985 0.995
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
0.026 0.032
0.020

0.025

0.950 0.956
0.950 0.956
0.042 0.048
0.042 0.048
0.042 0.056

0.020
2
10
0.910 0.930
0.040

2
10

NOTES:
1. DUE TO SPACE LIMITATION, CASE
779-02 SHALL BE REPRESENTED BY A
GENERAL (SMALLER) CASE OUTLINE
DRAWING RATHER THAN SHOWING
ALL 68 LEADS.
2. DATUMS -L-, -M-, -N-, AND -PDETERMINED WHERE TOP OF LEAD
SHOULDER EXIT PLASTIC BODY AT
MOLD PARTING LINE.
3. DIM G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING
PLANE.
4. DIM R AND U DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE MOLD
PROTRUSION IS 0.25 (0.010) PER SIDE.
5. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
6. CONTROLLING DIMENSION: INCH.
7. 779-01 IS OBSOLETE, NEW STANDARD
779-02.

FAST AND LS TTL DATA

7-13

M
M

T L
T N

S
S

M
P

S
S

N
L

S
S

P
M

S
S

FAST AND LS TTL DATA

7-14