SAFETY PRECAUTIONS

(Read these precautions before using this product.)

Before using this product, please read this manual and the relevant manuals carefully and pay full attention
to safety to handle the product correctly.
In this manual, the safety precautions are classified into two levels: "

WARNING" and "

CAUTION".

WARNING

Indicates that incorrect handling may cause hazardous conditions,

resulting in death or severe injury.

CAUTION

Indicates that incorrect handling may cause hazardous conditions,

resulting in minor or moderate injury or property damage.

Under some circumstances, failure to observe the precautions given under "

CAUTION" may lead to

serious consequences.
Make sure that the end users read this manual and then keep the manual in a safe place for future
reference.

[DESIGN PRECAUTIONS]
WARNING
Create a safety circuit outside the programmable controller to ensure the whole system will operate
safely even if an external power failure or a programmable controller failure occurs. Otherwise,
incorrect output or malfunction may cause an accident.
(1) When creating an emergency stop circuit, a protection circuit or an interlock circuit for
incompatible actions such as forward/reverse rotation or for damage prevention such as the
upper/lower limit setting in positioning, create it outside the programmable controller.
Install the emergency stop switch outsid the controlpanel so that workers can operate it easily.
(2) When the programmable controller detects the following error conditions, it stops the operation
and turn off all the outputs.
The overcurrent or overvoltage protector of the power supply module is activated.
The programmable controller CPU detects an error such as a watchdog timer error by the
self-diagnostics function.
In the case of an error undetectable by the programmable controller CPU, such as an I/O control
part error, all the outputs may turn on. In order to make all machines operate safely in such a
case, set up a fail-safe circuit or a specific mechanism outside the programmable controller. For
fail safe circuit example, refer to "OADING AND INSTALLATION" of this manual.
(3) Depending on the failure of the output module's relay or transistor, the output status may remain
ON or OFF incorrectly. For output signals that may lead to a serious accident, create an external
monitoring circuit.

A-1

[DESIGN PRECAUTIONS]
WARNING
If load current more than the rating or overcurrent due to a short circuit in the load has flowed in the
output module for a long time, it may cause a fire and smoke. Provide an external safety device such
as a fuse.
Design a circuit so that the external power will be supplied after power-up of the programmable
controller.
Activating the external power supply prior to the programmable controller may result in an accident
due to incorrect output or malfunction.
For the operation status of each station at a communication error in data link, refer to the respective
data link manual.
Otherwise, incorrect output or malfunction may cause an accident.
When controlling a running programmable controller (data modification) by connecting a peripheral
device to the CPU module or a PC to a special function module, create an interlock circuit on
sequence programs so that the whole system functions safely all the time.
Also, before performing any other controls (e.g. program modification, operating status change
(status control)), read the manual carefully and ensure the safety.
In these controls, especially the one from an external device to a programmable controller in a
remote location, some programmable controller side problem may not be resolved immediately due
to failure of data communications.
To prevent this, create an interlock circuit on sequence programs and establish corrective
procedures for communication failure between the external device and the programmable controller
CPU.
When setting up the system, do not allow any empty slot on the base unit.
If any slot is left empty, be sure to use a blank cover (A1SG60) or a dummy module (A1SG62) for it.
When using the extension base unit, A1S52B(S1), A1S55B(S1) or A1S58B(S1), attach the included
dustproof cover to the module in slot 0.
Otherwise, internal parts of the module may be flied in the short circuit test or when an overcurrent or
overvoltage is accidentally applied to the external I/O section.

CAUTION
Do not install the control lines or communication cables together with the main circuit or power lines,
or bring them close to each other.
Keep a distance of 100mm (3.94inch) or more between them.
Failure to do so may cause malfunctions due to noise.
If having read register R outside the allowable range with the MOV instruction, the file register data
will be FFFFH. Using this as it is may cause malfunctions.Pay attention not to use any out-of-range
file register when designing sequence programs.For instruction details, refer to the programming
manual.
When an output module is used to control the lamp load, heater, solenoid valve, etc., a large current
(ten times larger than the normal one) may flow at the time that the output status changes from OFF
to ON. Take some preventive measures such as replacing the output module with the one of a
suitable current rating.
Time from when the CPU module is powered on or is reset to when it enters in RUN status depends
on the system configuration, parameter settings, and program size.
Design the program so that the entire system will always operate safely, regardless of the time.
A-2

[INSTALLATION PRECAUTIONS]
CAUTION
Use the programmable controller under the environment specified in the user's manual.
Otherwise, it may cause electric shocks, fires, malfunctions, product deterioration or damage.
Install the module after inserting the pegs on the bottom of the module securely into the base unit
peg holes.
Not doing so could cause a malfunction, failure or fall.
Tightening the screw excessively may damage the screw and/or the module, resulting in a drop of
the module, a short circuit or malfunctions.
Connect the extension cable to the connector of the base unit or module.
Check for incomplete connection after installing it.
Poor electrical contact may cause incorrect inputs and/or outputs.
Insert the memory card and fully press it to the memory card connector.
Check for incomplete connection after installing it.
Poor electrical contact may cause malfunctions.
Be sure to shut off all the phases of the external power supply used by the system before mounting
or removing the module.
Failure to do so may damage the module.
Do not directly touch the conductive part or electronic components of the module.
Doing so may cause malfunctions or a failure of the module.

A-3

[WIRING PRECAUTIONS]
WARNING
Be sure to shut off all phases of the external power supply used by the system before wiring.
Failure to do so may result in an electric shock or damage of the product.
Before energizing and operating the system after wiring, be sure to attach the terminal cover
supplied with the product.
Failure to do so may cause an electric shock.

CAUTION
Always ground the FG and LG terminals to the protective ground conductor.
Failure to do so may cause an electric shock or malfunctions.
Wire the module correctly after confirming the rated voltage and terminal layout.
Connecting a power supply of a different voltage rating or incorrect wiring may cause a fire or failure.
Do not connect multiple power supply modules to one module in parallel.
The power supply modules may be heated, resulting in a fire or failure.
Press, crimp or properly solder the connector for external connection with the specified tool.
Incomplete connection may cause a short circuit, fire or malfunctions.
Tighten terminal screws within the specified torque range.
If the screw is too loose, it may cause a short circuit, fire or malfunctions.
If too tight, it may damage the screw and/or the module, resulting in a short circuit or malfunctions.
Carefully prevent foreign matter such as dust or wire chips from entering the module.
Failure to do so may cause a fire, failure or malfunctions.
Install our programmable controller in a control panel for use.
Wire the main power supply to the power supply module installed in a control panel through a
distribution terminal block.
Furthermore, the wiring and replacement of a power supply module have to be performed by a
maintenance worker who acquainted with shock protection.
(For the wiring methods, refer to Section 19.7.)

A-4

[START AND MAINTENANCE PRECAUTIONS

WARNING
Do not touch any terminal during power distribution.
Doing so may cause an electric shock.
Correctly connect the battery connector.
Do not charge, disassemble, heat, short-circuit, solder, or throw the battery into the fire.
Incorrect battery handling may cause personal injuries or a fire due to exothermic heat, burst and/or
ignition.
Be sure to shut off all phases of the external power supply used by the system before cleaning or
retightening the terminal screws or module mounting screws.
Failure to do so may result in an electric shock.
If they are too loose, it may cause a short circuit or malfunctions.
Tightening the screw excessively may damage the screw and/or the module, resulting in a drop of
the module, a short circuit or malfunctions.

A-5

CAUTION
When performing online operations (especially, program modification, forced output or operating
status change) by connecting a peripheral device to the running CPU module, read the manual
carefully and ensure the safety.
Incorrect operation will cause mechanical damage or accidents.
Do not disassemble or modify each of modules.
Doing so may cause failure, malfunctions, personal injuries and/or a fire.
When using a wireless communication device such as a mobile phone, keep a distance of 25cm
(9.84inch) or more from the programmable controller in all directions.
Failure to do so may cause malfunctions.
Be sure to shut off all the phases of the external power supply used by the system before mounting
or removing the module.
Failure to do so may result in failure or malfunctions of the module.
Do not drop or apply any impact to the battery.
Doing so may damage the battery, resulting in electrolyte spillage inside the battery.
If any impact has been applied, discard the battery and never use it.
Do not install/remove the terminal block more than 50 times after the first use of the product.
(IEC 61131-2 compliant)
Before handling modules, touch a grounded metal object to discharge the static electricity from the
human body.
Failure to do so may cause failure or malfunctions of the module.

A-6

[DISPOSAL PRECAUTIONS]
CAUTION
When disposing of the product, treat it as an industrial waste.
When disposing of batteries, separate them from other wastes according to the local regulations.
(For details of the battery directive in EU member states, refer to Appendix 11.)

[TRANSPORTATION PRECAUTIONS]
CAUTION
When transporting lithium batteries, make sure to treat them based on the transportation regulations.
(Refer to Appendix 10 for details of the relevant models.)

A-7

CONDITIONS OF USE FOR THE PRODUCT

(1) Mitsubishi programmable controller ("the PRODUCT") shall be used in conditions;
i) where any problem, fault or failure occurring in the PRODUCT, if any, shall not lead to any major
or serious accident; and
ii) where the backup and fail-safe function are systematically or automatically provided outside of
the PRODUCT for the case of any problem, fault or failure occurring in the PRODUCT.
(2) The PRODUCT has been designed and manufactured for the purpose of being used in general
industries.
MITSUBISHI SHALL HAVE NO RESPONSIBILITY OR LIABILITY (INCLUDING, BUT NOT
LIMITED TO ANY AND ALL RESPONSIBILITY OR LIABILITY BASED ON CONTRACT,
WARRANTY, TORT, PRODUCT LIABILITY) FOR ANY INJURY OR DEATH TO PERSONS OR
LOSS OR DAMAGE TO PROPERTY CAUSED BY the PRODUCT THAT ARE OPERATED OR
USED IN APPLICATION NOT INTENDED OR EXCLUDED BY INSTRUCTIONS, PRECAUTIONS,
OR WARNING CONTAINED IN MITSUBISHI'S USER, INSTRUCTION AND/OR SAFETY
MANUALS, TECHNICAL BULLETINS AND GUIDELINES FOR the PRODUCT.
("Prohibited Application")
Prohibited Applications include, but not limited to, the use of the PRODUCT in;
Nuclear Power Plants and any other power plants operated by Power companies, and/or any
other cases in which the public could be affected if any problem or fault occurs in the PRODUCT.
Railway companies or Public service purposes, and/or any other cases in which establishment of
a special quality assurance system is required by the Purchaser or End User.
Aircraft or Aerospace, Medical applications, Train equipment, transport equipment such as
Elevator and Escalator, Incineration and Fuel devices, Vehicles, Manned transportation,
Equipment for Recreation and Amusement, and Safety devices, handling of Nuclear or
Hazardous Materials or Chemicals, Mining and Drilling, and/or other applications where there is a
significant risk of injury to the public or property.
Notwithstanding the above, restrictions Mitsubishi may in its sole discretion, authorize use of the
PRODUCT in one or more of the Prohibited Applications, provided that the usage of the PRODUCT
is limited only for the specific applications agreed to by Mitsubishi and provided further that no
special quality assurance or fail-safe, redundant or other safety features which exceed the general
specifications of the PRODUCTs are required. For details, please contact the Mitsubishi
representative in your region.

A-8

REVISIONS
*The manual number is noted at the lower left of the back cover.
Print Date

*Manual Number

Sep.1996

SH (NA)-3599-A

Feb,1999

SH(NA)-3599-B

Revision
First printing

Additional model
SW

-GPPW GPP Function Software Package for Windows

Addition
The contents of the function version B has been added.
Section 2.2, Section 7.2, Sections 8.2.1, 8.2.2, Section 19.8, Appendix 7, 8

Partial correction
Safety Precautions, Contents, Section 1.2, Section 3.3.1, Chapter 4, Section
5.3, Section 6.1, Section 8.10.1, Section 15.2, Section 16.1, Section 19.7.1,
Section 21.3.1, Appendix 1.6, Appendix 2
Dec., 2002

SH(NA)-3599-C

Equivalent to Japanese version D

Partial correction
SAFETY PRECAUTIONS, Section 3.1.2, Section 3.3.1, Section 3.3.2, Section
3.3.3, Section 8.2.1, Section 8.5, Section 12.1.5, Section 12.1.6, Chapter 13,
Section 14.3, Section 15.1, Section 15.3, Section 16.1, Section 16.2, Section
17.2, Section 17.3, Section 19.1, Section 22.3.2, Appendix 3
Dec., 2003

SH(NA)-3599-D

Additional model
A1SY42P

Addition
Appendix 9, 9.1, 9.2

Partial correction
Section 3.3.1, Section 14.3, Section 18.3, Section 19.4.1, Section 19.8, Section
20.1.4, Section 21.3
Oct., 2006

SH(NA)-3599-E

Partial correction
SAFETY PRECAUTIONS, Section 1.1, Section 1.2, Section 2.1, 3.1.1, Section
3.1.2, Section 3.3.1, Section 3.3.2, Chapter 4, Section 5.3, Section 7.1, Section
7.2, Section 8.1, Section 8.2.1, Section 8.3, Section 8.4.3, Section 8.6, Section
8.8, Section 8.9, Section 8.10.1, Section 9.3, Section 9.4, Section 10.1, Section
10.5, Section 10.6.3, Section 10.8, Section 12.1, Section 12.1.3, Section 12.1.5,
Section 12.4, Chapter 13, Section 14.2, Section 15.1, Section 15.3, Section
16.1.1, Section 16.2, Section 16.3, Section 17.1, Section 17.2, Section 17.3,
Section 17.5, Section 18.1, Section 18.2, Section 18.3, Section 19.1, Section
19.4.1, Section 19.4.2, Section 19.5, Section 19.6, Section 19.7, Section 19.7.1,
Section 19.7.2, 20, Section 20.2.4, Section 20.2.6, Section 21.2, Section 21.3,
Section 21.4, Section 21.5, Section 22.2.5, Section 22.2.6, Section 22.2.8,
Section 22.3.3, Section 22.5.2, Appendix 1.1, Appendix 1.6, Appendix 2,
Appendix 3, Appendix 4.1, Appendix 4.2, Appendix 5.1, Appendix 5.2,

Deletion
Section 14.2

Chapter change
Section 14.3

Section 14.2

A-9

Print Date

*Manual Number

Apr.,2007

SH(NA)-3599-F

Revision

Partial correction
Section 3.1.1, 3.3.1, 3.3.2, 17.1, 19.7.1, 19.7.2, 20.1.3, 20.2.7, 22.5.1, 22.5.2,
Appendix 2, Appendix 3, Appendix 6.3

Addition
Section 20.1.8
Sep.,2008

SH(NA)-3599-G

Partial correction
SAFETY PRECAUTIONS, Section 5.2, 5.4, 8.2, 8.2.1, 8.5, 9.2, 9.3, 10.1, 10.3.
10.4, 10.5, 10.6.1, 12.1, 12.1.1, 12.1.7, 12.2, 12.3, 12.4, Chapter 13, Section
15.1, 15.3, 16.1.1, 16.2, 19.1, 19.2, 19.3, 19.4.1, 19.4.2, 19.7.1, 19.8, 20.1,
20.1.2, 20.1.3, 20.2, 20.2.1, 20.2.2, 20.2.3, 20.2.4, 20.2.6, 20.2.7, Chapter 21,
Section 21.3.1, 21.3.2, 21.4, 21.5, 22.1, 22.2.2, 22.2.5, 22.3, 22.5.1, Appendix 2

Addition
Appendix 11, Appendix 11.1, Appendix 11.2
Aug.,2009

SH(NA)-3599-H

Partial correction
Section 15.1, 18.3, 18.6, Chapter 20, Section 21.3.1, 21.3.2, 22.3.3, 22.5.1,
Appendix 2, 3

Nov.,2009

SH(NA)-3599-I

Partial correction
SAFETY PRECAUTIONS, Section 3.3.1, 21.3.1

Addition
CONDITIONS OF USE FOR THE PRODUCT
Mar.,2010

SH(NA)-3599-J

Partial correction
SAFETY PRECAUTIONS, Section 3.3.1, 3.3.2, 19.1, 19.7.1, 21.2, 21.3.2,
22.3.7, Appendix 2

Jan., 2011

SH(NA)-3599-K

Partial correction
Section 3.2, Section 15.1, Section 19.1, Section 20.1.1, Section 20.1.8

Addition
Section 20.1.9

Japanese Manual Version SH-3587-N

This manual does not imply guarantee or implementation right for industrial ownership or implementation of other rights.
Mitsubishi Electric Corporation is not responsible for industrial ownership problems caused by use of the contents of this
manual.

1996 MITSUBISHI ELECTRIC CORPORATION

A - 10

Introduction
Thank you for purchasing the Mitsubishi programmable logic controller MELSEC-QnA series.
Before using your new PLC, please read this manual thoroughly to gain an understanding of its functions so
that you can use it properly.
Please forward a copy of this manual to the end user.

Table of Contents

ABOUT THIS MANUAL

1.1

About this Manual..........................................................................................................................1 - 1

1.2

Abbreviations and Generic Terms Used in this Manual ................................................................1 - 2

OVERVIEW

2.1

Features ........................................................................................................................................2 - 1

2.2

3.1

3.2
3.3

2 - 1 to 2 - 8

Additional Functions of Q2ASCPU................................................................................................2 - 5

2.2.1

1 - 1 to 1 - 2

Overview of added functions.................................................................................................2 - 7

SYSTEM CONFIGURATION

3 - 1 to 3 - 23

System Configuration ....................................................................................................................3 - 1

3.1.1

Equipment configuration in a stand-alone system ................................................................3 - 1

3.1.2

Configuration of peripheral devices capable of Q2ASCPU...................................................3 - 2

System Configuration Overview ....................................................................................................3 - 3

System Equipment ........................................................................................................................3 - 5
3.3.1

System equipment list ...........................................................................................................3 - 5

3.3.2

Precautions when configuring the system...........................................................................3 - 19

3.3.3

Q2ASCPU memory block diagram......................................................................................3 - 23

PERFORMANCE SPECIFICATIONS

4 - 1 to 4 - 3

I/O NUMBER ASSIGNMENT

5.1

I/O Numbers ..................................................................................................................................5 - 1

5.2

I/O Number Assignment Concept..................................................................................................5 - 2

5.3

I/O Assignment with GPP Function ...............................................................................................5 - 4

5.4

Example of I/O Number Assignment .............................................................................................5 - 9

DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES 6 - 1 to 6 - 5

6.1

Reading/Writing Data from/to the Q2ASCPU Using the FROM/TO Instruction ............................6 - 2

6.2

Reading/Writing Data from/to the Q2ASCPU Using Special Direct Devices.................................6 - 3

6.3

Processing for Data Communication Requests from a Special Function Module .........................6 - 5

AUTO REFRESH FUNCTION

7.1

For MELSECNET/MINI-S3............................................................................................................7 - 1

7.2

Auto Refresh Setting of CC-Link ...................................................................................................7 - 8

5 - 1 to 5 - 13

7 - 1 to 7 - 14

A - 11

DEBUGGING FUNCTION

8 - 1 to 8 - 64

8.1

Function List ..................................................................................................................................8 - 1

8.2

Monitor Function............................................................................................................................8 - 2
8.2.1

Monitoring condition setting ..................................................................................................8 - 2

8.2.2

Monitor test of local device (function version B or later) .....................................................8 - 12

8.3

Write During RUN........................................................................................................................8 - 15

8.4

Execution Time Measurement.....................................................................................................8 - 19

8.4.1

Program monitor list ............................................................................................................8 - 19

8.4.2

Interrupt program monitor list ..............................................................................................8 - 22

8.4.3

Scan time measurement .....................................................................................................8 - 23

8.5

Sampling Trace Function ............................................................................................................8 - 25

8.6

Status Latch Function..................................................................................................................8 - 35

8.7

Step Operation ............................................................................................................................8 - 41

8.7.1

Step execution ....................................................................................................................8 - 42

8.7.2

Partial execution..................................................................................................................8 - 44

8.7.3

Skip function........................................................................................................................8 - 47

8.8

Program Trace Function..............................................................................................................8 - 48

8.9

Simulation Function.....................................................................................................................8 - 57

8.10 Debugging by Several People.....................................................................................................8 - 61

8.10.1 Simultaneous monitoring by several people .......................................................................8 - 62
8.10.2 Simultaneous execution of write during RUN by several people ........................................8 - 63

MAINTENANCE FUNCTION

9 - 1 to 9 - 19

9.1

Function List ..................................................................................................................................9 - 1

9.2

Watchdog Timer ............................................................................................................................9 - 2

9.3

Self-diagnostics Function ..............................................................................................................9 - 4

9.3.1

Interruption due to error detection.........................................................................................9 - 8

9.3.2

LED inidcation due to an error ..............................................................................................9 - 8

9.3.3

Resetting error ......................................................................................................................9 - 9

9.4

Error History ................................................................................................................................9 - 10

9.5

System protect ............................................................................................................................9 - 11

9.6

Password Registration ................................................................................................................9 - 12

9.7

System Display............................................................................................................................9 - 14

9.8

LED indication .............................................................................................................................9 - 15

10

9.8.1

LED indication .....................................................................................................................9 - 15

9.8.2

Priority setting .....................................................................................................................9 - 17

OTHER FUNCTIONS

10 - 1 to 10 - 24

10.1 Function List ................................................................................................................................10 - 1

10.2 Constant Scan.............................................................................................................................10 - 2
10.3 Latch Function.............................................................................................................................10 - 5
10.4 Setting of the Output (Y) Status When Switching from STOP to RUN........................................10 - 7
10.5 Clock Function.............................................................................................................................10 - 8
10.6 Remote Operation .....................................................................................................................10 - 12
10.6.1 Remote RUN/STOP ..........................................................................................................10 - 12
10.6.2 Remote STEP-RUN ..........................................................................................................10 - 15
A - 12

10.6.3 Remote PAUSE ................................................................................................................10 - 16

10.6.4 Remote RESET.................................................................................................................10 - 18
10.6.5 Remote latch clear ............................................................................................................10 - 19
10.6.6 Relationship between remote operation and CPU module RUN/STOP key switch ..........10 - 20
10.7 Terminal Operation....................................................................................................................10 - 21
10.7.1 Operation for message display .........................................................................................10 - 21
10.7.2 Key input operation ...........................................................................................................10 - 22
10.8 Reading Module Access Time Intervals ....................................................................................10 - 23

11

COMMENTS THAT CAN BE STORED IN Q2ASCPU

11 - 1 to 11 - 8

11.1 Function List ................................................................................................................................11 - 1

11.2 PLC name ...................................................................................................................................11 - 2
11.3 Drive Title ....................................................................................................................................11 - 3
11.4 File Title.......................................................................................................................................11 - 4
11.5 Device Comment.........................................................................................................................11 - 5
11.6 Statements/Notes........................................................................................................................11 - 7
11.7 Initial Device Value Comment .....................................................................................................11 - 8

12

OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU12 - 1 to 12 - 28

12.1 Program Execution Types ...........................................................................................................12 - 1

12.1.1 Initial execution type programs ...........................................................................................12 - 4
12.1.2 Scan execution type program .............................................................................................12 - 7
12.1.3 Low-speed execution type program ....................................................................................12 - 9
12.1.4 Standby type program.......................................................................................................12 - 16
12.1.5 Initial processing ...............................................................................................................12 - 22
12.1.6 Refresh processing of I/O module.....................................................................................12 - 22
12.1.7 END processing ................................................................................................................12 - 23
12.2 Operation Processing of RUN, STOP, PAUSE, and STEP-RUN..............................................12 - 24
12.3 Operation Processing for Instantaneous Power Failure............................................................12 - 26
12.4 Data Clear Processing ..............................................................................................................12 - 27

13

PARAMETER LIST

13 - 1 to 13 - 10

14

SELECTING MEMORY CARD MODELS

14 - 1 to 14 - 4

14.1 Applications of Memory Cards ....................................................................................................14 - 2

14.2 Selecting Memory Card Capacity................................................................................................14 - 3

15

HARDWARE SPECIFICATIONS OF CPU MODULES

15 - 1 to 15 - 6

15.1 SPECIFICATIONS ......................................................................................................................15 - 1

15.2 Part Names .................................................................................................................................15 - 2
15.3 Relationship between Switch Operations and LEDs/LED Display ..............................................15 - 4

16

POWER SUPPLY MODULE

16 - 1 to 16 - 6

16.1 Specifications ..............................................................................................................................16 - 1

16.1.1 Power supply module specifications ...................................................................................16 - 1
A - 13

16.1.2 Power supply module selection...........................................................................................16 - 3

16.2 Precautions for Handling .............................................................................................................16 - 4
16.3 Part Names .................................................................................................................................16 - 5

17

BASE UNIT AND EXTENSION CABLE

17 - 1 to 17 - 9

17.1 Base Unit Specifications..............................................................................................................17 - 1

17.1.1 Main base unit for high-speed access (A1S38HB/A1S38HBEU)........................................17 - 2
17.2 Extension Cable Specification List ..............................................................................................17 - 3
17.3 Application Standards of Extension Base Unit (A1S52B(S1), A1S55B(S1), A1S58B(S1), A52B,
A55B, A58B)................................................................................................................................17 - 4
17.4 Handling Precautions ..................................................................................................................17 - 6
17.5 Part Names .................................................................................................................................17 - 7

18

MEMORY CARDS AND BATTERIES

18 - 1 to 18 - 9

18.1 Memory Card Specifications .......................................................................................................18 - 1

18.2 Handling Memory Cards..............................................................................................................18 - 3
18.3 Battery Specifications (CPU Module and Memory Card Batteries) .............................................18 - 4
18.4 Handling Precautions ..................................................................................................................18 - 5
18.5 Part Names of Memory Card.......................................................................................................18 - 6
18.6 Installing Batteries (CPU Module and Memory Card Batteries) ..................................................18 - 7
18.7 Installing/Removing A Memory Card...........................................................................................18 - 8

19

LOADING AND INSTALLATION

19 - 1 to 19 - 19

19.1 Fail-Safe Circuit Concept ............................................................................................................19 - 1

19.2 Installation Environment ..............................................................................................................19 - 6
19.3 Calculation of Heat Generated by the programmable controller .................................................19 - 7
19.4 Installing the Base Units..............................................................................................................19 - 9
19.4.1 Installation precautions .......................................................................................................19 - 9
19.4.2 Installation .........................................................................................................................19 - 10
19.5 Installation and Removal of Modules ........................................................................................19 - 11
19.6 Installation and Removal of the Dustproof Cover......................................................................19 - 13
19.7 Wiring ........................................................................................................................................19 - 15
19.7.1 Wiring instructions.............................................................................................................19 - 15
19.7.2 Wiring to module terminals................................................................................................19 - 18
19.8 Precautions When Connecting Uninterruptible Power Supply Module (UPS)...........................19 - 19

20

EMC AND LOW VOLTAGE DIRECTIVES

20 - 1 to 20 - 16

20.1 Requirements for Compliance with EMC Directives....................................................................20 - 1

20.1.1 EMC Directive related standards ........................................................................................20 - 1
20.1.2 Installation inside the control panel .....................................................................................20 - 3
20.1.3 Cables .................................................................................................................................20 - 4
20.1.4 Power supply module..........................................................................................................20 - 9
20.1.5 Base unit .............................................................................................................................20 - 9
20.1.6 Ferrite core........................................................................................................................20 - 10
20.1.7 Noise filter (power supply line filter) ..................................................................................20 - 11
20.1.8 Power line for external power supply terminal ..................................................................20 - 12
A - 14

20.1.9 Installation environment of the CC-Link/LT module and the AS-i module.........................20 - 12
20.2 Requirements for Compliance with Low Voltage Directives......................................................20 - 13
20.2.1 Standard applied for MELSEC-QnA series programmable controller ...............................20 - 13
20.2.2 Precautions when using the QnA series programmable controller ...................................20 - 13
20.2.3 Power supply.....................................................................................................................20 - 14
20.2.4 Control panel.....................................................................................................................20 - 15
20.2.5 Module installation ............................................................................................................20 - 16
20.2.6 Grounding .........................................................................................................................20 - 16
20.2.7 External wiring...................................................................................................................20 - 16

21

MAINTENANCE AND INSPECTION

21 - 1 to 21 - 16

21.1 Daily Inspection ...........................................................................................................................21 - 1

21.2 Periodic Inspection ......................................................................................................................21 - 2
21.3 Battery Replacement...................................................................................................................21 - 3
21.3.1 Battery life ...........................................................................................................................21 - 5
21.3.2 Battery replacement procedure.........................................................................................21 - 11
21.4 When Reoperating a programmable controller After Storing it with a Battery Unconnected.....21 - 15
21.5 When a programmable controller is Reoperated After Stored with the Battery Over the Battery Life
..................................................................................................................................................21 - 16

22

TROUBLESHOOTING

22 - 1 to 22 - 53

22.1 Fundamentals of Troubleshooting...............................................................................................22 - 1

22.2 Troubleshooting...........................................................................................................................22 - 2
22.2.1 Troubleshooting flowchart ...................................................................................................22 - 2
22.2.2 Flow for actions when the "POWER" LED is turned OFF ...................................................22 - 3
22.2.3 Flow for actions when the "RUN" LED is turned OFF .........................................................22 - 4
22.2.4 When the "RUN" LED is flashing ........................................................................................22 - 5
22.2.5 Flow for actions when the "ERROR LED" is turned ON/flashing ........................................22 - 6
22.2.6 When the "USER" LED is turned ON ..................................................................................22 - 7
22.2.7 Flow for actions when the "BAT.ARM" LED is turned ON...................................................22 - 7
22.2.8 Flow for actions when the output module's output load does not turn ON ..........................22 - 8
22.2.9 Flow for actions when the program cannot be written.........................................................22 - 9
22.2.10 Flow for actions when booting from a memory card is not possible..................................22 - 11
22.2.11 Flow chart used when the CPU module is not started up .................................................22 - 13
22.3 Error Code List ..........................................................................................................................22 - 15
22.3.1 Error Codes.......................................................................................................................22 - 16
22.3.2 Procedure to read an error code .......................................................................................22 - 16
22.3.3 Error code list (1000 to 1999)............................................................................................22 - 17
22.3.4 Error code list (2000 to 2999)............................................................................................22 - 22
22.3.5 Error code list (3000 to 3999)............................................................................................22 - 28
22.3.6 Error code list (4000 to 4999)............................................................................................22 - 32
22.3.7 Error code list (5000 to 5999)............................................................................................22 - 41
22.3.8 Error code list (6000 to 6999)............................................................................................22 - 42
22.3.9 Error code list (7000 to 10000)..........................................................................................22 - 44
22.3.10 Canceling of Errors ...........................................................................................................22 - 45
22.4 Resetting Errors ........................................................................................................................22 - 46
22.5 Fault Examples with I/O Modules..............................................................................................22 - 47
A - 15

22.5.1 Faults with the input circuit and the corrective actions......................................................22 - 47
22.5.2 Faults in the output circuit .................................................................................................22 - 49

APPENDICES
APPENDIX 1

App - 1 to App - 165

INSTRUCTION LIST ................................................................................................. App - 1

Appendix 1.1

Sequence Instructions ......................................................................................... App - 1

Appendix 1.2

Basic Instructions................................................................................................. App - 5

Appendix 1.3

Application Instructions ...................................................................................... App - 17

Appendix 1.4

Data Link Instructions ........................................................................................ App - 38

Appendix 1.5

PID Control Instructions ..................................................................................... App - 41

Appendix 1.6

Special Function Module Instructions ................................................................ App - 42

APPENDIX 2

Special Relay List ................................................................................................... App - 48

APPENDIX 3

Special Register List ............................................................................................... App - 72

APPENDIX 4

PRECAUTIONS FOR UTILIZING THE EXISTING MELSEC-A SERIES PROGRAM FOR

Q2ASCPU............................................................................................................. App - 110

Appendix 4.1

Instructions....................................................................................................... App - 110

Appendix 4.2

Device .............................................................................................................. App - 118

Appendix 4.3

Parameters ...................................................................................................... App - 120

Appendix 4.4

Timer and Interrupt Counter Operations .......................................................... App - 121

Appendix 4.5

Sequence Programs, Statements, Notes......................................................... App - 122

Appendix 4.6

Microcomputer programs ................................................................................. App - 124

Appendix 4.7

Comments........................................................................................................ App - 125

Appendix 4.8

Constant Scan Function, Error Check Function............................................... App - 126

Appendix 4.9

I/O control mode .............................................................................................. App - 127

Appendix 4.10 Data Link System............................................................................................. App - 128

Appendix 4.11 Index Register Processing ............................................................................... App - 129
Appendix 4.12 CHK Instruction, IX Instruction......................................................................... App - 130
Appendix 4.13 Accessing File Register R with Instructions ..................................................... App - 131
APPENDIX 5

ERROR CODES RETURNED TO THE REQUEST SOURCE IN GENERAL DATA

PROCESSING ...................................................................................................... App - 132

Appendix 5.1

Error Codes...................................................................................................... App - 132

Appendix 5.2

Error Contents of Error Codes Detected by the CPU Module (4000H to 4FFFH)
......................................................................................................................... App - 133

APPENDIX 6

EXTERNAL DIMENSIONS ................................................................................... App - 141

Appendix 6.1

Q2AS(H)CPU(S1) module ............................................................................... App - 141

Appendix 6.2

A1S61PN, A1S62PN and A1S63P power supply modules ............................. App - 142

Appendix 6.3

Main Base Unit................................................................................................. App - 143

Appendix 6.4

Extension Base Unit......................................................................................... App - 145

APPENDIX 7

USE OF LOCAL DEVICE FOR SUBROUTINE/INTERRUPT PROGRAM STORAGE FILE

(FUNCTION VERSION B OR LATER) ................................................................. App - 151

APPENDIX 8

NETWORK RELAY FROM ETHERNET MODULE

(FUNCTION VERSION B OR LATER) ................................................................. App - 155

APPENDIX 9

Q2AS(H)CPU(S1) PROCESSING TIME .............................................................. App - 158

Appendix 9.1

Overview of the Q2AS(H)CPU(S1) Scan Time................................................ App - 158

Appendix 9.2

Causes of Increasing Scan Time ..................................................................... App - 159

APPENDIX 10 TRANSPORTATION PRECAUTIONS .................................................................. App - 162

Appendix 10.1 Relevant Models .............................................................................................. App - 162

A - 16

Appendix 10.2 Transportation Guidelines................................................................................ App - 163

APPENDIX 11 Handling of Batteries and Devices with Built-in Batteries in EU Countries ........... App - 164
Appendix 11.1 Disposal precautions........................................................................................ App - 164
Appendix 11.2 Exportation precautions ................................................................................... App - 165

INDEX

Index - 1 to Index - 5

A - 17

ABOUT THIS MANUAL

The following are manuals related to this product.
Request for the manuals as needed according to the chart below.

RELATED MANUALS
Manual No.

Manual Name

(Type code)

QnACPU GUIDEBOOK
For the first-time user of QnACPU, describes steps on creating a program, writing the program in

IB-66606

the CPU module, and debugging. Describes usage of QnACPU features.

(13JF10)
(Sold separately)

QnACPU PROGRAMMING MANUAL (Fundamentals)

Describes programming methods, device names and program types that are necessary in program

IB-66614

creation.

(13JF46)
(Sold separately)

QnACPU Programming Manual (Common Instructions)

Describes how to use sequence instructions, basic instructions and application instructions.
(Sold separately)
QnACPU PROGRAMMING MANUAL (Special Functions)

SH-080810ENG
(13JW11)
IB-66616

Describes dedicated instructions used in special-function modules.

(Sold separately)
QnACPU PROGRAMMING MANUAL (AD57 Instructions)
Describes dedicated instructions used to control theA D57(S1)-type CRT controller module.
(Sold separately)
QCPU (Q mode)/QnACPU PROGRAMMLNG MANUAL (PID Control Instructions)
Describes dedicated instructions used for PID control in Q2ACPU(S1), Q3ACPU and Q4ACPU.
(Sold separately)

(13JF48)
IB-66617
(13JF49)
SH-080040
(13JF59)

QCPU (Q mode)/QnACPU PROGRAMMING MANUAL (SFC)

Describes system components, performance specifications, functions, programming debug going
and error codes of MELSAP

SH-080041
(13JF60)

(Sold separately)
AnS Module Type I/O User's Manual

IB-66541

Describes specification of AnS module as I/O module.

(Sold separately)
Type QnA/Q4AR MELSECNET/10 Network System Reference Manual

(13JE81)
IB-66620

Descrlbes MELSECNET/10 overview, specifications, part names and settings.

(Sold separately)
Type MELSECNET, MELSECNET/B Data Link System Reference Manual
Describes MELSECNET(II) and MELSECNET/B overview, specifications, part names and settings.
(Sold separately)

(13JF77)
IB-66350
(13JF70)

GX Developer Version 8 Operating Manual

Describes the online functions of GX Developer including the programming procedure, printing out
procedure, and debugging procedure.

SH-080373
(13JU41)

(Included with product)

Type SW2IVD-GPPQ GPP Software package OPERATING MANUAL (Offline)
Describes SW2IVD-GPPQ's offline functions such as program creation, printout method and file

IB-66774

maintenance.

(13J921)
(Included with product)

A - 18

Manual No.

Manual Name

(Type code)

Type SW2IVD-GPPQ GPP Software package OPERATING MANUAL (Online)

Describes SW2IVD-GPPQ's online functions such as monitoring and debugging methods.
(Included with product)

IB-66775
(13J922)

Type SW2IVD-GPPQ GPP Software package OPERATING MANUAL (SFC)

Describes MWLSAP-3 system components, performamce specifications, functions, system start-up

IB-66776

procedure, SFC program editing method, monitoring method, printout method and error messages.

(13J923)

(Included with product)

Type SW2IVD-GPPQ GPP Software package OPERATING MANUAL (Q6TEL)

IB-66777

Describes Q6TEL system configuration, operating methods, etc.

(Included with product)

A - 19

(13J924)

USER PRECAUTONS

PRECAUTIONS WHEN USING THE QNA SERIES

When using a CPU module, format the memory using a peripheral device.
For details of memory format, refer to the following manuals.
GX Developer Operating Manual
SW

IVD-GPPQ Software package Operating Manual (Online)

PRECAUTIONS FOR BATTERY

(1)

The operation after removal of a battery

After removing a battery of the CPU module, format the memory using a peripheral
device to start next operation. (Refer to Section 21.4)

(2)

The operation after excess of a battery life

After removing a battery of the CPU module due to its excess life, format the memory
using a peripheral device to start next operation. (Refer to Section 21.5)

A - 20

1.

ABOUT THIS MANUAL

ABOUT THIS MANUAL

1.1

About this Manual

This manual serves to explain the specifications and functions of the Q2ASCPU,
Q2ASCPU-S1, Q2ASHCPU and Q2ASHCPU-S1 (abbreviated as Q2ASCPU hereafter),
the specifications of other modules, and the maintenance required for smooth system
operation, to users of MELSEC-QnA series programmable controllers.
It is divided into the following three main parts:
(1) Sections 2 and 3 These sections give the general description and system
configuration for the Q2ASCPU.
Read them to learn the features of Q2ASCPU, and the modules
that can be used and points to note when configuring a system.
(2) Sections 4 to 15 These sections give the specifications and functions of
Q2ASCPU.
They describe each Q2ASCPU function to enable you to use the
Q2ASCPU effectively.
(3) Sections 16 to 18 These sections describe the specifications and handling of units/
modules other than the CPU module (power supply module, base
units, etc.)
Read them to learn how to handle the power supply module, base
units, memory cards, etc.
(4) Section 19 to 20 These section describes the loading and installation, EMC and
low voltage directives.
(5) Section 21 to 22 These sections describe all aspects of maintenance, from
installing the Q2ASCPU to daily inspections and troubleshooting.
Read them to learn how to install the Q2ASCPU so as to ensure
smooth operation, and how to carry out daily inspections and
corrective action in the event of trouble.

REMARK
This manual does not cover MELSECNET(II) data link systems, MELSECNET/B data
link systems, MELSECNET/10 networks, or the SFC function.
For details on each function, refer to the following manuals.
MELSECNET(II), MELSECNET/B Data Link
MELSECNET, MELSECNET/B Data Link System Reference Manual
MELSECNET/10 Network
MELSECNET/10 Network System Manual for QnA/Q4AR
SFC Function
QCPU (Q Mode)/QnACPU Programming Manual (SFC)

1-1

1.

ABOUT THIS MANUAL

1.2

Abbreviations and Generic Terms Used in this Manual

The following abbreviations and generic terms are used in this manual.
(1)

Q2ASCPU................................... Abbreviation for Q2ASCPU, Q2ASCPU-S1,

Q2ASHCPU, and Q2ASHCPU-S1 type CPU
modules.

(2)

Network module......................... Abbreviation of A1SJ71QLP21, and

A1SJ71QBR11 type MELSECNET/10 network
modules.

(3)

Ethernet module......................... Abbreviation of A1SJ71QE71N-B2 and

A1SJ71QE71N-B5T type Ethernet interface
modules.

(4)

Serial communication module.... Abbreviation of A1SJ71QC24(N),

A1SJ71QC24(N)-R2 type serial communication
module.

(5)

CC-Link.....................................

Abbreviation of Control & Communication Link

(6)

GPP function.............................

Abbreviations for the SW IVD-GPPQ type

GPP function software package, GX Developer.

(7)

Personal computer..................... IBM's PC/AT or completely compatible

computers.

(8)

Peripheral device capable ......... Generic term for a peripheral device capable of
of GPP functions
running the GPP function software, for example
an IBM PC/AT.

(9)

Q6PU......................................... Abbreviation for Q6PU programming unit.

(10) Peripheral device........................ Generic term for a device that is connected to a

QnACPU and can be used to operate it, for
example a personal computer or Q6PU.
(11) Built-in RAM............................... A RAM incorporated in the Q2AS CPU that
stores sequence programs and other data.
(12) Memory card.............................. Abbreviation for Q1MEMcard

type memory

(13) ACPU......................................... Generic term for a MELSEC-A series

programmable controller

1-2

2.

OVERVIEW

OVERVIEW

2.1

Features
Q2ASCPU has the following features.
(1)

Large memory capacity

(a) Q2AS(H)CPU-S1 has a program capacity of 60k steps, which means that 60k
steps can be used for a single program (Q2AS(H)CPU: 28k steps).
(b) The device memory capacity is 29k words and the user can change the number
of points as required.
For example, the default number of points for internal relays (M) is 8k points, but
this can be expanded up to 32k points.
(c) One memory card of a maximum of 2M bytes can be installed.
Memory cards are used to store programs, comments, statements, and file
registers.
(Programs can be stored in the CPU module itself, so a memory card is not
essential to run a CPU module.)

(2)

High-speed processing
(a) Higher operation processing speeds have been achieved for basic instructions
and application instructions.
A2USCPU(S1)

Q2ASHCPU(S1)

0.2 s

0.075 s

Application instructions 1.2 s

0.225 s

Basic instructions

(b) The access time for expansion data memory (file registers: R) has been
conformed with the internal devices of the Q2ASCPU (data registers: D, and link
registers: W).
(c) Reading/writing of the buffer memories of special function modules dedicated to
QnA (serial communication modules) have been realised processing speed-up
by six times compared to AnUCPU.
(The processing speed of the existing special function modules for ACPU use is
about the same as that when using AnUCPU.)
(d) A high-speed access base unit (A1S38HB/A1S38HBEU) is available to speed
up the processing time for accessing special function modules such as network
modules and serial communication modules that handle large quantities of data.
Simply by mounting the special function module on the high-speed access base
unit, the access processing speed is increased when the Q2ASCPU accesses
the special function module.

2-1

2.

OVERVIEW

(3)

Selection of program execution type that is appropriate for the control has been
realised.
There are four program execution types to be selected as follows.
(a) Initial execution type
This program type is executed once only when the Q2ASCPU is set to RUN.
(b) Scan execution type
This program type is run continually while the Q2ASCPU is in the RUN status.
This is equivalent to a conventional program that runs from step 0 to END
instruction.It is possible to create subroutine programs and interrupt programs
for this type of program.
(c) Low-speed execution type
This is a program type which is executed only during the surplus constant scan
time (process to preset the program execution time for constant scan time) or
during the set execution time of the low-speed execution program.
(d) Stand-by type
This type of program consists entirely of a subroutine program or interrupt
program.

(4)

The SFC language MELSAP3 has been supplied.

With enhancement of step attributes and SFC control instructions, MELSAP3 makes
SFC programming even easier.

(5)

A software development environment that improves program productivity has been

realized.
(a) In order to enable the design of structured programs, a file format has been
adopted for programs.
What would conventionally have been a single continuous program can now be
handled in a structured way as a number of files.
This allows for design work to be shared by several designers, and allows
management of programs in accordance with functions, processes, or
designers, etc.

2-2

2.

OVERVIEW

(b) The user can standardize and simplify programs by creating and using macro
instructions corresponding to functions.

(c) Devices can be used without restrictions.

1) Word device bit operations are possible.
2) Differential contacts can be used.
3) Buffer memories of special function modules can be accessed directly from a
program as devices.
4) The link data of network modules can be accessed directly from a program as
devices.
(d) Ease of operation for GPP function program editing has been improved.
1) Up to four programs, data, etc., can be edited simultaneously.
Programs and data can be cut and pasted between edited objects.
2) Ladder editing is possible while the ladder is displayed with comments.
3) Familiar operations can be performed with pull-down menus and dialog
boxes.
(e) The debugging function at start-up has been perfected.
1) Ladder modification while performing monitoring is possible.
2) Coil ON/OFF causes can be searched for.
3) The timing for monitoring can be set using a step number or device status,
allowing debugging to be conducted under the optimum conditions.
4) Devices for which index qualifications have been set can be monitored.
(f) The GPP function document creation function has been strengthened.
1) Since comments can now comprise 32 characters, they can be more detailed
than before.
2) Comments can now be set for all devices.
3) The statements and notes appended to programs can now be managed as
an integral part of the program, which makes program modifications and
utilization easier.
4) Printout data can be stored in a file.

2-3

2.

OVERVIEW

(g) A powerful array of support software packages is available for program creation.
1) Data conversion package
Comment data, device data, etc., which is created with spreadsheet software
and text editors available on the market, can be converted to files for GPP
function use.
Conversely, files created for GPP function use can be converted to data for
spreadsheets or text editors.
2) Macro/library package
The basic programs for accessing special function modules, and standard
programs for error detection, alarm processing, etc., have been brought
together as a package of macro and library data.
3) Ladder sequence linking package
This package is used to link multiple programs to make a single program.
This has an automatic allocation function that ensures that devices from each
program without duplicating in the created program.
4) CAD interface program
This package is used to handle sequence ladders, instruction lists, comment
data and SFC diagrams as CAD data and communicate these data to CAD
systems.

2-4

2.

OVERVIEW

2.2

Additional Functions of Q2ASCPU

New functions and instructions for special function module are added to the Q2ASCPU.
[Additional functions]
Variety of local devices................................................ Refer to Section 2.2.1 (1)
Monitor test of local device................................. Refer to Section 8.2.2
Use of local device at the subroutine/interrupt
program storage destination................................ Refer to Appendix 7
Auto refresh setting of CC-Link..................................... Refer to Section 2.2.1 (2),
Section 7.2.
MELSECNET/10 relay communication from the
Ethernet module (Network relay)................................... Refer to Section 2.2.1 (3),
Appendix 8.
Addition of AJ71QC24N-compatible commands
..................................................................................... Section 2.2.1 (4)
[Added instructions for special function module]
The following instructions have been added for function version "B" of the Q2ASCPU:
A1SJ61QBT11 control instructions ................................ 13
A1SD75 control instructions .......................................... 19
A1SJ71ID

-R4 control instructions .............................. 12

A1SJ71QE71 control instructions .................................. 10

Additional function/special function module instructions can be used for the Q2ASCPU
described function version B in the date column of the rating plate.
Check that function version B is described on the Q2ASCPU rating plate before using the
additional function/special function module instructions.
If your Q2ASCPU does not have indication of function version B, skip this item and the
description of additional functions.

When using additional function/special function module instructions of the Q2ASCPU, it is

necessary to match the GPP function model and the function version/version of the
applicable special function module. (Refer to Table 2.1.)

2-5

2.

OVERVIEW

Table 2.1 List of combination between Q2ASCPU and function version/version of special function module

QnACPU

SW0IVDGPPQ
SW1IVDGPPQ

SW2IVDGPPQ

A1SJ71QE7
1(B2), (B5)

A1SD75PS3

9707B and
later

9707B and
later

No
restriction

No
restriction

A1SJ71

A1SJ61QBT
11

A1SJ71QC2
4(N)(R2)

9707B and
later

No
restriction

BC and later

No
restriction

MELSECNET/10 relay
communication from Ethernet

A1SJ71QE71 control instruction

Module/package Name

Function version

ID

-R4

Condition
Version
Local device
monitor test
Local device switching of
subroutine/interrupt program

Auto refresh function of CC-Link

A1SJ61QBT11 control
instructions

A1SD75 control instructions

ID interface module
instructions

Compatibility with A1SJ71QC24N

commands

REMARK
1) Marks

, -,

and

in Table 2.1 indicate as follows:

: Essential for use of function and instruction

:

Irrelevant to function and instruction

: Required in the case of access to the QnACPU in other stations from
the peripheral device via Ethernet
: Not available on peripheral devices.

2) GX Developer supports functions of function version B.

2-6

2.

2.2.1

OVERVIEW

Overview of added functions

This section shows an overview of the added functions.
(1)

Variety of local device

(a) The device set as the local device at "Device" in Parameter can be monitored
and tested with a peripheral device.
This function allows checking and debug of the local device in the program
monitored with a peripheral device.
(b) The local device of the file where the subroutine program/interrupt program is
stored has made it possible to be used during execution of the subroutine
program/interrupt program.
For this function, even if an operation using the local device of the subroutine
program is carried out, the original local device cannot be overwritten. In
addition, even if an operation using the local device of the interrupt program, the
local device which is executed before starting up the interrupt program cannot be
overwritten.
(c) The following GPP function software packages are required to perform the
monitor test of the local device:
Personal computer
GX Developer, SW

(2)

IVD-GPPQ type GPP function software package

Auto Refresh Setting of CC-Link

(a) When setting auto refresh of the CC-Link on the peripheral function, cyclic
communication with other stations connected to the CC-Link can be
automatically performed according to the set auto refresh data.
Remote I/O station (Communication in ON/OFF data)
Remote device station (Communication in ON/OFF data and Word data)
Intelligent device station (Communication in ON/OFF data and Word data)
Local station/master station (Communication in ON/OFF data and Word data)
The auto refresh setting of the CC-Link allows communication with other stations
using the FROM/TO instruction without communicating with the master station of
the CC-Link.
(b) Auto refresh is available for up to 8 CC-Link modules for each unit of Q2ASCPU.
Communication for 9th CC-Link modules and more can be performed with the
CC-Link module using the FROM/TO instruction.
(c) The following GPP function software packages are required to perform the auto
refresh setting of the CC-Link:
Personal computer
GX Developer, SW IVD-GPPQ type GPP function software package
It is necessary to upgrade the master station local station module of CC-Link to
function version B or later.

2-7

2.

OVERVIEW

(3)

Netwotk relay from Ethernet module

(a) In the network system with mixture of Ethernet and MELSECNET/10, data can
be communicated with the Q2ASCPU of other stations via multiple Ethernets or
MELSECNET/10 modules.
(b) For the network relay from the Ethernet module, the function version of the
Ethernet module should be upgraded to "B" or later.

(4)

A1SJ71QC24N-compatible commands are possible.

(a) The following A1SJ71QC24N commands are available:
Multiple blocks batch read: Command "0406"
Multiple blocks batch write: Command "1406"
(b) Multiple blocks batch read/batch write is available with A1SJ71QC24N(-R2, R4).
Multiple blocks batch read/batch write is not available with A1SJ71QC24(-R2,
R4).
For commands of multiple blocks batch read/batch write, refer to the following
manual:
Corresponding Additional Explanation for A1SJ71QC24N [-R2/R4]

2-8

3.

SYSTEM CONFIGURATION

SYSTEM CONFIGURATION
This section describes the system configurations that can be used for a system centered
on a Q2ASCPU, cautions on configuring the system, and the system equipment.

3.1

System Configuration
The following shows the configuration of equipment and peripheral device when a
Q2ASCPU is used in a stand-alone system.

3.1.1

Equipment configuration in a stand-alone system

*1
Q1MEMMemory card
(optional)

Q2ASCPU

A1SC
NB
Extension cable
(building-block type)

A1S3 B/A1S38HB
Main base

A6BAT
Battery

A1S6 P(N) power supply

module
A1SX
input module
A1SY
output module
Special-function module

*2
A6 B extension base
(with power supply module)
A5 B extension base
(without power supply module)

A1SC
B
Extension cable

*2
A6 P power supply module
AX
input module
AY
output module
Special-function module

A1S6 B (S1) extension base

(with power-supply module)
A1S5 B (S1) extension base
(without power supply module)

A1S6 P(N) power supply

module
A1SX
input module
A1SY
output module
Special-function module

POINT

*1 Up to one memory card can be installed, if required.

SRAM and E2PROM memory cards allow file read/write when mounted on the
CPU module.
*2 When using an A1S5 B(S1), A5 B extension base unit, pay particular
attention to the power supply capacity of the main base unit.In the case of I/O
modules and the special function module with a high internal current
consumption, mounting on an A1S6 B(S1), A6 extension base unit is
recommended.
(Refer to Section 16.1 and Section 17.3 for details.)

3-1

3.

3.1.2

SYSTEM CONFIGURATION

Configuration of peripheral devices capable of Q2ASCPU

(To RS-422 interface)
Q2ASCPU

AC30R4-PUS cable
Q6PU
AC20R4-A8PU cable

programming unit

*2
RS-422 cable

RS-422

RS-232C
convertor

RS-232C cable

IBM-PC/AT-compatible
software package used:

*3

(Mounted to the
base unit)

A1SJ71QC24 serial
communication module

(To option board slot)

Option board

IC memory card

Dedicated cable
*1

(To RS-422 interface/RS-232C)*2

reader/writer

IBM-PC/AT-compatible
software package used:

RS-232C cable

*1

For details on the IC memory card reader/writer setting, refer to Operating Manual for the
peripheral device capable of GPP functions.

*2
*3

For connection to RS-422 interface, use the RS-422

/RS-232C converter.
When connecting the serial communication module and the peripheral devices capable of
GPP function, see User's Manual of the serial communication modules.

REMARK
1.
2.

For details on the system configuration for each peripheral device, refer to
the Operating Manual for each.
Q2ASCPU can connect a peripheral device capable of ACPU only when
accessing an ACPU in another station via a MELSECNET/10 or
MELSECNET data link. (However, Q2ASCPU cannot be accessed.) In
this case, set SW1 of system setting switch 2 on the CPU module ON.

3-2

3.

SYSTEM CONFIGURATION

3.2

System Configuration Overview

(a) Q2ASCPU, Q2ASHCPU system
[When the A1S6

B(S1), A1S5

B(S1) extension

[When the A6

B, A5

B extension base is used]

base is used]

The following shows an example that the 32-point

The following shows an example that the 16-point

module is installed to each slot.

module is installed to each slot.

System configuration

CPU module

Power supply
module

Main base
unit
(A1S38B)

Slot No.

00 20 40 60 80 A0 C0 E0
to

to

to

to

to

to

to

to

1F 3F 5F 7F 9F BF DF FF

Extension cable
Slot No.
1st extension
stage
1
2
3
4
5
6
7

Power supply
module

UNIT

1
2
3
4
5
6
7

10 11 12 13 14 15

100 120 140 160 180 1A0 1C0 1E0

to

to

to

to

to

Extension base unit (for A

Maximum number of

3rd extension stage

extension stages

to

N, A

A)

16 modules

I/O modules
Maximum number of

512 points

I/O points
Main base unit model

A1S32B, A1S33B, A1S35B, A1S38B, A1S38HB, A1S38HBEU

name

model name

to

1st extension stage

Maximum number of

Extension base unit

to

11F 13F 15F 17F 19F 1BF 1DF 1FF

A1S65B(S1), A1S68B(S1), A1S52B(S1),

A62B, A65B, A68B, A52B, A55B, A58B

A1S55B(S1), A1S58B(S1)

Extension cable

A1SC03B, A1SC07B, A1SC12B, A1SC30B,

model name

A1SC01B (right-side installation), A1SC60B

(1) Only one A6

B, A5

A1SC05NBA1SC07NBA1SC30NBA1SC50NB

B extension base can be used.(The second extension module cannot be used.)

(2) When the extension base A1S52B(S1), A1S55B(S1), A58B(S1) or A52B, A55B, A58B are used, the 5VDC
power is supplied from the power supply module of the main base unit.Before use, refer to Section 17.3 and
Precautions

examine if it can be used.

(3) Limit the length of extension cable to 6m (236inch) or shorter.
(4) When using the extension cable, do not install it with the main circuit cables, which has high voltage, large
current, or install them close together.
(1) Assign I/O numbers to the main base unit first, then to the extension base unit.
(2) Assign I/O numbers as if both main base unit and extension base unit have 8 slots each.When the A1S32B/

I/O number
assignment
(When I/O assignment is
not performed)

A1S33B/A1S35B for 2/3/5 slots are used as the main base unit, add 6/5/3 slots (96 points/80 points/48
points) and assign the extension base unit I/O numbers.
(3) 16 points are assigned to an empty slot.
(4) When A6

B or A5

B is used, be sure to set to a single extension level.If it is set to the number of skipped

stages, 16 points/slot are assigned to all of skipped stages 8 slots, and thus it does not work.
(5) Items (2) to (3) can be changed by the I/O assignment. (Refer to Section 5.3)

3-3

3.

SYSTEM CONFIGURATION

(b) Q2ASCPU-S1, Q2ASHCPU-S1 system

[When the A1S6

B(S1), A1S5

B(S1) extension

base is used]
The following shows an example that the 16-point
module is installed to each slot.

[When the A6

B, A5

B extension base is used]

The following shows an example that the 64-point

module is installed to each slot.

System configuration

CPU module

Power supply
module

Main base
unit
(A1S38B) 0

Slot No.

00 40 80 C0 100 140 180 1C0

to

to

to

to

to

to

to

to

3F 7F BF FF 13F 17F 1BF 1FF

Extension cable
Slot No.
1st extension
stage
1
2
3
4
5
6
7

Power supply
module

UNIT

1
2
3
4
5
6
7

10 11 12 13 14 15

200 240 280 2C0 300 340 380 3C0

to

to

to

to

to

Extension base unit (for A

Maximum number of

3rd extension stage

extension stages

to

to

to

23F 27F 2BF 2FF 33F 37F 3BF 3FF

N, A

A)

1st extension stage

Maximum number of
I/O modules

16 modules

Maximum number of

1024 points

I/O points
Main base unit model

A1S32B, A1S33B, A1S35B, A1S38B, A1S38HB, A1S38HBEU

name
Extension base unit
model name

A1S65B(S1), A1S68B(S1), A1S52B(S1),

A62B, A65B, A68B, A52B, A55B, A58B

A1S55B(S1), A1S58B(S1)

Extension cable

A1SC03B, A1SC07B, A1SC12B, A1SC30B,

model name

A1SC01B (right-side installation), A1SC60B

(1)Only one A6

B, A5

A1SC05NBA1SC07NBA1SC30NBA1SC50NB

B extension base can be used.(The second extension module cannot be used.)

(2) When the extension base A1S52B(S1), A1S55B(S1), A58B(S1) or A52B, A55B, A58B are used, the 5VDC
power is supplied from the power supply module of the main base unit.Before use, refer to Section 17.3 and
Precautions

examine if it can be used.

(3) Limit the length of extension cable to 6m (236inch) or shorter.
(4) When using the extension cable, do not install it with the main circuit cables, which has high voltage, large
current, or install them close together.
(1) Assign I/O numbers to the main base unit first, then to the extension base unit.
(2) Assign I/O numbers as if both main base unit and extension base unit have 8 slots each.When the A1S32B/

I/O number
assignment
(When I/O assignment is
not performed)

A1S33B/A1S35B for 2/3/5 slots are used as the main base unit, add 6/5/3 slots (96 points/80 points/48
points) and assign the extension base unit I/O numbers.
(3) 16 points are assigned to an empty slot.
(4)When A6

B or A5

B is used, be sure to set to a single extension level.If it is set to the number of skipped

stages, 16 points/slot are assigned to all of skipped stages 8 slots, and thus it does not work.
(5) Items (2) to (3) can be changed by the I/O assignment. (Refer to Section 5.3)

3-4

3.

SYSTEM CONFIGURATION

3.3

System Equipment

3.3.1

System equipment list

The following shows the system equipment (modules and peripheral devices) that can be
used in a Q2ASCPU system.
(1)

Product Name

CPU module

Memory card

For QnA module

Model Name

Number of Occupied
Points (points)
[I/O Assignment
Module Type]

Description

Current consumption
5VDC
(A)

24VDC
(A)

Q2ASCPU

Number of I/O points: 512, built-in RAM: 28k steps

0.3

Q2ASHCPU

Number of I/O points: 512, built-in RAM: 28k steps

0.7

Q2ASCPU-S1

Number of I/O points: 1024, built-in RAM: 60k steps

0.3

Q2ASHCPUS1

Number of I/O points: 1024, built-in RAM: 60k steps

0.7

Q1MEM-64S

SRAM, 64k bytes

Q1MEM-128S

SRAM, 128k bytes

Q1MEM-256S

SRAM, 256k bytes

Q1MEM-512S

SRAM, 512k bytes

Q1MEM-1MS

SRAM, 1M bytes

Q1MEM-2MS

SRAM, 2M bytes

Q1MEM-64SE SRAM, 32k bytes, E2PROM, 32k bytes

Q1MEM128SE

SRAM, 64k bytes, E2PROM, 64k bytes

Q1MEM256SE

SRAM, 128k bytes, E2PROM, 128k bytes

Q1MEM512SE

SRAM, 256k bytes, E2PROM, 256k bytes

Remark

Memory card
procured
separately.
Including
memory card
current
consumption.

Q1MEM-1MSE SRAM, 512k bytes, E2PROM, 512k bytes

Power supply
module

A1S61PN

5VDC, 5A

A1S62PN

5VDC, 3A/24VDC, 0.6A

A1S63P

5VDC, 5A

100/200VAC input

24VDC input

3-5

For power
supply slots of
main base and
extension base

3.

SYSTEM CONFIGURATION

Product Name

Input module

Model Name

Number of Occupied
Points (points)
[I/O Assignment
Module Type]

Description

Current consumption
5VDC
(A)

24VDC
(A)

A1SX10

16-point 100 to 120 VAC input module

16

(16 inputs)

0.05

A1SX10EU

16-point 100 to 120 VAC input module

16

(16 inputs)

0.05

A1SX20

16-point 200 to 240 VAC input module

16

(16 inputs)

0.05

A1SX20EU

16-point 200 to 240 VAC input module

16

(16 inputs)

0.05

A1SX30

16 points 12/24VDC, 12/24VAC input module

16

(16 inputs)

0.05

A1SX40

16 points 12/24VDC input module

16

(16 inputs)

0.05

A1SX40-S1

16 points 24VDC input module

16

(16 inputs)

0.05

A1SX40-S2

16 points 24VDC input module

16

(16 inputs)

0.05

A1SX41

32 points 12/24VDC input module

32

(32 inputs)

0.08

A1SX41-S1

32 points 24VDC input module

32

(32 inputs)

0.12

A1SX41-S2

32 points 24VDC input module

32

(32 inputs)

0.08

A1SX42

64-input 12/24VDC input module

64

(64 inputs)

0.09

A1SX42-S1

64 points 24VDC input module

64

(64 inputs)

0.16

A1SX42-S2

64 points 24VDC input module

64

(64 inputs)

0.09

A1SX71

32 points 5/12/24VDC input module

32

(32 inputs)

0.075

A1SX80

16 points 12/24VDC Sink/source input module

16

(16 inputs)

0.05

A1SX80-S1

16 points 24VDC Sink/source input module

16

(16 inputs)

0.05

A1SX80-S2

16 points 24VDC Sink/source input module

16

(16 inputs)

0.05

A1SX81

32 points 12/24VDC Sink/source input module

16

(16 inputs)

0.08

A1SX81-S2

32 points 24VDC Sink/source input module

32

(32 inputs)

0.08

A1SX82-S1

64 points 24VDC Sink/source input module

32

(32 inputs)

0.16

3-6

Remark

3.

SYSTEM CONFIGURATION

Product Name

Output module

Model Name

Number of Occupied
Points (points)
[I/O Assignment
Module Type]

Description

Current consumption
5VDC
(A)

24VDC
(A)

A1SY10

16-output relay contact output module (2A)

16

(16 outputs)

0.12

0.09

A1SY10EU

16-output relay contact output module (2A)

16

(16 outputs)

0.12

0.10

A1SY14EU

12-output relay contact output module (2A)

16

(16 outputs)

0.12

0.10

A1SY18A

8 points Relay contact output module (2A) for

independent contact

16

(16 outputs)

0.24

0.075

A1SY18AEU

8 points Relay contact output module (2A) for

independent contact

16

(16 outputs)

0.24

0.075

A1SY22

16 points triac output module (0.6A)

16

(16 outputs)

0.27

(200VAC)
0.002

A1SY28A

8 points triac output module (1A)

all points independent

16

(16 outputs)

0.13

A1SY40

16-output 12/24VDC transistor output module

(0.1A) sink type

16

(16 outputs)

0.27

0.008

A1SY40P

16-output 12/24VDC transistor output module

(0.1A) sink type

16

(16 outputs)

0.08

0.011

A1SY41

32-output 12/24VDC transistor output module

(0.1A) sink type

32

(32 outputs)

0.50

0.008

A1SY41P

32-output 12/24VDC transistor output module

(0.1A) sink type

32

(32 outputs)

0.14

0.012

A1SY42

64-output 12/24VDC transistor output module

(0.1A) sink type

64

(64 outputs)

0.93

0.008

A1SY50

16-output 12/24VDC transistor output module

(0.5A) sink type

16

(16 outputs)

0.12

0.06

A1SY60

16 points 24VDC transistor output module

(2A) sink type

16

(16 outputs)

0.12

0.015

A1SY60E

16 points 5/12/24VDC transistor output module

(2A) source type

16

(16 outputs)

0.20

0.01

A1SY68A

8 points 5/12/24/48VDC
transistor output module sink/source type
all points independent

16

(16 outputs)

0.11

A1SY71

32 points 5/12VDC transistor output module

(0.016A) sink type

32

(32 outputs)

0.40

0.15

A1SY80

16-output 12/24VDC transistor output module

(0.8A) source type

16

(16 outputs)

0.12

0.02

A1SY81

32-output 12/24VDC transistor output module

(0.1A) source type

32

(32 outputs)

0.50

0.008

A1SY82

64-output 12/24VDC transistor output module

(0.1A) source type

64

(64 outputs)

0.93

0.008

3-7

Remark

3.

SYSTEM CONFIGURATION

Product Name

Model Name

Number of Occupied
Points (points)
[I/O Assignment
Module Type]

Description

Current consumption
5VDC
(A)

24VDC
(A)

A1SH42

32 points 12/24VDC input module

32-output 12/24VDC transistor output module
(0.1A) sink type

32

(32 outputs)

0.50

0.008

A1SH42-S1

32 points 24VDC input module

32-output 12/24VDC transistor output module
(0.1A) sink type

32

(32 outputs)

0.50

0.008

A1SX48Y18

8 points 24VDC input module

8 points Relay contact output module (2A)

16

(16 outputs)

0.085

0.045

A1SX48Y58

8 points 24VDC input module

8-output 12/24VDC transistor output module (0.5A)

16

(16 outputs)

0.06

0.06

A1S42X

16/32/48/64 points
12/24VDC dynamic input module

Specified points

0.08

Dynamic output
A1S42Y
module

16/32/48/64 points
12/24VDC dynamic output module

Specified points

0.18

0.055

Blank cover

Dust-proof cover for unused slot

16

16 point, 32 point, 48 point, 64 point selectable

module

Specified points

I/O module

Dynamic input
module

A1SG60

Dummy module A1SG62

[Input

Set number of points

[Output

[Input

Set number of points

[Empty]

Set number of points

Pulse catch
module

A1SP60

Pulse input module with short pulse duration

(minimum pulse duration:0.5 ms) Input 16 points

16

(16 outputs)

0.055

Analog timer
module

A1ST60

Allows for different set timer value (0.1 to 1.0 s, 1 to

10 s, 10 to 60 s, 60 to 600 s) depending on volume
Analog timer 8 points

16

(16 outputs)

0.055

Interrupt
module

A1SI61

For interrupt program execution Interrupt module

(Interrupt input:16 points)

32

[Special 32 points]

0.057

A1SD61

32 bit signed binary

50 KPPS, 1 channel

32

[Special 32 points]

0.35

A1SD62

24 bit signed binary, 2 channels

100 KPPS,
Transistor output (sink type)

32

[Special 32 points]

0.1

24 bit signed binary, 2 channels

200 KPPS,
Transistor output (sink type)

32

[Special 32 points]

0.25

A1SD62D-S1

24 bit signed binary, 2 channels

200 KPPS,
Transistor output (sink type)

32

[Special 32 points]

0.27

A1SD62E

24 bit signed binary, 2 channels

100 KPPS,
Transistor output (source type)

32

[Special 32 points]

0.1

A1S64AD

4 to 20mA/0 to 10V
4 analog channels

32

[Special 32 points]

0.4

A1S68AD

4 to 20mA/0 to 10V
8 analog channels

32

[Special 32 points]

0.4

A1SD62D
High-speed
counter module

A/D converter
module

3-8

Remark

3.

SYSTEM CONFIGURATION

Product Name

D/A converter
module

Model Name

Number of Occupied
Points (points)
[I/O Assignment
Module Type]

Description

Current consumption
5VDC
(A)

24VDC
(A)

A1S62DA

4 to 20mA/0 to 10V
Analog output, 2 channels

32

[Special 32 points]

0.8

A1S68DAV

-10 to 10V input

Analog output, 8 channels

32

[Special 32 points]

0.65

A1S68DAI

4 to 20mA input
Analog output, 8 channels

32

[Special 32 points]

0.85

A1S63ADA

Analog input, Two channels Controllable simplified

loop,
Analog output. 1 channel

32

[Special 32 points]

0.8

A1S66ADA

Analog input, Four channels Controllable simplified

loop,
Analog output, 2 channels

64

(64 outputs)

0.21

0.16

A1S62RD3

For connecting Pt 100 (3-wire type)

Temperature input 2 channels

32

[Special 32 points]

0.49

For connecting Pt 100 (4-wire type)

Temperature input 2 channels

32

[Special 32 points]

0.39

A1S68TD

Temperature input 8 channels

32

[Special 32 points]

0.32

A1S62TCTTS2

Transistor output, temperature input

2 channels/module
PID control : ON/OFF pulse

32

[Special 32 points]

0.19

A1S62TCTTB
W-S2

Transistor output, temperature input

2 channels/module
PID control : ON/OFF pulse, heater wire breakage
detection function

32

[Special 32 points]

0.28

A1S62TCRTS2

Transistor output, platinum RTD(Resistance

Temperature Detector) input
2 channels/module
PID control : ON/OFF pulse

32

[Special 32 points]

0.19

A1S62TCRTB
W-S2

Transistor output, platinum RTD input

2 channels/module
PID control : ON/OFF pulse, heater wire breakage
detection function

32

[Special 32 points]

0.28

A1S64TCTTS1

Transistor output, temperature input

4 channels/module
PID control : ON/OFF pulse or 2- position control

32

[Special 32 points]

0.33

A1S64TCTTB
W-S1

Transistor output, temperature input

4 channels/module
PID control : ON/OFF pulse or 2- position control
Heater wire breakage detection function

32

[Special 32 points]

0.42

A1S64TCRTS1

Transistor output, temperature input

4 channels/module
PID control : ON/OFF pulse or 2- position control

32

[Special 32 points]

0.33

A1S64TCRTB
W-S1

Transistor output, temperature input

4 channels/module
PID control : ON/OFF pulse or 2- position control
Heater wire breakage detection function

32

[Special 32 points]

0.42

Analog I/O
module

Temperature
digital converter
A1S62RD4
module

Temperature
control module

3-9

Remark

3.

SYSTEM CONFIGURATION

Product Name

Model Name

Number of Occupied
Points (points)
[I/O Assignment
Module Type]

Description

24VDC
(A)

0.33
(0.19)*

32

A1S64TCTRT
BW

Transistor output, thermocouple input, or platinum

RTD input
[For standard control]
4channels/module
PID control: ON/OFF pulse or 2 positioning control
[For heating-cooling control]
2channels/module
PID control: ON/OFF pulse, wire breakage detection
function

32

[Special 32 points]

0.39
(0.25)*

A1SJ71QC24

Computer link function 300 to 19,200bps

RS-232C 1 channel, RS-422/485 1 channel

32

[Special 32 points]

0.24

32

[Special 32 points]

0.155

32

[Special 32 points]

Temperature
control module

A1SJ71QC24- Computer link & printer function

R2
RS-232C 2 channel 300 to 19,200bps
A1SJ71QC24
N
A1SJ71QC24
N1
A1SJ71QC24
N-R2
A1SJ71QC24
N1-R2
A1SJ71UC24-

[Special 32 points]

0.38

0.3
Computer link & printer function
RS-232C 2 channel 300 to 115,200bps

32

[Special 32 points]

0.3

[Special 32 points]

0.1

A1SJ71UC24- Computer link & printer function

RS-232C 1 channel
PRF*2

32

[Special 32 points]

0.1

A1SJ71UC24- Computer link function, multidrop link function

RS-422 / RS-485 1 channel
R4*2

32

[Special 32 points]

0.1

10 BASE-T

32

[Special 32 points]

0.69

10 BASE2

32

[Special 32 points]

0.66

10BASE5

32

[Special 32 points]

0.57

A1SJ71E71N3
-T*2
A1SJ71E71NB2*2
A1SJ71E71NB5*2

Remark

*:When the
temperature
conversion
function of
unused
channels are
not used in the
heating-cooling
control

0.35
Computer link function 300 to 115,200bps
RS-232C 1 channel, RS-422/485 1 channel

32

R2*2

Ethernet
interface
module

5VDC
(A)

Transistor output, thermocouple input, or platinum

RTD input
[For standard contro]
4 channels/module
PID control: ON/OFF pulse or 2 positioning control
[For heating-cooling control]
2 channels/module
PID control: ON/OFF pulse

A1S64TCTRT

Computer
link module

Current consumption

Computer link function RC-232C 1 channel

3 - 10

Dedicated to
QnACPU

3.

SYSTEM CONFIGURATION

Product Name

Ethernet
interface
module

Model Name

24VDC
(A)

[Special 32 points]

0.53

A1SJ71QE71N
10BASE5
-B5

32

[Special 32 points]

0.40

A1SJ71QE71N
10 BASE-T
3-T

32

[Special 32 points]

0.53

32

[Special 32 points]

0.4

48
First half
empty 16 points
Second half
special32 points

0.3

A1SD75P1-S3 For positioning control, Pulse chain output, One axis

32

[Special 32 points]

0.7

Used for positioning control Pulse output, 2 axes

(independent,
A1SD75P2-S3
dual-axis simultaneous, linear interpolation, circular
interpolation)

32

[Special 32 points]

0.7

Interpreter BASIC, Compiler BASIC.

RS-232C 2 channel.
RS-422/485 1 channel
1-axis positioning control, speed control and speedpositioning control,
analog voltage output for speed-positioning control (0
to

MELSECNET
(II)
data link
module

5VDC
(A)

32

A1SD70

ID
interface
module

Current consumption

A1SJ71QE71N
10 BASE2
-B2

Intelligent
communication A1SD51S*2
module

Positioning
module

Number of Occupied
Points (points)
[I/O Assignment
Module Type]

Description

10V)

Used for positioning control Pulse output, 3 axes

(independent,
32
A1SD75P3-S3
triple-axis simultaneous, dual-axis linear interpolation,
dual-axis circular interpolation)

[Special 32 points]

0.7

A1SD75M1

Used for positioning control, Digital output.

For MR-H-B/MR-J-B/MR-J2-B.

32

[Special 32 points]

0.7

A1SD75M2

Used for positioning control, Digital output.

For MR-H-B/MR-J-B/MR-J2-B.
(independent, dual-axis simultaneous, linear
interpolation, circular interpolation)

32

[Special 32 points]

0.7

A1SD75M3

Used for positioning control, Digital output.

For MR-H-B/MR-J-B/MR-J2-B.
(independent, triple-axis simultaneous, dual-axis
linear interpolation, dual-axis circular interpolation)

32

[Special 32 points]

0.7

A1SD35ID1

ID interface module
Connectable reader/writer unit: one

32

[Special 32 points]

0.25

0.17

A1SD35ID2

ID interface module
Connectable reader/writer units: two

32

[Special 32 points]

0.25

0.33

A1SJ71AP21*2

For MELSECNET(II) data link system master station

and local station

32

[Special 32 points]

0.33

For MELSECNET(II) data link system master station

and local station
(for G1-type optical fiber cable)

32

[Special 32 points]

0.33

For MELSECNET(II) data link system master station

and local station (for coaxial cable)

32

[Special 32 points]

0.8

A1SJ71AP21S3*2

A1SJ71AR21*2

3 - 11

Remark

Dedicated to
QnACPU
Maximum 4
modules can
be used for
one CPU
module.
(Refer to
Section 3.3.2)

* When
Differential
driver is
connected: 0.78

Maximum 2
modules can be
used for one
CPU module.
(Refer to
Section 3.3.2)

3.

SYSTEM CONFIGURATION

Product Name

MELSECNET/
B
data link
module

B/NET
interface
module

Model Name

Number of Occupied
Points (points)
[I/O Assignment
Module Type]

Description

A1SJ71AT21B For MELSECNET/B data link system master station

and local station

*2

32

For MELSECNET/B data link system remote I/O

A1SJ72T25B*1 station

A1SJ71B62S3

5VDC
(A)

24VDC
(A)

0.66

0.3

32

[Special 32 points]

0.08

For control station , master station , and local station

A1SJ71QLP21 of the MELSECNET/10 data link module system
(For SI type optical fiber cable, double loop)

32

[Special 32 points]

0.40

For control station , master station, and local station

A1SJ71QLP21
of the MELSECNET/10 data link module system
GE
(For GI type optical fiber cable, double loop)

32

[Special 32 points]

0.47

For control station , master station , and local station

A1SJ71QLP21 of the MELSECNET/10 data link module system
S
With external power supply function
(For SI type optical fiber cable, double loop)

48
First half
empty 16 points
Second half
special32 points

0.40

0.17

For control station , master station, and local station

A1SJ71QBR11 of the MELSECNET/10 data link module system
(For the single bus coaxial cable)

32

[Special 32 points]

0.80

For control station , master station, and local station

A1SJ71QLR21 of the MELSECNET/10 data link module system
(For the coaxial cable dual loop)

32

[Special 32 points]

1.14

For the master and local stations of the CC-Link data

CC-Link system
A1SJ61QBT11 link system
32
master module
(For the twisted pair shield cable only)

[Special 32 points]

0.40

I/O dedicated mode

For MELSECNET/MINI-S3 master station, 64 stations 32 (special 32 points)
maximum, Controls remote I/O with a total of 512 I/O
Expanded mode
points, and remote terminal
48 (special 48 points)

0.35

64

[Output 64 points]

0.115

0.09

MELSECNET/
10
data link
module

MELSECNET/
MI NI-S3
master module

A1SJ71PT32S3*1

Master module for B/NET

[Special 32 points]

Current consumption

MELSEC - I/O
LINK master
module

A1SJ51T64

For MELSECNET - I/O master station, 16 stations

maximum, Controls I/O LINK with a total of 128 I/O
points, and remote I/O module
If only a few remote I/O units are used, perform I/O
assignment with a peripheral device to decrease the
number of occupied I/O points to 16, 32, or 48.

S-LINK
interface
module

A1SJ71SL92N

Master module for S-LINK

I/O total 128 points

32

[Special 32 points]

0.20

AS-I interface
module

A1SJ71AS92

Master module for AS-I,

total I/O: 496 points

32

[Special 32 points]

0.15

Position
detection
module

A1S62LS

Absolute detection system

32

[Special 32 points]

0.55

PLC easier
monitoring
module

A1SS91

PC easier monitoring module

32

[Output 32 points]

0.08

3 - 12

Remark

Maximum 4
modules can be
used for one
CPU module.
(Refer to
Section 3.3.2)

3.

SYSTEM CONFIGURATION

Product Name

Model Name

Number of Occupied
Points (points)
[I/O Assignment
Module Type]

Description

Memory card
interface
module

A1SD59J-S2

Memory card interface module

Simulation
module

A6SIMX64Y64

I/O simulation module for connection to the main

base,Allows desk debugging without connecting I/O
64
module to the base module. Use an expansion cable
64
of the AnS series
between the main base of the
AnS series and the A6SIM-X64Y64.

PROFIBUS
Interface
Module

A1SJ71PB92D PROFIBUS-DPmaster module

32

A1SJ71PB96F PROFIBUS-FMSinterface module

A1SJ71DN91

DeviceNet
Interface
Module

MODBUS
Interface
Module

32

5VDC
(A)

24VDC
(A)

0.05

TYP. 0.3
(When all
points
"ON")

[Special 32 points]

0.56

32

[Special 32 points]

0.56

32

[Special 32 points]

0.24

A1SJ71UC24RS-232Ctype MODBUS interface module

R2-S2

32

[Special 32 points]

0.1

A1SJ71UC24RS-422/485type MODBUS interface module

R4-S2

32

[Special 32 points]

0.1

Device Net master module

*1
*2

[Special 32 points]

Current consumption

(64 inputs)
(64 outputs)

Discontinued model
This module can access devices within the device range of the AnACPU
(cannot access file register). (Refer to Section 3.3.2.)

3 - 13

Remark

Power
consumption
assumes
connection of
A1SD59J-MIF.

3.

SYSTEM CONFIGURATION

Product Name

Model Name

A985GOT

A975GOT

Number of Occupied
Points (points)
[I/O Assignment Module
Type]

Description

Current consumption
Remark

5VDC
(A)

24VDC
(A)

0.22 *

*When bus
connected

For RS-232C
connected only

0.22 *

*When bus
connected

For RS-422
connected only

0.12

*When bus
connected

Extension
connector
attached to one
on each side

Large-size graphic operation terminal

256 colors, TFT color, 800 600 dots, high intensity
Large-size graphic operation terminal
256 colors, TFT color, 640 480 dots, high intensity
Large-size graphic operation terminal
16 colors, TFT color, 640 480 dots, high intensity/

A970GOT

16 colors, TFT color, 640 480 dots, wide viewing

angle/
8 colors, STN color, 640 480 dots/
2 colors, STN monochrome, 640 480 dots

A960GOT

32

[Special 32 points]*

Large-size graphic operation terminal

2 colors, EL, 640 400 dots
Medium-size graphic operation terminal

A956GOT

8 colors, STN color, 320 240 dots/

STN monochrome, 320 240 dots/
256 colors, STN color, 320 240 dots

A956WGOT
Graphic
operation
terminal

Medium-size graphic operation terminal

256 colors, TFT color, 480 234 dots
Medium-size graphic operation terminal

A953GOT

8 colors, STN color, 320 240 dots/

STN monochrome, 320 240 dots/

256 colors, STN color, 320 240 dots
Medium-size graphic operation terminal

A951GOT

8 colors, STN color, 320 240 dots/

32

STN monochrome, 320 240 dots/

[Special 32 points]*

256 colors, STN color, 320 240 dots

Medium-size graphic operation terminal
A950GOT

8 colors, STN color, 320 240 dots/

STN monochrome, 320 240 dots/

256 colors, STN color, 320 240 dots
Large-size graphic operation terminal 8.4"

GT1565-VTBA

256/65536 colors, TFT color, 640 480 dots

(When installing a multi color display board, 65536
colors can be displayed.)
32

[Special 32 points]*

Large-size graphic operation terminal 10.4"

GT1575-VTBA

Main Base Unit

256/65536 colors, TFT color, 640 480 dots

(When installing a multi color display board, 65536
colors can be displayed.)

A1S32B

2 I/O modules can be installed.

A1S33B

3 I/O modules can be installed.

A1S35B

5 I/O modules can be installed.

A1S38B

8 I/O modules can be installed.

3 - 14

3.

SYSTEM CONFIGURATION

Product Name

Model Name

Number of Occupied
Points (points)
[I/O Assignment Module
Type]

Description

Current consumption
Remark

5VDC
(A)

24VDC
(A)

The power
supply module
is required.

For extension to
right side

Extension base
module
connecting
cable

A1S52B
2 I/O modules can be installed.
A1S52B-S1
A1S55B
5 I/O modules can be installed.
A1S55B-S1
Extension Base
Unit

A1S58B
8 I/O modules can be installed.

Does not take

power supply
module.
(Power supplied
from the main
base module).

A1S58B-S1
A1S65B
5 I/O modules can be installed.
A1S65B-S1
A1S68B
8 I/O modules can be installed.
A1S68B-S1

Extension
Cables

A1SC01B

Flat cable, 55 mm (2.17 inch) long

A1SC03B

330mm (118.11in) long

A1SCO7B

Extension base module connecting cable

A1SC12B

1200 mm (47.24 inch) long

A1SC30B

1200 mm (47.24 inch) long

A1SC60B

6000 mm (236.22 inch) long

A1SC05NB

450 mm (17.72 inch) long

A1SCO7NB

Extension base module connecting cable

A1SC30NB

1200 mm (47.24 inch) long

A1SC50NB

5000 mm (197.1 inch) long

3 - 15

Cable for A
and A A
extension
bases

3.

SYSTEM CONFIGURATION

Product Name

Model Name

Description

Applicable Model

Memory
A2SNMCAE2PROM
cassette
30KE

With 30k-step E2PROM (direct connection)

Direct writing to and reading from a peripheral device is

feasible.

Battery

A6BAT

IC-RAM memory backup

Installed in the Q2ASCPU, Q2ASHCPU, Q2ASCPU-S1,

Q2ASHCPU-S1 main module

A6TBXY36

For sink type input module and sink type output

module (standard type)

A6TBXY54

For sink type input module and sink type output

module (2 wire type)

A6TBX70

For sink type input module (3 wire type)

A1SX41(S1/S2), A1SX42(S1/S2), A1SH42(S1)

A6TBX36-E

For source-type input module (standard type)

A1SX71, A1SX82-S1, A1SX81(S2)

A6TBY36-E

For source-type output module (standard type)

A1SY81, A1SY82

A6TBX54-E

For source type input module (2 wire type)

A1SX71, A1SX82-S1, A1SX81(S2)

A6TBY54-E

For source type input module (2 wire type)

A1SY81, A1SY82

A6TBX70-E

For source type input module (3 wire type)

A1SX71, A1SX82-S1, A1SX81(S2)

AC05TB

0.5 m (1.64 ft.) long, for sink module

AC10TB

1 m (3.28 ft.) long, for sink module

AC20TB

2 m (6.56 ft.) long, for sink module

AC30TB

3 m (9.84 ft.) long, for sink module

AC50TB

5 m (16.4 ft.) long, for sink module

AC80TB

5 m (16.4 ft.) long, for sink module

AC100TB

10 m (32.8 ft.) long, for sink module

AC05TB-E

0.5 m (1.64 ft.) long, for source module

AC10TB-E

1 m (3.28 ft.) long, for source module

AC20TB-E

2 m (6.56 ft.) long, for source module

AC30TB-E

3 m (9.84 ft.) long, for source module

AC50TB-E

5 m (16.4 ft.) long, for source module

A6TE2-16SRN

For sink-type output module

AC06TE

0.6 m (1.97 ft.) long

AC10TE

0.6 m (1.97 ft.) long

AC30TE

3 m (9.84 ft.) long

AC50TE

5 m (16.4 ft.) long

AC100TE

10 m (32.8 ft.) long

A1STEC-S

Slim type terminal block cover for A1S I/O module

and special module

Connector/ terminal
block conversion
module

Cable for
connector/ terminal
block conversion
module

Relay terminal
module

Cable for relay

terminal module
connection

Terminal block
cover for A1S I/O
module and special
module

A1SX41(S1/S2), A1SX42(S1/S2), A1SY41, A1SY41P,

A1SY42, A1SY82, A1SH42(S1)

A6TBXY36
A6TBXY54
A6TBX70

A6TBX36-E
A6TBY36-E
A6TBX54-E
A6TBY54-E
A6TBX70-E

A1SY41, A1SY41P, A1SY42, A1SH42(S1)

A6TE2-16SRN

3 - 16

All terminal block connector type modules

3.

SYSTEM CONFIGURATION

Product Name

IDC terminal block

adapter

Terminal block
adapter

Model Name

Description

Applicable Model

A1S-TA32

IDC terminal block adapter for 32 points 0.5mm2

(AWG20)

A1S-TA32-3

IDC terminal block adapter for 32 points 0.3mm2

(AWG22)

A1S-TA32-7

IDC terminal block adapter for 32 points 0.75mm2

(AWG18)

A1S-TB32

For 32 points, conversion into Europe type terminal

block

A6C0N1

Soldering-type, straight out

A6C0N2

Solderless-type, straight out

A6C0N3

Press-fit type, flat cable

A6CON4

Soldering-type, straight/diagonal out

A6C0N1E

Soldering-type, straight out

A6C0N2E

Solderless-type, straight out

A6C0N3E

Press-fit type, flat cable

40-pin connector

3-pin D-sub
connector

A1SX41(S1/S2), A1SX71, A1SY41, A1SY41P, A1SY71

A1SX41(S1/S2), A1SX71, A1SY41, A1SY41P, A1SY71

Sink type (40p FCN)

Source type (37p D-sub)

REMARK
Toa Electric Industrial CO., LTD. provides I/O cables with connectors, which can
connect to 40-pin connector (A1SX41,A1SX42,A1SY41,A1SY41P,A1SY42, etc.) or
37-pin D-sub connector (A1SX81,A1SY81) of I/O modules.
Contact:
TOA ELECTRIC INDUSTRIAL CO., LTD.

3 - 17

3.

SYSTEM CONFIGURATION

(2)

Peripheral device
Product Name

Programming unit

Model Name

Remark

Q6PU

Connected to the CPU module by an RS-422 cable (AC30R4-PUS,

AC20R4-A8PU); for program writing and reading. (5VDC 0.4A)

AC30R4-PUS

Cable for connection between CPU module and Q6PU

3 m (9.84 ft.) long

AC20R4-A8PU

Cable for connection between CPU module and Q6PU

2m (78.74 in) long

RS-422 cable

3 - 18

3.

3.3.2

SYSTEM CONFIGURATION

Precautions when configuring the system

The following shows the hardware and software packages which can be used for
Q2ASCPU.
(1)

Hardware
(a) The number of modules that can be mounted is restricted depending on the
module type.
Applicable Module

For Q2ASCPU only

For AnSCPU

Remark

No limit

No limit

No limit

I/O module
Special function module

Including GOT-A900
Series
(Only when the bus

Intelligent special

No limit

function module

Total 6 modules

connection is used.),
and GOT1000 Series
(Only when the bus
connection is used.)

Interrupt module
Link module
Ethernet module

Only 1 module

Total 4
Ethernet module for

Total 2

for network,

network, total of 4 units

for data link use

Ethernet and
data link use

REMARK
The modules described above are categorized as follows.
1) I/O module:

Standard input modules and output modules

2) Special function module:

Special function modules that perform processing

in accordance with FROM/TO instructions from the
Q2ASCPU (for example: A1S64AD, A1S62DA,
etc.)

3) Intelligent special function

module:

Special function modules that can process not only

by executing FROM/TO instruction of Q2ASCPU
but also by accessing Q2ASCPU from special
function module (Example: A1SJ71UC24-R2,
A1SJ71QC24N, etc.)

4) Interrupt module:

Modules that issue interrupts to the Q2ASCPU

(A1SI61)

5) Link module:

Special function modules for MELSECNET II,

/B data links and MELSECNET/10 networks.
(Example: A1SJ71AP21, A1SJ71QLP21, etc.)

6) Ethernet module:

Dedicated Ethernet interface modules for

Q2ASCPU (A1SJ71QE71N-B2, A1SJ71QE71NB5)
3 - 19

3.

SYSTEM CONFIGURATION

(b) The following shows special function modules that cannot be used with
Q2ASCPU:
AJ71C23 (Host controller high-speed link module)
AD57-S2 (A6MD controller module)
AJ71C24 (Computer link module): Manufactured through February 1987.
Products manufactured in March 1987 or later,
and products marked "H" (corresponding to A3H
) can be used.
AD51 (Intelligent communication module)
: Manufactured thorugh March 1987.
Products manufactured in April 1987 or later,
and products marked "H" (corresponding to A3H
) can be used.
A7GT-BUS (Bus connection interface module for A77GOT and A870GOT):
Manufactured through January 1996.
Products manufactured in February 1996 or
later, and products marked "C" (corresponding to
A3H ) can be used.
AJ71LP21(G), AJ71BR11, AJ71LR21, A1SJ71LP21, A1SJ71BR11,
A1SJ71LR21 (MELSECNET/10 network modules)
(c) When using a special function module with Q2ASCPU, the device range to be
used is depending on models of special function modules.
Access range
Device range equivalent to the

Device range equivalent to the AnACPU*1

A3HCPU*1

A1SD51S, A1SJ71UC24-R2/PRF/R4,
Device

A1SJ71AP21(S3)*2, A1SJ71AR21*2,
AD51(S3), AJ71C24-S3,
AJ71P41

A1SJ71AT21B*2, AD51H(S3),
AD51FD-S3, AJ71C23-S3,
AJ71C24-S6/S8, AJ71UC24,
AJ71AP21(S3)*2, AJ71AR21*2,

A1SJ71E71N(3)-T,
A1SJ71E71N3-B5T/B2/B5,
AJ71E71(S3), AJ71E71N(3)-T,
AJ71E71N-B5T/B2/B5

Q2AS(H)

Q2AS(H)-S1

X/Y0 to
X/Y1FF

X/Y0 to
X/Y3FF

AJ71AT21B*2, AJ71ME81
I/O device (X/Y)

X/Y0 to X/Y7FF

X/Y0 to X/Y7FF

M0 to M2047

M0 to M8191

M0 to M8191

Link relay (B)

B0 to B3FF

B0 to BFFF

B0 to BFFF

Timer (T)

T0 to T255

T0 to T2047

T0 to T2047

Counter (C)

C0 to C255

C0 to C1023

C0 to C1023

Data register (D)

D0 to D1023

D0 to D6143

D0 to D6143

Link register (W)

W0 to W3FF

W0 to WFFF

W0 to WFFF

Annunciator (F)

F0 to F255

F0 to F2047

F0 to F2047

Internal relays (M, L, S) *3

*1
*2
*3

Reading/Writing of file registers, programs, etc. are not possible.

Only I/O devices (X/Y), link relay (B), and link register (W) are available.
Even when L or S is specified, the device becomes M.
(Example: Even when L10 is specified, the device becomes M10.)

3 - 20

3.

SYSTEM CONFIGURATION

(d) When a QnACPU is mounted on a main base unit for A1S38HB/A1S38HBEU

high-speed access, the Q2ASCPU can access special function modules,
intelligent special function modules and link modules to write/read at greater
speeds.
QnACPU cannot input/output to the I/O module at greater spped.
(e) The following shows how to connect graphic operation terminal units to a
Q2ASCPU.
Model

Connection Method

Accessible Device Range

Direct connection to CPU

GOT1000 series

Computer link connection

Access is available for all device ranges of Q2ASCPU.

CC-Link connection

(Refer to the GT Works2/GT Designer2 Reference Manual for

MELSECNET/10 connection

details.)

Bus connection
Direct connection to CPU
GOT-A900 series

Computer link connection

Access is available for all device ranges of Q2ASCPU.

CC-Link connection

(Refer to the GT Works2/GT Designer2 Reference Manual for

MELSECNET(II), /B, /10 connection details.)

Bus connection

(f)

The accessible range for an A1SJ71UC24 computer link module comprises the
CPU to which the A1SJ71UC24 is mounted (the host station) and the other
stations in the network to which the host station is connected.
It is not possible to access other stations in other networks by using the
MELSECNET/10 network system routing function.
The access range for an A1SJ71QC24N serial communication module is the
host station, other stations in the network connected to the host station, and
other stations in other networks accessed through up to 7 relay stations by using
the routing function.

(g) When accessing from intelligent communication module A1SD51S to other

station Q2ASCPU/QnACPU on the network, only Format 1 control table can be
used.Format 2 control table cannot be used.
Access to other network is not allowed on Format 1 control table.
(h) In Q2ASCPU, I/O assignment set with the parameter cannot be valid for
MELSECNET (II) and MELSECNET/B.When setting the I/O assignment for a
remote I/O station, build the remote I/O network with MELSECNET/10.

3 - 21

3.

SYSTEM CONFIGURATION

(2)

Software package
The following shows the system start-up software packages to create programs for
Q2ASCPU.
Software Package for System Start-up

Peripheral Device Capable of GPP Functions

Personal computer

GX Developer, SW

IVD-GPPQ

Set to the following PC CPU type using peripheral device.

PC CPU model

PC CPU model

Q2AS(H)CPU

Q2A

Q2AS(H)CPU-S1

Q2AS1

Apart from the above, the following software packages can be used.
CAD interface package

SW

IVD-CADQ

Data conversion package

SW

IVD-CNVQ

Macro/library package

SW

IVD-MSDQ

SW

IVD-MSPQ

SW

IVD-LNKQ

Ladder sequence linking package

REMARK
The following shows the peripheral devices and software packages that cannot be
used with Q2ASCPU:

A PUProgramming unit)
A6WU (ROM writer unit)
A6DU-B (Data access unit)
A6TEL (Modem interface unit)
A6GPP (Intelligent GPP)
A6HGP (Hand-held graphic programmer)
A6PHP (Plasma hand-held graphic programmer)
System start-up software package for ACPU

SW
-GPPA, SW
-SAP2
Utility software package for ACPU
SW

-GPPATEL, SW

SW

-FUNP, SW

-CADIF, SW
-TSAP2

3 - 22

-DRWA,

3.

3.3.3

SYSTEM CONFIGURATION

Q2ASCPU memory block diagram

The following block diagram shows the Q2ASCPU memory configuration.
from peripheral devices

CPU main module

Drive 0

Drive 1

Memory card RAM area

Drive 2

Memory card ROM area

Built-in RAM

PC memory

Error-history
storage memory

Device memory

Built-in RAM

: Memory that stores parameters, sequence programs, etc.

Error history storage : Memory that stores error history data

memory
Device memory

: Memory that stores device data

Memory card
(RAM, ROM area)

: Memory that stores the files, comments, etc., for parameters,

sequence programs, sampling traces, etc.

PLC memory

: Indicates all the memories of drives 0 through 2.

For file types stored in each memory, refer to "FireTypes & Storage Destinations of Files
Managed by QnACPU" in the QnACPU Programming Manual (Fundamentals).

3 - 23

4.

PERFORMANCE SPECIFICATIONS

PERFORMANCE SPECIFICATIONS
This section shows the performance specifications of the Q2ASCPU.
Model Name
Item

Remark
Q2ASCPU

Q2ASCPU-S1

Q2ASHCPU

Control method

Sequence program control method

I/O control mode

Refresh mode

Q2ASHCPU-S1

Direct input/output is allowed by

specifying direct input/output (DX
DY

).

Language dedicated to sequence control

Programming language
Relay symbol language, logic symbolic language, MELSAP-3 (SFC)
Processing speed (Sequence
instruction)

LD

0.2 s/step

0.075 s/step

MOV

0.6 s/step

0.225 s/step

Constant Scan
(Function that makes the scan time
constant)
Memory capacity

Program
capacity

Number of steps
Number of files

5ms to 2000ms (Possible to set in 5ms units)

Capacity of the installed memory card (Max. 2036k bytes)

Maximum 28k
step

Maximum 60k
step

Maximum 28k
step

Maximum 60k
step

28

60

28

60

Number of I/O device points

Number of I/O points

Possible to set in the parameters

The number of points usable in the

program

8192 points X/Y to 1FFF

512 points
X/Y0 to 1FF

1024 points
X/Y0 to 3FF

4-1

512 points
X/Y0 to 7FF

1024 points
X/Y0 to FFF

The number of accessible points to

actual I/O module

4.

PERFORMANCE SPECIFICATIONS

Model Name
Item

Remark
Q2ASCPU

Q2ASHCPU

Internal relay [M]

Default 8192 points M0 to 8191

Latch relay [L]

Default 8192 points L0 to 8191

Link relay [B]

Default 8192 points B0 to 1FFF

Q2ASHCPU-S1

Timer [T]

Default: 2048 points (T0 to T2047)

(Low-speed timers and high-speed timers sharing)
Set low-speed timers/high-speed timers switching with instructions.
Set low-speed/high-speed measurement units by parameter.
(Low-speed timers: 10ms to 1000ms, 10ms units, Default: 100ms)
(High-speed timers: 1ms to 100 ms, 1ms units, default: 10 ms)

Retentive timer [ST]

Default 0 points ST0 to 2047

(Low-speed timers and high-speed timers sharing)
Set Low-speed timers/high-speed timers switching with instructions.
Set low-speed/high-speed measurement units by parameter.
(Low-speed timers: 10ms to 1000ms, 10ms units, Default: 100ms)
(High-speed timers: 1ms to 100 ms, 1ms units, default: 10 ms)

Counter [C]

Device points

Q2ASCPU-S1

Normal counter Default 1024 points C0 to 1023

Interrupt counters Max. 48 points (Default: 0 point, Can be set by the
parameter.)

Data register [D]

Default 12288 points D0 to 12287

Link register [W]

Default 8192 points W0 to 1FFF

Annunciator [F]

Default 2048 points F0 to 2047

Edge relay [V]

Default 2048 points V0 to 2047

32768 points R0 to 32767
Up to 1042432 points can be used by block switching.

File register [R]

1042432 points ZR0 to 1042431
Block switching is not necessary.
Special link relay [SB]

Default 2048 points SB0 to 7FF

Special link register [SW]

Default 2048 points SW0 to 7FF

Step relay [S]

Index register [Z]

Possible to set the number of points

to be used by the parameter

8192 points S0 to 8191

16 points (Z0 to 15)

Pointer [P]

4096 points P0 to 4095

Possible to set Ranges for pointers in files and common pointers by the
parameter.

Interrupt pointer [I]

48 points I0 to 47
The fixed-cycle interval for system interrupt pointers I28 to I31 is set by
the parameter. (5ms to 1000ms, in 5ms units)

Special relay [SM]

2048 points SM0 to 2047

Special register [SD]

2048 points SD0 to 2047)

Function input [FX]

16 points (FX0 to F)

Function output [FY]

16 points (FY0 to F)

Function register [FD]

5 points (FD0 to 4)

Link direct device

Possible to set the number of points

to be used by the parameter

Devices that access link devices directly.

Dedicated to MELSECNET/10Designation format: J

4-2

The number of device points is fixed.

4.

PERFORMANCE SPECIFICATIONS

Model Name
Item

Remark
Q2ASCPU

Q2ASCPU-S1

Q2ASHCPU

Q2ASHCPU-S1

Devices that directly access the buffer memories of special function

modules.

Special function module direct device

Designation format: U
Latch (power failure compensation)
range

\G

L0 to L8191 (Default)
(Latch ranges can be set for B, F, V, T, ST, C, D, W devices.)
Possible to set in the parameters
Possible to setup one contact poin for each of RUN/PAUSE from X0 to
X1FFF.

Remote RUN/PAUSE contact

Year, month, day, hour, minute, second, day of the week (automatic
detection of the leap year)
Accuracy -1.7 to +4.9s (TYP. +1.7s)/d at 0

Clock Function

Accuracy -1.0 to +5.2s (TYP. +2.2s)/d at 25

Accuracy -7.3 to +2.5s (TYP. -1.9s)/d at 55
Allowable momentary power failure
period

Depends on the power supply modules

See Section Section 16.1.

5VDC internal current consumption*

0.3A

0.3A

0.7A

0.7A

Weight

0.5kg

0.5kg

0.5kg

0.5kg

External dimensions

130

54.5

110 (5.12

2.15

4.33)

REMARK
*

Indicates current consumption of the Q2ASCPU with function version

"B" (9707B).The following shows the current consumption values of theQ2ASCPU without the
function version:
Q2ASCPU, Q2ASCPU-S1

: 0.3A

Q2ASHCPU, Q2ASHCPU-S1

: 0.7A

4-3

5.

I/O NUMBER ASSIGNMENT

I/O NUMBER ASSIGNMENT

This section explains the method for I/O number assignment using the Q2ASCPU to
enable data communications with a I/O modules and a special function module.

5.1

I/O Numbers
The I/O number is used in the sequence program to input data from a input module and to
output data to an output module.
The I/O number is expressed as three-digit hexadecimal numbers.
The I/O numbers when all the I/O modules are occupied in 16 points are indicated below.

Concept of I/O numbers

REMARK
When programming with a peripheral device for GPP function, I/O numbers can be
input in 2 digits.
I/O numbers
Input with a peripheral device
X010
X10
Y020
Y20

5-1

5.

I/O NUMBER ASSIGNMENT

5.2

I/O Number Assignment Concept

When the programmable controller power is ON or the CPU module is reset, the I/O
assignment described below is performed.
In the sequence program, designate the I/O numbers assigned in accordance with the
following.
(1)

I/O numbers are sequentially assigned from left to right, taking slot 0 (The slot to the
right of the CPU module) of the main base unit to be "0".

(2)

The I/O modules and special function modules mounted to the main base unit occupy
the I/O numbers corresponding to the number of I/O points for each module.

(3)

16 points are assigned to the empty slots where no I/O module or special function
module is mounted.

(4)

If an extension base unit is connected, its assignment starts from the number
immediately after the number assigned to a main base unit.

5-2

I/O NUMBER ASSIGNMENT

(5)

I/O numbers are assigned assuming that every base unit has 8 slots.
If a 5-slot type base unit is used, an I/O number obtained by adding points equivalent
to 3 slots (48 points) to the final I/O number of the 5-slot base unit is assigned to the
next extension base unit.

Extension cable

CPU module

Main base

power supply
module

5.

20

30

40

50

60

70

to

to

to

to

to

to

2F

3F

4F

5F

6F

7F

00

10

to

to

0F

1F

I/O numbering direction

Extension base
8

10

11

12

13

14

80

90

A0

B0

C0

D0

E0

F0

to

to

to

to

to

to

to

to

8F

9F

AF

BF

CF

DF

EF

FF

15

*I/O numbers are allocated in the order of 1

2
4
3
Example above shows a case where all slots are 16 points modules

5-3

Allocate numbers for 8 slots

(Occupies three slots,slots
5 to 7, as vacant slots.)

5.

I/O NUMBER ASSIGNMENT

5.3

I/O Assignment with GPP Function

When using the Q2ASCPU, I/O modules and a special function module can be controlled
even if I/O assignment with GPP function is not performed.
I/O assignment with GPP function are valid in the following cases.

(1)

The purpose of I/O assignment with GPP function

(a) When using a base unit for 5 slots, set 0 point for 3 slots for efficient use of
number of I/O points.
(b) Reserve the points when changing a module to other than a 16-point module for
future system extension.
(c) The I/O assignment prevents the I/O numbers from changing if an I/O module or
special function module that occupies other than 16 points has to be removed
due to failure.
(d) The I/O assignment reduces the I/O number modification in a program since it
enables to match with the I/O numbers of the designed program and to change
the I/O numbers assigned to each module on the base unit per slot.

(2)

The concept of I/O assignment with GPP function

The following two methods are available for I/O assignment with GPP function.
1) Set the number of points for the empty slots on a main base unit and
extension base unit.(Points occupied by empty slot)
2) Set the I/O assignment per slot of main base unit or extenstion base unit to
each module type.(I/O assignment)
Parameter settings are used for both of these methods.If both 1) and 2) are set, the
setting of 2) takes priority.
(a) Setting points occupied by empty slot
Set the number of points for all slots that are empty on the base unit.
In the systems in which this setting is not made in the parameters, 16 points are
set for empty slots.
Make this setting in "8. Number of empty slots" on the "PLC system" screen in
the parameter mode.

5-4

I/O NUMBER ASSIGNMENT

0 point

0 point

0 point

Output 16 points

2
Input 16 points

Output 16 points

Input 16 points

CPU module

power supply
module

A1S35B

Input 16 points

The setting is made in units of 16 point within the range of 0 to 64.The default is 16 points.
Example: When the points occupied by empty slot is set to 0 points
Assign 0 point to three vacant slots
(worth 48 points) of A1S35B

X000 X010 X020 X030 X040

to
to
to
to
to
X00F X01F X02F X03F X04F

Output 16 points

Output 16 points

A1S65B
power supply
module

5.

X050 X060
to
to
X05F X06F

I/O number continue from the last

main base's I/O number.

(b) I/O assignment settings

Set the I/O assignment per slot of main base unit or extenstion base unit to each
module type.
Make this setting in the "I/O Assign" screen in the parameter mode.

5-5

5.

I/O NUMBER ASSIGNMENT

The setting details are as follows:

Item
Slot setting

Setting

Setting range

Set data for each slot.

(Not necessary to set all data).

Empty/input/output/special

Classification

Set the module type.

Number of points

Set the number of points for the module.

Start XY

Set the start number of XY devices of the module.

Model Name

Set the model name of the module.

Base specification
POWER SUPPLY
MODULE
Extension cable

Default value

0 to 64 points (in 16 point

No setting

units)
0 to 1FFF (in 16 point units)
Up to 16 characters

Set data for each base unit.

Up to 16 characters
Set the model name of the power supply module.
Set the model name of the extension cable.

No setting
Up to 16 characters

The items without settings are handled as follows:

Type and Points : In accordance with the loaded module.
Start XY

: The number following the total points obtained by adding the

number of points of the modules already set.
If there is any duplication, an error (SP.UNIT LAY ERROR) is
detected.

POINT

The power supply module names set in the base specification is only used for the
current capacity check in the PLC diagnostics mode and not used for a CPU
module. Therefore, even if they are not set, any problem does not occur.

5-6

5.

I/O NUMBER ASSIGNMENT

The CPU module performs the following processing when I/O assignment is set.
1) Any of the following assignment can be performed per slot of each base unit.
Assigned number of points
Special function

Empty slot

Input module

Output module

16

16

16

16

32

32

32

32

48

48

48

48

64

64

64

64

module

2) The slots for which I/O assignment has been performed with GPP function,
the I/O assignment setting takes priority regardless of the loaded module.
If a number of points fewer than the that of the loaded I/O module is set, the
actual number of points of the loaded I/O module is reduced.
For example, if the loaded module is a 32-point input module but I/O
assignment is set for a 16-point input module using GPP function, the latter
16 points for the input module cannot be used.
If a number of points is greater than the that of the loaded I/O module is
set, the number of points in excess of the actual number of points is
occupied with dummy points.
If the slot where an I/O module is loaded is set as a empty slot, the I/O
module will be unusable.
3) The slots for which I/Oassignment is not performed using GPP function are
assigned with the number of points of the loaded module.
4) The slots for which I/O assignment is not performed using GPP function are
assigned I/O numbers that are consecutive to those of modules for which I/O
assignment has been performed.
(3)

Precautions
(a) If there is a disparity between the I/O assignment made in the parameter settings
and the actually loaded I/O modules, the input and output is not normally
performed.
Loaded module

I/O assignment

Result

Input

Output

No input

Output

Input

No output

Input/Output

Special

CPU module error

Special

Input/Output

CPU module error

5-7

5.

I/O NUMBER ASSIGNMENT

(b) The I/O assignment of a slot to which a special function module is loaded has to
be the same setting with the module.Not doing so may cause an error.
1) A11VC....................................... Special: 16 points
2)

AI61 ..........................................

Special: 32 points

3)

AG62.........................................

Input: Set number of points

4)

Modules that occupy 2 slots......

Set "Empty, 16 points" and "Special, 32 points".

(c) When operating MELSECNET data link, perform I/O assignment as follows.
1) As for a master station, I/O assignment has to be performed for the master
station and all remote I/O stations.
I/O assignment of MELSECNET (II)/B to the remote I/O station is invalid.

2) As for a local station, perform I/O assignment only for the local station.
3) Assign the I/O for the I/O hybrid module (e.g. A42XY) as an output module.
(d) When the MELSECNET/10 network is established, assign the I/O only for the
host station (master station).
Since the I/O assignment of MELSECNET/10 to the remote I/O station is
irrelevant, the I/O assignment is not allowed.
For I/O assignment of MELSECNET/10 to the remote I/O station, use the I/O
assignment settings in the "Network param".
REMARK
As for the remote I/O station of MELSECNET (II)/B, I/O assignment settings in the
"Network param" is irrelevant, therefore, the I/O assignment is not allowed.

5-8

5.

I/O NUMBER ASSIGNMENT

5.4

Example of I/O Number Assignment

The following shows the example of I/O number assignment when I/O assignment is
performed using GPP function.
When changing the assignment for an empty slot from 16 points to 0 or 32 points
When the A1S35B is used, there are three empty slots. When setting the assignment
for these to 0 points in order to increase the number of I/O points that can be used by
the CPU module
When reserving 32 I/O points for a current empty slot to which a 32-point input
module is loaded later, in order to prevent the I/O number assignment change
To achieve these operations, perform I/O assignment as follows.
(a) Loading status and I/O numbers
A1S35B base unit

90

Output 16 points

Output 16 points

Input 16 points

Input 32 points

Input 32 points

CPU module

power supply
module

00

20

40

50

60

70

80

to

to

to

to

to

to

to

to

1F

3F

4F

5F

6F

7F

8F

9F

10

11

12

Slot

Output 32 points

Output 32 points

C0

Output 16 points

A0

Vacant

Output 32 points

48 points occupied
power supply
module

(1)

D0

E0

100

to

to

to

to

to

BF

CF

DF

FF

11F

A1S65B base unit

(b) I/O numbers when I/O assignment is performed using GPP function
1) I/O assignment example

The example of I/O assignment with GPP function

5-9

I/O NUMBER ASSIGNMENT

2) I/O numbers after performing I/O assignment using GPP functon

Input 32 points

Input 32 points

Input 16 points

Output 16 points

Output 16 points

Vacant 16 points

Vacant 16 points

Vacant 16 points

CPU module

Power supply module

A1S35B base unit

0S

0S

0S

32X 16X 32X 16Y 16S

points points points points points points points points

X00 X20 X30 X50

to

to

to

to

11

Slot number

Number of I/O points in

actual mounting status

Number of I/O points allocated

using GPP function

60
to

6F
(*3)

0
(*4)

12

Output 32 points

Vacant

32Y 32X

10

Output 32 points

Output 16 points

Output 32 points

X1F X2F X4F Y5F

(*1) (*2)
A1S65B base unit

Power supply module

5.

16Y 48Y 32Y

points points points points points

X70

90

Y8F

AF YBF YEF Y10F

(*5)
(*6)

to

*1
*2
*3
*4
*5
*6

to

YB0 YC0 YF0

to

to

to

Since 16 points is set, the latter 16 points of inputs cannot be used.

Since 32 points is set, the points from 40 to 4F is occupied with dummy points.
Since "Empty (S), 16 points" is set, the points cannot be used for outputs.
Since "Empty (S), 0 points" is set, the number of I/O points for the three slots are not lost.
Since "input (S), 32 points" is set, there are 32 input points.
Since 48 points are set, E0 to EF is occupied with dummy points.

5 - 10

I/O NUMBER ASSIGNMENT

Input 16 points

7
Output 16 points

Output 16 points

Output 16 points

Output 16 points

Input 16 points

CPU module

A1S38B

Input 16 points

Replacing a 16-point input module with a 32-point input module

When replacing the 16-point input module with a 32-point input module without
changing the all I/O number assignment in a system to which a 16-point input module
is designedTo achieve this operation, perform I/O assignment as follows.
(a) Loading status and I/O numbers before the replacement

Input 16 points

(2)

Power supply
module

5.

X00 X10 X20 X30 Y40 Y50 Y60 Y70

to
to to
to to to
to
to
X0F X1F X2F X3F Y4F Y5F Y6F Y7F

These I/O numbers are unchanged.

This module is replaced with 32-point module.
Change I/O numbers into X80-9F.

(b) I/O numbers when I/O assignment is performed using GPP function
1) I/O assignment example

The example of I/O assignment with GPP function

5 - 11

I/O NUMBER ASSIGNMENT

2) I/O numbers after performing I/O assignment using GPP function and
replacing the module

Output 16 points

Output 16 points

Output 16 points

Input 16 points

Output 16 points

Input 16 points

Input 32 points

CPU module

Input 16 points

A1S38B

power supply
module

5.

X00 X80 X20 X30 Y40 Y50 Y60 Y70

to to
to
to to
to to to
X0F X9F X2F X3F Y4F Y5F Y6F Y7F

POINT

When the I/O number set for "Start XY" in the "I/OAssign" is changed, also set the
"Start XY" for the next module to avoid changing the I/O numbers of the module
for which the change was made and the subsequent modules.
In the example above, since "20" is set for the "Start XY" for the second slot,
consecutive I/O numbers starting from X30 are set for slot 3 and later.

5 - 12

5.

I/O NUMBER ASSIGNMENT

(3)

When combining an input module and output module having non-consecutive I/O
numbers on a base unit
When controlling the machine

(I/O numbers X0 to X3F, Y40 to Y7F) and

machine (I/O numbers X200 to X23F and Y240 to X27F) with a single
programmable controller, it is desired to combine input modules and output modules
on the base unit.To achieve this operation, perform I/O assignment as follows.
(a) Loading status and I/O numbers to be set

(b) The example of I/O assignment with GPP function

5 - 13

6.

DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES

DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES

This chapter explains the methods for reading data from a special function module, and
writing data to a special function module with the Q2ASCPU.
The special function module is a module that allows analog quantity, high-speed pulse,
etc., which cannot be processed with I/O module alone, to be handled by the Q2ASCPU.
For example, analog quantity is converted to a digital value by an analog/digital converter
module (which is a special function module) so that they can be used by the Q2ASCPU.
The special function module has buffer memory in which data input from external sources
and data to be output to external destinations are stored.
The folloiwng two methods are available for reading data from a special function module,
and writing data to a special function module with the Q2ASCPU.
1) Using the FROM/TO instruction
2) Using special direct devices
These methods are explained in the following sections.

6-1

6.

DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES

6.1

Reading/Writing Data from/to the Q2ASCPU Using the FROM/TO Instruction

When the FROM/TO instruction is performed, data stored in the buffer memory of a
special function module is read, or data is written to the buffer memory of a special
function module.

Data communications with a special function module

When the FROM instruction is performed, the data read from the buffer memory is stored
in the specified device. When the TO instruction is performed, the data in the specified
device is written to the buffer memory.

REMARK
1) For details on the FROM/TO instructions, refer to the QCPU (Q mode)/
QnACPU Programming Manual (Common Instructions).
2) For details on the buffer memory of a special function module, refer to the
manual of the special function module in use.
POINT

When executing the FROM/TO instruction for the special function module
frequently in short scan time, it may cause the target special function module
operation error.
When executing the FROM/TO instruction, match the processing time and
conversion time of the special function module using timer or constant scanning.

6-2

6.

DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES

6.2

Reading/Writing Data from/to the Q2ASCPU Using Special Direct Devices

As the FROM/TO instruction, the special direct device reads data stored in the buffer
memory of a special function module or writes data to the buffer memory of a special
function module.

The special direct device represents the buffer memory in a special function module as the
Q2ASCPU device.
Example: U10\G10:

U10
G10

Indicates the head I/O No.100 of the special function

module. (Hexadecimal)
Indicates the buffer memory address 10. (Decimal)

REMARK
For details on a special direct device, refer to the QnACPU Programming Manual
(Fundamentals).
The special direct device differs from the FROM/TO instruction in that the CPU
module can handle the buffer memory of a special function module as a direct
device.
This can reduce the total number of steps in the program. However, the instruction
processing speed is the same with the FROM/TO instruction.
Example: Writing data to address 0 of the buffer memory in the special function
module loaded at X/Y0, and reading the data of address 1.
(a) Using the FROM/TO instruction

6-3

(b) Using special direct device

6.

DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES

POINT

1.

2.

When reading data from the special function module frequently during the
programming, store the special direct device to a data register after reading in
an area of the program by using the FROM instruction rather than by using
them at each instruction.
This is because programming scan interval is added due to an access
processing to the special function module for each instruction.
When executing the instruction using a special direct device for the special
function module frequently in short scan time, it may cause the target special
function module operation error.
When performing the instruction using a special direct device, match the
processing time and conversion time of the special function module using
timer or constant scanning.

6-4

6.

DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES

6.3

Processing for Data Communication Requests from a Special Function Module

When a data communication request is received from a special function module such as a
serial communication module, the Q2ASCPU performs the processing for the data
communication request at the END processing.
The Q2ASCPU can process all the data communication requests received in one scan
with one END processing, according to the parameter settings. In this case, the data lag to
each module is eliminated, but the END processing is extended by the data
communications request processing.
Data communications request batch processing is set in the "6. General Data
Processing"on the "PC system" screen in the GPP function parameter mode.
The setting range is 1 to 6 modules, and the processsing can be set per module.

6-5

7.

AUTO REFRESH FUNCTION

AUTO REFRESH FUNCTION

7.1

For MELSECNET/MINI-S3
By setting link information, I/O storage device, etc. of the MELSECNET/MINI-S3 to the
parameters, the module automatically communicates with the buffer memory area for the
batch refresh send/received data of the type A1SJ71PT32 MELSECNET/MINI-S3 master
module (abbreviated as the MINI master module hereafter).
The settings are made on the MELSECNET/MINI setting in the parameter mode of GPP
function.
Sequence programs can be created using the I/O devices allocated to send/received by
the MELSECNET/MINI-S3 setting. (The FROM/TO instructions are not required.)

7-1

7.

AUTO REFRESH FUNCTION

POINT

(1) Since up to 8 master modules can be set for auto refresh by the parameter,
auto refresh is possible for up to 8 modules.
When 9 or more modules are desired, use the FROM/TO instruction in the
sequence program from the 9th module.
(2) Since auto refresh is not possible with send/received data for the separate
refresh I/O modules and for the remote terminal units No.1 to No.14, use them
by the FROM/TO instructions.
However, the remote terminal units shown below are subject of auto refresh in
the limited area:
AJ35PTF-R2 RS-232C interface module
AJ35PT-OPB-M1-S3 mount-type tool box
AJ35PT-OPB-P1-S3 portable type tool box
(3) For the master modules set up for auto refresh, since the Q2ASCPU
automatically turns ON the link communication start signal Y(n+18) or
Y(n+28), it is not necessary to turn it on from the sequence program.
(4) Auto refresh of I/O data is performed by the batch after the Q2ASCPU
performs the END instruction.
(Auto refresh processing is performed when the CPU module is in the RUN/
PAUSE/STEP-RUN status.)
(5) The master module may perform the processing while the link communication
start signal Y(n+18) or Y(n+28) is OFF depending on the remote terminal units
connected.
For instance, if the AJ35PTF-R2 RS-232C interface unit is used without
protocol, it is necessary to write parameters to the parameter area (buffer
memory address 860 to 929) while the link communication start signal is OFF.
Since the link communication start signal becomes ON after the CPU module
enters the RUN status and one scan is performed, write the parameters
during the first 1 scan.
ON

Link communication
start signal
OFF
Y(n+28)
ON
SM402

OFF
1 scan
Set CPU module to RUN

(6) If the hardware error signal X(n+0)or X(n+20) or ROM error signal X(n+8)or
X(n+28) of a master module for which auto refresh has been set comes ON,
the Q2ASCPU does not perform auto refresh processing.
(7) When making the settings, ensure that there is no duplication between
receive data refresh devices and send data refresh devices.

7-2

7.

AUTO REFRESH FUNCTION

(1)

Parameter setting items, setting ranges and contents of auto refresh, as well as the
buffer memory address of the master module which is used for exchanging data with
the Q2ASCPU are shown below.
Set the parameters for the number of the master modules used.

I/O signal
from a
master
module

Buffer memory
address of a
master module

Number of
master
modules

0, 1 to 8 module(s)

Sets the total number of the master modules used.

Set "0" if auto refresh is not to be used.

Start I/O No.

Number of I/O points of CPU

module

Sets the head I/O number where the master module

is installed.

Model
classification
of MINI/MINIS3

110
to
141

Y(n+1A)*1

Y(n+1B)*1

10
to
41

Item

Total number
of remote I/O
stations
Storage
device for
received data
*4

Send data
storage
device

Number of
retries

Setting range

Description

MINI
In I/O mode (occupies 32 points)
MINI-S3
In expansion mode (occupies 48 points)

MINI or MINI-S3

Default value

Follow the
settings
made in the
"I/O Assign"
in the
parameter
mode.*3

Set only when MINI is set.

In MINI-S3, since the number of master module's
initial ROMs becomes valid, the setting is not
necessary .(When the setting is executed, ignore it).

0 to 64 stations

X
M, L, B, T, ST, C, D, W, R, ZR,
none
(Bit device: multiples of 16)

Y
M, L, B, T, ST, C, D, W, R, ZR,
none
(Bit device: multiples of 16)

0 to 32 times

Link priority; CPU priority

Priority selection of access
to the master module
buffer memory

FROM/TO
response
specification

Data clear
specification
for
Retention, clear (received data)
communication
faulty station

7-3

Sets the devices to store the received/send data for

batch refresh.
Specify the head number of the device.
The total number of remote I/O stations, set starting
from the first device number, is occupied as a auto
refresh area.
(8 points/station 64 stations = 512 points : Bit
device)*2
Use of X/Y remote I/O range is recommended for
devices.

X1000 to
X11FF

Y1000 to
Y11FF

Sets the number of retries upon the communication

errors occurrence.
Error is not output when the communication is
restored within the number of the retries set.

5 times

1) Link priority
Link access by MINI-S3 has the priority.
During the link access, FROM/TO is caused to wait.
Possible to read out the received data refreshed at
the same timing.
The maximum wait time (0.3ms + 0.2ms
number
of separate refresh stations) for the FROM/TO
instruction may be generated.
2) CPU priority
The FROM/TO instructions from a CPU module are
given access priority. Even during the link access, it
interrupts and accesses.
Depending on the timing, received data in the midst
of I/O refresh may be read.
No wait time for the FROM/TO instruction.

CPU priority

Retention
Retains the received data for batch and separate
refresh.
Clear
Sets all points to OFF

Clear

7.

AUTO REFRESH FUNCTION

I/O signal
from a
master
module

Buffer memory
address of a
master module

Item

100
to
103
195

Faulty station
detection

107
196
to
203

Error No.

Line error
check setting
(Line error)

Operation at
CPU STOP

*1
*2
*3

*4

Setting range

Description

Default value

M, L, B, T, ST, C, D, W, R, ZR,
none
(Bit device: multiples of 16)

Sets the head device to store the faulty stations

detected data.
MINI occupies 4 words; MINI-S3 occupies 5 words.

No setting

T, ST, C, D, W, R, ZR

Sets the head device to store the error code at the

error occurrence.
MINI occupies 1 word; MINI-S3 occupies (1 +
Number of remote terminal modules) words.

No setting

Sets data sending method for verification of faulty

area when the line errors occur.

Retention

Sets the operating status when the CPU module is

in the STOP state.

Stop

Test message sending (Test)

OFF data sending (OFF)
Immediate data transmission
before line errors
(Retention)
Stop/Continue

"n" is determined by the installation location of the master modules.

When the total number of remote I/O station is odd, add 1 to the station number to obtain the
occupied storage devices.
When the master module number setting column is made blank in parameter setting, auto
refresh can be used without this setting.
However, model name registration is required in the "I/O Assign". (MINI mode: AJ71PT32,
MINI-S3 mode: AJ71PT32-S3)
When the input (X) is specified in the received data storage device, use the I/O number later
than the number used for the module loaded on the main base unit and the extension base
unit. When the I/O number usage range for the module loaded on the main base and the
extension base is used for input/output of the received data storage device, the CPU module
imports both the input ON/OFF data from the input module and the ON/OFF data from auto
refresh of MELSECNET/MINI-S3. Therefore, input (X) of the CPU module is not operated as
desired.

7-4

7.

AUTO REFRESH FUNCTION

(2)

Y20
X0 to
to
Y3F
X1F

Setting of the send/received data storage devices is explained using the system
example shown below.
(Example) When the device X/Y400 and later are used as the remote I/O stations:

AJ71PT32-S3
master module

AX41C Station No.1

(number of occupied stations: 4)

A1SY41
A1SX41

Q2ASCPU
A1S61PN

AJ35TB1-16D
Station number 5
(number of occupied
stations: 2)
MELSECNET/MINI

First I/O No.: 40

MINI/MINI-S3 model
name setting: MINI
Total number of I/O
stations: 11 stations
AJ35TJ-8R
Station No.11
(number of occupied stations: 1)

AX40Y50C Station No.7

(number of occupied stations: 4)

Sample parameter setting of the GPP function for the above system configuration is
shown below:

7-5

7.

AUTO REFRESH FUNCTION

The storage devices for the send/received data for the present system example are as
follows:
(a) Storage device for received data
Master module
Address b15
100
111
112
113
114
115

b8 b7

Station No.2
Station No.4
Station No.6
Station No.8
Station No.10

Q2ASCPU

b0
X40F
X41F
X42F
X43F
X44F
X45F

Station No.1
Station No.3
Station No.5
Station No.7
Station No.9
Station No.11

X408 X407
X418 X417
X428 X427
X438 X437
X448 X447
X458 X457

X400
X410
X420
X430
X440
X450

Used by the system

Input area

1) Set the device number (X400) for b0 of the station 1 as a received data
storage device.
2) The received data storage device occupies from X400 to X45F.
For the present system example, since the total number of stations is odd, it
is occupied for one extra station.
3) The device numbers of input modules connected are as follows:
Stations 1 to 4

AX41C

X400 to X41F

Stations 5 and 6

AJ35TB-16D

X420 to X42F

Stations 7 and 8 AX40Y50C

X430 to X43F
With respect to X440 to X45F, they are simultaneously refreshed, and set to
OFF at any time.
Do not use X440 to X45F in the sequence program.

7-6

7.

AUTO REFRESH FUNCTION

(b) Send data storage device

1) Set the device number (Y400) for b0 of the station 1 as a send data storage
device.
2) The send data storage device occupies from Y400 to Y45F.
For the present system example, since the total number of stations is odd, it
is occupied for one extra station.
3) The device numbers of output modules connected are as follows:
Station 9 to 10

AX40Y50C

Y440 to Y44F

Station 11
Y450 to Y457
AJ35TJ-8R
With respect to Y400 to Y43F and Y458 to Y45F, they are simultaneously
refreshed, but are not output.
POINT

(1) If the same device type is used for the send data storage devices and
received data storage devices, make sure that there is no duplication of
device numbers.
When the received data storage device is set to B0 in the system
configuration example, it occupies B0 to B5F as the device range.
Set the send data storage device to B60 or later.
When the send data storage device is set to B60, the device range will be B60
to BBF.
(2) If a bit device is specified as the send/received data storage device, the
device number set must be a multiple of 16.
Example:
X0, X10,
X100,
M0, M16,
B0, B10,

M256,
B100,

(3) Device range used is (8 points) (Number of stations).

When the number of stations is an odd number, extra 8 points are necessary.
(4) When specifying input (X) for the received data storage device, specify the
device number out of the actual input (X) range.

7-7

7.

AUTO REFRESH FUNCTION

7.2

Auto Refresh Setting of CC-Link

Auto refresh of the CC-Link designates automatic communications between the
Q2ASCPU and the buffer memory for cyclic communication of CC-Link master stations/
local stations.
Data for communication varies depending on the remote station connected.
Remote I/O station (Communication in ON/OFF data)
Remote device station (Communication in ON/OFF data and Word data)
Intelligent device station (Communication in ON/OFF data and Word data)
Master station/local station (Communication in ON/OFF data and Word data)
The auto refresh setting of the CC-Link allows communication with other stations of CCLink using the FROM/TO instruction without communicating with the master station of the
CC-Link.
Cyclic communication
Q2ASCPU

Parameter

Master station
Auto refresh
setting of
CC-Link

Remote input
(ON/OFF data)

0 step

to

Update the data

for settings.

Remote output
(ON/OFF data)

Remote I/O
station (input)

External
device

Remote I/O
station (output)

External
device

Remote device
station

External
device

Remote register
(RWr: Word data)
END
END
processing

Remote register
(RWw: Word data)

7-8

7.

AUTO REFRESH FUNCTION

(1)

Settings for auto refresh

The Table 7.1 shows the setting items for auto refresh parameters of the Q2ASCPU.
Table 7.1 List of auto refresh settings
Setting station

Item

Description

Setting range
M

Number of modules

The number of CC-Link modules is set.

1 to 8

Module head I/O number

The head I/O number of a CC-Link module is set.

0000H to 0FE0H

Module type

The loaded CC-Link module type (Master station, local station, stand-by station)
is set.

M: Master station
L: Local station
T: Stand-by station

Receiving data batch refresh

bit device
(Input data)

The device that stores the batch refresh received data from the remote station
is set.
When the head device number is set, the points corresponding to the specified
number of stations (Total number of stations) are obtained to refresh all areas.
The output module area is also refreshed.
The settings are made in units of 16 points.

Transmission data batch

refresh bit device
(Output data)

The device that stores the batch refresh send data to the remote station is set.
When the head device number is set, the points corresponding to the specified
X, M, L, B, T, ST, C, D,
number of stations (Total number of stations) are obtained to refresh all areas.
W, R, ZR*
The input module area is also refreshed.
The settings are made in units of 16 points.

Receiving data batch refresh

word device
(Remote device: RWr)

The device that stores the batch refresh received data from the remote station
is set.
When the head device number is set, the points corresponding to the specified
number of stations (Total number of stations) are obtained to refresh all areas.
The I/O module area is also refreshed.
The settings are made per point.

Transmission data batch

refresh device
(Remote device: RWw)

The device that stores the batch refresh send data to the remote station is set.
When the head device number is set, the points corresponding to the specified
M, L, B, T ,ST, C, D, W,
number of stations (Total number of stations) are obtained to refresh all areas.
R, ZR*
The I/O module area is also refreshed.
The settings are made per point.

Receiving buffer specification

for transient station

The receive buffer capacity for transient station is set.

80 to 4096

Transmission buffer
specification for transient
station

The send buffer capacity for transient station is set.

80 to 4096

Batch refresh device for

special relay

The destination device for special relay is set.

X, M, L, B, T, ST, C, D,
W, R, ZR*

M, L, B, T ,ST, C, D, W,
R, ZR*

M, L, B, T ,ST, C, D, W,
R, ZR*

Only when the file register is set to "Use the designated file" with the "Parameter", R and ZR
can be used as the auto refresh devices.
When "Use same file name as program" is set, R and ZR cannot be used.

REMARK
1)

In "Setting station" in the table above, M refers to the master station, L to the
local station, and T to the stand-by station.

2)

In the table above,

means that the setting can be made and
the setting is not required.

7-9

means that

7.

AUTO REFRESH FUNCTION

Table 7.1 List of auto refresh settings (Continued)

Setting station
Item

Description

Setting range
M

Batch refresh device for

special register

The destination device for special register is set.

T, ST, C, D, W, R, ZR*

Auto update buffer

specification

The buffer capacity for automatic update is set.

128 to 4096

Total number of slave

stations

The last station number of the remote station connected to the master station
is set.

1 to 64

Delay timer

The delay time of link scan is set.

1 to 100
(0 is invalid.)

Standby station specification

The use status of the stand-by master function is set.

Number of retries

The number of retries at the occurrence of a transient transmission error is set. 1 to 7

Number of automatic return

stations

The number of automatic return stations is set to one link scan.

Operation specification for

CPU stop

When the CPU module has stopped, continuation/stop of the data link is set.

Stop
Continue

Scan mode setting

Synchronization/Non-synchronization is set to the CPU module scan.

Non-synchronization
Synchronization

The model for each remote station is set.

Remote I/O station

Remote device
station
Intelligent device
station

Number of occupied stations

The number of occupied stations for each remote station is set.

Specification of reserved
station

Reservation for remote station is set.

Not reserved
Reserved

Specification of invalid
station

Validity/Invalidity for error detection of the remote station is set.

Invalid
Valid

Station type

Not used
Used

1 to 10

1 station
2 stations
3 stations
4 stations

Only when the file register is set to "Use the designated file" with the "Parameter",
R and ZR can be used as the auto refresh devices. When "Use same file name as program" is
set, R and ZR cannot be used.

REMARK
1)

In "Setting station" in the table above, M refers to the master station, L to the
local station, and T to the stand-by station.

2)

In the table above,

means that the setting can be made and
the setting is not required.

7 - 10

means that

7.

AUTO REFRESH FUNCTION

(2)

Precautions
(a) Auto refresh of the CC-Link is available when the Q2ASCPU and the CC-Link
module with function version "B" are used.
When either of the Q2ASCPU or the CC-Link module does not indicate function
version "B," auto refresh of the CC-Link is not available.
(b) Auto refresh can be set to up to 8 CC-Link modules.
When 9 or more CC-Link modules are used, handle with the FROM/TO
instruction of the sequence program for the 9th module or later.
(c) When both the CC-Link module and the master station module for
MELSECNET/MINI-S3 are loaded and auto refresh is not set, the default
parameter is set to the master station module for MELSECNET/MINI-S3.
(d) The COM instruction or the G(P). ZCOM instruction allows auto refresh to the
CC-Link module while performing the sequence program.
However, auto refresh to the CC-Link module cannot be performed with the
J(P).ZCOM instruction. Error code "4102" (The network number designated with
the dedicated network instruction does not exist) appears.
(e) Refresh operation for the mixture of MELSECNET (/10, /II) and MELSECNET/
MINI-S3.
Refresh is performed in the order of MELSECNET (/10, /II), CC-Link and
MELSECNET/MINI-S3.
Therefore, the input data specifying the same range is afterward overwritten
with the executed data.
The output data is output to the MELSECNET (/10, /II), CC-Link, and
MELSECNET/MINI-S3.
(f) The operation of the Q2ASCPU when the CC-Link module is in the online/offline
mode is shown in the table below:
Parameter settings

CC-Link module

for auto refresh

status

Operation of the Q2ASCPU

The communications with the remote station is

Online

performed with the specified parameter for

auto refresh.

Set
The Q2ASCPU does not generate an error,
Offline

but does not communicate with the remote

station.

Online
Not set

The communications with the remote station is

performed by the FROM/TO instruction.
The Q2ASCPU does not generate an error,

Offline

but does not communicate with the remote

station.

(g) Auto refresh setting to the CC-Link is performed using the following peripheral
devices.
Personal computer:
GX Developer, SW2IVD-GPPQ type GPP function software package

7 - 11

7.

AUTO REFRESH FUNCTION

(3)

Setting method
Auto refresh setting to the CC-Link is set with the following procedures.
(a) When the "CC-Link" is selected in the "Parameter", the "CC-Link setting" screen
appears.

(b) Set the number of the CC-Link modules loaded on the main base unit and
extension base unit for the Q2ASCPU and selct "Execute", then the screen of
CC-Link setting list appears.

Pressing the Esc key registers the set data.

7 - 12

7.

AUTO REFRESH FUNCTION

(c) Move the cursor to the module number position for auto refresh setting and
press the

F3 key (Detail). The "CC-Link setting" screen appears.

Select "4. Auxiliary setting...." and "5. Station information setting...." to set
detailed data.
I/O number setting of
the CC-Link module
whose number
is specified

Type setting of
the CC-Link module
whose number is
specified

Device settings
for the Q2ASCPU
to be used

[CC-Link setting]
1. Module starting I/O No.
2. Module type 1. (*) M.
2. ( ) L.

Label name:
[ ]

4. Auxiliary setting....

Master station
Local station

3 Batch refresh device

Remote input(RX)
Remote output(RY)
Remote register(RWr)
Remote register(RWw)
Special link relay(SB)
Special link register(SW)

Device
Device
Device
Device
Device
Device

Execute(Y)

5. Station information
setting....

[
[
[
[
[
[

]
]
]
]
]
]

Setting of remote
station connected to
the CC-Link module
(Refer to 1).)

Setting of each remote

station (Refer to 2).)

Cancel(N)

Spase:Select Esc:Close

When pressing the Execute (Y) or the Esc key , the screen returns to the
screen of CC-Link setting list.

7 - 13

7.

AUTO REFRESH FUNCTION

1) When selecting the "4. Auxiliary setting....", the "Auxiliary setting" screen
appears.
When pressing the Esc key, the screen returns to the CC-Link setting
screen of (c).

2) When selecting the "5. Station information setting...", the "Station information
setting"screen appears.
When pressing the Esc key, the screen returns to the CC-Link setting
screen of (c).
[Station information setting]
Station
No.

Set the number of

stations specified in
2).

1
2
3
4
5
6
7
8
9
10
11
12

Label name:

Station type

Number of Reserved/
invalid
occupied
station
stations

<
<
<
<
<
<
<
<
<
<
<
<

<
<
<
<
<
<
<
<
<
<
<
<

I/O >
I/O >
I/O >
I/O >
I/O >
I/O >
I/O >
I/O >
I/O >
I/O >
I/O >
I/O >

1>
1>
1>
1>
1>
1>
1>
1>
1>
1>
1>
1>

7 - 14

<
<
<
<
<
<
<
<
<
<
<
<

>
>
>
>
>
>
>
>
>
>
>
>

Intelligent buffer specification (word)

Send

[
[
[
[
[
[
[
[
[
[
[
[

Receive

Auto

] [
]
[
]
] [
]
[
]
] [
]
[
]
] [
]
[
]
] [
]
[
]
] [
]
[
]
] [
]
[
]
] [
]
[
]
] [
]
[
]
] [
]
[
]
] [
]
[
]
] [
]
[
]
Spase:Select Esc:Close

8.

DEBUGGING FUNCTION

DEBUGGING FUNCTION

8.1

Function List
Q2ASCPU has a variety of convenient functions when debugging.
The following shows the debugging functions.
Item

Description
Function that reads CPU programs, device statuses from a

Monitor function

peripheral device capable of GPP functions

Function that writes a program while the CPU module is

Write during RUN

running

Execution time measurement

Program monitor list

Interrupt program monitor list

Scan time measurement

Sampling trace function*1

Status latch function*1

Functions that displays the processing time of a program

being execute
Functions that displays the processing time of a program
being executed
Function that displays the number of executions of an
interrupt program
Function that measures the execution time of section of a
program
Function that continually collects the data of devices in
accordance with a timing set at the CPU module
Function that collects the device data at the moment to
designate
Functions that runs one step or one part of a program,

Step operation

runs a program with a part skipped

Reference
Section 8.2

Section 8.3

Section 8.4

Section 8.4.1

Section 8.4.2

Section 8.4.3

Section 8.5

Section 8.6

Section 8.7

Step execution

Function that runs a program step by step

Section 8.7.1

Partial execution

Function that executes a designated part of a program

Section 8.7.2

Skip execution
Program trace function*1
Simulation function*2

Debugging by several people

Function that executes a program with a designated part

skipped
Function that collects the program execution status
Function that simulats execution in isolation from the I/O
modules and special function modules
Function that simultaneously debuggs from several
peripheral devices capable of GPP functions

Section 8.7.3
Section 8.8
Section 8.9

Section 8.10

Function that collects device data at a peripheral device

Monitoring trace function

capable of GPP functions in accordance with the

designated timing

For details on the operation for each function, refer to the GPP function Operating
Manual.
*1
*2

When executing this function, a memory card is required.

When executing part of this function, a memory card is required.

8-1

8.

DEBUGGING FUNCTION

8.2

Monitor Function
This function reads CPU module programs and device statuses to a peripheral device
capable of GPP functions.

Application
This function is used to set monitoring conditions for monitoring the operating
statuses of the programmable controller in accordance with a precise timing.
There are three "Monitoring Condition" as follows.
Executing a monitoring at END processing.
Setting the step number to be monitored and the step conducting status.
Setting the device status.
This function is used to retain the monitoring screen by setting "Monitor stop
condition setup" in accordance with a precise timing.
When monitoring the CPU module marked Function version B using a peripheral
device capable of GPP function, local device monitor test is executed by setting
"local device monitor".
8.2.1

Monitoring condition setting

Function Description
(1)

This function allows setting of the monitoring condition.

All operations are performed using Monitor/test menu in the ladder mode.
The following shows an example of setting a monitor condition.

The following shows an explanation of the screen above:

The monitoring condition can be select either "1. ( ) Monitor Always." or "2. ( )
Condition".
(a) When "1. ( ) Monitor Always." is set
The collection timing for monitor data is every scan after END processing at the
CPU module.

8-2

8.

DEBUGGING FUNCTION

(b) When "2. ( ) Condition" is set

"1. [ ] Device" and "2. [ ] Step #" can be set.
1) When only "2. [ ] Step #" is set
The monitor data collection timing is the moment when a QnACPU shows
designated status immediately before executing the designated step.
The following shows the possible designations to execute.
When switching from OFF to ON:

:<

>

When switching from ON to OFF:

:<

>

All the time only during ON

:< ON >

All the time only during OFF

:<OFF >

All the time in any statuses

:<Always>

8-3

8.

DEBUGGING FUNCTION

REMARK
1) When Step # [ 0] is designated, the execution condition must be set as Always.
2) When "1. [ ] Device" only is specified (when "2. [ ] Step #" is not specified), the
monitor data collection timing is every scan after END processing of the
programmable controller CPU.
When the data is changed in the same scan, it cannot be detected. (Including the
low-speed program)
3) When only "1. [ ] Device" is set, either
"1. ( ) Word Device" or "2. ( ) Bit Device" can be designated.
When "1. ( ) Word Device" is designated
The collection timing of the monitor data is the scan END processing when the
current value of the specified word device becomes the specified value.
The following shows the method for designating the current value.
Decimal designation:

[K Decimal number

Hexadecimal designation: [H Hexadecimal number

]
]

When "2. ( ) Bit Device" is designated

The collection timing of the monitor data is the scan END processing when the
execution status of the specified bit device becomes the specified status.
The following shows the possible designations for execution status.
At leading edge :<

>

At trailing edge :<

>

4) When "2. [ ] Step #" and "1. [ ] Device" are designated

The monitor data collection timing is such that data is collected when the status
immediately before execution of the designated step or the execution status (current
value) of the designated bit device (word device) attains the designated status.

8-4

8.

DEBUGGING FUNCTION

POINT

In the ladder block shown below, assuming that the detailed condition is set as
follows: "Step # [100] = <

>, Word device [D1 ] = [K5 ]".

The monitor timing is shown below. However, the monitoring interval at a

peripheral device capable of GPP functions depends on the processing speed of
that peripheral device. Even if data changes occur faster than the monitor interval,
data can be collected only once during the interval.

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8.

DEBUGGING FUNCTION

POINT

(1) Assume that "Step # [ 2] = <ON>" is designated as the detailed condition in

the case of the ladders shown below; In this case the monitor execution differs
for the two ladders. For (a) it is "X0 and X1 both ON" and for (b) it is "X1 ON
(regardless of ON/OFF status of X0)".
If a step part way through an AND/OR block is designated for a monitor
condition, the monitor data collection timing is such that data is collected when
the status immediately before execution of the step designated from the LD
instruction in the block becomes the designated status.

(2) If the ladder block head other than 0 step is specified to the step number as
detailed conditions, the monitor data is collected when the instruction
execution status immediately before execution is the specified status.
When "Step # [ 2] = <ON>" is specified in the ladder below, the monitor data is
collected for OUT Y10 ON.

8-6

8.

DEBUGGING FUNCTION

(2)

A monitor stop condition can be set.

All operations are performed on the monitor/test screen window in the ladder mode.
The following shows an example of the setting for a monitor stop condition.

The following shows an explanation of the screen above:

Either "1. ( ) Without Monitor Stop" or "2. ( ) Condition" can be set for the monitor stop
condition.
(a) When "1. ( ) Without Monitor Stop" is set
Monitoring is stopped when
key is pressed.
(b) When "2. ( ) Condition" is set
"1. [ ] Device" and "2. [ ] Calculation State" can be set.
1) When "2. [ ] Calculation State" is set
The monitor stop timing is such that monitoring stops when the execution
condition of the step designated for the monitor condition attains the
designated status.
The following shows the possible designations for execution status.
When switching from OFF to ON

When switching from ON to OFF

All the time only during ON

ON

All the time only during OFF

OFF

All the time in any statuses

: Always
If "2. [ ] Calculation State" isn't set, the timing for monitor stop is such that
monitoring is stopped after CPU module END processing.

8-7

8.

DEBUGGING FUNCTION

2) When "1. [ ] Device" is set Either

"1. ( ) Word Device" or "2. ( ) Bit Device" can be set.
When "1. ( ) Word Device" is set
The monitor stop timing is such that monitoring stops when the present
value of the designated word device attains the designated value.
The following shows the method for designating the current value.
For decimal (word) designation

: [K Decimal number

For hexadecimal (word) designation

: [H Hexadecimal number

For decimal (double word) designation: [K Decimal number

Space

L]

For hexadecimal (double word)

designation

: [H Hexadecimal number Space L]

For real number designation

: [E Real number

When "2. ( ) Bit Device" is designated

The monitor stop timing is such that monitoring stops when the execution
status of the designated bit device becomes the designated status.
The following shows the possible designations for execution status.
At leading edge :
At trailing edge :

(3)

In the case of devices for which index qualifications have been made, the index
qualified value is monitored.
The following shows an example of this type of monitoring.

8-8

8.

DEBUGGING FUNCTION

(4)

The ON status of comparison instructions can be monitored.

The following shows an example of this type of monitoring.

(5)

The devices of special function modules can be monitored.

The following shows an example of this type of monitoring.

REMARK
To monitor devices of special function modules, set "2. Buffer Memory 1. Monitor" for
"5/Monitor Target Setting" under the ladder mode "Option" menu.

8-9

8.

DEBUGGING FUNCTION

(6)

Real numbers and character strings can be monitored.

The following shows an example of this type of monitoring.

(7)

The following shows the devices that can be monitored.

(a) Bit devices

X, FX, DX, Y, FY, DY, M, L, F, SM, V, B, SB, T(Contact),

T(Coil), ST(Contact), ST(Coil), C(Contact), C(Coil), J
J

(b) Word device

\Y, J

\B, J

\SB, BL

\S

T(Current value), ST(Current value), C(Current value), D,

SD, FD, W, SW, R, Z, ZR, U

(8)

\X,

\G, J

\W, J

\SW

The following shows the setting device under the detailed condition.
(a) Bit device

X, FX, Y, FY, M, L, F, SM, V, B, SB, T(Contact),

ST(Contact), C(Contact), J
BL

(b) Word device

\X, J

\Y, J

\B, J

\SB,

\S

T(Current value), ST(Current value), C(Current value), D,

SD, FD, W, SW, R, Z, ZR, U

\G, J

\W, J

\SW

The following qualifications are possible with respect to the devices listed above.
Digit designation for bit devices
Bit number designation for word devices

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8.

DEBUGGING FUNCTION

NOTE
1) When a monitoring is performed with a monitor condition set, the file
displayed at the device running GPP function is monitored.
Make sure that the file name used with GPP function is the same as the file
name when monitoring is performed by executing "Newly from PLC".
2) When the buffer memory of a peripheral device is read by designating a
direct device, FFFFH is monitored if the peripheral device is faulty or not
connected.
3) When monitoring file registers, FFFFH is monitored if no file register
designation is made.
4) Before monitoring, make sure that the device assignment of the CPU and
GPP function agree.
5) For the local device monitor in each program file, the monitor operation
varies depending on presence of the CPU module function version B and the
GPP function model.
[Without function version B]
Detailed conditions (step number and device condition) are set for each
program file to perform monitoring.
[With function version B]
When the GX Developer and the SW2IVD-GPPQ are used, the local
device can be monitored in each program file by setting compatibility with
local device.(Refer to Section 8.2.2.)
When SW0IVD-GPPQ and SW1IVD-GPPQ are used, the local device can
be monitored with the same operation as the operation without function
version B.
6) When monitoring the buffer memory of a special function module, the scan
time is prolonged in the same way as it is when a FROM/TO instruction is
executed.
7) Several people can perform monitoring at the same time.
The following considerations apply when executing this:
High-speed monitoring can be made possible by increasing the system
area by 1k steps for each monitor for other station use when formatting the
built-in RAM.
In the monitor for other stations, 15k steps maximum can be set in the
system area and the corresponding file space for the user is reduced.
Only one person can set the detailed conditions for monitoring.
8) The detailed conditions for monitoring can only be set in ladder monitoring.
9) If the same device is designated for both a monitor condition and monitor
stop condition, also designate the "ON" or "OFF" status.
10) When the step number is specified for the monitor condition, monitor
conditions are not satisfied for no execution of the applicable step instruction
as shown below:
Applicable step instructions are skipped by CJ, SCJ and JMP instructions.
The applicable instruction is the END instruction and the FEND instruction
exists in the program.
11) Do not reset the CPU module while the monitor condition is registered.

8 - 11

8.

8.2.2

DEBUGGING FUNCTION

Monitor test of local device (function version B or later)

With the "parameter device setting," the device set in the local device can be monitored
and tested in the peripheral device.
This function allows debugging while checking details of the local device by peripheral
devices.
To monitor the local device, set the peripheral device to "local device monitor". The
following fig. is an example that monitoring the local device of program B with the CPU
module, which is executing programs A, B and C.

CPU module
Execution of program ("A"
Program: A

X0

Program: B

X10
MOVP

K2 D0

MOVP

K3 D9

X1

MOVP

MOVP

"C")
Program: C

X20

K4 D0

X11

MOVP

K3 D0

X21

K8 D9

MOVP

K6 D9

The local device data of program "B" is

displayed.

Device is set to the local

device monitor and
program "B" is monitored.

[EX]
When D0 to D10 are local devices,
D0=4 for X10 ON and D9=8 for X11
ON are displayed.

GX Developer or
SW2 -GPPQ is installed.

(1)

"B"

Peripheral device
To perform monitor test of the local devices, the following GPP function software
packages are required:
Personal computer
GX Developer, SW2IVD-GPPQ type GPP function software package

8 - 12

8.

DEBUGGING FUNCTION

(2)

Monitoring procedures of local device

The following shows the procedures to be monitored local devices:
Connect the CPU module to
peripheral devices.

Display the ladder in the ladder mode.

Change a mode to a monitor mode.

Press the ALT (GRPH) key.

Display the ALT (GRPH) menu.

Select "6/Monitor test."

Select "H/Local device

compatibility setting."

Display the local device

setting screen.

Set the local device compatibility

to "Execute."

Monitor the local device

of the displayed program.

8 - 13

Set the local device monitor.

8.

DEBUGGING FUNCTION

(3)

Operation for CPU module and GPP function versions

Table 8.1 shows the operation when the local devices are set to D0 to D99 and when
3 programs with the program names of "A", "B" and "C" are performed in the CPU
module.
(The order of the programs is A, B, C, (END processing), A, B...)
Table 8.1 Operation for CPU module and GPPQ function versions
Monitor Device

GPPQ Model Name

With Function Version "B"

D0

SW0

-GPPQ

D0 of program "C" is

SW1

-GPPQ

monitored.
When local
device is not
set

SW2

D0 of program "C" is
monitored.

D100
D100 after execution of
program "C" is
monitored.
D100 after execution of
program "C" is
monitored.

Without Function Version "B"

D0
D0 of program "C" is
monitored.

D0 of program "C" is
monitored.

D100
D100 after execution of
program "C" is
monitored.
D100 after execution of
program "C" is
monitored.

-GPPQ
When local

D0 of the displayed

device is set

program is set.

D100 after execution of

the displayed program is

An error (error code: 4001) occurs.

set.

REMARK
GX Developer supports functions of function version B.

(4)

Precautions
(a) The local device that can perform the monitor test in one peripheral device is
only one program.
Monitor test for multiple program local devices from one peripheral device is not
allowed.
(b) The number of programs that allows simultaneous monitor test from multiple
peripheral devices is up to 16.
When the local device of the stand-by type program is monitored, the local
device data is read/escape. The scan time is extended as follows:
Q2ASCPU(S1)

:560 + 1.3 (Number of words in the local device) [ s]

Q2ASHCPU(S1) :220 + 0.8 (Number of words in the local device) [ s]

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8.

DEBUGGING FUNCTION

8.3

Write During RUN

This is a function that writes a program to the CPU while the CPU module is in the RUN.
Read the manual carefully and confirm safety before changing the program during
operation.
An operation error of write during run may result in damage to the machine or
accident.

CAUTION

Application
This function is used to change a program without stopping program execution.

Function Description
(1)

Write during RUN is possible from multiple peripheral devices capable of GPP
functions with respect to one file.
In order for this, designate the pointer for the programs to be written from the
peripheral devices capable of GPP functions in advance. This enables write safely
during RUN using peripheral devices capable of GPP functions.

8 - 15

8.

DEBUGGING FUNCTION

The example below shows a case where peripheral device capable of GPP functions
A performs write during RUN from P0, and peripheral device capable of GPP
functions B performs write during RUN from P1. The program enclosed in the frame
is the program subject to write during RUN.
The machining program
from P0 onward is obtained
by write during RUN.

The machining program

from P1 onward is obtained
by write during RUN.

X0 X2

X0 X2

P0

P0

Y30

Serial communication module

X3 X4
P1

Y30
X1

X1

A1SJ71QC24

SET M10

X3 X4
P1

SET M10
X5

X5

END

END

Peripheral device
capable of GPP
function A

(2)

Peripheral device
capable of GPP
function B

It is possible to write programs from peripheral devices capable of GPP functions that
are connected to other stations in the network during the RUN.

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8.

DEBUGGING FUNCTION

Operation Procedures
To write from the GPP function peripheral devices during RUN, the following two methods
are available:
(1)

After a ladder is created in the ladder mode, write during RUN is performed by
pressing

(2)

Shift

F4

keys for conversion of the ladder.

With "4. Write/conversion setting" in "8/ Option" menu of the ladder mode, "4. Write
setting during RUN" and "7. Write method during RUN" are set.
When the F4 key is pressed for conversion of the ladder after the ladder is
created, write during RUN is performed.
The following shows the setting examples:

(a) In "4. Write setting during RUN," "1. ( ) After conversion, PLC is written during
RUN" is set.
(b) In "7. Write method during RUN," "1. ( ) Write during normal RUN" or "2. ( ) Write
during relative RUN with pointer" is selected.
NOTE
The following shows the precautions relating to write during RUN.
(1)

The only memory that can be used for write during RUN is the built-in RAM. If write
during RUN is performed during a boot operation, also write the program to the
memory card at STOP.
When the boot operation is started again without write on the memory card, the
program before write during RUN is transferred from the memory card to the built-in
RAM for execution.

(2)

The maximum number of steps that can be handled in one write during RUN
operation is 512.
The number can be changed according to how many steps of write during RUN
saved using a peripheral device capable of GPP function. The saved steps of write
during RUN can be set during the CPU module OFF. Note that the saved steps of
write during RUN decrease every time write during RUN is performed.

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8.

DEBUGGING FUNCTION

(3)

1)

During low-speed program execution, write during RUN is started when execution of
all low-speed programs is completed. Also, execution of low-speed programs is
suspended during write during RUN.
2)

Scan execution
type program
step 0 to END
Low-speed execution
type program
step 0 to 200

3)

Scan execution
type program
step 0 to END
Low-speed execution
type program
step 201 to 320

1 scan

4)

Scan execution
type program
step 0 to END
Low-speed execution
type program
step 321 to END

1 scan

1 scan

Scan execution
type program
step 0 to END
Low-speed execution
type program
step 0 to 120
1 scan

1): Write during RUN command of scan execution type program

2): Write during RUN execution of scan type program
3): Write during RUN command of low-speed execution type program
4): Write during RUN execution of low-speed execution type program
POINT

Write during RUN cannot be performed on the program in step operation.

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8.

DEBUGGING FUNCTION

8.4

Execution Time Measurement

This is a function that displays the processing time of the program being executed.

Application
This function is used to determine the influence of the processing time of each program on
the total scan time when making system adjustments.

Function Description
Execution time measurement provides the following three functions. For explanations of
each function, refer to Section 8.4.1 through Section 8.4.3.
Program monitor list
Interrupt program monitor list
Scan time measurement
8.4.1

Program monitor list

This is a function that displays the processing time of the program being executed.

Function Description
The scan time, execution count, and processing time for each item can be displayed for
each program.
All operations are performed using Monitor/test menu in the ladder mode.

(1)

Select "Program Batch Monitor".

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8.

DEBUGGING FUNCTION

(2)

Select "Program List Monitor".

The following shows an example of execution of the program list monitor when a
constant scan time of 120ms is set.

The following shows an explanation of the screen above:

(a) "Total Scan Time"
The times set in "5.( ) PC RAS Setting" for monitor time and scan time total are
displayed here for each program type.
1) "Mon Time"
The monitor times for scan execution type programs, initial execution type
programs, and low-speed execution type programs are displayed here.
If the scan time exceeds the time displayed here, a watchdog timer error
occurs at the CPU module.
2) "Max Scan"
The total time for the items listed under "Time Details / Scan" is displayed
here.
(b) "Time Details / Scan"
The scan time details are displayed here.
1) "Program"
The total execution time of scan execution type programs is displayed here.
2) "END Proc Time"
The END processing time is displayed here.
3) "Slow Prog"
When an execution time for low-speed execution type programs is set, the
total execution time for low-speed execution type programs is displayed here.
4) "Wait for Con"
When constant scan is set, the constant scan waiting time is displayed here.
However, if an execution time for low-speed execution type programs is also
set, 0.000 ms is displayed.

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8.

DEBUGGING FUNCTION

(c) "Program Status"

The times set in "9. ( ) Auxilliary Setting" in the parameter mode are displayed
here.
1) "Program"
The program names are displayed here in the order that the parameters are
set.
2) "Exec"
The types of the programs set in the parameters are displayed here.
3) "Scan Time"
The actual scan times (current values) are displayed here. In the program
stop (stand-by) status, 0.000ms is displayed as the scan time.
4) "Ex Times"
The number of execution times is displayed here, taking the point at which
measurement was started to be 0 in the count (When reaching the maximum
times of 65536, the count returns to 0). The number of execution times is
retained even when program execution is stopped.
When the subroutine program/interrupt program of the stand-by program is
performed in the subroutine call/interrupt request, the number of the stand-by
program is not counted.
(3)

Both start ( F1 ) and stop ( F2 ) of the program can be performed on Program

monitor list screen.
(a) Start of program ( F1 )
Either "Scan execution" or "Low-speed execution" can be set for the stand-by
program.
When the

F1

key is pressed, the window below is displayed.

(b) Stop of program ( F2 )

1) When the stop mode is set to "Output stop after stop" and stop is executed,
the program stops after execution of 1 scan-off. (The operation is the same
as the POFF instruction execution.)
When the above stop opearation is made in the stand-by program, the
program stops after 1 scan-off execution.
Therefore, the "execution count" is added by one.
2) If an error occurs with the RET/IRET instruction during 1 scan OFF execution
in the stand-by program, the "execution count" is added by one.
In this case, the execution type becomes "Scan execution".
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8.

8.4.2

DEBUGGING FUNCTION

Interrupt program monitor list

This function displays the number of executions of interrupt programs.

Application
This is used to check the execution status of interrupt programs.

Function Description
This function allows display of the execution counts of interrupt programs.
All operations are performed using the monitor/test menu in the ladder mode.

(1)

Select "Program Batch Monitor".

(2)

Select "Interrupt Program List Monitor".

The following shows an example of the display when the interrupt program monitor
list function is run.

The following shows an explanation of the screen above:

(a) "Ex Times"
The number of times the program has been executed, taking the point when
monitoring started as 0 in the count, is displayed here.
(When reaching the maximum times of 65536, the count returns to 0.)
The count is cleared to zero when switching to RUN.
(b) "Comment"
The comments set in the documentation mode are displayed here.

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8.

8.4.3

DEBUGGING FUNCTION

Scan time measurement

This function displays the processing time for section of a program.

Function Description
This function allows measurement of the execution time of section of the program in a
program file.
The function can also be used to measure times within subroutine programs and interrupt
programs.
If there is an interrupt program in the monitored section, the processing is added to the
total measurement time.

All operations are performed using "Monitor/test" menu in the ladder mode.
(1)

Select "Measure Scan".

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8.

DEBUGGING FUNCTION

(2)

Designate the scan time measurement range (The designated part is highlighted).

(3)

The scan time measurement results are displayed.

NOTE
1)
2)
3)
4)

Make sure that the start step is lower than the end step in the setting.
Times that span different program files cannot be measured.
If the measured time is less than 0.100ms, 0.000ms is displayed.
END processing time is not included in the measuring time, being included in
the measurement range.

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8.

DEBUGGING FUNCTION

8.5

Sampling Trace Function

The function that collects devices continuously on the CPU module with the specified
timing.
POINT

When executing the sampling trace function, a memory card is required.

Application
This allows checking the changes in the contents of the devices used in a program in
accordance with a designated timing during debugging.
This enables debugging time to be shortened.

Function Description
(1)

Function
(a) The sampling trace function samples the contents of a designated device in a
constant time interval (the sampling cycle) and stores the trace results in a
sampling trace file in a memory card.
(b) The devices that can be traced are listed below.
1) Bit device:

X, FX, DX, Y, FY, DY, M, L, F, SM, V, B, SB, T (Contact), T

(Coil), ST (Contact), ST(Coil), C (Contact), C (Coil), J
J

2) Word device:

\Y, J

\B, J

\SB, BL

\X,

\S.......................Max. 50 points

T (Current value), ST (Current value), C (Current value), D,

SD, FD, W, SW, R, Z, ZR, U \G, J \W, J \SW
......................................................................Max. 50 points

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8.

DEBUGGING FUNCTION

(c) The sampling trace file stores the trace condition data and trace execution data
required to execute the sampling trace. Once a GPP function starts tracing, the
number of set tracing times are executed.

CPU module

Peripheral device capable

of GPP functions

Memory card

Device
area
File
register
area

*
Data of
designated
device

Sampling trace area

1
2
3
4
5
6
n-1
n

1st data
2nd data
3rd data
4th data
5th data
6th data

Sampling trace area

1
2
3
4
5
6

Reading to
peripheral
device

Data of
designated
number of
traces is
displayed.

Monitoring of
sampling trace
data

n-1
n

(n1)th data
nth data

When "n" data has been stored, the

existing data is overwritten starting
from the 1st data area.

* When the trigger point is executed, sampling is performed for the designated number of times and then
the data of the sampling trace area is latched.

Fig. 8.1 Sampling trace operation

(d) The trace results show the ON/OFF statuses of bit devices, and current values of
word devices, for each sampling cycle.

NOTE
While the CPU module is STOP, trace is stopped. The trace result cannot be read.

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8.

DEBUGGING FUNCTION

(2)

Basic operation
The basic operation for sampling trace is shown below.
The statuses during execution of the sampling trace function can be confirmed by
monitoring special relays SM800 to SM805 and SM826.
Trace execution

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8.

DEBUGGING FUNCTION

Suspending the trace

The following shows the operation at error occurrence.

When an error occurs during sampling trace, SM826 (sampling trace error)
comes ON, and at the same time, SM801 (sampling trace start) goes OFF.
Start the trace again for turning OFF SM826.

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8.

DEBUGGING FUNCTION

Operation Procedures
The following shows the procedures of sampling trace.
These operations are performed on the "Sampling Trace" screen of the trace menu in the
online mode.
(1)

Set the trace devices and trace conditions with GPP function.
(a) Setting the trace devices
Set the devices at "Trace Device Setting" on the "Sampling Trace" screen.

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8.

DEBUGGING FUNCTION

(b) Setting the trace conditions

Set the trace conditions at "Trace Device Setting" on the "Sampling Trace"
screen.

Sampling the designated number of times (count after trigger) leads completion
after the trigger point execution.

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8.

DEBUGGING FUNCTION

The following shows an explanation of the screen above:

One of the following four settings can be made for the trace condition: "1. Trace
Counts", "2. Trace Point", "3. Trigger Point", or "4. Added Trace Information".
1) "Trace Counts"
In the case of the total count, set the number of sampling traces executed
from start to end of the trace.
In the case of the count after the trigger, set the number of sampling traces
executed from the trigger execution to the trace end.
The following shows the formula that sets range for these counts:
Count after trigger

total count

8192

2) "Trace Point"
Set the timing for collection of trace data. Select one of the following:
Every END
: Data collected at END instruction of every
scan.
Every Interval

: Data collected with each designated time.

Setting range is 5 to 5000ms in 5ms units.

Specify Detail Condition : Set a device and step number.

The following shows setting examples: The
details on how to make the settings and data
collection timing are the same as described in
Section 8.2.1 Monitor condition setup in
Monitor Function.
The following shows the setting device under the detailed condition.
Bit device

: X, FX, Y, FY, M, L, F, SM, V, B, SB, T (Contact), ST

(Contact), C (Contact), J

\X, J

\Y, J

\B, J

\SB,

BL \S
Word device

: T (Current value), ST (Current value), C (Current

value), D, SD, FD, W, SW, R, Z, ZR, U

\G, J

\W,

J \SW
The following qualifications are possible with respect to the devices listed
above.
Digit designation for bit devices
Bit number designation for word devices

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DEBUGGING FUNCTION

3) "Trigger Point"
The point at which the trigger is executed is set. Select one of the following:
At Instruction Execution : When executing STRA instruction
At Request of PDT

: When operating trigger using GPP functions

Specify Detail Condition : Set a device and step number.

The following shows setting examples: The
details on how to make the settings and trigger
execution timing are the same as described in
Section 8.2 Monitor condition setup in Monitor
Function.

4) "Added Trace Information"

Set information to be added at each trace. Select one or multiple item(s) of
the following: (Making no selection is possible.)

(2)

Time

: The time at which the trace was executed is stored.

Step No.

: The step number at which the trace was executed is

stored.

Program Name

: The program name for which the trace was executed

is stored.

Write the set trace device and trace condition to the memory card.
(a) Set the trace file and storage destination.
Set the drive number and file name at "1. ( ) Execute Trace & Display Status" on
the "Sampling Trace" screen.

(b) Write the trace file to the memory card.

Write the trace file to the memory card by using "9. ( ) Write to PC (Condition)" on
the "Sampling Trace" screen.
Since file names are used when writing to the memory card, multiple trace files
can be written.

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DEBUGGING FUNCTION

(3)

Execute the sampling trace.

Execute the sampling trace by using "1. ( ) Execute Trace & Display Status" on
"Sampling Trace" screen.
The following shows a setting example for "1. ( ) Execute Trace & Display Status".

The following shows an explanation of the screen above:

The following settings can be made for "Execute Trace & Display Status" : "1.
Operation", "2. Sampling Trace Data", and "3. Trace Condition".
(a) "Operation"
Select one of the following:
1) Register, Start

: The trace is registered and started. The trace count is

started.

2) Suspension

: The trace is suspended. The trace count and the

count are cleared after the trigger. (To restart the
trace, select "Register, Start" again.)

3) Display Status

: The trace statuses are displayed on the same

screen.

4) Trigger Execution

: The count is started after the trigger.

The trace is ended on reaching the designated count
after the trigger.

(b) "Sampling Trace Data"

Select one of the following:
1) Select From List

: Data from among the sampling trace files in the

memory card are selected.

2) File Shown Right

: The drive number and sampling trace file name are set.

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DEBUGGING FUNCTION

(c) "Trace Condition"

Select one of the following:
1) Overwrite Conditions onto CPU's : The trace condition in an existing trace
file is overwritten.
2) Use Condition in CPU

(4)

: Sampling trace under the condition in the

trace file designated in "2. Sampling
Trace Data" is executed.

Retrieve the trace results from the CPU module and display them.
1) Read the trace results from the CPU module by using "4. ( ) Read from PC
(Results)" on the "Sampling Trace" screen.
2) Display the trace results by using "4. ( ) Trace Results Display" on the
"Sampling Trace" screen.
POINT

Once the sampling trace has been executed, the second is not executed. To
execute the trace again, execute the STRAR instruction to reset sampling trace.
NOTE
1) Set sampling trace files in the RAM area of the memory card.
2) It is possible to execute sampling trace from another station in the network, or
from a serial communication module. However, sampling trace cannot be
executed from more than one site at the same time. With the Q2ASCPU,
sampling trace can be executed from only one site at a time.
3) Since the trace condition registered in the CPU module is latched, the
condition data is retained even when the programmable controller power is
turned OFF. The data can be cleared by performing a latch clear operation
using the RUN/STOP key switch on the Q2ASCPU.
4) The Q2ASCPU must be connected to the peripheral device capable of GPP
functions in order to execute sampling trace.

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DEBUGGING FUNCTION

8.6

Status Latch Function

This function collects the data of devices at designated moment.
POINT

When executing status latch function, a memory card is required.

Application
This function is used to retain the statuses of devices used in a program at designated
moment during debugging.

Function Description
(1)

Function
(a) Status latch stores the device statuses at designated moment in a status latch
file of a memory card.
(b) The status latch file stores the status latch condition and status latch execution
data for status latch execution.
Saving the device statuses can be executed in the following case.
When executing SLT instruction in a program
When specifying a status latch start at GPP functions
When the conditions of the set devices and step Nos. are met
(c) The status latch results show the bit device ON/OFF statuses and word devices
values at designated moment.

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DEBUGGING FUNCTION

(2)

Basic operation
The following shows the basic operation for status latch.
The statuses during execution of the status latch function can be checked by
monitoring special relays SM806 to SM809 and SM827.

(3)

The following shows the operation at error occurrence.

When an error occurs during status latch, SM827 comes ON, and at the same time
SM808 (completed) is turned ON.
To turn SM827 OFF, either turn SM809 ON or execute the SLTR instruction.

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DEBUGGING FUNCTION

Operation Procedures
The following shows procedures for status latch.
All operations are performed on the "Status Latch" screen of the trace menu in the online
mode.
(1)

Setting the status latch condition

Set the status latch condition at "2. ( ) Status Latch Condition Setting" on the "Status
Latch" screen.

The following shows an explanation of the screen above:

Either "1. Status Latch Device Setting" or "2. Trigger Point" can be set for the status
latch condition setting.
(a) "Status Latch Device Setting"
Set the devices to execute the status latch. Select one of the following:
1) All Internal Dev

: Whether or not QnACPU latches all built-in devices

is set.

2) Specify Detail Range : The device types and numbers of points are set.
The following shows setting examples:

(Applicable devices)
1) Bit device

: X, Y, M, L, F, SM, V, B, SB, T (Contact), T (Coil), C

(Contact), C (Coil), ST (Contact), ST (Coil), J

\X, J

\Y,

J \B, J \SB, BL \S
2) Word device

: T (Current value), ST (Current value), C (Current value),

D, SD, W, SW, R, ZR, U

\G, J

\W, J

\SW

REMARK
Up to 1000 device ranges can be set including both bit devices and word devices.
The devices listed above cannot be qualified.

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DEBUGGING FUNCTION

(b) "Trigger Point"

Set the condition to execute the status latch. Select one of the following:
1) At Instruction Execution : When executing SLT instruction
2) At Request of PDT

: When operating trigger using the peripheral

devices capable of GPP function.

3) Specify Detail Condition : Set a device and step number.

The following shows setting examples: The details
on how to make the settings and trigger execution
timing are the same as described in Section 8.2.1
Monitor condition setting in Monitor function.
Data collection timing
In the case that only "Device" is specified, data
are collected when the trigger condition is
satisfied.
In the case that "Step No." only is set, data is
collected with the END processing when the
trigger condition is satisfied.

(2)

Write the created status latch condition to the memory card.

(a) Set the status latch file and storage destination.
Set the status latch condition at "1. ( ) Exec Status Latch & Disp Status" on the
"Status Latch" screen.

(b) Write the status latch file to the memory card.

Write the status latch file to the memory card using "7. ( ) Write to PC
(Condition)" on "Status Latch" screen.
Since file names are used when writing to the memory card, multiple status latch
files can be written.

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DEBUGGING FUNCTION

(3)

Execute the status latch.

Execute the status latch by using "1. ( ) Exec Status Latch & Disp Status" on "Status
Latch" screen.
The following shows a setting example for "1. ( ) Execute Status Latch & Display
Status".

The following is an explanation of the screen above:

The following settings can be made for "Exec Status Latch & Disp Status": "1
Operation", "2 Status Latch", and "3 Trace Condition".
(a) "Operation"
Select one of the following:
1) Register, Start

: The status latch is registered and started.

Device data collection is started.

2) Suspension

: The status latch statuses are cleared.

3) Display Status

: The status latch statuses are displayed on

the same screen.

4) Trigger execution

: The trigger is executed. (Refer to Precaution

6).)

(b) "Status Latch"

Select one of the following:
1) Select From List

: Data from among the status latch files in the memory

card are selected.

2) File Shown Right

: The drive number and status latch file name are set.

(c) "Trace Condition"

Select one of the following:
1) Overwrite Conditions onto CPU's : The status latch condition in an existing
status latch file is overwritten.
2) Use Condition in CPU

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: Status latch under the condition in the

status latch file designated in "2. Status
Latch" is executed.

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DEBUGGING FUNCTION

(4)

Retrieve the status latch results from the CPU module and display them.
(a) Read the status latch results from the CPU module by using "8. ( ) Read from PC
(Results)" on "Status Latch" screen.
(b) Display the read trace results by setting "1. ( ) Monitor Target" on the "Monitor
Target Setting" screen of "Option" menu in the ladder mode to "3. ( ) Status
Latch".
NOTE
1) Set status latch files in the RAM area of the memory card.
2) It is possible to execute status latch from another station in the network, or from a
serial communication module. However, sampling trace cannot be executed from
more than one site at the same time.
With Q2ASCPU, sampling trace can be executed from only one site at a time.
3) Since the status latch conditions registered in the CPU module are latched, the
status latch data is retained even when the power is turned OFF.
The data can be cleared by performing a latch clear operation using the RUN/
STOP key switch on the Q2ASCPU.
4) Status latch is performed by connecting the Q2ASCPU with the peripheral devices
capable of GPP function.
5) When the monitor destination is set to the "status latch", set values of the timer/
counter are not displayed.
"0" is displayed for the column of the timer/counter set values.
6) When "device" is specified in the detailed condition for trigger point setting,
"device" is specified. When the condition is satisfied before execution of the
trigger, trigger cannot be executed.
REMARK
1) When the monitor destination is set to "device memory", the set values of the
timer/counter are not displayed.
"0" is displayed in the set value column of the timer/counter.

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DEBUGGING FUNCTION

8.7

Step Operation
This function runs one step or one part of a program, runs a program with a part skipped.

Application
This function is used to determine the causes of faults during debugging.

Function Description
This function can only be used when the CPU module is set to STEP-RUN.
The step operation function provides the following three functions. For explanations of
each function, refer to Section 8.7.1 through Section 8.7.3.
Step execution
Partial execution
Skip execution

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8.7.1

DEBUGGING FUNCTION

Step execution
Step execution is a sequence program execution that performs by one step at a time,
starting from the designated step.
It allows a sequence program execution while checking an execution status of the
sequence program and the contents of each device during debugging.
There are two types of step execution as described below:
(1)

Step execution for one instruction

Instructions are executed one for each step starting from the step where program
operation is stopped. Program operation is stopped again after execution of each
instruction.
This method is used to confirm the status of each devices after execution of one
instruction.

Fig. 8.2 Step execution for each instruction

(2)

Step execution with designated loop count

Program execution is repeated for the designated loop count (range: 1 to 32767)
beginning with step 0 or the step where program operation was last stopped, and is
stopped at the designated step (break point).

Fig. 8.3 Step execution with designated loop count

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DEBUGGING FUNCTION

Operation Procedures
The following shows the procedures to perform step execution.
All operations are performed on Monitor/test screen in the ladder mode (debugging).
(1)

Select "B/Step Run".

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8.7.2

DEBUGGING FUNCTION

Partial execution
The sequence program is executed from the start step or the step where operation is
currently stopped to a designated step (break point).

Fig. 8.4 Partial execution

Operation Procedures
The following shows the procedures to perform partial execution.
All operations are performed on Monitor/test screen in the ladder mode (debugging).
(1)

Designate the execution start step, break condition, and execution operation with
GPP function.
(a) Setting the execution start step
Designate the step at which partial execution is started at "1. Partial Run" on the
"Partial Run" screen.

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DEBUGGING FUNCTION

(b) Setting the break condition

Set the device status and break point at "2. Break Cond" on the "Partial Run"
screen.

The following shows the devices that can be set.

1) Bit device

: X, FX, DX, Y, FY, DY, M, L, F, SM, V, B, SB, T (Contact), T

(Coil), ST (Contact), ST (Coil), C (Contact), C (Coil), J
J

2) Word device

\Y, J

\B, J

\SB, BL

\X,

\S

: T (Current value), ST (Current value), C (Current value), D,

SD, FD, W, SW, R, Z, ZR, U

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\G, J

\W, J

\SW

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DEBUGGING FUNCTION

(c) Setting the execution operation

Set the scan time, interrupt status, and refresh, at "3. Option" on "Partial Run"
screen.

*Multiple setting can be made.

The following shows all settings.

Item
Scan time

Interrupt status

Description
Designates whether QnACPU executes the scan time by the actual time or by
the designated time. (Default: designated time 10ms)
Designates whether or not interrupts are prohibited during execution.
(Default: "Inhibit")
Designates whether QnACPU executes I/O refresh whenever program

Refresh

execution is stopped due to satisfaction of a condition, or executes only at END

processing.
(Default: "Successively")

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8.7.3

DEBUGGING FUNCTION

Skip function
Skip execution or partial execution of a program whereby the program is executed with the
designated step(s) skipped.

Fig. 8.5 Skip execution

Operation Procedures
The following shows the procedures to perform skip execution.
All operations are performed on Monitor/test screen in the ladder mode (debugging).
(1)

Set the program range to be skipped using GPP function.

Designate the step number(s) to be skipped on "D/Skip Run" screen.

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DEBUGGING FUNCTION

8.8

Program Trace Function

This function collects program execution statuses.
POINT

When executing the program trace function, a memory card is required.

Application
This function is used to check the execution status of any step of any program during
debugging.
This enables debugging time to shorten.

Function Description
(1)

Function
(a) The program trace function collects the execution status of the designated step
of the designated program and stores it in a program trace file in the memory
card.
(b) The devices that can be traced are listed below.
1) Bit device

: X, FX, DX, Y, FY, DY, M, L, F, SM, V, B, SB, T (Contact), T

(Coil), ST (Contact), ST (Coil), C (Contact), C (Coil), J
J

2) Word device

\Y, J

\B, J

\SB, BL

\X,

\S........................Max. 50 points

: T (Current value), ST (Current value), C (Current value), D,

SD, FD, W, SW, R, Z, ZR, U \G, J \W, J \SW

......................................................................Max. 50 points
(c) The program trace file stores the trace condition data and trace execution data to
execute a program trace. After a trace is started in a peripheral device capable of
GPP functions, it is continued until the set number of traces is completed.
(d) The trace results show the program name, step No. device status, etc., for each
trace No.

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DEBUGGING FUNCTION

(2)

Basic operation
The following shows the basic operation for program trace.
The statuses during execution of the program trace function can be confirmed by
monitoring special relays SM810 to SM815 and SM828.

Without suspension of the trace

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DEBUGGING FUNCTION

With trace suspension

The following shows an operation at error occurrence.

When an error occurs during program trace, SM828 (program trace error) comes ON,
and at the same time, SM811 (program trace start) goes OFF.
To turn SM828 OFF, either turn SM811 ON, or execute the PTRA instruction.

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DEBUGGING FUNCTION

Operation Procedures
The following shows the procedures to perform program trace.
These operations are performed on the "Program Trace" screen of the trace menu in the
online mode.
Perform these operations with the CPU module setting to the STEP-RUN. (Refer to
Section 8.7.)

(1)

Set the trace devices and trace conditions with GPP function.
(a) Setting the trace devices
Set the devices at "Trace Device Setting" on the "Program Trace" screen.

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DEBUGGING FUNCTION

(b) Setting the trace conditions

Set the trace conditions at "Trace Condition Setting" on the "Program Trace"
screen.

The following is an explanation of the screen above:

One of the following three settings can be made for the trace condition: "1. Trace
Counts", "2. Trace Point", or "3. Trigger Point".
1) "Trace Counts"
For the total count, set the number of program traces executed from the trace
start to the trace end.
For the count after the trigger, set the number of program traces executed
from execution of the trigger to the trace end.
The following shows the formula that sets range for these counts:
Count after trigger total count 8192
2) "Trace Point"
Set the point at which the trace is to be executed. Select one or multiple
item(s) of the following:
Branch Instruction :Executed at each CALL, JMP, or other instructions.
Every Interruption

:Executed at each interrupt program.

Upon execution of :Executed at each PTRAEXE instruction.

each instruction

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DEBUGGING FUNCTION

3) "Trigger Point"
Set the point at which the trigger is executed. Select one of the following:
Upon execution of : When executing PTRA instruction
each instruction
At Request of PDI : When operating trigger using the peripheral devices
capable of GPP function.
Specify Detail
Condition

: Set a device and step number.

The following shows setting examples: The details
on how to make the settings and trigger execution
timing are the same as described in Section 8.2
Monitor condition setup in Monitor function.

The following shows the setting device under the detailed condition.
Bit device

: X, FX, Y, FY, M, L, F, SM, V, B, SB, T (Contact), ST

Word device

: T (Current value), ST (Current value), C (Current value), D,

(Contact), C (Contact), J

\X, J

\Y, J

\B, J

\SB, BL \S

SD, FD, W, SW, R, Z, ZR, U \G, J \W, J \SW

The following qualifications are possible with respect to the devices listed
above.
Digit designation for bit devices
Bit number designation for word devices
POINT

The trace execution time, program name, step and branch factor are automatically
added to the trace results.

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DEBUGGING FUNCTION

(2)

Write the set trace device and trace condition to the memory card.
(a) Set the trace file and storage destination.
Set the drive number and file name at "1. ( ) Execute Trace & Display Status" on
"Program Trace" screen.

(b) Write the trace file to the memory card.

Write the trace file to the memory card by using "9. ( ) Write to PC (Condition)" on
"Program Trace" screen.
Since file names are used when writing to the memory card, multiple trace files
can be written.

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DEBUGGING FUNCTION

(3)

Execute the program trace.

Write the trace file to the memory card by using "9. ( ) Write to PC (Condition)" on
"Program Trace" screen.
The following shows a setting example for "1. ( ) Execute Trace & Display Status".

The following is an explanation of the screen above:

The following settings can be made for "Execute Trace & Display Status": "1.
Operation", "2. Program Trace Data", and "3. Trace Condition".
(a) "Operation"
Select one of the following:
1) Register, Start

The trace is started. The trace count is started.

2) Suspension

The trace is suspended.The trace count and the count

are cleared after the trigger. (To restart the trace,
select "Register, Start" again.)

3) Display Status

The trace statuses are displayed on the same screen.

4) Trigger Execution :

The count is started after the trigger.

The trace is ended on reaching the designated count
after the trigger.

(b) "Program Trace Data"

Select one of the following:
1) Select From List

Data from among the program trace files in the

memory card are selected.

2) File Shown Right

The drive number and program trace file name are

set.

(c) "Trace Condition"

Select one of the following:
1) Overwrite Conditions onto CPU's :

The trace condition in an existing trace

file is overwritten.

2) Use Condition in CPU

Program trace under the condition in

the trace file designated in "2. Program
Trace Data" is executed.

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DEBUGGING FUNCTION

(4)

Retrieve the trace results from the CPU module and display them.
(a) Read the trace results from the CPU module by using "A. ( ) Read from PC
(Results)" on "Program Trace" screen.
(b) Display the read trace results by using "4. ( ) Trace Results Display" on "Program
Trace" screen.
POINT

Once the program trace has been executed, the second is not executed. To
execute the trace again, execute the PTRAR instruction to reset program trace.
NOTE
1) The program trace can be performed only for STEP-RUN.
2) Set program trace files in the RAM area of the memory card.
3) It is possible to execute program trace from another station in the network, or
from a serial communication module. However, sampling trace cannot be
executed from more than one site at the same time. With the Q2ASCPU,
sampling trace can be executed from only one site at a time.
4) The program trace is performed by connecting the Q2ASCPU with the
peripheral device capable of GPP function.

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DEBUGGING FUNCTION

8.9

Simulation Function

POINT

When the link memory and the buffer memory are simulated in the simulation data
file, a memory card is required.

Application
This function simulates execution of a program in step execution or partial execution, with
the input module, output module, or special function module isolated from the CPU
module.This enables QnACPU to debug a program without any effects on other modules.

Function Description
(1)

When the program is executed, data chaneges from/to external sources are isolated
by setting so that data refreshes for input/output modules are not executed.

(2)

Isolation from special function module operations is achieved by setting "Ignore" or

"Depend on Simulation Data File" with respect to the buffer memory of the special
function module.

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DEBUGGING FUNCTION

Operation Procedures
The following shows the procedures to perform simulation.
indicates a GPP function operation and
module.

indicates an operation at the CPU

Set the "Simulation Range" in the device mode.

Using the PLC menu, write the set simulation range as a

simulation file.
Switch to the
ladder mode.

Select "Monitor Target Setting" in the Option menu, and

set "1. ( ) Monitor" for "2. Buffer Memory Link Memory".

Switch to the debug mode ( Shift + F2 ).

Switch to STEP-RUN

(Refer to Section 8.7.)

Select "E/Simulation" in the Monitor/test menu.

(*)

Select "3. Depend on Simulation Data File" for "3. Link

Memory Buffer Memory" and set the drive name to be used
and file name.

(*)

Select "9. /Device Test" from the Monitor/test menu and set the
device status.

Perform step execution or partial execution.

The operation results are stored in the memory card.
Data read and written to the memory card is
monitored at peripheral device for GPP function.
(*) Described in this section.

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(Refer to Section 8.7.)

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DEBUGGING FUNCTION

(1)

Make the settings on the simulation setting screen shown below.

The following shows details on the settings that can be made for each item:
Setting Item

Setting Option

Input Refresh

Yes/No

Output Refresh

Yes/No

Description
Select whether inputs from external sources are input
to the CPU module or not.
Select whether the operation results in the CPU
module are output to external destinations or not.

Access Unit
Link Memory/

Ignore

Buffer Memory

Depend on Simulation
Data File

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Select the method of accessing each module.

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DEBUGGING FUNCTION

If "Depend on Simulation Data File" is selected for "Link Memory/Buffer Memory", the
access range for each module can be checked by checking the simulation range settings.

NOTE
1) Simulation can be performed only for STEP-RUN.
2) A memory card is required to carry out link memory/buffer memory simulation
using a simulation data file.
Set the simulation data file to the RAM area of the memory card.
3) It is possible to carry out simulation from another station in the network, or
from a serial communication module. However, simulation cannot be
executed from several sites at the same time. With the Q2ASCPU, sampling
trace can only be executed from one site at a time.
4) Simulation is performed by connecting the Q2ASCPU and the peripheral
devices capable of GPP function.
5) Note the following points when executing simulation:
If direct inputs (DX) and direct outputs (DY) are used to handle inputs/
outputs directly, the device memory is accessed rather than the actual
inputs/outputs.
No processing is performed for any special function module instruction.
When a "SP.UNIT ERROR" occurs, FFFFH is displayed in the module
number area of the common information.
If "Ignore" is set for the buffer memory access method, FFFFH is set for
access by instruction and the monitor results.

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DEBUGGING FUNCTION

8.10 Debugging by Several People

This function allows simultaneous debugging from several peripheral devices capable of
GPP functions.

Application
This function is used to simultaneously debug different files from more than one peripheral
device capable of GPP functions.

Function Description
The following shows the combinations of debugging functions that can be used
simultaneously by different operators.
Debug function from other stations
Debug function from
host

Monitor

Write during

Execution Time

Sampling Trace

RUN

Measurement

/Program Trace

Status Latch

Step
Operation

Simulation

Monitor
Write during RUN
Execution time
measurement
Sampling trace
Program trace
Status latch
Step operation
Simulation

: Simultaneous execution possible. (However, the detailed condition setting at

only one peripheral device capable of GPP functions is valid; detailed
conditions cannot be set at the other peripheral devices capable of GPP
functions.)
: Can only be executed from one peripheral device capable of GPP functions.

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DEBUGGING FUNCTION

8.10.1 Simultaneous monitoring by several people

The Q2ASCPU allows monitoring for several people. Setting of other station monitor file in
the built-in RAM system area allows monitoring at a high-speed from other stations.
(Monitor file setting for the host is not required.)

Operation Procedures
The operation for simultaneous monitoring by several people is described below.

(1)

Select "5. ( ) Format (with Option)" for "B/PC Memory Batch Processing" in the "2/
PC" menu in the online mode, and set a monitor file for another station.
The following shows setting examples:

Up to 15k steps in 1k step units can be set as the system area. The area
corresponding to one monitor file for another station is no more than 1k step.
Accordingly, a maximum of 15 monitor files can be set.
Since the built-in RAM program file area is in the same area as the monitor file for
other stations, the program file area is reduced for the area of the other station
monitor file.
(2)

After setting, the built-in RAM is formatted.

NOTE
1) The detailed conditions for monitoring can be set from one site only.
2) Monitoring from other stations is possible without setting monitor files for
other stations, but in this case, high-speed monitoring is not possible.
3) When simultaneous monitoring from multiple persons is desired, perform this
operation before writing the parameter file or the program file in the built-in
RAM.
If this operation is performed after writing the file in the built-in RAM, all files
are erased.
4) The number of locations for simultaneous access to one CPU is up to 16.

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DEBUGGING FUNCTION

8.10.2 Simultaneous execution of write during RUN by several people

The Q2ASCPU allows simultaneous write during RUN to one file or another file by several
people.

Operation Procedures
The following shows the procedures for simultaneous write during RUN executed by
several people.
(1)

With "4/ Write & Conversion Setting" in "8/ Option" menu of the ladder mode, "4.
Write During RUN Setting" and "7. Write Method at Write During RUN" are set.
The following shows setting examples:

(a) Set "1. ( ) Write into PC during Run state" for "4. Write During Run Setting".
(b) Select "1. ( ) Normal" or "2. ( ) Relatively using Pointer" for "7. Write Method at
Write During Run".
If more than one person is to perform a write during RUN operation with respect to
the same file, set a write during RUN pointer in advance and select "2. ( ) Relatively
using Pointer".

8 - 63

8.

DEBUGGING FUNCTION

The example below shows a case where peripheral device capable of GPP functions
A performs write during RUN from P0, and peripheral device capable of GPP
functions B performs write during RUN from P1.The program enclosed in the frame
is the program subject to write during RUN.
Writes P0 or later in the
machining program in RUN.
P0

Writes P1 or later in the

machining program in RUN.

X0 X2

P0

Y30

Y30
X1

X1

P1

X0 X2

Serial
communication
module
A1SJ71QC24

X3 X4
SET M10

P1

X3 X4
SET M10

X5

X5

END

END

Peripheral device A
capable of GPP
functions

Peripheral device B
capable of GPP
functions

NOTE
Refer to Section 8.3.

8 - 64

9.

MAINTENANCE FUNCTION

MAINTENANCE FUNCTION

9.1

Function List
The following shows the functions for maintenance.
Item
Watchdog timer

Self-diagnostics function

Error history

System protect

Keyword Registration

System display

LED indication

Description
Function that monitors watchdog errors due to CPU module
hardware or program errors.
Function whereby the Q2ASCPU itself diagnoses whether or not
there are any errors.
Function that stores the results of diagnosis in memory as a fault
history.
Function that sets whether reading/writing is enabled or disabled
for Q2ASCPU files.
Function that disables GPP function operations with respect to the
CPU module.
Function that allows monitoring of the system configuration by
connecting a peripheral device capable of GPP functions.
Function to display the CPU module operation status with the LED
located on the front of the CPU module.

Reference
Section 9.2

Section 9.3

Section 9.4

Section 9.5

Section 9.6

Section 9.7

Section 9.8

LED indication

Indicates whether CPU module operation is normal or abnormal.

Section 9.8.1

Priority setting

Priority for LED indication is set depending on the error.

Section 9.8.2

For details of GPP function operation, refer to the GX Developer Operating Manual or the
Type SW IVD-GPPQ Software package Operating Manual (Online).

9-1

9.

MAINTENANCE FUNCTION

9.2

Watchdog Timer
(1)

Watchdog timer (WDT)

The watchdog timer is an internal timer of programmable controller that detects
programmable controller CPU hardware errors and sequence program errors.
200ms is set as the default setting for this timer.

REMARK
The time set for the watchdog timer can be changed using "WDT" in PC RAS setting
in the GPP function parameter mode.
The setting range is 10ms to 2000ms (in 10ms units).

(2)

Resetting the watchdog timer

The Q2ASCPU resets the watchdog timer during END processing.
When the Q2ASCPU is normally operating and executing the END instruction within
the setting value of the watchdog timer, the watchdog timer does not give time-out.
WDT times out when the END instruction is not executed within the value set for the
watchdog timer due to a Q2ASCPU hardware error or an excessively long sequence
program scan time.

REMARK
Scan time is the time taken for the execution of the sequence program, starting from
step 0 and ending at step 0.
The scan time is not the same in every scan: it differs according to the execution or
non-execution of the instructions used in the program. (Refer to Section 12.1.)

Sequence program

Internal processing time

Low-speed execution
type program C

Scan execution

0 type program A

WDT reset
(Internal processing of a
programmable controller)

Scan execution
type program B

END

Scan time
Time measured by watchdog
timer

Next scan time

WDT reset
(Internal processing of a
programmable controller)

Fig. 9.1 Resetting the watchdog timer

9-2

9.

MAINTENANCE FUNCTION

(3)

Processing when the watchdog timer times out

When the scan time exceeds the set value of the watchdog timer, a watchdog timer
error occurs and the programmable controller operates as follows.
(a) All PLC outputs are turned OFF.
(b) The RUN LED on the front of the CPU module goes off and the ERROR LED
flickers.
(c) SM1 turns ON and the error code is stored in SD0.

REMARK
The watchdog timer can be reset by a WDT instruction in the sequence program.
However, the scan time value is not reset and scan time is measured up to the END
instruction.
POINT

An error occurs within 0ms to 10ms in the measured time for watchdog timer.

9-3

9.

MAINTENANCE FUNCTION

9.3

Self-diagnostics Function
The self-diagnosis function is a function whereby the Q2ASCPU diagnoses its own errors.
(1)

The self-diagnosis function serves to prevent malfunctions of the programmable

controller, and to facilitate preventive maintenance.Self-diagnositics processing is
executed if an error occurs at QnACPU power ON or while the programmable
controller is in the RUN status, and it involves the display of the error detected by the
self-diagnostics function, stopping of programmable controller operation, etc.

(2)

The Q2ASCPU stores the error code of the error in the special register SD0, and
turns on the ERROR LED and displays a message.
If several errors occur, the error code of the latest error is stored in SD0.

(3)

Even if the programmable controller power is turned OFF, the latest 16 errors are
recorded with the battery backup.(Refer to 9.4?)
The PLC diagnostics mode of the GPP function can check error histories.

(4)

When an error is detected by self-diagnosis, CPU module operation complies with

one of the following two modes:
Mode in which programmable controller operation is stopped
When an error is detected, operation is stopped immediately and all outputs (Y) are
turned OFF.
Mode in which programmable controller operation is continued
When an error is detected, only the program part affected by the error is not
executed; the rest of the program is executed.
In addition, settings can be made in PC RAS setting in the parameter mode to
continue operation or stop operation when the following errors occur:
1) Calculation (including SFC programs)
2) Extended Ins
3) Fuse Blown
4) I/O Unit Compare
5) Sp Unit Access
6) IC Card Access
7) IC Card Operate
(The default for all of these in the parameters is "Pause".)
Example: If "Resume" is set for I/O module verify error, operation is continued using I/
O address before error occurrence.
When an error is detected, a record of the error occurrence is stored in the special
relays (SM0, SM1) and the error contents are stored in a special register (SD0).Use
these special relays and this special register in the sequence program to establish
programmable controller or mechanical system interlocks.

9-4

9.

MAINTENANCE FUNCTION

(5)

It is possible to select whether or not the following checks are performed by setting
"Yes/No" for error check in PC RAS setting in the parameter mode.
1) Battery Check
2) Fuse Blown Check
3)
(The default for all of these in the parameter settings is "Yes".)
If "No" is set for error check, error detection is not performed for these items, which
shortens the processing time for the END instruction.
Even if "Yes" for error check is set in the parameter, 1) thorugh 3), above error check,
can be canceled by turning on the special relay SM 1084.
However, if "No" is set in the parameter, turning off SM1084 is ineffective to execute
the error check.

9-5

9.

MAINTENANCE FUNCTION

Self-diagnostics list

Hardware error

Diagnosis item

RUN

ERROR

Always

Stop

OFF

Flickers

END instruction not executed

When executing END instruction

Stop

OFF

Flickers

RAM check

At power-ON or RESET

Stop

OFF

Flickers

Operation circuit check

At power-ON or RESET

Stop

OFF

Flickers

Fuse blown

When executing END instruction

Stop/Continue

OFF/ON

Flickering/ON

Stop

OFF

Flickers

(Default

stop)*1

I/O interrupt error

(Default

check executed)*2

When interruption occurs

Special function module error

At power-ON or RESET
When executing FROM/TO instruction

Stop

OFF

Flickers

Control bus error

At power-ON or RESET
When executing FROM/TO instruction

Stop

OFF

Flickers

Continue

ON

OFF

Continue

ON

OFF

Stop/Continue

OFF/ON

Flickering/ON

When power is ON or RESET

When switching from STOP to RUN

Stop

OFF

Flickers

When executing FROM/TO instruction

Stop/Continue

OFF/ON

Flickering/ON

(Default

I/O module verification

(Default

stop)*1

Special function module

Special function module
allocation error
Special function module
access error
(Default

Always
Always

Low battery

Handling error

LED Status

CPU module error

Occurrence of momentary
power interruption

check executed)*3

When executing END instruction

(Default

check executed)*2

stop)*1

No parameters

When power is ON or RESET

Stop

OFF

Flickers

Boot error

When power is ON or RESET

Stop

OFF

Flickers

Stop/Continue

OFF/ON

Flickering/ON

Stop

OFF

Flickers

Stop/Continue

OFF/ON

Flickering/ON

Stop

OFF

Flickers

Memory card operation error

(Default

stop)*1

File setting error

File access error
(Default

stop)*1

Unable to execute instruction

Parameter errors

Status of the CPU

module

Diagnosis timing

When memory card is inserted/removed

When power is ON or RESET
When executing each instruction
When power is ON or RESET

Parameter setting check

When power is ON or RESET

When switching from STOP to RUN

Stop

OFF

Flickers

Link parameter error

When power is ON or RESET

When switching from STOP to RUN

Stop

OFF

Flickers

Stop

OFF

Flickers

SFC parameter error

When switching from STOP to RUN

*1
*2
*3

Can be changed to operation continues by GPP function parameter setting.

GPP function parameters can be set so that no check is performed.
Also, checking is not performed when SM251 is on.
GPP function parameters can be set so that no check is performed.

9-6

9.

MAINTENANCE FUNCTION

Self-diagnostics list(Continued)
Diagnosis item

LED Status
RUN

ERROR

Instruction code check

When power is ON or RESET

When switching from STOP to RUN

Stop

OFF

Flickers

No END instruction

When power is ON or RESET

When switching from STOP to RUN

Stop

OFF

Flickers

Pointer setting error

When power is ON or RESET

When switching from STOP to RUN

Stop

OFF

Flickers

Pointer setting error

When power is ON or RESET

When switching from STOP to RUN

Stop

OFF

Flickers

When executing each instruction

Stop/Continue

OFF/ON

Flickering/ON

FOR-NEXT instruction
configuration error

When executing each instruction

Stop

OFF

Flickers

CALL-RET instruction
configuration error

When executing each instruction

Stop

OFF

Flickers

Interrupt program error

When executing each instruction

Stop

OFF

Flickers

Unable to execute instruction

When executing each instruction

Stop

OFF

Flickers

When executing each instruction

Stop/Continue

OFF/ON

Flickering/ON

Operation error
(Default

Program error

Status of the CPU

module

Diagnosis timing

stop)*1

Extended instruction error

(Default

stop)*1

SFC program configuration

error

When switching from STOP to RUN

Stop

OFF

Flickers

SFC block configuration error

When switching from STOP to RUN

Stop

OFF

Flickers

SFC step configuration error

When switching from STOP to RUN

Stop

OFF

Flickers

SFC syntax error

When switching from STOP to RUN

Stop

OFF

Flickers

Stop/Continue

OFF/ON

Flickering/ON

Continue

ON

ON

SFC operation check error

(Default

stop)*1

When executing each instruction

When switching from STOP to RUN

SFC block execution error

When executing each instruction

Stop

OFF

Flickers

SFC step execution error

When executing each instruction

Stop

OFF

Flickers

Watchdog error supervision

Always

Stop

OFF

Flickers

Program timeout

Always

Continue

ON

ON

Annunciator check

When executing each instruction

Continue

ON

OFF

CHK instruction check

When executing each instruction

Continue

ON

OFF

CPU error

SFC program execution error

*1

Can be changed to operation continues by GPP function parameter setting.

9-7

9.

9.3.1

MAINTENANCE FUNCTION

Interruption due to error detection

Q2ASCPU can execute the interrupt program, which is interrupt pointer I32 to I39, at error
occurrence.
In the case of errors for which operation can be set to continue or stop in PC RAS setting
in the GPP function parameter mode, this function is only executed when "Resume" is set.
If "Pause" is set for the error, a stop error interrupt program (132) is executed.
The following shows the relevant errors.
Interrupt pointer Corresponding error message
I32
Stop all errors
I33
I34

Vacancy
UNIT VERIFY ERR.
FUSE BREAK OFF
SP.UNIT ERROR

I35

OPERATION ERROR
SFCP OPE.ERROR
SFCP EXE.ERROR

I36

ICM.OPE.ERROR
FILE.OPE.ERROR

I37

EXTEND INS.ERR.
PRG.TIME OVER

I38
I39

CHK instruction
Annunciator detect

I40 to I47

Vacancy

When the error occurs and the

system can continue the drive
mode. Or it is an error where
"continues/stops" can be selected,and "continues" is set.

POINT

Interrupt pointers I32 to I39 are prohibited for execution when the PLC power is
ON or when the CPU module is reset.
To use I32 to I39, make the execution allowed with IMASK instruction.

REMARK
1) For details on interrupt pointers, refer to the QnACPU Programming Manual
(Fundamentals).
2) For the IMASK instruction, refer to the QCPU (Q mode)/QnACPU
Programming Manual (Common Instructions).
9.3.2

LED inidcation due to an error

When an error occurs, the LED located on the front of the CPU module turns on.Refer to
Section 9.8 for the details of the LED display.

9-8

9.

9.3.3

MAINTENANCE FUNCTION

Resetting error
Q2ASCPU allows error resetting only for the errors that does not block the CPU module
operation.
The procedure for resetting an error is as follows.
1) Eliminate the cause of the error.
2) Store the error code to be reset in special register SD50.
3) Turn on special register SM50.
4) The error is reset.
When the CPU module is recovered from canceling the error, the special relay, special
register, and LED affected by the error are set to the state before the error occurred.
If the same error occurs again after the error reset, it is recorded in the error history again.
To reset multiple detected annunciators, only the first detected F number is reset.

POINT

When an error is reset by storing its error code in SD50, the last two digits of the
error code are ignored.
Example:
If errors with error codes 2100 and 2111 have occurred, and error code 2100 is
reset, error code 2111 is also reset.

9-9

9.

MAINTENANCE FUNCTION

9.4

Error History
Q2ASCPU can record the results detected by the self-diagnostics function with the
detection time in memory as an error history.

POINT

Since the internal clock of the Q2ASCPU is used for setting the detection time, be
sure to set the correct time before using the CPU module. (Refer to Section 10.5
for setting method of the clock.)

(1)

Storage area
(a) The latest 16 errors are stored in the error history storage memory of the CPU
module, which is latched.
(b) In the case of storing more than 16 errors, they can be stored to files in a
memory card by making the appropriate setting in the PC RAS settings in the
GPP function parameter mode.
(c) If a discrepancy arises between the parameters and memory card error history
when executing 1) or 2) below, the contents of the error history files are cleared
first, and the 16-point data of the fault history storage memory of the CPU is
transferred to the history file.
1) The number of error records in the history file as set in the parameters is
changed part way through.
2) A memory card whose capacity does not match the number of error records
set in the parameters is installed.
(d) The following shows the storage area for the error history file:
Storage area

File in set memory card

Number of storable error records

Max. 100 (can be changed)*1

*1

When the number of errors that can be stored is exceeded, the oldest error record is cleared
and the newest one stored in the same place.

POINT

Even if the error history file set in the parameters does not exist in the memory
card, no CPU module error occurs.
The CPU module performs only the processing that stores errors in the error
history storage file.
(2)

Clearing the error history

The error history is cleared by using the error history clear function in the PLC menu
in the PLC diagnosis mode of GPP function.
The error history clear function erases all details in the error history storage memory
of the CPU module and in the error history file of the memory card.

9 - 10

9.

MAINTENANCE FUNCTION

9.5

System protect
Q2ASCPU features a number of functions that protect against program changes ("system
protect") by restricting general data processing (access processing from GPP functions,
serial communication modules, etc.) by third parties other than designers.
The following system protect functions are available.

Target Protection

Valid File for Protection

Description

Method

Valid Timing

Remark

Turn ON SW1 of system

setting switch 1 on the main
CPU module .
(See Section 15.2.)

Always

Valid for
devices

Whole of CPU module

All files

Batch prohibition of write/control to

the CPU module.

Memory card units

All files

Turn ON the memory card's

Establishes write protect for the
write protect switch.
memory card and prohibits writing.
(Refer to Section 18.5)

Always

Drive units

Parameter Program

Registers entry codes for the

following settings in relation to a
specific drive (Example: Built-in
RAM):
1) Prohibiting read/write display
2) Prohibiting writing

Register password.
(Refer to Section 9.6)

Always

File units

All files

Changes attributes file for each file

as follows:
1) Prohibiting read/write display
2) Prohibiting writing

Change file attributes by

password registration.
(Refer to Section 9.6)

Always

"Control direction", "read/write display" and "writing" in the table above have the following
meanings:

Item
Control
instruction
Read/write
display
Write

Description
CPU module operation instruction by remote operation (Remote RUN, Remote STOP, etc.)

Operations of program read/write

Operations that involve write processing, such as program write and test.

9 - 11

9.

MAINTENANCE FUNCTION

9.6

Password Registration
Passwords serve to prohibit reading and overwriting of data such as programs, comments,
etc., in the Q2ASCPU from a peripheral device.
In password registration, the parameter files and program files of a designated memory
(built-in RAM, memory card) are made the target of the entry code. There are two types of
registration as follows:
File names are not displayed, and read/write are prohibited.
File write is prohibited. (Read is possible).
When a password is registered, file operations from a peripheral device are not possible
without inputting the entry code registered in the CPU module.
(1)

Register Password
Entry codes are registered using the entry code registration function in the PLC menu
of the online mode of GPP function.

The following shows an explanation of each item in the screen:

(a) Password.... When a password is registered in the CPU module, input the
registered password so that file operations are executed.
When an incorrect password is input, file operations are not
performed.
(b) Operation.... 1) Change

: Register a new password in the CPU module.

Or, if the password matches, change the password.

Read, Write and

Display Protect
Write Protect

: File names in the designated memory

cannot be displayed or written to.
: Files in the designated memory cannot
be written to.Read is possible.

2) Cancel
Password : If the password matches, the registered password is
deleted from the CPU module.
3) None
: The current password is recorded in the GPP function
only and is not registered at the CPU module.
4) Change
Attribute : File read/write display or write can be prohibited in file
units.
(Operation possible even if no entry code is
registered.)
(c) Memory....... Designate the memory for which the password is to be registered.
9 - 12

9.

MAINTENANCE FUNCTION

POINT

(1) Password registration is valid for parameter files and program files only.
Invalid for other file types. Other file types can be protected by changing
attributes for each file.
(2) The keyword registered in the CPU module cannot be read from the CPU
module. If you forget the password, CPU module file operations will be
impossible. Keep a record of the password, e.g. on paper, and store it in a
safe place.
(3) When a keyword is registered, memory for 1 file is occupied.
(When a keyword is registered in the built-in RAM, 4k bytes are occupied.)

9 - 13

9.

MAINTENANCE FUNCTION

9.7

System Display
The following items can be checked by connecting a peripheral device capable of GPP
functions to the Q2ASCPU:
(1)

The following information relating to the modules actually mounted on the base unit:
(a) Type
(b) No. of Occupied Points
(c) Head X/Y number

(2)

The following module information set in the parameters:

(a) Type
(b) No. of Occupied Points
(c) Type Name

(3)

The following information relating to the CPU module:

(a) Status of the RUN/STOP key switch
(b) Status of the system setting switches
(c) LED statuses

These items can be checked using the detail HELP display and CPU module panel items
in the display menu of the GPP function PLC diagnositics mode.

9 - 14

9.

MAINTENANCE FUNCTION

9.8

LED indication
The Q2ASCPU module has LEDs on its front face that indicate the operating status of the
CPU module.
The following shows the meanings of the LED and LED indications.

9.8.1

LED indication
(1)

The following shows the meanings of the indications of each of the LEDs are given.

LED Name

Indication Detail
Indicates the operating status of the CPU module.
ON:
OFF:

RUN

Flickering:

Operating with the RUN/STOP key switch set to RUN or STEP RUN.
Operation is stopped, with the RUN/STOP key switch in the STOP, PAUSE, or STEP RUN position.
An error that stops operation has been detected.
The RUN/STOP key switch has been turned from STOP to RUN after writing a program in the STOP status.
To light, either turn the RUN/STOP key switch RUN

STOP

RUN, or reset operation using the RUN/STOP

key switch.
Indicates the CPU module error detection status.
ERROR

ON:

A self-diagnostics error that does not stop operation, other than a battery error, has been detected.(The
operation mode at error occurrence has been set to "Resume" in PC RAS setting in the parameter mode.)

OFF:

Normal

Flickering: An error that stops operation has been detected.

Indicates the CHK instruction detection status, and annunciator (F) statuses.
USER

ON:

An error has been detected by the CHK instruction, or an annunciator F has come ON.

OFF:

Normal

Flickering: Executing latch clear.

Indicates the battery statuses of the CPU module itself and the memory card.
BAT.ALARM ON:
OFF:

A battery error has occurred due to low battery voltage.

Normal

Indicates status of the boot operation execution.

BOOT

ON:

Execution has been completed.

OFF:

The boot operation has not been executed.

9 - 15

9.

MAINTENANCE FUNCTION

(2)

The following shows how to turn OFF an LED that is currently ON.(Excluding the
reset operation.)
LED Name
Method for Turning OFF the LED
ERROR

USER

BAT.
ALARM

BOOT

Resolve the cause of the error, then execute the LEDR

instruction.
Eliminate the cause of the error, then reset the error using special
relay SM50 and special register SD50. (Restricted to error which
do not stop operation.)*1
Operate the special relay SM202 and special register SD202 to
turn off the LED.*1

: Valid
*1

: Not valid

Explanation of special relays and special registers

SM50.......... When turning OFF

ON, resets the error corresponding to the error code stored

in SD50.
SD50.......... Stores the error code of the error to be reset.
(For details on error codes, refer to Section 22.3.3.)
SM202........ When turning OFF

ON, turns OFF the LEDs corresponding to each of the bits

of SD202.
SD202........ Designates the LED to be turned OFF. (The LEDs that can be turned OFF are
the USER LED and the BOOT LED only.)

A bit setting of "1" indicates that the bit is to be turned OFF, "0" indicates that it is not to be
turned OFF.
The following shows the setting possibilities (all hexadecimal notation):
To turn both LEDs OFF: SD202 = 110H
To turn only the BOOT LED OFF: SD202 = 100H
To turn only the USER LED OFF: SD202 = 10H

(3)

Method for stopping ERROR LED, USER LED, and BAT.ALARM LED indications
ERROR LED, USER LED and BAT. ALARM LED have the same priority order as
described for LED indications in Section 9.8.2.
If an error item number is deleted from this order of priority, the LED does not light
even if the error corresponding to that error item number occurs.
(For details on the setting method, refer to the POINT in Section 9.8.2.)

9 - 16

9.

9.8.2

MAINTENANCE FUNCTION

Priority setting
If several errors occurred at a time, the indication conforms to the following conditions.
1) Stop error is indicated unconditionally.
2) Operation continue error are indicated in accordance with error item numbers
in an order of priority set by default.
Priorities can be changed. (set with special registers SD207 to SD209)
3) If several errors with the same priority occur, a first detected error is
indicated.
The following shows how to set priorities in special registers SD207 to SD209.

9 - 17

9.

MAINTENANCE FUNCTION

The following shows the details of the error item numbers and default for priorities which is
set in special registers SD207 to SD209.

Order of
priority

Error Item
No.

Description

Remark

(Hex.)

AC DOWN

AC power/DC power OFF

UNIT VERIFY ERR.

I/O module verification

FUSE BREAK OFF

Fuse blown

SP.UNIT ERROR

Special function module access error

OPERATION ERROR

Operation error

LINK PARA.ERROR

Link parameter error

SFCP OPE.ERROR

SFC instruction operation error

SFCP EXE.ERROR

SFC program execution error

ICM.OPE.ERROR

Memory card operation error

FILE OPE.ERROR

File access error

EXTEND INST.ERROR

Extended instruction error

PRG.TIME OVER

CHK instruction

Annunciator

BATTERY ERR.

10

Clock data

9 - 18

Constant scan setting time over error

Low-speed execution monitoring timeout

9.

MAINTENANCE FUNCTION

POINT

(1) When LED indicator is left OFF for the error occurrence above, set the factor number
area to 0, which stores the applicable factor numbers from SD207 to SD209.
Example:

To set the ERROR LED to remain OFF when a fuse blown error occurs, set
"0" in the item number setting area whose item number is "2".

Since the item number "2" is not set, the ERROR LED remains OFF even if
a fuse blown error is detected.The ERROR LED remains OFF even if
another error whose error item number is "2" is detected (I/O module verify
error, special function module verify error).
(2) Even if the LED is set to remain OFF, SM0 (the diagnostics error flag) is still turned
ON, SM1 (the self-diagnostics error flag) is still turned ON, and the error code is
stored in SD0 (CPU diagnosis error register).

9 - 19

10. OTHER FUNCTIONS

10

OTHER FUNCTIONS

10.1 Function List

The following list shows the rest of the functions.
Item
Constant scan

Latch function

Description
Performs a program at fixed intervals regardless of the
actual program scan time.
Retains the device data when resetting the CPU module
while the programmable controller power is OFF.

Reference
Section 10.2

Section 10.3

Sets the output (Y) status when the CPU module is

Setting of the output status when

switched from STOP to RUN (Re-outputting the outputs

switching from STOP to RUN

before STOP/Outputting the outputs after performing

Section 10.4

operation).
Clock function

Runs the internal clock of the CPU module.

Section 10.5

Remote operation

Operates the Q2ASCPU from a remote place.

Section 10.6

Remote RUN/STOP

Starts or stops the CPU module operation.

Section 10.6.1

Remote STEP-RUN

Performs a step operation to the CPU module.

Section 10.6.2

Remote PAUSE

Suspends the CPU module operation.

Section 10.6.3

Remote RESET

Resets the CPU module.

Section 10.6.4

Remote latch clear

Clears the CPU module latch data.

Section 10.6.5

Relationship between remote

Explains the relationship between the CPU module

operation and CPU module RUN/ RUN/STOP key switch setting and operation when
STOP key switch
Terminal setting

Section 10.6.6

performing remote operation.

Uses the Q6PU programming units indicator and key
input.

Section 10.7

Message display

Displays messages on the indicator of the Q6PU.

Section 10.7.1

Key input operation

Reads key input from the Q6PU.

Section 10.7.2

Monitors the access time intervals (The time between

Reading module access time
intervals

the acceptance of one CPU module access and the

acceptance of the next CPU module access) for special

Section 10.8

function modules, network modules, and peripheral

devices.

For details of GPP function operation, refer to the GX Developer Operating Manual or the
Type SW IVD-GPPQ GPP Software package Operating Manual (Online).
For details of the Q6PU operation, refer to the Q6PU Operating Manual.

10 - 1

10. OTHER FUNCTIONS

10.2 Constant Scan

(1)

Constant scan
In the Q2ASCPU, the scan time varies since the processing time differs depend on
the execution status of the instructions used in the sequence program.
Constant scan is a function whereby the sequence program is repeatedly performed
while maintaining constant scan time.

Scan time when the constant scan is not used

Scan time when the constant scan time is set to 70ms

Scan time when the constant scan time is set to 100ms while performing multiple programs

Fig. 10.1 Constant scan operation

When the low-speed execution type program is used, either this constant scan function or
a low-speed program execution time has to be set.
(For details, refer to the QnACPU Programming Manual (Fundamentals).)

10 - 2

10. OTHER FUNCTIONS

(2)

Setting the constant scan time

(a) The setting is made in "PC RAS" in the parameter mode of GPP function.
When performing the constant scan, set the constant scan time.
When not performing the constant scan, leave the field blank.
Example: When setting 100ms to "Constant scan"

(b) Set constant scan time that is longer than the maximum scan time of the
sequence program. If the scan time of the sequence program is longer than the
set value for constant scan time, the Q2ASCPU detects an error code (SD0 =
5010), and the sequence program is performed in the own scan time, ignoring
the constant scan time setting.
Make sure that the constant scan time setting is shorter than the set time for
WDT (Watchdog timer). If it is longer than the set time for WDT, the Q2ASCPU
detects a WDT error and the program execution is stopped.
Set the constant scan time within the following range.
Setting time for WDT

Setting time for constant scan

Maximum scan time of sequence program

Fig. 10.2 Operation when scan time is longer than constant scan setting time

(c) Sequence program processing is suspended in the wait time between the END
processing of the sequence program and the start of the next scan.
However, if an interrupt factor occurs after the execution of END processing, or if
there is a low-speed execution type program, the interrupt program or the lowspeed execution type program is performed.

10 - 3

10. OTHER FUNCTIONS

(d) Constant scan time error

If there is a low-speed execution type program when performing the constant
scan, the constant scan time may be shifted by the time shown below.
Maximum processing time

(Error) = of one instruction in the

low-speed execution type
program

+ low-speed END processing time

Time taken to execute the END
processing for a low-speed
execution type program

The low-speed execution type program is divided and performed within surplus
time. Therefore, if one constant scan ends while performing the instruction takes
long processing time, the constant scan is completed after finishing the
processing of the instruction during execution. The time extended to complete
the execution of the instruction is the constant scan error. For details of the
instruction processing time, refer to the QCPU (Q mode)/QnACPU Programming
Manual (Common Instructions).

10 - 4

10. OTHER FUNCTIONS

10.3 Latch Function

When the programmable controller power is turned ON, the CPU module is reset using the
RUN/STOP key switch, or a instantaneous power failure lasting longer than the allowable
momentary power interruption time occurs, the all device values in the Q2ASCPU are
cleared, and the default values are set in the devices (Bit devices: OFF, word devices: 0).
The latch function retains the data in the devices when performing these operations.
The operations in the program are the same whether or not the latch function is used.
(1)

Application of the latch function

The latch function can be used when continuing the control to retain data such as
production quantities, numbers of defects, addresses, etc., even if a instantaneous
power failure longer than the allowable time occurs.

(2)

Devices that can be latched

(a) The following devices can be latched.
1) Latch relay
2) Link relay
3) Annunciator
4) Edge relay
5) Timer
6) Retentive timer
7) Counter
8) Data register
9) Link register
POINT

Even if a latch designation is set for a device, the device will not be latched if a
local device designation or device initial value designation is made.
(b) The latch range is set on the "Device" in the parameter mode of GPP function.
In latch range setting, it is possible to set a range within which the latch clear key
is effective (Latch (1) Start) and a range within which the key is not effective
(Latch (2) Start). For details on device latch ranges for each device, refer to the
QnACPU Programming Manual (Fundamentals).
POINT

The devices data in the latch range are retained by the battery (A6BAT) installed
in the CPU module.
(1) Even if a sequence program is written to a memory card and ROM operation
is performed, the battery is required for the latch function.
(2) If the battery connector is disconnected from the CPU module connector while
the programmable controller power is OFF, the devices data in the latch range
is lost.

10 - 5

10. OTHER FUNCTIONS

(3)

Clearing the device data in the latch range

(a) To clear the devices data in a latch range and set the default values instead,
perform "Latch clear". When the latch clear is performed, the devices data in the
non-latched range is also cleared.
However, the devices for which the latch clear key has been set to Disable in the
Parameter are not cleared by performing latch clear.
(b) For the methods of performing latch clear, refer to Section 12.4.

10 - 6

10. OTHER FUNCTIONS

10.4 Setting of the Output (Y) Status When Switching from STOP to RUN
When the RUN or other status is changed to the STOP status, the CPU module stores the
output (Y) in the RUN status into the programmable controller and turns all outputs (Y)
OFF.
In this function, whether to re-output the outputs (Y) when switching from STOP to RUN or
to output them after an operation can be set in the "PC system" in the parameter mode of
GPP function .

(a) Re-output (Prior to Calc).....................The output (Y) status immediately before

the STOP status is output, and then the
sequence program is calculated.
(b) Output after operation execution
(After one Scan)..................................The output is OFF status.
The output (Y) will be output after the
sequence program operation is executed.

Fig. 10.3 Processing when a programmable controller is switched from STOP to RUN

10 - 7

10. OTHER FUNCTIONS

10.5 Clock Function

The Q2ASCPU has a clock in the CPU module.
Since the clock data can be read in the sequence program, it can be used for time control
of the user system.
In addition, the clock data can also be used for time control to the functions performed by
the CPU module, such as the breakdown history.
Clock operation by the clock function is continued with the battery when the programmable
controller power is turned OFF or a instantaneous power failure lasting longer than the
allowable momentary power interruption time occurs.
POINT

The CPU module system uses the clock data for a breakdown history.When using
a CPU module, be sure to set the correct time first.
(1)

Clock data
The clock data is composed of the year, month, day, hour, minute, second, and day of
the week used by the clock element in the programmable controller CPU, as shown
below.
Data name

Description

Year

Last two digits of the year

Mon

1 to 12

Sun

1 to 31(Leap year, automatic identification)

Hour

0 to 23 (24-hour system)

Minute

0 to 59

Second

0 to 59

Day of the week

(2)

Sunday

Monday

Tuesday

Wednesday

Thursday

Friday

Saturday

Accuracy
The accuracy of the clock function depends on the ambient temperature, as shown
below.
Ambient Temperature

Accuracy (daily variance)

-1.7 to + 4.9s (TYP. +1.7S)

+ 25

-1.0 to + 5.2s(TYP.+2.2S)

+ 55

-7.3 to + 2.5s(TYP.-1.9S)

10 - 8

10. OTHER FUNCTIONS

(3)

Writing clock data to the clock elements

(a) Use the following procedure to write clock data to the clock elements.
1) Writing from a peripheral device
When using GPP function, clock data can be written to the clock elements
using the "Set clock" of the PLC menu in PLC diagnostics mode.
When using the Q6PU, clock data can be written to the clock elements by
using the clock monitor option in the monitor functions of the PLC system
in the other mode.
(For details on the operation for each peripheral device, refer to the Operating
Manual for each.)
2) Writing from a program
Clock data is written to the clock elements using the clock instruction
(DATEWR).
The following shows the example of the program.

For details on the DATEWR instruction, refer to the QCPU (Q mode)/

QnACPU Programming Manual (Common Instructions).

POINT

(1) Clock data is not written to clock elements in advance.Write clock data to the
clock elements before using the Q2ASCPU.
(2) Even if partly changing the clock data, rewrite all data to the clock elements.
(3) If the nonexistent time is written to the clock elements, normal clock operation
is impossible.
Example
Setting "13" to the month.

10 - 9

10. OTHER FUNCTIONS

(4)

Clock data read

(a) To read clock data to data registers, use the clock data read instruction
(DATERD) in the program.
An example of a program using the instruction is shown below.

For details on the DATERD instruction, refer to the QCPU (Q mode)/QnACPU

Programming Manual (Common Instructions).
(b) To read the clock data to SD210 to SD213, turn SM213 ON from a sequence
program or a peripheral device.
(5)

Special relays and special registers for reading/writing clock data

The section explains the special relays and special registers used for setting data
and reading clock data for clock operation.
(a) Special relays used for the clock function
Device

Name

Description
Writes clock data to the special registers (SD210 to
SD213) and performs clock operation.

SM210

Clock data set request

Writes the clock data stored in SD210 to SD213 to the

clock elements after execution of the END instruction in
the scan in which SM210 turns from OFF to ON.
Used to determine whether or not there are any errors

SM211

Clock data error

when the clock data is set.

Turns ON if any data is not a BCD cord.
Reads the clock data stored in special registers SD210

SM213

Clock data read request

to SD213.
When SM213 is ON, the clock data is read to SD210 to
SD213 after execution of the END instruction.

10 - 10

10. OTHER FUNCTIONS

(b) Special registers used for clock data

Device

Name

Description
The year and month are recorded as follows.The year
data is the last two digits of the year.

SD210

Clock data
(year, month)

The day and hour are recorded as follows.

SD211

Clock data
(day, hour)

The minute and second are recorded as follows.

SD212

Clock data
(minute, second)

The day of the week is recorded as follows.

SD213

Clock data

The settings for the day of the week are as follows:

(day of the week)

Day of
the week
Storage
data

10 - 11

Sun Mon

Tue Wed Thu

Fri

Sat

10. OTHER FUNCTIONS

10.6 Remote Operation

With the Q2ASCPU, the operating status of the CPU module can be controlled from
external sources (GPP function, intelligent special function module, remote contact, etc.).
REMARK
In this chapter, a serial communication module is used as an example of an intelligent
special function module.
10.6.1 Remote RUN/STOP
Remote RUN/STOP refers to the function that sets the Q2ASCPU to RUN or STOP from
an external source while the CPU module RUN/STOP key switch is set to the RUN
position.
(1)

Application of remote RUN/STOP

Remote RUN/STOP operation from remote location is useful in the following cases.
(a) When the CPU module is installed in an inaccessible location
(b) When setting the CPU module in a control panel to RUN/STOP from an external
source

(2)

Operation for remote RUN/STOP

The following shows the program operations to which remote RUN/STOP is
performed.
(a) Remote STOP......... The program is performed up to the END instruction, then
STOP state is established.
(b) Remote RUN........... When remote RUN is performed with the CPU in STOP set
by remote STOP, the program will be in RUN state again
and be performed from step 0.

(3)

Method for performing remote RUN/STOP

The following two methods are available for performing remote RUN/STOP.
(a) Method using a remote RUN contact
The remote RUN contact is set in the PLC system in the parameter mode of
GPP function.
The settable device range is from input X0 to 1FFF.
Remote RUN/STOP can be performed by switching the remote RUN contact
ON/OFF.
1) When the remote RUN contact is OFF, the CPU module is in RUN state.

10 - 12

10. OTHER FUNCTIONS

2) When the remote RUN contact is ON, the CPU module is in STOP state.

Fig. 10.4 Time chart for RUN/STOP switching with remote RUN contact

10 - 13

10. OTHER FUNCTIONS

(b) Method using GPP function, serial communication module, etc.

The CPU module can be set to RUN or STOP by remote RUN/STOP operation
from GPP function, or a serial communication module, etc.
The operation using GPP function can be performed in the Remote operation of
the PLC menu in any mode.
The control using a serial communication module is performed with the
commands in the dedicated protocol.
For details on serial communication module control, refer to the Serial
Communication Module User's Manual.
Step 0

Step 0

END
ON

GPP function
Serial
communication
module

Remote STOP
command

OFF

END
0

ON

OFF

Remote RUN
command

RUN
STOP

Programmable controller
CPU RUN/STOP status
STOP status

Fig. 10.5 Time chart for remote RUN/STOP switching with GPP function or a serial
communication module

(4)

Precautions
(a) Since the STOP state has a priority in the Q2ASCPU, pay attention to the
following points.
1) In the Q2ASCPU, if remote STOP is performed from any one of remote RUN
contact, GPP function, serial communication module, etc., the QnACPU will
be STOP.
2) In order to set the Q2ASCPU to RUN again after it has been set to STOP by
remote STOP, all external factors which set remote STOP (Remote RUN
contact, GPP function, serial communication module, etc.) have to be set to
RUN.

REMARK
The RUN/STOP status is defined as follows.
RUN status.............. Status in which the sequence program is repeatedly
performed from step 0 to the END instruction.
STOP status........... Status in which the sequence program operation is stopped
and all outputs (Y) are OFF.

10 - 14

10. OTHER FUNCTIONS

10.6.2 Remote STEP-RUN

Remote STEP-RUN refers to the function whereby the step run of the Q2ASCPU is
performed from GPP function while the RUN/STOP key switch of the module is in RUN
position.
"Step run" is program execution that operates by one step at a time, starting from the
designated step.
For details on step run, refer to Section 8.7.
(1)

Application of remote STEP-RUN

When debugging the system, for example, the program can be performed while
checking its execution and the contents of each device.

(2)

Method for performing remote STEP-RUN

The procedure for remote STEP-RUN is as follows.
1) Set the RUN/STOP key switch of the CPU module to RUN position.
2) Perform STEP-RUN operation with GPP function.

10 - 15

10. OTHER FUNCTIONS

10.6.3 Remote PAUSE

Remote PAUSE refers to the function that performs PAUSE function to the Q2ASCPU
from an external source while the CPU module RUN/STOP key switch is set to the RUN
position.
The PAUSE function stops a CPU module operation while retaining the ON/OFF status of
all outputs (Y).
(1)

Application of remote PAUSE

This function can be used to retain the output (Y) with ON status even if the CPU
module is in STOP due to process control.

(2)

Methods for remote PAUSE

The following two methods are available for performing remote PAUSE.
(a) Method using a remote PAUSE contact
The remote PAUSE contact is set in the PLC system in the parameter mode of
GPP function.
The settable device range is from input X0 to 1FFF.
1) When the scan END processing is performed with both the remote PAUSE
contact and the PAUSE enable flag (SM206) are ON, the PAUSE status
contact (SM204) turns ON.
When performing up to the END instruction of the scan following the scan in
which the PAUSE status contact turned ON, the PAUSE state is established
and operation is stopped.
2) When turning the remote PAUSE contact OFF or turning SM206 OFF with
GPP function, the PAUSE status is reset and the sequence program
operation is again performed from step 0.
0
ON
Remote PAUSE
contact
SM206

END
0

END
0

END

END
0

OFF
ON
OFF
ON

SM204
RUN/PAUSE
status

OFF
RUN

ON when PAUSE
condition is satisfied

PAUSE

PAUSE status

Fig. 10.6 Time chart for PAUSE with remote PAUSE contact

REMARK
When the remote RUN contact is made same as the remote PAUSE contact, the
remote PAUSE contact will be invalid.
10 - 16

10. OTHER FUNCTIONS

(b) Methods using GPP function or a serial communication module

The remote PAUSE operation can be performed from GPP function or from a
serial communication module.
The operation using GPP function can be performed in the Remote operation of
the PLC menu in any mode.
The control using a serial communication module is performed with the
commands in the dedicated protocol.
For details on serial communication module control, refer to the Serial
Communication Module User's Manual.
1) When the END processing of the scan in which the remote PAUSE command
has received from GPP function is performed, the PAUSE status contact
(SM204) turns ON.
When performing up to the END instruction of the scan following the scan in
which the PAUSE status contact turned ON, the PAUSE status is established
and the operation is stopped.
2) When the remote RUN command is received from GPP function, the
sequence program operation is again performed from step 0.
END

0
END

Remote PAUSE
command

OFF

Remote RUN
command

OFF

SM204
RUN/STOP status

0
END

ON

ON

ON
OFF
RUN

Comes ON
when the
PAUSE
condition
is satisfied

PAUSE
PAUSE status

Fig. 10.7 Time chart for PAUSE with GPP function

POINT

To arrange for outputs (Y) to be turned ON or OFF when the PAUSE status is
established, provide an interlock using the PAUSE state contact (SM204).

10 - 17

10. OTHER FUNCTIONS

10.6.4 Remote RESET

Remote RESET is a function for resetting the Q2ASCPU by operation from an external
device while the CPU module is in STOP.
Resetting is also possible even when the RUN/STOP key switch on the CPU module is set
to the RUN position if the CPU module is stopped by an error detectable by the selfdiagnostics function.

POINT

Remote RESET cannot be performed when the CPU module is in RUN.

(1)

Application of remote RESET

Remote RESET can be used to reset the CPU module by remote operation when an
error has occurred in the place from where the CPU module cannot be directly
operated.

(2)

Methods for remote RESET

Remote RESETcan only be performed by operation from GPP function or a serial
communication module.
(a) Regardless of whether reset is performed from GPP function or a serial
communication module, the setting to enable remote RESET has to be made in
the Parameter before performing the reset operation.
The remote RESET "Enable/Disable" setting is made in the PLC system in the
parameter mode of GPP function.
(b) When the parameter is set to "Allow" in the "Remote reset" and written to the
CPU module, resetting is performed with remote operation.
When using GPP function, perform the reset in the PLC menu in any mode.
When using a serial communication module, perform the reset with dedicated
protocol commands.
For details on serial communication module control, refer to the Serial
Communication Module User's Manual.

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10. OTHER FUNCTIONS

10.6.5 Remote latch clear

Remote latch clear is a function for resetting the latched device data of the Q2ASCPU
while the CPU module is in STOP by using such as a GPP function.
POINT

Remote latch clear cannot be performed when the CPU module is in RUN.
(1)

Application of remote latch clear

Remote latch clear is useful for latch clear operation when the CPU module is at the
locations below: In this case, the function is used in combination with the remote
RUN/STOP function.
When the CPU module is installed in an inaccessible location
When performing latch clear to the CPU module in a control panel from an external
source

(2)

Methods for remote latch clear

Remote latch clear can only be performed by operation from GPP function or a serial
communication module.
The operation using GPP function can be performed in the Remote operation of
the PLC menu in any mode.
The control using a serial communication module is performed with the commands
in the dedicated protocol.
For details on serial communication module control, refer to the Serial
Communication Module User's Manual.
POINT

1.

2.

According to the device latch ranges set in "Device" in parameter mode, there
are ranges within which latch clear is valid and ranges within which it is not
valid.Remote latch clear is only valid for devices set in the range for which
"Latch clear valid" is set.
When remote latch clear is performed, devices that are not latched are also
cleared.

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10. OTHER FUNCTIONS

10.6.6 Relationship between remote operation and CPU module RUN/STOP key switch
Using the combination of the remote operation and the RUN/STOP key switch of the CPU
module explained in Section 10.6.1 through Section 10.6.5, the operating status of the
Q2ASCPU is determined as follows.
Remote Operation
Key switch
RUN*1

STEP-RUN

STOP

PAUSE*2

RUN

RUN

STEP-RUN

STOP

PAUSE

STOP

STOP

STOP

STOP

STOP

*1
*2

*3
*4

RESET*3

Latch Clear

Operation is not

Operation is not

possible.*4

possible.*4

RESET

Latch Clear

If performed using a remote RUN contact, beforehand set "RUN-PAUSE contacts" in the PLC
system in parameter mode.
If performed using a remote PAUSE contact, beforehand set "RUN-PAUSE contacts" in the
PLC system in parameter mode.Furthermore, the remote PAUSE enable coil (SM206) has to
be turned ON in advance.
"Remote reset" field in the PLC system has to be set to "Allow"in parameter mode.
The operation status can be RESET if the CPU module is stopped by remote operation.

When the RUN/STOP key switch is set to RUN and multiple remote operation requests are
received, the CPU module first performs the operation with the highest priority.
Remote
operation

RUN

STEP-RUN

STOP

PAUSE

RESET

Latch Clear

Order of priority

4)

3)

1)

2)

The order of priority increases from (4) to (1).

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10. OTHER FUNCTIONS

10.7 Terminal Operation

This function sets the Q6PU programming unit in the terminal mode and performs the data
communications shown below by using the instructions for peripheral devices of
theQ2ASCPU.
1) Display of messages from the Q2ASCPU on the display of the Q6PU.
2) Storage of the Q6PU key input data in the devices of the Q2ASCPU.
In this way, the Q6PU can be used as a terminal of the Q2ASCPU.
These functions are explained from the next section.
However, for details on the instructions for peripheral devices, refer to the QCPU (Q
mode)/QnACPU Programming Manual (Common Instructions).
10.7.1 Operation for message display
Specified character strings can be displayed on the Q6PU using the MSG instruction for
peripheral devices.
Furthermore, character strings can be displayed with GPP function by using the CPU
messages of the Display menu in the PLC diagnostics mode.
Example: Program to display "TOSOU LINE READY" as a message No.1 on the Q6PU
when X0 is turned ON.
X0

List
MSG "TOSOU LINE READY"

Display

10 - 21

0 LD X0
1 MSG "TOSOU LINE READY"

TOSOU LINE LEADY

Q6PU

10. OTHER FUNCTIONS

10.7.2 Key input operation

Character string data input at the Q6PU can be stored as ASCII data without change in
specified devices by using the PKEY instruction for peripheral device.Data input ends
when a CR code is input or when the 32nd character is input.
Example: Program to input "TOSOU LINE READY" on the Q6PU when X0 is turned ON.

10 - 22

10. OTHER FUNCTIONS

10.8 Reading Module Access Time Intervals

The Q2ASCPU can monitor the access interval time (The time between one access
reception and the next access reception) for intelligent special function modules, network
modules, data link modules, or GPP function. This enables to grasp the frequency of
accesses to the CPU module from external sources.
The operation for reading the module access interval time involves the following special
relay and special registers.
(1)

Special relay

Number

Name

Description
When this relay turns from OFF to ON, the module access interval time for the

SM551

Read module service

interval

special function module specified in special register SD550 is read into special
registers SD551 to SD552.
ON : Read
OFF : Ignored

(2)
Number

Special register
Name

Description
Set the I/O number of the module whose access interval time is to be measured.

SD550

Service interval
measurement module

Set the I/O number of the peripheral device connected to the RS-422 interface of
the CPU module to FFFFH.
Also set the I/O number of the upper 2 digits in the 3-digit representation.
When SM551 is turned ON, it stores the interval time for access from the module
specified at SD550.
SD551: 1ms units (Range: 0 to 65535)

SD551 to SD552

Service interval time

SD552: 1 s units (Range: 0 to 900, stored every 100 s)

Example: When the module access interval time is 123.4ms:
SD551=123, SD552=400

Program example:
Program for reading the module access interval time of the special function module at
X/Y160.

POINT

To read the access interval time for access from GPP function at another station in
the network, set the I/O number of the network module.

10 - 23

10. OTHER FUNCTIONS

REMARK
The module access interval includes a transient request interval such as a monitor,
a test and a program read/write.
The access interval via cyclic communication from a network module or a data link
module is not stored.

10 - 24

11. COMMENTS THAT CAN BE STORED IN Q2ASCPU

11

COMMENTS THAT CAN BE STORED IN Q2ASCPU

11.1 Function List

The Q2ASCPU can store various types of comments. This has improved the CPU module
operability, allowing users other than programmers to read programs easily.
The types of comments that can be stored in the Q2ASCPU are listed in the table below.
Item

Function

Refer to

PLC name

Naming the CPU module to be used.

Section 11.2

Drive title

Assigning a title to each drive.

Section 11.3

File title

Assigning a title to each file.

Section 11.4

Device comment

Assigning comments and/or labels to devices used in a program.

Section 11.5

Statements/notes
Initial device value
comment

Assigning comments to each program step number or P or I

pointer.
Assigning a comment to the initial device value file.

Section 11.6

Section 11.7

For details on the setting method for each function, refer to the GX Developer Operating
Manual or SW IVD-GPPQ Operating Manual (Offline).

11 - 1

11. COMMENTS THAT CAN BE STORED IN Q2ASCPU

11.2 PLC name

PLC name appends a comment to a CPU module to make it easier to confirm the CPU
module when accessing the Q2ASCPU by GPP function.
Two types of PLC names can be set: labels and comments. The settings are made on the
"Define PC name" screen in the parameter mode of GPP function.

The setting details are indicated in the table below.

Item
Label

Setting
Set a label for the CPU module.

Setting range

Default value

Up to 10
characters
No setting

Comment

Set a comment for the CPU module.

11 - 2

Up to 64
characters

11. COMMENTS THAT CAN BE STORED IN Q2ASCPU

11.3 Drive Title

The drive title function assigns a title to a drive to allow users to easily identify what file is
stored in the built-in RAM or memory card.
Drive titles are created on the "Title Statement Def" screen under the PC menu in the
online mode of GPP function.

A created title is displayed on the screen as shown below.

POINT

Note that creating a drive title uses an area equivalent to one file in each memory.

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11. COMMENTS THAT CAN BE STORED IN Q2ASCPU

11.4 File Title

The file title function allows file titles to be assigned to files so that the contents of the files
can be figured out.
File titles are set in file setting performed when starting GPP function, or in PLC writing
from the PLC menu in any mode. Up to 32 characters can be used.

File titles are stored in the corresponding created files.

Note that they are not stored in any files for file registers.

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11. COMMENTS THAT CAN BE STORED IN Q2ASCPU

11.5 Device Comment

The device comment function displays comments assigned to respective devices so that
programs can be read easily.
In addition, by setting "Xtype" for the CPU type with GPP function, programs can be
created using labels instead of devices.

POINT

A memory card is required to create device comments and store a device

comment file in a CPU module.

(1)

Device comments are set in the documentation mode of GPP function.

Up to 32 characters are used for each comment and up to 10 characters for each
label (device label name).

Comments and labels can be assigned to the following devices.

Device name:X, Y, M, L, F, SM, B, SB, V, T (present value), C (present value), ST
(present value), D, SD, W, SW, R, ZR, P, I, U \G

J \X, J \Y, J \B, J \SB, J \W, J \SW, BL \S, BL \TR

(When P or I comments are used as pointers for programs such as
subroutine or interrupt programs, they are not displayed. To display
these comments, make them displayed as pointer statements. (Refer
to Section 11.6))

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11. COMMENTS THAT CAN BE STORED IN Q2ASCPU

(2)

When using comments with application instructions (LEDC, PRC, etc.), if a device
comment file has been written to the CPU module, enable one of the options in the
parameter setting for the device comment file.
This setting is made at "2. Comment file used in a command" on the "PLC file" screen
in the parameter mode of GPP function.

The setting details are as follows:

1. "Not Used":
No setting is made for the comment file to be used. To use the comment file, use
the QCDSET instruction. (For details on the QCDSET instruction, refer to the
QCPU (Q mode)/QnACPU Programming Manual (Common Instructions).)
2. "Program Name is Used":
Use the comment file with the same file name as the program that exists in the
specified drive and is currently being executed.
When the program is changed, the comment file is also changed.
3. Using the designated device comment file:
Use the name of the file that is stored in the drive specified by the parameter.

POINT

(1) When using the QCDSET instruction, note the following points.
(a) When the above 1) or 2) has been set, the file set with the QCDSET
instruction is valid for all program files.
(b) When 3) is set, the file set with the QCDSET instruction is valid only for
the program file for which the QCDSET instruction is executed.
(2) Even if the file set with the parameter does not exist in the specified drive, no
CPU module error is generated. Since no file exists, however, the CPU
module does not display any comments.

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11. COMMENTS THAT CAN BE STORED IN Q2ASCPU

11.6 Statements/Notes
Statements and notes are assigned to each program step, or to P or I pointers, in order to
facilitate program reading.

(1)

Statements or notes are set on the "Pointer statement", "Statement", or "Note" screen
displayed from the edit menu in the documentation mode of GPP function.

(2)

The details of each comment are as follows:

(a) Statement (Line statement)
A comment can be appended to a ladder block provided for individual function to
explain the meaning and usage of the function.
(b) Pointer statement
A comment can be appended to a pointer placed in the head of a subroutine or
interrupt program to explain the meanng and usage of each program.
(c) Note
A comment can be appended to individual ladder blocks to explain the meaning
and usage of the function.

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11. COMMENTS THAT CAN BE STORED IN Q2ASCPU

11.7 Initial Device Value Comment

Initial device value comments are assigned to initial device value files so that individual file
contents can be figured out.
Initial device value comments are stored in an initial device value file.
They are set on the "Device Initial Value Range" screen displayed from the edit menu in
the device mode of GPP function.

11 - 8

12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

12

OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

12.1 Program Execution Types

Programs to be executed by the Q2ASCPU are stored in the built-in RAM of the CPU
module or in a memory card.
While all of the data can be stored as one program in the built-in RAM or a memory card,
they can be also divided into several programs based on control units and stored.
When programming is undertaken by more than one designer, all the programming
process can be divided into several parts based on the processing units for each designer
and all of the programming data can be stored in the built-in RAM of a CPU module or a
memory card.

When dividing a program data into multiple programs, set "execution type" for each
program in program setting in the parameter mode of GPP function.
The Q2ASCPU executes each execution type program in order of setting.
There are four executions types: "Initial execution type", "Scan execution type", "Lowspeed execution type", and "Standby type".
Initial execution type

: Program executed only once when a programmable

controller is powered ON, when a CPU module is reset, or
when the RUN/STOP key switch of the CPU module is
switched from STOP to RUN.
(Refer to Section 12.1.1)

Scan execution type

: Program that is executed once per scan, starting from the

next scan after execution of the initial execution type
program.
(Refer to Section 12.1.2)

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

Low-speed execution type : Program that is executed only in the surplus scan time
after execution of a scan execution type program in the
constant scan setting, or only when the low-speed type
program execution time is set.
(Refer to Section 12.1.3)
Standby type

: Program that is only executed when an execution request

is made for it.
(Refer to Section 12.1.4)

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

The following shows the flow of operation processing when a programmable controller is
powered ON, when a CPU module is reset, or when the RUN/STOP key switch of a CPU
module is switched from STOP to RUN.

POINT

For the Q2ASCPU, all execution types need not be set.

Use initial execution type, low-speed execution type, and standby type programs
marked with asterisks if required.

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

12.1.1 Initial execution type programs

(1)

Definition
(a) The initial execution type program is a program executed only once when a
programmable controller is powered ON, when a CPU module is reset, or when
the RUN/STOP key switch of the CPU module is switched from STOP to RUN.
(b) The execution type is set to "Init" in program setting in the parameter mode of
GPP function.
(c) Initial execution type programs can be used for applications such as the initial
processing for a special function module, where once the program has been
executed, it need not be executed from the next scan.*

(2)

Execution of multiple initial execution type programs

If there are more than one initial execution type program, they are executed in
ascending order of the program numbers set in the parameter mode.

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

(3)

END processing
When execution of all initial execution type programs is completed, END processing
is performed and a scan execution type program is executed from the next scan.

POINT

Instructions that contain a completion device cannot be used in initial execution

type programs.

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

(4)

Initial scan time

(a) This is the execution time of an initial execution type program.
If multiple initial execution type programs are to be executed, it is the time
required to complete execution of all these programs.
(b) The Q2ASCPU measures the initial scan time and stores it in special registers
SD522 and SD523.*1
The initial scan time can be checked by monitoring SD522 and SD523.

Example:
If "3" and "400" are stored in SD522 and SD523 respectively, the initial scan time
is 3.4ms.
*1

(5)

The accuracy of each scan time stored in the special registers is 0.1ms. Note that, even if a
watchdog timer (WDT) reset instruction is executed in the sequence program, measurement
of the initial scan time is continued.

Initial execution monitoring time

This is a timer for monitoring the execution time of initial execution type programs; no
default value is set.
To monitor the execution time of an initial execution type program, a value can be set
within the range of 10ms to 2000ms in "PLC RAS" in the parameter mode. (Unit: 10
ms)
If the initial scan time exceeds the set initial execution monitoring time, a "WDT
ERROR" occurs and the Q2ASCPU stops its operation.

POINT

An error may be generated in the range of 0 to 10ms in measurement of the initial

execution monitoring time.
Because of this, if the initial execution monitoring time (t) is set as 10ms, a WDT
ERROR will occur when the initial scan time exceeds the limit within the range of
10ms t 20ms.

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

12.1.2 Scan execution type program

(1)

Definition
(a) The scan execution type program is a program that is executed once for every
scan, starting from the next scan after execution of the initial execution type
program.
(b) The execution type is set to "Scan" in program setting in the parameter mode of
GPP function.

(2)

Execution of multiple scan execution type programs

If there are more than one scan execution type program, they are executed in
ascending order of the program numbers set in the parameter mode.

(3)

END processing
When all the scan execution type programs have been executed, END processing is
performed and then the first scan execution type program is executed again.
By inserting a COM instruction at the end of a scan execution type program, END
processing (general data processing, link refresh) can be executed for each program.

STOP
Power ON/RESET

RUN
RUN
1st scan

2nd scan

3rd scan

4th scan

END processing
Initial execution type programs
0

Scan execution type program A

END

END

END

END

END

Scan execution type program B

0

Scan execution type program C

END

END

Scan time

(4)

When constant scan time is set*1

When constant scan is set, the scan execution type program is executed once for
every preset constant scan time.

REMARK
*1

Constant scan is a function whereby a scan execution type program is

repeatedly executed at fixed intervals.
See Section 10.2.
POINT

(1) For the index register processing in the case where an interrupt program is
executed during execution of a scan execution type program, refer to the
QnACPU Programming Manual (Fundamentals).

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

(5)

Scan time
The scan time is a total of the scan execution type program execution time, the
END processing time, and either the low-speed program execution time or the
constant scan waiting time.*1
When more than one scan execution type program is executed, "the execution
time of the scan execution type program" is the time required for completing
execution of all these programs.
*1

Refer to Section 12.1.3.

The Q2ASCPU measures the present, minimum, and maximum values for the
scan time and stores them in special registers SD520, SD521, and SD524 to
SD527.*2
The scan time can be checked by monitoring these special registers.

Example:If "3" and "400" are stored in SD520 and SD521 respectively, the scan
time is 3.4ms.
*2

(6)

The accuracy of each scan time stored in the special registers is 0.1ms. Note that, even if
the watchdog timer (WDT) reset instruction is executed in the sequence program,
measurement of each scan time is continued.

WDT (watchdog timer)

This is a timer that monitors the scan time; and 200ms is set as a default value.
WDT is set within the range of 10ms to 2000ms in "PLC RAS" in the parameter
mode. (Unit: 10ms).
When using a low-speed execution type program(s), make sure that the specified
WDT value is greater than the sum of the scan time and the low-speed execution
type program execution time.
If the scan time (total of execution times for scan execution type programs and lowspeed execution type programs, END processing time, and low-speed END
processing time) exceeds the time set for WDT, a "WDT ERROR" occurs and the
Q2ASCPU stops its operation.
POINT

The WDT measurement error is 0 to 10ms.

Because of this, when WDT (t) is set to 10ms, a WDT ERROR may not occur
even if the scan time exceeds the limit within the range of 10ms t 20ms.

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

12.1.3 Low-speed execution type program

(1)

Definition
(a) The low-speed execution type program is a program that is executed only in the
surplus time of constant scan operation or in the preset low-speed execution
program execution time.
When using a fixed scan time to give priority to control accuracy, set the
constant scan time in "PLC RAS" in the GPP function's parameter mode.
(Setting range: 5 to 2000ms; Unit: 5ms)
To ensure the execution time for low-speed execution type programs in each
scan and to make these programs operate properly, set the low-speed
program execution time in "PLC RAS" in the parameter mode.
(Setting range: 1 to 2000ms; Unit: 1ms)
In order to execute low-speed execution type programs, either the constant
scan time or the low-speed program execution time must be set.
(b) Set "Slow" as the execution type in program setting in the parameter mode.
(c) This execution type is used for programs that do not have to be executed every
scan, such as a program for printer output.

(2)

Execution of multiple low-speed execution type programs

If there are more than one low-speed execution type program, they are executed in
ascending order of the program numbers set in the parameter mode.

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

(3)

Execution time for low-speed execution type program executed in one scan
(a) When operation of all low-speed execution type programs is completed within
one scan and there is surplus time, the subsequent processing varies depending
on the setting status of special relay SM330 and the execution condition for the
low-speed execution type programs.
Non-synchronization
method (SM330 = OFF)

: Operation of a low-speed execution type

program is continuously executed within
surplus time.

Synchronization method
(SM330 = ON)

: Even if there is surplus time, operation of a lowspeed execution type program is not executed
and another operation starts from the next
scan.

Operation method
of low-speed execution
type program

method
Synchronization method

*2

*3

status of
SM330

Non-synchronization

*1

Execution condition of low-speed execution type program

Setting

OFF

ON

Constant scan setting

Low-speed program execution

time setting
Re-executes low-speed

Re-executes low-speed
*1

execution type program.

execution type program.*2

Constant scan wait

Starts scan execution type

time occurred*3

program operation.*4

When the constant scan time is set, the low-speed execution type program is repeatedly
executed for the surplus time of the constant scan.
Accordingly, the execution time of the low-speed execution type program is different at each
scan. If surplus time in constant scan is less than 2ms, the low-speed execution type program
is not executable.
When using a low-speed execution type program, set a proper constant scan time so that
surplus time will be 2ms or longer.
When the low-speed program execution time is set, a low-speed execution type program is
repeatedly executed for the set time duration.
Accordingly, the scan time is different at each scan.
When the constant scan time is set, surplus time after completion of the low-speed END
processing is used as wait time. When the set constant scan time is reached, the scan
execution type program is executed.
Wait time for constant scan
= (Set constant scan time) - (Scan time) - (Low-speed scan time)

*4

Therefore, the scan time for each scan is constant.

If surplus time in constant scan is less than 2ms, the low-speed execution type program is not
executable. When using a low-speed execution type program, set a proper constant scan
time so that surplus time will be 2ms or longer.
When the low-speed program execution time is set, operation of the scan execution type
program is started ignoring the surplus time after completion of the low-speed END
processing.
Surplus time in low-speed program execution time
= (Set low-speed program execution time) - (Low-speed scan time)
Accordingly, the scan time is different at each scan.

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

(b) If the low-speed execution type program is not processed within surplus time of
the constant scan time or within the low-speed program execution time, the
program execution is interrupted and is resumed in the next scan.

POINT

(1) For the index register processing in the case where a scan execution type
program is switched to a low-speed execution type program, refer to the
QnACPU Programming Manual (Fundamentals).
(2) For the index register processing in the case where an interrupt program is
executed during execution of a low-speed execution type program, refer to the
QnACPU Programming Manual (Fundamentals).
(3) Set a proper low-speed program execution time so that the value obtained by
adding it to the scan time is smaller than the set WDT value.
(4) The COM instruction cannot be used in the low-speed program.
(5) When "Constant scan time" and "Low-speed program execution time" are set,
PRG. TIME OVER (Error code: 5010) occurs in the case of (Surplus time of
constant scan)
(Low-speed program execution time)
Execute the low-speed execution type program either in the constant scan
time or in low-speed program execution time.

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

12 - 12

12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

12 - 13

12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

(4)

END processing
When all of the low-speed execution type program has been completed, low-speed
END processing is executed.
The following processing is performed in low-speed END processing:
Setting of special relays/special registers for the low-speed execution type
program
Writing the low-speed execution type program during RUN
Measurement of the low-speed scan time
Resetting the watchdog timer for the low-speed execution type program
When low-speed END processing is completed, the low-speed execution type
program is executed again from the beginning.
POINT

In execution of a low-speed execution type program, the constant scan time may
be extended by a time equivalent to the maximum processing time for the
instructions executed plus the low-speed END processing time.
(5)

Low-speed scan time

(a) The low-speed scan time is a total time of the time required for completion of the
low-speed execution program and the low-speed END processing time.
If multiple low-speed execution type programs are to be executed, it is the total
time of the time required for completion of all low-speed execution type
programs and the low speed END processing time.
(b) The Q2ASCPU measures the low-speed scan time and stores it in special
registers SD528 to SD535.*1
The low-speed execution scan time can be checked by monitoring these
registers.

Example:
If "3" and "400" are stored in SD528 and SD529 respectively, the scan time is
3.4ms.
*1

The accuracy of each scan time stored in the special registers is 0.1ms. Note that, even if a
watchdog timer (WDT) reset instruction is executed in the sequence program, measurement
of each scan time is continued.

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

(6)

Low-speed execution monitoring time

This is a timer for monitoring the execution time of low-speed execution type
programs; no default value is set.
To monitor the execution time of an low-speed execution type program, a value can
be set within the range of 10ms to 2000ms in "PLC RAS" in the parameter mode.
(Setting units: 10ms).
If the low-speed scan time exceeds the set low-speed execution monitoring time, a
"PRG TIME OVER" error occurs. The Q2ASCPU however continues its operation.
POINT

The low-speed execution monitoring time is measured in low-speed END

processing.
Because of this, when the low-speed execution monitoring time (t) is set to 100ms,
a "PRG TIME OVER" error occurs if the low-speed scan time measured in lowspeed END processing exceeds 100ms.

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

12.1.4 Standby type program

(1)

Definition
(a) The standby type program is a program that is executed only in response to an
execution request.
(b) The standby type program has the following applications:
1) Program library
Subroutine programs and interrupt programs are set as standby type
programs and controlled separately from the main program.
2) Set-up of programs
The main routine program is registered to the standby type program and
programs required for control are changed to the scan execution type
programs. Programs not used for control are changed to the standby type
programs.

(2)

Program library
(a) Library creation of program
1) Program library is used to control subroutine programs and interrupt
programs separately from the main routine program.
It is possible to create multiple subroutine programs and interrupt programs
as one standby type program.

2) When a standby type program execution is completed, control returns to the

program that was being executed before execution of the standby type
program.
The following shows the operation performed when a subroutine program
and an interrupt program in a standby type program are executed.

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

POINT

(1) Timers are not to be used in standby type programs because they update
present values and turn ON/OFF the contacts when the OUT T instruction is
executed.
(2) When setting a subroutine program as a standby type program, use a common
pointer.
Standby type programs that use local pointers are not executable.
For details on common and local pointers, refer to the QnACPU Programming
Manual (Fundamentals).
(b) When grouping several subroutine programs into one
1) Create subroutine programs in order starting from step 0 in the standby type
program.
An END instruction is required at the end of the subroutine programs.
2) Since there are no restrictions on the order of creation of subroutine
programs, there is no need to arrange pointers in ascending order of pointer
numbers when creating multiple subroutine programs.
3) Use common pointers. *
Subroutine programs using common pointers can be called from all the
programs that are being executed by the Q2ASCPU.
Q2ASCPU

Program A

Memory card/
internal RAM
Main routine program

Write

Program B

Program B (standby type program)

P500

Y10

Program A

Write

RET

P508

Y11

RET

Y12

P501

RET
END
Use a common pointer.*
(Pointers do not have to be set in ascending order.)

REMARK
*

For details on common pointers, refer to the QnACPU Programming Manual (Fundamentals).

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

(c) When grouping several interrupt programs into one

1) Create interrupt programs in order starting from step 0 in the standby type
program.
An END instruction is required at the end of the interrupt programs.
2) Since there are no restrictions on the order of creation of interrupt programs,
there is no need to arrange pointers in ascending order of pointer numbers
when creating multiple interrupt programs.
Q2ASCPU

Program A

IC Memory card/
internal RAM

Main routine program

Write

Program B

Program B (standby type program)

I0

Y10

Program A

Write

RET
Interrupt
program

I32

Y11

RET

Y12

I28

RET
END
Use an interrupt pointer.
(Pointers do not have to be set in ascending order.)

REMARK
For details on interrupt pointers, refer to the QnACPU Programming Manual
(Fundamentals).

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

(3)

Set-up of programs
(a) Programs corresponding to all of the systems can be created in advance, and
thereby necessary programs only can be executed.
Programs set as the standby type with parameters can be changed to the scan
type programs in the sequence program for execution.
Use the following instructions to change the execution type in the Q2ASCPU:
1) PSCAN instruction : Changes the program type from the standby type to the
scan execution type.
2) PLOW instruction : Changes the program type from the standby type to the
low-speed execution type.
3) PSTOP instruction : Changes the program type from the scan execution/lowspeed execution type to the standby type.
(b) The following methods are available to switch programs for execution:
1) When selecting programs to be executed in a control program:
Defining the scan execution type program as the control program, the
QnACPU switches between the standby type program and the scan
execution type program according to the set conditions to control the
program to be executed.
The following shows how the excution types of standby programs, "ABC,"
"DEF," "GHI" and "JKL" are changed in the control program.

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

2) When changing the execution type of another program from the scan
execution type program:
In the scan execution type program in execution, the type of the program to
be executed next is changed from the standby type to the scan execution
type.
The following shows the operation that the QnACPU switches the standby
type program "DEF" to the scan execution type, and the scan execution
program "ABC" to the standby type program when M0 in program "ABC"
turns on.
[Before execution of PSCAN and PSTOP instructions]

[After execution of PSCAN and PSTOP instructions]

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

(c) The program execution type is changed by the PSCAN or PSTOP instruction in
the END processing.
Therefore, it is not changed during program execution.

REMARK
*

The "GHI" and "DEF" programs are executed in the sequence set with parameters in the
program setting.

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

12.1.5 Initial processing

Initial processing is the pre-processing for executing sequence operations.
The QnACPU executes it only once in the case of the CPU module status described in the
following table.
Once the initial processing is completed, the CPU module is placed into the operation
status set by the RUN/STOP switch.
Status of the CPU module
Item
At Power ON

STOP

At RESET

RUN

Status*1

Initialization of I/O module

Initialization of devices outside latched range
(Bit device: OFF, Word device: 0)
Self-diagnostics
Auto allocation of module I/O No.
Setting MELSECNET/10 network info and MELSECNET(II)/B
data link info
Setting CC-Link info and MELSECNET/MINI-S3 info
Setting initial device values
Booting from memory card

: Executed
*1

: Not executed

Indicates the case that the CPU enters RUN status without being reset after changing a
parameter or program in STOP status.
(The RUN/STOP key switch is operated as follows: STOP
flickering.)

STOP

RUN

(RUN LED is

RUN.)

Note that the instructions for conversion into pulse (PLS, P) may not function properly since
the previous information may not be retained depending on the program change (write during
RUN in STOP status, or write to PLC).

12.1.6 Refresh processing of I/O module

Refresh processing of I/O modules is executed.
(Refer to the QnACPU Programming Manual (Fundamentals).)

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12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

12.1.7 END processing

This is a post-process to finish one cycle of operation processing of the sequence program
and to return the execution of the sequence program to step 0.
(a) Self-diagnostic checks are performed for fuse blown, module verify, or low
battery. (Refer to Section 9.3)
(b) When data read/write is requested from a peripheral device or an intelligent
special function module (computer link module, serial communication module,
Ethernet module, etc.), data are exchanged between the programmable
controller CPU and the peripheral device or intelligent special function module.
(c) Refresh processing is performed when a refresh request is issued from a
network module or a link module.
(d) When the trace point for sampling trace is set to each scan (after execution of
END instruction), the status of the set device is stopred into the sampling trace
area.
(e) Refresh processing based on the MELSECNET/MINI-S3 automatic refresh
function is performed. (Refer to Chapter 7))
POINT

(1) If the constant scan function (see Section 10.2) is set, the END processing
time result is retained during the period between completion of END
processing and start of the next scan.
(2) If a low-speed execution type program (see Section 12.1.3) is executed, lowspeed END processing is performed separately from normal END processing.
In low-speed END processing, the special relays and special registers for lowspeed execution programs are set.

12 - 23

12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

12.2 Operation Processing of RUN, STOP, PAUSE, and STEP-RUN

The Q2ASCPU has four kinds of operation statuses: RUN, STOP, PAUSE, and step
operation (STEP-RUN) statuses.
Operation processing of programmable controller CPU in each operation status is
explained here.
(1)

RUN status operation processing

(a) The RUN status represents a status in which sequence program operation is
repeated in the order from step 0
END (FEND) instruction
step 0.
(b) When entering the RUN status, the CPU outputs the output status data saved in
STOP status according to the output mode setting parameter for STOP
RUN.
(c) Processing time from switching STOP
RUN to the start of the sequence
program operation is usually one to three seconds, although it may vary
depending on the system configuration.
Note that it may be longer than this depending on the conditions.

(2)

STOP status operation processing

(a) The STOP status is a status in which sequence program operation is stopped by
the RUN/STOP key switch or due to remote STOP (see Section 10.6.1).
(b) When entering the STOP status, the CPU saves the output status data and turns
all output points to OFF. Data memories except for output (Y) are retained.

(3)

PAUSE status operation processing

(a) The PAUSE status represents a status in which operation of sequence program
is suspended with the output and data memory statuses retained. (Refer to
Section 10.6.3)

(4)

Step operation (STEP-RUN) operation processing

(a) STEP operation is an operation mode in which operation processing of a
sequence program can be paused/continued by each instruction using GPP
function. (Refer to Section 8.7)
(b) Since an operation processing is paused while retaining the output and data
memories, the execution condition can be confirmed.

12 - 24

12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

(5)

Operation processing of Q2ASCPU when RUN/STOP key switch is operated

Q2ASCPU Operation Processing

RUN/STOP state

Operation processing of
sequence program

RUN

STOP

Executes up to the END

instruction, then stops.

Data memory
External output

OS saves the output

status, and sets all the
output points to OFF.

Depends on the
STOP

RUN

Starts from step 0.

Remark
M, L, S, T, C, D

output mode set by

the parameter for
STOP

RUN.

Retains the condition

immediately before
entering the STOP
status.
Starts operations from
the condition
immediately before
entering the STOP
status.

Y
OS saves the output
status, and sets all the
output points to OFF.

Depends on the
output mode set by
the parameter for
STOP

RUN.

POINT

The Q2ASCPU executes the following processing in any of RUN state, STOP
state, or PAUSE status.
Refresh processing of I/O modules
Data communication with peripheral devices, computer link modules, and/or
serial communication modules.
Link refresh processing.
Thus, even in the STOP state or PAUSE state, I/O monitoring and test operations
using a peripheral device, reading/writing from computer link modules or serial
communication modules, and communication with other stations via MELSECNET
can be performed.

12 - 25

12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

12.3 Operation Processing for Instantaneous Power Failure

The Q2ASCPU detects a momentary power failure when the input power voltage supplied
to the power supply module becomes lower than the specified range.
When the Q2ASCPU detects an instantaneous power failure, the following operation
processing is performed.
(1)

When an instantaneous power failure shorter than the allowable momentary power
failure period occurred:
(a) When an instantaneous power failure occurs, the output statuses are held and
the operation processing is suspended after the name of the currently accessing
file and error history have been stored.
(The timer count continues.)
(b) If there is an SFC continuous operation designation, system save processing is
executed.
(c) When power is restored, the operation processing will be continued.
(d) While the operation is interrupted due to an instantaneous power failure,
measurement of the watchdog timer (WDT) continues. For example, if 200ms is
set for the WDT parameter setting, power failure of 15ms in the scan time of
190ms will cause a watchdog timer error.

Occurrence of
instantaneous
power failure
END 0

Power supply
recovered
END

END

The programmable controller

suspends the operation.

Fig. 12.1 Operation Processing for Instantaneous Power Failure

(2)

When power failure longer than the allowable momentary power failure period
occurred:
The Q2ASCPU starts from the first.
The operation processing is the same as that performed at programmable controller
power-up or at CPU module reset by the RUN/STOP key switch.

12 - 26

12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

12.4 Data Clear Processing

The Q2ASCPU clears data other than the following by turning the RUN/STOP key switch
to RESET or by resetting the programmable controller power (ON, OFF and ON):
(a) Data in the built-in RAM (except data specified for memory clear in the boot
(b)
(c)
(d)
(e)
(f)
(g)

specification)*1
Data in the memory card
Data of latch-specified devices(Latch clear key enabled)
Data of latch-specified devices(Latch clear key disabled)
File register data
Local device data
Fault history data
*1

For the boot specification, refer to the QnACPU Programming Manual (Fundamentals).

Data given in (c) and (g) are cleared by latch clear operation using the RUN/STOP key
switch (Refer to Section 15.3.) or by remote latch clear operation from GPP function (Refer
to Section 10.6.5.)
The latch range is specified for each device on the "Device" screen in the parameter mode
of GPP function. There are the following two latch range setting options.
1) Latch clear key enabled : Used to set a latch range which can be cleared by
the latch clear operation using the RUN/STOP key
switch.
2) Latch clear key disabled: Used to set a latch range which cannot be cleared
by the latch clear operation using the RUN/STOP
key switch.
Devices for which the latch clear key is disabled can be cleared by an instruction or by the
clear operation of GPP function.
1) Clearing by an instruction

: Reset by RST instruction , or transfer K0

with MOV instruction .

2) Clearing by GPP function

: Execute device memory all clear from the

PLC menu in the online mode.

For details on device latch ranges, refer to the QnACPU Programming Manual
(Fundamentals).
For details on the operation method of GPP function, refer to the GX Developer Operating
Manual or Type SW IVD-GPPQ Software Package Operating Manual (Online)/(Offline).

POINT

To clear file registers or local devices, reset them with the RST instruction or
transfer KO with the MOV instruction.

12 - 27

12. OVERVIEW OF PROCESSING PERFORMED BY THE Q2ASCPU

MEMO

12 - 28

13. PARAMETER LIST

13

PARAMETER LIST
The parameters set for the Q2ASCPU are listed in the table below.
For details on each parameter, refer to the section or reference manual indicated.
Item

Parameter No.

Description

Set labels and/or comments for peripheral devices on the CPU

PLC name

module.
This setting does not affect CPU module operation.

Label

0000H

Set a label for the CPU module.

Comment

0001H

Set a comment for the CPU module.

PLC system

Make various settings that are required for the CPU module
system.

Low-speed timer
1000H

Set the low-speed or high-speed timer limit.

RUN-PAUSE contacts

1000H

Set the contact to control RUN/PAUSE of the CPU module.

Remote reset

1002H

Enable or disable the remote reset operation.

1003H

Set the output mode for switching from STOP to RUN.

Common pointer No.

1005H

Set the first common pointer number.

General data processing

1006H

Points occupied by empty slot

1007H

Timer limit setting

High-speed timer

Output at STOP

RUN

Set the number of modules that are processed in one general data
processing.
Set the number of points occupied by empty slots.

Interrupt counter

System interrupt

1008H
Fixed scan interval

PLC file

Set the first interrupt counter number, and the fixed scan interval for
the interrupt pointer.

Set various kinds of files used by the CPU module.

File register

1100H

Set a file register file to be used.

Comment file used in a command

1101H

Set a comment file used in an instruction.

Initial device value

1102H

Set a file for initial device values to be used.

File for local device

1103H

Set a file for local devices to be used.

13 - 1

13. PARAMETER LIST

Setting
Reference Section/Reference Manual
Default value

Setting range

No setting

Up to 10 characters

No setting

Up to 64 characters

100ms

10ms to 1000ms (in 10ms units)

10ms

1ms to 100ms (in 1ms units)

No setting

X0 to X1FFF

Section 10.6.1, Section 10.6.3

Disabled

Enabled/disabled

Section 10.6.4

Before operation

Before operation/After 1 scan

Section 10.4

No setting

P0 to P4095

QnACPU Programming Manual (Fundamentals)

1 module

1 to 6 modules

Section 6.3

16 points

0 point to 64 points (in 16-point units)

Section 5.3

No setting

C0 to C65535

Section 11.2

QnACPU Programming Manual (Fundamentals)

I28

100ms

I29

40ms

I30

20ms

I31

10ms

QnACPU Programming Manual (Fundamentals)

5ms to 1000ms (in 5ms units)

Not used
Not used

Use the same file name as the program.

QnACPU Programming Manual (Fundamentals)

Use the following file.

Not used
Not used

Use the same file name as the program.

Section 11.5

Use the following file.

Use the same file name as the

program.

Not used

Not used
Use the same file name as the program.

QnACPU Programming Manual (Fundamentals)

Use the following file.

Not used

QnACPU Programming Manual (Fundamentals)

Use the following file.

13 - 2

13. PARAMETER LIST

Item

Device

Parameter No.

Description

Set the number of points, latch range, etc., for each device.

Device points

2000H

Set the number of device points used.

Latch (1) start (Enable C/L key)

2001H

Set the latch range for which latch clear key operation is enabled.

Latch (2) start (Disable C/L key)

2002H

Set the latch range for which latch clear key operation is disabled.

Local device

2003H

Set the range of devices to be set as local devices.

Set various kinds of settings for the RAS function.

PLC RAS
WDT setting
Initial execution
WDT setup

3000H

Set the watchdog timer for the CPU module.

Error check

3001H

Set whether to detect the specified errors or not.

Operating mode when there is an error

3002H

Constant scan

3003H

monitoring time
Low speed execution
monitoring time

Set the operation mode in which the CPU module enters when an
error is detected.
Set the constant scan time.

Display F No.
Annunciator
display mode

Comment display

3004H

Set the display mode that is activated when an annunciator comes

ON.

Time of occurrence
Breakdown history

3005H

Low speed program execution time

3006H

Set where the CPU module breakdown history is stored.

Set the time required for execution of low-speed execution type
programs.

13 - 3

13. PARAMETER LIST

Setting
Reference Section/Reference Manual
Default value

Setting range

8k points

8k points

8k points

8k points

8k points

2k points

SB

2k points

Fixed to X (8k points), Y (8k points), S (8k points), SB

(2k points), SW (2k points).

2k points

Up to 32k points per device within a range of 28.8k

8k points

words, including the above points

2k points

ST
C

QnACPU Programming Manual (Fundamentals)

However, the total for bit devices is 64k points.

0k point
1k point

12k points

8k points

SW

2k points

No setting

1 range only for each device

Section 10.3

No setting

1 range only for each device

Section 10.3

No setting

1 range only for each device

QnACPU Programming Manual (Fundamentals)

200ms

10ms to 2000ms (in 10ms units)

Section 9.2

No setting

10ms to 2000ms (in 10ms units)

Section 12.1.1

No setting

10ms to 2000ms (in 10ms units)

Section 12.1.3

Checked

Error checked

Section 9.3

Stop

Stop/Continue

Section 9.3

No setting

5ms to 2000ms (in 5ms units)

Section 10.2

Displayed

Displayed/Not displayed

Not displayed

Displayed/Not displayed

Not displayed

Displayed/Not displayed

Stored in built-in RAM

Stored in built-in RAM/specified history file

Section 9.4

No setting

1ms to 2000ms (in 1ms units)

QnACPU Programming Manual (Fundamentals)

13 - 4

Section 9.8.2

13. PARAMETER LIST

Item

Parameter No.

I/O Assign

Description

Set the mounting status of each module.

Classification
Number of points
Slot setting

4000H

Set the module type, number of points, head I/O No., etc.

Start XY
Model Name
Set model names of a power supply module and/or extension

Power model name

Base setting

cables.

4001H
Extension cable

MELSECNET/Ethernet setting
Unit count
Valid module for
access to other station
Inter-device transfer
parameters

MELSECNET (II)
and MELSECNET/
10 network setting

5000H
5001H

5002H
5003H

Network setting

5NM0H

Set link parameters for the MELSECNET (II) data link system,
network parameters for the MELSECNET/10 network system or

Network refresh
parameter

Station inherent
parameter
I/O assignment

setting

Routing parameter

Common parameter

Ethernet network

This setting does not affect CPU module operation.

5NM1H

Ethernet parameters.

5NM2H
5NM3H
5NM4H

Group No.
9N00H
IP address

13 - 5

13. PARAMETER LIST

Setting
Reference Section/Reference Manual
Default value

Setting range

No setting

Empty/Input/Output/Special

No setting

0 to 64 points (in 16-point units)

No setting

0 to 1FFFH (in 10H units, hexadecimal)

No setting

Up to 16 characters

No setting

Up to 16 characters

Section 5.3

Section 5.3

For QnA/Q4AR MELSECNET/10 Network System

For QnA/Q4AR MELSECNET/10 Network

Reference Manual

System Reference Manual

MELSECNET, MELSECNET/B Data Link System

Reference Manual

Network type

N and M indicate the following:

N: Number of the module counted from the first.
M: Network type
M

Network type

0H

MELSECNET/10 (Default)

7H

MELSECNET (Local station)

1H

MELSECNET/10 (Control station)

8H

MELSECNET II mixed (Local station)

2H

MELSECNET/10 (Normal station)

9H

MELSECNET II (Local station)

3H

MELSECNET/10 (Remote master station)

AH MELSECNET/10 (Standby station)

4H

MELSECNET (Master station)

BH MELSECNET/10 (Multiple remote master)

5H

MELSECNET II mixed (Master station)

CH MELSECNET/10 (Parallel remote master)

6H

MELSECNET II (Master station)

13 - 6

Network type

MELSECNET/10 (Multiple remote

DH submaster, No remote master in the host
CPU module)
MELSECNET/10 (Multiple remote
EH submaster, There is a remote master in the
host CPU module.)
FH

MELSECNET/10 (Parallel remote

submaster)

13. PARAMETER LIST

Item

Parameter No.

MELSECNET/MINI setting

Number of master modules

6000H

Description

Make the settings for automatic refresh of the MELSECNET/MINI

system.
Set the number of MELSECNET/MINI master modules to be used.

Master module head

I/O No.
Model name & number
of stations
Receive data
batch refresh
Send data
batch refresh
Retry count for
MELSECNET/
MINI
detailed settings

communication errors
FROM/TO instruction

600NH*

Make the detailed setting required for automatic refresh of the

MELSECNET/MINI system.

access priority
Receive data clear
at communication error
Faulty station detection
bit data
Error No.
MINI link operation
when CPU stopped
Circuit error check
Perform various settings required when multiple programs are

Supplementary settings

used.
7000H

Program setting
Boot file setting

Set programs to be executed among multiple programs.

Set the file for boot operation and other settings.

SFC

SFC program start mode

8002H

Start condition

8003H

Output mode when the block is stopped

8005H

Perform various settings required for SFC programs.

Acknowledge XY assignment

Allows confirmation of the settings made in I/O assignment.

This setting does not affect CPU module operation.

N means the number of the master module counting from the first. (N: 1 to 8)

13 - 7

13. PARAMETER LIST

Setting
Reference Section/Reference Manual
Default value

Setting range

0 to 8

No setting

Number of I/O points of CPU module

MINIS3

MINIS3/MINI( ) stations

X1000 to 200H

Y1000 to 200H

X, M, L, B, T, ST, C, D, W, R, ZR, none

(Bit device: multiples of 16)
Y, M, L, B, T, ST, C, D, W, R, ZR, none
(Bit device: multiples of 16)

5 times

0 to 32 times

CPU

CPU/Link

Clear

Clear/Hold

No setting

M, L, B, T, ST, C, D, W, R, ZR, none

No setting

D, W, T, ST, C, R, ZR

Stop

Continue/Stop

Latch data

Test message/OFF data/Latch data

No setting

Program name/Scan/Low-speed/Initial/Standby

No setting

Chapter 7

QnACPU Programming Manual (Fundamentals)

File name/Type/Transfer source drive/

Transfer destination drive

QCPU (Q mode)/QnACPU Programming

QCPU (Q mode)/QnACPU Programming Manual

Manual (SFC)

(SFC)

GX Developer Operating Manual

SW

IVD-GPPQ Software Package Operating

Manual (Offline)

13 - 8

13. PARAMETER LIST

Item
Network parametars Setting the CC-Link
Number of CC-Link

Parameter No
C000H

Master module head

I/O No

Description
Make the settings for automatic refresh of the CC-Link system.
Set the number of CC-Link master modules to be used.

CNM2H

Module type
Receiving data batch refresh
bit device
(Input data)
Transmission data batch
refresh bit device
(Output data)
Receiving data batch refresh
word device

CNM1H

(Remote device: RWr)

CC-Link

Transmission data batch

detailed

refresh device

settings

(Remote device: RWw)

Batch refresh device for

Make the detailed setting required for automatic refresh of

special relay

the CC-LinkI system.

Batch refresh device for

special register
Number of retries
Number of automatic return
stations
Standby master staiton No.
PLC down select
Scan mode setting
Delay timer

CNM2H

Station type
Station
information
setting

Number of occupied stations

Specification of reserved
station/Specification of
invalid station

13 - 9

13. PARAMETER LIST

Setting
Default value

Setting range

1 to 8

0000H to 0FE0H

Reference Section/Reference Manual

M: Master station/L: Local station/

T: Stand-by station

X,M,L,B,T,ST,C,D,W,R,ZR

Y,M,L,B,T,ST,C,D,W,R,ZR

M,L,B,T,ST,C,D,W,R,ZR

M,L,B,T,ST,C,D,W,R,ZR

M,L,B,T,ST,C,D,W,R,ZR

T,ST,C,D,W,R,ZR

1 to 7

1 to 10

Not reserved/Reserved

Continue/Stop

Synchronization/Non-synchronization

Chapter 7

1 to 100

(0 is invalid.)
Remote I/O station/Remote device station

/Intelligent device station

1 station/2 station/3 station/4 station

Specification of reserved station/Specification

of invalid station
*

N and M indicate the following:

N:Number of the module counted from the first.
M:Network type M:Network type
Network type

Network type

0H

Master station)

4H

MELSECNET (Master station)

1H

Local station)

5H

MELSECNET II mixed (Master station)

2H

Standby master station

6H

MELSECNET II (Master station)

3H

MELSECNET/10
(Remote master station)

13 - 10

14. SELECTING MEMORY CARD MODELS

14

SELECTING MEMORY CARD MODELS

Since the Q2ASCPU has a built-in RAM as a standard feature to store parameters and
programs, programs can be executed without installing a memory card.
Each CPU model has a built-in RAM of the following program capacity.
Q2ASCPU.................... 28k steps

(112k bytes)

Q2ASCPU-S1.............. 60k steps

(240k bytes)

Q2ASHCPU................. 28k steps

(112k bytes)

Q2ASHCPU-S1............60k steps

(240k bytes)

14 - 1

14. SELECTING MEMORY CARD MODELS

14.1 Applications of Memory Cards

A memory card is required in the following cases:
(1)

To perform a boot operation

Parameters, programs, initial device values, comments, and boot files are stored in a
memory card, and they are loaded to the built-inRAM at the time of program
execution.

(2)

To use file registers.*1

(3)

To use local devices.*2

(4)

To use a simulation data file with the simulation function.*2

(5)

To use the sampling trace function.*2

(6)

To use the status latch function.*2

(7)

To use the program trace function.*2

(8)

To store the breakdown history data in a file.*2

(9)

To execute programs of the maximum number of steps available for the Q2ASCPU.
When a program of the maximum capacity is stored in the built-in RAM, the
parameter files and initial device values must be stored in a memory card.

(10) To use the SFC trace function.*2

*1
*2

They will be read-only in programs if they are set in the ROM area of the memory card.
Can only be set in the RAM area of the memory card.

14 - 2

14. SELECTING MEMORY CARD MODELS

14.2 Selecting Memory Card Capacity

Select a memory card capacity according to the types and sizes of files to be stored in the
memory card. The sizes of files are calculated using the formulas presented below.
Function

Approximate File Capacity (Unit: Bytes)

Drive title

64

Keyword

72

Parameters*3

MELSECNET, NET/10 None

330

When MELSECNET (II, /B) set

Boot file

(Number of files

Sequence program*3

(Number of steps

Max. 4096 per module

18) + 67
4) + 122

(Total commend data size of each device) + 74

Setting with GX Developer
The comment data size of 1 device is as follows:
Device comments*3

10250

a + 40

b + 10 (Quotient of (No. of devices / 256) is substituted for a and the remainder for b.)

Setting with SW

IVD-GPPQ

Although the size varies depending on EMS capacity, it is equivalent to or less than the size obtained in the above DX
Developer case.
Initial device value*3

(Number of device points

2) + (device types*1

File register

Number of points for file registers

Local device

(72 + (6

44) + 66

2 bytes

No. of Setting range*4) + (2

No. of word devices) + (No. of bit devices / 8)

No. of program files used

Round-up

Simulation data

(Number of word device points

2) + (number of bit device points / 16)

2 + (device ranges*2 44) + 66

Rounded up
362 + (No. of word device points + No. of bit device points)

Sampling trace data

For all devices

Status latch data

12 + (N1 + N2 + N3 + No. of word device points

2 + (No. of

bit device points/16) 2) trace count (total count)*5

According to the items set in the added trace information on the trace device setting screen, the following values are
added forN1 to N3.
(Refer to Section 8.5 (2) (b))
N1: When setting time, "4" is added.
N2: When setting step No., "10" is added.
N3: When setting the program name, "8" is added.
: 58576

For detailed devices : (Number of word device points 2)

+ (number of bit device points / 16) 2 + (device types

8) + 352

Rounded up
Program Trace Data

Same as sampling trace

Breakdown history data

54

SFC trace data

Max. 48k (in 1 kbyte units)

number of faults stored + 72 bytes

*1
*2
*3
*4
*5

"Device types" represents the number of registered device names.

For example, if D, W, and T are registered, it is 3.
"Device ranges" represents the number of registered range settings.
These files can be transferred from the memory card to the built-in RAM in the boot operation.
The total number of setting ranges is the total number of types of the devices that are set as
local devices.
Decimal fraction of "number of bit device points/16" is rounded up.

14 - 3

14. SELECTING MEMORY CARD MODELS

POINT

Note that the capacity may be rounded up as follws depending on the memory
area used for storage:
Built-in RAM.................. 4096 bytes (1k step) units
Memory card................. 512 bytes units
Note that, when a file is transferred from the memory card to the built-in RAM in
boot operation, the reserved capacity is changed after transfer.

14 - 4

15. HARDWARE SPECIFICATIONS OF CPU MODULES

15

HARDWARE SPECIFICATIONS OF CPU MODULES

15.1 SPECIFICATIONS
The general specification common to various modules is shown.
Specifications
Item

Specifications

Operating ambient

0 to 55

temperature
Storage ambient

-20 to 75

temperature
Operating ambient humidity

10 to 90 % RH, No-condensing

Storage ambient humidity

10 to 90 % RH, No-condensing

Under
Conforming to
Vibration resistance

JIS B 3502,

Frequency

Acceleration

10 to 57Hz

0.075mm
(0.003 inch)

intermittent
vibration

57 to 150Hz

9.8m/s

10 to 57Hz

IEC 61131-2
Under

57 to 150Hz

Sweep count
10 times each
in X, Y, Z
directions

0.035mm
(0.001inch)

continuous
vibration

Amplitude

4.9m/s

Conforming to JIS B 3502, IEC 61131-2 (147m/s2 , 3 times in each of 3 directions XYZ)

Shock resistance
Operation ambiance

No corrosive gasses

Operating elevation*3

2000m (6562 ft.) or less

Installation location

Control panel

Overvoltage category*1

II or lower

Pollution degree*2

2 or lower

Equipment category

Class I
*1

*2

*3

This indicates that the equipment is assumed to be connected to which power distributer in
the area from the public electrical power distribution network to machinery in the premises.
Category II applies to equipment to which electrical power is supplied from fixed facilities.
The surge voltage withstand level for up to the rated voltage of 300V is 2500V.
This index indicates the degree of conductive material generation in the environment where
the equipment is used.
In Pollution degree 2, only non-conductive pollution occurs. Occasionally, however, temporary
conductivity caused by condensation can be expected.
Do not use or store the programmable controller in the environment where the pressure is
higher than the atmospheric pressure at sea level. Otherwise, malfunction may result.
To use the programmable controller in high-pressure environment, please contact your local
Mitsubishi representative.

15 - 1

15. HARDWARE SPECIFICATIONS OF CPU MODULES

15.2 Part Names

The names of module parts and their settings are described here.
Q2ASCPU, Q2ASCPU-S1, Q2ASHCPU, Q2ASHCPU-S1

Q2ASHCPU

1)
2)
3)
4)
5)

STOP

6)

L.CLR
RESET

RUN
RESET

7)

9)
8)

12)

10)

14)

13)
11)

Viewed with the front cover open

No.

Name

Application
Indicates the operating status of the CPU module.

1)

RUN LED

ON:
OFF:

Operating with the RUN/STOP key switch set to RUN or STEP RUN.
Stopped with the RUN/STOP key switch set to STOP, PAUSE, or STEP RUN.
Or, an error that stops operation was detected.

Flickering:

The RUN/STOP key switch was shifted from STOP to RUN after writing a program in the STOP state.
The CPU module is not in the RUN state.To actually put the CPU module in the RUN state, either move
the switch one more time from "RUN"

"STOP"

"RUN", or use the RUN/STOP key switch to perform

reset operation.Alternatively, reset it with the RUN/STOP key switch.

ON:
OFF:
Flickering:

A self-diagnostics error that does not stop operation, other than a battery error, has been detected.
(When the parameter setting is made for operation to continue when an error occurs.)
Normal
An error that stops operation has been detected.

USER LED

ON:
OFF:
Flickering:

An error has been detected by the CHK instruction, or an annunciator F has come ON.
Normal
When latch clear is performed.

4)

BAT.ALARM LED

ON:
OFF:

A battery error occurred due to low battery voltage in the CPU module or memory card.
Normal

5)

BOOT LED

ON:
OFF:

Execution of the boot operation is completed.

No boot operation has been executed.

2)

ERROR LED

3)

RUN/STOP: Starts/stops sequence program operation.

6)

RUN/STOP key switch

L.CLR:

Clears all data in the latch area (to "OFF" or "0") which is set with parameters.
Clears sampling trace and status latch registrations.

RESET: Resets the hardware. Resets and initializes operation when an operation error occurred.

15 - 2

15. HARDWARE SPECIFICATIONS OF CPU MODULES

No.

Name

Application

7)

Battery (A6BAT)

Backup battery for the built-in RAM and the power failure compensation function.

8)

Battery connector pin

Used for connection of the battery lead wire.

(To prevent battery drain, the battery lead wire is disconnected from the connector before shipment. See Section 18.6.)

9)

Memory card EJECT

button

Used to eject the memory card from the CPU module.(Refer to Section 18.7)

10)

Memory card installing

connector

Connector for installing the memory card in the CPU module.

Memory card in/out

switch
(with built-in LED)

Used to enable/disable memory card installation or removal while the power is ON.Factory-set to OFF.

11)

ON:

Cannot be removed (LED lit)

OFF:

Can be removed (LED unlit)

Refer to Section 15.3 (3) and (4) for installation or removal of a memory card.

Settings required to operate the CPU module are made.All switches are set to OFF before shipping.

System setting switch 1

SW5:

Boot file settingSetting of the memory used for operation.

ON:

Boot operation

OFF:

Boot operation is not performed.

ON
5
4
3

12)

SW2 to 4: Parameter areaSetting of the memory in which parameters are written.

System
setting
switch 1

Memory card

* SW2 to 4 are valid even if SW5 is OFF.

Built-in RAM
RAM

ROM

SW4

OFF

ON

OFF

SW3

OFF

OFF

ON

SW2

OFF

OFF

OFF

System setting switch 2

SW1:

System protectProhibition of all writing and control directions to the CPU module.

ON:

System protection enabled

OFF:

System protection disabled

Settings required to operate the CPU module are made.All switches are set to OFF before shipping.
SW2: Not used. (Fixed to OFF.)

ON
13)

SW1:

Peripheral protocol.Select the type of the peripheral device connected to the peripheral interface of the CPU
module.
(When accessing an ACPU on another station from a peripheral device for ACPU, set this switch to ON. The
setting becomes valid immediately after switching.)

ON:

Peripheral device for ACPU

14)

RS-422 connector

Connector for connecting to a peripheral device.

15 - 3

15. HARDWARE SPECIFICATIONS OF CPU MODULES

15.3 Relationship between Switch Operations and LEDs/LED Display

(1)

Writing programs with the CPU module in STOP state

To write a program to the CPU module while it is in the STOP state, use the following
procedure.
1) Set the RUN/STOP key switch to STOP
RUN LED

:OFF

2) Set the RUN/STOP key switch to RESET

RUN LED

......CPU module in RESET state

:OFF

3) Set the RUN/STOP key switch to STOP

RUN LED

:ON

RUN

......CPU module in RUN state

POINT

(1) For the Q2ASCPU, after writing a program (except for writing to PLC during
RUN), set the CPU module to RESET and then to RUN.
(2) If the key switch is set to RUN without resetting, the CPU module will remain
in STOP state displaying as follows:
RUN LED

:Flickers

*1

After this occurs, the CPU can be placed into RUN state by setting the RUN/
STOP key switch to RESET.
In this case, internal CPU module data such device data are cleared.
(3) To prevent the internal CPU module information from being cleared, switch
the RUN/STOP key switch STOP RUN again without resetting.
*1

If Remote STOP RUN is performed for the CPU module, the CPU will be in RUN status, not
in "PROG.CHECK" status.

15 - 4

15. HARDWARE SPECIFICATIONS OF CPU MODULES

(2)

Performing latch clear

To perform latch clear, operate the RUN/STOP key switch as follows.
1) Move the "RUN/STOP" key switch of the CPU module from the "STOP" to the
"L.CLR" position several times to flicker the "USER LED" on the CPU module
front.
Normally, the LED flickers after the switch is moved several (three or four) times.
When the "USER LED" flickers, it indicates that latch clear is ready.
2) After the "USER LED" has flickered, moving the key switch from the "STOP" to
the "L.CLR" position again executes latch clear and lights up the "USER LED".
When the "USER LED" is lit for 2 seconds and then goes off, it indicates normal
completion of latch clear.
3) To cancel latch clear midway, move the key switch to the "RUN" position to put
the CPU module in a RUN status or to the "RESET" position to reset.

POINT

(1) The latch clear operation can be set enabled or disabled for each device in
the device setting in the parameter mode.
(2) Remote latch clear executed by the GPP function is an alternative method
other than using the RUN/STOP key switch.(Refer to Section 10.6.5)
(3)

Removing a memory card while the programmable controller power is ON:

When removing a memory card with the programmable controller power ON, operate
the memory card in/out switch as follows:
1) In/out switch: ON.
LED in the switch

:ON ............................. Memory card removal prohibited

2) In/out switch: OFF

LED in the switch

:OFF ........................... Memory card removal permitted

Removal of memory card

POINT

(1) The LED in the in/out switch may not come OFF if the memory card is being
used for a CPU module system function (sampling trace, status latch, etc.) or
by a program. In such a case, stop the function or program using the memory
card. After aborting it, confirm that the LED in the in/out switch has gone OFF,
then remove the memory card.
(2) When a file register, local device or breakdown history set with parameters is
present, the memory card cannot be removed.
Even if the memory card in/out switch is turned OFF, its built-in LED does not
turn OFF. When the file register is set to "Not used" with the QDRSET (P)
instruction, the memory card can be removed.
(3) After removing the memory card, do not turn on the memory card insertion/
disconnection switch for preventing an error.

15 - 5

15. HARDWARE SPECIFICATIONS OF CPU MODULES

(4)

Installing a memory card while the programmable controller power is ON:

When installing a memory card with the programmable controller power ON, operate
the memory card in/out switch as follows:
1) Install the memory card.
2) In/out switch: ON
LED in the switch

:ON ............................. Memory card removal prohibited

POINT

(1) After installing the memory card, set the memory card in/out switch to ON. If it
is not set to ON, the memory card cannot be used.
(2) During one scan after the memory card installation, mounting processing is
performed again. Note that the scan time may be increased by 10ms at
maximum.

15 - 6

16. POWER SUPPLY MODULE

16

POWER SUPPLY MODULE

This section describes the specifications and selection of power supply modules.
16.1 Specifications
16.1.1 Power supply module specifications
(1)

Standard power supply module

Power supply module specifications
Performance specifications

Item

A1S61PN

A1S62PN

Slot position

A1S63P

Power supply module slot

+10%

+30%

100 to 240VAC -15%

Input power supply

(85 to 264VAC)

(15.6 to 31.2VAC)

50/60Hz 5

Within 5% (See Section 19.8)

105VA

41W

20A, 8ms or less *4

81A, 1ms or less

Input frequency
Input voltage distortion

24VDC -35%

Max. input apparent power

Inrush current
Rated output

5VDC

5A

3A

5A

current

24VDC

0.6A

5VDC

5.5A or higher

3.3A or higher

5.5A or higher

24VDC

0.66A or higher

Overcurrent
protection

*1

Overvoltage

5VDC

5.5 to 6.5V

protection*2

24VDC

Efficiency

65% or higher

Allowable momentary power

failure period
Dielectric
withstand
voltage

10ms or lower

20ms or less

*3

(24VDC or higher)

Between primary
and 5VDC

500VAC

AC across input/LG and output/FG,

Between primary 2830VAC rms/3 cycles (altitude 2000m (6562ft.))

AC across input/LG and output/FG 10M

Insulation resistance

or higher, measures with a 500VDC

insulation resistance tester

(10M

or above by insulation resistance tester)

Checked by noise simulator of noise voltage 1500Vpp, noise width 1 , and noise frequency 25 to 60Hz
Noise durability

Checked by noise simulator of noise voltage IEC801-4,

2kV, 1500Vp-p, noise width 1 s, and noise frequency
25 to 60Hz

Power indicator
Fuse

and 24VDC

Checked by noise
simulator of noise voltage
1500Vp-p, noise width
1 , and noise frequency
25 to 60Hz

Power LED indication (light at the time of output of 5VDC)

Built-in (User cannot change.)

16 - 1

16. POWER SUPPLY MODULE

Performance specifications

Item

A1S61PN

A1S62PN

Terminal screw size

M3.5 7

Applicable wire size

0.75 to 2mm2

Applicable solderless terminal

A1S63P

RAV1.25 to 3.5, RAV2 to 3.5

Applicable tightening torque

59 to 88N cm

External dimensions

130mm 55mm 93.6mm

Weight

0.60kg

0.60kg

0.50kg

REMARK
1) The number of occupied slots for the A66P is 1.
POINT

*1 Overcurrent protection
(a) The overcurrent proctector shuts off the 5VDC and/or 24VDC circuit(s)
and stops the system if the current exceeding the specified value flows
in the circuit(s).
As this results in voltage drop, the power supply module LED turns
OFF or is dimly lit.
(b) When this device is activated, eliminate probable causes such as
insufficient current capacity or short circuit, and then start the system.
When the current has reached the normal value, the system will start
from the first.
*2 Overvoltage protection
The overvoltage protector shuts off the 5VDC circuit and stops the system if
overvoltage of 5.5 to 6.5V is applied to the circuit.
The power supply module LED turns OFF. When restarting the system,
switch the input power OFF, then back ON. The system is started up with
an initial start. If the system is not booted and the LED remains off, this
means that the power supply module has to be replaced.
*3 Allowable momentary power failure period
The allowable momentary power failure period of programmable controller
CPUs varies depending on the power supply module used.
In the system using the A1S63P, it is the time from when the primary side of
the stabilized power supply supplying 24VDC to the A1S63P turns OFF
until the voltage (secondary side) has dropped from 24VDC to the specified
value (15.6VDC) or less.
*4 Inrush current
If power is reapplied immediately after power OFF (within 5 seconds), an
inrush current exceeding the specified value may flow (for 2ms or less).
Therefore, before reapplying power, make sure that 5 seconds have
elapsed after power off.
When selecting a fuse or breaker for an external circuit, consider the above
as well as meltdown and detection characteristics.
16 - 2

16. POWER SUPPLY MODULE

16.1.2 Power supply module selection

A power supply module is selected based on to the total current consumption of I/O
modules, special function modules and peripheral devices to which power is supplied by
the power supply module. Remember that when an extension base module such as
A1S52B(S1), A1S55B(S1), A1S58B(S1), A52B, A55B or A58B are used, power is
supplied by the main base.
For 5VDC current consumption of I/O modules, special function modules and peripheral
devices, refer to Section 3.3.

Power-supply
module

Peripheral devices
Q6PU, converter/cable (for connection of
CPU module and personal computer), etc

CPU module

I/O module such as

A1SX10 and A1SY10
*

Special module such as

A1SD61 and A1SD71-S2

Peripheral
device, AD71TU

* Select the module in consideration of the current

consumption of the peripheral device that will be
connected to the special-function module. For
example, when AD71TU is connected to A1SD71S2, the current consumption of AD71TU must also
be considered.

(2)

Selection of power-supply module when extension base modules such as

A1S52B(S1), A1S55B(S1), A1S58B(S1), A52B, A55B and A58B are used
When extension base modules such as A1S52B(S1), A1S55B(S1), A1S58B(S1),
A52B, A55B and A58B are used, the 5 VDC power supply is supplied through the
extension cable from the power-supply module of the main base module. Thus, when
one of these units is used, pay attantion to the following:
(a) When mounting a power supply module on the main base unit, select a model
that can cover 5VDC current consumed by modules mounted on the
A1S52B(S1), A1S55B(S1), A1S58B(S1), A52B, A55B, and/or A58B.
[Example]

When the 5 VDC current consumption on the main base module is

3A and the 5 VDC current consumption on A1S55B is 1A, the
power-supply module that is loaded into the main base module
must be A1S61PN(DC5V 5A).

(b) Since power to the A1S52B(S1), A1S55B(S1), A1S58B(S1), A52B, A55B or

A58B is supplied via an extension cable, a voltage drop occurs through the
cable. It is necessary to select a power supply module and cables with proper
length so that 4.75VDC or more is available on the receiving end. Refer to the
usage standard of the Extension Base Module in Section 17.3 for details on
voltage drops, etc.

16 - 3

16. POWER SUPPLY MODULE

16.2 Precautions for Handling

The following explains the handling precautions for unpacking to mounting of the power
supply module.
(1)

Do not drop the power supply module or give it hard shock since its case, terminal
block connectors and pin connectors are made of resin.

(2)

Tighten the module mounting screws (unnecessary in normal operating status),

terminal screws, etc. in the following ranges.
Screw

Tightening torque range

Power supply module terminal

block terminal screw

(M3 screw)

Power supply module terminal

block terminal screw

(M4 screw)

Module mounting screws

(Optional)

(3)

(M4 screw)

39 to 59N

cm

98 to 137N

cm

78 to 118N

cm

When installing the module to the base unit, press the module completely so that its
hook is locked into the base. When dismounting the module, press the hooks until
they come off the base completely, and then pull the module toward you. (See
Section 19.5.)

16 - 4

16. POWER SUPPLY MODULE

16.3 Part Names

The following gives the names and description of the parts of the power supply modules :

(1) A1S61PN

No.

(2) A1S62PN

Name

Application

1)

POWER LED

The indicator LED for the 5 V DC power.

2)

24 V and 24 G terminals

Used to supply 24 V DC to inside the output module (using external wiring).

3)

FG terminal

The grounding terminal connected to the shield pattern of the printed circuit board.

4)

LG terminal

Grounding for the power supply filter. The potential of A1S61P or A1S62P terminal
is 1/2 of the input voltage.

16 - 5

16. POWER SUPPLY MODULE

(3) A1S63P

No.

Name

Application

5)

Power supply input terminals Used to connect a 24VDC power supply.

6)

Power supply input terminals Used to connect 100VAC to 200VAC power supply.

7)

Terminal screw

M3.5 7

8)

Terminal cover

The protective cover of the terminal block.

9)

Module mounting screw

Used to fix the module to the base unit.

(M4 screw, tightening torque : 59 to 88 N cm)

POINT

(1) Do not cable to the unused terminals such as FG and LG on the terminal
block (terminals whose name is not printed on the terminal cover).
(2) Be sure to ground the terminal LG to the protective ground conductor.

16 - 6

17. BASE UNIT AND EXTENSION CABLE

17

BASE UNIT AND EXTENSION CABLE

This section explains the specifications of the base units (the main and extension base
units) and extension cables available for the systems, and the application standards for
use of extension base units.

17.1 Base Unit Specifications

(1)

Main base unit specifications

Table 17.1 Main base unit specifications

Item
I/O module
installation range

A1S32B

A1S33B

A1S35B

A1S38B

A1S38HB

2 modules can be
installed.

3 modules can be
installed.

5 modules can be
installed.

8 modules can be
installed.

8 modules can be
installed.

Extension
possibility

Extendable

Installation hole
size

6 bell-shaped holes (for M5 screws)

255mm (3.3inch)

220mm (3.3inch)

External
dimensions
Weight

325mm (3.3inch)

130mm (2.1inch)

130mm (2.1inch)

130mm (2.1inch)

28mm (0.1inch)

28mm (0.1inch)

28mm (0.1inch)

0.52kg

0.65kg

430mm (3.3inch)

0.75kg

Accessory

130mm (2.1inch)

28mm (0.1inch)
0.97kg

1.0kg

Attaching screws: M5 25 4 screws

(2)

Extension base unit specifications

Table 17.2 Extension base unit specifications

Item
I/O module
installation range
Power supply
module loading
necessity

A1S65BS1

A1S65B

5 modules can be
installed.

A1S68BS1

A1S68B

8 modules can be
installed.

A1S52B

A1S52BS1

2 modules can be
installed.

Power supply module required

A1S55B

A1S55BS1

5 modules can be
installed.

M4 6(FG terminal)

Applicable wire size

0.75 to 2mm2

Applicable
solderless terminal

315mm (3.3inch)

420mm (3.3inch)

Accessory

8 modules can be
installed.

6 bell-shaped holes (for M5 screws)

Terminal screw size

Weight

A1S58BS1

Unnecessary (Refer to POINT below)

Installation hole
size

External
dimensions

A1S58B

(V) 1.25-4 (V) 1.25-YS4(V)2-YS4A

(Applicable tightening torque: 78 to 118N
135mm (3.3inch)

260mm (3.3inch)

cm

365mm (3.3inch)

130mm (2.1inch)

130mm (2.1inch)

130mm (2.1inch)

130mm (2.1inch)

130mm (2.1inch)

28mm (0.1inch)

28mm (0.1inch)

28mm (0.1inch)

28mm (0.1inch)

28mm (0.1inch)

0.71kg

0.95kg

0.38kg

0.61kg
*1

Attaching screws: M5 25 4 screws

*1

0.87kg

Dustproof cover (for I/O module): 1 pc.

Attaching screws: M5 25 4 screws

1 For the attachment of the dustproof cover, refer to Section 19.6.

POINT

(1) 5VDC power for the A1S52B(S1), A1S55B(S1) or A1S58B(S1) is supplied

from the power supply module mounted to the main base unit.
(2) Refer to Section 16.1.2, "Selecting the Power Supply Module" or Section
17.3, "Application Standards of Extension Base Unit" when using
A1S52B(S1), A1S55B(S1) and A1S58B(S1).
17 - 1

17. BASE UNIT AND EXTENSION CABLE

17.1.1 Main base unit for high-speed access (A1S38HB/A1S38HBEU)

The main base units, (A1S38HB/A1S38HBEU) for high-speed access have been
improved in the speed of access to the buffer memory of the special function module
mounted on A1S38HB/A1S38HBEU.
POINT

(1) The A1S38HB/A1S38HBEU can perform high-speed access to the buffer

memories of special function modules only. I/O devices of I/O modules are not
accessed at high speed but at the same access speed as that of a
conventional main base unit.
(2) When an extension base unit is connected to the A1S38HB/A1S38HBEU, the
buffer memories of the special function modules on the extension base unit
are not accessed at high speed. The access speed is the same as the one in
the case of connecting to a conventional main base unit.
REMARK
(1)

The A1S38HB/A1S38HBEU base unit is dedicated to the Q2ASCPU and cannot be

used with the AnSCPU.

(2)

When using the simulation module A6SIM-X64Y64, set its base unit specification to
"1" or later.
If "0" is set, the A6SIM-X64Y64 does not operate normally.
When "0" is to be set for the base unit specification of the A6SIM-X64Y64, replace
the base unit with the A38B.

17 - 2

17. BASE UNIT AND EXTENSION CABLE

17.2 Extension Cable Specification List

The specifications of the extension cables used for the Q2ASCPU system are shown
below:
A1SC01B

A1SC03B

A1SC07B

A1SC12B

A1SC30B

A1SC60B

A1SC05NB A1SC07NB A1SC30NB A1SC50NB

Cable length

Item

0.055m

0.33m

0.7 (2.30)

1.2 (3.94)

3.0 (9.84)

6.0 (19.69)

0.45 (1.48)

Resistance value of
5VDC supply line

0.02

0.02

(at 55

0.06

0.12

0.18

0.04

0.05

3.0 (9.84)
0.12

5 (16.43)
0.18

Application
Weight

0.04

0.7 (2.30)

Connection between a main base and A1S5

0.025

CAUTION

0.10

0.14

0.20

B(S1)/A1S6
0.40

B(S1)
0.65

Connection between a main base and A5

0.20

0.22

0.40

B/A6
0.56

Connect the extension cable to the connector of the base unit or module.
After that, check for incomplete insertion.
Poor electrical contact may cause incorrect inputs and/or outputs.
When using extension cables, keep them away from the main circuit cables (high
voltage, large current).

17 - 3

17. BASE UNIT AND EXTENSION CABLE

17.3 Application Standards of Extension Base Unit (A1S52B(S1), A1S55B(S1), A1S58B(S1), A52B, A55B,
A58B)
To the A1S52B(S1), A1S55B(S1), A1S58B(S1), A52B, A55B and A58B extension base
units, 5VDC is supplied from the power supply module on the main base unit. (Power is
not supplied from any power supply module on the A62B, A65B and A68B.)
Therefore, if a voltage drop occurs on an extension cable, the specified voltage may not
supplied to the receiving end, resulting in erroneous inputs and outputs.
It is recommended to connect the A1S52B(S1), A1S55B(S1), A1S58B(S1), A52B, A55B
and/or A58B after a main base unit to minimize a voltage drop.
Determine applicability of the A1S52B(S1), A1S55B(S1), A1S58B(S1), A52B, A55B and
A58B by the following calculation method.
(1)

Selection condition
The voltage received by the module installed in the last slot of an extension base unit
A1S52B(S1), A1S55B(S1), A1S58B(S1), A52B, A55B or A58B must be 4.75 V or
above.
Since the output voltage of the power supply module is set at 5.1 V or above, the
voltage drop must be 0.35 V or less.

(2)

Classification of voltage drop

Voltage drop is classified into (a), (b), and (c) as follows according to the connecting
method and type of extension base units.
(a) Voltage drop of a main base unit
(b) Voltage drop of an extension base unit
(c) Voltage drop over an extension cable

Extension base unit used

Extension cable connected to the left Extension cable connected to the right side of main
side of main base unit (serial)

base unit (Parallel)

A1S52B(S1), A1S55B(S1) or
A1S58B(S1) extension base

A1S3 B

unit is used
A1S3 B

(c)

(a)
A1S5 B(S1)
(b)

Voltage drop of the main base unit

can be ignored.

17 - 4

A1S5 B(S1)
(c)

(b)

17. BASE UNIT AND EXTENSION CABLE

Extension base unit used

Extension cable connected to the left Extension cable connected to the right side of main
side of main base unit (serial)

base unit (Parallel)

A52B, A55B or A58B

extension base unit is used

A1S3 B

A1S3 B

(c)

(a)

A5 B
(c)

A5 B

Voltage drop of the main and the

Voltage drop of the extension base units can be

extension base units can be ignored. ignored.

17 - 5

17. BASE UNIT AND EXTENSION CABLE

17.4 Handling Precautions

The handling precautions to be taken from unpacking to mounting a base unit are
described below.
The terminal connectors and pin connectors of the base unit are made of resin. Do not
drop them or apply heavy impact to them.

CAUTION

Do not remove the printed-circuit board from the base unit.

Doing so may cause failure, malfunctions, personal injuries and/or a fire.
Use caution to prevent foreign matter, such as dust or wire chips, from entering the
base unit during wiring.
Failure to do so may cause a failure, malfunction or fire.

17 - 6

17. BASE UNIT AND EXTENSION CABLE

17.5 Part Names

Part names of the base unit are shown here.
(1)

Main base module (A1S32B, A1S33B, A1S35B, A1S38B, A1S38HB, A1S38HBEU)

5)

1)

4)

1)

OUT

OUT

Remove with a tool

such as a nipper

CPU

2)

No.
1)

2)

I/O 0

I/O 1

I/O 2

I/O 3

I/O 4

I/O 5

POWER

I/O 6

I/O 7
A1S38B

6)

3)

Name

2)

Application

Extension cable connector

Base cover

Connects an extension cable using a signal-communication connector for the

extension base module.
Protective cover for the extension cable connector.To expand it, the area
surrounded by grooves located below the word "OUT" on the base cover should
be removed with a nipper, etc.

3)

Module connector

Connector to load the power supply module, CPU module, I/O module and
specialfunction module.
To prevent dust accumulation, load the attached connector cover, blank cover
(A1SG60) or a dummy module (A1SG62) to reserved space connector not loaded
a module.

4)

Module mounting screw

5)

Base mounting hole

Screws to attach the module to the bases. Screw size: for M4 screw
Mounting hole to attach the base module to the panel of the control panels, etc.
(For M5 screw)

6)

DIN rail hook

Attachment hook for DIN rail

One piece each for A1S32B and A1S33B.
Two pieces each for A1S35B, A1S38B, A1S38HB and A1S38HBEU.

IMPORTANT

Only one extension base module can be connected to a main base module.
Connecting two extension connectors of the main base module to extension base
modules may result in input and/or output errors.
17 - 7

17. BASE UNIT AND EXTENSION CABLE

(2)

Extension base module (A1S52B, A1S55B, A1S58B, A1S52B-S1, A1S55B-S1,

A1S58B-S1, A1S65B, A1S68B, A1S65B-S1, A1S68B-S1)
5)

4)

2)

A1S65B, A1S68B,
A1S65B-S1,
A1S68B-S1

POWER

1)

A1S52B, A1S55B, A1S58B,

A1S52B-S1, A1S55B-S1,

A1S68B

3)

6)

5)

4)

2)

A1S58B-S1

A1S58B

1)

7)

No.
1)

6)

Name
Extension cable connector

3)

Application
Connects an extension cable using a signal-communication connector for the
extension base module.
Connect the extension cable after removing the connector cover.

2)

Base cover

Protective cover for the extension cable connector.

3)

Module connector

Connector to load power-supply module, CPU module, I/O module and

specialfunction module.To prevent dust accumulation, load the attached connector
cover, blank cover (A1SG60) or a dummy module (A1SG62) to reserved space
connector not loaded a module.

4)

Module mounting screw

Screws to attach the module to the bases. Screw size: for M4 screw

5)

Base mounting hole

Mounting hole to attach the base module to the panel of the control panels, etc.
(For M5 screw)

17 - 8

17. BASE UNIT AND EXTENSION CABLE

No.
6)

Name
DIN rail hook

Application
Attachment hook for DIN rail
One piece each for A1S52B, A1S55B, A1S52B-S1 and A1S55B-S1.
Two pieces each for A1S65B, A1S68B, A1S58B, A1S65B-S1,
A1S68B-S1 and A1S58B-S1.

7)

FG terminal

The grounding terminal connected to the shield pattern of the printed circuit board.

17 - 9

18. MEMORY CARDS AND BATTERIES

18

MEMORY CARDS AND BATTERIES

This section describes the specifications and handling of the memory cards and batteries
that can be used with the Q2ASCPU.

18.1 Memory Card Specifications

The specifications of the memory cards that can be used with Q2ASCPU conform to
JEIDA Ver. 4.0.
(1)

SRAM type memory cards

Model Name

Item
Q1MEM-64S

Q1MEM-128S

Q1MEM-256S

Q1MEM-512S

Q1MEM-1MS

Q1MEM-2MS

64k bytes

128k bytes

256k bytes

512k bytes

1M bytes

2M bytes

59k bytes

123k bytes

250.5k bytes

506k bytes

1016.5k bytes

2036k bytes

SRAM memory
capacity before
formatting
SRAM memory
capacity after
formatting
Number of storable

118

files

128

Insertion/removal

256

5000 times

limit
External dimensions

85.6mm (3.3inch)

54mm (2.1inch)

Weight

3.3mm (0.1inch)

0.04kg

(2)

SRAM + E2PROM type memory cards

Model Name

Item
Q1MEM-64SE

Q1MEM-128SE

Q1MEM-256SE

Q1MEM-512SE

Q1MEM-1MSE

32k bytes

64k bytes

128k bytes

256k bytes

512k bytes

32k bytes

64k bytes

128k bytes

256k bytes

512k bytes

28.5k bytes

58.5k bytes

122.5k bytes

250k bytes

505.5k bytes

29k bytes

59k bytes

123k bytes

250.5k bytes

506k bytes

57

117

128

58

118

128

Memory capacity before formatting

SRAM
E2PROM
Memory capacity after formatting
SRAM
E2PROM
Number of storable files
SRAM
E2PROM
Maximum number of writes to E2PROM

10,000 times

18 - 1

18. MEMORY CARDS AND BATTERIES

(2)

SRAM + E2PROM type memory cards

Model Name

Item
Q1MEM-64SE

Q1MEM-128SE

Insertion/removal limit
External dimensions

Q1MEM-256SE

Q1MEM-512SE

5000 times
85.6mm (3.3inch)

Weight

54mm (2.1inch)
0.04kg

18 - 2

3.3mm (0.1inch)

Q1MEM-1MSE

18. MEMORY CARDS AND BATTERIES

18.2 Handling Memory Cards

(1)

Formatting memory cards

All memory cards used with Q2ASCPU must be formatted.
The purchased memory card is not formatted. Use the memory card after formatting
with the GPP function.
(a) SRAM+E2PROM type memory card
Format both RAM and ROM.
If installed with only one of them formatted, the Q2ASCPU detects an error
(ICM.OPE.ERROR).
For information on how to format SRAM and E2PROM, see the following
manual.
GX Developer Operating Manual
Type SW

(2)

IVD-GPPQ Software package Operating Manual (Online)

Installing the battery in the memory card

The memory card is packaged with a RAM memory bakup battery.To use the RAM
memory of the memory card, this battery must be installed first.
POINT

The battery installed in the CPU module does not back up RAM memories of
memory cards.
Also, a battery installed in a memory card does not back up the internal RAM of a
CPU module.
(3)

Switch setting when using a memory card

When using a memory card, turn ON the memory card in/out switch which is close to
the connector.If it is set to OFF, the memory card cannot be used.

18 - 3

18. MEMORY CARDS AND BATTERIES

18.3 Battery Specifications (CPU Module and Memory Card Batteries)

(1)

CPU module batteries

Model Name
Item
A6BAT

Type

Thionyl chloride lithium battery

Initial voltage

3.6VDC

Battery life when stored

5 years

Battery life when used

Refer to Section 21.3.1

Lithium content

0.48g

Application

Built-in RAM memory backup and power failure compensation

External dimensions

16

30mm [0.6

1.2 inch]

REMARK
For the battery directive in EU member states, refer to Appendix 11.

(2)

Memory card batteries

Model Name
Item
BR2325 or equivalent

Type

BR-type coin cell lithium battery

Initial voltage

3.0VDC

Battery life when stored

5 years

Battery life when used

Refer to Section 21.3.1

Lithium content

0.05g

Application

Card memory backup and power failure compensation

18 - 4

18. MEMORY CARDS AND BATTERIES

18.4 Handling Precautions

Handling precautions on memory cards and batteries from unpacking to mounting are
listed below.

(1)

Memory card
(a) Do not drop, bend or apply any strong impact to the memory card.
(b) Do not expose the memory card to water.
(c) Do not expose the memory card to direct sunlight or leave it near a heat source.
(d) Be careful to prevent dust from entering the connector.
(e) Do not store the memory card in high temperature or high humidity areas.
(f) To protect the memory card from static electricity, always enclose it in a plastic
case before transporting or storing.
(g) Do not touch the terminals of the memory card.
Insert the memory card and fully press it to the memory card connector.Check for
incomplete connection after installing it.
Poor electrical contact may cause malfunctions.

CAUTION

(2)

Battery
(a) Do not short the battery.
(b) Do not disassemble the battery.
(c) Do not put it into a fire.
(d) Do not heat it.
(e) Do not apply solder to the battery poles.

18 - 5

18. MEMORY CARDS AND BATTERIES

18.5 Part Names of Memory Card

Part names of the memory card are shown below.

No.

Name

Description

(1) Connector

Connects the memory card to the CPU module.

(2) Battery holder

Holds a lithium battery that is used to backup RAM data.

(3) Battery holder locking switch

Remark

Locks the battery holder to the memory card.

(Locked in "LOCK" position.)
Enables or disables writing to the memory.Factory-set to OFF.

(4) Write protect switch

ON : Data writing disabled

OFF : Data writing enabled

Must be set before writing a program and starting operation.

18 - 6

18. MEMORY CARDS AND BATTERIES

18.6 Installing Batteries (CPU Module and Memory Card Batteries)

(1)

Since the CPU module battery is shipped with its battery connector disconnected,
connect the connector according to the procedure indicated below.
Open the cover of the Q2ASHCPU.

Q2ASH CPU
STOP
L.CLR
RESET

RUN
RESET

Confirm that the battery is loaded

cerrectly.

lnsert the battery connector into

the connector pin on the case.
Be sure that the insertion
direction is correci.

Completion

(2)

Since the memory card battery is removed from the battery holder before shipping,
set it in the battery holder before use of the RAM.

POINT

Firmly push the battery connector all the way in to the connector pin.

18 - 7

18. MEMORY CARDS AND BATTERIES

18.7 Installing/Removing A Memory Card

(1)

Installing a memory card

When installing a memory card into the CPU module with its power ON, make sure
that the orientation of the memory card is correct, then insert it fully until it's edge is
flush with the face of the EJECT button.
After installing it, set the memory card in/out switch to "ON".
The memory card is operable after the LED on the memory card in/out switch turns
ON.
Memory card EJECT button

CPU main
module

Memory card
Insert it in
this direction

"Precartions"
on this side

Insert the memory card and fully press it to the memory card connector. After that,
check for incomplete insertion. Poor electrical contact may cause malfunctions.

CAUTION

(2)

Removing the memory card

Before removing the memory card from the CPU module with its power ON, set the
memory card in/out switch to "OFF".
Verify that the LED on the switch has gone OFF. Then, press the memory card
EJECT button and remove the memory card.
Memory card EJECT button
Push
CPU main
module

Memory card

Remove the card in this direction

POINT

(1) When a memory card is installed, the scan time will increase by 10ms at
maximum. The scan time increases only in 1 scan during which the
Q2ASCPU performs mount processing.
(2) If the memory card in/out switch is turned OFF while the system or a program
is using the memory card, it may take a while for the LED on the switch to go
OFF.
(3) Installing or removing a memory card with the memory card in/out switch set
ON while the power is ON will destroy the contents of the memory card.

18 - 8

18. MEMORY CARDS AND BATTERIES

(3)

Memory card remove/insert prohibit flag (special relays SM605)

Instead of operating the memory card in/out switch, turning ON/OFF special relays
SM605 (memory card) can be also used as the card remove/insert prohibit flag. Once
removal/insertion is prohibited with the remove/install prohibit flag, it is still disabled
even if the memory card in/out switch is set to ON.
The relationship between the memory card in/out switch and the memory card
remove/insert prohibit flag is shown in the table below.
Memory card in/out switch
Memory card remove/insert
ON

OFF

(Removal/Insertion Prohibited)

(Removal/Insertion Permitted)

ON (removal/insertion prohibited)

Removal/insertion prohibited

Removal/insertion prohibited

OFF (removal/insertion permitted)

Removal/insertion prohibited

Removal/insertion permitted

prohibit flag

18 - 9

19. LOADING AND INSTALLATION

19

LOADING AND INSTALLATION

This chapter describes the loading and installation procedures and precautions to obtain
the maximum system reliability and performance.

19.1 Fail-Safe Circuit Concept

When the programmable controller is powered ON or OFF, improper outputs may be
generated temporarily depending on the delay time and start-up time differences between
the programmable controller power supply and the external power supply for the control
target (especially, DC).
For example, if the external power supply for a DC output module is powered ON and then
the programmable controller is powered ON, the DC output module may generate
incorrect outputs temporarily upon the programmable controller power-ON. To prevent
this, it is required to build a circuit by which the programmable controller is powered on
first.
Also, an external power failure or programmable controller failure may lead to erroneous
operation.
In order to eliminate the possibility of an system error and to ensure fail-safe operation,
create a circuit (emergency stop circuit, protection circuit, interlock circuit, etc.) outside the
programmable controller for the parts whose faulty operation could cause mechanical
damage and/or accidents.
A system design circuit example based on the above is provided later.

19 - 1

19. LOADING AND INSTALLATION

(1)

System design circuit example

AC system

AC/DC system
Power supply

Power supply
Transformer
Fuse
CPU module
SM52
Ym
SM403

XM
Start
switch
MC

Yn
Y1

DC power supply
established signal
input

Transformer

Start/stop circuit
Can be started
by turning ON of
RA1, which is the
programmable
controllers's RUN
output.

CPU module

Fuse
SM52
SM403
XM

Fuse
The setting for TM
is the time taken
to establish the
DC input signal.

SM1084
MC1 N0 M10

N0

Start
switch

MC

Input unit

RA2

( - )( + )

TM

SM1084

RA1

Yn
TM

TM

Program
Stop
switch

DC power
supply

Ym

MC

XM

Output unit
Ym
L

Stop
switch
RA2

Turned ON in RUN
status by M9039

RA1

Program

RA1

Output for warning

(lamp or buzzer)

Yn

M10

MC

Input unit
XM

Voltage relay
recommended
RA2

Output for warning

(lamp or buzzer)

Output unit
Ym

Output unit
MC

MC 2
MC 1

MC

MC1

MC2

Y1
RA2

Switches the power

supply to output devices
OFF when the system
stops:
At emergency stops
at stops on reaching a
limit
Interlock circuit
Constructs external
interlock circuits for
opposing operations such
as forward and reverse
rotation, and parts that
could cause machine

Yn

RA1

Output unit

19 - 2

Turned ON in RUN
status by SM403

MC

MC2
MC1

MC1
MC2

MC
Switches the power
supply to output
devices OFF when
the system stops:
At emergency stops
at stops on reaching
a limit

19. LOADING AND INSTALLATION

The procedures used to switch on the power supply are indicated below.
AC system

AC/DC system

1) Switch the power supply ON.

1) Switch the power supply ON.

2) Set the CPU module to RUN.

2) Set the CPU module to RUN.

3) Switch the start switch ON.

3) Switch RA2 ON when the DC power supply starts.

4) The output devices are driven in accordance with the

4) Set the timer (TM) to "ON" upon 100% establishment of DC

power supply.

program when the magnetic contactor (MC) comes ON.

(The set value for TM shall be the period from turning

"ON"RA2 to 100% establishment of DC power supply. Set 0.5
seconds for it.)
5) Switch the start switch ON.
6) The output devices are driven in accordance with the
program when the magnetic contactor (MC) comes ON.
(When a voltage relay is used for RA2, the timer in the
program (TM) is not necessary.)

19 - 3

19. LOADING AND INSTALLATION

(2)

Fail-safe measures for programmable controller failure

While failure of a CPU module and its memory can be detected by the selfdiagnostics function, an error occurred in I/O control area may not be detected by the
CPU module.
In such a case, depending on the condition of the failure, all device points could turn
ON or OFF resulting in a situation where normal operations of the control target and
safety cannot be ensured.
Though Mitsubishi programmable controllers are manufactured under strict quality
control, create a fail-safe circuit outside the programmable controller to prevent
mechanical damage and accidents in the case of a programmable controller failure
occurred due to any cause.
Examples of a system and its fail-safe circuitry are described below:

System example

Power
Input
CPU
supply
16
module
module
points

Input
16
points

Input
16
points

Output
16
Power Output Output Output
16
16
16
points Empty
supply
points
points
points
module
YB0
to
YBF

Input Output Output Output Output

16
16
16
16
16
points points points points points

Output module for fail-safe purpose*1

*1

The output module for fail safe purpose should be mounted on the last slot of the
system.(YB0 to YBF in the above system.)

Fail safe circuit example

On delay timer
Internal program

T1

YB0

1s
Off delay timer *3

SM412
YB0

T2
1s
External load

YB0

0.5s

0.5s

YB1

to

to

YBF

MC

24V
- +
0V

CPU module

Output module
*2

24VDC
T1

T2
MC

*2
*3

Since YB0 turns ON and OFF alternatively at 0.5 second intervals, use a contactless output
module (a transistor is used in the above example).
If an off delay timer (especially miniature timer) is not available, construct a fail safe circuit
using an on delay timer shown on the next page.

19 - 4

19. LOADING AND INSTALLATION

When constructing a fail safe circuit using on delay timers only

On delay timer
Internal program

YB0

T1

SM412

1s

*4

YB0

M1
On delay timer
M1
T2

1s

M1
M2

YB0
M2
0.5s

T2

0.5s
Externai load
YB1

to

to

YBF

MC

24V
- +
0V

CPU module

output module

24VDC

T1

M2
MC

*4

Use a solid state relay for the M1 relay.

19 - 5

19. LOADING AND INSTALLATION

19.2 Installation Environment

Avoid the following environment when installing a programmable controller system:
(1)

The ambient temperature may fall outside the range of 0 to 55

(2)

The ambient humidity may fall outside the range of 10 to 90%RH.

(3)

Condensation may occur due to drastic changes in temperature.

(4)

Corrosive gas or flammable gas exists.

(5)

A lot of conductive powdery substance such as dust or iron powder, oil mist, salt, or
organic solvent exists.

(6)

A location exposed to direct sunlight.

(7)

Strong electric or magnetic fields may be generated.

(8)

Vibrations and shocks are transmitted directly to the system.

19 - 6

19. LOADING AND INSTALLATION

19.3 Calculation of Heat Generated by the programmable controller

The operating ambient temperature in the panel where the programmable controller is
stored must be kept 55
or less.For heat dissipation design of the panel, it is necessary
to know the average power consumption (heat generation) of the devices and machinery
stored inside.In this section, a method to obtain the average power consumption of the
programmable controller system is explained.
Calculate the temperature rise inside the panel from the power consumption.

Average Power Consumption

The power consuming parts of the programmable controller may be roughly classified into
the following blocks:

(1)

Power consumption by power supply module

The power conversion efficiency of the power supply module is about 70%, and 30%
is consumed as heat generated, thus, 3/7 of the output power is the power
consumption.Therefore, the calculation formula is:
Wpw= 3 {(I5V 5)+(I15V 15)+(I24V 24)} (W)
7
I5V

: Current consumption of 5VDC logic ladder circuit of each module

I15V : Current consumption of 15VDC external power supply part of special function
module
I24V : Average current consumption of 24VDC power supply for output module's
internal consumption
(Current consumption equivalent to the points simultaneously ON)
...... Not applicable to a system where 24VDC is supplied externally and a
power supply module with no 24VDC output is used.
(2)

Total power consumption of 5VDC logic circuits of modules

The 5VDC output circuit power of the power supply module is regarded as the power
consumption of each module.
W5V=I5V 5 (W)

19 - 7

19. LOADING AND INSTALLATION

(3)

Total 24VDC average power consumption of the output module (power consumption
equivalent to the points simultaneously ON)
The average 24VDC output circuit power of the power supply module is regarded as
the total power consumption of each module.
W24V=I24V 24 (W)

(4)

Average power consumption due to output voltage drop of the output modules
(power consumption equivalent to the points simultaneously ON)
WOUT=IOUT Vdrop
IOUT

Output points

that are simultaneously ON (W)

: Output current (actual operating current) (A)

Vdrop : Voltage dropped across each output load (V)

(5)

Average input power consumption of the input modules (power consumption

equivalent to the points simultaneously ON)
WIN=IIN E

Input points

that are simultaneously ON (W)

IIN : Input current (effective value for AC) (A)

E
(6)

: Input voltage (actual operating voltage) (V)

Power consumption of the external power supply part of the special function module
WS=I+15V 15+I-15V 15+I24V 24 (W)
The total of the power consumption values obtained for each block is power
consumption of the entire programmable controller system.
W=Wpw+W5V+W24V+WOUT+WIN+WS (W)
Using this value (W), calculate the amount of heat generation and temperature rise
inside the panel.
The calculation formula to obtain the temperature rise inside a panel is shown as:

T=

W [
UA

W : Power consumption of the entire programmable controller system (the

value obtained above)
A : Surface area inside the panel (m2)
U : When temperature inside panel is kept constant by a fan, etc.
When air inside panel is not circulated

........... 6

................................................ 4

POINT

If the temperature inside the panel can exceed the specified range, it is
recommended to install a heat exchanger to the panel to lower the inside
temperature.
If a ordinary ventilation fan is used, it sucks dust together with the outside air and it
may affect the performance of the programmable controller.

19 - 8

19. LOADING AND INSTALLATION

19.4 Installing the Base Units

Precautions on installation of the main base unit and extension base unit are described
here.
19.4.1 Installation precautions
Precautions for installing a programmable controller to a panel, etc. are explained below.
(1)

To improve the ventilation and to facilitate the exchange of the module, provide at
least 30mm (1.18in.) of distance between the top part of the module and any
structure or part.
However, when A52B, A55B, A58B, A62B, A65B or A68B extension base unit is
used, provide at least 80mm (3.15in.) of distance between the top of the unit and any
structural part.

(2)

Do not install the programmable controller vertically or horizontally, because it may

affect the ventilation.

(3)

If the base unit is installed to the surface which is not flat or is distorted, an excessive
force is applied to the printed-circuit board and it may cause a fault. Be sure to install
it to a flat surface.

(4)

Avoid sharing the same panel with any source of vibration such as a large-sized
magnetic contactor or no-fuse breaker, and install to a separate panel or away from
such devices.

(5)

Provide wiring ducts as necessary.

However, when the clearance from the top or bottom of the programmable controller
is less than that in Fig. 19.1 and Fig. 19.2, pay attention to the following:
(a) When installing to the top of programmable controller, to improve the ventilation,
keep the height of the duct to 50mm (1.97in.) or below.
In addition, the distance from the top of the programmable controller should be
sufficient for tightening and loosening works for the mounting screws on the top
of the module.
The module cannot be replaced if the screws on the top of the module cannot be
loosened or tightened.
(b) When placing a duct under the programmable controller, take into account the
use of optical fiber cables or coaxial cables as well as the minimum bending
radius of the cables.

(6)

If any device is installed in front of the programmable controller (i.e. installed in the
back of the door), position it to secure at least 100mm (3.94inch) of distance to avoid
the effects of radiated noise and heat.
Also, place the base unit at least 50mm (1.97inch) away from any other equipment
on the right or left.

(7)

When installing the base unit to DIN rail in an environment with large vibration, use a
vibration-proofing bracket (A1S-PLT-D). Mounting the vibration-proofing bracket
(A1S-PLT-D) enhances the resistance to vibration.
Depending on the environment to set up the base unit, it is also recommended to fix
the base unit to the control panel directly.
19 - 9

19. LOADING AND INSTALLATION

19.4.2 Installation
Installation location of the main base unit and the extension base unit is shown below.
Indicates the location of ceiling of
the panel, wiring duct or other part.

Main base unit

Extension base unit

30mm (1.18inch)
or more

30mm (1.18inch)
or more

Fig19.1 Parallel Installation

Indicates the location of ceiling of

the panel, wiring duct or other part.

Basic base (A1S3 B, A1S38HB, A38HBEU)

At least 30mm
(1.18 inch)

Basic base (A1S3

B, A1S38HB, A38HBEU)

At least 30mm
(1.18 inch)
At least 30mm
(1.18 inch)
At least 30mm
(1.18 inch)
Extension base(A1S5 B(S1), A1S6 B(S1))

At least 30mm
(1.18 inch)

Extension base (A5 B, A6 B)

At least 80mm
(3.15 inch)

Duct
(maximum height:
50mm (1.97 inch))
At least 30mm
(1.18 inch)

At least 80mm
(3.15 inch)

Fig. 19.2 Series Installation

Panel, etc.

Programmable
controller

Door

Contactor
relay, etc.

100mm (3.94 inch) or more

Fig. 19.3 Distance from Front Device

Fig. 19.4 Vertical Mounting (not allowed)

19 - 10

Fig. 19.5 Horizontal Mounting (not allowed)

19. LOADING AND INSTALLATION

19.5 Installation and Removal of Modules

This section explains how to install or remove the power supply module, CPU module, I/O
module and special function module, etc. to or from the base unit.

(1)

Module installation
The procedure for mounting a module is described below.

Base unit
Module
Module
connector

Insert the module fixing projection

of the module into the module fixing
hole.

Install the module to the base unit

by pushing it in the direction of the
arrow.

Projection
for fixing
the module
Module fixing hole

Confirm that the module is firmly

inserted to the base unit, then
fix it with the module fixed screw.

Complete

19 - 11

19. LOADING AND INSTALLATION

(2)

Removing a module
The procedure for removing a module is explained here.
Base unit

Remove the module installation

screw, then pull out the top of the
module while using the bottom of
the module as the fulcrum.
Module
connector

While lifting the module upward,

disengage the module fixing
projection from the module fixing
hole.

Module

Module fixing hole

Complete

POINT

To dismount the module, be sure to disengage the hook from the module fixing
hole and then remove the module fixing projection from the module fixing hole.If
the module is forcibly removed, the hook or module fixing projection will be
damaged.

19 - 12

19. LOADING AND INSTALLATION

19.6 Installation and Removal of the Dustproof Cover

When using the A1S52B(S1), A1S55B(S1) or A1S58B(S1), attach the dustproof cover
supplied with the extention base unit to the I/O module on the left end.If no dustproof cover
is attached, foreign matter will enter the I/O module, causing a failure.
Procedures for installing and removing the dustproof cover are described below.
(1)

Installation

I/O module

Dust-proof cover

Insert the dustproof cover into the connector- or terminal-side groove of the I/O
module first as shown in the figure, and then push the dustproof cover.

19 - 13

19. LOADING AND INSTALLATION

(2)

Removal

I/O module

Hole for removal

Dust-proof cover

To remove the dustproof cover from the I/O module, insert the tip of a flat-head
screwdriver into the hole as shown in the figure, then pry the tab of the cover out from
the hole using the screwdriver.

19 - 14

19. LOADING AND INSTALLATION

19.7 Wiring
19.7.1 Wiring instructions
Instructions for wiring of power cables or I/O cables are given in this section.
(1)

Wiring the power supply

(a) When voltage fluctuates outside the specified value range, connect a constantvoltage transformer.
Constant
voltage
transformer

Programmable
controller

(b) Use a power supply which generates minimal noise between wires and between
the programmable controller and ground.
If excessive noise is generated, connect an isolating transformer.
I/O
equipment

Programmable
controller
Insulation
transformer

Insulation
transformer

(c) When using a power transformer or an isolating transformer to reduce the

voltage from 200VAC to 100VAC, its capacity must be equal to or greater than
the corresponding value shown in the following table.
Power Supply

Transformer

Module

Capacity

A1S61PN

110VA n

A1S62PN

110VA n

n: Stands for the number of power supply

modules.

(d) Separate the programmable controller's power supply line from the lines for I/O
devices and power devices as shown below.
When there is much noise, connect an isolating transformer.
(e) Taking rated current or inrush current into consideration when wiring the power
supply, be sure to connect a breaker or an external fuse that have proper blown
and detection.
When using a single programmable controller, a 10A breaker or an external fuse
are recommended for wiring protection.
Main
power supply

Programmable
controller
power supply

Insulation
Transformer
Programmable
controller

200VAC
Relay
terminal block

T1

I/O power supply

I/O equipment
Main circuit
power supply
Main circuit equipment
On a control panel

19 - 15

19. LOADING AND INSTALLATION

(f)

Note on using 24VDC output of the A1S62PN power supply module.

If the 24VDC output power from a single power supply module is insufficient,
supply it from the external 24VDC power supply.

(g) Twist the 100VAC, 200VAC or 24VDC wires as tightly as possible, and use the
minimum length to make connection between modules.
Also, use a thick wire (max. 2 mm2) to minimize voltage drop.
(h) Do not install 100VAC and 24VDC wires together with main circuit wires (high
voltage and large current) or I/O signal lines (including common line). Provide a
distance of 100mm (3.94inch) or more between them if possible.
(i)

As a measure against lightning surges, connect a lightning surge absorber as

shown below.

Programmable
controller
I/O devices

AC

E1

E1

E1

E2

Surge absorber for lightening

POINT

(1) Ground the lightning surge absorber (E1) and the programmable controller
(E2) separately from each other.
(2) Select a lightning surge absorber whose voltage does not exceed the
maximum allowable circuit voltage even when line voltage reaches the
maximum.

19 - 16

19. LOADING AND INSTALLATION

(2)

Wiring I/O equipment

(a) The applicable wire size for a terminal block connector is 0.75 to 2mm2. It is
recommended to use wire of 0.75mm2 for easy use.
(b) Run the input line and output line away from each other.
(c) Separate the I/O signal lines (including common line) at least 100mm (3.94inch)
away from the main circuit line carrying high voltage and large current.
(d) If it is not possible, use a batch shielding cable and ground it on the
programmable controller side.
However, ground it on the opposite side in some cases.

(e) When ducts are used for wiring, securely ground them.
(f) Separate the 24VDC I/O cables from the 100VAC and 200VAC cables.
(g) In a long distance wiring of 200m (656.2ft.) or longer, leak current due to
capacitance may cause failure.
(h) As protective measures against lightning surges, separate the AC wiring from
the DC wiring and connect a lightning surge absorber as shown in (1) (i).
Failure to do so increases the risk of I/O equipment failure due to lightning.
(3)

Programmable
controller

Grounding
(a) Carry out the independent grounding if possible.
(b)

Other device

(1) Independent grounding ......... Best

Programmable
controller

Other device

(2) Shared grounding ......... Good

Programmable
controller

Other device

(3) Common grounding ......... Not allowed

(c) Use the cable of 2mm2 (0.0031in.2) or more for grounding.

Set the grounding point closer to the programmable controller to make the
grounding cable short as possible.
(d) If any malfunction occurs due to grounding, disconnect either or both of the LG
and FG terminals of the base unit from the ground.

19 - 17

19. LOADING AND INSTALLATION

19.7.2 Wiring to module terminals

This section provides an example for wiring power cables and ground wires to the main
and extension bases.
Main base unit (A1S38B)
100/110VAC
200/240VAC

A1S61PN

Main base unit (A1S38B)

100/110VAC
200/240VAC

CPU

A1S62PN

CPU

AC

AC

Fuse

NC
NC
(FG)

AC
DC

AC
DC

(LG)

24VDC

+24V
24G

Fuse

(FG)
24VDC
24VDC

(LG)
INPUT
100-240VAC

INPUT
100-240VAC

Connect to the 24VDC

terminals of an I/O
module that requires
24VDC internally.

Extension base unit (A1S58B)

I/O

Connect to the 24VDC

terminals of an I/O
module that requires
24VDC internally.

Extension base unit (A1S68B)

I/O

A1S62PN

Extension cable

I/O

Extension cable

+24V
24G
(FG)
(LG)

100/240VAC

INPUT
100-240VAC

FG
Grounding wire

Grounding wire

Ground

Ground

POINT

(1) Use the thickest possible (max. 2 mm2 (14 AWG)) wires for the 100/200 VAC
and 24 VDC power cables. Be sure to twist these wires starting at the
connection terminals. For wiring a terminal block, be sure to use a solderless
terminal. To prevent short-circuit due to loosening screws, use the solderless
terminals with insulation sleeves of 0.8 mm (0.03 inch) or less thick. The
number of the solderless terminals to be connected for one terminal block are
limited to 2
Solderless terminals
with insulation sleeves

Terminal block

(2) When connection is made between the LG and FG terminals, be sure to

ground the wire. Failure to observe this instruction after connecting the LG
and FG terminals will make the line susceptible to noise. Note that each LG
terminal has half the potential of the input voltage; you might get an electric
shock if you touch it.
(3) A1S61PN and A1S62PN do not need to be switched as the are 100 to
240VAC wide-range.
19 - 18

19. LOADING AND INSTALLATION

19.8 Precautions When Connecting Uninterruptible Power Supply Module (UPS)

When onnecting a programmable controller system to an uninterruptible power supply
(UPS), pay attention to the following.
When connecting an uninterruptible power supply (UPS) to the programmable controller
system, use an online UPS or line-interactive UPS with a voltage distortion rate of 5% or
less.
When connecting a standby UPS, use a Mitsubishi FREQUPS FW-F series UPS
(hereinafter FW-F series UPS)*1. (Example: FW-F10-0.3K/0.5K)
Do not use any standby UPS other than the FW-F series UPS.
*1

The FW-F series UPS whose serial number starts with the letter "P" or later, or ends with the
letters "HE" is applicable.

Starts with "P" or later

Ends with "HE"

19 - 19

20. EMC AND LOW VOLTAGE DIRECTIVES

20

EMC AND LOW VOLTAGE DIRECTIVES

The products sold in the European countries have been required by law to comply with the
EMC and Low Voltage Directives of the EU Directives since 1996 and 1997, respectively.
The manufacturers must confirm by self-declaration that their products meet the
requirements of these directives, and put the CE mark on the products.
(1)

Authorized representative in Europe

Authorized representative in Europe is shown below.
Name: Mitsubishi Electric Europe BV
Address: Gothaer Strase 8, 40880 Ratingen, Germany

20.1 Requirements for Compliance with EMC Directives

The EMC Directives specifies emission and immunity criteria and requires the products to
meet both of them, i.e., not to emit excessive electromagnetic interference (emission): to
be immune to electromagnetic interference outside (immunity). Guidelines for complying
the machinery including MELSEC-QnA series programmable controller with the EMC
Directives are provided in Section 20.1.1 to Section 20.1.9 below.
The guidelines are created based on the requirements of the regulations and relevant
standards, however, they do not guarantee that the machinery constructed according to
them will comply with the Directives. Therefore, manufacturers must finally determine how
to make it comply and how it is compliant with the EMC Directives.
20.1.1 EMC Directive related standards
(1)
Standard

Regulations regarding emission

Test item

Test description

Value specified in standard

30M-230MHz
QP: 40dB V/m (10m in

CISPR16-2-3

Radio waves from the product are

Radiated emission

*2

measured.

measurement range) *1
230M-1000MHz
QP: 47dB V/m (10m in

EN61131-2:2007

measurement range)
150k-500kHz
CISPR16-2-1, CISPR16-1-2

Noise from the product to the power

Conducted emission *2

line is measured.

QP: 79dB, Mean: 66dB *1

500k-30MHz
QP: 73dB, Mean: 60dB

*1
*2

QP: Quasi-peak value, Mean: Average value

Programmable controllers are open-type devices (devices designed to be housed inside other
equipment) and must be installed inside a conductive control panel. The corresponding tests
were conducted with the programmable controller installed inside a control panel.

20 - 1

20. EMC AND LOW VOLTAGE DIRECTIVES

(2)

Regulations regarding immunity

Standard

Test item

Test description
Immunity test in which electrostatic

EN61000-4-2
Electrostatic discharge immunity *1

is applied to the cabinet of the

equipment.

Value specified in standard

8kV Air discharge
4kV Contact discharge
80% AM modulation@1kHz

EN61000-4-3
Radiated, radio-frequency,
electromagnetic field immunity *1

Immunity test in which electric fields

80M-1000MHz: 10V/m

are irradiated to the product.

1.4G-2.0GHz: 3V/m
2.0G-2.7GHz: 1V/m

EN61000-4-4

Immunity test in which burst noise is

Electrical fast transient/burst

applied to the power line and signal

immunity *1

line.

AC/DC main power, I/O power, AC

I/O (unshielded): 2kV
DC I/O, analog, communication:
1kV
AC power line, AC I/O power, AC I/

Immunity test in which lightning

EN61000-4-5
EN61131-2:2007

surge is applied to the power line

Surge immunity *1

and signal line.

O (unshielded): 2kV CM, 1kV DM

DC power line, DC I/O power: 0.5kV
CM, DM
DC I/O, AC I/O (shielded),analog,
communication: 1kV CM

EN61000-4-6
Immunity to conducted
disturbances, induced by radiofrequency fields *1

Immunity test in which high

frequency noise is applied to the
power line and signal line.

EN61000-4-8

Immunity test in which the product

Power-frequency magnetic field

is installed in inductive magnetic

immunity *1

field.

0.15M-80MHz, 80% AM
modulation@1kHz, 10Vrms

50Hz/60Hz, 30A/m
Apply at 0%, 0.5 cycles and zero-

EN61000-4-11
Voltage dips and interruption
immunity *1

Immunity test in which power supply

voltage is momentarily interrupted.

cross point
0%, 250/300 cycles (50/60Hz)
40%, 10/12 cycles (50/60Hz)
70%, 25/30 cycles (50/60Hz)

*1

Programmable controllers are open-type devices (devices designed to be housed inside other
equipment) and must be installed inside a conductive control panel. The corresponding tests
were conducted with the programmable controller installed inside a control panel.

20 - 2

20. EMC AND LOW VOLTAGE DIRECTIVES

20.1.2 Installation inside the control panel

The programmable controller is open equipment and must be installed within a control
panel for use.* This is effective not only for ensuring safety but also for shielding
electromagnetic noise generated from the programmable controller.
*

Each network remote station also needs to be installed inside the control panel.
However, waterproof type remote stations can be installed outside the control panel.

(1)

Control panel
(a) Use a conductive control panel.
(b) When attaching the control panel's top plate or base plate, mask painting and
weld so that good surface contact can be made between the panel and the bolt.
(c) To ensure an electrical contact with the control panel, mask the bolt areas of the
inner plates when painting to allow conductivity over the widest possible area.
(d) Ground the control panel with a thick wire so that a low impedance can be
ensured even at high frequencies.
(e) Holes made in the control panel must be 10 cm (3.94 inch) diameter or less. If
the diameter is more than 10cm (3.94 inch), radio waves can be leaked.
(f) Lock the control panel so that only those who are trained and have
acquiredenough knowledge of electric facilities can open the control panel.

(2)

Connection of power cable and ground wires

Handle the power cables and ground wires as described below.
(a) Provide a grounding point near the power supply module. Ground the power
supply module's LG and FG terminals (LG : Line Ground, FG : Frame Ground)
with the thickest and shortest wire possible. (The wire length must be 30 cm
(11.18 inch) or shorter.) As the LG and FG terminals release the noise generated
in the programmable controller to the ground, the lowest possible impedance
must be ensured.
The ground wires also need to be short as they are used to release noise.
Because the wire itself carries large noise, short wiring prevents it from acting as
an antenna.
(b) Twist the ground wire led from the grounding point with the power cable. By
doing this, noise from the power cable can be released to the ground. If a filter is
attached to the power cable, however, this twisting may not be needed.

20 - 3

20. EMC AND LOW VOLTAGE DIRECTIVES

20.1.3 Cables
The cables extracted from the control panel contain a high frequency noise component.
On the outside of the control panel, therefore, they serve as antennas to emit noise. To
prevent noise emission, use shielded cables for the cables which are connected to the I/O
modules and intelligent function modules and may be extracted to the outside of the
control panel.
The use of a shielded cable also increases noise resistance.
The signal lines (including common line) of the programmable controller, which are
connected to I/O modules, intelligent function modules and/or extension cables, have
noise durability in the condition of grounding their shields by using the shielded cables. If a
shielded cable is not used or not grounded correctly, the noise resistance will not meet the
specified requirements.
(1)

Grounding of shielded cables

(a) Shielding must be done close to the control panel. Otherwise, electromagnetic
induction from the cable after the grounding point will generate high frequency
noise.
(b) Partly remove the outer sheath of the shielded cable so that it can be contact
with the widest possible area of the control panel. A clamp may also be used as
shown in the figure below. In this case, cover the control panel's inner surface
which will come in contact with the clamp when painting.

Note) Grounding a shield cable by soldering a wire to the shield section as

illustrated below is not recommended. The high frequency impedance
will increase and the shield will be ineffective.

20 - 4

20. EMC AND LOW VOLTAGE DIRECTIVES

(2)

MELSECNET (II) and MELSECNET/10 modules

(a) Use double-shielded coaxial cables (MITSUBISHI CABLE INDUSTRIES, LTD.:
5C-2V-CCY) for the MELSECNET modules (such as A1SJ71AR21,
A1SJ71QLR21, A1SJ71QBR11) which uses coaxial cables.Noise in the range of
30 MHz or higher in radiated noise can be suppressed by the use of doubleshielded coaxial cables. Ground the double-shielded coaxial cable by
connecting its outer shield to the ground.

Refer to (1) for the grounding of the shield.

(b) Always attach a ferrite core to the double-shielded coaxial cable connected to
the MELSECNET module. In addition, position the ferrite core on each cable
near the outlet of the control panel. The ferrite core manufactured by TDK
Corporation, ZCAT3035-1330, is recommended.
(3)

Ethernet module
Precautions to be followed when AUI cables*1, twisted pair cables and coaxial cables
are used are described below.
(a) Be sure to ground the AUI cables*1 connected to the 10BASE5 connectors.
Because the AUI cable is of the shielded type, as shown in the figure below,
partly remove the outer sheath, and ground the exposed shield section to the
widest possible surface.

Refer to (1) for the grounding of the shield.

(b) Use shielded twisted pair cables as the twisted pair cables*1 connected to the
10BASE-T connectors. Partly strip the outer sheath of the shielded twisted pair
cable, and ground the exposed shield section to the widest possible area as
shown below.

Refer to (1) for the grounding of the shield.

*1

Make sure to attach a ferrite core to the cable.

The ferrite core manufactured by TDK Corporation, ZCAT2032-0930, is recommended.

20 - 5

20. EMC AND LOW VOLTAGE DIRECTIVES

(c) Always use double-shielded coaxial cables as the coaxial cables*2 connected to
the 10BASE2 connectors. Ground the double-shielded coaxial cable by
connecting its outer shield to the ground.

Refer to (1) for the grounding of the shield.

*2

Make sure to attach a ferrite core to the cable.

The ferrite core manufactured by TDK Corporation, ZCAT3035-1330, is recommended.

Ethernet is the registered trademark of XEROX, Co.,LTD

(4)

I/O signal cables and other communication cables

Always ground the I/O signal lines (including common line) and other communication
cables (RS-232, RS-422, etc.) in the same manner as described in (1) if they are
brought out of the control panel.

(5)

Positioning modules
Precautions for configuring machinery compliant with the EMC Directives using the
A1SD75P -S3 are described below.
(a) When using a cable of 2m (6.56ft.) or less
Ground the shield section of the external wiring cable with a cable clamp.

C P U module

Powersupply
module

(Ground the shield at the closest location to the A1SD75 -S3 external wiring
connector.)
Connect the external wiring cable to a drive unit or an external device in the
shortest distance.
Install the drive unit in the same panel.
External wiring connector

A1
SD
75

Cable clamp

External wiring cable (within 2m (6.56ft.))

Drive unit

20 - 6

20. EMC AND LOW VOLTAGE DIRECTIVES

(b) When connecting a cable longer than 2m (6.56ft.), but not exceeding 10m
(32.81ft.)
Ground the shield section of the external wiring cable with a cable clamp.

C P U module

Powersupply
module

(Ground the shield at the closest location to the A1SD75 -S3 external wiring
connector.)
Install a ferrite core.
Connect the external wiring cable to a drive unit or an external device in the
shortest distance.
External wiring connector

A1
SD
75

Ferrite core

Cable clamp
External wiring cable (2m to 10m (6.56ft. to 32.81f

Drive unit

(c) Models and required quantities of the ferrite core and cable clamp
Cable clamp
Model: AD75CK (Manufactured by Mitsubishi Electric)
Ferrite core
Model: ZCAT3035-1330 (TDK ferrite core)
Contact: TDK Corporation
Required quantity
Cable length

Optional part

Required quantity
1 axis

2 axes

Within 2m (6.56ft.)

AD75CK

2m (6.56ft.) to 10m

AD75CK

ZCAT3035-1330

(32.81ft.)

(d) Cable clamp position

Inside control panel

A1SD75

20 to 30cm
(7.87 to 11.81inch)

AD75CK

20 - 7

3 axes

20. EMC AND LOW VOLTAGE DIRECTIVES

(6)

CC-Link module
(a) Be sure to ground the shield of the cable that is connected to a CC-Link module
close to the exit of the control panel or to any of CC-Link stations within 30cm
(11.81inch) from the module or stations.
The CC-Link dedicated cables are shielded cables. As shown in the illustration
below, remove a part of the outer sheath and ground it to the widest possible
area.

(b) Always use the specified CC-Link dedicated cable.

(c) Connect the CC-Link module and each CC-Link station to the FG line inside the
control panel with the FG terminals as shown below.
[Simplified diagram]

(d) Each power line connecting to the external power supply terminal or module
power supply terminal must be 30m (98.43 ft) or less.
(e) Install a noise filter to the external power supply. Use a noise filter with an
attenuation characteristic equivalent to that of the MA1206 (TDK-Lambda
Corporation). Note that a noise filter is not required when the module is used in
Zone A defined in EN61131-2.
(f) Keep the length of signal cables connected to the analog input terminals of the
following modules to 30m or less.
Wire cables connected to the external power supply and module power supply
terminal in the control panel where the module is installed.
AJ65BT-64RD3
AJ65BT-64RD4
AJ65BT-68TD
(g) For the cable connected to the power supply terminal of the AJ65SBT-RPS or
AJ65BT-68TD, attach a ferrite core with an attenuation characteristic equivalent
to that of the ZCAT3035-1330 from TDK Corporation. Twist the cable around the
ferrite core by one as shown below.

20 - 8

20. EMC AND LOW VOLTAGE DIRECTIVES

(7)

CC-Link/LT module
To supply the CL2DA2-B and CL2AD4-B with 24VDC power using the CL1PAD1,
keep the length of the power cable from the CL1PAD1 to the 24VDC power supply to
30m or less.

(8)

Measures against static electricity

When using an insulation displacement connector without connector cover, a
connected cable for the connector is thin in applicable wire size and coating.
Therefore, note that the module may cause an electric discharge failure.
As measures against the failure, using pressure-displacement type connector whose
applicable wire size is thick or soldering type connector is recommended.

20.1.4 Power supply module

The precautions required for each power supply module are described below.Always
observe the items noted as precautions.
Precautions*2

Model Name
A1S61PN, A1S62PN

Make sure to short the LG and FG terminals with a cable of 6 to 7cm and
ground the cable.

A1S63P*1

Use a CE-compliant 24VDC power supply in the control panel.

A1SJHCPU(S8)

Make sure to short and ground the LG and FG terminals.*2

*1

Filter attachment to the power cable is not required for the A1S63P product with the version
(F) and later. However, use the 24VDC panel power equipment that conforms to the CE.
Make sure to attach two ferrite cores to the power line.
Attach them as close to the power supply module as possible.
Use a ferrite core whose damping characteristic is equivalent to that of the RFC-H13
produced by Kitagawa Industries Company, LTD.

*2

20.1.5 Base unit

The following table lists the base units that can be used for compliance with the EMC
directives.
Type
Main Base Unit
Extension Base Unit

Model Name
A1S38HBEU

Applicable

A1S3

B, A1S38HB

A1S5

B, A1S6

20 - 9

Applicability

N/A
Applicable

20. EMC AND LOW VOLTAGE DIRECTIVES

20.1.6 Ferrite core

Use of ferrite cores is effective in reducing conduction noise in the band of about 10MHz
and radiated noise of 30 to 100MHz.
It is recommended to attach ferrite cores when the shield of the shielded cable coming out
of the control panel does not work effectively, or when emission of the conduction noise
from the power line has to be suppressed.
We tested using ferrite cores from TDK Corporation, ZCAT3035-1330 and ZCAT20320930, and RFC-H13 from Kitagawa Industries Company, LTD.
Make sure to attach a ferrite core to a cable right before the cable is pulled out of the
control panel. If attached to an improper position, the ferrite core does not work effectively.
Ferrite core
Type:
ZCAT3035-1330, ZCAT2032-0930
Contact: TDK Corporation
Type:
RFC-H13
Contact: Kitagawa Industries Company, LTD

20 - 10

20. EMC AND LOW VOLTAGE DIRECTIVES

20.1.7 Noise filter (power supply line filter)

A noise filter is effective for suppressing conduction noise. It is not required to attach a
noise filter to the power supply line except for some models, however, attaching it can
suppress more noise. (The noise filter has the effect on reducing conduction noise of
10MHz or less.). Use any of the following noise filters (double type filters) or equivalent.
Model name

FN343-3/01

FN660-6/06

ZHC2203-11

Manufacturer

SCHAFFNER

SCHAFFNER

TDK

Rated current

3A

6A

3A

Rated voltage

250V

The precautions required when installing a noise filter are described below.
(1)

Do not bundle the wires on the input side and output side of the noise filter. When
bundled, the output side noise will be induced into the input side wires from which
noise has been filtered out.

(a) The noise will be induced when the input and output
wires are installed together.

(2)

(b) Separate the input wires from the output wires.

Ground the noise filter ground terminal to the control panel with the shortest wire
possible (approx. 10cm (3.94in.)).

20 - 11

20. EMC AND LOW VOLTAGE DIRECTIVES

20.1.8 Power line for external power supply terminal

(1)

Use a CE-marked AC/DC power supply for an external power supply of the modules,
and the power cable length needs to be less than 30m (98.43 ft.).*1
*1

The power cable length for the A1SJ71QE71N-B5 needs to be less than 3m (9.84 ft.).

(2)

Use a CE-marked AC/DC power supply for an external power supply of the
A1SJ71QLP21S.

(3)

Install noise filters to external supply power terminals of the I/O module and the
modules below.
Use noise filters whose damping characteristic is equivalent to that of the MA1206
produced by TDK Lambda Corporation.
Analog-digital converter module
Digital-analog converter module
Analog I/O module
Temperature input module
Temperature control module
Pulse input module
High-speed counter module
Positioning module

20.1.9 Installation environment of the CC-Link/LT module and the AS-i module
(1)

CC-Link/LT module
Use the module under the environment of Zone A*1.
For the categories of the following products, refer to the manual came with each
product.
CL1Y4-R1B1
CL1Y4-R1B2
CL1XY4-DR1B2
CL1XY8-DR1B2
CL1PSU-2A

(2)

AS-i module
Use the module under the environment of Zone A*1.
*1

Zone defines categories according to industrial environment, specified in the EMC and Low
Voltage Directives, EN61131-2.
Zone C: Factory mains (isolated from public mains by dedicated transformer)
Zone B: Dedicated power distribution, secondary surge protection (rated voltage:300V or
less)
Zone A: Local power distribution, protected from dedicated power distribution by AC/DC
converter and insulation transformer (rated voltage: 120V or less)

20 - 12

20. EMC DIRECTIVES AND LOW VOLTAGE DIRECTIVES

20.2 Requirements for Compliance with Low Voltage Directives

The Low Voltage Directives apply to the electrical equipment operating from 50 to
1000VAC or 75 to 1500VDC; the manufacturer must ensure the safety of the equipment.
Sections 20.2.1 to Section 20.2.7 provide precautions on installation and wiring of the
MELSEC-QnA series programmable controller to conform to The Low Voltage Directives.
The descriptions are made based on the requirements and standards of the latest
regulation. However, they do not guarantee that any machinery produced according to the
contents of this manual is compliant with the above directives. Therefore, manufacturers
must finally determine how to make it comply it and how it is compliant with the low voltage
directives.
20.2.1 Standard applied for MELSEC-QnA series programmable controller
The standard applied for MELSEC-QnA series programmable controller is EN61010-1
Safety of devices used in measurement, control, or laboratories.
For the modules which operate with the rated voltage of 50 VAC/75 VDC or above, we
have developed new models that conform to the above standard.
For the modules which operate with the rated voltage less than 50 VAC or 75 VDC,
conventional models can be used, because the low voltage directives do not apply to
them.
20.2.2 Precautions when using the QnA series programmable controller
Module selection
(1)

POWER SUPPLY MODULE

Since a power supply module with the rated input voltage of 100/200VAC has a
potentially hazardous voltage area (42.4V or more at the peak), select a model in
which reinforced insulation is provided between the primary and secondary sides.
For those of 24VDC rated input, conventional models can be used.

(2)

I/O module
Since an I/O module with the rated input voltage of 100/200VAC has a potentially
hazardous voltage area, select a model in which reinforced insulation is provided
between the primary and secondary sides.
For those of 24VDC rated input, conventional models can be used.

(3)

CPU module, memory card, base unit

Conventional models can be used for these modules, because they only have a
5VDC circuit inside.

(4)

Special function module

Conventional models can be used for the special function modules including analog
modules, network modules, and positioning modules, because their rated voltage is
24VDC or lower.

(5)

Display
Use the CE-marked product.
20 - 13

20. EMC DIRECTIVES AND LOW VOLTAGE DIRECTIVES

20.2.3 Power supply

The insulation specification of the power supply module was designed assuming
installation category II. Be sure to use the installation category II power supply to the
programmable controller.
The installation category indicates the durability level against surge voltage generated by
a thunderbolt. Category I has the lowest durability; and category IV has the highest
durability.

Category IV

Category III

Category II

Category

Figure 20.1 Installation Category

Category II indicates a power supply whose voltage has been reduced by two or more
levels of isolating transformers from the public power distribution.

20 - 14

20. EMC DIRECTIVES AND LOW VOLTAGE DIRECTIVES

20.2.4 Control panel

Because the programmable controller is an open type device (a device designed to be
stored within another device), be sure to use it inside the control panel.*
*

Also, each network remote station needs to be installed inside the control panel.However, the
waterproof type remote station can be installed outside the control panel.

(1)

Shock protection
To prevent personnel such as operators who are not familiar with electricity from
electric shocks, the control panel must be handled as follows:
(a) Lock the control panel so that only the qualified personnel can open it.
(b) Provide a mechanism so that opening the control panel will automatically stop
the power supply.
(c) For electric shock protection, use IP20 or greater control panel.

(2)

Dustproof and waterproof features

The control panel also has the dustproof and waterproof functions.Insufficient
dustproof and waterproof features lower the insulation withstand voltage, resulting in
insulation destruction. As our programmable controllers are designed assuming the
pollution level 2, use them in an environment of pollustion level 2 or lower.
Pollution level 1: An environment where the air is dry and conductive dust does not
exist.
Pollution level 2: An environment where conductive dust does not usually exist,
however, temporary conductivity may occasionally occur due to
accumulated dust. Generally, this is the level for the inside of the
IP54-equivalent control panel in a control room or on a shop floor.
Pollution level 3: An environment where conductive dust exits and conductivity
may be generated due to accumulated dust.
An environment for a typical factory floor.
Pollution level 4: Continuous conductivity may occur due to rain, snow, etc.An
outdoor environment.
As shown above, the programmable controller can meet pollution level 2 when stored
in a control panel equivalent to IP54.

20 - 15

20. EMC DIRECTIVES AND LOW VOLTAGE DIRECTIVES

20.2.5 Module installation

(1)

Installing modules contiguously

The left side face of each QnA series I/O module is open.When installing I/O modules
to the base, do not allow any empty slots between modules.If a slot to the left of a
100/200VAC module is left empty, the circuit board containing the hazardous voltage
circuit is exposed.When a slot needs to be left open, be sure to install the blank
module (A1SG60).
When using the A1S5 B(S1) expansion base with no power supply, attach the
included cover to the side of the leftmost module.

20.2.6 Grounding
There are two kinds of ground terminals as shown below.Either ground terminal must be
used grounded.
Be sure to perform protective grounding to ensure the safety.
Protective grounding

: Ensures the safety of the programmable controller and

improves the noise resistance.

Functional grounding

: Improves the noise resistance.

20.2.7 External wiring

(1)

Module power supply and external power supply

For the remote module which requires 24VDC as module power supply, the 5/12/24/
48VDC I/O module, and the special function module which requires the external
power supply, use the 5/12/24/48VDC circuit which is doubly insulated from the
hazardous voltage circuit or use the power supply whose insulation is reinforced.

(2)

External devices
When a device with a hazardous voltage circuit is externally connected to the
programmable controller, use a model whose circuit section of the interface to the
programmable controller is intensively insulated from the hazardous voltage circuit.

(3)

Reinforced insulation
Reinforced insulation refers to the insulation with the dielectric withstand voltage
shown in Table 1.

Reinforced Insulation Withstand Voltage (Installation Category II, source : IEC664)

Rated voltage of hazardous
voltage area

Surge withstand voltage (1.2/50 s)

150VAC or less

2500V

300VAC or less

4000V

20 - 16

21. MAINTENANCE AND INSPECTION

21

MAINTENANCE AND INSPECTION

In order to use the programmable controller always in good condition, conducting daily
and periodical maintenance/inspection on the following items are strongly recommended.

21.1 Daily Inspection

Dairy inspection items recommended are shown in Table 21.1.
Table 21.1 Dairy Inspection
Item

Check item
Installation condition of
the base unit

Content of inspection

screws are not loose or

It is installed securely.

Retighten the screw.

cover is not detached.

Check if the module is

The hook should be

Installation condition of

not disengaged and if

securely engaged and the

Securely engage the

the I/O modules

the hook is securely

module should be

hook.

engaged.

positively mounted.

screw
Connection conditions

MODULE

Retighten the terminal

screw.

There is an appropriate

terminals.

distance.

Connector areas of

No loosening at

Retighten the

extension cable

connectors.

connector fixing screw.

Confirm it is ON.

POWER LED

LEDs on the main module

No loosening.

Proximity of solderless

POWER SUPPLY

Action

Confirm if installation

Loosening of terminal

Judgement

The LED is ON.

(Faulty if it is OFF.)

CPU module

Confirm it is ON in the

The LED is ON.

"RUN" LED

"RUN" state.

(Faulty if it is OFF.)

CPU module

Check that the LED is

"ERROR" LED

OFF.

CPU module

Check that the LED is

OFF

"BAT. ARM" LED

OFF.

(Faulty if it is ON.)

Correct the distance.

Refer to Section 22.2.2

Refer to

Section 22.2.3
Section 22.2.4

OFF
(Faulty if it is ON or

Refer to Section 22.2.5

flickering.)
Refer to Section 22.2.7

The LED is ON when input

Input module

Confirm if it correctly

LED

turns on and off.

is ON, and OFF when

input is OFF.

Refer to Section 22.2.8

(Faulty other than the

above.)
The LED is ON when

Output module

Confirm if it correctly

LED

turns on and off.

output is ON, and OFF

when output is OFF.
(Faulty other than the
above.)

21 - 1

Refer to Section 22.2.8

21. SYSTEM CONFIGURATION

21.2 Periodic Inspection

Inspection on items shown below should be conducted once or twice every six months to a
year. Conduct the inspection when the equipment is moved or modified, or wiring is
changed.
Table 21.2 Periodic inspection

Check item
Ambient environment

Item

Ambient temperature
Ambient humidity

Atmosphere

Content of inspection
Measure with

Judgement
0 to 55

temperature and humidity 10 to 90%RH

gauge.
Measure presence of

There is no corrosive

corrosive gases.

gas present.

100/200VAC
2

Line voltage check

Measure voltage across

Corrective action

85 to 264VAC

100/200VAC terminals.

When used in a panel,

temperature inside
the panel is the
ambient temperature.

Change the power

supply.

Connection conditions

Installation condition

Retighten the screw.

Loosening, backlash

Test by moving the

Must be installed

module.

solidly.

Adhesion of dirt or
foreign matters

Visual inspection

Loosening of terminal

Retighten with a

screw

screwdriver.

Proximity of
solderless terminals
Loosening of
connector

Visual inspection

loosened, secure it

No adhesion.

Remove and clean.

No loosening.

Retighten.

There is an
appropriate distance.

Battery

Correct the distance.

Retighten the

Visual inspection

No loosening.

connector fixing
screw.
Even when there is no

is OFF with a peripheral

(Preventive

low-battery display,

device in the monitoring

maintenance)

replace if specified life

mode.

WARNING

power supply, if
with screws.

Confirm SM51 or SM52

5

For CPU, I/O, or

is exceeded.

Be sure to shut off all phases of the external power supply used by the system
before cleaning or retightening the terminal screws or module mounting screws.
Failure to do so may result in an electric shock.
If they are too loose, it may cause a short circuit or malfunctions.
If too tight, it may cause damage to the screws and/or module, resulting in an
accidental drop of the module, short circuit or malfunctions.

21 - 2

21. MAINTENANCE AND INSPECTION

21.3 Battery Replacement

Special relay SM51 or SM52 is turned ON when voltage of the battery for backing up
programs and power failure compensation function drops. Even though programs and
contents of power failure compensation function are not erased immediately when these
special relays become ON, the contents could be erased if the ON-status of the special
relay fails to be recognized.
Replace the battery before the total latch time after special relay SM51 turns ON reaches
the stipulated time.
POINT

SM51 is a battery voltage drop alarm, and it remains ON once turning it ON even if
the battery voltage returns to normal.
SM52 is a battery voltage drop alarm, and after turning ON, it goes OFF when the
battery voltage returns to normal.
After SM51 and SM52 have turned ON, immediately replace the battery.
SM51 is a battery voltage drop alarm, and it remains ON once turning it ON even if the
battery voltage returns to normal.
In order to determine which of these memory's battery has sustained the voltage drop,
check the contents of special relay SD51 and SD52.
When the voltage of any memory's battery drops, the bit in SD51 and SD52 that
corresponds to each memory turns ON.
SD51, SD52 bit No.

Corresponding memory

Bit 0

Built-in RAM

Bit 1, 2

Memory card

21 - 3

21. MAINTENANCE AND INSPECTION

POINT

The relationship of back up between the status of the batteries installed in the
CPU module and memory cards is explained below.
The following two points are applied.
1) The battery installed in the CPU module does not back up the RAM memories
of the memory cards.
2) The batteries installed in the memory cards do not back up the built-in RAM of
the CPU module.
CPU module
AC power supply for CPU
module

CPU module
CPU module battery

Memory card
memory
Battery

CPU module
CPU module
memory

Memory card
memory
Memory

ON
ON
OFF
ON
ON
OFF
OFF
ON
ON
OFF
OFF
ON
OFF
OFF

: Back up is possible.
: Back up is not possible.
The battery life guideline and the replacement procedures are explained on the following
pages.

21 - 4

21. MAINTENANCE AND INSPECTION

21.3.1 Battery life

(1)

Battery life of CPU module

The CPU module battery life differs depending on the CPU module model.
(a) Q2ASCPU, Q2ASCPU-S1
Table 21.3 shows the battery lives when the Q2ASCPU and Q2ASCPU-S1 are
used.
Table 21.3 CPU module battery life
Battery life*5

CPU module model

Actual service value

Power-on time
ratio

*1

Guaranteed value*2

ambient

0%

30%

After SM51, SM52 turns

(Referencevalue)*3

ON
(Backup power time after

ambient

an alarm*4)

temperature 40

temperature 25

1,800 hours

22,000 hours

43,800 hours

48 hours

0.2 years

2.5 years

5 years

2.0 days

2,570 hours

31,400 hours

43,800 hours

48 hours

0.3 years

3.6 years

5 years

2.0 days

3,600 hours

43,800 hours

43,800 hours

48 hours

0.4 years

5 years

5 years

2.0 days

43,800 hours

43,800 hours

43,800 hours

48 hours

5 years

5 years

5 years

2.0 days

1,150 hours

22,000 hours

43,800 hours

27 hours

0.1 years

2.5 years

5 years

1.0 days

1,640 hours

31,400 hours

43,800 hours

27 hours

0.2 years

3.6 years

5 years

1.0 days

2,300 hours

43,800 hours

43,800 hours

27 hours

0.3 years

5 years

5 years

1.0 days

43,800 hours

43,800 hours

43,800 hours

27 hours

5 years

5 years

5 years

1.0 days

Q2ASCPU
50%

100%

0%

30%
Q2ASCPU-S1
50%

100%
*1

The power time ratio indicates the percentage of power-on time per day (24 hours).
(The power-on time ratio is 50% when the total power-on time is 12 hours and the total poweroff time is 12 hours.)

*2

The guaranteed value represents a battery life at 70 , which is calculated based on

characteristic values of manufacturer-supplied memories (SRAM) and on the assumption of
storage within the ambient temperature range of -20 to 75

(operating ambient temperature

*3

of 0 to 55 ).
The actual service value (reference value) represents a battery life that is calculated based on

*4

the values measured at storage ambient temperatures of 40

and 25 . This value is
intended for refe rence only, as it varies with characteristics of the memory.
The guaranteed time after power-off is 10 minutes when:
The battery connector is disconnected.

*5

The battery lead wire is broken

The battery duration (maximum life) is 5 years (43,800 hours).

21 - 5

21. MAINTENANCE AND INSPECTION

Yardsticks for preventive maintenance are as follows:

[1] Replace the battery in four to five years even when it has not been used
exceeding the guaranteed value shown in the above table.
[2] Replace the battery when it has been used exceeding the guaranteed value
shown in the above table and SM51 is on.
POINT

(1) Use the battery within the time shown by the guaranteed value of the battery
life.
(2) If the battery may be used exceeding the guaranteed time, perform ROM
operation to protect data in case that the battery will be exhausted during
power-off of the programmable controller. Or, after SM51 turns on, back up
data within the backup power time.
(3) When the battery (A6BAT) is not connected to the CPU module, its service
life is five years.
(4) When the battery-low special relay SM51 turns on, immediately change the
battery.
Even if an alarm has not yet occurred, it is recommended to replace the
battery periodically according to the operating condition.

21 - 6

21. MAINTENANCE AND INSPECTION

(b) Q2ASHCPU, Q2ASHCPU-S1

1) Table 21.4 shows battery lives when the Q2ASHCPU and Q2ASHCPU-S1
of hardware version G or eariler are used. For hardware versions, refer to
Section 15.2.
Table 21.4 Battery lives when the Q2ASHCPU and Q2ASHCPU-S1 of hardware version G or earlier are used
Battery life*5

CPU module model

Actual service value (Reference

Power-on time
ratio

*1

Guaranteed value*2
ambient

0%

30%

After SM51, SM52 turns

value)*3

ON
(Backup power time after

ambient

an alarm*4)

temperature 40

temperature 25

1,050 hours

8,800 hours

43,800 hours

24 hours

0.1 years

1years

5 years

1.0 days

1,500 hours

12,570 hours

43,800 hours

24 hours

0.2 years

1.4 years

5 years

1.0 days

2,100 hours

17,600 hours

43,800 hours

24 hours

0.2 years

2 years

5 years

1.0 days

43,800 hours

43,800 hours

43,800 hours

24 hours

5 years

5 years

5 years

1.0 days

860 hours

7,600 hours

40,000 hours

19 hours

0.1 years

0.9 years

4.6 years

1.0 days

1,220 hours

10,860 hours

43,800 hours

19 hours

0.1 years

1.2 years

5 years

1.0 days

1,720 hours

15,200 hours

43,800 hours

19 hours

0.2 years

1.7 years

5 years

1.0 days

43,800 hours

43,800 hours

43,800 hours

19 hours

5 years

5 years

5 years

1.0 days

Q2ASHCPU
50%

100%

0%

30%
Q2ASHCPU-S1
50%

100%
*1

The power time ratio indicates the percentage of power-on time per day (24 hours).
(The power-on time ratio is 50% when the total power-on time is 12 hours and the total poweroff time is 12 hours.)

*2

The guaranteed value represents a battery life at 70 , which is calculated based on

characteristic values of manufacturer-supplied memories (SRAM) and on the assumption of
storage within the ambient temperature range of -20 to 75

(operating ambient temperature

*3

of 0 to 55 ).
The actual service value (reference value) represents a battery life that is calculated based on

*4

the values measured at storage ambient temperatures of 40

and 25 . This value is
intended for refe rence only, as it varies with characteristics of the memory.
The guaranteed time after power-off is 10 minutes when:.
The battery connector is disconnected.

*5

The battery lead wire is broken

The battery duration (maximum life) is 5 years (43,800 hours).

Yardsticks for preventive maintenance are as follows:

[1] Replace the battery in four to five years even when it has not been used
exceeding the guaranteed value shown in the above table.
[2] Replace the battery when it has been used exceeding the guaranteed value
shown in the above table and SM51 is on.
21 - 7

21. MAINTENANCE AND INSPECTION

POINT

(1) Use the battery within the time shown by the guaranteed value of the battery
life.
(2) If the battery may be used exceeding the guaranteed time, perform ROM
operation to protect data in case that the battery will be exhausted during
power-off of the programmable controller. Or, after SM51 turns on, back up
data within the backup power time.
(3) When the battery (A6BAT) is not connected to the CPU module, its service life
is five years.
(4) When the battery-low special relay SM51 turns on, immediately change the
battery.
Even if an alarm has not yet occurred, it is recommended to replace the
battery periodically according to the operating condition.

2) Table 21.5 shows battery lives when the Q2ASHCPU and Q2ASHCPU-S1
of hardware version H or later are used. For hardware versions, refer to
Section 15.2.
Table 21.5 Battery lives when the Q2ASHCPU and Q2ASHCPU-S1 of hardware version H or later are used
Battery life*5

CPU module model

Actual service value (Reference

Power-on time
ratio*1

value)*3

0%

30%

ON

Guaranteed value*2
ambient

After SM51, SM52 turns

ambient

(Backup power time after

an alarm*4)

temperature 40

temperature 25

1,050 hours

3,400 hours

4,000 hours

24 hours

0.1 years

0.4 years

0.5 years

1.0 days

1,500 hours

4,800 hours

5,700 hours

24 hours

0.2 years

0.5 years

0.7 years

1.0 days

2,100 hours

6,800 hours

8,000 hours

24 hours

0.2 years

0.8 years

0.9 years

1.0 days

43,800 hours

43,800 hours

43,800 hours

24 hours

5 years

5 years

5 years

1.0 days

860 hours

3,400 hours

4,000 hours

19 hours

0.1 years

0.4 years

0.5 years

1.0 days

1,220 hours

4,800 hours

5,700 hours

19 hours

0.1 years

0.5 years

0.7 years

1.0 days

1,720 hours

6,800 hours

8,000 hours

19 hours

0.2 years

0.8 years

0.9 years

1.0 days

43,800 hours

43,800 hours

43,800 hours

19 hours

5 years

5 years

5 years

1.0 days

Q2ASHCPU
50%

100%

0%

30%
Q2ASHCPU-S1
50%

100%

21 - 8

21. MAINTENANCE AND INSPECTION

*1

The power time ratio indicates the percentage of power-on time per day (24 hours).
(The power-on time ratio is 50% when the total power-on time is 12 hours and the total poweroff time is 12 hours.)

*2

The guaranteed value represents a battery life at 70 , which is calculated based on

characteristic values of manufacturer-supplied memories (SRAM) and on the assumption of
storage within the ambient temperature range of -20 to 75

(operating ambient temperature

*3

of 0 to 55 ).
The actual service value (reference value) represents a battery life that is calculated based on

*4

the values measured at storage ambient temperatures of 40

and 25 . This value is
intended for refe rence only, as it varies with characteristics of the memory.
The guaranteed time after power-off is 10 minutes when:
The battery connector is disconnected.

*5

The battery lead wire is broken

The battery duration (maximum life) is 5 years (43,800 hours).

Yardsticks for preventive maintenance are as follows:

[1] Replace the battery in four to five years even when it has not been used
exceeding the guaranteed value shown in the above table.
[2] Replace the battery when it has been used exceeding the guaranteed value
shown in the above table and SM51 is on.
POINT

(1) Use the battery within the time shown by the guaranteed value of the battery
life.
(2) If the battery may be used exceeding the guaranteed time, perform ROM
operation to protect data in case that the battery will be exhausted during
power-off of the programmable controller. Or, after SM51 turns on, back up
data within the backup power time.
(3) When the battery (A6BAT) is not connected to the CPU module, its service life
is five years.
(4) When the battery-low special relay SM51 turns on, immediately change the
battery.
Even if an alarm has not yet occurred, it is recommended to replace the
battery periodically according to the operating condition.

21 - 9

21. MAINTENANCE AND INSPECTION

(2)

Battery life of memory card

The battery life of memory card differs depending on the memory capacity.The life for
each memory is shown in Table 21.6.
Table 21.6 Battery lives of memory cards
Battery life (Total power failure time) [hr]

Memory card model name

Guaranteed value (MIN)

Actual value (TYP)

After SM51 is turned ON

Q1MEM-64S

5256

23652

Q1MEM-128S

2628

12264

Q1MEM-256S

5256

23652

Q1MEM-512S

2628

12264

Q1MEM-1MS

7008

23652

Q1MEM-2MS

2628

12264

Q1MEM-64SE

5256

23652

Q1MEM-128SE

5256

23652

Q1MEM-256SE

5256

23652

Q1MEM-512SE

5256

23652

Q1MEM-1MSE

2628

12264

Actual value indicates a rough average value and guaranteed value indicates the minimum
value.

Yardsticks for preventive maintenance are as follows:

[1] Replace the battery in four to five years even when it has not been used
exceeding the guaranteed value shown in the above table.
[2] Replace the battery when it has been used exceeding the guaranteed value
shown in the above table and SM51 is on.

21 - 10

21. MAINTENANCE AND INSPECTION

21.3.2 Battery replacement procedure

WARNING

(1)

Correctly connect the battery connector.

Do not charge, disassemble, heat, short-circuit, solder, or throw the battery into the
fire.
Incorrect battery handling may cause personal injuries or a fire due to exothermic
heat, burst and/or ignition.
CPU module battery replacement procedure
Replace the battery of a CPU module according to the following procedure when life
of the battery is over. Even when the battery is removed, memory is backed up by the
capacitor for a while. However, if replacement takes longer than the guaranteed value
shown in the following table, the content of the memory may be erased, so replace
the battery quickly.

21 - 11

21. MAINTENANCE AND INSPECTION

Table 21.7 Period backed up by the capacitor

Period backed up by the capacitor [min]
3

Refer to Section 21.3.2 (2)

21 - 12

21. MAINTENANCE AND INSPECTION

POINT

After replacing a battery, write the date for next battery replacement on the sticker
on the back side of the front cover.
Write the proper date by checking the battery life. (Refer to Section 21.3.1)

(2)

Memory card battery replacement procedure

Replace the memory card battery according to the following procedure when the life
is over. Even if the battery is removed, the memory card memory is backed up by a
capacitor so that the battery can be replaced while the memory card is out of the
CPU module.
However, if the time taken to replace the battery exceeds the guaranteed value
indicated in Table 21.6 below, the contents of the memory may be lost. Therefore,
change the battery as quickly as possible. While the programmable controller power
is ON, the battery can be replaced without removing the memory card in the CPU
module. In this case, the memory contents are backed up by the power supply
voltage from the power supply module.

21 - 13

21. MAINTENANCE AND INSPECTION

Table 21.8 Period backed up by the capacitor

Period backed up by the capacitor [min]
2

Refer to Section 21.3.2 (1)

21 - 14

21. MAINTENANCE AND INSPECTION

21.4 When Reoperating a programmable controller After Storing it with a Battery Unconnected
When reoperating after a battery is uncounted and the programmable controller is stored,
the memory contents of a CPU module and memory card may be undefined.
Therefore, when resuming the operation, clear the CPU module memory and format the
memory in the CPU module by peripheral device.
Afeter doing so, write the memory contents backed up before saving to each memory.
The relationship between the backed-up memory and the batteries is explained below.
Battery
Memory
A6BAT installed in a CPU module

Battery incorporates a memory card

Built-in RAM
CPU module
Device*
SRAM type
Memory card

SRAM

SRAM + E2PROM
type

E2PROM

(Battery back up is not required.)

:Battery is backed up.

: Battey is not backed up.

*As for device memory, also clear the latch range.

Before resuming the operation, clear/format the memory for which a battery is backed up
in the table above with a peripheral device.
For memory clear/format operations, refer to the following manuals.
Type SW IVD-GPPQ GPP Software package Operating Manual (Online)
GX Developer Operating Manual
POINT

(1) Make sure to back up each memory contents before storing the
programmable controller.
When a programmable controller power supply is ON or CPU module reset is
cancelled, a CPU module reviews the status of data below, and initializes all
the data if detecting an error.
RAM data in built-in RAM
Breakdown history
Latch data (Latch relay (L), latch setting range device set in a parameter),
special relay SM900 to SM999, special register SD900 to SD999)
Sampling trace data

21 - 15

21. MAINTENANCE AND INSPECTION

21.5 When a programmable controller is Reoperated After Stored with the Battery Over the Battery Life
If a battery exceeded its guaranteed life is stored and reoperated, the memory contents of
CPU module and memory card may be undefined.
Therefore, when resuming the operation, clear the CPU module memory and format the
memory in the CPU module by peripheral device.
Afeter doing so, write the memory contents backed up before saving to each memory.
The relationship between the backed-up memory and the batteries is explained below.
Battery
Memory
A6BAT installed in a CPU module

Battery incorporates a memory card

Built-in RAM
CPU module
Device*
SRAM type
Memory card

SRAM + E2PROM
type

SRAM
E2PROM

(Battery back up is not required.)

:Battery is backed up.

: Battey is not backed up.

*As for device memory, also clear the latch range.

Before resuming the operation, clear/format the memory for which a battery is backed up
in the table above with a peripheral device.
For memory clear/format operations, refer to the following manuals.
Type SW IVD-GPPQ GPP Software package Operating Manual (Online)
GX Developer Operating Manual
POINT

(1) Make sure to back up each memory contents before storing a programmable
controller.
(2) When a programmable controller power supply is ON or CPU module reset is
cancelled, a CPU module reviews the status of data below, and initializes all
the data if detecting an error.
RAM data in built-in RAM
Breakdown history
Latch data (Latch relay (L), latch setting range device set in a parameter),
special relay SM900 to SM999, special register SD900 to SD999)
Sampling trace data

21 - 16

22. TROUBLESHOOTING

22

TROUBLESHOOTING
The description, cause determination, and corrective actions of each error which may
occur during system usage are described.

22.1 Fundamentals of Troubleshooting

Besides using obviously highly-reliable devices to increase system reliability, it is an
important point to quickly start up the system again when an error occurs.
In order to quickly start up the system, find the cause of the problem and resolve it. There
are the following three basic points to be aware of when performing troubleshooting.

(1)

Visual confirmation
Confirm the following points:
1) Machine operation (stop status and operation status)
2) Power supply ON/OFF
3) I/O equipment status
4) Wiring status (I/O wires and cable)
5) Display status of each display indicator (POWER LED, RUN LED, ERROR LED,
I/O LED, etc.)
6) Status of each setting switch (extension base, power failure compensation, etc.)
After confirming 1) to 6), connect a peripheral device and observe the operation
status of the programmable controller and program contents.

(2)

Error confirmation
Observe how the error changes by performing the following operations:
1) Set the RUN/STOP key switch to "STOP".
2) Reset using the RUN/STOP key switch.
3) Turn ON/OFF the power supply.

(3)

Narrow down the range

By performing the (1) and (2) above, assume the faulty area in the following:
1) Programmable controller or external?
2) I/O module or others?
3) Sequence program?

22 - 1

22. TROUBLESHOOTING

22.2 Troubleshooting
The error definition determination method, error definition corresponding to the error code,
and corrective actions are described.
22.2.1 Troubleshooting flowchart
The error definitions are described by events.

Section 22.2.2

Section 22.2.3

Section 22.2.3

Section 22.2.5

Section 22.2.6

Section 22.2.7

Section 22.2.8

Section 22.2.9

Section 22.2.10

Section 22.2.11

22 - 2

22. TROUBLESHOOTING

22.2.2 Flow for actions when the "POWER" LED is turned OFF
The flow when the programmable controller power is ON or when the "POWER" LED of
the power supply module is ON during operation is described.
"POWER" LED is turned off

Is there a power
supply?

NO

Supply power.

YES
NO

Is the
supply voltage is
reaching 85 to 132VAC
or 170 to 264VAC?

NO

Can "POWER"
LED be turned

YES

The supply voltage should

be within the rated range.

YES
NO

Is the powersupply
unit fixed?

NO

Can "POWER"
LED be turned

YES

Properly fix the power-supply

unit.

YES
NO

Is overcurrent
protection and overvoltage
protection working?

Can "POWER"
LED be turned

YES

(1) Check the electric-current

capacity and reduce the amount
of overcurrent?
(2) Turn the input power supply off
and then immediately turn it on.

YES

NO

NO

Can "POWER"
LED be turned

Contact the nearest service

center, dealer or our office,
and explain the error

YES

End

22 - 3

22. TROUBLESHOOTING

22.2.3 Flow for actions when the "RUN" LED is turned OFF
The flow when the "POWER" LED of the CPU module turns OFF during operation is
described.

Section 22.2.5

22 - 4

22. TROUBLESHOOTING

22.2.4 When the "RUN" LED is flashing

Flashing of the "RUN" LED of a CPU module is described below.
With the Q2ASCPU, when the RUN/STOP key switch is turned from STOP to RUN after
writing a program in the STOP state, the "RUN" LED flashes. Then, no CPU module error
occurs, but the operation stops.
To set the CPU module to RUN, either turn the RUN/STOP key switch to STOP then RUN
again, or reset the CPU module using the key switch. The "RUN" LED turns ON.

22 - 5

22. TROUBLESHOOTING

22.2.5 Flow for actions when the "ERROR LED" is turned ON/flashing
The flow when the programmable controller power is ON, when the operation is started or
when the "ERROR" LED of the CPU module is ON/blinking during operation is described.

Section 22.3)

Section 22.3)

22 - 6

22. TROUBLESHOOTING

22.2.6 When the "USER" LED is turned ON

This section describes the case when the "USER" LED of CPU module is turned on.
With the Q2ASCPU, the "USER" LED comes ON when an error is detected by the CHK
instruction, or when an annunciator (F), turns ON.
When the "USER" LED is turned ON, monitor SM62 and SM80 of the special relay in the
peripheral device monitor mode.
After monitoring and removing the cause, the "USER" LED can be turned OFF by resetting
the RUN/STOP key switch or performing the LEDR instruction.
When SM62 is ON
With the annunciator (F) ON, the "USER" LED is ON.
Check the error cause with SD62 to SD79.
When SM80 is ON,
With execution of the CHK instruction, the "USER" LED is ON.
Check the error cause with SD80.
After checking the error cause, remove the cause.
The "USER" LED can be turned OFF by either of the following operations.
Resetting the system with the RUN/STOP key switch
Execution of the LEDR instruction with the sequence program

REMARK
When the RUN/STOP key switch is turned to "L.CLR" several times in a latch clear
operation, the "USER" LED flashes to indicate that latch clear processing is in
progress.
When the RUN/STOP key switch is turned once more to "L.CLR" while the "USER"
LED is flashing, the "USER" LED goes OFF and latch clear processing is ended.
22.2.7 Flow for actions when the "BAT.ARM" LED is turned ON
This section describes the case when the "BAT.ARM" LED of CPU module is turned on.
With the Q2ASCPU, the "BAT.ARM" LED turns ON when the voltage of the battery for a
CPU module or a memory card drops.
When the "BAT.ARM" LED turns ON, monitor the special relays (SM51 and SM52) and
special registers (SD51 and SD52) in the peripheral device monitor mode, and check if
there has been a voltage drop at either of the battery for a CPU module or a memory card.
After monitoring and replacing the battery by a new one, the "BAT.ALM" LED can be
turned OFF by resetting the RUN/STOP key switch or performing the LEDR instruction.

22 - 7

22. TROUBLESHOOTING

22.2.8 Flow for actions when the output module's output load does not turn ON
The flow when the output load of the output module is not turned ON during operation is
described.

POINT

For problems when the input signal does not turn off or ourput load does not turn
off, perform troubleshooting by referring to the fault examples for the I/O modules
in Section 22.5.

22 - 8

22. TROUBLESHOOTING

22.2.9 Flow for actions when the program cannot be written

The flow when a program cannot be written to the CPU module is described.

SW1

SW1

22 - 9

22. TROUBLESHOOTING

(2)
Check if the in/out switch
of the memory card is ON.
Check if the write protect
switch is OFF.
Check if the memory is
formatted.
Check the designation
for the write destination.

Can program be
written?
NO

(1)

22 - 10

YES

(3)

22. TROUBLESHOOTING

22.2.10 Flow for actions when booting from a memory card is not possible
The flow when the CPU module cannot be booted from a memory card is described.

22 - 11

22. TROUBLESHOOTING

22 - 12

22. TROUBLESHOOTING

22.2.11 Flow chart used when the CPU module is not started up
The following shows the flow when the CPU module is not started up.
The CPU module is not started up.

Is the power supply

module LED ON?

See "Flowchart for actions when

the "POWER" LED is turned OFF".
(Refer to Section 22.2.2.)

NO

YES
Are all the power of the power
supply modules ON? Is the power supply
module wired correctly?

NO

Review the wiring and turn ON all the

power supply .

NO

YES

Is CPU module started up?

YES

Try to connect the peripheral device.

Is it available
to communicate with
the peripheral device?

YES

Make the PLC diagnosis, and execute

the troubleshooting according to the
result.

NO
Is the extension cable
connected to the incorrect
direction? (Connected IN and
IN, or OUT and OUT?)

YES

NO

Is the RUN/STOP key

switch of the CPU
module at RESET?

Connect the extension cable.

NO

at RESET

Not at RESET

Is CPU module started up?

YES

Switch the RUN/STOP key switch

to RUN.

NO

Is CPU module started up?

YES

Switch the power supply module and

confirm the LED lights.

Is CPU module started up?

YES

Hardware error of the power supply

module

NO

Possible hardware errors are described below.

1) CPU module
2)Main base unit, Extension base unit
3)Extension cable
4)Network module (Only when installed)
For the malfunctioning module even after executed the serial
operation check from the minimum system, please consult
your local Mitsubishi service center or representative,
explaining a detailed description of the problem.

22 - 13

Completed

22. TROUBLESHOOTING

MEMO

22 - 14

22. TROUBLESHOOTING

22.3 Error Code List

When an error occurs at PLC power ON, on switching to the RUN status, or during the
RUN status, the self-diagnostics function displays the error content (by LED indication, or
message display on an LED indicator), and stores the error information at a special relay
(SM) and special register (SD).
If an error occurs on a data communicaton request from peripheral devices, a special
function module and the network system to the CPU module, error codes (4000H to
4FFFH) are returned to the request source.
QnACPU errors and corrective actions are described in this section.
(1)

How to read the error code lists

The following shows the way of reading the error code lists from Section 22.3.3 (1000
to 1999) to Section 22.3.9 (7000 to 10000).
(a) Error code, common information, and individual information
Alphanumeric characters in the parentheses of the titles indicate the special
register numbers where the individual information is stored.
(b) Compatible CPUs
: Compatible with all the QnACPU and QCPU.
QCPU

: Compatible with all the Q series CPU module.

Q00J/Q00/Q01

: Compatible with the Basic model QCPU.

Qn(H)

: Compatible with the High Performance model QCPU.

QnPH

: Compatible with the process CPU.

QnPRH

: Compatible with the redundant CPU.

QnA

: Compatible with the QnA series and Q2ASCPU series.

Rem

: Compatible with the MELSECNET/H remote I/O

module.

Each CPU module

: Compatible with the listed CPU module.

(Example: Q4AR, Q2AS)

22 - 15

22. TROUBLESHOOTING

22.3.1 Error Codes

There are errors that is detected by the self-diagnostics function of the CPU module, and
that is detected while communicating with the CPU module.
The table below shows the link between the type of error detection, the point of error
detection and the error codes.
Error Detection Type

Error Detection Point

Error Code

Reference for Error Contents

Detection by the self1000 to 10000*1

Section 22.3.3 to Section 22.3.9

CPU module

4000H to 4FFFH

Appendix 5

Serial communication

7000H to 7FFFH

Serial Communication Module User's Manual

CC-Link module

B000H to BFFFH

CC-Link System Master/Local Module User's Manual

Ethernet module

C000H to CFFFH

Ethernet Interface Module User's Manual

diagnostics function of CPU module

the CPU module

Detection while
communicating with
the CPU module

MELSECNET/10 network
module
*1

F000H to FFFFH

QnA/Q4AR MELSECNET/10 Network System

Reference Manual

The error codes of the CPU module are categorizes according to minor errors, moderate
errors and major errors.
Minor error:

Errors that CPU module such as a battery error continues the operation
(Error code: 1300 to 10000)

Moderate error: Errors that CPU module such as a WDT error stops the operation
(Error code: 1300 to 10000)
Minor error:

Errors that CPU module such as a RAM error stops the operation
(Error code: 1000 to 1299)

"The error that the QnACPU continues operation" and "the error that QnACPU stops
operation" are determined by "CPU operation status" of the error code list.

22.3.2 Procedure to read an error code

When an error occurs, error codes and error messages can be read with the peripheral
devices.
For details on the setting method for each function, refer to the GX Developer Operating
Manual or SW IVD-GPPQ Operating Manual (Offline).

22 - 16

22. TROUBLE SHOOTING

22.3.3 Error code list (1000 to 1999)

The following shows the error messages from the error code 1000 to 1999, the contents
and causes of the errors, and the corrective actions for the errors.
Error
Code

Error Contents and Cause

Corrective Action

1000

[MAIN CPU DOWN]

Runaway or failure of CPU module or failure of
main CPU
Malfunctioning due to noise or other reason
Hardware fault
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
Always

Take noise reduction measures.

Reset the CPU module and RUN it again.If the
same error is displayed again, this suggests a
CPU module hardware fault.(Contact your local
Mitsubishi representative.)

1010

[END NOT EXECUTE]

Entire program was executed without the execution
of an END instruction.
When the END instruction is executed it is read
as another instruction code, e.g. due to noise.
The END instruction has been changed to
another instruction code somehow.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
When an END instruction executed

Take noise reduction measures.

Reset the CPU module and RUN it again. If the
same error is displayed again, this suggests a
CPU module hardware fault. (Contact your local
Mitsubishi representative.)

1101

[RAM ERROR]
The sequence program storing built-in RAM/
program memory in the CPU module is faulty.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
At power ON/ At reset/ When an END instruction
executed

Take noise reduction measures.

Reset the CPU module and RUN it again. If the
same error is displayed again,this suggests a
CPU module hardware fault.(Contact your local
Mitsubishi representative.)

1102

[RAM ERROR]
The work area RAM in the CPU module is faulty.
The standard RAM and extended RAM in the
CPU module are faulty.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
At power ON/ At reset/ When an END instruction
executed

Take noise reduction measures.

Reset the CPU module and RUN it again. If the
same error is displayed again,this suggests a
CPU module hardware fault.(Contact your local
Mitsubishi representative.)

1103

[RAM ERROR]
The device memory in the CPU module is faulty.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
At power ON/At reset

Take noise reduction measures.

When indexing is performed, check the value of
index register to see if it is within the device
range.
Reset the CPU module and RUN it again. If the
same error is displayed again,this suggests a
CPU module hardware fault.(Contact your local
Mitsubishi representative.)

1104

[RAM ERROR]
The address RAM in the CPU module is faulty.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
At power ON/At reset

Take noise reduction measures.

Reset the CPU module and RUN it again.If the
same error is displayed again, this suggests a
CPU module hardware fault. (Contact your local
Mitsubishi representative.)

LED Status
CPU Status

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

22 - 17

Corresponding
CPU

QnA

22. TROUBLE SHOOTING

Error
Code

Error Contents and Cause

1105

[RAM ERROR]
The system RAM in the CPU module is faulty.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
At power ON/At reset

1200

[OPE. CIRCUIT ERR.]

The operation circuit for index modification in the
CPU module does not operate normally.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
At power ON/At reset

1201

[OPE. CIRCUIT ERR.]

The hardware (logic) in the CPU module does not
operate normally.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
At power ON/At reset

1202

[OPE. CIRCUIT ERR.]

The operation circuit for sequence processing in
the CPU module does not operate normally.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
At power ON/At reset

1203

[OPE. CIRCUIT ERR.]

The operation circuit for index modification in the
CPU module does not operate normally.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
When an END instruction executed

1204

[OPE. CIRCUIT ERR.]

The hardware (logic) in the CPU module does not
operate normally.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
When an END instruction executed

1205

[OPE. CIRCUIT ERR.]

The operation circuit for sequence processing in
the CPU module does not operate normally.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
When an END instruction executed

Corrective Action

LED Status
CPU Status

Take noise reduction measures.

Reset the CPU module and RUN it again.If the
same error is displayed again, this suggests a
CPU module hardware fault. (Contact your local
Mitsubishi representative.)

Corresponding
CPU

Q4AR

QnA

RUN:
Off
ERR.:
Flicker

This suggests a CPU module hardware fault.

(Contact your local Mitsubishi representative.)

CPU Status:
Stop

Q4AR

QnA

22 - 18

22. TROUBLE SHOOTING

Error
Code

1206

Error Contents and Cause

[OPE. CIRCUIT ERR.]
The DSP operation circuit in the CPU module does
not operate normally.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
When instruction executed

1401

*1
*2

This suggests a CPU module hardware fault.

(Contact your local Mitsubishi representative.)

[FUSE BREAK OFF]

There is an output module with a blown fuse.
Collateral informationmmon
Common Information:Module No.(Slot No.)
[For Remote I/O network]
Network No./Station No.
Individual Information:
Diagnostic Timing
Always

[FUSE BREAK OFF]

There is an output module with a blown fuse.
External power supply for output load is turned
off or disconnected.
Collateral informationmmon
Common Information:Module No.(Slot No.)
[For Remote I/O network]
Network No./Station No.
Individual Information:
Diagnostic Timing
Always

Check ERR. LED of the output modules and

replace the module whose LED is lit.
Read the common information of the error using the
peripheral device and replace the fuse at the output
module corresponding to the numerical value
(module No.) reading.
Alternatively, monitor special registers SD1300 to
SD1331 with the peripheral device and change
the fuse of the output module whose bit has a
value of "1".
Check whether the external power supply for
output load is ON or OFF.
When a GOT is bus-connected to the main base
unit or extension base unit, check the connection
status of the extension cable and the earth status
of the GOT.

[I/O INT. ERROR]

An interruption has occurred although there is no
interrupt module.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
During interrupt
[SP. UNIT DOWN]
When PLC parameter I/O allocation was being
made, there was no return signal from the special
function module during initial processing
stage.(When error is generated, the head I/O
number of the special function module that
corresponds to the common information is stored.)
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:
Diagnostic Timing
At power ON/At reset

LED Status
CPU Status
RUN:
Off
ERR.:
Flicker

Corresponding
CPU

Q4AR

CPU Status:
Stop
Check ERR. LED of the output modules and
replace the fuse of the module whose LED is lit.
Read the common information of the error using the
peripheral device and replace the fuse at the output
module corresponding to the numerical value
(module No.) reading.
Alternatively, monitor special registers SD1300 to
SD1331 with the peripheral device and change
the fuse of the output module whose bit has a
value of "1".
When a GOT is bus-connected to the main base
unit or extension base unit, check the connection
status of the extension cable and the grounding
status of the GOT.

1300

1310

Corrective Action

Any of the mounted modules is experiencing a

hardware fault. Therefore, check the mounted
modules and change the faulty module. (Contact
your local Mitsubishi representative.)

QnA
Q4AR

RUN:
Off/On
ERR.:
Flicker/On
CPU Status:
Stop/
Continue*1

Q2AS

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

QnA
The CPU module, base unit and/or the special
function module that was accessed is experiencing
a hardware fault. (Contact your local Mitsubishi
representative.)

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop*2

CPU operation can be set in the parameters at error occurrence. (LED indication varies.)
The BAT.ALM LED turns on at BATTERY ERROR.

22 - 19

22. TROUBLE SHOOTING

Error
Code

Error Contents and Cause

Corrective Action

1402

[SP. UNIT DOWN]

The special function module was accessed during
the execution of a FROM/TO instruction set, but
there was no response.
(When an error is generated, the program error
location corresponding to the individual information
is stored.)
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:Program error location
Diagnostic Timing
During execution of FROM/TO instruction set

The CPU module, base unit and/or the special

function module that was accessed is experiencing
a hardware fault.(Contact your local Mitsubishi
representative.)

1411

[CONTROL-BUS. ERR.]
When performing a parameter I/O allocation the
intelligent function module/special function module
could not be accessed during initial
communications.
(On error occurring, the head I/O number of the
corresponding intelligent function module/special
function module is stored in the common
information.)
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:
Diagnostic Timing
At power ON / At reset

1412

[CONTROL-BUS. ERR.]
The FROM/TO instruction is not executable, due to
a control bus error with the intelligent function
module/special function module.
(On error occurring, the program error location is
stored in the individual information.)
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:Program error location
Diagnostic Timing
During execution of FROM/TO instruction set

1421

[SYS. UNIT DOWN]

Hardware fault at the system management module
AS92R.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
Always

1500

[AC/DC DOWN]
A momentary power supply interruption has
occurred.
The power supply went off.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
Always

LED Status
CPU Status

Corresponding
CPU

QnA

Reset the CPU module and RUN it again. If the

same error is displayed again, the intelligent
function module/special function module, CPU
module or base unit is faulty. (Contact your local
Mitsubishi representative.)

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

This suggests a system management module

AS92R hardware fault.
(Contact your local Mitsubishi representative.)

Check the power supply.

Q4AR

RUN:
On
ERR.:
Off
CPU Status:
Continue

22 - 20

QnA

22. TROUBLE SHOOTING

Error
Code

1510

1520

1530

1600

Error Contents and Cause

[DUAL DC DOWN 5V]
The power supply voltage (100 to 240VAC) of
either of the two power supply modules on the
power supply duplexing extension base unit
dropped to or below 85% of the rated voltage.
(This can be detected from the control system of
the redundant system.)
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
Always
[DC DOWN 5V]
The voltage(100 to 240VAC) of the power supply
module on the extension base unit dropped to or
below 85% of the rated voltage.
(This can be detected from the control system of
the stand-alone system or redundant system.)
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
Always
[DC DOWN 24V]
The 24 VDC power supplied to the system
management module AS92R has dropped below
90% of the rated voltage.
(This can be detected from the control system or
standby system of the redundant system.)
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
Always
[BATTERY ERROR*2]
The battery voltage in the CPU module has
dropped below stipulated level.
The lead connector of the CPU module battery is
not connected.
Collateral informationmmon
Common Information:Drive Name
Individual Information:
Diagnostic Timing
Always

1601

[BATTERY ERROR*2]
Voltage of the battery on memory card 1 has
dropped below stipulated level.
Collateral informationmmon
Common Information:Drive Name
Individual Information:
Diagnostic Timing
Always

1602

[BATTERY ERROR*2]
Voltage of the battery on memory card 2 has
dropped below stipulated level.
Collateral informationmmon
Common Information:Drive Name
Individual Information:
Diagnostic Timing
Always

*2

Corrective Action

Check the supply voltage of the power supply

module. If the voltage is abnormal then replace the
power supply module.

LED Status
CPU Status

Corresponding
CPU

RUN:
On
ERR.:
On
CPU Status:
Continue

Check the supply voltage of the power supply

module. If the voltage is abnormal then replace the
power supply module.

RUN:
Off
ERR.:
Flicker

Q4AR

CPU Status:
Stop

Check the 24VDC power supplied to the system

management module AS92R.

RUN:
On
ERR.:
On
CPU Status:
Continue

Change the battery.

If the battery is for program memory, standard
RAM or for the back-up power function, install a
lead connector.

RUN:
On
ERR.:
Off
CPU Status:
Continue
QnA

Change the battery.

Change the battery.

RUN:
On
ERR.:
On
CPU Status:
Continue

The BAT.ALM LED turns on at BATTERY ERROR.

22 - 21

22. TROUBLE SHOOTING

22.3.4 Error code list (2000 to 2999)

The following shows the error messages from the error code 2000 to 2999, the contents
and causes of the errors, and the corrective actions for the errors.
Error
Code

2000

Error Contents and Cause

[UNIT VERIFY ERR.]
I/O module information power ON is changed.
I/O module (or special function module) not
installed properly or installed on the base unit.
Collateral informationmmon
Common Information:Module No.(Slot No.)
[For Remote I/O network]
Network No./Station No.
Individual Information:
Diagnostic Timing
When an END instruction executed

Corrective Action
Read the common information of the error using
the peripheral device, and check and/or change
the module that corresponds to the numerical
value (module number) there.
Alternatively, monitor the special registers
SD1400 to SD1431 at a peripheral device, and
change the fuse at the output module whose bit
has a value of "1".
When a GOT is bus-connected to the main base
unit or extension base unit, check the connection
status of the extension cable and the grounding
status of the GOT.

2100

[SP. UNIT LAY ERR.]

In PLC parameter I/O allocation settings, a special
function module was allocated to a location
reserved for an I/O module. Or, the opposite has
happened.
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:
Diagnostic Timing
At power ON/At reset

2101

[SP. UNIT LAY ERR.]

13 or more special function modules (not counting
the A1SI61) capable of sending an interrupt to the
CPU module have been installed.
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:
Diagnostic Timing
At power ON/At reset

2102

[SP. UNIT LAY ERR.]

Seven or more serial communication modules
(excludes A (1S) J71QC24) have been installed.
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:
Diagnostic Timing
At power ON/At reset

Keep the number of serial communication modules

(excludes A(1S)J71QU24) installed to six or fewer.

2103

[SP. UNIT LAY ERR.]

Two or more A (1S) I61 interrupt modules have
been mounted.
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:
Diagnostic Timing
At power ON/At reset

Install only 1 A (1S) I61 module.

*1

LED Status
CPU Status

Corresponding
CPU

RUN:
Off/On
ERR.:
Flicker/On
CPU Status:
Stop/
Continue*1

Reset the PLC parameter I/O allocation setting to

conform with the actual status of the special
function modules.

QnA
Keep the number of special function modules that
can initiate an interrupt (with the exception of the
A(1S)I61 module) to 12 or fewer.

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

CPU operation can be set in the parameters at error occurrence. (LED indication varies.)

22 - 22

22. TROUBLE SHOOTING

Error
Code

2104

Error Contents and Cause

Corrective Action

[SP. UNIT LAY ERR.]

At the MELSECNET/MINI auto refresh network
parameter settings, the module allocation that was
set is different from the actual module models at
the station numbers in the link system.
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:
Diagnostic Timing
At power ON/At reset

Reset the network parameter MELSECNET/MINI

auto refresh unit module allocation setting so that it
conforms to the station number of the module that
is actually linked.

LED Status
CPU Status

Corresponding
CPU

[SP. UNIT LAY ERR.]

There are too many special function modules that
can use dedicated instructions allocated (number
of modules installed).
(The total of the figures indicated below is above
1344.)

2105

(AD59
(AD57(S1)/AD58
(AJ71C24(S3/S6/S8)
(AJ71UC24
(AJ71C21(S1)
(AJ71PT32-S3/AJ71T32-S3
(AJ71QC24(R2,R4)
(AJ71ID1(2)-R4
+(AD75

modules installed
modules installed
modules installed
modules installed
modules installed
modules installed
modules installed
modules installed
modules installed
total

5)
8)
10)
10)
29)
125)
29)
8)
12)
1344

Reduce the number of special function modules

installed.

*: When the expansion mode is used.

Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:
Diagnostic Timing
At power ON/At reset

2106

[SP.UNIT LAY ERR.]

Five or more AJ71QLP21 & AJ71QBR11
modules are installed.
Three or more AJ71AP21/R21 & AJ71AT21B
modules are installed.
The total number of installed AJ71QLP21,
AJ71QBR11, AJ71AP21/R21, and AJ71AT21B
modules exceeds five.
The same network numbers or identical station
numbers exist in the MELSECNET/10 network
system.
Two or more master or load stations exist
simultaneously at the MELSECNET(II) or
MELSECNET/B data link system.
Collateral informationmmon
Common Information:Module No. (Slot No.)
Individual Information:
Diagnostic Timing
At power ON/At reset

2107

[SP. UNIT LAY ERR.]

The start X/Y set in the PLC parameters I/O
assignment settings is overlapped with the one for
another module.
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:
Diagnostic Timing
At power ON/At reset

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

Reduce the AJ71QLP21 and AJ71QBR11

modules to four or less.
Reduce the AJ71AP21/R21 and AJ71AT21B
modules to two or less.
Reduce the AJ71QLP21, AJ71QBR11,
AJ71AP21/R21 and AJ71AT21B modules to a
total of four or less.
Check the network Nos. and station Nos.
Check the station Nos.

Make the PLC parameters I/O assignment setting

again so it is consistent with the actual status of the
special function modules.

22 - 23

QnA

22. TROUBLE SHOOTING

Error
Code

2108

2109

2110

Error Contents and Cause

Corrective Action

[SP. UNIT LAY ERR.]

A(1S)J71LP21 or A(1S)J71BR11 for use with the
AnUCPU network module has been installed.
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:
Diagnostic Timing
At power ON/At reset
[SP. UNIT LAY ERR.]
The control system and standby system module
configurations are different when a redundant
system is in the backup mode.
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:
Diagnostic Timing
At power ON/At reset
[SP. UNIT ERROR]
The location designated by the FROM/TO
instruction set is not the special function module.
The module that does not include buffer memory
has been specified by the FROM/TO instruction.
The special function module, Network module
being accessed is faulty.
Station not loaded was specified using the
instruction whose target was the CPU share
memory.
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:Program error location
Diagnostic Timing
When instruction executed
[SP. UNIT ERROR]
The location designated by a link direct device

2111

2112

(J \ ) is not a network module.

The I/O module (special function module) was
nearly removed, completely removed, or
mounted during running.
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:Program error location
Diagnostic Timing
When instruction executed
[SP. UNIT ERROR]
The module other than special function module is
specified by the special function module
dedicated instruction.
Or, it is not the corresponding special function
module.
The module model specified by the special
function module dedicated instruction and that
specified by the parameter I/O assignment is
different.
Collateral informationmmon
Common Information:Module No.(Slot No.)
Individual Information:Program error location
Diagnostic Timing
When instruction executed/STOP

*1
*2

Replace the network module to A(1S)J71QLP21 or

A(1S)J71QBR11.

LED Status
CPU Status
RUN:
Off
ERR.:
Flicker

Corresponding
CPU

QnA

CPU Status:
Stop

Check the module configuration of the standby

system.

RUN:
Off
ERR.:
Flicker

Q4AR

CPU Status:
Stop/
Continue*2

Read the individual information of the error using

the GX Developer, check the FROM/TO
instruction that corresponds to that numerical
value (program error location), and correct when
necessary.
The special function module that was accessed
is experiencing a hardware fault. Therefore,
change the faulty module. Alternatively, contact
your local Mitsubishi representative.

RUN:
Off/On
ERR.:
Flicker/On
CPU Status:
Stop/
Continue*1

Read the individual information of the error using

a peripheral device, and check the special
function module dedicated instruction (network
instruction) that corresponds to the value
(program error part) to make modification.
Set the module model by PLC parameter I/O
assignment according to the special function
module dedicated instruction setting.
Example) Although AJ71QC24N is used actually,
AJ71QC24 is set.

RUN

CPU operation can be set in the parameters at error occurrence. (LED indication varies.)
The BAT.ALM LED turns on at BATTERY ERROR.

22 - 24

QnA

22. TROUBLE SHOOTING

Error
Code

2113

Error Contents and Cause

[SP. UNIT ERROR]
Data of special function module to be simulated is
not set in the simulation date.
Collateral informationmmon
Common Information:FFFFH (fixed)
Individual Information:Program error location
Diagnostic Timing
When instruction executed/STOP

2210

Corrective Action

Read the individual information of the error using a

peripheral device, and check the special function
module /special function module dedicated
instruction (network instruction) that corresponds to
CPU Status:
the value (program error part) to make modification.
Stop/
Continue*1

Check and correct the valid parameter drive

settings made by the DIP switches.
Set the boot file to the drive specified by the
parameter drive DIP switches.

[ICM. OPE. ERROR]

A memory card was removed without switching
the memory card in/out switch OFF.
The memory card in/out switch is turned ON
although a memory card is not actually installed.
Collateral informationmmon
Common Information:Drive name
Individual Information:
Diagnostic Timing
When memory card is inserted or removed/When
memory card is inserted

Remove memory card after placing the memory

card in/out switch OFF.
Turn on the card insert switch after inserting a
memory card.

[ICM. OPE. ERROR]

The memory card has not been formatted.
Memory card format status is incorrect.
Collateral informationmmon
Common Information:Drive name
Individual Information:
Diagnostic Timing
When memory card is inserted or removed/When
memory card is inserted

Format memory card.

Reformat memory card.

2302

[ICM. OPE. ERROR]

A memory card that cannot be used with the CPU
module has been installed.
Collateral informationmmon
Common Information:Drive name
Individual Information:
Diagnostic Timing
When memory card is inserted or removed

Format memory card.

Reformat memory card.
Check memory card.

2400

[FILE SET ERROR]

The file designated at the PLC file settings in the
parameters cannot be found.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/
At writing to progurammable controller

Read the individual information of the error using

peripheral device, check to be sure that the
parameter drive name and file name correspond
to the numerical values there (parameter
number), and correct.
Create a file created using parameters, and load
it to the CPU module.

2300

2301

*1

Corresponding
CPU

RUN:
Off/On
ERR.:
Flicker/On

RUN

[BOOT ERROR]
There is no boot file in the drive designated by the
parameter enabled drive switch even though the
Boot DIP switch is ON.
Collateral informationmmon
Common Information:Drive name
Individual Information:
Diagnostic Timing
At power ON/At reset

LED Status
CPU Status

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

RUN:
Off/On
ERR.:
Flicker/On
CPU Status:
Stop/
Continue*1

CPU operation can be set in the parameters at error occurrence. (LED indication varies.)

22 - 25

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

QnA

22. TROUBLE SHOOTING

Error
Code

2401

Error Contents and Cause

[FILE SET ERROR]
The file specified by parameters cannot be made.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/
At writing to progurammable controller

Corrective Action
Read the individual information of the error using
the peripheral device, check to be sure that the
parameter drive name and file name correspond
to the numerical values there (parameter
number), and correct.
Check the space remaining in the memory card.

2402

[FILE SET ERROR]

Though the file register has been set in the pairing
setting/tracking setting, the file register does not
exist.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/
At writing to progurammable controller

2410

[FILE OPE. ERROR]

The specified program does not exist in the
program memory.
This error may occur when the ECALL, EFCALL,
PSTOP, PSCAN, POFF or PLOW instruction is
executed.
The specified file does not exist.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Program error location
Diagnostic Timing
When instruction executed

Read the individual information of the error using

the peripheral device, check to be sure that the
program corresponds to the numerical values
there (program location), and correct.
Create a file created using parameters, and load
it to the CPU module.
In case a specified file does not exist, write the
file to a target memory and/or check the file
specified with the instruction again.

2411

[FILE OPE. ERROR]

The file is the one which cannot be specified by
the sequence program (such as comment file).
The specified program exists in the program
memory, but has not been registered in the
program setting of the Parameter dialog box.
This error may occur when the ECALL, EFCALL,
PSTOP, PSCAN or POFF instruction is executed.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Program error location
Diagnostic Timing
When instruction executed

Read the individual information of the error using

the peripheral device, check to be sure that the
program corresponds to the numerical values there
(program location), and correct.

2412

[FILE OPE. ERROR]

The SFC program file is one that cannot be
designated by the sequence program.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Program error location
Diagnostic Timing
When instruction executed

Read the individual information of the error using

the peripheral device, check to be sure that the
program corresponds to the numerical values there
(program location), and correct.

2413

[FILE OPE. ERROR]

No data has been written to the file designated by
the sequence program.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Program error location
Diagnostic Timing
When instruction executed

Read the individual information of the error using

the peripheral device, check to be sure that the
program corresponds to the numerical values there
(program location), and correct.
Check to ensure that the designated file has not
been write protected.

*1

LED Status
CPU Status

Corresponding
CPU

QnA
RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

Confirm the file register and parameter.

Q4AR

RUN:
Off/On
ERR.:
Flicker/On
CPU Status:
Stop/
Continue*1

CPU operation can be set in the parameters at error occurrence. (LED indication varies.)

22 - 26

QnA

22. TROUBLE SHOOTING

Error
Code

Error Contents and Cause

Corrective Action

2500

[CAN'T EXE. PRG.]

There is a program file that uses a device that is
out of the range set in the PLC parameter device
setting.
After the PLC parameter setting is changed, only
the parameter is written into the PLC.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:
Diagnostic Timing
At power ON/At reset

Read the common information of the error using

the peripheral device, check to be sure that the
parameter device allocation setting and the
program file device allocation correspond to the
numerical values there (file name), and correct if
necessary.
If PLC parameter device setting is changed,
batch-write the parameter and program file into
the PLC.

2501

[CAN'T EXE. PRG.]

There are multiple program files although "none"
has been set at the PLC parameter program
settings.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:
Diagnostic Timing
At power ON/At reset

2502

[CAN'T EXE. PRG.]

The program file is incorrect.
Alternatively, the file contents are not those of a
sequence program.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:
Diagnostic Timing
At power ON/At reset

2503

[CAN'T EXE. PRG.]

There are no program files at all.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:
Diagnostic Timing
At power ON/At reset

2504

[CAN'T EXE. PRG.]

Two or more SFC normal programs or control
programs have been designated.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:
Diagnostic Timing
At power ON/At reset

LED Status
CPU Status

Corresponding
CPU

Edit the PLC parameter program setting to "yes".

Alternatively, delete unneeded programs.

RUN:
Off
ERR.:
Flicker
Check whether the program version
is
.QPG, and check the file contents to be
sure they are for a sequence program.

Check program configuration.

Check parameters and program configuration.

22 - 27

CPU Status:
Stop

QnA

22. TROUBLE SHOOTING

22.3.5 Error code list (3000 to 3999)

The following shows the error messages from the error code 3000 to 3999, the contents
and causes of the errors, and the corrective actions for the errors.
Error
Code

3000

Error Contents and Cause

[PARAMETER ERROR]
The PLC parameter settings for timer time limit
setting, the RUN-PAUSE contact, the common
pointer number, general data processing, number
of empty slots, system interrupt settings, baud rate
setting, and service processing setting are outside
the range that can be used by the CPU module.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/STOP

RUN/

At writing to progurammable controller

[PARAMETER ERROR]
The parameter settings in the error individual
information (special register SD16) are illegal.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/STOP

Corrective Action

Read the individual information of the error using

the peripheral device, check the parameter item
corresponding to the numerical value (parameter
No.), and correct it.
Rewrite corrected parameters to the CPU
module, reload the CPU power supply and/or
reset the module.
If the same error occurs, it is thought to be a
hardware error. (Contact your local Mitsubishi
representative.)

RUN/

LED Status
CPU Status

RUN:
Off
ERR.:
Flicker

At writing to progurammable controller

3001

CPU Status:
Stop

[PARAMETER ERROR]
The parameter settings are corrupted.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/STOP

RUN/

At writing to progurammable controller

3002

[PARAMETER ERROR]
When "Use the following file" is selected for the file
register in the PLC file setting of the PLC parameter
dialog box, the specified file does not exist although
the file register capacity has been set.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/STOP

RUN/

At writing to progurammable controller

Read the individual information of the error using

the peripheral device, check the parameter item
corresponding to the numerical value (parameter
No.), and correct it.
Rewrite corrected parameters to the CPU
module, reload the CPU power supply and/or
reset the module.
If the same error occurs, it is thought to be a
hardware error. (Contact your local Mitsubishi
representative.)

22 - 28

Corresponding
CPU

QnA

22. TROUBLE SHOOTING

Error
Code

Error Contents and Cause

[PARAMETER ERROR]
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
When an END instruction executed

3003

[PARAMETER ERROR]
The number of devices set at the PLC parameter
device settings exceeds the possible CPU module
range.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
At power-On/At reset/STOP

Corrective Action

LED Status
CPU Status

Corresponding
CPU

Read the individual information of the error using

the peripheral device, check the parameter item
corresponding to the numerical value (parameter
No.), and correct it.
If the error is still generated following the
correction of the parameter settings, the possible
cause is the memory errorm of the CPU module's
built-in RAM or program memory or the memory
card. (Contact your local Mitsubishi
representative.)

RUN/

At writing to progurammable controller

3004

[PARAMETER ERROR]
The parameter file is incorrect.
Alternatively, the contents of the file are not
parameters.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
At power-On/At reset/STOP

Check whether the parameter file version

is
.QPA, and check the file contents to be
sure they are parameters.

RUN/

At writing to progurammable controller

3100

[LINK PARA. ERROR]

Although the QnACPU is a control station or master
station, the network parameters have not been
written.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/STOP

3101

3102

RUN

[LINK PARA. ERROR]

The network No. specified by a network
parameter is different from that of the actually
mounted network.
The head I/O No. specified by a network
parameter is different from that of the actually
mounted I/O unit.
The network class specified by a network
parameter is different from that of the actually
mounted network.
The network refresh parameter of the
MELSECNET/H, MELSECNET/10 is out of the
specified area.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/STOP

Check the network parameters and mounting

status, and if they differ, match the network
parameters and mounting status.
If any network parameter has been corrected,
write it to the CPU module.
Confirm the setting of the number of extension
stages of the extension base units.
Check the connection status of the extension
base units and extension cables.
When the GOT is bus-connected to the main
base unit and extension base units, also check
their connection status.
If the error occurs after the above checks, the
cause is a hardware fault. (Contact your local
Mitsubishi representative, explaining a detailed
description of the problem.)

RUN

[LINK PARA. ERROR]

The network module detected a network
parameter error.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/STOP

Correct and write the network parameters.

If the error occurs after correction, it suggests a
hardware fault. (Contact your local Mitsubishi
representative.)

Correct and write the network parameters.

If the error occurs after correction, it suggests a
hardware fault. (Contact your local Mitsubishi
representative.)

RUN*3

22 - 29

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

QnA

22. TROUBLE SHOOTING

Error
Code

Error Contents and Cause

Corrective Action

LED Status
CPU Status

Corresponding
CPU

[LINK PARA. ERROR]

Although the number of modules has been set to
one or greater number in the Ethernet network
parameter setting, the number of actually
mounted module is zero.
The start I/O No. of the Ethernet network
parameter differs from the I/O No. of the actually
mounted module.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing
3103

At power ON/At reset/STOP

At power ON/At reset/STOP

3104

RUN

RUN:
Off
ERR.:
Flicker

Write after correcting parameters.

RUN

[LINK PARA. ERROR]

The CC-Link parameter setting is incorrect.
The set mode is not allowed for the version of the
mounted CC-Link module.
Collateral informationmmon
Common Information:File name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/STOP

CPU Status:
Stop

RUN

[LINK PARA. ERROR]

The contents of the Ethernet parameter are
incorrect.
Collateral informationmmon
Common Information:File name / Drive name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/STOP

3107

Correct and write the network parameters.

If the error occurs after correction, it suggests a
hardware fault. (Contact your local Mitsubishi
representative.)

[LINK PARA. ERROR]

The Ethernet and MELSECNET/10 use the same
network number.
The network number, station number or group
number set in the network parameter is out of
range.
The specified I/O number is outside the range of
the used CPU module.
The Ethernet-specific parameter setting is not
normal.
Collateral informationmmon
Common Information:File name / Drive name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/STOP

3105

RUN

[LINK PARA. ERROR]

AJ71QE71 does not exist in the position of I/O
number set by the parameter.
I/O number designation is overlapping.
Numbers of the network parameter and loaded
AJ71QE71 are different.
Ethernet (parameter + dedicated instruction) is
set to more than five.
Collateral informationmmon
Common Information:File name/Drive name
Individual Information:Parameter number
Diagnostic Timing

Check the parameter setting.

RUN

22 - 30

QnA

22. TROUBLE SHOOTING

Error
Code

3200

Error Contents and Cause

RUN

[SFC PARA. ERROR]

The number of step relays specified in the device
setting of the PLC parameter dialog box is less than
that used in the program.
Collateral informationmmon
Common Information:File name
Individual Information:Parameter number
Diagnostic Timing
STOP

3203

Read the common information of the error using

the peripheral device, check error step
corresponding to its numerical value (program error
location), and correct the problem.

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

RUN

[SFC PARA. ERROR]

The execution type of the SFC program specified in
the program setting of the PLC parameter dialog
box is other than scan execution.
Collateral informationmmon
Common Information:File name
Individual Information:Parameter number
Diagnostic Timing
At power ON/At reset/STOP

*3

Corresponding
CPU

RUN

[SFC PARA. ERROR]

The block parameter setting is illegal.
Collateral informationmmon
Common Information:File name
Individual Information:Parameter number
Diagnostic Timing
STOP

3202

LED Status
CPU Status

[SFC PARA. ERROR]

The parameter setting is illegal.
Though Block 0 was set to "Automatic start" in
the SFC setting of the PLC parameter dialog box,
Block 0 does not exist.
Collateral informationmmon
Common Information:File name
Individual Information:Parameter number
Diagnostic Timing
STOP

3201

Corrective Action

RUN

The diagnostic timing of CPU modules except for Universal QCPU can be performed only when switching the CPU modules to run.

22 - 31

QnA

22. TROUBLE SHOOTING

22.3.6 Error code list (4000 to 4999)

The following shows the error messages from the error code 4000 to 4999, the contents
and causes of the errors, and the corrective actions for the errors.
Error
Code

4000

Error Contents and Cause

Corrective Action

LED Status
CPU Status

Corresponding
CPU

[INSTRCT. CODE ERR]

The program contains an instruction code that
cannot be decoded.
An unusable instruction is included in the
program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
At power ON/At reset/STOP

RUN

When instruction executed

4001

[INSTRCT. CODE ERR]

The program contains a dedicated instruction for
SFC although it is not an SFC program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
At power ON/At reset/STOP

RUN

When instruction executed

4002

[INSTRCT. CODE ERR]

The name of dedicated instruction specified by
the program is incorrect.
The dedicated instruction specified by the
program cannot be executed by the specified
module.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
At power ON/At reset/STOP

Read the common information of the error using a

peripheral device, check error step corresponding
to its numerical value (program error location), and
correct the problem.

RUN

When instruction executed

4003

[INSTRCT. CODE ERR]

The number of devices for the dedicated instruction
specified by the program is incorrect.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
At power ON/At reset/STOP

RUN

When instruction executed

4004

[INSTRCT. CODE ERR]

The device which cannot be used by the dedicated
instruction specified by the program is specified.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
At power ON/At reset/STOP

RUN

When instruction executed

22 - 32

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

QnA

22. TROUBLE SHOOTING

Error
Code

4010

Error Contents and Cause

RUN

[CAN'T SET(P)]
The common pointer Nos. assigned to files
overlap.
The local pointer Nos. assigned to files overlap.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
At power ON/At reset/STOP

4030

Read the common information of the error using a

peripheral device, check error step corresponding
to its numerical value (program error location), and
correct the problem.

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

RUN

[CAN'T SET(I)]
The allocation pointer Nos. assigned by files
overlap.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
At power ON/At reset/STOP

QnA

RUN

4100

[OPERATION ERROR]
The instruction cannot process the contained data.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

4101

[OPERATION ERROR]
The number of setting data dealt with the
instruction exceeds the applicable range.
The storage data and constant of the device
specified by the instruction exceeds the
applicable range.
When writing to the host CPU shared memory,
the write prohibited area is specified for the write
destination address.
The range of storage data of the device specified
by the instruction is duplicated.
The device specified by the instruction exceeds
the range of the number of device points.
The interrupt pointer No. specified by the
instruction exceeds the applicable range.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

*1

Corresponding
CPU

RUN

[CAN'T SET(P)]
The total number of internal file pointers used by
the program exceeds the number of internal file
pointers set in the parameters.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
At power ON/At reset/STOP

4021

LED Status
CPU Status

[MISSING END INS.]

There is no END (FEND) instruction in the
program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
At power ON/At reset/STOP

4020

Corrective Action

Read the common information of the error using

the peripheral device, check error step
corresponding to its numerical value (program error
location), and correct the problem.

RUN:
Off/On
ERR.:
Flicker/On
CPU Status:
Stop/
Continue*1

CPU operation can be set in the parameters at error occurrence. (LED indication varies.)

22 - 33

22. TROUBLE SHOOTING

Error
Code

Error Contents and Cause

Corrective Action

LED Status
CPU Status

Corresponding
CPU

[OPERATION ERROR]
The network No. or station No. specified for the
dedicated instruction is wrong.
The link direct device (J \ ) setting is incorrect.
4102

4103

The module No./ network No./number of

character strings exceeds the range that can be
specified.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

Read the common information of the error using

the peripheral device, check error step
corresponding to its numerical value (program error
location), and correct the problem.

[OPERATION ERROR]
The configuration of the PID dedicated instruction
is incorrect.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

RUN:
Off/On
ERR.:
Flicker/On

[OPERATION ERROR]
The number of settings is beyond the range.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

Read the common information of the error using

peripheral device, and check and correct the
program corresponding to that value (program error
location).

4107

[OPERATION ERROR]
Numbers of execution to the CC-Link instruction
are beyond 32.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

Set the numbers of execution to the CC-Link

instruction to 32 or less.

4108

[OPERATION ERROR]
The CC-Link parameter is not set when the CCLink instruction is executed.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

Execute the CC-Link instruction after setting the

CC-Link parameter.

4104

4200

*1

[FOR NEXT ERROR]

No NEXT instruction was executed following the
execution of a FOR instruction.
Alternatively, there are fewer NEXT instructions
than FOR instructions.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

QnA

Read the common information of the error using

the peripheral device, check error step
corresponding to its numerical value (program error
location), and correct the problem.

CPU operation can be set in the parameters at error occurrence. (LED indication varies.)

22 - 34

CPU Status:
Stop/

Q4AR

*1

Continue

QnA

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

22. TROUBLE SHOOTING

Error
Code

Error Contents and Cause

Corrective Action

4201

[FOR NEXT ERROR]

A NEXT instruction was executed although no FOR
instruction has been executed.
Alternatively, there are more NEXT instructions
than FOR instructions.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

Read the common information of the error using

the peripheral device, check error step
corresponding to its numerical value (program error
location), and correct the problem.

4202

[FOR NEXT ERROR]

More than 16 nesting levels are programmed.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

Keep nesting levels at 16 or under.

4203

[FOR NEXT ERROR]

A BREAK instruction was executed although no
FOR instruction has been executed prior to that.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

4210

[CAN'T EXECUTE(P)]
The CALL instruction is executed, but there is no
subroutine at the specified pointer.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

4211

[CAN'T EXECUTE(P)]
There was no RET instruction in the executed
subroutine program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

4212

[CAN'T EXECUTE(P)]
The RET instruction exists before the FEND
instruction of the main routine program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

4213

[CAN'T EXECUTE(P)]
More than 16 nesting levels are programmed.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

LED Status
CPU Status

RUN:
Off
ERR.:
Flicker

Read the common information of the error using

the peripheral device, check error step
corresponding to its numerical value (program error
location), and correct the problem.

Keep nesting levels at 16 or under.

22 - 35

CPU Status:
Stop

Corresponding
CPU

QnA

22. TROUBLE SHOOTING

Error
Code

Error Contents and Cause

4220

[CAN'T EXECUTE(I)]
Though an interrupt input occurred, the
corresponding interrupt pointer does not exist.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

4221

[CAN'T EXECUTE(I)]
An IRET instruction does not exist in the executed
interrupt program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

4223

[CAN'T EXECUTE(I)]
The IRET instruction exists before the FEND
instruction of the main routine program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

4230

[INST. FORMAT ERR.]

The number of CHK and CHKEND instructions is
not equal.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

4231

[INST. FORMAT ERR.]

The number of IX and IXEND instructions is not
equal.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

4235

[INST. FORMAT ERR.]

The configuration of the check conditions for the
CHK instruction is incorrect.
Alternatively, a CHK instruction has been used in a
low speed execution type program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

4300

[EXTEND INST. ERR.]

The designation of a MELSECNET/MINI-S3 master
module control instruction was wrong.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

*1

Corrective Action

Read the common information of the error using

the peripheral device, check error step
corresponding to its numerical value (program error
location), and correct the problem.

LED Status
CPU Status

Corresponding
CPU

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop
QnA

Read the common information of the error using

the peripheral device, check error step
corresponding to its numerical value (program error
location), and correct the problem.

RUN:
Off/On
ERR.:
Flicker/On
CPU Status:
Stop/
Continue*1

CPU operation can be set in the parameters at error occurrence. (LED indication varies.)

22 - 36

22. TROUBLE SHOOTING

Error
Code

4301

4400

Error Contents and Cause

[EXTEND INST. ERR.]
The designation of an AD57/AD58 control
instruction was wrong.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

CPU Status:
Stop/
Write the program to the CPU module again using
GX Developer.

RUN

RUN

[CAN'T SET(S)]
Step number designations overlap in SFC program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
STOP

*1

RUN

RUN:
Off/On
ERR.:
Flicker/On

[CAN'T SET(S)]
Total number of steps in all SFC programs exceed
the maximum.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
STOP

4422

RUN

[CAN'T SET(S)]
A step number designated in an SFC program
exceeds the range.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
STOP

4421

Read the common information of the error using

the peripheral device, check error step
corresponding to its numerical value (program error
location), and correct the problem.

RUN

[CAN'T SET(BL)]
Block number designations overlap in SFC
program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
STOP

4420

Corresponding
CPU

[CAN'T SET(BL)]
The block number designated by the SFC program
exceeds the range.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
STOP

4411

LED Status
CPU Status

[SFCP. CODE ERROR]

No SFCP or SFCPEND instruction in SFC
program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
STOP

4410

Corrective Action

RUN

CPU operation can be set in the parameters at error occurrence. (LED indication varies.)

22 - 37

Continue*1

QnA

22. TROUBLE SHOOTING

Error
Code

4500

Error Contents and Cause

*1

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

RUN

QnA
Write the program to the CPU module again
using GX Developer.
Read the common information of the error using
GX Developer, and check and correct the error
step corresponding to that value (program error
location).

RUN

[SFCP. FORMAT ERR.]

The structure of the SFC program is illegal.
The step specified in the TAND instruction does
not exist.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
STOP

4600

RUN

[SFCP. FORMAT ERR.]

The structure of the SFC program is illegal.
The step specified in the TSET instruction does
not exist.
In jump transition, the host step number was
specified as the destination step number.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
STOP

4504

Write the program to the CPU module again using

the peripheral device.

[SFCP. FORMAT ERR.]

The structure of the SFC program is illegal.
STEPI* instruction does not exist in the block of
the SFC program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
STOP

4503

Corresponding
CPU

RUN

[SFCP. FORMAT ERR.]

The configuration of the STEP* to TRAN* to TSET
to SEND instructions in the SFC program is
incorrect.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
STOP

4502

LED Status
CPU Status

[SFCP. FORMAT ERR.]

The numbers of BLOCK and BEND instructions in
an SFC program are not equal.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
STOP

4501

Corrective Action

Write the program to the CPU module again using

GX Developer.

RUN

[SFCP. OPE. ERROR]

The SFC program contains data that cannot be
processed.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

Read common information of the error using the

peripheral device, check error step corresponding
to its numerical value (program error location), and
correct the problem.

RUN:
Off/On
ERR.:
Flicker/On
CPU Status:
Stop/
Continue*1

CPU operation can be set in the parameters at error occurrence. (LED indication varies.)

22 - 38

22. TROUBLE SHOOTING

Error
Code

4601

4602

4610

Error Contents and Cause

[SFCP. OPE. ERROR]
Exceeds device range that can be designated by
the SFC program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed
[SFCP. OPE. ERROR]
The START instruction in an SFC program is
preceded by an END instruction.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed
[SFCP. EXE. ERROR]
The active step information at presumptive start of
the SFC program is incorrect.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
STOP

4611

STOP

4620

4621

*1

RUN

[SFCP. EXE. ERROR]

Key-switch was reset during RUN when
presumptive start was designated for SFC
program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing

Corrective Action

Read common information of the error using the

peripheral device, check error step corresponding
to its numerical value (program error location), and
correct the problem.

LED Status
CPU Status

RUN:
Off/On
ERR.:
Flicker/On
CPU Status:
Stop/
Continue*1

Read common information of the error using the

peripheral device, check error step corresponding
to its numerical value (program error location), and
correct the problem.
The program is automatically subjected to an initial
start.

RUN:
On
ERR.:
On
CPU Status:
Continue

RUN

[BLOCK EXE. ERROR]

Startup was executed at a block in the SFC
program that was already started up.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed
[BLOCK EXE. ERROR]
Startup was attempted at a block that does not exist
in the SFC program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

Corresponding
CPU

Read common information of the error using the

peripheral device, check error step corresponding
to its numerical value (program error location), and
correct the problem.

Read the common information of the error using

GX Developer, and check and correct the error
step corresponding to that value (program error
location).
Turn ON if the special relay SM321 is OFF.

CPU operation can be set in the parameters at error occurrence. (LED indication varies.)

22 - 39

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

QnA

22. TROUBLE SHOOTING

Error
Code

Error Contents and Cause

4630

[STEP EXE. ERROR]

Startup was executed at a block in the SFC
program that was already started up.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

4631

[STEP EXE. ERROR]

Startup was attempted at the step that does not
exist in the SFC program.
Or, the step that does not exist in the SFC
program was specified for end.
Forced transition was executed based on the
transition condition that does not exit in the SFC
program.
Or, the transition condition for forced transition
that does not exit in the SFC program was
canceled.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

4632

4633

Corrective Action

LED Status
CPU Status

Corresponding
CPU

Read common information of the error using the

peripheral device, check error step corresponding
to its numerical value (program error location), and
correct the problem.

Read the common information of the error using

the peripheral device, and check and correct the
error step corresponding to that value (program
error location).
Turn ON if the special relay SM321 is OFF.

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

[STEP EXE. ERROR]

There were too many simultaneous active steps in
blocks that can be designated by the SFC program.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Read common information of the error using the
Diagnostic Timing
When instruction executed
peripheral device, check error step corresponding
to its numerical value (program error location), and
[STEP EXE. ERROR]
There were too many simultaneous active steps in correct the problem.
all blocks that can be designated.
Collateral informationmmon
Common Information:Program error location
Individual Information:
Diagnostic Timing
When instruction executed

22 - 40

QnA

22. TROUBLE SHOOTING

22.3.7 Error code list (5000 to 5999)

The following shows the error messages from the error code 5000 to 5999, the contents
and causes of the errors, and the corrective actions for the errors.
Error
Code

5000

5001

5010

5011

Error Contents and Cause

Corrective Action

[WDT ERROR]
The scan time of the initial execution type
program exceeded the initial execution
monitoring time specified in the PLC RAS setting
of the PLC parameter.
Collateral informationmmon
Common Information:Time (value set)
Individual Information:Time (value actually
measured)
Diagnostic Timing
Always

Read the individual information of the error from

the peripheral device, check its value (time), and
shorten the scan time.
Change the initial execution monitoring time or
the WDT value in the PLC RAS setting of the
PLC parameter.
Resolve the endless loop caused by jump
transition.

[WDT ERROR]
The scan time of the program exceeded the
WDT value specified in the PLC RAS setting of
the PLC parameter.
Collateral informationmmon
Common Information:Time (value set)
Individual Information:Time (value actually
measured)
Diagnostic Timing
Always

Read the individual information of the error from

the peripheral device, check its value (time), and
shorten the scan time.
Change the initial execution monitoring time or
the WDT value in the PLC RAS setting of the
PLC parameter.
Resolve the endless loop caused by jump
transition.
Check the number of interrupt program
executions with the peripheral device and reduce
the number of interrupts.

[PRG. TIME OVER]

The program scan time exceeded the constant
scan setting time specified in the PLC RAS setting
of the PLC parameter.
Collateral informationmmon
Common Information:Time (value set)
Individual Information:Time (value actually
measured)
Diagnostic Timing
Always
[PRG. TIME OVER]
The low speed program execution time specified in
the PLC RAS setting of the PLC parameter
exceeded the excess time of the constant scan.
Collateral informationmmon
Common Information:Time (value set)
Individual Information:Time (value actually
measured)
Diagnostic Timing
Always
[PRG. TIME OVER]
The scan time of the low speed execution type
program exceeded the low speed execution watch
time specified in the PLC RAS setting of the PLC
parameter dialog box.
Collateral informationmmon
Common Information:Time (value set)
Individual Information:Time (value actually
measured)
Diagnostic Timing
Always

LED Status
CPU Status

Corresponding
CPU

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

QnA

Review the constant scan setting time.

Review the constant scan setting time and low
speed program execution time in the PLC
parameter so that the excess time of constant
scan can be fully secured.

RUN:
On
ERR.:
On
CPU Status:
Continue

Read the individual information of the error using

the peripheral device, check the numerical value
(time) there, and shorten scan time if necessary.
Change the low speed execution watch time in the
PLC RAS setting of the PLC parameter dialog box.

22 - 41

22. TROUBLE SHOOTING

22.3.8 Error code list (6000 to 6999)

The following shows the error messages from the error code 6000 to 6999, the contents
and causes of the errors, and the corrective actions for the errors
Error
Code

6000

6010

6100

Error Contents and Cause

Corrective Action

[PRG. VERIFY ERR.]

The control system and standby system in the
redundant system do not have the same programs
and parameters.
(This can be detected from the standby system of
the redundant system.)
Collateral informationmmon
Common Information:File name
Individual Information:
Diagnostic Timing
Always

Synchronise the programs and parameters of the

control system and standby system.

[MODE. VERIFY ERR.]

The operational status of the control system and
standby system in the redundant system is not the
same.
(This can be detected from the standby system of
the redundant system.)
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
Always

Synchronise the operation statuses of the control

system and standby system.

[TRUCKINERR.]
A CPU module tracking memory error was detected
during initial.
(This can be detected from the control system or
standby system of the redundant system.)
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
At power ON/At reset/STOP

LED Status
CPU Status

RUN:
Off
ERR.:
Flicker
CPU Status:
Stop

Hardware fault of the CPU module. (Please contact

your local nearest Mitsubishi or sales
representative, explaining a detailed description of
the problem. Change the CPU modules in order of
the standby system CPU module and control
system CPU module.)

RUN:
On
ERR.:
On
CPU Status:
Continue

RUN

6101

[TRUCKIN ERR.]
The CPU module detected an error during the
handshake for tracking.
(This can be detected from the control system or
standby system of the redundant system.)
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
When an END instruction executed

6200

[CONTROL EXE.]
The standby system in a redundant system is
switched to the control system.
(This can be detected from the standby system of
the redundant system.)
Collateral informationmmon
Common Information:Reason(s) for system
switching
Individual Information:
Diagnostic Timing
Always

Corresponding
CPU

Check the condition of the other stations.

Check the control system condition.

RUN:
On
ERR.:
Off
CPU Status:
Continue

22 - 42

Q4AR

22. TROUBLE SHOOTING

Error
Code

6210

6220

Error Contents and Cause

Corrective Action

[CONTROL WAIT ]
The control system in a redundant system is
switched to the standby system.
(This can be detected from the standby system of
the redundant system.)
Collateral informationmmon
Common Information:Reason(s) for system
switching
Individual Information:
Diagnostic Timing
Always

Check the control system condition.

[CAN'T EXE. CHANGE]

Since the standby system is in an error or similar
status in the redundant system, the control
system cannot be switched to the standby
system.
When an attempt was made to execute system
switching, the control system could not be
switched to the standby system due to a network
error of the control system.
(This can be detected from the control system of
the redundant system.)
Collateral informationmmon
Common Information:Reason(s) for system
switching
Individual Information:
Diagnostic Timing
At switching request

Check the standby system condition.

LED Status
CPU Status

Corresponding
CPU

RUN:
On
ERR.:
Off
CPU Status:
Continue

Q4AR
RUN:
On
ERR.:
On

6221

[CAN'T EXE. CHANGE]

Switching is disabled because of a bus switching
module error.
(This can be detected from the control system of
the redundant system.)
Collateral informationmmon
Common Information:Reason(s) for system
switching
Individual Information:
Diagnostic Timing
At switching request

This is a bus switching module hardware fault.

(Contact your local Mitsubishi representative.)

6230

[DUAL SYS. ERROR]

The link module mounted on the standby system
CPU module is the remote master station.
Collateral informationmmon
Common Information:
Individual Information:
Diagnostic Timing
Always

Check the system configuration status.

CPU Status:
Continue

22 - 43

22. TROUBLE SHOOTING

22.3.9 Error code list (7000 to 10000)

The following shows the error messages from the error code 7000 to 10000, the
contents and causes of the errors, and the corrective actions for the errors.
Error
Code

Error Contents and Cause

Corrective Action

LED Status
CPU Status

Corresponding
CPU

RUN:
On
ERR.:

9000

[F**** ]
Annunciator (F) was set ON
Collateral informationmmon
Common Information:Program error location
Individual Information:Annunciator number
Diagnostic Timing
When instruction executed

On/Off *2
Read the individual information of the error using
the peripheral device, and check the program
corresponding to the numerical value (annunciator
number).

CPU Status:
Continue
RUN:
USER LED On
ERR.:
USER LED On
CPU Status:
Continue

9010

[<CHK>ERR ***-***]
Error detected by the CHK instruction.
Collateral informationmmon
Common Information:Program error location
Individual Information:Failure No.
Diagnostic Timing
When instruction executed

RUN:
On
ERR.:
Off
Read the individual information of the error using
the peripheral device, and check the program
corresponding to the numerical value (error
number) there.

QnA

CPU Status:
Continue
RUN:
USER LED On
ERR.:
USER LED On
CPU Status:
Continue

*2

For the Basic model QCPU, the special register (SD207 to DS209) for LED indication priority can turn off the indication. (The LED indication is always OFF
for the High Performance model QCPU, Process CPU, Redundant CPU, and Universal model QCPU.)

22 - 44

22. TROUBLE SHOOTING

22.3.10 Canceling of Errors

Q series CPU module can perform the cancel operation for errors only when the
errors allow the CPU module to continue its operation.
To cancel the errors, follow the steps shown below.
1) Eliminate the cause of the error.
2) Store the error code to be canceled in the special register SD50.
3) Energize the special relay SM50 (OFF ON).
4) The error to be canceled is canceled.
After the CPU module is reset by the canceling of the error, the special relays, special
registers, and LEDs associated with the error are returned to the status under which
the error occurred.
If the same error occurs again after the cancellation of the error, it will be registered
again in the error history.
When multiple enunciators(F) detected are canceled, the first one with No. F only is
canceled.
Refer to the following manual for details of error canceling.
QCPU User's Manual (Function Explanation, Program Fundamentals)

POINT

(1) When the error is canceled with the error code to be canceled stored in the SD50,
the lower one digit of the code is neglected.
(Example)
If error codes 2100 and 2101 occur, and error code 2100 to cancel error code 2101.
If error codes 2100 and 2111 occur, error code 2111 is not canceled even if error
code 2100 is canceled.
(2) Errors developed due to trouble in other than the CPU module are not canceled
even if the special relay (SM50) and special register (SD50) are used to cancel the
error.
(Example)
Since "SP. UNIT DOWN" is the error that occurred in the base unit (including the
extension cable), intelligent function module, etc. the error cause cannot be
removed even if the error is canceled by the special relay (SM50) and special
register (SD50).
Refer to the error code list and remove the error cause.

22 - 45

22. TROUBLESHOOTING

22.4 Resetting Errors

The CPU module allows error resetting only for the errors that does not block the CPU
module operation.
The procedure for resetting an error is as follows.
1) Eliminate the cause of the error.
2) Store the error code to be reset to special register SD50.
3) Switch special relay SM50 from OFF to ON.
4) The error is reset.
If the CPU module is returned with the error reset, the special relay and special register
relating to the error, and the LED/LED indicator return to their state before the error
occurred.
If the same error occurs again after the error has been reset, it is recorded in breakdown
history again.
To reset multiple detected annunciators, only the first detected F number is reset.
POINT

When storing the error code to be reset in SD50 at error reset, the lower one digit
of the code number is ignored.
Example:
When error codes 2100 and 2101 occurred, resetting of error code 2100 results in
also resetting of error code 2101.
When error codes 2100 and 2111 occurred, resetting of error code 2100 does not
result in resetting of error code 2111.

22 - 46

22. TROUBLESHOOTING

22.5 Fault Examples with I/O Modules

Examples of faults concerning I/O circuits and the corrective actions are explained.
22.5.1 Faults with the input circuit and the corrective actions
The following is an input-circuit fault example and its corrective action.

Table 22.2 Faults with the input circuit and the corrective actions
Situation

Cause

Countermeasure

Leakage current of input switch (driven by

contactless switch, etc.)

modules terminal to terminal voltage is under

the OFF voltage value.

AC input

Example The input signal does

1

Connect the proper resistor so that the input

AC input

not turn off.

Leakage
current

Input
module

Recommend

Power supply

Input
module

0.1 to 0.47F + 47 to 120

(1/2W) for

CRs constant.

Drive by limit switch with neon lamp

AC input
Example The input signal does
2

not turn off.

Leakage
current

Same as the example 1.

Or, provide a totally independent display
circuit separately.

Input
module

Power supply
Line capacity C of the leak current
twisted pair cable due to line capacity
of the wiring cable is about 100PF/m.
Example The input signal does
3

Same as the example 1.

However, leakage current does not occur
when a power supply is on the side of input
device as shown below.

AC input

AC input

not turn off.

Leakage
current

Input
module

Power supply

Input
module
Power supply

Driven by a switch with LED indication

Connect an appropriate resistance so that

voltage between the terminal of the input
module and the common is lower than the
OFF voltage as shown below.

DC input (sink)

DC input (sink)

Example The input signal does

not turn off.

Leakage current

Input
module

Resister

Input
module

* An example of calculation of resistor to be connected

is provided on the following page.

22 - 47

22. TROUBLESHOOTING

Table 22.2 Faults with the input circuit and the corrective actions
Situation

Cause

Countermeasure
Use only one power supply.

Sneak path due to the use of two power

Connect revolving path preventive diode

supplies.

(figure below).

DC input
Example The input signal does
5

DC input

not turn off.

E1

Input
module

E2

E1
E1

E2

Input
module

E2

<Sample calculation for Example 4>

When a switch with LED indicator, giving leaking current of 3mA at maximum when
24VDC power is supplied to the A1SX40.
A1SX40

Leakage current 3mA

Input module

24VDC

(1)

1mA or less OFF current of the A1SX40 is not satisfied. Hence, connect a resistor as
shown below.
A1SX40

3mA

IR=2mA

IZ=1mA
Input impedance
3.3k

24VDC

(2)

Calculate the resistance value R as shown below.

To satisfy 1mA or less OFF current of the A1SX40, connect a resistor which flows
2mA or more.
IR :IZ=Z(Input impedance):R

IZ
IR

Z(Input impedance)

1.0
2.0

Supposing that the resistance R is 1.5k

W = (Input

voltage)2/R

26.42/1500

3.3 1.65[k ]
, the power capacity W of resistor R is:

= 0.465 [W]

(3)

Connect a resistor of 1.5(k ) and 2 to 3(W) to a terminal which may cause an error,
since the power capacity of a resistor is selected so that it will be 3 to 5 times greater
than the actual power consumption.

(4)

Also,OFF voltage when resistor R is connected will be as follows.

1
1
1
+
1.5[k ]
3.3[k ]

3[mA] = 3.09[V]

This satisfies 4V or less OFF voltage of A1SX40.

22 - 48

22. TROUBLESHOOTING

22.5.2 Faults in the output circuit

Faults concerning output circuits and the corrective actions are explained.
Table22.3 Faults in the output circuit
Situation

Cause

Countermeasure

When the load is subjected to half wave

Connect a resistor at several tens

rectification inside
(Solenoids have these types.)

several hundred of k

to

to the both ends of

the load.
A1SY22
Output module

[1]

D1

An excessive voltage is
Example applied to the load when
1

With this kind of usage, there is no problem

with the output element, but the diode builtin to the load may deteriorate and burn-out.

Load

output is off.
[2]

(Triac output)

When the polarity of the power supply is (1), C

is charged, and when the polarity is (2), the
voltage charged in C + voltage of the power
supply are applied to the both ends of D1.
The maximum value of the voltage is about
2.2E.
Connect a resistor to the both ends of the
Leak current caused by built-in noise supressor

Example Load does not turn OFF.

2

A1SY22
Output module

load.
If the wire distance from the output module to the
load is great, then it may have leakage current by
line capacity. It is necessary to take precautions.

Load

(Triac output)
Leakage current

22 - 49

22. TROUBLESHOOTING

Table22.3 Faults in the output circuit

Situation

Cause

Countermeasure

The load current is lower than the minimum

load current.

Connect a resistor to both ends of a load so

that the load current is higher than the
minimum load current.

Surge suppressor

A1SY22
Output module

Resistor

Phototriac

Load

Control
circuit

Example
3

Load

The load is not turned

OFF.
(Triac output)
Triac

When the load current is lower than the

minimum load current of the output module, the
triac does not operate since the load current
flows into a phototriac as shown below.
When an inductive load is connected, the load
may not be turned OFF since surge at the time
of OFF is applied to the phototriac.
Leakage current due to surge suppressor for

Disconnect the surge suppressor from

across the loads, leaving only the

the load.

resistance.
Example
4

Load turns OFF with a

delay.
(Triac output)

R
High-frequency
current

A1SY22

If the wire distance from the output module to the

load is great, then it may have leakage current by
line capacity. It is necessary to take precautions.

Output module

Resistance

Load

Guideline of resistance.
For 100VAC
5 to 10K , 5 to 3W
For 200VAC
10 to 20K , 15 to 10W

Connect a resistance between the CR timer

terminals.
In some timers, internal circuit may be

A1SY22
Output module

CR
timer

half wave rectification type, so the caution

as to the example 1 is necessary here.
If the wire distance from the output

When load is CR type

Leakage current

Example timer, the time limit

5

module to the load is great, then it may

have leakage current by line capacity. It is

fluctuates.

necessary to take precautions.

(Triac output)
The constant value
of resistor should be
calculated
according to the
load.

22 - 50

22. TROUBLESHOOTING

Table22.3 Faults in the output circuit

Situation

Cause

Countermeasure
Use only one power supply.

Sneak path due to the use of two power

Connect a diode for a sneak path.

supplies.

When a relay or similar load is used, a

A1SY40,41,42

Load does not turn OFF.

Example

Transistor

output with

Output module

free-wheel diode must be connected

12/24V

across the load.

(Shown by dotted line in the figure at left)

Load

E1

clamp diode

E2
0V

Sneak path occurs when E1

E2.

Incorrect output by parasitic transistor (Tr4)

When an external switch

is connected in parallel
between the output and
common, the voltage
between Y1 and COM1
drops to between 0 and
24V even though the
output Y1 which is not
connected to the
Example external switch is OFF.
7

Especially when the load

L2 is relatively small,
(Load current of several
mA only) such as LED
lamps and
photocouplers, the
outputs drop.
A1SY40
A1SY41
A1SY42

Y2 can turn the load L3 on either from a PC or

As shown above, connect diode D2 of IF = 1A

PB.

class to output Y2 which is connected to an

When PB is ON, Y0 is ON with a PC, and Y1 is

external switch.

OFF:

(This revents currents (3) and (4) from

(1) L1(current (a)) and L3 (current (b)) turn ON.

flowing.)

(2) A potential difference to COM1occurs in the

However, check the operation voltage of L3 as

emitter E of Tr1 to Tr3 since diode D1 is

the amount of voltage drop of Y2 at power ON

connected between COM1 and the emitter.

increases for 0.6 to 1V.

(3) The transistors A1SY40 to 42, etc., are

accompanied by a parasitic transistor (Tr4).
(4) The potential difference described in (2)
above is supplied between the base (B) of Tr4
and emitter (E), which causes the base
current (c) to flow.(Tr4 turns ON.)
(5) The current in (4) causes the collector current
(d) to flow, and voltage Y1 drops to between 0
and 24V.

22 - 51

22. TROUBLESHOOTING

Table22.3 Faults in the output circuit

Situation

Cause

Countermeasure

Incorrect output due to the floating capacitance

(1) After checking the external supply power

(C) between the collector and emitter of the

takes at least 10ms to start up when turned

photocoupler

it ON/OFF, set the switch SW1 at the

primary side of the external supply power.

This does not affect normal loads, but in

case of highly sensitive loads (such as solid
state relays ), incorrect outputs may occur.
Photocoupler

(2) If setting the switch at the secondary side

Output module, Combined module

of the external supply power is required,

Photocoupler
C

connect a capacitor and resistor so that the

Tr1

IC

start-up of the power is slowly performed

Y0

(Longer than 10ms).

Y0

CTL+
Constant
voltage circuit

24V

The load is momentarily

Example
8

SW

COM-

turned ON when the

external supply power is
started up.
(Transistor output)

R1

CTL+

(1) If the external supply power is suddenly

COM-

capacitance (C) between the collector and

24V

emitter of the photocoupler.

(2) Current Ic flows to the base of transistor Tr1in
the next stage, and output Y0 turns ON for

*1

R1: Number +
Power capacity

about 500 s.

SW

C1

started up, current Ic flows due to the floating

*2

(External supply power current)2

Resistive value (3 to 5)
C1: Several hundreds of

F, 50 mV

*1 For the current consumption of the external supply

power, refer to the manual attached to the module
to be used.
*2 Select the resistance for power capacity in the
range of between 3 and 5 times higher than the
actual power consumption.
Example:
R1 = 40

, C1 = 300

Calculate the time constant as follows:

C1

R1

= 300

10-6

= 12

10-3S

=12ms

22 - 52

40

22. TROUBLESHOOTING

Table22.3 Faults in the output circuit

Situation

Cause

Countermeasure

The load [2] which was turned OFF may be

To prevent the generation of the back

turned ON due to back electromotive force at the

electromotive force, connect diode in parallel

time of power-off [1] if an inductive load is used.

with load where the back electromotive force

has been generated.

Output module,
ombined module

[3]
Back electromotive
force

Source output
ON

Source output
[3]

Load

TB1 ON

Back electromotive
force

[2]
TB2 OFF

Load

OFF
[1]
Shut off

The load which was

Example
9

Load

Sink output
[3]

COM+

turned OFF is turned ON

for a moment at power-

CTL-

off.

Back electromotive
force

(Transistor output)

Load
Output module,
ombined module

[3]
Back electromotive
force

Sink output
ON

Load

TB1 ON
[2]
TB2 OFF

OFF

Load

[1]
Shut off
COMCTL+

22 - 53

APPENDICES

APPENDICES
APPENDIX 1 INSTRUCTION LIST
For details on SFC-related instructions, refer to the QnACPU Programming Manual (SFC).
Appendix 1.1

Sequence Instructions
(1)

Classification

Contact instructions
Symbol

Description

Logical operation start (N/O contact logical operation start)

Logical NOT operation start (N/C contact logical operation start)

Logical product (N/O contact series connection)

Logical product NOT (N/C contact series connection)

Logical sum (N/O contact parallel connection)

Logical sum NOT (N/C contact parallel connection)

Contact
Rising edge pulse operation start

Falling edge pulse operation start

Rising edge pulse series connection

Falling edge pulse series connection

Rising edge pulse parallel connection

Falling edge pulse parallel connection

App - 1

APPENDICES

(2)
Classification

Association commands
Symbol

Description

ANDs logical blocks (series connection of blocks).

ORs logical blocks (parallel connection of blocks).

Stores the operation result.

Reads the operation result from MPS.
Reads the operation result from MPS and clears the result.

Inverts the operation result.

Association

Converts the operation result to a rising edge pulse.

Converts the operation result to falling edge pulse.

Converts the operation result to rising edge pulse (stored at Vn).

Converts the operation result to falling edge pulse (stored at Vn).

App - 2

APPENDICES

(3)

Output instructions

Classification

Symbol

Description

Device output

Sets a device.*

Resets a device.

Generates one-program cycle pulse at the rising edge of an input

Output

signal.
Generates one-program cycle pulse at the falling edge of an input
signal.

Inverts device output.

Converts a direct output to pulse.

(4)
Classification

When specifying input (X) for the target device, specify the device number out of the actual
input (X) range.

Shift instructions
Symbol

Shift

Description

Shifts a device 1 bit.

(5)
Classification

Master control instructions

Symbol

Description

Master control start

Master control
Master control reset

App - 3

APPENDICES

(6)
Classification

End instructions
Symbol

Description

Ends the main program.

Program end
Ends the sequence program.

(7)
Classification

Other instructions
Symbol

Description
Stops sequence operation when the input condition is met.

Stop

Sequence program execution can be resumed by turning the RUN/

STOP key switch to RUN.

No processing (for program erasure or space)

No processing

No processing (for starting a new page during printout)

No processing
(for managing the rest of the program as starting from step 0 of page
"n")

App - 4

APPENDICES

Appendix 1.2

Basic Instructions
(1)

Classification

Comparison operation instructions

Symbol

Description
Conductive status when (S1) = (S2)
Non-conductive status when (S1)
Conductive status when (S1)

(S2)

(S2)

Non-conductive status when (S1) = (S2)

Conductive status when (S1)

(S2)

Non-conductive status when (S1)

16-bit data
comparison

Conductive status when (S1)

(S2)

Non-conductive status when (S1)

Conductive status when (S1)

(S2)

(S2)

Non-conductive status when (S1)

Conductive status when (S1)

(S2)

(S2)

(S2)

Non-conductive status when (S1)

(S2)

Conductive status when (S1 + 1, S1) = (S2 + 1, S2)

Non-conductive status when (S1 + 1, S1)
Conductive status when (S1 + 1, S1)

(S2 + 1, S2)

(S2 + 1, S2)

Non-conductive status when (S1 + 1, S1) = (S2 + 1, S2)

Conductive status when (S1 + 1, S1)

(S2 + 1, S2)

Non-conductive status when (S1 + 1, S1)

32-bit data
comparison

Conductive status when (S1 + 1, S1)

(S2 + 1, S2)

Non-conductive status when (S1 + 1, S1)

Conductive status when (S1 + 1, S1)

(S2 + 1, S2)

(S2 + 1, S2)

Non-conductive status when (S1 + 1, S1)

App - 5

(S2 + 1, S2)

(S2 + 1, S2)

Non-conductive status when (S1 + 1, S1)

Conductive status when (S1 + 1, S1)

(S2 + 1, S2)

(S2 + 1, S2)

APPENDICES

Classification

Symbol

Description
Conductive status when (S1 + 1, S1) = (S2 + 1, S2)
Non-conductive status when (S1 + 1, S1)
Conductive status when (S1 + 1, S1)

(S2 + 1, S2)

(S2 + 1, S2)

Non-conductive status when (S1 + 1, S1) = (S2 + 1, S2)

Conductive status when (S1 + 1, S1)

(S2 + 1, S2)

Non-conductive status when (S1 + 1, S1)

Real number data

comparison

Conductive status when (S1 + 1, S1)

(S2 + 1, S2)

Non-conductive status when (S1 + 1, S1)

Conductive status when (S1 + 1, S1)

(S2 + 1, S2)

(S2 + 1, S2)

Non-conductive status when (S1 + 1, S1)

App - 6

(S2 + 1, S2)

(S2 + 1, S2)

Non-conductive status when (S1 + 1, S1)

Conductive status when (S1 + 1, S1)

(S2 + 1, S2)

(S2 + 1, S2)

APPENDICES

Classification

Symbol

Description
Compares character strings (S1) and (S2) character by character.
Condition for "match":
Character string in which all characters match
Condition for "larger character string":
Character string that includes characters with larger character
codes, or the longer character string
Condition for "smaller character string":
Character string that includes characters with smaller character
codes, or the shorter character string
Conductive status when (character string S1) = (character
string S2)
Non-conductive status when (character string
S1)

(character string S2)

Conductive status when (S1 + 1, S1)

(S2 + 1, S2)

Non-conductive status when (S1 + 1, S1) = (S2 + 1, S2)

Character string data

comparison

Conductive status when (character string S1)

(character

string S2)
Non-conductive status when (character string
S1)

(character string S2)

Conductive status when (character string S1)

(character

string S2)
Non-conductive status when (character string
S1)

(character string S2)

Conductive status when (character string S1)

(character

string S2)
Non-conductive status when (character string
S1)

(character string S2)

Conductive status when (character string S1)

string S2)
Non-conductive status when (character string
S1)

App - 7

(character string S2)

(character

APPENDICES

Classification

Block data
comparison

Symbol

Description

Compares n points of data from (S1) with n points of data from (S2) in
1 word units, and stores the comparison result in the n points starting
from the bit device specified by (D).

App - 8

APPENDICES

(2)
Classification

Arithmetic operation instructions

Symbol

Description

(D) + (S)

(S1) + (S2)

(D)

(D)

BIN 16-bit addition/

subtraction
(D) - (S)

(S1) - (S2)

(D)

(D)

(D+1, D) + (S+1, S)

(D+1, D)

(S1+1, S1) + (S2+1, S2)

(D+1, D)

BIN 32-bit addition/

subtraction
(D+1, D) (S+1, S)

(D+1, D)

(S1+1, S1) (S2+1, S2)

(S1)

(S2)

(D+1, D)

(D+1, D)

BIN 16-bit
multiplication/division
(S1)/(S2)

(S1+1, S1)

quotient (D), remainder (D+1)

(S2+1, S2)

(D+3, D+2, D+1, D)

BIN 32-bit
multiplication/division
(S1+1, S1)/(S2+1, S2)

App - 9

quotient (D+1, D), remainder (D+3, D+2)

APPENDICES

Classification

Symbol

Description

(D) + (S)

(S1) + (S2)

(D)

(D)

BCD 4-digit addition/

subtraction
(D) - (S)

(S1) - (S2)

(D)

(D)

(D+1, D) + (S+1, S)

(D+1, D)

(S1+1, S1) + (S2+1, S2)

(D+1, D)

BCD 8-digit addition/

subtraction
(D+1, D) (S+1, S)

(D+1, D)

(S1+1, S1) (S2+1, S2)

(S1)

(S2)

(D+1, D)

(D+1, D)

BCD 4-digit
multiplication/division
(S1)/(S2)

(S1+1, S1)

quotient (D), remainder (D+1)

(S2+1, S2)

(D+3, D+2, D+1, D)

BCD 8-digit
multiplication/division
(S1+1, S1)/(S2+1, S2)

(D+1, D) + (S+1, S)

quotient (D+1, D), remainder (D+3, D+2)

(D+1, D)

(S1+1, S1) + (S2+1, S2)

(D+1, D)

Floating point data

addition/subtraction
(D+1, D) (S+1, S)

(D+1, D)

(S1+1, S1) (S2+1, S2)

App - 10

(D+1, D)

APPENDICES

Classification

Symbol

Description

(S1+1, S1)

(S2+1, S2)

(D+1, D)

Floating point data

multiplication/division
(S1+ 1, S1)/(S2+1, S2)

quotient (D+1, D)

Associates the character string specified at (S) to the character string

specified at (D) and stores the result to devices starting from (D).
Character string data
addition

Associates the character string specified at (S2) to the character

string specified at (S1) and stores the result to devices starting from
(D).

BIN block addition/

subtraction

Adds n points of data from (S1) and n points of data from (S2) in a
batch and stores the result to devices starting from (D).

(D) + 1

(D)

BIN data increment

(D+1, D) + 1

(D) 1

(D)

(D)

BIN data decrement

(D+1, D) 1

App - 11

(D)

APPENDICES

(3)
Classification

Data conversion instructions

Symbol

Description

BCD conversion

BIN conversion

Floating point
BIN conversion

BIN
floating point
conversion

BIN 16-bit
32-bit conversion

BIN
gray code
conversion

App - 12

APPENDICES

Classification

Symbol

Description

Gray code
BIN conversion

2's complement

Converts n points of BIN data from (S) to BCD data in a batch and
stores the result to devices starting from (D).

Block conversion
Converts n points of BCD data from (S) to BIN data in a batch and
stores the result to devices starting from (D).

App - 13

APPENDICES

(4)
Classification

Data transfer instructions

Symbol

Description

16-bit data transfer

(S)

(D)

32-bit data transfer

(S+1, S)

(D+1, D)

(S+1, S)

(D+1, D)

Floating point
data transfer
Character string
data transfer
16-bit data

Transfers the character string specified at (S) to devices starting with

the device specified at (D).

(S)

(D)

(S+1, S)

(D+1, D)

16-bit data exchange

(S)

(D)

32-bit data exchange

(S+1, S)

(D+1, D)

negation transfer
32-bit data
negation transfer

Data block transfer

Same data
block transfer

Block data exchange

Upper/lower byte
swap

App - 14

APPENDICES

(5)
Classification

Program branch instructions

Symbol

Description

Causes a jump to Pn when the input condition is met.

Causes a jump to Pn beginning with the scan after the one in which
the input condition is met.
Jump
Causes a jump to Pn unconditionally.

Causes a jump to the END instruction when the input condition is

met.

(6)
Classification

Program execution control instructions

Symbol

Description

Interrupt disable

Disables execution of interrupt programs.

Interrupt enable

Cancels the execution disabled status for interrupt programs.

Interrupt disable/

Disables or enables execution of individual interrupt programs.

enable setting

Return

Returns from the interrupt program to the sequence program.

(7)
Classification

I/O refresh

I/O refresh instruction

Symbol

Description

Executes partial refresh for the specified I/O part in a scan.

App - 15

APPENDICES

(8)
Classification

Other convenient instructions

Symbol

Description

Up/down counter

Teaching timer

Four bit devices starting with the bit device specified at (D) perform
the following operations in accordance with the ON/OFF status of the
STMR instruction.
Special timer

(D) + 0: Off delay timer output

(D) + 1: One shot timer output after OFF
(D) + 2: One shot timer output after ON
(D) + 3: On delay timer
Rotates a rotary table that is partitioned into n1 from the position at

Shortest path control

which it is stopped to the position specified by (S+1) in the direction

that gives the shortest path.

Ramp signal

Pulse density

Pulse output

Changes the device data specified at (D1) in the range of n1 to n2 in

n3 scans.
Counts the pulse input of the device specified at (S) for the time
specified at n and stores the result in the device specifid at (D).

(n1)Hz
(D)
Outputs "n2" times.

Pulse width
modulation

Consecutively reads the data of n rows of 16 devices starting from

Matrix input

the device specified at (S1) and stores it in devices starting from the
device specified at (D2).

App - 16

APPENDICES

Appendix 1.3

Application Instructions
(1)

Classification

Logical operation instructions

Symbol

Description

(D)

(S1)

Logical product

(S)

(S2)

(D+1, D)

(S1+1, S1)

(D)

(S1)

Logical sum

(S)

(S2)

(D+1, D)

(S1+1, S1)

App - 17

(D)

(D)

(S+1, S)

(D+1, D)

(S2+1, S2)

(D+1, D)

(D)

(D)

(S+1, S)

(D+1, D)

(S2+1, S2)

(D+1, D)

APPENDICES

Classification

Symbol

Description

(D)

(S1)

Exclusive logical sum

(S)

(D)

(S2)

(D+1, D)

(D)

(S+1, S)

(S1+1, S1)

(D)

(S1)

Not exclusive logical

(S)

(S2)

(D+1, D)

(D+1, D)

(S2+1, S2)

(D+1, D)

(D)

(D)

(S+1, S)

(D+1, D)

sum
(S1+1, S1)

App - 18

(S2+1, S2)

(D+1, D)

APPENDICES

(2)
Classification

Rotation instructions
Symbol

Description

Right rotation

Left rotation

Right rotation

Left rotation

App - 19

APPENDICES

(3)
Classification

Shift instructions
Symbol

Description

n bit shift

1 bit shift

1 word shift

App - 20

APPENDICES

(4)
Classification

Bit processing instructions

Symbol

Description

Bit set/reset

Bit test

Bit device batch reset

App - 21

APPENDICES

(5)
Classification

Data processing instructions

Symbol

Description

Data search

Bit check

Decode

Encode

7-segment decode

App - 22

APPENDICES

Classification

Symbol

Description
Dissociates the 16-bit data specified at (S) into 4-bit units, and stores
these data in the least significant four bits of n devices starting with
the one specified at (D). (n

4)

Associates the least significant 4-bit data of n devices starting from

the one specified at (S) and stores this data in the device specified at
(D). (n

4)

Dissociates data of the devices starting with the one specified at (S1)
into the specified bits starting with the one specified by (S2), and
stores this data in sequence starting at the device specified at (D).
Dissociation/
Association

Associates each of the data starting from the one specified at (S1) to
the data of the devices starting from the one specified by (S2) and
stores the data to the devices in equence starting at the device
specified at (D).
Dissociates the 16-bit data that starts from the device specified at (S)
into 8-bit units, and stores the n points of data to the devices in
sequence starting from the one specified at (D).
Associates the lower 8 bits of 16-bit data for n points starting from the
one specified at (S) to give 16-bit data, and stores the data to the
devices in sequence starting from the one specified at (D).
Searches the n points of data starting from the device specified at (S)
in 16-bit units, and stores the maximum value to the device specified
at (D).
Searches the n points of data starting from the device specified at (S)
in 16-bit units, and stores the minimum value to the device specified
at (D).

Search
Searches the 2

n points of data starting from the device specified at

(S) in 32-bit units, and stores the maximum value to the device
specified at (D).
Searches the 2

n points of data starting from the device specified at

(S) in 32-bit units, and stores the minimum value in the device
specified at (D).
Sorts n points of data starting from the device specified at (S1) in 16bit units.
[Max. number of scans required: {n

(n 1)}/2 scans]

Sort
Sorts 2

n points of data starting from the device specified at (S1) in

32-bit units.
[Max. number of scans required: {n

App - 23

(n 1)}/2 scans]

APPENDICES

(6)
Classification

Structured program instruction

Symbol

Description

Executes the program section between FOR and NEXT n times.

Repeat

Forcibly ends execution of the program section between FOR and

NEXT and causes a jump to Pn.

Executes the subroutine program Pn when the input condition is met.
(S1 to Sn are arguments for the subroutine program.0

5)

Causes a return from the subroutine program.

Executes no-execution processing for the subroutine program Pn

when the input condition is not met.
Subroutine
program call

Executes the subroutine program Pn of the specified program when

the input condition is met. (S1 to Sn are arguments for the subroutine
program.0

5)

Executes no-execution processing for the subroutine program Pn of

the specified program when the input condition is not met.

Executes link refresh and general data processing.

Indexes each of the devices used in the device qualification ladder.

Ladder indexing

Stores the qualification value for indexing at IX to IXEND to the

devices starting from the one specified at (D).

App - 24

APPENDICES

(7)
Classification

Table operation instructions

Symbol

Description

Table processing

(8)
Classification

Buffer memory access instructions

Symbol

Description

Reads data in 16-bit units from special function modules.

Data read
Reads data in 32-bit units from special function modules.

Writes data in 16-bit units to special function modules.

Data write
Writes data in 32-bit units to special function modules.

App - 25

APPENDICES

(9)
Classification

Display instructions
Symbol

Description
Outputs ASCII codes in the 8 points of devices (16 characters)
starting from the one specified at (S) to an output module.

ASCII print

Outputs ASCII codes in the devices starting from the one specified at
(S) and ending at 00H, to an output module.
Converts the device comment specified at (S) to ASCII codes and
outputs the result to an output module.
Displays ASCII codes in the 8 points of devices (corresponding to 16
characters) starting from the one specified at (S) on the LED

Display

indicator.
Displays the comment of the device specified at (S) on the LED
indicator.

Reset

Resets annunciators and LED indication.

App - 26

APPENDICES

(10) Debugging and fault diagnostics instructions

Classification

Symbol

Description
Executes the CHK instruction when it is executed.
Causes a jump to the step following the step of the CHK instruction
when it is not executed.
When normal
When abnormal

SM80: OFF, SD80: 0

SM80: ON, SD80: fault No.

Error check
Indicates the start of ladder pattern change for the ladders to be
checked with the CHK instruction.
Indicates the end of ladder pattern change for the ladders to be
checked with the CHK instruction.

Executes status latch.

Status latch
Resets the status latch to enable re-execution of status latch.

Triggers sampling trace.

Sampling trace
Resets the sampling trace to enable re-execution of sampling trace.

Triggers program trace.

Program trace

Resets the program trace to enable re-execution of program trace.

Executes program trace.

App - 27

APPENDICES

(11) Text string processing instructions

Classification

Symbol

Description
Converts the 1-word BIN data specified at (S) into 5-digit decimal

BIN
Decimal ASCII

ASCII values, and stores them to the word devices starting from the
one specified at (D).
Converts the 2-word BIN data specified at (S) into 10-digit decimal
ASCII values, and stores them to the word devices starting from the
one specified at (D).
Converts the 1-word BIN data specified at (S) into 4-digit
hexadecimal ASCII values, and stores them to the word devices

BIN
Hexadecimal ASCII

starting from the one specified at (D).

Converts the 2-word BIN data specified at (S) into 8-digit
hexadecimal ASCII values, and stores them to the word devices
starting from the one specified at (D).
Converts the 1-word BCD value specified at (S) into 4-digit decimal
ASCII values, and stores them to the word devices starting from the

BCD
ASCII

one specified at (D).

Converts the 2-word BCD value specified at (S) into 8-digit decimal
ASCII values, and stores them to the word devices starting from the
one specified at (D).
Converts the 5-digit decimal ASCII value specified at (S) to a 1-word

Decimal ASCII
BIN

BIN value, and stores this to the word device specified at (D).
Converts the 10-digit decimal ASCII values specified at (S) to a 2word BIN value, and stores this to the word device specified at (D).
Converts the 4-digit hexadecimal ASCII values specified at (S) to a 1-

Hexadecimal ASCII
BIN

word BIN value, and stores this to the word device specified at (D).
Converts the 8-digit decimal ASCII values designated at (S) to a 2word BIN value, and stores this at the word device number
designated at (D).
Converts the 4-digit decimal ASCII values specified at (S) to a 1-word

ASCII
BCD

BCD value, and stores this to the word device specified at (D).
Converts the 8-digit decimal ASCII values specified at (S) to a 2-word
BCD value, and stores this to the word devices specified at (D).

Device comment
read

Text string length

detection

Stores the comment data of the device specified at (S) to the device
specified at (D).
Stores the length of the character string data (number of characters)
that is stored in the device specified at (S) to the device specified at
(D).

App - 28

APPENDICES

Classification

Symbol

Description
Converts the 1-word BIN value specified at (S2) into a decimal
character string with the total number of digits and number of fraction
part digits specified at (S1), and stores it in the device specified at

BIN
Decimal text string

(D).
Converts the 2-word BIN value specified at (S2) into a decimal
character string with the total number of digits and number of fraction
part digits specified at (S1), and stores it in the device specified at
(D).
Converts the character string that includes a decimal point specified
at (S) to a 1-word BIN value and the number of fraction part digits,

Decimal text string

BIN

and stores them to the devices specified at (D1) and (D2).

Converts the character string that includes a decimal point specified
at (S) to a 2-word BIN value and the number of fraction part digits,
and stores them to the devices specified at (D1) and (D2).

Floating point
Character string
Character string
Floating decimal point
Hexadecimal BIN

Converts the floating point data specified at (S) to a character string

and stores it in the devices specified at (D).

Converts the character string specified at (S) to a floating point data

and stores it in the devices specified at (D).
Converts the 1-word BIN value in the devices starting from the one
specified at (S) to hexadecimal ASCII data, and stores them to the

ASCII

word devices starting from the one specified at (D) for n characters.

ASCII

Converts the hexadecimal ASCII data in the devices starting from the
one specified at (S) to BIN values for n characters, and stores them

Hexadecimal BIN

to the devices starting from the one specified at (D).

Stores n characters from the final character of the character string
specified at (S) to the devices specified at (D).
Stores n characters from the initial character of the character string
specified at (S) to the devices specified at (D).
Stores the specified number of characters from the position specified

Character string

at (S2) of the character string specified at (S1) to the devices

processing

specified at (D).
Stores the character string specified at (S1) for the specified number
of characters to the position specified at (S2) of the devices specified
at (D).
Searches for the character string specified at (S1) from the nth
character of the character string specified at (S2) and stores the
position where a match is found to (D).

Floating point data

Converts the floating point data specified at (S1) to a BCD data with
the number of fraction part digits specified at (S2), and stores this

BCD resolution

data to the devices specified at (D).

App - 29

APPENDICES

Classification
BCD

Symbol

Description
Converts the BCD data specified at (S1) to a floating point data with
the number of fraction part digits specified at (S2) and stores this

Floating point data

data to the devices specified at (D).

App - 30

APPENDICES

(12) Special function instructions

Classification

Symbol

Description

Sin(S+1, S)

(D+1, D)

Cos(S+1, S)

(D+1, D)

Tan(S+1, S)

(D+1, D)

Trigonometric function
(floating point data)
Sin1(S+1, S)

Cos1(S+1, S)

(D+1, D)

Tan1(S+1, S)

(D+1, D)

Degree

radian

(D+1, D)

conversion

Exponent operation

Natural logarithm

Square root

App - 31

APPENDICES

Classification

Symbol

Description

Trigonometric function

App - 32

APPENDICES

(13) Data control instructions

Classification

Symbol

Description
Processes the value specified at (S3) to a data in the range defined
by the upper and lower limits set at (S1) and (S2), and stores it to the
word device specified at (D).
When S3

Upper/lower limit
control

S1

When S1

S3

When S2

S3

The value at (S1) is stored to (D).

S2

The value at (S3) is stored to (D).

The value at (S2) is stored to (D).

Processes the value specified at (S3+1, S3) to a data in the range

defined by the upper and lower limits set at (S1+1, S1) and (S2+1,
S2), and stores it to the word device specified at (D+1, D).
When (S3+1, S3)

(S1+1, S1)
The value at (S1+1, S1) is stored to (D+1, D).

When (S1+1, S1)

(S3+1, S3)

(S2+1, S2)

The value at (S3+1, S3) is stored to (D+1, D).

When (S2, S2+1)

(S3, S3+1)
The value at (S2+1, S2) is stored to (D+1, D).

Taking the area set by (S1) and (S2) as the dead band, if the input
value specified at (S3) is within the dead band, "0" is stored to the
word device specified at (D) and if it is outside the dead band, the
value obtained by subtracting the dead band upper/lower limit value
from the input value is stored to the word device specified at (D).
When S1

S3

S2

When S3

S1

S3 S1

When S3

S2

S3 S2

Taking the area set by (S1+1, S1) and (S2+1, S2) as the dead band,
Dead zone control

if the input value specified at (S3+1, S3) is within the dead band, "0"
is stored to the word device specified at (D) and if it is outside the
dead band, the value obtained by subtracting the dead band upper/
lower limit value from the input value is stored to the word device
specified at (D).
When (S1+1, S1)

(S3+1, S3)

When (S3+1, S3)

(S1+1, S1)

When (S3+1, S3)

(S2+1, S2)

(S2+1, S2)
0

(D+1, D)

(S3+1, S3) (S1+1, S1)

(D+1, D)

(S3+1, S3) (S2+1, S2)

App - 33

(D+1, D)

APPENDICES

Classification

Symbol

Description
By setting positive and negative bias values for the input value
specified at (S3) with (S1) and (S2), calculates the value for S1 +
bias, and stores it to the word device specified at (D).
When S3 = 0

When S3

S3 + S2

When S3

S3 S1

By setting positive and negative bias values for the input value
specified at (S3+1, S3) with (S1+1, S1) and (S2+1, S2), calculates

Zone control

the value for S1 + bias, and stores it to the word device specified at
(D+1, D).
When (S3+1, S3) = 0
When (S3+1, S3)

When (S3+1, S3)

(D+1, D)

(S3+1, S3) (S2+1, S2)

(D+1, D)

(S3+1, S3) + (S1+1, S1)

(D+1, D)

(14) Switching instructions

Classification

Symbol

Description
Changes the block No. of an extension file register to the number
specified at (S).

Block No. setting

Sets the name of a file to be used as a file register.

Sets the name of a file to be used as a comment register.

App - 34

APPENDICES

(15) Clock instructions

Classification

Symbol

Description

Clock data read/write

App - 35

APPENDICES

(16) Instructions for peripheral devices

Classification

Symbol

Description
Stores the message specified at (S) to the QnACPU.
This message is displayed at the peripheral device.

Input/output to
peripheral device

Stores the data input from a peripheral device to the device specified
at (D).

(17) Program instructions

Classification

Symbol

Description

Sets the specified program in the standby status.

Turns OFF the coil of the specified program's OUT instruction and
Program execution

sets the program to the standby status.

status switch
Registers the specified program as a scan execution type program.

Registers the specified program as a low-speed execution type

program.

App - 36

APPENDICES

(18) Other instructions

Classification

WDT reset

Symbol

Description

Resets the WDT in a sequence program.

Timing clock

Direct read/write
in 1 byte unit

Indirect address set

Numeral key input

from keyboard

Fetches ASCII data to the input module specified at (S) for 8 points,
converts the data to hexadecimal values, and stores them in the
devices starting with the one specified at (D1).

App - 37

APPENDICES

Appendix 1.4

Data Link Instructions

(1)
Classification

Link refresh instructions

Symbol

Description
Performs link refresh for the network module corresponding to the

Specified network
refresh

specified network No. in network n.

Refreshes the network module corresponding to the specified I/O
number in network n.

App - 38

APPENDICES

(2)

QnA link dedicated instructions

Classification

Symbol

Description

Reads data from word devices of another station.

Data read/write
from/to other stations

Writes data to word devices of another station.

Sends data (message) to another station.

Data send/receive
to/from other stations

Receives data (message) from another station.

Processing request to

Executes remote RUN/STOP for another station.

other stations

Reads data from a special function module installed at a remote station

in the MELSECNET/10 network.
Data read/write
from/to a special
function module
at a remote I/O station
Writes data to a special function module at a remote I/O station in the
MELSECNET/10 network.

(The GP. *** instructions can also be used for the AJ71QC24N)

App - 39

APPENDICES

(3)
Classification

A series link instructions

Symbol

Word device read

Reads the data of T, C, D, and W devices of other stations in the

from specified station

MELSECNET(II) or MELSECNET/10 system.

Word device write

Reads the data of T, C, D, and W devices of other stations on the

to specified station

MELSECNET(II) or MELSECNET/10 network.

Reads data from the special function module installed at a remote I/O

Data read/write

station in the MELSECNET(II) system.

from a special
function module

Writes data to the special function module installed at a remote I/O

at a remote I/O station

station in the MELSECNET(II) system.

(4)
Classification
Routing information
read

Routing information
registration

Description

Routing parameter instructions

Symbol

Description
Reads the data of the transfer destination network with the number
specified by n in the routing parameters and stores the data to the
devices starting from (D).
Registers the routing data in the devices starting from (S) to the area
for the transfer destination network with the number specified by n in
the parameters.

App - 40

APPENDICES

Appendix 1.5

PID Control Instructions

Classification

PID control data set

Symbol

Description
Registers the PID control data in the devices starting from the one
specified at (S) to the PLC CPU.
Performs PID operation on the basis of the set value (SV) and process

PID control execution

value (PV) set in the devices starting from the one specified at (S), and
stores the operation result in the manipulated value (MV) area.
Displays, in the form of a bar graph, the PID control status of the loop

PID control status

monitor

with the number specified at (S1) on the display for the AD57 specified
at n. At the start of execution of PID control monitor, static image
elements of other than the bar graph and numerical data are displayed
by issuing the initial screen display request specified at (S2).

Specified loop
operation stop
Specified loop
operation start

Specified loop
parameter change

Stops operation for the loop whose number is specified at n.

Starts operation for the loop whose number is specified at n.

Changes the operation parameters of the loop whose number is

specified at n to the data set in the devices starting from the one whose
number is specified at (S).

App - 41

APPENDICES

Appendix 1.6

Special Function Module Instructions

(1)

Instructions compatible with all versions

The following instructions can be used for modules with all versions.
Classification

Function
Preset data setting

AD61(S1) control instruction

Set value data setting for larger/smaller/

matched judgments
Present value read
Character outputting for the intended number
to a printer
Character outputting up to the 00H code to a

AD59(S1) control instruction

printer

instruction

PVRD1, PVRD2
PRN

PR

Data write to memory card

PUT

Data send up to the 00H code in no-protocol

AJ71C21(S1) control

SVWR1, SVWR2

GET

in no-protocol mode

instruction

RVWR1, PVWR2

Data read from memory card

Data send for the specified number of bytes

AJ71C24 (-S3/S6/S8) control

Instruction Symbol

mode

PRN

PR

Data receive in no-protocol mode

INPUT

Communications status read

SPBUSY

Send/receive processing forced interruption

SPCLR

Data send for the specified number of bytes

PRN2, PRN4

Data send up to the 00H code

PR2, PR4

Data receive

INPUT2, INPUT4

Data read from RAM memory

GET

Data write to RAM memory

PUT

Communication processing forced interruption SPBUSY

App - 42

APPENDICES

Classification

Function
Key input from operation box
Data send for the specified number of bytes in
no-protocol mode
Data send up to the 00H code in no-protocol
mode

AJ71PT32-S3 control

Data receive in no-protocol mode

Instruction Symbol
INPUT
PRN

PR
INPUT

instruction
Communications with remote terminal
modules

MINI, MINIEND

Error reset for remote terminal module

MINIERR

Communications status read

SPBUSY

Communication processing forced interruption SPCLR

App - 43

APPENDICES

Classification

Function
Display mode setting

CMODE

Canvas screen display

CPS1

VRAM display address change

CPS2

Canvas data transfer to the VRAM area

CMOV

Display area clear

CLS

VRAM area clear

CLV

Screen scrolling

CSCRU, CSCRD

Cursor display

CON1, CON2

Cursor erase

COFF

Cursor position setting

LOCATE

Forward/reverse rotation specification for

characters
Forward/reverse rotation switching for
characters

AD75 control instruction

Instruction Symbol

CNOR, CREV

CRDSP, SRDSPV

Character display color specification

COLOR

Character color change

CCDSP, CCDSPV

ASCII character display

PR, PRN

ASCII character write to VRAM

PRV, PRNV

Character display

EPR, EPRN

Character write to VRAM

EPRV, EPRNV

Concatenated display of same character

CR1, CR2, CC1, CC2

- (minus) display

CINMP

- (hyphen) display

CINHP

. (period, decimal point) display

CINPT

Numeric character display

CIN0 to CIN9

Alphabet character display

CINA to CINZ

Space display

CINSP

Specified column clear display

CINCLR

ASCII code conversion of specified character

strings

INPUT

VRAM data read

GET

VRAM data write

PUT

Display status read

STAT

App - 44

APPENDICES

Classification

AJ71ID

-R4 control

instruction

Function
ID controller initial setting

IDINIT1, IDINIT2

Data read from ID data carrier

IDRD1, IDRD2

Data write to ID data carrier

IDWD1, IDWD2

Continuous read from ID data carrier

IDARD1, IDARD2

Continuous write to ID data carrier

IDAWD1, IDAWD2

Data compare with ID data carrier

IDCMP1, IDCMP2

Same data batch write to ID data carrier

IDFILL1, IDFILL2

Copy between ID data carriers

IDCOPY1, IDCOPY2

ID data carrier clear

IDCLR1, IDCLR2

ID data carrier use end

IDOFF1, IDOFF2

ID data carrier use start

IDON1, IDON2

Writes the user registration frame to the

E2PROM for the AJ71QC24N.
Reads the user registration frame from the
E2PROM for the AJ71QC24N.
Data send with the dedicated protocol using
the "on demand" function
Data send for the specified number of bytes in
no-protocol mode
Data send in accordance with the send
schedule table in no-protocol mode
AJ71QC24 control instruction*

PUTE

GETE

ONDEMAND

OUTPUT

PRR

Data receive in no-protocol mode

INPUT

Data send with the bi-directional protocol

BIDOUT

Data receive with the bi-directional protocol

BIDIN

Communication status read

SPBUSY

Device read from other stations

READ

Device write to other stations

SWRITE

Data send to other stations

SEND

Data receive from other stations

RECV

Transient transmission request to other

stations
*

Instruction Symbol

REQ

The AJ71QC24N can be used with QnA link instructions designated for use with special
function modules (G(P). ***).

App - 45

APPENDICES

(2)

Instructions added after function version B

With function version B, the following instructions can be used in addition to the
instructions in (1).
Refer to Section 2.2 for the function version.
Classification

Function
Comparison read from ID data carrier

IDCRD1, IDCRD2

Comparison write to ID data carrier

IDCWD1, IDCWD2

Continuous comparison read from ID data

AJ71ID

-R4 control

instruction

Instruction Symbol

carrier

IDSRD1, IDSRD2

Continuous comparison write to ID data carrier IDSWD1, IDSWD2

Continuous high-speed read from ID data
carrier

IDFRD1, IDFRD2

Continuous high-speed write to ID data carrier IDFWD1, IDFWD2

Read from the buffer memory of the intelligent
device station
Write to the buffer memory of the intelligent
device station
Write to the buffer memory of the intelligent
device station(with handshake)
Read from the buffer memory of the intelligent
device station (with handshake)
Read from master station buffer memory for
automatic update
CC-Link control instruction

Write to master station buffer memory for

automatic update
Intelligent device station communication
Intelligent device station communication status
read
Intelligent device station communication
processing interrupt

RIRD

RIWT

RISEND

RIRCV

RIFR

RITO
CCL, CCLEND
SPCBUSY

SPCCLR

Remote register (RWr) read

RDGET

Remote register (RWw) write

RDPUT

Remote register (RWr) monitor

RDMON

App - 46

APPENDICES

Classification

Function
1 axis positioning start

PSTART

Interpolation positioning start

PHOSTA

OPR start

PZPR

Current value change request

PADCH

Forward JOG start/stop

PJOG+

Reverse JOG start/stop

PJOG-

Manual pulse generator operation enable/

disable

AD75 contorol instruction

Instruction Symbol

PMPG

Speed change request

PSPCH

Axis error reset

PERRST

Basic parameter setting

PBPSET

Detail parameter setting

PEPSET

OPR data setting

POPSET

Positioning data setting

PPOSET

Positioning start data setting

PSDSET

Positioning special start data setting

PSPSET

Condition data setting

PCTSET

Error/warning number read

PEWR

Monitor data read

PMDRD

Positioning data I/F setting

PIFSET

Parameter setting

EPRSET

QnA compatible
transmission/
receiving instruction
AJ71QE71 control instruction

Other station device

READ

read

SREAD

Other station device

WRITE

write

SWRITE

Data send

SEND

Data receive

RECV

Other station transient

request
Other station device
A compatible send/
receive instruction

read
Other station device
write

App - 47

REQ

ZNRD

ZNWR

APPENDICES

APPENDIX 2 Special Relay List

Special relays, SM, are internal relays whose applications are fixed in the PLC.
For this reason, they cannot be used by sequence programs in the same way as the
normal internal relays.
However, they can be turned ON or OFF as needed in order to control the CPU module
and remote I/O modules.
The heading descriptions in the following special relay lists are shown in Table App. 2.1.
Table App. 2.1. Explanation of special relay list
Item
Number

Function of Item
Indicates special register number

Name

Indicates name of special register

Meaning

Indicates contents of special register

Explanation

Discusses contents of special register in more detail

Indicates whether the relay is set by the system or user, and, if it is set by the system, when setting is performed.
<Set by>
S

: Set by system

: Set by user (sequence programs or test operations from GX Developer)

S/U

: Set by both system and user

<When set>
Set by
(When set)

Indicated only for registers set by system

Each END

: Set during each END processing

Initial

: Set only during initial processing (when power supply is turned ON, or when going from STOP

Status change

: Set only when there is a change in status

Error

: Set when error occurs

to RUN)

Instruction execution : Set when instruction is executed

Corresponding
ACPU M9
Corresponding
CPU

Request

: Set only when there is a user request (through SM, etc.)

System switching

: Set when system switching is executed.

Indicates the corresponding special relay (M9

) of the ACPU.

(When the contents are changed, the special relay is represented M9

format change.)

New indicates the special relay newly added to the QnACPU.

Indicates the corresponding CPU module type name.
QnA

: Indicates the QnA series and Q2ASCPU series.

Each CPU module model name: Indicates the relevant specific CPU module. (Example: Q4AR, Q2AS)

For details on the following items, refer to the following manuals:

Networks
Manual of the corresponding network module
SFC
QCPU(Q mode)/QnACPU Programming Manual (SFC)

App - 48

APPENDICES

(1) Diagnostic Information

Table App. 2.2. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9

Diagnostic errors

OFF : No error
ON : Error

Turns ON if an error occurs as a result of diagnosis.

(Includes when an annunciator is ON, and when an
error is detected with CHK instruction)
Remains ON even if the condition is restored to
normal thereafter.

SM1

Self-diagnostic error

OFF : No self-diagnosis
errors
ON : Self-diagnosis

Turns ON if an error occurs as a result of diagnosis.

(Does not include when an annunciator is ON or
when an error is detected by the CHK instruction)
Remains ON even if the condition is restored to
normal thereafter.

S (Error)

M9008

QnA

SM5

Error common
information

OFF : No error common

information
ON : Error common
information

When SM0 is ON, turns ON if there is error common

information

S (Error)

New

QnA

SM16

Error individual
information

OFF : No error individual

information
ON : Error individual
information

When SM0 is ON, turns ON if there is error individual

information

S (Error)

New

QnA

SM50

Error reset

OFF

SM0

ON: Error reset

Conducts error reset operation

SM51

Battery low latch

OFF : Normal
ON : Battery low

Turns ON if battery voltage at CPU module or

memory card drops below rated value.
Remains ON even if the battery voltage returns to
normal thereafter.
Synchronizes with the BAT. ALARM/BAT.
LED.

SM52

Battery low

OFF : Normal
ON : Battery low

Same as SM51, but turns OFF subsequently when

battery voltage returns to normal.

SM53

AC/DC DOWN
detection

OFF : AC/DC DOWN not

detected
ON : AC/DC DOWN
detected

Turns ON if an instantaneous power failure of within

20ms occurs during use of the AC power supply
module.
Reset when the power supply is switched OFF, then
ON.
Turns ON if an instantaneous power failure of within
1ms occurs during use of the DC power supply
module.
Reset when the power supply is switched OFF, then
ON.

S (Error)

New

QnA

New

QnA

S (Error)

M9007

QnA

S (Error)

M9006

QnA

QnA
S (Error)

M9005
QnA

SM54

MINI link error

OFF : Normal
ON : Error

Turns ON if MINI (S3) link error is detected at even

one of the installed AJ71PT32 (S3) modules.
Remains ON even if the condition is restored to
normal thereafter.

S (Error)

M9004

QnA

SM56

Operation error

OFF : Normal
ON : Operation error

ON when operation error is generated

Remains ON if the condition is restored to normal
thereafter.

S (Error)

M9011

QnA

Blown fuse detection

OFF : Normal
ON : Module with blown
fuse

Turns ON if there is at least one output module

whose fuse has blown.
Remains ON if the condition is restored to normal
thereafter.
Blown fuse status is checked even for remote I/O
station output modules.

S (Error)

M9000

QnA

S (Error)

M9002

QnA

SM60

SM61

I/O module verify error

OFF : Normal
ON : Error

Turns ON if the I/O module differs from the status

registered at power on.
Remains ON if the condition is restored to normal
thereafter.
I/O module verification is also conducted for remote
I/O station modules.

SM62

Annunciator detection

OFF : Not detected

ON : Detected

Goes ON if even one annunciator F goes ON.

S (Instruction
execution)

M9009

QnA

SM80

CHK detection

OFF : Not detected

ON : Detected

Goes ON if error is detected by CHK instruction.

Remains ON if the condition is restored to normal
thereafter.

S (Instruction
execution)

New

QnA

App - 49

APPENDICES

Table App. 2.2. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9
SM90

Corresponds
to SD90

M9108

SM91

Corresponds
to SD91

M9109

SM92

Corresponds
to SD92

M9110

SM93

Corresponds
to SD93

SM94
SM95

Startup of monitoring
OFF : Not started(monitoring
timer for step transition
timer reset)
(Enabled only when
ON : Started(monitoring
SFC program exists)
timer started)

Corresponds
to SD94
Corresponds
to SD95

M9111
Goes ON when measurement of
step transition monitoring timer is
commenced.
Resets step transition monitoring
timer when it goes OFF.

M9112
U

QnA
M9113

SM96

Corresponds
to SD96

M9114

SM97

Corresponds
to SD97

New

SM98

Corresponds
to SD98

New

SM99

Corresponds
to SD99

New

App - 50

APPENDICES

(2) System information

Table App. 2.3. Special relay

Number

Name

Meaning

Explanation

ON : LED OFF

When this relay goes from OFF to ON, the LEDs

corresponding to the individual bits at SD202 go off

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9
SM202

LED OFF command

OFF

New

QnA

SM203

STOP contact

STOP status

Goes ON at STOP status

S (Status change)

M9042

QnA

SM204

PAUSE contact

PAUSE status

Goes ON at PAUSE status

S (Status change)

M9041

QnA

SM205

STEP-RUN contact

STEP-RUN status

Goes ON at STEP-RUN status

S (Status change)

M9054

QnA

PAUSE enable coil

OFF : PAUSE disabled

ON : PAUSE enabled

PAUSE status is entered if this relay is ON when the

PAUSE contact goes ON

M9040

QnA

M9025

QnA

SM206

SM210

Clock data set request

OFF : Ignored
ON : Set request

When this relay goes from OFF to ON and after END

instruction execution of subsequent scan, clock data
stored in SD210 to SD213 are written to the CPU
module.

SM211

Clock data error

OFF : No error
ON : Error

ON when error is generated in clock data (SD210 to

SD213) value, and OFF if no error is detected.

S (Request)

M9026

QnA

SM212

Clock data display

OFF : Ignored
ON : Display

Displays clock data as month, day, hour, minute, and

second at the LED display at front of CPU
module.(Enabled only for Q3ACPU and Q4ACPU)

M9027

Q3A
Q4A
Q4AR

SM213

Clock data read

request

OFF : Ignored
ON : Read request

When this relay is ON, clock data is read to SD210 to

SD213 as BCD values.

M9028

QnA

SM250

Max. loaded I/O read

OFF : Ignored
ON : Read

When this relay goes from OFF to ON, maximum

loaded I/O number is read to SD250.

New

QnA

M9094

Q2A(S1)
Q3A
Q4A
Q4AR

SM251

I/O change flag

OFF : No replacement
ON : Replacement

By turning this relay ON after setting the head I/O

number of the replaced I/O module to SD251, the I/O
module can be replaced online (with power on).
(Only one module can be replaced for each setting.)
Turn this relay ON in the test mode of the program or
peripheral device for an I/O module change during
RUN, or in the test mode of the peripheral device for
an I/O change during STOP.
Do not execute a RUN/STOP mode change until I/O
module change is finished.

SM252

I/O change OK

OFF : Replacement
prohibited
ON : Replacement enabled

Goes ON when I/O replacement is OK.

S (END)

New

OFF : Operative network

ON : Standby network

Goes ON for standby network(If no designation has

been made concerning active or standby, active is
assumed.)

S (Initial)

New

OFF : Reads
ON : Does not read

For refresh from link to CPU module (B, W, etc.)

indicate whether to read from the link module.

New

SM257

OFF : Writes
ON : Does not write

For refresh from CPU module to link (B, W, etc.),

designate whether to write to the link module.

New

SM260

OFF : Operative network

ON : Standby network

Goes ON for standby network

(If no designation has been made concerning active
or standby, active is assumed.)

S (Initial)

New

OFF : Reads
ON : Does not read

For refresh from link to CPU module (B, W, etc.)

indicate whether to read from the link module.

New

OFF : Writes
ON : Does not write

For refresh from CPU module to link (B, W, etc.),

designate whether to write to the link module.

New

OFF : Operative network

ON : Standby network

Goes ON for standby network

(If no designation has been made concerning active
or standby, active is assumed.)

S (Initial)

New

OFF : Reads
ON : Does not read

For refresh from link to CPU module (B, W, etc.)

indicate whether to read from the link module.

New

OFF : Writes
ON : Does not write

For refresh from CPU module to link (B, W, etc.),

designate whether to write to the link module.

New

OFF : Operative network

ON : Standby network

Goes ON for standby network

(If no designation has been made concerning active
or standby, active is assumed.)

S (Initial)

New

OFF : Reads
ON : Does not read

For refresh from link to CPU module (B, W, etc.)

indicate whether to read from the link module.

New

OFF : Writes
ON : Does not write

For refresh from CPU module to link (B, W, etc.),

designate whether to write to the link module.

New

OFF : Normal
ON : Error

Goes ON when a CC-Link error is detected in any of

the installed CC-Link module. Remains ON if the
condition is restored to normal thereafter.

S (Error)

New

SM255

SM256

SM261

MELSECNET/10
module 1 information

MELSECNET/10
module 2 information

SM262

SM265

SM266

MELSECNET/10
module 3 information

SM267

SM270

SM271

MELSECNET/10
module 4 information

SM272

SM280

CC-Link error

App - 51

QnA

QnA

QnA

QnA

QnA

APPENDICES

Table App. 2.3. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9
Presence/absence of
SFC program

OFF : SFC program absent

ON : SFC program present

Turns ON when an SFC program is registered.

OFF when an SFC program is not registered.

SM321

Start/stop SFC
program

OFF : SFC program not

executed (stop)
ON : SFC program
executed (start)

SM322

SFC program start

status

OFF : Initial start

ON : Resume start

SM323

Presence/absence of
continuous transition
for entire block

OFF : Continuous transition

not effective
ON : Continuous transition
effective

SM324

Continuous transition
prevention flag

OFF : When transition is

executed
ON : When no transition

SM320

S (Initial)

M9100

QnA

Initial value is set at the same value as SM320.

(Goes ON automatically if SFC program is present.)
Turn this relay from ON to OFF to stop program
execution.
Turn this relay from OFF to ON to resume program
execution.

S (Initial)/U

M9101form
at change

QnA

The SFC program starting mode in the SFC setting

of the PLC parameter dialog box is set as the initial
value.
At initial start: OFF
At continued start: ON

S (Initial)/U

M9102form
at change

QnA

Set the presence/absence of continuous transition for

the block where "Continuous transition bit" of the SFC
data device has not been set.

M9103

QnA

S (Instruction
execution)

M9104

QnA

S (Status change)

New

QnA

S (Initial)/U

M9196

QnA

OFF during operation in the continuous transition

mode or during continuous transition, and ON when
continuous transition is not executed.
Always ON during operation in the no continuous
transition mode.

SM325

Output mode at block

stop

OFF : OFF
ON : Preserves

Select whether the coil outputs of the active steps are

held or not at the time of a block stop.
As the initial value, the output mode at a block stop in
the parameter is OFF when the coil outputs are OFF,
and ON when the coil outputs are held.
All coil outputs go OFF when this relay is OFF.
Coil outputs are preserved when this relay is ON.

SM326

SFC device clear

mode

OFF : Clear device

ON : Preserves device

Selects the device status when the stopped CPU is run

after the sequence program or SFC program has been
modified when the SFC program exists.

New

QnA

SM327

Output during end step

execution

OFF : Hold step output

turned OFF (cleared)
ON : Hold step output held

Select the device status at the time of switching from

STOP to program write to RUN.(All devices except
the step relay)

S (Initial)/U

New

QnA

New

QnA

SM330

Operation mode for

low speed execution
type program

OFF : Asynchronous mode

ON : Synchronous mode

Select whether the low speed execution type program

will be executed in the asynchronous mode or in the
synchronous mode.
Asynchronous mode (this relay is turned OFF.)
Mode in which the operation of the low speed
execution type program is performed continuously
within the excess time.
Synchronous mode (this relay is turned ON.)
Mode in which the operation of the low speed
execution type program is not performed
continuously and operation is performed from the
next scan if there is excess time.

App - 52

APPENDICES

(3) System clocks/counters

Table App. 2.4. Special relay

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

M9
SM400

Always ON

ON
OFF

Normally is ON

S (Every END
processing)

M9036

QnA

SM401

Always OFF

ON
OFF

Normally is OFF

S (Every END
processing)

M9037

QnA

S (Every END
processing)

M9038

QnA

S (Every END
processing)

M9039

QnA

SM402

After RUN, ON for 1

scan only

ON
OFF

1 scan

After RUN, ON for 1 scan only.

This connection can be used for scan execution type
programs only.
When an initial execution type program is used, this
relay turns OFF at the END processing of the scan
execution type program in the first scan after RUN.

ON
OFF

SM403

After RUN, OFF for 1

scan only

ON
OFF

1 scan

Initial
execution
type program

1 scan of scan
execution type
program

After RUN, OFF for 1 scan only.

This connection can be used for scan execution type
programs only.
When an initial execution type program is used, this
relay turns OFF at the END processing of the scan
execution type program in the first scan after RUN.

ON
OFF

Initial
execution
type program

1 scan of scan
execution type
program

SM404

Low speed execution

type programON for 1
scan only after RUN

ON
OFF

1 scan

After RUN, ON for 1 scan only.

This connection can be used for low speed execution
type programs only.

S (Every END
processing)

New

QnA

SM405

Low speed execution

type programAfter
RUN, OFF for 1 scan
only

ON
OFF

1 scan

After RUN, OFF for 1 scan only.

This connection can be used for low speed execution
type programs only.

S (Every END
processing)

New

QnA

SM410

0.1 second clock

0.05s

M9030

QnA

M9031

QnA

M9032

QnA

M9033

QnA

M9034form
at change

QnA

SM411

0.2 second clock

0.05s
0.1s
0.1s

SM412

1 second clock

0.5s

SM413

2 second clock

1s

SM414

2n second clock

SM420

User timing clock No.0

SM421

User timing clock No.1

SM422

User timing clock No.2

SM423

User timing clock No.3

SM424

User timing clock No.4

SM430

User timing clock No.5

SM431

User timing clock No.6

SM432

User timing clock No.7

SM433

User timing clock No.8

SM434

User timing clock No.9

Repeatedly changes between ON and OFF at each

designated time interval.
When PLC power supply is turned OFF or a CPU
module reset is performed, goes from OFF to start.
(Note that the ON-OFF status changes when the
designated time has elapsed during the execution of
the program.)

0.5s

S (Status change)

1s
This relay alternates between ON and OFF at
intervals of the time (unit: s) specified in SD414.
When PLC power supply is turned OFF or a CPU
module reset is performed, goes from OFF to start.
(Note that the ON-OFF status changes when the
designated time has elapsed during the execution of
the program.)

ns
ns

Relay repeats ON/OFF switching at fixed scan

intervals.
When PLC power supply is turned ON or a CPU
module reset is performed, goes from OFF to start.
The ON/OFF intervals are set with the DUTY
instruction
n2 scan

n2 scan

n1 scan

DUTY

n1

n2

S (Status change)

M9020
M9021
S (Every END
processing)

SM420

App - 53

QnA

M9023

n1: ON scan interval

n2: OFF scan interval

For use with SM420 to SM424 low speed programs

M9022

M9024

S (Every END
processing)

New

QnA

APPENDICES

(4) Scan information

Table App. 2.5. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9
SM510

Low speed program

execution flag

OFF : Completed or not

executed
ON : Execution under way.

SM551

Reads module service

interval

OFF : Ignored
ON : Read

Goes ON when low speed execution type program is

executed.
When this relay goes from OFF to ON, the module
service interval designated by SD550 is read to
SD551 to SD552.

App - 54

S (Every END
processing)

New

QnA

New

QnA

APPENDICES

(5) Drive information

Table App. 2.6. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9
SM600

Memory card (A)

usable flags

OFF : Unusable
ON : Use enabled

ON when memory card (A) is ready for use by user

S (Status change)

New

QnA

SM601

Memory card (A)

protect flag

OFF : No protect
ON : Protect

Goes ON when memory card (A) protect switch is

ON

S (Status change)

New

QnA

Drive 1 flag

OFF : No drive 1
ON : Drive 1 present

Turns ON when the mounted memory card (A) is

RAM

S (Status change)

New

QnA

SM603

Drive 2 flag

OFF : No drive 2
ON : Drive 2 present

Turns ON when the mounted memory card (A) is

ROM

S (Status change)

New

QnA

SM604

Memory card (A) inuse flag

OFF : Not used

ON : In use

Goes ON when memory card (A) is in use

S (Status change)

New

QnA

SM605

Memory card (A)

remove/insert prohibit
flag

OFF : Remove/insert
enabled
ON : Remove/insert
prohibited

Goes ON when memory card (A) cannot be inserted

or removed

New

QnA

SM620

Memory card B usable

flags

OFF : Unusable
ON : Use enabled

ON when memory card B is ready for use by user

S (Initial)

New

Q2A(S1)
Q3A
Q4A
Q4AR

SM621

Memory card B protect

flag

OFF : No protect
ON : Protect

Goes ON when memory card B protect switch is ON

S (Initial)

New

Q2A(S1)
Q3A
Q4A
Q4AR

SM622

Drive 3 flag

OFF : No drive 3
ON : Drive 3 present

Goes ON when drive 3 (card 2 RAM area) is present

S (Initial)

New

Q2A(S1)
Q3A
Q4A
Q4AR

SM623

Drive 4 flag

OFF : No drive 4
ON : Drive 4 present

Goes ON when drive 4 (card 2 ROM area) is present

S (Initial)

New

Q2A(S1)
Q3A
Q4A
Q4AR

SM624

Memory card B in-use

flag

OFF : Not used

ON : In use

Goes ON when memory card B is in use

S (Status change)

New

Q2A(S1)
Q3A
Q4A
Q4AR

SM625

Memory card B
remove/insert prohibit
flag

OFF : Remove/insert
enabled
ON : Remove/insert
prohibited

Goes ON when memory card B cannot be inserted or

removed

New

Q2A(S1)
Q3A
Q4A
Q4AR

SM640

File register use

OFF : File register not used

ON : File register in use

Goes ON when file register is in use

S (Status change)

New

QnA

SM650

Comment use

OFF : File register not used

ON : File register in use

Goes ON when comment file is in use

S (Status change)

New

QnA

SM660

Boot operation

OFF : Internal memory

execution
ON : Boot operation in
progress

Goes ON while boot operation is in process

Goes OFF if boot designation switch is OFF

S (Status change)

New

QnA

SM672

Memory card A file

register access range
flag

OFF : Within access range

ON : Outside access range

Goes ON when access is made to area outside the

range of file register of memory card A(Set within
END processing.)
Reset at user program

S/U

New

QnA

SM673

Memory card B file

register access range
flag

OFF : Within access range

ON : Outside access range

Goes ON when access is made outside the range of

file register of memory card B.(Set within END
processing.)
Reset at user program

S/U

New

Q2A(S1)
Q3A
Q4A
Q4AR

SM602

App - 55

APPENDICES

(6) Instruction-Related Special Relays

Table App. 2.7. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9
SM700

Carry flag

OFF : Carry OFF

ON : Carry ON

SM701

Number of output
characters selection

Switching the number of

output characters and the
output pattern

Used for the PR, PRC, BINDA, DBINDA, BINHA,

DBINHA, BCDDA, DBCDDA, or COMRD instruction
For details, refer to the QCPU (Q Mode)/QnACPU
Programming Manual (Common Instructions).

SM702

Search method

OFF : Search next

ON : 2-part search

SM703

Sort order

SM704

Block comparison

Carry flag used in application instruction

S (Instruction
execution)

M9012

QnA

M9049

QnA
Qn(H)
QnPH
QnPRH
QnU

Designates method to be used by search instruction.

Data must be arranged for 2-part search.

New

QnA

OFF : Ascending order

ON : Descending order

The sort instruction is used to designate whether

data should be sorted in ascending order or in
descending order.

New

QnA

OFF : Non-match found

ON : All match

Goes ON when all data conditions have been met for

the BKCMP instruction.

S (Instruction
execution)

New

QnA

New

Q4AR

SM707

Selection of real
number instruction
processing type

OFF : Speed oriented

ON : Accuracy oriented

When SM707 is OFF, real number instructions are

processed at high speed.
When it is ON, real number instructions are
processed with high accuracy.

SM710

CHK instruction
priority ranking flag

OFF : Conditions priority

ON : Pattern priority

Remains as originally set when OFF.

CHK priorities updated when ON.

S (Instruction
execution)

New

QnA

SM711

Divided transmission
status

OFF : Other than during

divided processing
ON : During divided
processing

In processing of AD57(S1), goes ON when screen is

split for transfer, and goes OFF when split
processing is completed

S (Instruction
execution)

M9065

QnA

SM712

Transmission
processing selection

OFF : Batch processing

ON : Divided processing

In processing of AD57(S1), goes ON when canvas

screen is divided for transfer.

S (Instruction
execution)

M9066

QnA

SM714

Communication
request registration
area BUSY signal

OFF : Communication
request to remote
terminal module
enabled
ON : Communication
request to remote
terminal module
disabled

Used to determine whether communications

requests to remote terminal modules connected to
the AJ71PT32-S3 can be executed or not.

S (Instruction
execution)

M9081

QnA

SM715

EI flag

OFF : During DI
ON : During EI

ON when EI instruction is being executed.

S (Instruction
execution)

New

QnA

SM736

PKEY instruction
execution in progress
flag

OFF : Instruction not

executed
ON : Instruction execution

ON when PKEY instruction is being executed.

Goes OFF when CR is input, or when input character
string reaches 32 characters.

S (Instruction
execution)

New

QnA

SM737

Keyboard input
reception flag for
PKEY instruction

OFF : Keyboard input

reception enabled
ON : Keyboard input
reception disabled

Goes ON when keyboard input is being conducted.

Goes when keyboard input has been stored at the
CPU.

S (Instruction
execution)

New

QnA

SM738

MSG instruction
reception flag

OFF : Instruction not

executed
ON : Instruction execution

Goes ON when MSG instruction is executed

S (Instruction
execution)

New

QnA

SM774

PID bumpless
processing
(for complete
derivative)

OFF : Matched
ON : Not matched

Specifies whether to match the set value (SV) with

the process value (PV) or not in the manual mode.

New

QnA

SM775

Selection of refresh
processing during
COM instruction
execution

OFF : Performs link refresh

ON : Performs no link
refresh

Select whether link refresh processing will be

performed or not when only communication with the
CPU module is made at the execution of the COM
instruction.

New

QnA

SM776

Enable/disable local
device at CALL

OFF : Local device disabled

ON : Local device enabled

Set whether the local device of the subroutine

program called at execution of the CALL instruction
is valid or invalid.

New

QnA

SM777

Enable/disable local
device in interrupt
program

OFF : Local device disabled

ON : Local device enabled

Set whether the local device at execution of the

interrupt program is valid or invalid.

New

QnA

SM780

CC-Link dedicated
instruction executable

OFF : CC-Link dedicated

instruction executable
ON : CC-Link dedicated
instruction not
executable

Switches ON when the number of the CC-Link

dedicated instructions that can be executed
simultaneously reaches 32. Switches OFF when the
number goes below 32.

New

QnA

App - 56

APPENDICES

(7) Debug
Table App. 2.8. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9
OFF : Not ready

SM800

Sampling trace
preparation

SM801

Sampling trace start

OFF : Suspend
ON : Start

Sampling trace started when this goes ON

Suspended when OFF (Related special M all OFF)

SM802

Sampling trace
execution in progress

OFF : Suspend
ON : Start

Goes ON during execution of sampling trace

Sampling trace trigger goes ON when this goes from
OFF to ON (Identical to STRA instruction execution
status)

ON : Ready

Goes ON when sampling trace is ready

S (Status change)

New

QnA

M9047

QnA

S (Status change)

M9046

QnA

New

QnA

Goes ON after sampling trace trigger

S (Status change)

New

QnA

Goes ON at completion of sampling trace

S (Status change)

M9043

QnA

S (Status change)

New

QnA

New

QnA

S (Status change)

M9055

QnA

New

QnA

SM803

Sampling trace trigger

OFF

SM804

After sampling trace

trigger

OFF : Not after trigger

SM805

Sampling trace
completed

OFF : Not completed

SM806

Status latch
preparation

OFF : Not ready

ON : Ready

Goes ON when status latch is ready

SM807

Status latch command

OFF

Runs status latch command

OFF : Latch not completed

ON : Latch completed

Comes ON when status latch is completed.

Enable next status latch

ON: Start

ON : After trigger
ON : End

ON: Latch

SM808

Status latch
completion

SM809

Status latch clear

OFF

SM810

Program trace
preparation

OFF : Not ready

ON : Ready

Goes ON when program trace is ready

S (Status change)

New

QnA

SM811

Start program trace

OFF : Suspend
ON : Start

Program trace started when this goes ON

Suspended when OFF (Related special M all OFF)

S (Status change)

New

QnA

SM812

Program trace
execution under way

OFF : Suspend
ON : Start

ON when program trace execution is underway

New

QnA

SM813

Program trace trigger

OFF

Program trace trigger goes ON when this goes from

OFF to ON (Identical to PTRA instruction execution
status)

S (Status change)

New

QnA

SM814

After program trace

trigger

OFF : Not after trigger

ON : After trigger

Goes ON after program trace trigger

S (Status change)

New

QnA

SM815

Program trace
completion

OFF : Not completed

ON : End

Goes ON at completion of program trace

S (Status change)

New

QnA

SM820

Step trace preparation

OFF : Not ready

ON : Ready

Goes ON after program trace registration, at ready

S (Status change)

New

QnA

SM821

Step trace starts

OFF : Suspend
ON : Start

Select whether execution of step trace is started or

suspended.
When this goes ON, step trace is started
Suspended when OFF (Related special M all OFF)

M9182form
at change

QnA

SM822

Step trace execution

underway

OFF : Suspend
ON : Start

Goes ON when step trace execution is underway

Goes OFF at completion or suspension

S (Status change)

M9181

QnA

S (Status change)

New

QnA

ON: Clear

ON: Start

SM823

After step trace trigger

OFF : Not after trigger

ON : Is after first trigger

Goes ON if even 1 block within the step trace being

executed is triggered.
Goes OFF when step trace is commenced.

SM824

After Step trace trigger

OFF : Is not after all triggers

ON : Is after all triggers

Goes ON if all blocks within the step trace being

executed are triggered.
Goes OFF when step trace is commenced.

S (Status change)

New

QnA

SM825

Step trace completed

OFF : Not completed

ON : End

Goes ON at step trace completion.

Goes OFF when step trace is commenced.

S (Status change)

M9180

QnA

SM826

Sampling trace error

OFF : Normal
ON : Errors

Goes ON if error occurs during execution of sampling

trace.

S (Status change)

New

QnA

Status latch error

OFF : Normal
ON : Errors

Goes ON if error occurs during execution of status

latch.

S (Status change)

New

QnA

Program trace error

OFF : Normal
ON : Errors

Goes ON if error occurs during execution of program

trace.

S (Status change)

New

QnA

SM827
SM828

App - 57

APPENDICES

(8) Latch area

Table App. 2.9. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9
SM900

Power off file

OFF : No power off file

ON : Power off file present

SM910

RKEY registration flag

OFF : Keyboard input

notregistered
ON : Keyboard input
registered

Goes ON if a file is present during access when

power is interrupted.
Goes ON at registration of keyboard input.
OFF if keyboard input is not registered.

App - 58

S (Status change)/
U

New

QnA

S (Instruction
execution)

New

QnA

APPENDICES

(9) A to QnA conversion correspondences

Special relays SM1000 to SM1255 are the relays which correspond to ACPU special
relays M9000 to M9255 after A to QnA conversion.
These special relays are all set by the system, and cannot be set by the user
program.
To turn them ON/OFF by the user program, change the special relays in the program
into those of QnACPU.
However, some of SM1084 and SM1200 to SM1255 (corresponding to M9084 and
M9200 to M9255 before conversion) can be turned ON/OFF by the user program, if
they could be turned ON/OFF by the user program before conversion.For details on
the ACPU special relays, see the user's manuals for the individual CPUs, and
MELSECNET or MELSECNET/B Data Link System Reference Manuals
The following are additional explanations about the Special Relay for Modification
column.
When a special relay for modification is provided, the device number should
be changed to the provided QnACPU special relay.
When
number.
When

is provided, the converted special relay can be used for the device
is provided, the device number does not work with QnACPU.
Table App. 2.10. Special relay

ACPU
Special
Relay

M9000

Special
Special
Relay after
Relay for
Conversion Modification

SM1000

Name

Fuse blown

Details

Corresponding
CPU

OFF : Normal
ON : Module with blown
fuse

Turned on when there is one or more output modules of

which fuse has been blown.
Remains ON if the condition is restored to normal
thereafter.
Output modules of remote I/O stations are also checked
fore fuse condition.

QnA

QnA

Meaning

M9002

SM1002

I/O module verify

error

OFF : Normal
ON : Error

Turned on if the status of I/O module is different form

entered status when power is turned on.
Remains ON if the condition is restored to normal
thereafter.
I/O module verification is done also to remote I/O station
modules.
Reset is enabled only when special registers SD1116 to
SD1123 are reset.

M9004

SM1004

NIMI link master

module error

OFF : Normal
ON : Error

Goes ON if MINI (S3) link error is detected at even one of

the installed AJ71PT32 (S3) modules.
Remains ON if the condition is restored to normal
thereafter.

QnA

Turns ON if an instantaneous power failure of within 20ms

occurs during use of the AC power supply module.
Reset when the power supply is switched OFF, then ON.

QnA

AC DOWN
detection

OFF : AC DOWN not

detected
ON : AC DOWN detected

Turns ON if an instantaneous power failure of within 1ms

occurs during use of the DC power supply module.
Reset when the power supply is switched OFF, then ON.

QnA

M9005

SM1005

M9006

SM1006

Battery low

OFF : Normal
ON : Battery low

Turns ON when the battery voltage drops to or below the

specified.
Turns OFF when the battery voltage returns to normal
thereafter.

QnA

M9007

SM1007

Battery low latch

OFF : Normal
ON : Battery low

Turns ON when the battery voltage drops to or below the

specified.
Remains ON if the battery voltage returns to normal
thereafter.

QnA

M9008

SM1008

SM1

Self-diagnosis
error

OFF : No error
ON : Error

Turned on when error is found as a result of selfdiagnosis.

QnA

OFF : No F number detected

ON : F number detected

Turned on when OUT F of SET F instruction is

executed.
Switched off when SD1124 data is cleared to zero.

QnA

M9009

SM1009

SM62

Annunciator
detection

App - 59

APPENDICES

Table App. 2.10. Special relay

ACPU
Special
Relay

Special
Special
Relay after
Relay for
Conversion Modification

Name

Meaning

Details

Corresponding
CPU

M9011

SM1011

SM56

Operation error
flag

OFF : No error
ON : Error

Turned on when operation error occurs during execution

of application instruction.
Remains ON if the condition is restored to normal
thereafter.

QnA

M9012

SM1012

SM700

Carry flag

OFF : Carry OFF

ON : Carry ON

Carry flag used in application instruction.

QnA

M9016

SM1016

Data memory clear

flag

OFF : lgnored
ON : Output claered

Clears the data memory including the latch range (other

than special relays and special registers) in remote run
mode from computer, etc. when SM1016 is on.

M9017

SM1017

Data memory clear

flag

OFF : lgnored
ON : Output claered

Clears the unlatched data memory (other than special

relays and special egisters) in remote run mode from
computer, etc. when SM1017 is on.

M9020

SM1020

M9021
M9022

SM1021
SM1022

User timing clock

No.0

User timing clock

No.1

User timing clock

No.2

M9023

SM1023

User timing clock

No.3

M9024

SM1024

User timing clock

No.4

n2 scan

n2 scan

n1 scan

Relay which repeats on/off at intervals of predetermined

scan.
When power is turned on or reset is per-formed, the clock
starts with off.
Set the intervals of on/off by DUTY instruction.

DUTY n1 n2 SM1020
n1: ON scan interval
n2: OFF scan interval

M9025

SM1025

Clock data set

request

OFF : Ignored
ON : Set request present
used

M9026

SM1026

Clock data error

OFF : No error
ON : Error

Switched on by clock data (SD1025 to SD1028) error

Writes the clock data stored in SD1025 to SD1028 to the

CPU module after the END instruction is executed in the
scan in which SM1025 turned from OFF to ON.

M9027

SM1027

Clock data display

OFF : Ignored
ON : Display

Clock data is read from SD1025 to SD1028 and month,

day, hour, minute and minute are indicated on the CPU
module front LED display.

M9028

SM1028

Clock data read

request

OFF : Ignored
ON : Read request

Reads clock data to SD1025 to SD1028 in BCD when

SD1028 is on.

OFF : Batch processing not

conducted
ON : Batch processing
conducted

The SM1029 relay is turned on using a sequence program

to process all data communication requests accepted
during one scan in the END processing of that scan.
The batch processing of the data communication requests
can be turned on and off during running.
The default is OFF (processed one at a time for each END
processing in the order in which data communication
requests are accepted).

Batch processing
of data
communications
requests

M9029

SM1029

M9030

SM1030

0.1 second clock

0.05s

M9031

SM1031

0.2 second clock

0.1s

M9032

SM1032

1 second clock

0.5s

M9033

SM1033

2 second clock

1s

QnA
QnA
QnA
QnA
QnA

QnA

QnA
Q3A
Q4A
Q4AR
QnA

0.05s

0.1s

0.5s

0.1 second, 0.2 second, 1 second and 2 second, clocks

are generated.
Not turned on or off per scan but turned on and off even
during scan if corresponding time has elapsed.
Starts with off when PLC power supply is turned on or
CPU module reset is performed.

QnA

Alternates between ON and OFF according to the

seconds specified at SD414. (Default: n = 30)
Not turned on or off per scan but turned on and off even
during scan if corresponding time has elapsed.
Starts with off when PLC power supply is turned on or
CPU module reset is performed..

QnA

Used as dummy contacts of initialization and application

instruction in sequence program.
SM1038 and SM1037 are turned on and off without regard
to position of key switch on CPU module front. SM1038
and SM1039 are under the same condition as RUN status
except when the key switch is at STOP position, and
turned off and on. Switched off if the key switch is in STOP
position. SM1038 is on for one scan only and SM1039 is
off for one scan only if the key switch is not in STOP
position.

QnA

1s

M9034

SM1034

2n minute clock(1
minute clock)*

ns

M9036

SM1036

Always ON

ON
OFF

M9037

SM1037

Always OFF

ON
OFF

M9038

SM1038

ON for 1 scan only

after RUN

ON
OFF

1 scan

M9039

SM1039

RUN flag(After
RUN, OFF for 1
scan only)

ON
OFF

1 scan

ns

App - 60

APPENDICES

Table App. 2.10. Special relay

ACPU
Special
Relay
M9040

Special
Special
Relay after
Relay for
Conversion Modification
SM1040

Name

Meaning

SM206

PAUSE enable coil

OFF : PAUSE disabled

ON : PAUSE enabled
OFF : PAUSE not in effect
ON : PAUSE in effect

M9041

SM1041

SM204

PAUSE status
contact

M9042

SM1042

SM203

STOP status
contact

OFF : STOP not in effect

ON : STOP in effect

SM805

Sampling trace
completed

OFF : Sampling trace in

progress
ON : Sampling trace
completed

M9043

SM1043

M9045

SM1045

M9046

SM1046

SM802

Details

Corresponding
CPU

When RUN key switch is at PAUSE position or pause

contact has turned on and if SM204 is on, PAUSE mode is
set and SM206 is turned on.

QnA

Switched on when the RUN key switch or RUN/STOP

switch is in STOP position.

QnA

Turns on when sampling trace is performed by the number

of times set by the peripheral device after the STRA
instruction is executed.

QnA

This relay is reset by executing the STRAR instruction.

Watchdog timer
(WDT) reset

OFF : Does not reset WDT

ON : Resets WDT

The SM1015 relay is turned on to reset the WDT when the

ZCOM instruction and data communication request batch
processing are executed (used when the scan time
exceeds 200 ms).

Sampling trace

OFF : Trace not in progress

ON : Trace in progress

Switched on during sampling trace.

QnA

Sampling trace is not executed unless SM801 is turned

ON.
Sampling trace is suspended when SM801 goes OFF.

QnA

QnA

M9047

SM1047

SM801

Sampling trace
preparations

OFF : Sampling trace

suspended
ON : Sampling trace
started

M9049

SM1049

SM701

Switching the
number of output
characters

OFF : Output until NULL

code encountered
ON : 16 characters output

When SM701 is OFF, characters up to NULL (00H) code

are output.
When SM701 is ON, ASCII codes of 16 characters are
output.

M9051

SM1051

CHG instruction
execution disable

OFF : Enabled
ON : Disable

Switched ON to disable the CHG instruction.

Switched ON when program transfer is requested.
Automatically switched OFF when transfer is complete.

M9052

SM1052

SEG instruction
switch

OFF : 7SEG segment

display
ON : I/O partial refresh

When SM1052 is ON, the SEG instruction is executed as

an I/O partial refresh instruction.
When SM1052 is OFF, the SEG instruction is executed as
a 7-SEG display instruction.

M9054

SM1054

SM205

STEP RUN flag

OFF : STEP RUN not in

effect
ON : STEP RUN in effect

Switched on when the RUN key switch is in STEP RUN

position.

QnA

M9055

SM1055

SM808

Status latch
completion flag

OFF : Not completed

ON : Completed

Turned on when status latch is completed.

Turned off by reset instruction.

QnA

M9056

SM1056

Main side P, I set

request

OFF : Other than when P, I

set being requested
ON : P, I set being
requested

M9057

SM1057

Sub side P, I set

request

OFF : Other than when P, I

set being requested
ON : P, I set being
requested

M9058

SM1058

Main side P, I set

completion

Momentarily ON at P, I set
completion

M9059

SM1059

Sub program P, I
set completion

Momentarily ON at P, I set
completion

M9060

SM1060

Sub program 2 P, I
set request

OFF : Other than when P, I

set being requested
ON : P, I set being
requested

M9061

SM1061

Sub program 3 P, I
set request

OFF : Other than when P, I

set being requested
ON : P, I set being
requested

*: 1 minute clock indicates the name of the special relay (M9034) of the ACPU.

App - 61

Provides P, I set request after transfer of the other

program (for example subprogram when main program is
being run) is complete during run. Automatically switched
off when P, I setting is complete.

Turned ON once when the P, I set has been completed,

and then turned OFF again.

Provides P, I set request after transfer of the other

program (for example subprogram when main program is
being run) is complete during run. Automatically switched
off when P, I setting is complete.

APPENDICES

Table App. 2.10. Special relay

ACPU
Special
Relay

Special
Special
Relay after
Relay for
Conversion Modification

Name

Meaning

Details

Corresponding
CPU

M9065

SM1065

SM711

Divided transfer
status

OFF : Divided processing

not underway
ON : During divided
processing

Turned on when canvas screen transfer to AD57(S1)/

AD58 is done by divided processing, and turned off at
completion of divided processing

QnA

M9066

SM1066

SM712

Transfer
processing switch

OFF : Batch transfer

ON : Divided transfer

Turned on when canvas screen transfer to AD57(S1)/

AD58 is done by divided processing.

QnA

M9070

SM1070

A8UPU/
A8PUJrequired
search time*2

OFF : Read time not

shortened
ON : Read time shortened

Turned ON to shorten the search time in the A8UPU/

A8PUJ.
(In this case, the scan time is extended by 10 %.)

Communication
request
registration area
BUSY signal

OFF : Empty spaces in

communication
request registration
area
ON : No empty spaces in
communication
request registration
area

Indication of communication enable/disable to remote

terminal modules connected to the AJ71PT32-S3, A2C or
A52G.

QnA

It is set whether the error checks below are performed or not

when the END instruction is processed (to set the END
instruction processing time).
Check for fuse blown.
Check of battery
Collation check of I/O module

M9081

SM1081

SM714

M9084

SM1084

Error check

OFF : Error check executed

ON : No error check

M9091

SM1091

Operation error
details flag

OFF : No error
ON : Error

Turns ON when the detail factor of the operation error is

stored into SD1091.
Remains ON if the condition is restored to normal
thereafter.

QnA

M9094

SM1094

SM251

I/O exchange flag

OFF : Exchanged
ON : Not exchanged

The I/O module can be changed online (with power on)

when SM251 is turned ON after the head I/O number of
the I/O module is set to SD251. (One module only is
allowed to be changed by one setting.)
To be switched on in the program or peripheral device test
mode to change the module during CPU RUN. To be
switched on in peripheral device test mode to change the
module during CPU STOP.
RUN/STOP mode must not be changed until I/O module
change is complete.

M9100

SM1100

SM320

Presence/absence
of SFC program

OFF : SFC programs not

used
ON : SFC programs used

Turned on if the SFC program is registered.

Turned off if the SFC program is not registered.

QnA

QnA

M9101

SM1101

SM321

Start/stop SFC
program

OFF : SFC programs stop

ON : SFC programs start

The value in SM320 is set as the initial value.

(The relay automatically turns ON when the SFC program
is present.)
When this relay turns from ON to OFF, execution of the
SFC program stops.
When this relay turns from OFF to ON, execution of the
SFC program resumes.

M9102

SM1102

SM322

SFC program start

status

OFF : Initial start

ON : Resume start

The SFC program start mode in the SFC setting of the

PLC parameter dialog box is set as the initial value.
At initial start: OFF
At continue start: ON

*2: The A8UPU/A8PUJ is not available for the QnACPU.

App - 62

QnA

APPENDICES

Table App. 2.10. Special relay

ACPU
Special
Relay
M9103

Special
Special
Relay after
Relay for
Conversion Modification
SM1103

Name

Meaning

Details

Corresponding
CPU

SM323

Presence/absence
of continuous
transition

OFF : Continuous transition

not effective
ON : Continuous transition
effective

Set whether continuous transition will be performed for the

block where the "continuous transition bit" of the SFC
information device is not set.

QnA

OFF : When transition is

completed
ON : When no transition

OFF during operation in the continuous transition mode or

during continuous transition, and ON when continuous
transition is not executed.
Always ON during operation in the no continuous
transition mode.

QnA

OFF : Monitoring timer reset

ON : Monitoring timer reset
start

Turns ON when the measurement of the step transition

monitoring timer is started.
Turning this relay OFF resets the step transition
monitoring timer.

QnA

M9104

SM1104

SM324

Continuous
transition
suspension flag

M9108

SM1108

SM90

Step transition
monitoring timer
start (equivalent of
SD90)

M9109

SM1109

SM91

Step transition
monitoring timer
start (equivalent of
SD91)

M9110

SM1110

SM92

Step transition
monitoring timer
start (equivalent of
SD92)

M9111

SM1111

SM93

Step transition
monitoring timer
start (equivalent of
SD93)

M9112

SM1112

SM94

Step transition
monitoring timer
start (equivalent of
SD94)

M9113

SM1113

SM95

Step transition
monitoring timer
start (equivalent of
SD95)

M9114

SM1114

SM96

Step transition
monitoring timer
start (equivalent of
SD96)

M9180

SM1180

SM825

Active step
sampling trace
completion flag

OFF : Trace started

ON : Trace completed

Set when sampling trace of all specified blocks is

completed. Reset when sampling trace is started.

QnA

M9181

SM1181

SM822

Active step
sampling trace
execution flag

OFF : Trace not being

executed
ON : Trace execution under
way

Set when sampling trace is being executed.Reset when

sampling trace is completed or suspended

QnA

M9182

SM1182

SM821

Active step
sampling trace
permission

OFF : Trace disable/

suspend
ON : Trace enable

Selects sampling trace execution enable/disable.

ON: Sampling trace execution is enabled.
OFF: Sampling trace execution is disabled. If turned off
during sampling trace execution, trace is suspended.

QnA

OFF : Coil output OFF

ON : Coil output ON

Selects the operation output when block stop is executed.

ON: Retains the ON/OFF status of the coil being used by
using operation output of the step being executed at block
stop.
OFF: All coil outputs are turned off. (Operation output by the
SET instruction is retained regardless of the ON/OFF status
of M9196.)

QnA

M9196

SM1196

SM325

Operation output
at block stop

SM
1198

I/O numbers
to be
displayed

OFF

OFF

X/Y0 to 7F0

ON

OFF

X/Y800 to
FF0

OFF

ON

X/Y1000 to
17F0

ON

ON

X/Y1800 to
1FF0

SM
1197
M9197

SM1197
Switch between
blown fuse and I/O
verify error display

M9198

M9199

SM1198

SM1199

Data recovery of
online sampling
trace/status latch

OFF : Data recovery

disabled
ON : Data recovery
enabled

App - 63

Switches I/O numbers in the fuse blow module storage

registers (SD1100 to SD1107) and I/O module verify error
storage registers (SD1116 to SD1123) according to the
combination of ON/OFF of the SM1197 and SM1198.

Recovers the setting data stored in the CPU module at

restart when sampling trace/status latch is executed.
SM1199 should be ON to execute again. (Unnecessary
when writing the data again from peripheral devices.)

APPENDICES

Table App. 2.10. Special relay

ACPU
Special
Relay

M9200

M9201

M9202

M9203

M9204

Special
Special
Relay after
Relay for
Conversion Modification

SM1200

SM1201

SM1202

SM1203

SM1204

Name

Depends on whether or not the ZNRD (word device read)

instruction has been received.
Used in the program as an interlock for the ZNRD
instruction.
Use the RST instruction to reset.

QnA

ZNRD instruction
(LRDP instruction
for ACPU)
completion (for
master station)

OFF : Not completed

ON : End

Depends on whether or not the ZNRD (word device read)

instruction execution is complete.
Used as a condition contact for resetting M9200 and
M9201 after the ZNRD instruction is complete.
Use the RST instruction to reset.

QnA

ZNWR instruction
(LWTP instruction
for ACPU)
reception (for
master station)

OFF : Not accepted

ON : Accepted

Depends on whether or not the ZNWR (word device

write) instruction has been received.
Used in the program as an interlock for the ZNWR
instruction.
Use the RST instruction to reset.

QnA

ZNWR instruction
(LWTP instruction
for ACPU)
completion (for
master station)

OFF : Not completed

ON : End

Depends on whether or not the ZNWR (word device

write) instruction execution is complete.
Used as a condition contact to reset M9202 and M9203
after the ZNWR instruction is complete.
Use the RST instruction to reset.

QnA

ZNRD instruction
(LRDP instruction
for ACPU)
reception (for local
station)

OFF : Not completed

ON : End

On indicates that the ZNRD instruction is complete at the

local station.

QnA

OFF : Not completed

ON : End

On indicates that the ZNWR instruction is complete at the

local station.

QnA

OFF : Normal
ON : Abnormal

Depends on whether or not the link parameter setting of

the host is valid.

QnA

OFF
ON

Depends on whether or not the link parameter setting of

the master station in tier two matches that of the master
station in tier three in a three-tier system.
(Valid for only the master station in a three-tier system.)

QnA

QnA

QnA

SM1205

M9206

SM1206

Host station link

parameter error

M9208

SM1208

Corresponding
CPU

OFF : Not accepted

ON : Accepted

M9205

SM1207

Details

ZNRD instruction
(LRDP instruction
for ACPU)
reception (for
master station)

ZNWR instruction
(LWTP instruction
for ACPU) reception (for local
station)

M9207

Meaning

Link parameter
check results

: Match
: Mismatch

Sets master
station B and W
transmission range
(for lower link
master stations
only)

OFF : Transmits to tier2 and

tier 3
ON : Transmits to tier2 only

Depends on whether or not the B and W data controlled by

higher-link master station (host station) is sent to lowerlink local stations (tertiary stations).
When SM1208 is OFFB and W of host station is sent to
tertiary stations.
When SM1208 is ONB and W of host station is not sent to
tertiary stations.

OFF : Executing the check

function
ON : Check non-execution

Set to ON not to match B and W of the higher and lower

links.
When SM1209 is ON, the link parameters of the higher
and lower link are not checked.
When SM1209 is OFF, the link parameters of the higher
and lower link are checked.

M9209

SM1209

Link parameter
check command
(for lower link
master stations
only)

M9210

SM1210

Link card error (for

master station)

OFF : Normal
ON : Abnormal

Control is performed depending on whether the link card

hardware is faulty or not.

QnA

M9211

SM1211

Link module error

(for local station
use)

OFF : Normal
ON : Abnormal

Control is performed depending on whether the link card

hardware is faulty or not.

QnA

M9224

SM1224

Link status

OFF : Online
ON : Offline,station-tostation test, or selfloopback test

Depends on whether the master station is online or offline or

is in station-to-station test or self-loopback test mode.

QnA

M9225

SM1225

Forward loop error

OFF : Normal
ON : Abnormal

Depends on the error condition of the forward loop line.

QnA

M9226

SM1226

Reverse loop error

OFF : Normal
ON : Abnormal

Depends on the error condition of the reverse loop line.

QnA

Depends on whether or not the master station is executing a

forward or a reverse loop test.

QnA

M9227

SM1227

Loop test status

OFF : Not being executed

ON : Forward or reverse
loop test execution
underway

M9232

SM1232

Local station
operation status

OFF : RUN or STEP RUN

status
ON : STOP or PAUSE
status

Control is performed depending on whether a local station is

in the STOP or PAUSE mode.

QnA

M9233

SM1233

Local station error

detect status

OFF : No errors
ON : Error detection

Depends on whether or not a local station has detected an

error in another station.

QnA

App - 64

APPENDICES

Table App. 2.10. Special relay

ACPU
Special
Relay
M9235

Special
Special
Relay after
Relay for
Conversion Modification
SM1235

Name

Meaning

Details

Corresponding
CPU

Local station,
remote I/O station
parameter error
detect status

OFF : No errors
ON : Error detection

Depends on whether or not a local or a remote I/O station

has detected any link parameter error in the master station

QnA

OFF : No communications
ON : Communications
underway

Depends on the results of initial communication between a

local or remote I/O station and the master station.
(Parameter communication, etc.)

QnA

M9236

SM1236

Local station,
remote I/O station
initial
communications
status

M9237

SM1237

Local station,
remote I/O station
error

OFF : Normal
ON : Abnormal

Depends on the error condition of a local or remote I/O

station.

QnA

M9238

SM1238

Local station,
remote I/O station
forward or reverse
loop error

OFF : Normal
ON : Abnormal

Depends on the error condition of the forward and reverse

loop lines of a local or a remote I/O station.

QnA

M9240

SM1240

Link status

OFF : Online
ON : Offline, station-tostationtest, or selfloopback test

Depends on whether the local station is online or offline, or is

in station-to-station test or self-loopback test mode.

QnA

M9241

SM1241

Forward loop line

error

OFF : Normal
ON : Abnormal

Depends on the error condition of the forward loop line.

QnA

M9242

SM1242

Reverse loop line

error

OFF : Normal
ON : Abnormal

Depends on the error condition of the reverse loop line.

QnA

M9243

SM1243

Loopback
implementation

OFF : Loopback not being

conducted
ON : Loopback
implementation

Depends on whether or not loopback is occurring at the local

station.

QnA

M9246

SM1246

Data not received

OFF : Reception
ON : No reception

Depends on whether or not data has been received from the

master station.

QnA

M9247

SM1247

Data not received

OFF : Reception
ON : No reception

Depends on whether or not a tier three station has received

data from its master station in a three-tier system.

QnA

M9250

SM1250

Parameters not
received

OFF : Reception
ON : No reception

Depends on whether or not link parameters have been

received from the master station.

QnA

Depands on the data link condition at the local station.

QnA

M9251

SM1251

Link relay

OFF : Normal
ON : Abnormal

M9252

SM1252

Loop test status

OFF : Not being executed

ON : Forward or reverse
loop test execution
underway

Depends on whether or not the local station is executing a

forward or a reverse loop test.

QnA

M9253

SM1253

Master station
operation status

OFF : RUN or STEP RUN

status
ON : STOP or PAUSE
status

Control is performed depending on whether the master

station is in the STOP or PAUSE mode.

QnA

M9254

SM1254

Local station other

than host station
operation status

OFF : RUN or STEP RUN

status
ON : STOP or PAUSE
status

Control is performed depending on whether a local station

other than the host is in the STOP or PAUSE mode.

QnA

M9255

SM1255

Local station other

than host station
error

OFF : Normal
ON : Abnormal

Depends on whether or not a local station other than the host

is in error.

QnA

App - 65

APPENDICES

(10)Process control instructions

Table App. 2.11. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9
SM1500

Hold mode

OFF : No-hold
ON : Hold

Specifies whether or not to hold the output value

when a range over occurs for the S.IN instruction
range check.

SM1501

Hold mode

OFF : No-hold
ON : Hold

Specifies whether or not the output value is held

when a range over occurs for the S.OUT instruction
range check.

New

Q4AR

New

Q4AR

(11)For redundant systems (Host system CPU information *1)

SM1510 to SM1599 are only valid for redundant systems.
All off for standalone systems.
Table App. 2.12. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9

SM1510

Operation mode

OFF : Redundant system

backup mode, standalone system
ON : Redundant system
separate mode

SM1511

Start mode when

power supply is on

OFF : System A fixed mode

ON : Previous control
system latch mode

SM1512

Start mode when CPU

is started

SM1513

Turns on when the operating mode is redundant

system separate.

S (Each END)

New

Q4AR

Turns on when the start mode for a redundant

system when the power is turned on is the previous
control system latch mode.

S (Initial)

New

Q4AR

OFF : Initial start

ON : Hot start

Turns on when the CPU module operation mode is

hot start when the redundant system is started up.

S (Initial)

New

Q4AR

Operation status when

CPU is started

OFF : Initial start

ON : Hot start

Turns on when the CPU module operation mode is

hot start when the redundant system is actually start
up.

S (Initial)

New

Q4AR

SM1514

Operation mode at
CPU module change

OFF : Initial start

ON : Hot start

Turns on when the operation is hot start when the

CPU module operation is switched for a redundant
system.

S (Initial)

New

Q4AR

SM1515

Output hold mode

OFF : Output reset

ON : Output hold

Turns on when the output mode during a stop error is

output hold.

S (Each END)

New

Q4AR

SM1516

Operation system
status

OFF : Control system

ON : Standby system

Turns on when the CPU module operation system

status is the standby system.

S (Status change)

New

Q4AR

*1: The information of the host CPU module is stored.

App - 66

APPENDICES

Table App. 2.12. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9
SM1517

SM1518

CPU module startup

status

Tracking execution
mode

OFF : Power supply on

startup
ON : Operation system
switch start up

Turns on when the CPU module is started up by the

operation system switch.
Reset using the user program.

S (Status change)/
U

New

Q4AR

OFF : Batch transfer mode

ON : Carryover mode

When this relay is turned OFF, the start of tracking is

delayed until it is executable if the tracking memory
is being used at END.
When this relay is turned ON, the start of tracking is
carried over to next END if the tracking memory is
being used at END.

New

Q4AR

New

Q4AR

SM1520

SM1520

Block 1

SM1521

SM1521

Block 2

SM1522

SM1522

Block 3

SM1523

SM1523

Block 4

SM1524

SM1524

Block 5

SM1525

SM1525

Block 6

SM1526

SM1526

Block 7

SM1527

SM1527

Block 8

SM1528

SM1528

Block 9

SM1529

SM1529

Block 10

SM1530

SM1530

Block 11

SM1531

SM1531

Block 12

SM1532

SM1532

Block 13

SM1533

SM1533

Block 14

SM1534

Block 15

SM1535

Block 16

SM1536

SM1536

Block 17

SM1537

SM1537

Block 18

SM1538

SM1538

Block 19

SM1539

SM1539

Block 20

SM1540

SM1540

Block 21

SM1541

SM1541

Block 22

SM1542

SM1542

Block 23

SM1543

SM1543

Block 24

SM1544

SM1544

Block 25

SM1545

SM1545

Block 26

SM1546

SM1546

Block 27

SM1547

SM1547

Block 28

SM1548

SM1548

Block 29

SM1534
SM1535

Data tracking transfer

trigger specification

OFF : No trigger
ON : Trigger

When data is transferred by

the data tracking instruction
S. TRUCK, the target block
is specified as trigger.

App - 67

APPENDICES

Table App. 2.12. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9
SM1549

SM1549

Block 30

SM1550

SM1550

Block 31

SM1551

SM1551

Block 32

SM1552

SM1552

Block 33

SM1553

SM1553

Block 34

SM1554

SM1554

Block 35

SM1555

SM1555

Block 36

SM1556

SM1556

Block 37

SM1557

SM1557

Block 38

SM1558

SM1558

Block 39

SM1559

SM1559

Block 40

SM1560

SM1560

Block 41

SM1561

SM1561

Block 42

SM1562

SM1562

Block 43

SM1563

SM1563

Block 44

SM1564

SM1564

Block 45

SM1565

SM1565

Block 46

SM1566

Block 47

SM1567

Block 48

SM1568

SM1568

Block 49

SM1569

SM1569

Block 50

SM1570

SM1570

Block 51

SM1571

SM1571

Block 52

SM1572

SM1572

Block 53

SM1573

SM1573

Block 54

SM1574

SM1574

Block 55

SM1575

SM1575

Block 56

SM1576

SM1576

Block 57

SM1577

SM1577

Block 58

SM1578

SM1578

Block 59

SM1579

SM1579

Block 60

SM1580

SM1580

Block 61

SM1581

SM1581

Block 62

SM1582

SM1582

Block 63

SM1583

SM1583

Block 64

SM1590

Turns ON when switching could not be executed

normally if the network module had detected a
network fault and issued a switching request to the
host CPU module.

SM1566
SM1567

Data tracking
transmission link
specification

Switching status from

the network module

OFF : No trigger
ON : Trigger

OFF : Normal
ON : Switching
unsuccessful

When data is transferred by

the data tracking instruction
S. TRUCK, the target block
is specified as trigger.

App - 68

New

Q4AR

S (Error ocurrs)

New

Q4AR

APPENDICES

(12)For redundant system (Other system CPU information *1)

SM1600 to SM1650 only valid for the CPU redundant system backup mode, so they
cannot be refreshed during the separate mode.
Either the backup mode or the separate mode is valid for the SM4651 to SM1699.
SM1600 to SM1699 are all turned off for stand-alone system.
Table App. 2.13. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresp
onding
Host
SM
*2

Corresponding
CPU

SM1600

Diagnosis error

OFF : No error
ON : Error

Turns on if a error occurs in the diagnosis results.

(Including external diagnosis)
Remains on even if returns to normal thereafter.

S (Each END)

SM0

Q4AR

SM1601

Self diagnosis error

OFF : No self diagnosis

error
ON : Self diagnosis error

Turns on when an error occurs in the self-diagnosis

results.
Remains on even if returns to normal thereafter.

S (Each END)

SM1

Q4AR

SM1605

Error common
information

OFF : No error common

information
ON : Error common
information

Turns on when there is error common information

and the SM1600 is on.

S (Each END)

SM5

Q4AR

SM1616

Error individual
information

OFF : No error individual

information
ON : Error individual
information

Turns on when there is error individual information

and the SM1600 is on.

S (Each END)

SM16

Q4AR

SM1653

STOP contact

STOP status

Turns on when in the STOP status.

S (Each END)

SM203

Q4AR

SM1654

PAUSE contact

PAUSE status

Turns on when in the PAUSE status.

S (Each END)

SM204

Q4AR

SM1655

STEP-RUN contact

STEP-RUN status

Turns on when in the STEP-RUN status.

S (Each END)

SM205

Q4AR

*1 Stores other system CPU diagnostic information and system information.

*2 This shows the special relay(SM

) for the host system CPU.

App - 69

APPENDICES

(13)For redundant system (tracking)

Either the backup mode or the separate mode is valid for SM1700 to SM1799.
All is turned off for stand-alone system.
Table App. 2.14. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9
SM1700

Tracking execution
flag

OFF : Execution not

possible
ON : Execution possible

Turns on when tracking can be normally executed.

SM1712

SM1712

Block 1

SM1713

SM1713

Block 2

SM1714

SM1714

Block 3

SM1715

SM1715

Block 4

SM1716

SM1716

Block 5

SM1717

SM1717

Block 6

SM1718

SM1718

Block 7

SM1719

SM1719

Block 8

SM1720

SM1720

Block 9

SM1721

SM1721

Block 10

SM1722

SM1722

Block 11

SM1723

SM1723

Block 12

SM1724

SM1724

Block 13

SM1725

SM1725

Block 14

SM1726

SM1726

Block 15

SM1727

SM1727

Block 16

SM1728

SM1728

Block 17

SM1729

SM1729

Block 18

SM1730

SM1730

Block 19

SM1731

SM1731

Block 20

SM1732

SM1732

Block 21

SM1733

SM1733

Block 22

SM1734

SM1734

Block 23

SM1735

Block 24

SM1735
SM1736

Transfer trigger
completion flag

OFF : Transfer uncompleted

ON : Transfer completed

SM1736

Block 25

SM1737

SM1737

Block 26

SM1738

SM1738

Block 27

SM1739

SM1739

Block 28

SM1740

SM1740

Block 29

SM1741

SM1741

Block 30

SM1742

SM1742

Block 31

SM1743

SM1743

Block 32

SM1744

SM1744

Block 33

SM1745

SM1745

Block 34

SM1746

SM1746

Block 35

SM1747

SM1747

Block 36

SM1748

SM1748

Block 37

SM1749

SM1749

Block 38

SM1750

SM1750

Block 39

SM1751

SM1751

Block 40

SM1752

SM1752

Block 41

SM1753

SM1753

Block 42

SM1754

SM1754

Block 43

SM1755

SM1755

Block 44

SM1756

SM1756

Block 45

SM1757

SM1757

Block 46

SM1758

SM1758

Block 47

SM1759

SM1759

Block 48

Turns ON only during one

scan when the transmission
of the corresponding data is
completed.

App - 70

S (status change)

New

Q4AR

S (status change)

New

Q4AR

APPENDICES

Table App. 2.14. Special relay

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

M9
SM1760

SM1760

Block 49

SM1761

SM1761

Block 50

SM1762

SM1762

Block 51

SM1763

SM1763

Block 52

SM1764

SM1764

Block 53

SM1765

SM1765

Block 54

SM1766

SM1766

Block 55

SM1767

Block 56

SM1768

Block 57

SM1769

SM1769

Block 58

SM1770

SM1770

Block 59

SM1771

SM1771

Block 60

SM1772

SM1772

Block 61

SM1773

SM1773

Block 62

SM1774

SM1774

Block 63

SM1775

SM1775

Block 64

SM1767
SM1768

Transmission trigger
end flag

OFF : Transmission
uncompleted
ON : Transmission end

Turns ON only during one

scan when the transmission
of the corresponding data is
completed.

App - 71

S (status change)

New

Q4AR

APPENDICES

APPENDIX 3 Special Register List

The special registers, SD, are internal registers with fixed applications in the PLC.
For this reason, it is not possible to use these registers in sequence programs in the same
way that normal registers are used.
However, data can be written as needed in order to control the CPU modules and remote
I/O modules.
Data stored in the special registers are stored as BIN values if no special designation has
been made to the contrary.
The heading descriptions in the following special register lists are shown in Table App. 3.1.
Table App. 3.1. Special register
Item

Function of Item

Number

Indicates special register number

Name

Indicates name of special register

Meaning

Indicates contents of special register

Explanation

Discusses contents of special register in more detail

Set by
(When set)

Corresponding ACPU
M9

Corresponding CPU

Indicates whether the relay is set by the system or user, and, if it is set by the system, when setting is performed.
<Set by>
S
: Set by system
U
: Set by user (sequence programs or test operations from GX Developer)
S/U
: Set by both system and user
<When set>
Indicated only for registers set by system
Each END
: Set during each END processing
Initial
: Set only during initial processing (when power supply is turned ON, or when going from STOP to RUN)
Status change
: Set only when there is a change in status
Error
: Set when error occurs
Instruction execution
: Set when instruction is executed
Request
: Set only when there is a user request (through SM, etc.)
System switching
: Set when system switching is executed.
Indicates corresponding special register in ACPU
(When the contents are changed, the special register is represented D9
New indicates the special register newly added to the QnACPU.

format change.)

Indicates the relevant CPU module.

QnA
: Can be applied to QnA series and Q2ASCPU series
Each CPU type name
: Can be applied only to the specific CPU. (e.g. Q4AR, Q2AS)

For details on the following items, refer to the following manuals:

Networks

Manual of the corresponding network module

SFC

QCPU(Q mode)/QnACPU Programming Manual (SFC)

App - 72

APPENDICES

(1) Diagnostic Information

Table App. 3.2. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
SD0

Diagnostic
errors

Diagnosis error
code

Error codes for errors found by diagnosis are stored as BIN data.
Contents identical to latest fault history information.

S (Error)

D9008
format
change

QnA

Year (last two digits) and month that SD0 data was updated is stored as
BCD 2-digit code.
SD1

SD2

b15 to
b8 b7 to
b0
Year (0 to 99) Month (1 to 12)
Clock time for
diagnosis error
occurrence

Clock time for

diagnosis error
occurrence

QnA

(Example) October, 1995

H9510

The day and hour that SD0 was updated is stored as BCD 2-digit code.

b15 to
b8 b7 to
b0
Day (1 to 31) Hour (0 to 23)

(Example) 10 a.m. on 25th

H2510

S (Error)

New

QnA

The minute and second that SD0 data was updated is stored as BCD 2digit code.
SD3

b15
to
b8 b7
to
b0
Minutes (0 to 59) Seconds (0 to 59)

QnA

(Example) 35 min. 48 sec.

H3548

Category codes which help indicate what type of information is being

stored in the common information areas (SD5 through SD15) and the
individual information areas (SD16 through SD26) are stored here.
The category code for judging the the error information type is stored.

b15
b8 b7
b0
to
to
Individual information Common information
category codes
category codes

SD4

Error
information
categories

Error information
category code

The common information category codes store the following codes:

0 : No error
1: Unit/module No.
2: File name/Drive name
3: Time (value set)
4: Program error location
5: System switching cause (for Q4ARCPU only)
6: Power supply No.
The individual information category codes store the following codes:
0: No error
1: (Empty)
2: File name/Drive name
3: Time (value actually measured)
4: Program error location
5: Parameter number
6: Annunciator number
7: CHK instruction failure No.

App - 73

S (Error)

New

QnA

APPENDICES

Table App. 3.2. Special register

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

D9
Common information corresponding to the error codes (SD0) is stored
here.
The following five types of information are stored here:
The error common information type can be judged by the "common
information category code" in SD4. (The values of the "common
information category code" stored in SD4 correspond to following 1) to 5).)
1)
Slot No.

SD5

SD6

Number
SD5
SD6
SD7
SD8
SD9
SD10
SD11
SD12
SD13
SD14
SD15

SD7

SD8

SD9

SD10

SD11

SD12

SD13

SD14

SD15

Error common
information

Error common
information

Meaning
Slot No. 1
I/O No. 2

(Empty)

*1: Definitions of slot No.

<Slot No.>
Value used to identify the slot of each base unit and the module mounted
on that slot.
The I/O slot 0 (slot on the right side of the CPU slot) of the main base
unit is defined as the slot of "Slot No. = 0".
The slot Nos. are consecutively assigned to the slots of the base units in
order of the main base unit and extension base units 1 to 7.
When the number of base unit slots has been set in the I/O assignment
setting of the PLC parameter dialog box, the slot Nos. are assigned for
only the number of set slots.
*2: When 0FFFFH is stored into SD6 (I/O No.), the I/O No. cannot be
identified due to overlapping I/O No., etc. in the I/O assignment setting of
the PLC parameter dialog box. Therefore, identify the error location using
SD5.
2)
File name/Drive name

(Example) File name =

Number
Meaning
ABCDEFGH. IJK
SD5
Drive
b15 to b8 b7 to b0
SD6
42H(B) 41H(A)
SD7
File name
44H(D) 43H(C)
SD8
(ASCII code: 8 characters)
46H(F) 45H(E)
SD9
48H(H) 47H(G)
SD10 Extension 3
2EH(.)
49H(I) 2EH(.)
SD11 (ASCII code: 3 characters)
4BH(K) 4AH(J)
SD12
SD13
(Empty)
SD14
SD15

App - 74

S (Error)

New

QnA

APPENDICES

Table App. 3.2. Special register

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

D9
3)

Time (value set)

Number
SD5
SD6
SD7
SD8
SD9
SD10
SD11
SD12
SD13
SD14
SD15

SD5

SD6

4)

SD7

Meaning
Time : 1 s units (0 to 999 s)
Time : 1ms units (0 to 65535ms)

(Empty)

Program error location

Meaning
Number
SD5
File name
SD6
(ASCII code: 8 characters)
SD7
SD8
2EH(.)
SD9 Extension 3
(ASCII code: 3 characters)
SD10
SD11
Pattern 4
SD12
Block No.
SD13
Step No./transition condition
Sequence
step No. (L)
SD14
Sequence step No. (H)
SD15

SD8

SD9

S (Error)

New

QnA

S (Error)

New

Q4AR

*4 : Contents of pattern data

15 14
0 0

to
to

4 3 2 1 0
0 0

SFC block designation present

(1)/absent (0)

(Not used)
SD10

Error common
information

(Bit number)

SFC step designation present

(1)/absent (0)

Error common
information

SFC transition designation present

(1)/absent (0)
5)
SD11

Reason(s) for system switching

Number

Meaning
System switching condition
(0: automatic system switching/
1: manual system switching)
System switching direction
(0:standby system to control system/
1: control system to standby system)
Tracking flag 5

SD5

SD6
SD12

SD13

SD14

SD7
SD8
SD9
SD10
SD11
SD12
SD13
SD14
SD15

(Empty)

*5 : Tracking flag contents

Shows whether or not the tracking data is valid.

15 14
0 0

to
to

4 3 2 1 0
0 0

(Not used)
SD15

(Bit number)
Initial work data
invalid (0)/valid (1)
System data
(SFC active step information)
invalid (0)/valid (1)
System switching condition
invalid (0)/valid(1)

App - 75

APPENDICES

Table App. 3.2. Special register

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

D9
Individual information corresponding to error codes (SD0) is stored here.
There are the following seven different types of information are stored.
The error individual information type can be judged by the "individual
information category code" in SD4. (The values of the "individual
information category code" stored in SD4 correspond to following 1) to
7).)

SD16

1)

(Empty)

2)

File name/Drive name

SD17

Number
Meaning
SD16
Drive
SD17
File name
SD18
SD19 (ASCII code: 8 characters)
SD20
2EH(.)
SD21 Extension 3
SD22 (ASCII code: 3 characters)
SD23
SD24
(Empty)
SD25
SD26

SD18

3)
SD19

4)
SD21

SD22

Time (value actually measured)

Number
SD16
SD17
SD18
SD19
SD20
SD21
SD22
SD23
SD24
SD25
SD26

SD20

Error common
information

Error common
information

(Example) File name =

ABCDEFGH. IJK
b15 to b8 b7 to b0
42H(B) 41H(A)
44H(D) 43H(C)
46H(F) 45H(E)
48H(H) 47H(G)
49H(I)
2EH(.)
4BH(K) 4AH(J)

Meaning
Time : 1 s units (0 to 999 s)
Time : 1ms units (0 to 65535ms)

(Empty)

Program error location

Number
Meaning
SD16
SD17
File name
SD18
(ASCII code: 8 characters)
SD19
2EH(.)
SD20 Extension 3
(ASCII code: 3 characters)
SD21
SD22
Pattern 6
SD23
Block No.
SD24
Step No./transition No.
Sequence step No. (L)
SD25
Sequence step No. (H)
SD26
*6 : Contents of pattern data

SD23

15 14
0 0

to
to

4 3 2 1 0
0 0

(Bit number)

SFC block designation

present (1)/absent (0)

(Not used)

SFC step designation

present (1)/absent (0)
SD24

SFC transition designation

present (1)/absent (0)

5) Parameter No. 6) Annunciator number /

7) CHK instruction
malfunction number
SD25

SD26

Number
Meaning
SD16 Parameter No. 7
SD17
SD18
SD19
SD20
SD21
(Empty)
SD22
SD23
SD24
SD25
SD26

Number
SD16
SD17
SD18
SD19
SD20
SD21
SD22
SD23
SD24
SD25
SD26

Meaning
No.

(Empty)

*7: For details of the parameter No., refer to the User's Manual of the
CPU module used.

App - 76

S (Error)

New

QnA

APPENDICES

*3 : Extensions are shown below.

Table App. 3.3. Extension name
SDn

SDn+1

Extension

Higher 8 bits

Lower 8 bits

Higher 8 bits

Name

51H

50H

41H

QPA

51H

50H

47H

QPG

51H

43H

44H

QCD

File Type
Parameters
Sequence program
SFC program
Device comment

51H

44H

49H

QDI

Initial device value

51H

44H

52H

QDR

File register

51H

44H

53H

QDS

Simulation data

51H

44H

4CH

QDL

Local device

51H

54H

44H

QTD

Sampling trace data

51H

54H

4CH

QTL

Status latch data

51H

54H

50H

QTP

Program trace data

51H

54H

52H

QTR

SFC trace file

51H

46H

44H

QFD

Breakdown history data

App - 77

APPENDICES

Table App. 3.2. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
SD50

Error reset

Error number that

performs error
rese

Stores error number that performs error reset

New

QnA

S (Error)

New

QnA

All corresponding bits go 1(ON) when battery voltage drops.

Subsequently, these remain 1(ON) even after battery voltage has been
returned to normal.

SD51

Battery low
latch

b5 b4 b3 b2 b1 b0

to
0

b15

Bit pattern
indicating where
battery voltage
drop occurred

CPU error
Memory card A alarm
Memory card A error
Memory card B alarm
Memory card B error
In the alarm, data can be held within the time specified for battery low.
The error indicates the complete discharge of the battery.

SD52

Battery low

Bit pattern
indicating where
battery voltage
drop occurred

Same configuration as SD51 above

Turns to 0 (OFF) when the battery voltage returns to normal thereafter.

S (Error)

New

QnA

SD53

AC/DC DOWN
detection

Number of times
for AC/DC DOWN
detection

Every time the input voltage falls to or below 85% (AC power)/65% (DC
power) of the rating during operation of the CPU module, the value is
incremented by 1 and stored in BIN code.

S (Error)

D9005

QnA

S (Error)

QnA

1)
2)
SD54

MINI link errors

Error detection
state

When any of X(n+0)/X(n+20), X(n+6)/X(n+26), X(n+7)/X(n+27) and X(n+8)/X(n+28) of

the mounted MINI(-S3) turns ON, the bit of the corresponding station turns to 1 (ON).
Turns to 1 (ON) when communication between the mounted MINI(-S3) and CPU module
cannot be made.

b15

to

8th
module

b9 b8

to

1st
8th
module module

Information of 2)

b0
1st
module

Information of 1)

SD60

Number of
module with
blown fuse

Number of module
with blown fuse

Value stored here is the lowest station I/O number of the module with the blown fuse.

S (Error)

QnA

SD61

I/O module
verify error
number

I/O module verify

error module
number

The lowest I/O number of the module where the I/O module verification number took place.

S (Error)

QnA

App - 78

APPENDICES

Table App. 3.2. Special register

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

D9
SD62

Annunciator
number

Annunciator
number

The first annunciator number (F number) to be detected is stored here.

S (Instruction
execution)

D9009

QnA

SD63

Number of
annunciators

Number of
annunciators

Stores the number of annunciators searched.

S (Instruction
execution)

D9124

QnA

SD64
SD65

SD68
SD69

SD71
Table of
detected
annunciator
numbers

Annunciator
detection number

SD75
SD76
SD77
SD78

SD79

CHK number

CHK number

SD90
SD91
SD92
SD93
SD94
SD95
SD96
SD97
SD98
SD99

Step transition
monitoring timer
setting value
(Enabled only
when SFC
program exists)

F number for timer

set value and time
over error

D9129
D9130
D9131

SD62 0 50 50 50 50 50 50 50 50 50 50 50 99 (Number
detected)

D9132

SD63 0

SD64
SD65
SD66
SD67
SD68
SD69
SD70
SD71
SD72
SD73
SD74
SD75
SD76
SD77
SD78
SD79

SD74

D9128

SET SET SET RST SET SET SET SET SET SET SET
F50 F25 F99 F25 F15 F70 F65 F38 F110 F151 F210 LEDR

SD70

SD80

D9127

Execution of the LEDR instruction shifts the contents of SD64 to SD79

up by one.
(This can also be done by using the INDICATOR RESET switch on the of
the Q3A/Q4ACPU.)
After 16 annunciators have been detected, detection of the 17th will not be
stored from SD64 through SD79.

SD67

SD73

D9126

The F numbers turned OFF by RST F are deleted from SD64 - SD79,
and the F numbers stored after the deleted F numbers are shifted to the
preceding registers.

SD66

SD72

D9125

When F goes ON due to OUT F or SET F , the F numbers which go

progressively ON from SD64 through SD79 are registered.

8 (Number of
annunciators
detected)

0 50 50 50 50 50 50 50 50 50 50 50 99
0 0 25 25 99 99 99 99 99 99 99 99 15
0 0 0 99 0 15 15 15 15 15 15 15 70
0 0 0 0 0 0 70 70 70 70 70 70 65
0 0 0 0 0 0 0 65 65 65 65 65 38
0 0 0 0 0 0 0 0 38 38 38 38 110
0 0 0 0 0 0 0 0 0 110 110 110 151
0 0 0 0 0 0 0 0 0 0 151 151 210
0 0 0 0 0 0 0 0 0 0 0 210 0
0 0 0 0 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0 0 0 0

New

QnA

New
New
New
New

(Number
detected)

New
New

New

Error codes detected by the CHK instruction are stored as BCD code.
Corresponds to
SM90
Corresponds to
SM91
Corresponds to
SM92
Corresponds to
SM93
Corresponds to
SM94
Corresponds to
SM95
Corresponds to
SM96
Corresponds to
SM97
Corresponds to
SM98
Corresponds to
SM99

S (Instruction
execution)

S (Instruction
execution)

Set the annunciator number (F number) that will

be turned ON when the step transition
monitoring timer setting or monitoring timeout
occurs.

New

QnA

D9108
D9109
D9110

b15

to

b8 b7

to

b0

D9111
D9112

F number setting
(0 to 255)

Timer time limit

setting
(1 to 255s:
(1s units))

Turning ON any of SM90 to SM99 during an

active step starts the timer, and if the transition
condition next to the corresponding step is not
met within the timer time limit, the set
annunciator (F) turns ON.

App - 79

QnA
D9113
D9114
New
New
New

APPENDICES

(2) System information

Table App. 3.4. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
The CPU switch status is stored in the following format:

b15

to

b12 b11 to

b8 b7

3)

Status of switch

Status of CPU
switch

b4 b3
2)

Empty

to

b0

1)

0: RUN
1: STOP
2: L.CLR

1): CPU switch status

SD200

to

b4 corresponds to memory card

A, and b5 corresponds to
memory card B.
0: OFF, 1: ON

2): Memory card

switch

S (Every END
processing)

New

QnA

S (Status
change)

New

QnA

S (Every END
processing)

D9015
format
change

QnA

b8 through b12 correspond to

SW1 through SW5 of system
setting switch 1.
b14 and b15 correspond to SW1
and SW2 of system setting switch
2, respectively.
OFF at 0; ON at 1

3): DIP switch

The following bit patterns store the status of the LEDs on the CPU
module:
0 is off, 1 is on, and 2 is flicker

b15
SD201

LED status

Status of
CPU-LED

to

8)

b12b11
7)

to

b8 b7

6)

5)

to

4)

b4 b3
3)

to

2)

b0
1)

1): RUN 5): BOOT

2): ERROR 6): CARD A (memory card A)
3): USER 7): CARD B (memory card B)
4): BAT.ALARM 8): Empty
The CPU operating status is stored as indicated in the following figure:

b15

to

b12 b11

to

b8 b7

to
2)

1): Operating status

of CPU
SD203

Operating
status of CPU

Operating status
of CPU

0:
1:
2:
3:

b4 b3

to

b0

1)

RUN
STEP-RUN
STOP
PAUSE

2): STOP/PAUSE
cause

0: Instruction in remote operation program

from RUN/STOP switch
1: Remote contact
2: Remote operation from GX Developer/
serial communication, etc.
3: Internal program instruction

Note: Priority is
earliest first

4: Error

App - 80

APPENDICES

Table App. 3.4. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9

SD207

SD208

Priorities 1 to 4

LED display
priority ranking

SD209

When error is generated, the LED display (flicker) is made according to

the error number setting priorities.
(The Basic model QCPU supports only the annunciator (error item No.
7).
The Universal model QCPU sets execution/non-execution of LED
display of the error corresponding to the each priority ranking when the
error occurs.
The setting areas for priorities are as follows:

b15 to b12 b11 to b8

SD207 Priority 4
Priority 3
SD208 Priority 8
Priority 7
SD209

Priorities 5 to 8

Priorities 9 to 10

b7 to b4 b3 to b0
Priority 1
Priority 2
Priority 5
Priority 6
Priority 10 Priority 9

D9038

Default Value
SD207 = 4321H
SD208 = 8765H
(0765H for Redundant CPU)
SD209 = 00A9H
No display is made if "0" is set.

D9039
format
change

QnA

New

The year (last two digits) and month are stored as BCD code as shown
below:
SD210

Clock data

Clock data (year,

month)

b15 to b12 b11 to

b8 b7 to

b4 b3 to

b0 Example:
D9025

July, 1993
9307H
Year

Month

The day and hour are stored as BCD code as shown below:

b15 to b12 b11 to

SD211

Clock data

b8 b7 to

b4 b3 to

Clock data (day,

hour)

b0 Example:

31st, 10 a.m.
3110H
Day

S (Request)/U

D9026

QnA

Hour

The minutes and seconds (after the hour) are stored as BCD code as
shown below:
SD212

Clock data

Clock data
(minute, second)

b15 to b12 b11 to

b8 b7

to

b4 b3

to

b0 Example:
D9027

35 min, 48 s
3548H
Minute

Second

The day of the week is stored as BCD code as shown below.

b15

to b12 b11

to

b8 b7

to b4 b3 to

b0 Example:

Friday
0005H
SD213

Clock data

Clock data
(day of week)

Day of the week

0
Sunday
1
Monday
2
Tuesday
3 Wednesday
4 Thursday
5
Friday
6 Saturday

Always set "0".

App - 81

S (Request)/U

D9028

QnA

APPENDICES

Table App. 3.4. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
LED display ASCII data (16 characters) stored here.

SD220

b15

SD221

SD220
SD222

SD221

SD223
SD224

LED display
data

SD222
LED display data

SD223
SD224

SD225

SD225
SD226

SD226
SD227

SD227

to

b8 b7

15th character from

the right
13th character from
the right
11th character from
the right
9th character from
the right
7th character from
the right
5th character from
the right
3rd character from
the right
1st character from
the right

to

b0

16th character from

the right
14th character from
the right
12th character from
the right
10th character from
the right
8th character from
the right
6th character from
the right
4th character from
the right
2nd character from
the right

SD251

Head I/O
number for
replacement

Head I/O No. for

module
replacement

Stores the upper two digits of the head I/O number of an I/O module that
is removed/replaced in the online status (with power on). (Default value:
100H).

SD253

RS422
transmission
speed

RS422
transmission
speed

Stores transmission speed of RS422.

0 : 9600bps 1 : 19.2kbps 2 : 38.4kbps

App - 82

S (When
changed)

New

QnA

D9094

Q2A(S1)
Q3A
Q4A
Q4AR

S (When
changed)

New

QnA

APPENDICES

Table App. 3.4. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
SD254
SD255
SD256
SD257
SD258
SD259

MELSECNET/
10
information

Information from 1st module

Number of
modules installed

Indicates the number of mounted MELSECNET/10 modules.

I/O No.

Indicates I/O number of mounted MELSECNET/10 module

Network
No.

Indicates network No. of mounted MELSECNET/10 module

Group
number

Indicates group No. of mounted MELSECNET/10 module

Station No.

Indicates station No. of mounted MELSECNET/10 module

Standby
information

In the case of standby stations, the module number of the standby

station is stored. (1 to 4)

SD260
to
SD264

Information from
2nd module

Configuration is identical to that for the first module.

SD265
to
SD269

Information from
3rd module

Configuration is identical to that for the first module.

SD270
to
SD274

Information from
4th module

Configuration is identical to that for the first module.

SD280

CC-Link error

Error
dete
ction
statu
s

When Xn0 of the mounted CC-Link module turns ON, the bit of the
corresponding station turns to 1 (ON).
When either Xn1 or XnF of the mounted CC-Link module turns OFF, the
bit of the corresponding station turns to 1 (ON).
Turns to 1 (ON) when communication between the mounted CC-Link
module and CPU module cannot be made.

b15
8th
module

to

b9 b8
1st 8th
module module

Information of 2)

to

SD290

Stores the number of points currently set for X devices

SD291

Number of points
assigned for Y

Stores the number of points currently set for Y devices

SD292

Number of points
assigned for M

Stores the number of points currently set for M devices

SD293

Number of points
assigned for L

Stores the number of points currently set for L devices

SD294

Number of points
assigned for B

Stores the number of points currently set for B devices

SD295

Number of points
assigned for F

Stores the number of points currently set for F devices

Number of points
assigned for SB

Stores the number of points currently set for SB devices

Number of points
assigned for V

Stores the number of points currently set for V devices

Number of points
assigned for S

Stores the number of points currently set for S devices

SD299

Number of points
assigned for T

Stores the number of points currently set for T device

SD300

Number of points
assigned for ST

Stores the number of points currently set for ST devices

SD301

Number of points
assigned for C

Stores the number of points currently set for C devices

SD302

Number of points
assigned for D

Stores the number of points currently set for D devices

SD303

Number of points
assigned for W

Stores the number of points currently set for W devices

SD304

Number of points
assigned for SW

Stores the number of points currently set for SW devices

SD297
SD298

Device
assignment
(Same as
parameter
contents)

New

QnA

S (Error)

New

QnA

S (Initial)

New

QnA

b0
1st
module

Information of 1)

Number of points
assigned for X

SD296

S (Initial)

App - 83

APPENDICES

Table App. 3.4. Special register

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

D9

SD341

I/O No.

Indicates I/O No. of mounted Ethernet module

Network
No.

Indicates network No. of mounted Ethernet module

Group No.

Indicates group No. of mounted Ethernet module

Station No.

Indicates station No. of mounted Ethernet module

IP address

Indicates IP address of mounted Ethernet module

Error code

Indicates error code of mounted Ethernet module

SD342
SD343
SD344
SD345
to
SD346
SD347

Ethernet
information

Information of 1st module

SD340

No. of modules
installed

Indicates the number of mounted Ethernet module.

SD348
to
SD354

Information from
2nd module

Configuration is identical to that for the first module.

SD355
to
SD361

Information from
3rd module

Configuration is identical to that for the first module.

SD362
to
SD368

Information from
4th module

Configuration is identical to that for the first module.

SD380

Ethernet
instruction
reception status

Instruction
reception status of
1st module

b15 to b8 b7 b6 b5 b4 b3 b2 b1 b0
0
Not used
Instruction reception
status of channel 1
Instruction reception
status of channel 2
Instruction reception
status of channel 3
Instruction reception
status of channel 4
Instruction reception
status of channel 5
Instruction reception
status of channel 6
Instruction reception
status of channel 7
Instruction reception
status of channel 8

S (Initial)

New

QnA

S (Initial)

New

QnA

S (Initial)

D9060

QnA

ON: Received (Channel is being used.)

OFF: Not received (Channel is not used.)
Stores the internal system software version in ASCII code.

SD392

Software
version

Internal system
software version

Stored into lower

Higher byte Lower byte byte
Stored into higher
byte
For version "A", for example, "41H" is stored.
Note: The internal system software version may differ from the version
indicated by the version symbol printed on the case.

App - 84

APPENDICES

(3) System clocks/counters

Table App. 3.5. Special register

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

D9
SD412

1 second
counter

Number of counts
in 1-second units

Following programmable controller CPU module RUN, 1 is added each

second
Count repeats from 0 to 32767 to -32768 to 0

SD414

2n second clock
setting

2n second clock
units

Stores value n of 2n second clock (Default is 30)

Setting can be made between 1 and 32767

SD420

Scan counter

Number of counts
in each scan

SD430

Low speed scan

counter

Number of counts
in each scan

S (Status
change)

D9022

QnA

New

QnA

Incremented by 1 for each scan execution after the CPU module is set to
RUN.
(Not counted by the scan in an initial execution type program.)
Count repeats from 0 to 32767 to -32768 to 0

S (Every END
processing)

New

QnA

Incremented by 1 for each scan execution after the CPU module is set to
RUN.
Count repeats from 0 to 32767 to -32768 to 0
Used only for low speed execution type programs

S (Every END
processing)

New

QnA

App - 85

APPENDICES

(4) Scan information

Table App. 3.6. Special register

Number

Name

Meaning

Corresponding
ACPU

Explanation

Set by
(When Set)

Corresponding
CPU

S (Status
change)

New

QnA

S (Every END
processing)

New

QnA

S (Every END
processing)

D9017
format
change

D9
SD500

Execution
program No.

Program No. in
execution

Program number of program currently being executed is stored as BIN

value.

SD510

Low speed
excution type
program No.

Low speed
execution type
program No. in
execution

Program number of low speed excution type program No. currently

being executed is stored as BIN value.
Enabled only when SM510 is ON.

Current scan time

(in 1 ms units)

SD520
Current scan
time
SD521

Current scan time

(in 100 s units)

SD522

Initial scan time

(in 1 ms units)
Initial scan time

SD523

Initial scan time

(in 100 s units)

SD524

Minimum scan
time (in 1 ms
units)

Minimum scan
time
SD525

Minimum scan
time (in 100 s
units)

SD526

Maximum scan
time (in 1 ms
units)

Maximum scan
time
SD527

SD528

SD529

SD532

SD533

SD534

SD535

Current scan
time for low
speed execution
type programs

Minimum scan
time for low
speed execution
type programs

Maximum scan
time for low
speed execution
type programs

SD540
END processing
time

Maximum scan
time (in 100 s
units)
Current scan time
(in 1 ms units)
Current scan time
(in 100 s units)
Minimum scan
time (in 1 ms
units)
Minimum scan
time (in 100 s
units)
Maximum scan
time (in 1 ms
units)
Maximum scan
time (in 100 s
units)
END processing
time (in 1 ms
units)

SD541

END processing
time (in 100 s
units)

SD542

Constant scan
wait time (in 1 ms
units)

Constant scan
wait time
SD543

Constant scan
wait time (in 100
s units)

The current scan time is stored into SD520 and SD521.

(Measurement is made in 100 s units.)
SD520: Stores the ms place. (Storage range: 0 to 65535)
SD521: Stores the s place. (Storage range: 0 to 900)
(Example) When the current scan time is 23.6ms, the following values are
stored.
SD520 = 23
SD521 = 600
Stores the scan time of an initial execution type program into SD522 and
SD523.
(Measurement is made in 100 s units. )
SD522: Stores the ms place. (Storage range: 0 to 65535)
SD523: Stores the s place. (Storage range: 0 to 900)
Stores the minimum value of the scan time except that of an initial
execution type program into SD524 and SD525. (Measurement is made
in 100 s units.)
SD524: Stores the ms place. (Storage range: 0 to 65535)
SD525: Stores the s place. (Storage range: 0 to 900)

QnA
S (Every END
processing)

New

S (First END
processing)

New

S (Every END
processing)

D9018
format
change

S (Every END
processing)

New
D9019
format
change

QnA

QnA

Stores the maximum value of the scan time except that of an initial
execution type program into SD526 and SD527. (Measurement is made
in 100 s units.)
SD526: Stores the ms place. (Storage range: 0 to 65535)
SD527: Stores the s place.

S (Every END
processing)

Stores the current scan time of a low speed execution type program into
SD528 and SD529.
(Measurement is made in 100 s units.)
SD528: Stores the ms place. (Storage range: 0 to 65535)
SD529: Stores the s place. (Storage range: 0 to 900)

S (Every END
processing)

New

QnA

Stores the minimum value of the scan time of a low speed execution
type program into SD532 and SD533.
(Measurement is made in 100 s units.)
SD532: Stores the ms place. (Storage range: 0 to 65535)
SD533: Stores the s place. (Storage range: 0 to 900)

S (Every END
processing)

New

QnA

Stores the maximum value of the scan time except that of the first scan
of a low speed execution type program into SD534 and SD535.
(Measurement is made in 100 s units.)
SD534: Stores the ms place. (Storage range: 0 to 65535)
SD535: Stores the s place. (Storage range: 0 to 900)

S (Every END
processing)

New

QnA

Stores the time from the end of a scan execution type program to the
start of the next scan into SD540 and SD541.
(Measurement is made in 100 s units.)
SD540: Stores the ms place. (Storage range: 0 to 65535)
SD541: Stores the s place. (Storage range: 0 to 900) (Storage range: 0
to 900)

S (Every END
processing)

New

QnA

Stores the wait time for constant scan setting into SD542 and SD543.
(Measurement is made in 100 s units. (For the Universal model QCPU,
in 1 s units.))
SD542: Stores the ms place. (Storage range: 0 to 65535)
SD543: Stores the s place. (Storage range: 0 to 900 (For the Universal
model QCPU, storage range is 0 to 999))

S (Every END
processing)

New

QnA

App - 86

QnA

New

APPENDICES

Table App. 3.6. Special register

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

D9

SD544
Cumulative
execution time
for low speed
execution type
programs

Cumulative
execution time for
low speed
execution type
programs
(in 1 ms units)

SD545

Cumulative
execution time for
low speed
execution type
programs
(in 100 s units)

SD546

Execution time for

low speed
execution type
programs
(in 1 ms units)

Execution time
for low speed
execution type
programs
SD547

Execution time for

low speed
execution type
programs
(in 100 s units)

SD548

Scan execution
type program
execution time (in
1 ms units)

Scan execution
type program
execution time
SD549

SD550

Service interval
measurement
module

SD551
Service interval
time
SD552

Scan execution
type program
execution time (in
100 s units)
Unit/module No.
Module service
interval
(in 1 ms units)
Module service
interval
(in 100 s units)

Stores the cumulative execution time of a low speed execution type

program into SD544 and SD545.
(Measurement is made in 100 s units.)
SD544: Stores the ms place. (Storage range: 0 to 65535)
SD545: Stores the s place. (Storage range: 0 to 900)
Cleared to 0 after the end of one low speed scan.

S (Every END
processing)

New

QnA

Stores the execution time of a low speed execution type program during
one scan into SD546 and SD547.
(Measurement is made in 100 s units.)
SD546: Stores the ms place. (Storage range: 0 to 65535)
SD547: Stores the s place. (Storage range: 0 to 900)
Stored every scan.

S (Every END
processing)

New

QnA

Stores the execution time of a scan execution type program during one
scan into SD548 and SD549.
(Measurement is made in 100 s units.)
SD548: Stores the ms place. (Storage range: 0 to 65535)
SD549: Stores the s place. (Storage range: 0 to 900)
Stored every scan.

S (Every END
processing)

New

QnA

New

QnA

S (Request)

New

QnA

Sets I/O number for module that measures service interval.

Stores the service interval for the module specified in SD550 into SD551
and SD552 when SM551 is turned ON.
(Measurement is made in 100 s units.)
SD551: Stores the ms place. (Storage range: 0 to 65535)
SD552: Stores the s place. (Storage range: 0 to 900)

App - 87

APPENDICES

(5) Drive information

Table App. 3.7. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
Indicates the type of memory card A installed.
b15

to

b8 b7

to

b4 b3

to

b0

SD600

Memory card A
typs

Drive 1
(RAM) type

Memory card A
typs

0: Does not exist

1: SRAM

S (Initial and
card removal)

New

QnA

0: Does not exist

Drive 2

2: E 2 PROM
3: Flash ROM

(ROM) type

SD602

Drive 1
(Memory card
RAM) capacity

Drive 1 capacity

Drive 1 capacity is stored in 1 k byte units.

(Empty capacity after format is stored.)

S (Initial and
card removal)

New

QnA

SD603

Drive 2
(Memory card
ROM) capacity

Drive 2 capacity

Drive 2 capacity is stored in 1 k byte units.

S (Initial and
card removal)

New

QnA

S (Status
change)

New

QnA

S (Initial/Card
installation and
removal)

New

Q2A(S1)
Q3A
Q4A
Q4AR

The use conditions for memory card A are stored as bit patterns.
(In use when ON)
The significance of these bit patterns is indicated below:

SD604

Memory card A
use conditions

Memory card A
use conditions

b0 : Boot operation (QBT)

b8 : Simulation data (QDS)

b1 : Parameters (QPA)

b9 : CPU fault history (QFD)

b2 : Device comments (QCD)

b10 : SFC trace (QTR)

b3 : Device initial value (QDI)

b11 : Local device (QDL)

b4 : File register (QDR)

b12 : Not used

b5 : Sampling trace (QTD)

b13 : Not used

b6 : Status latch (QTL)

b14 : Not used

b7 : Program trace (QTP)

b15 : Not used

Indicates memory card B type installed

b15

SD620

Memory card B
typs

to
0

b8 b7

to

b4 b3

Memory card B
typs

to

b0

Drive 3
(RAM)

0: Does not exist

1: SRAM

Drive 4
(ROM)

0: Does not exist

2: E2PROM
3: Flash ROM

SD622

Drive 3
(Standard RAM)
capacity

Drive 3 capacity

Drive 3 capacity is stored in 1 k byte units.

(Empty capacity after format is stored.)

S (Initial/Card
installation and
removal)

New

Q2A(S1)
Q3A
Q4A
Q4AR

SD623

Drive 4
(Standard ROM)
capacity

Drive 4 capacity

Drive 4 capacity is stored in 1 k byte units.

(Empty capacity after format is stored.)

S (Initial/Card
installation and
removal)

New

Q2A(S1)
Q3A
Q4A
Q4AR

S (Status
change)

New

Q2A(S1)
Q3A
Q4A
Q4AR

S (Status
change) *10

New

QnA

The use conditions for memory card B are stored as bit patterns.
(In use when ON)
The significance of these bit patterns is indicated below:

SD624

SD640

Memory card B
use conditions

File register
drive

Memory card B
use conditions

Drive number:

b0 : Boot operation (QBT)

b8 : Simulation data (QDS)

b1 : Parameters (QPA)

b9 : CPU fault history (QFD)

b2 : Device comments (QCD)

b10 : SFC trace (QTS)

b3 : Device initial value (QDI)

b11 : Local device (QDL)

b4 : File register (QDR)

b12 : Local device (QDL)

b5 : Sampling trace (QTD)

b13 : Not used

b6 : Status latch (QTL)

b14 : Not used

b7 : Program trace (QTP)

b15 : Not used

Stores drive number being used by file register

App - 88

APPENDICES

Table App. 3.7. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
Stores file register file name (with extension) selected at parameters or
by use of QDRSET instruction as ASCII code.

SD641
SD642
SD643
SD644

File register file

name

File register file

name

SD645

b15
b8
to
2nd character
4th character
6th character
8th character
1st character of
SD645
extension

SD641
SD642
SD643
SD644

SD646

3rd character of
the extension

b7

b0
to
1st character
3rd character
5th character
7th character

S (Status
change)

New

QnA

2EH(.)
2nd character of
the extension

SD647

File register
capacity

File register
capacity

Stores the data capacity of the currently selected file register in 1 k word
units.

S (Status
change)

New

QnA

SD648

File register
block number

File register block

number

Stores the currently selected file register block number.

S (Status
change)

D9035

QnA

Comment drive

Comment drive
number

Stores the comment drive number selected at the parameters or by the

QCDSET instruction.

S (Status
change)

New

QnA

S (Status
change)

New

QnA

S (Initial)

New

QnA

S (Initial)

New

QnA

SD650

Stores the comment file name (with extension) selected at the

parameters or by the QCDSET instruction in ASCII code.

SD651
SD652
SD653
SD654
SD655

Comment file
name

Comment file
name

SD656

Boot designation
file drive number

SD660

SD662

SD664
SD665

SD666

b7

b0
to
1st character
3rd character
5th character
7th character
2EH(.)

2nd character of
the extension

Stores the drive number where the boot designation file (*.QBT) is being
stored.
Stores the file name of the boot designation file (*.QBT).

SD661

SD663

b15
b8
to
2nd character
4th character
6th character
8th character
1st character of
SD655
the extension
3rd character of
SD656
the extension

SD651
SD652
SD653
SD654

Boot operation
designation file

File name of boot

designation file

b15
b8
to
2nd character
4th character
6th character
8th character
1st character of
SD665
the extension
3rd character of
SD666
the extension

SD661
SD662
SD663
SD664

b7

b0
to
1st character
3rd character
5th character
7th character
2EH(.)

2nd character of
the extension

App - 89

APPENDICES

(6) Instruction-Related Registers

Table App. 3.8. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
Mask pattern

Mask pattern

During block operations, turning SM705 ON makes it possible to use the

mask pattern being stored at SD705 (or at SD705 and SD706 if double
words are being used) to operate on all data in the block with the
masked values.

Number of
empty
communication
request
registration
areas

0 to 32

Stores the number of empty blocks in the communications request area

for remote terminal modules connected to the MELSECNET/MINI-S3.

SD705
SD706

SD714

New

QnA

S (During
execution)

D9081

QnA

S (During
execution)

New

QnA

S/U

New

QnA

Patterns masked by use of the IMASK instruction are stored in the

following manner:

SD715
SD716

IMASK
instruction mask
pattern

b1

b0

SD715 l15

to

l1

l0

SD716 l31

to

l17

l16

SD717 l47

to

l33

l32

b15
Mask pattern

SD717

SD718
Accumulator

Accumulator

For use as replacement for accumulators used in A series programs.

SD730

No. of empty
areas for CCLink
communication
reguest register
area

0 to 32

Stores the number of empty registration area for the request for
communication with the intelligent device station connected to
A(1S)J61QBT61.

S (During
execution)

New

QnA

SD736

PKEY input

PKEY input

Special register that temporarily stores keyboard data input by means of

the PKEY instruction.

S (During
execution)

New

QnA

SD719

App - 90

APPENDICES

Table App. 3.8. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
SD738

Stores the message designated by the MSG instruction.

SD739
SD740
SD741
SD742
SD743
SD744
SD745
SD746
SD747
SD748
SD749
SD750
SD751
SD752
SD753
SD754

Message
storage

Message storage

Remaining No.
of simultaneous
execution of
CC-Link
dedicated
instruction

0 to 32

SD755
SD756
SD757
SD758
SD759
SD760
SD761
SD762
SD763
SD764
SD765
SD766
SD767
SD768

SD738
SD739
SD740
SD741
SD742
SD743
SD744
SD745
SD746
SD747
SD748
SD749
SD750
SD751
SD752
SD753
SD754
SD755
SD756
SD757
SD758
SD759
SD760
SD761
SD762
SD763
SD764
SD765
SD766
SD767
SD768
SD769

b15
b8
to
2nd character
4th character
6th character
8th character
10th character
12th character
14th character
16th character
18th character
20th character
22nd character
24th character
26th character
28th character
30th character
32nd character
34th character
36th character
38th character
40th character
42nd character
44th character
46th character
48th character
50th character
52nd character
54th character
56th character
58th character
60th character
62nd character
64th character

b7

b0
to
1st character

3rd character
5th character
7th character
9th character
11th character
13th character
15th character
17th character
19th character
21st character
23rd character
25th character
27th character
29th character
31st character
33rd character
35th character
37th character
39th character
41st character
43rd character
45th character
47th character
49th character
51st character
53rd character
55th character
57th character
59th character
61st character
63rd character

S (During
execution)

New

QnA

New

QnA

SD769

SD780

Stores the remaining number of simultaneous execution of the CC-Link

dedicated instructions.

App - 91

APPENDICES

(7) Debug
Table App. 3.9. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
Stores file name (with extension) from point in time when status latch
was conducted as ASCII code.

SD806
SD807

b15

SD808
SD809

Status latch file

name

Status latch file

name

SD810

SD811

b8

to

b7

to

b0

SD806
SD807
SD808
SD809

2nd character
4th character
6th character
8th character

1st character
3rd character
5th character
7th character

SD810

1st character of
the extension

2EH(.)

SD811

3rd character of
the extension

2nd character of
the extension

S (During
execution)

New

QnA

S (During
execution)

D9055
format
change

QnA

Stores step number from point in time when status latch was conducted.
SD812

Pattern 1
SD812
SD813
Block No.
SD814 Step No./transition condition No.
SD815
Sequence step No. (L)
SD816
Sequence step No. (H)

SD813

SD814

SD815

Status latch
step

Status latch step

*1: Contents of pattern data

15 14
0 0

to
to

4 3 2 1 0
0 0

(Not used)
SD816

(Bit number)

SFC block designation present

(1)/absent (0)
SFC step designation present
(1)/absent (0)
SFC transition designation present
(1)/absent (0)

App - 92

APPENDICES

(8) Latch area

Table App. 3.10. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
SD900

Drive where
power was
interrupted

Access file drive

number during
power loss

SD902

SD904

File name active

during power
loss

Access file name

during power loss

SD905
SD906
SD910

b15
b8
to
2nd character
4th character
6th character
8th character
1st character of
SD905
the extension
3rd character of
SD906
the extension

SD901
SD902
SD903
SD904

SD912
SD913
SD914
SD915
SD916

SD918
SD919
SD920
SD921
SD922
SD923
SD924
SD925

New

QnA

S (Status
change)

New

QnA

S (During
execution)

New

QnA

b7

b0
to
1st character
3rd character
5th character
7th character
2EH(.)

2nd character of
the extension

Stored in sequence that PU key code was entered.

SD911

SD917

S (Status
change)

Stores file name (with extension) in ASCII code if file was being
accessed during power loss.

SD901

SD903

Stores drive number if file was being accessed during power loss.

RKEY input

RKEY input

SD910
SD911
SD912
SD913
SD914
SD915
SD916
SD917
SD918
SD919
SD920
SD921
SD922
SD923
SD924
SD925

b15
b8
to
2nd character
4th character
6th character
8th character
10th character
12th character
14th character
16th character
18th character
20th character
22nd character
24th character
26th character
28th character
30th character
32nd character

b7

b0
to
1st character

3rd character
5th character
7th character
9th character
11th character
13th character
15th character
17th character
19th character
21st character
23rd character
25th character
27th character
29th character
31st character

App - 93

APPENDICES

(9) A to QnA conversion

ACPU special registers D9000 to D9255 correspond to QnA special registers SD1000
to SD1255 after A to Q/QnA conversion.
These special registers are all set by the system, and cannot be set by the user
program.
To set data by the user program, correct the program for use of the QnACPU special
registers.
However, some of SD1200 to SD1255 (corresponding to D9200 to 9255 before
conversion) can be set by the user program if they could be set by the user program
before conversion.
For details on the ACPU special registers, refer to the user's manual for the
corresponding CPU, and MELSECNET or MELSECNET/B Data Link System
Reference Manuals.
REMARK
Supplemental explanation on "Special Register for Modification" column
For the device numbers for which a special register for modification is
specified, modify it to the special register for QnACPU.
For the device numbers for which
conversion can be used.
Device numbers for which

App - 94

is specified, special register after

is specified do not function for QnACPU.

APPENDICES

Table App. 3.11. Special register

ACPU
Special
Register

D9000

Special
Register
after
Conversion

Special
Register for
Modification

SD1000

Name

Fuse blown

Details

Corresponding
CPU

When fuse blown modules are detected, the first I/O number of the
lowest number of the detected modules is stored in hexadecimal.
(Example: When fuses of Y50 to 6F output modules have blown,
"50" is stored in hexadecimal)
To monitor the number by peripheral devices, perform monitor
operation given in hexadecimal.
(Cleared when all contents of SD1100 to SD1107 are reset to 0.)
Fuse blow check is executed also to the output modules of remote
I/O stations.

QnA

Meaning

Number of module
with blown fuse

Stores the module numbers corresponding to setting switch

numbers or base slot numbers when fuse blow occurred.

AJ02 I/O module

D9001

SD1001

Fuse blown

Setting
switch

Stored
data

0
1
2
3
4
5
6
7

0
1
2
3
4
5
6
7

Number of module
with blown fuse

Extension base unit

Stored
data

Base unit
slot No.
0
1
2
3

4
5
6
7

QnA

For the remote I/O station, the value of (module I/O No./10H) + 1 is
stored.

D9002

SD1002

I/O module
verify error

I/O module verify

error module number

If I/O modules, of which data are different from data entered, are
detected when the power is turned on, the first I/O number of the
lowest number unit among the detected units is stored in
hexadecimal. (Storing method is the same as that of SD1000.)
To monitor the number by peripheral devices, perform monitor
operation given in hexadecimal.
(Cleared when all contents of SD1116 to SD1123 are reset to 0.)
I/O module verify check is executed also to the modules of remote
I/O terminals.

QnA

Error status of the MINI(S3) link detected on loaded AJ71PT32(S3)

is stored.

b15

to

b8

b7

to

b0

8th 7th 6th 5th 4th 3rd2nd1st 8th 7th 6th 5th 4th 3rd 2nd1st

D9004

D9005

D9008

SD1004

SD1005

SD1008

SD0

MINI link
master module
errors

AC DOWN
counter

Self-diaghostic
error

Stores setting status

made at parameters

Number of times for

AC DOWN

Self-diaghostic error
number

Bits which correspond to faulty

AJ71PT32(S3) are turned on.

Bits which correspond to the signals of

AJ71PT32(S3), shown below, are
turned on as the signals are turned
on.
Hardware error (X0/X20)
MINI(S3) link error datection
(X6/X26)
MINI(S3) link
communication error
(X7/X27)

QnA

When the AC power supply module is used, 1 is added at

occurrence of an instantaneous power failure of within 20ms.
(The value is stored in BIN code.) It is reset when the power supply
is switched from OFF to ON.

QnA

When the DC power supply module is used, 1 is added at

occurrence of an instantaneous power failure of within 1ms.
(The value is stored in BIN code.) It is reset when the power supply
is switched from OFF to ON.

QnA

When error is found as a result of self-diagnosis, error number is

stored in BIN code.

QnA

App - 95

APPENDICES

Table App. 3.11. Special register

ACPU
Special
Register

Special
Register
after
Conversion

Special
Register for
Modification

Name

Meaning

Corresponding
CPU

Details

When one of F0 to 2047 is turned on by OUT F or

SET F , the F number, which has been detected earliest among

the F numbers which have turned on, is stored in BIN code.

D9009

SD1009

SD62

Annunciator
detection

F number at which
external failure has
occurred

SD62 can be cleared by RST F or LEDR instruction.

If another F number has been detected, the clearing of SD62
causes the next number to be stored in SD62.
When one of F0 to 2047 is turned on by OUT F or SET F , the
F number, which has been detected earliest among the F numbers
which have turned on, is stored in BIN code.
SD62 can be cleared by executing RST F or LEDR
instruction or moving INDICATOR RESET switch on CPU module
front to ON position.
If another F number has been detected, clearing of SD62 stores
the next F number into SD62.

Q2AS
Q2A

Q3A
Q4A
Q4AR

The operation status of CPU as shown below are stored in SD203.

b15 to b12 b11 to

Remote RUN/STOP
by computer

D9015

SD1015

SD203

Operating
status of CPU

Operating status of
CPU

RUN

STOP

PAUSE 1

Status in program

*1:

D9016

Program
number

SD1016

0: Main program
(ROM)
1: Main program
(RAM)
2: Subprogram 1
(RAM)
3: Subprogram 2
(RAM)
4: Subprogram 3
(RAM)
5: Subprogram 1
(ROM)
6: Subprogram 2
(ROM)
7: Subprogram 3
(ROM)
8: Main program

Except below

STOP
Instruction
execution

b8 b7

to

b4 b3

to

b0

CPU key switch

0

RUN

STOP

PAUSE 1

STEP RUN

QnA

Remains the same in

remote RUN/STOP
mode.
Remote RUN/STOP
by parameter setting
0

RUN

STOP

PAUSE 1

When the CPU mdoule is in RUN mode and SM1040 is off, the
CPU module remains in RUN mode if changed to PAUSE
mode.

Indicates which sequence program is run presently. One value of 0

to B is stored in BIN code.

(E2PROM)
9: Subprogram 1
(E2PROM)
A: Subprogram 2
(E2PROM)
B: Subprogram 3
(E2PROM)
D9017

SD1017

SD520

Scan time

Minimum scan time

(10 ms units)

If scan time is smaller than the content of SD520, the value is

newly stored at each END. Namely, the minimum value of scan
time is stored into SD520 in BIN code.

QnA

D9018

SD1018

SD524

Scan time

Scan time
(10 ms units)

At every END, the scan time is stored in BIN code and always
rewritten.

QnA

Maximum scan time

(10 ms units)

If scan time is larger than the content of SD526, the value is newly
stored at each END. Namely, the maximum value of scan time is
stored into SD526 in BIN code.

QnA

D9019

SD1019

SD526

Scan time

App - 96

APPENDICES

Table App. 3.11. Special register

ACPU
Special
Register

Special
Register
after
Conversion

D9020

SD1020

D9021

SD1021

D9022

SD1022

Special
Register for
Modification

Details

Corresponding
CPU

Constant scan

Constant scan time

(User sets in 10 ms
units)

Sets the interval between consecutive program starts in multiples

of 10 ms.
0
: No setting
1 to 200 : Set. Program is executed at intervals of (set
value) 10 ms.

Scan time

Scan time
(1 ms units)

At every END, the scan time is stored in BIN code and always
rewritten.

QnA

Count in units of 1s.

When the PC CPU starts running, it starts counting 1 every second.

It starts counting up from 0 to 32767, then down to -32768 and then
again up to 0. Counting repeats this routine.

QnA

Name

1 second
counter

SD412

Meaning

The year (last two digits) and month are stored as BCD code as
shown below.
D9025

SD1025

Clock data

b15 to b12 b11 to

Clock data
(year, month)

b8 b7 to

b0 Example:

b4 b3 to

1987, July
H8707

Year

QnA

Month

The day and hour are stored as BCD code as shown below.

b15 to b12 b11 to

D9026

SD1026

Clock data

b8 b7 to

b4 b3 to b0

Clock data
(day, hour)

Day

Example:
31st, 10 a.m.
H3110

QnA

Hour

The minute and second are stored as BCD code as shown below.

b15 to b12 b11 to

D9027

SD1027

Clock data

b4 b3 to b0 Example:

b8 b7 to

Clock data
(minute, second)

35 min, 48 sec.
H3548
Minute

QnA

Second

The day of the week is stored as BCD code as shown below.

b15

D9028

D9035

D9036

SD1028

SD1035

SD648

Clock data

Extension file
register

to

b8 b7

to

b4 b3

to

b0

Example:
Friday
H0005
Day of the week

Clock data
(day of week)

Always set "0".

Sunday

Monday

Tuesday

Wednesday

Thursday

Friday

Saturday

Stores the block No. of the extension file register being used in
BCD code.

Use block No.

SD1036

SD1037

b12 b11

Designate the device number for the extension file register for
direct read and write in 2 words at SD1036 and SD1037 in BIN
data.
Use consecutive numbers beginning with R0 of block No. 1 to
designate device numbers.
Extension file
registerfor
designation of
device number

D9037

to

Device number when

individual devices
from extension file
register are directly
accessed

QnA

QnA

Extension file register

0
Block No.1
to
area
16383

SD1037,SD1036
Device No. (BIN data)

16384
to

to

App - 97

Block No.2
area

APPENDICES

Table App. 3.11. Special register

ACPU
Special
Register

D9038

Special
Register
after
Conversion

Special
Register for
Modification

SD1038

SD207

Name

Meaning

Sets priority of ERROR LEDs which illuminate (or flicker) to

indicate errors with error code numbers.
Configuration of the priority setting areas is as shown below.

Priorities 1 to 4
LED display
priority ranking

SD207

SD1039

SD208

Priorities 5 to 7

QnA

b15 to b12 b11 to b8 b7 to

b4 b3 to
b0
Priority 4
Priority 3
Priority 2
Priority 1

Priority 7

SD208

D9039

Corresponding
CPU

Details

Priority 6

Priority 5

For details, refer to the applicable CPUs User's Manual and the
ACPU Programming manual (Fundamentals).

QnA

Turned on/off with a peripheral device.

D9044

D9049

When STRA or STRAR is executed, the value stored in

SD1044 is used as the sampling trace condition.
At scanning--------0
At time--------------Time (10 msec unit)
The value is stored into SD1044 in BIN code.

SD1044

For sampling
trace

Step or time during

sampling trace

SD1049

Work area for

SFC

Block number of
extension file register

Stores the block number of the expansion file register which is

used as the work area for the execution of a SFC program in a
binary value.
Stores "0" if an empty area of 16K bytes or smaller, which cannot
be expansion file register No. 1, is used or if SM320 is OFF.

D9050

SD1050

SFC program
error number

Error code generated

by SFC program

Stores error code of errors occurred in the SFC program in BIN

code.
0 : No error
80: SFC program parameter error
81: SFC code error
82: Number of steps of simultaneous execution exceeded
83: Block start error
84: SFC program operation error

D9051

SD1051

Error block

Block number where

error occurred

Stores the block number in which an error occurred in the SFC

program in BIN code.
In the case of error 83 the starting block number is stored.

D9052

SD1052

Error step

Step number where

error occurred

Stores the step number, where error code 84 occurred in an SFC

program, in BIN value.
Stores "0" when error code 80, 81 or 82 occurred.
Stores the block stating step number when error code 83 occurs.

D9053

SD1053

Error transition

Transition condition
number where error
occurred

Stores the transition condition number, where error code 84

occurred in an SFC program, in BIN value.
Stores "0" when error code 80, 81, 82 or 83 occurred.

D9054

SD1054

Error sequence
step

Sequence step
number where error
occurred

Stores the sequence step number of transfer condition and

operation output in which error 84 occurred in the SFC program in
BIN code.

D9055

SD1055

SD812

Status latch
execution step
number

Status latch step

Stores the step number when status latch is executed.

Stores the step number in a binary value if status latch is executed
in a main sequence program.
Stores the block number and the step number if status latch is
executed in a SFC program.

Block No.
(BIN)
Upper 8 bits

QnA

Step No.
(BIN)
Lower 8 bits

Stores the software version of the internal system in ASCII code.

Stored into lower

Lower byte byte
Undefind value in
higher byte
For version "A", for example, "41H" is stored.

Upper byte
D9060

SD1060

SD392

Software
version

Software version of
internal software

QnA

Note: The software version of the initial system may differ from the
version indicated by the version information printed on the rear
of the case.
D9072

D9081

SD1072

PLC
communication
check

Data check of serial

communication
module

In the self-loopback test of the serial communication module, the

serial communication module writes/reads data automatically to
make communication checks.

SD1081

Number of
empty blocks in
communications
request
registrtion area

Number of empty
blocks in
communications
request registration
area

Stores the number of empty blocks in the communication request

registration area to the remote terminal module connected to the
MELSECNET/MINI-S3 master unit, A2CCPU or A52GCPU.

QnA

SD714

App - 98

APPENDICES

Table App. 3.11. Special register

ACPU
Special
Register

Special
Register
after
Conversion

Special
Register for
Modification

Name

Meaning

Corresponding
CPU

Details

1 s to 65535 s

Sets the time check time of the data link instructions (ZNRD,
ZNWR) for the MELSECNET/10.
Setting range : 1 s to 65535 s (1 to 65535)
Setting unit: 1 s
Default value : 10 s (If 0 has been set, default 10 s is applied)

D9085

SD1085

Register for
setting time
check value

D9090

SD1090

Number of
special
functions
modules over

Number of special
functions modules
over

For details, refer to the manual of each microcomputer program

package.

D9091

SD1091

Detailed error
code

Self-diagnosis
detailed error code

Stores the detail code of cause of an instruction error.

D9094

SD1094

Head I/O
number of I/O
module to be
replaced

Head I/O number of I/

O module to be
replaced

Stores the first two digits of the head I/O number of the I/O module,
which will be dismounted/mounted online (with power on), in BIN
value.
Example) Input module X2F0 H2F

D9100

SD1100

D9101

SD1101

D9102

SD1102

D9103

SD251

Output module numbers (in units of 16 points), of which fuses have

blown, are entered in bit pattern. (Preset output module numbers
when parameter setting has been performed.)

b15 b14b13b12b11b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

SD1103

D9104

SD1104

D9105

SD1105

D9106

SD1106

D9107

SD1107

D9108

SD1108

D9109

SD1109

D9110

SD1110

D9111

SD1111

D9112

Fuse blown
module

Bit pattern in units of

16 points, indicating
the modules whose
fuses have blown

SD1100 0

SD1101 0

SD1107 0

1
(YC0)

Y7
B0

1
(Y80)

0
0

Y7
30

Indicates fuse blow.

For a module whose number of output points exceeds 16 points, all
bits corresponding to output module numbers within the number of
output points occupied by the module (in increments of 16 points)
turn on.
(Example) When a 64-point module is mounted on the slot 0, b0 to
b3 turn on when the fuse has blown.
Fuse blow check is executed also to the output module of remote I/
O station.
(If normal status is restored, clear is not performed. Therefore, it is
required to perform clear by user program.)

SD1113

D9114

SD1114

QnA

Set the value of the step transition monitoring timer and the
annunciator number (F number) that will be turned ON when the
monitoring timer times out.

b15

Step transfer
monitoring timer
setting

Timer setting valve

and the F number at
time out

to

b8 b7

to

b0

QnA

F number setting
(02 to 255)

Timer time limit setting

(1 to 255 s:(1 s units))

SD1112

D9113

QnA

By turning ON any of SM1108 to SM1114, the monitoring timer

starts. If the transition condition following a step which corresponds
to the timer is not established within set time, set annunciator (F) is
turned on.)

App - 99

APPENDICES

Table App. 3.11. Special register

ACPU
Special
Register

Special
Register
after
Conversion

D9116

SD1116

D9117

SD1117

D9118

SD1118

Special
Register for
Modification

Name

Meaning

Corresponding
CPU

Details

When I/O modules, of which data are different from those entered
at power-ON, have been detected, the I/O module numbers (in
units of 16 points) are entered in bit pattern. (Preset I/O module
numbers set in parmeters when parameter setting has been
performed.)

b15 b14b13b12b11b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
1
0 0 0 0 0 0 0 0 0 0 0 0 0 0 XY

SD1116 0

D9119

SD1119

D9120

SD1120

D9121

SD1121

D9122

SD1122

D9123

SD1123

I/O module
verification error

Bit pattern, in units of

16 points, indicating
the modules with
verification errors.

SD1117 0

SD1123 0

XY
7B0

XY
190

QnA

Indicates an I/O module verify error.

For a module whose number of I/O points exceeds 16 points, all
bits corresponding to I/O module numbers within the number of I/O
points occupied by the module (in increments of 16 points) turn on.
(Example) When a 64-point module is mounted on the slot 0, b0 to
b3 turn on when an error is detected.
I/O module verify check is executed also to remote I/O station
modules.
(If normal status is restored, clear is not performed. Therefore, it is
required to perform clear by user program.)
When one of F0 to 255 (F0 to 2047 for AuA and AnU) is turned on
by SET F 1 is added to the contents of SD63. When RST F or

D9124

SD1124

SD63

Number of
annuciator
detections

Number of annuciator
detections

LEDR instruction is executed, 1 is subtracted from the contents

of SD63.
(If the INDICATOR RESET switch is provided to the CPU module,
pressing the switch can execute the same processing.)

QnA

Quantity, which has been turned on by SET F is stored into

SD63 in BIN code. The value of SD63 is maximum 8.

D9125

SD1125

SD64

D9126

SD1126

SD65

D9127

SD1127

SD66

D9128

SD1128

SD67

D9129

D9130

D9131

D9132

SD1129

SD1130

SD1131

SD1132

SD68

SD69

SD70

SD71

When any of F0 to 2047 is turned on by SET F , the annunciator

numbers (F numbers) that are turned on in order are registered into
D9125 to D9132.
The F number turned off by RST F is erased from any of D9125
to D9132, and the F numbers stored after the erased F number are
shifted to the preceding registerers.
By executing LEDR instruction, the contents of SD64 to SD71
are shifted upward by one. (For A3N, A3HCPU, it can be
performed by use of INDICATOR RESET switch on front of CPU
module.)
When there are 8 annunciator detections, the 9th one is not stored
into SD64 to SD71 even if detected.
SET SET SET RST SET SET SET SET SET SET SET
F50 F25 F99 F25 F15 F70 F65 F38 F110 F151 F210 LEDR

Annunciator
detection
number

Annunciator detection
number

SD62

50 50 50 50 50 50 50 50 50 50 50 99

SD63

SD64

50 50 50 50 50 50 50 50 50 50 50 99

SD65

25 25 99 99 99 99 99 99 99 99 15

SD66

99

15 15 15 15 15 15 15 70

SD67

70 70 70 70 70 70 65

SD68

65 65 65 65 65 38

SD69

38 38 38 38 110

SD70

0 110 110 110 151

SD71

App - 100

0 151 151 210

QnA

APPENDICES

(10)Special register list dedicated for QnA

Table App. 3.12. Special register
ACPU
Special
Register

Special
Register
after
Conversion

Special
Register for
Modification

Name

0:
2:

D9200

SD1200

ZNRD
instruction
processing
result
(LRDP for
ACPU)

3:
4:

0:
2:

D9201

D9202

SD1201

SD1202

ZNWR
instruction
processing
result
(LWTP for
ACPU)

Details

Corresponding
CPU

Normal end
ZNRD
instruction
setting fault
Error at
relevant station
Relevant
station ZNRD
execution
disabled

Stores the execution result of the ZNRD (word device read)

instruction
ZNRD instruction setting faultFaulty setting of the ZNRD instruction
constant, source, and/or destination.
Corresponding station errorOne of the stations is not
communicating.
ZNRD cannot be executed in the corresponding station
The specified station is a remote I/O station.

QnA

Normal end
ZNWR
instruction
setting fault
Error at
relevant station
Relevant
station ZNWR
execution
disabled

Stores the execution result of the ZNWR (word device write)

instruction.
ZNWR instruction setting faultFaulty setting of the ZNWR
instruction constant, source, and/or destination.
Corresponding station errorOne of the stations is not
communicating.
ZNWR cannot be executed in the corresponding station
The specified station is a remote I/O station.

QnA

Meaning

3:
4:

Stores conditions for

up to numbers 1 to 16

Stores whether the slave station corresponds to MELSECNET or

MELSECNET II.
Bits corresponding to the MELSECNET II stations become "1."
Bits corresponding to the MELSECNET stations or unconnected
become "0."
Device
number

QnA

Bit
b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

SD1202 L16 L15 L14 L13 L12 L11 L10 L9 L8 L7 L6 L5 L4 L3 L2 L1

Local station
link type

SD1203 L32 L31 L30 L29 L28 L27 L26 L25 L24 L23 L22 L21 L20 L19 L18 L17
SD1241 L48 L47 L46 L45 L44 L43 L42 L41 L40 L39 L38 L37 L36 L35 L34 L33
SD1242 L64 L63 L62 L61 L60 L59 L58 L57 L56 L55 L54 L53 L52 L51 L50 L49

D9203

SD1203

Stores conditions for

up to numbers 17 to
32

If a local station goes down during the operation, the contents

before going down are retained.
Contents of SD1224 to SD1227 and SD1228 to SD1231 are ORed.
If the corresponding bit is "0", the corresponding bit of the special
register above becomes valid.
If the host (master) station goes down, the contents before going
down are also retained.

QnA

Stores the present path status of the data link.

Data link in forward loop

Master
station
0:
1:
2:

D9204

SD1204

Link status

3:

4:

5:

Forward loop,
during data link
Reverse loop,
during data link
Loopback
implemented in
forward/
reverse
directions
Loopback
implemented
only in forward
direction
Loopback
implemented
only in reverse
direction
Data link
disabled

Station
No.1

Station
No.2

Forward loop

Station n

Reverse loop

Data link in reverse loop

Master
station

Station
No.1

Forward loop

Station
No.2

Station n

Reverse loop

Loopback implemented in forward/reverse directions

Master
station

Station
No.1

Forward loopback

App - 101

Station
No.2

Station
No.3

Reverse loopback

Station n

QnA

APPENDICES

Table App. 3.12.Special register

ACPU
Special
Register

Special
Register
after
Conversion

Special
Register for
Modification

Name

Meaning

0:
1:
2:

D9204

SD1204

Link status

3:

4:

5:

Forward loop,
during data link
Reverse loop,
during data link
Loopback
implemented in
forward/
reverse
directions
Loopback
implemented
only in forward
direction
Loopback
implemented
only in reverse
direction
Data link
disabled

Corresponding
CPU

Details

QnA

Loopback in forward loop only

Master
station

Station
No.1

Station
No.2

Station
No.3

Station n

Forward loopback
QnA

Loopback in reverse loop only

Master
station

Station
No.1

Station
No.2

Station
No.3

Station n

Reverse loopback
Stores the local or remote I/O station number at which loopback is
being executed.

D9205

SD1205

Station
implementing
loopback

Station that
implemented forward
loopback

Station that
implemented reverse
loopback

Master
station

Station
No.1

Forward loopback

Station
No.2

Station
No.3

Station n

QnA

Reverse loopback

D9206

SD1206

Station
implementing
loopback

D9210

SD1210

Number of
retries

Stored as cumulative
value

Stores the number of retry times due to transmission error.

Count stops at maximum of "FFFFH" .
To return the value to "0", perform reset operation.

QnA

D9211

SD1211

Number of
times loop
selected

Stored as cumulative
value

Stores the number of times the loop line has been switched to reverse
loop or loopback.
Count stops at maximum of "FFFFH".
To return the value to "0", perform reset operation.

QnA

D9212

SD1212

Local station
operation status

Stores conditions for

up to numbers 1 to 16

Stores the local station numbers which are in STOP or PAUSE mode.

Local station
operation status

Stores conditions for

up to numbers 17 to
32
Stores conditions for
up to numbers 33 to
48

In the above example, 1 is stored into D9205 and 3 into D9206.

If data link returns to normal status (data link in forward loop), values
in D9205 and D9206 remain 1 and 3. To return them to "0", therefore,
use a sequence program or perform reset operation.

Device
number

D9213

SD1213

D9214

SD1214

Local station
operation status

D9215

SD1215

Local station
operation status

Stores conditions for

up to numbers 49 to
64

D9216

SD1216

Local station
error detect
status

Stores conditions for

up to numbers 1 to 16

D9217

SD1217

Local station
error detect
status

Stores conditions for

up to numbers 17 to
32
Stores conditions for
up to numbers 33 to
48
Stores conditions for
up to numbers 49 to
64

Bit
b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

SD1212 L16 L15 L14 L13 L12 L11 L10 L9 L8 L7 L6 L5 L4 L3 L2 L1

SD1213 L32 L31 L30 L29 L28 L27 L26 L25 L24 L23 L22 L21 L20 L19 L18 L17
SD1214 L48 L47 L46 L45 L44 L43 L42 L41 L40 L39 L38 L37 L36 L35 L34 L33
SD1215 L64 L63 L62 L61 L60 L59 L58 L57 L56 L55 L54 L53 L52 L51 L50 L49

D9218

SD1218

D9219

SD1219

Local station
error detect
status

QnA

When a local station is switched to STOP or PAUSE mode, the bit

corresponding to the station number in the register becomes "1".
Example: When station 7 switches to STOP mode, b6 in SD1212
becomes "1" , and when SD1212 is monitored, its value is
"64 (40H)".

Stores the local station numbers which are in error.

Device
number

Bit
b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

SD1216 L16 L15 L14 L13 L12 L11 L10 L9 L8 L7 L6 L5 L4 L3 L2 L1

SD1217 L32 L31 L30 L29 L28 L27 L26 L25 L24 L23 L22 L21 L20 L19 L18 L17
SD1218 L48 L47 L46 L45 L44 L43 L42 L41 L40 L39 L38 L37 L36 L35 L34 L33
SD1219 L64 L63 L62 L61 L60 L59 L58 L57 L56 L55 L54 L53 L52 L51 L50 L49

Local station
error detect
status

QnA

If a local station detects an error, the bit corresponding to the station

number becomes "1".
Example: When station 6 and 12 detect an error, b5 and 11 in
SD1216 become "1", and when SD1216 is monitored, its
value is "2080 (820H)".

App - 102

QnA

APPENDICES

Table App. 3.12.Special register

ACPU
Special
Register

D9220

D9221

D9222

D9223

D9224

D9225

D9226

Special
Register
after
Conversion

SD1220

SD1221

SD1222

SD1223

SD1224

SD1225

SD1226

Special
Register for
Modification

Name

Meaning

Local station
parameters
non-conforming;
remote I/O
station I/O
assignment
error

Stores conditions for

up to numbers 1 to 16

Local station
parameters
non-conforming;
remote I/O
station I/O
assignment
error

Stores conditions for

up to numbers 17 to
32

Local station
parameters
non-conforming;
remote I/O
station I/O
assignment
error

Stores conditions for

up to numbers 33 to
48

Local station
parameters
non-conforming;
remote I/O
station I/O
assignment
error

Stores conditions for

up to numbers 49 to
64

Local station
and remote I/O
station initial
communications
underway

Stores conditions for

up to numbers 1 to 16

Local station
and remote I/O
station initial
communications
underway

Stores conditions for

up to numbers 17 to
32

Local station
and remote I/O
station initial
communications
underway

Stores conditions for

up to numbers 33 to
48

Stores conditions for

up to numbers 49 to
64

Stores conditions for

up to numbers 1 to 16

D9227

SD1227

Local station
and remote I/O
station initial
communications
underway

D9228

SD1228

Local station
and remote I/O
station error

D9229

SD1229

Stores the local station numbers which contain mismatched

parameters or of remote station numbers for which incorrect I/O
assignment has been made.
Bit
Device
number b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
SD1220 L16 L15 L14 L13 L12 L11 L10 L9 L8 L7 L6 L5 L4 L3 L2 L1
SD1221 L32 L31 L30 L29 L28 L27 L26 L25 L24 L23 L22 L21 L20 L19 L18 L17
SD1222 L48 L47 L46 L45 L44 L43 L42 L41 L40 L39 L38 L37 L36 L35 L34 L33
SD1223 L64 L63 L62 L61 L60 L59 L58 L57 L56 L55 L54 L53 L52 L51 L50 L49

Stores conditions for

up to numbers 17 to
32
Stores conditions for
up to numbers 33 to
48

Stores the local or remote station numbers while they are

communicating the initial data with their relevant master station.
Bit
Device
number b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
L/R
SD1224 L/R
16 15
L/R
SD1225 L/R
32 31

SD1226

Stores conditions for

up to numbers 49 to
64

SD1230

D9231

SD1231

Local station
and remote I/O
station error

L/R
14
L/R
30
L/R L/R L/R
48 47 46
L/R L/R L/R
64 63 62

L/R
13
L/R
29
L/R
45
L/R
61

L/R
12
L/R
28
L/R
44
L/R
60

L/R
11
L/R
27
L/R
43
L/R
59

L/R
10
L/R
26
L/R
42
L/R
58

L/R
9
L/R
25
L/R
41
L/R
57

L/R
8
L/R
24
L/R
40
L/R
56

L/R
7
L/R
23
L/R
39
L/R
55

L/R
6
L/R
22
L/R
38
L/R
54

L/R
5
L/R
21
L/R
37
L/R
53

L/R
4
L/R
20
L/R
36
L/R
52

L/R
3
L/R
19
L/R
35
L/R
51

L/R
2
L/R
18
L/R
34
L/R
50

L/R
1
L/R
17
L/R
33
L/R
49

QnA

The bit corresponding to the station number which is currently

communicating the initial settings becomes "1" .
Example: When stations 23 and 45 are communicating, b6 of
SD1225 and b12 of SD1226 become "1", and when
SD1225 is monitored, its value is "64 (40H)", and when
SD1226 is monitored, its value is "4096 (1000H) " .

Stores the local or remote station numbers which are in error.

Device
number b15 b14 b13 b12 b11 b10 b9
SD1228
SD1229
SD1230
SD1231

D9230

QnA

If a local station acting as the master station of tier three detects a

parameter error or a remote I/O station whose I/O assignment is
abnormal, the bit of the device number corresponding to the station
number of that local station or remote I/O station turns to "1".
Example: When local station 5 and remote I/O station 14 detect an
error, b4 and b13 in SD1220 become "1" , and when
SD1220 is monitored, its value is "8208 (2010H) " .

SD1227

Local station
and remote I/O
station error
Local station
and remote I/O
station error

Corresponding
CPU

Details

L/R
16
L/R
32
L/R
48
L/R
64

L/R
15
L/R
31
L/R
47
L/R
63

L/R
14
L/R
30
L/R
46
L/R
62

L/R
13
L/R
29
L/R
45
L/R
61

L/R
12
L/R
28
L/R
44
L/R
60

L/R
11
L/R
27
L/R
43
L/R
59

L/R
10
L/R
26
L/R
42
L/R
58

Bit
b8
L/R
9
L/R
25
L/R
41
L/R
57

b7
L/R
8
L/R
24
L/R
40
L/R
56

b6
L/R
7
L/R
23
L/R
39
L/R
55

b5
L/R
6
L/R
22
L/R
38
L/R
54

b4
L/R
5
L/R
21
L/R
37
L/R
53

b3
L/R
4
L/R
20
L/R
36
L/R
52

b2
L/R
3
L/R
19
L/R
35
L/R
51

b1
L/R
2
L/R
18
L/R
34
L/R
50

b0
L/R
1
L/R
17
L/R
33
L/R
49

The bit corresponding to the station number with the error becomes
"1" .
Example: When local station 3 and remote I/O station 14 have an
error, b2 and b13 of SD1228 become "1", and when
SD1228 is monitored, its value is "8196 (2004H)".

App - 103

QnA

APPENDICES

Table App. 3.12.Special register

ACPU
Special
Register

D9232

D9233

D9234

D9235

D9236

D9237

Special
Register
after
Conversion
SD1232

SD1233

SD1234

SD1235

SD1236

SD1237

Special
Register for
Modification

Name

Meaning

Local station
and remote I/O
station loop
error

Stores conditions for

up to numbers 1 to 8

Local station
and remote I/O
station loop
error

Stores conditions for

up to numbers 9 to 16

Local station
and remote I/O
station loop
error

Stores conditions for

up to numbers 17 to
24

Stores the local or remote station number at which a forward or

reverse loop error has occurred

Local station
and remote I/O
station loop
error

Stores conditions for

up to numbers 25 to
32

Local station
and remote I/O
station loop
error

Stores conditions for

up to numbers 33 to
40

SD1237

Local station
and remote I/O
station loop
error

Stores conditions for

up to numbers 41 to
48

SD1239

Local station
and remote I/O
station loop
error

Stores conditions for

up to numbers 49 to
56

D9239

SD1239

Local station
and remote I/O
station loop
error

Stores conditions for

up to numbers 57 to
64

Number of
times
communications
errors detected

Stores cumulative
total of receive errors

D9241

SD1233
SD1234

SD1238

SD1240

Device
number

SD1232

D9238

D9240

Stores conditions for

up to numbers 33 to
48

SD1241

Corresponding
CPU

Details

SD1235
SD1236

SD1238

Bit
b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
R

L/R8
R

L/R7
R

L/R6
R

L/R5
R

L/R4
R

L/R3
R

L/R2
R

L/R16

L/R15

L/R14

L/R13

L/R12

L/R11

L/R10

L/R1
R

L/R9
R

L/R24

L/R23

L/R22

L/R21

L/R20

L/R19

L/R18

L/R17

L/R32

L/R31

L/R30

L/R29

L/R28

L/R27

L/R26

L/R25

L/R40

L/R39

L/R38

L/R37

L/R36

L/R35

L/R34

L/R33

L/R47

L/R46

L/R45

L/R44

L/R43

L/R42

L/R41

L/R56

L/R55

L/R54

L/R53

L/R52

L/R51

L/R50

L/R49

L/R64

L/R63

L/R62

L/R61

L/R60

L/R59

L/R58

QnA

L/R48

L/R57

"F" in the above table indicates a forward loop line, and "R" a reverse
loop line. The bit of the device number corresponding to the station
number of the local station or remote I/O station that has a forward
loop line or reverse loop line error.
Example: When the forward loop line of station 5 has an error, b8 of
SD1232 become "1", and when SD1232 is monitored, its
value is "256 (100H)".

Stores the number of times the following transmission errors have

been detected:
CRC, OVER, AB. IF
Count is made to a maximum of FFFFH.
To return the value to "0", perform reset operation.

QnA

Stores whether the slave station corresponds to MELSECNET or

MELSECNET II.
Bits corresponding to the MELSECNET II stations become "1."
Bits corresponding to the MELSECNET stations or unconnected
become "0."
Device
number

Bit
b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

SD1202 L16 L15 L14 L13 L12 L11 L10 L9 L8 L7 L6 L5 L4 L3 L2 L1

SD1203 L32 L31 L30 L29 L28 L27 L26 L25 L24 L23 L22 L21 L20 L19 L18 L17

Local station
link type

SD1241 L48 L47 L46 L45 L44 L43 L42 L41 L40 L39 L38 L37 L36 L35 L34 L33

QnA

SD1242 L64 L63 L62 L61 L60 L59 L58 L57 L56 L55 L54 L53 L52 L51 L50 L49

Stores conditions for

up to numbers 49 to
64

If a local station goes down during the operation, the contents

before going down are retained.
Contents of SD1224 to SD1227 and SD1228 to SD1231 are ORed.
If the corresponding bit is "0", the corresponding bit of the special
register above becomes valid.
If the host (master) station goes down, the contents before going
down are also retained.

D9242

SD1242

D9243

SD1243

Station number
information for
host station

Stores station
number (0 to 64)

Allows a local station to confirm its own station number

QnA

D9244

SD1244

Number of link
device stations

Stores number of
slave stations

Indicates the number of slave stations in one loop.

QnA

D9245

SD1245

Receive error
detection count

Stores cumulative
total of receive errors

Stores the number of times the following transmission errors have

been detected: CRC, OVER, AB. IF
Count is made to a maximum of FFFFH. To return the value to "0",
perform reset operation.

QnA

App - 104

APPENDICES

Table App. 3.12.Special register

ACPU
Special
Register

D9248

D9249

Special
Register
after
Conversion
SD1248

SD1249

Special
Register for
Modification

Name

Meaning

Local station
operation status

Stores conditions for

up to numbers 1 to 16

Local station
operation status

Stores conditions for

up to numbers 17 to
32

Corresponding
CPU

Details

Stores the local station number which is in STOP or PAUSE mode.

Bit

Device
number

b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

SD1248 L16 L15 L14 L13 L12 L11 L10 L9 L8 L7 L6 L5 L4 L3 L2 L1

SD1249 L32 L31 L30 L29 L28 L27 L26 L25 L24 L23 L22 L21 L20 L19 L18 L17
SD1250 L48 L47 L46 L45 L44 L43 L42 L41 L40 L39 L38 L37 L36 L35 L34 L33
SD1251 L64 L63 L62 L61 L60 L59 L58 L57 L56 L55 L54 L53 L52 L51 L50 L49

Stores conditions for

up to numbers 33 to
48

D9250

SD1250

Local station
operation status

D9251

SD1251

Local station
operation status

Stores conditions for

up to numbers 49 to
64

D9252

SD1252

Local station
error conditions

Stores conditions for

up to numbers 1 to 16

D9253

SD1253

Local station
error conditions

Stores conditions for

up to numbers 17 to
32
Stores conditions for
up to numbers 33 to
48
Stores conditions for
up to numbers 49 to
64

D9254

SD1254

Local station
error conditions

D9255

SD1255

Local station
error conditions

QnA

The bit corresponding to the station number which is in STOP or

PAUSE mode, becomes "1".
Example: When local stations 7 and 15 are in STOP mode, b6 and
b14 of SD1248 become "1", and when SD1248 is
monitored, its value is "16448 (4040H)".

Stores the local station number other than the host, which is in error.
Bit

Device
number

b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

SD1252 L16 L15 L14 L13 L12 L11 L10 L9 L8 L7 L6 L5 L4 L3 L2 L1

SD1253 L32 L31 L30 L29 L28 L27 L26 L25 L24 L23 L22 L21 L20 L19 L18 L17
SD1254 L48 L47 L46 L45 L44 L43 L42 L41 L40 L39 L38 L37 L36 L35 L34 L33
SD1255 L64 L63 L62 L61 L60 L59 L58 L57 L56 L55 L54 L53 L52 L51 L50 L49

QnA

The bit corresponding to the station number which is in error,

becomes "1".
Example: When local station 12 is in error, b11 of SD1252 becomes
"1", and when SD1252 is monitored, its value is "2048
(800H) ".

(11)Fuse blown module

Table App. 3.13. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
SD1300
SD1301
SD1302
SD1303
SD1304
SD1305
SD1306
SD1307
SD1308
SD1309
to
SD1330
SD1331

D9100

The numbers of output modules whose fuses have blown are input as a
bit pattern (in units of 16 points).
(If the module numbers are set by parameter, the parameter-set
numbers are stored.)
Also detects blown fuse condition at remote station output modules

Fuse blown
module

Bit pattern in units

of 16 points,
indicating the
modules whose
fuses have blown
0 : No blown fuse
1 : Blown fuse
present

SD1300

D9101
D9102

b15 b14 b13 b12 b11b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

1
1
0 0 0 (YC0) 0 0 0 (Y80) 0 0 0 0 0 0 0 0
1

SD1301

(Y1F0)

SD1331

Y1F
B0

1
(Y1A0)

Y1F
30

Indicates fuse blow.

For a module whose number of output points exceeds 16 points, all bits
corresponding to output module numbers within the number of output
points occupied by the module (in increments of 16 points) turn on.
(Example) When a 64-point module is mounted on the slot 0, b0 to b3
turn on when the fuse has blown.
Not cleared even if the blown fuse is replaced with a new one.
This flag is cleared by error resetting operation.

App - 105

D9103
D9104
S (Error)

D9105
D9106
D9107
New
New
New

QnA

APPENDICES

(12)I/O module verification

Table App. 3.14. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
SD1400
SD1401
SD1402
SD1403
SD1404
SD1405

D9116

When the I/O modules whose I/O module information differs from that
registered at power-ON are detected, the numbers of those I/O modules
are entered in bit pattern.
(If the I/O numbers are set by parameter, the parameter-set numbers are
stored.)
Also detects I/O module information.

I/O module
verify error

SD1406
SD1407

Bit pattern, in units

of 16 points,
indicating the
modules with
verification errors.
0 : No I/O
verification
errors
1 : I/O verification
error present

SD1408
SD1409
to
SD1430

SD1400

D9117
D9118
D9119

b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

1
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 X0Y

SD1401

SD1431

XY

1FE0

XY
190

D9120
S (Error)

D9121

Indicates an I/O module verify error.

D9123

For a module whose number of I/O points exceeds 16 points, all bits
corresponding to I/O module numbers within the number of I/O points
occupied by the module (in increments of 16 points) turn on.
(Example) When a 64-point module is mounted on the slot 0, b0 to b3
turn on when an error is detected.

New
New

Not cleared even if the blown fuse is replaced with a new one.
This flag is cleared by error resetting operation.

SD1431

QnA

D9122

New

(13)Process control instructions

Table App. 3.15. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU

Corresponding
CPU

D9
SD1500
SD1501

Basic period

SD1502

Process control
instruction detail
error code

Process control
instruction detail
error code

SD1503

Process control
instruction
generated error
location

Process control
instruction
generated error
location

Basic period tome

Set the basic period (1 second units) use for the process control
instruction using floating point data.

New

Q4AR

Shows the detailed error contents for the error that occurred in the
process control instruction.

S (Error)

New

Q4AR

Shows the error process block that occurred in the process control
instruction.

S (Error)

New

Q4AR

Floating point data =

SD1501

App - 106

SD1500

APPENDICES

(14)For redundant systems (Host system CPU information *1)

SD1510 to SD1599 are only valid for redundant systems.
They are all set to 0 for stand-alone systems.
Table App. 3.16. Special register

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

D9
SD1512

Operation mode
during CPU
module start up

Hot start switch

power out time

Shows the power out time (S) during the automatic switch from hot start
to initial start in the operation mode when the CPU module is started up.

S (Initial)

New

Q4AR

SD1590

Switch request
network No.

Request source
network No.

Stores the request source at work No. when the SM1590 is turned on.

S (Error)

New

Q4AR

App - 107

APPENDICES

(15)For redundant systems (Other system CPU information *1)

SD1600 to SD1659 is only valid during the back up mode for redundant systems, and
refresh cannot be done when in the separate mode.
SD1651 to SD1699 are valid in either the backup mode or separate mode.
When a stand-alone system SD1600 to SD1699 are all 0.
Table App. 3.17. Special register

Number

Name

Meaning

Set by
(When Set)

Explanation

Corresponding
ACPU
SD

Corresponding
CPU

*2

Diagnosis error

Diagnosis error
No.

Stores as BIN code the error No. of the error that occurred during the
other system CPU module diagnosis.
Stores the latest error currently occurring.

Diagnosis error
occurrence time

Diagnosis error
occurrence time

SD1600 stores the updated date and time.

Stores each of the BCD two digits.
Refer to SD1 to SD3 for the storage status.
(SD1 SD1601, SD2 SD1602, SD3 SD1603)

S (Each END)

SD1 to
SD3

Q4AR

Error
information
classification

Error information
classification

Stores the error comment information/individual information

classification code.
Refer to SD4 for the storage status.

S (Each END)

SD4

Q4AR

Error common
information

Error common
information

Stores the common information for the error code.

Refer to SD5 to SD15 for the storage status.
(SD5 SD1605, SD6 SD1606, SD7 SD1607, SD8 SD1608,
SD9 SD1609, SD10 SD1610, SD11 SD1611, SD12 SD1612,
SD13 SD1613, SD14 SD1614, SD15 SD1615)

S (Each END)

SD5 to
SD15

Q4AR

Error individual
information

Error individual
information

Stores the individual information for the error code.

Refer to SD16 to SD26 for the storage status.
(SD16 SD1616, SD17 SD1617, SD18 SD1618,
SD19 SD1619, SD20 SD1620, SD21 SD1621, SD22
SD23 SD1623, SD24 SD1624, SD25 SD1625, SD26

S (Each END)

SD16 to
SD26

Q4AR

Switch status

CPU module
switch status

Stores the CPU module switch status.

Refer to SD200 for the storage status.
(SD1650 SD200)

S (Each END)

SD200

Q4AR

SD1651

LED status

CPU module -LED

status

Stores the CPU module's LED status.

Shows 0 when turned off, 1 when turned on, and 2 when flicking.
Refer to SD201 for the storage status.
(SD1651 SD201)

S (Each END)

SD201

Q4AR

SD1653

CPU module
operation status

CPU module
operation status

Stores the CPU module operation status.

Refer to SD203 for the storage status.
(SD1653 SD203)

S (Each END)

SD203

Q4AR

SD1600
SD1601
SD1602
SD1603
SD1604

S (Each END)

SD0

Q4AR

SD1605
SD1606
SD1607
SD1608
SD1609
SD1610
SD1611
SD1612
SD1613
SD1614
SD1615
SD1616
SD1617
SD1618
SD1619
SD1620
SD1621
SD1622
SD1623

SD1622,
SD1626)

SD1624
SD1625
SD1626
SD1650

*1 : Stores other system CPU module diagnostics information and system information.
*2 : Shows the special register (SD

) for the host system CPU module.

App - 108

APPENDICES

(16)For redundant systems (Trucking)

SD1700 to SD1779 is valid only for redundant systems.
These are all 0 for stand-alone systems.
Table App. 3.18. Special register

Number

Name

Meaning

Explanation

Set by
(When Set)

Corresponding
ACPU

Corresponding
CPU

D9
SD1700

Tracking error
detection count

Tracking error
detection count

When the tracking error is detected, count is added by one.

App - 109

S(Error)

New

Q4AR

APPENDICES

APPENDIX 4 PRECAUTIONS FOR UTILIZING THE EXISTING MELSEC-A SERIES

PROGRAM FOR Q2ASCPU
To utilize a sequence program, created for AnNCPU, AnACPU, or AnUCPU, for
Q2ASCPU, convert it using the "A QnA Conversion" option of the "Option" menu in the
file maintenance mode of the GPP function.
For details on the GPP function operations, refer to the GX Developer Operating Manual
or SW IVD-GPPQ Operating Manual (Offline).
For details on instructions and devices, refer to the QCPU (Q mode)/QnACPU
Programming Manual (Common Instructions).
The instructions, devices, and comments, etc. indicated below may require modification in
each mode after conversion.
Appendix 4.1

Instructions

An

CPU Instruction

Instruction after A
Conversion

QnA

Corrective Action
Modify the instruction to a BMOV

BMOVR instruction

instruction.

Program example:
LEDA BMOVR

OUT SM1255

LEDC D10

LEDC D10

LEDC D100

LEDC D100

SUB K10

OUT SM1255

LEDR

LEDR

BMOV ZR100 ZR1000 K10

Modify the instruction to a BXCH

BXCHR instruction

instruction.

Program example:
LEDA BXCHR

OUT SM1255

LEDC D10

LEDC D10

LEDC D100

LEDC D100

SUB K10

OUT SM1255

LEDR

LEDR

BXCH ZR100 ZR1000 K10

Since the Q2ASCPU does not

have the main/subsequence
program system, it has no CHG
instructions.Delete OUT SM1255
CHG instruction

OUT SM1255

as it is not necessary.Modify the

main/subsequence program after
conversion and set new
parameters.
(Refer to Appendix 4.5)

CHK instruction
Program example:
CHK M10 X100

Refer to Appendix 4.12

CHK

CLC instruction

Modify the instruction to SM700,

Program example:
CLC

special relay for carry flag.

RST SM1012

App - 110

RST SM700

APPENDICES

An

Instruction after A

CPU Instruction

QnA

Corrective Action

Conversion

AnA/AnUCPU dedicated instruction

IX instruction

OUT SM1255

Refer to Appendix 4.12

LEDA instruction

Modify the instruction to an LED

(excluding dedicated instructions for

instruction.

AnACPU, AnUCPU)
Program example:

$MOV "ABCDEFGH" D0

LEDA ABCDEFGH

OUT SM1255

$MOV "IJKLMNOP" D10

$+

LEDB instruction

D0 D10 D20

LED D20

(excluding dedicated instructions for

AnACPU, AnUCPU)

LED display is performed after

Program example:

adding the right 8 characters and

LEDB IJKLMNOP

OUT SM1255

the left 8 characters.

Modify the instruction to a ZNRD

LRDP instruction

instruction.

Program example:
LRDP K3 D10 D100 K10

OUT SM1255

J.ZNRD J0 K3 D10 D100 K10

M0
Modify the instruction to a ZNWR

LWTP instruction

instruction.

Program example:
LWTP K3 D10 D100 K10

OUT SM1255

J.ZNWR J0 K3 D10 D100 K10

M0

OUT instruction
Program example:
The number of counter points or the
device by which the set value is used

After conversion, the parameters

is set by parameter.

will be set as defaults, so they

Number of counter points: 512

must be set again if using an

Setting val. stored dev. start: D3000

interrupt counter.

OUT C0

K10

OUT C256 D3000

OUT C0 K10
OUT C256 D3000
Modify the instruction to an RFRP

RFRP instruction

instruction for QnACPU.

Program example:
RFRP H100 K10 W100 K10

OUT SM1255

Modify the instruction to an RTOP

RTOP instruction

instruction for Q2ASCPU.

Program example:
RTOP H100 K10 W100 K10

U.RFRP U10 K10 W100 K10 M0

OUT SM1255

SCMP instruction

U.RTOP U10 K10 W100 K10 M0

Modify the instruction to an

Program example:

instruction using AND$= and OUT

LEDA SCAP

OUT SM1255

LEDC D10

LEDC D10

LEDC D100

LEDC D100

AND$= D0 D100

LEDC M0

LEDC M0

OUT M0

LEDR

App - 111

instructions.

APPENDICES

An

CPU Instruction

Instruction after A
Conversion

SEG instruction

QnA

Corrective Action
Modify the instruction to an RFS
instruction.

When used as a partial refresh

instruction
Program example:
SET M9052

SET SM1052

SEG K4Y10 K4B1

SEG K4Y10 K4B1

STC instruction

Modify the instruction to SM700,

Program example:
STC

RFS Y10 H8

special relay for carry flag.

SET SM1012

SET SM700
As the Q2ASCPU cannot store
any microcomputer program, it
has no SUB instructions.
Delete OUT SM1255 as it is not
necessary.

SUB instruction

OUT SM1255

Change the microcomputer

program for the AnNCPU or
A3HCPU to the sequence
program using Q2ASCPU
instructions.
(Refer to Appendix 4.6)
Modify the instruction to an MOV
instruction.

ZRRD instruction
Program example:
DMOV K8000 D9036

DMOV K8000 SD1036

MOV ZR8000 SD718

LEDA ZRRD

OUT SM1255

SD718 is the device resulting

from converting accumulator A0.
Modify the instruction to an MOV

ZRWR instruction

instruction.

Program example:
DMOV K8000 D9036

DMOV K8000 SD1036

MOV SD718 ZR8000

LEDA ZRWR

OUT SM1255

SD718 is the device resulting

from converting accumulator A0.

App - 112

APPENDICES

(a) Instructions for which program modification is unnecessary after conversion

An

CPU Instruction

Instruction after A

QnA Conversion

ASC instruction
Program example:
ASC ABCDEFGH D10

$MOV ABCDEFGH D10

Note:Since the $MOV instruction has 00H appended at
the end, 5 data register words (for 9 characters)
must be secured.

DFLOAT instruction
Program example:
LEDA DFLOAT

DFLT D10 D100

LEDC D10
LEDC D100
LEDR
DOUT instruction
Program example:
LEDA DOUT

OUT DY10

LEDC Y10
LEDR
DRCL instruction
Program example:

DRCL SD718 K8

DRCL K8

SD718 is the device resulting from converting

accumulator A0.

DRCR instruction
Program example:

DRCR SD718 K8

DRCR K8

SD718 is the device resulting from converting

accumulator A0.

DROL instruction
Program example:

DROL SD718 K8

DROL K8

SD718 is the device resulting from converting

accumulator A0.

DROR instruction
Program example:

DROR SD718 K8

DROR K8

SD718 is the device resulting from converting

accumulator A0.

DRST instruction
Program example:
LEDA DRST

RST DY10

LEDC Y10
LEDR

App - 113

APPENDICES

An

CPU Instruction

Instruction after A

QnA Conversion

DSUM instruction
Program example:

DSUM D10 SD718

DSUM D10

SD718 is the device resulting from converting

accumulator A0.

DSET instruction
Program example:
LEDA DSET

SET DY10

LEDC Y10
LEDR
FLOAT instruction
Program example:
LEDA FLOAT

FLT D10 D100

LEDC D10
LEDC D100
LEDR
OUT instruction
Program example:
Set head numbers with parameters.
Low speed : 0
High speed: 200
Retentive : 224
Extension timer
Low speed : 256
High speed: 512
Retentive : 768
Setting val. stored dev. start: D5000
OUT T0

OUT T0 K10

K10

OUT T200 K10

OUTH T200 K10

OUT T225 K10

OUT ST225 K10

OUT T256 D5000

OUT T256 D5000

OUT T512 D5256

OUTH T512 D5256

OUT T768 D5512

OUT ST768 D5512

RCL instruction
Program example:
RCL K8

RCL SD718 K8
SD718 is the device resulting from converting
accumulator A0.

RCR instruction
Program example:
RCR K8

RCR SD718 K8
SD718 is the device resulting from converting
accumulator A0.

ROL instruction
Program example:
ROL K8

ROL SD718 K8
SD718 is the device resulting from converting
accumulator A0.

App - 114

APPENDICES

An

CPU Instruction

Instruction after A

QnA Conversion

ROR instruction
Program example:
ROR K8

ROR SD718 K8
SD718 is the device resulting from converting
accumulator A0.

SADD instruction
Program example:
LEDA SADD

$+ D10 D100 D200

LEDC D10
LEDC D100
LEDC D200
LEDR
SER instruction
Program example:
SER D10 D100 K5

SER D10 D100 SD718 K5

SD718 is the device resulting from converting
accumulator A0.

SMOV instruction
Program example:
$MOV D10 D100

LEDA SMOV
LEDC D10
LEDC D100
LEDR
SUM instruction
Program example:
SUM D10

SUM D10 SD718

SD718 is the device resulting from converting
accumulator A0.

ZRRDB instruction
Program example:
DMOV K8000 D9036

DMOV K8000 SD1036

LEDA ZRRDB

ZRRDB SD1036 SD718

SD1036 is the device resulting from converting the
special register D9036.
SD718 is the device resulting from converting
accumulator A0.

ZRWRB instruction
Program example:
DMOV K8000 D9036

DMOV K8000 SD1036

LEDA ZRWRB

ZRWRB SD1036 SD718

SD1036 is the device resulting from converting the
special register D9036.
SD718 is the device resulting from converting
accumulator A0.

App - 115

APPENDICES

An

CPU Instruction

Instruction after A

QnA Conversion

AnA/AnUCPU dedicated instruction

LEDA/LEDB instruction name
SUB/LEDC device 1

Instruction name device 1 .... device n

... ...
SUB/LEDC device n
LEDR
Program example 1: SIN instruction
LEDA SIN

SIN D10 D100

LEDC D10
LEDC D100
LEDR
Program example 2: DSER instruction
LEDA DSER

DSER D10 D100 SD718 K5

SD718 is the device resulting from converting

LEDC D10

accumulator A0.

LEDC D100
SUB K5
LEDR
AnA/AnUCPU special function module
dedicated instruction
LEDA/LEDB instruction name

Enter "G." before the instruction.

G. instruction name device Un .... device n

SUB/LEDC device 1
... ...
SUB/LEDC device n
LEDR
Program example:

G.SVWR1 U2 D10

LEDA SVWR1
SUB H2
LEDC D10
LEDR
AnA/AnUCPU data link dedicated instruction
LEDA/LEDB instruction name

Enter "J." before the instruction.

J. instruction name J0 device 1 .... device n

SUB/LEDC device 1
Network for using MELSECNET II

... ...
SUB/LEDC device n
LEDR
Program example:
LEDA LRDP

OUT SM1255

SUB K12

J.ZNRD J0 K12 D10 D100 K5M0

LEDC D10
LEDC D100
SUB K5
LEDC M0
LEDR

App - 116

APPENDICES

An

Instruction after A

CPU Instruction

QnA Conversion

Index register
Z, Z1 to Z6, V, V1 to V6

Z0

Z1 to Z6
V

Z1 to Z6

Z7

V1 to V6

Z8 to Z13

Index register double word

If an index register is used for destination of double

word operation or single word multiplication/division, the
relation of upper and lower levels may be broken,
causing a problem.

App - 117

APPENDICES

Appendix 4.2

Device
(a) Only devices within the Q2ASCPU range are converted.
An

Device after A

CPU Device

Same as to left

Same as to left

QnA Conversion

Same as to left

M
M/L/S is determined by the

parameter settings.

Same as to left

Same as to left (Correct to M

M9000 to M9255

SM1000 to SM1255

Same as to left

T (low-speed timer)
T (high-speed timer)
T (retentive timer)

Low-speed/high-speed/
retentive is determined by
parameter setting.

Same as to left
Same as to left
ST

Same as to left

Same as to left

Same as to left

D9000 to D9255

SD1000 to SD1255

Same as to left

Same as to left

.)

Z0

Z1 to Z6

Z1 to Z6

Z7

V1 to V6

Z8 to Z13

A0,A1

SD718,SD719

Same as to left*

Same as to left

Same as to left

Same as to left

Same as to left

REMARK
*

When P254 is used as the CHK instruction pointer, P254 can be converted to P254 as is.
(Refer to Appendix 4.12)

App - 118

APPENDICES

(b) Devices that are outside the Q2ASCPU range are converted to SM1255 if they
are bit devices and to SD1255 if they are word devices.

App - 119

APPENDICES

Appendix 4.3

Parameters
The following parameter settings only are converted to Q2ASCPU use.
Latch range setting
Converted to the "latch clear key valid" range.
The latch clear key invalid range is made blank (no setting).
MELSECNET (II, /10) setting
For the MELSECNET setting when the ACPU is an AnN or AnA, the number of
modules are stored after conversion, but the network refresh parameters are not
converted.
I/O assignment
Only the head I/O No. is made blank; all other items are converted.
MELSECNET/MINI auto refresh setting
If only I/O assignment was set in the parameters and MELSECNET/MINI auto refresh
settings have not been made, the MELSECNET/MINI data link operates with the
default values.
The following items are set for the Q2ASCPU default. If settings have been made, make
the settings again.
RUN-PAUSE contacts

:No setting

Output at STOP

:Before operation

RUN

Interrupt counter No.

:No setting

WDT setting

:200ms

Operation mode when

there is an error

:STOP (All items)

App - 120

APPENDICES

Appendix 4.4

Timer and Interrupt Counter Operations

(1)

Timer
(a) The ACPU turns timer coils ON/OFF on execution of the OUT instruction, and
updates timer current values and turns contacts ON/OFF on execution of the
END instruction. In contrast, the Q2ASCPU turns timer coils ON/OFF, updates
current values, and turns contacts ON/OFF on execution of the OUT instruction.
Note that after conversion, the turning of contacts ON/OFF may be up to one
scan faster.
Example: Timing for turning contact ON

In the case of ACPU, a timer contact will turn ON quickly if it is located in the first
step.In the case of Q2ASCPU, it will turn ON quickly if it is located in the step
following OUT T.
(b) Note that processing differs as follows when the set value of a timer is set to K0:
For ACPU, count is in infinite units (timer does not count up).
For Q2ASCPU, the timer counts up instantaneously.
(2)

Interrupt counter
Interrupt counters for Q2ASCPU count the number of interrupt occurrences.However,
the counter contact does not turn ON even when the count has reached the set
value.
The operation of interrupt counters for ACPU differs according to the CPU type.
(a) Interrupt counters for A3HCPU, AnACPU, or AnUCPU count the number of
interrupts occurrences.When the count reaches the set value, the counter
contact turns ON.
In order to achieve the same operation as with interrupt counters for A3HCPU,
AnACPU, and AnUCPU when using a Q2ASCPU, the program must be modified
after conversion.
An example modification is shown below.

(b) Interrupt counters for AnCPU and AnNCPU operate as counters used in interrupt
programs.
To achieve the same operation as with interrupt counters for AnCPU or AnNCPU
when using a Q2ASCPU, the program modification is not needed after
conversion.
When ordinary counters are used in an interrupt program with Q2ASCPU, they
operate in the same way as with AnNCPU.
App - 121

APPENDICES

Appendix 4.5

Sequence Programs, Statements, Notes

After conversion by A QnA conversion, sequence programs are stored in the set file.
If a subsequence program is included, the main/subsequence program must be modified.
There are two types of modification, as indicated below:
(a) When executing the main sequence program and subsequence program
alternately, modify the parameters and programs as follows.
1) Modification of parameters
Set file names of the main sequence program and subsequence program in
program setting in "Auxiliary setting" in the parameter mode.Select scan
execution for the main sequence program and standby execution for the
subsequence program.
2) Modification of the sequence program
The CHG instruction that switches between main sequence and
subsequence programs is converted to OUT SM1255 after A QnA
conversion. Modify this OUT SM1255 to the PSCAN instruction which
converts another sequence program to an scan execution type program.
Next, add the GOEND instruction that executes a jump to the END
instruction to the following step.
Next, add the PSTOP instruction, which converts another sequence
program to a standby execution type program, to the first step of the
sequence program.
This enables execution of the subsequence program from the main
sequence program, and disables execution of the main sequence program
when the subsequence program is executed.
Main sequence program

Subsequence program

App - 122

APPENDICES

(b) To execute the main sequence program and subsequence program serially as
one program, modify the parameters and program as follows.
1) Modification of parameters
Set the file names in the order of main sequence program and subsequence
program in program setting in "Auxiliary setting" in the parameter mode.
Select scan execution as the execution type for both the main sequence
program and the subsequence program.
2) Modification of the sequence program
The CHG instruction that switches between main sequence and
subsequence programs is converted to OUT SM1255 after A QnA
conversion.Delete it as it is not required for Q2ASCPU.
If the same interrupt program or pointer is used for the main sequence
program or subsequence program, use only one interrupt program or
pointer.
REMARK
AnACPU executes END processing on switching from execution of the main
sequence program to execution of the subsequence program, and also executes
END processing after execution of the subsequence program.
Note that END processing is executed only after execution of the second program
when a Q2ASCPU executes two programs consecutively.
Statements and notes are entered in the sequence program file after A
conversion.
No modification is required after conversion.

App - 123

QnA

APPENDICES

Appendix 4.6

Microcomputer programs
Microcomputer programs and utility software packages cannot be converted as the
Q2ASCPU has no microcomputer mode.
When a microcomputer program or utility software package is used with the ACPU, a SUB
instruction (microcomputer program call instruction) is written in the sequence program to
execute it.The SUB instruction is converted to OUT SM1255 after A QnA conversion;
delete it as it is not necessary.
In the case of user-created microcomputer programs, convert processing contents of the
microcomputer programs to sequence programs using operation instructions added for
Q2ASCPU.
When using a utility software package of the following, convert processing contents of the
utility software package to a sequence program using operation instructions added for
Q2ASCPU.
SW

-AD57P

Refer to the QnACPU Programming Manual (AD57

Instructions).

SW

-UTLP-FN0

Refer to the QCPU (Q mode)/QnACPU Programming

Manual (Common Instructions).

SW

-UTLP-FN1

Refer to the QCPU (Q mode)/QnACPU Programming

Manual (Common Instructions).

SW

-UTLP-PID

Refer to the QCPU (Q mode)/QnACPU Programming

Manual (PID Control Instructions).

SW

-SIMA

SW

-UTLP-FD1

SW

-SAPA

Unusable

App - 124

APPENDICES

Appendix 4.7

Comments
Conversions are made for the device range of Q2ASCPU. Devices outside the range are
not converted.

App - 125

APPENDICES

Appendix 4.8

Constant Scan Function, Error Check Function

When using the constant scan function or error check function for ACPUs, special
registers or special relays are set.
In contrast, for Q2ASCPUs, these functions are set with parameters. To use these
functions after conversion, make settings in "PLC RAS" in the parameter mode.

App - 126

APPENDICES

Appendix 4.9

I/O control mode

The I/O control mode for Q2ASCPU is refresh mode (direct I/O is enabled depending on
the device).
As the I/O control mode for A2US is the refresh mode as with Q2ASCPU, there are no
problems with the input timing of inputs (X) or the output timing of outputs (Y).
In the case of A1SCPU, and A2SCPU, I/O control mode is fixed or selected to direct
mode, and the input timing for inputs (X) and output timing for outputs (Y) differs from
that for the refresh mode.
Modifying programs that generate pulses from SET/RST instructions by using direct
devices
Modify programs which, in the direct mode, output pulse output to the external using
SET/RST instructions to programs that use direct output devices for Q2ASCPU.

App - 127

APPENDICES

Appendix 4.10 Data Link System

AnUCPU data link systems
The network settings in the AnUCPU parameters can be converted by A QnA
conversion. Parameter modifications after conversion are not needed.
CPU modules other than AnUCPU
The link settings in the CPU module parameters cannot be converted by A QnA
conversion. Link settings must be made in the parameters after conversion.

App - 128

APPENDICES

Appendix 4.11

Index Register Processing

For Q2ASCPU, the contents of index registers change when program processing transfers
between the main sequence program and interrupt programs.
Transfer of program processing from main sequence program to interrupt program
The contents of the index registers of the main sequence program are saved, and
then these contents are passed to the interrupt program.
Transfer of program processing from interrupt program to main sequence program
The index registers in the interrupt program are cleared, and the saved main
sequence program contents are written to them.

For ACPU, processing differs according to the CPU module type.

The processing for A2USCPU is the same as for Q2ASCPU, and no program
modification is required after conversion.
In the case of A1SCPU, and A2SCPU, when program processing is transferred from
an interrupt program to the main program, the data updated in the interrupt program
are passed on to the main program.
When passing a value written to the index register in an interrupt program on to the
main sequence program, for example, modify the program so that the value is passed
on via a data register.

App - 129

APPENDICES

Appendix 4.12 CHK Instruction, IX Instruction

(1)

CHK instruction
The CHK instruction operates as a fault check instruction for Q2ASCPU.
For ACPU, there are two types of processing depending on the CPU type.
Fault check............................. AnCPU, AnNCPU (direct I/O control mode),
A3HCPU, AnACPU, AnUCPU
Bit device output inversion..... AnNCPU (refresh I/O control mode)
After conversion, program modification is required for each processing.
[For fault check]
Modify the CJ instruction in the step before the CHK instruction to a CHKST
instruction.
The CHK instruction pointer (P254) and the CJ instruction destination pointer
are converted to pointers with the same number. As the above pointers are
not used for Q2ASCPU, delete them.

[For bit device output inversion]

The Q2ASCPU has the FF instruction for inverting bit device outputs.
Modify the CHK instruction to the FF instruction.

(2)

IX instruction
The IX instruction is converted, but not executed. Modify the program so that all the
devices that are objects of the IX instruction are subject to indexing.

App - 130

APPENDICES

Appendix 4.13 Accessing File Register R with Instructions

For Q2ASCPU, no error will occur even if an instruction for accessing file registers outside
the setting range is executed.
When reading data, FFFFH is stored to the storage device. When writing data, the
instruction is executed but no data is stored in the file register.
For ACPU, execution of such an instruction causes an error.
The capacity of file register R is set by parameter. It is therefore necessary to check the
capacities of file registers before executing instructions that access file registers, such as
the MOV instruction and + instruction.

App - 131

APPENDICES

APPENDIX 5 ERROR CODES RETURNED TO THE REQUEST SOURCE IN GENERAL

DATA PROCESSING
With the Q2ASCPU, when an error occurs while general data processing is requested
from a peripheral device, a special function module, or a network system, the error code is
returned to the source of the general data processing request.
POINT

Since this error code is not an error detected by the Q2ASCPU self-diagnostics
function, it is not stored to special relay SD0.
If the request source is a peripheral device, the message or the error code is
displayed.
If the request source is a special function module or a network system, the error
code corresponding to the requested processing is returned.
Appendix 5.1

Error Codes
The error code's numbers depends on the location where the error has been detected.
The correspondences between the locations where errors are detected and the error
codes are indicated in the table below.
Location Where an Error is
Detected
CPU module
Serial communication module,
etc.

Error Code
4000H to 4FFFH
7000H to 7FFFH

CC-Link module

B000H to BFFFH

Ethernet module

C000H to CFFFH

MELSECNET/10 network
module

F000H to FFFFH

App - 132

Reference for Error Contents

App Appendix 5.2
Serial Communication Module User's Manual,
etc.
Control & Communication Link System Master/
Local Module User's Manual
Ethernet Interface Module User's Manual
For QnA/Q4AR MELSECNET/10 Network
System Reference Manual

APPENDICES

Appendix 5.2

Error Contents of Error Codes Detected by the CPU Module (4000H to 4FFFH)
The error contents of error codes detected by the CPU module (4000H to 4FFFH), and the
messages displayed on the peripheral device are indicated in the table below.

Error Code
(Hexadecimal)

Error

Message Displayed

Error Contents

Corrective Action

at Peripheral Device

Check the connection between

4000H

Sum check error

Message (1) is displayed.

the CPU module and connection

cable.

4001H

Remote request that cannot be

handled is performed.

4002H

Message (1) is displayed.

Check the requested remote

operation.

Command to which a global

4003H

request is not allowed is

Message (1) is displayed.

Check the requested command.

Execution is not allowed

Turn the Q2ASCPU system

during system protection.

protect switch OFF.

The data volume is too large for

Cannot execute in excess of

Reduce the data volume so that it

the specified request.

capacity.

can be handled with the request.

performed.

4004H

CPU

Since the Q2ASCPUsystem is

module-

protected, the request contents

related error

cannot be performed.

4005H

Password has not been cancelled.

4006H

CID is different from the

4007H

The Q2ASCPU is not BUSY.

Message (1) is displayed.

(Buffer is not empty.)

The request contents cannot be

4010H

performed because the

Q2ASCPU is in RUN.

4011H

CPU

The request contents cannot be

module

performed because the

mode error

Q2ASCPU is not in STEP-RUN.

The request contents cannot be

4012H

performed because the

Q2ASCPU is in STEP-RUN.

cancelled.
Message (1) is displayed.

Q2ASCPU data.

4008H

Password has not been

Cancel the set password.

Check the CID.

Re-perform the request after the
elapse of an arbitrary time period.

Cannot execute when PLC is

Perform the request after setting

in RUN mode.

the Q2ASCPU to STOP.

Cannot execut while PLC is

Perform the request after setting

not in STEP RUN mode.

the Q2ASCPU to STEP-RUN.

Not executed due to STEP-

Perform the request after setting

RUN of PLC.

the Q2ASCPU to RUN/STOP.

App - 133

APPENDICES

Error Code
(Hexadecimal)

Error

4021H

Designated drive memory does

The target dirve contains a

Check the status of the

not exist or is abnormal.

fault.

designated drive memory.

and file No. does not exist.

The file name and file No. of the

4023H

designated file do not match.

The designated file cannot be

4024H

accessed by the user.

The designated file is processing

4025H

a request from another source.

The keyword set for target drive

4026H

memory has to be designated.

CPU

The designated range exceeds

module

the file range.

The file name does not exist.

Cannot access files.

This file cannot be handled.

Check the designated file name

and file No.
Delete the file and create a new
one.
Do not access the designated file.
Forcibly perform the request.

Alert (1) is displayed.

Or perform the request again after

other processing has completed.
Access by designating the

Keyword doesn't match.

keyword set for the target drive

memory.
Check the designated range, and

File capacity is not enough.

access within the permissible

range.

file-related

Forcibly perform the request.

error
The same file has already existed. Alert (2) is displayed.

4028H

Corrective Action

at Peripheral Device

The file with designated file name,

4022H

4027H

Message Displayed

Error Contents

Or change the file name and then

perform the request.
Review the capacity of the

The capacity of the designated file

4029H

is not secured.

File capacity is not enough.

designated file.
Or sort the designated drive
memory and re-perform.
Check the designated cluster No.,

The designated cluster No. does

402AH

not exist.

and access by designating a

Cannot access files.

cluster No. within the number of

clusters of the designated drive
memory.

The request contents cannot be

performed with the designated

402BH

Do not make requests which

Cannot access files.

drive memory.

currently performed.
The designated device name

4030H

4031H

CPU
device
designation
error

Cannot access files.

Device is invalid.

cannot be handled.

module
4032H

drive memory.

The request contents cannot be

402CH

The designated device No. is out

of range.
A mistake in the designated

Device No. is out of range.

Device is invalid.

device qualification.
The designated device is for

4033H

caused an error to the designated

Re-perform after the elapse of an

arbitrary time period.
Check the designated device
name.
Check the designated device No.
Check the method for qualification
of the designated device.
Do not write data to the

system use and cannot be written

Device is invalid.

to.

designated device, or turn it ON/

OFF.

App - 134

APPENDICES

Error Code
(Hexadecimal)

Error

Message Displayed

Error Contents
The designated special function

4040H

module cannot perform the

Do not make requests which

The unit does not exist.

request contents.

memory range of the designated

Check the head address and

The # of devices is too large.

special function module.

4042H
Special

Access to the designated special

The corresponding unit is

function module is not possible.

faulty.

module

The special function module is not

designation

at the designated position.

Setting required for simulation has

not been made.

The corresponding unit is

faulty.

Data error

The head number of the device or

the number of device points

4046H

Check if the designated special

function module normally
operates.

designated special function

module.

A control bus error has occurred.

4045H

access within the actual ranges at

Check the head I/O No. of the

The unit does not exist.

error
4044H

number of accessed points, and

the special function module.

function
4043H

caused an error to the designated

special function module.

Access range exceeds the buffer

4041H

Corrective Action

at Peripheral Device

designated for simulation is not in

Check if there is a fault in the

hardware of the special function
module or other modules.
Make settings for the simulation.

Check the head number and

Device No. is not in 16 units.

number of device points and then

modify them to 16-point units.

16-point units.
Request contents cannot be
4050H

performed because the write

Cannot execute as the

Turn the write protect switch of the

protect switch of the memory card

memory protect switch is ON.

memory card OFF.

is ON.
Check the following and take
The designated device memory

4051H

cannot be accessed.

corrective action.
Wrong ROM

Whether the memory is usable

Whether the designated drive
memory correctly installed

Data cannot be written to the

4052H

Protect error

Do not write data to the

designated file because its

Write is prohibited.

attribute is read only.

Or change the file attribute.

An error occurred when writing

4053H

designated file.

data to the designated drive

memory.

Check the designated drive

Cannot write correctly in

memory.

ROM.

Or replace the target drive

memory and then rewrite the data.
Check the designated drive

An error occurred when deleting

4054H

data from the designated drive

memory.
Cannot erase ROM correctly.

memory.

Or replace the target drive

memory and then delete the data
again.

App - 135

APPENDICES

Error Code
(Hexadecimal)

Error

Message Displayed

Error Contents

Corrective Action

at Peripheral Device

When monitoring of the other

device has completed, perform

The CPU module system area for

registering monitor conditions is

4060H

Alert (1) is displayed.

being used by another device.

the monitoring again.

Or increase the system area of the
buil-in RAM using a format with an
option.

Communications failed.

4061H

Not registered.

Re-perform communications.
Do not use the detailed condition
for monitoring from the designated

Another device is monitoring using

4062H

the detailed condition for

Alert (1) is displayed.

monitoring.

device.
Or cancel the monitoring detailed
condition for other device and
perform the monitoring again.

The number of registrations for file

4063H
4064H
4065H

lock is greater than 16.

Online
registration
error

Cannot access files.

Reduce the number of

registrations to 16 or less.

Incorrect setting contents.

Setting is incorrect.

Check the set contents.

Device I/O information differs from

Does not match the

Check the parameters.

parameters.

parameter.

Or check the data.

Keyword doesn't match.

Check the designated keyword.

A keyword that differs from the

one set for the designated drive

4066H

memory was specified.

The designated monitor file has

4067H

not been secured.

The designated command cannot
be registered or cancelled since it

4068H

is in execution.
Condition has already satisfied at

4069H

device.

4070H

been designated.
Ladder
verification

Unable to execute due to on

going process.

perform monitoring.
Re-perform the command after
requests from other devices has
been completed.
Check the monitor condition.

Setting is incorrect.

Drive specification is incorrect.

The program before modification

differs from the registered

Secure the monitor file, then

Or perform monitor registration

again and then monitor.

Drive other than No.1 to 3 has

406AH

File capacity is not enough.

Program does not match.

program.

App - 136

Check the designated drive and

specifies a correct drive.
Check the registered program and
match the program to it.

APPENDICES

Error Code
(Hexadecimal)

Error

4080H

Message Displayed

Error Contents

Data error

Data is faulty.

The searched target cannot be

4081H

detected.
The designated command cannot

4082H

be performed since it is in

Cannot find the find target.

Unable to execute due to on

going process.

execution.
An attempt was made to perform a
program not registered in the

4083H

Not registered.

parameters.
The designated pointer P, I cannot

4084H

be detected.

Cannot find the find target.

possible because the program is

Not registered.

4086H

An attempt was made to add a

pointer P, I that have already

Device ranges are duplicated.

existed.
4087H

4088H

The number of pointers

No pointer exists.

designated is too great.

The designated step No. is not at
the head of the instruction.

Execution position is incorrect.

The END instruction was inserted/

4089H

deleted while the CPU module

Setting is incorrect.

had been in RUN.

The file capacity has been
408AH

exceeded by performing write

contents.
Check the data to be searched.
Re-perform the command after
requests from other devices has
been completed.
Register the program to be
performed to the parameters.

Check the data to be searched.

performed in the parameters, then

designate the pointer P, I.

not registered in the parameters.

Other error

Check the requested data

Register the program to be

Pointer P, I designation is not

4085H

Corrective Action

at Peripheral Device

File capacity is not enough.

during RUN.

Check the pointer No. to be added

and change it.
Check and correct the designated
pointer.
Check and correct the designated
step No.
Insert/Delete the instruction after
setting the CPU module to STOP.

Set the CPU module to STOP and

then write the program.
Set the CPU module to the state

408BH

Cannot perform a remote request. Data error.

for performing a remote request,

then reissue the request.

App - 137

APPENDICES

Error Code
(Hexadecimal)

Error

Message Displayed

Error Contents

at Peripheral Device

Too many block break points.

4090H

The number of registered block

4091H

break points is incorrect.

Too many step break points.

4092H

The number of registered step

4093H

break points is incorrect.

An attempt was made to perform a
request during block continuous

4094H

processing.
An attempt was made to perform a
4095H

request during block forced

execution processing.
An attempt was made to perform a
request during step continuous

4096H

processing.
An attempt was made to perform a
request during step forced

4097H

execution processing.

Corrective Action

Setting is out of range.

Check and correct the set number.

Setting is out of range.

Check and correct the set number.

Setting is out of range.

Check and correct the set number.

Setting is out of range.

Check and correct the set number.

Unable to execute due to on

Reissue the request after the

going process.

processing has been completed.

Unable to execute due to on

Reissue the request after the

going process.

processing has been completed.

Unable to execute due to on

Reissue the request after the

going process.

processing has been completed.

Unable to execute due to on

Reissue the request after the

going process.

processing has been completed.

Unable to execute due to on

Reissue the request after the

going process.

processing has been completed.

Unable to execute due to on

Reissue the request after the

going process.

processing has been completed.

Unable to execute due to on

Reissue the request after the

going process.

processing has been completed.

Unable to execute due to on

Reissue the request after the

going process.

processing has been completed.

Unable to execute due to on

Reissue the request after the

going process.

processing has been completed.

Online
4098H

registration

An attempt was made to perform a

error during

request during one step

SFC STEP

continuous processing.

RUN
4099H

An attempt was made to perform a

request during one step forced
execution processing.
An attempt was made to perform a

409AH

request during block forced end

processing.
An attempt was made to perform a

409BH

request during step forced end

processing.
An attempt was made to perform a

409CH

request during holding step reset

processing.
A block No. with no created block

409DH

or out-of-range block No. has

Setting is incorrect.

been designated.
409EH

409FH

A step No. for which no step has

been created was designated.
The designated number of cycles
is out of range.

Setting is incorrect.

Setting is out of range.

App - 138

Check and correct the set

contents.
Check and correct the set
contents.
Check and correct the set number.

APPENDICES

Error Code
(Hexadecimal)

Error

Setting is incorrect.

designated.
Designation exceeds the range for

40A1H

the number of blocks.

Out-of-range step No. is

40A2H
SFC device

Designation exceeds the range for

designation

number of steps.

error

Out-of-range sequence step No. is

designated.
The designated device is out of

40A5H

Setting is out of range.

Setting is incorrect.

designated.

40A4H

range.

Setting is out of range.

Setting is incorrect.

Setting is out of range.

The block designation pattern or

40A6H

step designation pattern was

Setting is incorrect.

incorrect.
The designated drive is incorrect.

40B0H

The designated program does not

40B1H

Corrective Action

at Peripheral Device

Out-of-range block No. is

40A0H

40A3H

Message Displayed

Error Contents

exist.

Setting is incorrect.

The file name does not exist.

Check and correct the set

contents.
Check and correct the set number.
Check and correct the set
contents.
Check and correct the set number.
Check and correct the set
contents.
Check and correct the set number.

Check and correct the set

contents.
Check and correct the set
contents.
Check and correct the designated
file name.

SFC file40B2H

related error

The designated program was not

an SFC program.

This file cannot be handled.

The SFC dedicated instruction

exists in the write during RUN

40B3H

Setting is incorrect.

area.
The designated station cannot be
4A00H

accessed because no routing

Routing parameter does not

parameters have been set to the

exist.

relevant station.

4A01H

Link-related

No network with the No. set in the

The network I/O does not

error

routing parameters exists.

exist.

Check and correct the designated

file name.
Check and correct the set
contents.

Set the routing parameters for

accessing to the designated
station in the relevant station.
Check and correct the routing
parameters set at the relevant
station.
Check if an error has occurred at

Cannot access to the designated

4A02H

station.

Link unit error.

the network module/link module,

or if the online state has not been
established.
Check and correct the error at the

4B00H

Target-

An error occurred at the access

The corresponding unit is

designated access target station

related error

target station or the relay station.

faulty.

or the relay station for the access

station.

App - 139

APPENDICES

REMARK
(1) Message (1)

An error code is displayed in ****.

(2) Alert (1)

(3) Alert (2)

App - 140

APPENDICES

APPENDIX 6 EXTERNAL DIMENSIONS

Appendix 6.1

Q2AS(H)CPU(S1) module

Q2ASHCPU
STOP
L.CLR
RESET

RUN
RESET

RUN
ERROR
USER
BAT.ALM
BOOT

NP

130 (5.12)

MITSUBISHI

PULL

6.5
(0.26)

110 (4.33)

54.5 (2.15)
Unit : mm (inch)

App - 141

APPENDICES

Appendix 6.2

A1S61PN, A1S62PN and A1S63P power supply modules

A 1S61PN
POWER

NP

6.5
(0.25)

OUTPUT
DC 5V 5A

130 (5.11)

INPUT
AC 85 132V
AC170 264V
50 / 60Hz

93.6 (3.68)

54.5 (2.14)

Unit :mm (inch)

App - 142

APPENDICES

Main Base Unit

(1)

A1S32B main base unit

4-mounting screws
(M5 25)

OUT

CPU

I/O0

I/O1

MITSUBISHI ELECTRIC CORPORATION

POWER

A1S32B

130 (5.11)

OUT

110 (4.33)

200 (7.87)
220 (8.66)

16.4
(0.64)

28

(1.10)
Unit: mm (inch)

(2)

A1S33B main base unit

4-mounting screws
(M5 25)

OUT

CPU

POWER

I/O0

I/O1

I/O2

MITSUBISHI ELECTRIC CORPORATION

A1S33B

130 (5.11)

OUT

110 (4.33)

Appendix 6.3

235 (9.25)
255 (10.03)

28

16.4
(0.64)

(1.10)

Unit: mm (inch)

App - 143

APPENDICES

(3)

A1S35B main base unit

4-mounting screws
(M5 25)

I/O0

CPU

I/O1

MITSUBISHI ELECTRIC CORPORATION

POWER

I/O2

I/O3

I/O4

BD626E680G52
MADE IN JAPAN

E.S.D

A1S35B

130 (5.11)

OUT

110 (4.33)

OUT

16.4

305 (12.00)

(0.64)

28

325 (12.79)

(1.10)
Unit: mm (inch)

(4)

A1S38B, A1S38HB main base units

4-mounting screws
(M5 25)

CPU

POWER

I/O0

I/O1

I/O2

I/O3

I/O4

MITSUBISHI ELECTRIC CORPORATION

I/O5

I/O6

I/O7

BD626E680G52

MADE IN JAPAN

E.S.D

A1S38B

130 (5.11)

OUT

110 (4.33)

OUT

410 (16.14)
430 (16.93)

28

16.4
(0.64)

(1.10)
Unit: mm (inch)

App - 144

APPENDICES

Appendix 6.4

Extension Base Unit

(1)

A1S65B extension base unit

4-mounting screws
(M5 25)

I/O1

I/O2

I/O3

I/O4
A1S65B

MITSUBISHI ELECTRIC CORPORATION

130 (5.11)

I/O0

POWER

FG

110 (4.33)

IN

295 (11.61)
315 (12.40)

16.4
(0.64)

28

(1.10)
Unit: mm (inch)

(2)

A1S68B extension base unit

4-mounting screws
(M5 25)

I/O1

I/O2

I/O3

I/O4

MITSUBISHI ELECTRIC CORPORATION

I/O5

I/O6

I/O7

BD626E680G52

A1S68B
MADE IN JAPAN

E.S.D

130 (5.11)

I/O0

POWER

110 (4.33)

IN

16.4
28 (0.64)
(1.10)

400 (15.74)
420 (16.53)

Unit: mm (inch)

App - 145

APPENDICES

(3)

A1S52B extension base unit

4-mounting screws
(M5 25)

I/O1

MITSUBISHI ELECTRIC CORPORATION

FG

A1S52B

130 (5.11)

I/O0

110 (4.33)

IN

135 (5.31)
155 (6.10)

16.4
(0.64)

28

(1.10)
Unit: mm (inch)

(4)

A1S55B extension base unit

4-mounting screws
(M5 25)

I/O1

I/O2

I/O3

I/O4
A1S55B

MITSUBISHI ELECTRIC CORPORATION

130 (5.11)

I/O0
FG

110 (4.33)

IN

240 (9.44)
260 (10.23)

28

16.4
(0.64)

(1.10)
Unit: mm (inch)

App - 146

APPENDICES

(5)

A1S58B extension base unit

4-mounting screws
(M5 25)

I/O1

I/O2

I/O3

I/O4

I/O5

I/O6

I/O7
A1S58B

MITSUBISHI ELECTRIC CORPORATION

130 (5.11)

I/O0
FG

110 (4.33)

IN

345 (13.58)

16.4

365 (14.37)

(0.64)

28

(1.10)
Unit: mm (inch)

App - 147

APPENDICES

(6)

A1S65B-S1 extension base unit

4-mounting screws
(M5 25)

IN

OUT

OUT

110 (14.33)

1
2
3

I/O 3
POWER

I/O 4

I/O 5

I/O 6

130 (15.12)

I/O 7

MITSUBISHI ELECTRIC CORPORATION

16.4(0.65)

295 (11.61)
315 (12.40)

28
(1.10)
Unit: mm (inch)

(7)

A1S68B-S1 extension base unit

4-mounting screws
(M5 25)

OUT

OUT

1
2
3

I/O 0
POWER

I/O 1

I/O 2

I/O 3

I/O 4

I/O 5

MITSUBISHI ELECTRIC CORPORATION

MADE IN JAPAN

400 (15.75)
420 (16.54)

App - 148

I/O 6

I/O 7

110 (4.33)

IN

130 (5.12)

16.4(0.65)
28
(1.10)

APPENDICES

A1S52B-S1 extension base unit

4-mounting screws
(M5 25)

IN

OUT

OUT

1
2
3

I/O 0

I/O 1

MITSUBISHI ELECTRIC CORPORATION

S1

110 (4.33)
130 (5.12)

(8)

FG

135 (5.31)

16.4(0.65)

155 (6.10)
28 (1.10)
Unit: mm (inch)

App - 149

APPENDICES

(9)

A1S55B-S1 extension base unit

4-mounting screws
(M5 25)

IN

OUT

OUT

110 (4.33)

1
2
3

I/O 0

I/O 1

I/O 2

I/O 3

I/O 4

130 (5.12)

MITSUBISHI ELECTRIC CORPORATION

FG

16.4(0.65)

240 (9.45)
260 (10.24)

28 (1.10)
Unit: mm (inch)

(10) A1S58B-S1 extension base unit

4-mounting screws
(M5 25)

OUT

OUT

1
2
3

I/O 0

I/O 1

I/O 2

I/O 3

I/O 4

MITSUBISHI ELECTRIC CORPORATION

FG

I/O 5

I/O 6

I/O 7

110 (4.33)
130 (5.12)

IN

16.4(0.65)

345 (13.58)
365 (14.37)

28 (1.10)

Unit: mm (inch)

App - 150

APPENDICES

APPENDIX 7 USE OF LOCAL DEVICE FOR SUBROUTINE/INTERRUPT PROGRAM

STORAGE FILE (FUNCTION VERSION B OR LATER)
When the subroutine/interrupt program is executed, the local device for the subroutine/
interrupt program storage files can be used.
To use the local device in the storage destination file for the subroutine/interrupt program,
set the special relaies below:
Subroutine program

: SM776

Interrupt program

: SM777

(1)

Switching of local device with special relay ON/OFF

SM776

OFF

Operation is performed at the local device of

the call source file of the subroutine program.
Operation is performed at the local device of

ON

the file where the subroutine program is

stored.

App - 151

SM777
Operation is performed at the local device of
the file executed before execution of the
interrupt program.
Operation is performed at the local device of
the file where the interrupt program is stored.

APPENDICES

(a) Operation for subroutine program

[SM776 operation: OFF without function version B or with function version B]

[SM776 operation: ON with function version B]

App - 152

APPENDICES

(b) Operation for interrupt program

[SM776 operation: OFF without function version B or with function version B]

[SM776 operation: ON with function version B]

App - 153

APPENDICES

(2)

Precautions
(a) When the SM776 is ON, the local device data can be read while the subroutine
program is called. Furthermore, the data will be escaped after performing the
RET instruction.
When the SM777 is ON, the local device data is read before performing the
interrupt program. The data will be escaped after performing the IRET
instruction.
Therefore, when SM776 and SM777 are ON, the scan time is extended by the
time below after the subroutine program/interrupt program is executed once.
Q2ASCPU(S1)

F560{1.3 (Number of words in the local device) [ s]

Q2ASHCPU(S1)

F220{0.8 (Number of words in the local device) [ s]

(b) ON/OFF of SM776 and SM777 is set for each CPU module.
It cannot be set for each file.
(c) When ON/OFF of SM776 and SM777 is changed during execution of the
sequence program, the control is performed with the changed information.

App - 154

APPENDICES

APPENDIX 8 NETWORK RELAY FROM ETHERNET MODULE

(FUNCTION VERSION B OR LATER)
This is the network system that mixes Ethernet with MELSECNET/10. The network allows
communicating data with the Q2ASCPU in other station via many Ethernet or
MELSECNET/10.
To perform the network relay from the Ethernet module, the Ethernet module with function
version B or later is required.
(1)

Access range
Table 8.1 shows the access range of the network relay ftom the computer/peripheral
device with the system:

Ethernet
A1SJ71QE71

A1SJ71QBR11

Q2ASCPU(B)

Power supply module

A1SJ71QE71

Q2ASCPU(C)

Power supply module

Ethernet

App - 155

A1SJ71QE71

MELSECNET/10

Q2ASCPU(D)

A1SJ71QBR11

A1SJ71QE71

A1SJ71QE71

Power supply module

Peripheral device
(GX Developer
SW VD-GPPQ)

Q2ASCPU(A)

Power supply module

Computer

APPENDICES

Table 8.1 Comparison table of access range from Ethernet module

Access to

Route

Q2ASCPU

Q2ASCPU

"with" Function Version

"without" Function Version

A
Host access
Other station access in host network
(MELSECNET/10)
Other station access of other network
(From MELSECNET/10 to Ethernet)
Other station access in host network
(Ethernet)

(Computer)

Q2ASCPU(A)

(Computer)

Q2ASCPU(B)

(Computer)

Q2ASCPU(C)

(Computer)

Q2ASCPU(D)

(Peripheral device)

Host access

Q2ASCPU(A)

Other station access in host network

(MELSECNET/10)

(Peripheral device)
Q2ASCPU(B)

Other station access of other network

(Peripheral device)

(From MELSECNET/10 to Ethernet)

Q2ASCPU(C)

Other station access in host network

(Peripheral device)

(Ethernet)

Q2ASCPU(D)

: Access allowed, : Access not allowed

A : Ethernet module has indication of the function version.
B : Ethernet module does not have indication of the
function version.

(2)

Precautions
(a) With combination of Ethernet module and MELSECNET/10, maximum 7 relays
can be performed.
(b) The following shows other station access with or without setting for other station
access:
When other station access valid module is set, the set module is used for
relay.
When other station access valid module is not set, the relay is as follows:
When MELSECNET/10 is available: 1st of MELSECNET/10 is relayed.
When MELSECNET/10 is not available: 1st of Ethernet is relayed.
(c) When parameters are not registered in the Ethernet module, the Q2ASCPU
stores the default parameters in all AJ71QE71.
When multiple Ethernet modules are installed, settings are made in the order of
1st station and 2nd station and so on counting from the Q2ASCPU side.

App - 156

APPENDICES

(d) Table 8.2 shows operation of the Q2ASCPU for online/offline of the Ethernet
module.
Table 8.2 Operation of Q2ASCPU for online/offline of Ethernet module
Ethernet

Ethernet Module

Parameter

Status
Online

Q2ASCPUOperation
Communication with external device is performed with
the specified parameter.

With
Offline

Online

The Q2ASCPU does not show an error, but

communication with external device is not performed.
Communication with external device is performed with
the default parameter.

Without
Offline

The Q2ASCPU does not show an error, but

communication with external device is not performed.

(e) Set the Ethernet module and MELSECNET/10 not to overlap their Network No.s
each other.Same network No. cannot be set for them.
The following shows the number of the Ethernet modules and the
MELSECNET(/10, /II) modules that can be mounted on one Q2ASCPU:
(Ethernet module)

[(MELSECNET/10) + (MELSECNET/II)]
(f)

When the Ethernet parameters are set for the Ethernet module without function
version B, error code "3103" (No Ethernet module in the I/O number set with the
parameter) appears and the system stops due to an error.

App - 157

APPENDICES

APPENDIX 9 Q2AS(H)CPU(S1) PROCESSING TIME

The Q2AS(H)CPU(S1) processing time is explained below.
Appendix 9.1

Overview of the Q2AS(H)CPU(S1) Scan Time

The Q2AS(H)CPU(S1) scan time comes to the total of the following values.
I/O refresh processing
Total values of instruction execution time
END processing
(1)

I/O refresh time

(a) I/O data refresh time between the following modules, which is mounted in the
Q2AS(H)CPU(S1) main base unit, extension base unit.
Input module
Output module
Special function module
(b) I/O refresh time can be calculated in the following formula.
(I/O refresh time) = (I/O points 16) N1 + (Output points
For N1 and N2, refer to the following table.
CPU module

N1

16) N2
N2

Q2ASCPU(S1)

5.2

5.0

Q2ASHCPU(S1)

4.4

4.3

(2)

Instruction execution time

(a) The processing time of each instruction used for the Q2AS(H)CPU(S1) program.
For the processing time of each instruction, refer to the following manual.
QCPU (Q mode)/QnACPU Programming Manual (Common Instructions)
(b) Since interrupt/fixed-cycle execution type program have overhead time, add the
overhead time to the instruction execution time.

(3)

END processing
(a) The Q2AS(H)CPU(S1) common processing time except for above (1) ,(2).
(b) The following table shows values of the END processing time.
CPU module
With error check
(SM1084 = OFF)
Without error check
(SM1084 = ON)

END Proc Time

Q2ASCPU(S1)

1.7ms

Q2ASHCPU(S1)

0.7ms

Q2ASCPU(S1)

1.2ms

Q2ASHCPU(S1)

0.5ms

App - 158

APPENDICES

Appendix 9.2

Causes of Increasing Scan Time

The following shows the functions that increase the Q2AS(H)CPU(S1) scan time.
When using the following functions, add the values calculated in Appendix 9.1 to the
following values.
MELSECNET/10 refresh
MELSECNET/MINI-S3 refresh
CC-Link auto refresh
Sampling trace
Monitor using GX Developer
Local device
Multiple program execution
Installation/removal of memory card
File register whose file name is the same as the program
(1)

MELSECNET/10 refresh
Refresh time between the Q2AS(H)CPU(S1) and MELSECNET/10 network module.
For MELSECNET/10 refresh time, refer to the following manual.
QnA/Q4AR MELSECNET/10 Network System Reference Manual

(2)

MELSECNET/MINI-S3 refresh
Refresh time between the Q2AS(H)CPU(S1) and MELSECNET/MINI(S3) network
module.
For MELSECNET/MINI (S3) refresh time, refer to the following manual.
MELSECNET/MINI-S3 Master Module User's Manual

(3)

CC-Link auto refresh

Refresh time between the Q2AS(H)CPU(S1) and CC-Link master/local module.
For the auto refesh processing time of CC-Link, refer to the following manual.
Control & Communication Link System Master/Local Module type AJ61QBT11/
A1SJ61QBT11 User's Manual

(4)

Sampling trace
(a) Processing time in the case of sampling trace execution
Sampling trace data are set using GX Developer, and the processing time is
added when the sampling trace is executed.
(b) The following table shows the processing time when internal relay 50 points as a
bit device, data register 50 points as a word device are set for sampling trace
data.
CPU module

Processing Time

Q2ASCPU(S1)

3.2ms

Q2ASHCPU(S1)

1.2ms

App - 159

APPENDICES

(5)

Monitor using GX Developer

Processing time in the case of monitoring by GX Developer
The processing time is added when monitoring by GX Developer.
(a) The following table shows the processing time when data register 64 points are
set for registration monitor:
CPU module

Processing Time

Q2ASCPU(S1)

0.46ms

Q2ASHCPU(S1)

0.18ms

(b) The following shows the processing time when monitor conditions are set.
Processing Time
CPU module

(6)

Agreement in

Agreement in

Designated Step

Designated Device

Q2ASCPU(S1)

0.38ms

0.38ms

Q2ASHCPU(S1)

0.15ms

0.15ms

Local device
Processing time when the local device is used
The processing time is added when the local device is used.
CPU module

Processing Time

Q2ASCPU(S1)

3.0 (n - 1) + 2.8ms

Q2ASHCPU(S1)

1.1 (n - 1) + 1.1ms

Condition: loca device setting: 1 k point, n: number of program files

(7)

Multiple program execution

Overhead time of each program execution when the Q2AS(H)CPU(S1) performs
multiple programs. The processing time is added when several programs are
executed..
CPU module

Processing Time

Q2ASCPU(S1)

0.21 n ms

Q2ASHCPU(S1)

0.08 n ms

Condition: n: number of program files

App - 160

APPENDICES

(8)

File register
Processing time when the file register is used
The processing time is added when the file register is used.
CPU module

Processing Time

Q2ASCPU(S1)

0.87 (n - 1) + 0.74ms

Q2ASHCPU(S1)

0.32 (n - 1) + 0.28ms

Condition: n: number of program files

App - 161

APPENDICES

APPENDIX 10 TRANSPORTATION PRECAUTIONS

When transporting lithium batteries, make sure to treat them based on the transportation
regulations.
Appendix 10.1 Relevant Models
The batteries used for Q2ASCPU are classified as shown in the table below:
Product Name
QnA series battery

Model Name
A6BAT

Description

Handled as

Lithium battery alone

Q1MEM-128S,
Q1MEM-128SE,
Q1MEM-1MS,
Q1MEM-1MSE,
Q1MEM-256S,
QnA series memory card

Q1MEM-256SE,
Q1MEM-2MS,
Q1MEM-512S,
Q1MEM-512SE,
Q1MEM-64S,
Q1MEM-64SE

App - 162

Packed with lithium

coin battery (BR2325)

Non-dangerous goods

APPENDICES

Appendix 10.2 Transportation Guidelines

Products are packed properly in compliance with the transportation regulations prior to
shipment. When repacking any of the unpacked products to transport it to another
location, make sure to observe the IATA Dangerous Goods Regulations, IMDG Code and
other local transportation regulations.
For details, please consult your transportation company.

App - 163

APPENDICES

APPENDIX 11 Handling of Batteries and Devices with Built-in Batteries in EU Countries

This section describes the precautions for disposing of used batteries in EU countries and
exporting batteries and/or devices with built-in batteries to EU countries.
Appendix 11.1

Disposal precautions
In EU countries, there is a separate collection system for used batteries. Dispose of
batteries properly at the local community waste collection/recycling center.
The following symbol is printed on the batteries and packaging of batteries and devices
with built-in batteries used for Mitsubishi programmable controllers.

Symbol mark

Note: This symbol mark is for EU countries only.

The symbol mark is specified in the EU directive 2006/66/EC Article 20
AgInformation for end usersAh and Annex II.
The symbol mark indicates that batteries need to be disposed of separately from other
wastes.

App - 164

APPENDICES

Appendix 11.2

Exportation precautions
In accordance with the enforcement of the new EU Battery Directive (2006/66/EC), the
following must be required when marketing or exporting batteries and/or devices with
builtin batteries to EU coutries.
To print the symbol mark on batteries, devices, or their packaging
To explain the symbol mark in the manuals of the products
(1)

Printing the symbol mark

To market or export batteries and/or devices with built-in batteries, which have no
symbol, to EU member states on September 26, 2008 or later, print the symbol
shownon the previous page on the batteries, devices, or their packaging.

(2)

Explaining the symbol mark in the manuals

To export devices incorporating Mitsubishi programmable controller to EU countries
on September 26, 2008 or later, provide the latest manuals that include the
explanation of the symbol mark.
If no Mitsubishi manuals or any old manuals without the explanation of the symbol
mark are provided, separately attach an explanatory note regarding the symbol mark
to each manual of the devices.

POINT
The requirements apply to batteries and/or devices with built-in batteries
manufactured before the enforcement date of the new EU Battery Directive.

App - 165

INDEX
[A]
Accessing File Register R with Instructions
.................................................................. App-131
Accuracy of scan time .................. 12-6,12-8,12-14
Additional Functions of Q2ASCPU ................... 2-5
Allowable period of momentary power failure... 4-3
Annunciator [F] ......................................... 3-20,4-2
Application instructions............................... App-17
Application standards of extension base modules
........................................................................ 17-4
Applications of Memory Cards........................ 14-2
Auto refresh ...................................................... 7-1
Auto Refresh Setting of CC-Link ...................... 7-8
[B]
Base Unit
Base unit allocation....................................... 5-2
External dimensions of installing base unit
.............................................................. App-143
Installation and Removal of Modules ........ 19-11
Installing the Base Units ............................. 19-9
Parts names................................................ 17-7
Basic instructions.......................................... App-5
Battery
Battery Replacement .................................. 21-3
Battery replacement procedure................. 21-11
Battery replacement timing ................. 21-3,21-5
Battery Specifications (CPU Module and Memory
Card Batteries)............................................ 18-4
Installing Batteries (CPU Module and Memory
Card Batteries)............................................ 18-7
Battery life ................................................... 21-5
When a PLC is Reoperated After Stored with the
Battery Over the Battery Life..................... 21-16
When Reoperating a PLC After Storing it with a
Battery Unconnected ................................ 21-15
Battery transportation ............................... App-162
Boot file setting ............................................... 13-7
Boot operation ...................................... 14-2,22-11
[C]
Calculation of Heat ......................................... 19-7
Category II .................................................... 20-14
Causes of Increasing Scan Time.............. App-159
CHK Instruction, IX Instruction ................. App-130

Circuit
Fail-Safe Circuit .................................. 19-4,19-5
System design circuit example ....................19-2
Clearing file register ......................................12-27
Clock data read .............................................10-10
Clock Function ................................................10-8
Comments ................................................ App-125
COMMENTS THAT CAN BE STORED IN
Q2ASCPU .......................................................11-1
Common pointer................................... 12-17,13-1
Constant Scan.................................................10-2
Constant scan ...................................................4-1
Constant Scan Function, Error Check Function
................................................................. App-126
Control Method..................................................4-1
Counter [C] ........................................................4-2
CPU module
External Dimensions............................. App-141
Installation and Removal ...........................19-11
Performance specifications............................4-1
Current consumption .........................................4-3
[D]
Dairy Inspection ..............................................21-1
Data Clear Processing ..................................12-27
Data link instructions .................................. App-38
Data Link Systems ................................... App-128
Data register [D] ................................................4-2
Debugging by several people..........................8-61
DEBUGGING FUNCTION
Debugging by several people ......................8-61
Simultaneous execution of write during RUN by
several people .............................................8-63
Simultaneous monitoring by several people
.....................................................................8-62
Device
Annunciator [F] ..............................................4-2
Counter [C] ....................................................4-2
Data register [D].............................................4-2
Edge relay [V] ................................................4-2
File register [R, ZR]........................................4-2
Function input [FX].........................................4-2
Function output [FY] ......................................4-2
Function register [FD] ....................................4-2
Index register [Z]............................................4-2

Index - 1

Internal relay [M] ........................................... 4-2

Interrupt pointer [I]......................................... 4-2
Latch relay [L] ............................................... 4-2
Link direct device .......................................... 4-2
Link register [W] ............................................ 4-2
Link relay [B] ................................................. 4-2
Pointer [P] ..................................................... 4-2
Retentive timer [ST] ...................................... 4-2
Special function module direct device........... 4-3
Special link register [SW] .............................. 4-2
Special link relay [SB] ................................... 4-2
Special register [SD] ..................................... 4-2
Special relay [SM] ......................................... 4-2
Step relay [S] ................................................ 4-2
Timer [T]........................................................ 4-2
Device comment............................................. 11-5
Initial device value comment .......................... 11-8
Device points .................................................... 4-2
Device............................................................. 13-3
Drive title......................................................... 11-3
[E]
Edge relay [V] ................................................... 4-2
END processing............................................ 12-23
Equipment configuration in an independent system
.......................................................................... 3-1
Error
Interruption due to error detection................. 9-8
LED inidcation due to an error ...................... 9-8
Operation mode when there is an error
............................................................ 9-15,13-3
Resetting error .............................................. 9-9
Resetting errors ........................................ 22-46
Error Code
Error Code List.......................................... 22-15
Error Codes.................................22-16,App-132
Error Contents of Error Codes Detected by the
CPU Module (4000H to 4FFFH) ........... App-133
Procedure to read an error code............... 22-16
ERROR CODES RETURNED TO THE REQUEST
SOURCE IN GENERAL DATA PROCESSING
.................................................................. App-132
Error history .................................................... 9-10
Execution time measurement ......................... 8-19
Execution Types ............................................. 12-1
Extension
Extension Base Unit.............................. App-145
Extension Cable Specification List.............. 17-3
External Dimensions................................. App-141

CPU module ......................................... App-141

Extension Base Unit ............................. App-145
Main Base Unit ..................................... App-143
POWER SUPPLY MODULE
................................................App-141,App-142
[F]
Fail-Safe
Fail-Safe Circuit ...........................................19-4
Fail-safe measures ......................................19-4
Fault Examples with I/O Modules..................22-47
Faults in the output circuit .............................22-49
Faults with the input circuit and the corrective
actions ...........................................................22-47
Features ............................................................2-1
Ferrite core ....................................................20-10
File register [R] ..................................................4-2
File title ............................................................11-4
For MELSECNET/MINI-S3................................7-1
Format .............................................................18-3
Function List
COMMENTS THAT CAN BE STORED IN
QnACPU ......................................................11-1
List of other functions...................................10-1
MAINTENANCE FUNCTION .........................9-1
List of debugging function..............................8-1
Function version ................ 8-12,App-151,App-155
Fundamentals of Troubleshooting...................22-1
[G]
GOT ................................................................3-19
[H]
High-speed timer [T]..........................................4-2
[I]
Index Register Processing ....................... App-129
Index register [Z] ...............................................4-2
Initial execution type program .........................12-4
Initial execution WDT time ..............................12-6
Initial processing ...........................................12-22
Installation and Removal of the Dustproof Cover
......................................................................19-13
Installation Environment ..................................19-6
Instruction List
Sequence instructions .............................. App-1
Internal current consumption.............................4-3
Internal relay [M] ...............................................4-2

Index - 2

Interrupt
Interrupt counter.................................... App-121
Interrupt module.......................................... 3-19
Interrupt pointer [I]......................................... 4-2
Interruption due to error detection................. 9-8
I/O assignment ................................................. 5-4
I/O control mode .................................4-1,App-127
I/O module
Refresh processing of I/O module ............ 12-22
I/O number
Example of I/O Number Assignment............. 5-9
I/O number assignment................................. 5-2
I/O signal
About I/O Numbers ....................................... 5-1
[K]
Key input operation....................................... 10-22
Keyword Registration ..................................... 9-12
[L]
Latch clear operation ...................................... 15-5
Latch Function ................................................ 10-5
Latch relay [L] ................................................... 4-2
Latch (power failure compensation) range ....... 4-3
LED
When the "RUN" LED is flashing ................ 22-5
Flow chart used when "ERROR" LED is ON or
flashing........................................................ 22-6
Flow for actions when the "BAT.ARM" LED is
turned ON ................................................... 22-7
Flow for actions when the "POWER" LED is
turned OFF.................................................. 22-3
Flow for actions when the "RUN" LED is turned
OFF............................................................. 22-4
LED Name .................................................. 16-5
When the "USER" LED is ON ..................... 22-7
LED indication ................................................ 9-15
Lightning surge absorber.............................. 19-16
Link direct device.............................................. 4-2
Link register [W]................................................ 4-2
Link relay [B]..................................................... 4-2
Local device
Data clear of local device.......................... 12-27
Monitor test of local device (function version B or
later)............................................................ 8-12
Use of local device (Function version B or later)
.............................................................. App-151
Local pointer ................................................. 12-17
LOW VOLTAGE DIRECTIVES ............. 20-1,20-13

low-speed END processing ...........................12-14

Low-speed execution type program ................12-9
Low-speed execution monitoring time...........12-15
Low-speed scan time ....................................12-14
Low-speed timers [T]................................ 4-2,13-1
[M]
Main Base Unit ......................................... App-143
Main base unit for high-speed access (A38HB)
........................................................................17-2
Maximum number of extension stages....... 3-3,3-4
Memory capacity ...............................................4-1
Memory card
Handling Memory Cards ..............................18-3
Installing the batterie to the memory card....18-7
Installing/Removing A Memory Card ...........18-8
Memory card battery specifications .............18-4
Memory Card Specifications........................18-1
Part Names of Memory Card .......................18-6
Microcomputer program ........................... App-124
[(delete)]
Installation..................................................19-11
Removal.....................................................19-12
Monitor
Monitor function .............................................8-2
Monitoring condition setting ...........................8-2
[N]
Network module ................................................1-2
NETWORK RELAY FROM ETHERNET MODULE
(FUNCTION VERSION B OR LATER)..... App-155
Noise filter .....................................................20-11
Precautions
Handling precautions .......................... 17-6,18-5
Number of files ..................................................4-1
Points occupied by empty slot...........................5-4
Number of I/O device points..............................4-1
Number of I/O points .........................................4-1
[O]
Operation for message display .....................10-21
Operation processing for momentary power failure
......................................................................12-26
Overview of added functions .............................2-7
OVERVIEW OF PROCESSING PERFORMED BY
THE Q2ASCPU ...............................................12-1
Overview of the Q2AS(H)CPU(S1) Scan Time
................................................................. App-158

Index - 3

[P]
Parameter.........................................13-1,App-120
Partial execution ............................................. 8-44
Part Names..................................................... 15-2
Parts names................................ 15-2,16-5,17-7
PAUSE status operation processing ............ 12-24
Periodic inspection ......................................... 21-2
PID Control Instructions.............................. App-41
PLC name....................................................... 11-1
Pointer [P]......................................................... 4-2
Common pointer [P] .......................... 12-17,13-1
Interrupt pointer [I]......................... 4-2,9-8,12-18
Local pointer [P] ........................................ 12-17
POWER SUPPLY MODULE
External dimensions of power supply module
............................................... App-141,App-142
Parts names................................................ 16-5
Power supply module selection .................. 16-3
Precautions
CPU module handling precautions ............. 16-4
DESIGN PRECAUTIONS ............................. A-1
DISPOSAL PRECAUTIONS ......................... A-7
Installation precautions ............................... 19-9
Precautions for using coaxial cables........... 20-5
PRECAUTIONS FOR UTILIZING THE EXISTING
MELSEC-A SERIES PROGRAM FOR
Q2ASCPU............................................. App-110
Precautions when configuring the system .. 3-19
Precautions When Connecting Uninterruptible
Power Supply Module (UPS) .................... 19-19
Precautions when using the MELSEC-AnS series
PLC ........................................................... 20-13
STARTUP AND MAINTENANCE
PRECAUTIONS ............................................ A-5
Transportation Precautions................... App-162
USER PRECAUTONS ................................ A-20
WIRING PRECAUTIONS....................A-4,19-15
Priority setting................................................. 9-17
Processing speed ............................................. 4-1
Processing Time....................................... App-158
Program capacity.............................................. 4-1
Program Execution Types .............................. 12-1
Program monitor list ....................................... 8-19
Program setting .............................................. 12-1
Program Trace Function................................. 8-48
Programming language .................................... 4-1

Q2ASCPU memory block diagram..................3-23

[R]
Reading module access time intervals..........10-23
Reading/Writing Data from a Q2ASCPU Using
FROM/TO Instructions ......................................6-2
Reading/Writing Data from/to the Q2ASCPU Using
Special Direct Devices ......................................6-3
Refresh mode..................................... 4-1,App-127
Reinforced insulation.....................................20-16
Relationship between remote operation and CPU
module RUN/STOP key switch .....................10-20
Relationship between Switch Operations and LEDs
........................................................................15-4
Relevant Models ...................................... App-162
Remote latch clear ........................................10-19
Remote operation..........................................10-12
Remote PAUSE ............................................10-16
Remote RESET.............................................10-18
Remote RUN/PAUSE contacts .........................4-3
Remote RUN/STOP ......................................10-12
Remote STEP-RUN ......................................10-15
Retentive timer [ST] ..........................................4-2
RUN status operation processing .................12-24
[S]
Sampling Trace Function ................................8-25
Scan execution type program .........................12-7
Scan time measurement .................................8-23
Selecting Memory Card Capacity....................14-3
Self-diagnostics function ...................................9-4
Sequence Programs, Statements, Notes
................................................................. App-122
Setting of the Output (Y) Status When Switching
from STOP to RUN .........................................10-7
Setting Switch
Switch setting when using a memory card ..18-3
Simulation Function.........................................8-57
Simultaneous execution of write during RUN by
several people .................................................8-63
Simultaneous monitoring by several people....8-62
Skip function....................................................8-47
Low speed program execution time ................13-3
Special Direct Devices ......................................6-3
Special Function Module Instructions ........ App-42
Special link register [SW] ..................................4-2
Special link relay [SB] .......................................4-2

[Q]
QnAS(H)CPU(S1) Processing Time......... App-158
Index - 4

Special module
Processing for Data Communication Requests
from a Special Function Module ................... 6-5
Special Function Module Instructions ..... App-42
Special register [SD]......................................... 4-2
Special relay [SM]............................................. 4-2
SPECIFICATIONS.......................................... 15-1
Specifications
Battery Specifications (CPU Module and Memory
Card Batteries)............................................ 18-4
Extension cable specifications .................... 17-3
Memory card battery specifications ............ 18-4
Memory Card Specifications ....................... 18-1
Performance specifications........................... 4-1
SPECIFICATIONS ...................................... 15-1
Standards
LOW VOLTAGE DIRECTIVES ......... 20-1,20-13
Standby type program .................................. 12-16
Statements/notes............................................ 11-7
Status Latch Function..................................... 8-35
Step execution................................................ 8-42
Step operation ................................................ 8-41
Step relay [S] .................................................... 4-2
STEP-RUN status operation processing ...... 12-24
STOP status operation processing............... 12-24
Structured programs......................................... 2-2
System area ........................................... 8-11,8-62
SYSTEM CONFIGURATION............................ 3-1
Equipment configuration in an independent
system........................................................... 3-1
Precautions when configuring the system .. 3-19
Q2ASCPU memory block diagram ............. 3-23
System Configuration Overview.................... 3-3
System display ............................................... 9-14
System Equipment ........................................... 3-5
System interrupt ............................................. 13-1
System protect................................................ 9-11

Flow for actions when the CPU module is not

started up...................................................22-13
Flow for actions when the output module's output
load does not turn ON..................................22-8
Flow for actions when the program cannot be
written ..........................................................22-9
Flow for actions when the "BAT.ARM" LED is
turned ON ....................................................22-7
Flow for actions when the "POWER" LED is
turned OFF ..................................................22-3
Flow for actions when the "RUN" LED is turned
OFF..............................................................22-4
When the "USER" LED is ON......................22-7
[W]
Watchdog timer (WDT)......................................9-2
WDT(Watchdog Timer) .....................................9-2
Weight ...............................................................4-3
Extension cable ...........................................17-3
Memory card....................................... 18-1,18-2
Wiring
Wiring I/O equipment .................................19-17
Wiring to the module terminals ..................19-18
Wiring I/O equipment ....................................19-17
Wiring to the module terminals......................19-18
Write
Simultaneous execution of write during RUN by
several people .............................................8-63
Write during RUN.........................................8-15
Writing clock data to the clock devices ........10-9
Write during RUN ............................................8-15
Numerics
5VDC internal power consumption....................4-3
Troubleshooting flowchart
Flow for actions when the "ERROR LED" is
turned ON/flashing.......................................22-6

[T]
Terminal Operation....................................... 10-21
Timer and Interrupt Counter Operations... App-121
Timer limit setting ........................................... 13-1
Timer [T] ........................................................... 4-2
Transportation Guidelines ........................ App-163
TROUBLESHOOTING ................................... 22-2
Troubleshooting flowchart
When the "RUN" LED is flashing ................ 22-5
Flow for actions when booting from a memory
card is not possible ................................... 22-11
Index - 5

WARRANTY
Please confirm the following product warranty details before using this product.

1. Gratis Warranty Term and Gratis Warranty Range

If any faults or defects (hereinafter "Failure") found to be the responsibility of Mitsubishi occurs during use of the
product within the gratis warranty term, the product shall be repaired at no cost via the sales representative or
Mitsubishi Service Company.
However, if repairs are required onsite at domestic or overseas location, expenses to send an engineer will be
solely at the customer's discretion. Mitsubishi shall not be held responsible for any re-commissioning,
maintenance, or testing on-site that involves replacement of the failed module.
[Gratis Warranty Term]
The gratis warranty term of the product shall be for one year after the date of purchase or delivery to a designated
place.
Note that after manufacture and shipment from Mitsubishi, the maximum distribution period shall be six (6) months,
and the longest gratis warranty term after manufacturing shall be eighteen (18) months. The gratis warranty term of
repair parts shall not exceed the gratis warranty term before repairs.
[Gratis Warranty Range]
(1) The range shall be limited to normal use within the usage state, usage methods and usage environment, etc.,
which follow the conditions and precautions, etc., given in the instruction manual, user's manual and caution
labels on the product.
(2) Even within the gratis warranty term, repairs shall be charged for in the following cases.
1. Failure occurring from inappropriate storage or handling, carelessness or negligence by the user. Failure
caused by the user's hardware or software design.
2. Failure caused by unapproved modifications, etc., to the product by the user.
3. When the Mitsubishi product is assembled into a user's device, Failure that could have been avoided if
functions or structures, judged as necessary in the legal safety measures the user's device is subject to or
as necessary by industry standards, had been provided.
4. Failure that could have been avoided if consumable parts (battery, backlight, fuse, etc.) designated in the
instruction manual had been correctly serviced or replaced.
5. Failure caused by external irresistible forces such as fires or abnormal voltages, and Failure caused by
force majeure such as earthquakes, lightning, wind and water damage.
6. Failure caused by reasons unpredictable by scientific technology standards at time of shipment from
Mitsubishi.
7. Any other failure found not to be the responsibility of Mitsubishi or that admitted not to be so by the user.

2. Onerous repair term after discontinuation of production

(1) Mitsubishi shall accept onerous product repairs for seven (7) years after production of the product is
discontinued.
Discontinuation of production shall be notified with Mitsubishi Technical Bulletins, etc.
(2) Product supply (including repair parts) is not available after production is discontinued.

3. Overseas service
Overseas, repairs shall be accepted by Mitsubishi's local overseas FA Center. Note that the repair conditions at
each FA Center may differ.

4. Exclusion of loss in opportunity and secondary loss from warranty liability

Regardless of the gratis warranty term, Mitsubishi shall not be liable for compensation of damages caused by any
cause found not to be the responsibility of Mitsubishi, loss in opportunity, lost profits incurred to the user by Failures
of Mitsubishi products, special damages and secondary damages whether foreseeable or not, compensation for
accidents, and compensation for damages to products other than Mitsubishi products, replacement by the user,
maintenance of on-site equipment, start-up test run and other tasks.

5. Changes in product specifications

The specifications given in the catalogs, manuals or technical documents are subject to change without prior notice.

SH(NA)-3599-K