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From Sand To Silicon: Illustrations 32nm High-K/Metal Gate - Version

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Abhishek Mishra
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58 views15 pages

From Sand To Silicon: Illustrations 32nm High-K/Metal Gate - Version

its my ppt that i made

Uploaded by

Abhishek Mishra
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
You are on page 1/ 15

1

From Sand to Silicon


Illustrations
32nm HighK/Metal Gate Version
By Abhishek Mishra
G-14

Sand / Ingot

Ingot / Wafer

Fabrication of chips on a wafer consists of


hundreds of precisely controlled steps which
result in a series of patterned layers of various
materials one on top of another.

What follows is a sample of the most important


steps in this complex process.

Ion Implantation

High-k Dielectric Deposition

Photo Lithography

Etching

Metal Deposition

10
Copyright 2011, Intel
Corporation. All rights
reserved.

Intel, Intel logo and


Intel Core are
trademarks of Intel
Corporation in the
U.S. and other
countries.

Metal Layers

Polishing
scale: transistor level (~50200nm)
The excess material is polished
off.

Metal Layers scale: transistor level (six transistors


combined
~500nm)
Multiple metal
layers are created to interconnect (think: wires) in between the
various transistors. How these connections have to be wired is
determined by the architecture and design teams that develop the
functionality of the respective processor (e.g. Intel Core i5 Processor ).
While computer chips look extremely flat, they may actually have over
30 layers to form complex circuitry. If you look at a magnified view of a chip,
you will see an intricate network of circuit lines and transistors that look like a
futuristic, multi-layered highway system.

11

When wafer processing is complete, the wafers


are transferred from the fab to an assembly/test
facility.

There, the individual die are first tested, then the


they are singulated and the ones that passed
their test are packaged. Finally, a thorough test
of the packaged part is conducted before the
finished product is shipped.

12

Wafer Sort Test / Slicing

13

Packaging

14

Class Testing / Completed Processor

15

And thats how they do it!!!

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