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DSPKG

This data sheet provides package information about Altera(r) devices. Packages are listed in order of ascending pin count. For information about trays, tubes, and dry packs, refer to AN 71: Guidelines for Handling J-Lead, QFP, and BGA Devices.

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276 views364 pages

DSPKG

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Altera Device Package Information

Data Sheet

DS-PKG-16.0

Introduction
This data sheet provides package information about Altera® devices, and includes the
following sections:
■ Device and Package Cross Reference
■ Thermal Resistance (starting on page 21)
■ Package Outlines (starting on page 49)
In this data sheet, packages are listed in order of ascending pin count.

f For information about trays, tubes, and dry packs, refer to AN 71: Guidelines for
Handling J-Lead, QFP, and BGA Devices.

Device and Package Cross Reference

Table 2 through Table 27 show the devices available in Ball-Grid Array (BGA),
FineLine BGA (FBGA), Ultra FineLine BGA (UBGA), Micro FineLine BGA (MBGA),
Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC), Thin Quad Flat Pack
(TQFP), Plastic Quad Flat Pack (PQFP), Ceramic Dual In-Line Package (CerDIP), and
Hybrid FineLine BGA (HBGA):
■ Arria® series FPGAs
■ Stratix ® series FPGAs
■ Cyclone® series FPGAs
■ MAX ® series CPLDs
■ HardCopy ® series ASICs
■ APEX™ series FPGAs
■ ACEX® 1K FPGAs
■ Mercury™ FPGAs
■ FLEX ® series FPGAs
■ Excalibur™ FPGA
■ Enhanced configuration devices

Table 1. Arria II GX Devices

Device Package Pins
EP2AGX45 UBGA, Flip Chip 358
FBGA, Flip Chip 572
FBGA, Flip Chip 780
EP2AGX65 UBGA, Flip Chip 358
FBGA, Flip Chip 572
FBGA, Flip Chip 780
EP2AGX95 FBGA, Flip Chip 572
FBGA, Flip Chip 780
FBGA, Flip Chip 1152
EP2AGX125 FBGA, Flip Chip 572
FBGA, Flip Chip 780
FBGA, Flip Chip 1152
FBGA, Flip Chip 780
EP2AGX190
FBGA, Flip Chip 1152
FBGA, Flip Chip 780
EP2AGX260
FBGA, Flip Chip 1152

Table 2. Arria GX Devices

Device Package Pins
FBGA, Flip Chip 484
EP1AGX20
FBGA, Flip Chip 780
FBGA, Flip Chip 484
EP1AGX35
FBGA, Flip Chip 780
FBGA, Flip Chip 484
EP1AGX50 FBGA, Flip Chip 780
FBGA, Flip Chip 1,152
FBGA, Flip Chip 484
EP1AGX60 FBGA, Flip Chip 780
FBGA, Flip Chip 1,152
EP1AGX90 FBGA, Flip Chip 1,152

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
3
Device and Package Cross Reference

Table 3. Stratix IV Devices (Part 1 of 2)

Device Package Pins
EP4S40G2 FBGA, Flip Chip (ES—Option 1, Production—Option 2) 1,517
EP4S40G5 HBGA, Flip Chip (ES—Option 1, Production—Option 2) 1,517
EP4S100G2 FBGA, Flip Chip (ES—Option 1, Production—Option 2) 1,517
EP4S100G3 FBGA, Flip Chip (Option 2) 1,932
EP4S100G4 FBGA, Flip Chip (Option 2) 1,932
HBGA, Flip Chip (ES—Option 1, Production—Option 2) 1,517
EP4S100G5
FBGA, Flip Chip (ES—Option 1, Production—Option 2) 1,932
FBGA, Flip Chip (Option 3) 780
EP4SGX70
FBGA, Flip Chip (Option 2) 1,152
FBGA, Flip Chip (Option 3) 780
EP4SGX110
FBGA, Flip Chip (Option 2) 1,152
FBGA, Flip Chip (Option 1) 780
FBGA, Flip Chip (1) (ES—16 channel and 24 channel, Option 1, 1,152
EP4SGX180
Production—16 channel, Option 2; 24 channel, Option 1)
FBGA, Flip Chip (Option 2) 1,517
FBGA, Flip Chip (Option 1) 780
FBGA, Flip Chip (1) (ES—16 channel and 24 channel, Option 1, 1,152
EP4SGX230
Production—16 channel, Option 2; 24 channel, Option 1)
FBGA, Flip Chip (ES—Option 1, Production—Option 2) 1,517
33 MM SQ HBGA, Flip Chip (Option 1) 780
FBGA, Flip Chip (FF35) (Option 2) 1,152
FBGA, Flip Chip (HF35) (Option 1) 1,152
EP4SGX290
FBGA, Flip Chip (Option 2) 1,517
FBGA, Flip Chip (Option 2) 1,760
FBGA, Flip Chip (Option 2) 1,932
33 MM SQ HBGA, Flip Chip (Option 1) 780
FBGA, Flip Chip (FF35) (Option 2) 1,152
FBGA, Flip Chip (HF35) (Option 1) 1,152
EP4SGX360
FBGA, Flip Chip (Option 2) 1,517
FBGA, Flip Chip (Option 2) 1,760
FBGA, Flip Chip (Option 2) 1,932
42.5 MM SQ HBGA, Flip Chip (ES—Option 1, 1,152
Production—Option 3)
42.5 MM SQ HBGA, Flip Chip (ES—Option 1, 1,517
EP4SGX530 Production—Option 2)
FBGA, Flip Chip (Option 2) 1,760
FBGA, Flip Chip (ES—Option 1, Production—Option 2) 1,932
EP4SE230 FBGA, Flip Chip (Option 1) 780
EP4SE360 FBGA, Flip Chip (Option 1) 1,152
33 MM SQ HBGA, Flip Chip (Option 1) 1,152

Table 3. Stratix IV Devices (Part 2 of 2)

Device Package Pins
42.5 MM SQ HBGA, Flip Chip (ES—Option 1, 1,152
Production—Option 3)
EP4SE530 42.5 MM SQ HBGA, Flip Chip (ES—Option 1, 1,517
Production—Option 2)
FBGA, Flip Chip (Option 2) 1,760
40 MM SQ HBGA, Flip Chip (Option 4) 1,152
EP4SE820 FBGA, Flip Chip (Option 2) 1,517
FBGA, Flip Chip (Option 2) 1,760
Note to Table 3:
(1) EP4SGX110, EP4SGX180, EP4SGX230, EP4SGX290, and EP4SGX360 devices are available in two 1152-pin
packages: the 16 transceiver channel version and the 24 transceiver channel version.

Table 4. Stratix III Devices

Device Package Pins
FBGA, Flip Chip 484
EP3SL50
FBGA, Flip Chip (Option 1) 780
FBGA, Flip Chip 484
EP3SL70
FBGA, Flip Chip (Option 1) 780
FBGA, Flip Chip (Option 1) 780
EP3SL110
FBGA, Flip Chip 1,152
FBGA, Flip Chip (Option 1) 780
EP3SL150
FBGA, Flip Chip 1,152
HBGA, Flip Chip (Option 1) 780
EP3SL200 FBGA, Flip Chip 1,152
FBGA, Flip Chip 1,517
HBGA, Flip Chip 1,152
EP3SL340 FBGA, Flip Chip 1,517
FBGA, Flip Chip 1,760
FBGA, Flip Chip 484
EP3SE50
FBGA, Flip Chip (Option 1) 780
FBGA, Flip Chip (Option 1) 780
EP3SE80
FBGA, Flip Chip 1,152
FBGA, Flip Chip (Option 1) 780
EP3SE110
FBGA, Flip Chip 1,152
HBGA, Flip Chip (Option 1) 780
EP3SE260 FBGA, Flip Chip 1,152
FBGA, Flip Chip 1,517

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
5
Device and Package Cross Reference

Table 5. Stratix II Devices

Device Package Pins
FBGA, Flip Chip 484
EP2S15
FBGA, Flip Chip 672
FBGA, Flip Chip 484
EP2S30
FBGA, Flip Chip 672
FBGA, Flip Chip 484
EP2S60 FBGA, Flip Chip 672
FBGA, Flip Chip 1,020
HBGA, Flip Chip 484
FBGA, Flip Chip 780
EP2S90
FBGA, Flip Chip 1,020
FBGA, Flip Chip 1,508
FBGA, Flip Chip 780
EP2S130 FBGA, Flip Chip 1,020
FBGA, Flip Chip 1,508
FBGA, Flip Chip 1,020
EP2S180
FBGA, Flip Chip 1,508

Table 6. Stratix II GX Devices

Device Package Pins
EP2SGX30 FBGA, Flip Chip 780
FBGA, Flip Chip 780
EP2SGX60
FBGA, Flip Chip 1,152
FBGA, Flip Chip 1,152
EP2SGX90
FBGA, Flip Chip 1,508
EP2SGX130 FBGA, Flip Chip 1,508

Table 7. Stratix GX Devices

Device Package Pins
EP1SGX10 FBGA, Flip Chip 672
FBGA, Flip Chip 672
EP1SGX25
FBGA, Flip Chip 1,020
EP1SGX40 FBGA, Flip Chip 1,020

Table 8. Stratix Devices

Device Package Pins
FBGA, Flip Chip 484
BGA, Wire Bond 672
EP1S10
FBGA, Wire Bond (Option 2) 672
FBGA, Flip Chip 780
FBGA, Flip Chip 484
BGA, Wire Bond 672
EP1S20
FBGA, Wire Bond (Option 2) 672
FBGA, Flip Chip 780
BGA, Wire Bond 672
FBGA, Wire Bond (Option 2) 672
EP1S25
FBGA, Flip Chip 780
FBGA, Flip Chip 1,020
FBGA, Flip Chip 780
EP1S30 BGA, Flip Chip 956
FBGA, Flip Chip 1,020
BGA, Flip Chip 956
FBGA, Flip Chip 780
EP1S40
FBGA, Flip Chip 1,020
FBGA, Flip Chip 1,508
BGA, Flip Chip 956
EP1S60 FBGA, Flip Chip 1,020
FBGA, Flip Chip 1,508
BGA, Flip Chip 956
EP1S80 FBGA, Flip Chip 1,020
FBGA, Flip Chip 1,508

Table 9. Cyclone IV Devices (Part 1 of 2)

Device Package Pins
EP4CE6 EQFP, Wire Bond 144
FBGA, Wire Bond 256
EQFP, Wire Bond 144
EP4CE10
FBGA, Wire Bond 256
FBGA, Wire Bond 256
EP4CE15
FBGA, Wire Bond 484
EP4CE30 FBGA, Wire Bond 484
FBGA, Wire Bond 780
FBGA, Wire Bond 484
EP4CE40
FBGA, Wire Bond 780

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
7
Device and Package Cross Reference

Table 9. Cyclone IV Devices (Part 2 of 2)

Device Package Pins
FBGA, Wire Bond 484
EP4CE55
FBGA, Wire Bond 780
EP4CE75 FBGA, Wire Bond 484
FBGA, Wire Bond 780
EP4CE115 FBGA, Wire Bond 484
FBGA, Wire Bond 780
EP4CE155 FBGA, Wire Bond 484
FBGA, Wire Bond 780

Table 10. Cyclone IV GX Devices

Device Package Pins
EP4CGX15 QFN, Wire Bond 148
FBGA, Wire Bond 169
EP4CGX22 FBGA, Wire Bond 169
FBGA, Wire Bond 324
EP4CGX30 FBGA, Wire Bond 169
FBGA, Wire Bond 324
FBGA, Wire Bond 484
EP4CGX50 UBGA, Wire Bond 484
FBGA, Wire Bond 672
EP4CGX75 FBGA, Wire Bond 484
FBGA, Wire Bond 672
EP4CGX110 FBGA, Wire Bond 484
FBGA, Wire Bond 672
FBGA, Wire Bond 896
EP4CGX150 FBGA, Wire Bond 484
FBGA, Wire Bond 672
FBGA, Wire Bond 896

Table 11. Cyclone III LS Devices (Part 1 of 2)

Device Package Pins
FBGA, Wire Bond (Option 2) 484
EP3CLS70 UBGA, Wire Bond 484
FBGA, Wire Bond (Option 2) 780
FBGA, Wire Bond (Option 2) 484
EP3CLS100 UBGA, Wire Bond 484
FBGA, Wire Bond (Option2) 780
FBGA, Wire Bond (Option 2) 484
EP3CLS150
FBGA, Wire Bond (Option 2) 780

Table 11. Cyclone III LS Devices (Part 2 of 2)

Device Package Pins
FBGA, Wire Bond (Option 2) 484
EP3CLS200
FBGA, Wire Bond (Option 2) 780

Table 12. Cyclone III Devices (Part 1 of 2)

Device Package (2) Pins
EQFP, Wire Bond 144 (1)
MBGA, Wire Bond 164
EP3C5
FBGA, Wire Bond (Option 2) 256
UBGA, Wire Bond 256
EQFP, Wire Bond 144 (1)
MBGA, Wire Bond 164
EP3C10
FBGA, Wire Bond (Option2) 256
UBGA, Wire Bond 256
EQFP, Wire Bond 144 (1)
MBGA, Wire Bond 164
PQFP, Wire Bond 240
EP3C16 FBGA, Wire Bond (Option 2) 256
UBGA, Wire Bond 256
FBGA, Wire Bond (Option 3) 484
UBGA, Wire Bond 484
EQFP, Wire Bond 144 (1)
PQFP, Wire Bond 240
EP3C25 FBGA, Wire Bond (Option 2) 256
UBGA, Wire Bond 256
FBGA, Wire Bond 324
PQFP, Wire Bond 240
FBGA, Wire Bond 324
EP3C40 FBGA, Wire Bond (Option 3) 484
UBGA, Wire Bond 484
FBGA, Wire Bond (Option 2) 780
FBGA, Wire Bond (Option 3) 484
EP3C55 UBGA, Wire Bond 484
FBGA, Wire Bond (Option 2) 780
FBGA, Wire Bond (Option 3) 484
EP3C80 UBGA, Wire Bond 484
FBGA, Wire Bond (Option 2) 780

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
9
Device and Package Cross Reference

Table 12. Cyclone III Devices (Part 2 of 2)

Device Package (2) Pins
FBGA, Wire Bond (Option 3) 484
EP3C120
FBGA, Wire Bond (Option 2) 780
Notes to Table 12:
(1) The E144 package has an exposed pad at the bottom of the package. This exposed ground pad must be connected
to the ground plane on your PCB. This exposed pad is used for electrical connectivity and not for thermal purposes.
(2) The package type entries with “Option #” refer to instances where multiple package options exist for a given
package type and pin count. The Option number identifies the specific type used by the corresponding device
density.

Table 13. Cyclone II Devices

Device Package Pins
TQFP, Wire Bond 144
EP2C5 PQFP, Wire Bond 208
FBGA, Wire Bond (Option 2) 256
TQFP, Wire Bond 144
EP2C8 PQFP, Wire Bond 208
FBGA, Wire Bond (Option 2) 256
FBGA, Wire Bond (Option 2) 256
EP2C15
FBGA, Wire Bond (Option 3) 484
PQFP, Wire Bond 240
EP2C20 FBGA, Wire Bond (Option 2) 256
FBGA, Wire Bond (Option 3) 484
FBGA, Wire Bond (Option 3) 484
EP2C35 UBGA, Wire Bond 484
FBGA, Wire Bond (Option 3) 672
FBGA, Wire Bond (Option 3) 484
EP2C50 UBGA, Wire Bond 484
FBGA, Wire Bond (Option 3) 672
FBGA, Wire Bond (Option 3) 672
EP2C70
FBGA, Wire Bond 896

Table 14. Cyclone Devices

Device Package Pins
TQFP, Wire Bond 100
EP1C3
TQFP, Wire Bond 144
FBGA, Wire Bond 324
EP1C4
FBGA, Wire Bond 400
TQFP, Wire Bond 144
EP1C6 PQFP, Wire Bond 240
FBGA, Wire Bond (Option 1) 256
PQFP, Wire Bond 240
EP1C12 FBGA, Wire Bond (Option 1) 256
FBGA, Wire Bond 324
FBGA, Wire Bond 324
EP1C20
FBGA, Wire Bond 400

Table 15. MAX Series Devices (Part 1 of 3)

Device Package Pins

MAX II Devices
TQFP, Wire Bond 100
EPM240 FBGA, Wire Bond (Option 2) 100
MBGA, Wire Bond 100
TQFP, Wire Bond 100
MBGA, Wire Bond 100
FBGA, Wire Bond (Option 2) 100
EPM570
TQFP, Wire Bond 144
FBGA, Wire Bond (Option 1) 256
MBGA, Wire Bond 256
TQFP, Wire Bond 144
EPM1270 FBGA, Wire Bond (Option 1) 256
MBGA, Wire Bond 256
FBGA, Wire Bond (Option 1) 256
EPM2210
FBGA, Wire Bond 324
MAX 9000 Devices
EPM9320 BGA, Wire Bond 356
EPM9320A BGA, Wire Bond 356
EPM9560 BGA, Wire Bond 356
MAX 7000B Devices
PLCC, Wire Bond 44
EPM7032B TQFP, Wire Bond 44
UBGA, Wire Bond 49

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
11
Device and Package Cross Reference

Table 15. MAX Series Devices (Part 2 of 3)

Device Package Pins
TQFP, Wire Bond 44
UBGA, Wire Bond 49
EPM7064B
FBGA, Wire Bond 100
TQFP, Wire Bond 100
UBGA, Wire Bond 49
TQFP, Wire Bond 100
FBGA, Wire Bond 100
EPM7128B
TQFP, Wire Bond 144
UBGA, Wire Bond 169
FBGA, Wire Bond (Option 1) 256
TQFP, Wire Bond 100
TQFP, Wire Bond 144
EPM7256B UBGA, Wire Bond 169
PQFP, Wire Bond 208
FBGA, Wire Bond (Option 1) 256
TQFP, Wire Bond 144
UBGA, Wire Bond 169
EPM7512B PQFP, Wire Bond 208
FBGA, Wire Bond (Option 1) 256
BGA, Wire Bond (Option 1) 256
MAX 7000AE Devices
PLCC, Wire Bond 44
EPM7032AE
TQFP, Wire Bond 44
PLCC, Wire Bond 44
TQFP, Wire Bond 100
TQFP, Wire Bond 144
EPM7064AE
UBGA, Wire Bond 49
FBGA, Wire Bond 100
FBGA, Wire Bond (Option 1) 256
PLCC, Wire Bond 84
TQFP, Wire Bond 100
FBGA, Wire Bond 100
EPM7128AE
UBGA, Wire Bond 169
TQFP, Wire Bond 144
FBGA, Wire Bond (Option 1) 256

Table 15. MAX Series Devices (Part 3 of 3)

Device Package Pins
TQFP, Wire Bond 100
FBGA, Wire Bond 100
EPM7256AE TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond (Option 1) 256
TQFP, Wire Bond 144
PQFP, Wire Bond 208
EPM7512AE
BGA, Wire Bond (Option 1) 256
FBGA, Wire Bond (Option 1) 256
MAX 7000A Devices
PLCC, Wire Bond 44
EPM7032A
TQFP, Wire Bond 44
PLCC, Wire Bond 84
TQFP, Wire Bond 100
EPM7128A FBGA, Wire Bond 100
TQFP, Wire Bond 144
FBGA, Wire Bond (Option 1) 256
TQFP, Wire Bond 100
TQFP, Wire Bond 144
EPM7256A
PQFP, Wire Bond 208
FBGA, Wire Bond (Option 1) 256

Table 16. HardCopy IV E Devices

Device Package Pins
HC4E25WF484 FBGA, Wire Bond 484
HC4E25FF484 FBGA, Flip Chip 484
HC4E25WF780 FBGA, Wire Bond 780
HC4E25FF780 FBGA, Flip Chip 780
HC4E35LF1152 FBGA, Flip Chip 1,152
HC4E35FF1152 FBGA, Flip Chip 1,152
HC4E35LF1517 FBGA, Flip Chip 1,517
HC4E35FF1517 FBGA, Flip Chip 1,517

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
13
Device and Package Cross Reference

Table 17. HardCopy IV GX Devices

Device Package Pins
HC4GX15LF780 FBGA, Flip Chip 780
HC4GX15LAF780X FBGA, Flip Chip 780
HC4GX25LF780 FBGA, Flip Chip 780
HC4GX25LF1152 FBGA, Flip Chip 1,152
HC4GX25FF1152 FBGA, Flip Chip 1,152
HC4GX35FF1152 FBGA, Flip Chip 1,152
HC4GX35FF1517 FBGA, Flip Chip 1,517

Table 18. HardCopy III Devices

Device Package Pins
HC315WF484 FBGA, Wire Bond 484
HC325WF484 FBGA, Wire Bond 484
HC325FF484 FBGA, Flip Chip 484
HC325WF780 FBGA, Wire Bond 780
HC325FF780 FBGA, Flip Chip 780
HC335LF1152 FBGA, Flip Chip 1, 152
HC335FF1152 FBGA, Flip Chip 1,152
HC335LF1517 FBGA, Flip Chip 1,157
HC335FF1517 FBGA, Flip Chip 1,157

Table 19. HardCopy II Devices

Device Package Pins
HC210 FBGA, Flip Chip 484
HC210W FBGA, Wire Bond (Option 3) 484
HC220 FBGA, Flip Chip 672
FBGA, Flip Chip 780
HC230 FBGA, Flip Chip 1,020
HC240 FBGA, Flip Chip 1,020
FBGA, Flip Chip 1,508

Table 20. HardCopy Devices

Device Package Pins
HC1S25 FBGA, Wire Bond (Option 3) 672
BGA, Wire Bond 672
HC1S30 FBGA, Flip Chip 780
HC1S40 FBGA, Flip Chip 780
HC1S60 FBGA, Flip Chip 1,020
HC1S80 FBGA, Flip Chip 1,020

Table 21. HardCopy APEX Devices

Device Package Pins
HC20K400 BGA, Wire Bond (Option 3) 652
HC20K600 BGA, Wire Bond (Option 3) 652
FBGA, Flip Chip 672

Table 22. APEX Series Devices (Part 1 of 3)

Device Package Pins

APEX II Devices
EP2A15 FBGA, Flip Chip 672
BGA, Flip Chip 724
EP2A25 FBGA, Flip Chip 672
BGA, Flip Chip 724
FBGA, Flip Chip 1,020
EP2A40 FBGA, Flip Chip 672
BGA, Flip Chip 724
FBGA, Flip Chip 1,020
EP2A70 BGA, Flip Chip 724
FBGA, Flip Chip 1,508
APEX 20KE Devices
EP20K30E TQFP, Wire Bond 144
FBGA, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond 324
EP20K60E TQFP, Wire Bond 144
FBGA, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond 324
BGA, Wire Bond 356
EP20K100E TQFP, Wire Bond 144
FBGA, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond 324
BGA, Wire Bond 356

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
15
Device and Package Cross Reference

Table 22. APEX Series Devices (Part 2 of 3)

Device Package Pins
EP20K160E TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond (Option 2) 484
EP20K200E PQFP, Wire Bond 208
PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond (Option 2) 484
BGA, Wire Bond (Option 2) 652
FBGA, Wire Bond (Option 2) 672
EP20K300E PQFP, Wire Bond 240
BGA, Wire Bond (Option 2) 652
FBGA, Wire Bond (Option 2) 672
EP20K400E BGA, Wire Bond (Option 3) 652
FBGA, Flip Chip 672
EP20K600E BGA, Wire Bond (Option 3) 652
FBGA, Flip Chip 672
FBGA, Flip Chip 1,020
EP20K1000E BGA, Flip Chip 652
FBGA, Flip Chip 672
FBGA, Flip Chip 1,020
EP20K1500E BGA, Flip Chip 652
FBGA, Flip Chip 1,020
APEX 20KC Devices
EP20K200C PQFP, Wire Bond 208
PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond (Option 2) 484
EP20K400C BGA, Wire Bond (Option 3) 652
FBGA, Flip Chip 672
EP20K600C BGA, Wire Bond (Option 3) 652
FBGA, Flip Chip 672
FBGA, Flip Chip 1,020
EP20K1000C BGA, Flip Chip 652
FBGA, Flip Chip 672
FBGA, Flip Chip 1,020

Table 22. APEX Series Devices (Part 3 of 3)

Device Package Pins

APEX 20K Devices

EP20K100 TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond 324
BGA, Wire Bond 356
EP20K160 PQFP, Wire Bond 240
TQFP, Wire Bond 144
EP20K200 PQFP, Wire Bond 208
PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond (Option 2) 484
EP20K300 FBGA, Wire Bond (Option 2) 672
EP20K400 BGA, Wire Bond (Option 3) 652
PGA, Wire Bond 655
FBGA, Flip Chip 672

Table 23. ACEX 1K Devices

Device Package Pins
EP1K10 TQFP, Wire Bond 100
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond (Option 1) 256
EP1K30 TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond (Option 1) 256
EP1K50 TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond (Option 1) 256
FBGA, Wire Bond (Option 2) 484
EP1K100 PQFP, Wire Bond 208
FBGA, Wire Bond (Option 1) 256
FBGA, Wire Bond (Option 2) 484

Table 24. Mercury Devices

Device Package Pins
EP1M120 FBGA, Flip Chip 484
EP1M350 FBGA, Flip Chip 780

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
17
Device and Package Cross Reference

Table 25. FLEX Series Devices (Part 1 of 3)

Device Package Pins

FLEX 10KA Devices

EPF10K10A TQFP, Wire Bond 100
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond (Option 1) 256
EPF10K30A TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond (Option 1) 256
BGA, Wire Bond 356
FBGA, Wire Bond (Option 2) 484
EPF10K100A RQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond (Option 2) 484
BGA, Wire Bond 600
EPF10K250A PGA, Wire Bond 599
BGA, Wire Bond 600
FLEX 10KS Devices
EPF10K50S TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond (Option 1) 256
BGA, Wire Bond 356
FBGA, Wire Bond (Option 2) 484
EPF10K200S RQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond (Option 2) 484
BGA, Wire Bond 600
FBGA, Wire Bond (Option 2) 672
FLEX 10KE Devices
EPF10K30E TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond (Option 1) 256
FBGA, Wire Bond (Option 2) 484

Table 25. FLEX Series Devices (Part 2 of 3)

Device Package Pins
EPF10K50E TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond (Option 1) 256
BGA, Wire Bond 356
FBGA, Wire Bond (Option 2) 484
EPF10K100E PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond (Option 1) 256
BGA, Wire Bond 356
FBGA, Wire Bond (Option 2) 484
EPF10K130E PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond (Option 2) 484
BGA, Wire Bond 600
FBGA, Wire Bond (Option 2) 672
EPF10K200E PGA, Wire Bond 599
BGA, Wire Bond 600
FBGA, Wire Bond (Option 2) 672
EPF10K10 PLCC, Wire Bond 84
TQFP, Wire Bond 144
PQFP, Wire Bond 208
EPF10K20 TQFP, Wire Bond 144
RQFP, Wire Bond 208
RQFP, Wire Bond 240
EPF10K30 RQFP, Wire Bond 208
RQFP, Wire Bond 240
BGA, Wire Bond 356
EPF10K40 RQFP, Wire Bond 208
RQFP, Wire Bond 240
EPF10K50 RQFP, Wire Bond 240
BGA, Wire Bond 356
PGA, Wire Bond 403
EPF10K50V RQFP, Wire Bond 240
PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond 484
EPF10K70 RQFP, Wire Bond 240
PGA, Wire Bond 503

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
19
Device and Package Cross Reference

Table 25. FLEX Series Devices (Part 3 of 3)

Device Package Pins
EPF10K100 PGA, Wire Bond 503
EPF10K130V PGA, Wire Bond 599
BGA, Wire Bond 600
EPF6010A TQFP, Wire Bond 100
TQFP, Wire Bond 144
PQFP, Wire Bond 208
EPF6016 TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
BGA, Wire Bond (Option 2) 256
EPF6016A TQFP, Wire Bond 100
FBGA, Wire Bond 100
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond (Option 1) 256
EPF6024A TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
BGA, Wire Bond (Option 2) 256
FBGA, Wire Bond (Option 1) 256
EPF8282A PLCC, Wire Bond 84
TQFP, Wire Bond 100
EPF8452A TQFP, Wire Bond 100
PQFP, Wire Bond 160

Table 26. Excalibur Devices

Device Package Pins
EPXA1 FBGA, Wire Bond (Option 2) 484
FBGA, Flip Chip 672
EPXA4 FBGA, Flip Chip 672
FBGA, Flip Chip 1,020
EPXA10 FBGA, Flip Chip 1,020

Table 27. Enhanced Configuration Devices

Device Package Pins
EPC1 PDIP, Wire Bond 8
PLCC, Wire Bond 20
EPC2 PLCC, Wire Bond 20
TQFP, Wire Bond 32
EPC4 PLCC, Wire Bond 44
TQFP, Wire Bond 44
PQFP, Wire Bond 100
FPGA, Wire Bond 144
EPC8 PQFP, Wire Bond (Option 2) 100
EPC16 UBGA, Wire Bond 88
PQFP, Wire Bond (Option 2) 100
EPC32 FPGA, Wire Bond 88
EPC1441 PDIP, Wire Bond 8
PLCC, Wire Bond 20
TQFP, Wire Bond 32

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
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Thermal Resistance

Thermal Resistance
Table 28 through Table 58 provide θJA (junction-to-ambient thermal resistance) and θJC
(junction-to-case thermal resistance) values for the following Altera device families:
■ Arria series FPGAs
■ Stratix series FPGAs
■ Cyclone series FPGAs
■ MAX series CPLDs
■ HardCopy series ASICs
■ APEX series FPGAs
■ ACEX 1K FPGAs
■ Mercury FPGAs
■ FLEX series FPGAs
■ Excalibur FPGA
■ Classic devices
Altera is transitioning to an industry-standard copper lid for its thermally enhanced
BGA and thermally enhanced Flip Chip FBGA package offerings (as mentioned in the
Process Change Notice PCN0214 available on Altera’s website:
http://www.altera.com/literature/pcn/pcn0214.pdf). This change affects the APEX
20KE, APEX 20KC, APEX II, Mercury, and Excalibur device families. Therefore, two
thermal resistance specifications are provided for devices affected by this change. The
older packages are identified as using the aluminum silicon carbide (AlSiC) lid, while
the newer packages are identified as using the copper (Cu) lid.
Thermally enhanced BGA and thermally enhanced Flip Chip FBGA packages offered
in the newer Altera families, including Stratix and Stratix GX, were introduced using
an industry-standard Cu lid. Therefore, these device specifications include only a
single thermal resistance specification.

1 Contact Altera if you need typical +/– values of A dimensions for thermal analysis.
The max numbers are provided for physical layout.

Arria Series Devices Thermal Resistance

Table 28 and Table 29 provide thermal resistance values for Arria series devices.

Table 28. Thermal Resistance of Arria II GX Devices

θ JA θ JA
Pin (° C/W) θ JA (° C/W) θJA (° C/W) (° C/W) θ JC θ JB
Device Count Package Still Air 100 ft./min. 200 ft./min. 400 ft./min. (° C/W) (° C/W)
358 FBGA 18.3 16.5 14.8 13.4 0.06 5.6
EP2AGX45 572 FBGA 14.8 14.0 12.2 10.9 0.10 5.7
780 FBGA 13.8 13.0 11.4 10.1 0.10 5.7
EP2AGX65 358 FBGA 18.3 16.5 14.8 13.4 0.06 5.6
572 FBGA 14.8 14.0 12.2 10.9 0.10 5.7
780 FBGA 13.8 13.0 11.4 10.1 0.10 5.7
572 FBGA 13.7 12.9 11.2 9.9 0.05 4.5
EP2AGX95 780 FBGA 13.3 12.6 10.9 9.6 0.05 5.0
1152 FBGA 12.7 11.9 10.3 9.0 0.05 5.3
572 FBGA 13.7 12.9 11.2 9.9 0.05 4.5
EP2AGX125 780 FBGA 13.3 12.6 10.9 9.6 0.05 5.0
1152 FBGA 12.7 11.9 10.3 9.0 0.05 5.3
780 FBGA 11.7 11.5 10.0 8.7 0.03 3.9
EP2AGX190
1152 FBGA 10.8 10.7 9.3 8.0 0.04 4.1
EP2AGX260 780 FBGA 11.7 11.5 10.0 8.7 0.03 3.9
1152 FBGA 10.8 10.7 9.3 8.0 0.04 4.1

Table 29. Thermal Resistance of Arria GX Devices

θ JA θ JA
Pin (° C/W) θ JA (° C/W) θ JA (° C/W) (° C/W) θ JC θ JB
Device Count Package Still Air 100 ft./min. 200 ft./min. 400 ft./min. (° C/W) (° C/W)
484 FBGA 12.8 10.3 8.7 7.5 0.3 3.1
EP1AGX20
780 FBGA 11.1 8.6 7.2 6.0 0.2 3.1
484 FBGA 12.8 10.3 8.7 7.5 0.3 3.1
EP1AGX35
780 FBGA 11.1 8.6 7.2 6.0 0.2 3.1
484 FBGA 12.7 10.2 8.6 7.3 0.2 2.9
EP1AGX50 780 FBGA 10.9 8.4 6.9 5.8 0.2 2.9
1152 FBGA 9.9 7.5 6.1 5.0 0.2 2.5
484 FBGA 12.7 10.2 8.6 7.3 0.2 2.9
EP1AGX60 780 FBGA 10.9 8.4 6.9 5.8 0.2 2.8
1152 FBGA 9.9 7.5 6.1 5.0 0.2 2.5
EP1AGX90 1152 FBGA 9.6 7.3 5.9 4.9 0.1 2.3

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
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Thermal Resistance

Stratix Series Devices Thermal Resistance

Table 30 through Table 35 provide thermal resistance values for Stratix series devices.

Table 30. Thermal Resistance of Stratix IV Devices (Part 1 of 2)

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package Still Air 100 ft./min. 200 ft./min. 400 ft./min. θ JC (° C/W) θJB (° C/W)
JEDEC 2S2P Board
EP4SE230 780 FBGA 9.7 8.4 7.0 5.8 0.2 2.0
EP4SE360 780 HBGA 9.0 8.2 6.7 5.6 0.2 2.6
1152 FBGA 8.3 7.4 6.0 4.9 0.2 1.6
1517 FBGA 7.7 6.8 5.4 4.4 0.2 1.7
EP4SE530 1152 HBGA 7.6 6.9 5.7 4.7 0.1 2.8
1517 HBGA 7.2 6.4 5.2 4.3 0.1 1.8
1760 FBGA 7.0 6.1 5.0 4.1 0.1 1.4
EP4SE680 1152 HBGA 8.0 7.2 5.8 4.7 0.1 2.3
1517 FBGA 7.7 6.7 5.4 4.3 0.1 1.4
1760 FBGA 7.0 6.1 5.0 4.1 0.1 1.4
EP4SE820 1152 HBGA 7.6 6.9 5.7 4.7 0.1 2.8
1517 HBGA 7.2 6.4 5.2 4.3 0.1 1.9
1760 FBGA 7.0 6.1 5.0 4.1 0.1 1.3
EP4SGX70 780 FBGA 10.7 8.6 7.2 6.0 0.3 2.3
1152 FBGA 9.8 7.7 6.3 5.2 0.3 2.0
EP4SGX110 780 FBGA 10.7 8.6 7.2 6.0 0.3 2.3
1152 FBGA 9.8 7.7 6.3 5.2 0.3 2.0
EP4SGX180 780 FBGA 9.7 8.4 7.0 5.8 0.2 2.0
1152 FBGA 8.8 7.5 6.1 5.0 0.2 1.7
1517 FBGA 8.2 6.9 5.5 4.5 0.2 1.8
EP4SGX230 780 FBGA 9.7 8.4 7.0 5.8 0.2 2.0
1152 FBGA 8.8 7.5 6.1 5.0 0.2 1.7
1517 FBGA 8.2 6.9 5.5 4.5 0.2 1.8
EP4SGX290 780 HBGA 9.0 8.2 6.7 5.6 0.2 2.6
1152 FBGA 8.3 7.4 6.0 4.9 0.2 1.6
1517 FBGA 7.7 6.8 5.4 4.4 0.2 1.7
1760 FBGA 7.0 6.2 5.1 4.2 0.2 1.5
1932 FBGA 6.8 5.9 4.8 3.9 0.1 1.5
EP4SGX360 780 HBGA 9.0 8.2 6.7 5.6 0.2 2.6
1152 FBGA 8.3 7.4 6.0 4.9 0.2 1.6
1517 FBGA 7.7 6.8 5.4 4.4 0.2 1.7
1760 FBGA 7.0 6.2 5.1 4.2 0.2 1.5
1932 FBGA 6.8 5.9 4.8 3.9 0.1 1.5

Table 30. Thermal Resistance of Stratix IV Devices (Part 2 of 2)

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package Still Air 100 ft./min. 200 ft./min. 400 ft./min. θ JC (° C/W) θJB (° C/W)
EP4SGX530 1152 HBGA 7.6 6.9 5.7 4.7 0.1 2.8
1517 HBGA 7.2 6.4 5.2 4.3 0.1 1.8
1760 FBGA 7.0 6.1 5.0 4.1 0.1 1.4
1932 FBGA 6.8 5.9 4.8 3.9 0.1 1.5
EP4S40G2 1517 FBGA 8.2 6.9 5.5 4.5 0.2 1.8
EP4S100G2 1517 FBGA 8.2 6.9 5.5 4.5 0.2 1.8
EP4S40G5 1517 HBGA 7.2 6.4 5.2 4.3 0.1 1.8
EP4S100G5 1517 HBGA 7.2 6.4 5.2 4.3 0.1 1.8
EP4S100G3 1932 FBGA 6.8 5.9 4.8 3.9 0.1 1.5
EP4S100G4 1932 FBGA 6.8 5.9 4.8 3.9 0.1 1.5
EP4S100G5 1932 FBGA 6.8 5.9 4.8 3.9 0.1 1.5

Table 31. Thermal Resistance of Stratix III Devices (Part 1 of 2)

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package Still Air 100 ft./min. 200 ft./min. 400 ft./min. θJC (° C/W) θ JB (° C/W)
EP3SE50 484 FBGA 12.7 10.1 8.6 7.3 0.3 2.8
780 FBGA 11.3 8.7 7.2 6.1 0.3 2.4
EP3SL50 484 FBGA 12.7 10.1 8.6 7.3 0.3 2.8
780 FBGA 11.3 8.7 7.3 6.1 0.3 2.4
EP3SL70 484 FBGA 12.7 10.1 8.6 7.3 0.3 2.8
780 FBGA 11.3 8.7 7.3 6.1 0.3 2.4
EP3SE80 780 FBGA, 10.2 8.5 7.0 5.8 0.2 2.0
Flip Chip
1152 FBGA, 9.4 7.6 6.2 5.1 0.2 2.0
Flip Chip
EP3SE110 780 FBGA, 10.2 8.5 7.0 5.8 0.2 2.0
Flip Chip
1152 FBGA, 9.4 7.6 6.2 5.1 0.2 2.0
Flip Chip
EP3SL110 780 FBGA, 10.2 8.5 7.0 5.8 0.2 2.0
Flip Chip
1152 FBGA, 9.4 7.6 6.2 5.1 0.2 2.0
Flip Chip
EP3SL150 780 FBGA, 10.2 8.5 7.0 5.8 0.2 2.0
Flip Chip
1152 FBGA, 9.4 7.6 6.2 5.1 0.2 2.0
Flip Chip

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
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Thermal Resistance

Table 31. Thermal Resistance of Stratix III Devices (Part 2 of 2)

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package Still Air 100 ft./min. 200 ft./min. 400 ft./min. θJC (° C/W) θ JB (° C/W)
EP3SL200 780 HBGA, 9.0 8.1 6.7 5.5 0.1 2.5
Flip Chip
1152 FBGA, 8.4 7.4 6.0 4.9 0.1 1.8
Flip Chip
1517 FBGA, 7.8 6.8 5.5 4.4 0.1 1.7
Flip Chip
EP3SE260 780 HBGA, 9.0 8.1 6.7 5.5 0.1 2.5
Flip Chip
1152 FBGA, 8.4 7.4 6.0 4.9 0.1 1.8
Flip Chip
1517 FBGA, 7.8 6.8 5.5 4.4 0.1 1.7
Flip Chip
EP3SL340 1152 HBGA, 8.1 7.2 5.8 4.7 0.1 2.3
Flip Chip
1517 FBGA, 7.7 6.8 5.4 4.4 0.1 1.4
Flip Chip
1760 FBGA, 7.5 6.5 5.2 4.2 0.1 1.3
Flip Chip

Table 32. Thermal Resistance of Stratix II Devices

Pin θ JA (° C/W) θ JA (° C/W) θJA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. θ JB (° C/W)
EP2S15 484 FBGA, Flip Chip 0.4 13.1 11.1 9.6 8.3 4.2
672 FBGA, Flip Chip 0.4 12.2 10.2 8.8 7.6 4.1
EP2S30 484 FBGA, Flip Chip 0.2 12.6 10.6 9.1 7.9 3.7
672 FBGA, Flip Chip 0.2 11.7 9.7 8.3 7.1 3.4
EP2S60 484 FBGA, Flip Chip 0.1 12.3 10.3 8.8 7.5 3.4
672 FBGA, Flip Chip 0.1 11.4 9.4 7.8 6.7 3.0
1,020 FBGA, Flip Chip 0.1 10.4 8.4 7.0 5.9 2.7
EP2S90 484 HBGA, Flip Chip 0.1 12.0 9.9 8.3 7.1 3.7
780 FBGA, Flip Chip 0.1 10.8 8.8 7.3 6.1 2.6
1,020 FBGA, Flip Chip 0.1 10.2 8.2 6.8 5.7 2.4
1,508 FBGA, Flip Chip 0.1 9.3 7.4 6.1 5.0 2.2
EP2S130 780 FBGA, Flip Chip 0.1 10.1 8.7 7.2 6.0 2.4
1,020 FBGA, Flip Chip 0.1 9.5 8.1 6.7 5.5 2.2
1,508 FBGA, Flip Chip 0.1 8.6 7.3 6.0 4.8 2.1
EP2S180 1,020 FBGA, Flip Chip 0.1 9.0 7.9 6.5 5.4 2.1
1,508 FBGA, Flip Chip 0.1 8.1 7.1 5.8 4.7 1.9

Table 33. Thermal Resistance of Stratix II GX Devices

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. θ JB (°C/W)
EP2SGX30 780 FBGA, 0.2 11.1 8.6 7.2 6.0 3.1
Flip Chip
EP2SGX60 780 FBGA, 0.2 10.9 8.4 6.9 5.8 2.8
Flip Chip
1152 FBGA, 0.2 9.9 7.5 6.1 5.0 2.5
Flip Chip
EP2SGX90 1152 FBGA, 0.1 9.6 7.3 5.9 4.9 2.3
Flip Chip
1508 FBGA, 0.1 9.0 6.7 5.4 4.4 1.9
Flip Chip
EP2SGX130 1508 FBGA, 0.1 8.3 6.6 5.3 4.3 1.8
Flip Chip

Table 34. Thermal Resistance of Stratix GX Devices

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EP1SGX10C 672 FBGA, Flip Chip 0.4 11.1 9.1 7.7 6.5
EP1SGX10D
EP1SGX25C 672 FBGA, Flip Chip 0.2 10.8 8.8 7.4 6.2
EP1SGX25D
EP1SGX25D 1020 FBGA, Flip Chip 0.2 9.9 7.9 6.5 5.4
EP1SGX25F
EP1SGX40D 1020 FBGA, Flip Chip 0.2 9.8 7.7 6.4 5.3
EP1SGX40G

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
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Thermal Resistance

Table 35. Thermal Resistance of Stratix Devices

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EP1S10 484 FBGA, Flip Chip 0.4 11.9 9.8 8.4 7.2
672 BGA 3.2 16.8 13.7 11.9 10.5
672 FBGA 3.4 17.2 14.0 12.2 10.8
780 FBGA, Flip Chip 0.4 10.9 8.8 7.4 6.3
EP1S20 484 FBGA, Flip Chip 0.3 11.8 9.7 8.3 7.1
672 BGA 2.5 15.5 12.4 10.7 9.3
672 FBGA 2.7 16.0 12.8 11.0 9.6
780 FBGA, Flip Chip 0.3 10.7 8.6 7.2 6.1
EP1S25 672 BGA 2.2 14.8 11.7 10.0 8.7
672 FBGA 2.3 15.3 12 10.4 9.0
780 FBGA, Flip Chip 0.3 10.5 8.5 7.1 6.0
1020 FBGA, Flip Chip 0.3 10.0 8.0 6.6 5.5
EP1S30 780 FBGA, Flip Chip 0.2 10.4 8.4 7.0 5.9
956 BGA, Flip Chip 0.2 9.1 7.1 5.8 4.8
1020 FBGA, Flip Chip 0.2 9.9 7.9 6.5 5.4
EP1S40 780 FBGA, Flip Chip 0.2 10.4 8.3 6.9 5.8
956 BGA, Flip Chip 0.2 9.0 7.0 5.7 4.7
1020 FBGA, Flip Chip 0.2 9.8 7.8 6.4 5.3
1508 FBGA, Flip Chip 0.2 9.1 7.1 5.8 4.7
EP1S60 956 BGA, Flip Chip 0.1 8.9 6.9 5.6 4.6
1020 FBGA, Flip Chip 0.1 9.7 7.7 6.3 5.2
1508 FBGA, Flip Chip 0.1 8.9 7.0 5.6 4.6
EP1S80 956 BGA, Flip Chip 0.1 8.8 6.8 5.5 4.5
1020 FBGA, Flip Chip 0.1 9.6 7.6 6.2 5.1
1508 FBGA, Flip Chip 0.1 8.8 6.9 5.5 4.5

Cyclone Series Devices Thermal Resistance

Table 36 through Table 41 provide thermal resistance values for Cyclone series
devices.

1 The data in Table 36 and Table 37 is preliminary and subject to change.

Table 36. Thermal Resistance of Cyclone IV Devices

θJA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Package Still Air 100 ft./min. 200 ft./min. 400 ft./min. θJC (° C/W) θJB (° C/W)
EP4CE6 E144 27.1 22.1 20.9 18.5 10.7 12.4
F256 36.3 29.9 28.0 26.4 9.8 20.6
EP4CE10 E144 27.1 22.1 20.9 18.5 10.7 12.4
F256 36.3 29.9 28.0 26.4 9.8 20.6
EP4CE15 F256 32.2 25.7 23.9 22.3 7.3 16.5
F484 31.4 25.1 23.4 21.9 10.5 17.5
EP4CE30 F484 25.3 20.3 18.7 17.2 7.1 12.8
F780 24.7 19.9 18.2 16.9 6.9 13.4
EP4CE40 F484 25.3 20.3 18.7 17.2 7.1 12.8
F780 24.7 19.9 18.2 16.9 6.9 13.4
EP4CE55 F484 24.0 19.1 17.4 16.0 6.3 11.5
F780 23.4 18.6 17.0 15.6 6.1 12.2
EP4CE75 F484 21.6 17.6 15.9 14.5 5.3 10.0
F780 21.0 17.1 15.4 14.1 5.1 10.6
EP4CE115 F484 18.6 15.9 14.3 12.9 4.4 8.4
F780 18.1 15.4 13.8 12.5 4.2 9.0
EP4CE155 F484 16.0 13.8 12.2 10.9 3.2 6.2
F780 15.4 13.2 11.7 10.4 3.0 6.7

Table 37. Thermal Resistance of Cyclone IV GX Devices (Part 1 of 2)

θJA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Package Still Air 100 ft./min. 200 ft./min. 400 ft./min. θJC (° C/W) θJB (° C/W)
EP4CGX15 QFN148 28.4 23.7 22.7 20.4 3.6 10.5
F169 31.2 27.1 25.2 23.6 7.7 17.0
EP4CGX22 F169 26.9 23.4 21.5 19.9 5.6 13.2
F324 25.2 21.7 20.0 18.5 5.3 13.1
EP4CGX30 F169 26.9 23.4 21.5 19.9 5.6 13.2
F324 25.2 21.7 20.0 18.5 5.3 13.1
F484 17.2 15.7 14.1 12.8 4.4 8.2
EP4CGX50 F484 17.2 15.7 14.1 12.8 4.4 8.2
F672 16.9 15.3 13.8 12.5 4.2 8.6
EP4CGX75 F484 17.2 15.7 14.1 12.8 4.4 8.2
F672 16.9 15.3 13.8 12.5 4.2 8.6

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
29
Thermal Resistance

Table 37. Thermal Resistance of Cyclone IV GX Devices (Part 2 of 2)

θJA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Package Still Air 100 ft./min. 200 ft./min. 400 ft./min. θJC (° C/W) θJB (° C/W)
EP4CGX110 F484 14.7 13.8 12.2 10.9 3.3 6.2
F672 14.3 13.4 11.9 10.6 3.1 6.7
F896 14.0 13.1 11.7 10.4 3.1 7.1
EP4CGX150 F484 14.7 13.8 12.2 10.9 3.3 6.2
F672 14.3 13.4 11.9 10.6 3.1 6.7
F896 14.0 13.1 11.7 10.4 3.1 7.1

Table 38. Thermal Resistance of Cyclone III LS Devices

θJA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Package Still Air 100 ft./min. 200 ft./min. 400 ft./min. θJC (° C/W) θJB (° C/W)
EP3CLS70 F484 17.5 12.7 11.1 9.8 3.4 5.5
Wire Bond (Option 2)
U484 18.7 13.8 12.2 10.8 3.2 6.4
Wire Bond
F780 16.6 11.8 10.3 9.0 3.0 5.2
Wire Bond (Option 2)
EP3CLS100 F484 17.5 12.7 11.1 9.8 3.4 5.5
Wire Bond (Option 2)
U484 18.7 13.8 12.2 10.8 3.2 6.4
Wire Bond
F780 16.6 11.8 10.3 9.0 3.0 5.2
Wire Bond (Option 2)
EP3CLS150 F484 14.5 11.5 9.9 8.6 2.6 4.4
Wire Bond (Option 2)
F780 13.5 10.5 9.0 7.8 2.2 4.1
Wire Bond (Option 2)
EP3CLS200 F484 14.5 11.5 9.9 8.6 2.6 4.4
Wire Bond (Option 2)
F780 13.5 10.5 9.0 7.8 2.2 4.1
Wire Bond (Option 2)

Table 39. Thermal Resistance of Cyclone III Devices (Part 1 of 3)

θJA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Package Still Air 100 ft./min. 200 ft./min. 400 ft./min. θ JC (° C/W) θ JB (° C/W)
EP3C5 E144 20.0 17.5 15.4 14.0 8.4 —
Wire Bond
EP3C5 F256 32.4 28.9 27.0 25.5 11.7 15.6
Wire Bond (Option 2)
EP3C5 U256 32.5 29.1 27.2 25.6 12.2 17.3
Wire Bond
EP3C10 E144 20.0 17.5 15.4 14.0 8.4 —
Wire Bond

Table 39. Thermal Resistance of Cyclone III Devices (Part 2 of 3)

EP3C10 M164 39.0 32.3 30.4 28.7 9.9 20.0
Wire Bond
EP3C10 F256 32.4 28.9 27.0 25.5 11.7 15.6
Wire Bond (Option 2)
θJA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Package Still Air 100 ft./min. 200 ft./min. 400 ft./min. θ JC (° C/W) θ JB (° C/W)
EP3C10 U256 32.5 29.1 27.2 25.6 12.2 17.3
Wire Bond
EP3C16 E144 20.0 17.5 15.4 14.0 8.4 —
Wire Bond
EP3C16 M164 35.0 28.4 26.4 24.7 7.6 15.8
Wire Bond
EP3C16 Q240 27.2 24.7 22.1 17.8 4.3 —
Wire Bond
EP3C16 F256 28.5 25.1 23.2 21.7 9.1 13.2
Wire Bond (Option 2)
EP3C16 U256 28.8 25.4 23.5 22.0 9.7 14.1
Wire Bond
EP3C16 U484 26.1 23.5 21.6 20.1 8.5 11.4
Wire Bond
EP3C16 F484 22.9 19.4 17.7 16.2 6.9 10.2
Wire Bond (Option 3)
EP3C25 E144 29.0 27.5 26.3 24.4 7.8 —
Wire Bond
EP3C25 Q240 27.0 24.5 21.8 17.6 4.2 —
Wire Bond
EP3C25 F256 27.5 24.1 22.2 20.7 8.5 12.5
Wire Bond (Option 2)
EP3C25 U256 27.9 24.5 22.6 21.1 9.1 13.6
Wire Bond
EP3C25 F324 26.6 23.1 21.3 19.8 8.0 11.5
Wire Bond
EP3C40 Q240 25.8 23.2 20.6 17.0 4.0 —
Wire Bond
EP3C40 F324 23.2 19.7 18.0 16.5 5.9 8.9
Wire Bond
EP3C40 U484 22.8 19.3 17.6 16.1 5.9 8.5
Wire Bond
EP3C40 F484 19.8 16.3 14.6 13.2 4.8 7.6
Wire Bond (Option 3)
EP3C40 F780 18.7 15.2 13.5 12.2 4.5 7.0
Wire Bond (Option 2)
EP3C55 U484 21.6 18.2 16.4 15.0 5.1 8.2
Wire Bond
EP3C55 F484 18.9 15.4 13.8 12.2 4.2 6.9
Wire Bond (Option 3)

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
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Thermal Resistance

Table 39. Thermal Resistance of Cyclone III Devices (Part 3 of 3)

EP3C55 F780 17.8 14.4 12.7 11.4 3.9 6.7
Wire Bond (Option 2)
EP3C80 U484 20.4 16.9 15.2 13.8 4.4 7.2
Wire Bond
EP3C80 F484 18.0 14.5 12.9 11.5 3.6 6.1
Wire Bond (Option 3)
EP3C80 F780 16.9 13.5 11.8 10.5 3.3 5.9
Wire Bond (Option 2)
θJA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Package Still Air 100 ft./min. 200 ft./min. 400 ft./min. θ JC (° C/W) θ JB (° C/W)
EP3C120 F484 17.1 13.7 12.0 10.7 3.1 5.4
Wire Bond (Option 3)
EP3C120 F780 16.0 12.6 11.0 9.7 2.8 5.1
Wire Bond (Option 2)

Table 40. Thermal Resistance of Cyclone II Devices

Pin θ JA (° C/W) θJA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EP2C5 144 TQFP, Wire Bond 10.0 31.0 29.3 27.9 25.5
208 PQFP, Wire Bond 5.5 30.4 29.2 27.3 22.3
256 FBGA, Wire Bond 8.7 30.2 26.1 23.6 21.7
EP2C8 144 TQFP, Wire Bond 9.9 29.8 28.3 26.9 24.9
208 PQFP, Wire Bond 5.4 30.2 28.8 26.9 21.7
256 FBGA, Wire Bond 7.1 27.0 23.0 20.5 18.5
EP2C15 256 FBGA, Wire Bond 5.5 24.2 20.0 17.8 16.0
484 FBGA, Wire Bond 4.2 21.0 17.0 14.8 13.1
EP2C20 240 PQFP, Wire Bond 4.2 26.6 24.0 21.4 17.4
256 FBGA, Wire Bond 5.5 24.2 20.0 17.8 16.0
484 FBGA, Wire Bond 4.2 21.0 17.0 14.8 13.1
EP2C35 484 FBGA, Wire Bond 3.3 19.4 15.4 13.3 11.7
484 UBGA, Wire Bond 5.0 20.6 16.6 14.5 12.8
672 FBGA, Wire Bond 3.1 18.6 14.6 12.6 11.1
EP2C50 484 FBGA, Wire Bond 2.8 18.4 14.4 12.4 10.9
484 UBGA, Wire Bond 4.4 19.6 15.6 13.6 11.9
672 FBGA, Wire Bond 2.6 17.7 13.7 11.8 10.2
EP2C70 672 FBGA, Wire Bond 2.2 16.9 13.0 11.1 9.7
896 FBGA, Wire Bond 2.1 16.3 11.9 10.5 9.1

Table 41. Thermal Resistance of Cyclone Devices

θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device
Pin Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
100 TQFP 11.0 37.5 35.4 33.4 29.8
EP1C3
144 TQFP 10.0 31.1 29.4 27.9 25.5
144 TQFP 9.8 29.4 28.0 26.7 24.7
EP1C6 240 PQFP 4.3 27.2 24.7 22.1 17.8
256 FBGA 8.8 28.7 24.5 22.3 20.5
240 PQFP 4.0 26.0 23.4 20.8 17.1
EP1C12 256 FBGA 6.6 24.3 20.2 18.1 16.4
324 FBGA 6.1 23.0 19.8 17.7 16.1
324 FBGA 5.0 21.0 17.7 15.6 14.1
EP1C20
400 FBGA 4.7 20.7 17.5 15.5 13.9

MAX Series Devices Thermal Resistance

Table 42 through Table 45 provide thermal resistance values for MAX series devices.

Table 42. Thermal Resistance of MAX II Devices

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPM240 100 TQFP 12.0 39.5 37.5 35.5 31.6
100 MBGA 32.1 53.8 47.7 45.7 44.0
100 FBGA 20.8 51.2 45.2 43.2 41.5
EPM570 100 TQFP 11.2 38.7 36.6 34.6 30.8
100 MBGA 25.0 46.5 40.4 38.4 36.8
100 FBGA 14.8 42.8 36.8 34.9 33.3
144 TQFP 10.5 32.1 30.3 28.7 26.1
256 FBGA 13.0 37.4 33.1 30.5 28.4
256 MBGA 12.9 39.5 33.6 31.6 30.1
EPM1270 144 TQFP 10.5 31.4 29.7 28.2 25.8
256 FBGA 10.4 33.5 29.3 26.8 24.7
256 MBGA 10.6 36.1 30.2 28.3 26.8
EPM2210 256 FBGA 8.7 30.2 26.1 23.6 21.7
324 FBGA 8.2 29.8 25.7 23.3 21.3

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
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Thermal Resistance

Table 43. Thermal Resistance of MAX 9000 Devices

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPM9320 84 PLCC 9.0 29.0 27.0 25.0 23.0
208 RQFP 1.0 17.0 16.0 15.0 13.0
280 PGA 2.0 14.0 10.0 7.0 5.0
356 BGA 2.0 14.0 12.0 11.0 10.0
EPM9320A 84 PLCC 9.0 29.0 27.0 26.0 23.0
208 RQFP 2.0 17.0 16.0 15.0 13.0
356 BGA 1.0 12.0 11.0 10.0 9.0
EPM9400 84 PLCC 9.0 29.0 27.0 25.0 23.0
208 RQFP 1.0 17.0 16.0 15.0 13.0
240 RQFP 1.0 14.0 12.0 11.0 10.0
EPM9480 208 RQFP 1.0 17.0 16.0 15.0 12.0
240 RQFP 1.0 12.0 11.0 10.0 9.0
EPM9560 208 RQFP 1.0 17.0 16.0 15.0 12.0
240 RQFP 1.0 12.0 11.0 10.0 9.0
280 PGA 2.0 14.0 10.0 7.0 5.0
304 RQFP 1.0 12.0 11.0 10.0 9.0
356 BGA 1.0 12.0 11.0 10.0 9.0
EPM9560A 208 RQFP 1.0 17.0 16.0 15.0 12.0
240 RQFP 1.0 11.0 10.0 9.0 8.0
356 BGA 1.0 12.0 11.0 10.0 9.0

Table 44. Thermal Resistance of MAX 7000 Devices (Part 1 of 4)

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPM7032 44 PLCC 10.0 33.0 31.0 30.0 27.0
PQFP 15.0 48.0 46.0 45.0 42.0
TQFP 14.0 46.0 44.0 43.0 40.0
EPM7032B 44 PLCC 10.0 33.0 31.0 30.0 27.0
TQFP 14.0 46.0 44.0 43.0 40.0
49 UBGA 23.0 69.0 67.0 66.0 62.0
EPM7032S 44 PLCC 10.0 33.0 31.0 30.0 27.0
TQFP 14.0 46.0 44.0 43.0 40.0
EPM7032V 44 PLCC 9.0 31.0 30.0 28.0 25.0
TQFP 14.0 45.0 44.0 42.0 39.0
EPM7032AE 44 PLCC 9.0 31.0 30.0 28.0 25.0
TQFP 14.0 46.0 45.0 43.0 40.0

Table 44. Thermal Resistance of MAX 7000 Devices (Part 2 of 4)

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPM7064S 44 PLCC 9.0 31.0 30.0 28.0 25.0
TQFP 14.0 46.0 44.0 43.0 40.0
84 PLCC 9.0 28.0 26.0 25.0 23.0
100 TQFP 11.0 39.0 37.0 35.0 32.0
EPM7064 44 PLCC 9.0 31.0 30.0 28.0 25.0
TQFP 13.0 44.0 43.0 41.0 38.0
68 PLCC 9.0 29.0 28.0 26.0 23.0
84 PLCC 9.0 28.0 26.0 25.0 22.0
100 PQFP 6.0 33.0 32.0 31.0 30.0
EPM7064AE 44 PLCC 9.0 31.0 30.0 28.0 25.0
EPM7064B TQFP 14.0 46.0 45.0 43.0 40.0
49 UBGA 23.0 56.0 53.0 51.0 47.0
100 TQFP 12.0 39.0 37.0 35.0 31.0
FBGA 21.0 49.0 47.0 44.0 40.0
EPM7096 68 PLCC 9.0 29.0 27.0 26.0 23.0
84 PLCC 9.0 28.0 26.0 24.0 22.0
100 PQFP 6.0 32.0 31.0 30.0 29.0
EPM7128A 84 PLCC 9.0 28.0 26.0 25.0 22.0
100 TQFP 11.0 37.0 35.0 33.0 30.0
FBGA 18.0 44.0 42.0 39.0 35.0
144 TQFP 9.0 31.0 29.0 28.0 25.0
256 FBGA 12.0 38.0 36.0 34.0 31.0
EPM7128B 49 UBGA 22.0 53.0 50.0 48.0 44.0
100 TQFP 11.0 38.0 36.0 34.0 31.0
FBGA 19.0 46.0 44.0 41.0 37.0
144 TQFP 9.0 32.0 30.0 29.0 26.0
169 UBGA 16.0 44.0 42.0 39.0 35.0
256 FBGA 13.0 40.0 38.0 36.0 33.0
EPM7128E 84 PLCC 10.0 29.0 28.0 26.0 23.0
100 PQFP 6.0 32.0 31.0 30.0 29.0
160 PQFP 6.0 32.0 31.0 30.0 28.0
EPM7128S 84 PLCC 10.0 30.0 28.0 26.0 23.0
100 TQFP 12.0 38.0 36.0 34.0 30.0
PQFP 10.0 35.0 34.0 33.0 32.0
160 PQFP 7.0 33.0 32.0 31.0 30.0

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
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Thermal Resistance

Table 44. Thermal Resistance of MAX 7000 Devices (Part 3 of 4)

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPM7128AE 84 PLCC 11.0 30.0 28.0 26.0 23.0
100 TQFP 12.0 38.0 36.0 34.0 30.0
FBGA 14.0 43.0 40.0 38.0 37.0
144 TQFP 11.0 33.0 30.0 28.0 26.0
169 UBGA 14.0 42.0 40.0 38.0 36.0
256 FBGA 12.0 39.0 37.0 35.0 31.0
EPM7160E 84 PLCC 10.0 29.0 28.0 26.0 23.0
100 PQFP 6.0 32.0 31.0 30.0 29.0
160 PQFP 6.0 33.0 32.0 31.0 30.0
EPM7160S 84 PLCC 10.0 35.0 28.0 26.0 23.0
100 TQFP 12.0 37.0 35.0 33.0 30.0
160 PQFP 6.0 33.0 32.0 31.0 30.0
EPM7192S 160 PQFP 6.0 32.0 31.0 30.0 29.0
EPM7192E 160 PGA 6.0 20.0 13.0 10.0 8.0
PQFP 6.0 32.0 31.0 30.0 26.0
EPM7256A 100 TQFP 9.0 36.0 34.0 32.0 30.0
144 TQFP 8.0 32.0 27.0 25.0 24.0
208 PQFP 5.0 30.0 28.0 26.0 21.0
256 FBGA 12.0 34.0 32.0 29.0 28.0
EPM7256B 100 TQFP 12.0 37.0 35.0 33.0 30.0
144 TQFP 9.0 33.0 29.0 27.0 25.0
169 UBGA 13.0 40.0 38.0 36.0 34.0
208 PQFP 5.0 31.0 29.0 27.0 22.0
256 FBGA 9.0 34.0 32.0 30.0 28.0
EPM7256E 192 PGA 6.0 20.0 13.0 10.0 8.0
160 PQFP 6.0 31.0 30.0 29.0 25.0
208 RQFP 1.0 17.0 16.0 15.0 13.0
EPM7256S 208 PQFP 5.0 30.0 29.0 26.0 21.0
RQFP 1.0 18.0 17.0 16.0 15.0
EPM7256AE 100 FBGA 13.0 42.0 39.0 37.0 36.0
100 TQFP 12.0 37.0 35.0 33.0 30.0
144 TQFP 9.0 33.0 29.0 27.0 25.0
208 PQFP 5.0 31.0 29.0 27.0 22.0
256 FBGA 9.0 34.0 32.0 30.0 28.0
EPM7512AE 144 TQFP 10.0 32.0 27.0 25.0 23.0
208 PQFP 5.0 30.0 28.0 25.0 21.0
256 BGA 1.2 14.0 12.0 11.0 10.0
FBGA 11.0 32.0 30.0 28.0 22.0

Table 44. Thermal Resistance of MAX 7000 Devices (Part 4 of 4)

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPM7512B 144 TQFP 10.0 32.0 27.0 25.0 24.0
169 UBGA 12.0 35.0 33.0 31.0 30.0
208 PQFP 5.0 30.0 28.0 25.0 21.0
256 BGA 1.2 14.0 12.0 11.0 10.0
256 FBGA 11.0 32.0 30.0 28.0 27.0

Table 45. Thermal Resistance of MAX 3000A Devices

Pin θ JA (° C/W) θJA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPM3032A 44 TQFP 14.0 46.0 45.0 43.0 40.0
PLCC 9.0 31.0 30.0 28.0 25.0
EPM3064A 44 TQFP 14.0 46.0 45.0 43.0 40.0
PLCC 9.0 31.0 30.0 28.0 25.0
100 TQFP 12.0 39.0 37.0 35.0 31.0
EPM3128A 100 TQFP 12.0 38.0 36.0 34.0 30.0
EPM3256A 144 TQFP 9.0 33.0 29.0 27.0 25.0
208 PQFP 5.0 31.0 29.0 27.0 22.0
EPM3512A 208 PQFP 5.0 30.0 28.0 25.0 21.0
256 FBGA 11.0 32.0 30.0 28.0 22.0

HardCopy Series Devices Thermal Resistance

Table 46 through Table 49 provide thermal resistance values for HardCopy series
devices.

1 The data in Table 46 and Table 47 is preliminary and subject to change.

Table 46. Thermal Resistance of HardCopy IV Devices (Part 1 of 2)

θ JA (° C/W)
θJA (° C/W) 100 θ JA (° C/W) θ JA (° C/W) θ JC (° C/W) θ JB (° C/W)
Device Pin Count Package Still Air ft./min. 200 ft./min. 400 ft./min.

FineLine Ball-Grid Array (FBGA) — Flip Chip — Wire Bond

HC4E25 484 FBGA, 15.8 13.2 11.7 10.4 3.9 5.6
Wire Bond
780 FBGA, 14.5 12.3 10.8 9.6 3.5 5.8
Wire Bond
FineLine Ball-Grid Array (FBGA) — Flip Chip — Lidless
HC4E25 484 FBGA, 15.3 13.6 11.8 10.5 0.05 4.9
Flip Chip
780 FBGA, 13.7 12.3 10.6 9.3 0.05 5.0
Flip Chip

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
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Thermal Resistance

Table 46. Thermal Resistance of HardCopy IV Devices (Part 2 of 2)

θ JA (° C/W)
θJA (° C/W) 100 θ JA (° C/W) θ JA (° C/W) θ JC (° C/W) θ JB (° C/W)
Device Pin Count Package Still Air ft./min. 200 ft./min. 400 ft./min.
HC4E35 1152 FBGA, 11.8 10.9 9.3 8.0 0.04 4.3
Flip Chip
1517 FBGA, 11.1 10.5 8.9 7.6 0.03 4.6
Flip Chip
HC4GX15 78 0 FBGA, 13.2 12.4 10.7 9.4 0.05 4.9
Flip Chip
HC4GX25 780 FBGA, 12.1 11.6 9.9 8.6 0.03 3.9
Flip Chip
1152 FBGA, 11.2 10.5 8.9 7.6 0.03 3.8
Flip Chip
HC4GX35 1152 FBGA, 10.2 10.0 8.4 7.1 0.02 3.3
Flip Chip
1517 FBGA, 9.8 9.5 7.9 6.7 0.02 3.5
Flip Chip
FineLine Ball-Grid Array (FBGA) — Flip Chip — Single-Piece Lid
HC4E25 484 FBGA, 13.1 10.4 8.8 7.6 0.5 3.2
Flip Chip
780 FBGA, 11.3 9.0 7.6 6.4 0.5 2.8
Flip Chip
HC4E35 1152 FBGA, 9.6 8.0 6.5 5.4 0.3 2.4
Flip Chip
1517 FBGA, 8.7 7.3 6.0 4.9 0.3 2.4
Flip Chip
HC4GX15 780 FBGA, 11.1 9.4 7.9 6.7 0.7 3.0
Flip Chip
HC4GX25 780 FBGA, 10.6 9.2 7.7 6.5 0.5 2.5
Flip Chip
1152 FBGA, 9.4 7.9 6.5 5.4 0.4 2.3
Flip Chip
HC4GX35 1152 FBGA, 8.7 7.7 6.3 5.2 0.3 2.0
Flip Chip
1517 FBGA, 8.2 7.1 5.8 4.7 0.3 2.0
Flip Chip

Table 47. Thermal Resistance of HardCopy III Devices

θ JA (° C/W)
θJA (° C/W) 100 θ JA (° C/W) θ JA (° C/W) θ JC (° C/W) θ JB (° C/W)
Device Pin Count Package Still Air ft./min. 200 ft./min. 400 ft./min.
FineLine Ball-Grid Array (FBGA) — Flip Chip — Wire Bond
HC315 484 FBGA, 18.4 15.6 14.0 12.7 5.7 7.9
Wire Bond
HC325 484 FBGA, 15.8 13.2 11.7 10.4 3.9 5.6
Wire Bond
780 FBGA, 14.5 12.3 10.8 9.6 3.5 5.8
Wire Bond
FineLine Ball-Grid Array (FBGA) — Flip Chip — Lidless
HC325 484 FBGA, 15.3 13.6 11.8 10.5 0.05 4.9
Flip Chip
780 FBGA, 13.7 12.3 10.6 9.3 0.05 5.0
Flip Chip
HC335 1152 FBGA, 11.8 10.9 9.3 8.0 0.04 4.3
Flip Chip
1517 FBGA, 11.1 10.5 8.9 7.6 0.03 2.4
Flip Chip
FineLine Ball-Grid Array (FBGA) — Flip Chip — Single-Piece Lid
HC325 484 FBGA, 13.1 10.4 8.8 7.6 0.5 3.2
Flip Chip
780 FBGA, 11.3 9.0 7.6 6.4 0.5 2.8
Flip Chip
HC335 1152 FBGA, 9.6 8.0 6.5 5.4 0.3 2.4
Flip Chip
1517 FBGA, 8.7 7.3 6.0 4.9 0.3 2.4
Flip Chip

Table 48. Thermal Resistance of HardCopy II Devices

Pin θ JA (° C/W) θ JA (° C/W) θJA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min. θ JB (° C/W)
HC210 484 FBGA, Flip Chip 0.8 13.4 11.2 9.6 8.3 4.6
484 FBGA, Wire Bond 5.5 21.3 17.4 15.3 13.8 9.6
HC220 672 FBGA, Flip Chip 0.5 12.1 9.9 8.3 7.1 3.6
780 FBGA, Flip Chip 0.5 11.7 9.5 8.0 6.8 3.5
HC230 1020 FBGA, Flip Chip 0.3 10.8 8.6 7.1 6.0 2.9
HC240 1020 FBGA, Flip Chip 0.2 10.6 8.4 6.9 5.8 2.7
1508 FBGA, Flip Chip 0.2 9.7 7.5 6.1 5.0 2.6

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
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Thermal Resistance

Table 49. Thermal Resistance of HardCopy Devices

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
HC20K400 652 BGA, Flip Chip 0.5 9.1 7.9 6.4 5.3
HC20K600 672 FBGA, Flip Chip 1.0 13.0 10.2 8.6 7.3
HC1S25 672 FBGA, Wire Bond 3.7 19.7 15.8 13.9 12.4
BGA, Wire Bond 3.4 19.3 15.6 13.8 12.3
HC1S30 780 FBGA, Flip Chip 0.4 10.9 8.8 7.4 6.3
HC1S40 780 FBGA, Flip Chip 0.4 10.9 8.8 7.4 6.3
HC1S60 1020 FBGA, Flip Chip 0.3 10.3 8.54 7.0 5.8
HC1S80 1020 FBGA, Flip Chip 0.3 10.3 8.54 7.0 5.8

APEX Series Devices Thermal Resistance

Table 50 and Table 51 provide thermal resistance values for APEX series devices.

Table 50. Thermal Resistance of APEX II Devices

Pin θ JA (° C/W) θJA (° C/W) θ JA (° C/W) θJA (° C/W)
Device Count Package θJC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EP2A15 672 FBGA, Flip Chip (Cu lid) 0.2 10.8 8.8 7.4 6.2
FBGA, Flip Chip (AlSiC lid) 0.3 11.6 9.6 8.0 6.6
724 BGA, Flip Chip (Cu lid) 0.2 9.7 7.7 6.4 5.3
BGA, Flip Chip (AlSiC lid) 0.4 10.0 8.2 6.6 5.4
EP2A25 672 FBGA (Cu lid) 0.2 10.7 8.7 7.2 6.1
FBGA, Flip Chip (AlSiC lid) 0.3 11.5 9.6 8.0 6.6
724 BGA, Flip Chip (Cu lid) 0.2 9.6 7.6 6.2 5.2
BGA, Flip Chip (AlSiC lid) 0.3 10.0 8.2 6.6 5.4
1020 FBGA, Flip Chip (Cu lid) 0.2 9.8 7.8 6.4 5.3
FBGA, Flip Chip (AlSiC lid) 0.3 10.4 8.5 6.9 5.7
EP2A40 672 FBGA, Flip Chip (Cu lid) 0.2 10.0 8.2 6.9 5.9
FBGA, Flip Chip (AlSiC lid) 0.2 10.0 8.2 6.9 5.9
724 BGA, Flip Chip (Cu lid) 0.2 9.5 7.5 6.1 5.1
BGA, Flip Chip (AlSiC lid) 0.2 9.5 7.5 6.1 5.1
1,020 FBGA, Flip Chip (Cu lid) 0.2 9.7 7.7 6.3 5.2
FBGA, Flip Chip (AlSiC lid) 0.2 9.7 7.7 6.3 5.2
EP2A70 724 BGA, Flip Chip (Cu lid) 0.1 9.3 7.3 6.0 4.9
BGA, Flip Chip (AlSiC lid) 0.1 10.0 7.9 6.4 5.3
1,508 FBGA, Flip Chip (Cu lid) 0.1 8.8 6.8 5.5 4.5
FBGA, Flip Chip (AlSiC lid) 0.1 9.3 7.3 5.8 4.7

Table 51. Thermal Resistance of APEX 20K and APEX 20KE Devices (Part 1 of 3)
Pin θJA (° C/W) θJA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EP20K30E 144 TQFP 8.0 29.0 28.0 26.0 25.0
208 PQFP 5.0 30.0 29.0 27.0 22.0
144 FBGA 14.0 36.0 34.0 32.0 29.0
324 FBGA 9.0 31.0 29.0 28.0 25.0
EP20K60E 144 TQFP 7.0 28.0 26.0 25.0 24.0
144 FBGA 11.0 33.0 32.0 30.0 27.0
208 PQFP 5.0 30.0 28.0 26.0 21.0
240 PQFP 4.0 26.0 24.0 21.0 17.0
324 FBGA 7.0 29.0 28.0 26.0 24.0
356 BGA 1.0 12.0 11.0 10.0 9.0
EP20K100 144 TQFP 7.0 26.0 25.0 24.0 23.0
208 PQFP 5.0 29.0 27.0 25.0 20.0
240 PQFP 4.0 25.0 23.0 20.0 17.0
324 FBGA 6.0 28.0 26.0 25.0 23.0
356 BGA 1.0 12.0 11.0 10.0 9.0
EP20K100E 144 TQFP 7.0 26.0 25.0 24.0 23.0
144 FBGA 9.0 32.0 30.0 29.0 26.0
208 PQFP 5.0 29.0 27.0 25.0 20.0
240 PQFP 4.0 25.0 23.0 20.0 17.0
324 FBGA 6.0 28.0 26.0 25.0 23.0
356 BGA 1.0 12.0 11.0 10.0 9.0
EP20K160E 144 TQFP 6.0 25.0 24.0 23.0 22.0
208 PQFP 5.0 28.0 26.0 23.0 19.0
240 PQFP 4.0 24.0 21.0 19.0 16.0
356 BGA 1.0 12.0 11.0 10.0 9.0
484 FBGA 5.0 24.0 23.0 22.0 21.0
EP20K200 208 PQFP 4.0 25.0 23.0 20.0 17.0
240 PQFP 3.0 21.0 19.0 17.0 15.0
356 BGA 1.0 12.0 11.0 10.0 9.0
484 FBGA 5.0 22.0 21.0 20.0 19.0
EP20K200E 208 PQFP 4.0 25.0 23.0 20.0 17.0
240 PQFP 3.0 22.0 19.0 18.0 16.0
356 BGA 2.0 12.0 11.0 10.0 9.0
484 FBGA 5.0 23.0 22.0 21.0 20.0
652 BGA 1.0 12.0 11.0 10.0 9.0
672 FBGA 5.0 21.0 20.0 19.0 18.0

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
41
Thermal Resistance

Table 51. Thermal Resistance of APEX 20K and APEX 20KE Devices (Part 2 of 3)
Pin θJA (° C/W) θJA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EP20K200C 208 PQFP 4.0 25.0 23.0 20.0 17.0
240 PQFP 3.0 22.0 19.0 18.0 16.0
356 BGA 2.0 12.0 11.0 10.0 9.0
484 FBGA 5.0 23.0 22.0 21.0 20.0
EP20K300E 240 PQFP 3.0 19.0 18.0 16.0 15.0
652 BGA 1.0 12.0 11.0 10.0 9.0
672 FBGA 5.0 20.0 19.0 18.0 17.0
EP20K400 652 BGA 0.5 9.0 8.0 7.0 6.0
655 PGA 1.0 8.0 7.0 6.0 4.0
672 FBGA 0.4 11.6 9.6 7.9 6.5
672 FBGA w/ fin (1) 0.5 7.0 4.0 3.0 2.6
EP20K400E 652 BGA 0.5 9.0 8.0 7.0 6.0
EP20K400C 672 FBGA (Cu lid) 0.3 10.9 8.8 7.4 6.3
FBGA (AlSiC lid) 0.4 11.7 9.7 8.0 6.7
672 FBGA w/ fin (1) 0.5 7.0 4.0 3.0 2.6
EP20K600E 652 BGA 0.5 9.0 8.0 7.0 6.0
EP20K600C 672 FBGA (Cu lid) 0.2 10.8 8.7 7.3 6.1
FBGA (AlSiC lid) 0.3 11.6 9.6 7.9 6.5
672 FBGA w/ fin (1) 0.5 5.0 3.0 3.0 2.0
1,020 FBGA (Cu lid) 0.2 9.9 7.8 6.5 5.4
FBGA (AlSiC lid) 0.3 10.4 8.4 6.8 5.6
1,020 FBGA w/ fin (1) 0.5 5.0 3.0 3.0 2.0
EP20K1000E 652 BGA (Cu lid) 0.1 8.3 7.0 5.6 4.5
EP20K1000C BGA (AlSiC lid) 0.2 9.3 7.4 6.0 4.9
652 FBGA w/ fin (1) 0.5 4.0 3.0 3.0 2.0
672 FBGA (Cu lid) 0.1 10.6 8.6 7.2 6.0
FBGA (AlSiC lid) 0.2 11.4 9.4 7.7 6.3
672 FBGA w/ fin (1) 0.5 6.0 4.0 3.0 2.0
1,020 FBGA (Cu lid) 0.1 9.7 7.7 6.3 5.2
FBGA (AlSiC lid) 0.2 10.2 8.2 6.6 5.4
1,020 FBGA w/ fin (1) 0.5 5.0 3.0 2.0 2.0

Table 51. Thermal Resistance of APEX 20K and APEX 20KE Devices (Part 3 of 3)
Pin θJA (° C/W) θJA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EP20K1500E 652 BGA (Cu lid) 0.1 8.2 6.9 5.5 4.4
BGA (AlSiC lid) 0.2 9.2 7.3 5.8 4.8
652 FBGA 0.1 9.2 7.3 5.8 4.8
652 FBGA w/ fin (1) 0.5 4.0 3.0 2.5 2.0
1,020 FBGA (Cu lid) 0.1 9.6 7.6 6.2 5.1
FBGA (AlSiC lid) 0.2 10.1 8.1 6.4 5.3
1,020 FBGA w/ fin (1) 0.5 5.0 3.0 2.5 2.0
Note to Table 51:
(1) “fin” is an extra heat sink that customers can add to the device. Several vendors make heat sinks, and they all have different sizes. Altera
performed the thermal calculations in Table 51 using the following fin specifications: width: 0.25 mm; height: 7.0 mm; pitch: 1.5 mm; base
thickness: 0.5 mm.

ACEX 1K Devices Thermal Resistance

Table 52 provides thermal resistance values for ACEX 1K devices.

Table 52. Thermal Resistance of ACEX 1K Devices

Pin θ JA (° C/W) θJA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EP1K10 100 TQFP 11.0 37.0 35.0 33.0 29.0
144 TQFP 8.0 31.0 29.0 28.0 25.0
208 PQFP 6.0 30.0 29.0 27.0 22.0
256 FBGA 12.0 37.0 35.0 33.0 30.0
EP1K30 144 TQFP 8.0 28.0 27.0 26.0 24.0
208 PQFP 5.0 30.0 28.0 26.0 21.0
256 FBGA 9.0 31.0 29.0 28.0 25.0
EP1K50 144 TQFP 7.0 26.0 25.0 24.0 23.0
208 PQFP 5.0 29.0 28.0 25.0 20.0
256 FBGA 7.0 30.0 28.0 27.0 24.0
484 FBGA 5.0 25.0 24.0 23.0 22.0
EP1K100 208 PQFP 5.0 28.0 26.0 23.0 18.0
256 FBGA 6.0 28.0 26.0 25.0 23.0
484 FBGA 5.0 24.0 23.0 22.0 21.0

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
43
Thermal Resistance

Mercury Devices Thermal Resistance

Table 53 provides thermal resistance values for Mercury devices.

Table 53. Thermal Resistance of Mercury Devices

Pin θ JA (° C/W) θ JA (° C/W) θJA (° C/W) θJA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EP1M120 484 FBGA (Cu lid) 0.6 12.2 10.1 8.7 7.5
484 FBGA (AlSiC lid) 0.9 13.0 11.1 9.3 7.9
EP1M350 780 FBGA (Cu lid) 0.2 10.5 8.5 7.1 5.9
780 FBGA (AlSiC lid) 0.3 11.0 9.2 7.6 6.3

FLEX Series Devices Thermal Resistance

Table 54 through Table 56 provide thermal resistance values for FLEX series devices.

Table 54. Thermal Resistance of FLEX 10K Devices (Part 1 of 3)

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPF10K10 84 PLCC 9.0 28.0 26.0 24.0 22.0
144 TQFP 7.0 26.0 25.0 24.0 23.0
208 PQFP 5.0 29.0 27.0 25.0 20.0
EPF10K10A 100 TQFP 10.0 35.0 33.0 31.0 28.0
144 TQFP 7.0 29.0 28.0 26.0 25.0
208 PQFP 5.0 30.0 29.0 27.0 21.0
256 FBGA 7.0 33.0 30.0 28.0 26.0
EPF10K20 144 TQFP 6.0 24.0 23.0 22.0 21.0
208 RQFP 1.0 17.0 16.0 15.0 13.0
240 RQFP 1.0 14.0 12.0 11.0 10.0
EPF10K30 208 RQFP 1.0 17.0 16.0 15.0 12.0
240 RQFP 1.0 13.0 12.0 11.0 10.0
356 BGA 1.0 12.0 11.0 10.0 9.0
EPF10K30A 144 TQFP 7.0 25.0 24.0 23.0 22.0
208 PQFP 5.0 29.0 27.0 24.0 19.0
240 PQFP 4.0 25.0 22.0 20.0 17.0
256 FBGA 6.0 28.0 26.0 24.0 23.0
356 BGA 1.0 12.0 11.0 10.0 9.0
484 FBGA 5.0 24.0 22.0 21.0 20.0
EPF10K30E 144 TQFP 9.0 28.0 27.0 26.0 24.0
208 PQFP 5.0 30.0 28.0 26.0 21.0
256 FBGA 9.0 31.0 29.0 28.0 25.0
484 FBGA 6.0 26.0 25.0 24.0 22.0
EPF10K40 208 RQFP 1.0 17.0 16.0 15.0 12.0
240 RQFP 1.0 13.0 12.0 11.0 10.0

Table 54. Thermal Resistance of FLEX 10K Devices (Part 2 of 3)

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPF10K50 240 RQFP 1.0 12.0 11.0 10.0 9.0
356 BGA 1.0 12.0 11.0 10.0 9.0
403 PGA 3.0 12.0 10.0 9.0 8.0
PGA (1) 3.0 10.0 8.0 7.0 6.0
EPF10K50V 240 PQFP 4.0 25.0 22.0 20.0 17.0
240 RQFP 1.0 13.0 12.0 11.0 10.0
356 BGA 1.0 12.0 11.0 10.0 9.0
484 FBGA 5.0 23.0 22.0 21.0 20.0
EPF10K50E 144 TQFP 9.0 26.0 25.0 24.0 23.0
208 PQFP 5.0 29.0 27.0 24.0 19.0
240 PQFP 4.0 25.0 22.0 20.0 17.0
256 FBGA 6.0 29.0 27.0 26.0 24.0
484 FBGA 5.0 25.0 24.0 23.0 21.0
EPF10K50S 144 TQFP 9.0 26.0 25.0 24.0 23.0
208 PQFP 5.0 29.0 28.0 25.0 20.0
240 PQFP 4.0 26.0 23.0 20.0 17.0
256 FBGA 7.0 30.0 28.0 27.0 24.0
356 BGA 1.0 12.0 11.0 10.0 9.0
484 FBGA 5.0 25.0 24.0 23.0 22.0
EPF10K70 240 RQFP 1.0 12.0 11.0 10.0 9.0
503 PGA 1.0 8.0 7.0 6.0 4.0
EPF10K100 503 PGA 1.0 8.0 7.0 6.0 4.0
PGA (1) 1.0 6.0 5.0 4.0 3.0
PGA (2) — 2.0 — — —
EPF10K100A 240 RQFP 1.0 13.0 11.0 10.0 9.0
356 BGA 1.0 12.0 11.0 10.0 9.0
484 FBGA 5.0 22.0 21.0 20.0 18.0
600 BGA 0.5 10.0 9.0 8.0 7.0
EPF10K100E 208 PQFP 5.0 28.0 26.0 23.0 18.0
240 PQFP 4.0 23.0 21.0 19.0 16.0
256 FBGA 6.0 28.0 26.0 25.0 23.0
356 BGA 1.0 12.0 11.0 10.0 9.0
484 FBGA 5.0 24.0 23.0 22.0 21.0
EPF10K130V 599 PGA 1.0 8.0 7.0 6.0 4.0
600 BGA 0.5 10.0 9.0 8.0 7.0

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
45
Thermal Resistance

Table 54. Thermal Resistance of FLEX 10K Devices (Part 3 of 3)

Pin θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPF10K130E 240 PQFP 4.0 21.0 19.0 17.0 15.0
356 BGA 1.0 12.0 11.0 10.0 9.0
484 FBGA 5.0 23.0 22.0 21.0 20.0
600 BGA 0.5 10.0 9.0 8.0 7.0
672 FBGA 5.0 21.0 20.0 19.0 18.0
EPF10K200E 599 PGA 1.0 8.0 7.0 6.0 4.0
600 BGA 0.5 10.0 9.0 8.0 7.0
672 FBGA 5.0 20.0 19.0 18.0 17.0
EPF10K200S 240 RQFP 1.0 13.0 11.0 10.0 9.0
356 BGA 1.0 12.0 11.0 10.0 9.0
484 FBGA 5.0 22.0 21.0 20.0 19.0
600 BGA 0.5 10.0 9.0 8.0 7.0
672 FBGA 5.0 21.0 20.0 19.0 18.0
EPF10K250A 599 PGA 1.0 8.0 7.0 6.0 4.0
600 BGA 0.5 10.0 9.0 8.0 7.0
Notes to Table 54:
(1) With attached pin-fin heat sink.
(2) With attached motor-driven fan heat sink.

Table 55. Thermal Resistance of FLEX 8000 Devices (Part 1 of 2)

Pin θJA (° C/W) θ JA (° C/W) θJA (° C/W) θ JA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPF8282A 84 PLCC 10.0 30.0 28.0 26.0 23.0
100 TQFP 11.0 36.0 34.0 32.0 29.0
EPF8452A 84 PLCC 10.0 30.0 28.0 26.0 23.0
100 TQFP 11.0 35.0 33.0 31.0 28.0
160 PQFP 6.0 32.0 31.0 30.0 28.0
160 PGA 6.0 20.0 13.0 10.0 8.0
EPF8636A 84 PLCC 10.0 29.0 28.0 26.0 23.0
160 PQFP 6.0 32.0 31.0 30.0 27.0
192 PGA 6.0 16.0 11.0 8.0 6.0
208 PQFP 5.0 30.0 38.0 26.0 20.0
208 RQFP 1.0 17.0 16.0 15.0 14.0
EPF8820A 144 TQFP 9.0 26.0 25.0 24.0 23.0
160 PQFP 6.0 32.0 31.0 30.0 27.0
192 PGA 6.0 16.0 11.0 8.0 6.0
208 PQFP 5.0 29.0 27.0 25.0 20.0
208 RQFP 1.0 17.0 16.0 15.0 14.0
225 BGA 6.0 28.0 19.0 14.0 11.0

Table 55. Thermal Resistance of FLEX 8000 Devices (Part 2 of 2)

EPF81188A 208 PQFP 5.0 28.0 26.0 24.0 19.0
232 PGA 2.0 14.0 10.0 7.0 5.0
240 PQFP 4.0 24.0 21.0 19.0 16.0
240 RQFP 1.0 14.0 12.0 11.0 10.0
EPF81500A 240 PQFP 4.0 22.0 20.0 19.0 16.0
240 RQFP 1.0 13.0 12.0 11.0 10.0
280 PGA 2.0 14.0 10.0 7.0 5.0
304 RQFP 1.0 11.0 10.0 9.0 8.0

Table 56. Thermal Resistance of FLEX 6000 Devices

θ JA (° C/W) θ JA (° C/W) θ JA (° C/W) θ JA (° C/W)
Device Pin Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPF6010A 100 TQFP 11.0 35.0 33.0 31.0 28.0
144 TQFP 10.0 28.0 26.0 25.0 24.0
EPF6016 144 TQFP 10.0 28.0 26.0 25.0 24.0
208 PQFP 5.0 30.0 28.0 26.0 21.0
240 PQFP 4.0 26.0 24.0 21.0 17.0
256 BGA 6.0 28.0 22.0 20.0 19.0
EPF6016A 100 TQFP 11.0 35.0 33.0 31.0 28.0
FBGA 14.0 36.0 34.0 32.0 29.0
144 TQFP 10.0 29.0 28.0 26.0 24.0
208 PQFP 5.0 30.0 29.0 26.0 21.0
256 FBGA 10.0 32.0 30.0 29.0 26.0
EPF6024A 144 TQFP 10.0 27.0 26.0 25.0 24.0
208 PQFP 5.0 29.0 28.0 26.0 20.0
240 PQFP 4.0 26.0 23.0 21.0 17.0
256 BGA 6.0 28.0 22.0 20.0 19.0
FBGA 8.0 30.0 29.0 27.0 25.0

Excalibur Embedded Processor Solutions Thermal Resistance

Table 57 provides thermal resistance values for Excalibur Embedded Processor
Solutions.

Table 57. Thermal Resistance of Excalibur Embedded Processor Solutions (Part 1 of 2)

Pin θ JA (° C/W) θ JA (° C/W) θJA (° C/W) θJA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPXA1 484 FBGA 4.0 20.0 18.3 15.8 13.9
672 FBGA, Flip Chip (Cu lid) 0.5 11.3 9.3 7.9 6.7
672 FBGA, Flip Chip (AlSiC lid) 0.8 12.2 10.2 8.6 7.2

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
47
Thermal Resistance

Table 57. Thermal Resistance of Excalibur Embedded Processor Solutions (Part 2 of 2)

Pin θ JA (° C/W) θ JA (° C/W) θJA (° C/W) θJA (° C/W)
Device Count Package θ JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
EPXA4 672 FBGA, Flip Chip (Cu lid) 0.2 10.8 8.8 7.3 6.2
672 FBGA, Flip Chip (AlSiC lid) 0.3 11.6 9.6 7.9 6.6
1,020 FBGA, Flip Chip (Cu lid) 0.2 9.9 7.9 6.5 5.4
1,020 FBGA, Flip Chip (AlSiC lid) 0.3 10.4 8.5 6.9 5.7
EPXA10 1,020 FBGA, Flip Chip (Cu lid) 0.1 9.6 7.6 6.2 5.1
1,020 FBGA, Flip Chip (AlSiC lid) 0.2 10.0 8.0 6.4 5.7

Classic Devices Thermal Resistance

Table 58 provides thermal resistance values for Classic devices.

Table 58. Thermal Resistance of Classic Devices

Device Pin Count Package θ JC (° C/W) θ JA (° C/W)
EP600I 24 PDIP 22.0 67.0
CerDIP 18.0 60.0
28 PLCC 16.0 64.0
EP610 24 CerDIP 10.0 60.0
PDIP 18.0 55.0
SOIC 17.0 77.0
28 PLCC 13.0 74.0
EP610I 24 CerDIP 18.0 60.0
PDIP 22.0 67.0
28 PLCC 16.0 64.0
EP900I 40 PDIP 23.0 49.0
44 PLCC 10.0 58.0
EP910 40 CerDIP 12.0 40.0
PDIP 23.0 49.0
44 PLCC 10.0 58.0
EP910I 40 CerDIP 17.0 44.0
PDIP 29.0 51.0
44 PLCC 16.0 55.0
EP1800I 68 PLCC 13.0 44.0
EP1810 68 JLCC 12.0 47.0
PLCC 13.0 44.0
PGA 6.0 38.0

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
49
Package Outlines

Package Outlines
The package outlines on the following pages are listed in order of ascending pin
count. Altera package outlines meet the requirements of JEDEC Publication No. 95.

1 All flip chip packages are vented packages and all wire bond packages are non-vented
packages.

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 51

8-Pin Plastic Dual In-Line Package (PDIP) — Wire Bond

■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in inches.
■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.

Package Information

Description Specification
Ordering Code Reference P
Package Acronym PDIP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-001 Variation: BA
Lead Coplanarity NA
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A – – 0.170
A1 0.015 – –
A2 0.130 TYP
D 0.360 – 0.380
E 0.300 0.310 0.325
E1 0.240 0.250 0.260
L 0.125 – 0.135
b 0.016 0.018 0.020
c 0.008 0.010 0.014
e 0.100 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
52 Altera Device Package Information Data Sheet

Package Outline

D
Pin 8

E
Pin 1 ID
Pin 4
Pin 1

c
A2

A
A1

e
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 53

8-Pin Small Outline Integrated Circuit Package (SOIC) — Wire Bond

■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in millimeters.
■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.

Package Information

Description Specification
Ordering Code Reference S
Package Acronym SOIC
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ)
Pb-free: NiPdAu (Preplated)
JEDEC Outline Reference MS-012 Variation. AA
Lead Coplanarity 0.1 mm
Weight 0.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A 1.35 – 1.75
A1 0.10 – 0.25
A2 1.25 – 1.65
D 4.90 BSC
E 6.00 BSC
E1 3.90 BSC
L 0.40 – 1.27
L1 1.04 REF
b 0.31 – 0.51
c 0.17 – 0.25
e 1.27 BSC
θ 0° – 8°

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
54 Altera Device Package Information Data Sheet

Package Outline

D
Pin 8

E
Pin 1 ID
Pin 4
Pin 1

See Detail A

Detail A
A2

e
A1

L1
C

L
0.25mm

Gage
Plane

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 55

16-Pin Small Outline Integrated Circuit Package (SOIC) — Wire Bond

Package Information

Description Specification
Ordering Code Reference S
Package Acronym SOIC
Leadframe Material Copper
Lead Finish (Plating) Pb-free: NiPdAu (Preplated)
JEDEC Outline Reference MS-013 Var. AA
Lead Coplanarity 0.1 mm
Weight 0.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A 2.35 – 2.65
A1 0.10 – 0.30
A2 2.05 – 2.55
D 10.30 BSC
E 10.30 BSC
E1 7.50 BSC
L 0.40 – 1.27
L1 1.40 REF
b 0.31 – 0.51
c 0.20 – 0.33
e 1.27 BSC
θ 0° – 8°

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
56 Altera Device Package Information Data Sheet

Package Outline

Pin 16
D

E
Pin 1 ID
Pin 8
Pin 1

See Detail A

Detail A
A2

b e
A1

L1
C
L

0.25mm
Gage
Plane

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 57

20-Pin Plastic J-Lead Chip Carrier (PLCC) Wire Bond

■ All dimensions and tolerances conform to ASME Y14.5M – 1994.
■ Controlling dimension is in inches.
■ Pin 1 is generally indicated by an indentation in the plastic body, in Pin 1's
proximity, on package surface.

Package Information

Description Specification
Ordering Code Reference L
Package Acronym PLCC
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-018 Variation: AA
Lead Coplanarity 0.004 inches (0.10mm)
Weight 0.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A 0.165 0.172 0.180
A1 0.020 – –
A2 0.150 TYP
D 0.385 0.390 0.395
D1 0.350 0.353 0.356
D2 0.290 0.310 0.330
E 0.385 0.390 0.395
E1 0.350 0.353 0.356
E2 0.290 0.310 0.330
b 0.013 – 0.021
c 0.010 TYP
e 0.050 TYP

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
58 Altera Device Package Information Data Sheet

Package Outline

D
D1
Pin 1
Pin 20

Pin 4
Pin 1 ID

E2
E
Pin 8

c
A2

b
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 59

24-Pin Ceramic Dual In-Line Package (CerDIP) —Wire Bond

■ All dimensions and tolerances conform to ASME Y14.5M – 1994.
■ Controlling dimension is in inches.
■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.

Package Information

Description Specification
Ordering Code Reference D
Package Acronym CerDIP
Leadframe Material Alloy 42
Lead Finish Regular: 63Sn:37Pb (Typ.)
JEDEC Outline Reference MS-030 Variation: AF
Lead Coplanarity NA
Weight 4.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Package Information

Description Specification
Ordering Code Reference L
Package Acronym PLCC
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-018 Variation: AB
Lead Coplanarity 0.004 inches (0.10 mm)
Weight 1.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A 0.165 0.172 0.180
A1 0.020 – –
A2 0.150 TYP
D 0.485 0.490 0.495
D1 0.450 0.453 0.456
D2 0.382 0.410 0.438
E 0.485 0.490 0.495
E1 0.450 0.453 0.456
E2 0.382 0.410 0.438
b 0.013 – 0.021
c 0.010 TYP
e 0.050 TYP

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
66 Altera Device Package Information Data Sheet

Package Outline

D
D1
Pin 1
Pin 28

Pin 5
Pin 1 ID

E2
E1

E
Pin 11

c
A2

b
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 67

32-Pin Plastic Thin Quad Flat Pack (TQFP) — Wire Bond

■ All dimensions and tolerances conform to ASME Y14.5M – 1994.
■ Controlling dimension is in millimeters.
■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.

Package Information

Description Specification
Ordering Code Reference T
Package Acronym TQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: ABA
Lead Coplanarity 0.004 inches (0.1mm)
Weight 0.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 1.20
A1 0.05 – 0.15
A2 0.95 1.00 1.05
D 9.00 BSC
D1 7.00 BSC
E 9.00 BSC
E1 7.00 BSC
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 – –
b 0.30 0.37 0.45
c 0.09 – 0.20
e 0.80 BSC
θ 0° 3.5° 7°

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
68 Altera Device Package Information Data Sheet

Package Outline

D
D1
Pin32

Pin 1

Pin 1 ID

E
Pin 8

A2
A
A1

See Detail A

Detail A
e
C
Gage
Plane

b θ
S 0.25mm
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 69

40-Pin Ceramic Dual In-Line Package (CerDIP) — Wire Bond

Package Information

Description Specification
Ordering Code Reference D
Package Acronym CerDIP
Leadframe Material Alloy 42
Lead Finish Regular: 63Sn:37Pb (Typ.)
JEDEC Outline Reference MS-032 Variation: AD
Lead Coplanarity N/A
Weight 12.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A – – 0.225
A1 0.015 0.025 0.035
D 2.030 2.050 2.070
E 0.600 0.610 0.620
E1 0.510 0.550 0.590
L 0.125 – –
b 0.016 0.018 0.020
c 0.008 0.010 0.012
e 0.100 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
70 Altera Device Package Information Data Sheet

Package Outline

Pin 40

E
Pin 1 ID

Pin 20
Pin 1

c
A
A1
e b

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 71

40-Pin Plastic Dual In-Line Package (PDIP) — Wire Bond

Package Information

Description Specification
Ordering Code Reference P
Package Acronym PDIP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
JEDEC Outline Reference MS-011 Variation: AC
Lead Coplanarity N/A
Weight 7.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A – – 0.190
A1 0.015 – –
A2 0.150 BSC
D 2.030 2.050 2.070
E 0.600 – 0.625
E1 0.520 0.540 0.560
L 0.125 – 0.135
b 0.015 0.018 0.022
c 0.008 – 0.012
e 0.100 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
72 Altera Device Package Information Data Sheet

Package Outline

Pin 40

E
Pin 1 ID

Pin 20
Pin 1

c
A2

A
A1
e b

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 73

44-Pin Plastic J-Lead Chip Carrier (PLCC) — Wire Bond

Package Information

Description Specification
Ordering Code Reference L
Package Acronym PLCC
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-018 Variation: AC
Lead Coplanarity 0.004 inches (0.10 mm)
Weight 2.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A 0.165 0.172 0.180
A1 0.020 – –
A2 0.150 TYP
D 0.685 0.690 0.695
D1 0.650 0.653 0.656
D2 0.582 0.610 0.638
E 0.685 0.690 0.695
E1 0.650 0.653 0.656
E2 0.582 0.610 0.638
b 0.013 – 0.021
c 0.010 TYP
e 0.050 TYP

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
74 Altera Device Package Information Data Sheet

Package Outline

D1
Pin 1
Pin 44

Pin 7

Pin 1 ID

E2
E
Pin 17

c
A2

b
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 75

44-Pin Plastic Quad Flat Pack (PQFP) — Wire Bond

Package Information

Description Specification
Ordering Code Reference Q
Package Acronym PQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-022 Variation: AB
Lead Coplanarity 0.004 inches (0.10 mm)
Weight 0.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 2.45
A1 – – 0.25
A2 1.80 2.00 2.20
D 13.20 BSC
D1 10.00 BSC
E 13.20 BSC
E1 10.00 BSC
L 0.73 0.88 1.03
L1 1.60 REF
S 0.20 – –
b 0.29 – 0.45
c 0.11 – 0.23
e 0.80 BSC
θ 0° – 7°

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
76 Altera Device Package Information Data Sheet

Package Outline

D1
Pin 44

Pin 1

Pin 1 ID

E
Pin 11

A
A1

See Detail A

Detail A
e
C
Gage
Plane

b θ
S 0.25mm
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 77

44-Pin Plastic Thin Quad Flat Pack (TQFP) — Wire Bond

Package Information

Description Specification
Ordering Code Reference T
Package Acronym TQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: ACB
Lead Coplanarity 0.004 inches (0.1mm)
Weight 0.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 1.20
A1 0.05 – 0.15
A2 0.95 – –
D 12.00 BSC
D1 10.00 BSC
E 12.00 BSC
E1 10.00 BSC
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 – –
b 0.30 0.37 0.45
c 0.09 – 0.20
e 0.80 BSC
θ 0° 3.5° 7°

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
78 Altera Device Package Information Data Sheet

Package Outline

D1
Pin 44

Pin 1

Pin 1 ID

E
Pin 11

See Detail A
A1

Detail A
e
C
Gage
Plane

b θ
S 0.25mm
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 79

49-Pin Ultra FineLine Ball-Grid Array (UBGA) — Wire Bond

■ All dimensions and tolerances conform to ASME Y14.5M – 1994.
■ Controlling dimension is in millimeters.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.

Package Information

Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAB-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 0.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 1.55
A1 0.20 – –
A2 – – 1.35
A3 0.70 TYP
D 7.00 BSC
E 7.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
80 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D Pin A1
Corner
7 6 5 4 3 2 1

A
Pin A1 ID

B
C

E
D

e
E
F
G

b e
A3
A2
A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 81

68-Pin Micro FineLine Ball-Grid Array (MBGA) — Wire Bond

Package Information

Description Specification
Ordering Code Reference M
Package Acronym MBGA
Substrate Material BT
Solder Ball Composition Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-195 Variation: AB
Lead Coplanarity 0.003 inch (0.08 mm)
Weight 0.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A — — 1.20
A1 0.15 — —
A2 — — 1.00
A3 0.60 REF
D 5.00 BSC
E 5.00 BSC
b 0.25 0.30 0.35
e 0.50 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
82 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D
Pin A1
Corner

Pin A1 ID

e
E

b e
A3
A2
A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 83

68-Pin Ceramic Pin-Grid Array (PGA) — Wire Bond

■ All dimensions and tolerances conform to ASME Y14.5M – 1994.
■ Controlling dimension is in inches.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.

Package Information

Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-066 Variation: AC
Lead Coplanarity N/A
Weight 10.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A 0.154 0.177 0.200
A1 0.050 TYP
A2 0.114 0.127 0.140
D 1.100 1.120 1.140
E 1.100 1.120 1.140
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
84 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D
Pin A1
11 10 9 8 7 6 5 4 3 2 1
Corner
A
B
Pin A1 ID C
D

e
E

E
F
G
H
J
K
L
A2

b
A

e
A1
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 85

68-Pin Plastic J-Lead Chip Carrier (PLCC) — Wire Bond

■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in inches.
■ Pin 1 is generally indicated by an indentation in the plastic body, in Pin 1's
proximity, on package surface.
Figure 19–1.
Package Information

Description Specification
Ordering Code Reference L
Package Acronym PLCC
Lead Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-018 Variation: AE
Lead Coplanarity 0.004 inches (0.10 mm)
Weight 5.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A 0.165 0.172 0.180
A1 0.020 – –
A2 0.150 TYP
D 0.985 0.990 0.995
D1 0.950 0.954 0.958
D2 0.882 0.910 0.938
E 0.985 0.990 0.995
E1 0.950 0.954 0.958
E2 0.882 0.910 0.938
b 0.013 – 0.021
c 0.008 TYP
e 0.050 TYP

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
86 Altera Device Package Information Data Sheet

Package Outline

D
D1
Pin 1
Pin 68

Pin 10

Pin 1 ID

E2
E
Pin 26

c
A2

b
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 87

84-Pin Plastic J-Lead Chip Carrier (PLCC) — Wire Bond

Package Information

Description Specification
Ordering Code Reference L
Package Acronym PLCC
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-018 Variation: AF
Lead Coplanarity 0.004 inches (0.10mm)
Weight 7.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A 0.165 0.172 0.180
A1 0.020 – –
A2 0.150 TYP
D 1.185 1.190 1.195
D1 1.150 1.154 1.158
D2 1.082 1.110 1.138
E 1.185 1.190 1.195
E1 1.150 1.154 1.158
E2 1.082 1.110 1.138
b 0.013 – 0.021
c 0.008 TYP
e 0.050 TYP

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
88 Altera Device Package Information Data Sheet

Package Outline

D1
Pin 1
Pin 84

Pin 12
Pin 1 ID

E2
E
Pin 32

c
A2

b
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 89

88-Pin Ultra FineLine Ball-Grid Array (UBGA) — Wire Bond

■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in millimeters.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.

Package Information

Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline MO-219
Lead Coplanarity 0.005 inches (0.12 mm)
Weight 0.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 1.40
A1 0.25 – –
A2 0.80 – –
A3 0.70 REF
D 11.00 BSC
E 8.00 BSC
b 0.40 0.45 0.50
e 0.80 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
90 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D Pin A1
Corner
12 11 10 9 8 7 6 5 4 3 2 1

A
Pin A1 ID B
C

e
D

E
E
F
G
H

A2 b e
A3

A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 91

100-Pin FineLine Ball-Grid Array (FBGA), Option 1 — Wire Bond

1 This POD is applicable to F100 packages of all products except MAX II, which is
assembled in Option 2 package outlines.

Package Information

Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder ball composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: AAC-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 1.70
A1 0.30 – –
A2 0.25 – 1.10
A3 – – 0.80
D 11.00 BSC
E 11.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
92 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D
Pin A1
Corner

Pin A1 ID

e
E

b e
A3
A2
A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 93

100-Pin FineLine Ball-Grid Array (FBGA), Option 2 — Wire Bond

Detail A
e
C
Gage
Plane

b
S 0.25mm
L
L1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 99

100-Pin Plastic Thin Quad Flat Pack (TQFP) — Wire Bond

Package Information

Description Specification
Ordering Code Reference T
Package Acronym TQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: AED
Lead Coplanarity 0.003 inches (0.08mm)
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 1.20
A1 0.05 – 0.15
A2 0.95 1.00 1.05
D 16.00 BSC
D1 14.00 BSC
E 16.00 BSC
E1 14.00 BSC
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 – –
b 0.17 0.22 0.27
c 0.09 – 0.20
e 0.50 BSC
θ 0° 3.5° 7°

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
100 Altera Device Package Information Data Sheet

Package Outline

D1
Pin 100

Pin 1

Pin 1 ID

E
Pin 25

A
A1

See Detail A

Detail A
e
C
Gage
Plane

b θ
S 0.25mm
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 101

144-Pin Plastic Enhanced Quad Flat Pack (EQFP) — Wire Bond

Package Information

Description Specification
Ordering Code Reference E
Package Acronym EQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: BFB
Lead Coplanarity 0.003 inches (0.08mm)
Weight 1.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 1.60
A1 0.05 – 0.15
A2 1.35 1.40 1.45
D 22.00 BSC
D1 20.00 BSC
D2 4.00 – –
E 22.00 BSC
E1 20.00 BSC
E2 4.00 – –
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 – –
b 0.17 0.22 0.27
c 0.09 – 0.20
e 0.50 BSC
θ 0° 3.5° 7°

b θ
S 0.25mm
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 109

148-Pin Quad Flat No-Lead Package (QFN) — Wire Bond

Package Information

Description Specification
Ordering Code Reference N
Package Acronym QFN
Substrate Material Tape
Solder Ball Composition Pb-free: NiAu
JEDEC Outline Reference MO-247 Variation: BWQQB
Lead Coplanarity 0.003 inches (0.08mm)
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A 0.70 0.75 0.80
A1 0.00 0.01 0.05
D 11.00 BSC
D1 8.35 8.40 8.45
D2 6.85 6.90 6.95
E 11.00 BSC
E1 8.35 8.40 8.45
E2 5.65 5.70 5.75
d 0.20 0.25 0.30
eT 0.50 BSC
eR 0.65 BSC
k 0.20 — —
L 0.25 0.30 0.35
L1 0.05 0.10 0.15

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
110 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D
D1 Pin A1
D2 Corner
D

Pin 1 ID

E2
E1
E

E
See Detail A
A
A1

L
L

k
d

eR d

k
eT d L1
k
L1

Detail A

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 111

160-Pin Ceramic Pin-Grid Array (PGA) — Wire Bond

Package Information

Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-067 Variation: AG
Lead Coplanarity N/A
Weight 19.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A 0.160 0.190 0.220
A1 0.050 TYP
A2 0.120 0.140 0.160
D 1.540 1.560 1.580
E 1.540 1.560 1.580
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
112 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D
Pin A1
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Corner

A
B
Pin A1 ID C
D

e
E
F
G

E
H
J
K
L
M
N
P
R

b e
A2

A
A1
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 113

160-Pin Plastic Quad Flat Pack (PQFP) — Wire Bond

Package Information

Description Specification
Ordering Code Reference Q
Package Acronym PQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-022 Variation: DD-1
Lead Coplanarity 0.004 inches (0.10mm)
Weight 6.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 4.10
A1 0.25 – 0.50
A2 3.20 3.40 3.60
D 31.20 BSC
D1 28.00 BSC
E 31.20 BSC
E1 28.00 BSC
L 0.50 – 1.03
L1 1.60 REF
S 0.20 – –
b 0.22 – 0.40
c 0.09 – 0.23
e 0.65 BSC
θ 0° – 7°

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
114 Altera Device Package Information Data Sheet

Millimeters
Symbol
Min. Nom. Max.
A 1.25 1.40 1.55
A1 0.30 0.35 0.40
A2 0.85 1.05 1.25
A3 0.60 0.70 0.80
D 14.00 BSC
E 14.00 BSC
b 0.45 0.50 0.55
e 1.00 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
120 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D Pin A1
Corner

Pin A1 ID

e
E

A2 b e
A3

A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 121

169-Pin Ultra FineLine Ball-Grid Array (UBGA) — Wire Bond

Package Information

Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAF-1
Lead Coplanarity 0.005 inches (0.12mm)
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 1.70
A1 0.20 – –
A2 0.65 – –
A3 0.70 TYP
D 11.00 BSC
E 11.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
122 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D Pin A 1
Corner
13 12 11 10 9 8 7 6 5 4 3 2 1

A
Pin A1 ID B
C
D

e
E
F

E
G
H
J
K
L
M
N

b e
A3
A2
A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 123

192-Pin Ceramic Pin-Grid Array (PGA) — Wire Bond

Package Information

Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-067 Variation: AJ
Lead Coplanarity N/A
Weight 21.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A 0.167 0.192 0.217
A1 0.050 TYP
A2 0.127 0.142 0.157
D 1.740 1.760 1.780
E 1.740 1.760 1.780
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
124 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D
Pin A1
17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Corner
A
B
Pin A1 ID C
D

e
E
F
G
H

E
J
K
L
M
N
P
R
T
U

b e
A2
A
A1
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 125

208-Pin Plastic Quad Flat Pack (PQFP) — Wire Bond

■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in millimeters.
■ Pin 1 may be indicated by an ID dot in its proximity on package surface.

Package Information

Description Specification
Ordering Code Reference Q
Package Acronym PQFP
Lead Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: FA-1
Lead Coplanarity 0.003 inches (0.08 mm)
Weight 6.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 4.10
A1 0.25 – 0.50
A2 3.20 3.40 3.60
D 30.60 BSC
D1 28.00 BSC
E 30.60 BSC
E1 28.00 BSC
L 0.50 0.60 0.75
L1 1.30 REF
S 0.20 – –
b 0.17 – 0.27
c 0.09 – 0.20
e 0.50 BSC
θ 0° 3.5° 8°

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
126 Altera Device Package Information Data Sheet

Package Outline

D
D1
Pin 208

Pin 1

Pin 1 ID

E
Pin 52
A2
A

See Detail A
A1

Detail A
e
C
Gage
Plane

b
S 0.25mm
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 127

208-Pin Power Quad Flat Pack (RQFP) — Wire Bond

Package Information

Description Specification
Ordering Code Reference R
Package Acronym RQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: FA-1
Lead Coplanarity 0.003 inches (0.08mm)
Weight 11.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 4.10
A1 0.25 – 0.50
A2 3.20 3.40 3.60
D 30.60 BSC
D1 28.00 BSC
E 30.60 BSC
E1 28.00 BSC
L 0.45 0.60 0.75
L1 1.30 REF
S 0.20 – –
b 0.17 – 0.27
c 0.09 – 0.20
e 0.50 BSC
θ 0° 3.5° 8°

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
128 Altera Device Package Information Data Sheet

Package Outline

D1
Pin 208

Pin 1

Pin 1 ID

E
Pin 52

A
A1

See Detail A

Detail A
e
C
Gage
Plane

b θ
S 0.25mm
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 129

232-Pin Ceramic Pin-Grid Array (PGA) — Wire Bond

Package Information

Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-067 Variation: AJ
Lead Coplanarity N/A
Weight 25.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A 0.174 0.192 0.210
A1 0.050 TYP
A2 0.134 0.142 0.150
D 1.740 1.760 1.780
E 1.740 1.760 1.780
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
130 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D
Pin A1
17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Corner

A
B
Pin A1 ID C
D

e
E
F
G
H

E
J
K
L
M
N
P
R
T
U

b e
A2
A
A1
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 131

240-Pin Plastic Quad Flat Pack (PQFP) — Wire Bond

Package Information

Description Specification
Ordering Code Reference Q
Package Acronym PQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: GA
Lead Coplanarity 0.003 inches (0.08mm)
Weight 8.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 4.10
A1 0.25 – 0.50
A2 3.20 3.40 3.60
D 34.60 BSC
D1 32.00 BSC
E 34.60 BSC
E1 32.00 BSC
L 0.45 0.60 0.75
L1 1.30 REF
S 0.20 – –
b 0.17 – 0.27
c 0.09 – 0.20
e 0.50 BSC
θ 0° 3.5° 8°

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
132 Altera Device Package Information Data Sheet

Package Outline

D1
Pin 240

Pin 1

Pin 1 ID

E
Pin 60

A
A1

See Detail A

Detail A
e
C
Gage
Plane

b θ
S 0.25mm
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 133

240-Pin Power Quad Flat Pack (RQFP) — Wire Bond

Package Information

Description Specification
Ordering Code Reference R
Package Acronym RQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: GA
Lead Coplanarity 0.003 inches (0.08mm)
Weight 15.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
134 Altera Device Package Information Data Sheet

Package Outline

D
D1
Pin 240

Pin 1

Pin 1 ID

E
Pin 60

A
A1

See Detail A

Detail A
e
C
Gage
Plane

b θ
S 0.25mm
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 135

256-Pin Ball-Grid Array (BGA), Option 1 — Wire Bond

Package Information

Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT or tape
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: BAL-2
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 4.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 1.70
A1 0.35 – –
A2 0.25 – 1.10
D 27.00 BSC
E 27.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
136 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D 20 18 16 14 12 10 8 6 4 2 Pin A1
19 17 15 13 11 9 7 5 3 1 Corner

A
B
Pin A1 ID
C
D
E
F
G

e
H
J
K

E
L
M
N
P
R
T
U
V
W
Y

b e
A2
A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 137

256-Pin Plastic Ball-Grid Array (BGA), Option 2 — Wire Bond

Package Information

Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAL-2
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 2.60
A1 0.35 – –
A2 – – 2.20
A3 – – 1.80
D 27.00 BSC
E 27.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
138 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

Pin A1
D Corner
20 18 16 14 12 10 8 6 4 2
19 17 15 13 11 9 7 5 3 1

A
B
C
D
E
Pin A1 ID F

e
G
H
J
K

E
L
M
N
P
R
T
U
V
W
Y

b e
A3
A2
A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 139

256-Pin FineLine Ball-Grid Array (FBGA), Option 1 — Wire Bond

1 This POD is applicable to F256 packages of all products except Cyclone II and III,
which is assembled in Option 2 package outlines.

Package Information

Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAF-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 1.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 2.20
A1 0.30 – –
A2 – – 1.80
A3 0.70 REF
D 17.00 BSC
E 17.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
140 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D Pin A1
Corner

Pin A1 ID

e
E

b e
A2
A3

A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 141

256-Pin FineLine Ball-Grid Array (FBGA), Option 2 — Wire Bond

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 147

280-Pin Ceramic Pin-Grid Array (PGA) — Wire Bond

Package Information

Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-067 Variation: AL
Lead Coplanarity N/A
Weight 29.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A 0.165 0.185 0.205
A1 0.050 TYP
A2 0.125 0.135 0.145
D 1.940 1.960 1.980
E 1.940 1.960 1.980
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
148 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D
Pin A1
19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Corner

A
B
Pin A1 ID C
D
E
F

e
G
H
J

E
K
L
M
N
P
R
T
U
V
W

b e
A2
A
A1
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 149

304-Pin Power Quad Flat Pack (RQFP) — Wire Bond

Package Information

Description Specification
Ordering Code Reference R
Package Acronym RQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: JA
Lead Coplanarity 0.003 inches (0.08mm)
Weight 26.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 4.50
A1 0.25 – 0.50
A2 3.55 3.80 4.05
D 42.60 BSC
D1 40.00 BSC
E 42.60 BSC
E1 40.00 BSC
L 0.45 0.60 0.75
L1 1.30 REF
S 0.20 – –
b 0.17 – 0.27
c 0.09 – 0.20
e 0.50 BSC
θ 0° 3.5° 8°

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
150 Altera Device Package Information Data Sheet

Millimeters
Symbol
Min. Nom. Max.
A – – 1.70
A1 0.25 – –
A2 0.80 - 1.10
A3 0.80 TYP
D 17.00 BSC
E 17.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
158 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

Pin A1 ID

e
E

b e
A3
A2
A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 165

403-Pin Ceramic Pin-Grid Array (PGA) — Wire Bond

Package Information

Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-128 Variation: AL
Lead Coplanarity N/A
Weight 47.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A 0.157 0.180 0.203
A1 0.050 TYP
A2 0.117 0.130 0.143
D 1.940 1.960 1.980
E 1.940 1.960 1.980
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
166 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
172 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

Pin A1 ID

e
E

b e
A2
A3

A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 185

503-Pin Ceramic Pin-Grid Array (PGA) — Wire Bond

■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in inches.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.

Package Information

Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-128 Variation: AN
Lead Coplanarity N/A
Weight 59.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Inches
Symbol
Min. Nom. Max.
A – – 0.205
A1 0.050 TYP
A2 – – 0.145
D 2.245 2.260 2.275
E 2.245 2.260 2.275
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
186 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D
42 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 Pin A1
43 41 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 Corner
A
B
C
D
Pin A1 ID E
F
G
H
J
K
L
M

e
N
P
R
T
U
V
W
Y
AA

E
AB

1
AC

2
AD

e
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
AY
BA
BB
BC

1
b 2 e e
A2
A
A1
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 187

572-Pin FineLine Ball-Grid Array (FBGA) — Flip Chip

Package Information

Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAK-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 6.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 3.50
A1 0.30 – –
A2 0.25 – 3.00
A3 – – 2.50
D 25.00 BSC
D1 19.00 BSC
E 25.00 BSC
E1 19.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
188 Altera Device Package Information Data Sheet

Package Outline

D
46 44 42 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 Pin A1
47 45 43 41 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 Corner
A
B
C
D
Pin A1 ID E
F
G
H
J
K
L
M

e
N
P
R
T
U
V
W
Y
AA
AB
AC

E
AD

1
AE

2
AF

e
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
AY
BA
BB
BC
BD
BE
BF
BG

1
b 2 e e
A2
A
A1
L

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 199

600-Pin Ball-Grid Array (BGA) — Wire Bond

Package Information

Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT or tape
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: BAW-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 12.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 2.00
A1 0.35 – –
A2 0.25 – 1.10
D 45.00 BSC
E 45.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
200 Altera Device Package Information Data Sheet

Package Outline

Package Outline

TOP VIEW BOTTOM VIEW

TOP VIEW BOTTOM VIEW

D
D1 Pin A1
Corner

e
Pin A1
ID

E1
E

b e
A3
A2
A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 245

780-Pin FineLine Ball-Grid Array (FBGA) — Flip Chip — Channel Lid (EP4SGX230)
■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in millimeters.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.

Package Information

Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 9.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A 3.05 3.25 3.45
A1 0.40 0.50 0.60
A2 2.45 2.75 3.05
A3 1.45 1.55 1.65
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
246 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D Pin A1
Corner

Pin A1 ID

e
E

b e
A3
A2
A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 247

780-Pin FineLine Ball-Grid Array (FBGA) — Flip Chip — Single-Piece Lid (HC325)
■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in millimeters.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.

Package Information

Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 8.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A 2.80 3.05 3.30
A1 0.40 0.50 0.60
A2 2.20 2.55 2.90
A3 1.20 1.40 1.60
D 29.00 BSC
D1 21.00 BSC
E 29.00 BSC
E1 21.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
248 Altera Device Package Information Data Sheet

Package Outline

D Pin A1
Corner

Pin A1 ID

e
E

b e
A3

A2
A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 291

1152-Pin Hybrid FineLine Ball-Grid Array (HBGA), Option 1 — Flip Chip

Package Information

Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 20.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 3.50
A1 0.30 – –
A2 0.25 – 3.00
A3 – – 2.50
D 40.00 BSC
E 40.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
292 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

TOP VIEW BOTTOM VIEW

D
D1 Pin A1
Corner

D Pin A1
Corner

Pin A1 ID

e
E

b e
A3

A2
A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 307

1508-Pin FineLine Ball-Grid Array (FBGA), Option 2 — Flip Chip

Package Information

Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 17.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Millimeters
Symbol
Min. Nom. Max.
A – – 3.50
A1 0.30 – –
A2 0.25 – 3.00
A3 – – 2.50
D 40.00 BSC
D1 30.00 BSC
E 40.00 BSC
E1 30.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC

© December 2009 Altera Corporation Altera Device Package Information Data Sheet
308 Altera Device Package Information Data Sheet

Package Outline

TOP VIEW BOTTOM VIEW

D Pin A1
Corner

Pin A1 ID

e
E

b e
A3
A2
A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 329

1517-Pin Hybrid FineLine Ball-Grid Array (HBGA), Option 2 — Flip Chip

Package Information

Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV -1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 22.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Package Outline

TOP VIEW BOTTOM VIEW

D Pin A1
Corner

Pin A1 ID

e
E

b e
A3
A2
A
A1

Altera Device Package Information Data Sheet © December 2009 Altera Corporation
Altera Device Package Information Data Sheet 341

1760-Pin FineLine Ball-Grid Array (FBGA), Option 2— Flip Chip

Package Information

Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 22.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag

Package Outline Dimension Table

Table 59. Document Revision History (1) (Part 3 of 4)

Date and Document
Version Changes Made Summary of Changes
March 2009 ■ Fixed theta symbols in several data sheet Dimension Tables Updated for version 15.5
■ Updated dimensions in 256-Pin UBGA Data Sheet
■ Added 358-Pin UBGA Data Sheet, 572-Pin, 780-Pin Option 3, and
1152-Pin Option 2 FBGA Data Sheets
■ Added Arria II GX thermal resistance table
■ Added Arria II GX device and package cross-reference table
■ Added EP3SL50, EP3SE80, and EP3SL110 devices to Stratix III
thermal resistance table
■ Added EP4SGX70, EP4SGX180, and EP4SGX290 devices and
updated Stratix IV GX thermal resistance table
■ Added HardCopy III and HardCopy IV thermal resistance table
■ Miscellaneous formatting changes
December 2008 ■ Changed dimension “A” Max. value in 1932-Pin FBGA Data Sheet Updated for version 15.4
November 2008 ■ Moved Revision History to the end and added “How to Contact Altera” Updated for version 15.3
section
■ Added subheadings in Thermal Resistance section
■ Converted to 8-1/2 x 11 page size
■ Changed “Maximum Lead Coplanarity” to “Lead Coplanarity” and
added “(Typ.)” to weights for all packages
■ Added EP2C15 information to Cyclone II tables
September 2008 ■ Added thermal resistance values for Stratix IV Updated for version 15.2
■ Added new 1152-Pin HBGA Option 2 (42.5 MM SQ.) Data Sheet
■ Added new 1517-Pin HBGA (42.5 MM SQ.) Data Sheet
■ Added theta-JB thermal resistance values for Stratix II
■ Added HardCopy II thermal resistance values
■ Revised weights for 256-Pin BGA Option 2, 652-Pin BGA Option 2,
652-Pin BGA Option 3, 208-Pin RQFP, 240-Pin RQFP, and 304-Pin
RQFP Data Sheets
■ Added notes to 1152-Pin FBGA, 1517-Pin FBGA, 1760-Pin FBGA;
changed dimension “A” thickness and “A2” thickness in 1932-Pin
FBGA Data Sheet
May 2008 ■ Added 1932-Pin FBGA Data Sheet Updated for version 15.1
■ Added Device and Package Cross Reference table for Stratix IV
April 2008 ■ Revised Maximum Lead Coplanarity values for 1517-Pin FBGA and Updated for version 15.0
1760-Pin FBGA Data Sheets
■ Added three entries to Table 3
■ Corrected minor typos in Table 4 and Table 10
■ Corrected HC210W package in Table 12
■ Many tables updated for formatting consistency

Table 59. Document Revision History (1) (Part 4 of 4)

Date and Document
Version Changes Made Summary of Changes
February 2008 ■ Added 164-Pin MBGA information in Table 8 Updated for version 14.9
■ Added HardCopy II device information in Table 12
■ Updated Stratix III thermal resistance values in Table 22
■ Added 164-Pin MBGA Data Sheet
■ Corrected 8-Pin SOIC Data Sheet (changed “B” to “b” in Package
Outline Dimension Table)
■ Corrected 68-Pin MBGA Data Sheet (changed “Inches” to
“Millimeters” in Package Outline Dimension Table)
October 2007 ■ Removed note from 100-Pin PQFP Option 1 Data Sheet Updated for version 14.8
■ Removed 100-Pin PQFP Option 2 Data Sheet
■ Updated 88-Pin UBGA, 144-Pin EQFP, 256-Pin FBGA Option 1, 256-
Pin FBGA Option 2, 256-Pin UBGA, 1517-Pin FBGA, and 1760-Pin
FBGA Data Sheets
■ Added 780-Pin HBGA and 1152-Pin HBGA Data Sheets
May 2007 v14.7 ■ Added Arria™ GX information Changes and additions as
■ Added Cyclone III tables described in “Changes
Made” section
■ Revised D2 and E2 dimensions for 144-Pin EQFP
■ Revised 100-Pin MBGA - Wire Bond and 256-Pin MBGA - Wire Bond
■ Added 780-Pin FBGA option 2 - Wire Bond,
256-Pin UBGA - Wire Bond, 68-Pin MBGA - Wire Bond, and 144-Pin
MBGA - Wire Bond
February 2007 ■ Updated 144-Pin Plastic Thin Quad Flat Pack (TQFP) Data Sheet to Revised one data sheet
v14.6 correct title and ordering code reference (144-Pin Plastic Thin Quad
■ Added revision history Flat Pack (TQFP) Data
Sheet), added revision
history
December 2006 ■ Table 2 was added for Stratix III Device and Package Cross-Reference Added Tables for Stratix
v14.5 ■ Tables 16, 17, and 18 were added for Stratix III Thermal Resistance III, updated other data
information sheets

■ 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was
added
■ 1760-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was
added
■ "Wire Bond" and "Flip Chip" was added to title of each data sheet, as
appropriate
■ "BGA" was spelled out as "Ball-Grid Array" in all titles
■ Some package outline drawings were reformatted
■ Weights were updated for many packages
Note to Table 59:
(1) Formal revision history for this document began with version 14.5.

How to Contact Altera

For the most up-to-date information about Altera ® products, see the following table.

Contact
Contact (Note 1) Method Address
Technical support Website www.altera.com/support
Technical training Website www.altera.com/training
Email custrain@altera.com
Altera literature services Email literature@altera.com
Non-technical support (General) Email nacomp@altera.com
(Software Licensing) Email authorization@altera.com
Note:
(1) You can also contact your local Altera sales office or sales representative.

Copyright © December 2009. Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company,
the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks
and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera Corporation in the U.S.
and other countries. All other product or service names are the property of their respective holders. Altera products
101 Innovation Drive are protected under numerous U.S. and foreign patents and pending applications, maskwork rights, and copyrights.
San Jose, CA 95134 Altera warrants performance of its semiconductor products to current specifications in accordance with Altera's
www.altera.com standard warranty, but reserves the right to make changes to any products and services at any time without notice.
Technical Support Altera assumes no responsibility or liability arising out of the application or use of any information,
www.altera.com/support product, or service described herein except as expressly agreed to in writing by Altera Corporation.
Altera customers are advised to obtain the latest version of device specifications before relying on any
published information and before placing orders for products or services.

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