19-1120; Rev 0; 9/96

±15kV ESD-Protected, EMC-Compliant,

230kbps, 3-Tx/3-Rx RS-232 IC
_______________General Description ____________________________Features

MAX1406
The MAX1406 is an RS-232 IC designed to meet the ♦ Enhanced ESD Protection:
stringent electrostatic discharge (ESD) requirements of ±15kV Human Body Model
the European community. All transmitter outputs and
receiver inputs are protected to ±15kV using IEC1000-4-2 ±8kV IEC1000-4-2, Contact Discharge
Air-Gap Discharge, ±8kV using IEC 1000-4-2 Contact ±15kV IEC1000-4-2, Air-Gap Discharge
Discharge, and ±15kV using the Human Body Model.
♦ Latchup Free During an ESD Event
The MAX1406 has three RS-232 transmitters and three
RS-232 receivers, and is optimized for operation in ♦ 16-Pin SSOP or SO Packages
printer, modem, and telecom applications. It is guaran- ♦ Guaranteed 230kbps Data Rate
teed to run at data rates up to 230kbps, providing com- ♦ Flow-Through Pinout
patibility with popular software for communicating with
personal computers. Power-supply current is less than ♦ Pin Compatible with MC145406
500µA for IDD and ISS, and less than 1mA for ICC.
The MAX1406 is pin and functionally compatible with the ______________Ordering Information
industry-standard MC145406, so existing designs can PART TEMP. RANGE PIN-PACKAGE
instantly become Electromagnetic Compatibility (EMC)
MAX1406CPE 0°C to +70°C 16 Plastic DIP
compliant. The MAX1406 is available in DIP and SO pack-
ages, and in a tiny SSOP that reduces board space. MAX1406CWE 0°C to +70°C 16 Wide SO
MAX1406CAE 0°C to +70°C 16 SSOP
MAX1406C/D 0°C to +70°C Dice*
MAX1406EPE -40°C to +85°C 16 Plastic DIP
________________________Applications MAX1406EWE -40°C to +85°C 16 Wide SO
MAX1406EAE -40°C to +85°C 16 SSOP
Telecommunications
*Dice are specified at TA = +25°C, DC parameters only.
Modems
Printers ________________Functional Diagram
Instruments
+5V
Equipment Meeting IEC1000-4-2
0.1µF

-12V
__________________Pin Configuration +12V
VDD VCC VSS
0.1µF 0.1µF
MAX1406
TOP VIEW T1IN T1OUT
T1
VDD 1 16 VCC
T2IN T2OUT
R1IN 2 15 R1OUT T2

T1OUT 3 14 T1IN T3IN T3OUT

T3
R2IN 4 MAX1406 13 R2OUT
R1OUT R1IN
R1
T2OUT 5 12 T2IN
R3IN 6 11 R3OUT R2OUT R2IN
R2
T3OUT 7 10 T3IN
R3OUT R3IN
R3
VSS 8 9 GND
GND
DIP/SO/SSOP

________________________________________________________________ Maxim Integrated Products 1

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 ±15kV ESD-Protected, EMC-Compliant,
230kbps, 3-Tx/3-Rx RS-232 IC
ABSOLUTE MAXIMUM RATINGS
MAX1406

VCC ...........................................................................-0.3V to +7V Continuous Power Dissipation (TA = +70°C)

VDD .........................................................................-0.3V to +14V DIP (derate 10.53mW/°C above +70°C) .......................842mW
VSS..........................................................................+0.3V to -14V Wide SO (derate 20.00mW/°C above +70°C)...................1.6W
Input Voltages SSOP (derate 8.00mW/°C above +70°C) .....................640mW
TIN .........................................................................-0.3V to +6V Operating Temperature Ranges
RIN ....................................................................................±30V MAX1406C_E .......................................................0°C to +70°C
Output Voltages MAX1406E_E ....................................................-40°C to +85°C
TOUT ..................................................................................±15V Storage Temperature Range ............................-65°C to +160°C
ROUT ........................................................-0.3V to (VCC + 0.3V) Lead Temperature (soldering, 10sec) ............................+300°C
Short-Circuit Duration
TOUT (one at a time)................................................Continuous
ROUT (one at a time)................................................Continuous

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS
(VCC = +4.5V to +5.5V, VDD = +10.8V to +13.2V, VSS = -10.8V to -13.2V, TA = TMIN to TMAX, unless otherwise noted. Typical values
are at TA = +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC CHARACTERISTICS
VCC 4.5 5.5
Operating Voltage Range VDD 10.8 13.2 V
VSS -13.2 -10.8
ICC 230 1000
Supply Current IDD No load 185 500 µA
ISS 185 500
LOGIC
Input Logic Threshold Low VILT T_IN 0.8 V
Input Logic Threshold High VIHT T_IN 2.0 V
Input Leakage Current 0.01 1 µA
Output Voltage Low VOLR R_OUT; ISINK = 3.2mA 0.4 V
Output Voltage High VOHR R_OUT; ISOURCE = 1mA VCC - 0.6 V
TRANSMITTER OUTPUTS
VDD = 7.0V, VSS = -7.0V, RL = 3kΩ ±5.0
Output Voltage Swing V
VDD = 12V, VSS = -12V, RL = 3kΩ ±9.5
Transmitter Output Resistance VCC = VDD = VSS = 0V, VT_OUT = ±2V 300 Ω
RS-232 Output Short-Circuit
±35 ±60 mA
Current
RECEIVER INPUTS
Receiver Input Voltage
-25 +25 V
Operating Range
RS-232 Input Threshold Low 0.75 V
RS-232 Input Threshold High 2.4 V
RS-232 Input Hysteresis 0.65 V

2 _______________________________________________________________________________________
 ±15kV ESD-Protected, EMC-Compliant,
230kbps, 3-Tx/3-Rx RS-232 IC
ELECTRICAL CHARACTERISTICS (continued)

MAX1406
(VCC = +4.5V to +5.5V, VDD = +10.8V to +13.2V, VSS = -10.8V to -13.2V, TA = TMIN to TMAX, unless otherwise noted. Typical values
are at TA = +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RECEIVER INPUTS (continued)
RS-232 Input Resistance 3 5 7 kΩ
Receiver Output Short-Circuit
±10 mA
Current
ESD CHARACTERISTICS
Human Body Model ±15
ESD Protection IEC1000-4-2 (Contact Discharge) ±8 kV
IEC1000-4-2 (Air-Gap Discharge) ±15

TIMING CHARACTERISTICS
(TA = +25°C, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Transmitter Output Propagation
tPLHT VDD = 12V, VSS = -12V, RL = 3kΩ, CL = 1000pF 4 µs
Delay, Low to High

Transmitter Output Propagation

tPLHT VDD = 12V, VSS = -12V RL = 3kΩ, CL = 1000pF 4 µs
Delay, High to Low

Transmitter Propagation Delay

tSKT VDD = 12V, VSS = -12V RL = 3kΩ, CL = 1000pF 0.4 µs
Skew, |tPLHT - tPHLT|

CL = 150pF to
VDD = 12V, VSS = -12V, 4 12 30
2500pF
Transition Output Slew Rate SR RL = 3kΩ to 7kΩ, measured V/µs
from +3V to -3V or -3V to +3V CL = 50pF to
8 12 30
1000pF

Receiver Output Propagation

tPLHR VCC = 5V, CL = 50pF 4.0 µs
Delay, Low to High

Receiver Output Propagation

tPHLR VCC = 5V, CL = 50pF 4.0 µs
Delay, High to Low

Receiver Propagation Delay

tSKR VCC = 5V, CL = 50pF 0.4 µs
Skew, |tPLHR - tPHLR|
CL = 150pF to
120
VCC = 5V, VDD = 12V, 2500pF
Guaranteed Data Rate DR kbps
VSS = -12V, RL = 3kΩ to 7kΩ CL = 50pF to
230
1000pF

_______________________________________________________________________________________ 3
 ±15kV ESD-Protected, EMC-Compliant,
230kbps, 3-Tx/3-Rx RS-232 IC
__________________________________________Typical Operating Characteristics
MAX1406

(VCC = +5.0V, VDD = +12.0V, VSS = -12.0V, TA = +25°C, unless otherwise noted.)

SUPPLY CURRENT SUPPLY CURRENT

vs. SUPPLY VOLTAGE vs. LOAD CAPACITANCE
20 25

MAX1406 TOC-2
MAX1406 TOC-1
IDD, 240kbps IDD, 240kbps
15 20
IDD, 120kbps IDD, 120kbps
15
10

SUPPLY CURRENT (mA)

SUPPLY CURRENT (mA)

IDD, 20kbps 10 IDD, 20kbps

5 1 TRANSMITTER AT DATA RATE 5
ICC 2 TRANMITTERS AT DATA RATE/16 ICC 3kΩ + CL
0 0
3kΩ + 2500pF LOAD 1 TRANSMITTER AT DATA RATE
-5 ISS, 20kbps -5 2 TRANMITTERS AT DATA RATE/16

ISS, 120kbps -10 ISS, 20kbps

-10
-15 ISS, 120kbps
ISS, 240kbps
-15
-20
ISS, 240kbps
-20 -25
10.8 11.4 12.0 12.6 13.2 0 1000 2000 3000 4000 5000
SUPPLY VOLTAGE (V) LOAD CAPACITANCE (pF)

SLEW RATE TRANSMITTER OUTPUT VOLTAGE

vs. LOAD CAPACITANCE vs. LOAD CAPACITANCE
16 12.5

MAX1406 TOC-3
MAX1406 TOC-4

120kbps
TRANSMITTER OUTPUT VOLTAGE (V)

14 10.0
7.5 240kbps
12
FALL 5.0
SLEW RATE (V/µs)

10 RISE 2.5
1 TRANSMITTER AT DATA RATE
8 0 2 TRANMITTERS AT DATA RATE/16
3kΩ + CL LOAD
6 -2.5
1 TRANSMITTER AT DATA RATE 240kbps
2 TRANMITTERS AT DATA RATE/16 -5.0
4
3kΩ + CL LOAD -7.5
2 120kbps
-10.0
0 -12.5
0 1000 2000 3000 4000 5000 0 1000 2000 3000 4000 5000
LOAD CAPACITANCE (pF) LOAD CAPACITANCE (pF)

4 _______________________________________________________________________________________
 ±15kV ESD-Protected, EMC-Compliant,
230kbps, 3-Tx/3-Rx RS-232 IC
______________________________________________________________Pin Description

MAX1406
PIN NAME FUNCTION

1 VDD Supply-Voltage Input, +10.8V to +13.2V

3, 5, 7 T1OUT, T2OUT,T3OUT Transmitter Outputs, swing between VDD and VSS

2, 4, 6 R1IN, R2IN, R3IN Receiver Inputs

8 VSS Supply-Voltage Input, -10.8V to -13.2V

9 GND Ground. Connect to system ground.

10, 12, 14 T3IN, T2IN, T1IN Transmitter Inputs. Tie unused inputs to GND or VCC.

11, 13, 15 R3OUT, R2OUT, R1OUT Receiver Outputs, swing between GND and VCC

16 VCC Supply-Voltage Input, +4.5V to +5.5V

When the power is off, the MAX1406 outputs are permit-

3.0V ted to be driven up to ±15V. The transmitter inputs do
DRIVER
INPUT 1.5V not have internal pull-up resistors. Connect unused
0V
inputs to GND or VCC.
tPHL tPLH
VOH RS-232 Receivers
The receiver inputs invert and convert the RS-232 sig-
nals to CMOS-logic output levels. The MAX1406 has
3.3V
3.0V
hysteresis of 650mV. The receiver output swings
VOUT 0V
between GND and VCC.

-3.0V ±15kV ESD Protection

-3.3V As with all Maxim devices, electrostatic discharge
(ESD) protection structures are incorporated on all pins
to protect against ESD encountered during handling
tF2 tR2
VOL
and assembly. The MAX1406 driver outputs and receiv-
tF1 tR1 er inputs have extra protection against static electricity
found in normal operation. Maxim’s engineers devel-
oped state-of-the-art structures to protect these pins
against ±15kV ESD without damage. After an ESD
event, the MAX1406 continues working without latchup.
SIGNAL RL CL
GENERATOR ESD protection can be tested in several ways. The
transmitter outputs and the receiver inputs are charac-
terized for protection to the following:
1) ±15kV using the Human Body Model
Figure 1. Slew-Rate Test Circuit and Timing Diagram 2) ±8kV using the Contact-Discharge method specified
in IEC1000-4-2 (formerly IEC801-2)
_______________Detailed Description
3) ±15kV using the Air-Gap Discharge method speci-
RS-232 Transmitters fied in IEC1000-4-2 (formerly IEC801-2)
The transmitters are inverting level translators that con-
vert CMOS-logic input levels to an EIA/TIA-232 voltage ESD Test Conditions
between ±5V and ±13.2V, into a load between 3kΩ and ESD performance depends on a number of conditions.
7kΩ. The MAX1406 guarantees a 230kbps data rate Contact Maxim for a reliability report that documents
with a worst-case load of 3kΩ and 1000pF, providing test setup, methodology, and results.
compatibility with PC-to-PC communication software.

_______________________________________________________________________________________ 5
 ±15kV ESD-Protected, EMC-Compliant,
230kbps, 3-Tx/3-Rx RS-232 IC
Human Body Model ESD withstand voltage measured to this standard is
MAX1406

Figure 2a shows the Human Body Model, and Figure generally lower than that measured using the Human
2b shows the current waveform it generates when dis- Body Model. Figure 3b shows the current waveform for
charged into a low impedance. This model consists of the ±8kV IEC1000-4-2 Level 4 ESD Contact-Discharge
a 100pF capacitor charged to the ESD voltage of inter- test.
est, which is then discharged into the device through a The Air-Gap test involves approaching the device with
1.5kΩ resistor. a charge probe. The Contact-Discharge method con-
IEC1000-4-2 nects the probe to the device before the probe is ener-
The IEC1000-4-2 standard covers ESD testing and per- gized.
formance of finished equipment; it does not specifically Machine Model
refer to integrated circuits. The MAX1406 helps you The Machine Model for ESD testing uses a 200pF stor-
design equipment that meets Level 4 (the highest level) age capacitor and zero-discharge resistance. It mimics
of IEC1000-4-2, without additional ESD-protection com- the stress caused by handling during manufacturing
ponents. and assembly. Of course, all pins (not just RS-232
The main difference between tests done using the inputs and outputs) require this protection during man-
Human Body Model and IEC1000-4-2 is higher peak ufacturing. Therefore, the Machine Model is less rele-
current in IEC1000-4-2 (Figure 3). Because series resis- vant to the I/O ports than are the Human Body Model
tance is lower in the IEC1000-4-2 ESD test model, the and IEC1000-4-2.

RC 1M RD 1500Ω RC 50M to 100M RD 330Ω

CHARGE-CURRENT DISCHARGE CHARGE-CURRENT DISCHARGE

LIMIT RESISTOR RESISTANCE LIMIT RESISTOR RESISTANCE

HIGH- DEVICE HIGH- DEVICE

VOLTAGE Cs STORAGE UNDER VOLTAGE Cs STORAGE UNDER
DC 100pF CAPACITOR TEST DC 150pF CAPACITOR TEST
SOURCE SOURCE

a) a)

I
100%
IP 100% Ir PEAK-TO-PEAK RINGING 90%
90% (NOT DRAWN TO SCALE)
IPEAK

AMPERES

36.8%

10% 10%
0
0 TIME tr = 0.7ns to 1ns t
tRL 30ns
tDL
60ns
CURRENT WAVEFORM
b) b)

Figure 2. Human Body ESD Test Model and ESD-Generator Figure 3. IEC1000-4-2 Test Model and ESD-Generator Current
Current Waveform Waveform

6 _______________________________________________________________________________________
 ±15kV ESD-Protected, EMC-Compliant,
230kbps, 3-Tx/3-Rx RS-232 IC
__________Applications Information ___________________Chip Topography

MAX1406
Because the MAX1406 is not sensitive to power-supply
sequencing, no external protection diodes are required.
0.094"
Any of the three supplies can power up first. However, (2.38mm)
use proper layout techniques to ensure other devices VDD VCC
on your board are not damaged in case of an ESD
event. R1IN
R1OUT

• Minimize the ground-lead return path to the power

supply, because currents as high as 60A can pass
into the ground. T1OUT T1IN

• Use a separate return path to the power supply.

• Make trace widths greater than 40 mils. R2IN R2OUT

• Bypass VCC, VDD, and VSS with 0.1µF capacitors as 0.153" T2OUT T2IN
close to the MAX1406 as possible to ensure maxi- (3.89mm)
mum ESD protection.
• Tie any unused transmitter inputs to GND or VCC to
minimize power consumption.
R3OUT
R3IN

T3OUT
T3IN

VSS GND

TRANSISTOR COUNT: 161

SUBSTRATE CONNECTED TO GND

_______________________________________________________________________________________ 7
 ±15kV ESD-Protected, EMC-Compliant,
230kbps, 3-Tx/3-Rx, RS-232 IC
________________________________________________________Package Information
MAX1406

INCHES MILLIMETERS
E DIM
MIN MAX MIN MAX
E1 A – 0.200 – 5.08
D
A1 0.015 – 0.38 –
A3 A2 0.125 0.175 3.18 4.45
A3 0.055 0.080 1.40 2.03
A A2
B 0.016 0.022 0.41 0.56
B1 0.045 0.065 1.14 1.65
C 0.008 0.012 0.20 0.30
L A1 D1 0.005 0.080 0.13 2.03
0° - 15°
E 0.300 0.325 7.62 8.26
C E1 0.240 0.310 6.10 7.87
e e 0.100 – 2.54 –
B1 eA
B eA 0.300 – 7.62 –
eB eB – 0.400 – 10.16
L 0.115 0.150 2.92 3.81
D1
INCHES MILLIMETERS
Plastic DIP PKG. DIM PINS
MIN MAX MIN MAX
PLASTIC P D 8 0.348 0.390 8.84 9.91
P D 14 0.735 0.765 18.67 19.43
DUAL-IN-LINE
P D 16 0.745 0.765 18.92 19.43
PACKAGE P D 18 0.885 0.915 22.48 23.24
(0.300 in.) P D 20 1.015 1.045 25.78 26.54
N D 24 1.14 1.265 28.96 32.13
21-0043A

INCHES MILLIMETERS
DIM
MIN MAX MIN MAX
D A 0.093 0.104 2.35 2.65
A1 0.004 0.012 0.10 0.30
0°- 8° B 0.014 0.019 0.35 0.49
A C 0.009 0.013 0.23 0.32
0.101mm E 0.291 0.299 7.40 7.60
0.004in.
e B e 0.050 1.27
A1 H 0.394 0.419 10.00 10.65
C L
L 0.016 0.050 0.40 1.27

INCHES MILLIMETERS
DIM PINS
MIN MAX MIN MAX
E H Wide SO D 16 0.398 0.413 10.10 10.50
SMALL-OUTLINE D 18 0.447 0.463 11.35 11.75
D 20 0.496 0.512 12.60 13.00
PACKAGE
D 24 0.598 0.614 15.20 15.60
(0.300 in.) D 28 0.697 0.713 17.70 18.10
21-0042A

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implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

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