CD54HC73, CD74HC73,

CD74HCT73
Data sheet acquired from Harris Semiconductor
SCHS134E
Dual J-K Flip-Flop with Reset
February 1998 - Revised September 2003 Negative-Edge Trigger

Features Description
• Hysteresis on Clock Inputs for Improved Noise The ’HC73 and CD74HCT73 utilize silicon gate CMOS
Immunity and Increased Input Rise and Fall Times technology to achieve operating speeds equivalent to LSTTL
[ /Title parts. They exhibit the low power consumption of standard
• Asynchronous Reset
(CD74 CMOS integrated circuits, together with the ability to drive 10
HC73, • Complementary Outputs LSTTL loads.
CD74 • Buffered Inputs These flip-flops have independent J, K, Reset and Clock
HCT73 inputs and Q and Q outputs. They change state on the
• Typical fMAX = 60MHz at VCC = 5V, CL = 15pF, negative-going transition of the clock pulse. Reset is
) TA = 25oC accomplished asynchronously by a low level input. This
/Sub- • Fanout (Over Temperature Range) device is functionally identical to the HC/HCT107 but differs
ject - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads in terminal assignment and in some parametric limits.
(Dual - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads The HCT logic family is functionally as well as pin compatible
J-K • Wide Operating Temperature Range . . . -55oC to 125oC
with the standard LS logic family.
Flip- Ordering Information
• Balanced Propagation Delay and Transition Times
Flop
• Significant Power Reduction Compared to LSTTL TEMP. RANGE
Logic ICs PART NUMBER (oC) PACKAGE

• HC Types CD54HC73F3A -55 to 125 14 Ld CERDIP

- 2V to 6V Operation CD74HC73E -55 to 125 14 Ld PDIP
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC CD74HC73M -55 to 125 14 Ld SOIC
at VCC = 5V
CD74HC73MT -55 to 125 14 Ld SOIC
• HCT Types
CD74HC73M96 -55 to 125 14 Ld SOIC
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility, CD74HCT73E -55 to 125 14 Ld PDIP
VIL= 0.8V (Max), VIH = 2V (Min) CD74HCT73M -55 to 125 14 Ld SOIC
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel of
250.

Pinout
CD54HC73 (CERDIP)
CD74HC73, CD74HCT73 (PDIP, SOIC)
TOP VIEW

1CP 1 14 1J

1R 2 13 1Q

1K 3 12 1Q

VCC 4 11 GND

2CP 5 10 2K

2R 6 9 2Q

2J 7 8 2Q

CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2003, Texas Instruments Incorporated
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 CD54HC73, CD74HC73, CD74HCT73

Functional Diagram
14
1J 12
1Q
3
1K FF 1 13
1Q
1
1CP
2
1R

7
2J 9
2Q
10
2K FF 2
8
5 2Q
2CP

6 GND = 11
2R VCC = 4

TRUTH TABLE

INPUTS OUTPUTS

R CP J K Q Q

L X X X L H

H ↓ L L No Change

H ↓ H L H L

H ↓ L H L H

H ↓ H H Toggle

H H X X No Change

H =High Level (Steady State)

L =Low Level (Steady State)
X = Irrelevant
↓ = High-to-Low Transition

Logic Diagram

14 (7)
J 12 (9)
J Q
3(10)
K K

1 (5) CL 13 (8)
CP nA CL R Q

2 (6)
R

2
 CD54HC73, CD74HC73, CD74HCT73

Absolute Maximum Ratings Thermal Information

DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V Thermal Resistance (Typical, Note 1) θJA (oC/W)
DC Input Diode Current, IIK E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 80
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 86
DC Drain Current, per Output, IO Maximum Junction Temperature (Hermetic Package or Die) . . . 175oC
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
DC Output Diode Current, IOK Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
DC Output Source or Sink Current per Output Pin, IO (SOIC - Lead Tips Only)
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA

Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.

DC Electrical Specifications
TEST
CONDITIONS 25oC -40oC TO 85oC -55oC TO 125oC
PARAMETER SYMBOL VI (V) IO (mA) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS
HC TYPES
High Level Input VIH - - 2 1.5 - - 1.5 - 1.5 - V
Voltage
4.5 3.15 - - 3.15 - 3.15 - V
6 4.2 - - 4.2 - 4.2 - V
Low Level Input VIL - - 2 - - 0.5 - 0.5 - 0.5 V
Voltage
4.5 - - 1.35 - 1.35 - 1.35 V
6 - - 1.8 - 1.8 - 1.8 V
High Level Output VOH VIH or -0.02 2 1.9 - - 1.9 - 1.9 - V
Voltage VIL
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
CMOS Loads
-0.02 6 5.9 - - 5.9 - 5.9 - V
High Level Output - - - - - - - - - V
Voltage
-4 4.5 3.98 - - 3.84 - 3.7 - V
TTL Loads
-5.2 6 5.48 - - 5.34 - 5.2 - V
Low Level Output VOL VIH or 0.02 2 - - 0.1 - 0.1 - 0.1 V
Voltage VIL
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
CMOS Loads
0.02 6 - - 0.1 - 0.1 - 0.1 V
Low Level Output - - - - - - - - - V
Voltage
4 4.5 - - 0.26 - 0.33 - 0.4 V
TTL Loads
5.2 6 - - 0.26 - 0.33 - 0.4 V
Input Leakage II VCC or - 6 - - ±0.1 - ±1 - ±1 µA
Current GND

3
 CD54HC73, CD74HC73, CD74HCT73

DC Electrical Specifications (Continued)

TEST
CONDITIONS 25oC -40oC TO 85oC -55oC TO 125oC
PARAMETER SYMBOL VI (V) IO (mA) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS
Quiescent Device ICC VCC or 0 6 - - 4 - 40 - 80 µA
Current GND
HCT TYPES
High Level Input VIH - - 4.5 to 2 - - 2 - 2 - V
Voltage 5.5
Low Level Input VIL - - 4.5 to - - 0.8 - 0.8 - 0.8 V
Voltage 5.5
High Level Output VOH VIH or -0.02 4.5 4.4 - - 4.4 - 4.4 - V
Voltage VIL
CMOS Loads
High Level Output -4 4.5 3.98 - - 3.84 - 3.7 - V
Voltage
TTL Loads
Low Level Output VOL VIH or 0.02 4.5 - - 0.1 - 0.1 - 0.1 V
Voltage CMOS Loads VIL
Low Level Output 4 4.5 - - 0.26 - 0.33 - 0.4 V
Voltage
TTL Loads
Input Leakage II VCC - 5.5 - ±0.1 - ±1 - ±1 µA
Current and
GND
Quiescent Device ICC VCC or 0 5.5 - - 4 - 40 - 80 µA
Current GND
Additional Quiescent ∆ICC VCC - 4.5 to - 100 360 - 450 - 490 µA
Device Current Per (Note 2) - 2.1 5.5
Input Pin: 1 Unit Load
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.

HCT Input Loading Table

INPUT UNIT LOADS HC TYPES HCT TYPES

All 0.3 Input Level VCC 3V

NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifica- VS 50% VCC 1.3V
tions table, e.g., 360µA max at 25oC. NOTE: Transition times and propagation delay times

Prerequisite For Switching Specifications

25oC -40oC TO 85oC -55oC TO 125oC
TEST VCC
PARAMETER SYMBOL CONDITIONS (V) MIN TYP MAX MIN MAX MIN MAX UNITS
HC TYPES
CP Pulse Width tw -CL = 50pF 2 80 - - 100 - 120 - ns
4.5 16 - - 20 - 24 - ns
6 14 - - 17 - 20 - ns
R Pulse Width tw -CL = 50pF 2 80 - - 100 - 120 - ns
4.5 16 - - 20 - 24 - ns
6 14 - - 17 - 20 - ns

4
 CD54HC73, CD74HC73, CD74HCT73

Prerequisite For Switching Specifications (Continued)

25oC -40oC TO 85oC -55oC TO 125oC

TEST VCC
PARAMETER SYMBOL CONDITIONS (V) MIN TYP MAX MIN MAX MIN MAX UNITS
Setup Time, J, K to CP tSU CL = 50pF 2 80 - - 100 - 120 - ns
4.5 16 - - 20 - 24 - ns
6 14 - - 17 - 20 - ns
Hold Time, J, K to CP tH CL = 50pF 2 3 - - 3 - 3 - ns
4.5 3 - - 3 - 3 - ns
6 3 - - 3 - 3 - ns
Removal Time tREM -CL = 50pF 2 80 - - 100 - 120 - ns
4.5 16 - - 20 - 24 - ns
6 14 - - 17 - 20 - ns
CP Frequency fMAX CL = 50pF 2 6 - - 5 - 4 - MHz
4.5 30 - - 25 - 20 - MHz
CL = 15pF 5 - 60 - - - - - MHz
CL = 50pF 6 35 - - 29 - 23 - MHz
HCT TYPES
CP Pulse Width tw CL = 50pF 4.5 16 - - 20 - 24 - ns
R Pulse Width tw CL = 50pF 4.5 18 - - 23 - 27 - ns
Setup Time, J, K to CP tSU CL = 50pF 4.5 16 - - 20 - 24 - ns
Hold Time, J, K to CP tH CL = 50pF 4.5 3 - - 3 - 3 - ns
Removal Time tREM CL = 50pF 4.5 12 - - 15 - 18 - ns
CP Frequency fMAX CL = 50pF 4.5 30 - - 25 - 20 - MHz
CL = 15pF 5 - 60 - - - - - MHz

Switching Specifications Input tr, tf = 6ns

25oC -40oC TO 85oC -55oC TO 125oC
TEST VCC
PARAMETER SYMBOL CONDITIONS (V) MIN TYP MAX MIN MAX MIN MAX UNITS
HC TYPES
Propagation Delay, tPLH, tPHL CL = 50pF 2 - - 160 - 200 - 240 ns
CP to Q
4.5 - - 32 - 40 - 48 ns
CL = 15pF 5 - 13 - - - - - ns
CL = 50pF 6 - - 28 - 34 - 41 ns
Propagation Delay, tPLH, tPHL CL = 50pF 2 - - 160 - 200 - 240 ns
CP to Q
4.5 - - 32 - 40 - 48 ns
CL = 15pF 5 - 13 - - - - - ns
CL = 50pF 6 - - 28 - 34 - 41 ns
Propagation Delay, tPLH, tPHL CL = 50pF 2 - - 145 - 180 - 220 ns
R to Q, Q
4.5 - - 29 - 36 - 44 ns
CL = 15pF 5 - 12 - - - - - ns
CL = 50pF 6 - - 25 - 31 - 38 ns
Output Transition Time tTLH, tTHL CL = 50pF 2 - - 75 - 95 18 110 ns
4.5 - - 15 - 19 - 22 ns
6 - - 13 - 16 - 19 ns

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 CD54HC73, CD74HC73, CD74HCT73

Switching Specifications Input tr, tf = 6ns (Continued)

25oC -40oC TO 85oC -55oC TO 125oC

TEST VCC
PARAMETER SYMBOL CONDITIONS (V) MIN TYP MAX MIN MAX MIN MAX UNITS
Input Capacitance CI - - - - 10 - 10 - 10 pF
Power Dissipation Capacitance CPD - 5 - 28 - - - - - pF
(Notes 3, 4)
HCT TYPES
Propagation Delay, tPLH, tPHL CL = 50pF 4.5 - - 38 - 48 - 57 ns
CP to Q
Propagation Delay, tPLH, tPHL CL = 50pF 4.5 - - 36 - 45 - 54 ns
CP to Q
Propagation Delay, tPLH, tPHL CL = 50pF 4.5 - - 34 - 43 - 51 ns
R to Q, Q
Output Transition Time tTLH, tTHL CL = 50pF 4.5 - - 15 - 19 - 22 ns
Input Capacitance CI - - - - 10 - 10 - 10 pF
Power Dissipation Capacitance CPD - 5 - 28 - - - - - pF
(Notes 3, 4)
NOTES:
3. CPD is used to determine the dynamic power consumption, per flip-flop.
4. PD = CPD VCC2 fi + Σ CL VCC2 fo where fi = input frequency, fo = output frequency, CL = output load capacitance, VCC = supply voltage.

Test Circuits and Waveforms

I
I tWL + tWH =
tWL + tWH = trCL = 6ns fCL
trCL tfCL fCL tfCL = 6ns

VCC 3V
90% 2.7V
CLOCK 50% CLOCK 1.3V
50% 50% 1.3V 1.3V
10% 10% GND 0.3V 0.3V GND

tWL tWH tWL tWH

NOTE: Outputs should be switching from 10% VCC to 90% VCC in NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%. accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 2. HC CLOCK PULSE RISE AND FALL TIMES AND FIGURE 3. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH PULSE WIDTH

tr = 6ns tf = 6ns tr = 6ns tf = 6ns

VCC 3V
90% 2.7V
INPUT 50% INPUT 1.3V
10% GND 0.3V GND

tTHL tTLH tTHL tTLH

90% 90%
50% 1.3V
INVERTING 10% INVERTING
10%
OUTPUT OUTPUT
tPHL tPLH tPHL tPLH

FIGURE 4. HC AND HCU TRANSITION TIMES AND PROPAGA- FIGURE 5. HCT TRANSITION TIMES AND PROPAGATION
TION DELAY TIMES, COMBINATION LOGIC DELAY TIMES, COMBINATION LOGIC

6
 CD54HC73, CD74HC73, CD74HCT73

Test Circuits and Waveforms (Continued)

trCL tfCL trCL tfCL

VCC 3V
90% CLOCK 2.7V
CLOCK 50% 1.3V
INPUT 10% INPUT 0.3V
GND GND

tH(H) tH(L) tH(H) tH(L)

VCC 3V
DATA
DATA 50% 1.3V 1.3V 1.3V
INPUT INPUT
GND GND
tSU(H) tSU(L) tSU(H) tSU(L)

tTLH tTHL tTLH tTHL

90% 90%
90% 90%
50% 1.3V
OUTPUT OUTPUT 1.3V
10% 10%
tPLH tPHL tPLH tPHL

tREM tREM
VCC 3V
SET, RESET 50% SET, RESET 1.3V
OR PRESET OR PRESET
GND GND

IC IC
CL CL
50pF 50pF

FIGURE 6. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, FIGURE 7. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS TRIGGERED SEQUENTIAL LOGIC CIRCUITS

7
 PACKAGE OPTION ADDENDUM
www.ti.com 28-Feb-2005

PACKAGING INFORMATION

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
5962-8515301CA ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC
CD54HC73F ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC
CD54HC73F3A ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC
CD74HC73E ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
CD74HC73M ACTIVE SOIC D 14 50 Pb-Free CU NIPDAU Level-2-260C-1 YEAR/
(RoHS) Level-1-235C-UNLIM
CD74HC73M96 ACTIVE SOIC D 14 2500 Pb-Free CU NIPDAU Level-2-260C-1 YEAR/
(RoHS) Level-1-235C-UNLIM
CD74HC73MT ACTIVE SOIC D 14 250 Pb-Free CU NIPDAU Level-2-260C-1 YEAR/
(RoHS) Level-1-235C-UNLIM
CD74HCT73E ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
CD74HCT73M ACTIVE SOIC D 14 50 Pb-Free CU NIPDAU Level-2-260C-1 YEAR/
(RoHS) Level-1-235C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.

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Addendum-Page 1
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