HMC462LP5 / 462LP5E: Features Typical Applications
HMC462LP5 / 462LP5E: Features Typical Applications
v05.0213
Gain: 13 dB
• Telecom Infrastructure P1dB Output Power: +14.5 dBm @ 10 GHz
• Microwave Radio & VSAT Self-Biased: +5V @ 66mA
• Military EW, ECM & C3I 50 Ohm Matched Input/Output
• Test Instrumentation 25 mm2 Leadless SMT Package
• Fiber Optics
Gain 12 14 11 13 10 12 dB
Gain Variation Over Temperature 0.015 0.025 0.02 0.03 0.03 0.04 dB/ °C
Supply Current
41 66 84 41 66 84 41 66 84 mA
(Idd) (Vdd= 5V)
GAIN (dB)
0 12
-5
-10 8
-15
-20 4
-25
-30 0
0 2 4 6 8 10 12 14 16 18 20 22 0 2 4 6 8 10 12 14 16 18 20 22
FREQUENCY (GHz) FREQUENCY (GHz)
Input Return Loss vs. Temperature Output Return Loss vs. Temperature
0 0
OUTPUT RETURN LOSS (dB)
-5
INPUT RETURN LOSS (dB)
-5
-10
-15 -10
-20
-15
-25
-30 -20
0 2 4 6 8 10 12 14 16 18 20 22 0 2 4 6 8 10 12 14 16 18 20 22
FREQUENCY (GHz) FREQUENCY (GHz)
-10
REVERSE ISOLATION (dB)
8
NOISE FIGURE (dB)
-20
6
-30
4
-40
2
-50
-60 0
0 2 4 6 8 10 12 14 16 18 20 22 0 2 4 6 8 10 12 14 16 18 20 22
FREQUENCY (GHz) FREQUENCY (GHz)
17 17
P1dB (dBm)
Psat (dBm)
14 14
11 11
8 8
5 5
0 2 4 6 8 10 12 14 16 18 20 22 0 2 4 6 8 10 12 14 16 18 20 22
FREQUENCY (GHz) FREQUENCY (GHz)
20 70
27 18 68
16 66
14 64
IP3 (dBm)
24
12 62
Idd (mA)
10 60
21
8 58
6 56
18 54
4
2 52
15 0 50
0 2 4 6 8 10 12 14 16 18 20 22
4.5 5 5.5
FREQUENCY (GHz) Vdd (V)
Idd
Outline Drawing
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3]
[1] H462
HMC462LP5 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1
XXXX
[2] H462
HMC462LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Pin Descriptions
Pin Number Function Description Interface Schematic
AMPLIFIERS - LOW NOISE - SMT
Evaluation PCB
Item Description The circuit board used in the application should use
J1 - J2 PCB Mount SMA Connector RF circuit design techniques. Signal lines should
J3 2 mm Molex Header have 50 Ohm impedance while the package ground
C1 100 pF Capacitor, 0402 Pkg. leads and package bottom should be connected
C2 1000 pF Capacitor, 0603 Pkg. directly to the ground plane similar to that shown.
C3 4.7 µF Capacitor, Tantalum
A sufficient number of via holes should be used
U1 HMC462LP5 / HMC462LP5E
to connect the top and bottom ground planes.
PCB [2] 109751 Evaluation PCB
The evaluation board should be mounted to an
[1] Reference this number when ordering complete evaluation PCB
appropriate heat sink. The evaluation circuit board
[2] Circuit Board Material: Rogers 4350
shown is available from Hittite upon request.
Authorized Distributor