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Power 6
Electronics
SEMIKRON 1
COVER CONTENT BACKCOVER
POWER MODULES 2
IG BT D R I V ER 3
S TA C K S 4
SYSTEMS 5
DISCRE T E S
ACCE SS OIRE S 6
I N F O R M AT I O N
S E R V I C E & C O N TA C T 7
2 SEMIKRON SEMIKRON 3
COVER CONTENT BACKCOVER
Product Range
OVERVIEW
2
POWER MODULES
3 IGBT DRIVERS
4 S TA C K S
Water-cooled IGBT Air-cooled IGBT
CHAPTER
CHAPTER
CHAPTER
MiniSKiiP Page 22 SEMITOP Page 24 SEMiX Page 26 SKYPER Page 156 SEMIKUBE Page 166
3
Diode/Thyristor
5 SYSTEMS
CHAPTER
4
SEMISTACK
SEMITRANS Page 28 SKiM Page 30 SEMIPONT Page 32 CLASSIC Page 168
6
DISCRETES
SEMISTACK
SEMIPACK Page 34 SEMiSTART Page 36 SKiiP Page 140 SEMISTACK RE Page 164 Application Page 170
CHAPTER
Product Classes
6
IGBT Modules 38
MOSFET Modules 98
Diodes
Thyristor / Diode Modules 104 Thyristors
Bridge Rectifier Modules 120 Chips Page 196
4 SEMIKRON SEMIKRON 5
COVER CONTENT BACKCOVER
1
5
6 SEMIKRON SEMIKRON 7
COVER CONTENT BACKCOVER
Being able to access service, technical support and experts that our customers can always rely
on is instrumental to our customers’ success.
Today, increased product diversity in power semiconductors calls for customer support far beyond
the information contained in data sheets. Only comparison under application-specific conditions –
such as voltage, switching frequency or cooling conditions – can demonstrate the differences in
2
performance of available devices. That’s why we continue to invest in our professional application
engineering support, including lab space and reference designs.
In recent years, we have built a network comprising 25 sites across the globe to provide fast,
comprehensive application support. Our application engineering teams work both locally and globally
with our customers throughout the entire project life cycle. We strive to understand and help our
customers overcome both big and small challenges throughout their projects. For example, we
conduct topology studies to fully understand the advantages in the end user application and carry 3
out benchmark investigations when needed. It is this application-centred approach that
sets us apart from others.
7
www.semikron.com/service-support/application-support
8 SEMIKRON SEMIKRON 9
COVER CONTENT BACKCOVER
SEMIKRON was the first power module manufacturer on the market to offer power modules with
pre-applied thermal interface material. With more than two decades of field experience and more
than fifteen million pre-printed modules in the field, benchmarks are being set. The modules with
pre-applied TIM are printed in a clean environment on an automated and SPC controlled
silk screen and stencil printing line.
2
For each requirement SEMIKRON offers the right choice of material. In addition to the standard
silicone thermal grease, a phase change material and high performance thermal paste with im-
proved thermal performance are also available.
A thermal grease or a phase change material is recommended for the given customer needs for
handling and module performance as well as for module type (with baseplate, baseplate-less).
Phase change materials with a solid consistency at room temperatures can fully exploit the
advantages that a non-smearing TIM layer offers on modules without any other drawbacks. 3
Modules with no baseplate, on the other hand, usually require a lower-viscosity material to help
improve robustness during assembly. Here, thermal grease is the preferred solution.
Key features
Increased productivity thanks to reduced handling costs and improved logistics
Low thermal resistance with optimised TIM layer thickness
Improved lifetime and reliability 4
Improved assembly robustness
Modules can be shipped directly to the assembly line without any additional treatment processes
Lower overall costs
Portfolio
Phase Change Material: TPC-Z-PC-P8; TPC-4000PE; PSX-PE = P8
Phase Change Material: TPC-V-PC-P-HT; TPC-7000 = HT 5
High Performance Thermal Paste = HPTP
Standard Thermal Paste: Wacker P12 = P12
7
www.semikron.com/thermal-interface-materials
10 SEMIKRON SEMIKRON 11
COVER CONTENT BACKCOVER
SEMIKRON’s power electronic stacks enable our customers to prosper in dynamic markets and meet
any global challenge. With more than 200,000 stacks in the field, SEMIKRON is the global market
leader for power electronic stacks.
Our services are as multifaceted as our customers, highlighted by these four distinctive attributes:
time to market, cost savings, global production and engineering experience. Our passion for
2
power electronics and our commitment to high-performance design are the factors that make us
your ultimate partner for value creation in the dynamic power electronics market.
The experience we have gained in over 40 years of high-performance stack design has reinforced
the four essential ingredients needed for your success. In emerging markets, where new product
innovation is essential, companies need to be nimble and have a fast time to market. In global
markets, multiple production locations play a vital role in ensuring rapid deployment to more than
one country, while also meeting local demand and building customer relationships. Quality and 3
cost control are crucial factors in the long-term success of any project. Finally, success in highly
competitive markets is underpinned by superior technical capability. All four of these prerequisites
are addressed by SEMIKRON’s power electronic stacks.
12 SEMIKRON SEMIKRON 13
COVER CONTENT BACKCOVER
IGBT Generation 7:
IGBT Generation 7: The new benchmark for Motor Drives
The generation 7 IGBTs represent the latest IGBT chip technology. This new generation is
specifically designed to match the requirements of motor drive applications. The IGBTs
The New Benchmark come with a significantly lower forward voltage drop and deliver optimised switching
performance. Thanks to roughly 25% smaller chips, higher nominal currents can fit into
Product specifications/features
for Solar String Inverters 1200V and 950V devices and comes with the option of SiC Schottky diodes in the neutral
path for maximum efficiency. This new module allows for baseplate-less, PCB-mounted 4
inverter designs with benchmarking power density of up to 180kW for 1500VDC photovoltaic
systems. The benefits of the MiniSKiiP Dual’s SPRiNG contact layout are low-inductance
DC-link designs, easy driver integration and parallel AC power connections.
Product specifications/features
950V IGBT 7 chips and SiC Schottky diodes in neutral path for maximum efficiency 5
Low-inductance DC-link connection
Product specifications/features
Reliability for EV Charger vest in the charging infrastructure. The critical points in the product decision are costs, power
and reliability. SEMIKRON offers a comprehensive portfolio of products that meet the needs 4
of fast charge equipment from as little as 22kW right up to 450kW. Our new 50kW PowerCell
enables companies to market DC fast chargers using an existing power electronics platform.
Availability, efficiency and reliability guarantees fast time to market and low upfront invest-
ment costs. In combination with a secure supply chain and a modular design, the PowerCell
plays a vital role in the successful deployment of your DC fast chargers.
Product specifications/features
5
50kW rated power 3L PFC topology with 6 rather than 12 driver channels
Scalable up to 350kW 6
Platform for Battery Vehicles The 3rd generation is a platform concept for standard inverter designs or customized designs
tailored to the customer’s needs. The inverter connects easily to the customer control board,
facilitating quick and easy design while leaving control to the customer.
Product specifications/features
DC-link capacitors
SEMITRANS 20
The High-Power Standard in The SEMITRANS 20 overcomes the limits of conventional module concepts and provides a
new design approach for inverters used in applications such as traction, industrial drives and
5
Product specifications/features
Standard Package
Innovative technologies with sintered chip interconnects and AlCu wire bonds
Power Modules
PAG E
IGBT Modules 38
Full Silicon Carbide Modules 78 1
2
5
20 SEMIKRON SEMIKRON 21
COVER CONTENT BACKCOVER
MiniSKiiP
®
Short facts required, no dedicated tools are needed for MiniSKiiP assem-
Low-cost assembly, high production run rate, high yield bly. Instead, a single or two screw connection is used. The
Small and compact inverter design printed circuit board (PCB), the power module and the heat 3
Excellent reliability and long product life time
sink are assembled in one mounting step. This connection
technology features a number of additional advantages: the
PCB can be more flexible in design, as the printed circuit board
Key features
does not need to include holes for solder pins or press-fit con-
Solder-free SPRiNG technology for fast and easy assembly
nections. The springs provide a flexible connection between
Without copper baseplate for cost efficient designs
the PCB and the power circuitry which is far superior to a
Easy and flexible PCB routing without pin holes soldered joint, particularly under thermal or mechanical stress
urrent range 4A to 400A for inverter range up to 90kW
C 4
conditions which can affect lifetime. Thanks to the high me-
with one product platform
chanical pressure provided by the springs, an air-tight, reliable
omprehensive setup of topologies:
C electrical connection is achieved.
CIB, Sixpack, Twelvepack, H-Bridge, Half-Bridge,
3-level, bridge rectifiers with brake chopper
22 SEMIKRON SEMIKRON 23
COVER CONTENT BACKCOVER
SEMITOP
®
Portfolio Benefits
SEMITOP 1, 2, 3, 4 up to 55kW The SEMITOP platform centers around 12-mm-high modules,
SEMITOP E1/E2 up to 70kW covering the low and medium-power range, with one or two 3
mounting screws and no baseplate, featuring PCB interface via
solder or press-fit pins. The low commutation inductance
Short facts
design and the choice of the latest Si and SiC chip technolo-
12mm module height
gies make this product suitable for UPS and solar applications,
Reliable solder or press-fit connection
motor drives, power supplies, welding and the new EV battery
Low stray inductance case
charger market. A large variety of configurations is possible
within the SEMITOP family, including 3-level (NPC/TNPC) and
Key features 4
CIB (converter-inverter-brake) topologies.
No baseplate
24 SEMIKRON SEMIKRON 25
COVER CONTENT BACKCOVER
SEMiX
®
26 SEMIKRON SEMIKRON 27
COVER CONTENT BACKCOVER
SEMITRANS
®
Portfolio Benefits
SEMITRANS 2-9 45kW up to 500kW SEMITRANS 2-9 feature well-proven designs that come from
SEMITRANS 10 500kW up to 2MW over 25 years of market experience, but are still suitable for the 3
SEMITRANS 20 3,3 kV, 450A / 1,7kV, 1200A
latest chips generations , including silicon carbide, thanks to
its low-inductance design. SEMITRANS 10 takes the power ran-
ge into the realm of megawatt applications, utilizing the latest
Short facts
SEMIKRON packaging technologies including Direct Pressed
Safe operation with high DC-link voltages
Die technology for maximum reliability and minimum thermal
Maximum power output
resistance. SEMITRANS 20 serves low and medium-voltage
Multiple IGBT sources applications with a low-inductance and easy-to-parallel
4
power module design. With its advanced technologies such as
Key features sintered chips and AlCu bond wires, it boasts up to 5 time more
Half-Bridge, Chopper, Single Switch, 3-level, common emitter lifetime than standard modules.
Isolated copper baseplate using DBC technology
28 SEMIKRON SEMIKRON 29
COVER CONTENT BACKCOVER
SKiM
®
Short facts
Benefits
No solder delamination thanks to sintered chips – SKiM 63/93
The SKiM module can improve the reliability of inverters several
1500 temperature cycles without failure – SKiM 63/93
times over, even under substantial active and passive tempe-
Up to 23% more performance with AlCu-bonded diodes and high
rature swings. In addition to sintered chips, pressure contacts
performance thermal grease
and spring technology, the SKiM63/93 featuring AlCu-bonded
4
diodes and high performance thermal grease delivers as much
Key features
as 23.3% better performance with the same chip set and same
IGBT power module in Sixpack configuration with 3 separate
lifetime or twice the power cycling capability of standard sinter
half-bridges - SKiM 63/93
modules. The SKiM 93 is also available with hybrid SiC techno-
Available in 600V, 1200V and 1700V and from 200A to 900A
logy to extend efficiency and switching frequency.
NPC and TNPC configuration - SKiM4/5
30 SEMIKRON SEMIKRON 31
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SEMIPONT
®
32 SEMIKRON SEMIKRON 33
COVER CONTENT BACKCOVER
SEMIPACK
®
34 SEMIKRON SEMIKRON 35
COVER CONTENT BACKCOVER
SEMiSTART
®
36 SEMIKRON SEMIKRON 37
COVER CONTENT BACKCOVER
IGBT Modules
For Maximum Performance
SEMITRANS ®
Higher nominal currents
Sixpack
3-level 5
IGBT Generation 7 – MiniSKiiP, SEMITOP, SEMiX 40 ICnom in A 0 20 60 100 300 400 600 900 1200 1400 1800
MiniSKiiP 42
SKiM ® 63/93
SEMITOP 48
38 SEMIKRON SEMIKRON 39
COVER CONTENT BACKCOVER
Topology
Topology
Package
Package
Icnom
Icnom
A Topology A Topology 1
1200V - IGBT (T7) 1200V - IGBT (T7)
SKiiP11NAB12T7V1 10 CIB MiniSKiiP 1 SK10DGDL12T7ETE1 10 CIB SEMITOP E1
SKiiP12NAB12T7V1 15 CIB MiniSKiiP 1 SK15DGDL12T7ETE1 15 CIB SEMITOP E1
SKiiP23NAB12T7V1 25 CIB MiniSKiiP 2 SK35DGDL12T7ETE2 35 CIB SEMITOP E2
SKiiP24NAB12T7V1 35 CIB MiniSKiiP 2
SKiiP25NAB12T7V2 50 CIB MiniSKiiP 2
SKiiP34NAB12T7V1 35 CIB MiniSKiiP 3
SK25GD12T7ETE1 25 Sixpack SEMITOP E1
SKiiP35NAB12T7V1 50 CIB MiniSKiiP 3
SK35GD12T7ETE1 35 Sixpack SEMITOP E1
2 SKiiP37NAB12T7V1 75 CIB MiniSKiiP 3 2
SK50GD12T7ETE2 50 Sixpack SEMITOP E2
SKiiP38NAB12T7V2 100 CIB MiniSKiiP 3
SK75GD12T7ETE2 75 Sixpack SEMITOP E2
SKiiP11AC12T7V1 10 Sixpack MiniSKiiP 1
SK100GD12T7ETE2 100 Sixpack SEMITOP E2
SKiiP12AC12T7V1 15 Sixpack MiniSKiiP 1
SKiiP13AC2T7V1 25 Sixpack MiniSKiiP 1 1200V - IGBT (M7)
SKiiP14AC12T7V1 35 Sixpack MiniSKiiP 1 SEMiX076DGDL12M7p 75 CIB SEMiX 6p
SKiiP23AC12T7V1 25 Sixpack MiniSKiiP 2 SEMiX106DGDL12M7p 100 CIB SEMiX 6p
SKiiP24AC12T7V1 35 Sixpack MiniSKiiP 2 SEMiX156DGDL12M7p 150 CIB SEMiX 6p
SKiiP25AC12T7V1 50 Sixpack MiniSKiiP 2
SKiiP26AC12T7V1 70 Sixpack MiniSKiiP 2 3
SKiiP27AC12T7V1 75 Sixpack MiniSKiiP 2
SKiiP28AC12T7V1 100 Sixpack MiniSKiiP 2 SEMiX106GD12M7p 100 Sixpack SEMiX 6p
SKiiP37AC12T7V1 75 Sixpack MiniSKiiP 3 SEMiX156GD12M7p 150 Sixpack SEMiX 6p
SKiiP38AC12T7V1 100 Sixpack MiniSKiiP 3 SEMiX206GD12M7p 200 Sixpack SEMiX 6p
SKiiP39AC12T7V1 150 Sixpack MiniSKiiP 3
SKiiP39AC12T7V10 200 Sixpack MiniSKiiP 3
SEMiX223GB12M7p 220 Half-Bridge SEMiX 3p
SKiiP12ACC12T7V1 15 Twelvepack MiniSKiiP 1
SEMiX303GB12M7p 300 Half-Bridge SEMiX 3p
SKiiP23ACC12T7V1 25 Twelvepack MiniSKiiP 2
SEMiX453GB12M7p 450 Half-Bridge SEMiX 3p
SKiiP24ACC12T7V1 35 Twelvepack MiniSKiiP 2
SKiiP35ACC12T7V1 50 Twelvepack MiniSKiiP 3
SEMiX603GB12M7p 500 Half-Bridge SEMiX 3p 4
SEMiX703GB12M7p 700 Half-Bridge SEMiX 3p
40 SEMIKRON SEMIKRON 41
COVER CONTENT BACKCOVER
Type IGBT Diode Rectifier Module Type IGBT Diode Rectifier Module
Thermal Interface
VF @ Tj = 25°C typ.
VF @ Tj = 25°C typ.
IFSM @ Tj = 25°C
IFSM @ Tj = 25°C
IC @ TS= 25°C
IC @ TS= 25°C
IF@ TS = 25°C
IF@ TS = 25°C
Material
Material
Package
Package
ICnom
ICnom
Eoff
Eoff
Eon
Eon
Err
Err
A A V mJ mJ A V mJ A Topology A A V mJ mJ A V mJ A Topology 1
600V - IGBT3 (Trench) 650V - IGBT3 (Trench)
SKiiP 16GH066V1 65 50 1.45 1.7 1.7 56 1.50 1.3 - II 1 P12, HPTP SKiiP 24GB07E3V1 2) 185 150 1.45 2.2 5.1 161 1.54 3.7 - II 2 P12, HPTP
SKiiP 27GH066V1 88 75 1.45 2.7 3 77 1.50 1.8 - II 2 P12, HPTP SKiiP 26GB07E3V1 2) 229 200 1.45 4.4 7.4 235 1.40 4.5 - II 2 P12, HPTP
SKiiP 28GH066V1 112 100 1.45 3.4 3.5 112 1.30 3.3 - II 2 P12, HPTP SKiiP 38GB07E3V1 2) 287 300 1.45 5.5 10.6 310 1.40 5.1 - II 3 P12, HPTP
SKiiP 02AC066V1 20 10 1.45 0.45 0.3 20 1.30 0.3 - II 0 P12, HPTP SKiiP 26MLI07E3V1 2) 98 75 1.45 2.8 2.8 75 1.54 1.4 - II 2 P12, HPTP
2 SKiiP 04AC066V1 33 20 1.45 0.8 0.7 31 1.60 0.55 - II 0 P12, HPTP SKiiP 27MLI07E3V1 2) 110 100 1.45 4.2 4.2 107 1.40 3.5 - II 2 P12, HPTP 2
SKiiP 15AC066V1 40 30 1.45 1 1.1 39 1.50 1.1 - II 1 P12, HPTP SKiiP 28MLI07E3V1 2) 135 150 1.45 5.5 5.6 126 1.40 5.5 - II 2 P12, HPTP
SKiiP 39MLI07E3V1 2) 159 200 1.45 3.6 8.9 163 1.39 8.3 - II 3 P12, HPTP
SKiiP 27AC066V1 88 75 1.45 2.7 3 77 1.50 1.8 - II 2 P12, HPTP SKiiP 03AC126V1 3) 16 8 1.70 0.9 0.9 8 1.90 0.7 - II 0 P12, HPTP
SKiiP 28AC066V1 112 100 1.45 3.4 3.5 112 1.30 3.3 - II 2 P12, HPTP SKiiP 11AC126V1 3) 16 8 1.70 0.9 1 14 1.90 0.9 - II 1 P12, HPTP
SKiiP 39AC066V4 146 150 1.45 7.9 5.6 164 1.30 3.5 - II 3 P12, HPTP SKiiP 11AC126V10 3) 16 6 1.65 18 1 48 1.10 16.4 - II 1 P12, HPTP
SKiiP 12AC126V1 3) 28 15 1.70 1.7 1.9 26 1.60 1.2 - II 1 P12, HPTP
SKiiP 13AC126V1 3) 41 25 1.70 4.1 3.1 30 1.80 2.2 - II 1 P12, HPTP
3
SKiiP 01NEC066V3 12 6 1.45 0.3 0.2 12 1.30 0.2 220 II 0 P12, HPTP SKiiP 13AC126V20 3) 41 25 1.65 2.9 3 27 2.00 1.2 - II 1 P12, HPTP
SKiiP 02NEC066V3 20 10 1.45 0.5 0.3 20 1.30 0.5 220 II 0 P12, HPTP
SKiiP 23AC126V1 3) 41 25 1.70 3.7 3.1 30 1.80 2.6 - II 2 P12, HPTP
SKiiP 03NEC066V3 27 15 1.45 0.6 0.5 28 1.40 0.5 220 II 0 P12, HPTP
SKiiP 24AC126V1 3) 52 35 1.70 4.2 4.4 38 1.80 3.5 - II 2 P12, HPTP
SKiiP 25AC126V1 3) 73 50 1.70 5.8 6.5 62 1.60 5.1 - II 2 P12, HPTP
SKiiP 01NAC066V3 12 6 1.45 0.3 0.2 12 1.30 0.2 220 II 0 P12, HPTP SKiiP 26AC126V1 3) 88 70 1.70 9 7.7 91 1.50 7.5 - II 2 P12, HPTP
SKiiP 02NAC066V3 20 10 1.45 0.5 0.3 20 1.30 0.5 220 II 0 P12, HPTP SKiiP 37AC126V2 3) 97 75 1.70 9.6 8.7 90 1.60 9.6 - II 3 P12, HPTP
SKiiP 38AC126V2 3) 118 105 1.70 13.1 13 118 1.60 11.2 - II 3 P12, HPTP
SKiiP 39AC126V2 3) 157 140 1.70 19.9 17.2 167 1.50 16.2 - II 3 P12, HPTP
SKiiP 02NEB066V3 20 10 1.45 0.5 0.3 20 1.30 0.5 220 II 0 P12, HPTP SKiiP 39AC126V20 3) 157 140 1.65 13 17 - 2.00 8.1 - II 3 P12, HPTP
SKiiP 03NEB066V3 27 15 1.45 0.6 0.5 28 1.40 0.5 220 II 0 P12, HPTP
4
SKiiP 03NAC126V1 3) 16 8 1.70 0.9 0.9 14 1.60 0.7 220 II 0 P12, HPTP
SKiiP 25NEB066V1 43 30 1.45 0.9 1.2 39 1.50 1.1 370 II 2 P12, HPTP
42 SEMIKRON SEMIKRON 43
COVER CONTENT BACKCOVER
Type IGBT Diode Rectifier Module Type IGBT Diode Rectifier Module
Thermal Interface
VF @ Tj = 25°C typ.
VF @ Tj = 25°C typ.
IFSM @ Tj = 25°C
IFSM @ Tj = 25°C
IC @ TS= 25°C
IC @ TS= 25°C
IF@ TS = 25°C
IF@ TS = 25°C
Material
Material
Package
Package
ICnom
ICnom
Eoff
Eoff
Eon
Eon
Err
Err
A A V mJ mJ A V mJ A Topology A A V mJ mJ A V mJ A Topology 1
1200V - IGBT4 (Trench) 1200V - IGBT4 (Trench)
SKiiP 24GB12T4V1 2) 170 150 1.85 10.8 15.6 157 2.17 10.3 - II 2 P12, HPTP SKiiP 22NAB12T4V2 1) 28 15 1.85 t.b.d. t.b.d. 22 2.38 t.b.d. 220 II 2 P12, HPTP
SKiiP 26GB12T4V1 2) 224 200 1.80 13.6 22.1 194 2.20 13.4 - II 2 P12, HPTP
SKiiP 38GB12E4V1 2) 329 300 1.85 19.1 34.6 267 2.20 21.5 - II 3 P12, HPTP
SKiiP 39GB12E4V1 2) 388 400 1.80 20.8 49.7 363 2.20 30.2 - II 3 P12, HPTP
SKiiP 23NAB12T4V2 2) 37 25 1.85 3.1 2.56 32 2.41 1.4 370 II 2 P12, HPTP
SKiiP 24NAB12T4V4 2) 48 35 1.85 4.3 3.25 40 2.30 2.4 370 II 2 P12, HPTP
SKiiP 39GA12T4V1 2) 167 150 1.85 22.5 14 136 2.14 11.4 - II 3 P12, HPTP
2 2
SKiiP 23NAB12T4V10 37 25 1.85 2.65 2.3 30 2.41 1.6 700 II 2 P12, HPTP
SKiiP 24NAB12T4V1 48 35 1.85 4.3 3.25 44 2.30 2.4 370 II 2 P12, HPTP
SKiiP 24NAB12T4V10 48 35 1.85 4.3 3.25 44 2.30 2.4 700 II 2 P12, HPTP
SKiiP 26GH12T4V11 90 70 1.85 9.5 7.1 83 2.17 5.6 - II 2 P12, HPTP
SKiiP 34NAB12T4V1 52 35 1.85 4.3 3.3 44 2.30 2.4 370 II 3 P12, HPTP
SKiiP 35NAB12T4V1 69 50 1.85 6 4.7 60 2.22 3.4 700 II 3 P12, HPTP
SKiiP 37NAB12T4V1 90 75 1.85 9.7 6.8 83 2.17 4.9 700 II 3 P12, HPTP
SKiiP 37NAB12T4V10 90 75 1.85 9.7 6.8 83 2.17 4.9 850 II 3 P12, HPTP
SKiiP 39MLI12T4V1 1) 167 150 1.85 11.1 16.9 134 2.14 10.9 - II 3 P12, HPTP SKiiP 38NAB12T4V1 115 100 1.80 11.2 10 99 2.20 6.5 1000 II 3 P12, HPTP
3
SKiiP 12ACC12T4V10 2) 28 15 1.85 2.1 1.6 23 2.38 0.8 60 II 1 P12, HPTP
SKiiP 23ACC12T4V10 2) 41 25 1.85 3.5 2.7 32 2.41 1.15 65 II 2 P12, HPTP
SKiiP 24ACC12T4V10 2) 52 35 1.85 3.9 3.5 44 2.30 2.3 100 II 2 P12, HPTP
SKiiP 39TMLI12T4V2 2) 235 200 1.80 7.5 12.8 194 2.20 9.7 - II 3 P12, HPTP SKiiP 24ACC12T4V1 2) 38 25 1.85 3.2 3 31 2.41 1.4 - II 2 P12, HPTP
SKiiP 10NAB12T4V1 6 4 1.85 0.66 0.37 7.5 1.82 0.34 220 II 1 P12, HPTP
SKiiP 11NAB12T4V1 18 8 1.85 0.87 0.74 15 2.33 0.57 220 II 1 P12, HPTP
6
SKiiP39MLIT12F4V221) 409 400 2.05 t.b.d. t.b.d. 193 2.20 t.b.d. - II 3 P12, HPTP
SKiiP 12NAB12T4V1 28 15 1.85 1.4 1.3 23 2.38 1.1 220 II 1 P12, HPTP
SKiiP 23NAB12T4V1 37 25 1.85 2.65 2.3 32 2.41 1.6 370 II 2 P12, HPTP
44 SEMIKRON SEMIKRON 45
COVER CONTENT BACKCOVER
MiniSKiiP II 0
Thermal Interface
VF @ Tj = 25°C typ.
IFSM @ Tj = 25°C
IC @ TS= 25°C
IF@ TS = 25°C
Material
Package
ICnom
Eoff
Eon
Err
A A V mJ mJ A V mJ A Topology 1
1200V - IGBT4 (Fast Trench)
SKiiP39MLIB12F4V1 1) 409 400 2.05 t.b.d. t.b.d. 193 2.20 t.b.d. - II 3 P12, HPTP
MiniSKiiP II 1
SKiiP39MLIB12F4V221) 409 400 2.05 t.b.d. t.b.d. 193 2.20 t.b.d. - II 3 P12, HPTP
2 2
SKiiP 24NAB176V1 2) 38 29 2.00 5.1 6.3 48 2.00 4.9 370 II 2 P12, HPTP
4
SKiiP 34NAB176V3 2) 67 58 2.00 11.2 12.8 66 2.06 6.6 635 II 3 P12, HPTP
Dimensions in mm
46 SEMIKRON SEMIKRON 47
COVER CONTENT BACKCOVER
Type IGBT Diode Rectifier Module Type IGBT Diode Rectifier Module
Thermal Interface
VF @ Tj = 25°C typ.
VF @ Tj = 25°C typ.
IFSM @ Tj = 25°C
IFSM @ Tj = 25°C
IC @ TS= 25°C
IC @ TS= 25°C
IF@ TS = 25°C
IF@ TS = 25°C
Material
Material
Package
Package
ICnom
ICnom
Eoff
Eoff
Eon
Eon
Err
Err
A A V mJ mJ A V mJ A Topology A A V mJ mJ A V mJ A Topology 1
600V - IGBT3 (Trench) 600V - NPT IGBT (Standard)
SK 75 GB 066 T 77 75 1.45 3.1 2.8 62 1.35 0.85 - 3 P12, HPTP SK 45 GAL 063 3) 45 50 2.10 1.4 1.2 57 1.45 0.25 - 2 P12
SK 100 GB 066 T 96 100 1.45 7 6 108 1.35 1.7 - 3 P12, HPTP
SK 150 GB 066 T 124 150 1.45 6.25 5.7 135 1.35 1.7 - 3 P12, HPTP
SK 30 GBB 066 T 40 30 1.45 0.97 1.77 36 1.45 0.26 - 3 P12, HPTP
SK 50 GBB 066 T 60 50 1.45 2.2 1.73 56 1.50 0.72 - 3 P12, HPTP SK 45 GAR 063 3) 45 50 2.10 1.4 1.2 57 1.45 0.25 - 2 P12
SK 75 GBB 066 T 77 75 1.45 3.1 2.8 77 1.35 0.85 - 3 P12, HPTP
2 2
SK 30 GD 066 ETp 1) 40 30 1.45 0.97 1.77 36 1.45 0.26 - 3p P12, HPTP SK 13 GD 063 3) 18 10 2.10 0.6 0.4 22 1.45 0.1 - 3 P12, HPTP
SK 25 GD 063 3) 30 30 2.10 1.3 0.9 36 1.45 0.25 - 3 P12, HPTP
4
SK 45 GD 063 3) 45 50 2.10 1.4 1.2 36 1.45 0.25 - 3 P12, HPTP
SK 50 DGDL 066 ETE2 1) 53 50 1.45 0.85 1.6 51 1.00 0.9 520 E2 HPTP, HT 6
Footnotes: 1) Sample status / 2) In production new / 3) Not for new designs / 4) Discontinued SK 50 GARL 065 F 4) 54 60 1.70 1.03 0.8 82 1.70 0.45 - 2 P12
SK 50 GARL 065 USA 4) 54 60 1.70 1.07 0.76 64 1.40 0.55 - 2 P12
Footnotes: 1) Sample status / 2) In production new / 3) Not for new designs / 4) Discontinued
48 SEMIKRON SEMIKRON 49
COVER CONTENT BACKCOVER
Type IGBT Diode Rectifier Module Type IGBT Diode Rectifier Module
Thermal Interface
VF @ Tj = 25°C typ.
VF @ Tj = 25°C typ.
IFSM @ Tj = 25°C
IFSM @ Tj = 25°C
IC @ TS= 25°C
IC @ TS= 25°C
IF@ TS = 25°C
IF@ TS = 25°C
Material
Material
Package
Package
ICnom
ICnom
Eoff
Eoff
Eon
Eon
Err
Err
A A V mJ mJ A V mJ A Topology A A V mJ mJ A V mJ A Topology 1
600V - NPT IGBT (Ultrafast) 650V - IGBT3 (Fast Trench)
SK 55 GARL 065 E 3) 54 60 1.70 1.1 0.76 36 1.45 0.9 - 3 P12, HPTP SK100MLI07F3TD1p 2) 109 100 1.85 4.6 1 137 1.37 1.76 - 4p P12, HPTP
SK 75 GARL 065 E 3) 80 90 1.70 2.71 2.75 57 1.30 0.2 - 3 P12, HPTP SK 150 MLI 07F3 TD1p 2) 151 150 1.85 9.07 1.3 137 1.37 1.76 - 4p P12, HPTP
SK 100 GD 07F3 TD1 2) 104 100 1.85 3.92 2.1 95 1.35 0.92 - 4 P12, HPTP
SK 50 GH 065 F 3) 54 60 2.00 1.07 1.76 82 1.10 0.42 - 3 P12, HPTP
2 2
SK150DBB07F3TD1p 2) 74 150 1.85 1.52 0.65 108 1.35 0.9 - 4p P12, HPTP
SK100DBB07F3TD1p 2) 54 100 1.85 1 0.5 115 1.35 0.7 - 4p P12, HPTP
SK 35 GD 065 ET 3) 45 50 2.00 1.3 0.6 36 1.90 0.9 - 3 P12, HPTP
SK 10 BGD 065 ET 4) 17 6 2.00 0.18 0.13 22 1.30 0.18 220 3 P12, HPTP
SK 9 BGD 065 ET 3) 12 6 2.00 0.22 0.12 20 1.35 0.31 220 3 P12, HPTP
SK 9 DGD 065 ET 3) 12 6 2.00 0.22 0.12 20 1.35 0.31 220 3 P12, HPTP
SK 20 DGD 065 ET 3) 26 20 2.00 0.66 0.4 25 1.60 t.b.d. 370 3 P12, HPTP
Footnotes: 1) Sample status / 2) In production new / 3) Not for new designs / 4) Discontinued
Footnotes: 1) Sample status / 2) In production new / 3) Not for new designs / 4) Discontinued
50 SEMIKRON SEMIKRON 51
COVER CONTENT BACKCOVER
Type IGBT Diode Rectifier Module Type IGBT Diode Rectifier Module
Thermal Interface
VF @ Tj = 25°C typ.
VF @ Tj = 25°C typ.
IFSM @ Tj = 25°C
IFSM @ Tj = 25°C
IC @ TS= 25°C
IC @ TS= 25°C
IF@ TS = 25°C
IF@ TS = 25°C
Material
Material
Package
Package
ICnom
ICnom
Eoff
Eoff
Eon
Eon
Err
Err
A A V mJ mJ A V mJ A Topology A A V mJ mJ A V mJ A Topology 1
1200V - IGBT3 (Trench) 1200V - IGBT4 (Trench)
SK 50 GD 126 T 4) 68 50 1.70 4.6 6.3 62 1.35 3.6 - 4 P12, HPTP SK 50 GH 12T4 T 2) 75 50 1.80 8.3 5 56 2.20 2.15 - 4 P12, HPTP
SK 75 GD 126 T 4) 88 75 1.70 11.3 10 91 1.46 6 - 4 P12, HPTP SK 100 GH 12T4 T 126 100 1.80 16.6 10 102 2.20 5.2 - 4 P12, HPTP
SK 100 GD 126 T 4) 114 100 1.70 9.8 11.7 118 1.50 7.3 - 4 P12, HPTP
SK 50 GB 12T4 T 2) 71 50 1.85 8.3 5 50 2.20 2.15 - 3 P12, HPTP SK 50 GD 12T4 T 75 50 1.85 8.3 5 60 2.20 2.15 - 4 P12, HPTP
SK 75 GB 12T4 T 80 75 1.85 13.6 8.2 70 2.10 3.39 - 3 P12, HPTP SK 50 GD 12T4 Tp 2) 72 50 1.85 8.3 5 60 2.22 2.15 - 4p P12, HPTP
SK 100 GB 12T4 T 2) 100 100 1.85 16.6 10 85 2.25 5.2 - 3 P12, HPTP SK 75 GD 12T4 T 102 75 1.85 13.6 8.2 83 2.20 3.38 - 4 P12, HPTP
SK 75 GD 12T4 Tp 1) 97 75 1.85 13.6 8.2 83 2.17 3.38 - 4p P12, HPTP
SK 200 GB 12T4 Tp 1) 210 200 1.80 13.6 22.1 190 2.20 13.4 - 4p P12, HPTP
SK 100 GD 12T4 T 126 100 1.85 16.6 10 102 2.25 5.2 - 4 P12, HPTP
SK 10 DGDL 12T4 ET 17 8 1.85 0.41 0.75 15 2.38 0.41 220 3 P12, HPTP 5
SK 15 DGDL 12T4 ET 27 15 1.85 0.82 1.52 21 2.38 0.82 220 3 P12, HPTP
SK 150 GAH 12T4 Tp 1) 167 150 1.85 10.8 15.6 33 2.33 0.82 - 4p P12, HPTP SK 25 DGDL 12T4 T 45 25 1.85 2.27 2.7 30 2.40 t.b.d. 370 4 P12, HPTP
SK 25 GH 12T4 2) 35 25 1.85 2.27 2.7 28 2.41 1.28 - 3 P12, HPTP SK 25 DGDL 12T4 ETE2 1) 33 25 1.85 2.6 2.35 53 1.00 2.05 520 E2 HPTP, HT
6
SK 35 DGDL 12T4 T 58 35 1.85 3.27 3.3 46 2.30 1.46 370 4 P12, HPTP
Footnotes: 1) Sample status / 2) In production new / 3) Not for new designs / 4) Discontinued
Footnotes: 1) Sample status / 2) In production new / 3) Not for new designs / 4) Discontinued
52 SEMIKRON SEMIKRON 53
COVER CONTENT BACKCOVER
Type IGBT Diode Rectifier Module Type IGBT Diode Rectifier Module
Thermal Interface
VF @ Tj = 25°C typ.
VF @ Tj = 25°C typ.
IFSM @ Tj = 25°C
IFSM @ Tj = 25°C
IC @ TS= 25°C
IC @ TS= 25°C
IF@ TS = 25°C
IF@ TS = 25°C
Material
Material
Package
Package
ICnom
ICnom
Eoff
Eoff
Eon
Eon
Err
Err
A A V mJ mJ A V mJ A Topology A A V mJ mJ A V mJ A Topology 1
1200V - IGBT4 (Trench) 1200V - NPT IGBT (Ultrafast)
SK 35 DGDL 12T4 ETE2 1) 43 35 1.85 3.15 3.2 53 1.00 2.6 520 E2 HPTP, HT SK 60 GAR 125 4) 51 50 3.20 8.36 3.32 43 2.00 2 - 2 P12
2 2
SK25GD12T4ETE1 1) 33 25 1.85 2.6 2.35 29 2.41 2.05 - E1 -
SK 80 GB 125 T 85 75 3.20 9.9 5 90 2.00 1 - 3 P12, HPTP
SK35GD12T4ETE1 1) 43 35 1.85 3.15 3.2 38 2.30 2.6 - E1 -
Footnotes: 1) Sample status / 2) In production new / 3) Not for new designs / 4) Discontinued
SK50GD12T4ETE2 1) 66 50 1.85 5.8 4.5 59 2.22 3.6 - E2 HPTP, HT
SK75GD12T4ETE2 1) 84 75 1.85 8 6.4 82 2.17 5.5 - E2 HPTP, HT
3
1200V - IGBT4 (Fast Trench)
SK 120 GB 12F4 T 1) 174 120 2.05 8.8 7.47 29 2.38 2.04 - 3 P12, HPTP
SK 150 MLIT 12F4 TE2 1) 149 150 2.05 12.6 11 80 2.20 8.3 - E2 HPTP, HT
SK 150 MLIB 12F4 TE2 1) 149 150 2.05 12.6 11 80 2.20 8.3 - E2 HPTP, HT
6
1200V - NPT IGBT (Ultrafast)
SK 60 GAL 125 3) 51 50 3.20 8.36 3.32 43 2.00 2 - 2 P12
Footnotes: 1) Sample status / 2) In production new / 3) Not for new designs / 4) Discontinued
54 SEMIKRON SEMIKRON 55
COVER CONTENT BACKCOVER
Packages Packages
7.97408
SEMITOP 2 SEMITOP E1
2 6.705
8.08732 8.07255
2
SEMITOP 3 SEMITOP 3 Press-Fit
SEMITOP E2
4
6.59769 6.58582
8.07333 8.07244
Dimensions in mm 5
7.58046 7.58047
Dimensions in mm
56 SEMIKRON SEMIKRON 57
COVER CONTENT BACKCOVER
Thermal Interface
VF @ Tj = 25°C typ.
VF @ Tj = 25°C typ.
IC @ TC= 25°C
IC @ TC= 25°C
IF@ TC = 25°C
IF@ TC = 25°C
Material
Material
Package
Package
ICnom
ICnom
Eoff
Eoff
Eon
Eon
Err
Err
A A V mJ mJ A V mJ Topology A A V mJ mJ A V mJ Topology 1
600V - IGBT3 (Trench) 1200V - V-IGBT
SEMiX402GAL066HDs 502 400 1.45 22 24 543 1.40 10 2s P8 SEMiX101GD12Vs 159 100 1.75 13 11 121 2.20 7.7 13 P8
SEMiX603GAL066HDs 720 600 1.45 12 43 771 1.40 13 3s P8, HT SEMiX151GD12Vs 231 150 1.75 19 17 189 2.14 12 13 P8
58 SEMIKRON SEMIKRON 59
COVER CONTENT BACKCOVER
Thermal Interface
VF @ Tj = 25°C typ.
VF @ Tj = 25°C typ.
IC @ TC= 25°C
IC @ TC= 25°C
IF@ TC = 25°C
IF@ TC = 25°C
Material
Material
Package
Package
ICnom
ICnom
Eoff
Eoff
Eon
Eon
Err
Err
A A V mJ mJ A V mJ Topology A A V mJ mJ A V mJ Topology 1
1200V - IGBT4 (Trench) 1200V - IGBT3 (Trench)
SEMiX71GD12E4s 115 75 1.85 7.5 9 97 2.17 5.3 13 P8 SEMiX353GD126HDc 364 225 1.70 27 33 329 1.60 29 33c P8
SEMiX101GD12E4s 160 100 1.80 11 13 121 2.20 6.5 13 P8 SEMiX503GD126HDc 466 300 1.70 28 44 412 1.60 33 33c P8
SEMiX151GD12E4s 232 150 1.80 14 19 189 2.14 8.9 13 P8 SEMiX703GD126HDc 642 450 1.70 32 68 561 1.59 60 33c P8
5
1700V - IGBT3 (Trench)
SEMiX252GB126HDs 242 150 1.70 20 21 228 1.60 18 2s P8 SEMiX653GAL176HDs 619 450 2.00 300 180 545 1.70 73 3s P8, HT
SEMiX302GB126HDs 311 200 1.70 30 26 292 1.60 23 2s P8
SEMiX353GB126HDs 364 225 1.70 27 33 329 1.60 29 3s P8, HT
SEMiX452GB126HDs 455 300 1.70 35 45 394 1.60 33 2s P8
SEMiX503GB126HDs 466 300 1.70 28 44 431 1.60 33 3s P8, HT
SEMiX653GAR176HDs 619 450 2.00 300 180 545 1.70 73 3s P8, HT
SEMiX604GB126HDs 590 400 1.70 36 60 533 1.60 46 4s HT
SEMiX703GB126HDs 642 450 1.70 32 68 561 1.60 60 3s P8, HT
SEMiX904GB126HDs 821 600 1.70 60 88 752 1.60 75 4s HT 6
SEMiX101GD126HDs 129 75 1.70 10 11 117 1.60 9 13 P8
SEMiX151GD126HDs 168 100 1.70 12 14 152 1.60 12 13 P8 SEMiX252GB176HDs 246 150 2.00 90 55 288 1.55 32 2s P8
SEMiX251GD126HDs 242 150 1.70 19 22 207 1.60 15 13 P8 SEMiX302GB176HDs 308 200 2.00 130 77 389 1.50 43 2s P8
SEMiX353GB176HDs 353 225 2.00 155 85 428 1.55 45 3s P8, HT
SEMiX452GB176HDs 437 300 2.00 180 110 389 1.70 46 2s P8
Footnotes: 1) Sample status / 2) In production new
SEMiX453GB176HDs 444 300 2.00 215 125 545 1.50 65 3s P8, HT
SEMiX604GB176HDs 567 400 2.00 215 165 740 1.50 95 4s HT
Footnotes: 1) Sample status / 2) In production new
60 SEMIKRON SEMIKRON 61
COVER CONTENT BACKCOVER
SEMiX 3s SEMiX 3p
Thermal Interface
VF @ Tj = 25°C typ.
IC @ TC= 25°C
IF@ TC = 25°C
Material
Package
ICnom
Eoff
Eon
Err
A A V mJ mJ A V mJ Topology 1
1700V - IGBT3 (Trench)
SEMiX653GB176HDs 619 450 2.00 300 180 545 1.70 73 3s P8, HT
SEMiX854GB176HDs 779 600 2.00 300 250 740 1.70 170 4s HT
Packages
5.42167 6.255
SEMiX 1s SEMiX 2s
7.095 42.1875
3
7.92416 4.665
6.28833 6.14667
Dimensions in mm
7.67991 4.555 6
Dimensions in mm
62 SEMIKRON SEMIKRON 63
COVER CONTENT BACKCOVER
Thermal Interface
VF @ Tj = 25°C typ.
IC @ TC= 25°C
IF@ TC = 25°C
Material
Package
ICnom
Eoff
Eon
Err
A A V mJ mJ A V mJ Topology 1
600V - IGBT3 (Trench)
SKM145GB066D 195 150 1.46 8.5 5.5 150 1.40 3.5 2 HT
SKM195GB066D 265 200 1.46 14 8 200 1.40 5.6 2 HT
SKM300GB066D 390 300 1.45 7.5 11.5 350 1.38 10.5 3 P8
SKM400GB066D 500 400 1.45 8 16 450 1.40 14 3 P8
SKM600GB066D 760 600 1.45 7.5 29.5 700 1.40 25 3 P8
SKM200GARL066T 2) 280 200 1.45 2.24 7.89 270 1.45 4 5 -
SKM300GARL066T 2) 393 300 1.45 3.5 10.1 421 1.54 4 5 -
2 SKM400GARL066T 1) 504 400 1.45 4.48 15.78 421 1.54 8 5 - 2
SKM150MLI066TAT 1) 200 150 1.45 1.7 5.1 200 1.35 2 5 -
SKM200MLI066TAT 2) 280 200 1.45 2.53 6.82 270 1.4 4 5 -
SKM300MLI066TAT 2)
400 300 1.45 3.5 10.1 324 1.35 4 5 -
Footnotes: 1) Sample status / 2) In production new / 3) Not for new designs / 11) Values at Tj=150°C
64 SEMIKRON SEMIKRON 65
COVER CONTENT BACKCOVER
Thermal Interface
VF @ Tj = 25°C typ.
VF @ Tj = 25°C typ.
IC @ TC= 25°C
IC @ TC= 25°C
IF@ TC = 25°C
IF@ TC = 25°C
Material
Material
Package
Package
ICnom
ICnom
Eoff
Eoff
Eon
Eon
Err
Err
A A V mJ mJ A V mJ Topology A A V mJ mJ A V mJ Topology 1
1200V - NPT IGBT (Ultrafast) 1200V - V-IGBT
SKM200GAR125D 200 150 3.3 14 8 200 2.06 8 3 P8 SKM50GB12V 77 50 1.84 4.9 4.5 65 2.22 2.8 2 HT
SKM400GAR125D 400 300 3.3 17 18 390 2.06 16 3 P8 SKM75GB12V 114 75 1.84 6.7 7.1 97 2.17 4.2 2 HT
SKM100GB12V 159 100 1.75 10.7 8.7 121 2.20 5.7 2 HT
SKM150GB12V 231 150 1.75 13.5 14.2 189 2.14 8.5 2 HT
SKM150GB12VG 222 150 1.86 10 16.5 187 2.17 11 3 P8
SKM100GB125DN 100 75 3.3 9 3.5 95 2.06 4 2N -
SKM200GB12V 311 200 1.76 14 22 229 2.20 13 3 P8
SKM200GB125D 200 150 3.3 14 8 200 2.06 8 3 P8
SKM300GB12V 420 300 1.84 23 33 353 2.17 21 3 P8
SKM300GB125D 300 200 3.3 16 11 260 2.00 13 3 P8
2 SKM400GB12V 612 400 1.74 39 42 440 2.20 26 3 P8 2
SKM400GB125D 400 300 3.3 17 18 390 2.06 16 3 P8
Footnotes: 1) Sample status / 2) In production new / 3) Not for new designs / 11) Values at Tj=150°C
66 SEMIKRON SEMIKRON 67
COVER CONTENT BACKCOVER
Thermal Interface
VF @ Tj = 25°C typ.
VF @ Tj = 25°C typ.
IC @ TC= 25°C
IC @ TC= 25°C
IF@ TC = 25°C
IF@ TC = 25°C
Material
Material
Package
Package
ICnom
ICnom
Eoff
Eoff
Eon
Eon
Err
Err
A A V mJ mJ A V mJ Topology A A V mJ mJ A V mJ Topology 1
1200V - IGBT4 Fast (Trench) 1200V - IGBT4 High Power (Trench)
SKM50GAL12T4 81 50 1.85 5.5 4.5 65 2.22 3.6 2 HT SKM1400GB12P4 2) 2165 1400 1.75 150 277 1768 2.06 85 10 HT
SKM100GAL12T4 160 100 1.80 15 10.2 121 2.20 5.9 2 HT
SKM150GAL12T4 232 150 1.81 19.2 15.8 189 2.14 13 2 HT
SKM200GAL12T4 313 200 1.80 21 20 229 2.20 13 3 P8
SKM300GAL12T4 422 300 1.85 27 29 353 2.17 23 3 P8
SKM400GAL12T4 616 400 1.80 33 42 461 2.20 30.5 3 P8
SKM600GAL12T42) 860 600 1.80 33 70 623 2.28 40 3 P8 1700V - IGBT3 (Trench)
2 SKM150GAR12T4 232 150 1.81 19.2 15.8 189 2.14 13 2 HT 2
SKM600GA176D 660 400 2.00 255 155 600 1.6 102 4 P8
SKM400GAR12T4 616 400 1.80 33 42 461 2.20 30.5 3 P8
SKM800GA176D 830 600 2.00 335 245 630 1.6 155 4 P8
SKM600GAR12T42) 860 600 1.80 33 70 623 2.28 40 3 P8
SKM50GB12T4 81 50 1.85 5.5 4.5 65 2.22 3.8 2 HT SKM145GAL176D 160 100 2.00 60 38 140 1.6 27.5 2 HT
SKM75GB12T4 115 75 1.85 11 6.9 97 2.17 4.7 2 HT SKM200GAL176D 260 150 2.01 93 58 210 1.70 31 3 P8
SKM100GB12T4 160 100 1.80 15 10.2 121 2.20 5.9 2 HT SKM400GAL176D 432 300 1.99 170 118 440 1.70 78 3 P8
SKM100GB12T4G 154 100 1.90 16.1 8.6 118 2.22 6 3 P8
SKM150GB12T4 232 150 1.81 19.2 15.8 189 2.14 13 2 HT SKM400GAR176D 432 300 1.99 170 118 440 1.70 78 3 P8
SKM150GB12T4G 223 150 1.85 18.7 14.1 183 2.17 9 3 P8 3
SKM200GB12T4 313 200 1.80 21 20 229 2.20 13 3 P8
SKM300GB12T4 422 300 1.85 27 29 353 2.17 23 3 P8
SKM400GB12T4 616 400 1.80 33 42 461 2.20 30.5 3 P8
SKM75GB176D 80 50 2.00 25 18 80 1.70 14.5 2 HT
SKM450GB12T4 2) 699 450 1.84 32 49 461 2.31 28 3 P8
SKM100GB176D 125 75 1.98 44 28.5 100 1.6 21.4 2 HT
SKM600GB12T42) 860 600 1.80 33 70 623 2.28 40 3 P8
SKM145GB176D 160 100 2.00 60 38 140 1.6 27.5 2 HT
SKM150GM12T4G 229 150 1.85 19.2 15.8 187 2.17 13 3 P8
SKM200GB176D 260 150 2.01 93 58 210 1.70 31 3 P8
SKM200GM12T4 313 200 1.80 21 20 229 2.20 13 3 P8
SKM400GB176D 432 300 1.99 170 118 440 1.70 78 3 P8
SKM300GM12T4 422 300 1.85 27 29 353 2.17 23 3 P8
SKM400GM12T4 616 400 1.80 33 42 461 2.20 30.5 3 P8 1700V - IGBT4 (Trench) 4
SKM300GBD12T4 422 300 1.85 27 29 56 2.41 30.5 3 P8 SKM600GA17E4 1021 600 1.90 258 246 629 1.98 132 4 P8
1200V - IGBT4 High Speed (Trench) (new product series, target data) SKM100GAL17E4 164 100 1.90 43 39 113 2.00 26 2 HT
SKM100GAL12F42) 142 100 2.05 6.2 7.9 111 2.55 6.4 2 HT SKM200GAL17E4 321 200 1.90 69 79 213 2.00 45 3 P8
SKM400GAL12F4 1) 548 400 2.06 26 28 402 2.55 20 3 P8 SKM400GAL17E4 614 400 1.92 156.5 180 443 2.00 130 3 P8
Footnotes: 1) Sample status / 2) In production new / 3) Not for new designs / 11) Values at Tj=150°C
68 SEMIKRON SEMIKRON 69
COVER CONTENT BACKCOVER
SEMITRANS 3 SEMITRANS 4
Thermal Interface
VF @ Tj = 25°C typ.
IC @ TC= 25°C
IF@ TC = 25°C
Material
Package
ICnom
Eoff
Eon
Err
A A V mJ mJ A V mJ Topology 1
1700V - IGBT4 (Trench) chip - dedicated for humid environment (target data)
SKM75GB17E4H16 2) 132 75 1.93 37 29 88 2.00 18 2 HT
SKM150GB17E4GH16 2) 255 150 1.96 69 59 163 2.00 36 3 P8
SKM300GB17E4H16 2) 500 300 1.97 106 122 314 2.00 71 3 P8
3
Footnotes: 1) Sample status / 2) In production new / 3) Not for new designs / 11) Values at Tj=150°C
2.67601 2.67463
5.96 2.35294
SEMITRANS 5 SEMITRANS 6
Packages
2.40154 5
SEMITRANS 2 SEMITRANS 2N
6
2.67568 5.74667
Dimensions in mm
5.65833 2.67474
Dimensions in mm
70 SEMIKRON SEMIKRON 71
COVER CONTENT BACKCOVER
Thermal Interface
VF @ Tj = 25°C typ.
IC @ TS= 25°C
IF@ TS = 25°C
Material
Package
ICnom
Eoff
Eon
Err
A A V mJ mJ A V mJ Topology 1
600V - IGBT3 (Trench)
SKiM301MLI07E4 252 300 1.55 2.8 17 177 1.40 - 4 P12 + HPTP
SKiM401MLI07E4 314 400 1.55 3.3 21 289 1.40 1.8 4 P12 + HPTP
SKiM601MLI07E4 433 600 1.55 6.1 44 318 1.39 2.4 4 P12 + HPTP
SEMITRANS 20
4
1200V - IGBT4 (Trench)
SKiM301TMLI12E4B 311 300 1.80 6.6 19 249 2.20 1.8 4 P12 + HPTP
SKiM401TMLI12E4B 388 400 1.80 8.8 26 311 2.20 2.4 4 P12 + HPTP
SKiM601TMLI12E4B 529 600 1.80 11 45 495 2.14 4.4 4 P12 + HPTP
Dimensions in mm
72 SEMIKRON SEMIKRON 73
COVER CONTENT BACKCOVER
Thermal Interface
VF @ Tj = 25°C typ.
VF @ Tj = 25°C typ.
IC @ TS= 25°C
IC @ TS= 25°C
IF@ TS = 25°C
IF@ TS = 25°C
Material
Material
Package
Package
ICnom
ICnom
Eoff
Eoff
Eon
Eon
Err
Err
A A V mJ mJ A V mJ Topology A A V mJ mJ A V mJ Topology 1
1700V - IGBT3 (Trench) 600V - IGBT3 (Trench)
SKiM120GD176D 110 125 2.00 72 46 105 1.6 22 4 P12 + HPTP SKiM406GD066HD10) 468 400 1.45 8 25 360 1.53 12 63 P12, HPTP
SKiM220GD176DH4 220 250 2.00 145 100 220 1.7 65 4 P12 + HPTP SKiM606GD066HD10) 640 600 1.45 16 53 462 1.52 21 63 P12, HPTP
SKiM909GD066HD10) 897 900 1.45 36 88 690 1.52 29 93 P12, HPTP
5
Footnotes: 10) Also available with new HpTp, see Accessories/Thermal Interface Materials
6.63667 6.57
Dimensions in mm
74 SEMIKRON SEMIKRON 75
COVER CONTENT BACKCOVER
Packages
SKiM 63
2 2
SKiM 93
Dimensions in mm
7
76 SEMIKRON SEMIKRON 77
COVER CONTENT BACKCOVER
MiniSKiiP ® 1200V
SEMIKRON offers full silicon carbide power modules in MiniSKiiP, SEMITOP Sixpack
The increase in switching frequency means passive filter components SEMITOP ® 1200V
can be drastically reduced. Power losses are reduced at the same time, Sixpack
Chopper
resulting in smaller heat sinks and reducing cooling needs in general. H-Bridge
Both benefits result in a major decrease in overall system costs. Half-Bridge
Rectifier I in A 0 40 60 80 100 200 300 400 500 600
The full silicon carbide power modules are available from 20A to 540A in 2
1200V, with and without anti-parallel free-wheeling Schottky diode. The SEMITRANS ® 1200V
Half-Bridge
standard topology sixpacks in classic configuration but split output is also
an option that allows for flexible adaption to your application.
Other half-bridges and boost converters including a bypass diode are I in A 0 40 60 80 100 200 300 400 500 600
also available. Beside its SiC MOSFET module portfolio, SEMIKRON offers 3
also single SiC Schottky diodes in SEMIPACK 2 housing. SEMIPACK ® 2 1200V
Rectifier
Full SiC
MiniSKiiP 80
SEMITOP 82
6
SEMITRANS 86
SEMIPACK 87
Further information
http://www.semikron.com/full-sic
7
78 SEMIKRON SEMIKRON 79
COVER CONTENT BACKCOVER
SiC Modules / Full SiC / MiniSKiiP SiC Modules / Full SiC / MiniSKiiP
Type Packages
MiniSKiiP II 2
Thermal Interface
ID @ TC = 25°C
Material
Package
VDS
V A mΩ Topology 1
1200V - SiC MOSFET
SKiiP 13ACM12V17 1) 1200 25 80 II 1 P12, HPTP
Packages
MiniSKiiP II 1
Dimensions in mm
80 SEMIKRON SEMIKRON 81
COVER CONTENT BACKCOVER
SiC Modules / Full SiC / SEMITOP SiC Modules / Full SiC / SEMITOP
Type Type
Thermal Interface
ID @ TC = 25°C
ID @ TC = 25°C
Material
Material
Package
Package
VDS
VDS
V A mΩ Topology V A mΩ Topology 1
1200V - SiC MOSFET SEMITOP rectifier module
SK45MH120TSCp 1) 1200 40 45 2p P12 SK70B12SCTE1 1) 1200 54 - E1 -
SK25MH120SCTp 1) 1200 26 80 2p P12
SK35MLLE120SCp 1)
1200 36 40 2p P12
4
SK50BMB120SCTE2 1) 1200 52 80 E2 HPTP, HT
82 SEMIKRON SEMIKRON 83
COVER CONTENT BACKCOVER
SiC Modules / Full SiC / SEMITOP SiC Modules / Full SiC / SEMITOP
Packages Packages
2 2
SEMITOP 3 Press-Fit
Dimensions in mm
SEMITOP E1
Dimensions in mm
84 SEMIKRON SEMIKRON 85
COVER CONTENT BACKCOVER
SiC Modules / Full SiC / SEMITRANS SiC Modules / Full SiC / SEMIPACK
Type Type
rF @ Tj = 150°C max.
Thermal Interface
Thermal Interface
ID @ TC = 25°C
VRRM VDRM
Material
Package
IFAV @ TC
Material
Package
VDS
TC
Tj
V A mΩ Topology V A °C V mΩ °C Topology
1
SKKE60S12 1) 1200 64 85 0.90 15 -40 ... +175 2 -
1200V - SiC MOSFET
SKKE300S12 1) 1200 400 85 0.90 3.0 -40 ... +175 2 -
SKM350MB120SCH15 1) 1200 523 5.6 3 P8
SKM500MB120SC 1) 1200 541 3.8 3 P8 Footnotes: 1) Sample status
SEMIPACK 2
2 2
1200V - SiC Rectifier
SKM125KD12SC 1) 1200 236 - 3 P8
Packages 3
SEMITRANS 3
Dimensions in mm 6
Dimensions in mm
86 SEMIKRON SEMIKRON 87
COVER CONTENT BACKCOVER
MiniSkiiP ® 1200V
effects, higher switching frequencies can be achieved in the same SEMiX Press-Fit ® 1200V
Half-Bridge
module package, which efficiently lowers the filter needs on the
output side, for example, of solar inverters, UPS systems or high
frequency power supplies. Higher output powers than with standard
I in A 0 40 60 80 100 200 300 400 500 600
silicon power modules can also be achieved. 3
SEMITRANS ® 1200V
Half-Bridge
4
SKiM ® 63/93 1200V
Sixpack
Hybrid SiC
MiniSKiiP 90
SEMITOP 92
SEMiX Press-Fit 95
6
SEMITRANS 96
SKiM 63/93 97
Further information
http://www.semikron.com/hybrid-sic
7
88 SEMIKRON SEMIKRON 89
COVER CONTENT BACKCOVER
SiC Modules / Hybrid SiC / MiniSKiiP SiC Modules / Hybrid SiC / MiniSKiiP
MiniSKiiP II 3
Thermal Interface
IC @ TS= 25°C
IF@ TS = 25°C
Material
Package
ICnom
Eoff
Eon
VF
A A V mJ mJ A V Topology 1
1200V - IGBT4 (Fast Trench)
SKiiP 38GB12F4V19 1) 303 300 2.05 10 22 133 1.40 II 3 P12, HPTP
Dimensions in mm
SKiiP39MLIB12F4V221) 409 400 2.05 t.b.d. t.b.d. 193 2.20 II 3 P12, HPTP
SKiiP39MLIT12F4V221) 409 400 2.05 t.b.d. t.b.d. 193 2.20 II 3 P12, HPTP 3
Packages 4
MiniSKiiP II 2
Dimensions in mm
90 SEMIKRON SEMIKRON 91
COVER CONTENT BACKCOVER
SiC Modules / Hybrid SiC / SEMITOP SiC Modules / Hybrid SiC / SEMITOP
SEMITOP 2
Thermal Interface
IC @ TS= 25°C
IF@ TS = 25°C
Material
Package
ICnom
Eoff
Eon
VF
A A V mJ mJ A V Topology 1
1200V - IGBT4 Fast (Trench)
SK 25 GAR 12F4 TSC 1) 33 25 2.05 2.27 2.7 21 1.40 2 P12
2 2
Dimensions in mm
4
600V - CoolMOS
SK35MLT60SCKE1 1) - 45 - t.b.d. t.b.d. - 1.35 E1 -
92 SEMIKRON SEMIKRON 93
COVER CONTENT BACKCOVER
SiC Modules / Hybrid SiC / SEMITOP SiC Modules / Hybrid SiC / SEMiX
Thermal Interface
IC @ TC= 25°C
IF@ TC = 25°C
Material
Package
ICnom
Eoff
Eon
VF
A A V mJ mJ A V Topology 1
1200V - IGBT4 (Trench)
SEMiX603GB12E4SiCp1) 1110 600 1.80 17 72 404 1.40 3p P8, HT
2 2
Packages
SEMiX 3p
SEMITOP E2
Dimensions in mm 5
Dimensions in mm
94 SEMIKRON SEMIKRON 95
COVER CONTENT BACKCOVER
SiC Modules / Hybrid SiC / SEMITRANS SiC Modules / Hybrid SiC / SKiM 63/93
Thermal Interface
IC @ TC= 25°C
IC @ TS= 25°C
IF@ TC = 25°C
IF@ TS = 25°C
Material
Material
Package
Package
ICnom
ICnom
Eoff
Eoff
Eon
Eon
VF
VF
A A V mJ mJ A V Topology A A V mJ mJ A V Topology 1
1200V - IGBT4 (Trench) 1200V - IGBT4 (Fast Trench)
SKM200GB12T4SiC2 1) 313 200 1.80 7 20 246 1.40 3 P8 SKiM459GD12F4V3 1) 476 450 2.05 2 11 214 1.33 93 P12, HPTP
SKiM459GD12F4V4 1) 476 450 2.05 5 20 357 1.33 93 P12, HPTP
SKiM 93
Packages
SEMITRANS 3 3
Dimensions in mm
6
Dimensions in mm
96 SEMIKRON SEMIKRON 97
COVER CONTENT BACKCOVER
MOSFET Modules
Best in Class Switching Performance
Single Switch
6
SEMITOP 100
SEMITRANS 102
98 SEMIKRON SEMIKRON 99
COVER CONTENT BACKCOVER
Type Packages
7.97408 8.08732
SEMITOP 2 SEMITOP 3
Thermal Interface
ID @ TC = 25°C
Material
Package
VDS
V A mΩ Topology 1
80V
SK300MB080 1) 80 317 0.90 3 P12, HPTP
100V
SK 85 MH 10 T 3) 100 80 - 2 P12
2 2
6.705 6.59769
Dimensions in mm
Packages
600V
SK35MLT60SCKE1 1) 600 45 37 E1 -
5
Dimensions in mm
Type
Thermal Interface
ID @ TC = 25°C
Material
Package
VDS
V A mΩ Topology 1
100V
SKM 111 AR 100 200 7 M1 -
SKM 111 RZR 100 200 7 M1 -
200V
SKM 180 A020 200 180 9 M1 -
2 2
Packages
SEMITRANS M1
Dimensions in mm
Rectifier
The product class offers a product range with voltages of up to Thyristor
2200V. Thanks to the comprehensive product range, the optimum
solution can be found for each application. 2
Rectifier
Thyristor
3
Rectifier
Thyristor 4
Thyristor 5
SEMITOP 106 Ioverload in A 0 100 500 1000 1500 2000 2500 3000
SEMiX 108
SEMIPONT 110
SEMIPACK 111
6
SEMiSTART 117
Type Packages
SEMITOP 1
Thermal Interface
ITSM IFSM @ Tjmax
VT(TO) @ Tjmax
ITAV IFAV @ TS
VRRM VDRM
rT @ Tjmax
Material
Package
TS
Tj
V A °C A V mΩ °C Topology
SK 35 TAA 2) 800-1600 35 80 380 0.85 9.10 -40 ... +130 2 P12 1
SK 55 TAA 800-1600 55 80 900 0.85 5.70 -40 ... +130 2 P12
SK 75 TAA 2) 800-1600 75 80 1500 0.90 4.50 -40 ... +130 2 P12
SK 100 TAA 2) 800-1600 100 80 2000 0.90 3.50 -40 ... +130 2 P12
2 2
SEMITOP 2
SEMITOP 3
SK 45 STA 800-1600 47 75 380 1.00 10.00 -40 ... +125 3 P12, HPTP
5
SK 25 UT 800-1600 29 85 280 1.10 20.00 -40 ... +125 3 P12, HPTP
SK 45 UT 800-1600 47 85 380 1.00 10.00 -40 ... +125 3 P12, HPTP
SK 30 DTA 800-1600 25 80 900 1.00 6.00 -40 ... +150 3 P12, HPTP
SK 60 DTA 800-1600 61 80 1350 0.90 0.60 -40 ... +125 3 P12, HPTP
SK 80 DTA 800-1600 65 80 1800 0.90 3.50 -40 ... +150 3 P12, HPTP
Dimensions in mm
Type Packages
SEMiX 3Ip
Thermal Interface
ITSM IFSM @ Tjmax
VT(TO) @ Tjmax
ITAV IFAV @ TC
VRRM VDRM
rT @ Tjmax
Material
Package
TC
Tj
V A °C A V mΩ °C Topology
SEMiX191KD16s 1600 190 85 5000 0.85 0.95 -40 ... +130 1s HT 1
SEMiX302KD16s 1600 300 85 7500 0.85 1.1 -40 ... +130 2s P8
SEMiX443KD16p1) 1600 585 85 8200 0.916 2.0 -40 ... +175 3Ip P8, HT
SEMiX603KD16p 2) 1600 732 85 9000 0.916 1.9 -40 ... +175 3Ip P8, HT
SEMiX443KD22p 2) 2200 580 85 8200 0.834 2.0 -40 ... +150 3Ip P8, HT
SEMiX171KH16s 1600 170 85 4800 0.85 1.5 -40 ... +130 1s HT
SEMiX302KH16s 1600 300 85 8000 0.85 1.1 -40 ... +130 2s P8
Packages
5.78167 6.75667
SEMiX 1s SEMiX 2s
Dimensions in mm 3
6
7.18833 7.51167
Dimensions in mm
Type Type
Thermal Interface
Thermal Interface
ITSM IFSM @ Tjmax
VT(TO) @ Tjmax
ITAV IFAV @ TC
ITAV IFAV @ TS
VRRM VDRM
VRRM VDRM
rT @ Tjmax
rT @ Tjmax
Material
Material
Package
Package
TC
TS
Tj
Tj
V A °C A V mΩ °C Topology V A °C A V mΩ °C Topology
SKUT 85/12 T V2 2) 1200 94 85 1050 1.10 6.0 -40 ... +125 5 - SKET 330 800-2200 295 85 8000 1.20 0.55 -40 ... +130 4 - 1
SKET 400 800-1800 392 85 12000 0.92 0.3 -40 ... +130 4 -
SKET 741/22 E 2200 819 85 26500 0.82 0.17 -40 ... +125 6 -
SKWT 40 1)
800-2200 40 85 580 0.9 6.0 -40 ... +125 1 - SKET 801/18 E 1800 819 85 30000 0.82 0.17 -40 ... +125 6 -
SKKE 15 600-1600 14 85 280 0.85 15 -40 ... +125 0 -
SKKE 81 800-1600 82 85 1750 0.85 1.8 -40 ... +125 1 -
SKKE 162 800-2200 195 85 5000 0.85 1.2 -40 ... +135 2 HT
SKUT 85/16 T V2 2) 1600 94 85 1050 1.10 6.0 -40 ... +125 5 - SKKE 212/16 H2 1600 213 85 5500 0.75 1.05 -40 ... +135 2 HT
SKUT 115/12T V2 2) 1200 127 85 1250 0.90 5 -40 ... +125 5 - SKKE 380 1200-1600 380 100 10000 0.80 0.35 -40 ... +150 3 -
SKUT 115/16T V2 2) 1600 127 85 1250 0.90 5 -40 ... +125 5 - SKKE 600 1200-2200 600 100 18000 0.75 0.25 -40 ... +150 4 -
2 2
SKUT 85/12 V2 2)
1200 85 85 1050 1.1 6.0 -40 ... +125 5 - SKKE 1201/22 2200 1360 85 35000 0.75 0.073 -40 ... +125 6 -
SKUT 85/16 V2 2)
1600 85 85 1050 1.1 6.0 -40 ... +125 5 - SKKL 92 800-1800 95 85 1750 0.90 2 -40 ... +125 1 -
SKUT 115/12 V2 2) 1200 105 85 1250 0.9 5.0 -40 ... +125 5 -
SKUT 115/16 V2 2) 1600 105 85 1250 0.9 5.0 -40 ... +125 5 -
SKMT 92 800-1800 95 85 1750 0.90 2 -40 ... +125 1 -
Footnotes: 1) Sample status / 2) In production new
Dimensions in mm SKKH 132 H4 2000-2200 128 85 3800 1.10 2 -40 ... +125 2 HT
SKKH 162 800-1800 156 85 5000 0.85 1.5 -40 ... +125 2 HT
SKKH 162 H4 2000-2200 143 85 4800 0.95 2 -40 ... +125 2 HT
SKKH 172/16 E 1600 175 85 5000 0.83 1.3 -40 ... +125 2 HT 6
Type Packages
4.04667 5.54518
SEMIPACK 0 SEMIPACK 1
Thermal Interface
ITSM IFSM @ Tjmax
VT(TO) @ Tjmax
ITAV IFAV @ TC
VRRM VDRM
rT @ Tjmax
Material
Package
TC
Tj
V A °C A V mΩ °C Topology
SKKH 250 1200-1800 250 85 8000 0.93 0.45 -40 ... +130 3 - 1
SKKH 273 1200-1800 273 85 8000 0.90 0.92 -40 ... +130 3 -
SKKH 280 H4 2000-2200 252 85 7500 0.90 0.75 -40 ... +125 3 -
SKKH 323 1200-1800 320 85 8200 0.81 0.85 -40 ... +130 3 -
SKKH 330 800-1800 305 85 8000 0.80 0.6 -40 ... +130 3 -
SKKH 460 1600-2200 460 85 15500 0.88 0.45 -40 ... +130 5 -
SKKH 570 1600-1800 570 85 15500 0.78 0.32 -40 ... +135 5 -
SKKT 15 600-1600 13.5 85 280 1.10 20 -40 ... +125 0 -
SKKT 20 800-1600 18 85 280 1.00 16 -40 ... +125 1 -
SKKT 20B 800-1600 18 85 280 1.00 16 -40 ... +125 1 -
2 2
SKKT 27 800-1600 25 85 480 0.90 12 -40 ... +125 1 -
SKKT 27B 800-1600 25 85 480 0.90 12 -40 ... +125 1 -
SKKT 42 800-1800 40 85 850 1.00 4.5 -40 ... +125 1 -
SKKT 42B 800-1800 40 85 850 1.00 4.5 -40 ... +125 1 -
SKKT 57 800-1800 50 85 1250 0.90 3.5 -40 ... +125 1 -
SKKT 57B 800-1800 50 85 1250 0.90 3.5 -40 ... +125 1 -
SKKT 57 H4 2000-2200 50 85 1250 0.90 3.5 -40 ... +125 1 -
SKKT 58/16 E 1600 55 85 1200 1.00 4.8 -40 ... +130 1 -
SKKT 58B16 E 1600 55 85 1200 1.00 4.8 -40 ... +130 1 -
SKKT 72 800-1800 70 85 1450 0.90 3.5 -40 ... +125 1 - 3
SKKT 72B 800-1800 70 85 1450 0.90 3.5 -40 ... +125 1 - 5.51167
2.45
4.96463
7.03426
SKKT 72 H4 2000-2200 70 85 1450 0.90 3.5 -40 ... +125 1 - SEMIPACK 2 SEMIPACK 3
SKKT 92 800-1800 95 85 1750 0.90 2 -40 ... +125 1 -
SKKT 92B 800-1800 95 85 1750 0.90 2 -40 ... +125 1 -
SKKT 106 800-1800 106 85 1900 0.90 2 -40 ... +130 1 -
SKKT 106B 800-1800 106 85 1900 0.90 2 -40 ... +130 1 -
SKKT 107/16 E 1600 119 85 1900 0.90 3.35 -40 ... +130 1 -
SKKT 107B16 E 1600 119 85 1900 0.90 3.35 -40 ... +130 1 -
SKKT 122 800-1800 129 85 3200 0.85 2 -40 ... +125 2 HT
4
SKKT 132 800-1800 137 85 4000 1.00 1.6 -40 ... +125 2 HT
SKKT 132 H4 2000-2200 128 85 3800 1.10 2 -40 ... +125 2 HT
SKKT 162 800-1800 156 85 5000 0.85 1.5 -40 ... +125 2 HT
SKKT 162 H4 2000-2200 143 85 4800 0.95 2 -40 ... +125 2 HT
SKKT 172 1400-1800 175 85 5000 0.83 1.3 -40 ... +125 2 HT
SKKT 215/16 E 1600 215 85 5700 0.85 1.2 -40 ... +125 2 HT
SKKT 215/18 E 1800 215 85 5700 0.85 1.2 -40 ... +125 2 HT
SKKT 250 800-1800 250 85 8000 0.93 0.45 -40 ... +130 3 -
SKKT 273 1200-1800 273 85 8000 0.90 0.92 -40 ... +130 3 -
SKKT 280 H4 2000-2200 252 85 7500 0.90 0.75 -40 ... +125 3 - 5
SKKT 323 1200-1800 320 85 8200 0.81 0.85 -40 ... +130 3 -
SKKT 330 800-1800 305 85 8000 0.80 0.6 -40 ... +130 3 -
SKKT 460/16 E 1600 460 85 15500 0.88 0.45 -40 ... +130 5 -
SKKT 460/22 E H4 2200 460 85 15500 0.88 0.45 -40 ... +130 5 -
SKKT 570 1200-1800 570 85 15500 0.78 0.32 -40 ... +135 5 -
2.3425 8.32936 6
Dimensions in mm
Packages Type
16.6146 7.79915
SEMIPACK 4 SEMIPACK 5
Thermal Interface
VT(TO) @ Tjmax
ITAV IFAV @ TC
IFSM @ Tjmax
VRRM VDRM
rT @ Tjmax
Material
Package
TC
Tj
V A °C A V mΩ °C Topology
SKKE 120F17 1700 120 82 1800 1.5 4.5 -40 ... +150 2 - 1
SKKE 290F06 600 290 109 6000 0.9 1.2 -40 ... +150 2 -
SKKE 301F12 1200 300 43 3600 1.2 2.75 -40 ... +150 2 -
SKKE 310F12 1200 310 84 5500 1.2 1.9 -40 ... +150 2 -
SKKE 330F175) 1700 330 70 5200 1.5 1.9 -40 ... +150 4 -
SKKE 600F125) 1200 600 85 5800 1.2 1.9 -40 ... +150 4 -
SKKD 40F 600-1000 40 80 940 1.2 4 -40 ... +125 1 -
SKKD 42F 1200-1400 42 85 1100 1 5 -40 ... +130 1 -
SKKD 60F 1700 60 83 900 1.5 9 -40 ... +150 2 -
SKKD 75F12 1200 75 55 900 1.2 11 -40 ... +150 2 -
2 2
SKKD 105F16 1600 105 83 2100 1.2 2.5 -40 ... +130 1 -
SKKD 150F12 1200 150 54 1800 1.2 5.5 -40 ... +150 2 -
SKKD 170F 1200 170 85 2300 1.2 3.5 -40 ... +150 2 -
SKKD 205F06 600 205 87 3000 0.9 2 -40 ... +150 2 -
SKMD 150F12 1200 150 54 1800 1.2 5.5 -40 ... +150 2 -
SKND 150F12 1200 150 54 1800 1.2 5.5 -40 ... +150 2 -
SKND 205F06 600 205 87 3000 0.9 2 -40 ... +150 2 -
Packages
5.54518 2.45
SEMIPACK 1 SEMIPACK 2
19.2917 10.6085
8.23859
SEMIPACK 6
5.41357
Dimensions in mm
4.96463 2.3425
Dimensions in mm
Packages Type
2.10149
Thermal Interface
rT @ Tjmax =125°C
ITSM @ Tj = 125°C
Material
Package
TC
V A °C A V mΩ °C Topology
1
SKKQ 560 1400-1800 560 150 5200 0.9 0.9 150 1 -
SKKQ 800 1400-1800 800 150 5200 0.9 0.8 150 2 -
SKKQ 1200 1400-1800 1225 150 8000 0.9 0.5 150 2 -
SKKQ 1500 1400-1800 1500 150 15000 0.85 0.3 150 2 -
SKKQ 3000 1400-1800 3080 150 25500 0.95 0.18 150 3 -
Packages
2 SEMiSTART 1 2
2.67463
Dimensions in mm
Dimensions in mm
Packages Packages
SEMiSTART 2 SEMiSTART 3
2 2
Dimensions in mm
Dimensions in mm
SEMITOP ® / SEMIPONT ® / MiniSKiiP ®
Bridge rectifiers include every branch of a rectifier topology in a Rectifier with
600V up to 1800V
Brake Chopper
single, compact case. Bridge rectifiers exist from a few amps to
several hundred amps in different package types.
1
SEMIKRON offers bridge rectifier modules in single phase or 3-phase
topology with or without brake chopper. The bridge rectifier modules
are available in different packages such as SEMiX, SEMITOP, SEMIPONT,
Power Bridge and MiniSKiiP.
ID / IC in A 0 10 20 30 40 50 75 100 200 300 400 500
2
SEMITOP / SEMIPONT / SEMiX / Power Bridge
® ® ®
MiniSKiiP 122
SEMITOP 124
SEMIPONT 128
6
SEMiX 132
Type Type
Thermal Interface
Thermal Interface
IFSM/TSM@TS=25°C
IFSM/TSM@TS=25°C
VRRM VDRM
VRRM VDRM
Material
Material
Package
Package
rT@Tjmax
rT@Tjmax
IF@TS
IF@TS
VT(TO)
VT(TO)
TS
TS
Tj
Tj
V A °C A V mΩ °C Topology V A °C A V mΩ °C Topology
1
3-phase Rectifier 3-phase Rectifier + Chopper
SKiiP 28AN16V2 2) 1200 86 70 890 0.83 6 -40 ... +150 II 2 P12, HPTP SKiiP 39AHB16V3 1) 1600 126 70 1250 0.85 2.8 -40 ... +130 II 3 P12, HPTP
Packages
MiniSKiiP II 2
SKiiP 39AH16V1 1) 1600 112 70 2900 0.85 2.4 -40 ... +130 II 3 P12, HPTP
MiniSKiiP II 3 4
SKiiP 28ANB16V10 1600 83 70 1000 0.8 7 -40 ... +150 II 2 P12, HPTP
SKiiP 28ANB18V3 2) 1800 98 70 1000 0.965 3.4 -40 ... +150 II 2 P12, HPTP
5
SKiiP 28AHB16V1 1600 82 70 1000 0.85 7 -40 ... +125 II 2 P12, HPTP
SKiiP 39AHB16V1 1600 121 70 1250 0.85 4 -40 ... +125 II 3 P12, HPTP
Dimensions in mm
SKiiP 39ANB16V1 1600 124 70 1600 0.8 4 -40 ... +150 II 3 P12, HPTP
Type Type
Thermal Interface
Thermal Interface
ITSM IFSM@Tjmax
ITSM IFSM@Tjmax
VT(TO)@Tjmax
VT(TO)@Tjmax
VRRM VDRM
VRRM VDRM
Material
Material
Package
Package
rT@Tjmax
rT@Tjmax
ID @ T S
ID @ TS
TS
TS
Tj
Tj
V A °C A V mΩ °C Topology V A °C A V mΩ °C Topology
1
1 and 3 phase 1 and 3 phase
SK 50 B 06 UF 600 46 80 400 0.80 11.00 -40 ... +150 2 P12 SK60B12TUFE1 1) 650 51 - - - - -40 ... +175 E1 -
SK 50 B 800-1600 51 80 270 0.8 13.00 -40 ... +150 2 P12
SK 55 B 06 F 600 54 80 440 0.9 16.00 -40 ... +150 2 P12
SK 55 B 12 F 1200 57 80 550 1.20 22.00 -40 ... +150 2 P12
SK 70 B 800-1600 68 80 560 0.8 11.00 -40 ... +150 2 P12
SK 100 B 800-1600 100 80 890 0.83 3.90 -40 ... +150 2 P12
2 SK225BV07S5D1E2 1) 800 135 - 1250 0.83 3.09 -40 ... +130 E2 HPTP, HT 2
SK 40 DT 800-1600 42 80 280 1.1 20.00 -40 ... +125 3 P12, HPTP
SK 70 DT 800-1600 68 80 380 1 10.00 -40 ... +125 3 P12, HPTP
Packages 4
7.97408 8.03716
SK 55 DGL 126 1200 55 80 370 0.80 13.00 -40 ... +150 3 P12, HPTP
SK 95 DGL 126 1600 96 80 700 0.8 11.00 -40 ... +150 3 P12, HPTP
SK 170 DHL 126 1) 1200 170 70 1000 0.8 7.00 -40 ... +150 4 P12, HPTP
SK 200 DHL 066 1) 600 210 70 1250 0.8 4.00 -40 ... +150 4 P12, HPTP
SK 40 BHL 066T 2) 1600 42 42 280 0.85 20.00 -40 ... +130 3 P12, HPTP
SK150DGL12T4 1) 1200 49 - - 0.83 - -40 ... +150 3 P12, HPTP 6
6.705 6.76054
Packages Packages
8.08732 8.07333
2 2
6.59769 7.58046
Dimensions in mm
Dimensions in mm
Packages 3
SEMITOP E1
Dimensions in mm
Type Type
Thermal Interface
Thermal Interface
ITSM IFSM@Tjmax
ITSM IFSM@Tjmax
VT(TO)@Tjmax
VT(TO)@Tjmax
VRRM VDRM
VRRM VDRM
Material
Material
Package
Package
rT@Tjmax
rT@Tjmax
ID @ TC
ID @ TC
TC
TC
Tj
Tj
V A °C A V mΩ °C Topology V A °C A V mΩ °C Topology
1
1 and 3 phase 1 and 3 phase
SKB 28 200-1600 28 87 320 0.85 12.0 -40 ... +125 1 - SKD 31 200-1600 31 100 320 0.85 12.0 -40 ... +125 1 -
SKB 52 400-1800 50 99 425 0.85 8.0 -40 ... +150 3 - SKD 60 400-1600 60 102 850 0.85 5.0 -40 ... +125 2 -
SKB 60 400-1600 60 88 850 0.85 5.0 -40 ... +125 2 - SKD 62 400-1800 60 110 425 0.85 8.0 -40 ... +150 3 -
SKB 72 400-1800 70 101 640 0.85 5.0 -40 ... +150 3 - SKD 82 400-1800 80 110 640 0.85 5.0 -40 ... +150 3 -
SKD 100 400-1600 100 93 1000 0.85 5.0 -40 ... +125 2 -
SKD 110 800-1800 110 100 1000 0.85 4.0 -40 ... +150 4 -
SKD 115 1200-1800 110 85 1150 0.8 7.0 -40 ... +150 5 -
SKD 145 1200-1800 145 85 1700 0.8 4.0 -40 ... +150 5 -
2 SKD 160 800-1800 205 85 1500 0.85 3.0 -40 ... +150 4 - 2
SKBH 28 600-1400 28 89 280 1 16.0 -40 ... +125 1 -
SKD 210 900-1800 207 99 1600 0.85 3.0 -40 ... +150 4 -
SKDH 100 800-1400 100 84 850 1 4.5 -40 ... +125 2 -
SKDH 115 1200-1600 110 80 950 1.1 6.0 -40 ... +125 5 -
SKDH 145 1200-1600 145 80 1250 0.9 5.0 -40 ... +125 5 -
Packages Packages
40.2727 2.66667
2 2
3
47.2163 3.84667
SEMIPONT 6
2.66667 2.66667
SEMIPONT 3 SEMIPONT 4
4.14333 3.57333
Dimensions in mm
Dimensions in mm
Type Packages
SEMiX 13
Thermal Interface
ITSM IFSM@Tjmax
VT(TO)@Tjmax
VRRM VDRM
Material
Package
rT@Tjmax
ID @ TC
TC
Tj
V A °C A V mΩ °C Topology
1
3 phase
SEMiX251D12Fs 3) 1200 256 85 1330 1.20 7 -40 ... +150 13 P8
SEMiX291D16s 1600 232 85 1380 0.83 4.6 -40 ... +150 13 P8
SEMiX341D16s 1600 348 85 2000 0.9 2.7 -40 ... +130 13 P8
SEMiX501D17Fs 1700 494 85 2140 1.10 2.7 -40 ... +150 13 P8
SEMiX241DH16s 1600 298 100 1800 0.85 3.4 -40 ... +130 13 P8
SEMiX245DH16 2) 1600 336 96 1800 0.91 3.0 -40 ... +130 5p P8, HT SEMiX 5p
SEMiX365DH16 2) 1600 484 96 2750 0.85 2.5 -40 ... +130 5p P8, HT
Packages
SEMiX 6p
Dimensions in mm
Dimensions in mm
Bridge Rectifier Modules / Power Bridge Bridge Rectifier Modules / Power Bridge
Type Packages
G 50a, G 50b
Thermal Interface
VT(TO)@Tjmax
IFSM@Tjmax
VRRM VDRM
Material
Package
rT@Tjmax
ID @ TC
TC
Tj
V A °C A V mΩ °C Topology
1
1 phase
SKB 25 100-1600 17 75 320 0.85 12.00 -40 ... +150 G 10b -
SKB 26 200-2000 18 75 320 0.85 12.00 -40 ... +150 G 50a -
SKB 30 200-1600 30 94 320 0.85 12.00 -40 ... +150 G 12, G 13 -
SKB 35 400-1600 35 29 330 0.85 7.00 -40 ... +150 G 10b -
2 2
3 phase
SKD 25 200-1600 20 73 320 0.85 12.00 -40 ... +150 G 11b -
SKD 26 400-1600 20 73 320 0.85 12.00 -40 ... +150 G 50b -
SKD 30 200-1600 30 98 320 0.85 12.00 -40 ... +150 G 12, G 13 -
SKD 33 400-1800 33 110 240 0.8 18.00 -40 ... +150 G55 -
SKD 35 400-1600 36 70 320 0.85 7.00 -40 ... +150 G 11b - G 12, G 13
SKD 35 AV 1200-1600 39 70 345 0.9 6.00 -40 ... +150 G 11b -
SKD 51 400-1800 50 127 700 0.8 8.50 -40 ... +150 G51 -
SKD 53 400-1800 53 100 270 0.8 13.00 -40 ... +150 G55 - 3
SKD 83 400-1800 83 95 560 0.8 7.50 -40 ... +150 G55 -
DBI 6 P 400-2200 9 113 165 0.8 24.00 -40 ... +150 DBI P -
DBI 25 P 400-2200 27 32 310 0.85 9.00 -40 ... +150 DBI P -
Packages
G 10b, G 11b
Dimensions in mm
Dimensions in mm
Bridge Rectifier Modules / Power Bridge Bridge Rectifier Modules / Power Bridge
Packages Packages
G 51 DBI P
2 2
G 55
Dimensions in mm
Dimensions in mm
2
5
SKiiP
®
Portfolio Benefits
SKiiP 3, 4 500A up to 3600A SKiiP is the most powerful IPM on the market. The power
semiconductors used in SKiiP 4 modules can be operated up to 3
Short facts a junction temperature of 175°C. To make sure these compo-
nents can be reliably used at these temperatures, the power
3-in-1: Driver, semiconductors and cooling
circuitry is 100% solder-free. Sinter technology is used to create
2-3 times higher power cycling capability thanks to sinter technology
(SKiiP 4) a sintered silver layer instead of the solder layer which could
limit the service life of power modules. Reliability during active
Fully assembled and 100% tested
and passive thermal cycling is greatly improved.
The integrated gate driver in the SKiiP 4 sets new standards in
Key features 4
terms of reliability and functionality. The digital driver guaran-
Integrated driver, semiconductor and cooling
tees safe isolation between the primary and secondary side
Integrated temperature measurement
for both switching signals and parameter measurement. This
Integrated current sensors means the user no longer has to introduce complex and costly
Integrated DC-Link monitoring topology components to provide safe isolation.
100% solder-free (SKiiP 4)
Product range
Applications SKiiP IPMs are available in half-bridge and sixpack topologies 5
SKiiP fully meets the specific requirements for wind turbines in in power ratings of up to 2MW without paralleling. Cooling
the 0.5 to 6MW power range. Besides wind power applications, solutions range from water to air-cooled systems and custo-
SKiiP modules can also be found in elevators, solar power and mised cooling in SKiiP 3/4. A wide range of accessories is now
railway applications – in fact, in any area where powerful, safe also available for both SKiiP 3 and SKiiP 4. These include fiber
and reliable IGBT IPMs are a must. optic boards, paralleling boards for SKiiP systems and adapter
boards to connect SKiiP 4 to SKiiP 3 controller.
IPM
SEMIKRON For Highly Integrated IPMs
The SKiiP IPMs set a benchmark for high performance and Sixpack
robust converter designes. Especially the SKiiP 4 with its sintered chips Half-Bridge
is an enabler for maximum load cycle capability and lifetime for use
in renewable energy converters such as wind turbines and solar inverters 1
Half-Bridge 2
3
ICnom in A 0 50 100 600 1200 1800 2400 3600
VF @ Tj = 25°C typ.
IC @ TS= 25°C
IC @ TS= 25°C
IF@ TS = 25°C
IF@ TS = 25°C
U=U-Option
U=U-Option
F=F-Option
F=F-Option
S=SKiFace
S=SKiFace
Package
Package
Eon + Eoff
Eon + Eoff
Adapter
Adapter
Options
Options
Inom
Inom
Err
Err
A A V mJ A V mJ Topology A A V mJ A V mJ Topology 1
1200V - IGBT 3 (Trench) - SKiiP3 1700V - IGBT 3 (Trench) - SKiiP3
SKiiP 603 GD123-3DUL V3 627 600 1.7 195 508 1.50 28 - S33 SKiiP 1013 GB172-2DL V3 1072 1000 1.9 575 879 2.00 86 F S23
SKiiP 603 GD123-3DUW V3 627 600 1.7 195 508 1.50 28 - S33 SKiiP 1013 GB172-2DW V3 1072 1000 1.9 575 879 2.00 86 F S23
SKiiP 613 GD123-3DUL V3 577 600 1.7 195 466 1.50 28 - S33 SKiiP 1203 GB172-2DL V3 1159 1200 1.9 575 961 2.00 86 F S23
SKiiP 613 GD123-3DUW V3 577 600 1.7 195 466 1.50 28 - S33 SKiiP 1203 GB172-2DW V3 1159 1200 1.9 575 961 2.00 86 F S23
2 SKiiP 1213 GB123-2DL V3 1145 1200 1.7 390 925 1.50 56 F S23 2
SKiiP 1513 GB172-3DL V3 1589 1500 1.9 863 1336 2.00 128 F,U S33
SKiiP 1213 GB123-2DW V3 1145 1200 1.7 390 925 1.50 56 F S23
SKiiP 1513 GB172-3DW V3 1589 1500 1.9 863 1336 2.00 128 F,U S33
SKiiP 1513 GB172-3DFL V3 1589 1500 1.9 863 1336 2.00 128 F,U S33
SKiiP 1803 GB172-3DL V3 1744 1800 1.9 863 1454 2.00 128 F,U S33
SKiiP 1803 GB172-3DW V3 1744 1800 1.9 863 1454 2.00 128 F,U S33
SKiiP 2013 GB172-4DL V3 2102 2000 1.9 1150 1758 2.00 171 F,U S43
SKiiP 1813 GB123-3DL V3 1695 1800 1.7 585 1411 1.50 84 F,U S33
SKiiP 2013 GB172-4DW V3 2102 2000 1.9 1150 1758 2.00 171 F,U S43
SKiiP 1813 GB123-3DW V3 1695 1800 1.7 585 1411 1.50 84 F,U S33
SKiiP 2013 GB172-4DFL V3 2102 2000 1.9 1150 1758 2.00 171 F,U S43
SKiiP 1813 GB123-3DUL V3 1695 1800 1.7 585 1411 1.50 84 F,U S33
SKiiP 2403 GB172-4DL V3 2282 2400 1.9 1150 1921 2.00 171 F,U S43 3
SKiiP 2403 GB172-4DW V3 2282 2400 1.9 1150 1921 2.00 171 F,U S43
SKiiP 3614 GB17E4-6DUL V2 5078 3600 2.12 6840 3547 2.02 996 F,S S64
SKiiP 3614 GB17E4-6DUW V2 5078 3600 2.12 6840 3547 2.02 996 F,S S64
SKiiP 2414 GB12E4-4DUL 3109 2400 2.01 1680 2369 2.33 200 F,S S44
SKiiP 3614 GB17E4-6DULR V2 5078 3600 2.12 6840 3547 2.02 996 F,S S64
SKiiP 2414 GB12E4-4DUW 3109 2400 2.01 1680 2369 2.33 200 F,S S44
SKiiP 3614 GB17E4-6DPVLR 5078 3600 2.12 6840 3547 2.02 996 F,S S64
SKiiP 2414 GB12E4-4DUSL 3109 2400 2.01 1680 2369 2.33 200 F,S S44
SKiiP 3614 GB17E4-6DPVL 5078 3600 2.12 6840 3547 2.02 996 F,S S64
SKiiP 2414 GB12E4-4DUL 3109 2400 2.01 1680 2369 2.33 200 F,S S44 5
SKiiP 2414 GB12E4-4DULR 3109 2400 2.01 1680 2369 2.33 200 F,S S44
SKiiP 3614 GB12E4-6DUL 4664 3600 2.01 2520 3558 2.33 300 F,S S64
SKiiP 3614 GB12E4-6DUW 4664 3600 2.01 2520 3558 2.33 300 F,S S64
SKiiP 3614 GB12E4-6DULR 4664 3600 2.01 2520 3558 2.33 300 F,S S64
SKiiP 3614 GB12E4-6DUSL 4664 3600 2.01 2520 3558 2.33 300 F,S S64
SKiiP 3614 GB12E4-6DUL 4664 3600 2.01 2520 3558 2.33 300 F,S S64
SKiiP 3 SKiiP 3
Package S 23 mounted on P3016 heat sink Package S 33 mounted on P3016 heat sink
2 2
Weight without heat sink: 1,7 kg Weight without heat sink: 2,4 kg
P3016: 4,4 kg P3016: 6,2 kg
Package S 23 mounted on liquid cooled heat sink NWK 40 Package S 33 mounted on liquid cooled heat sink NWK 40
Dimensions in mm
SKiiP 3 SKiiP 4
Package S 43 mounted on P3016 heat sink Package S 34 mounted on P4016 heat sink
2 2
Dimensions in mm
SKiiP 4 SKiiP 4
Package S 44 mounted on P4016 heat sink Package S 64 mounted on P4016 heat sink
2 2
Weight without heat sink: 3,22 kg Weight without heat sink: 4,84 kg
P4016: 7,55 kg P4016: 9,9 kg
Package S 44 mounted on liquid cooled heat sink NHC Package S 64 mounted on liquid cooled heat sink NHC
NHC: 4,25 kg
NHC: 5,77 kg
Dimensions in mm
Dimensions in mm
SKiiP 4 Type
Package S 64 mounted on P4016 heat sink with 90° rotated fins F-Option SKiiP3
SKiiP3 F-Option Fiber optic control board for SKiiP3
F-Option SKiiP4
SKiiP4 F-Option Fiber optic control board for SKiiP4
SKiiP4 F-Option with D-Sub connector Fiber optic control board for SKiiP4
Dimensions in mm
IGBT Drivers
PAG E
SKYPER 156
1
3
5
SKYPER
®
IGBT Driver
SEMIKRON IGBT Driver Family
SEMIKRON offers two different IGBT driver families for any appli- Driver Cores
cation. Driver cores from the SKHI and SKYPER family can be opti-
mised using adapter boards for each module type. Drivers such
as the SKYPER Prime offer a fully qualified plug & play solution, 1
ASIC chipset ensures safe IGBT gate control throughout the entire
lifecycle. Short topologies are managed very fast by separate error SKYPER ® 600V up to 1700V
2
Plug & Play Driver
channels.
SoftOff and over voltage feedback prevent dangerous over voltages.
The mixed signal ASICs guarantee minimum tolerances over
the full temperature range. NPC or paralleled IGBT topologies
are managed thanks to adjustable error management. With an
3
optimised interface and adjustable filter settings, the SKYPER Pout in W/per channel
0 2 4 8 16 32
family operates safely in noisy environments. The SEMIKRON
adapter boards enable a wide range of inverter platforms to be SKYPER ® & SKHI Up to 1700V
The latest highlights are the SKYPER 12 driver core and the plug
& play driver SKYPER Prime that features electrical and optical 4
IGBT Driver
Type
Channels
Qout/pulse
VisolIO
IoutPEAK
VG(off)
dv/dt
VG(on)
fmax
VCE
V V V A µC kHz kV kV/µs
Driver
SKHI 10/12 R 1 1200 15 -8 8 9.6 100 2500 75
SKHI 10/17 R 1 1700 15 -8 8 9.6 100 4000 75 1
SKHI 23/12 R 2 1200 15 -8 8 4.8 100 2500 75
SKHI 23/17 R 2 1700 15 -8 8 4.8 100 4000 75
SKHIT 01 R7) 3 528 - - - - 10 2500 -
SKYPER 12 press-fit 300A 2 1200 15 -11.3 15 8 20 4000 50
SKYPER 12 press-fit 450A 2 1200 15 -11.3 15 8 13 4000 50
SKYPER 12 press-fit 600A 2 1200 15 -11.3 15 8 10 4000 50
SKYPER 12 press-fit C 300A 2 1200 15 -11.3 15 8 20 4000 50
SKYPER 12 press-fit C 450A 2 1200 15 -11.3 15 8 13 4000 50
SKYPER 12 press-fit C 600A 2 1200 15 -11.3 15 8 10 4000 50
SKYPER 12 press-fit 450A 1700V 2 1700 15 -11.3 15 8 9 4000 50
2
SKYPER 12 press-fit 600A 1700V 2 1700 15 -11.3 15 8 7 4000 50
SKYPER 12 press-fit C 450A 1700V 2 1700 15 -11.3 15 8 9 4000 50
SKYPER 12 press-fit C 600A 1700V 2 1700 15 -11.3 15 8 7 4000 50
SKYPER PRIME 1000A / 1700V PP 2) 2 1700 15 -8 15 10 10 5000 50
SKYPER PRIME 1000A / 1700V ST10 2) 2 1700 15 -8 15 7 10 5000 50
SKYPER PRIME 1400A / 1700V PP 2) 2 1700 15 -8 15 13.5 7 5000 50
SKYPER PRIME 1400A / 1700V ST10 2) 2 1700 15 -8 15 10 10 5000 50
SKYPER PRIME 1400A / 1200V PP 2) 2 1200 15 -8 15 10 10 5000 50
3 SKYPER PRIME 1400A / 1200V ST10 2) 2 1200 15 -8 15 7.5 10 5000 50 3
SKYPER PRIME O 1400A / 1200V PP 2) 2 1200 15 -8 15 10 10 5000 50
SKYPER PRIME O 1400A / 1200V ST10 2) 2 1200 15 -8 15 7.5 10 5000 50
SKYPER PRIME O 1400A / 1700V PP 2) 2 1700 15 -8 15 13.5 7.4 5000 50
SKYPER PRIME O 1400A / 1700V ST10 2) 2 1700 15 -8 15 10 10 5000 50
Driver Core
SKHI 21A R8) 2 1200 15 0 8 4 50 2500 50
SKHI 22 A/B H4 R 2 1700 15 -7 8 4 50 4000 50
SKHI 24 R 2 1700 15 -8 15 5 50 4000 50
SKHI 61 R 4) 6 900 15 -7 2 1 50 2500 15 4
SKHI 71 R 4) 7 900 15 -7 2 1 50 2500 15
SKYPER 12 R 2) 2 1700 15 -9 20 20 100 5000 50
SKYPER 12 PV R 2) 2 1700 15.4 -9.5 20 20 100 5000 50
SKYPER 32 R 2 1700 15 -7 15 2.5 50 4000 50
SKYPER 32 PRO R 2 1700 15 -7 15 6.3 50 4000 50
SKYPER 42 R 2 1700 15 -8 30 50 100 4000 100
SKYPER 42 R/02 (coated) 2) 2 1700 15 -8 30 50 100 4000 100
SKYPER 42 LJ R 2 1700 14.8 -8 24 20 100 4000 100
SKYPER 42 LJ R (coated) 2) 2 1700 14.8 -8 24 20 100 4000 100 5
Adapter Board
Board 1 SKYPER 32 R 2 1700 15 -7 15 2.5 50 4000 50
Board 1 SKYPER 32PRO R 2 1700 15 -7 15 6.3 50 4000 50
Board 2 // 4S SKYPER 42 R 2 1200 15 -8 30 50 100 4000 100
Board 2 generic SKYPER 42 R 2 1700 15 -8 30 50 100 4000 100
Board 2//3S SKYPER 42 R 2 1700 15 -8 30 50 100 4000 100
Board 2S SKYPER 32 PRO R Gold 2 1700 15 -7 15 6.3 50 4000 50
Board 2S SKYPER 32 R Gold 2 1700 15 -7 15 2.5 50 4000 50
Board 3S SKYPER 32 PRO R Gold 2 1700 15 -7 15 6.3 50 4000 50 6
Board 3S SKYPER 32 R Gold 2 1700 15 -7 15 2.5 50 4000 50
Board 4S SKYPER 32 PRO R Gold 2 1700 15 -7 15 6.3 50 4000 50
Board 4S SKYPER 32 R Gold 2 1700 15 -7 15 2.5 50 4000 50
Board 63 GB SKYPER 42 R 2 1700 15 -8 30 50 100 4000 100
Board 93 GB SKYPER 42 R 2) 2 1700 15 -8 30 50 100 4000 100
Footnotes: 2) In production new / 4) Discontinued / 7) Thyristor Driver / 8) MOSFET Driver
Stacks
PAG E
Diode/Thyristor 168
Customized 170
2
4
5
Water-Cooled IGBT
STACKS 2
Short facts SEMIKRON qualification tests and the latest environmental stan-
Off-the-shelf product range dards (IEC 60721-3). The platform design has been optimised to
2 and 4-quadrant 3-phase converter achieve the ideal balance between costs and performance for 3
IGBT inverter power density of up to 10.4kVA/L
a water-cooled power inverter in the megawatt power range.
They are designed for applications requiring a high degree of
Long life expectancy
reliability and a long service life of up to 20 years. The design
and footprint enables compact integration into standard indus-
Key features
trial cabinets, making high power of up to 6MVA low-voltage
Maximum continuous output current from 600A to 1400ARMS
possible. Specified for wind turbine applications, the SEMISTACK
DC bus voltage of up to 1250VDC
family boasts excellent IGBT cycling capability and a high capa-
Inverter output voltage of up to 690VAC 4
citor bank lifetime, reducing maintenance requirements.
DC bus polypropylene capacitor bank lifetime
rates at 100,000 hours at 40°C
Product range
Analogue measurements for Theatsink, Vbus, Iout The SEMISTACK water-cooled platform offers various inverter
CAN interface (configuration & monitoring) sizes to fit two power sub-assemblies into a 600 x 600 x 2000mm
cabinet. The standard size has a current range between 1000A
Applications and 1400ARMS. For applications with lower current ratings or
The SEMISTACK platforms comply with wind turbine require- with tighter cabinet size constraints, a smaller inverter size 5
ments, making it possible to build 4-quadrant converters is available with a continuous output current rated for up to
that are suitable for use with synchronous generators and dou- 900ARMS. The SEMISTACKs embed the SKiiP IPM product family,
ble fed induction generators, with an optional brake chopper which in turn integrates IGBT gate driver and monitors ana-
design. The platform flexibility allows for the requirements logue outputs (temperature, output current and DC bus volta-
of solar central inverters to be met with a continuous DC bus ge). As an option, a CAN interface is also available to monitor
voltage of up to 900VDC. Alternatively, SEMISTACK platforms the SKiiP. To increase power capacity up to 6MVA, SEMISTACKs
can be used in low-voltage applications requiring high power can be put in parallel, connected together through the DC bus
and a high degree of reliability, such as 3-phase inverters in a and controlled all-in-one using a SEMIKRON paralleling board. 6
shipyard or in a battery energy storage unit installed close to Optionally, SEMISTACK platforms are also available integrated
renewable energy power plants. into an industrial cabinet with suitable AC and/or DC power
filters, electrical and hydraulic distribution systems.
Benefits
The SEMISTACK water-cooled platforms offer a pre-qualified Further information: www.semikron.com/water-cooled-igbt-stacks
power assembly ready for integration following rigorous
Air-Cooled IGBT
STACKS 2
Diode/Thyristor
STACKS 2
Short facts
Off-the shelf product range Benefits
Air-cooled power assemblies The SEMISTACK CLASSIC family offers a pre-qualified power 3
Ready for integration
assembly ready for integration in line with rigorous SEMIKRON
qualification tests and current environmental standards.
Customizable
The platform design has been optimised to achieve the best
balance between costs and performance for power inverters
Key features
and rectifiers right up to the megawatt range.
Various topologies (B6U, B6C, B2C, B2U, W3C, W1C)
Customized
STACKS 2
Solar inverters
Power in kW 50 75 100 500 1000 2000 3000 4000 5000 6000
SKiiPRACK ®
Synchronous wind
generators
2
Double-fed wind
generators
High power AC drives Power in kW 50 75 100 500 1000 2000 3000 4000 5000 6000
Air-cooled IGBT
SEMIKUBE ® 3
Solar inverters
Pump and
compressor drives Power in kW 50 75 100 500 1000 2000 3000 4000 5000 6000
SEMIKUBE ® SlimLine
Solar inverters 4
AC drives
and servos Power in kW 50 75 100 500 1000 2000 3000 4000 5000 6000
Diode/Thyristor
SEMISTACK ® CLASSICS
5
B6U non isolated
SKiiPRACK 176
6
SEMIKUBE 177
B6C non isolated
SEMIKUBE SlimLine 178
3-phase fully controlled rectifier isolated
SEMISTACK CLASSICS 179
Type Packages
Component
Heatsink
Isolated
Current
Cooling
Family
profile
VDC
VAC
V V A Topology
4-Quadrant converter
SKS B2 120 GDD 69/11 - A11 MA PB 690 1100 1200 SKiiP 3 Water/Glycol - yes 1
SKS B2 140 GDD 69/12 U - A11 MA PB 690 1250 1400 SKiiP 4 Water/Glycol - yes
3-phase inverter
SKS B1 090 GD 69/11 - MA PB 690 1100 900 SKiiP 3 Water/Glycol - yes
SKS B2 100 GD 69/11 - MA PB 690 1100 1000 SKiiP 3 Water/Glycol - yes
SKS B2 120 GD 69/11 - MA PB 690 1100 1200 SKiiP 3 Water/Glycol - yes
SKS B2 140 GD 69/12 U - MA PB 690 1250 1400 SKiiP 4 Water/Glycol - yes
SKS B2 100 GD 69/11 - MA PB, SKS B2 120 GD 69/11 - MA PB, and SKS B2 140 GD 69/12 - MA PB
4 4
Dimensions in mm
Type Type
Component
Component
Heatsink
Heatsink
Isolated
Isolated
Current
Current
Cooling
Cooling
Family
profile
Family
profile
VDC
VDC
VAC
VAC
V V A Topology V V A Topology
Packages
2.06333 6.63333
3
Frames Size 1
4 4
2.64333 7.87402
Dimensions in mm 5
1.76667 5.82667
Dimensions in mm
Type Type
Component
Component
DC Current
Heatsink
Isolated
Isolated
Current
Cooling
Cooling
Family
Family
profile
Frame
VDC
VDC
VAC
VAC
V V A Topology V V A Topology
Semikube SlimLine SL 20 SKS 570F B6C 380 V16 SU 500 670 570 SEMIPACK 3 Forced-air cooled P16/200 yes
SKS 640F B6C 430 V16 500 670 640 SEMIPACK 3 Forced-air cooled P16/200 yes
SKS 640F B6C 430 V16 SU 500 670 640 SEMIPACK 3 Forced-air cooled P16/200 yes
SKS 700N B6C 470 V16 500 670 700 Capsules Natural cooled P11/415 no
SKS 700N B6C 470 V16 SU 500 670 700 Capsules Natural cooled P11/415 no
SKS 845N B6C 570 V16 500 670 845 Capsules Natural cooled U3/515 no
SKS 845N B6C 570 V16 SU 500 670 845 Capsules Natural cooled U3/515 no 3
SKS 970F B6C 650 V16 500 670 970 SEMIPACK 5 Forced-air cooled P16/300 yes
SKS 970F B6C 650 V16 SU 500 670 970 SEMIPACK 5 Forced-air cooled P16/300 yes
SKS 1000N B6C 670 V16 500 670 1000 Capsules Natural cooled U3/515 no
SKS 1000N B6C 670 V16 SU 500 670 1000 Capsules Natural cooled U3/515 no
SKS 1200F B6C 800 V16 500 670 1200 Capsules Forced-air cooled P17/130 no
SKS 1200F B6C 800 V16 SU 500 670 1200 Capsules Forced-air cooled P17/130 no
SKS 1500F B6C 1010 V16 500 670 1500 Capsules Forced-air cooled P17/130 no
SKS 1500F B6C 1010 V16 SU 500 670 1500 Capsules Forced-air cooled P17/130 no
SKS 1890F B6C 1270 V16 500 670 1890 Capsules Forced-air cooled P18/180 no
4 SKS 1890F B6C 1270 V16 ZU 500 670 1890 Capsules Forced-air cooled P18/180 no 4
SKS 2580F B6C 1730 V16 500 670 2580 Capsules Forced-air cooled N4/250 no
SKS 2580F B6C 1730 V16 ZU 500 670 2580 Capsules Forced-air cooled N4/250 no
SKSE 2580F B6C 1730 V16 2) 500 670 2580 Capsules Forced-air cooled Z5/120 no
SKSE 2580F B6C 1730 V16 ZU 2) 500 670 2580 Capsules Forced-air cooled Z5/120 no
SKSE 1890F B6C 1270 V16 ZU 2) 500 670 1890 Capsules Forced-air cooled Z5/90 no
SKSE 1890F B6C 1270 V16 2) 500 670 1890 Capsules Forced-air cooled Z5/90 no
3.12 5.49831
SKSE 1500F B6C 1010 V16 SU 2) 500 670 1500 Capsules Forced-air cooled Z5/60 no
Dimensions in mm
SKSE 1500F B6C 1010 V16 2) 500 670 1500 Capsules Forced-air cooled Z5/60 no
SKSE 1200F B6C 800 V16 SU 2) 500 670 1200 Capsules Forced-air cooled Z5/60 no 5
SKSE 1200F B6C 800 V16 2) 500 670 1200 Capsules Forced-air cooled Z5/60 no
Type Type
Component
Component
DC Current
DC Current
Heatsink
Heatsink
Isolated
Isolated
Cooling
Cooling
Family
profile
Family
profile
VDC
VDC
VAC
VAC
V V A Topology V V A Topology
Packages
SKS
SKSE
4 4
Dimensions in mm
Systems
PAG E
SKAI ® 2 HV 188
SKAI ® 3 LV 188 1
5
5
SKAI
®
Short facts Power densities of up to 20 kVA / liter bring about notable size
Suitable for battery voltages 24V up to 800V reductions compared with other existing standard motor
Sintered power semiconductors controller products. The systems are designed to operate with 3
EMI compliant
supply voltages of 24V to 800V and with output power ratings
of up to 250 kVA. The IGBT-based SKAI 2 HV motor controller
“Off-the-shelf” versions with gate driver interface, vector
control software, automotive power connections operates on sintered, 100% solder-free 600V or 1200V power
semiconductors and it features polypropylene film DC-link
Key features capacitors. The MOS-based SKAI 3 LV motor controller uses
established SkiiP technology with a very low-inductance con-
Compact integration into IP67 enclosure
nection to the DC-link capacitors, driver electronics, current,
Voltage, current and temperature sensors 4
voltage and temperature sensors. It is integrated into a wa-
Gate driver with protection
terproof IP66 enclosure. The compact motor controllers can
IGBT/ MOSFET power semiconductors
withstand high vibration amplitudes of up to 10g rms.
Fully programmable digital signal processor SKAIware motor control software adds to the system function
EMI filters and finishes off this tried-and-tested package for the SKAI 2
Versatile cooling system (liquid cooled, forced air cooled, base plate) HV nicely. SEMIKRON provides engineering services to support
DC link capacitors customers with the integration of SKAI 2 HV motor controller
Motor control software systems. Other available services include, for instance, lifetime 5
estimation, field application support, individual parameterizati-
Applications on of motor control software, and others.
The SKAI “off-the-shelf” power electronic building block
family has been introduced to cover a broad range of vehicle Product range
electrification applications. Examples are electric drivetrains Versatile SKAI 2 HV “off-the-shelf” versions are available. The
with standardized motor/generator flanges to fit or retrofit the SKAI 3 LV is available for supply voltages between 24V and
drives easily into existing vehicle designs. These types of 180V. Cooling methods are liquid, forced air cooling or base-
drivetrains have been developed for many vehicle types, i.e. plate. Various optional services also exists, such as end-of- 6
buses, light trucks, agriculture and construction machinery line flashing of customer specific software, lifetime estimation
as well as marine applications or cars. based on application profile analysis, field application support,
individual parameterization of motor control software and
Benefits other services (on request).
The SKAI power electronic platform comprises highly integ-
rated motor controllers which provide the ideal powertrain Further information: www.semikron.com/skai
solution for mobile electric and hybrid applications.
7
SEMIKRON’s motor controllers are already fully equipped with current IGBT Motor Controller
sensors, IGBT drivers, DC link capacitors and a fast processor (DSP). The
systems are designed to operate with supply voltages of 24V to 800V
and with output power ratings of up to 300kVA. 1
3
Inom in A rms 150 200 250 300 350 400 450
SKAI 190
Type Packages
Vbattery (max)
Topology
Package
Cooling
DSP
Inom
V Arms Topology
5 5
Dimensions in mm
Systems / SKAI
Packages
AP
EP
5 5
Dimensions in mm
Discretes
PAG E
Discretes 198
Chips 210 1
Accessories 216
6
5
Discretes 2
Discretes
Discrete Diodes
SEMIKRON offers discrete diodes in three major packaging styles; axial HV Screw-Axial 4800V up to 8000V
epoxy diodes for PCB mounting, stud screw-fit diodes that are suitable for
applications such as welding, rotating rectifiers in brushless generators
1
thanks to their robustness and easy assembly, as well as capsule (disc)
diodes for high-power applications.
A 0 5 10 20 40 60 80 100 200 300 400 500 600
The line includes standard rectifiers with current ratings up to 7500A, fast
rectifiers up to 140A, and avalanche rectifiers that allow for high voltage Leaded 100V up to 2000V
Typical applications are soft-starters, resistance heating, static switches, Capsules 200V up to 2200V
battery chargers, welding equipment, static excitation and others.
4
Discrete Thyristors
5
Discrete diodes
Capsules 205
Discrete thyristors
A 0 100 300 500 700 900 1200 1400 1600 1800
Stud Screw-Fit 207 6
Capsules 208
Capsules 400V up to 1800V
For detailed information please refer to data sheets.
Further information
www.semikron.com/discrete-diodes
www.semikron.com/discrete-thyristors
A
0 100 300 500 700 900 1200 1400 1600 1800 7
Type Type
Voltage (V)
Voltage (V)
Current (A)
IFAV @ Toil
Package
Package
Toil
VF
VF
TC
Tj
Tj
V A °C A V K/W °C Topology V A °C A V K/W °C Topology
SKHE 2000/900-1,2 4800 1.5 75 135 3.60 21 -40 ... +150 SKHE 1
Standard recovery
SKHE 3500/1550-2,0 8000 2.5 75 270 6.70 8 -40 ... +150 SKHE 2
SK 1 1000-1600 1.45 85 60 1.50 85 -40 ... +150 E33 1
SKN 2,5 400-1600 2.5 173 180 1.20 55 -40 ... +180 E5
SK 3 400-1600 3 92 180 1.20 60 -40 ... +150 E34
Packages SKN 5 200-1600 5 169 190 1.25 25 -40 ... +180 E6
SKHE 1 SK 62) 400-1600 6 46 375 1.10 55 -40 ... +150 SK6
Avalanche
SKa1 1300-1700 1.45 85 60 1.50 85 -40 ... +150 E33
SKNa2 1300-1700 2 175 180 1.20 2.5 -40 ... +150 E5
SKa3 1300-2000 3 92 180 1.20 60 -40 ... +150 E34 2
SKNa4 1300-1700 4 171 190 1.20 25 -40 ... +150 E6
SKa 62) 1300-2000 6 46 375 1.10 55 -40 ... +150 SK6
Footnotes: 2) In production new
Packages
5.68364 8.24512
SKHE 2
3.70075 3.57762
8.24512
E6
Dimensions in mm
5
3.2825
Dimensions in mm
6 6
Discretes / Diodes / Stud Screw Fit Discretes / Diodes / Stud Screw Fit
Type Type
IFSM@Tj=25°C
Voltage (V)
Voltage (V)
Current (A)
Current (A)
Package
Package
VF
VF
TC
TC
Tj
Tj
V A °C A V K/W °C Topology V A °C A V K/W °C Topology
SKR 45 400-1600 45 125 700 1.60 0.85 -40 ... +180 E12 E7 / E8 / E10 / E11 / E31 E9 / E12 ... E17 / DO-8
SKR 46 800-1600 45 125 700 1.60 0.85 -40 ... +180 E11
SKR 70 400-1600 70 125 1150 1.50 0.55 -40 ... +180 E12
SKR 71 400-1600 70 125 1150 1.50 0.55 -40 ... +180 E11
SKR 86 2) 800-1600 86 129 1500 1.20 0.4 -40 ... +180 E10
SKR 94 200-1200 96 141 2000 1.20 0.35 -40 ... +180 E12
SKR 96 200-1200 96 141 2000 1.20 0.35 -40 ... +180 E10
SKR 100 400-1800 100 120 1750 1.55 0.45 -40 ... +180 E13 4
SKR 130 400-1800 130 125 2500 1.50 0.35 -40 ... +180 E14
SKR 152 200-1200 152 139 4500 1.40 0.22 -40 ... +180 DO-8
SKR 240 400-1800 240 125 6000 1.40 0.2 -40 ... +180 E15
SKR 262 2000-2800 262 115 6000 1.40 0.2 -40 ... +180 E45
SKR 300 400-1600 300 124 6500 1.40 0.15 -40 ... +180 E15
SKR 320 400-1600 320 125 9000 1.35 0.16 -40 ... +180 E16
SKR 390 400-1600 390 117 9000 1.35 0.13 -40 ... +180 E15
SKR 400 1800-3600 400 100 9000 1.45 0.11 -40 ... +160 E17
SKR 600 2) 400-1600 600 105 14000 1.33 0.1 -40 ... +180 E16
5
Fast recovery
SKN 2F17 400-1000 17 113 450 2.15 1.2 -40 ... +150 E7
SKN 3F20 800-1200 20 104 375 2.15 1.2 -40 ... +150 E7
SKN 2F50 400-1000 50 105 1100 1.80 0.5 -40 ... +150 E10
2.84667 4.33998
SKN 60F 1200-1700 60 100 1400 1.75 0.5 -40 ... +150 E10 Dimensions in mm
SKN 135F 800-1200 135 100 2500 1.95 0.2 -40 ... +150 E14
SKN 136F 800-1200 135 100 2500 1.95 0.2 -40 ... +150 E31
SKN 140F 1200-1700 140 100 2500 1.80 0.2 -40 ... +150 E14
6 SKN 141F 1200-1700 140 100 2500 1.80 0.2 -40 ... +150 E31 6
SKR 2F17 400-1000 17 113 450 2.15 1.2 -40 ... +150 E7
SKR 3F20 800-1200 20 104 375 2.15 1.2 -40 ... +150 E7
SKR 2F50 400-1000 50 95 1100 1.80 0.5 -40 ... +150 E10
SKR 60F 1200-1700 60 100 1400 1.75 0.5 -40 ... +150 E10
SKR 135F 800-1200 135 100 2500 1.95 0.2 -40 ... +150 E14
SKR 136F 800-1200 135 100 2500 1.95 0.2 -40 ... +150 E31
SKR 140F 1200-1700 140 100 2500 1.80 0.2 -40 ... +150 E14
Footnotes: 1) Sample status / 2) In production new
Packages Type
3.87661
E 42 / E 43 / E 44 / E 45 / E 46
Current (A)
Package
VF
TC
Tj
V A °C A V K/W °C Topology
SKN 503 SG 1) 400-2200 503 120 7000 1.50 0.075 -40 ... +180 E25
SKN 1503 SG 1) 400-2200 1503 91 19000 1.50 0.033 -40 ... +175 E26
1
SKN 6000 200-600 6000 85 60000 1.30 0.012 -40 ... +180 E35
SKN 7500/06 1) 600 7500 85 60000 1.12 0.009 -40 ... +180 E28
Footnotes: 1) Sample status
Packages
3.25193
Dimensions in mm
E35
Dimensions in mm
6 6
Packages Type
E28
VT @ IT, Tj=25°C
Current (A)
Package
IT@VT
TC
Tj
V A °C A V A K/W °C Topology
SKT 10 600-1200 10 111 250 1.6 30 1.3 -40 ... +130 B1
SKT 16 400-1800 16 104 370 2.4 75 0.9 -40 ... +130 B2 1
SKT 24 400-1800 24 95 450 1.9 75 0.9 -40 ... +130 B2
SKT 40 400-1800 40 80 700 1.95 120 0.66 -40 ... +130 B3
SKT 50 600-1800 50 78 1050 1.8 120 0.6 -40 ... +130 B3
SKT 55 400-1800 55 92 1300 1.8 200 0.47 -40 ... +130 B5
SKT 80 600-1800 80 85 1700 2.25 300 0.28 -40 ... +130 B5
SKT 100 400-1800 100 85 2000 1.75 300 0.28 -40 ... +130 B5
SKT 130 400-1600 130 85 3500 2.25 500 0.18 -40 ... +130 B6
SKT 160 400-1600 160 84 4300 1.75 500 0.18 -40 ... +130 B6
SKT 250 400-1600 250 85 7000 1.65 800 0.123 -40 ... +130 B7
SKT 300 400-1600 300 93 11000 1.45 800 0.096 -40 ... +130 B7
2
Packages
B1 ... B3
3
Dimensions in mm
B5 ... B7
4
6 6
Dimensions in mm
Type
VT @ IT, Tj=25°C
Current (A)
Package
IT@VT
TC
Tj
V A °C A V A K/W °C Topology
SKT 340 1200-1800 340 82 5700 1.9 1000 0.072 -40 ... +125 B8
SKT 551 1200-1800 550 85 9000 1.65 1500 0.047 -40 ... +125 B11 1
SKT 553 SG 2) 400-1800 554 85 9000 1.65 1500 0.045 -40 ... +125 B11b
SKT 760 1200-1800 760 80 15000 1.65 2400 0.04 -40 ... +125 B10
SKT 813 2) 400-1800 855 85 15000 1.65 2400 0.03 -40 ... +125 B21
SKT 883 1) 400-1800 890 85 19000 1.46 2400 0.032 -40 ... +125 B23
SKT 1200 1200-1800 1200 85 30000 1.65 3600 0.021 -40 ... +125 B14
Footnotes: 1) Sample status / 2) In production new
Packages 2
B8 ... B14
Dimensions in mm
6 6
Discretes / Chips
Chips SEMICELL
CAL (Controlled Axial Lifetime) freewheeling diodes are available in Freewheling 600V up to 1700V
600V / 650V, 1200V, and 1700V voltage classes with current ratings of Diode CAL
up to 200A. Depending on the frequency of the target application,
custom-designed switching properties are also available. 1
Rectifier diodes and thyristors are designed for the 1600V voltage class,
covering a wide range of current ratings up to 770A, equivalent to a die
size of more than 500mm2. Variable configurations of the thyristor gate
(corner vs. center gate) allow for optimised bond layout in the respective IFnom in A 0 10
20 40
60
80
100 200 300 400 500 600 700 800
target design on the customer side. All the chips cover SEMIKRON’s Rectifier 1600V
2
extensive module and system range, which means a proven history Diode
IF (DC) 0 10
20 40
60
80
100 200 300 400 500 600 700 800
Thyristor 1600V
IT (DC) 0 10
20 40
60
80
100 200 300 400 500 600 700 800
Thyristor 215
Type Type
IF @ VF Tj=25°C
IF @ VF Tj=25°C
IFSM @Tj=150°C
IFSM @Tj=150°C
Qrr @Tj=125°C
Qrr @Tj=125°C
IF @Tj=150°C
IF @Tj=150°C
VF @Tj=25°C
VF @Tj=25°C
VRRM
VRRM
V A A V A µC V A A V A µC
600V - Freewheeling Diodes CAL I3 Fast 1200V - Freewheeling Diodes CAL I3 Fast
1
SKCD 06 C 060 I3 600 15 80 1.35 8 1 SKCD 11 C 120 I3 1200 15 130 2.00 10 1.6
SKCD 09 C 060 I3 600 20 100 1.35 13 1.46 SKCD 18 C 120 I3 1200 25 200 2.00 15 3
SKCD 18 C 060 I3 600 30 200 1.35 25 1.98 SKCD 23 C 120 I3R 1200 30 270 2.00 25 3.8
SKCD 31 C 060 I3 600 50 440 1.35 50 3.3 SKCD 31 C 120 I3 1200 40 370 2.00 35 5.3
SKCD 47 C 060 I3 600 80 720 1.35 85 6.2 SKCD 47 C 120 I3 1200 55 600 2.00 55 7.5
SKCD 61 C 060 I3 600 100 1000 1.35 110 8.7 SKCD 61 C 120 I3 1200 75 800 2.00 70 11
SKCD 81 C 060 I3 600 150 1260 1.35 155 11.5 SKCD 81 C 120 I3 1200 100 1100 2.00 100 16.5
SKCD 121 C 060 I3 600 210 2100 1.35 245 18 SKCD 121 C 120 I3 1200 150 1600 2.00 155 24
IF @ VF Tj=25°C
IFSM @Tj=150°C
Qrr @Tj=150°C
IF @Tj=175°C
VF @Tj=25°C
SKCD 31 C 120 I HD 1200 55 480 1.50 45 11
SKCD 47 C 120 I HD 1200 85 700 1.50 70 17.4
VRRM
IF @ VF Tj=25°C
IFSM @Tj=150°C
Err @Tj=150°C
IF @Tj=175°C
SKCD 16 C 060 I HD
VF @Tj=25°C
600 50 320 1.23 25 3.87
SKCD 24 C 060 I HD 600 75 395 1.23 41 6
SKCD 42 C 060 I HD 600 100 810 1.23 75 11.1
VRRM
SKCD 61 C 060 I HD 600 150 1080 1.23 112 15.75
SKCD 81 C 060 I HD 600 200 1310 1.23 152 19.69 V A A V A mJ
Err @Tj=150°C
IF @Tj=175°C
6 6
Type Type
IF @ VF Tj=25°C
IF @ VF Tj=25°C
IFSM @Tj=150°C
IFSM @Tj=150°C
Qrr @Tj=125°C
IF @Tj=150°C
VF @Tj=25°C
VF @Tj=25°C
IF(AV) @Tj max
IF(DC) @Tj max
Tj max
VRRM
VRRM
V A A V A µC V °C A A A V A
IF @ VF Tj=25°C
SKN 18,2 Qu bond6)
IFSM @Tj=150°C
1600 150 380 318 5500 1.00 360
Err @Tj=150°C
IF @Tj=175°C
VF @Tj=25°C
SKN 22,4 Qu bond6) 1600 150 770 634 9450 1.00 550
Type
IT(DC) @ Tj=130°C
ITSM @Tj=130°C
4
VGT @Tj=25°C
tq @Tj=130°C
IGT @Tj=25°C
VRRM, VDRM
V A A V A µs
Accessories
Heatsinks / Fans
Heatsinks
SEMIKRON offers a wide range of heat sinks including forced and Forced air-cooled
natural air cooling. The heatsinks are available for capsules, insulated
base modules or IPMs.
1
SEMIKRON offers a broad range of axial, centrifugal and radial fans
Natural cooled
for different inverter designs.
Fans
Axial
Centrifugal
Radial
Heatsinks 218
6
Fans 220
Further information
www.semikron.com/heatsinks
www.semikron.com/fans
7
Type Type
Suitable for
Weight
Weight
Weight
Weight
K/W K/W kg kg/m Produkt Picture K/W K/W kg kg/m Produkt Picture 1
Forced-air cooled Forced-air cooled
N4 Capsules - 0.04 6.3 25.1 P 16 SKiiP or modules - 0.06 1.3 23.5
P 17 Capsules 0.45 0.12 1.5 10.6 P1 Studs or modules 0.7 0.4 0.8 11.3
3
P 18 Capsules 0.37 0.08 1.6 12.2
4
P 8,59) Capsules 0.3 0.08 1.5 9.5
Natural cooled
P 49) Stud device 0.27 - 4.1 20.6
U3 Capsules 0.14 0.06 7.1 23.7 Footnotes: 9) Non standard item, available on request only, typical minimum batch quantities of 60 pieces will apply
Footnotes: 9) Non standard item, available on request only, typical minimum batch quantities of 60 pieces will apply
7
Accessories / Fans
Type
Weight
Noise
TAmax
Vair/t
Pmax
Vin
f
V Hz m³/h W °C kg dB Produkt Picture
Axial Fans
SKF 3-230-01 230 50 / 60 150 / 174 15 / 14 70 0.55 37 / 41
SKF RE-024-02 24 - 500 90 75 0.43 76
SKF SR-024-01 24 - 56 3.6 70 0.085 43 1
SKF 9-230-01 230 50 / 60 375 / 440 24 / 26 70 1 54 / 60
Centrifugal Fans
SKF 17A-230-11 230 50 / 60 850 / 930 110 / 120 70 2 74
SKF 17B-230-12 230 50 / 60 1175 / 1300 230 70 6.1 73 / 76 2
Radial Fans
SKF 16A-230-01 230 50 / 60 630 / 590 130 / 140 60 / 50 3.3 59
SKF 16P-230-01 230 50 / 60 1125 165 60 3.9 -
6 6
I N F O R M AT I O N
7
5
Technologies
1
Double Sided Sintering Technology
In Double Sided Sintering technology (DSS) two sinter layers are used: the chip is sintered
to the DBC and a flex layer is sintered on top of the chip. The flex layer replaces the wire bonds,
resulting in maximum reliability and current capability.
SKiN® Technology
SKiN technology is based on Double Sided Sintering. It also integrates the heatsink using a
third sinter layer. SKiN technology is free of bond wires, thermal grease and solder, combining 3
maximum reliability with minimum thermal resistance.
4
SEMIKRON develops innovative power electronics products for Examples of topics at our technical seminars SKiiP® Technology
space saving, energy efficient electronic systems. Our power mo- Semikron’s SKiiP technology utilises spring loaded mechanical and electrical contacts
- SiC chips and their application-specific advantages
dules are the heart of modern, energy efficient motor drives and and features a compact and durable module construction.
- Three level topology - topology, protection concepts,
industrial automation systems. But that’s not all – our products
application areas
are also paving the way for reduced global energy consumption
Press-Fit Technology
in the areas of power supplies, the production of renewable - Reliability and service life of power modules
Alternative concept to solder for module to PCB assembly press-fit pins ensure a reliable
energy and electric commercial vehicles. Our success is based - Loss calculation, thermal resistance, module dimensioning
connection in a solder-free production process. 5
on close cooperation and technical dialogue between our appli-
- IGBT driver topologies
cation engineers, product managers and our customers.
- Parallel connection of power modules
SOLDER Technology
- Simulation tool SEMISEL The tried and tested interface for power modules. Solder pins are a robust interface that are used in
This close partnership is also reflected in our practical range of - Typical problems in inverter design a wide range of applications worldwide. Solder processes are widely used and easy to implement.
technical seminars and roadmap workshops which cover all the
- Motor drives – topologies, challenges, trends
relevant topics in our product scope and application areas.
You are cordially invited to any of our seminars and workshops. - Solar inverters – topologies, challenges, trends SCREW Technology 6
- UPS inverters – topologies, challenges, trends The standard interface to the power terminals for medium and high-power modules.
- Wind inverters – topologies, challenges, trends Easy to use and robust power interface to AC and DC terminals.
7
Further information: www.semikron.com/technical-seminars
7
Further information: www.semikron.com/sample-request Further information:: www.semikron.com/semisel
Abbreviations
Eoff Energy dissipation during turn-off Rth(c-s) Thermal resistance case to heat sink
Eon Energy dissipation during turn-on Rth(j-a) Thermal resistance junction to ambient
ID Direct output current (of a rectifier connection) tq Circuit commutated turn-off time (thyristor)
Available in German, English, Chinese and Japanese IFSM Surge forward current VCEsat Collector-emitter saturation voltage
Application Manual IGT Minimum guaranteed gate trigger current VDRM Repetitive peak off-state voltage
Power Semiconductors IoutPEAK Output peak current (driver) VDS Drain-source voltage
Applications Applications
Electric & Electrified Vehicles
Wind Energy
With power semiconductors in the converters or in the drives controlling blade pitch. Battery Vehicles
Almost one in three wind turbines in the world is fitted with SEMIKRON power Battery driven vehicles, mostly for material handling such as fork lifters, require maximum availability.
modules. SEMIKRON‘s SKAI LV systems are the ideal solution for this application.
Power Quality
PFC, AVC and UPS systems ensure a clean reliable mains supply is kept available
3
to critical applications. SEMIKRON power modules are at the heart of critical power systems.
4
Urban Transport Equipment
Electrical transportation applications demand high reliability of the drive systems
with their cyclic operating profile and the continuous auxiliary supplies over years
of operation.
Energy Storage
For integration of renewable energy sources into the grid, high-performance energy storage
systems are essential to ensure permanent grid stability. SEMIKRON offers a variety of 6
power modules that are ideally suited for this application.
4
Delivering expert support Technical & sales support
Our specialty lies in the delivery of expert support to - Reply within 24 hours
small and medium-sized enterprises by offering them the - Multilingual sales and support
following services: - Design-in-support directly from manufacturers’ specialists
Worldwide shipping
- Fast shipping to more than 100 countries
5
- Low-volume purchases also possible
- Shipping directly from manufacturer’s warehouse
- Over 600 conventional SCRs, IGBT modules, bridge rectifiers
and IPMs in stock
We are close
Transparency & efficiency
- Transparent price breakdowns online
- Updated information
- Instant quotes using the online quotation tool
to our customers 6
Visit us at
7
shop.semikron.com
Online SEMIKRON Elektronik GmbH & Co. KG Phone : +49 911 6559 6663 Online Zhuhai SindoPower Electronics Company Limited Phone : +86 756 3396 619
Shop Sigmundstr. 200 Fax : +49 911 3091 9771 00 Shop Unit 3, Ground Floor, 2#, Manufacturing Centre , No. 1 Fax : +86 756 3396 677
90431 Nuremberg E-mail : [email protected] Software Road E-mail : [email protected]
Germany shop.semikron.com 519080 Zhuhai, Guangdong shop.semikron.cn 1
China
Distributor Semcor (Qingdao) Electronic Co., Ltd. Phone : +86 532 8870 1773
No. 192 Zhuzhou Rd., Hi-Tech Park Fax : +86 532 8870 1478
Qingdao E-mail : [email protected] 5
China
Online SEMIKRON Elektronik GmbH & Co. KG Phone : +49 911 6559 6663 Online SEMIKRON Elektronik GmbH & Co. KG Phone : +49 911 6559 6663
Shop Sigmundstr. 200 Fax : +49 911 3091 9771 00 Shop Sigmundstr. 200 Fax : +49 911 3091 9771 00
90431 Nuremberg E-mail : [email protected] 90431 Nuremberg E-mail : [email protected]
Germany shop.semikron.com Germany shop.semikron.com 1
Distributor FREEMAN Industrial Supplies Co. Phone : +852 2365 3231 Distributor Ghosh & Co. Phone : +91 33 2212 8727
Flat C,10/F, China Fen Hin, Building, Fax : +852 2365 0476 171/C, Lenin Sarani Fax : +91 33 2212 8727
5 Cheung Yue Street E-mail : [email protected] 700013 Kolkata E-mail : [email protected] 3
Cheung Sha Wan, Kowloon India
Hong Kong SAR of China
Distributor INNOVA ENTERPRISES Phone : +91 20 2529 0077
Distributor Richardson RFPD Hong Kong Limited Phone : + 86 755 8294 3736 Sr No-81, Plot No-3/2, Phone alternative : +91 20 2529 1177
20th Floor, Tower 2, 88 Container Port Road, Nda Khadakwasla Road, Shivane Fax : +91 20 2529 2188
Ever Gain Plaza, Kwai Chung 411023 Pune E-mail : [email protected]
Kwai Tsing India
Hong Kong SAR of China
Distributor Premier Controls Phone : +91 44 2825 8882
122, 1st Floor, Valluvar Kottam High Rd Fax : +91 44 2827 4307 4
600034 Chennai E-mail : [email protected]
India
Distributor Rectifier House (India) Pvt. Limited Phone : +91 99 3059 6249
101, 1st Floor, Munani Trade Centre, Fax : +91 22 2386 1262
near Model CO-OP Bank, Waliv Phata E-mail : [email protected]
401208 Mumbai
India
Distributor V V ELECTROTECH
113, Saffron Complex, Fatehgunj Circle, Phone : +91 265 278 6781
Fatehgunj, 390002 Vadodara Phone alternative : +91 265 278 8438
India Fax : +91 265 278 8438
E-mail : [email protected] 6
Online SEMIKRON Elektronik GmbH & Co. KG Phone : +49 911 6559 6663 Online SEMIKRON Elektronik GmbH & Co. KG Phone : +49 911 6559 6663
Shop Sigmundstr. 200 Fax : +49 911 3091 9771 00 Shop Sigmundstr. 200 Fax : +49 911 3091 9771 00
90431 Nuremberg E-mail : [email protected] 90431 Nuremberg E-mail : [email protected]
Germany shop.semikron.com Germany shop.semikron.com 1
Main site SEMIKRON Osaka branch office Phone : +81 6 6305 3299 Distributor RAON Device Phone : +82 505 306 3079
Daitaku17 bldg 6F, 4-13-22 Nishi-Nakajima, Fax : +81 6 6305 3560 202,2nd Floor, 29-22, Wolgot Haean-ro, Fax : +82 505 309 3079
Yodogawa-ku, 532-0011 Osaka www.semikron.com Si-Heung -si, Gyeonggi-do E-mail : [email protected]
Japan South Korea
NADEX CO., LTD. Phone : +81 5 2322 3511 Distributor Wintech-W Co., Ltd Phone : +82 226 837 240
Distributor 9-27 Furuwatari-cho, Naka-ku, Fax : +81 5 2332 4324 1417, 90, Gyeongin-ro 53gil, Guro-gu, Fax : +82 226 837 241
Nagoya City, Aichi Seoul E-mail : [email protected]
460-8338 Nagoya South Korea www.wintechw.co.kr 3
Japan
Distributor Dong-San Electronics Phone : +82 518 049 133
Distributor TOKYO ELECTRON DEVICE LIMITED Phone : +81 4 5443 4000 A-117, 9-10, Seojeon-ro 38beon-gil, Fax : +82 518 187 400
Yokohama East Square 1-4, Kinko-cho, Fax : +81 4 5443 4050 Busan gin-gu, Busan E-mail : [email protected]
Kanagawa-ku, Yokohama City, Kanagawa South Korea
221-0056 Yokohama
Japan Distributor CS Component Phone : +82 266 794 630~1
GA-4303, Jungang Circulation Comlex Fax : +82 226 860 291
Distributor EICH Corporation Phone : +81 3 5348 7716 Guro-2-dong, Guro-guo, Seoul E-mail : [email protected]
5F, KDX Nishi Shinjuku Bldg., Fax : +81 3 5348 4145 South Korea 4
7-22-45, Nishi Shinjuku, Shinjuku-ku
160-0023 Tokyo
Japan Taiwan
Main site SEMIKRON (HONG KONG) CO. Ltd. Phone : +886 930 347 711
Distributor KTL Corporation Phone : +81 3 5639 1102 Taiwan Representative Office 8F, Fax : +886 282 820 403
9F, Yamatane Building · 1-2-21, Fax : +81 3 5639 1156 No. 32 Guang-zhou Street, Wanhua Dist. E-mail : [email protected]
Ecchujima · Koto-ku 108 Taipei City www.semikron.com
135-0044 Tokyo Taiwan
Japan
5
Distributor Kenden Corporation Phone : +81 3 3769 5311
Mita 43MT Building, 3-13-16 Mita, Minato-ku Fax : +81 3 3769 5333
108-0073 Tokyo
Japan
Online SEMIKRON Elektronik GmbH & Co. KG Phone : +49 911 6559 6663 Online SEMIKRON Elektronik GmbH & Co. KG Phone : +49 911 6559 6663
Shop Sigmundstr. 200 Fax : +49 911 3091 9771 00 Shop Sigmundstr. 200 Fax : +49 911 3091 9771 00
90431 Nuremberg E-mail : [email protected] 90431 Nuremberg E-mail : [email protected]
Germany shop.semikron.com Germany shop.semikron.com
Belgium
2
Flemish-speaking
Main site SEMIKRON Phone : +31 555 295 295
Linie 502 Fax : +31 555 295 290
7325 DZ Apeldoorn E-mail sales : [email protected]
Netherlands E-mail jobs : [email protected]
www.semikron.com
French-speaking
Main site SEMIKRON S.A.R.L Phone : +33 130 868 000
130 route de Cormeilles, BP 70 Fax : +33 139 151 083 3
78501 Sartrouville Cedex E-mail sales : [email protected]
France E-mail jobs : [email protected]
www.semikron.com
Czech Republic
Main site SEMIKRON s.r.o. Phone : +420 378 051 400
Teslova 3 Fax : +420 378 051 401
30100 Plzen E-mail sales : [email protected]
Czech Republic www.semikron.com
4
Distributor Semic Trade, s.r.o. Phone : +420 251 551 204
Volutová 2521/18, Praha 5 E-mail : [email protected]
158 00 Prague
Czech Republic
Denmark
Main site SEMIKRON AB Phone : +46 303 816 16
Östra Köpmansgatan 18 Fax : +46 303 816 31
44430 Stenungsund E-mail sales : [email protected]
Sweden E-mail jobs : [email protected]
5
www.semikron.com
France
Main site SEMIKRON S.A.R.L Phone : +33 130 868 000
130 route de Cormeilles, BP 70 Fax : +33 139 151 083
78501 Sartrouville Cedex E-mail sales : [email protected]
France E-mail jobs : [email protected]
www.semikron.com
Distributor FGET.sa
ZI Mi-Plaine Phone : +33 472 796 415
6
17, rue de Genève, BP 354 Fax : +33 472 796 410
69746 Genas Cedex E-mail : [email protected]
France www.fget.fr
SEMIKRON Online Shop Main site SEMIKRON S.r.l. Phone : +39 0250 1130
Global Direct Sales Via Mecenate 76/22 Fax : +39 0691 1424 711
20138 Milano E-mail sales : [email protected]
Online SEMIKRON Elektronik GmbH & Co. KG Phone : +49 911 6559 6663 Italy E-mail jobs : [email protected]
Shop Sigmundstr. 200 Fax : +49 911 3091 9771 00 www.semikron.com
90431 Nuremberg E-mail : [email protected]
Distributor Bongiorno Srl Phone : +39 049 8974 236
Germany shop.semikron.com
Via Galvani 9 Phone alternative : +39 049 8974 588
35030 Rubano PD Fax : +39 049 8974240
Italy E-mail : [email protected] 1
Germany
Distributor TOTEM ELECTRO SRL Phone : +39 02 2885 111
Main site SEMIKRON Elektronik GmbH & Co. KG / Phone : +49 911 6559 0 Viale Lombardia 66 Fax : +39 02 2885 1150
SEMIKRON INTERNATIONAL GmbH Phone sales : +49 911 6559 6663 20131 Milano E-mail : [email protected]
Sigmundstr. 200 Phone purchase : +49 911 6559 6767 Italy
90431 Nuremberg Phone jobs : +49 911 6559 460
Germany Fax : +49 911 6559 262 Netherlands
E-mail sales : [email protected] Main site SEMIKRON B.V. Phone : +31 555 295 295
E-mail jobs : [email protected] Linie 502 Fax : +31 555 295 290
www.semikron.com 7325 DZ Apeldoorn E-mail sales : [email protected]
2
Netherlands E-mail jobs : [email protected]
www.semikron.com
Technical SEMIKRON, Technisches Büro Phone : +49 724 4720 819
Offices Südwest, Karlsruhe Phone alternative : +49 160 8830 497 Poland
Dipl.-Ing. (FH) Thomas Birnbreier Fax : +49 724 4720 824 Main site SEMIKRON Sp. z o.o. Phone : +48 226 157 984
Guntherstr. 1 E-mail : [email protected] ul. Pozaryskiego 28 Fax : +48 226 133 887
76297 Stutensee www.semikron.com 04-703 Warszawa E-mail sales : [email protected]
Germany Poland E-mail jobs : [email protected]
www.semikron.com
Technical SEMIKRON, Technisches Büro Phone : +49 620 1393 090 Russia
Offices Solutions Solar, Mannheim Phone alternative : +49 171 3000 289 3
Main site Semikron Ltd. Phone : +7 812 2329 825
Dipl.-Ing. Walter Schmidt Fax : +49 911 6559 775 97
Gabrichevskogo Str. 5; Building 1 Fax : +7 812 2329 825
Carl-Orff-Str. 9 E-mail : [email protected]
125367 Moscow E-mail : [email protected]
69488 Birkenau-Herrenwiese www.semikron.com Russia E-mail jobs : [email protected]
Germany www.semikron.com
Technical SEMIKRON, Technisches Büro Phone : +49 614 5540 708 Technical SEMIKRON Ltd. Phone : +7 812 2329 825
Offices West-Mitte, Wiesbaden Phone alternativ : +49 160 8986 557 Office B. Pushkarskaya 41 Fax : +7 812 2329 825
Jörg Jung Fax : +49 911 6559 775 61 197101 Sankt Petersburg E-mail : [email protected]
Schönbornstr. 4 E-mail : [email protected] Russia E-mail jobs : [email protected]
65439 Flörsheim www.semikron.com www.semikron.com 4
Deutschland
Distributor COMPEL JSC Phone : +7 495 234 7762
1/2 Derbenevskaya Str., Bldg. 1 Fax : +7 495 234 7763
Technical SEMIKRON, Technisches Büro Phone : +49 911 6559 6200
115114 Moscow E-mail : [email protected] www.compel.ru
Offices Norddeutschland Phone alternativ : +49 176 3008 6200 Russia
Dipl.-Physiker Martin Boing Fax : +49 911 6559 776200
Stadtlohner Str. 8 E-mail : [email protected]
48691 Vreden www.semikron.com Distributor Corporation IP Ltd. Phone : +8 800 555 3361
Deutschland 131, Plakhotnogo Str. E-mail : [email protected]
630136 Novosibirsk www.iphold.ru
Russia
Distributor Arrow Central Europe GmbH Phone : +49 6102 5030 0 5
Frankfurter Straße 211 Fax : +49 6102 5030 8455
Phone : +7 812 324 6350
63263 Neu-Isenburg
Distributor PTElectronics LCC Fax : +7 812 324 6611
Deutschland Prospect Engels, d. 71 E-mail : [email protected]
194214 St. Petersburg https://ptelectronics.ru/
Russia
Serbia
Distributor VREMEPLOV d.o.o. Phone : +381 11 265 3685
Vidikovacki Venac 104g, Lokal 75 Fax : +381 11 265 3618 6
11137 Beograd E-mail : [email protected]
Serbia
Slovakia
Main site SEMIKRON s.r.o. Phone : +420 378 051 400
Steruská ul. 3 Fax : +420 378 051 401
92203 Vrbové E-mail sales : [email protected]
Slovakia E-mail jobs : [email protected]
www.semikron.com
7
Online SEMIKRON Elektronik GmbH & Co. KG Phone : +49 911 6559 6663 Online SEMIKRON Elektronik GmbH & Co. KG Phone : +49 911 6559 6663
Shop Sigmundstr. 200 Fax : +49 911 3091 9771 00 Shop Sigmundstr. 200 Fax : +49 911 3091 9771 00
90431 Nuremberg E-mail : [email protected] 90431 Nuremberg E-mail : [email protected]
Germany shop.semikron.com Germany shop.semikron.com
Slovenia Canada
Distributor ALMA Electronic d.o.o. Phone : +386 1 256 1381 Main site SEMIKRON Inc. Phone : +1 603 8838 102
Leskoskova Cesta 6 Fax : +386 12 256 3870 11 Executive Drive Fax : +1 603 8838 021
1000 Ljubljana E-mail : [email protected] NH 03051 Hudson E-mail : [email protected]
Slovenia United States www.semikron.com
Spain
Main site SEMIKRON ELECTRONICS S.L.U. Phone : +34 936 335 890 Mexico
C/ de la Ciencia, 35, Nave 3 Fax : +34 936 333 065 2
Main site SEMIKRON DE MEXICO S.A. de C.V. Phone : +52 555 3001 151
8850 Gavá E-mail sales : [email protected]
Ave Morelos No. 28, Phone alternative : +52 555 3007 922
Spain E-mail jobs : [email protected]
Col. Parque Industrial Naucalpan de Juárez Fax : +52 555 3000 364
www.semikron.com
C.P. 53470 Estado de México E-mail sales : [email protected]
Sweden
Mexico www.semikron.com
Main site SEMIKRON OY Phone : +358 103 217 950
Taivaltie 5 Fax : +358 9870 1308
01610 Vantaa E-mail sales : [email protected] United States
Finland E-mail jobs : [email protected] Main site SEMIKRON Inc. Phone : +1 603 8838 102
www.semikron.com 11 Executive Drive Fax : +1 603 8838 021
NH 03051 Hudson E-mail sales : [email protected]
3
Switzerland
United States E-mail jobs : [email protected]
Main site SEMIKRON AG Phone : +41 449 141 333
www.semikron.com
Rugenparkstrasse 7 Fax : +41 449 141 330
3800 Interlaken E-mail sales : [email protected]
Technical NORTH EAST USA / Eastern Canada Phone : +1 603 8838 773
Switzerland E-mail jobs : [email protected]
Offices (ME, NH, VT, MA, CT, RI, NJ, DE, EASTERN MD, EASTERN Phone alternative : +1 603 9307 834
www.semikron.com
NY, EASTERN PA, CANADA: QUEBEC PROVINCE) Fax : +1 603 8838 021
Turkey
SEMIKRON, Regional Sales Office E-mail : [email protected]
Main site SEMIKRON Phone : +90 216 5115 046 Tom Rantala www.semikron.com
Esentepe Mah. Milangaz cad. no.77, Dumankaya Phone alternative : +90 532 5088 500 United States
Vizyon Rezidans, A1-Blok Daire 46 Fax : +90 216 5115 846 4
34870 Kartal/Istanbul E-mail : [email protected] Technical CENTRAL USA (IL, MN, WI, ND, SD, NE, IA, MO, JOHN, Phone : +1 262 4704 242
Turkey www.semikron.com Offices DEERE[OLD PHOENIX INT‘L], ROCKWELL) Phone alternative : +1 603 8839 051
SEMIKRON, Regional Sales Office Fax : +1 603 8838 021
Distributor ELSE ELEKTRIK MAKINA SANAYI VE TICARET A.S. Phone : +90 212 422 6670
Robert Falk E-mail : [email protected]
Cihangir Mah. Kargaci Sok. No:5, Avcılar Fax : +90 212 422 6679
United States www.semikron.com
TR-34310 Istanbul E-mail : [email protected]
Turkey
Technical WESTERN USA (UT, WY, ID, MT, NV, AZ, CA, WA, OR, Phone : +1 425 7375 060
Ukraine Offices CANADA: BRITISH COLUMBIA, ALBERTA, MANITOBA, Phone alternative : +1 425 6368 025
Distributor TECHNOSERVICEDRIVE LTD. SASKATCHEWAN) Fax : +1 603 8838 021
Phone : +380 44 366 2462
SEMIKRON, Regional Sales Office E-mail : [email protected]
5
Peremogy ave 56, of.335 Phone alternative : +380 44 458 4766
03057 Kiev E-mail : [email protected] Kevin Monohan www.semikron.com
Ukraine www.semismart.com.ua United States
Distributor INCOMTECH-PROJECT LTD. Phone : +380 44 230 0181 Technical MIDWEST USA (MI, IN, OH, KY, W.VA, ONTARIO CANADA, Phone : +1 603 8839 096
Hertsenastr. 17-25, Office # 9 Phone alternative : +380 44 230 0186 Offices WESTERN NY, WESTERN MD, WESTERN PA, TN, V, NC) Phone alternative : +1 216 4968 580
04050 Kiev E-mail : [email protected] SEMIKRON, Regional Sales Office E-mail : [email protected]
Ukraine www.i-p.com.ua Andy Camardo www.semikron.com
United States
United Kingdom
Main site SEMIKRON Ltd. Phone : +44 199 2584 677
6
Technical SOUTH USA (TX, OK, AR, LA, KS, NM, CO, MEXICO, Phone : +1 940 231 3491
9 Harforde Court, John Tate Road, Fax : +44 199 2503 837 Offices MS, AL, GA, FL, SC) Phone alternative : +1 603 883 1533
Foxholes Business Park E-mail sales : [email protected] SEMIKRON, Regional Sales Office Fax : +1 603 8838 021
SG13 7NW Hertford E-mail jobs : [email protected] Emiliano Meza E-mail : [email protected]
United Kingdom www.semikron.com United States www.semikron.com
Argentina
Distributor DINATECNICA S.A Phone: + 54 11 4709-0069
Blanco Encalada 35, Villa Martelli Fax: + 54 11 5181-8273
1603 - Buenos Aires E-mail: [email protected]
Argentinia
Brazil
Main site SEMIKRON Semicondutores Ltda. Phone : +55 11 4186 9500
Av. Inocêncio Seráfico, 6300 Fax : +55 11 4186 3567
06366-900 Carapicuiba - Sao Paulo E-mail sales : [email protected]
Brazil www.semikron.com
Chile
Main site SEMIKRON Semicondutores Ltda. Phone : +55 11 4186 9500
Av. Inocêncio Seráfico, 6300 Fax : +55 11 4186 3567
06366-900 Carapicuiba - Sao Paulo E-mail sales : [email protected]
Brazil www.semikron.com
Colombia
Distributor SEMIKRON Semicondutores Ltda. Phone : +55 11 4186 9500
Av. Inocêncio Seráfico, 6300 Fax : +55 11 4186 3567
06366-900 Carapicuiba - Sao Paulo E-mail sales : [email protected]
Brazil www.semikron.com
Ecuador
Main site SEMIKRON Semicondutores Ltda. Phone : +55 11 4186 9500
Av. Inocêncio Seráfico, 6300 Fax : +55 11 4186 3567
06366-900 Carapicuiba - Sao Paulo E-mail : [email protected]
Brazil shop.semikron.com
Peru
Distributor SEMIKRON Semicondutores Ltda. Phone : +55 11 4186 9500
Av. Inocêncio Seráfico, 6300 Fax : +55 11 4186 3567
06366-900 Carapicuiba - Sao Paulo E-mail : [email protected]
Brazil shop.semikron.com
Uruguay
Distributor SEMIKRON Semicondutores Ltda. Phone : +55 11 4186 9500
Av. Inocêncio Seráfico, 6300 Fax : +55 11 4186 3567
06366-900 Carapicuiba - Sao Paulo E-mail : [email protected]
Brazil shop.semikron.com
Venezuela
Main site SEMIKRON Semicondutores Ltda. Phone : +55 11 4186 9500
Note
Av. Inocêncio Seráfico, 6300 Fax : +55 11 4186 3567 All data and information referred to in this data book are based on the best of our knowledge and state-of-the-art technology available at the time of printing and are intended to
06366-900 Carapicuiba - Sao Paulo E-mail : [email protected] be used for information purposes only. Component specifications are not to be considered a guarantee of component characteristics. The use of SEMIKRON products in life-support
Brazil shop.semikron.com appliances and systems is subject to prior specification and written approval by SEMIKRON. All product specifications and terms of delivery are subject to change. For updates of our
datasheets as well as information on our latest products, please refer to www.semikron.com. Sales and delivery of SEMIKRON products are subject to our “General Terms and Condi-
tions of Sale”. Please refer to www.semikron.com for applicable power semiconductor standards. Reproduction permission may be granted on request on condition that the source is
cited. Modifications to any and all data published by SEMIKRON are expressly prohibited. All product specifications and promotion statements apply to SEMIKRON International GmbH
and all SEMIKRON companies within the SEMIKRON group.
For reasons of readability, separate gender-specific nouns are not used in the text.
The text nonetheless always refers to all genders.
Note: All information is based on our present knowledge and is to be used for information purposes only. The specifications of our components may not be considered as an assurance of component characteristics.
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