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HUAWEI G740 Maintenance Manual

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224 views133 pages

HUAWEI G740 Maintenance Manual

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G740 Maintenance Manual

Issue 1.0

Date 2013-10-18

HUAWEI TECHNOLOGIES CO., LTD.

Copyright © Huawei Technologies Co., Ltd. 2013. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.

Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.

Address: Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China

Website: http://www.huawei.com

Email: [email protected]

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential i

About This Document

Author
Prepared by Zhou Dezhi (ID: Date 2013-09-12
00211076)

Reviewed by Date

Approved by Date

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential ii

Contents

About This Document .................................................................................................................... ii

1 Product Overview ......................................................................................................................... 1
1.1 Appearance ....................................................................................................................................................... 1
1.2 Product Specifications ...................................................................................................................................... 2

2 Applicable Scope and Precautions ............................................................................................ 4

2.1 Applicable Scope .............................................................................................................................................. 4
2.2 Precautions ....................................................................................................................................................... 4
2.3 How to Obtain Product and Maintenance Information .................................................................................... 4

3 Exploded View and Components on the PCBA ...................................................................... 5

3.1 Exploded View ................................................................................................................................................. 5
3.2 Components Layout ......................................................................................................................................... 7

4 Software Upgrade ....................................................................................................................... 11

4.1 Selecting the Operation Type and the BIN File to Load................................................................................. 11
4.2 Home Screen .................................................................................................................................................. 13
4.3 Screen Element Description ........................................................................................................................... 13
4.3.1 Title Bar ................................................................................................................................................ 13
4.3.2 Scan && Download Button .................................................................................................................. 13
4.3.3 Remove Devices Button........................................................................................................................ 15
4.4 Procedure ....................................................................................................................................................... 16
4.5 (Important) Be Cautious to Allow a Second-time Upgrade............................................................................ 16
4.6 Software Downloading Types ........................................................................................................................ 16

5 Maintenance Tools ...................................................................................................................... 17

6 Assembly Procedure ................................................................................................................... 19
7 Disassembly Procedure .............................................................................................................. 22
8 Working Principles ..................................................................................................................... 26
8.1 Hardware Structure ........................................................................................................................................ 26
8.2 Block Diagram ............................................................................................................................................... 26
8.3 PCBA Functions ............................................................................................................................................. 27
8.4 Baseband Subsystem ...................................................................................................................................... 31
8.4.1 Power-On Sequence .............................................................................................................................. 31

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential iii

8.4.2 MSM8930 Memory Interfaces .............................................................................................................. 31

8.4.3 LCD+TP Module .................................................................................................................................. 33
8.4.4 Camera Interfaces ................................................................................................................................. 36
8.4.5 Wi-Fi/Bluetooth Interfaces .................................................................................................................... 40
8.4.6 USIM and microSD Card Interfaces ..................................................................................................... 42
8.4.7 Headset Interface .................................................................................................................................. 43
8.4.8 Electric Acoustic Interfaces................................................................................................................... 45
8.4.9 Keypad Interface ................................................................................................................................... 48
8.4.10 Battery and Charging Interfaces .......................................................................................................... 48
8.4.11 Sensor Interfaces ................................................................................................................................. 59
8.4.12 Motor Interface ................................................................................................................................... 65
8.4.13 Environment Monitoring and Protection Solution .............................................................................. 65
8.4.14 Board Reset, Sequence, and the WDT Function ................................................................................. 67
8.4.15 Charging Indicator Port ....................................................................................................................... 70
8.4.16 Board Power Allocation Solution ........................................................................................................ 71
8.4.17 Board Memory Allocation................................................................................................................... 76
8.4.18 Board Power-on and Power-off Processes .......................................................................................... 77
8.4.19 Clock Solution .................................................................................................................................... 80
8.4.20 RTC and Battery Backup .................................................................................................................... 80
8.4.21 UVLO and SMPL Recovery Functions ............................................................................................... 81
8.5 RF subsystem ................................................................................................................................................. 83
8.5.1 W-CDMA/GSM Transmission .............................................................................................................. 83
8.5.2 W-CDMA/GSM Reception ................................................................................................................... 87
8.5.3 Frequency Source .................................................................................................................................. 90
8.5.4 GPS and WCDMA B1 Band Diversity Circuit ..................................................................................... 91
8.5.5 Wi-Fi and Bluetooth .............................................................................................................................. 92

9 Troubleshooting Common Faults ............................................................................................ 93

9.1 Startup Failure ................................................................................................................................................ 93
9.2 Reception Failure ........................................................................................................................................... 98
9.3 Transmission Failure ...................................................................................................................................... 99
9.4 Charging Failure ........................................................................................................................................... 102
9.5 Camera Failure ............................................................................................................................................. 103
9.6 Connection Failure Between the Phone and Computer ................................................................................ 104
9.7 Call Receiving Failure .................................................................................................................................. 105
9.8 Call Sending Failure ..................................................................................................................................... 106
9.9 Vibration Failure .......................................................................................................................................... 107
9.10 Ringtone Failure ......................................................................................................................................... 108
9.11 LCD Display Failure .................................................................................................................................. 109
9.12 Key Failure ................................................................................................................................................. 110
9.13 No Sound Coming from the Headset During a Call ................................................................................... 111
9.14 microSD Card Detection Failure ................................................................................................................ 112

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential iv

9.15 GPS Signal Reception Failure .................................................................................................................... 113

10 Functional Tests....................................................................................................................... 114

10.1 MMI Test .................................................................................................................................................... 114
10.2 Wi-Fi Test ................................................................................................................................................... 126
10.3 Voice Call Test............................................................................................................................................ 126

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential v

1 Product Overview

1.1 Appearance
Figure 1-1 G740

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 1

1.2 Product Specifications

Table 1-1 Product specifications

Item Description

Type Touchscreen smartphone

Dimensions About 139.5 mm x 71.5 mm x 9.3 mm
Weight About 155 g (including the battery)
Operating bands  WCDMA 900 MHz: 880–915 MHz (uplink), 925–960 MHz
(downlink)
 WCDMA 2100 MHz: 1920–1980 MHz (uplink), 2110–2170
MHz (downlink)
 GSM 850 MHz: 824–849 MHz (uplink), 869–894 MHz
(downlink)
 GSM 900 MHz: 890–915 MHz (uplink), 925–960 MHz
(downlink)
 GSM 1800 MHz: 1710–1785 MHz (uplink), 1805–1880 MHz
(downlink)
 GSM 1900 MHz: 1850–1910 MHz (uplink), 1930–1990 MHz
(downlink)
 LTE B3: 1710–1785 MHz (uplink), 1805–1880 MHz
(downlink)
 LTE B7: 2500–2570 MHz (uplink), 2620–2690 MHz
(downlink)
 LTE B20: 832–862 MHz (uplink), 791–821 MHz (downlink)
Maximum transmit  WCDMA: +24 dBm (Power class 3)
power  GSM/GPRS 850/900 MHz: +33 dBm (Power class 4)
 GSM/GPRS 1800 MHz/1900 MHz: +33 dBm (Power class 1)
 LTE B3: 21.5–23 dBm
 LTE B7: 21.5–23 dBm
 LTE B20: 21.5–23 dBm
External ports Standard micro USB port, microSD card slot, and 3.5 mm
headset jack
USIM card slot Standard 6-pin USIM card slot
Maximum supported 32 GB
capacity of expansion
card
USB USB 2.0, high speeds of up to 480 Mbit/s
Battery Capacity: 2400 mAh
Display 5.0-inch INCH HD display, 720P (1280 x 720 pixels), 16 M
colors

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 2

Item Description
Antenna Built-in antenna
Camera 8 MP rear camera, 1 MP front camera
Sensors Accelerator, proximity sensor, light sensor
Bluetooth Bluetooth V2.1+EDR
Wi-Fi 802.11b/g/n, supporting Wi-Fi router
GPS GPSone
Power supply 100–240 V, 50/60 Hz, 1 A
Temperature Operating temperature: 0°C to +40°C
Storage temperature: –40°C to + 70°C
Humidity Operating humidity: 5% to 95%

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 3

2 Applicable Scope and Precautions

2.1 Applicable Scope

This document provides maintenance instructions for the technicians at service centers
authorized by Huawei. Being Huawei proprietary, this document is accessible only for
authorized service centers and companies. Although every effort was made to ensure the
accuracy of this document, errors may still exist. If you find any errors or have any
suggestions, please contact Huawei customer service.

2.2 Precautions
 Only qualified technicians are allowed to perform maintenance and calibration.
 Perform all operations in electrostatic discharge (ESD) rooms and wear ESD wrist straps
throughout the operations.
 Ensure that all the components, screws, and insulators are properly installed after
maintenance and calibration and that all cables and wires are installed and connected
correctly.
 Ensure that the soldering is lead-free and compliant with eco-friendly requirements.

ESD is a major cause for damage to sensitive electronic components. Every

service center must attach great importance to ESD protection to meet ESD
protection requirements specified in this document.

2.3 How to Obtain Product and Maintenance Information

To obtain the product and maintenance information, visit Huawei website at:
http://www.huaweidevice.com/cn/technicaIndex.do

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 4

3 Exploded View and Components on the

PCBA

3.1 Exploded View

Figure 3-1 Exploded view

The components listed in Table 3-1 are structural parts of the phone, and cannot be used as reference
when requesting spare parts.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 5

Table 3-1 Component list

No. Description
1 TP/LCD assembly
2 Cover A
3 Proximity sensor sheath
4 Proximity sensor FPC
5 AUDIO rubber
6 Shielding cover
7 Shielding cover
8 Shielding cover
9 RCV
10 Mother board
11 Shielding cover
12 Rear camera
13 Volume key
14 Cover B
15 Battery
16 Battery cover
17 Front camera
18 Front camera holder
19 Side key FPC
20 Shielding cover
21 Main FPC
22 Power key
23 Speaker
24 Screw

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 6

3.2 Components Layout

Figure 3-2 Front view of the PCBA
J1901 headset jack
J2102 front camera
Fault symptom:
socket
U1701 audio codec Headset failure
Fault symptom:
Fault symptom:
Front camera failure
Audio failure

J2401 power key/volume

key connector
U2202 Fault symptom:
magnetometer Volume key failure
Fault symptom: and startup failure
Compass failure

U2101 flashlight driver

Fault symptom:
X202 19.2 MHz Flash light fault
crystal oscillator
Fault symptom:
Startup failure

U201 power management

chip
Fault symptom:
Startup failure

U301 CPU and U301_POP

DDR chips
Fault symptom:
Startup failure
Q801 MOS transistor
Fault symptom:
Startup failure

U5601 RF chip
Fault symptom: U3301 RF PA
RF failure Fault symptom:
RF failure

J1501 battery
connector
Fault symptom:
Startup failure

MIC1802 secondary microphone

Fault symptom:
Sound with noise or no
sound

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 7

Figure 3-3 Rear view of the PCBA

MIC1801 secondary
microphone J2402 TPconnector
Fault symptom: Fault symptom:
handfree talk fault TP failure

J6805 GPS antenna J2601 light sensor

spring connector
Fault symptom: Fault symptom:
GPS fault proximity sensor fault

J6810 Wi-Fi
antenna spring
J2101 rear camera Fault symptom:
holder Wi-Fi failure
Fault symptom:
Camera fault
J2301 SIM card holder
Fault symptom:
Failure to read the
SIM card

J2302 microSD
card slot
Fault symptom:
microSD card
detection failure
U2201 tilt sensor
Fault symptom:
Tilt sensor failure

U1401 flash chip

Fault symptom:
Power failure fault

J2602 Speaker and key light

connector J2001 LCD holder
Fault symptom: Fault symptom:
Speaker or key light fault Display fault

J3302 RF connector
J6801 main Fault symptom:
antenna RF failure
Fault symptom:
Poor reception

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 8

Table 3-2 Part description

Location Part Description
Number Number
Card Socket,Battery connector,4PIN,Mid Mount,Side
J1501 14240582 Contact,2.50mm,With Plastic Peg,0.50mm,Terminal
Dedicated
Headphone Connector,12.6*6.7*4.2,6pin,arc,SMT,cambered
J1901 14240663
surface 2.5mm under board,Terminal Dedicated
BTB
J2001 14240579 Connector,BTBconnector,34PIN,0.4mm,0.8mm,SMT,female
,Terminal Dedicated
BTB
J2101 14240579 Connector,BTBconnector,34PIN,0.4mm,0.8mm,SMT,female
,Terminal Dedicated
TB Connector,Female,24Pin,0.4mm,SMT,Mating Height
J2102 14240496
0.8mm,Terminal Dedicated
BTB Connector,female,10Pin,0.4mm,0.8mm,SMT,Terminal
J2601 14240692
Dedicated
Card Socket,Micro SIM
Socket,6Pin,Horizontal,2.54mm,Without Hold
J2301 14240431
Peg,PUSH-PULL,Pin Tail Length1.7mm,ball type height
1.6mm,Terminal Dedicated
Card Block
J2302 14240303
Connector,Micro-SD,8,PUSH-PULL,1.1mm,Detect PIN
BTB Connector,female,10Pin,0.4mm,0.8mm,SMT,Terminal
J2602 14240692
Dedicated
J6801,J6810 51621274 DKBA8.382.0615,Main Antenna SMT Spring,C5600
RF Connector,Coaxial
J3302 14240060
Connector,50,Straight,Male,SMT,Terminal dedicated
MIC1801,
22050075 Microphone,-42dB.,3.76*2.95*1.1mm,silicon
MIC1802
MOSFET,P
Q301 15060318
Channel,12V,5A,0.020ohm,8V,UDFN6,Terminal Dedicated
Q801 15060150 MOSFET,P Channel,-12V,-2.4A,112mohm,-8V,SOT23
Power Management
U201 39200438
IC(PM8038),2.5~4.5V,NSP(pb-free),Terminal Dedicated
Terminal Baseband process IC,LTE/WCDMA/GSM
Multimode BASEBAND PROCESSOR
U301 39200558
MSM8930-3,1.2V/1.8V/2.85V/5V,12x12mm POP,Terminal
Dedicated

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 9

Location Part Description

Number Number
DDR2 DRAM,8Gb
U301_POP 40020204 LPDDR2,533MHz,32bit,1.8V/1.2V,216BALL
FBGA(POP),Channel B,Terminal Dedicated
NAND Flash,4GB
U1401 40060446 EMMC,52MHz,1024KB,3.3V/1.8V,FBGA153(Pb-free),Ter
minal Dedicated
AUDIO CODEC
U1701 39200436
DEVICE-WCD9304,1.2/1.8/2.2/3.8V,WLNSP
Switching Regulators,1.5A LED Flash Driver
U2101 39110800
IC,2.5V~5.5V,1.5A,4MHz,CSP-9,Terminal Dedicated
Semiconductor Sensor,Accelerometer,LGA,3axis,Terminal
U2201 38140098
Dedicated
RF Power Amplifying Module,1920MHz~1980MHz,29.5dB
U3301 47100500
max.,28.25dBm,QFN,Terminal Dedicated
Terminal Baseband process
U5601 39200360 IC,LTE/WCDMA/CDMA/TDSCDMA/GSM
Transceiver(WTR1605L)-2.2V/1.8V/1.3V-WLNSP142
Crystal
X202 12020215 Unit,19.2MHz,7pF,+/-10ppm,70ohm,2.5*2.0*0.9mm,NTC
internal,Terminal Dedicated

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 10

4 Software Upgrade

4.1 Selecting the Operation Type and the BIN File to Load
After WH62406270ML01Ver1006 is run, the following dialog box is displayed.

Figure 4-1 Entering the login password

Enter the password (initial password: Huawei) and click OK.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 11

Figure 4-2 Selecting the BIN file and configuration file

In this dialog box, you can select whether to allow a second-time upgrade and select the BIN
(Firmware) file and the configuration file to be loaded.
1. Select the operation type.
Under Be cautious to select, select or deselect Allow upgrade for the Second time to
allow or prohibit a second phone board upgrade.

If the board software is burned and then mounted, do not select this option, and ensure that the board has
just loaded with the BOOT file with the JTAG tool and does not have APP.
In a normal upgrade after printing rear labels, select this option; otherwise, file loading will fail.
Selection or deselection of this option may affect the NV data status of the phone. Be cautious to
confirm the operation in the displayed dialog box.
2. Select the file to load.
Under Please Select File, the browse button is unavailable and the file path is cleared if
the check boxes are deselected.
3. Once selecting a check box, an Open dialog box is displayed, asking you to select a BIN
file. After you select a file, its path information will be displayed in the text box and the
browse button will be available. When the check box is selected and the browse button is
available, you can click the button to change the file path.
4. The default configuration file PhoneMultiUpgradeDefaultCfg.xml (Windows phones
and some other products possibly cannot use the default configuration file, and therefore
a customized configuration file needs to be provided) and the software executable file
WH62406270ML01VerXXXX are in the same directory level.
5. Select Next to navigate to the Home screen.
6. To cancel or exit the software, select Cancel.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 12

4.2 Home Screen

After you click Next, the screen shown in Figure 4-3 is displayed.

Figure 4-3 Home screen

4.3 Screen Element Description

4.3.1 Title Bar
The title bar displays the software name, version, feature code, and compilation date from left
to right.

The feature code is automatically generated by the software based on the configuration file, and is
intended only for check by R&D personnel.

4.3.2 Scan && Download Button

After clicking the Scan && Download button (before loading a file, ensure that ports have
been correctly mapped; otherwise, loading will fail), the application scans for the mapped
ports (the names of ports to search for are specified in the configuration file) in Device
Manager and start loading software. The port numbers of the found ports are displayed on the
list. You can click Scan && Download several times until the ports of all the UEs are found.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 13

Figure 4-4 During an upgrade process

During the software upgrade, do not close the application; otherwise the dialog box shown in
Figure 4-5 will be displayed.

Figure 4-5 Closing the application during an upgrade

Do not terminate the application forcibly during an upgrade through measures such as the
Windows Task Manager. Otherwise, the tested boards may get damaged.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 14

Figure 4-6 Restoring NV after loading (not required for some products)

Figure 4-7 Successful downloading

4.3.3 Remove Devices Button

You can click Remove Devices to remove phones only after all phones are upgraded.
The Remove Devices button will clear all current screen display, preparing for the next
upgrade.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 15

4.4 Procedure
Prepare the required environment and ensure that ports for all phones have been correctly
mapped in Device Manager. Then, click the Scan && Download button. If not all ports are
found after a click, perform several more clicks. During an upgrade, the upgrade progresses of
different phones may be different. When stable phone hot swapping is supported, especially if
several phones need to be hot swapped (unstable hot swapping may cause problems such as
computer down), first remove phones that have been upgraded successfully without affecting
phone being upgraded. This process releases ports for accessing new phones to be upgraded.
After the ports of the new phones are correctly mapped, click the Scan && Download button
again to upgrade the new phones, without affecting other phones being upgraded.

4.5 (Important) Be Cautious to Allow a Second-time

Upgrade

Under Be cautious to select, select or deselect Allow upgrade for the Second time to allow
or prohibit a second phone board upgrade. That is, once is selected, a phone to which phone
software has been downloaded can be upgraded for a second time.

If this downloading tool needs to be used for software loading for a phone that is loaded with a BOOT
file with a JTAG tool and with applications with a USB flash driver, do not select the Allow upgrade
for the Second time option. In addition, before using this tool, ensure that the board has just loaded with
the BOOT file with the JTAG tool and does not have APP; otherwise, downloading will fail and a
message Refuse Download In AMSS Fail will be displayed. If this operation is incorrectly selected in
this case, it may result in faulty phones in subsequent work stations.
In a normal upgrade after printing rear labels, select this option; otherwise, the software upgrade will fail
and a message Refuse Download In AMSS Fail is displayed. Before a software upgrade, the phone
software automatically backs up the NV data in the current phone. After the software upgrade, the phone
software will automatically restore the NV data from the backup data. After a later USG upgrade or SD
upgrade, the NV data will also be restored from the backup. The backup data is restored in the NV
backup area of the phone. Pay attention to the message in the dialog box that is displayed after you
selecting or deselecting this option, and be cautious to confirm your operation.

4.6 Software Downloading Types

Two software upgrade types are available: software is burned (not supported for smart
phones), and software upgrade. The screens for the two types are similar except for the
messages displayed during interchanges with phones. Differentiate the phones for which
software needs to be burned and the phones for which software needs to be upgraded;
production line stoppage or even accidents may result if the phones are not correctly
differentiated. (The software should be initially started by a PE. Operators must not start it
without permission. If no exception occurs during software downloading, this software does
not need to be shut down.)

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 16

5 Maintenance Tools

Name: heat gun

Usage: heats components

Name: soldering iron

Usage: solders components

Name: DC power supply

Usage: supplies power

Name: soldering fixture

Usage: secures PCBAs

Name: lead-free tin solder wire

Usage: solders components

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 17

Name: heat gun

Usage: heats components

Name: digital multimeter

Usage: measures parameters during maintenance

Name: toolkit
Usage: assembles and disassembles terminals

Name: electric screwdriver

Usage: fastens and removes screws

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 18

6 Assembly Procedure

1. Ensure that the ESD wrist strap is properly 2. Remove the battery cover and remove the screws.
connected to the ground.

3. Remove cover B along the gap. 4. Remove the speaker from cover B.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 19

5. Remove the volume keys and power key. 6. Remove the rear camera.

7. Disconnect the connector and remove the PCBA 8. Remove the headset rubber.
from cover A.

9. Remove the volume key FPC. 10. Remove the front camera and its support.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 20

11. Remove the main FPC. 12. Remove the motor FPC.

13. Remove the earpiece. 14. Remove the proximity sensor FPC.

15. Remove the proximity sensor rubber. 16. Remove the TP/LCD from cover A.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 21

7 Disassembly Procedure

1. Ensure that the ESD wrist strap is properly 2. Install the TP/LCD to cover A.
connected to the ground.

3. Fasten the TP FPC. 4. Assemble the proximity sensor rubber to cover A.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 22

5. Assemble the proximity sensor FPC to cover A. 6. Assemble the earpiece to cover A.

7. Assemble the motor FPC to cover A. 8. Assemble the main FPC to cover A.

9. Assemble the front camera and its support to the 10. Assemble the volume key FPC to the PCBA.
PCBA.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 23

11. Assemble the headset rubber to the PCBA. 12. Assemble the speaker to cover B.

13. Assemble the PCBA and cover A together. 14. Assemble the rear camera.

15. Assemble the volume key and power key. 16. Assemble cover B and secure the screws.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 24

17. Assemble the battery cover.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 25

8 Working Principles

8.1 Hardware Structure

The G740 is a bar-type phone. It consists of a PCBA, a battery, and mechanical parts. The
PCBA incorporates the PCB (main board), proximity sensor sub-board, motor key
indicator/backlight sub-board, power key volume key FPC, LCD modules, TP, 8 MP rear
camera module, 1 MP front camera module, mechanical parts, and antennas.
The PCBA is the core part of the phone, which controls the baseband, RF, and other boards.

8.2 Block Diagram

Figure 8-1 Block diagram of the G740

MSM8930 is the baseband signal processing chip that processes the input and output of
signals, such as image, video, audio, RF interfaces, and connectivity. The MSM8930 also
provides interfaces, including the keypad, LCD, microSD card, Bluetooth, camera, and

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 26

microphone. PM8038 provides the analog multi-way switch, real time clock (RTC) circuit,
temperature compensated crystal oscillator (TCXO), motor drive circuit, and programmable
current source. WTR1605L is an RF signal processor that implements conversion of uplink
and downlink RF signals. The PCB can be divided into four logical subsystems: the baseband,
RF transceiver, power management (PM) unit, and user interface.

8.3 PCBA Functions

The PCBA can be divided into four subsystems: baseband, RF, PM, and user interface. Table
8-1 describes the modules, units, and functions of the subsystems.

Table 8-1 Modules, units, and functions of the subsystems

Subsystem Module Unit Functions
Baseband MSM8930 Modem unit Adopts two sets of QDSP6 V4 processors of up to
subsystem 500 MHz and performs the modulation and
demodulation of LTE, CDMA, WCDMA, GPS,
and GSM. The subsystem includes the ARM9
processor, modem DSP, modem AHB bus,
interrupt controller, and sleep controller
Application unit Dual processors: Krait processor of up to 1.0 GHz
and QDSP6 V4 processor; supports microSD card,
EBI2, UART/USIM, I2C, GPIO, clock, and other
functional modules.
User interface Provides the camera, PCM, broadband codec,
processing unit vocoder, RF, HKADC, LCD, microSD card, USB,
UART, USIM card, SBI, GPIO, JTAG/ETM, and
keypad interfaces.
Multimedia and The multimedia and game engine runs the
game engine MPEG/JPEG hardware engine, game engine, and
JAVA accelerator. It also provides
MP3/MMS/MIDI functions.
PM8038 Power supply Lists monitoring targets, such as the external
voltage monitoring power input, Li-ion battery, button battery, VDD,
unit and important LDO.
Temperature Monitors the battery and PA temperature.
monitoring unit
Battery ID unit Differentiates batteries of different manufacturers
and charges and discharge algorithms.
eMMC NAND feature, Stores applications and NVs. It is 4 GB (16 Gbit x
power 2).
consumption, and
file system
supporting units
LPDDR2RAM POP on the RAM for application running, 4 GB (128 Mbit x
MSM8930 32)

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Subsystem Module Unit Functions

RF subsystem GPS interface GPS reception unit Global Navigation Satellite System (GNSS),
gpsOne® engine Gen 8A. Receives and processes
GPS signals, mainly including the RTRLTN chip
and peripheral circuit.
Bluetooth Bluetooth unit Implements the Bluetooth baseband function, and
interface transmits and receives RF signals. Mainly includes
WCN3660 Bluetooth and the peripheral circuits.
Wi-Fi interface Wi-Fi unit Implements the Wi-Fi baseband function, and
transmits and receives RF signals. Mainly includes
the Wi-Fi module of the WCN3660 chip and
peripheral circuit.
Crystal oscillator VCTCXO and Generates the highly accurate, 19.2 MHz local
and frequency mobile station reference clock TCVCXO.
synthesizer modem (MSM)
control circuit
Antenna External antenna, The phone uses internal antennas for wireless
internal interface communication, supporting WCDMA high and
component, and low frequency bands. The antennas include the
antenna protection main antenna, Wi-Fi/Bluetooth antenna, and GPS
unit antenna.
Coupler Power coupler Couples part of the output power of the PA to
RTRLTN for power monitoring.
User interface UART interface: The UART interface in MSM8930 subsystem is
subsystem used for Bluetooth.
USB interface Driver, protection Indicates the peripheral circuit of the USB
circuit, and output interface in the MSM8930 subsystem and unit
interface circuits, such as the protection circuit and interface
component connectors. It is the major data service channel for
engineering samples and can be used to debug and
test devices during product development.
USIM card Power supply, Mainly includes the USIM card holder and related
interface protection circuit, connection circuits.
and USIM card
holder
Keypad and Keypad driver Performs interrupt monitoring on the volume key
backlight circuit, external using GPIO. Provides a side backlight LED. The
keypad, and backlight turns on when a key is pressed.
backlight LED
control circuit
Color LCD and LCD driver, The main display of the phone; 1600 M color; 480
backlight interface mode, x 800 pixels; The LCD backlight brightness is
and backlight controlled using the CABC function.
control

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Subsystem Module Unit Functions

microSD card Power supply, Mainly includes the microSD card holder and
protection circuit, related interface circuits.
connector
Speaker Driver mode, The power of the speaker that plays polyphonic
connection mode, ringtones when there is an incoming call can be
speaker 500 mW (Class AB). It has good frequency
component response for playing 20-20000 Hz ringtones. It can
also play monophonic MP3 audio files.
Receiver Driver mode, The power of the receiver during calls shall be less
connection mode, than 70 mW.
receiver
component
Microphone Interface circuit, Built-in microphone that adopts dual microphone
connection mode, noise reduction.
and microphone
component
Headset Headset, headset The phone provides a headset jack to output MP3
interface circuit, audio or voice during calls. The microphone on the
and microphone headset cable can pick up sound and input it into
interface circuit the phone.
Motor interface Driver mode, When there is an incoming call, the motor vibrates
connection mode, to notify the user of the call.
and motor
Accelerometer I2C interface Senses acceleration to help realize game functions.
control unit
Compass I2C interface Implements the E-Compass function or other
control unit auxiliary functions.
Power Internal backup Li-ion battery and The standard output of the Li-ion battery is 3.7
subsystem battery interface V/1650 mAh. It is required that the battery's
component charge/discharge lifecycle is over 500 times. (The
battery must pass related certifications and comply
with the safety requirements for Li-ion batteries in
GB18287.)
External power Adapter and The charger meets the application requirements in
supply (travel interface China, Europe, the USA, and Australia.
charger) component Charger specifications: 90–240 V, 45–55 Hz, AC
input
The model may vary in different markets.
The output voltage of the charger is 5±0.25 V. The
charger must pass the CE and CCC certifications.
The charger's output current must be adequate to
charge the battery and supply power to the phone
for normal operation at the same time.
Power Power distribution Includes filtering networks and circuits for the
distribution network power supply.

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Subsystem Module Unit Functions

network and Backup battery Provides battery charging and discharging
power management, management as well as overcharging and
management charge circuit, over-discharging protection. It also charges the
charge mode, and capacitor used for RTC current maintenance.
charge protection
Board circuit Mainly controls the LDO regulator power supply
power to flexibly manage the power supply. Based on the
management service status, protocol requirements, and
(power-on and power-saving analysis, the board software
power-off manages the power supply to unit circuits on the
analysis) unit board to reduce power consumption. A 32.768 kHz
sleep clock is provided.
PM8038 RTC The built-in RTC circuit uses a sleep clock of
enhanced 32.768 kHz to provide the precise time.
function
HKADC Supports 16 channels of analog signals multiplex
and outputs a channel of signals to MSM8930 for
ADC.
TCXO driver and The PM8038 provides a built-in TCXO driver to
its control outputs sine wave that is suitable for use.
UVLO Provides the UVLO function. When the input
voltage is lower than the threshold for a specific
period of time, the phone powers off.
WDT reset Supports the WDT counter overflow reset
function.
Overheat When the on-chip junction temperature exceeds
protection 150°C, the phone powers off.
Internal driver Provides four LED drivers, one motor driver, and
circuit one speaker driver.
Interrupt The built-in interrupt manager handles interrupted
management signals.
USB driver The PM8038 has a built-in OTG USB driver that
supports USB 2.0 high speeds. The software does
not support OTG for the time being.

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8.4 Baseband Subsystem

8.4.1 Power-On Sequence
Figure 8-2 shows the power-on sequence of the PM8038.

Figure 8-2 Power-on sequence of the PM8038

The MSM8930's power-on process starts when the KYPD_PWR_N signal of the PM8038 is
pulled down, which triggers the power-on sequence of the PM, as shown in Figure 8-2.
PS_HOLD is first signal to be pulled down during the power-off process.

8.4.2 MSM8930 Memory Interfaces

The MSM8930 supports PoP memory LPDDR2 SDRAM and an external eMMC NAND
flash memory. Figure 8-3 shows the memory interfaces of the MSM8930, which mainly
includes the POP LPDDR2, external eMMC chip, and microSD card.

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Figure 8-3 Interfaces of the MSM8930

LPDDR2 is connected to the MSM through EBI with a 32-bit bus. The MSM8930 adopts the
EBI1 bus, which supports clock frequencies of up to 400 MHz and a memory space of up to 1
GB.
POP LPDDR2 is controlled by the chip select signals of EBI1. EBI has three configuration
schemes of POP LPDDR2, as shown in Figure 8-4.

Figure 8-4 Supported memory configurations

The MSM8930 supports eMMC and microSD cards and supports clock frequencies of 104
MHz (SDR) and 52 MHz (DDR) at most. The eMMC chip is connected to the MSM through
the SDC1 interface, while the microSD card is connected to the MSM8930 through the SDC3
interface. The G740 supports a microSD card of 32 GB at most.

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Figure 8-5 eMMC interface

Figure 8-6 microSD card interface

8.4.3 LCD+TP Module

The G740 adopts LCD+TP full lamination technology. The LCD is an HD INCH module that
supports the Mobile Industry Processor Interface (MIPI). The LCD's features are:
 Resolution: HD (1280 x 720 pixels)
 Color: 16 M colors
The schematic diagram of the MSM8930 and LCD interface is shown in Figure 8-7.

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Figure 8-7 Interface circuits of the MSM8930 and LCD

The G740's LCD uses the MIPI-DSI, requiring only two pairs of low voltage differential
signal lines and one pair of clock line. The LCD interface supports a refresh rate of 60 Hz.
With the frame synchronization function, the LCD uses MDP_VSYNC_P of GPIO_0 as the
data transmission synchronization signal to avoid LCD breakage. The LCD's backlight
controller is integrated in the PM3038. See Table 8-2 for the definitions of the LCD's key
signals.

Table 8-2 Signal definitions

Category Function Name in the Circuit MSM8930
Network GPIO/PM8038 MPP

Power Digital power VREG_L11_1P8 VREG_L11_1P8

supply supply input (PM8038)
Digital power VREG_L9_2P85 VREG_L9_2P85
supply input (PM8038)
Signal line MIPI signal line MIPI_DSI_LANE1_P_A MIPI_DSI_LANE1_P
MIPI signal line MIPI_DSI_LANE1_N_ MIPI_DSI_LANE1_N
A
MIPI signal line MIPI_DSI_LANE2_P_A MIPI_DSI_LANE2_P
MIPI signal line MIPI_DSI_LANE2_N_ MIPI_DSI_LANE2_N
A
Synchroniz Frame MDP_VSYNC_P GPIO0
ation signal synchronization
clock
Clock MIPI clock MIPI_DSI_CLK_P_A MIPI_DSI_CLK_P
signal
MIPI clock MIPI_DSI_CLK_N_A MIPI_DSI_CLK_N

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Category Function Name in the Circuit MSM8930

Network GPIO/PM8038 MPP

Control Reset signal MIPI_DSI0_RESET_N GPIO58

signal

Identificatio LCD model LCD_ID0 GPIO93

n signal identification

Backlight Anode of the LED_A Anode of the backlight

signals backlight LED LED
Cathode of the LED_K Cathode of the backlight
backlight LED LED
Brightness PWM_OUT
control signals
from the LCD
Brightness LCD_BL_PWM GPIO1 (PM8038)
control signals
from the phone's
main chip

The G740 adopts a backlight system integrated in the PM8038 and powered by VPH_PWR.
The output voltage of the backlight system is controlled by the input signal PWM_OUT of the
WLED_CABC pin. The PWM_OUT signal is output by the LCD module to automatically
control the backlight brightness. The circuit design is shown in Figure 8-8.

Figure 8-8 LCD interface and backlight driver circuit principle

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Figure 8-9 TP interface

8.4.4 Camera Interfaces

The 8 MP rear camera uses a 24-pin BTB connector and is controlled by the I2C bus. The data
is transmitted in MIPI mode.

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Table 8-3 Interfaces of the rear camera

Category Name in the MSM8930 Voltage Connector Remarks
Circuit GPIO/PM8038MPP (V) Number
Network

Camera CAM_VIO VREG_L11_1P8(PM8038) 1.8 1. 6 and 8 0.750 to 3.050

power V
supply
CAM_AVDD VREG_L8 (PM8038) 2.85 22 0.750 to 3.050
V
VREG_L8_2V8 VREG_L8(PM8038) 2.85 3 1.500 to 3.050
V
Clock CAMIF_MCLK GPIO5 1.8 16 Camera
reference clock
MIPI_CSI0_CLK MIPI_CSI0_CLK_P 1.8 13
_P
MIPI_CSI0_CLK MIPI_CSI0_CLK_N 1.8 11
_N

Data line MIPI_CSI0_LAN MIPI_CSI0_LANE0_P 1.8 17 Data line

E0_P
MIPI_CSI0_LAN MIPI_CSI0_LANE0_N 1.8 15
E0_N
MIPI_CSI0_LAN MIPI_CSI0_LANE1_P 1.8 21
E1_P
MIPI_CSI0_LAN MIPI_CSI0_LANE1_N 1.8 19
E1_N
I2C control I2C3_SCL GPIO21 1.8 7 I2C control
signal signal
I2C3_SDA GPIO20 1.8 5
Control MCAMIF_SHD GPIO54 1.8 54 Camera
signal N shutdown
signal
MCAMIF_ID GPIO55 1.8 55 Module
supplier
identification
MCAMIF_RESE GPIO107 1.8 107 Reset signal
T
CAM_VCM_PD GPIO13 1.8 13 Camera motor
_N control
Ground GND 0 2. 1, 9, 14, Ground signal
18, and
24

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Figure 8-10 Interface circuits of the rear camera

The 1 MP front camera shares the I2C bus with the 8 MP rear camera. Data is transmitted in
MIPI mode. See Table 8-4 for the interface definitions.

Table 8-4 Interfaces of the front camera

Category Name in the MSM722A GPIO Voltage Connector Remarks
Circuit Network (V) Number

Camera VREG_VIO VREG_L11_1P8(PM 1.8 6 0.750 to 3.050 V

power 8038)
supply
VREG_VIO VREG_L11_1P8(PM 1.8 8 0.750 to 3.050 V
8038)
VREG_AVDD VREG_L8(PM8038) 2.85 22 1.500 to 3.050 V
Clock CAMIF_MCLK GPIO15 1.8 16 Camera reference
clock
MSM->CAMERA
MIPI_CSI1_CLK_P MIPI_CSI1_CLK_P 1.8 13
MIPI_CSI1_CLK_N MIPI_CSI1_CLK_N 1.8 11

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Category Name in the MSM722A GPIO Voltage Connector Remarks

Circuit Network (V) Number

Data line MIPI_CSI1_LANE0 MIPI_CSI1_LANE0_ 1.8 17

_P P
MIPI_CSI1_LANE0 MIPI_CSI1_LANE0_ 1.8 15 Data line
_N N
I2C control I2C3_SCL GPIO21 1.8 7 I2C control signal
signal
I2C3_SDA GPIO20 1.8 5
Control SCAMIF_SHDN GPIO14 1.8 10 Camera shutdown
signal signal
SCAMIF_ID GPIO75 1.8 2 Module supplier
identification
SCAMIF_RESET GPIO76 1.8 12 Reset signal
Ground GND 0 3. 1, 9, 14, Ground signal
24

Figure 8-11 Interface circuits of the front camera

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The G740's camera flash is driven by the LM3642TLX charger pump chip. The chip's
maximum output current is 1.5 A.

Figure 8-12 Interface circuits of the camera flash

SDA/SCL: I2C data/clock signal line for configuring the register to control the flash LED
switch, flash driver current, flash duration, output voltage, chip mode, and more

8.4.5 Wi-Fi/Bluetooth Interfaces

The G740 adopts the Qualcomm chip WCN3660, which integrates the Bluetooth, Wi-Fi, and
FM modules together. The WCN3660 supports Wi-Fi networks of 5 GHz and 2.4 GHz,
Bluetooth, and FM.
 Power supply
The WCN3660's power supply principle is shown in Figure 8-13. VREG_L1_1P3 is dedicated
to the WCN3660 and works as the main power supply. See Table 8-5 for the power supplies'
names and working directions.

Table 8-5 Power supplies for the WCN3660

Category Name in the Circuit Direction PM8038
Network
Working power VREG_L1_1P3 PM to VREG_L1_1/2
WCN3660
PA power VREG_L10_3P0 PM to VREG_L10
WCN3660
XO power VDD_XO_1P8 PM to VREG_L4
WCN3660
IO power VDD_IO_1P8 PM to VREG_L11
WCN3660

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Figure 8-13 Power supply principle of the WCN3660

 Communication module
The WCN3660 communicates with the main chip using three buses: SSBI, IQ, and SD. The
SSBI and IQ high-speed buses are bus protocols defined by Qualcomm.

Figure 8-14 Communication module circuits

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8.4.6 USIM and microSD Card Interfaces

 USIM card interface
Figure 8-15 shows the USIM card interface circuits. The MSM8930 supports two USIM
cards. The G740 only adopts the USIM1 card interface that supports USIM cards with
voltages of 1.8 V and 3.0 V. The USIM card is powered by VREG_L15. When the USIM
card is being tested, VREG_L15 is first pulled to 1.8 V. If the USIM card is proved to
support 1.8 V, VREG_L15 maintains at 1.8 V. If the USIM card does not support 1.8 V,
VREG_L15 is pulled to 2.85 V to supply power to it.
UIM1_CLK (clock signal), UIM1_REST (reset signal), and UIM1_DATA (data signal,
bidirectional) are directly connected to the MSM8930, among which UIM1_DATA will
be pulled up to VREG_L15. Considering that USIM card operations are frequent,
transient-voltage-suppression (TVS) diodes are added to the circuit to provide ESD and
surge protection.
In addition, to support the NFC function, the USIM card's pin 5 is connected to the NFC
chip's SWIO pin, enabling the NFC data to be saved to the EEPROM of the USIM card.

Figure 8-15 USIM card interface circuits

 microSD card interface

The MSM8930 provides five SD card interfaces, among which the SDC3 interface is
dedicated to microSD cards. In the G740, the SDC3 interface on the MSM8930 is
connected to the microSD card slot, as shown in Figure 8-16.

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Figure 8-16 microSD card interface

SDC3_CLK is the clock signal for the microSD card, SDC3_CMD is the command signal,
while SDC3_DATA[3–0] are four data lines. The insertion and removal of the microSD card
is detected by SD_DETECT, which has an external pull-up resistor of 1 mohm. After a
microSD card is inserted into the phone, SD_DETECT is pulled down, enabling the
MSM8930 to detect the card insertion.

8.4.7 Headset Interface

The G740 adopts a 3.5-mm five-line headset interface. Figure 8-17 shows the headset
interface circuits.

Figure 8-17 Headset interface circuits

The headset interfaces consist of the left and right audio channels, microphone, and ground. It
uses a line sequence of LRGM (American line sequence).
Because the headset jack is connected to the board, the TVS pipe is added to provide ESD and
surge protection.
 Headset insertion and removal test
For the insertion and removal test of the headset, refer to the WCD9304 functional diagram.
For the structural diagram related to headset and headset key tests in the WCD9304, see
Figure 8-18.

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Figure 8-18 Structural diagram related to headset and headset key tests in the WCD9304

In the WCD9304, HPH_LP is connected to a weak current source L2 in parallel. If no headset

is inserted, the current source L2 works normally, but the Schmitt trigger is not initiated (its
voltage level is high) and not interrupt is incurred. After a headset is inserted, its low
impedance pulls down HPH_LP, initiating the Schimitt trigger and incurring system interrupt
(falling edge). The headset insertion is then detected. The removal of the headset results in a
raising edge interrupt on the HPH_LP Schimitt trigger. This way, the removal of the headset is
detected. The headset's pin4 (HS_DETECT) is connected to the MSM's GPIO_37 pin, which
can also detect headset insertion. When the headset is inserted into an active speaker, the
impedance may not be sufficient to pull down HPH_LP. As a result, the headset insertion
cannot be detected. Therefore, HS_DETECT is preferred.
 Headset key test
When a headset is detected, the current source L1 connected in parallel to MIC_BIAS inside
the WCD9304 generates a periodic pulse of 1.8 V and 100 ms on MIC_BIAS. After this pulse
distributes its voltage to the MIC_BIAS's pull-up resistor (2.2 kohms) and MIC impedance of
the headset, the MBHC_IN pin receives a periodic pulse of 1.1 V and 100 ms. When this
pulse is initiated, the system checks L1's Schimitt trigger. If a headset key is pressed, the
Schimitt trigger will be pulled down, triggering a key interrupt. In addition, the headset keys
are not directly connected to GND. Each key has a different resistance-to-ground. Different
values will be obtained from MBHC_IN's ADC for different key operations. Therefore,
different key operations are identified.

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8.4.8 Electric Acoustic Interfaces

Categories of Electric Acoustic Interfaces
 Speaker: Plays polyphonic ringtones upon incoming calls. The maximum power of the
speaker is 500 mW. With good frequency response, the speaker can replay 20-20000 Hz
music as well as play MP3 in single audio channel.
 Receiver: Earpiece used for calls.
 Microphone: built-in microphone
 Headset: Outputs call voice or replays MP3 voice to the earpiece. Meanwhile, a
microphone is built in the headset cable to pick voice and transmit the voice to the phone.
The headset supports the stereo sound effect.

MSM8930 Electric Acoustic Interfaces

The MSM8930's electric acoustic interface functions are implemented by its compatible
codec chip, the WCD9304.

Figure 8-19 WCD9304

The codec chip (instead of the I2S) and MSM8930 are used for audio data communications.
The codec chip includes four analog input interfaces, five analog output interfaces, four
analog to digital converters (ADCs), five digital to analog converters (DACs), and four digital
microphone input interfaces (two pairs of DATA/CLK). The codec chip supports the MBHC
function, which can be used for the headset insertion and removal test, identification of
whether a headset has a microphone, and test of eight keys at most.

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Figure 8-20 Audio interfaces

Details about the Audio Interfaces

 Speaker
The speaker employs an external Class D amplifier. This design includes a differential input
from a signal audio channel and single-speaker output. The PM8038 uses SPKR_OUT_M and
SPKR_OUT_P for output to the external Class D amplifier to drive the speaker. Figure 8-21
shows the signal connections of the PM803.

Figure 8-21 Signal connections of the PM803

 Receiver
The WCD9304 supports connection to an 8–32 ohm receiver. It is built in with a Class G
amplifier and provides a maximum power of about 125 mW. The WCD9304 circuit is shown
in Figure 8-22. EAR_M and EAR_P are directly connected to the corresponding pins on the
WCD9304.

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Figure 8-22 WCD9304 circuit

 Microphone
The G740 adopts a dual microphone noise reduction scheme. The two silicon microphones
have the same specifications. The main microphone is on the U board and at the bottom of the
phone. It is used to collect audio input. The secondary microphone is on the M board and in
the middle upper area of the phone. It is used to collect environmental noise to reduce the
noise and eliminate echo. Both microphones use MIC_BIAS1 output by the codec as the bias
voltage.
Figure 8-23 shows the main microphone circuit. MIC1_P and MIC1_N are respectively
connected to the MIC1_P and MIC1_N pins of the WCD9310.

Figure 8-23 Circuit of the main microphone

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8.4.9 Keypad Interface

The G740 has four physical keys: power, volume up, volume down. In addition, it has three
touch keys on the TP: search, back, and menu.
The power key's signal KYPD_PWR_ON is connected to the KYPD_PWR_N pin of the
PM8038.
The three physical keys are connected to different test pins on the PM8038. See Table 8-6 for
details.

Table 8-6 Connections between physical keys and test pins

8.4.10 Battery and Charging Interfaces

Battery Interfaces
Figure 8-24 shows the G740's battery interface. VBAT is the battery voltage, BATT_TEMP is
the output pin for the battery temperature check, and VREF_THERM is the pull-up reference
voltage for the battery temperature check. The G740 does not support battery ID check. The
ID check pin BAT_ID is connected to a fixed voltage signal. The temperature threshold can
be set based on the actual needs and implemented by adjusting the connected resistance. For
the detailed temperature check procedure and principles, see Figure 8-24.

Figure 8-24 Battery interface

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Charging
The PM8038 supports charging through USB and wall chargers. See Table 8-7 for pins related
to charging through USB and wall chargers.

Table 8-7 Pins related to charging through USB and wall chargers

Because the wall charger ultimately charges the G740 using its USB port, current enters the
PM through USB_IN, no matter you are using a wall charger or USB charger. The PM then
detects the current, and the current then flows from USB_OUT to DC_IN, where the voltage
is checked.
 Power input circuit
RC network: Both USB and wall chargers have RC networks. Respectively choose
capacitors of 1.0 uF and 4.7 uF for filtering, stabilizing the voltage, and ensuring the
compatibility between electromagnetic fields. The resistor is mainly used to pull down
the voltages. When the phone is not connected to a wall charger or USB charger, the RC
network's voltage is pulled down to the ground. A quick check of connections can be
realized using resistors.
Current check: Conducted within the PM. Input current is checked only when the phone
is charging through a USB charger.
Battery controlling MOS: The p-channel MOSFET is used. This MOS is controlled by
BAT_FET_N of the PM8038. When the MOS is connected, VPH_CHG charges the
battery and supplies power to the phone.

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Figure 8-25 Power supply solution of the G740

Figure 8-26 USB power supply

 External voltage check

The PMIC continuously monitors the external power supply voltage at USB_IN. Based
on this voltage, the PMIC checks whether a power supply is connected and verifies
whether the connection duration is within the valid range. The PMIC prevents
unexpected switch-on and switch-off around the threshold with the hysteresis function
and report the voltage status of USB_IN to the state machine on chip and MSM or QSC
device.
 OVP
The G740 supports the completely built-in OVP circuit and USB-OTG switch. When
you connect a USB charger to the phone, USB OTG is connected, and the OVP circuit
checks the input voltage. If the voltage does not reach the preset value (range: 5.5–7.5 V;
step: 0.5 V; default value: 6.5 V), the MOSFET is connected, and USB_OUT receives
charging voltage. If the detected voltage exceeds the threshold, the overvoltage
protection is enabled, the MOS gets disconnected, and the charging voltage cannot pass
the MOS.

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Figure 8-27 OVP and USB-OTG

 Enabling and disabling battery charging and the four control loops
The PM8038 can implement charging protection using the closed-loop controls of USB
input current, charger input voltage, BUCK circuit output voltage, and battery charging
current. Figure 8-28 shows the four closed loops.
The PM8038 controls the charging current and voltage by selecting the loop with the
least duty ratio.

Figure 8-28 Closed loops

Main Battery Charging

The PM8038 supports charging of Li-ion batteries in four ways: trickle, constant current,
constant voltage, and pulsed charging. Through the analog multiplexer of the PM, the MSM
detects the battery voltage, external power voltage, and current to control the charging
process.
During the startup process, the charging state machine powers on. After VDD occurs, the state
machine reacts to certain conditions, such as whether the charger is connected and whether
the battery requires trickle charging. When the phone is connected to a power supply, the state
machine is set up to read the phone's initial status. The hardware then determines whether

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automatic trickle charging is required. This charging method restricts the charging current and
prevents the VDD from unexpected power-off. After the phone system starts up, the software
automatically determines whether to enable trickle charging mode. When the battery voltage
reaches a threshold, constant current charging is used to accelerate the charging speed, which
is also called fast charging mode. Once the Li-ion battery reaches a target voltage, the
software enables constant voltage mode or pulsed charging mode. Figure 8-30 shows the
charging process.

Figure 8-29 Charging process

The detailed introduction to the charging methods is as follows:

 Trickle charging
When the battery is in deep discharge state, charging the battery with strong current will
make the VDD collapse, which will cause function disorder or power-off of the phone.
To avoid this issue, the PM8038 provides a stable charging method with weak current —
trickle charging. The PM8038 can implement trickle charging using USB or trickle
charging on chip. Figure 8-30 shows the trickle charging process.

Figure 8-30 Tricking charging process

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Trickle charging is controlled by the phone software. Generally speaking, when the
battery voltage reaches the threshold (3.0 V for Li-ion batteries), trickle charging ends.
The software monitors the battery voltage through the HKADC and controls when to end
the trickle charging. The software can also control the trickle charging current. The
charging current can range from 50 mA to 300 mA in certain increments.
 Constant current charging
Constant current charging requires that the MOS is in linear areas and the main battery is
connected to the VDD. A closed-loop control is formed after the battery current is tested.
The current is adjusted to the preset value through the transistor. IMAXSEL.MSM
controls the constant current charging process until the battery voltage reaches the preset
value. Figure 8-31 shows the constant current charging process.

Figure 8-31 Constant current charging

When VBAT is close to Vset, the charging current decreases. The constant current
charging then ends, and the constant voltage charging begins. Figure 8-32 shows the
waveforms of the voltage and current during constant current charging.

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Figure 8-32 Waveforms of the voltage and current during constant current charging

 Constant voltage charging

The settings of constant voltage charging and constant current charging are similar. The
MOSFET works in linear areas, and the transistor performs the closed-loop control to
make sure that VBAT reaches the preset value VMAXSEL. This ensures that the battery
voltage can reach a more accurate value. Li-ion battery manufacturers usually
recommend that the voltage precision reaches 1% or higher when charging ends. During
the constant voltage charging process, the battery voltage remains constant (or almost
constant), and the charging current decreases exponentially. Figure 8-33 shows the
constant voltage charging process.

Figure 8-33 Constant voltage charging process

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Button Battery Charging and Backup Power Supply

The G740 does not have a button battery. Instead, it is connected to two 22 uF capacitors in
parallel.
Some clock circuits and the RTC circuit continue to run when the phone is powered off. The
main battery supplies power to these circuits if it is in place. If the main battery is absent, a
button battery or backup capacitor is required. The backup power supply does not have
sufficient power to support the continuous operation of the RTC and other circuits, but it
applies to scenarios of Sudden Momentary Power Loss (SMPL). Capacitors with different
capacitance can endure for different time. A 22 uF capacitors can endure for more than 10
seconds.
Figure 8-34 shows the backup power supply's charging process. The backup power supply's
charging settings are always effective and will not be restored upon SMPL protection. When
the main battery is connected, the phone is charged even if it is powered off.

Figure 8-34 Charging process of the backup power supply

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Battery Monitoring System

Figure 8-35 Battery monitoring system

The battery monitoring system (BMS) can be divided into four parts.
 Battery temperature detection
VREF_BAT provides the reference voltage for external temperature detection and
battery identification. You can set the temperature threshold. Adjust the external resistors
to be connected according to the desired threshold.

Figure 8-36 External resistors

Figure 8-37 Battery temperatures and thresholds

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 Battery voltage warning

A programmable window detector continues to adjust the VBAT voltage. The two
thresholds, VBAT high, and VABT low are all programmable. Voltage hysteresis is
included to make sure the battery voltage is stable. Certain conditions must be met for
the interrupt to take place to prevent redundant interrupts. This hysteresis is also
programmable. If the battery voltage returns to the range before the programmable
hysteresis, the hysteresis timer is reset, and no interrupt will occur.

Figure 8-38 Battery voltage warning (1)

Figure 8-39 Battery voltage warning (2)

 UVLO and SMPL

Under Voltage Lockout (UVLO) continues to monitor the VDD and powers off the
phone when the battery power is low. The programmable UVLO threshold is lower than
the low battery threshold.
If the VDD drops out of the voltage range and returns to the range within the preset time,
the SMPL function initializes the power-on sequence. If SMPL is enabled on the
software, once sudden power loss occurs, the SMPL starts functioning right away and is
restored to its original state.

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 ICC
The integrated control center (ICC) collects the original open-circuit voltage (OCV) and
coulometer circuit (CC) data. Based on the tested voltage and current, the battery
resistance can be calculated.

Battery MOSFET

Figure 8-40 Battery MOSFET

Figure 8-41 PMIC

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8.4.11 Sensor Interfaces

Accelerometer
There are three accelerometer suppliers: ADI, ST, and Freescale.
 ADXL346 by ADI
Test range: ±2 g, ±4 g, ±8 g, and ±16 g
Maximum precision: 1/256 g
 LIS3DH by ST
Test range: ±2 g, ±4 g, ±8 g, and ±16 g
Maximum precision: 1 mg
 MMA8452Q by Freescale
Test range: ±2 g, ±4 g, and ±8 g
Maximum precision: 1/1024 g
These three models all have ultra-low voltage, high precision, and high resolution
three-axis accelerometers and are built in with ADCs to directly output digital signals.
The ADXL346 and LIS3DH support the I2C and SPI interfaces, while the MMA8452Q
only supports the I2C interface.
To implement the pin-to-pin compatibility design of the three components:
1. The I2C communication method supported by all the three components is adopted. Pin 8
is connected to the IO interface to enable the I2C function of the LIS3DH. Pin 4 is
I2C4_CLK_SENS, and pin 6 is I2C4_DATA_SENS. Pin 7 SA0 is grounded, setting the
lowest position of the component's I2C address to 0.
2. 0.1 uF of pin 2 is connected to GND in serial, according to the MMA8452Q's
requirement.
3. Pin 10 is grounded, according to the LIS3DH's requirement, and pins 5, 12, and 16 are
all grounded.
4. Pin 15 is connected to the component power supply interface VDD, according to the
ADXL346's requirement.
Figure 8-42 shows the accelerometer interface circuit.

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Figure 8-42 Accelerometer interface circuit

Table 8-8 Interface signal description

Signal Direction Functions
I2C4_CLK_SENS Input I2C clock signal; connected to GPIO_45 of the
MSM
I2C4_DATA_SENS In/Out I2C data signal; connected to GPIO_44 of the
MSM
VREG_L11_1P8 Power supply Power supply at the I/O interface; powered by
LVS2; 1.8 V
ACCEL_INT1 Out Interrupt signal 1; connected to GPIO_46 of the
MSM
ACCEL_INT2 Out Interrupt signal 2; connected to GPIO_67 of the
MSM
VREG_L9_2P85 Power supply Internal power supply for the sensor

Chip select (CS): used to select the communication method of the SPI or I2C. The CS is set at
a high level, and the I2C is selected.
SA0: used to select the I2C address. The SA0 value is 0, and the I2C addresses are shown in
Table 8-9.

Table 8-9 I2C addresses

Component Name Write Address Read Address
ADXL346 A6H A7H
LIS3DH 30H 31H
MMA8452Q 38H 39H

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Table 8-10 Accelerometer specifications requirement

Parameter Microsoft Requirement 38140023 Is the Requirement
ADXL346 Met?
Dimension Three axes Three axes OK

Hardware 100 Hz or higher Data output rate: OK

sampling rate 0.1–3200 Hz

Driver-selectabl ±2, ±4, ±8 User selectable: ±2, OK

e g-ranges ±4, ±8, ±16

Resolution At least 8 bits (10 bit 4. 13-bit resolution OK

recommended)
Precision ±5 degrees tilt at the ±2 Precision: ±0.25 OK
g-range recommended degrees tilt at the ±2
g-range
recommended
Power modes Sleep and active modes Sleep and active OK
recommended mode
SNR ≤ 500 ug/√Hz N/A Recommended but
recommended optional

Compass
The AK8962C is a highly integrated micro three-axis electronic compass. It can sense the
magnetic fields in three dimensions, and supports I2C and SPI communications. The
AK8962C has a measurement range of ±1200 uT and sensitivity of 0.3 uT.

Figure 8-43 Compass circuit

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The interface signal description is as follows:

COMPASS_INT: Data ready signal; connected to the MSM8930; generates interrupt signals
when the data is ready
I2C4_DATA_SENS and I2C4_CLK_SENS: I2C interfaces; used to configure the register and
transmit the sensor data to the processor
CSB: used to select the communication method of the SPI or I2C. The CS is set at a high level,
and the I2C is selected.
CAD0 and CAD1: used to select the I2C address. The CAD0 and CAD1 values are 0, and the
I2C address is 0CH.

Table 8-11 Compass specification requirements

Parameter Microsoft 38140069 Is the Requirement Met?
Requirement AK8963C

Magnetic 60 Hz 8 Hz or 100 Hz What exactly does Microsoft mean

field by sampling rate? Software
sampling personnel should help confirm
rate whether it means continuous
measurement mode for the
AK8963C.
Resolution At least 1 uT (0.3 0.3 uT OK
uT
recommended)
Precision ±5 uT 0.3 uT OK

Magnetic At least ±300 uT ±4900 uT OK

field range (±1200 uT
recommended)

Proximity and Ambient Light Sensor

There are two suppliers for proximity and ambient light sensors: AVAGO and TAOS. They
both provide solutions integrating the ALS, proximity detection, and IR LED. The pins of the
ADPS-990x by AVAGO and the TMD2771x by TAOS are completely compatible. The
ambient light sensor is used to automatically adjust the LCD backlight brightness based on the
detected ambient light, while the proximity sensor is used to avoid misoperation on the
capacitive screen during calls.
The proximity sensor emits IR through its internal infrared diode and detects the returned IR
strength through the internal light detector. The use of all-pass diodes and infrared diodes to
filter the invisible elements from the ambient light to achieve the light sensing capability close
to that of human eyes. The sensor not only supports the communication method of I2C but
also programmable interrupt thresholds.
Figure 8-44 shows the proximity and ambient light sensor's circuit.

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Figure 8-44 Proximity and ambient light sensor circuit

The interface signal description is as follows:

PROXIMITY_INT: interrupt output; connected to the MSM8930; provides interrupt signals
for proximity and ambient light; generates interrupt when the proximity or ambient light ADC
exceeds or becomes smaller than the preset value
I2C4_DATA_SENS and I2C4_CLK_SENS: I2C interface; used to configure the register;
transmits the sensor data to the processor, including the ambient light (including exposed and
shielded) and proximity sensor values
LDR: connected to the LEDK; driven by the chip's internal LED
The I2C address is 0x72/0x73.

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Table 8-12 Ambient light sensor specification requirements

Parameter Microsoft APDS-9900 Is the
Requirement Requirement
Met?

Normalized Close to the Close to the human eye OK

spectral response human eye response
of the sensor response

Peak response Resolution: ≤ 10 N/A TBD

wavelength lux in the scale
resolution of 0 ≤ x ≤ 100
lux
Peak response Resolution: ≤ 64 N/A
wavelength lux in the scale
resolution of 100 ≤ x ≤
1000 lux
Precision: within
±25%
Peak response Resolution: ≤128 N/A
wavelength lux in the scale
resolution of 1000 ≤ x ≤
4000 lux
Precision: within
±25%
Sampling rate ≥4 Hz ALS ADC integration OK
Time:2.72696 ms

Table 8-13 Proximity sensor specification requirements

Parameter Microsoft APDS-9900 Is the
Requirement Requirement
Met?
Can detect black, gray, The detection of the
and white cards with a black card is difficult
width of 3 cm and height because it has high
of 5 cm standard requirements
for the architecture
design. Few
in-development
projects can achieve
that.
Sampling rate ≥ 10 Hz ADC conversion OK
Time: 2.72 ms

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8.4.12 Motor Interface

The motor is on the L board. See Figure 8-45 for the motor's circuit principle.

Figure 8-45 Motor circuit principle

The VIB_DRV_N signal is connected to the corresponding pin on the PM8038 to drive the
motor to vibrate.

8.4.13 Environment Monitoring and Protection Solution

The HK/XO ADC of the PM8038 monitors the external environment of the phone. The
monitoring signals include the power supply voltage, battery temperature, PA temperature,
and crystal temperature. See the House Keeping part in Figure 8-46 for the general structure
of the system.

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Figure 8-46 High-level PM8038 IC functional block diagram

Table 8-14 Analog multiplexer and scaling functions

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 Power supply voltage monitoring: Monitoring signals such as VBAT, VCOIN, VCHG,
USB_IN, and DC_IN are brought in through the analog interface of the PM 8038 power
supply, and then sent to HKADC through the internal analog multiplexer and converted
into digital signals.
 Battery temperature monitoring: Resistors are installed in series on the NTC in the
battery and the resistors are connected to VREF_THERM. The voltage allocated to NTC
resistors passes through the analog multiplexer, and is then sent to HKADC and
converted into digital signals.
 PA temperature monitoring: A temperature sensor (an NTC resistor) is placed near the PA
to measure the temperature of the PA. The output PA_THERM of the temperature sensor
is connected to the PM8038 analog multiplexer, and is then sent to HKADC and
converted into digital signals. When designing the PCB, this temperature sensor should
be placed as close to the PA as possible.
 Crystal temperature monitoring: The 19.2 MHz crystal oscillator equipping with an NTC
resistor is used. The TH-IN pin is connected to the XO_THERM pin of the PM8038. The
crystal temperature information passes through the PM8038 analog multiplexer, and is
then sent to HKADC and converted into digital signals.

8.4.14 Board Reset, Sequence, and the WDT Function

Hardware Reset Signals

Table 8-15 shows the hardware reset signal information on the MSM8x30 platform.

Table 8-15 Hardware reset signal information

Name Output Chip and Input Chip and Function
Pin Pin Description
PON_RESET_N PM8038 PON_RST MSM8x RESIN Power-on reset
_N 30 _N signal output by
the PM8038; shifts
from low to high
voltage after the
PMIC powers on
- - - PM8038 RESIN External reset input
_N signal of the
PM8038; Contains
a pull-up resistor;
can be connected
to a ground switch;
Pulling down the
resistor resets the
PM8038.
MSM_RESOUT_N MSM8x RESOUT_ eMMC RSTN Reset signal output
30 N from MSM8x30 to
the eMMC.

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 The PON_RESET_N signal is the reset signal released by the PM8038 when it finishes
the power-on sequence. When the PM8038 powers on, the PON_RST_N pin is in a low
level. When the power supply and clock finish the power-on sequence as scheduled, the
PON_RST_N pin is pulled to a high voltage level after a certain period of time, making
the MSM8x30 main chip is initiated after it is released from the hardware reset state, as
shown in Figure 8-48.

Figure 8-48 Power-on sequence diagram

 There is a hardware reset input pin RESIN_N on the PM8038 chip. When the phone
breaks down or encounters other function faults, pull down the pin and keep it down for
a certain period of time by pressing the external reset switch can reset the PM8038.

Figure 8-49 Power-off sequence

Pay attention to the following items when using the reset signal:
 The reset function can be enabled through the SBI control.
 There is a pull-up resistor for the RESIN_N signal in the PM8038. Reset the phone by
pulling down the pin externally.

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 The PM8038 contains a programmable timer (32 ms–10.25s). If the RESIN_N is pulled
up before the timer overflows, the PMIC chip will not make any move, deeming it as
mis-touching of the reset key. If the RESIN_N is kept low until the timer overflows, the
PMIC chip will reset the board.
 During the reset, the PMIC sends an interrupt signal to the MSM, and then the internal
reset timer (10 ms–2s, programmable) starts counting. The modem chip will turn off the
internal functional module in sequence after receiving the interrupt signal. If the modem
is turned off before the timer overflows, the PMIC chip starts implementing the
power-off sequence. When the timer overflows, the PMIC chip will implement the
power-off sequence regardless of whether the modem chip is turned off.
 Once the PMIC chip finishes the power-off sequence, the "remain off or attempt
power-on" pit of the SBI control register will determine whether to restart the power-on
sequence or keep the power-off state.
In this design, the RESIN_N pin of the PM8038 is suspended in the air, and is not used.

Figure 8-50 PM8038 RESIN_N pin

The MSM8x30 chip contains a RESOUT_N pin. (This reset output signal is generated by
RESIN_N reset input and WDOG_RESET. The rising edge of the RESOUT_N defers several
uP clocks compared with that of the RESIN_N.)

Figure 8-51 Watchdog reset

The WDOG_RESET Timer And Soft Reset

The WDOG_RESET timer in the MSM is a 14-digit timer. When the system hardware or
software encounters unexpected failures, and the timer will overflow and initiate the reset
procedure if the CPU does not reset the watchdog within the time limit. The enable/disable
function of the watchdog can be realized through the WDOG_DISABLE pin. When the pin is
pulled up, the watchdog will be disabled. When the pin is suspended in the air, the watchdog
will be enabled. Qualcomm suggests us to reserve the pull-up resistor pin that can be used
during testing stage. When the product is in delivery stage, the pin should be suspended in the
air.

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Figure 8-52 Watchdog reset timer and soft reset diagram

Note that the WDOG_DISABLE status is read only once when the phone is powered on.
Later the pin will be used as the GPIO. Therefore, the WDOG_DISABLE pull-up power
supply is the VREG_L11_1P8_FET in Figure 8-52. The power supply will be suspended
when the MSM is turned on.
The watchdog reset is as follows:
1. When the watchdog timer overflows, the MSM drivers PS_HOLD to a low level.
2. When the PMIC detects that PS_HOLD is at a low level, it will drive the PON_RST_N
signal to a low level. The MSM and other peripheral chips will then be reset.
3. After a certain period of time, check various status of the phone to make sure that
watchdog timer overflowing and software reset are implemented.
4. During the software resetting procedure, the PMIC will not be powered off. Instead, it
resets all the SBI registers to their default values. 20 ms later, it drives the PON_RST_N
signal to a high level, releasing the MSM from the reset state

8.4.15 Charging Indicator Port

The tri-color indicator is driven by the PM8038. See Figure 8-53 for the detailed connection
method. The red indicator LED_RED_DRV is connected to the RGB_RED pin of the
PM8038. The green indicator LED_GREEN_DRV is connected to the RGB_GRN pin of the
PM8038. The blue indicator LED_BLUE_DRV is connected to the RGB_BLU pin of the
PM8038. The PM8038 controls the current value and percentage to adjust the brightness and
color of the tri-color indicator.

Figure 8-53 Tri-color indicator connection diagram

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8.4.16 Board Power Allocation Solution

On the G740 phone, the power supply is mainly provided by the PM8038 power management
chip.

PM8038 power management chip

1. General description on the PM8038 power allocation
The PM8038 provides two types of programmable voltage regulators with a total of 33 output
channels: six switched-mode power supplies and 27 LDO regulators. Besides, two
low-voltage switches and one negative voltage are provided.
Although each regulator has a recommended function, all regulators have other usages except
for the following regulators.
 S1: Dedicated to supply power to MSM's modem and the USB.
 S5: Dedicated to supply power to MSM's krait #1.
 S6: Dedicated to supply power to MSM's krait #2.
 L13: Dedicated to supply power to the PMIC CLOCK.
 L15/L17: Dedicated to supply power to the UIM card.
Table 8-16 lists the voltage regulator parameters.

Table 8-16 Voltage regulator specifications

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Table 8-17 Voltage regulator specifications (2)

2. Reference source
All the voltage regulators and other circuits in the PM8038 share the same reference voltage
source. There are some special requirements in the circuit connection between the PM8038
and other circuits. The REF_GND pin is the ground for the reference power supply. The
REF_BYP pin connects a 0.1 uF bypass capacitor to the ground, realizing low-pass filtering
function together with the internal resistors. The filtered voltage can be provided to the MPP
pin, serving as the analog output.
Figure 8-54 shows the reference circuit.

Figure 8-54 Reference circuit

3. Switched-mode power supply

The switched-mode power supply (SMPS) is realized through the PWM method, and can
function under PWM and PFM mode.
To enhance the efficiency under low-current mode, the transverter can function properly
under low power consumption mode. The transverter is shut down for most of the time and is
turned on for a short period of time to maintain the output voltage. Under low consumption
mode, the buck transverter reduces its pulse frequency and works under pulse frequency

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modulation (PFM) mode. Note that when the load is extremely light, the pulse frequency may
be reduced to the audio frequency range, influencing the audio performance.
The PM8038 contains six Buck SMPS circuits, among which two are fast transient SMPS
circuits with the maximum output current of 2000 mA, and the other four are high-frequency
SMPS circuits with the maximum output current of 1500 mA. It is recommended to supply
power in the following way:
 S1: Supply power to MSM's core (1500 mA).
 S5: Supply power to MSM's krait #1 (2000 mA).
 S6: Supply power to MSM's krait #2 (2000 mA).
 L16/L19: Supply to the QDSP (1200 mA).

Figure 8-55 Switched-mode power supply diagram (1)

Figure 8-56 Switched-mode power supply diagram (2)

All the bucks have two control modes: PFM (with low power consumption) and PWM (the
normal mode). To realize the greatest efficiency, bucks automatically choose between the
working modes. You can also use software to select working mode.
The two types of SMPSs adopt a constant frequency mode control structure and use build-in
switch tube.
4. LDO
The low drop-out (LDO) regulator consists of the following four functional modules: the
reference voltage, control components, feedback path, and error amplifier. The four functional
modules form a closed-loop control system to reduce the gap between the output voltage and
the reference voltage. The system will not adjust the current output. The input of the error
amplifier includes reference voltage and the proportional output of the output voltage

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generated from the feedback path. Any difference between the two inputs will be amplified by
the error amplifier. The closed-loop system changes the control component, which changes
the output voltage, with the ultimate purpose of reducing the difference to zero. The accuracy
of output voltage does not vary with the change of the current. Figure 8-57 is the LDC
functional block diagram.

Figure 8-57 LDC functional block diagram

Reference voltage: The PM8038 generates reference voltage using the trimmed bandgap. Its
accuracy and stability directly influence the output voltage. The closed-loop system offers
percentage feedback; therefore, the reference voltage is optional.
Control component: The PM8038 uses the PMOS tube as the control component, which has
two main functions. First, generate different voltage drops between the gate and source based
on different output of the amplifier. Second, a wide-range of current passes through the drain
without influencing the drain voltage drop. When you turn on or off the circuit, the current
passing through the control component changes greatly, satisfying the different working mode
of the phone, including sleep, Rx, and Rx/Tx mode.
Feedback path and error amplifier: The PM8038 uses op amplifier circuit to realize the
function of feedback path and error amplifier. The output voltage Vout provides feedback
input through the resistor network. To begin with, , and according
to the features of operation amplifier, V (+) = V (-) while V (+) = Vin, therefore V (-) = Vin.
Consequently, the output voltage is , and the feedback control function
is realized.
The PM8038 LDO can be classified into five categories based on the output current. The first
category covers L1, L16, L19, L20, L24, and L27, whose output current is 1200 mA. The
second category covers L5, L6, L7, L10, and L11, whose output current is 600 mA. The third
category includes L8, L9, and L12, whose output current is 300 mA. The fourth category
includes L2, L15, L17, L21, and L26, whose output current is 150 mA. The last category
covers L3, L4, L18, L22, and L23, whose output current is 50 mA.
5. NCP
The PM8038 contains an NCP SMPS, which serves to generate a –1.8 V power supply,
supplying power to stereo headset. The NCP is not used in the G740 phone.

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6. Voltage switch
The PM8038 contains two low-voltage switches: LVS 1 and LVS 2, which can supply a
current of 100 mA.

Internal Voltage Connection

Some internal modules in the PM8038 use the output of the special voltage regulators. The
connections between internal modules and voltage regulators are made internally. Only when
the regulators output in a normal way and are in the default state can the modules in the
PM8038 function properly. The signal connection is shown in Table 8-16.

Table 8-18 Internal voltage regulator connections

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8.4.17 Board Memory Allocation

Figure 8-58 illustrates MSM8930 memory allocation.

Figure 8-58 MSM8930 memory allocation diagram

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8.4.18 Board Power-on and Power-off Processes

Figure 8-59 shows the power-on and power-off processes when the power switch is set to ON.

Figure 8-59 PM038 power-on and power-off processes

Figure 8-60 PM8038 power supply grouping diagram

The power-on sequence starts when you press the power switch and the KPDPWR_N signal
of the PM8038 is pulled down. To ensure a successful power-on process, this signal must be
kept at a low level before the PS_HOLD signal is pulled up.
After KPDPWR_N is pulled down for a certain period of time (treg1), the voltage regulators
are turned on in sequence from Group 7 to Group 0. The power supplies in the same group are
turned on with a time lag of four sleep clock cycles. After all the voltage regulators are
enabled, the detection circuit will check whether the power-on process is accomplished. A
short delay (treg) can be found in the power-on process of different groups before all the
power supplies that are on by default are powered on.

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The PON_RESET_N signal is pulled up after a short delay (treset1). This delay aims to
ensure that the MSM has enough time to complete the power-on process.
In the initial stage of the power-on sequence, the PS_HOLD signal can be in any state, but it
must be pulled up before the tpshold timer overflows. Till then, a successful power-on process
is complete.
If the PS_HOLD signal remains at low level after the tpshold timer overflows, the power-on
process fails and the power-off process starts immediately. The PS_HOLD signal is always at
a high level when a phone is being powered on.
The power-off process starts when the power key is pressed and the KPDPWR_N signal of
the PM is pulled down for a specified period of time. This time range must be long enough to
ensure that the phone does not deem it as a mis-touching move. After this period of time, the
MSM pulls down the PS_HOLD signal and requests the PM8038 to initiate the power-off
process.
After a short time span (treset0), voltage regulators are enabled in sequence from Group 0 to
Group 7, which is the reverse order for enabling voltage regulators during the power-on
process.

Power-on Process
When the PS_HOLD signal remains at a low level, the PM8038 is off, and the power-on
circuit is detecting the following events that can trigger the power-on sequence:
 The power key is pressed, and the KPDPWR_N signal is pulled down.
 Cable Poweron pins are pulled down.
 External power supplies are plugged in (the VCHG pin voltage exceeds the related
threshold).
 A real-time clock alarm is triggered.
 SMPL occurs.
Any of the preceding events can generate power-on signals, and a related interrupt signal is
sent to the triggering source of the MSM8930 power-on process. No matter what the
triggering source is, the PM8038 performs the power-on process as follows:
1. Any of the five triggering events occurs or they occur in sequence.
2. The PM8038 determines and selects power supplies. If the VCHG pin voltage exceeds
the threshold, the charger is used as power supplies. If the VCHG pin voltage is lower
than the threshold, the PM8038 pulls up the BAT_FET_N signal, uses the main battery
as power supplies, and prohibits charging.
3. The internal bandgap voltage reference is enabled.
4. The VDD voltage is monitored. When the voltage exceeds the under voltage lock out
(UVLO) threshold, the power-on process continues.
5. The PM8038 pulls down the PON_RESET_N signal even though this signal has not
been generated because the MSMP is not enabled. This mechanism ensures that the
PON_RESET_N signal can be in proper state during the MSM power-on process.
6. The PM8308 restores the SBI register to its default settings. If the VCOIN voltage is
lower than the related threshold, the PM8308 also restores the SBI bit powered by the
backup battery and the RTCRST interrupt.
7. The PM8308 sets the SMPL interrupt state and restores the SMPL timer if the SMPL
function is enabled and the SMPL restart signal is valid. This move aims to prepare for
the next SMPL event.

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8. After the treg1 delay, the PM8308 enables voltage regulators in the following sequence:
S2 > L24 > S1 > S4 > L11 > L20 > L26 > L4 > L22 > L6 > L3 > L5.
9. The PM8308 pulls up the PON_RESET_N signal a short time delay (treset1) after all
voltage regulators that are on by default have been powered on.
10. The PS_HOLD times starts counting and monitors the PS_HOLD signal sent by the
MSM in real time. A successful power-on process requires that the PS_HOLD signal
changes from low to high before the PS_HOLD timer completes counting. If the
PS_HOLD signal has not been pulled up when the PS_HOLD timer overflows, the
PM8308 goes back to the off state and the power-on process returns to step 1. If any of
the five triggering event still occurs, for example the KPD_PWR_N signal remains at
low level, the power-on process starts again. If the PS_HOLD signal becomes high
before the PS_HOLD timer overflows, the PM8038 enters the power-on state (sleeping
or working) and sends the related interrupt signal to the MSM to determine the triggering
source.
The power-on process fails if any of the following events occurs:
 The triggering signal disappears. In this case, the power-on process stops and returns to
step 1.
 The VDD voltage decreases and reaches the UVLO threshold before the PS_HOLD
signal is pulled up. In this case, the PM8308 terminates the power-on process and retries
it twice. If all these three power-on attempts fail, the PM8308 is reset and waits for the
next triggering event.

If the PS_HOLD signal is pulled up before the VDD voltage decreases to the UVLO threshold, the
restart circuit does not work and this event is processed in the same way as an SMPL event.

When the MSM is powered on, the PM8308 remains on until the PS_HOLD signal is pulled
down, a UVLO event occurs, or an overheating shutdown event occurs. In any of these three
cases, the PM8308 performs the power-off process.

Power-off Process
When the PS_HOLD signal of the MSM remains at high level, the PM8308 is on and will
detect any of the following events that trigger the power-off process:
 The power key is pressed, and the MSM pulls down the PS_HOLD signal.
 The VDD voltage detected at the ISNS_M pin is lower than the UVLO threshold.
 The temperature of the PM8038 exceeds the overheating threshold.
In general, the power-off sequence is triggered when the power key is pressed and the
MSM8930 is on. The KPDPWR_N pin (can be pulled up inside the PM8038) of the PM8038
connects to the power key on the phone. The MSM8930 monitors the power key using the
interrupt logic. When the KPD_PWR_N interrupt event occurs, the MSM starts the power-off
process:
1. The power key is pressed and held for a period, and the power-off menu is displayed.
2. The MSM writes the information that must be saved into the flash memory when the
user chooses the power-off option.
3. The MSM disables the SMPL function to prevent itself from being powered on again.
4. The MSM pulls down the PS_HOLD signal.
5. The PM8038 pulls down the PON_RESET_N signal, resets the MSM and other
peripherals, and shuts down the TXCO manager.

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6. After the treset0 interval, the MSM determines the next action depending on the
following conditions:
7. If the temperature of the PM8038 exceeds the overheating threshold, the MSM pulls
down the PON_RESET_N signal immediately and shuts down all PM8038 circuits to
prevent the PM8038 from being damaged.
8. If the VDD voltage is lower than the UVLO threshold, the MSM pulls down the
PON_RESET_N signal immediately and shuts down all PM8038 circuits to prevent the
main battery from being damaged.
9. If either of the preceding events does not occur and the watchdog restart bit is set, the
MSM sets the interrupt status bit of the watchdog. Then, the MSM8930 restarts, its
watchdog timer resets, and the PM8038 restarts without being powered off.
10. If any of the preceding events does not occur and the SMPL function is enabled, the
SMPL process is triggered.
11. If none of the preceding events occurs, the normal power-off process continues.
12. The MSM8930 shuts down the remaining power managers in turn. Only the battery or
the VPH_PWR provided by external power supply is used to supply power.

8.4.19 Clock Solution

The MSM8930's clock source consists of two parts, the 27 MHz PXO clock and the 19.2
MHz CXO clock. The 32.768 kHz sleep clock signals are generated by the internal RC
oscillation circuit and calibrated by the external 19.2 MHz CXO clock.

Table 8-19 MSM8930's clock source

Source Output to Divided as
Signal
19.2M PM8038: XO_OUT_A0 WTR1605L: XO_IN
XTAL_19M XO_OUT_D0 MSM8930: CXO and
USB_HS_SYSCLK
SLEEP_CLK(32.768k)
27M MSM8930: SB_CLK WCD9304: SB_CLK
PXO (27M)
SB_MCLK WCD9304: MCLK

8.4.20 RTC and Battery Backup

The power-off clock (RTC) and SMPL recovery function rely on the precise 32 kHz clock
(32.768 kHz). Figure 8-61 shows the clock source of the PM8038 sleep clock, which consists
of four components: external 32 kHz crystal oscillator, built-in RC oscillator (for calibration),
external 19.2 MHz crystal oscillator's frequency divider, and 19.2 MHz frequency division of
the RC oscillator.

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Figure 8-61 clock source of the PM8038 sleep clock

The two frequency dividers are put into use only when the 32K crystal oscillator and RC
crystal are unavailable. The 19.2 M frequency division produced by the crystal oscillator and
RC oscillator generates the low-precision 32K clock, which can be used as a sleep clock only.
Only the two oscillators can generate the RTC and SMPL recovery clocks.

8.4.21 UVLO and SMPL Recovery Functions

The PM8038 supports the under voltage lockout (UVLO) and protection functions using the
UVLO circuit. The UVLO circuit monitors the VDD voltage and turns off the PM8038 when
the voltage is too low. The threshold (2.70 V by default) for voltages that can trigger a UVLO
event can be programmed, from 1.50 V to 3.05 V by increments of 50 mV. This threshold
must be lower than the low voltage alarm threshold of the phone.
Even thought the UVLO is realized by hardware, signals output by the UVLO circuit can be
used for additional features by interacting with software, such as SMPL recovery, power-on
sequence termination, and timeout soft reset of the watchdog.
The power-on process is initialized only if the VDD voltage exceeds the threshold. The low
VDD voltage for a certain period will trigger a UVLO event. Setting timeout duration
prevents noise signals from being detected as UVLO events. The VDD voltage being low for
a certain period of time would trigger a UVLO event. Once a UVLO event is detected, the
PON_RST_N voltage will be pulled down, and the phone will be powered off. The voltage
threshold can be programmed, but the UVLO event detection does not involve software. The
timeout duration length cannot be modified. The UVLO events do not generates interrupt
signals. Instead, it pulls down PON_RST_N directly to start the power-off process.
Figure 8-62 shows the UVLO event detection mechanism.

Figure 8-62 UVLO event detection mechanism

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The sudden momentary power loss (SMPL) recovery function enables the PM8038 to restart
after a momentary power-off.
The SMPL recovery can be enabled using software. After you enable the SMPL recovery, if
the VDD voltage recovers to the normal value (higher than 2.7 V) within the preset timeout
duration (0.5s to 2.0s), the following recovery process will be initiated:
 Driven by the UVLO event, the PON_RST_N voltage is pulled down, and the PM8038
is powered off.
 The backup capacitor or button battery connected to the VCOIN pin starts to power the
SMPL circuit.
If the VDD voltage recovers within the programmed interval, the PM8038 powers on
again without requiring any software intervention. In the meantime, the PMIC sends
interrupt signals to the MSM to inform that: a sudden momentary power loss has
happened
the RTC is affected by the abnormal voltage
the current power-on process is abnormal.
 If the VDD voltage fails to recover within the programmed interval, the phone powers
off. Only a normal power-on process can bring the phone back on.
To use the SMPL recovery function, enable it using software and ensure that the phone has a
keep-alive capacitor or backup battery.

Figure 8-63 SMPL recovery function diagram

Figure 8-64 shows the VCOIN circuit of the G740. The 44 uF capacitor ensures that the RTC
is maintained when you replace the phone's main battery.

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Figure 8-64 G740 VCOIN circuit diagram

8.5 RF subsystem
The RF subsystem consists of the transceiver, frequency source, antennas, GPS module, and
Bluetooth+Wi-Fi module. This section gives a detailed introduction to each module.

8.5.1 W-CDMA/GSM Transmission

The RF subsystem employs the platform chip of WTR1605L, which implements RF
transmission and receiving and GPS functions. Figure 8-65 shows the block diagram of the
WTR1605L.

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Figure 8-65 WTR1605L block

The WTR1605L provides seven common WCDMA/CDMA/LTE reception channels. Among

them, three are used for receiving low-frequency differential signals, and other four all for
receiving middle-frequency and high-frequency signals. The WTR1605L also contains four
diversity reception channels. Among them, two are used for receiving low-frequency
differential signals, and the other two for receiving middle-frequency and high-frequency
signals. The WTR1605L has a GPS reception channel (support A-GPS), providing the IQ
signal to the baseband. In the meantime, the WTR1605L possesses four GSM transmission
channels. GSM and WCDMA share two channels to output I/Q signals to the baseband.

RF transmit circuit
The transmit circuit of the WTR1605L can be classified into four WCDMA/GSM systems.
Among them, WCDMA is classified into the B1, B2, B4, and B5 bands while GSM is
classified into four frequencies bands of GSM, EGSM, PCS, and DCS. The WCDMA B1, B2,
B4, and B5 bands and the four GSM frequency bands share the same multimode power
amplifier to transmit circuit, as shown in Figure 8-66.

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Figure 8-66 RF transmit circuit

The MSM8930 provides the control signals such as the enable model and frequency selection
of the multimode power amplifier. The GSM bands pass through the RF switch and then
transmitted from the main antenna.
However, the WCDWA transmission signals go through the duplexer and the RF switch, and
finally they are transmitted from the main antenna. The transmission channel of the WCDMA
B1 band is shown in Figure 8-67.

Figure 8-67 WCDMA B1 band transmission channel

The transmission channel of the WCDMA B2 band is shown in Figure 8-68.

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Figure 8-68 WCDMA B2 band transmission channel

The transmission channel of the WCDMA B4 band is shown in Figure 8-69.

Figure 8-69 the WCDMA B4 band transmission channel

The transmission channel of the WCDMA B5 band is shown in Figure 8-70.

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Figure 8-70 WCDMA B5 band transmission channel

8.5.2 W-CDMA/GSM Reception

The reception circuit consists of WCDMA and GSM reception channels. Both the WCDMA
and GSM reception signal are received by the main antenna, then goes through the main
antenna, and finally, arrives at the WTR1605L. The main antenna and its switch are shown in
Figure 8-71.

Figure 8-71 Main antenna and main antenna switch diagram

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2. WCDMA reception channel

After going through the main antenna and main antenna RF switch, the WCDMA reception
signals are sent to the duplexer, and then mapped to the WTR1605L. Figure 8-72 shows the
signal reception for the WCDMA B1 band.

Figure 8-72 WCDMA B1 band signal reception diagram

Figure 8-73 shows the signal reception for the WCDMA B2 band.

Figure 8-73 WCDMA B2 band signal reception diagram

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Figure 8-74 shows the signal reception for the WCDMA B4 band.

Figure 8-74 WCDMA B4 band signal reception diagram

Figure 8-75 shows the signal reception for the WCDMA B5 band and GSM850 frequency
band.

Figure 8-75 Signal reception diagram for the WCDMA B5 band and GSM850 frequency band

3. GSM reception channel

After going through the main antenna and main antenna RF switch, the GSM reception
signals are mapped to the WTR1605L. The GSM850 frequency band and WCDMA B5 band
share the same reception channel, as shown in Figure 8-76. Figure 8-77 shows the signal
reception for the GSM900 frequency band.

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Figure 8-76 Signal reception diagram for the GSM900 frequency band

Figure 8-77 shows the signal reception for the GSM1800 and GSM1900 frequency bands.

Figure 8-77 Signal reception diagram for the GSM1800 and GSM1900 frequency bands

8.5.3 Frequency Source

The WTR1605L integrates all LO generation circuits required by the reception and
transmission of the WCDMA and GSM, and GPS reception. Three internal LO circuits are
available, and each circuit has the independent PLL, VCO, and distribution circuit. In addition,
an external filter circuit is used. These circuits use PM8930's XO input as the reference clock
source, as shown in Figure 8-78.

Figure 8-78 Referent clock source diagram

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The first local oscillation in the WTR1605L is used in all the transmission links of GSM and
WCDMA, the second one is used in all the reception links of GSM and WCDMA, and the
third one is used in all the reception links of GPS.

8.5.4 GPS and WCDMA B1 Band Diversity Circuit

The WTR1605L integrates the GPS circuit. After being filtered and amplified by the external
LNA, GPS signals are sent to the WTR1605L. Figure 8-79 shows the GPS reception circuit.

Figure 8-79 GPS reception circuit

Figure 8-80 shows the WCDMA B1, B2, and B4 DRX band circuits.

Figure 8-80 WCDMA B1, B2, and B4 DRX band circuits diagram

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8.5.5 Wi-Fi and Bluetooth

The G740 uses the Qualcomm WCN3660 chip that integrates Bluetooth and Wi-Fi modules.
In the G740, the Bluetooth and Wi-Fi share one antenna. The timeshare design in this solution
realizes the multiplexing of Wi-Fi and Bluetooth functions without any SP3T RF switches.
Figure 8-81 shows the Wi-Fi and Bluetooth circuit.

Figure 8-81 Wi-Fi and Bluetooth circuit

The MSM8930 provides a PCM interface that interconnects to the Bluetooth module's PCM
signals. Table 8-20 shows signal definitions.

Table 8-20 Signal definitions of the PCM interface

BT_WAKES_MSM: This is the Bluetooth module's wake-up output signal, which connects to
the Bluetooth unit's HOST_WAKE pin to wake up the MSM that is in sleeping mode.
MSM_WAKES_BT: This is connected to the Bluetooth unit's BT_WAKE pin to allow the
MSM to wake up the Bluetooth unit that is in sleeping mode.

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9 Troubleshooting Common Faults

Before you repair a G740, back up the user data and restore the phone to its factory settings.

9.1 Startup Failure

Most power-on failures are caused by power supply exceptions. Therefore, you can rectify
power-on failures by troubleshooting power supply circuit faults. Power-on failures are
divided into the following types:
 No current: After you connect the phone to the DC power supply and power on the
phone, the reading on the power supply ranges from 0 mA to 5 mA.
 Weak current: After you connect the phone to the DC power supply and power on the
phone, the reading on the power supply ranges from 5 mA to 100 mA.
 Excessive current: After you connect the phone to the DC power supply and power on
the phone, the reading on the power supply exceeds 300 mA.
If the G740 fails to be powered on, observe the power-on current reading on the DC
power supply to identify the fault.
 No current

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Figure 9-1 Troubleshooting procedure for startup failures with no current

This situation occurs when the main power circuit is short-circuited. Check whether VBUS and VSYS
circuits are short-circuited.
 Weak current

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Figure 9-2 Troubleshooting procedure for startup failures with weak current

Startup f ailure

Connect the phone to a f ake

battery and maintenance power
supply, power it on, and observe
the startup current

Weak current

N
Does the U201
DC-DC voltage Check the
has partial output? U201

Y
Is other output of the U201 Check the short-
short-circuited? circuited position

Replace the
U201

If the VPH_PWR voltage is normal, but the U201 output is not, the other output of U201 is probably
short-circuited, which results in the power output exception of the PMU. Check every output of the
U201 to see whether they are short-circuited.
 Excessive current
Excessive current is usually caused by short-circuited power supply circuits (DC power
supply) which may result in 500 mA or greater current. Mostly this fault occurs when VBAT
is short-circuited to ground.

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Figure 9-3 Troubleshooting procedure for startup failures with excessive current

Startup f ailure

Connect the phone to a f ake

battery and maintenance power
supply, power it on, and observe
the startup current

Excessive current
(greater than 500 mA)

Is pin 1 of the N
J1501short-
Check the U201
circuited to
ground?

N
Re-solder or
Is the U201's voltage normal?
replace the U201

Check the U201

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Figure 9-4 Pin 1 of the J1501

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9.2 Reception Failure

The maintenance procedure for reception failure of W2100 is used as an example.

Figure 9-5 Troubleshooting procedure for reception failures

W2100 reception
f ailure

Check the J3201

without plugging in
the RF cable

Are the J3201's

pin 1 and middle N Check the
thimble J3201
connected?

Is the U3201's switch N

control signal normal? Check the U3202
(See the truth table f or and U301
ref erence)

Are the signals at U4101's

N Check the
pin 1 and pin 6 normal?
(The insertion loss cannot U4101
exceed 2.5 dB)

Are the U4001's IQ N Check the

signal and the battery
U4001
voltage normal?

Check the U301

End

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Check the control signals of U3201 switch using a multimeter or oscilloscope. Table 9-1 is a truth table
for control signals.

Table 9-1 Truth table for control signals

For B2 reception failures, just replace the check procedure of the U4101 with that of the
U4102.
For B4 reception failures, just replace the check procedure of the U4101 with that of the
U3801.
For B5 reception failures, just replace the check procedure of the U4101 with that of the
U3802.
For GSM850, use the same handling method as that for the B5 reception failures.
For GSM900, only replace the check procedure of the U4101 with that of the Z3201.
For GSM1800/1900, only replace the check procedure of the U4101 with that of the Z32012.

9.3 Transmission Failure

This section describes the troubleshooting process for RF transmission failures of
B1/B2/B4/B5/GSM850/900/GSM1800/1900.
The B1 is used as an example. Firstly, ensure that the USIM card, GSM circuit, and RF
antenna are installed properly, and troubleshoot the phone according to the following
procedure.

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Figure 9-6 Troubleshooting procedure for transmission failures

W2100 transmission
f ailure

Check the J3201

without plugging in the
RF cable

N
Are the J3201's
pin 1 and pin 2 Check the J3201
connected?

Is the U3201's switch N

control signal normal? Check the U3201
(See the truth table f or and U301
ref erence)

Are the signals at U4101's

N
pin 3 and pin 6 normal? Check the
(The insertion loss cannot U4101
exceed 2.5 dB)

Y
N

Is the U3301's multi- Check the

mode PA output normal? U3301

Y
N
Are the U4001's IQ
Check the
signalY and the battery
U4001
voltage normal?

Check the U301

End

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For B2 transmission failures, just replace the check procedure of the U4101 with that of the
U4102.
For B4 transmission failures, just replace the check procedure of the U4101 with that of the
U3801.
For B5 transmission failures, just replace the check procedure of the U4101 with that of the
U3802.
For GSM transmission failures, just skip the check procedure of the U3302.

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9.4 Charging Failure

Figure 9-7 Troubleshooting procedure for charging failures

Charging f ailure af ter a

charger is connected

N
Does the charger Replace the
f unction properly? charger

Y
Y
Is the J1501 Re-solder the
poorly soldered? J1501

N
Is there voltage at Replace the Q301
VPH_PWR?

N
Is the battery connector's Repair the
contact properly J1501
connected to the battery?

Y Replace the
Is the battery damaged?
battery

Check the U201

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9.5 Camera Failure

Figure 9-8 Troubleshooting procedure for camera failures

Camera f ailure

Y
Is the problem
solved af ter you re-
End
load the phone
sof tware?
N
Y
Is the J2101 poorly Re-solder or
soldered? replace the J2101

Is the problem Y
solved af ter you
End
replace the
camera?
N

Replace the Y
End
U2101

Replace the
U301

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9.6 Connection Failure Between the Phone and Computer

Figure 9-9 Troubleshooting procedure for connection failures between the phone and computer

Connection f ailure between

the phone and computer

Y
Is the problem
solved af ter you
replace the USB End
cable?
N

Y
Is the 5-pin mini USB Re-solder the
port poorly soldered? USB port

Is the U board Y
Re-solder the U
BTB connector board BTB
poorly soldered? connector

Y
Is the main FPC Re-solder or
connected? replace the FPC

Y
Is the J2602 Re-solder or
poorly soldered? replace the FPC

N
Is the problem Y
solved after you End
re-load the phone
software?

N
Y
Is there voltage Replace the
at Vchg? U201

Replace the
U301

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9.7 Call Receiving Failure

Figure 9-10 Troubleshooting procedure for call receiving failures

No voice can be heard

af ter a call is set up

N
Is the receiver
End
volume properly set?

Y
Y
Is the insertion of the Replace the
headset misjudged? headset connector

Is the problem Y
solved af ter you
End
replace the
receiver?
N

Replace the
U1701

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9.8 Call Sending Failure

Figure 9-11 Troubleshooting procedure for call sending failures

No voice can be sent

af ter a call is set up

Y
Is the problem
solved af ter you re-
End
load the phone
sof tware?
N
N
Is the MICBIAS voltage Check the
1.8 V? U201

Y
Y
Is the problem
solved af ter you End
replace the
microphone?
N

Replace the
U1701

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9.9 Vibration Failure

Figure 9-12 Troubleshooting procedure for vibration failures

No vibration

Y
Is the problem
solved af ter you re-
load the phone End
sof tware?
N
Y
Is the problem solved
af ter you replace the End
motor?

Y
Is the VIB_DRV_N
Replace the
voltage equal to
FPC
the battery voltage?

Replace the
main FPC

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9.10 Ringtone Failure

Figure 9-13 Troubleshooting procedure for ringtone failures

No ringtone f or
incoming calls

N
Is the ringtone
volume properly set? End

Y
Y
Is the problem
solved af ter you re- End
load the phone
sof tware?
N
Y
Is the problem solved
af ter you replace the End
speaker?

N Re-f asten or
Is the FPC properly
replace the
f astened?
FPC

Is the problem solved af ter Y

you replace the volume key End
sub-board?

Replace the
U1701

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9.11 LCD Display Failure

Figure 9-14 Troubleshooting procedure for LCD display failures

No display on the LCD

Y
Is the problem solved
af ter you re-load the End
phone sof tware?

Is the problem solved Y

af ter you disassemble the
End
phone can re-f asten the
LCD BTB connector?

Is the problem solved Y

af ter you replace the End
LCD?

Is the resistance-to-
ground of the T2010, Y Replace the
T2011, and T2012 not 0 U201
ohm?
N

Replace the
U301

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Figure 9-15 T2010, T2011, and T2012

9.12 Key Failure

Figure 9-16 Troubleshooting procedure for key failures

Key failure

N
Are the key dome Clean or
sheets in good replace the
contact? key dome
sheets

Y
Y
Is the problem
solved after you
replace the key End
FPC?

Re-load the
phone
software

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 110

9.13 No Sound Coming from the Headset During a Call

Figure 9-17 Troubleshooting procedure for no sound coming from the headset during a call

No voice can be heard f rom the

headset af ter a call is set up

N
Is the receiver
End
volume properly set?

Y
Y
Is the problem solved
af ter you replace the End
headset?

N
N
Is the headset Replace the
icon displayed headset
on the status bar? connector

Replace the
U1701

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 111

9.14 microSD Card Detection Failure

Figure 9-18 Troubleshooting procedure for microSD card detection failures

microSD card detection

f ailure

Does the problem Y

persist after you End
replace the microSD
card?

N
Y
Is the microSD card slot Replace the
tilted? microSD card slot

Is the problem solved Y

af ter you replace the End
Z2301?

Replace the U301

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 112

9.15 GPS Signal Reception Failure

Figure 9-19 Troubleshooting procedure for GPS signal reception failures

GPS signal reception

failure

Is the GPS
N Replace the GPS
antenna in good
contact with the antenna or spring
spring?

Y
Re-solder or
Is the GPS channel
replace the faulty
poorly soldered?
component

Re-load the
phone software

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 113

10 Functional Tests

10.1 MMI Test

1. Insert the TF and SIM cards, install the battery, and then power on the phone.
2. On the dialing screen, enter *#*#2846579#*#*to enter MMI test mode. Press the volume
down key to start the test. Select MMITest_II in the following displayed screen.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 114

No. Item Description Instructions

After the phone enters the MMI test, the

background program automatically searches
for the phone's manufacture information,
including the CT, and BT status. If any of
Board the stations' status is F (fail), Test Failed is
manufacturing displayed on the phone screen. Write the
1
information Error Code in a defective product
test identification card and place the phone in
the area where defective products are stored.
If the status of all these stations is P (pass),
the phone automatically starts the next text
item.

The phone automatically checks for the

microSD card. If no microSD card is
detected, an error message will be
displayed. Write the Error Code in a
defective product identification card and
MicroSD and
2 place the phone in the area where defective
SIM card test
products are stored. The phone
automatically checks whether the SIM card
is functional. If the SIM card is functional,
the phone automatically proceeds to the next
test
The phone automatically checks whether the
battery is functional. If the test fails, Test
Fail is displayed on the phone screen. Write
3 Battery test
the Error Code in a defective product label
and place the phone in the faulty-product
zone.

The LCD screen displays the layout of

phone keys, includes the side keys and main
keys. After a key is touched or pressed, the
phone will receive the corresponding signal,
4 Key test
triggering the corresponding key icon to
turn blue. In addition, check the key
resilience. After the test is passed, the next
test item automatically proceeds.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 115

No. Item Description Instructions

Test the following items in sequence. If any
test item fails, mark the phone as defective
and place it separately. For defective
product inspection criteria, refer to the
G740-L00 Phone General Inspection Guide.
Dark dot test: Display the white screen and
test whether the LCD screen has defects
such as dark dots.
Bright dot test: Display a black screen and
check whether the LCD screen has bright
dots or light leakage.
5 LCD test
Display red, green, and blue strips and
check whether:
a. The color and brightness of the LCD are
even.
b. There are no light issues, such as dark
dots, bright dots, color dots, shadows, and
black blocks. c. Boundaries between the
color strips are clear without issues of
cross-color, white dots, dark dots,
insufficient light, or color difference. If the
phone passes the test, press the volume
down key to proceed with the next test item.

The LCD backlight turns brighter every

0.5s. The software performs circular tests
LCD
with three brightness levels. Check whether
backlight and
6 the brightness changes gradually one level
tri-color LED
after another. If yes, the test is passed; then,
test
press the volume down key to proceed with
the next test item.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 116

No. Item Description Instructions

Slide your finger along the screen edges in a

circle. The route that your finger passes
should turn red. After three to five touches
Touchscreen
7 at a same point on the screen, if the
test
touchscreen does not respond or some
panes’ colors do not change, mark it as
defective and place it separately.

Check whether the tri-color indicator next to

the receiver blinks at an interval of 0.5
Tri-color
8 seconds in red, green, and blue. If yes, this
indicator test
test item passes. Press the volume down key
to proceed to the next test item.

The phone's LED lights should turn on and

off in cycle. Check that the LED lights of
the return, home, and menu keys switch on
and off simultaneously in circles and there
9 TP LED test are no issues of uneven brightness, light
leakage, or defective lights (fail to be lit up).
If the phone passes the test, press the
volume down key to proceed with the next
test item.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 117

No. Item Description Instructions

Rear camera focus test: Touch the screen to
focus the camera on an object 10 cm away,
if the camera focuses from far to near, and
the viewfinder becomes clear from blurred,
the focus function is normal.
Rear camera test: Enter the camera preview,
check the preview color board in whether
the color display is normal and whether the
camera produces pictures with ripple effect,
painting effect, and color difference. Check
that the preview is shown on the screen.
10 Camera test
After the test is passed, press the volume
down key to proceed with the next test item.
Front camera test: Enter the camera
preview, check the preview color board in
whether the color display is normal and
whether the camera produces pictures with
ripple effect, painting effect, and color
difference. Check that the preview is shown
on the screen. After the test is passed, press
the volume down key to proceed with the
next test item.

Touch the red Flashlight test on the screen.

After Flashlight test turns green, the flash
11 Flashlight test turns on. If the test is passed, press the
volume down key to proceed with the next
test item.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 118

No. Item Description Instructions

Note that the test can only be made under

the same light strength. Changing the light
strength during the test is not allowed. Move
a figure 2 to 5 cm close to the approaching
Proximity sensor area of the mobile phone. If the
12
sensor test mobile phone displays the answering screen,
the approach test is passed, and then move
away the figure; if not, the test failed. After
the test is passed, the next test item
automatically proceeds.

Turn around the phone once or twice for the

phone to adapt to light changes. The phone
software automatically judges the light
changes and determines whether the test is
passed. If the test item passes, the phone
Environmenta
13 automatically proceeds to the next test item.
l light test
If the phone fails to detect the light changes
after you tried changing the light
environment for the phone several times,
press the power key to confirm the light
sensor failure.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 119

No. Item Description Instructions

Check that the motor vibrates properly and

whether noises are emitted. Then press the
volume down key to proceed to the next test
14 Motor test
item. If there is no vibration or bad/weak
vibration (with noise), mark the product as a
defective product.

Check whether the speaker has zero sound,

low sound, noise, and broken sound. If not,
the test is passed. Then, press the Volume
15 Speaker test
Down key. Note: Place the phone 30 cm
away from your ears and do not block the
speaker.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 120

No. Item Description Instructions

An audio clip will be played. Listen to it and

determine whether the receiver functions
properly. If the following occurs: zero
16 Receiver test
sound, low sound, noise, and broken sound,
mark the phone as defective and place it
separately.

Touch Record to start recording. Speak to

the main microphone, and touch Play.
Check whether what you hear from the
speaker is consistent with what you said. If
the headset is silent or barely audible, plays
echoes, or howls, mark the phone as
Main
defective and place it separately. Say
17 microphone
something to the phone with normal voice
loopback test
and ensure that no howl exists, the volume
is stable and the sound is clear and not
strident. If the test is passed, press the
volume Down key to proceed with the next
test item. Otherwise, touch the power key to
confirm the test failure.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 121

No. Item Description Instructions

Secondary microphone loopback test: Touch

Record to start recording. Speak to the
secondary microphone, and touch Play.
Check whether what you hear from the
speaker is consistent with what you said. If
the headset is silent or barely audible, plays
Secondary echoes, or howls, mark the phone as
18 microphone defective and place it separately. Say
loopback test something to the phone with normal voice
and ensure that no howl exists, the volume
is stable and the sound is clear and not
strident. If the test is passed, press the
volume Down key to proceed with the next
test item. Otherwise, touch the power key to
confirm the test failure.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 122

No. Item Description Instructions

Touch Next Channel to search for

channels. Check whether the phone can find
at least two channels. If two or more
channels are found and no noise exists, this
19 FM test test item passes. Do not pull out the headset
(for the headset wire control test), and press
the volume down key to proceed to the next
test item. Otherwise, touch the power key to
confirm the test failure.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 123

No. Item Description Instructions

The headset was inserted into the phone

when you made auxiliary microphone
loopback test. The In icon is green. Connect
the headset, the in icon turns green.
Headset wire
20 Disconnect the headset, and the out icon
control test
turns green. If all tested icons turn green, the
test is passed. Then, the next test item
automatically proceeds. Otherwise, touch
the power key to confirm the test failure.

After the test is initiated, the background

automatically enables the bluetooth. If one
or more bluetooth addresses are found, this
test is passed. If a message is displayed
21 Bluetooth test notifying of a search failure and asking
whether to perform a second search, select
OK and perform a second search. If the
second search fails, touch the power key to
confirm the test failure.

Fix the phone onto the dedicated test fixture

and retain it for more than 1s. If this test is
passed, the next test item then automatically
22 Tilt sensor test
proceeds. If the phone does not respond,
touch the power key to confirm the test
failure.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 124

No. Item Description Instructions

After the Wi-Fi test is initiated, the phone

automatically starts searching for SSID lists.
It passes the test after finding one or more
sample SSID lists. If a message is displayed
23 Wi-Fi test notifying of a search failure and asking
whether to perform a second search, select
OK and perform a second search. If the
second search fails, touch the power key to
confirm the test failure.

After the MMI test is complete, a message

will be displayed asking you whether to
Factory restore the factory default settings. Select
24 defaults Cancel. Then, the screen displays PASS.
restoration After the phone passes the test, press the
HOME key twice to exit, and pass the
phone to the next station.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 125

No. Item Description Instructions

If any items failed the tests, the failed test

items will be displayed. Fill a defective
25 Display test product identification card and place the
defect product in the area where defective
products are stored.

10.2 Wi-Fi Test

1. To ensure a normal network, place the phone within 15 meters away from the AP, and
there must be no obstacle between the phone and AP.
2. Configure the AP properly. Power on the phone and place it within the AP's transmission
range.
3. Touch Settings > WIRELESS&SETTINGS > WLAN > turn WLAN on, and enable
network notifications.
4. After the phone automatically finds the AP's SSID, touch the SSID and enter the
password to establish a connection.
5. Change the distance between the phone and AP and check the change of the Wi-Fi signal
strength.
6. In the normal network, launch a browser and access a website to test the network quality.
7. If no problems are found, finish the Wi-Fi test. If any problems are found, troubleshoot
the phone or send it to an advanced service site for repair.

10.3 Voice Call Test

1. Install a USIM card and battery on the phone.
2. Press and hold the power key to power on the phone.
3. Place a call to a fixed-line number and check the voice quality during the call.
4. If no problems are found, end the test. If any problems are found, troubleshoot the phone
or send it to an advanced service center for repair.

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 126

Appendix 1: Location numbers of the G740's PCBA

HU1Y340U081M.pdf

Issue 1.0 (2013-10-18) Huawei Proprietary and Confidential 127

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