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PRIME H310M-E R2.0 Repair Guide Jonas 2018/7/18: 1. Standard Appearance

service and repair guide

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3K views11 pages

PRIME H310M-E R2.0 Repair Guide Jonas 2018/7/18: 1. Standard Appearance

service and repair guide

Uploaded by

sandro123
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

PRIME H310M-E R2.

0 Repair Guide
Jonas
2018/7/18
1. STANDARD APPEARANCE
2. BLOCK DIAGRAM
3. POWER FLOW
4. POWER ON SEQUENCE
5. Timing Diagram for G3 to S5
Timing Diagram for S5 to S0/M0
6. Frequency Flow
7. Socket reflow profile
8. Lead-Free Rework Thermo profile Graphic for BGA & Chipset

Except for body temp, all temperatures are measured with thermo couples inside solder
joints, for better accuracy
Primary Factors for Successful Rework:
•Flux formulation and solder paste formulation and volume
•A capable thermal reflow profile
•Proper PCB pad solder preparation/wicking (clean-up of the residual solder
from the PCB pads)
Caution: Always remove batteries and thermal solutions following the system
design disassembly process steps prior to BGA rework to avoid damaging the BGA.
View this Intel®BGA / Socket Rework Video (10 minutes in length):
http://link.brightcove.com/services/player/bcpid1409165005001?bckey=AQ~~,AAA
AqwZd9wk~,X1Exj3sUi-03b71FGkEmVWbi4T4yGcor&bctid=1519232885001
9. MB Baking Time: 120〬C, 8 hours
BGA Baking Time:

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