Parallel ATA Interface

Reference Design Guide

Parallel ATA Interface

Reference Design
Guide

Specifications subject to change without notice, contact your sales representatives for the most update information.
REV 0.1 Page 1 of 13 Feb. 7, 2012
 Parallel ATA Interface
Reference Design Guide

CONTENTS
1. Scope.................................................................................................. 4 
2. Parallel Interface Physical and Electrical Requirements............... 5 
2.1  Electrical characteristics .............................................................................................. 5 
2.2  Cable configuration....................................................................................................... 7 
3. Schematic Guidelines ....................................................................... 8 
3.1  IDE Port Schematic Guidelines .................................................................................... 8 
3.1.1  IDE 40-Pin Header and Schematic .................................................................................................... 9 
3.1.2  IDE 44-Pin Header and Schematic .................................................................................................... 9 
3.1.3  IDE Port Implementation Notes ....................................................................................................... 10 
3.2  CompactFlash (CF) Socket on IDE Port Schematic Guidelines .............................. 11 
3.2.1  CompactFlash (CF) Socket and Schematic ................................................................................... 11 
3.2.2  CompactFlash (CF) Socket on IDE Port Implementation Notes .................................................. 11 
3.3  UDMA Support ............................................................................................................. 12 
4. Layout Guidelines ........................................................................... 13 
 Parallel ATA Interface
Reference Design Guide

Revision History

Rev. Date History

0.1 2012/2/7 1. 1st release

Advantech reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or
design. Information furnished by Advantech is believed to be accurate and reliable. However, Advantech does not assure any liability
arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither
does it convey any license under its patent rights nor the rights of others.
Copyright © 1983-2012 Advantech Co., Ltd. All rights reserved.
 Parallel ATA Interface
Reference Design Guide

1. Scope

This document is intended as a guide for designing a custom system mainboard for
Parallel ATA (PATA) interface. This guide includes reference schematics for the external circuitry
required to implement the Parallel ATA (PATA) peripheral functions, as well as related
comments and application notes. The circuits presented in this guide are typical application
circuits. They may not be suitable for all applications. In particular, additional components may
need to be added to these circuits in order to meet specific inquiry.

This reference design guide specifies the optional operating features of a parallel and
serial bus transport described. It provides a common attachment interface for the physical and
electrical requirements, schematic guidelines and layout guidelines.
 Parallel ATA Interface
Reference Design Guide

2. Parallel Interface Physical and Electrical Requirements

2.1 Electrical characteristics

Table 1 defines the DC characteristics of the interface signals. Table 2 defines the AC
characteristics. These characteristics apply to both host and device unless otherwise specified.

Description Min Max

IoL Driver sink current (See note 1) 4 mA
IoLDASP Driver sink current for DASP (See note 1) 12 mA
IoH Driver source current (See note 2) 400 μA
IoHDMARQ Driver source current for DMARQ (See note 2) 500 μA
Device pull-up current on DD(15:8), DD(6:0), and STROBE
IZ -100 μA 200 μA
when released
IZDD7 Device pull-up current on DD7 when released -100 μA 10 μA
ViH Voltage input high 2.0 VDC 5.5 VDC
ViL Voltage input low 0.8 VDC
VoH Voltage output high at IoH min (See note 3) 2.4 VDC
VoL Voltage output low at IoL min (See note 3) 0.5 VDC
Additional DC characteristics for Ultra DMA modes greater than 4
VDD3 DC supply voltage to drivers and receivers 3.3 V - 8% 3.3 V + 8%
V+ Low to high input threshold 1.5 V 2.0 V
V− High to low input threshold 1.0 V 1.5 V
Difference between input thresholds:
VHYS 320 mV
((V+current value) − (V−current value))
VTHRAVG Average of thresholds: ((V+current value) + (V−current value))/2 1.3 V 1.7 V
Voltage output high at -6 mA to +3 mA (at VoH2 the output shall VDD3 - VDD3 + 0.3
VoH2
be able to supply and sink current to VDD3) (See note 3) 0.51 VDC VDC
VoL2 Voltage output low at 6 mA (See note 3) 0.51 VDC
NOTES −
1. IoLDASP shall be 12 mA minimum to meet legacy timing and signal integrity.
2. IoH value at 400 μA is insufficient in the case of DMARQ that is pulled low by a 5.6 kΩ resistor.
3. Voltage output high and low values shall be met at the source connector to include the effect of series
termination.
4. A device shall have less than 64 μA of leakage current into a 6.2 KΩ pull-down resistor while the INTRQ
signal is in the released state.
Table 1. DC Characteristics
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Reference Design Guide

Description Min Max

SRISE Rising edge slew rate for any signal (See note 1) 1.25 V/ns
SFALL Falling edge slew rate for any signal (See note 1) 1.25 V/ns
Chost Host interface signal capacitance at the host connector (See note 2) 25 pf
Device interface signal capacitance at the device connector (See
Cdevice 20 pf
note 2)
Additional AC characteristics for Ultra DMA modes greater than mode 4
SRISE2 Rising edge slew rate for DD(15:0) and STROBE (See note 1) 0.40 V/ns 1.0 V/ns
SFALL2 Falling edge slew rate for DD(15:0) and STROBE (See note 1) 0.40 V/ns 1.0 V/ns
Induced signal to conductor side of device connector for any
VDD3 - 500
VDSSOH non-switching data signal at VoH due to simultaneous switching of all
mV
other data lines high and low by the device (See note 3)
VDSSOL Same as VDSSOH except non-switching data signal at VoL (See note 3) 500 mV
Induced signal to conductor side of host connector for any
VDD3 - 600
VHSSOH non-switching data signal at VoH due to simultaneous switching of all
mV
other data lines high and low by the host (See note 3)
VHSSOL Same as VHSSOH except non-switching data signal at VoL (See note 3) 600 mV
VRING AC voltage at recipient connector (See note 4) -1.0 V 6.0 V
Cdevice2 Device capacitance measured at the connector pin (See note 2) 17 pf
Ratio of the highest DD(15:0) or STROBE signal capacitance as
Cratio measured at the connector to the lowest DD(15:0) or STROBE signal 1.5
capacitance.
The highest voltage reached on a rising transition at the recipient
VihPEAK 2.2 V
connector within 3 ns of crossing 1.5 V (See note 5)
The lowest voltage on a high signal at the recipient connector at any
VihRING time after the rising edge crosses VihPEAK until activity driven low by 1.7 V
a subsequent falling transition (See note 5)
The lowest voltage reached on a falling transition at the recipient
VilPEAK 0.8 V
connector within 3 ns of crossing 1.5 V (See note 5)
The highest voltage on a low signal at the recipient connector at any
VilRING time after the falling edge crosses VilPEAK until activity driven high by a 1.3 V
subsequent rising transition (See note 5)
NOTES -
1. Signal integrity may be improved by using slower slew rates at slower transfer rates.
2. Capacitance measured at 1 MHz.
3. Please refer to “Information Technology - AT Attachment – 8 ATA/ATAPI Parallel Transport (ATA8-APT)” 4.2.1.2
for measurement details.
4. The sender shall not generate voltage peaks higher then these absolute limits on DD (15:0) with all data lines
switching simultaneously and a single recipient at end of cable. The test load shall be an 18" long, 40-conductor
cable in Ultra DMA mode 2, as well as, an 18", long 80-conductor cable operated in the highest Ultra DMA mode
supported.
5. VihPEAK, VihRING, VilPEAK, and VilRING shall be met in a functioning system across all patterns and shall be met
when measured at any connector.
Table 2. DC Characteristics
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Reference Design Guide

2.2 Cable configuration

The following table defines the host transceiver configurations for a dual cable system
configuration for all transfer modes.

Transfer Optional host Recommended host Mandatory host transceiver

mode transceiver configuration transceiver configuration configuration
DIOR-, DIOW-, and IORDY Either DIOR-, DIOW-, and IORDY
All PIO and One transceiver may be used
should have a separate or CS0- and CS1- shall have a
Multiword DMA for signals to both ports.
transceiver for each port. separate transceiver for each port.
Either DIOR-, DIOW-, and IORDY
One transceiver may be used DIOR-, DIOW-, and IORDY or CS0- and CS1- shall have a
Ultra DMA
for signals to both ports should have a separate separate transceiver for each port.
0, 1, 2
except DMACK-. transceiver for each port. DMACK- shall have a separate
transceiver for each port.
One transceiver may be used RESET-, INTRQ, DA(2:0), All signals shall have a separate
Ultra DMA for signals to both ports for CS0-, CS1-, and DASP- transceiver for each port except for
modes > 2 RESET-, INTRQ, DA(2:0), should have a separate RESET-, INTRQ, DA(2:0), CS0-,
CS0-, CS1-, and DASP-. transceiver for each port. CS1-, and DASP-.

The following table defines the system configuration for connection between devices and
systems for all transfer modes. For Ultra DMA modes requiring an 80-conductor cable, that
cable should meet requirements for 80-conductor cables.

Single device direct

Transfer 40-conductor cable 80-conductor cable
connection configuration
mode connection configuration connection configuration
(See note 1)
All PIO and
May be used. May be used. May be used (See note 2)
Multiword DMA
Ultra DMA
May be used. May be used. May be used (See note 2)
0, 1, 2
Ultra DMA
May be used (See note 3). Shall not be used. May be used (See note 3).
modes > 2
NOTES -
1. Direct connection is a direct point-to-point connection between the host connector and the device connector.
2. 80-conductor cable assemblies may be used in place of 40-conductor cable assemblies to improve signal quality
for data transfer modes that do not require an 80-conductor cable assembly.
3. Either a single device direct connection configuration or an 80-conductor cable connection configuration shall be
used for systems operating with Ultra DMA modes greater than 2.
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Reference Design Guide

3. Schematic Guidelines

3.1 IDE Port Schematic Guidelines

The IDE port can support two storage disks or other ATAPI devices. These two storage disks on
the port are wired in parallel, which is accomplished by plugging both drives into a single flat
ribbon cable equipped with two socket connectors. A jumper can be manually set on each IDE
storage disk for selecting master or slave mode.

If two storage disks are used in the master/slave mode, the IDE_CBLID# of both storage disks
must be connected together as in Figure 1. These pairs of pins negotiate between the master
and slave storage disks. The storage disks may not function correctly unless these pins are
interconnected. If two storage disks are plugged into one standard IDE cable, the cable will
interconnect the pins properly by itself.

Host
connector Device 0 Device 1
Host PCB connector connector
PDIAG-:CBLID-
conductor

Device 0 Device 1
PCB PCB

Figure 1. IDE Master/Slave Handshake Signals Connection

The DASP-S# (pin 39 on IDE connector or pin 45 on CF connector) should be also connected
between master and slave storage disks.

A diagram illustrating connections from the Module connector to a 0.1-inch pitch, two-row,
40-pin header suitable for use with standard parallel ATA drives is shown in Figure 2. No
pull-ups or other termination are required.

An industry standard 80-pin, 0.25-inch pitch cable is used for Ultra-DMA 66 and 100 drives. The
cable assemblies have sockets with 40 positions. The extra 40 conductors on the 80-conductor
cable are tied to GND to isolate the adjacent signals for improved signal integrity.
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Reference Design Guide

3.1.1 IDE 40-Pin Header and Schematic

Power to the parallel ATA drive is handled on a separate 4-pin connector and is not shown here.
The 40-pin IDE header is used with a 40-pin, 0.5-inch pitch, and flat cable for slower drives.

Figure 2. IDE 40-Pin Connector Schematic

3.1.2 IDE 44-Pin Header and Schematic

Figure 3 shows a 44-pin, 2mm-pitch header used for 2.5”-IDE drives. The cabling used is a
44-pin, 1mm-pitch, flat-ribbon cable. Power to the drive is supplied over the 44-pin cable on
Conductors 41 and 42. The drive-activity LED shown is driven by signal pin, ATA_ACT#.

Figure 3. IDE 44-Pin Connector Schematic

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Reference Design Guide

3.1.3 IDE Port Implementation Notes

y The IDE port connector shown is a standard 40-pin IDC flat-cable header, which is used
with 3.5 inch IDE storage disk. These storage disks require a separate power cable to
provide them with 5 and 12V operating power.

y The IDE port connector shown is a 44-pin, 2mm header of the type used with 2.5 inch IDE
storage disk. The pinout is the same as for the standard connector, with the addition of pins
41, 42, 43 and 44 which provide 5V power to the drive. It does not require a separate
power cable.

y Each IDE port can support two storage disks. The two storage disks on each port are wired
in parallel, which is accomplished by plugging both drives into a single flat ribbon cable
equipped with two socket connectors. A jumper is typically manually set on each storage
disks to set it for “master” or “slave” operation.

y If two storage disks are used in the master/slave mode on the same IDE port, the DASP#
pins of both storage disks must be connected together. Also, the PDIAG# pins of both
storage disks must be connected together. These pairs of pins negotiate between the
master and slave storage disks. The storage disk may not function correctly unless these
pins are interconnected. If two storage disks are plugged into a single IDE cable, the cable
will interconnect the pins properly. If the two storage disks on one port are integrated on the
baseboard or plugged into separate connectors, care should be taken to tie the
corresponding pins together. On a standard IDE connector, PDIAG# is Pin 34 and DASP#
is Pin 39.

y The DASP# and PDIAG# pins from the primary and secondary IDE ports should NOT be
tied together. They should only be connected between the devices that share a single port.
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Reference Design Guide

3.2 CompactFlash (CF) Socket on IDE Port Schematic Guidelines

3.2.1 CompactFlash (CF) Socket and Schematic

For the IDE application, the CompactFlash (CF) card cannot be hot-plugged. If hot-plug support
is necessary, the PCI-based Card-Bus controller chip can be integrated onto the platform and
used to control the CF hot-plug function. Figure 4 shows the CF schematics.

Figure 4. CompactFlash (CF) Socket Schematic

3.2.2 CompactFlash (CF) Socket on IDE Port Implementation Notes

y The CF card can be configured as a slave device by changing the voltage level of the
CSEL signal.

y The CF card can be configured as a slave device when the CSEL signal is set as
non-connection. If two CF cards (or one CF card and one hard drive) are used in the
master/slave mode on the same IDE port, the IDE_CBLID# and DASP-S#0 pins on both
devices must be connected. The signal negotiates the communication between the master
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Reference Design Guide

and slave devices.

3.3 UDMA Support

SQFlash storage devices support UDMA ATA 33/ 66/ 100 data transfer modes. If an advanced
IDE data transfer mode such as UDMA 66/ 100 is required, the 80-pin type IDE connector and
cable are needed for signal integrity.

To provide better signal integrity, the optional 80-conductor cable assembly is specified for use
with 40-pin connectors. Use of this assembly is mandatory for systems operating at Ultra DMA
modes greater than 2.

A1
A2 A3

Device 0
Device 1
Host

Host Connector Polarity stripe on Device 1 Device 0

#1 conductor Connector Connector

Figure 5. 80-conductor cable configuration

Dimension Millimeters Inches

A1 457.20 max 18.00 max
A2 127.00 min 5.00 min
A3 152.40 max 6.00 max
A2 min shall be greater than or equal to A3.
Table 3. 80-conductor cable configuration
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Reference Design Guide

4. Layout Guidelines

The IDE interface can be routed with 6-mil traces on 6-mil spaces (dependent upon stack-up
parameters), and must be less than 7 inches in length (from ICH to platform IDE connector).

The maximum length difference between the data signals and the strobe signal (IDE_IOR# and
IDE_IOW#) should be less than 100 mils. Refer to Advantech’s layout checklist for the details of
each platform. Use Daisy Chain not Y type routing if both IDE and CF connectors are needed.