One-Dimensional,
Steady-State Conduction
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Applied Heat Transfer Research Group
Departemen Teknik Mesin
Fakultas Teknik – Universitas Indonesia
Objectives
• Understand the concept of thermal resistance and its limitations, and develop
thermal resistance networks for practical heat conduction problems
• Solve steady conduction problems that involve multilayer rectangular, cylindrical, or
spherical geometries
• Develop an intuitive understanding of thermal contact resistance, and circumstances
under which it may be significant
• Identify applications in which insulation may actually increase heat transfer
• Analyze finned surfaces, and assess how efficiently and effectively fins enhance
heat transfer
• Solve multidimensional practical heat conduction problems using conduction shape
factors
The Plane Wall
◉ For one-dimensional conduction in a plane
wall, temperature is a function of the x-
coordinate only and heat is transferred
exclusively in this direction.
◉ The temperature distribution equation :
◉ The conduction heat transfer rate use
Fourier’s law :
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Thermal Resistance
◉ Conduction
Conduction resistance of the wall: Thermal
resistance of the wall against heat conduction.
Thermal resistance of a medium depends on the
geometry and the thermal properties of the
medium.
◉ Ohm’s law provides an electrical resistance
of the form
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◉ Convection
When the convection heat transfer coefficient is very
large (h → ∞), the convection resistance becomes
zero and Ts ≈ T.
That is, the surface offers no resistance to
convection, and thus it does not slow down the heat
transfer process.
This situation is approached in practice at surfaces
where boiling and condensation occur.
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◉ Radiation
Radiation heat transfer coefficient
Combined heat transfer
coefficient
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The Composite Wall
◉ T∞1-T∞4 is the overall temperature difference
◉ With composite systems, it is often convenient to
work with an overall heat transfer coefficient U,
which is defined by an expression analogous to
Newton’s law of cooling
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◉ Equivalent thermal circuits for a series–
parallel composite wall.
a) it is presumed that surfaces normal to the
x-direction are isothermal, whereas for
case
b) it is assumed that surfaces parallel to the
x-direction are adiabatic
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Contact Resistance
Temperature distribution and heat flow lines along two solid
plates pressed against each other for the case of perfect and
imperfect contact.
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A typical experimental setup for the
determination of thermal contact resistance
◉ When two such surfaces are pressed against each
other, the peaks form good material contact but the
valleys form voids filled with air.
◉ These numerous air gaps of varying sizes act as
insulation because of the low thermal conductivity
of air.
◉ Thus, an interface offers some resistance to heat
transfer, and this resistance per unit interface area
is called the thermal contact resistance, Rc.
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The thermal contact resistance can be minimized by
applying
• a thermal grease such as silicon oil
• a better conducting gas such as helium or hydrogen
• a soft metallic foil such as tin, silver, copper, nickel, or Effect of metallic coatings on thermal contact
aluminum conductance
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The thermal contact
conductance is highest (and thus
the contact resistance is lowest)
for soft metals with smooth
surfaces at high pressure.
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Porous
Media
◉ Heat transfer occurs within porous media that are combinations of a stationary solid and
a fluid. When the fluid is either a gas or a liquid, the resulting porous medium is said to
be saturated. In contrast, all three phases coexist in an unsaturated porous medium.
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◉ The heat rate for saturated porous medium after stady state condition T1>T2
where keff is an effective thermal conductivity
◉ The effective thermal conductivity varies with the porosity or void fraction of the
medium which is defined as the volume of fluid relative to the total volume (solid and
fluid). The value of the effective thermal conductivity may be bracketed by considering
the composite walls. Series composite wall consisting of a fluid region of length εL and
a solid region of length (1 – ε)L for which there is no convection (h1=h2=0) and only
two conduction terms
◉ Result equation for effective thermal conductivity
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Heat Conduction in Cylinder
◉ Temperature distribution
◉ Heat transfer rate
◉ Thermal resistance
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Heat Conduction in Sphere
◉ Heat transfer rate
◉ Thermal resistance
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Multilayered
Cylinders and Spheres
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Conduction with Thermal Energy Generation
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Thermal Energy Generation at
Plane Wall
◉ Heat equation :
where C1 and C2 are the constants of integration
◉ The maximum temperature exists at the midplane
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Thermal Energy Generation at
Radial System
For steady-state conditions, the rate at which heat is
generated within the cylinder must equal the rate at
which heat is convected from the surface of the
cylinder to a moving fluid.
◉ Temperature distribution
◉ Surface energy balance
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Heat Transfer from Extended
Surfaces
a) Straight fin of uniform cross section. (b) Straight
(a) Bare surface. (b) Finned fin of
surface. nonuniform cross section. (c) Annular fin. (d) Pin fin.
Finned-tube heat
exchangers.
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Energy balance for an
extended surface
◉ Conduction heat transfer rate
◉ Convection heat transfer rate
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Fins of Uniform Cross-Sectional Area
Conduction and convection in a fin of
uniform cross section.
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Fin Performance
Efficiency of straight
fins (rectangular,
triangular, and parabolic
profiles).
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Fin Performance
Efficiency of annular
fins of rectangular
profile.
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Efficiency of common fin shapes
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Efficiency of
common fin
shapes
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• Heat sinks: Specially designed
finned surfaces which are commonly
used in the cooling of electronic
equipment, and involve one-of-a-kind
complex geometries.
• The heat transfer performance of
heat sinks is usually expressed in
terms of their thermal resistances R.
• A small value of thermal resistance
indicates a small temperature drop
across the heat sink, and thus a high
fin efficiency.
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Thermoelectric Power
Generation
◉ Asumsing the thermal resistances of the thin
ceramic layers are negligible, q1, q2, and the
total module electric power, PN,
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◉ Conduction Through Thin Gas Layers
Micro- and Nanoscale Conduction
◉ Conduction Through Thin Solid Films
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TERIMA KASIH
