Historical Introduction To Capacitor Technology: F E A T U R E A R T I C L E
Historical Introduction To Capacitor Technology: F E A T U R E A R T I C L E
dizing/vaporizing the dielectric and aluminum electrode, ceramic strength. Promising developments have been reported based on
dielectrics tend to crack during breakdown, rendering the entire copolymers of PVDF that are ferroelectric relaxors. Of polymer
device useless. In addition, the internal electrode, typically 0.5 films, only PET is well suited to low-voltage capacitors because
to 1 µm in thickness, cannot be vaporized readily to isolate the it can be made to less than 0.5 µm in thickness. Polypropyl-
breakdown region electrically. The catastrophic failure mode of ene, which along with PET dominates film capacitors, cannot be
ceramic capacitors is an obstacle to their acceptance for critical made thinner than about 3 µm, which, given its breakdown field
applications in which a disruption of operation is not acceptable in the range of 700 V/µm, means it is not well matched to low-
or in which the energy stored is so large as to render the capaci- voltage applications. The other major advantage of metalized
tor dangerous upon shorting. Efforts have been made to address polymer film capacitors is graceful failure that results from self-
this issue, such as integrating fuses at MLCC terminations and clearing. This allows operation at increased field because break-
parylene coating on monolithic ceramic capacitors, but success down of the polymer film results in only a minute reduction in
has been very limited. capacitance rather than catastrophic failure of the capacitor as is
The abundance of ceramic compounds and the diverse prop- the case with foil-based or ceramic-based designs. Self-clearing
erties thereof has resulted in a wide range of materials suited comes at the cost of a number of complications, including a wire
to specific applications, a good example of which is the recent arc metal spray end connection that has limited current-carrying
development of a class of antiferroelectric ceramics with a field- capability, the improvement of which is an area of active inves-
dependent phase transition to ferroelectric, as a result of which tigation.
they achieve an energy density greater than 10 J/cc. Some such For very high-voltage applications, metalized film capacitors
materials have a meta-stable antiferroelectric to ferroelectric can be made with multiple sections in series across the film. This
transition that results in a large dielectric constant under DC facilitates fairly compact, high-voltage capacitors; however, a
bias, which makes them an excellent candidate for DC link ca- great deal of volume is wasted as a result of the margins required
pacitors. Recently, glass-based dielectrics have become a popu- between the sections so that high energy density in such designs
lar candidate for high breakdown strength materials. Porosity- is unlikely. For fast pulse discharge applications, the end con-
free ferroelectric glass-ceramics in which ferroelectric particles nections of such designs often limit the peak current output.
are precipitated from an engineered glass have achieved a break- Foil-film designs dominate capacitors used for reactive com-
down strength near 100 V/µm, an order of magnitude greater pensation in utility power systems, although designs based on
than conventional ceramics. As a result of their inorganic nature, metalized film capacitors are available. Foil-film capacitors can
ceramic capacitors can be formulated to operate at much higher achieve very high power density, i.e., very large current discharge
temperatures than organic polymer-based dielectrics, which is over very short times, because they can be designed with low
important for applications such as filter capacitors in power elec- equivalent series inductance, very low equivalent series resis-
tronics based on wide band gap semiconductors. tance (ESR), and unlimited end-connection current density. The
Polymer films can have Weibull characteristic breakdown energy density is limited by the need for conservative operating
fields >700 V/µm for test areas of a few square centimeters fields because the system is not self-clearing. Foil-film technol-
with a Weibull slope parameter in the range of 15, which is ogy can be used to make extremely compact, high-voltage ca-
very good. However, they have low dielectric constants, in the pacitors through the use of multiple sections in series within the
range of 2.2 for near-perfect dielectrics such as polypropylene winding. Unlike the case of metalized film capacitors, this can
and polystyrene and up to 12 for ferroelectric polymers such as be done with very little wasted volume because the margin be-
polyvinylidene fluoride (PVDF), which are far from perfect with tween sections runs across the film in the longitudinal direction
tan(δ) in the range of 1%. Thus, the emphasis in this technology (film width) rather than in the winding direction (film length) as
is greater dielectric constant and, if possible, greater dielectric for metalized film capacitors. In such a multiple-sections foil de-