Microelectronics
Introduction
2019/9/12
Jieh-Tsorng Wu
National Chiao-Tung University
Department of Electronics Engineering
Outline
1. Electronic and Electrical Engineering
2. Signal Processing and Electronic Circuits
3. Analog and Digital Circuits
4. Integrated Circuits
1. Introduction 2 Microelectronics; Jieh-Tsorng Wu
Electronic and Electrical Engineering
1. Introduction 3 Microelectronics; Jieh-Tsorng Wu
A Radio System
At the transmitter (TX), audio signal is converted to electro-magnetic (EM) wave.
At the receiver (RX), the EM signal is received and converted to audio signal.
1. Introduction 4 Microelectronics; Jieh-Tsorng Wu
A Radio Transmitter
1. Introduction 5 Microelectronics; Jieh-Tsorng Wu
An Electronic Radio Transmitter
1. Introduction 6 Microelectronics; Jieh-Tsorng Wu
A Radio Receiver
1. Introduction 7 Microelectronics; Jieh-Tsorng Wu
A Electronic Radio Receiver
1. Introduction 8 Microelectronics; Jieh-Tsorng Wu
An Image Sensor
1. Introduction 9 Microelectronics; Jieh-Tsorng Wu
Analog-Digital Systems
1. Introduction 10 Microelectronics; Jieh-Tsorng Wu
Analog-to-Digital Converter (ADC)
Do = b0 20 + b1 21 + b2 22 + + bN −1 2 N −1
An ADC samples its analog input and then quantizes (digitizes) the magnitude of the
sample into digital value.
1. Introduction 11 Microelectronics; Jieh-Tsorng Wu
CMOS Logic Gates
1. Introduction 12 Microelectronics; Jieh-Tsorng Wu
Analog or Digital?
A digital signal operating at very high frequency is very “analog”.
1. Introduction 13 Microelectronics; Jieh-Tsorng Wu
Integrated Circuits
1. Introduction 14 Microelectronics; Jieh-Tsorng Wu
CMOS Technology
1. Introduction 15 Microelectronics; Jieh-Tsorng Wu
Fabrication of Integrated Circuits on Silicon
Oxidation
Lithography &
Etching
Ion Implantation
Annealing &
Diffusion
1. Introduction 16 Microelectronics; Jieh-Tsorng Wu
Optical Lithography
1. Introduction 17 Microelectronics; Jieh-Tsorng Wu
Lithography for Integrated Circuits
(a) Resist Coating (c) Development
(SiO2)
(b) Exposure
(d) Etching and Resist Strip
Deep Ultraviolet Light
Optical Photomask with
Lens system opaque and
clear patterns
1. Introduction 18 Microelectronics; Jieh-Tsorng Wu
Interconnect – The Back-End Process
1. Introduction 19 Microelectronics; Jieh-Tsorng Wu
An IC Fabrication Example (1)
Ion
Wafer Implantation
Oxidation Annealing &
Diffusion
Al
Sputtering
Lithography
Lithography
Etching
1. Introduction 20 Microelectronics; Jieh-Tsorng Wu
An IC Fabrication Example (2)
Metal
Etching
CVD
Back-Side
Nitride
Metallization
Deposition
Lithography
and Etching
Back-Side
Milling
Dicing, wire bonding,
and packaging
1. Introduction 21 Microelectronics; Jieh-Tsorng Wu
MOSFET Scaling Rule by Robert Dennard
Parameter Symbol Scaling
Gate Length L 1/a
Gate Width W 1/a
Oxide Thickness tox 1/a
Gate Capacitance CG 1/a
Substrate Doping Na a2
Voltage VDD 1/a
Current I 1/a
Transit Frequency fT a
Power P 1/a2
Power-Delay P x ∆t 1/a3
1. Introduction 22 Microelectronics; Jieh-Tsorng Wu
Technology Scaling
1. Introduction 23 Microelectronics; Jieh-Tsorng Wu
Moore’s Law
The number of transistors on integrated circuits doubles
approximately every two years.
1. Introduction 24 Microelectronics; Jieh-Tsorng Wu
Microprocessors
Intel 4004. 1971. Intel 8080. 1974. Intel 8086-8088. 1978.
Intel 80386. 1985. Intel Pentium. 1993. Intel Pentium III. 1999.
1. Introduction 25 Microelectronics; Jieh-Tsorng Wu
Modern Application Processors
Apple A8, 2014. Apple A9, 2015.
20 nm CMOS. Area: 89 mm2. 16 nm FinFET. Area: 104.5 mm2.
1. Introduction 26 Microelectronics; Jieh-Tsorng Wu
Modern Application Processors
Apple A10 Fusion, 2016. Apple A11 Bionic, 2017.
16 nm FinFET. Area: 125 mm2. 10 nm FinFET. Area: 87.66 mm2.
3.3 billion transiistors. 4.3 billion transistors.
1. Introduction 27 Microelectronics; Jieh-Tsorng Wu
Radio Modem Chipset
LTE+GPS transceiver. Baseband and application processor.
28 nm CMOS.
1. Introduction 28 Microelectronics; Jieh-Tsorng Wu
Analog-Digital Mixed-Signal Chips
802.11a/b/g/n/ac WLAN SoC. 10 GBASE-T Analog Front-End
40 nm CMOS. Area: 46 mm2. 40 nm CMOS. Area: 15.5 mm2.
ISSCC 2014, S20.5. ISSCC 2014, S8.5.
1. Introduction 29 Microelectronics; Jieh-Tsorng Wu
Beyond Moore’s Law
SoC (System on a Chip) SiP (System in a Package) 3D IC
3D IC
3D SiP
1. Introduction 30 Microelectronics; Jieh-Tsorng Wu
Digital Cloud and Communication Network
1. Introduction 31 Microelectronics; Jieh-Tsorng Wu
Sensors and Integrated Circuits
Audio Video MEMS Biomed
1. Introduction 32 Microelectronics; Jieh-Tsorng Wu
