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8DG26342AAAATQZZA - V1 - 1850 Transport Service Switch (TSS-100 and TSS-100C) Release 4.1 (ETSI) Product Information and Planning Guide

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100% found this document useful (1 vote)

50 views600 pages

8DG26342AAAATQZZA - V1 - 1850 Transport Service Switch (TSS-100 and TSS-100C) Release 4.1 (ETSI) Product Information and Planning Guide

Uploaded by

Ahmed M. Gomaa

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Title page

Alcatel-Lucent 1850
Transport Service Switch (TSS-100 and TSS-100C) |
Release 4.1 (ETSI)
Product Information and Planning Guide

8DG26342AAAATQZZA
Issue 1
December 2011
Legal notice

Legal notice

Alcatel, Lucent, Alcatel-Lucent and the Alcatel-Lucent logo are trademarks of Alcatel-Lucent. All other trademarks are the property of their respective
owners.

The information presented is subject to change without notice. Alcatel-Lucent assumes no responsibility for inaccuracies contained herein.
Copyright © 2011 Alcatel-Lucent. All rights reserved.

Security statement

In rare instances, unauthorized individuals make connections to the telecommunications network through the use of remote access features. In such an event,
applicable tariffs require that the customer pay all network charges for traffic. Alcatel-Lucent cannot be responsible for such charges and will not make any
allowance or give any credit for charges that result from unauthorized access.

Limited warranty

Alcatel-Lucent provides a limited warranty for this product. For more information, consult your local Alcatel-Lucent customer support team.
Contents

About this document

Purpose ........................................................................................................................................................................................... xxi
xxi

Reason for reissue ...................................................................................................................................................................... xxi

xxi

Intended audience .................................................................................................................................................................... xxiii

xxiii

How to use this information product ................................................................................................................................ xxiii

Conventions used ..................................................................................................................................................................... xxiv

xxiv

Related information ................................................................................................................................................................ xxiv

xxiv

Technical support ...................................................................................................................................................................... xxv

xxv

How to order ............................................................................................................................................................................... xxv

xxv

How to comment ....................................................................................................................................................................... xxv

xxv

1 System overview

Overview ...................................................................................................................................................................................... 1-1

1-1

Overview of the Alcatel-Lucent 1850 Transport Service Switch portfolio ......................................................... 1-1
1-1

Introduction to the Alcatel-Lucent 1850 TSS-100 ........................................................................................................ 1-3

1-3

2 Features

Overview ...................................................................................................................................................................................... 2-1

2-1

Hardware features ..................................................................................................................................................................... 2-1

2-1

Networking capabilities .......................................................................................................................................................... 2-7

2-7

Cross-connection types ........................................................................................................................................................ 2-17

2-17

Management and operations features .............................................................................................................................. 2-22

2-22

Synchronization ...................................................................................................................................................................... 2-29

2-29

3 Topologies and configurations

Overview ...................................................................................................................................................................................... 3-1

3-1
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C iii
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Contents

DATA configurations ............................................................................................................................................................... 3-3

3-3

SDH/DATA network topologies .......................................................................................................................................... 3-4

3-4

4 Product description

Overview ...................................................................................................................................................................................... 4-1

4-1

Shelf descriptions ...................................................................................................................................................................... 4-2

4-2

Cards, modules, and miscellaneous components .......................................................................................................... 4-4

4-4

Units front view ...................................................................................................................................................................... 4-37

4-37

Transmission architecture .................................................................................................................................................... 4-44

4-44

Synchronization ...................................................................................................................................................................... 4-50

4-50

Synchronization from Ethernet interfaces/signals ...................................................................................................... 4-52

4-52

Control complex ..................................................................................................................................................................... 4-55

4-55

System management .............................................................................................................................................................. 4-56

4-56

Powering and grounding ...................................................................................................................................................... 4-60

4-60

5 Operations, administration, and maintenance

Overview ...................................................................................................................................................................................... 5-1

5-1

Operations

Overview ...................................................................................................................................................................................... 5-2

5-2

Software management ............................................................................................................................................................. 5-2

5-2

Database management ............................................................................................................................................................. 5-4

5-4

In-band/In-fiber management ............................................................................................................................................... 5-6

5-6

Administration

Overview ...................................................................................................................................................................................... 5-8

5-8

Security ......................................................................................................................................................................................... 5-8

5-8

Network management ........................................................................................................................................................... 5-13

5-13

Overview ................................................................................................................................................................................... 5-15

5-15

Loopbacks ................................................................................................................................................................................. 5-15

5-15

Data communication channel (DCC) .............................................................................................................................. 5-19

5-19

Diagnostics ............................................................................................................................................................................... 5-24

5-24

Protection switching .............................................................................................................................................................. 5-25

5-25

Link aggregation group (LAG) ......................................................................................................................................... 5-46

5-46

Performance monitoring ...................................................................................................................................................... 5-53

5-53

Housekeeping .......................................................................................................................................................................... 5-57

5-57

Alarms and reports ................................................................................................................................................................. 5-57

5-57

Ethernet Link OAM IEEE 802.3 Clause 57 ................................................................................................................. 5-59

5-59

Ethernet Service OAM IEEE 802.1ag ............................................................................................................................ 5-62

5-62

6 System planning and engineering

Overview ...................................................................................................................................................................................... 6-1

6-1

Engineering specifications ..................................................................................................................................................... 6-2

6-2

Required and optional equipment and slot allocation ................................................................................................. 6-2

6-2

SFP and XFP modules ............................................................................................................................................................. 6-7

6-7

Allowable cross-connections ............................................................................................................................................. 6-10

6-10

Shelf configuration examples ............................................................................................................................................ 6-17

6-17

Installation cabling ................................................................................................................................................................. 6-22

6-22

IS-IS Level 2 routing guidelines ....................................................................................................................................... 6-23

6-23

Network engineering rules and guidelines .................................................................................................................... 6-25

6-25

7 Ordering

Overview ...................................................................................................................................................................................... 7-1

7-1

Introduction ................................................................................................................................................................................. 7-1

7-1

Overview ...................................................................................................................................................................................... 8-1

8-1

Services ......................................................................................................................................................................................... 8-1

8-1

Training ........................................................................................................................................................................................ 8-2

8-2

9 Quality and reliability

Overview ...................................................................................................................................................................................... 9-1

9-1

Alcatel-Lucent quality policy ............................................................................................................................................... 9-1

9-1

Reliability program and specifications ............................................................................................................................. 9-2

9-2

Failure rates ................................................................................................................................................................................. 9-3

9-3

Conformance statements ........................................................................................................................................................ 9-6

9-6

Quality certifications ............................................................................................................................................................... 9-7

9-7

Warranty ....................................................................................................................................................................................... 9-7

9-7

Eco-environmental statements ............................................................................................................................................. 9-8

9-8

10 Technical specifications

Overview ................................................................................................................................................................................... 10-1

10-1

Physical design specifications ........................................................................................................................................... 10-2

10-2

Power and weight specifications ....................................................................................................................................... 10-3

10-3

Electrical interface specifications ..................................................................................................................................... 10-4

10-4

Optical units interface characteristics ............................................................................................................................. 10-5

10-5

Ethernet interface specifications .................................................................................................................................... 10-33

10-33

Control interface specifications ...................................................................................................................................... 10-35

10-35

A Reference

Overview ..................................................................................................................................................................................... A-1

A-1

Revision history ........................................................................................................................................................................ A-1

A-1

B Ethernet

Overview ..................................................................................................................................................................................... B-1

B-1

Quality of service ..................................................................................................................................................................... B-6

B-6

Ethernet Services ................................................................................................................................................................... B-11

B-11

C Unit data sheets

Overview ..................................................................................................................................................................................... C-1

C-1

ETSI rack hardware ................................................................................................................................................................. C-3

C-3

Alcatel-Lucent 1850 TSS-100 Shelf, Front Access ..................................................................................................... C-5

C-5

Alcatel-Lucent 1850 TSS-100C Compact Shelf ........................................................................................................ C-11

C-11

Top Rack Unit (TRU) ETSI with Bypass-Extension ................................................................................................ C-14

C-14

Equipment Controller TSS-100 (EC100) ..................................................................................................................... C-18

C-18

Equipment Controller TSS-100C (EC100C) ............................................................................................................... C-21

C-21

Equipment Controller High Capacity (EC100A) ....................................................................................................... C-24

C-24

Fan Unit TSS-100 High Performance (FAN100) ...................................................................................................... C-28

C-28

Fan Unit TSS-100C High Performance (FAN100C) ................................................................................................ C-32

C-32

Universal Matrix TSS-100 (MT100) .............................................................................................................................. C-34

C-34

Universal Matrix TSS-100C (MT100C) ....................................................................................................................... C-38

C-38

Power Supply (POW100/POW100NS) ......................................................................................................................... C-42

C-42

Termination Bus (TBF/TBR/TB100C) .......................................................................................................................... C-46

C-46

63-Port E1/DS1 Multiplexer (63E1DS1M) ................................................................................................................. C-48

C-48

56-Port E1/DS1 Multiplexer (E1DS1M) ...................................................................................................................... C-52

C-52

28-Port E1 Access (E1UAC) ............................................................................................................................................. C-56

C-56

32-Port E1/DS1 Access (E1DS1BAC) .......................................................................................................................... C-61

C-61

32-Port E1/DS1 Access Protection (E1DS1PAC) ..................................................................................................... C-64

C-64

32-Port E1 Access (E1UAC and E1DS1PAC) ............................................................................................................ C-67

C-67

24-Port E3/DS3/EC1 Multiplexer + TMUX (E3DS3TM) ..................................................................................... C-72

C-72

12-Port E3 Access (12XE3A) ........................................................................................................................................... C-76

C-76

6-Port DS3 Access (6XDS3AC) ...................................................................................................................................... C-79

C-79
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C vii
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Issue 1 December 2011
Contents

Combo PDH card (ASYMRTM) ..................................................................................................................................... C-85

C-85

16x-Port STM-1 electrical access (16XSEA) ............................................................................................................. C-88

C-88

16x-Port STM-1 protection access (SEPAC) .............................................................................................................. C-90

C-90

8-Port STM-1/OC-3/STM-4/OC-12 (8PSO -8×155/622M sync optical/8XSOA) ........................................ C-92

C-92

4-Port STM-16/OC-48 (4P2G5SO)(4×2.5G sync optical) ..................................................................................... C-98

C-98

8-port STM-1/STM-4/4-port STM-16 Multirate Synch (MRSOE) .................................................................. C-104

C-104

1-Port STM-64/OC-192 (1P10GSO) (1×10G sync optical) ................................................................................ C-109

C-109

10G Packet Transport Processor (PP10G) ................................................................................................................. C-116

C-116

1xGbE Packet Processor - Half Slot (PP10GHS) .................................................................................................... C-119

C-119

24xE/FE Electrical Packet Expander (PE24XFE) .................................................................................................. C-122

C-122

24XFE Packet Expander Access (PE24XFEA) ....................................................................................................... C-126

C-126

8XGE Packet Expander Access (8XGEEA) ............................................................................................................. C-130

C-130

8XGE Synchronous Ethernet Packet Expander Access (8XGEEA) ................................................................ C-132

C-132

1X10GE Packet Expander Access (10GEEA) ......................................................................................................... C-135

C-135

Booster Amplifier - BST10GA ...................................................................................................................................... C-138

C-138

PRE10GA - PRE-AMPLIFIER (Single channel) .................................................................................................... C-142

C-142

CWDM 4/8ch Mux/Demux (CMDX8) ....................................................................................................................... C-145

C-145

DWDM units ........................................................................................................................................................................ C-147

C-147

STM-1 electrical SFP (S1E) ............................................................................................................................................ C-154

C-154

STM-1/OC-3 SFPs ............................................................................................................................................................ C-156

C-156

STM-4/OC-12 SFPs .......................................................................................................................................................... C-160

C-160

STM-16/OC-48 SFPs ........................................................................................................................................................ C-164

C-164

100BASE-X SFPs ............................................................................................................................................................. C-169

C-169

1000BASE-X SFPs ........................................................................................................................................................... C-172

C-172

SFP 1000BASE-T electrical (ETHMR) (EL TRX SFP ETH MULTIRATE RJ45) .................................... C-181
C-181

STM-64/OC-192 and 10GbE XFPs ............................................................................................................................. C-184

C-184
....................................................................................................................................................................................................................................
viii Alcatel-Lucent 1850 TSS-100/TSS-100C
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Issue 1 December 2011
Contents

10GBASE-S XFP (Short Haul, 850 nm) (OPTO TRX XFP 10Gb) ................................................................. C-193
C-193

XFP-E adapter ...................................................................................................................................................................... C-198

C-198

DWDM XFPs ....................................................................................................................................................................... C-200

C-200

CWDM SFPs ........................................................................................................................................................................ C-205

C-205

CWDM XFPs ....................................................................................................................................................................... C-209

C-209

Glossary

Index

1 Documentation set ................................................................................................................................................... xxiv

xxiv

4-1 CWDM frequencies allocation plan in C-band ............................................................................................ 4-46

4-2 DWDM frequencies allocation plan in C-band, using FOADM technology .................................... 4-49

5-1 Default user profiles ............................................................................................................................................... 5-10

5-10

5-2 Protection switch characteristics per module ................................................................................................ 5-25

5-3 Number of registers for each PM parameter monitored ........................................................................... 5-54

5-4 STM-n PM parameters .......................................................................................................................................... 5-55

5-5 Virtual container PM parameters ....................................................................................................................... 5-56

5-6 No double tagging ................................................................................................................................................... 5-71

5-71

5-7 Double tagging – All to one bundling ............................................................................................................. 5-71

5-8 Double tagging – Service multiplexed ............................................................................................................ 5-71

6-1 Traffic and access area card complement ......................................................................................................... 6-2

6-2 SFP and XFP modules ............................................................................................................................................. 6-7

9-1 Card failure rates ........................................................................................................................................................ 9-3

9-3

9-2 SFP/XFP failure rates ............................................................................................................................................... 9-5

9-5

10-1 STM-1/OC-3 monodir SFPs optical characteristics ................................................................................. 10-10

10-2 STM-4/OC-12 monodir SFPs optical characteristics .............................................................................. 10-11

10-3 STM-16/OC-48 monodir SFPs optical characteristics ............................................................................ 10-12

10-4 STM-16/OC-48 long haul monodir SFPs optical characteristics ........................................................ 10-12

10-5 Multirate monodir SFPs optical characteristics ......................................................................................... 10-13

10-6 FE monodir SFPs optical characteristics ..................................................................................................... 10-14

10-7 GE monodir SFPs (SX, LX) optical characteristics ................................................................................. 10-14

10-8 GE monodir SFPs (VX, ZX) optical characteristics ................................................................................ 10-15

10-10 100BX / STM-1 / OC-3, 40Km bidir SFPs optical characteristics .................................................... 10-17

10-11 1000BX / STM-4 / OC-12 20Km bidir SFPs optical characteristics ................................................. 10-18

10-12 1000BX / STM-4 / OC-12 40Km bidir SFPs optical characteristics ................................................. 10-20

10-13 STM-16/OC-48 15Km bidir SFPs optical characteristics ..................................................................... 10-21

10-14 STM-16/OC-48 40Km bidir SFPs optical characteristics ..................................................................... 10-22

10-15 DWDM SFPs optical characteristics ............................................................................................................. 10-23

10-16 CWDM SFPs optical characteristics ............................................................................................................. 10-24

10-17 B&W XFPs optical characteristics (up to 10 Km reach) ....................................................................... 10-25

10-18 B&W XFPs optical characteristics (40/80 Km reach) ............................................................................ 10-26

10-19 DWDM XFPs optical characteristics ............................................................................................................ 10-27

10-20 DWDM XFPs (tunable - 50GHz grid spacing) optical characteristics ............................................. 10-28

10-21 CWDM XFPs optical characteristics ............................................................................................................. 10-29

B-1 GFP frame format details ....................................................................................................................................... B-4

C-1 Front access shelf: Relationships between slots for E1/ E3 applications ............................................. C-9

C-2 Front access shelf: Relationships between slots for data applications ................................................ C-10

C-3 Compact shelf: Relationships between slots for data applications ....................................................... C-13

C-4 Compact shelf: Relationships between slots and access for E1/ E3 applications ........................... C-13

C-5 TRU indicators ........................................................................................................................................................ C-17

C-17

C-6 Position on card in Access area ...................................................................................................................... C-107

C-7 Position on card in Basic/Traffic Area ......................................................................................................... C-108

C-8 HDXS/RJ-45 cable pinout ................................................................................................................................ C-124

C-9 Operating range for 1000BASE-SX over each optical fiber type ...................................................... C-176

C-10 1000BASE-SX transmit characteristics ....................................................................................................... C-176

C-11 1000BASE-SX receive characteristics ......................................................................................................... C-177

C-12 Operating range for 1000BASE-LX over each optical fiber type ...................................................... C-178

C-13 1000BASE-LX transmit characteristics ...................................................................................................... C-178

C-15 1000BASE-ZX transmitter side ..................................................................................................................... C-179

C-16 1000BASE-ZX receiver side ........................................................................................................................... C-180

C-17 10GBASE-E transmit characteristics ........................................................................................................... C-188

C-18 10GBASE-E receive characteristics ............................................................................................................. C-189

C-19 Operating range for 10GBASE-S over each optical fiber type ........................................................... C-195

C-20 10GBASE-S transmit characteristics ............................................................................................................ C-196

C-21 10GBASE-S receive characteristics ............................................................................................................. C-197

C-22 XFPs requiring XFP-E adapter ....................................................................................................................... C-198

2-1 T-MPLS and operational simplification ............................................................................................................ 2-9

2-2 Label switched path in T-MPLS . ........................................................................................................................ 2-9

2-3 T-MPLSstructure ..................................................................................................................................................... 2-10

2-10

2-4 Multi-service convergence over T-MPLS networks ................................................................................... 2-11

2-5 T-MPLS network layering model ...................................................................................................................... 2-12

2-6 T-MPLS network layers - Vertical scalability ............................................................................................... 2-12

2-7 T-MPLS forwarding ............................................................................................................................................... 2-13

2-8 T-MPLS OAM .......................................................................................................................................................... 2-16

2-16

2-9 Scaling Ethernet services with T-MPLS ......................................................................................................... 2-16

2-10 T-MPLS multi domain scenario ......................................................................................................................... 2-17

2-11 Uni/Bi-directional - SNCP ................................................................................................................................... 2-19

2-12 UPSR connections .................................................................................................................................................. 2-20

2-20

2-13 Single node MS-SPRing Ring interconnection ............................................................................................ 2-21

2-14 Dual node MS-SPRing – SNCP Ring Interconnection ............................................................................. 2-22

4-1 Alcatel-Lucent 1850 TSS-100 shelf (front access) ....................................................................................... 4-2

4-2 Alcatel-Lucent 1850 TSS-100C shelf ............................................................................................................... 4-3

4-3 CMDX8 - 8-channel CWDM mux/demux - front view ............................................................................ 4-38

4-4 OMDX8100 - 8-channel DWDM mux/demux) - front view .................................................................. 4-39

4-5 BOOST10G, PRE10G - 10G booster & preamplifier, Ch 34 - front view ........................................ 4-40

4-6 XFP modules and adapter .................................................................................................................................... 4-41

4-7 SFP Modules - view ............................................................................................................................................... 4-43

4-8 Signal architecture (functional overview) ...................................................................................................... 4-44

4-9 Synchronization architecture .............................................................................................................................. 4-51

4-11 Control complex architecture ............................................................................................................................. 4-55

4-12 Universal Matrix (MT100/MT100C) RJ-45 customer interface port .................................................. 4-59

5-1 Database management ............................................................................................................................................. 5-5

5-5

5-2 Architecture for file transfer .................................................................................................................................. 5-6

5-3 Facility loopback ..................................................................................................................................................... 5-16

5-16

5-4 Terminal loopbacks ................................................................................................................................................ 5-17

5-17

5-5 Cross-connect (or matrix) loopbacks ............................................................................................................... 5-18

5-6 DCC transparency ................................................................................................................................................... 5-21

5-21

5-7 DCC IP ring ............................................................................................................................................................... 5-22

5-22

5-8 DCC mixed IP/OSI ring ....................................................................................................................................... 5-22

5-9 DCC connecting IP rings ...................................................................................................................................... 5-23

5-10 DCC connecting OSI rings .................................................................................................................................. 5-23

5-11 Bidirectional 1:1 linear trail protection for Tunnel ..................................................................................... 5-33

5-12 T-MPLS/MPLS-TP Tunnel redundancy configuration - E-LAN service ........................................... 5-34

5-13 Example of Spanning Tree Protocol function (STP) .................................................................................. 5-38

5-14 LPT: failure on Customer Interface and Transport Network ................................................................... 5-40

5-15 Failure in upstream direction (Spoke -> Hub) .............................................................................................. 5-41

5-16 Failure in downstream direction (Hub -> Spoke) ........................................................................................ 5-41

5-17 ETH-CSF insertion - fault detection at UNI-N ............................................................................................ 5-43

5-18 ETH-CSF insertion - fault detection at NNI ................................................................................................. 5-44

5-19 ETH-AIS insertion - fault detection at UNI-N ............................................................................................. 5-45

5-20 ETH-AIS insertion - fault detection at NNI .................................................................................................. 5-46

5-21 Architectural positioning of link aggregation sub-layer ........................................................................... 5-48

5-22 Link aggregation ...................................................................................................................................................... 5-49

5-49

5-23 Fast LAG failure signaling .................................................................................................................................. 5-52

5-24 Service OAM reference model ........................................................................................................................... 5-63

5-26 Ethernet OAM over VPWS model ................................................................................................................... 5-69

5-27 Ethernet OAM over VPWS network scenario .............................................................................................. 5-69

6-1 Example of low-end SDH ADM (Alcatel-Lucent 1850 TSS-100) ....................................................... 6-18

6-2 Example of low-end SDH ADM (Alcatel-Lucent 1850 TSS-100C) .................................................... 6-18

6-3 Example of high-end SDH ADM (Alcatel-Lucent 1850 TSS-100) ...................................................... 6-19

6-4 Example of high-end SDH ADM (Alcatel-Lucent 1850 TSS-100C) .................................................. 6-20

6-5 Example of high-end MSPP (Alcatel-Lucent 1850 TSS-100) ................................................................ 6-21

6-6 Example of high-end MSPP (Alcatel-Lucent 1850 TSS-100C) ............................................................ 6-22

6-7 Network with Level 2 routers ............................................................................................................................. 6-24

6-8 Assigning areas ........................................................................................................................................................ 6-26

6-26

6-9 Assigning sub-domains ......................................................................................................................................... 6-27

6-10 Redundant routes with the Level 2 sub-domain .......................................................................................... 6-28

6-11 Recommended Level 2 router assignments ................................................................................................... 6-29

6-12 Recommended area assignments ....................................................................................................................... 6-30

6-13 Recommended placement of Level 2 routers ................................................................................................ 6-31

6-14 Level 2 router assignments on an OSI LAN ................................................................................................. 6-32

6-15 OSI LAN redundancy ............................................................................................................................................ 6-33

B-1 Dynamic bandwidth adjustment .......................................................................................................................... B-2

B-2 GFP frame format ..................................................................................................................................................... B-3

B-3

B-3 Ethernet aggregation using high-order ( VC3) virtual concatenation .................................................... B-5

B-4 W-RED thresholds .................................................................................................................................................... B-9

B-9

B-5 W-RED queueing ................................................................................................................................................... B-10

B-10

C-1 ETSI rack with integrated TRU ........................................................................................................................... C-4

C-2 Alcatel-Lucent 1850 TSS-100 Shelf (Front Access) .................................................................................... C-7

C-3 Alcatel-Lucent 1850 TSS-100 shelf common part interface (CPI) connectors .................................. C-8

C-4 Alcatel-Lucent 1850 TSS-100 Shelf (Front Access) .................................................................................... C-9

C-6 TRU front view ....................................................................................................................................................... C-15

C-15

C-7 Power pass-through of bypass units ................................................................................................................ C-16

C-8 Equipment Controller TSS-100 (EC100) ...................................................................................................... C-19

C-9 Equipment Controller TSS-100C (EC100C) ................................................................................................ C-22

C-10 Equipment Controller High Capacity (EC100A) ....................................................................................... C-26

C-11 Fan Unit TSS-100 High Performance (FAN100) ....................................................................................... C-30

C-12 Universal Matrix (MT100) ................................................................................................................................. C-35

C-13 Universal Matrix TSS-100C (MT100C) ........................................................................................................ C-39

C-14 Power Supply (POW100) with switch ........................................................................................................... C-43

C-15 Power Supply (POW100NS) without switch ............................................................................................... C-43

C-16 63-Port E1/DS1 Multiplexer (63E1DS1M) .................................................................................................. C-49

C-17 56-Port E1/DS1 Multiplexer (E1DS1M) ....................................................................................................... C-53

C-18 28-Port E1 Access (E1UAC) .............................................................................................................................. C-57

C-19 28-Port E1 Access protection scheme ............................................................................................................. C-59

C-20 32-Port E1/DS1 Access (E1DS1BAC) ........................................................................................................... C-62

C-21 32-Port E1/DS1 Access Protection (E1DS1PAC) ...................................................................................... C-65

C-22 32-Port E1 Access (32E1UAC) ......................................................................................................................... C-68

C-23 28-Port E1 Access protection scheme ............................................................................................................. C-70

C-24 24-Port E3/DS3/EC1 Multiplexer + TMUX (E3DS3TM) ...................................................................... C-73

C-25 12-Port E3 Access (12XE3A) ............................................................................................................................ C-77

C-26 6-Port DS3 Access (6XDS3AC) ....................................................................................................................... C-80

C-27 6-Port DS3 Access (6XDS3AC) functional overview .............................................................................. C-81

C-28 12-Port E3/DS3/EC1 Access Protection (E3DS3PAC) ............................................................................ C-83

C-29 12-Port E3/DS3/EC1 Access Protection (E3DS3PAC) card protection scheme ............................. C-84

C-30 12-Port E3/DS3/EC1 Access Protection (E3DS3PAC) control sub-system ..................................... C-85

C-31 8-Port STM-1 /STM-4 (8PSO/8XSOA) ........................................................................................................ C-93

C-33 MRSOE SFP positions ....................................................................................................................................... C-107

C-34 1-Port STM-64/OC-192 (1P10GSO) ............................................................................................................ C-111

C-35 Functional block diagram ................................................................................................................................. C-118

C-36 PP10GHS - block view ...................................................................................................................................... C-119

C-37 1x10GE Packet processor (PP10GHS) ........................................................................................................ C-121

C-38 24xFE Packet Expander - Block view ......................................................................................................... C-127

C-39 24XFE Packet Expander Access (PE24XFEA) ........................................................................................ C-129

C-40 8XGE Packet Expander Access (8XGEEA) .............................................................................................. C-131

C-41 Functional block diagram ................................................................................................................................. C-132

C-42 8XGE Synchronous Ethernet Packet Expander Access (8XGEEA) ................................................. C-134

C-43 Functional block diagram ................................................................................................................................. C-135

C-44 1X10GE Packet Expander Access (10GEEA) .......................................................................................... C-137

C-45 Functional block diagram ................................................................................................................................. C-138

C-46 BST10GA - block view ..................................................................................................................................... C-139

C-47 BST10GA board ................................................................................................................................................... C-141

C-48 PRE10GA - block view ..................................................................................................................................... C-142

C-49 PRE10GA board ................................................................................................................................................... C-144

C-50 CMDX8 block diagram ..................................................................................................................................... C-146

C-51 OMDX8100 block diagram ............................................................................................................................. C-149

C-52 Configuration for ultra long-haul applications .......................................................................................... C-150

C-53 BOOST10G block diagram .............................................................................................................................. C-151

C-54 Configuration for very long-haul applications .......................................................................................... C-152

C-55 PRE10G block diagram ..................................................................................................................................... C-154

C-56 Electrical SFP module ........................................................................................................................................ C-155

C-155

C-57 Optical SFP module ............................................................................................................................................ C-157

C-157

C-58 Optical SFP module block diagram .............................................................................................................. C-159

C-60 Optical SFP module block diagram .............................................................................................................. C-163

C-61 Optical SFP module ............................................................................................................................................ C-166

C-166

C-62 Optical SFP module intraoffice and short-haul block diagram ........................................................... C-167

C-63 Optical SFP module long-haul block diagram .......................................................................................... C-168

C-64 Optical SFP module ............................................................................................................................................ C-170

C-170

C-65 Optical SFP module block diagram .............................................................................................................. C-171

C-66 Optical SFP module ............................................................................................................................................ C-174

C-174

C-67 Optical SFP module block diagram .............................................................................................................. C-175

C-68 Electrical SFP module ........................................................................................................................................ C-183

C-183

C-69 Electrical SFP module functional diagram ................................................................................................. C-184

C-70 Optical XFP module ........................................................................................................................................... C-186

C-71 Optical XFP module, extended version ....................................................................................................... C-186

C-72 Optical XFP module block diagram .............................................................................................................. C-187

C-73 STM-64/OC-192 XFP-E module ................................................................................................................... C-191

C-74 STM-64/OC-192 XFP-E module block diagram ..................................................................................... C-192

C-75 Optical XFP module ........................................................................................................................................... C-194

C-76 Optical XFP module block diagram .............................................................................................................. C-195

C-77 XFP-E adapter ....................................................................................................................................................... C-199

C-199

C-78 XFP insertion into XFP-E adapter ................................................................................................................. C-200

C-79 Optical XFP module ........................................................................................................................................... C-205

C-80 Optical SFP module ............................................................................................................................................ C-208

C-208

C-81 Optical XFP module ........................................................................................................................................... C-210

Purpose
This Product Information and Planning Guide provides the following information about
the Alcatel-Lucent 1850 TSS-100 and Alcatel-Lucent 1850 TSS-100C.
• A system description including
– Features
– Physical configurations
– Software capabilities
– Typical applications
– Operations, administration, and maintenance functionality
– Technical specifications
• Unit descriptions of each physical component
• Product support information.

Reason for reissue

Issue 1, July 2011
This document, , Issue 1, is issued to provide information about the following significant
Release 4.1 features.
• T-MPLS support.
• Updated Cards, modules, and miscellaneous components.
• Updated FIT rates.
• 24xE/FE electrical packet expander card (PE24XFE) is installed on top of a 10G
Packet Processor (PP10G) card and routes 24x10MB (Ethernet) or 24x100MB (Fast
Ethernet) channels to the PP10G.
• Front Access Shelf, New Edition is new hardware.
• Compact Shelf, New Edition and top cover grid are new hardware.
• 63-Port E1/DS1 Multiplexer (63E1DS1M) supports the E1 (2Mb/s) and the DS1
(1.5Mb/s) port. This access manages up to 63 E1 or 56 DS1 channels. It is used
together with the proper access card No I/O connector is present on its front panel.
...................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C xxi
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
About this document

Intended audience
This product information and planning guide is intended for network planners and
engineers. However, anyone who needs specific information regarding the features,
applications, and operation of the Alcatel-Lucent 1850 TSS-100 would benefit from this
document.

How to use this information product

This product information and planning guide is divided into chapters. Refer to the
Contents section to locate specific information by chapter.

Appearance Description
italicized text • File and directory names
• Emphasized information
• Titles of publications
• A value that the user supplies
graphical user interface text or key name • Text that is displayed in a graphical user
interface or in a hardware label
• The name of a key on the keyboard
input text Command names and text that the user types
or selects as input to a system
output text Text that a system displays or prints

Related information
The following table lists the documents included in the current documentation set.
Table 1 Documentation set

Part Number Title

8DG26342AAAATQZZA Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and
TSS-100C) Release 4.1 (ETSI) Product Information and Planning
Guide
8DG26342BAAATQZZA Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and
TSS-100C) Release 4.1 (ETSI) User Provisioning Guide
8DG26342CAAATQZZA Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and
TSS-100C) Release 4.1 (ETSI) TL1 User Provisioning Guide
8DG26342DAAATQZZA Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and
TSS-100C) Release 4.1 (ETSI) TL1 Command Guide for MSPP
8DG26342EAAATQZZA
8DG26342FAAATQZZA Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and
TSS-100C) Release 4.1 (ETSI) Maintenance and Trouble-Clearing
Guide
8DG26342GAAATQZZA Alcatel-Lucent 1850 Transport Service Switch(TSS-100 and
TSS-100C) Release 4.1 (ETSI) Safety Guide
8DG26342HAAATQZZA Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and
TSS-100C) Release 4.1 (ETSI) Engineering Rules
....................................................................................................................................................................................................................................
xxiv Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
About this document

Part Number Title

8DG26342JAAATQZZA Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and
TSS-100C) Release 4.1 (ETSI) Installation Guide
8DG26342KAAATQZZA Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and
TSS-100C) Release 4.1 (ETSI) Turn-Up and Commissioning Guide
8DG25713AAAATQZZA Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and
TSS-100C) Release 3.0 - 7.2 Engineering and Ordering Information
8DG26215ABAAFMZZA Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and
TSS-100C) Release 4.1.0 (ETSI) Customer Release Notes
8DG26343AAAAADZZA Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and
TSS-100C) Release 4.1 (ETSI) Customer Documentation CD-ROM

Technical support
For technical support, contact your local Alcatel-Lucent customer support team. See the
Alcatel-Lucent Support web site (http://alcatel-lucent.com/support/) for contact
information.

How to order
To order Alcatel-Lucent documents, contact your local sales representative or use Online
Customer Support (OLCS) (http://support.alcatel-lucent.com).

How to comment
To comment on this document, go to the Online Comment Form (http://infodoc.alcatel-
lucent.com/comments/) or e-mail your comments to the Comments Hotline
([email protected]).

Overview
Purpose
This chapter introduces the Alcatel-Lucent 1850 TSS-100.

Contents

Overview of the Alcatel-Lucent 1850 Transport Service Switch portfolio 1-1

Introduction to the Alcatel-Lucent 1850 TSS-100 1-3

Overview of the Alcatel-Lucent 1850 Transport Service Switch

portfolio
Purpose
Bandwidth-hungry services, such as triple play and Ethernet virtual private networks
(VPNs), are redefining the capacity and functionality requirements of the existing
transport infrastructure. These changes are driving the move from circuit-based transport
using time division multiplexing (TDM) to packet-based transport using Ethernet in
metro and wide-area networks.
Different network approaches and topologies can be implemented, depending on the
service provider’s business model, service offerings and history. Service providers
focusing on broadband access, triple play, and business Ethernet services, tend to build
Ethernet-based networks with wavelength division multiplexing (WDM) support for
scalable service delivery. On the other hand, service providers offering multiple services,
including business and mobile, can leverage their installed base to transport existing and
new services, taking advantage of the full-featured, transport-oriented operations,
administration, maintenance and provisioning (OAM&P) capabilities of their SDH
networks.

Solution
The Alcatel-Lucent 1850 Transport Service Switch is the next step towards a converged
transport network: it is a single transport aggregation platform that switches packets and
circuits, and transports any kind of service in any possible mix, enabling service providers
to build future-proof transport networks that can support any future traffic requirement.
The industry’s first transport service switch, the Alcatel-Lucent 1850 Transport Service
Switch builds on the success of today’s Optical Multi-Service Node (OMSN), the
Alcatel-Lucent solution for multiservice SDH.

Portfolio
The Alcatel-Lucent 1850 Transport Service Switch portfolio includes several
next-generation products with different capacities, based on the most common
requirements of metro networks:
• Alcatel-Lucent 1850 TSS-5 — Supports 8 Gb/s data switching capacity or up to 15
Gb/s of switching capacity in mixed packet/TDM configurations. Supports any
service over any transport: TDM and Ethernet services are supported over SDH
transport as well as over Ethernet transport. For mobile backhaul applications, the
Alcatel-Lucent 1850 TSS-5 provides a single platform that gracefully transitions from
SDH to Ethernet transport. It can be configured for SDH transport for native TDM
and Ethernet over SDH services. As packet traffic grows with the deployment of
Ethernet-enabled 3G and 4G base stations, the Alcatel-Lucent 1850 TSS-5 can be
reconfigured for Ethernet transport for native Ethernet and can support legacy T1/E1
via circuit emulation service (CES).
• Alcatel-Lucent 1850 TSS-100 — Supports 60 Gb/s data switching capacity or up to
100 Gb/s in mixed packet/TDM configurations. These products are high-capacity
metro-edge and core switch with rich TDM and Ethernet services and transport
features. This product is positioned to provide capacity relief for traditional MSPP
networks that have reached their capacity limits and to seamlessly transition to packet
networks.
The Alcatel-Lucent 1850 TSS-100 shares the innovative Alcatel-Lucent
universal-switch matrix architecture and common SDH hardware modules with the
Alcatel-Lucent 1850 TSS-5. This architecture and equipment sharing ensures feature
transparency and capital expenditure and operating expenditure savings.

Introduction to the Alcatel-Lucent 1850 TSS-100

Overview
The Alcatel-Lucent 1850 TSS-100 is a multiservice transport platform that supports any
mix of traffic, from all-circuit to all-packet. Its unique, technology independent universal
matrix switches packets or circuits in their native format and transports them as they are,
optimizing overall network efficiency and applicability. This capability allows operators
to address transitioning from TDM/circuit-based transport to packet transport with the
flexible provisioning of carrier Ethernet/transport and SDH.
The Alcatel-Lucent 1850 TSS-100 supports current and future traffic requirements by
eliminating the scalability issues encountered by traditional multiservice provisioning
platform (MSPP)/ multiservice transport platform (MSTP) solutions. The 1850 TSS-100
is the ideal building block for evolving transport networks, allowing operators to flexibly
split increasing traffic demands among any combination of carrier transport technologies.
A smooth evolution from legacy transport networks, mainly based on SDH and PDH
technologies, to an integrated network solution containing optical, TDM, and data
services, calls for platforms that are capable of managing different technologies at the
same time.
The Alcatel-Lucent 1850 TSS-100 works around the agnostic matrix concept for multiple
network layers (SDH to packet).
The entire capacity of the agnostic matrix can be flexibly utilized by TDM and packet
traffic, from 100% TDM to 100%-packet, with slot granularity. This flexible utilization is
possible due to the following key architectural concepts:
• Payload matrices perform only cross-connections; they do not perform traffic
processing.
• Traffic processing within a layer is performed on port modules specific to that layer
and traffic processing is directly connected to the portion of the agnostic matrix
corresponding to that layer.
• Optional adapter cards are used to interconnect different layers (matrices) either
integrated with, or external to, the agnostic matrix: These cards include the
termination and adaptation functions required by a layered approach.
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Alcatel-Lucent 1850 TSS-100/TSS-100C 1-3
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System overview Introduction to the Alcatel-Lucent 1850 TSS-100

Features
This chapter shows a high-level summary of the most characteristic features of the
Alcatel-Lucent 1850 TSS-100.
Features NOT supported (w.r.t R3.x)
• LAG among EoS (Ethernet over VCG) ports
• Fast 1+1 LAG (sub 50 ms)
• 24xFE access card
General features
Independent of certain configuration options, the Alcatel-Lucent 1850 TSS-100 generally
supports the following features:
• Shelves for front access
• Redundant universal matrix at 100 Gbps
• Redundant controller and power supply
• 12 Slots for interface cards (front access and rear access shelves)
– 8 Slots at 10 Gbps
– 4 Slots at 5 Gbps
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1-4 Alcatel-Lucent 1850 TSS-100/TSS-100C
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System overview Introduction to the Alcatel-Lucent 1850 TSS-100

Overview
Purpose
This chapter briefly highlights the features supported by the Alcatel-Lucent
1850 TSS-100. Features are described in more detail in Chapter 3, “Topologies and
configurations”, Chapter 4, “Product description”, Appendix C, “Unit data sheets”, and
Chapter 5, “Operations, administration, and maintenance”.

Contents

Hardware features 2-1

Networking capabilities 2-7
Cross-connection types 2-17
Management and operations features 2-22
Synchronization 2-29

Hardware features
Overview
This section briefly describes the major hardware related features of the Alcatel-Lucent
1850 TSS-100.
The following is included in this section.
• SDH network interface cards
• PDH interface cards
• Ethernet cards
• Pluggable transmission modules installed in the card faceplates as needed

SDH cards
This section briefly describes the SDH cards supported in the Alcatel-Lucent
1850 TSS-100 shelves.
8-Port STM-1/OC-3/STM-4/OC-12 (8PSO) (8×155/622M sync optical)
The 8-port (8PSO) processes signals from up to eight STM-1/OC-3 or STM-4/OC-12
SFP plug-ins. The 8PSO provides eight slots, each of which hosts an STM-1/OC-3 or
STM-4/OC-12 Small Form Factor Plug-in (SFP) optical module. The STM-1/OC-3 SFP
module is available with three different interfaces, and the STM-4/OC-12 SFP module is
available with three different interfaces. The 8PSO can host any of these interfaces.
8-Port STM-1/STM-4 (8XSOA)
The 8-port (8XSOA) processes signals from up to eight STM-1/OC-3 or STM-4/OC-12
SFP plug-ins. The 8XSOA provides eight slots, each of which hosts an STM-1/OC-3 or
STM-4/OC-12 Small Form Factor Plug-in (SFP) optical module. The STM-1/OC-3 SFP
module is available with three different interfaces, and the STM-4/OC-12 SFP module is
available with three different interfaces. The 8XSOA can host any of these interfaces.
4-Port STM-16/OC-48 (4P2G5SO) (4×2.5G sync optical)
The 4-port STM-16/OC-48 (4P2G5SO) processes up to four STM-16/OC-48 SFP
plug-ins. The 4P2G5SO provides four slots, each of which hosts an STM-16/OC-48
Small Form Factor Plug-in (SFP) optical module. The STM-16/OC-48 SFP module is
available with four different interfaces, and the 4P2G5SO can host any of these interfaces.
1-Port STM-64/OC-192 (1P10GSO) (1×10G sync optical)
The 1-port OC-192 (1P10GSO) processes one STM-64/OC-192 XFP/XFP-E plug-in. The
1P10GSO provides one slot that hosts an STM-64/OC-192 10 Gb Small Form Factor
Plug-in (XFP) or XFP-Extended (XFP-E) optical module. The STM-64/OC-192
XFP/XFP-E module is available with different interfaces, and the 1P10GSO can host any
of these interfaces.
8-port STM-1/STM-4/4-port STM-16 Multirate Synch (MRSOE)
This card (if equipped with the proper access) is able to manage up to 16 electrical
STM-1 or up to 16 optical STM-1 or up to 16 optical STM-4 or up to 4 STM-16 channels.
Some mixed configuration are allowed The use of one of its access is not mandatory It is
equipped with 8 SFP cages.

PDH cards
This section briefly describes the PDH interface cards supported in the Alcatel-Lucent
1850 TSS-100 shelves.
Combo PDH Board (ASYMRTM)
This combo card is able to manage up to 6xDS3 or 6xE3 channels and up to 32xE1 or
28xDS1 channels. It is used together with the proper access cards. No I/O connector is
present on its front panel.
56-Port E1/DS1 Multiplexer (E1DS1M)
The 56-Port E1/DS1 Multiplexer (E1DS1M) accepts customer E1/DS1 signals from the
E1UAC, 28XDS1AC, or E1DS1BAC, provides direct mapping of E1/DS1 into
VT1.5/VC-n, provides E1/DS1 PM, and clear-channel E1/DS1.
63-Port E1/DS1 Multiplexer (63E1DS1M)
This card is the E1 (2Mb/s) and the DS1 (1.5Mb/s) port. This access manages up to 63 E1
or 56 DS1 channels. It is used together with the proper access card No I/O connector is
present on its front panel.
28-Port E1 Access (E1UAC)
The 28-Port E1 Access (E1UAC) collects 28 E1 channels and routes them to the
E1DS1M. It also performs protection switching toward the 28-Port E1/DS1 Access
Protection (E1DS1PAC) in the event of port failure.
28-Port E1/DS1 Access (100/120Ω) (E1DS1BAC)
The 28-Port E1/DS1 Access (100/120Ω) (E1DS1BAC) collects 28 E1/DS1 signals and
routes them to the E1DS1M. It also performs protection switching toward the 28-Port
E1/DS1 Access Protection (E1DS1PAC) in the event of port failure.
28-Port DS1 Access Protection (DS1PRAC)
The 28-Port DS1 Access Protection (DS1PRAC) controls protection switching for the
28XDS1AC cards in its protection group.
The 8DG02874AAX DS1PRAC card (SCSI connector interface) will be discontinued and
replaced by the 8DG25562AAXX E1DS1PAC (D-sub connector interface).
28-Port E1/DS1 Access Protection (E1DS1PAC)
The 28-Port E1/DS1 Access Protection (E1DS1PAC) controls protection switching for the
E1DS1BAC cards in its protection group.
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C 2-3
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Features Hardware features

10G Packet Transport Processor (PP10G)

The P10G Packet Transport Processor is a Layer 2 data aggregator cards capable of
switching incoming data from:
• Two access cards (Packed Expander) equipped with eight SFPs or one XFP
• Traffic coming from matrix unit.
The card is able to perform data mapping, allowing interworking between TDM traffic
and packet-based traffic, and providing data encapsulation.
The 10G Packet Transport Processor card is also ready to work with transport protocols
(for example, TMPLS).

....................................................................................................................................................................................................................................
The 8DG02652AAXX PP10G was discontinued and is replaced by the 8DG09099AAXX
PP10G. The 8DG02652AAXX PP10G is not be supported in Release 4.0 and later
releases.
Note: In Release 4.0 and later, the local 1xGE interfaces (4 ports) are no longer
managed by software. Refer to DLP-114: Disablement of local 1xGE interfaces on all
of the PP10G cards in Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and
TSS-100C) Release 4.1 (ETSI) Maintenance and Trouble-Clearing Guide.
24xE/FE electrical packet expander card (PE24XFE)
The 24xE/FE card (8DG26008AAXX) is installed on top of a 10G Packet Processor
(PP10G) card and routes 24x10MB (Ethernet) or 24x100MB (Fast Ethernet) channels to
the PP10G.
The following provisioning details must be observed.
• When a PP10G is configured to support a 24xFE electrical access card, the total
number of VCGs supported is 74.
• When a PP10G is configured to deny a 24xFE electrical access card, the total number
of VCGs supported is 128.
The Electrical FE IF is not rate limited; each Electrical FE occupies 100M of the 10G
bandwidth available.
1x10GbE Packet Processor - Half Slot (PP10GHS)
This card is used to manage data traffic. No access card is available for this card (the only
I/O is the front panel optical module). On its front panel are present two debug connectors
(available only for debug purpose) and the 10Gb/Eth XFP optical module used to connect
the data traffic.
The card is a half-height card.
8XGE Packet Expander Access (8XGEEA)
The 8XGE Packet Expander Access (8XGEEA) manages independently Gigabit Ethernet,
1000/100BASE-T, and Ethernet over PDH interfaces. The on board FPGA PPEXT_A
performs the MAC line termination function and sends/receives the packets to the 10G
Packet Processor (PP10G) through a XAUI interface.
The 8XGEEA provides eight slots that host eight GbE SFP modules.
8XGE Packet Expander Access (8XGEEA)
The 8XGE Packet Expander Access (8XGEEA) manages independently Gigabit Ethernet,
1000/100BASE-T, and Ethernet over PDH interfaces. The on board FPGA PPEXT_A
performs the MAC line termination function and sends/receives the packets to the 10G
Packet Processor (PP10G) through a XAUI interface.
The 8XGEEA provides eight slots that host eight GbE SFP modules.

SFP and XFP modules

The SDH and Ethernet interface cards support SFP and XFP modules. The SFP and XFP
modules are purchased separately from the cards and equipped (or plugged in) only as
additional interfaces become necessary. SFP and XFP modules make the Alcatel-Lucent
1850 TSS-100 interface density scalable and can lower initial costs.
CWDM and DWDM SFPs/XFPs are also supported for SDH and Ethernet network
interface cards.
The XFP-E adapter is used to adapt 10 Gb XFPs that are standard Multi-Source
Agreement (MSA) mechanical form factor to the extended mechanical form factor so that
it can be inserted into the 1P10GSO and 10GEEA cards.

Networking capabilities
Overview
This section briefly describes the major networking capabilities supported for
Alcatel-Lucent 1850 TSS-100.
SDH interfaces
The Alcatel-Lucent 1850 TSS-100 supports linear, SNCP, and MS-SPRing STM-1,
STM-4, STM-16, and STM-64 optical SDH interfaces.
The Alcatel-Lucent 1850 TSS-100 can be equipment protected, network (SDH) protected,
or unprotected. In order to have network protection the cards must be equipment
protected. Equipment protection is accomplished by virtue of card redundancy. This
redundancy allows for traffic restoration and card replacement without loss of SDH
service.
New provisioning rules remove current constraints for companion STM-n ports when
setting up MS-SPRing and SNCP applications.
The STM-n interfaces also support DCC interworking with other SDH products.
DCC transparency provides the capability to provision a fixed forwarding of LAPD/PPP
frames through SDH networks.
PDH interfaces
The Alcatel-Lucent 1850 TSS-100 supports the following PDH interfaces:
• E1/DS1
• E3/DS3
Alcatel-Lucent 1850 TSS-100 also supports TMUX services using the 24-Port
E3/DS3/EC1 multiplexer + TMUX (E3DS3TM) card.
Universal switch matrix
The 1:1 redundant universal agnostic switch matrix can support up to 1640 VC-4
cross-connections for 100 Gb/s. It also provides 5,376 VT1.5 cross-connections (ANSI)
or 192 VC-3 and 4,032 VC-12 cross-connections (ETSI) for 10 Gb/s. The system
processes the following signal types: DS1, E1, DS3, STS-1, STM-1, STM-4, STM-16,
STM-64, VC-12, VC3, VC4, and for data FastEthernet, GbE and 10GbE. The system
supports a variety of applications, from a network consisting of ring configurations
including only the Alcatel-Lucent 1850 TSS-100 systems to a network supporting a
mixed ring and connection to other vendor islands.

Figure 2-1 T-MPLS and operational simplification

Lot of sub 2.5G TDM More efficient transport for

Ma p & Ma p a t clients are there and L2 and L3 services
Switch Edge
grow due to mobile Ma p a t Ed ge

ATM, FR, SAN , PDH, SDH, ATM, FR, Ethernet,

SAN , PDH,
Client S Ethernet IP/ M PLS
IP/ MPLS, Clea r Cha nnel
q Pa cket
u SDH/ T- M PLS or ODU
L1 e SON ET/ SDH L1 SON ET MPLS-TP
ez
N etworking Photonic
L0 e WDM L0 Switching
( t
Grow (BW) Clear channel for Carriers’ Carrier and
large enterprise
Multi-vendor capable lambda networks
Distributed regeneration and recoloring

To increase scalability, bring networking into layer-0 and packet into layer-1
Layer 1: universal matrix and transport-optimized MPLS
Layer 0: Range from ROADM to tunable multi-degree switching

In a T-MPLS connection-oriented domain, a stream of data client (any L2) always

traverses a common, predetermined path via the establishment of a label switched path
(LSP), see Figure 2-2, “Label switched path in T-MPLS .” (p. 2-9)At the ingress switch,
each packet is assigned a label and it is transmitted downstream. At each switch along the
path, the label is used to forward the packet to the next hop.

Figure 2-2 Label switched path in T-MPLS .

Both technologies use a differentiated services architecture to manage traffic: all packets
crossing a link and requiring the same forwarding behavior are said to constitute a
behavior aggregate. At the ingress node, the packets are classified and marked with a code
point that corresponds to their behavior aggregate (based on the service configuration
policy). At each transit node, the code point is used to identify the per-hop behavior that
determines the appropriate scheduling and buffer management treatment and, in some
cases, the drop probability for each packet. The differentiated services implementation
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Alcatel-Lucent 1850 TSS-100/TSS-100C 2-9
8DG26342AAAATQZZA Release 4.1 (ETSI)
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Features Networking capabilities

Figure 2-3 T-MPLSstructure

L3 (IP) a ny L2 (e.g. Ethernet)

IP/ MPLS

MPLS tunnel PWE3

T-MPLS / MPLS-TP tunnel

Optica l- Pa cket Tra nsport N etwork

Figure 2-3, “T-MPLSstructure” (p. 2-10) shows the architecture for mapping client traffic
flows over T-MPLS LSP connectivity or path, according to the following guidelines:
• A generic client (any L2, e.g., Ethernet, IP/MPLS, SDH/SONET, OTN services) can
be mapped into a T-MPLS channel (G.8110.1).
• channels are based on the PseudoWire Emulation edge-to-edge (PWE3) model. A
PWE3 emulates the essential attributes of a physical connectivity service (ATM,
Ethernet) over a packet-switched network. From the client point of view, the
pseudowire is perceived as an unshared link or circuit. IETF RFC 3985 presents the
PWE3 Architecture. This makes pseudowire a powerful tool for multi-service support
over an MPLS network. Figure 2-4, “Multi-service convergence over T-MPLS
networks” (p. 2-11) shows the basic concept of a pseudowire. PW in IETF is defined

Figure 2-4 Multi-service convergence over T-MPLS networks

Internal transfer and switching of traffic in the packet network is independent of the
specific protocol stack and application service at the client side, while the edge mapping
may be optimally configured and tuned in accordance with the client's requirements.
A T-MPLS network can accomplish the interconnection of a set of IP-routing devices
with a set of point-to-point pseudowires or E-LAN transport services. The actual
interoperability is at the Ethernet link or media access control (MAC) level, and the client
device may be a generic Ethernet-interfaced device rather than an MPLS-enabled one.
The Ethernet frames from client ports are mapped into point-to-point pseudowires
(VPWS) or multipoint virtual LAN (E-LAN services), based on a meshed tunnel
infrastructure . No exchange of routing or topology information is required at the border
with the transport network.
Deploying T-MPLS frees service providers from managing a variety of single-purpose
packet-oriented transport networks. With T-MPLS a single packet network can emulate
the characteristics of legacy services while introducing new connectivity services that are
synergistic with advanced all-IP-oriented packet services.

Figure 2-5 T-MPLS network layering model

T-MPLS/MPLS-TP equipment
(switching capability either
at channel or path layer)

Cl ient A Cl ient A

Cl ient D Cl ient D

Cl ient C
Cl ient C
Cl ient B

Cl ient B
Physical connection: can be
Cl ients: can be any L2 Logical connection: in any L1 (Ethernet, SDH,
(Ethernet, ATM, FR, TDM T-MPLS/MPLS-TP two networking OTN+WDM …); moreover an
CES…) using mapping layers are defined: optional section layer is
options defined by IETF • channel ( IETF MS-PW) defined, in order to support
PWE3, or IP/MPLS path ( IETF MPLS tunnel) OAM i f not otherwi se avai l abl e

Figure 2-6 T-MPLS network layers - Vertical scalability

T- M PL/MPLS-TP

Client Equipmen t Client Equipmen t

Customer-owned
Carrier-owned (e.g. IP-
DSLAM, Ethernet Any Client Service
switch, IP/MPLS router) physical link Ether net
Other Carrier-owned IP/MPLS
(e.g. T-MPLS switch)
T-MPLS/MPLS-TP (carrier-carrier service)
ATM, FR, ...

Channel Layer
Pseudowire OAM

Se ct i on La ye r Path Layer . Tunnel O AM T-MPLS/MPLS-TP is scalable

Li nk O AM & multi-service
Any Medium
fiber, copper, radio T-MPLS/MPLS-TP is independent from the physical layer

T-MPLS Forwarding - The forwarding paradigm, label swapping and stacking, is

described in Figure 2-7, “T-MPLS forwarding” (p. 2-13).

Figure 2-7 T-MPLS forwarding

T-MPLS/MPLS-TP domain

The encapsulation/decapsulation of the client signals into a T-MPLS frame (Tunnel) is

performed by ingress/egress T-switches via PW encapsulation. T-MPLS uses only the
IETF PW encapsulation mechanism.
T-MPLS support point-to-point connections (E-Line service) via the VPWS (Virtual
Private Wire Service), as defined in IETF RFC3985 and RFC4664, and
multipoint-to-multipoint connections via the E-LAN services, as defined in IETF
RFC4672 and RFC4664.
Both single-segment and multi-segment network scenarios are supported, as depicted in
the next pictures.
QoS (Quality of Service) allows the operators to provide carrier-grade services that meet
the negotiated Service Level Agreement (SLA) in terms of network bandwidth, delay,
jitter, packet loss and availability.
QoS is the ability of a network to provide some level of assurance for consistent data
delivery.
Two basic approaches are available:
• Resource reservation (integrated services): network resources are apportioned in
accordance with an application's QoS request and subject to bandwidth management
policy.
• Prioritization (differentiated services): network traffic is classified and network
resources are apportioned in accordance with classification results.
Only the differentiated services approach is supported.

....................................................................................................................................................................................................................................
These types of QoS are applied to individual application "flows" (individual,
unidirectional data stream between two applications, sender and receiver), or to flow
aggregates (two or more flows, e.g., the flows having something in common, like a label,
a priority number, an ID).
The Differentiated Service (DiffServ) architecture provides a way to categorize and
prioritize network traffic (flow) aggregates, enabling QoS provisioning within a network
domain by applying rules at the edges of a domain to create traffic aggregates, and
coupling each of these with a specific forwarding path treatment in the domain using a
"code point" (a value) in the packet header ("per-hop forwarding behavior" - PHB).
The required functionality is mainly at diffserv domain edges to select (classifiers) and
condition (e.g., policing and shaping) traffic in accordance with well-defined rules.
Using the diffServ approach, each node uses the QoS information coded into the packet
header to correctly forward that class of traffic (Class of Service), in accordance with its
bandwidth, delay, jitter, and loss characteristics.
To improve network performance, QoS affects a network by manipulating the following
network characteristics:
• Bandwidth: The number of bits per second that can be successfully delivered across
some medium
• Delay: The time a packet takes to arrive at its destination, e.g., its queuing delay
• Jitter: The variation in the arrival rate of packets that were transmitted in a uniform
manner
• Packet loss: The probability for a packet to be discarded in the network, e.g., for
network congestion
The following parameters allows to provide QoS within a single network element:
• Classification: It is able to differentiate one packet from another by examining a
variety of fields inside the packet headers. After classification, any QoS tool can be
applied on a classified packet.
• Metering: It measures the traffic rate to determine whether the traffic conforms to the
stated contract or exceeds the traffic contract. Metering typically occurs on classified
flows, mostly on a per-class base.
• Marking: It is the process of inserting information into the frame to allow further
elaboration to the packets, e.g., applying "color" to a packet, to differentiate the
behavior of the node on different packets of the same packet flow. The following
algorithm has been defined:
– "Dual rate, three colors marker" is defined by two sets of parameters, respectively
committed parameters (CIR and CBS) and excess (or peak) parameters (EIR and
EBS). Packets exceeding PIR or PBS are marked as red, packets exceeding CIR or
CBR but conformant to PIR and PBS are market as yellow, while packet
conformant to both CIR and CBS are marked as Green.
CIR, CBS, EIR, EBS are the MEF parameters to define the Bandwidth Profile.
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Based on the classification, the following tools complete the QoS management:
• Shaping delays some or all the packets in a traffic flow in order to make the flow
compliant with a traffic profile. It has a finite size buffer and packets may be
discarded if there is not sufficient buffer space
• Queuing provides different treatments to different packet flows. The number of
available queues implies the maximum number of traffic categories (CoS) that can be
treated differently by the queuing method
• Queue Service Algorithm refers to the logic a queuing system uses to pick the queue
from which it will take the next packet. Strict priority algorithm schedules traffic so
that Higher-priority queues always get serviced before any lower priority queues. A
packet in a lower priority queue is served only when higher priority queues are empty.
Schedulers such as WFQ or DRR can provide bandwidth guarantees and latency
bounds for each queue, but they cannot guarantee low latency; it is obtained using a
hybrid scheduler (using Strict priority and Weighted queues) with the addition of at
least one priority queue.
DiffServ with Traffic Engineering allows to set LSPs with bandwidth reservation and
performs admission control at every node to check the network has enough resources to
guarantee the QoS of the LSP.
E-LSP mechanism is supported to encode QoS treatment to apply to a packet.
An E-LSP (EXP-inferred LSP) is an LSP on which nodes infer the QoS treatment for
MPLS packet exclusively from the EXP bits in the MPLS header. A single LSP can
support up to eight classes of traffic (3-bit field).
Both technologies define powerful OAM capabilities that enable status and performance
reports to remain confined in the T-MPLS layer, and do not require deeper packet
inspection. It permits guaranteed service level agreements (SLAs), defines protection
switching and restoration, enables efficient fault localization, continuity and connectivity
verifications, provides Quality control capabilities and multi-service provider service
offerings. An overview is shown in Figure 2-8, “T-MPLS OAM” (p. 2-16)
The general T-MPLS OAM requirements are:
• Proactive monitoring features, including continuity supervision, connectivity
supervision, signal quality supervision (packet loss), alarm suppression, remote defect
indication, single-ended maintenance
• Re-active/on-demand monitoring, including fault localization, signal quality
measurement (throughput, ordering and error measurement, transfer delay, delay
variation and jitter measurement)
• Communication channels, including protection switching head/tail-end coordination,
network management, remote node management, service management.
T-MPLS OAM are defined in ITU-T Recommendation G.8114/Y.1373.

Figure 2-8 T-MPLS OAM

G.8114/Y.1373 in data plane based on Y.1731 (Ethernet OAM) and Y.1711 for T-MPLS
draft-bhh-mpls-tp-oam-y1731 in data plane based on Y.1731 (Ethernet OAM) for MPLS-TP

Per-layer monitoring points for segment & end-to-end OAM

Maintenance End Points (MEP)
Maintenance Intermediate Points (MIP)
Continuous and on-demand OAM primitives
Checking signal integrity, connectivity, quality; allowing for fault localization
Remote indications for bidirectional paths
T - MPLS / M P L S - T PDoma in A T - MPLS / M P L S - T PDoma in B

Client Service Client Service

(e.g. Ethernet)
Tra nsport Service
T - MPLS / M P L S - T P Cha nnel
Doma in A Doma in B

T - MPLS / M P L S - T P P a t h

T - MPLS / M P L S - T P S e s s i o n

Network scenarios examples

Figure 2-9 Scaling Ethernet services with T-MPLS

Provider Edge (PE) Provider (P) (PE)

Metro T-MPLS/MPLS-TP Network

ETH
T-MPLS/MPLS-TP LO (PW)
T-MPLS/MPLS-TP used for scaling (beyond T-MPLS/MPLS-TP HO (Tunnel)
PB) particularly for EVPL and EVPLAN. GFP GFP ETH
Addition of VPLS for multipoint VCAT VCAT
STM-N OTM-n ETYn

PW MPLS Tunnel

Customer CE
Equipment
(CE) Provider Edge (PE)
Provider (P) PE
UNI
CE

In the T-MPLS/MPLS-TP edge node, in the ingress/ T-MPLS/MPLS-TP intermediate

egress direction, the client layer traffic flows are node performs T-MPLS /MPLS-TP
encapsulated/decapsulated into/from PWs, which cross- connection at Tunnel layer
are multiplexed/demultiplexed into/from Tunnels.

Cross-connection types
Overview
The Alcatel-Lucent 1850 TSS-100 has two-way cross-connection capabilities that offer
you flexibility in directing traffic flow through systems to support a wide variety of
customer applications.

Creating cross-connections
Cross-connections are created by specifying the SDH rate, the end point addresses
(AIDs), and the cross-connection type (for example, one way).

Cross-connection rates
The Alcatel-Lucent 1850 TSS-100 supports the following SDH VC-n cross-connections.
• VC4
• VC44C
• VC416C
• VC464C
• LOVC12
• LOVC3
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Cross-connection types
The Alcatel-Lucent 1850 TSS-100 supports the following cross-connection types:
• A one-way cross-connection is established between the receive side (from the
network) of the FROM port and the transmit side (to the network) of the TO port. A
one-way cross-connection can be established between the receive and transmit side of
the same port (FROM and TO are identical thereby establishing a loopback through
the system cross-connection matrix) or can be added as a bridge to an existing
one-way or two-way cross-connection.
• A one-way path ring cross connection is established between the FROM port which
has to be the UPSR ring port and the TO port which has to be the drop port. If the
FROM is not the ring port and the To is not the drop port, the request will be denied.
In order for one-way path ring cross-connections to succeed, the corresponding
tributary embedded within the Ring must be provisioned with UPSR=Y.
• A two-way cross-connection is established between the FROM and TO ports. A
pass-through cross-connection can be established between the FROM and TO ports if
both tributaries belong to the same STM-n/OC-n ring pair and are both in the same
timeslot. An unprotected cross-connection can be established between the FROM and
TO ports if one tributary is embedded within a ring STM-n/OC-n and the other
tributary is embedded within a non-ring (linear) STM-n/OC-n, an EC1 or another ring
STM-n/OC-n. .
• A one-way SNCP cross-connection is established between the received side (from the
network) of the FROMPED and FROMPING ports and the transmit side (to the
network) of the TO port. A selector shall define which is the currently active receive
facility based upon degradation or failure conditions or upon manual commands.
• A two-way SNCP cross-connection is established between the FROMPED and
FROMPING ports and TO port. In the direction FROM->TO, a selector shall define
which is the currently active receive facility based upon the degradation or failure
conditions or upon manual commands; in the opposite direction the single bridge
towards both FROMPED and FROMPING facilities.
Drop and continue connections are not supported and ring interconnection topologies are
supported through a set of atomic blocks (both SNCP and unprotected connections).

Figure 2-11 Uni/Bi-directional - SNCP

Management and operations features

Overview
This section briefly describes the major features related to management and operation of
the Alcatel-Lucent 1850 TSS-100.

Loopbacks
A loopback is a troubleshooting test in which a signal is transmitted through a port unit to
a set destination and then returned to the originating port unit. The transmitted and
received signals are measured and evaluated by the user to ensure that the received signal
is accurate and complete when compared to the originating signal.

Test access
Test access, a traditional DCS function, allows the user visibility into any VT1.5 tributary
in the network. Test access aids users in turning up connections and in identifying faults
in existing service connections. The system supports three different types of test access.
The non-intrusive method simply taps the VT1.5 tributary as it passes through the system
and routes it to an external testing device. The more intrusive mode splits the VT1.5
tributary from the incoming signal and sends it to an external testing device. The third
form of test access enables the Pseudo Random Test signal generation and check on a
facility involved in a test access connection with an Electrical T3 (T3STS1) or Electrical
T3 embedded T1 (T3VT1) TAP.

Performance monitoring
Performance monitoring (PM) provides the user with the facility to track systematically
the quality of a particular transport entity. This tracking is done by means of continuous
collection and analysis of the data derived from defined measurement points.
PM also compares the error counts with user-defined thresholds and issues a report when
any error count crosses its defined threshold.
The Alcatel-Lucent 1850 TSS-100 performs PM on the following facility types:
• STM-n (STM-1, STM-4, STM-16, STM-64)
• OC-n (OC-3, OC-12, OC-48, OC-192)
• STM-n (STM-1, STM-4, STM-16, STM-64)
• VT1.5
• VC-n (VC-4/AU-4 high-order: VC3/TU3 and VC12/TU12 low-order)
• E3/DS3/EC-1
• E1/DS1
Digital Diagnostic Monitoring (DDM) also allows performance parameters to be retrieved
for optical SFP and XFP modules.
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Zero Installation Craft Terminal (ZIC)

The system can also fully be managed from a web-based PC with no pre-installed
E-specific craft terminal software. Typically this feature uses a web browser to provide a
connection to the E. This connection requires logon security. Once connected, an IP
address is provided to retrieve a Java applet. A validation is made that the appropriate
revision applet is not already resident on the PC.

CLI management
The command line interface (CLI) is used for direct command entry to manage Ethernet
interfaces and connections.

TL1 management
Transaction Language 1 (TL1) commands can be entered directly through the following:
• a Telnet session
• the TL1 console tool of the ZIC interface
• the TL1 Direct Access Terminal (TL1DAT) capability of the Alcatel-Lucent 1350
Optical Management System
• the TL1 cut-thru capability of the Alcatel-Lucent 1340 Integrated Network Controller.

Alcatel-Lucent 1350 OMS

The Alcatel-Lucent 1350 OMS (global) provides a Graphical User Interface (GUI) to
enable a user to view and perform system administration for all network Elements (NEs)
in a network, including remote Alcatel-Lucent 1850 TSS-100 systems, over TCP/IP. The
Alcatel-Lucent 1350 OMS performs provisioning, monitoring, and alarm management for
the Alcatel-Lucent 1850 TSS-100.

OSI seven-layer protocol stack

This feature provides interworking using the Open Systems Interconnection (OSI)
seven-layer protocol stack over the data communications channel (DCC). The OSI
seven-layer protocol stack refers to the OSI reference model, a logical structure for
network operations standardized by the International Standards Organization (ISO).

Support of Simple Network Management Protocol

Simple Network Management Protocol (SNMP) is the most common protocol used by
data network management applications to query a management agent using a supported
Management Information Base (MIB). SNMP operates at the OSI Application layer. The
IP-based SNMP is the basis of most network management software, to the extent that
today the phrase managed device implies SNMP compliance.

Security
The Alcatel-Lucent 1850 TSS-100 provides various security features to monitor and
control access to the system via TL1 commands, Zero Installation Craft (ZIC) interface,
or Command Line Interface (CLI).
User login security controls access to the system on an individual user basis by means of
• User privileges and user attributes
• Login ID and password assignment
• User ID and password aging
• Auto-logout
• Security event log and autonomous messages.
• HTTPS for browser access to ZIC
• Secure SHell (SSH2)
• RADIUS authentication for user logins

Secure SHell
SSH allows a user to securely login to remote NEs, to execute commands (TL1 and CLI)
safely on a remote NE, and to provide secure encrypted and authenticated
communications between network management systems and NEs in an untrusted
network. It replaces other, insecure terminal applications, such as Telnet and FTP.
The following applications are supported:
• FTP over SSH (sometimes referred to as “Secure FTP” [SFTP]) is the practice of
tunnelling FTP through an SSH connection. In other words SFTP uses SSH to transfer
files. Unlike standard FTP, SFTP encrypts both commands and data, preventing
passwords and sensitive information from being transmitted in readable content over
the network.
SFTP provides the following services:
– SW download
– MIB backup and restore
– Performance Monitoring
• CLI and TL1 over SSH allows transparent and automatic tunneling of X11
connections and arbitrary TCP/IP-based applications, such Telnet applications.
Telnet-based applications, such TL1 and CLI, can be tunnelled via SSH.

RADIUS authentication for user logins

When the NE is provisioned to use Remote Authentication Dial In User Service
(RADIUS) authentication, any user TL1/CLI/ZIC login attempt triggers the network
element to query the designated RADIUS server(s) and act on the response.

SDH
Many of the traditional SDH maintenance, provisioning, operations, control, and
synchronization features are included in the Alcatel-Lucent 1850 TSS-100 The flexible
SDH standards provide a formidable foundation for the Alcatel-Lucent 1850 TSS-100 to
build upon.

Multivendor operations Interworking

The Alcatel-Lucent 1850 TSS-100 supports interoperability with many vendors’
equipment; particularly those that support ITU-T standards-based SDH.

MAC ACL
The Alcatel-Lucent 1850 TSS-100 supports MAC Access Control List for data plane
access security. It allows selective forwarding/dropping of all the frames except the ones
matching the values stored in the MAC ACL list. A single MAC ACL list is supported for
each port, so that MAC ACL List is configured on per port basis for the following ingress
port types.
• Ingress ports of Virtual Bridge
• Ingress UNI/ETH IWI ports of a Provider Bridge
• Ingress UNI ports of a T-MPLS over VPLS node
Each entry in the ACL is a Access Control Element (ACE), used as filtering criterion for
ingress frames. For security reason, the system discards those Ethernet packets which do
not satisfy the filtering criteria in MAC ACL list.
Note: At least one ACE filtering criterion should be entered in the ACL list. A
maximum of 64 ACE filtering elements can be associated to a MAC ACL list.

Synchronization
Overview
Synchronization is an important part of all SDH products. The Alcatel-Lucent
1850 TSS-100 is designed for high performance and reliable synchronization and can be
used in a number of synchronization environments.

Synchronization references
For synchronization, the Alcatel-Lucent 1850 TSS-100 can use:
• External E1/DS1 references from a Building Integrated Timing Supply (BITS)
• Line timing references derived from STM-n ports and 10 Gb/s Ethernet ports
• Internal clock reference (from an oscillator with Stratum 3 quality as defined in
Telcordia GR-1244).

Clock reference unit (CRU)

The Clock Reference Unit (CRU) is embedded in the Universal Matrix
(MT100/MT100C) cards and is equipment protected.
The CRU operates in an active/standby relationship and supports automatic and manual
protection switching.

Overview
Purpose
The Alcatel-Lucent 1850 TSS-100 supports a wide range of service applications and a
variety of network topologies and configurations economically and efficiently.
TheAlcatel-Lucent 1850 TSS-100 performs multi-service integration of SDH and Data.

Contents

SDH configurations 3-1

DATA configurations 3-3
SDH/DATA network topologies 3-4

SDH configurations
Overview
The Alcatel-Lucent 1850 TSS-100 is compliant with SDH ITU-Tand supports the
following SDH network configurations.
• Terminal multiplexer
• Add/drop multiplexer
• Hub
The Alcatel-Lucent 1850 TSS-100 is capable of supporting all configurations in one node
simultaneously in mixed configurations.

NE SDH/SONET Ports

SDH/SONET
DATA Ports

terminalmux

SDH add/drop multiplexer

In SDH add/drop multiplexer configurations, the Alcatel-Lucent 1850 TSS-100 is
equipped and provisioned to add to and drop from the protected STM-N/OC-N interface.
Pass through traffic is also allowed between the STM-N/OC-N line sides.
The following figure shows an example of the SDH add/drop multiplexer configuration.

SIDE A SIDE B

SDH/SONET Ports NE SDH/SONET Ports

SDH/SONET
DATA Ports

add-dropmux

SDH Hub
In SDH hub configurations, the Alcatel-Lucent 1850 TSS-100 is equipped and
provisioned to add to and drop from the protected STM-N/OC-N interface into multiple
streams and split in a hub structure.

SIDE A SIDE B

SDH/SONET Ports NE SDH/SONET Ports

SDH/SONET Ports

hub

DATA configurations
Overview
The Alcatel-Lucent 1850 TSS-100 is supports the following DATA configurations.
• DATA-only
• DATA-TDM
The Alcatel-Lucent 1850 TSS-100 is capable of supporting all configurations in one node
simultaneously in mixed configurations.

DATA-only configuration
The following figure shows an example of the DATA-only configuration.

DATA DATA
Cards Cards

Local Universal Local

Ethernet Matrix Ethernet
(LAN) (LAN)

Data-only

DATA TDM
Cards Cards
Remote
Local Universal Ethernet over
Ethernet Matrix SDH/SONET
(LAN)
(EOS)

Data-TDM

SDH/DATA network topologies

Overview
Each SDH/DATA configurations support a variety of network topologies including the
following:
• Point-to-point
• Linear
• Ring
• Mesh

Point-to-point
In point-to-point applications, the Alcatel-Lucent 1850 TSS-100 is connected to another
multiplexer through using an SDH line.
The following figure shows an example of a point-to-point application.

SDH/SONET Ports
SDH/SONET SDH/SONET
DATA Ports
NE NE DATA Ports

point-to-point

Linear
In linear applications, two Alcatel-Lucent 1850 TSS-100 network elements are connected
via one or more intermediate Alcatel-Lucent 1850 TSS-100 network elements.
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Topologies and configurations SDH/DATA network topologies

SDH/SONET SDH/SONET SDH/SONET

Ports Ports Ports
NE NE NE NE
DATA DATA
Ports Ports
SDH/SONET SDH/SONET
DATA Ports DATA Ports

linear

Ring
In ring applications, the Alcatel-Lucent 1850 TSS-100 network elements are connected
together in a ring. Ring applications can also be interconnected.
The following figure shows an example of a dual ring application.

SDH/SONET
DATA Ports

SDH/SONET NE STM-N/OC-N NE SDH/SONET

DATA Ports Ring DATA Ports

SDH/SONET
SDH/SONET NE DATA Ports NE SDH/SONET
DATA Ports DATA Ports
STM-N/OC-N
Ring

SDH/SONET
DATA Ports

ring

Mesh
In the mesh applications, the Alcatel-Lucent 1850 TSS-100 network elements are
interconnected using ring and linear connections.
The following figure shows an example of a mesh application.

SDH/SONET
DATA Ports

NE
SDH/SONET
DATA Ports
STM-1/OC-3 STM-1/
STM-N/OC-N OC-3 SDH/
DATA
NE Ring NE NE NE SONET
Ports Ports

SDH/SONET
NE Ports

STM-N/OC-N
SDH/SONET
DATA Ports
STM-N/OC-N

NE
SDH/
SONET NE
Ports STM-N/OC-N SDH/SONET
NE Ring NE DATA Ports
SDH/SONET
DATA Ports

DATA Ports

mesh

Overview
Purpose
This chapter describes theAlcatel-Lucent 1850 TSS-100 architecture. After introducing
the Alcatel-Lucent 1850 TSS-100, this chapter describes the system cards, transmission,
synchronization, control, and power.

Contents

Shelf descriptions 4-2

Cards, modules, and miscellaneous components 4-4
Units front view 4-37
Transmission architecture 4-44
Synchronization 4-50
Synchronization from Ethernet interfaces/signals 4-52
Control complex 4-55
System management 4-56
Powering and grounding 4-60

Shelf descriptions
Overview
The Alcatel-Lucent 1850 TSS-100 supports the following shelf types:
• Alcatel-Lucent 1850 TSS-100 front access shelf (global)
• Alcatel-Lucent 1850 TSS-100C compact shelf (ETSI only)

Alcatel-Lucent 1850 TSS-100 front access shelf (global)

The Alcatel-Lucent 1850 TSS-100 front access shelf, Figure 4-1, “Alcatel-Lucent
1850 TSS-100 shelf (front access)” (p. 4-2), houses equipment that performs control,
matrix, and I/O functions.

Figure 4-1 Alcatel-Lucent 1850 TSS-100 shelf (front access)

16 Access Slots
E1/DS1/E3/DS3
EC1
10/100 FE
EC100

GE/10GE

Fan
Sh ID HK
POW100(P)

12 Traffic Slots
_
MT100 (P)

STM-N/OC-N
EC100 (P)

10G slot
10G slot

10G slot
10G slot
10G slot
10G slot
10G slot
10G slot

E1/DS1/E3/DS3
5G slot
5G slot
5G slot

MT100
5G slot
EC100

GE
POW100
_

newgraphic3b

The shelf consists of top, bottom, rear, and side panels, card guides, and a printed circuit
backplane. Equipment connections are through connectors on the backplane.
....................................................................................................................................................................................................................................
4-2 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Product description Shelf descriptions

Alcatel-Lucent 1850 TSS-100C compact shelf (ETSI only)

The Alcatel-Lucent 1850 TSS-100C compact shelf, Figure 4-2, “Alcatel-Lucent
1850 TSS-100C shelf ” (p. 4-3), houses equipment that performs control, matrix, and I/O
functions.
The shelf consists of top, bottom, rear, and side panels, card guides, and a printed circuit
backplane. Equipment connections are through connectors on the backplane.

Figure 4-2 Alcatel-Lucent 1850 TSS-100C shelf

FAN100C PWR
14
PSF B
PSF A

HK/Alm/Lamp Access FAN Tray

connectors
12 11Power HK sync
HK/Alm/lamps
B
A

Batt A
SU
S

aux sync
Batt B
connectors connectors
MT100C (P)
EC100C (P)
10G Slot
10G Slot

10G Slot
10G Slot
10G Slot
10G Slot
MT100C
EC100C

Access
Access
Access
Access
Access
Access
Access
Access
Ac

Ac
Ac

1 2 3 4 5 6 7 8 9 10 15 16 17 18 19 20 21 22

6 Traffic Slots 8 Access Slots

STM1/4/16/64 E1/E3
E1/E3 10/100 FE
GE GE/10GE
TSS-100C

The Alcatel-Lucent 1850 TSS-100C compact shelf (ETSI only) is 531.0 mm (20.90 in.)
wide, 398.0 mm (15.67 in.) high, and 294.0 mm (11.57 in.) deep.
Up to three Alcatel-Lucent 1850 TSS-100C compact shelves may be mounted in an ETSI
rack with the Integrated Top Rack Unit.
Up to four Alcatel-Lucent 1850 TSS-100C compact shelves may be mounted in an ETSI
rack without the Integrated Top Rack Unit.

ETSI rack configurations

Standard ETSI racks are 600mm wide, 300mm deep, and 2200mm high. They are
closed-channel earthquake racks. The ETSI racks provide 25mm spacing of mounting
holes for ETSI mounting increments.
An ETSI rack may be equipped with up to two Alcatel-Lucent 1850 TSS-100 front access
shelves or up to three or four Alcatel-Lucent 1850 TSS-100C compact shelves with or
without the Integrated Top Rack Unit respectively.
Two types of mounting racks are available with an integrated Top Rack Unit:
• Optinex rack - for environments where most TDM connections are via copper
facilities
• TSS rack - for environments where most TDM connections are via fiber facilities.
For detailed information about the ETSI rack, refer to “ETSI rack hardware” (p. C-3).

Cards, modules, and miscellaneous components

Refer to the following table for brief descriptions of rack and shelf assemblies, cards,
modules, and miscellaneous components used in the Alcatel-Lucent 1850 TSS-100.

Unit Quantity Description

“TSS Rack w/TRU” (p. C-3) Configuration dependent The rack houses up to
two Alcatel-Lucent
1850 TSS-100 front
access shelves or
three Alcatel-Lucent
1850 TSS-100C
shelves and
supporting
equipment. The rack
is 2200mm high,
600mm wide, and
300mm deep.

Unit Quantity Description

“Optinex Rack w/TRU” (p. C-3) Configuration dependent The rack houses up to
two Alcatel-Lucent
1850 TSS-100 front
access shelves or
three Alcatel-Lucent
1850 TSS-100C
shelves and
supporting
equipment. The rack
is 2200mm high,
600mm wide, and
300mm deep.
“Alcatel-Lucent 1850 TSS-100 Shelf, Front Access, Up to 2 per rack The front-access
New Edition” (p. C-5) Alcatel-Lucent
1850 TSS-100 shelf
houses equipment that
performs control,
matrix, and I/O
functions. The shelf
consists of top,
bottom, rear, and side
panels; card guides;
and a printed circuit
backplane. Equipment
connections are
through connectors on
the backplane. (Front
cover is ordered
separately.)
“Top Rack Unit with Bypass-Extension” Up to 2 per rack The Top Rack Unit
(p. C-14) (TRU) contains a
Bypass-Extension that
passes voltages
between 38.4VDC
and 72VDC with two
breaker fuses that
have a maximum
capacity of 40 A.

Unit Quantity Description

“Equipment Controller” (p. C-18) (EC100) Up to 2 per shelf The EC100 is the
FLC for the
Alcatel-Lucent
1850 TSS-100 front
access shelves. As an
FLC, it controls shelf
management and
communication. For
the CGI function, it
manages physical
interfaces for alarm
collection and
signaling. It also uses
a 1 GB flash disk to
provide mass storage
functions.
“Equipment Controller High Capacity” Up to 2 per shelf The EC100A is the
(p. C-24) (EC100A) high capacity FLC for
the shelf. It controls
shelf management
and communication.
For the CGI function,
it manages physical
interfaces for alarm
collection and
signaling. The
EC100A is equipped
with an 8 GB flash
disk to provide
enhanced mass
storage functions for
future use.

Unit Quantity Description

“Equipment Controller” (p. C-21) (EC100C) Up to 2 per shelf The EC100C is the
FLC for the
Alcatel-Lucent
1850 TSS-100C shelf.
As an FLC, it controls
shelf management
and communication.
It also uses a 1 GB
flash disk to provide
mass storage
functions.
“Fan Unit” (p. C-28) (FAN100) 1 per shelf The FAN100 contains
eight multi-speed fans
and a fan controller to
provide 1:N
protection for cooling
the Alcatel-Lucent
1850 TSS-100 shelf.
“Fan Unit” (p. C-32) (FAN100C) 1 per shelf The FAN100C
contains eight
multi-speed fans and
a fan controller to
provide 1:N
protection for cooling
the Alcatel-Lucent
1850 TSS-100C
compact shelf.

Unit Quantity Description

“Fan Unit” (p. C-32) (4FANS) 1 per shelf The 4FANS contains
four multi-speed fans
and a fan controller to
provide 1:N
protection for cooling
the Alcatel-Lucent
1850 TSS-100 shelf
or compact shelf in
Central Office
applications.
This fan unit cannot
be used in Hardened
outdoor Cabinet
applications. You
must use FAN100 or
FAN100C for Cabinet
applications.
“Universal Matrix” (p. C-34) (MT100) 2 per shelf (required for The MT100 receives
redundancy) the signal from the
Input/Output (I/O)
modules and performs
switching for SDH at
the VC-3 and VC-12
levels . It also serves
as the SLC for the
shelf and provides a
CRU.
“Universal Matrix” (p. C-38) (MT100C) 2 per shelf (required for The MT100C
redundancy) receives the signal
from the Input/Output
(I/O) modules and
performs switching
for SDH at the VC-3
and VC-12 levels. It
also serves as the
SLC for
theAlcatel-Lucent
1850 TSS-100C shelf
and provides a CRU.

Unit Quantity Description

“Power Supply with switch” (p. C-42) (POW100) 2 per shelf The POW100
provides a 3.6 V
auxiliary voltage and
filtered A- and
B-battery power from
the PDU to all
modules in the shelf.
“Power Supply without switch” (p. C-42) (POW100NS) 2 per shelf The POW100NS
provides a 3.6 V
auxiliary voltage and
filtered A- and
B-battery power from
the PDU to all
modules in the shelf.
“Termination Bus (front access)” (p. C-46) (TBF) 1 per front access shelf The termination bus
comes equipped as
part of the
Alcatel-Lucent
1850 TSS-100 shelf.
This part number is
provided for
replacement purposes.
“Termination Bus (TSS-100C shelf)” 1 per TSS-100C shelf The termination bus
(p. C-46) (TB100C) provides the LCI
interface and
electrical termination
to buses routed on the
backplane of the
Alcatel-Lucent
1850 TSS-100C shelf.
The termination bus
comes equipped as
part of the
Alcatel-Lucent
1850 TSS-100C shelf.
This part number is
provided for
replacement purposes.

Unit Quantity Description

“Combo PDH card (ASYMRTM)” Front : Up to 8 per shelf This combo card is
(p. C-85) (ASYMRTM) Compact: Up to 4 per shelf able to manage up to
6xDS3 or 6xE3
channels and up to
32xE1 or 28xDS1
channels. It is used
together with the
proper access cards.
No I/O connector is
present on its front
panel.
“63-Port E1/DS1 Multiplexer (63E1DS1M)” Front : Up to 8 per shelf This card is the E1
(p. C-48) (63E1DS1M) Compact: Up to 4 per shelf (2Mb/s) and the DS1
(1.5Mb/s) port. This
access manages up to
63 E1 or 56 DS1
channels. It is used
together with the
proper access card No
I/O connector is
present on its front
panel.
“56-Port E1/DS1 Multiplexer” (p. C-52) (E1DS1M) Front : Up to 8 per shelf The E1DS1M accepts
Compact: Up to 4 per shelf customer E1 s from
the E1DS1BAC,
provides direct
mapping of E1 into
VC-12 , provides E1
PM, and
clear-channel E1 .

Unit Quantity Description

“63-Port E1/DS1 Multiplexer (63E1DS1M)” Front : Up to 14 per shelf The E1DS1BAC
(p. C-48) (E1DS1BAC) Compact: Up to 6 per shelf access card is the I/O
unit for the 63 x
E1/56xDS1 (56PDS1)
port. It collects up to
32 E1 (120 Ω) or up
to 28 DS1 (100 Ω)
differential pairs
channels and routes
them to the 56PDS1.
It also performs
protection switching
toward the
E1DS1PAC in the
event of port failure.
It is equipped with
two sub-D 78 female
connectors.
“32-Port E1 Access (E1UAC and E1DS1PAC)” Front : Up to 14 per shelf The E1UAC access
(p. C-67) (E1UAC) Compact: Up to 6 per shelf card is the I/O unit for
the 63 x E1/56xDS1
(56PDS1) port. It
collects up to 32 E1
channels and routes
them to the 56PDS1.
It also performs
protection switching
toward the
E1DS1PAC in the
event of port failure.
It is equipped with 64
1.0/2.3 female coax
connectors (75Ω).
“32-Port E1 Access (E1UAC and E1DS1PAC)” Front : Up to 4 per shelf The E1DS1PAC
(p. C-67) (E1DS1PAC) Compact: Up to 2 per shelf controls protection
switching for the
E1DS access modules
in its protection
group.

Unit Quantity Description

“28-Port E1 Access (75Ω)” (p. C-56) (E1UAC) Front : Up to 14 per shelf The E1UAC collects
Compact: Up to 6 per shelf 28 E1 channels and
routes them to the
E1DS1M. It also
performs protection
switching toward the
E1DS1PAC in the
event of port failure.
The EIUAC provides
75-ohm mini 1.0/2.3
coaxial faceplate
connectors for 28
transmit and 28
receive customer E1
signals.
“32-Port DS1 Access” (p. C-61) (28XDS1AC) Front : Up to 14 per shelf The 28XDS1AC
Compact: Up to 6 per shelf collects 28 DS1
channels and routes
them to the E1DS1M.
It also performs
protection switching
toward the DS1PRAC
in the event of port
failure. This
28DS1AC card uses 2
SCSI connectors.
The 28XDS1AC card
will be discontinued
and replaced by the
E1DS1BAC card.
“32-Port DS1 Access Protection” (p. C-64) (DS1PRAC) Up to 2 per shelf The DS1PRAC
controls protection
switching for
28XDS1AC cards in
its protection group.
The card uses SCSI
connectors.
The DS1PRAC card
will be discontinued
and replaced by the
E1DS1PAC card.

Unit Quantity Description

“32-Port E1/DS1 Access (100/120Ω)” Front : Up to 14 per shelf The E1DS1BAC
(p. C-61) (E1DS1BAC) Compact: Up to 6 per shelf access card is the I/O
unit for the 63 x
E1/56xDS1 (56PDS1)
port. It collects up to
32 E1 (120 Ω) or up
to 28 DS1 (100 Ω)
differential pairs
channels and routes
them to the 56PDS1.
It also performs
protection switching
toward the
E1DS1PAC in the
event of port failure.
It is equipped with
two sub-D 78 female
connectors
“32-Port E1/DS1 Access Protection” Up to 2 per shelf The E1DS1PAC
(p. C-64) (E1DS1PAC) controls protection
switching for
E1DS1BAC and
E1UAC modules in
its protection group.
The card uses D-sub
connector interfaces.

Unit Quantity Description

“24-Port E3/DS3/EC1 Multiplexer + TMUX” Front : Up to 8 per shelf The E3DS3TM can
(p. C-72) (E3DS3TM) Compact: Up to 4 per shelf serve in a ported or
portless mode. In the
ported mode, the
E3DS3TM accepts
customer DS3s from
the 12-Port DS3/EC1
Access (12XDS3AC),
provides direct
mapping of DS3 into
STS-1, provides DS1
(carried over DS3)
PM listening mode,
and clear channel
DS3. In the portless
mode, the E3DS3TM
converts STS-1
signals carrying DS3
into STS-1s carrying
DS1 mapped over
VT1.5s.
The E3DS3TM also
accepts customer E3
signals from the
12-Port E3 Access
(12XE3A) and
provides direct
mapping of E3s into
VC-3s. For ETSI
market applications,
customer DS3s can
also be mapped into
VC-3s.
“6-Port DS3 Access (6XDS3AC)” Front : Up to 14 per shelf This card is one of the
(p. C-79) (6XDS3AC) Compact: Up to 6 per shelf I/O units for the
combo port. This
access manages up to
6 x DS3 channels. It
is equipped with 12
mini-BNC coax
connectors.

Unit Quantity Description

“12-Port E3 Access” (p. C-76)(12XE3A) Front: Up to 12 per shelf The 12XE3A collects
Compact: Up to 6 per shelf 12 E3 channels and
routes them to the
E3DS3TM. It also
performs protection
switching toward the
E3DS3PAC in the
event of port failure.
“12-Port E3/DS3/EC1 Access Protection” Front : Up to 4 per shelf The E3DS3PAC
(p. C-82) (E3DS3PAC) Compact: Up to 2 per shelf collects 36 DS3
channels from three
12XDS3AC modules
and routes them to the
E3DS3TM to support
protection switching
in the event of port
failure.
“16x-Port STM-1 electrical access (16XSEA)” Front : Up to 14 per shelf This card is one of the
(p. C-88) (16XSEA) Compact: Up to 6 per shelf I/O units for the
multirate port. This
access manages up to
16 electrical STM-1
(75 Ω) coaxial
channels. It is
equipped with 16
1.0/2.3 female coax
connectors.
“16x-Port STM-1 protection access (SEPAC)” Front : Up to 14 per shelf This card is used to
(p. C-90) (SEPAC) Compact: Up to 6 per shelf involve one or more
STM-1 electrical
access in a protection
group. This access is
able to manage the
protection of up to 16
electrical STM-1
channels. No I/O
connector is present
on its front panel.

Unit Quantity Description

“8-port STM-1/STM-4/4-port STM-16 Multirate Synch Front : Up to 12 per shelf This card (if equipped
(MRSOE)” (p. C-104) (MRSOE) Compact: Up to 6 per shelf with the proper
access) is able to
manage up to 16
electrical STM-1 or
up to 16 optical
STM-1 or up to 16
optical STM-4 or up
to 4 STM-16
channels. Some
mixed configuration
are allowed The use
of one of its access is
not mandatory It is
equipped with 8 SFP
cages.
“8-Port STM-1/OC-3 / STM-4/OC-12 (8×155/622M Front : Up to 12 per shelf The 8PSO processes
Sync Optical)” (p. C-92) (8PSO) Compact: Up to 6 per shelf up to eight STM-1 s
or STM-4 s (SFP
plug-in). The 8PSO
provides eight slots,
each of which hosts
an STM-1 or STM-4
SFP optical module.
The STM-1 SFP
module is available
with three different
interfaces, and the
STM-4 SFP module is
available with three
different interfaces.
The 8PSO can host
any of these
interfaces. The
following STM-1 and
STM-4 SFPs are
available: SS-11,
SL-11, SL-12, SS-41,
SL-41, and SL-42.

Unit Quantity Description

“8-Port STM-1/OC-3 / STM-4/OC-12 (8×155/622M Front : Up to 12 per shelf The 8XSOA
Sync Optical)” (p. C-92) (8XSOA) Compact: Up to 6 per shelf processes up to eight
STM-1 s or STM-4 s
(SFP plug-in). The
8XSOA provides
eight slots, each of
which hosts an
STM-1 or STM-4
SFP optical module.
The STM-1 SFP
module is available
with three different
interfaces, and the
STM-4 SFP module is
available with three
different interfaces.
The 8PSO can host
any of these
interfaces. The
following STM-1 and
STM-4 SFPs are
available: SS-11,
SL-11, SL-12, SS-41,
SL-41, and SL-42.
8XSOA is the
8xSTM1/STM4
optical access card for
MRSOE.

Unit Quantity Description

“4-Port STM-16/OC-48 (4×2.5G Sync Optical)” Front : Up to 8 fully The 4P2G5SO
(p. C-98) (4P2G5SO) equipped cards and 4 processes up to four
partially equipped cards (2 STM-16 SFP
SFPs per card) per shelf plug-ins. The
Compact: Up to 6 fully 4P2G5SO provides
equipped cards (2 SFPs four slots, each of
per card) per shelf which hosts an
STM-16 SFP optical
module. The STM-16
SFP module is
available with the
following interfaces:
SI-161, SS-161,
SL-161, and SL-162.
The 4P2G5SO can
host any of these
interfaces.
“1-Port STM-64/OC-192 (1×10G Sync Optical)” Front : Up to 8 per shelf The 1P10GSO
(p. C-109) (1P10GSOE) Compact: Up to 6 per shelf provides one slot that
hosts an STM-64 10
Gb XFP or XFP-E
optical module. The
STM-64 XFP/XFP-E
module is available
with the following
interfaces: XI-641
(XFP), XS-642
(XFP), XS-642-E
(XFP-E), and
XP1L12D2 (XFP-E).
The 1P10GSO can
host any of these
XFPs/XFP-Es.

Unit Quantity Description

“10G Packet Transport Processor” (p. C-116) (PP10G) Front : Up to 6 per shelf The 10G Packet
Compact: Up to 3 per shelf Transport Processor is
a Layer 2 data
aggregator card
capable of switching
incoming data from
two access cards
equipped with eight
SFPs or one XFP, and
traffic coming from
the matrix unit. The
card is able to
perform data
mapping, allowing
interworking between
TDM traffic and
packet-based traffic,
providing data
encapsulation
functions. This card is
ready to work with
transport protocols
(e.g. TMPLS).
In Release 4.0 and
later, the local 1xGE
interfaces (4 ports)
are no longer
managed by software.
Refer to DLP-114:
Disablement of local
1xGE interfaces on all
of the PP10G cards in
Alcatel-Lucent
1850 Transport
Service Switch
(TSS-100 and
TSS-100C) Release
4.1 (ETSI)
Maintenance and
Trouble-Clearing
Guide.

Unit Quantity Description

“1xGbE Packet Processor - Half Slot (PP10GHS)” Front : Up to 6 per shelf This card is used to
(p. C-119) (PP10GHS) Compact: Up to 4 per shelf manage data traffic.
No access card is
available for this card
(the only I/O is the
front panel optical
module). On its front
panel are present two
debug connectors
(available only for
debug purpose) and
the 10Gb/Eth XFP
optical module used
to connect the data
traffic.
The card is a
half-height card.
“24xE/FE Electrical Packet Expander” Front : Up to 12 per shelf The PE24XFE card
(p. C-122) (PE24XFE) Compact: Up to 6 per shelf routes 24x10MB
(Ethernet) or
24x100MB (Fast
Ethernet) channels to
a 10G Packet
Processor (PP10G).
The PE24XFE
provides one slot that
hosts 2 multi-pin,
multi-coupled
connectors with 12
customers lines each.
This front panel
connector requires a
custom cable to adapt
the physical interface
to the commonly used
RJ-45 connector.

Unit Quantity Description

“8XGE Packet Expander” (p. C-130) (8XGEEA) Front : Up to 12 per shelf The 8XGEEA Packet
Compact: Up to 6 per shelf Expander collects 8
SFP
10/100/1000BASE-T
- 1000BASE-X
channels and routes
them to the 10G
Packet Processor
(PP10G). The
8XGEEA provides
eight slots that host
eight GbE SFP
modules. The SFP
modules are available
with different
interfaces, and the
8XGEEA can host the
following ones:
100BASE-FX, GbE
SX, GbE LX, GbE
ZX, ETHMR.
There is a version of
the 8XGEEA that
supports the
Synchronous Ethernet
in the transmission
side.

Unit Quantity Description

“1X10GE Packet Expander” (p. C-135) (10GEEA) Front : Up to 12 per shelf The 10GEEA card
Compact: Up to 6 per shelf routes a 10GE
channel to the 10G
Packet Processor
(PP10G). The
10GEEA provides
one slot that hosts a
GbE XFP optical
module. The
XFP/XFP-E modules
are available with
different interfaces,
and the 10GEEA can
host the following
ones: 10GbE S
(XFP), 10GbE L
(XFP), and 10GbE E
(XFP-E).
“CWDM 4/8ch Mux/Demux (CMDX8)” Front : Up to 16 per shelf The CWDM system
(p. C-145) (CMDX8) Compact: Up to 8per shelf supports up to 8
channels per fiber in
the third optical
window (1550 nm).
The CMDX8 can
Mux/Demux up to 8
lambdas (channels)

Unit Quantity Description

“8-channel DWDM mux/demux - OMDX8100” Front : Up to 8 per shelf This board allows the
(p. C-147)(OMDX8100) Compact: Up to 4 per shelf system to add/drop,
to/from the WDM
line, 8 carried
wavelengths. In this
release two
OMDX8100 boards
with one 8-uple of
added/dropped
wavelengths per card
on the 16 wavelength
range (L1 and L2).
The OMDX8100 is a
double-width pack
and as such it
occupies two adjacent
slots in the access
area.
“BOOST10G - Single channel (ch 34) booster” Front : Up to 16 per shelf Single-Channel
(p. C-150)(BOOST10G) Compact: Up to 8per shelf Booster. It provides
optical amplification
for one channel (34)
for ULH applications.
This card work as
optical amplifier
(EDFA) The output
optical power is
+10dBm. It is
equipped with a
couple of LC optical
connectors. The
optical connectors are
protected by a
metallic shield. By
removing the optical
connector metallic
shield the booster
laser will be switched
off.
“Booster Amplifier - BST10GA” (p. C-138)BST10GA

Unit Quantity Description

“PRE10G - Single channel (ch 34) preamplifier” Front : Up to 16 per shelf Single-Channel
(p. C-152)(PRE10G) Compact: Up to 8per shelf Pre-Amp. It provides
optical amplification
for one channel (34)
for ULH and VLH
applications. It is
usually used in
conjunction with the
Booster
(BOOST10G).
This card work as
optical pre-amplifier,
tuned on ch 34
(1550.12 nm). The
output optical power
is -7dBm. It is
equipped with a
couple of LC optical
connectors. The
above optical
connectors are
protected by a
metallic shield. By
removing the optical
connector metallic
shield the
pre-amplifier laser
will be switched off.
“PRE10GA - PRE-AMPLIFIER (Single channel)”
(p. C-142)PRE10GA
“STM-1 electrical SFP” (p. C-154) (S1E) Up to 4 per 8PSO The STM1-Electrical
SFP is an in-service
pluggable electrical
module that provides
an STM1 Electrical
interface for an 8PSO
card. It provides a
duplex 1.0/2.3 coaxial
connector.

Unit Quantity Description

“STM-1/OC-3 SFP (Short Haul, 1310 nm)” Up to 8 per 8PSO The SS-11 is an
(p. C-156) (SS-11) in-service pluggable
optical module that
provides a short-haul,
1310 nm STM-1
interface for an 8PSO.
The SS-11 provides a
duplex LC connector
and DDM.
“STM-1/OC-3 SFP (Long Haul, 1310 nm)” Up to 8 per 8PSO The SL-11 is an
(p. C-156) (SL-11) in-service pluggable
optical module that
provides a long-haul,
1310 nm STM-1
interface for an 8PSO.
The SL-11 provides a
duplex LC connector
and DDM.
“STM-1/OC-3 SFP (Long Haul, 1550 nm)” Up to 8 per 8PSO The SL-12 is an
(p. C-156) (SL-12) in-service pluggable
optical module that
provides a long-haul,
1550 nm STM-1
interface for an 8PSO.
The SL-12 provides a
duplex LC connector
and DDM.
“STM-4/OC-12 SFP (Short Haul, 1310 nm)” Up to 8 per 8PSO The SS-41 is an
(p. C-160) (SS-41) in-service pluggable
optical module. It
provides a short-haul,
1310 nm STM-4
interface for an 8PSO.
The SS-41 provides a
duplex LC connector
and DDM.

Unit Quantity Description

“STM-4/OC-12 SFP (Long Haul, 1310 nm)” Up to 8 per 8PSO The SL-41 is an
(p. C-160) (SL-41) in-service pluggable
optical module. It
provides a long-haul,
1310 nm STM-4
interface for an 8PSO.
The SL-41 provides a
duplex LC connector
and DDM.
“STM-4/OC-12 SFP (Long Haul, 1550 nm)” Up to 8 per 8PSO The SL-42 is an
(p. C-160) (SL-42) in-service pluggable
optical module. It
provides a long-haul,
1550 nm STM-4
interface for an 8PSO.
The SL-42 provides a
duplex LC connector
and DDM.
“STM-16/OC-48 SFP (Intraoffice, 1310 nm)” Up to 4 per 4P2G5SO The SI-161 is an
(p. C-164) (SI-161) in-service pluggable
optical module. It
provides an
intraoffice, 1310 nm
STM-16 interface for
a 4P2G5SO. The
SI-161 provides a
duplex LC connector
and DDM.
“STM-16/OC-48 SFP (Intraoffice, 1310 nm)” Up to 4 per 4P2G5SO The SI-161 is an
(p. C-164) (SI-161) in-service pluggable
optical module with
extended temperature
range. It provides an
intraoffice, 1310 nm
STM-16 interface for
a 4P2G5SO. The
SI-161 provides a
duplex LC connector
and DDM.

Unit Quantity Description

“STM-16/OC-48 SFP (Short Haul, 1310 nm)” Up to 4 per 4P2G5SO The SS-161 is an
(p. C-164) (SS-161) in-service pluggable
optical module. It
provides a short-haul,
1310 nm STM-16
interface for a
4P2G5SO. The
SS-161 provides a
duplex LC connector
and DDM.
“STM-16/OC-48 SFP (Short Haul, 1310 nm)” Up to 4 per 4P2G5SO The SS-161 is an
(p. C-164) (SS-161) in-service pluggable
optical module with
extended temperature
range. It provides a
short-haul, 1310 nm
STM-16 interface for
a 4P2G5SO. The
SS-161 provides a
duplex LC connector
and DDM.
“STM-16/OC-48 SFP (Long Haul, 1310 nm)” Up to 4 per 4P2G5SO The SL-161 is an
(p. C-164) (SL-161) in-service pluggable
optical module. It
provides a long-haul,
1310 nm STM-16
interface for a
4P2G5SO. The
SL-161 provides a
duplex LC connector.
“STM-16/OC-48 SFP (Long Haul, 1550 nm)” Up to 4 per 4P2G5SO The SL-162 is an
(p. C-164) (SL-162) in-service pluggable
optical module. It
provides a long-haul,
1550 nm STM-16
interface for a
4P2G5SO. The
SL-162 provides a
duplex LC connector.

Unit Quantity Description

“STM-16/OC-48 SFP (Long Haul, 1310 nm)” Up to 4 per 4P2G5SO The SL-161 is an
(p. C-164) (SL-161) in-service pluggable
optical module with
extended temperature
range. It provides a
long-haul, 1310 nm
STM-16 interface for
a 4P2G5SO. The
SL-161 provides a
duplex LC connector.
“STM-16/OC-48 SFP (Long Haul, 1550 nm)” Up to 4 per 4P2G5SO The SL-162 is an
(p. C-165) (SL-162) in-service pluggable
optical module with
extended temperature
range. It provides a
long-haul, 1550 nm
STM-16 interface for
a 4P2G5SO. The
SL-162 provides a
duplex LC connector.
“SFP 100BASE-FX with DDM -40/+85 C” Up to 8 per 8XGEEA The OPTO TRX SFP
(p. C-169) (100B) 10/100MBE FX is an
in-service pluggable
optical module that
provides a short haul
link, 1310nm
100BASE-FX
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a duplex LC
connector. DDM is
also supported.

Unit Quantity Description

“SFP 100BASE-LX -40/+85 C” (p. C-169) (100B) Up to 8 per 8XGEEA The OPTO TRX SFP
10/100MBE LX is an
in-service pluggable
optical module that
provides a long haul
link, 1310nm
100BASE-LX
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a duplex LC
connector.
“SFP 100BASE-LX with DDM -40/+85 C” Up to 8 per 8XGEEA The OPTO TRX SFP
(p. C-169) (100B) 10/100MBE LX is an
in-service pluggable
optical module that
provides a long haul
link, 1310nm
100BASE-LX
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a duplex LC
connector. DDM is
also supported.
“1000BASE SX SFP (Short Haul, 850 nm)” Up to 8 per 8XGEEA The OPTO TRX SFP
(p. C-172) (1000B) 1.25 GbE SX DDM is
an in-service
pluggable optical
module that provides
a short-haul, 850 nm
1000BASE-SX
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a duplex LC
connector and DDM.

Unit Quantity Description

“SFP GBE SX with DDM -40/+85 C” Up to 8 per 8XGEEA The OPTO TRX SFP
(p. C-172) (1000B) 1.25 GbE SX DDM is
an in-service
pluggable optical
module with extended
temperature range
that provides a
short-haul, 850 nm
1000BASE-SX
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a duplex LC
connector and DDM.
“1000BASE LX SFP (Long Haul, 1310 nm)” Up to 8 per 8XGEEA The OPTO TRX SFP
(p. C-172) (1000B) 1.25 GbE LX DDM is
an in-service
pluggable optical
module that provides
a long-haul, 1310 nm
1000BASE-LX
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a duplex LC
connector and DDM.
“SFP GBE LX with DDM -40/+85 C” Up to 8 per 8XGEEA The OPTO TRX SFP
(p. C-172) (1000B) 1.25 GbE LX DDM is
an in-service
pluggable optical
module with extended
temperature range
that provides a
long-haul, 1310 nm
1000BASE-LX
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a duplex LC
connector and DDM.

Unit Quantity Description

“SFP GBE ZX with DDM -5/+85 C” Up to 8 per 8XGEEA The OPTO TRX SFP
(p. C-172) (1000B) 1.25 GbE ZX is an
in-service pluggable
optical module with
extended temperature
range that provides an
extra long-haul, 1550
nm 1000BASE-ZX
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a duplex LC
connector.
“SFP GBE ZX with DDM -40/+85 C” Up to 8 per 8XGEEA The OPTO TRX SFP
(p. C-172) (1000B) 1.25 GbE ZX is an
in-service pluggable
optical module with
extended temperature
range that provides an
extra long-haul, 1550
nm 1000BASE-ZX
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a duplex LC
connector.
“SFP GBE EZX with DDM -5/+70 C” Up to 8 per 8XGEEA The OPTO TRX SFP
(p. C-172) (1000B) 1.25 GBE EZX is an
in-service pluggable
optical module that
provides an extra
long-haul, 1550 nm
1000BASE-EZX
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a duplex LC
connector.

Unit Quantity Description

“SFP GBE EZX with DDM -40/+85 C” Up to 8 per 8XGEEA The OPTO TRX SFP
(p. C-172) (1000B) 1.25 GBE EZX is an
in-service pluggable
optical module with
extended temperature
range that provides an
extra long-haul, 1550
nm 1000BASE-EZX
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a duplex LC
connector.
“SFP GBE BX 1310 nm with DDM -5/+70 C” Up to 8 per 8XGEEA The OPTO TRX SFP
(p. C-173) (1000B) 1.25 GBE BX is an
in-service pluggable
optical module that
provides a
bidirectional link,
1310/1490 nm
1000BASE-BX
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a single LC
connector
“SFP GBE BX 1490 nm with DDM -5/+70 C” Up to 8 per 8XGEEA The OPTO TRX SFP
(p. C-173) (1000B) 1.25 GBE BX is an
in-service pluggable
optical module that
provides a
bidirectional link,
1490/1310 nm
1000BASE-BX
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a single LC
connector

Unit Quantity Description

“SFP 1000BASE-T Electrical(EL TRX SFP ETH Up to 8 per 8XGEEA The EL TRX SFP
MULTIRATE RJ45)” (p. C-181) (ETHMR) ETH MULTIRATE
RJ45 is an in-service
pluggable electrical
1000BASE-T
interface for an 8XGE
Packet Expander
(8XGEEA). It
provides a custom
RJ45 connector with
integrated magnetics.
“STM-64/OC-192 XFP (Intraoffice, 1310 nm)XFP 1 per 1P10GSO The XI-641 is an
I-64.1/10GBE BASE L” (p. C-184) (XI-641) 1 per 10GEEA in-service pluggable
optical module. For
TDM applications, it
provides an
intraoffice, 1310 nm
STM-64 interface for
a 1-port STM-64
module (1P10GSO).
For data applications
the OPTO TRX XFP
10 GbE L provides a
long-haul, 1310 nm
10GBASE-L interface
for a 1X10GE Packet
Expander Access
(10GEEA). It
provides a duplex LC
connector and
requires an XFP-E
adapter so that it can
be plugged into the
10GEEA or
1P10GSO.

Unit Quantity Description

“STM-64/OC-192 XFP (Short Haul, 1550 nm)(XFP 1 per 1P10GSO The XI-642 is an
S-64.2B/10GBE BASE E)” (p. C-184) (XS-642) 1 per 10GEEA in-service pluggable
optical module. For
TDM applications, it
provides an
intraoffice, 1550 nm
STM-64 interface for
a 1-port STM-64
module (1P10GSO).
For data applications
the OPTO TRX XFP
10 GbE E provides a
short-haul, 1550 nm
10GBASE-E interface
for a 1X10GE Packet
Expander Access
(10GEEA). It
provides a duplex LC
connector and
requires an XFP-E
adapter so that it can
be plugged into the
10GEEA or
1P10GSO.
“STM-64/OC-192 XFP-E (Long Haul, 1550 nm)” 1 per 1P10GSO The XP1L12D2 is an
(p. C-190) (XP1L12D2) in-service pluggable
optical module. It
provides a long-haul,
1550 nm STM-64
interface for a 1-port
STM-64 module
(1P10GSO). The
XP1L12D2 provides
two LC connectors
and DDM.

Unit Quantity Description

“XFP (10 GBASE-SR)(OPTO TRX XFP GbE S)” 1 per 10GEEA The OPTO TRX XFP
(p. C-193) (10GB) 10GB is an in-service
pluggable optical
module that provides
a short-haul, 850 nm
10GBASE-S interface
for a 1X10GE Packet
Expander Access
(10GEEA). It
provides a duplex LC
connector and
requires an XFP-E
adapter so that it can
be plugged into the
10GEEA.
“XFP-E Adapter” (p. C-198) 1 per XI-641 or XS-642 or The XFP-E adapter is
10GB required for an XFP
that is standard MSA
mechanical form
factor. It adapts an
XFP to the extended
mechanical form
factor so that it can be
inserted into the
1P10GSO or into the
10GEEA.

Unit Quantity Description

“XFP L-64.2 DWDM (CH 60/1529.55 nm)” 1 per 1P10GSO The XL-642C XFP is
(p. C-200) through “XFP L-64.2 DWDM (CH an in-service
20/1561.42 nm)” (p. C-203) pluggable optical
module that provides
a long-haul (80km),
STM-64 interface for
a 1-port STM-64
(1P10GSO) card. It
provides a duplex LC
connector.
The DWDM XFPs
operate in a
temperature range of
-5 to +70 C with a
fine stabilized DFB
LASER that enables a
100GHz spacing
WDM grid.
“SFP multi-rate up to S-16.2 CWDM (CH 47/1470 nm)” Up to 8 per 8PSO or up to The SS-162C (CH47
(p. C-205) through “SFP multi-rate up to L-16.2 CWDM 4 per 4P2G5SO - CH61) SFP is an
(CH 61/1610 nm)” (p. C-207) in-service pluggable
multi-rate optical
module that provides
a 40km, STM-16
interface for a 4-port
STM-16 (4P2G5SO)
or STM-1/ STM-4/
interface for an 8-port
STM-1/ STM-4/
(8PSO). It provides a
duplex LC connector.
“ALU XFP CWDM-LH 1471NM” (p. C-209) through 1 per 1P10GSO The XFP CWDM are
“ALU XFP CWDM-LH 1611NM” (p. C-209) in-service pluggable
optical modules that
provide CWDM
compatible
wavelength optical
signals.

Units front view

Figure 4-3 CMDX8 - 8-channel CWDM mux/demux - front view

ACRONYM SLOTS

CMDX8 Slot 25-40: Alcatel-Lucent 1850 TSS-100

Slot 15-22: Alcatel-Lucent 1850 TSS-100C
LEGEND (from top to bottom)
LED OFF means Card not equipped or Card equipped
and not provisioned or SW in boot/autotesting Hardware
GREEN LED means card properly equipped, Failure LED
Green/ provisioned and In service
Red led RED LED means card fail or card misconfigured
or card mismatch
Empty
S
Empty

Line reception input signal (DEMUX IN, from line)

Line transmission output signal (MUX OUT, to line) Empty

Above connector: CH1 INPUT. 1471nm WDM input Empty
signal, coming from transponder/colored board LINE RX IN
Below connector: CH1 OUTPUT: 1471nm WDM LINE TX OUT
output signal, sent to transponder/colored board
Above connector: CH2 INPUT. 1491nm WDM input CH1 IN
CH1 OUT
signal, coming from transponder/colored board
Below connector: CH2 OUTPUT: 1491nm WDM CH2 IN
output signal, sent to transponder/colored board CH2 OUT
Above connector: C3 INPUT. 1511nm WDM input
signal, coming from transponder/colored board CH3 IN
CH3 OUT
Below connector: CH3 OUTPUT: 1511nm WDM
output signal, sent to transponder/colored1board CH4 IN
Above connector: CH4 INPUT. 1531nm WDM input CH4 OUT
signal, coming from transponder/colored 1oard
CH5 IN
Below connector: CH4 OUTPUT: 1531nm WDM CH5 OUT
output signal, sent to transponder/colored board
Above connector: CH5 INPUT. 1551nm WDM input CH6 IN
signal, coming from transponder/colored board CH6 OUT
Below connector: CH5 OUTPUT: 1551 WDM output
signal, sent to transponder/colored board CH7 IN
CH7 OUT
Above connector: CH6 INPUT. 1571nm WDM input
signal, coming from transponder/colored board CH8 IN
Below connector: CH6 OUTPUT: 1571nm WDM CH8 OUT
output signal, sent to transponder/colored board Optical safety label
Above connector: CH7 INPUT. 1591nm WDM input
signal, coming from transponder/colored board
Below connector: CH7 OUTPUT: 1591nm WDM
output signal, sent to transponder/colored board
Above connector: CH8 INPUT. 1611nm WDM input
signal, coming from transponder/colored board
Below connector: CH8 OUTPUT: 1611nm WDM
output signal, sent to transponder/colored board

Figure 4-4 OMDX8100 - 8-channel DWDM mux/demux) - front view

ACRONYM SLOTS

Slot 25-40: Alcatel-Lucent 1850 TSS-100

OMDX8100 Slot 15-22: Alcatel-Lucent 1850 TSS-100C
Abnormal Mux inputs LED
OMDX8100 is a double-wide pack. Up to four packs can be installed in Abnormal Demux input LED
The Alcatel-Lucent 1850 TSS-100C access slots:15/16, 17/18, 19/20, 21/22. Hardware Failure LED
OMDX8100 is a double-wide pack. Up to eight packs can be installed in
the Alcatel-Lucent 1850 TSS-100 access slots:25/26, 27/28, 29/20, 31/32,
33/34, 35/36, 37/38, 39/40.
OUT MUX MON
LEGEND (from top to bottom) IN DEMUX MON

Access channels (MUX inputs/demux outputs)

MSF ON indicates signal failure at one or more of the MUX inputs CH8 IN
Yellow led (OR of the MUX INPUT ports, access side) CH8 OUT
DSF ON indicates signal failure at the DEMUX input CH7 IN
Yellow led (multiplexed signal, line side) CH7 OUT
LED OFF when the board is plugged but has not been CH6 IN
declared CH6 OUT
GREEN LED means card plugged, provisioned and CH5 IN
Green/ without failure CH5 OUT
Red led RED LED means failure due to hardware failure, power CH4 IN
supply failure or failure in communication with the board CH4 OUT
CH3 IN
MUX output monitoring port CH3 OUT
CH2 IN
DEMUX input monitoring port CH2 OUT
The above connector is the CH1 INPUT. 1546.91nm MUX input CH1 IN
193.800

CH1 OUT
signal, coming from the corresponding transponder
The below connector is the CH1 OUTPUT. 1546.91nm DEMUX EXTRA PORT IN
output signal, sent to the corresponding transponder EXTRA PORT OUT
LINE RX OUT
193.000

193.700

The same as the couple of connectors of CH1 (193.800GHz), LINE TX IN

above described, but they refer to all the other channels of the
L1 band, from CH2 (1547.71nm) to CH8 (1553.33nm)
Extra band or pass-through channels MUX input signal
(from other MUX/DEMUX)
Extra band or pass-through channels DEMUX output signal
(to other MUX/DEMUX)
MUX OUTPUT: Line transmission output signal
Optical safety label
DEMUX INPUT: Line reception input signal

ACRONYM SLOTS

BOOST10G Slot 25-40: Alcatel-Lucent 1850 TSS-100

PRE10G Slot 15-22: Alcatel-Lucent 1850 TSS-100C 2

SD
STATUS
LEGEND (from top to bottom)
(1) multi-color LED indicating Unit Status:
GREEN: Card provisioned and properly working
RED: Card fail
ORANGE: FPGA download, the unit has being configured
3
(2) yellow LED indicating Laser Status:
OFF: Laser ON (OK) 4
YELLOW: Laser OFF (Laser shutdown)
(3) optical output signal (amplified TX signal), LC connector
(4) optical input signal (RX signal), LC connector

N.B. * When the board is on firmware download state, the hardware failure LED on the
front board, ligths on orange colour. Never unplug a board while this LED is
orange. Should this occur, the board will not restart and may have to be
returned for factory repair

Figure 4-6 XFP modules and adapter

Dual fiber (unidirectional) SFP

Type ACRONYM ANSI I/F ETSI I/F Equipped on
SS-11 IR-1 OC-3 S-1.1
SL-11 LR-1 OC-3 L-1.1
SL-12 LR-2 OC-3 L-1.2
B&W 8PSO, MRSOE
SS-41 IR-1 OC-12 S-4.1
SL-41 LR-1 OC-12 L-4.1
SL-42 LR-2 OC-12 L-4.2
SI-161 SR-1 OC-48 I-16.1
SS-161 IR-1 OC-48 S-16.1
B&W 4P2G5SO, MRSOE
SL-161 LR-1 OC-48 L-16.1
SL-162 LR-2 OC-48 L-16.2
B&W SS-161AR IR-1 anyrate S-16.1 anyrate
Type ACRONYM Ethernet I/F Equipped on
B&W 100FXETH 100BASE-F
B&W 100B-LX 100BASE-L
B&W ANY-DATAS 1000BASE-S/-L/-Z 1P10GSOE, PP10G, PP10GEHS, 8XGEEA, 10GEEA
B&W ANY-DATAS 1000BASE-V
B&W ETHEMR 100/1000BASE-T (electrical SFP)
Type ACRONYM CWDM I/F Equipped on
SS-162C PIN - CWDM multirate (C8S1-1D2)
CWDM MRSOE, 4P2G5SO, CMDX8
SL-162C APD - CWDM multirate (C8L1-1D2)
Single fiber (bidirectional) SFP
Type ACRONYM Interface type Equipped on
100BX-20U 100BASE-BX, STM-1/OC-3, 20Km upstream
B&W
100BX-20D 100BASE-BX, STM-1/OC-3, 20Km downstream
8PSO, MRSOE
100BX-40U 100BASE-BX, STM-1/OC-3, 40Km upstream
B&W
100BX-40D 100BASE-BX, STM-1/OC-3, 40Km downstream
1000BX-20U 1000BASE-BX, STM-4/OC-12, 20Km upstream
B&W
1000BX-20D 1000BASE-BX, STM-4/OC-12, 20Km downstream 8PSO, MRSOE
1000BX-40U 1000BASE-BX, STM-4/OC-12, 40Km upstream
B&W
1000BX-40D 1000BASE-BX, STM-4/OC-12, 40Km downstream
SS-16U STM-16/OC-48, 15Km upstream
B&W
SS-16D STM-16/OC-48, 15Km downstream
MRSOE, 4P2G5SO
SL-16U STM-16/OC-48, 40Km upstream
B&W
SL-16D STM-16/OC-48, 40Km downstream
SFP MODULES
OPTICAL OPTICAL
ELECTRICAL BIDIR
MONODIR

RJ45
connector
Output

Input Output/Input

Figure 4-7 SFP Modules - view

Dual fiber (unidirectional) SFP

RJ45
connector
Output

Input Output/Input

Transmission architecture
Overview
The signal management architecture (Figure 4-8, “Signal architecture (functional
overview)” (p. 4-44)) has been designed to provide a flexible system, able to handle TDM
traffic and data traffic at the same time.

Figure 4-8 Signal architecture (functional overview)

OTUk WDM
WDMProcessing
Processing OTUk
STM-N/OC-N STM-N/OC-N

FE FE
GE Packet
Packet Packet
Packet GE
10GE Processing
Processing Processing
Processing 10GE
Universal
Universal
Switch
STM-N/OC-N TDM
TDM Switch TDM
TDM STM-N/OC-N
E1/DS1 Processing Processing E1/DS1
E3/DS3 Processing Processing E3/DS3

sig-arch-1

In the Alcatel-Lucent 1850 TSS-100, flexibility is obtained by means of a payload

independent switching element, the Universal Matrix MT100/MT100C. Functions that
are specific for a certain type of payload are implemented on the individual TDM and
data line cards (for example on I/O port cards for HO SDH processing).
The traffic management is performed according to the functional architecture in current
reference standards. In particular, the functional architecture reference is:
• G.783 for SDH traffic and GR253 for SONET traffic
The signal architecture consists of the following elements:
• TDM transmission architecture
• Data transmission architecture.
• OTN transmission architecture (not yet supported)

Data transmission architecture

The data transmission architecture manages pure packet-based data transmission as well
as interworking between TDM traffic and packets. It uses the functionality of the
following modules:
• 10G Packet Processor (PP10G)
• 1x10GbE Packet Processor - Half Slot (PP10GHS)
• 8XGE Packet Expander Access (8XGEEA)
• 1X10GE Packet Expander Access (10GEEA)
The 10GE Packet Processor can manage up to 10 Gb/s of traffic and supports one or two
10GE Packet Expanders (one 10GE port), or one or two 8XGE Packet Expanders (eight
10/100/1000 ports) or a mix of them (one 10GE and one 8XGE Packet Expanders).
Therefore, if both expander modules are used, the system can support interfaces up to
20GE per 10GE Packet Processor module (both 1X10GE Packet Expanders used but
carrying a total of 10 Gb/s of traffic).
The management of the Ethernet ports on these modules and the management of the
Ethernet packets into GFP frames is done by SNMP.

Table 4-1 CWDM frequencies allocation plan in C-band

Central wavelength (nm) Channel number Wavelength deviation (nm)

1471 1470 +6.5
1491 1490 ±6.5
1511 1510 ±6.5
1531 1530 ±6.5
1551 1550 ±6.5
1571 1570 ±6.5
1591 1590 ±6.5
....................................................................................................................................................................................................................................
4-46 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Product description Transmission architecture

Central wavelength (nm) Channel number Wavelength deviation (nm)

1611 1610 ±6.5

The Wavelength adapter provides two independent optical channels (CWLA3). Each
board provides four optical interfaces (B&W and/or WDM). Four different boards are
required to cover the eigth CWDM channels.
TDM (STM-16/OC-48) and DATA (1GE) boards can be equipped with CWDM SFPs.
TDM (STM-64/OC-192) and DATA (10GE) boards can be equipped with CWDM XFPs.
Each TDM board provides one optical channel. Eight different boards are required to
cover the eight channels.

DWDM transmission architecture

The following typical configurations can be provided by the FOADM system:
• n-channel Line Terminal (n = 1 to 16)
• n-channel OADM (n = 1 to 16)
Line Terminal
In Line Terminal configuration, the DWDM system connects up to 16 User optical signals
to an optical fibre WDM line. The user signals are SDH/SONET at 9.95 Gbps, and 10 GE
LAN at 10.31 Gbps, according to the board type. DWDM tributaries are SDH/SONET
and DATA units with DWDM interface (XFP), supporting 9.95 Gbps and 10.31 Gbps B
bitrates respectively. In the figure above, B&W stands for B&W tributary board.
Each WDM (tributary) output is routed to the related OMDX8100 (L1 or L2). The
multiplexed output signal of the L2 Band-OMDX8100, is connected to the extra port of
the L1 Band-OMDX8100 (9:1 mux/demux), to be multiplexed with the wavelengths of
the L1 Band, thus providing the DWDM optical aggregate signal to be transmitted to the
line (16 channels), via an optional line optical amplifier. In egress direction (WDM to
Client), the aggregate signal coming from the line (16 channels), is pre-amplified
(optional functionality) and then demultiplexed by the L1 Band DWDM 1:9 demux
(OMDX8100). It extracts both the wavelengths of the L1 Band and the L2 Band
multiplexed signal, available on the extra port. The last one is then sent to the relevant
demultiplexer, able to extract the L2 Band wavelengths. All the 16 demultiplexed
channels, belonging to the L1 and L2 Bands, are then routed to the relevant tributary, able
to perform the conversion of the received WDM optical signal, into the B&Wone to be
sent to the client. It is performed in one step, using transponders, or in two steps, as
already described.

....................................................................................................................................................................................................................................
Optical add and drop multiplexer (OADM)
The Optical Add and Drop Multiplexer is able to add and drop a part of the traffic
(wavelengths) to/from the DWDM aggregate signal, in both directions (East/West): for
this reason, all the optical transmission functions (tributaries, Mux, Demux, line
amplifiers) are duplicated.
This configuration allows the O-SNCP of the added and dropped channels (future rel.).
The user signals are SDH (STM-64) and 10 GE LAN at 10.31 Gbps, in accordance with
the board type.
In egress direction (WDM to Client), the aggregate signal coming from the line (n
channels), is pre-amplified (optional functionality) and then demultiplexed by the L1 (or
L2) Band demultiplexer (OMDX8100). It is able to drop the eight wavelengths of the L1
(or L2) Band from the line signal. The channels that are not extracted are in pass-through,
without any regeneration (express channels); they are available on the extra (output) port,
that must be connected to the extra (input) port of the multiplexer of the opposite
transmission direction
The dropped channels, are then routed to the relevant tributary, able to perform the
conversion of the received WDM optical signal, into the B&W one to be sent to the
client. It is performed in one step using transponders, or in two steps, via Matrix
cross-connection betweeen a B&W and a colored (XFP) optical unit.
In ingress direction (Client to WDM), the tributary converts the B&W input signal
coming from the Client into the coloured one; this process is performed in one step, using
transponders, or in two steps, via Matrix cross-connection between a B&W and a colored
(XFP) optical unit.
Each WDM (tributary) output is routed to the OMDX8100 (L1 or L2), to be
multiplexed/added to the channels in pass-through (express channels), connected to the
extra (input) port, thus providing the DWDM optical aggregate to be transmitted to the
line (n channels), via an optional line optical amplifier.
DWDM optical channels supported by the FOADM architecture
The DWDM system is based on the 100 GHz channel spacing in the C-band, according to
the ITU-T G.694.1 Rec. In current release, the 16 channels of the L1 and L2 bands are
supported. The optical spectrum is shown in next Table 4-2, “DWDM frequencies
allocation plan in C-band, using FOADM technology” (p. 4-49) (ITU-T standard grid). It
is anchored to the 193.1 THz reference.

Table 4-2 DWDM frequencies allocation plan in C-band, using FOADM technology

Central Central Wavelength (nm)

Channel
Band frequency wavelength deviation: ±0.12nm (EOL) @2.5Gbps
Number
(GHz) wavelength deviation: ±0.1nm (EOL) @10Gbps
193.800 38 1546.92
193.700 37 1547.72
193.600 36 1548.51
193.500 35 1549.32
L1
193.300 33 1550.92
193.200 32 1551.72
193.100 31 1552.52
193.000 30 1553.33
BLUE
BAND
192.800 28 1554.94
192.700 27 1555.74
192.600 26 1556.55
192.500 25 1557.36
L2
192.300 23 1558.98
192.200 22 1559.79
192.100 21 1560.60
192.000 20 1561.42

The Central frequency value (in GHz) is the channel name, displayed on the Craft
Terminal.
TDM and DATA units at 10Gbps are equipped with DWDM XFPs, compliant with the
DWDM 100 GHz grid. Each board provides one optical channel.
16 different XFPs, plugged on 16 different boards, are required to cover the 16 DWDM
channels/wavelengths.

Synchronization
Overview
For synchronization, the Alcatel-Lucent 1850 TSS-100 can use:
• External Building Integrated Timing Supply (BITS) from a primary or secondary E1
BITS reference and/or
• External line timing from STM-n /10GE ports - from either a primary or a secondary
line time reference
• Internal clock in free running clock mode (from an oscillator with Stratum 3 quality as
defined in Telcordia GR-1244).
The Clock Reference Unit (CRU) which is embedded in the Universal Matrix
(MT100/MT100C) selects the appropriate source out of up to two references and
distributes timing. The options for the references are:
• 2 x BITS or
• 2 x Line timing or
• 1 x BITS and 1 x line timing.
E1 BITS timing enters the system through dedicated connectors on the front of the shelf.
Line timing enters the redundant CRU on the matrix boards through the STM-n boards.

Figure 4-9 Synchronization architecture

SYNCHOUT Reference Selector
(Based on Priority/Quality)

EXTREFOUT BITS 0
2MHz
0-1 2Mbit
1.5Mbit
BITS 1
Internal
2MHz BITS 0 Clock
2Mbit
1.5Mbit LINEREFOUT
BITS 1
0-1

STM-N/OC-N
Card

EXTREF
0-1 To the NE
units
Internal
Clock

STM-N/OC-N LINEREFSYS
Card 0-1
SYNCH Reference Selector
(Based on Priority/Quality)
syncharch

Timing protection (active/standby)

Two MT100/MT100C modules per system are arranged in a 1:1 protection configuration
such that one of the CRUs functions as the active one and the other as standby. In any
operation mode, the standby CRU is phase locked to the same synchronization source
selected by the active one.
The CRU operates in an active/standby relationship as follows:
• Supports automatic switching between active and standby CRU.
• Supports manual switching between active and standby CRU. This feature is provided
by a manual switching of the MT100/MT100C.

Time of day settings

Time of day settings (TODS) which are used for example for system time displays and
event time stamps can be done either by TL1 command or they can be synchronized with
an external NTP server.

Synchronization from Ethernet interfaces/signals

ITU-T G.8262 Synchronous Ethernet (SyncE)
With Ethernet equipment gradually replacing SDH equipment in service-provider
networks, frequency synchronization is required to provide high-quality clock
synchronization over Ethernet ports. SyncE provides the required synchronization at the
physical level. Ethernet links are synchronized by timing their bit clocks from
high-quality clock signals in the same manner as SDH . Operation messages maintain
SyncE links and ensure that a node always derives timing from the most reliable source.
In SyncE the communication channel for conveying clock information (and to prevent
timing loop) is ESMC.
ITU-T G.8262 is mainly reflecting G.813 “Timing characteristics of SDH equipments
slave clocks” while Jitter/wander requirements for Ethernet come from IEEE 802.3, so
that SDH and SyncE equipments can interwork in the same synchronization network.
The output Ethernet interfaces can be locked to the local CRU (default configuration).
ITU-T G.8262 (June 2007) Synchronous Ethernet is supported by the PP10GHS. In
addition, SynchE is supported on PP10G only in Rx mode where transmission clock is
locked to system clock and SSM messaging transmitted on the interfaces, without the
possibility to use 8XGEEA or 1X10GEEA interfaces as line timing sources.
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Figure 4-10 Synchronization processing

T3/T6 Ext IN ifs

T0 selection
T1 IN from T0 internal clk
SDH/Sonet ifs
T4/T5 selection
TE IN T4/T5 Ext OUT ifs
(from SyncE ifs)

SSM processing

T0 filtering SEC T0 filtering Str 3

(SDH only) (SONET only)

Ethernet 1+1 EPS process Ethernet

Option 1 Option 2

Up to two recovered 2048 Mhz clock signals (TE IN) can be supplied to CRU by SyncE
interfaces (from any traffic ports/slots). This reference timing is used as source for T0
internal clock as well as the external reference output interfaces T4/T5. TE can be
delivered as per ITU-T G.8262:
EEC Option 1: for SDH equipments only, in compliance with ITU-T G.813 Option 1 and
ETSI prETS300462-5 (for external clock generation). T0 internal clock is based on SEC
quality level -> SSM quality indicator is coded as 1011 (G.813)
T0 filtering for frequency accuracy is done by SETG in compliance with the operational
states and the selected option:
• Free running mode (temporary state when clock is not locked to any synchronization
source). Frequency accuracy can be:
SDH (option 1): better than ± 4.6 ppm, as per G.813 Option 1
• Locked mode (steady state when clock is locked to a selected reference for T0).
Frequency accuracy can be:
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Synchronous Ethernet with SSM

The system supports handling of SSM indicator for reference timing Quality Level from
SyncE signals, by providing periodic transmission of ESMC messages carrying Quality
Level indicator, as per ITU-T G.8264 (in cooperation with IEEE).
LOESM alarm is raised when ESMC timeout is reached, to trigger cutoff of the reference
clock used as timing synchronization source for T0, thus either entering the “hold-over”
state, or selecting a different reference timing, priority based.
SyncE SSM management is supported via ESMC messages, providing two types of
message:
• Heartbit (every 1 sec.), carrying ESMC information
• Event (immediate), providing accuracy state change (e.g. Quality Level)
This behavior is similar to SDM SSM management.
Note: ESMC message provides timing info only for the SyncE reference, without
extension to phase information.
For the cards implementing SyncE interfaces, it is possible to enable forwarding ESMC
received messages to LDC per each physical interface (sink function). Sink enabled port
must also be source enabled (e.g. transmitting ESMC messages).
The operator can enable ESMC sink/source functions via TL1 commands.
Note: Currently up to six ports can be enabled for SSM management, with further
extension to all the Ethernet ports, where the extended phase info shall be applied.
The Ethernet reference source TE is automatically squelched if one of the following
conditions is met:
• ETY SSF alarm is raised on the interface is recovering the clock; it is triggered by any
layer defect
• the Ethernet interface is working in “power down” mode, if applicable
• the Ethernet interface is working in 802.3az mode, if applicable.

Control complex
Overview
The control complex consists of the processors that are needed to manage the system as a
network element. The control complex is, for example, responsible for maintaining the
integrity of the database and for monitoring its own actual condition. The monitoring
includes processors, disk system, and communication paths between the modules.

Architecture
Figure 4-11, “Control complex architecture” (p. 4-55) shows the architecture of the
Alcatel-Lucent 1850 TSS-100 control complex.

Figure 4-11 Control complex architecture

Equipment Controller
(EC100/EC100C/EC100A)

FLC

Universal Matrix
(MT100/MT100C)

SLC

DATA Unit

LDC

NOTES:
FLC = First Level Controller
SLC = Second Level Controller
LDC = Local Data Controller
Control

The Alcatel-Lucent 1850 TSS-100 control complex consists of the following levels:
• The First Level Controller (FLC)

System management
Overview
The following applications are available for the Alcatel-Lucent 1850 TSS-100 system
management:
• 1350 Optical Management System (global)
• Zero Installation Craft Terminal (ZIC)
System management is supported by the following protocols:
• Transaction Language 1 (TL1) for TDM
• CLI/SNMP for data.

Alcatel-Lucent 1350 Optical Management System

The Alcatel-Lucent 1350 OMS (global) provides a Graphical User Interface (GUI) to
enable a user to view and perform system administration for all Network Elements (NEs)
in a network, including remote Alcatel-Lucent 1850 TSS-100 systems, over TCP/IP. The
Alcatel-Lucent 1350 OMS perform provisioning, monitoring, and alarm management for
the Alcatel-Lucent 1850 TSS-100.

Zero Installation Craft Terminal (ZIC)

The system can also fully be managed from a web-based PC with no pre-installed
NE-specific craft terminal software. Typically this feature uses a web browser to provide
a connection to the NE. This connection requires logon security. Once connected, an IP
address is provided to retrieve a Java applet. A validation is made that the appropriate
revision applet is not already resident on the PC.
The following are representative (typical) characteristics of a ZIC implementation for
guidance only:
• Java applet resides on every NE
• Connecting PC is typically required to have a minimum Java Runtime Environment
loaded and configured, assuming this is the case a Java Runtime Environment
installation disk would be required
• Browser support for Netscape 7, Mozilla, and Internet Explorer 6
• Minimum Operating Systems: Windows XP SP2, Windows 2000 SP4
• Connect through Ethernet
• Connect through analog modem (typically connected through Serial Port) 56k
minimum. Also typically through HyperTerminal directed to a specific port. This
option is important for CTAC to be able to interface with a problem NE, as some
carriers do not provide access to their LAN.
• TL1 cut through for the craft interface to enable direct entry of TL1 commands
• Command Line Interface (CLI) cut through for direct command entry to provision and
manage data services
• Java Applet can also be downloaded through the LAN.
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Transaction Language 1 (TL1)

Transaction Language 1 (TL1) commands can be entered directly through the following:
• a Telnet session
• the TL1 console tool of the ZIC interface
• the TL1 Direct Access Terminal (TL1DAT) capability of the Alcatel-Lucent 1350
Optical Management System
• the TL1 cut-thru capability of the Alcatel-Lucent Alcatel-Lucent 1350 OMS .
For a list of TL1 commands supported by the Alcatel-Lucent 1850 TSS-100, refer to the
Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and TSS-100C) Release 4.1
(ETSI) TL1 Command Guide for MSPP.

Customer interface port

You can connect directly to an Alcatel-Lucent 1850 TSS-100 through the customer
interface port on each of the two Universal Matrix (MT100/MT100C) modules using a
point-to-point connection from a PC. The customer interface port is designed as an RJ-45
connector and is labeled CT, see Figure 4-12, “Universal Matrix (MT100/MT100C)
RJ-45 customer interface port” (p. 4-59).

Management ports
Two redundant management ports on each of the two MT100/MT100C cards can be used
to connect the Alcatel-Lucent 1350 OMS through a bridged LAN. The management ports
are RJ-45 connectors and are labeled M, see Figure 4-12, “Universal Matrix
(MT100/MT100C) RJ-45 customer interface port” (p. 4-59).
For a more detailed description of the MT100/MT100C, refer to the Unit Data Sheets
(UDS) section of this manual.

Figure 4-12 Universal Matrix (MT100/MT100C) RJ-45 customer interface port

DBG
Port
RJ-45 customer
CT

1
interface port
M

Management ports
M

3
DS

STATUS
DS

EPS

DBG
RS-232

IDM

PKT

850-0096-1
200707

Powering and grounding

Central office battery connections
The system requires -48 V dc primary office power. Central Office (CO) battery A and
battery B power connections are required for each rack.
For a complete description of the connections required for office power, refer to the
Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and TSS-100C) Release 4.1
(ETSI) Installation Guide and Alcatel-Lucent 1850 Transport Service Switch (TSS-100
and TSS-100C) Release 4.1 (ETSI) Turn-Up and Commissioning Guide. The power
requirements for selected racks are as follows:

Power protection scheme

The system uses a 1:1 power protection scheme. The rack power inputs come from two
independent battery plants, A and B. The power inputs feed directly to a rack-mounted
TRU with Bypass Extension for ETSI installations. Each power input has a battery lead
and a battery return. Each feeder input battery return is isolated from the battery return of
other feeder inputs and also from frame ground.

System grounding
For information on system grounding, refer to Alcatel-Lucent 1850 Transport Service
Switch (TSS-100 and TSS-100C) Release 4.1 (ETSI) Installation Guide and
Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and TSS-100C) Release 4.1
(ETSI) Turn-Up and Commissioning Guide.

Overview
Purpose
This chapter describes the operations, administration, and maintenance (OAM) functions
for the Alcatel-Lucent 1850 TSS-100.

Contents

Operations 5-2
Software management 5-2
Database management 5-4
In-band/In-fiber management 5-6
Administration 5-8
Security 5-8
Network management 5-13
Maintenance 5-15
Loopbacks 5-15
Data communication channel (DCC) 5-19
Diagnostics 5-24
Protection switching 5-25
Link aggregation group (LAG) 5-46
Performance monitoring 5-53
Housekeeping 5-57
Alarms and reports 5-57
Ethernet Link OAM IEEE 802.3 Clause 57 5-59
Ethernet Service OAM IEEE 802.1ag 5-62

Operations

Overview
Purpose
This section describes the software and database management operations for the
Alcatel-Lucent 1850 TSS-100.

Contents

Software management 5-2

Database management 5-4
In-band/In-fiber management 5-6

Software management
Software management operations
The First Level Controller (FLC) in Alcatel-Lucent 1850 TSS-100 which is located on the
Equipment Controller (EC100/EC100/EC100A), provides two independent software
storage areas. One storage area holds the active system and application software, the other
storage area holds the standby system and application software.
Software management supports the following operations:
• Initial software download
• In service software upgrade, including activation of new software
• Software download from a remote file server
• Revert to old software version
• Delete an old software version
• Retrieve the firmware version and software version of the software running on the
NE.
Most of these operations require administration privileges. For additional details, refer to
the Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and TSS-100C) Release 4.1
(ETSI) TL1 User Provisioning Guide.

In-service upgrade
The software can be upgraded from the previous release software while in service without
impact to existing connections. The upgrade consists of two steps, downloading the
software and activating it. The system checks whether the old and new software version
are compatible with respect to the supported release upgrade path. Otherwise the upgrade
will fail. The whole content of the database, including all provisioning data, but excluding
historical performance monitoring data, alarm data and the event log, are preserved
during an in-service upgrade.
The In-Service Upgrade (ISU) feature is an automatic procedure limiting as far as
possible human intervention during the upgrade of a NE between two releases. The
procedure is designed to make the user aware of the consequences on the traffic of the
upgrade. In particular, the ISU procedure exploits equipment and facility protections in
order to minimize the traffic hit. The ISU procedure is considered “hitless” on a
cross-connection if the cross-connection itself or all its parent entity (HO xc, STMn,
STM1e) are protected and protection is available. In this scenario, a target traffic hit of
60ms (detection + switch) on the connection is admitted. In case traffic is not protected,
the traffic hit depends on the involved board, facility and the release being upgraded.
The ISU procedure makes all the relevant checks to verify whether the configured
protection groups can assure a “hitless” upgrade of the NE. In case the check fails the
user is warned of the possible consequences of the upgrade.
The ISU procedure performs the upgrade of protectable cards in the following order:
1. EC100/EC100C/EC100A
2. MT100/MT100C
3. E1/DS1
4. E3/DS3 Sx
5. E3/DS3 Dx
6. Electrical STM1
A check is performed also on the protection availability and status of
EC100/EC100C/EC100A, MT100/MT100C, E1/DS1 and E3/DS3 cards. The complete
procedure includes the following steps:
• Check of all the protection availability and status (with warning in case of fail).
• Active database backup.
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• Upgrade to the new database.
• Remove of the old database backup.
The ISU procedure upgrades the protection card first, then upgrades each single protected
card. During this phase the traffic is switched to the protection card while the first
protected card is being upgraded. The upgraded unit is continuously polled to check
whether it is upgraded. After the protected card is upgraded, if:
• The protection is revertive, traffic is automatically restored on the upgraded protected
card and the procedure steps forward to the next protected card in the same protection
group.
• The protection is non-revertive, the procedure steps forward to the next protected card
and consequently the traffic currently on the protection card is switched back to the
upgraded working card.
After the EPS protected cards are upgraded, the ISU procedure performs the upgrade of
SONET/SDH line cards, exploiting the facility protection groups provisioned. Finally,
data cards are upgraded, possibly exploiting the LAG as a protection mechanism. If the
upgrade of one of the cards fails, the upgrade process is not stopped and, after the
conclusion of the upgrade process, the card is declared out of service.

Software download from a remote file server

Software download from a remote file server to the NE modifies the standby storage area.
Any previous content of the standby storage area is overwritten by the remote file transfer
operation.

Database management
Database types
The Alcatel-Lucent 1850 TSS-100 is shipped with a factory default database. When
provisioned, it maintains all its configuration data, alarm states and conditions in a
volatile memory database. Additionally, two non-volatile backup databases are
implemented, the primary backup database and the secondary database. These
non-volatile databases are maintained either implicitly by the NE during its normal
operation, or explicitly by operator commands.

Figure 5-1 Database management

Remote File Server

TL1 interface
RFS

CPU

Memory
DB

Factory Primary Secondary

Default DB Backup DB Backup DB

Implicitely by NE

By TL1 command
850-5087

Database operations
Database management supports the following operations:
• Backup database.
• Restore database at restart, after a power failure or triggered by an operator command.
• Reset memory and primary database to the factory default database.
• Transfer locally stored database to and from a remote file server (see next figure).
• Initiate autonomous reports for all changes of the provisioning database, primary state
changes, equipment installation or removal, equipment, or facility failure or recovery.
The next figure shows the architecture for file transfer.

Figure 5-2 Architecture for file transfer

OS TL1 command and messages

TL1 Agent

FTP
command

FTP control and data

FTP Client
File data

Disk

RFS NE

Most of these operations require administration privileges. For details refer to the
Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and TSS-100C) Release 4.1
(ETSI) TL1 User Provisioning Guide.
In case of a redundant First Level Controller (FLC) configuration in the NE, the system
assures database consistency between the active and the standby controller, without any
operator interaction.

In-band/In-fiber management
Overview
The in-band/in-fiber management channel over Ethernet interfaces has the same
properties of management channels over SONET/SDH DCC. A sort of DCC transparency
is supported for this kind of management channel. It is not possible to create more than
one management channel on one single Ethernet interface.
The only configuration needed for this feature is the creation of an EVPL service between
two interfaces specifying the VLAN ID of the management channel. In this case there is
no need to create the DCC via the ent-netif command, but only the ETS connection,
since the NE is not aware that the VID is the management VID. The same VLAN used for
in-band/in-fiber management cannot be used for data traffic; the VLAN is to be devoted
only to Management.
Configuration of the management channel is performed by TL1 via the ent-netif
command, for example, ent-netif::gbe-1-1-25-1::::enable=y. This would
create an in-band management channel over an Ethernet interface with VLAN=4094
(default value). To change the VLAN the ed-netif command must be used.

Administration

Overview
Purpose
This section describes the various security features that the Alcatel-Lucent 1850 TSS-100
provides to monitor and control access to the system via TL1 commands, Zero
Installation Craft (ZIC) interface or Command Line Interface.
User login security controls access to the system on an individual user basis by means of
• User privileges and user attributes
• Login ID and password assignment
• User ID and password aging
• Auto-logout
• Security event log and autonomous messages.

Contents

Security 5-8
Network management 5-13

Security
User privileges
Two levels of user privileges with different permissions are supported:
• User access privileges (UAP)
User access privileges provide the common permissions to establish a session with the
NE (logon), change own user password, obtain own user information, retrieve system
wide user security attributes, retrieve command privilege partitioning, and terminate
the session (logoff).
• Security administration privileges (UAP including SEC)
Security administration privileges provide the extended permissions (for example for
a system administrator) to perform all security functions as to entering a user, editing
user security parameters, deleting users, canceling a user session, inhibiting an
existing user or allowing an inhibited user, and editing command privileges.

Login ID and password assignment

To access the system, the user must enter a valid login ID and a password. The password
is a case-sensitive string with 8 to 12 alphanumeric characters with specific requirements.
For additional details, refer to the Alcatel-Lucent 1850 Transport Service Switch (TSS-100
and TSS-100C) Release 4.1 (ETSI) TL1 User Provisioning Guide.
The Alcatel-Lucent 1850 TSS-100 allows up to 512 login IDs and passwords. The
number of simultaneous active sessions per user ID is limited to 1 per management
interface (ZIC, TL1, and CLI). Ten concurrent user sessions are supported.

Table 5-1 Default user profiles

Default Users
USER05 ALCATEL EML001 EML002
Default CONF CONF CONF CONF
User NETADMIN NETADMIN NETADMIN NETADMIN
Security
SEC SEC SEC SEC
Privileges
PROV PROV PROV PROV
READ READ READ READ
NOTMOUNT DEBUG NOTMOUNT NOTMOUNT
NOTMOUNT

User ID and password aging

The following aging processes provide more means of monitoring and controlling access
to the system:
• Login aging deletes individual logins if unused for a pre-set number of days
• Password aging requires that users change passwords periodically.

RADIUS authentication for user logins

The NE supports RADIUS (Remote Authentication Dial In User Service) User Access for
data management security.
RADIUS is a protocol for carrying information related to Authentication, Authorization
and Accounting (AAA) between a Network Access Server (NAS) which desires to
authenticate its links and a shared Authentication Server (RADIUS server).
When the NE is configured to use RADIUS for user authentication, the local DB is
always firstly checked; if the user is found in the local DB, no attempts are made through
RADIUS authentication.

RADIUS packet types

When the network element is provisioned to use Remote Authentication Dial In User
Service (RADIUS) authentication for user logins, any user login triggers the network
element, if the maximum number of attempts is not reached, to query the designated
RADIUS server(s) and act on the response.

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Access-Request
The network element (RADIUS client) sends a RADIUS Access-Request packet to the
RADIUS server via the IP network. The Access-Request packet contains the User-Name,
User-Password, and the network element IP address. The User-Password is hidden
(encrypted).
When the RADIUS server receives the Access-Request packet, it validates the sending
RADIUS client. A RADIUS client and server must have a provisioned shared secret (the
password shared between the RADIUS client and server). If the shared secret is not valid,
the Access-Request packet is silently discarded without sending a response. If the shared
secret is valid, the RADIUS server searches the user database. If the username is found
and the password is correct, the RADIUS server returns an Access-Accept packet to the
RADIUS client.
The shared secret key is an ASCII string between 5 to 32 characters. The secret key must
be encrypted on the NE using Data Encryption Standard (DES) and Advanced Encryption
Standard (AES).
Three cases can occurs during a RADIUS Authentication Login procedure:
• Authentication Login Success: If a secret is shared between client and server and the
username is found and the password is correct, the RADIUS server responds with an
Access-Accept to the Access-Request.
• Authentication Login Failed: If a secret is shared between client and server and the
username or password are incorrect, the RADIUS server responds with an
Access-Reject to the Access-Request.
• Authentication Login No Response: If no response is received from RADIUS server,
due to “shared secret” not configured or loss of communication, Access-Request from
client is retransmitted until time-out for response is reached. After the time-out
expires, the RADIUS server responds with an Access-Reject to the Access-Request.
Access-Accept
The Access-Accept packet informs the RADIUS client that the user’s login attempt is
authenticated and authorized. No further local validation is required.
Access-Reject
The Access-Reject packet informs the RADIUS client that the user’s login attempt is
rejected due to invalid username and/or password.
No response
If no response is returned within approximately 5 seconds to the RADIUS client, the
Access-Request packet is re-sent one time. If the retry to the primary RADIUS server
fails, the RADIUS client sends the Access-Request packet to the secondary RADIUS
server (if provisioned).

Logical port / Physical port access control

Alcatel-Lucent 1850 TSS-100 supports the ability to shut down a logical or physical port
(like the local CIT port) to prevent a local hacker/intruder from gaining access to the NE.
Physical ports
When the NE is in SECURE mode, the user can enable/disable all of the physical ports,
(except F interfaces). The physical ports include the LAN and the serial debug ports.
Physical port access control is provided through the SET-ATTR-SECUDFLT and ED-LAN
TL1 commands.
Logical ports
Changing the NE configuration from UNSECURE or SECURE mode or vice-versa, the
user can enable/disable any logical port that can be accessed by the user (for example,
TCP/IP port).
• The 1123, 3082, and 3083 ports are closed (OFF) and the following ports are open
(ON):
– 6084 and 6085 (TL1)
– 6086 (CLI)
– 443 (HTTP)
– 161 (SNMPv3)
• When the NE is in UNSECURE mode, the following ports are open (ON):
– 3082, 3083, 6084, and 6085 (TL1)
– 1123 and 6086 (CLI)
– 80 and 443 (HTTP)
– 161 (SNMPv2 and SNMPv3)

DHCP management
To support the capability of the NE to act as DHCP server for a local ZIC connection, the
Dynamic Host Configuration Protocol (DHCP) can be enabled/disabled by assigning a
dynamic IP address to the ZIC client.
DHCP management is provided via the SET-ATTR-SECUDFLT TL1 command.

Auto-logout
A user will be logged out and disconnected autonomously after a provisionable period of
time when the session has not been active.

Security event log and autonomous messages

The system provides a retrievable security event log with a circular recording mechanism
for recording specific events, for example, logins or modification of security attributes
and access control as well as intrusion attempts for security audits. The security event log
is stored in a non-volatile memory.
Besides the security event log, the system sends autonomous messages at certain events,
for example to the user just before a user's session is terminated or when the password is
expiring, or to the system administrator to report a successful user login or an invalid
attempt to log in.

Network management
T-TD Gateway
The system supports a TL1 Translation Device to translate TL1 over TCP to TL1 over
OSI. This encompasses TARP initiator and responder roles.

TARP
The system supports an application layer protocol for name resolution via TID address
resolution protocol (TARP). The system implements TARP responder and propagator
roles.
TL1 uses the TID to define the destination of a command, but the connectionless network
protocol (CLNP) uses the NSAP address to define the destination of a TL1 message. In
order to send a TL1 message in a network using CLNP at layer 3, the TID must be
converted into the appropriate NSAP address. The TID addresses are mapped to NSAP
addresses through automatic network provisioning (TARP feature). For TID routing
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translation, TIDs and NSAPs are associated in pairs and are cached in the TARP CACHE.
The TARP CACHE is essentially the TID-NSAP look-up table. The TARP cache is
populated automatically as a result of TARP protocol's functionalities.

Maintenance

Overview
Purpose
This section describes the maintenance philosophy of the Alcatel-Lucent 1850 TSS-100.

Contents

Loopbacks 5-15
Data communication channel (DCC) 5-19
Diagnostics 5-24
Protection switching 5-25
Link aggregation group (LAG) 5-46
Performance monitoring 5-53
Housekeeping 5-57
Alarms and reports 5-57
Ethernet Link OAM IEEE 802.3 Clause 57 5-59
Ethernet Service OAM IEEE 802.1ag 5-62

Loopbacks
Overview
This section describes the loopbacks that the Alcatel-Lucent 1850 TSS-100 can perform.
Loopback definition
A loopback is a troubleshooting test in which a signal is transmitted through a port unit to
a set destination and then returned to the originating port unit. The transmitted and
received signals are measured and evaluated by the user to ensure that the received signal
is accurate and complete when compared to the originating signal.
Loopback types
Both transparent (the signal being looped back is also forwarded to destination) and
not-transparent (AIS signal is forwarded towards the destination) are supported.

Figure 5-3 Facility loopback

Internal signals to
Equipment to perform and from other
the framing equipment in the NE

R AIS

Unused outgoing
and incoming
signals

Downstream Direction

850-0124-1
060607

Terminal loopbacks
In a terminal loopback, the signal that is about to be transmitted is connected to the
associated incoming receiver.

Figure 5-4 Terminal loopbacks

Internal signals to
Equipment to perform and from other
the framing equipment in the NE

Unused outgoing
and
incoming signals

T
AIS
Downstream Direction

850-0125-1
060607

Cross-connect (or matrix) loopbacks

A basic Matrix loopback is established by cross-connecting a port to itself through the
fabric. A special type of Matrix loopback is established where path selectors are involved.
The next figure depicts a Matrix loopback at the drop of a 2-Way protected connection.

Figure 5-5 Cross-connect (or matrix) loopbacks

Loopback of Both Paths
at the Selector

T R

Internal signals to
Preferred
and from other
equipment in the NE

T
Unused
outgoing and
Add
incoming
Drop
signals

AIS R

Preferred
Downstream Direction

R T
850-0126-1
060607

Matrix loopbacks are not dropped when the channel in loopback is switched due to line
facility or equipment protection switches.
Ethernet OAM 802.3 Clause 57 link loopback
The system supports IEEE 802.3 Clause 57 - Section 57.2.11 active and passive mode
Link OAM loopback. An OAM entity can initiate or respond to loopback requests with
compatible link partners. In Active mode, a port can send a loopback command or
respond to a loopback request from the remote end using loopback control OAMPDUs. In
the Passive mode, a port can only respond to a loopback request from the remote end. The
loopback routes frames received from the line back to the transmit direction. In loopback
mode, every frame received is transmitted back on that same port except for OAMPDUs
and pause frames. This helps you ensure the quality of links during installation or when
troubleshooting.
The periodic exchange of OAMPDUs must continue during loopback state to maintain
the OAM session. The loopback command is acknowledged by responding with an
Information OAMPDU with the loopback state indicated in the state field. Monitoring
associated with the loopback can be done at the originating end of the link allowing tests

Data communication channel (DCC)

Overview
DCC is the embedded overhead communications channel in the synchronous line, used
for end-to-end communications and maintenance. The DCC carries alarm, control, and
status information between network elements in a synchronous network.

Provisioning
By default, the DCC is enabled on ports supporting DCC. DCC communications can be
enabled or disabled on each port independently.
The ent-netif TL1 command creates a network interface on a specified DCC channel
on an OCn/STMn or Ethernet port for data communication purposes. The network
interface can be provisioned on the line or section or data DCC of the specific
OCn/STMn or Ethernet facility. The DCC is identified by means of the OCn/STMn or
Ethernet AID and the DCC channel (DCCCHNL) parameter. DCC channel specifies
whether the DCC is a Line/MS DCC or a Section/RS.
The system supports generation/termination of up to 16 DCCs (8 Section DCC plus up to
8 Line DCC) for each slot. A maximum of 182 DCC channels (86 line and/or 96 section
DCC) can be provisioned.
• The 8PSO module supports up to 8 each line and section DCC channels to the
backplane.
• The 4P2G5SO module supports up to 4 each line and section DCC channels to the
backplane.
• The 1P10GSO module supports 1 line and 1 section DCC channel.
• The 16XSEA module supports 16 line and 1 section DCC channel.

DCC transparency
DCC transparency allows the DCN of one provider to be transparently extended through
the Alcatel-Lucent 1850 TSS-100 SDH network of another provider with no termination
or processing.
DCC cross-connection provides the DCC transparency functionality. The “enter overhead
channel cross-connection” (ent-ovhccrs) TL1 command performs cross-connection
between channels defined by overhead bytes of the OC-n/STM-n frame or by a specific
VLAN for data DCC. Overhead channels addressed by this command are: Data
Communication Channel of the (Regenerator) Section (D1-D3); Data Communication
Channel of the Line/Multiplex Section (D4-D12). DCC cross-connection has to be
performed between homogeneous channels, that means between channels of the same
layer: regenerator section DCC with another regenerator section DCC; multiplex section
DCC with another line/multiplex section DCC.
For example, in Figure 5-6, “DCC transparency” (p. 5-21), the DCN of Provider 1 is
transparently extended through the SONET/SDH network of Provider 2 (based on
TSS-100 nodes) without interworking with the Provider 2 DCN.

Figure 5-6 DCC transparency

Provider 2 Provider 1
LAN DCN LAN DCN

LAPD/PPP LAPD/PPP
forwarding Provider 2 forwarding LAN
LAPD/PPP
forwarding
Provider 1 NE1.1 NE1.2 Provider 1 NE1.n

LAPD/PPP “connection”

Network DCC configurations

In this context, the term network configurations refers to ring interconnection
configurations and to DCC configurations.
The Alcatel-Lucent 1850 TSS-100 supports single and dual node ring interconnection
between SNCP rings, between MS-SPRing rings, or in mixed scenarios with SNCP rings
interconnected with MS-SPRing rings.
DCC configurations
The following figures show as examples different common DCC configurations.

Figure 5-7 DCC IP ring

Figure 5-8 DCC mixed IP/OSI ring

Figure 5-10 DCC connecting OSI rings

Diagnostics
Autonomous diagnostics
Autonomous diagnostics are continuous, periodic, or event driven. They detect and report
system hardware and software faults, independent of whether the failed module or unit is
in an active or standby mode, they isolate their source, and cause automatic transparent
transfer of service to a redundant unit.
Autonomous diagnostics comprise:
• Equipment protection switching diagnostics
• Communication bus diagnostics
• Card presence and fault indication signal diagnostics
• Database operation and monitoring diagnostics
• Autonomous module diagnostics including self tests.

Digital Diagnostic Monitoring

DDM status parameters
The following DDM monitoring parameters are displayed, if available.
• Laser Bias Current (milliamperes)
• Optical Power - Receive (dBm)
• Optical Power - Transmit (dBm)
• Temperature (Celsius)
• Calibration (interpretation of the raw DDM data stored on pluggable transmission
module)
• Power Supply Voltage (Volts)
XFPs P/N 1AB217280004 (40 Km reach) and 1AB217280003 (80 Km reach) support
Enhanced DDM. This allows to provide Rx power reading precision with ±1dB accuracy,
in order to detect intrusion in optical line by unauthorized users. This feature is supported
only when provisioned as STM-64.
Enhanced DDM
The enhanced DDM monitoring parameters are:
• Drift generated by module case temp changes (±0.5 dB)
• Drift generated by changes in bias supplies provided to the module (±0.5 dB)
• Drift generated by module ageing (±0.5 dB)
• Inaccuracy generated by noise (±0.3 dB)

Protection switching
Overview
Protection switching provides an automatic recovery mechanism when a fault is detected
in the Alcatel-Lucent 1850 TSS-100.
The following protection types are supported:
• Equipment protection
• Facility protection

Equipment protection
Equipment protection is supported on the Alcatel-Lucent 1850 TSS-100 for the following
modules:

Table 5-2 Protection switch characteristics per module

Protected Equipment Protection Number of Protection Protection

Modules Scheme Sources Mode
Equipment Controller automatic/ 1 Non-revertive
(EC100/EC100C/ manual ( 1:1)
EC100A)

Protected Equipment Protection Number of Protection Protection

Modules Scheme Sources Mode
Universal Matrix automatic/ 1 Non-revertive
(MT100/MT100C) with manual (1:1)
clock functions and
HO/LO Matrix
Main shelf power supply load-sharing 1 Non-revertive
and filter protection (1:1)
(POW100/POW100NS)
56-Port E1/DS1 automatic/ N = 1 to 7 revertive
Multiplexer (E1DS1M) manual ( 1:N)
28-Port E1 Access automatic/ N = 1 to 7 revertive
(E1UAC) manual (1:N)RX
and TX
interfaces are
connected to a
E1DS1M or
through the
E1DS1PAC to a
E1DS1M
24-Port E3/DS3/EC1 automatic/ N = 1 to 3 revertive
Multiplexer + TMUX manual (1:N)
(E3DS3TM)
12-Port DS3/EC1 Access automatic/ N = 1 to 3 revertive
(12XDS3AC) manual
(1:N)DS3
channels are
connected to the
working
E3DS3TM or
through the
E3DS3PAC to
the protected
E3DS3TM

Protected Equipment Protection Number of Protection Protection

Modules Scheme Sources Mode
12-Port E3 Access automatic/ N = 1 to 3 revertive
(12XE3A) manual
(1:N)DS3
channels are
connected to the
working
E3DS3TM or
through the
E3DS3PAC to
the protected
E3DS3TM
8-Port OC-3/OC-12 single and 1:1 revertive
(8PSO)(8×155/622M Sync dual-ended
Optical) automatic
protection
switching (APS)
signal
processing
4-Port OC-48 single and 1:1 revertive
(4P2G5SO)(4×2.5G Sync dual-ended
Optical) automatic
protection
switching (APS)
signal
processing
1-Port OC-192 single and 1:1 revertive
(1P10GSO)(1×10G Sync dual-ended
Optical) automatic
protection
switching (APS)
signal
processing

SDH protections
• MSP (Multiple Section linear trail Protection)
The characteristics parameters for MSP are listed in the following table.

Architecture type 1 + 1 MSP 1 : N MSP (not supported)

Switching type UNIDIR / BIDIR BIDIR
Operation type Non Revertive Revertive
WTR time Selectable Selectable
HO time Selectable Selectable
Switching time < 50 ms
Signal switching SF, SD
criteria
External commands all the operator commands as per G.841
Supported interfaces STM-1 / STM-4 / STM-16 / STM-64

• Subnetwork Protections (SNCP)

Architecture type SNCP/I SNCP/N

Switching type UNIDIR, single ended
Operation type Revertive / Non Revertive
WTR time Selectable
HO time Selectable
Switching time < 50 ms
SSF, ExBER, TIM,
Signal switching criteria AU-AIS, AU-LOP
UNEQ, SD
External commands all the operator commands as per G.841
Applied to TU12; TU3; AU4; AU4-4c; AU4-16c; AU4-64c

SNCP architecture. A 1+1 bi-directional SNCP consists of one 1:2 bridge and one 2:1
selector. "Bi-directional SNCP" is related to bi-directional transmission via sub
network connection and not to the operation of the protocol. SNCP switches are
unidirectional, i.e. each end switches independently from the other end. 2:1 selector
and 1:2 bridge are setup and deleted by XC provisioning operations, via
ENTCRSPROT and DLT-CRSPROT commands. It is also supported to convert an
unprotected XC into a protected one and vice versa (commands CNVT-CCTPR and
CNVT-CCTU).
A SNCP bridge permanently output the received Normal VC-n signal onto a Working
(Protected) VC-n connection and a Protection (Protecting) VC-n connection
A SNCP selector contains a protection switch selector which output as Normal VC-n
signal the VC-n signal received via either Working or Protection connection. The
selector is controlled by the protection switch control process, able to determine the
connection to forward the VC-n.
The working/protection tributary assignment is provisionable as part of
cross-connection provisioning, and the active/stand-by tributary selection dynamically
changes according to the protection switch state. Note: the terms “working tributary”
and “protection tributary” correspond to the terms "preferred path" and "alternate
path" of the UPSR section.
A SNCP selector contains a hold off timer and, in revertive operation, a wait to restore
timer.
Two arbitrary tributaries, within the HO / LO path layer are selectable for the HO /
LO SNCP. At creation time, the SNCP supports assignment of a working and a
protection label for the two tributaries within the SNCP. Individual
working/protection labelling per SNCP is necessary to provision one route as working
and the other route as protection, in case of revertive operation.
The NE supports both 1+1 bi-directional SNCP and 1+1 uni-directional SNCP.

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The following SNCP HO path rates are supported: VC4-64c; VC4-16c; VC4-4c; VC4.
Tthe following SNCP LO path rates are supported: VC3; VC12.
The SNCP protection operation type can be revertive or non-revertive:
– With revertive protection, service returns to the working tributary after the
condition that led the switching to the protection tributary has been cleared
– With non-revertive protection, active/stand-by tributary assignment in the group is
maintained after the condition that led the switch to the protection tributary has
been cleared.
The SNCP protection switching type is uni-directional, meaning that both ends of a
bi-directional sub network connection are controlled independently of each other.
In case of revertive switching, if the VC is selected from the protection tributary due
to a fail or degrade condition on the working tributary and this conditions clears, then
the WTR timer is started. When the timer expires, the selector is switched back to the
preferred working state.
The system supports SNC/I (default, for VC SNCP) and SNC/N protection type.
SCN/N protection is only allowed if the ingress NIM (POM) function of the related
AUn/TUn is enabled.
The system supports the following external switch commands:
– Clear (Clr) - clears an active external switch command, and the WtR timer (if
active)
– Lockout of Protection (LO) - the working tributary is requested to be active
– Forced Switch to Working (FSw-W) - the working tributary is requested to be
active
– Forced Switch to Protection (FSw-P) - the protection tributary is requested to be
active
– Manual Switch to Working (MSw-W) - the working tributary is requested to be
active
– Manual Switch to Protection (MSw-P) - the protection tributary is requested to be
active.
Protection Switch States depend on the active tributary (Working or Protection) and
the switch type (Locked Out, Forced Switched, Failed, Degraded, Manual Switched,
No Request or Wait to Restore). Taking into account the possible combinations, the
following protection switch states are defined:
– W,LO (Working, Locked Out) - the working tributary is active and the group state
is Locked Out
– W,FSw (Working, Forced Switched) - the working tributary is active and the group
state is Forced Switched
– P,FSw (Protection, Forced Switched) - the protection tributary is active and the
group state is Forced Switched
– W,SF (Working, Signal Failed) - the working tributary is active and the group state
is Signal Failed

Architecture type 2F
Switching type BIDIR
Operation type Revertive
WTR time Selectable
HO time Selectable
Switching time < 50 ms
External commands all the operator commands as per G.841
Applied to STM-16 / STM-64

• Drop & Continue

It is an architecture to connect sub-networks, in order to improve traffic availability
• Collapsed single node ring interconnection
It is an architecture to connect sub-networks, in order to improve traffic availability
with hardware resource reduction (four nodes collapse in one node).

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DATA protections
Bidirectional 1:1 linear trail protections (T-MPLS protection at Tunnel level)
Protection switching is based on a specific APS protocol, defined in
• G.8131 (linear protection) for T-MPLS
APS information is exchanged using a OAM communication channel as defined in
• ITU-T G.8114/Y.1373 for T-MPLS
T-MPLS protection switching is analogue to the existing schemes for other transport
technologies (e.g. SDH).
T-MPLS supports bidirectional 1:1 linear trail protection for Tunnel; it is depicted in
Figure 5-11, “Bidirectional 1:1 linear trail protection for Tunnel” (p. 5-33)
1-phase APS protocol is supported, revertive switch only is implemented.
In 1:1 architecture a protection connection is dedicated to each working connection.
The normal traffic is transported either on the working transport entity (tunnel) or on the
protection transport entity using a selector bridge at the source of the protected domain.
At the sink of the protected domain the entity that carries the normal traffic is selected.
In case of failure, protection switching is performed by the selective bridge at the source
of the protection domain: both directions of the connection are switched to protection.
The APS protocol coordinates source and sink bridge. The service always returns to (or
remain on) the working connection as soon as the switch requests are ended.
Sum of the main features of the Trail protection: end-to-end protection architecture:
• 1-phase APS protocol: the communication between the two ends of the protected
domain, e.g. A and Z, is only in one phase, from Z to A or A to Z.
• Bi-directional switching type: both directions of the connection are switched to
protection. APS protocol is required to coordinate the two endpoints
• Revertive: service will always return to the working connection if the switch request
is terminated.
Switching criteria. The following APS switch initiation criteria are available:
• Externally initiated commands, by operator:
– Clear
– Lockout of Protection (LO)
– Forced Switch (FS)
– Manual Switch (MS)
• Automatically initiated command associated with a protection domain:
– Signal Fail (SF)
– Signal Degrade (SD, detected on CV/CCM, received FDI..))

Figure 5-11 Bidirectional 1:1 linear trail protection for Tunnel

A Z SF
working A Z
working
protection X
protection
APS
selector bridge selector 1 2 APS
selector bridge selector
working working
protection protection
APS APS
selector selector bridge selector selector bridge

SF
A Z A Z
working working
X protection
protection
APS 3 4 APS
selector bridge selector selector bridge selector
working working

protection protection

APS APS
selector selector bridge selector selector bridge

T-MPLS/MPLS-TP Tunnel redundancy scenario

The system supports tunnel redundancy scenario for interworking with an access area.
This architecture is constituted by a dual node hierarchical core area where 1850
TSS-320/TSS-160 Hub nodes are deployed and by a ring area where other TSS are
located.

Figure 5-12 T-MPLS/MPLS-TP Tunnel redundancy configuration - E-LAN service

Edge Traffic Intermediate Main
hub Traffic hub
TSS-5 TSS-320
Main Tunnel PW1 CV/CCM
CV/CCM VSI VSI
ETH
ETH CV/CCM CV/CCM
VSI
PW2
CV/CCM

Dual homing to ELAN

Protection switch Access area

defined in TSS-5
for (aTSF or dRDI)
PW3
VSI
VSI
Redundant Tunnel
CV/CCM
T-MPLS/MPLS-TP PWE3
Dual Homing and Tunnel Redundancy TMPLS/MPLS-TP E-LAN (VPLS)
(no APS) 1:1 Protection with APS
(Note: Protecting tunnels not shown)

Spanning tree protocol

The Spanning Tree Protocol (STP) is a link management protocol that provides path
redundancy while preventing undesirable loops in the network. For an Ethernet network
to function properly, only one active path can exist between two stations.
Multiple active paths between stations cause loops in the network. If a loop exists in the
network topology, the potential exists for duplication of messages. When loops occur,
some switches see stations appear on both sides of the switch. This condition confuses the
forwarding algorithm and allows duplicate frames to be forwarded.
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To provide path redundancy, Spanning-Tree Protocol defines a tree that spans all switches
in an extended network. Spanning-Tree Protocol forces certain redundant data paths into a
standby (blocked) state. If one network segment in the Spanning-Tree Protocol becomes
unreachable, or if Spanning-Tree Protocol costs change, the spanning-tree algorithm
reconfigures the spanning-tree topology and reestablishes the link by activating the
standby path.
Spanning-Tree Protocol operation is transparent to end stations, which are unaware
whether they are connected to a single LAN segment or a switched LAN of multiple
segments.
All switches in an extended LAN participating in Spanning Tree Protocol gather
information on other switches in the network through an exchange of data messages.
These messages are Bridge protocol data units (BPDUs).
The Spanning Tree Protocol root switch is the logical center of the spanning-tree topology
in a switched network. All paths that are not needed to reach the root switch from
anywhere in the switched network are placed in Spanning Tree Protocol backup mode.
BPDUs contain information about the transmitting switch and its ports, including switch
and port Media Access Control (MAC) addresses, switch priority, port priority, and port
cost. The Spanning-Tree Protocol uses this information to elect the root switch and root
port for the switched network, as well as the root port and designated port for each
switched segment.
The stable active topology of a switched network is determined by:
• the unique switch identifier (MAC address) associated with each switch
• the path cost to the root associated with each switch port
• the port identifier (MAC address) associated with each switch port.
Each configuration BPDU contains the following minimal information:
• the unique identifier of the switch that the transmitting switch believes to be the root
switch
• the cost of the path to the root from the transmitting port
• the identifier of the transmitting port.
The switch sends configuration BPDUs to communicate and compute the spanning-tree
topology. A MAC frame conveying a BPDU sends the switch group address to the
destination address field. All switches connected to the LAN on which the frame is
transmitted receive the BPDU. BPDUs are not directly forwarded by the switch, but the
information contained in the frame can be used to calculate a BPDU by the receiving
switch, and, if the topology changes, instigate a BPDU transmission.
A BPDU exchange results in the following:
• one switch is elected as the root switch
• the shortest distance to the root switch is calculated for each switch
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• a designated switch is selected. This is the switch closest to the root switch through
which frames will be forwarded to the root
• a port for each switch is selected: it provides the best path from the switch to the root
switch
• ports included in the Spanning-Tree Protocol are selected.
Summarizing, STP accomplishes network resilience against STP failures recovering
network connectivity in case of link failures, if the bridged network is redundantly
protected (i.e. by electing a new Root Bridge, if the actual one is failed or by deactivating
a failed link and activating a backup one, if existing) and "breaks" all the loops of the
network, allowing only one path from a Bridge to any other Bridge, in order to prevent
"infinite loops" (infinite replying of the frames) due to redundantly connected bridges
network.
STP is compliant with 802.1d, 802.1w, 802.1s Rec.
The MSTP, which uses RSTP (see below) for rapid convergence, enables VLANs to be
grouped into a spanning-tree instance, with each instance having a spanning-tree topology
independent of other spanning-tree instances. This architecture provides multiple
forwarding paths for data traffic, enables load balancing, and reduces the number of
spanning-tree instances required to support a large number of VLANs.
MSTP (Multiple STP) provides simple and full connectivity for frames assigned to any
given VLAN throughout a Bridged LAN comprising arbitrarily interconnecte Bridges,
each operating MSTP, STP or RSTP. MSTP allows frames assigned to different VLN to
follow separate paths, each based on an independent Multiple Spanning Tree Instance
(MSTI) within Multiple Spanning Tree Regions composed of LANs and/or MST Bridges.
These Regions and the other Bridges and LANs are connected into a single Common
Spanning Tree (CST).
The RSTP (Rapid STP) takes advantage of point-to-point wiring and provides rapid
convergence (rapid recovery of connectivity following the failure of a switch, a switch
port, or a LAN) of the spanning tree, accomplishing reconfiguration of the spanning tree
in less than 1 second.
The RSTP provides rapid convergence of the spanning tree by assigning port roles and by
determining the active topology. The RSTP builds upon the IEEE 802.1D STP to select
the switch with the highest switch priority as the root switch. Then the RSTP assigns one
of these port roles to individual ports:
• Root port - provides the best path (lowest cost) when the switch forwards packets to
the root switch.
• Designated port - connects to the designated switch, which incurs the lowest path cost
when forwarding packets from that LAN to the root switch. The port through which
the designated switch is attached to the LAN is called the designated port.

Figure 5-13 Example of Spanning Tree Protocol function (STP)

D E H

F
G
PHYSICAL TOPOLOGY (Example)

A Active (forwarding) Port

Active link

B Active (forwarding) Port

Active link

Root Bridge C Blocking (discarding) Port

D E H

F
G
ACTIVE SPANNING TREE TOPOLOGY (Example)

Link Pass Through (LPT)

Link Pass Through (LPT) feature provides a means of Provider Equipment, which
supports Ethernet Service OAM, to communicate fault information between the customer
equipments at two ends. If the UNI link goes down at one end (or the Provider transport
fails in between), the link failure is then propagated to the remote peer UNI through

Figure 5-14 LPT: failure on Customer Interface and Transport Network

LLCF (Link Loss Carry Forward)

This mechanism is used to propagate failures detected on a transport network.
The system supports LPT on Hub & Spoke topology (EVC mux, point-to-point service),
applying LLCF mechanism, in case of either
• Upstream direction (Spoke→ Hub): Ethernet PHY Interface failure at Spoke CIF
(even if forced from Management operator for Maintenance) or failure detected in the
transport network
• Downstream direction (Hub → Spoke) Ethernet PHY Interface failure at Hub CIF
(even if forced from Management operator for Maintenance).

Figure 5-15 Failure in upstream direction (Spoke -> Hub)

Figure 5-16 Failure in downstream direction (Hub -> Spoke)

LPT applies the LLCF principle to propagate failures:

• through GFP CSF Point-to-MultiPoint (GFP-CSF P2MP)
• through ETH-CSF or ETH-AIS/RDI.

Figure 5-17 ETH-CSF insertion - fault detection at UNI-N

LPT through Ethernet AIS/RDI

The NE supports Ethernet AIS/RDI management that provides LPT functionality. During
the detection of link failure on UNI-N, ETH-AIS (Y.1731) is sent to the remote node for
appropriate consequent action for:
• Point-to-Point (EVPL, EPL) in the context of Ethernet based network
• At the edge of TMPLS network (enabling Ethernet MEP at the boundary of VPWS
services)

Figure 5-19 ETH-AIS insertion - fault detection at UNI-N

Link aggregation group (LAG)

Overview
Link Aggregation is de[filig ]ned in the IEEE Std 802.1AX™-2008 standard (formerly
specified in IEEE Std 802.3™, clause 43). Link Aggregation is a means of combining a
group of IEEE 802.3™ full duplex point-to-point Ethernet links (operating at the same
data rate) into a single logical link of up to the aggregate rate. While some physical layer
functions remain per member link, the bridging function treats the logical port as the only
one of the group that exists. The Link Aggregation Control Protocol (LACP) manages the
state of LAG Ethernet port members. This includes the ability to signal member status
changes (for example, failed, recovered) to the far-end LAG partner so that traf[filig ]c is
only passed on good links. Standard link aggregation status updates are not quick (on the
order of seconds) as compared to the performance (less than 50 ms) routinely offered by
synchronous optical networks. With the Link Aggregation feature, LAN ports are able to
terminate and participate in the standard protocol, to a limited degree or can be forced to
aggregate using no protocol.

Link aggregation
Link aggregation comprises an optional sub-layer between a MAC Client and the MAC
(or optional MAC Control sub-layer). Figure 5-21, “Architectural positioning of link
aggregation sub-layer” (p. 5-48) depicts the positioning of the link aggregation sub-layer
in the CSMA/CD layer architecture, and the relationship of that architecture to the Data
Link and Physical Layers of the OSI Reference Model. The figure also shows the ability
of the link aggregation sub-layer to combine a number of individual links in order to
present a single MAC interface to the MAC Client.

Figure 5-21 Architectural positioning of link aggregation sub-layer

OSI LAN
REFERENCE MODEL CSMA/CD
LAYERS LAYERS

APPLICATION
HIGHER LAYERS
PRESENTATION

SESSION MAC CLIENT (BRIDGE RELAY ENTITY, LLC, etc.)

TRANSPORT LINK AGGREGATION SUBLAYER (OPTIONAL)

NETWORK MAC CONTROL MAC CONTROL MAC CONTROL

(OPTIONAL) (OPTIONAL) (OPTIONAL)
DATA LINK MAC MAC MAC

PHYSICAL PHYSICAL PHYSICAL PHYSICAL

LAYER LAYER LAYER

Figure 5-22 Link aggregation

SONET/SDH Network

External 1850 1850 External

Ethernet TSS-100 TSS-100 Ethernet
Equipment Equipment
(Device) (Device)

LAN Ports LAN Ports

Link Located on 1 Located on 1 Link
Aggregation Or More Or More Aggregation
Group Modules Modules Group

Ethernet Links Ethernet Links

(10 or 100 or 1000 Mbps) (10 or 100 or 1000 Mbps)

Link Aggregation Group (e.g. Links that are aggregated together)

1850 TSS-100 = 1850 Transport Service Switch 100 MA-DMXplore-357a

The figure shows two Ethernet devices running link aggregation interconnected via
Ethernet circuit packs and a SONET/SDH Network. The Alcatel-Lucent 1850 TSS-100
shelves and the SONET/SDH network are invisible to the two Ethernet devices. The
Ethernet traffic is transparently transferred between the external devices. Link
aggregation is typically implemented using two dedicated unprotected point-to-point links
(Ethernet Private Line Service) for each pair of external ports.

Link Aggregation Control Protocol (LACP)

LACP can be used for automatic communication of aggregation capabilities between NEs
and automatic configuration of Link Aggregation. LACP is responsible for determining
which links may be aggregated, aggregating them, binding the ports within the NE to an
appropriate aggregator, and monitoring conditions to determine when a change in
aggregation is needed. LACP is responsible for determining, based on operator
configuration of the state variables for Link Aggregation (Keys). The LACP uses peer
exchanges across the links to determine, on an ongoing basis, the aggregation capability
of the various links, and continuously provides the maximum level of aggregation

Fast LAG
In Release 3.1 and later, the fast LAG mechanism applies to any Link Aggregation Group
provisioned in a node. Fast LAG is an improved implementation of the current Link
Aggregation (LAG) feature. The improvement consists of applying the LAG to
GFP-VCG, and an improvement of the LAG members failures detection and management
to guarantee a redistribution (protection) of the traffic over the working LAG members in
a time less than 50 ms.
Using fast LAG, two compatible nodes that interoperate via Fast LAG on two Ethernet
interfaces or on two VCGs guarantee a protection switch time of less than 50 ms. The
implementation of the fast LAG guarantees the interoperability between an
Alcatel-Lucent 1850 TSS-100 node and a generic node that supports the Link
Aggregation as defined in the IEEE Std 802.1AX™-2008 standard. In case of

Figure 5-23 Fast LAG failure signaling

Node B
VCG
failure

Node A LOS VCG #1

CSF
insertion
Tx
Shutdown
VCG #2

LAG
LAG

A modified link shut down procedure is implemented in order to recover from the
situation that happens when both transmit interfaces shut down and a fault on the link has
been fixed.
The “modified link shutdown procedure” is based on the following assumptions:
• Both sides support the LACP protocol.
• The healthy status of a link is based both on the diagnosis of failure and on the link
status signaling via LACP.
• Following the clearing of the “fail” condition of a link, a WTR (Wait to Restore)
timeout is started and the link is again added to the LAG only after the expiration of
such a timeout.
Use Figure 5-23, “Fast LAG failure signaling” (p. 5-52) as reference. The modified link
shutdown procedure performs the following:
1. At Node B:
a. Node B detects a link failure and shuts down the link transmitter (TX).
b. Node B discards the link from the LAG and starts a wait for failure detection
(WFD) timer.
c. Node B starts sending LACP control frames containing the “link failure”
information.
2. At Node A:
a. Node A detects a link fail and shuts down the link, Node A discards the link from
the LAG;
b. Node A starts a WFD timer and starts sending LACP control frames containing the
“link failure” information.

Performance monitoring
Overview
Performance monitoring (PM) provides the user with the facility to track systematically
the quality of a particular transport entity. This tracking is done by means of continuous
collection and analysis of the data derived from defined measurement points.
PM also compares the error counts with user-defined thresholds and issues a report when
any error count crosses its defined threshold.
The Alcatel-Lucent 1850 TSS-100 performs PM on the following facility types:
• STM-n (STM-1, STM-4, STM-16, STM-64)
• VC-n (VC-4/AU-4 high-order: VC3/TU3 and VC12/TU12 low-order)

Table 5-3 Number of registers for each PM parameter monitored

Register Type Number of Registers per Monitored Parameter

15-MINUTE 1-DAY
Current 1 1
Previous 1 1
Recent 31 6

Register initialization
Current registers for 15-min and 1-day counts accumulate error and event counts. When
the count in any of these registers reaches a maximum value, the register remains full
until either it is reset or the value is transferred to the Previous register. Current registers
initialize in the following circumstances:
• Automatically every 15 minutes or 1 day (24 hours)
• Manually via TL1 command at any time

Validity flags
Each register marks accumulation data with an associated validity flag. The system sets
the VLDTY flag to one of the following values:
• PRTL—Partial, Data accumulated over portions of the time period
• COMPL—Complete, data accumulated during the entire accumulation period.

Threshold registers
Two threshold registers are provided for each parameter monitored; a 15-minute threshold
register and a 1-day threshold register. Threshold registers are supported for all facility
PM parameters.
Threshold register values can be set and retrieved via TL1 commands.

Threshold crossing alerts

A threshold value is crossed when a current value register reaches or exceeds the set value
in the corresponding threshold register. When a threshold crossing is recognized,
Threshold Crossing Alerts (TCAs) are generated. By default, threshold crossing
conditions shall carry a severity of Warning (WR)

Retrieving selective PM data

TL1 commands are used to retrieve PM data on selected ports. Thus automatically
executed 15-minute and daily reports can be displayed as follows:
• Immediately or at a designated date and time
• At a single port, range of ports, or all ports.

Monitored parameters
Parameters monitored by the system vary according to facility.
• For a list of STM-n line PM parameters, refer to Table 5-4, “STM-n PM parameters”
(p. 5-55).
• For a list of Virtual Container parameters, refer to Table 5-5, “Virtual container PM
parameters” (p. 5-56).
For each facility type and parameter, default and maximum threshold levels are set. For
more details, refer to the Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and
TSS-100C) Release 4.1 (ETSI) TL1 Command Guide for MSPP.

Table 5-4 STM-n PM parameters

Parameter Definition
Near-End Line PM Parameters for STM-n
ES-RS Errored Seconds Regenerator Section

Parameter Definition
SES-RS Severely Errored Seconds Regenerator Section
BBE-RS Background Block Errors Regenerator Section
UAS-RS Unavailable Seconds Regenerator Section
ES-MS Errored Seconds Multiplex Section
SES-MS Severely Errored Seconds Multiplex Section
BBE-MS Background Block Errors Multiplex Section
UAS-MS Unavailable Seconds Multiplex Section

Table 5-5 Virtual container PM parameters

Parameter Definition
VC-4
ES-HOVC Errored Seconds Higher Order VC path
SES-HOVC Severely Errored Seconds Higher Order VC path
BBE-HOVC Background Block Errors Higher Order VC path
UAS-HOVC Unavailable Seconds Higher Order VC path
VC-3/VC-12
ES-LOVC Errored Seconds Lower Order VC path
SES-LOVC Severely Errored Seconds Lower Order VC path
BBE-LOVC Background Block Errors Lower Order VC Path
UAS-LOVC Unavailable Seconds Lower Order VC path

Housekeeping
Maintenance: Housekeeping
The housekeeping interface has 8 pins that can sense an electrical ground condition
indicating an external alarm from up to 8 external devices. It also supports 4 pairs of
output pins that can be configured to provide an open or closed condition indicating up to
4 internal alarm conditions from the NE. Each pair of output pins has an internal
electronic switch, that can be configured to close or open contacts toward independent
housekeeping output grounds.
Housekeeping functionality is provided by the active FLC board. The physical access to
these interfaces is provided through a Sub-D 25-pin connector on the Alcatel-Lucent
1850 TSS-100. Common Part Interface (CPI) as shown in Figure C-3, “Alcatel-Lucent
1850 TSS-100 shelf common part interface (CPI) connectors” (p. C-8) .

Alarms and reports

Alarm and condition types
The system reports different types of events, which differ in their potential affect on
service and the urgency of clearing the condition. These event types are:
• Alarms with different severities, which require trouble clearing
• Not alarmed but reported standing conditions in which the system is in a non-regular
state (for example in a loopback) but which do not require trouble clearing
• Transient conditions which are reported but do not require clearing.

Alarm and condition severities

The alarm severity is determined by the service affect of a particular failure. The alarm
severity is used to indicate the urgency to repair the failure.
Alarms and conditions are raised with one of these severities:
• Critical
• Major
• Minor
• Non-Alarmed.
• WR

Reporting
Alarms and conditions are reported in different ways:
• By autonomous reports and logs
• Visually by LEDs on the modules in the shelves in different colors which indicate the
severity
• As audible alarms, if the NE is connected to an external annunciator. The
Alcatel-Lucent 1850 TSS-100 does not contain an internal annunciator.
Nonvolatile Alarm Log Management allows alarm information to be stored in nonvolatile
memory. Alarms and conditions are autonomously reported and logged and they are
retrievable, individually or per type.
Reports and logs include access identifiers (AIDs), date and time, event type, event
description, severity (applies to alarms only), and service impact. Refer to the
Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and TSS-100C) Release 4.1
(ETSI) TL1 Command Guide for MSPP for details on their structure.
An alarm hierarchy applies to the alarm reporting. Whenever a higher level alarm occurs
while a lower level alarm exists on the same entity, indication of the lower level alarm is
masked. The lower level alarm remains active, although not indicated.

Displaying summary alarms

Summary alarms show that at least one alarm of a certain severity exists in the shelf or in
the rack. They are displayed for the individual shelf on LEDs on the Fan Unit according
to their severity (Critical, Major, Minor).

Alarm cut-off function for audible alarms

The Alarm Cut-Off ( ACO) function allows a user to reset an external audible alarm
indication for a any local or remote alarms being reported by the unit. It does not inhibit
audible alarms for subsequent alarms. The ACO does not impact any visual alarm display.
The ACO function can be invoked either locally via the Alarm cut-off key on the
Equipment Controller (EC100/EC100C/EC100A) or remotely via a TL1 command.

Ethernet Link OAM IEEE 802.3 Clause 57

Overview
The Alcatel-Lucent 1850 TSS-100 supports Link layer OAM in compliance with IEEE
802.3 Clause 57 for fault management and Performance Monitoring.
The system supports the following features:
• Link Discovery
• Link Monitoring
• Remote Failure Indication
• Remote Loopback (on demand)
Link OAM provides a way to monitor the health of a physical Ethernet link through:
• Continuous, bidirectional discovery protocol
• Loopback
• Communication of
– Link events
– Failures
– Threshold monitoring events
Note: L2CP tunneling and link OAM cannot both be enabled on the same port.

OAMPDUs
Link OAM uses Operations, Administration, and Maintenance Protocol Data Units
(OAMPDUs) for:
• Discovery
• Loopback control/response
• Event notification
During normal operation, one PDU is sent per second. Up to 10 PDUs can be sent per
second, unless there is a new critical event. The absence of PDUs indicate that a failure or
fault has occurred. PDUs can contain multiple Type/Length/Value (TLV).

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Maintenance
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Link discovery
Discovery identifies the devices in the network along with their OAM capabilities.
Discovery relies on the Information OAMPDUs. During discovery, the following
information is advertised in TLVs within periodic Information OAMPDUs:
• OAM configuration (capabilities) — Advertises the capabilities of the local OAM
entity. With this information, a peer can determine what functions are supported and
accessible, such as loopback capability.
• OAM mode — The mode is conveyed to the remote OAM entity. The mode can be
either active or passive, and can also be used to determine device functionality.
• OAMPDU configuration — This configuration includes maximum OAMPDU size to
receipt and delivery. This information along with the rate limiting of ten frames/sec
can be used to limit the bandwidth allocated to OAM traffic.
• Platform identity — The platform identity is a combination of an Organization
Unique Identifier (OUI) and 32-bits of vendor specific information. OUI allocation is
controlled by the IEEE and OUIs are typically the first three bytes of a MAC address.
Discovery includes an optional phase where the local station can accept or reject the
configuration of the peer OAM entity. For example, a node may require that its partner
support loopback capability to be accepted into the management network.
Each port can be configured in active or passive mode. The discovery function is
mandatory and is used to determine if the link partner is 802.3 OAM-capable and which
features of the protocol it supports
Active mode
Only active ports can initiate discovery or loopback. Discovery is initiated when link
OAM is enabled on a port and the port is configured in the active mode. The port sends
information PDUs. In active mode, a port can initiate discovery, respond to discovery
initiated from the remote end and initiate or respond to a loopback command.
Passive mode
Only active ports can initiate discovery or loopback. If a port is in the passive mode, it
can respond to discovery and can respond to a loopback command, but cannot initiate
discovery or loopback.

Link monitoring
The system supports Link Monitoring by means of Event Notification OAMPDUs as
described in IEEE 802.3 Clause 57 - Section 57.5.3
Link monitoring tools are for detecting and indicating link faults under a variety of
circumstances. Link monitoring uses the Event Notification OAMPDU, and sends events
to the remote OAM entity when there are problems detected on the link. The Event

Remote failure indication

The system supports Remote Failure Indication by means of Critical Link Event flags
present in any OAMPDUs, as described in IEEE 802.3 Clause 57 - Section 57.4.2.1
Faults in Ethernet are difficult to detect, especially when caused by slowly deteriorating
quality rather than completely disconnected links. A flag in the OAMPDU allows an
OAM entity to convey failure conditions to its peer. The failure conditions are as follows:
• Link Fault — Loss of signal is detected by the receiver; this is sent once per second in
the Information OAMPDU.
• Dying Gasp — Unrecoverable condition (for example, a power failure) has occurred;
these may be sent immediately and continuously.
• Critical Event — Unspecified critical event has occurred; these may also be sent
immediately and continuously.
The unrecoverable condition for dying gasp could be interpreted as any condition that
causes the equipment to restart (for example, shut down or restart of equipment). The link
fault applies only when the physical sub-layer is capable of independent transmit and
receive. When a link is not receiving a signal from its peer at the physical layer (for
example, if the peer’s laser was malfunctioning), the local entity can set this flag to let the
peer know that its transmit path is inoperable.
The above conditions are severe. When they are set in the flag, the OAMPDU is not
subject to normal rate limiting policy.

Ethernet Service OAM IEEE 802.1ag

Overview
Ethernet service OAM (Operations, Administration, and Maintenance) provides
maintenance features for detecting, isolating, and reporting connectivity faults for
Ethernet services. This release implements IEEE Std 802.1ag™ -2007 Connectivity Fault
Management. Three basic features are currently specified: Continuity Check, Link Trace,
and Loopback.
For each service, generally three types of players are involved: the customer, the service
provider, and operators. For this reason Service OAM is defined at multiple levels, as
shown in Figure 5-24, “Service OAM reference model” (p. 5-63).

Figure 5-24 Service OAM reference model

Customer Service Provider Customer

equipment Operator A NEs Operator B NEs equipment
1 2 3 4 5 6 7 8

E-NNI

Customer ME
(UNI-C to UNI-C)

EVC (Provider) ME
ETH (UNI-N to UNI-N)

Operator A ME Operator B ME
(UNI-N to E-NNI) (UNI-N to E-NNI)

Link Link Link Link Link

Tran/Eth
Physical

ME - Maintenance Entity Up MEP

ETH - Ethernet frames
Tran/ETH - Physical transport layer
Down MEP
E-NNI - External Network-to-Network Interface
UNI - User-to-Network Interface MIP
UNI-C - User Network Interface, port on customer side of UNI
UNI-N - User Network Interface, port on network side of UNI Port
OAMservice

Note: Service OAM also applies to more complex networks than are represented in
Figure 5-24, “Service OAM reference model” (p. 5-63), including multipoint and ring
networks.
Each player can establish their own Maintenance Associations (MA), consisting of
Maintenance Endpoints (MEPs, shown as triangles), which allows them to exchange
OAM messages over their domain of the service. MEPs can perform fault detection using
keep-alive messages called Continuity Check Messages (CCM). Maintenance
Intermediate Points (MIPs, shown as circles) may be created to facilitate fault isolation.
They can respond to, but do not initiate, certain OAM functions. For example, loopbacks

Ethernet OAM entities

Connectivity fault management (CFM) supports concepts to support multiple independent
operators, services, and customers.
Maintenance Entity (ME):
A point-to-point relationship between two MEPs within a single MA. An ME represents
an entity that requires management and is a relationship between two Maintenance Entity
Group End Points at a particular MEG Level. There may be 0 or more Maintenance
Intermediate Points (MIPs) along a Maintenance Entity between two Maintenance End
Points (MEPs). MEPs and MIPs are referred to, collectively, as Maintenance Points
(MPs). Maintenance Points are the active functional components of Connectivity Fault
Management.
Maintenance Point (MP) :
One of either a MEP or a MIP.
Maintenance domain (MD):
The network or the part of the network for which faults in connectivity are to be
managed. A Maintenance domain (MD) is a part of the network controlled by a single
player (owner) to support connectivity between maintenance end points (MEPs) that
bound the maintenance domain.

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Maintenance
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Maintenance domain level (MD level):
Maintenance domain levels allow customers, service providers, and operators to run
independent OAMs on their own level. Up to eight OAM levels are defined (0–7), with
seven (7) being the highest. Customers are allocated up to three levels (5, 6, 7), service
providers two levels (3, 4), and operators three levels (0, 1, 2).
Maintenance association (MA):
Maintenance associations (MA) are a set of MEPs associated with a single service
instance (identified by the service VLAN identifier) within a maintenance domain
(identified by the maintenance domain name). The combination of the maintenance
domain name (if MD name format is not null) and the maintenance association name is
called maintenance Association Identifier (MAID). In IEEE 802.1ag, the term MA is used
in the same context as MEG in ITU-T Y.1731.
Maintenance association identifier (MAID):
An identifier for a Maintenance Association, unique over the domain that CFM is
protecting. The MAID has two parts: the Maintenance Domain Name and the Short MA
Name.
Maintenance entity group (MEG):
In ITU-T Y.1731, the term MEG is used in the same context as MA in IEEE 802.1ag.
A MEG includes different MEs that
• exist in the same administrative boundary,
• have the same MEG level, and
• belong to the same point-to-point ETH connection or multipoint ETH connectivity.
For a point-to-point ETH connection, a MEG contains a single ME. For a multipoint ETH
connectivity containing n end-points, a MEG contains n*(n–1)/2 MEs.
MEG end point (MEP):
In ITU-T Y.1731, this is the end point of an ETH MEG that is capable of initiating and
terminating OAMPDU frames for fault management and performance monitoring.”
Maintenance association end point (MEP):
Maintenance End Points (MEP) are established on interfaces at each end of a
maintenance domain. MEPs are configured for a specific MA within a maintenance
domain to generate and receive Connectivity Fault Management (CFM) PDUs. Each
individual MEP is configured with a MEPID that is unique within its MA. MEPs may be
configured as Up MEPs or Down MEPs. MEPs may be addressed by the MEPID or by
their port’s MAC address for Down-MEPs or by the shared bridge CPU MAC address for
Up-MEPs.

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Maintenance
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Maintenance intermediate point (MIP):
Maintenance Intermediate Points (MIPs) may or may not be individually created by the
user. When an MA is created, it is provisioned to either enable or disable automatic
creation of MIPs on that MA based on lower level MEPs. When allowed, MIPs are
automatically created on a port at the MD level above the highest level MEP (or in the
lowest configured MD level if there is no MEP on the port). A MIP consists of two MIP
Half Functions (MHFs) on a single bridge port; an Up MHF and a Down MHF. MIPs
facilitate fault isolation. They can respond to, but do not initiate, certain OAM functions.
For example, loopbacks may be initiated from a MEP which has detected a CC fault and
targeted successively to each MIP at its level. MIPs may be addressed by their port’s
MAC address for Down-MHFs or by the shared bridge CPU MAC address for Up-MHFs.
Ethernet Continuity Check messages (ETH-CC)
ETH-CC is generated with a specific multicast Destination Address (mDA) and on a
configured polling interval, by each MEP. It can be used to detect continuity failures
(fault detection) across MEs.
Ethernet Loopback (ETH-LB)
Loopback request messages are generated “on-demand” by a MEP to verify connectivity
failure to either remote MEP or MIP. The loopback mode is non-intursive as it affects
only ETH-LB frames.
ETH-RDI management
The system supports ETH-RDI management in ETH OAM CCM PDU frames, as per
ITU-T Y.1731, including dRDI detection in the receiving direction and RDI insertion per
aRDI consequent action.
ETH-RDI is used to communicate to the peer MEP entity a defect detected on the remote
end, using the ETH-CC CFM tool. RDI flag =1, means that a CCM remote defect is
present.
ETH-RDI is transmitted with the bit set for the duration of the defect condition and it is
cleared in the subsequent CCM transmission after defect clearing.
Ethernet Link Trace messages (ETH-LT)
Link Trace messages are generated by a MEP either for route discovery or fault isolation.
The “request” signal is sent to a target MEP with identified in Target Address TLV. The
“reply” signal is sent back to the originating MEP, both by the destination MEP and by
the MIPs encountered along the route.

Ethernet OAM over T-MPLS/MPLS-TP

The system supports the configuration of Ethernet OAM over T-MPLS/MPLS-TP both
for VPWS and VPLS services as per Y.1731.
Ethernet OAM over VPLS
Ethernet OAM over VPLS provides the following ETH OAM functions:
• Connectivity Check Messages (CCM) with periodic refresh of 1 sec
• Loopback Messages (LM)
• Link Trace Messages (LTM)
For supporting Ethernet OAM over VPLS a MAis created and associated via management
operations to a VPLS Instance (identified via VPN ID). Each MEP inside MAis bound to
the same VPLS Instance. Inside MAa MEP is identified by MA(VPLS Instance) and port
(UNI/NNI).
AVPLS-NE node supports, for each VPLS instance, enabling of Ethernet OAM functions
with MEPs on both UNI and NNI interfaces.
• ”UP MEP” for UNI VPLS interfaces (AC port)
• ”DOWN MEP” for NNI VPLS interfaces (PW logical port)
For H-VPLS network “DOWN MEP” refers both on Spoke PW and Core PW. See Figure
5-25, “ETH OAM over VPLS and H-VPLS model” (p. 5-68).

Figure 5-25 ETH OAM over VPLS and H-VPLS model

Ethernet OAM over VPWS

Ethernet OAM over VPWS provides the following ETH OAM functions:
• Connectivity Check Messages (CCM) with periodic refresh of 1 sec
• Loopback Messages (LM)
• Link Trace Messages (LTM)
For supporting Ethernet OAM over VPWS a MAis created and associated via
management operations to a PW (identified via PW index). Each MEP inside the MAis
bound to the same PW. Inside MAa MEP is identified by MA(PW index) and port (UNI).
AT-MPLS/MPLS-TP node supports enabling of Ethernet OAM functions with MEPs
(“UP” MEP) on UNI interfaces.

Figure 5-26 Ethernet OAM over VPWS model

VPWS OAM MEPs points location is based upon the management model used in the
VPWS scenario. The final goal is to achieve end-to-end service and segment monitoring
in the network. See Figure 5-27, “Ethernet OAM over VPWS network scenario”
(p. 5-69).

Figure 5-27 Ethernet OAM over VPWS network scenario

Service OAM configurations

An example application is a provider-owned demarcation point between customers and
the provider’s network. This is Node 2 or Node 7 in Figure 5-24, “Service OAM
reference model” (p. 5-63). Each customer port may be provisioned to support a customer
MIP and at least a provider Up-MEP, and if applicable an operator Up-MEP, for each
Ethernet Virtual Connection (EVC). A link-level Down-MEP may be configured on both
customer and network ports, with no VID, to protect the entire link.

MIP support
Whether and how a customer MIP can be supported depends on the tagging mode, and
whether the customer OAM frames (only levels 5, 6 and 7 are designated for customer
use) are tagged. Table 5-6, “No double tagging” (p. 5-71) through Table 5-8, “Double
tagging – Service multiplexed” (p. 5-71) show, for the provider edge , the relation
between customer OAM tagging and the Service VLAN to be used for configuring the
MA. For example, Node 2 in Figure 5-24, “Service OAM reference model” (p. 5-63). A
customer MIP can only be supported (be accessible) in the provider’s equipment when the
customer’s OAM frames have a single tag when forwarded to the CPU. When
double-tagged, they are tunneled.
In the no double tagging (single tag) case Table 5-6, “No double tagging” (p. 5-71),
untagged customer traffic, including OAM, may be configured to be dropped or not. If
not dropped, then certain untagged customer OAM traffic is tagged with the Port VID
(which is the Service VLAN ID). This enables customer MIP support. The OAM traffic
tagged this way includes traffic with a Unicast DA, and with the OAM multicast DA at
the customer levels.
Untagged customer OAM traffic at lower levels (0–4) may be destined to a no-VLAN
Down-MEP there. Only OAM frames that encode the level in the DA are available to
such a Down-MEP. This includes CCM, which is the only function needed by a
Down-MEP on a customer port. This same consideration applies in the case of a LAG.
Untagged customer-level OAM may address a customer MIP on the LAG port while at
lower levels it can only belong to a no-VLAN Down-MEP on a member port.

Tagging

Table 5-6 No double tagging

Customer OAM VLAN Customer MIP supported? Service VLAN ID

Untagged (untagged not No N/A
accepted)
Untagged (untagged Yes, in pvid pvid
accepted)
VLAN=X Yes X
No OAM No Any

Table 5-7 Double tagging – All to one bundling

Customer OAM VLAN Customer MIP supported? Service VLAN ID

Untagged Yes, in default VLAN (pvid) pvid
VID=X No, tunneled pvid

Table 5-8 Double tagging – Service multiplexed

Customer OAM VLAN Customer MIP supported? Service VLAN ID

Untagged Yes, in only one EVC As mapped with SVLAN
VID=X No, tunneled As mapped with SVLAN

Overview
Purpose
This section summarizes basic system planning and engineering information to plan
procurement and deployment of the Alcatel-Lucent 1850 TSS-100. There are a number of
considerations that should be kept in mind when planning the role of the Alcatel-Lucent
1850 TSS-100 in the network. Projected customer requirements will determine initial
capacity needed, as well as evolution to higher capacities. The advanced networking
capabilities of the Alcatel-Lucent 1850 TSS-100 offer many economic and planning
benefits, and certain guidelines should be followed to maximize these benefits. Physical
installation considerations will be guided by the installation location (central office,
uncontrolled, or customer locations). Initial network configuration will determine
synchronization requirements. Synchronization should be planned on a network basis
considering items like topology, reliability, network connectivity, and service evolution.
For detailed specifications relating to signal, alarm, and control interfaces, refer to the
Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and TSS-100C) Release 4.1
(ETSI) Engineering Rules.

Contents

Engineering specifications 6-2

Required and optional equipment and slot allocation 6-2
SFP and XFP modules 6-7
Allowable cross-connections 6-10
Shelf configuration examples 6-17
Installation cabling 6-22
IS-IS Level 2 routing guidelines 6-23
Network engineering rules and guidelines 6-25

Engineering specifications
Overview
To ensure that engineering specifications are always consistent and up-to-date,
Alcatel-Lucent provides engineering specifications that provide basic information and
specifications relating to signal interfaces, alarm interfaces, and control interfaces.
Information about connection points, connector types, and pin assignments is also
provided.

Where to obtain engineering specifications

Order the most current version of the engineering specifications from the Online
Customer Support (OLCS) (https://support.lucent.com/portal/olcsHome.do) web site.
Important! When ordering equipment, obtain the current version of the
Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and TSS-100C) Release 4.1
(ETSI) Engineering Rules.

How to order engineering specifications

The most up-to-date version of the Alcatel-Lucent 1850 Transport Service Switch
(TSS-100 and TSS-100C) Release 4.1 (ETSI) Engineering Rules may be obtained through
the Online Customer Support (OLCS) web site (https://support.lucent.com).

Required and optional equipment and slot allocation

Overview
The following table shows shelf equipage requirements. Mandatory are at least a shelf,
one Equipment Controller, one Universal Matrix, Power Supply, Fan, and termination
bus. For detailed information about individual racks, cards, and modules refer to
Appendix C, “Unit data sheets”.
Table 6-1 Traffic and access area card complement

Unit Required Optional Card Slot Associated

Working (W) Access
Protection Slot
(P)
Common units
“Alcatel-Lucent 1850 TSS-100 Shelf, Front 11 0 NA NA
Access, New Edition” (p. C-5)

Unit Required Optional Card Slot Associated

Working (W) Access
Protection Slot
(P)
“Alcatel-Lucent 1850 TSS-100 Compact Shelf, 11 0 NA NA
New Edition” (p. C-11)
“Top Rack Unit with Bypass-Extension” 2 0 NA NA
(p. C-14) (TRU)
“Equipment Controller” (p. C-18) (EC100) 1 1 Front/: 1 (W), NA
2 (P)
“Equipment Controller” (p. C-21) (EC100C) 1 1 Compact: 1 NA
(W), 2 (P)
“Equipment Controller High Capacity” 1 1 1 (W), 2 (P) NA
(p. C-24) (EC100A)
“Fan Unit” (p. C-28) (FAN100) 1 0 Front: 19 NA
“Fan Unit” (p. C-32) (FAN100C) 1 0 Front: 19 NA
Compact: 14
“Fan Unit” (p. C-32) (4FANS) 1 0 Compact: 14 NA
“Universal Matrix” (p. C-34) (MT100) 22 0 Front/: 9 (W), NA
10 (P)
“Universal Matrix” (p. C-38) (MT100C) 22 0 Compact: 5 NA
(W), 6 (P)
“Power Supply with switch” 23 0 Front/: 17 NA
(p. C-42) (POW100) (Batt B), 18
(Batt A) 4
Compact:
12(Batt B),
11(Batt A)5
“Power Supply without switch” 23 0 Front/: 17 NA
(p. C-42) (POW100NS) (Batt B), 18
(Batt A) 4
Compact:
12(Batt B),
11(Batt A)5
PDH cards
“63-Port E1/DS1 Multiplexer (63E1DS1M)”
(p. C-48) (E1DS1M)

Unit Required Optional Card Slot Associated

Working (W) Access
Protection Slot
(P)
“56-Port E1/DS1 Multiplexer” 0 Front/: 8 Front/: 5-8 Front/:
(p. C-52) (E1DS1M) Compact: 4 12-14 (W), 11 25-40
(P) or 5-7. Compact:
11-14 (W), 8 17-20
(P)
Compact:
17-20 (W),
15-16, 21-22
(P)
“32-Port E1 Access (E1UAC and E1DS1PAC)”
(p. C-67) (E1UAC and E1DS1PAC)
“6-Port DS3 Access (6XDS3AC)”
(p. C-79) (6XDS3AC)
“Combo PDH card (ASYMRTM)” 1
(p. C-85) (ASYMRTM)
“28-Port E1 Access (75Ω)” (p. C-56) (E1UAC) 0 Front/: 14 Front/: 25-32, NA
Compact: 8 35-40
Compact:
15-22
“32-Port E1/DS1 Access (100/120Ω)” 0 Front/: 14 Front/: 25-32, NA
(p. C-61) (E1DS1BAC) Compact: 8 35-40
Compact:
15-22
“32-Port E1/DS1 Access Protection” 0 2 Front/: 31-32 NA
(p. C-64) (E1DS1PAC) or 33-34
Compact:
15-16 or 21-22
“24-Port E3/DS3/EC1 Multiplexer + TMUX” 0 Front/: 8 Front/: 5-8 Front/:
(p. C-72) (E3DS3TM) 12-14 (W), 11 25-40
(P) or 5-7. Compact:
11-14 (W), 8 17-20
(P)
Compact: 7
(P), 8-10 (W)

Unit Required Optional Card Slot Associated

Working (W) Access
Protection Slot
(P)
“12-Port E3 Access” (p. C-76) (12XE3A) 0 Front/: 12 Front/: 25-30, NA
35-40
“12-Port E3/DS3/EC1 Access Protection” 0 Front/: 4 Front/: 31-34 NA
(p. C-82) (E3DS3PAC)
SDH cards
“8-Port STM-1/OC-3 / STM-4/OC-12 0 Front/: 12 Front/: 3-8, NA
(8×155/622M Sync Optical)” (p. C-92) (8PSO) Compact: 6 11-16 6
Compact: 3-4,
7-10
“4-Port STM-16/OC-48 (4×2.5G Sync Optical)” 0 Front/: 12 Front/: 3-8, NA
(p. C-98) (4P2G5SO) Compact: 6 11-16 6
Compact: 3-4,
7-10
“1-Port STM-64/OC-192 (1×10G Sync Optical)” 0 Front/: 8 Front/: 3-6, NA
(p. C-109) (1P10GSO and 1P10GSOE) Compact: 6 13-16 6
Compact: 3-4,
7-10
“16x-Port STM-1 electrical access (16XSEA)”
(p. C-88) (16XSEA)
“8-port STM-1/STM-4/4-port STM-16 Multirate
Synch (MRSOE)” (p. C-104) (MRSOE)
“16x-Port STM-1 protection access (SEPAC)”
(p. C-90) (SEPAC)
“8-Port STM-1/OC-3/STM-4/OC-12 (8PSO
-8×155/622M sync optical/8XSOA)”
(p. C-92) (8XSOA)
Data
“10G Packet Transport Processor” 0 Front/: 6 Front/: 3, 5, 7, Front/:
(p. C-116) (PP10G) Compact: 3 11, 13, 15 25-30,
Compact: 3, 7, 35-40
9 Compact:
21, 19, 17

Unit Required Optional Card Slot Associated

Working (W) Access
Protection Slot
(P)
“1xGbE Packet Processor - Half Slot
(PP10GHS)” (p. C-119) (PP10GHS)
“24xE/FE Electrical Packet Expander” 0 Front/: 12 Front/: 25-30, NA
(p. C-122) (PE24XFE) Compact: 6 35-40
Compact:
15-20
“24XFE Packet Expander Access (PE24XFEA)”
(p. C-126)(PE24XFEA)
“8XGE Packet Expander” (p. C-130) (8XGEEA) 0 Front/: 12 Front/: 25-30, NA
Compact: 6 35-40
Compact:
15-20
“1X10GE Packet Expander” 0 Front/: 12 Front/: 25-30, NA
(p. C-135) (10GEEA) Compact: 6 35-40
Compact:
15-20
“Booster Amplifier - BST10GA”
(p. C-138)BST10GA
“PRE10GA - PRE-AMPLIFIER (Single
channel)” (p. C-142)PRE10GA

Notes:
1. One shelf type is required, either front access, or Compact.
2. Two MT100s are required for Matrix redundancy, although the unit will function with only one.
3. Two power supplies are required for Matrix redundancy. Equipment is shipped with two power supplies of
the same type. The new edition of the Front Access shelf, (code 8DG25686ABXX) and the new edition of
the Compact shelf (code 8DG25826ABXX) must be used with the new power filters: 8DG26182AAXX or
8DG26182ABXX. The original Front Access shelf (code 8DG25686AAXX) and the original Compact shelf
(code 8DG25826AAXX) must be used with the original power filters: 8DG02607ACXX or
8DG02607ADXX.
4. PSF in slot 18 is supplied by Battery A, PSF in slot 17 is supplied by Battery B.
5. PSF in slot 11 is supplied by Battery A, PSF in slot 12 is supplied by Battery B.

SFP and XFP modules

Overview
The following table lists the SFP and XFP modules and shows the maximum number of
SFPs and XFPs that can be used per Alcatel-Lucent 1850 TSS-100 shelf. For detailed
information about SFP and XFP modules refer to the Unit Data Sheets (UDS) in
Appendix C, “Unit data sheets”.
test text

Table 6-2 SFP and XFP modules

Module/Unit Data Sheet Maximum Per Shelf

“STM-1 electrical SFP” (p. C-154) (S1E) Front/Rear: 96
Compact: 48
“STM-1/OC-3 SFP (Short Haul, 1310 nm)” (p. C-156) (SS-11) Front/Rear: 96
Compact: 48
“STM-1/OC-3 SFP (Long Haul, 1310 nm)” (p. C-156) (SL-11) Front/Rear: 96
Compact: 48
“STM-1/OC-3 SFP (Long Haul, 1550 nm)” (p. C-156) (SL-12) Front/Rear: 96
Compact: 48
“STM-1/OC-3 SFP (Short Haul, 1310 nm)” (p. C-156) (SS-11) Front/Rear: 96
Compact: 48
“STM-4/OC-12 SFP (Short Haul, 1310 nm)” (p. C-160) (SS-41) Front/Rear: 96
Compact: 48
“STM-4/OC-12 SFP (Short Haul, 1310 nm)” (p. C-160) (SS-41) Front/Rear: 96
Compact: 48
“STM-4/OC-12 SFP (Long Haul, 1310 nm)” (p. C-160) (SL-41) Front/Rear: 96
Compact: 48
“STM-4/OC-12 SFP (Long Haul, 1550 nm)” (p. C-160) (SL-42) Front/Rear: 96
Compact: 48

Module/Unit Data Sheet Maximum Per Shelf

“STM-16/OC-48 SFP (Intraoffice, 1310 nm)” (p. C-164) (SI-161) Front/Rear: 40
Compact: 24
“STM-16/OC-48 SFP (Intraoffice, 1310 nm)” (p. C-164) (SI-161) Front/Rear: 40
Compact: 24
“STM-16/OC-48 SFP (Short Haul, 1310 nm)” (p. C-164) (SS-161) Front/Rear: 40
Compact: 24
“STM-16/OC-48 SFP (Short Haul, 1310 nm)” (p. C-164) (SS-161) Front/Rear: 40
Compact: 24
“STM-16/OC-48 SFP (Long Haul, 1310 nm)” (p. C-164) (SL-161) Front/Rear: 40
Compact: 24
“STM-16/OC-48 SFP (Long Haul, 1550 nm)” (p. C-164) (SL-162) Front/Rear: 40
Compact: 24
“STM-16/OC-48 SFP (Long Haul, 1310 nm)” (p. C-164) (SL-161) Front/Rear: 40
Compact: 24
“STM-16/OC-48 SFP (Long Haul, 1550 nm)” (p. C-165) (SL-162) Front/Rear: 40
Compact: 24
“SFP 100BASE-FX with DDM -40/+85 C” (p. C-169) (100B) Front/Rear: 96 + 24
Compact: 48
“SFP 100BASE-LX -40/+85 C” (p. C-169) (100B) Front/Rear: 96 + 24
Compact: 48
“SFP 100BASE-LX with DDM -40/+85 C” (p. C-169) (100B) Front/Rear: 96 + 24
Compact: 48
“1000BASE SX SFP (Short Haul, 850 nm)” (p. C-172) (1000B) Front/Rear: 96 + 24
Compact: 48
“SFP GBE SX with DDM -40/+85 C” (p. C-172) (1000B) Front/Rear: 96 + 24
Compact: 48
“1000BASE LX SFP (Long Haul, 1310 nm)” (p. C-172) (1000B) Front/Rear: 96 + 24
Compact: 48
“SFP GBE LX with DDM -40/+85 C” (p. C-172) (1000B) Front/Rear: 96 + 24
Compact: 48
“SFP GBE ZX with DDM -5/+85 C” (p. C-172) (1000B) Front/Rear: 96 + 24
Compact: 48
....................................................................................................................................................................................................................................
6-8 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
System planning and engineering SFP and XFP modules

Module/Unit Data Sheet Maximum Per Shelf

“SFP GBE ZX with DDM -40/+85 C” (p. C-172) (1000B) Front/Rear: 96 + 24
Compact: 48
“SFP GBE EZX with DDM -5/+70 C” (p. C-172) (1000B) Front/Rear: 96 + 24
Compact: 48
“SFP GBE EZX with DDM -40/+85 C” (p. C-172) (1000B) Front/Rear: 96 + 24
Compact: 48
“SFP GBE BX 1310 nm with DDM -5/+70 C” (p. C-173) (1000B) Front/Rear: 96 + 24
Compact: 48
“SFP GBE BX 1490 nm with DDM -5/+70 C” (p. C-173) (1000B) Front/Rear: 96 + 24
Compact: 48
“SFP 1000BASE-T Electrical(EL TRX SFP ETH MULTIRATE Front/Rear: 96 + 24
RJ45)” (p. C-181) (ETHMR) Compact: 48
XFP Modules
TDM: OC-192/STM-64 XFP (Intraoffice, 1310 nm) Front/Rear:
Data: 10 GBase-LR TDM: 8
“STM-64/OC-192 XFP (Intraoffice, 1310 nm)XFP I-64.1/10GBE Data: 12
BASE L” (p. C-184) ( XI-641) Compact:
TDM: 4
Data: 6
TDM: OC-192/STM-64 XFP (Short Haul, 1550 nm) Front/Rear:
Data: XFP S-64.2B/10GBE BASE E TDM: 8
“STM-64/OC-192 XFP (Short Haul, 1550 nm)(XFP Data: 12
S-64.2B/10GBE BASE E)” (p. C-184) (XS-642) Compact:
TDM: 4
Data: 6
“STM-64/OC-192 XFP-E (Long Haul, 1550 nm)” Front/Rear: 12
(p. C-190) (XP1L12D2) Compact: 6
“XFP (10 GBASE-SR)(OPTO TRX XFP GbE S)” Front/Rear: 12
(p. C-193) (10GB) Compact: 6
“XFP L-64.2 DWDM (CH 60/1529.55 nm)” (p. C-200) through Front/Rear: 12
“XFP L-64.2 DWDM (CH 20/1561.42 nm)” (p. C-203) Compact: 6

Module/Unit Data Sheet Maximum Per Shelf

“SFP multi-rate up to S-16.2 CWDM (CH 47/1470 nm)” (OC-48)
(p. C-205) through “SFP multi-rate up to L-16.2 CWDM (CH Front/Rear: 40
61/1610 nm)” (p. C-207)
Compact: 24
(OC-3/OC-12)
Front/Rear: 96
Compact: 48
“ALU XFP CWDM-LH 1471NM” (p. C-209) through “ALU XFP Front/Rear: 12
CWDM-LH 1611NM” (p. C-209) Compact: 6

Allowable cross-connections
Overview
This section describes the cross-connections supported by the Alcatel-Lucent
1850 TSS-100. Cross-connections are used to establish connections between the specified
ports/tributaries.
The following cross-connection types are supported:
• One-way (1WAY)
• Two-way (2WAY)
• One-way SNCP cross-connection (1WAYSNCP)
• Two-way SNCP path ring (2WAYSNCP)

One-way cross-connections
A one-way cross-connection is established between the receive side (from the network) of
the FROM port and the transmit side (to the network) of the TO port. A one-way
cross-connection can be established between the receive and transmit side of the same
port (FROM and TO are identical thereby establishing a loopback through the system
cross-connection matrix) or can be added as a bridge to an existing one-way or two-way
cross-connection.

Two-way cross-connections
A two-way cross-connection is established between the FROM and TO ports. A
pass-through cross-connection can be established between the FROM and TO ports if
both tributaries belong to the same STM-n/OC-n ring pair and are both in the same

One-way SNCP cross-connections

A one way SNCP cross-connection is established between the receive side (from the
network) of the FROMPED and FROMPING ports and transmit side (to the network) of
the TO port. A selector must be define which is currently active receive facility based
upon degeneration or failure conditions or upon manual commands.

Two way SNCP cross-connections

A two way SNCP cross-connection is established between the FROMPED and
FROMPING ports and the TO port. In the direction FROM->TO, a selector must define
which is the currently active receive facility based upon degradation or failure conditions
or upon manual commands; in the opposite direction, the signal is bridged towards both
FROMPED and FROMPING facilities.
Drop and continue connections are not supported and ring interconnection topologies are
supported through a set of atomic blocks (both SNCP and unprotected connections).

Cross-connection examples
The following figures show examples of cross-connections supported by the
Alcatel-Lucent 1850 TSS-100.

CCT = 1WAY

FROM TO

CCT = 2WAY

FROM/TO TO/FROM

CCT = 1WAY added to

already existing 2WAY
TO

FROM/TO TO/FROM

Access-to-Access

Note: As shown in above figures, multiple different interconnection scenarios can be

supported mixing the different connection types.

Shelf configuration examples

Low-end SDH ADM
Figure 6-1, “Example of low-end SDH ADM (Alcatel-Lucent 1850 TSS-100)”
(p. 6-18) shows the Alcatel-Lucent 1850 TSS-100 shelf configured as a low-end SDH
ADM, and Figure 6-2, “Example of low-end SDH ADM (Alcatel-Lucent
1850 TSS-100C)” (p. 6-18) shows the Alcatel-Lucent 1850 TSS-100C shelf configured as
a low-end SDH ADM. The configuration comprises the following:
• Trunk
– 2 x STM-16 (protected)
• Client
– 168 E1 (protected)

Figure 6-1 Example of low-end SDH ADM (Alcatel-Lucent 1850 TSS-100)

E1 Access Protection

28 E1 Access
28 E1 Access

28 E1 Access

28 E1 Access
4 STM-16 (P)

PSU
MT100(P)

4 STM-16
EC100(P)

MT100
EC100

E1 (P)
E1
E1
E1

PSU
FL

Figure 6-2 Example of low-end SDH ADM (Alcatel-Lucent 1850 TSS-100C)

FAN100C PWR
14
PSF B
PSF A

E1 Access Protection
E1 Access Protection

HK/Alm/Lamp Access FAN Tray

connectors
12 11Power HK sync
HK/Alm/lamps
B
A

Batt A
SU
S

aux sync
Batt B
connectors connectors
MT100C (P)
EC100C (P)

SDH Line
SDH Line

MT100C
EC100C

E1 (P)
E1
E1
E1
E1
E1
E1
E1
E1
E1
Ac

Ac
Ac

1 2 3 4 5 6 7 8 9 10 15 16 17 18 19 20 21 22

Low-end SDH ADM

Figure 6-3 Example of high-end SDH ADM (Alcatel-Lucent 1850 TSS-100)

E1 Access Protection

28 E1 Access
28 E1 Access
4 STM-16 (P)

STM-16 (P)
STM-4 (P)

PSU
STM-4 (P)
MT100 (P)
EC100 (P)

4 STM-16

4 STM-16
8 STM-4

STM-4
8 OC-48
8 OC-48
MT100
EC100

E1 (P)
DS3
DS3

DS1
DS1
E1

4
4
8

PSU
FL

FAN100C PWR
14

PSF B
PSF A

E1 Access Protection
E1 Access Protection
HK/Alm/Lamp Access FAN Tray
connectors
12 11Power HK sync
HK/Alm/lamps
B
A

Batt A

SU
S
aux sync
Batt B
connectors connectors

MT100C (P)
EC100C (P)

8xSTM1-4

(P)
8xSTM1-4
STM-1 (P)
SDH Line
SDH Line

MT100C
EC100C

STM-1
STM-1
STM-1
E1 (P)

E1
E1
E1

Ac
Ac

Ac
1 2 3 4 5 6 7 8 9 10 15 16 17 18 19 20 21 22

High-end SDH ADM

High-end MSPP
Figure 6-5, “Example of high-end MSPP (Alcatel-Lucent 1850 TSS-100)”
(p. 6-21) shows the Alcatel-Lucent 1850 TSS-100 shelf configured as a high-end Multi
Service Provisioning Platform (MSPP). The configuration comprises the following:
• Trunk
– 1 x STM-64 (protected)
• Client
– 4 x STM-16 (protected)
– 32 GE
– 56 E1 (protected)

Figure 6-5 Example of high-end MSPP (Alcatel-Lucent 1850 TSS-100)

E1 Access Protection

E1 Access Protection
8x1GE Access
8x1GE Access
8x1GE Access
8x1GE Access

28 E1 Access
28 E1 Access

1 STM-64 (P)

4 STM-16 (P)

PSU
MT100 (P)
EC100 (P)

1 STM-64

4 STM-16
MT100
PP10G

PP10G
EC100

E1 (P)
E1

PSU
FL

Figure 6-6, “Example of high-end MSPP (Alcatel-Lucent 1850 TSS-100C)”

(p. 6-22) shows the Alcatel-Lucent 1850 TSS-100C shelf configured as a high-end Multi
Service Provisioning Platform (MSPP). The configuration comprises the following:
• Trunk
– 1 x STM-64 (protected)
• Client
– 20 GE
– 28 E1 (protected)

Figure 6-6 Example of high-end MSPP (Alcatel-Lucent 1850 TSS-100C)

FAN100C PWR
14
PSF B
PSF A

E1 Access Protection
E1 Access Protection
HK/Alm/Lamp Access FAN Tray
connectors

8x1GE/1x10GE
8x1GE/1x10GE
12 11Power HK sync
HK/Alm/lamps
B
A

Batt A

SU
S
aux sync
STM-64 (P)
Batt B
connectors connectors

MT100C (P)
EC100C (P)
STM-64

MT100C

PP10G
EC100C

E1 (P)

E1
E1
E1

Ac
Ac

Ac
1 2 3 4 5 6 7 8 9 10 15 16 17 18 19 20 21 22

High-end mspp compact

Installation cabling
Overview
Alcatel-Lucent offers a full complement of transmission cables and optical jumpers. All
service interfaces have physical connectors.

Cable placement and routing

Refer to Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and TSS-100C) Release
4.1 (ETSI) Installation Guide for cable placement and routing information. Cables must
be routed in accordance with the guidelines provided in the Installation Manuals. Circuit
pack cables must be routed with half of the total number of cables from each side of the
shelf.

IS-IS Level 2 routing guidelines

Introduction
This section provides general guidelines for IS-IS Level 2 Routing in OSI connectionless
network protocol (CLNP) networks with up to 240 total nodes.

IS to IS routing protocol
The IS-IS routing protocol an interior gateway protocol (IGP) that is used for routing
within a single domain. If the domain contains a large number of nodes, nodes must be
split into a number of logical areas. IS-IS Level 1 Routing provides routing between
nodes and other Layer 1 routers within a single area. IS-IS Level 2 Routing provides
routing between the other Layer 2 routers in the network areas that compose the domain.
Support of Level 2 routing by Alcatel-Lucent 1850 TSS-100 means that it can be used to
support routing between areas within large domains.

OSI node vs. Network Element terminology

Each Alcatel-Lucent 1850 TSS-100 is an NE that functions as a single OSI node. Some
NEs support multiple OSI nodes in a single device. So, the term OSI node, when used to
describe network size, may not correspond with the number of NEs in that network.

Symbols
The graphical examples is this chapter use the symbols that are defined in the following
figure. The following figure illustrates an example network with nodes assigned to four
different areas connected by Level 2 routers.

Figure 6-7 Network with Level 2 routers

Area 1

Level 2 Subdomain

Area 2

Area 4

Area 3

= NE Level 1 Router

= NE Level 2 Router
= Generic Level 2 Router

= SNMS
= OSI LAN
= DCC
= Area
= Level 2 Subdomain
NC-DMX-042

Network services access point

Each network node is assigned a Network Services Access Point (NSAP) address. This
address is used by the IS-IS routing protocol. This address can be configured to group
nodes into different logical areas within a network domain.
The Network Services Access Point (NSAP) address is composed of 20 octets. These 20
octets can be represented by 40 hexadecimal characters. The 20 octet-space of the NSAP
address is used store values for the 9 fields that compose the NSAP.
The first 4 octets of the NSAP address are always the same and cannot be changed. The
next 9 octets of the NSAP address are provisionable. The last 7 octets contain the System
Identifier field, which is unique to each node, and the Selector (SEL) field.

Level 2 routing
A Level 1 router directly supports one or more individual network nodes. Level 1 routing
is the routing that takes place within a single area, between Level 1 routers and their
associated nodes.

Maximum number of OSI nodes

The total number of nodes within a Level 1 area cannot exceed 240. The Alcatel-Lucent
1850 TSS-100 can perform Level 1-2 routing as a single node within the Level 1 area
total of 240.
The maximum number of nodes in a domain is determined by multiplying the number of
Level 2 routers by the maximum number of nodes per area, up to a maximum of 50 areas,
and a maximum total of 1000 nodes.

Network engineering rules and guidelines

Overview
To use IS-IS Level 2 Routing, the user must plan and engineer the provisioning of Level 2
routers and area addresses in the network.
The goal is to create a network with all nodes having OSI LAN or DCC connectivity with
each other so that access to all the nodes can be gained from any node in the network.
Rules must be followed to assure OSI LAN and DCC message routing. Guidelines are
recommendations that add survivability in the event of a node, OSI LAN or DCC failure.
Rules must be followed. Guidelines should be followed. There may be customer
applications that cannot adhere to some or all of the guidelines. In most cases, the
potential consequence is that a single failure would at least partially disrupt operations
communications.

Rule: OSI LAN or DCC connectivity within an area

All nodes in an area must have OSI LAN or DCC connectivity within the area to all other
nodes in the same area. Otherwise, the area would be segmented and message routing
could not be expected to function properly. The following figure illustrates a correct and
an incorrect example of assigning nodes to areas.

Figure 6-8 Assigning areas

CORRECT

INCORRECT Both A and B are isolated

A B

= NE Level 1 Router
= NE Level 2 Router
= DCC
= Area
nc-dmx-043

Rule: single Level 2 router sub-domain

All Level 2 routers must have OSI LAN or DCC connectivity, either directly or indirectly
via other Level 2 routers, to all other Level 2 routers in the network to form a single Level
2 router sub-domain that provides connectivity to all areas. If more than one Level 2
router sub-domain exists, the network becomes segmented and routing will not function
properly.

Figure 6-9 Assigning sub-domains

CORRECT

INCORRECT This Level 2 router subdomain

and area are isolated

INCORRECT This area is isolated

= NE Level 1 Router = Area

= NE Level 2 Router = Level 2 Subdomain

= DCC
nc-dmx-004

Guideline: redundant routes within the Level 2 sub-domain

When practical, redundant routes in the Level 2 subdomain should be available between
all Level 2 routers to ensure that proper routing will occur in the event of a single failure.
To satisfy this guideline, every Level 2 router has at least two other Level 2 routers as
direct neighbors.

Figure 6-10 Redundant routes with the Level 2 sub-domain

RECOMMENDED

This Level 2 IS has

only one neighboring
Level 2 IS

NOT RECOMMENDED

= NE Level 1 Router = SNMS

= NE Level 2 Router = OSI LAN/WAN

= DCC
= Generic Level 2 Router
= Area

= Level 2 Subdomain
nc-dmx-045

Guideline: Level 2 router assignment in a ring

The recommended number of Level 2 routers in a ring may be one of the following:
• None
• One
• All nodes in the ring
• Two; for example, when dual-homing or dual ring interworking (DRI) is used.

Figure 6-11 Recommended Level 2 router assignments

All Level 2 routers

No Level 2 routers

Two adjacent
Level 2 routers

One Level 2 router

Two adjacent
Level 2 routers (DRI)

= NE Level 1 Router

= NE Level 2 Router

= Generic Level 2 Router

= SNMS

= OSI LAN/WAN

= DCC
nc-dmx-046

Guideline: Level 2 router area assignments in a ring

For a ring of Level 2 routers, the recommended area assignments may be one of the
following:
• All Level 2 routers are part of the same area.
• Each Level 2 router is part of a different area.
• A pair of adjacent Level 2 routers are in the same area (for example, with
dual-homing or DRI), with either the other Level 2 routers similarly paired off or
individually in different areas.

Figure 6-12 Recommended area assignments

same area different areas

dual homing

different areas

= NE Level 1 Router
= NE Level 2 Router
= DCC
= Area
NC-DMX-047

Guideline: adjacent Level 2 routers within an area

It is recommended that dual Level 2 routers in an area be adjacent to each other and have
a redundant route within the area. Failure to meet this guideline would result in some
messages not being routed properly in the event of a single failure that divides an area
into two separate islands.

Figure 6-13 Recommended placement of Level 2 routers

Failure
A
B

RECOMMENDED
If A or B sends a message to Z
and there is a DCC failure between A and Z,
routing will survive the failure.

Failure
A
B

NOT RECOMMENDED
If A or B sends a message to Z
and there is a DCC failure between A and Z,
routing will not be successful.

Failure

B
A

NOT RECOMMENDED
If A or B sends a message to Z
and there is a DCC failure between A and Z,
routing will not be successful.

= NE Level 1 Router
= NE Level 2 Router
= DCC
= Area
nc-dmx-048

Rule: Level 2 routers on an OSI LAN

If an OSI LAN (or WAN) is used to connect between areas, then at least one node in each
area on the OSI LAN must be provisioned to be a Level 2 router. Otherwise, the areas
won't route to each other via the OSI LAN.
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C 6-31
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
System planning and engineering Network engineering rules and guidelines

Figure 6-14 Level 2 router assignments on an OSI LAN

CORRECT

INCORRECT
This area is isolated

= NE Level 1 Router

= NE Level 2 Router

= Generic Level 2 Router

= SNMS

= OSI LAN/WAN

= DCC

= Area
nc-dmx-050

Guideline: OSI LAN redundancy

If an OSI LAN (or WAN) is the only method of connecting between areas, then at least
two Level 2 routers directly connected to the OSI LAN for each area are recommended
for redundancy purposes. A second, separate OSI LAN hub would provide additional
redundancy.

Figure 6-15 OSI LAN redundancy

RECOMMENDED

= NE Level 1 Router

= NE Level 2 Router

= Generic Level 2 Router

= Optical EMS

= OSI LAN/WAN
= DCC

= Area
nc-dmx-051

Overview
Purpose
This chapter contains information on ordering the Alcatel-Lucent 1850 TSS-100
equipment and software. The information in this chapter tells you where to go for
ordering information.

Contents

Introduction 7-1

Introduction
Overview
Alcatel-Lucent has created engineering and ordering information to facilitate the ordering
of all products in the future. The engineering and ordering information is updated for each
planned Release, and contains all of the information needed to order the Alcatel-Lucent
1850 TSS-100 equipment. The information contained in the engineering and ordering
information will not be duplicated here in the interest of keeping all information current
and consistent at all times. This chapter will explain how to make sure you are using the
most current version of the engineering and ordering information and where to order the
documents.
Any information about particular pieces of equipment (that is, the uses of various cables
versus other) is meant to convey useful information that may also be contained in the
engineering and ordering information. This information is meant to be used in
conjunction with engineering and ordering information, but not to replace them.

Overview
Purpose
This chapter describes the support services available to Alcatel-Lucent customers.
Alcatel-Lucent offers a number of services to assist customers with Engineering,
Installation and Technical Support of their networks. Additionally, Alcatel-Lucent offers
product-specific training courses.

Contents

Services 8-1
Training 8-2

Services
Overview
Alcatel-Lucent provides a full life-cycle of services and solutions to help you plan,
design, implement, and operate your network in today's rapidly changing and complex
environment.

Services
For information regarding services, refer to the Alcatel-Lucent Services web site
(http://www.alcatel-lucent.com/services).

Technical support
For technical support, contact your local customer support team. See the Alcatel-Lucent
Support web site (http://www.alcatel-lucent.com/support) for contact information.

Training
Overview
Alcatel-Lucent offers a formal training curriculum to complement your product needs.

Registering for a course

To explore the available courses, enroll in a training course at one of Alcatel-Lucent's
corporate training centers, or to arrange for a suitcase session at your facility, choose one
of the following contact methods:
• Refer to Product Training web site (https://training.alcatel-lucent.com/) for access to
the training catalog
• Within the United States, call 888-582-3688 and select Prompt 2.
• Outside the United States:
– Telephone: +1 407 767 2667
– Fax: +1 407 767 2677
– Refer to Contact Us web site (http://www.alcatel-lucent.com/contactus) for a
detailed list of international contact numbers.
– Contact your in-country training representative

Overview
Purpose
This chapter details quality and reliability information for the Alcatel-Lucent
1850 TSS-100.

Contents

Alcatel-Lucent quality policy 9-1

Reliability program and specifications 9-2
Failure rates 9-3
Conformance statements 9-6
Quality certifications 9-7
Warranty 9-7
Eco-environmental statements 9-8

Alcatel-Lucent quality policy

Quality policy
We ensure that everything we do must be focused on becoming the trusted partner of our
customers by:
• Delivering high quality, secure and reliable products, services, software and solutions
the first time, every time, and on time - as promised.
• Continuously making improvements and looking for innovative ways to anticipate
and fully meet the highest expectations of our customers.
• Counting on all employees to be personally accountable for putting the customer first
and honoring the commitments we make.

Reliability program and specifications

Overview
The reliability program provides enhanced reliability and is implemented as an integral
part of the Alcatel-Lucent Product Life Cycle (PLC) process. The reliability program is
comprehensive, and includes activities such as setting and ensuring compliance with
customer-focused system-reliability requirements, ensuring component qualification is
consistent with use environment and system design, assuring satisfactory
component-attachment reliability, predicting failure rates of Field Replaceable Units
(FRUs), making sparing recommendations, assessing reliability architecture, modeling
system reliability, assuring satisfactory system-downtime performance, reducing
hardware failure rates through Environmental Stress Testing (EST), and tracking field
returns.

Design and development

During the design and development stage, reliability predictions, qualification and
selection of components, definition of quality assurance audit standards, and prototyping
of critical areas of the system ensure built-in reliability.

Manufacturing and field deployment

During manufacturing and field deployment, techniques such as environmental stress
testing, production quality audits, field-return tracking, failure-mode analysis, and
feedback and corrective-action further enhance the ongoing reliability improvement
efforts on the Alcatel-Lucent 1850 TSS-100.

Environmental Stress Testing

Alcatel-Lucent 1850 TSS-100 boards are subjected to an Environmental Stress Testing
(EST) program. The purpose of the program is to improve reliability by reducing early
life failures and implementing root-cause analysis and corrective action on circuit packs
that fail EST.

Transmission downtime
Alcatel-Lucent 1850 TSS-100 satisfies a stringent set of reliability specifications. Some
of the critical specifications include Telcordia ® downtime requirements and objectives
for multiplexers.
....................................................................................................................................................................................................................................
9-2 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Quality and reliability Failure rates

Failure rates
Overview
This section provides card and SFP/XFP failure rates for Alcatel-Lucent 1850 TSS-100.

Card failure rates

Table 9-1, “Card failure rates” (p. 9-3) lists failure-rate predictions for all cards.
These failure rates were determined per Telcordia ® SR-332.
Important! Failure-rate predictions are estimates; actual values may vary.

Table 9-1 Card failure rates

Card Apparatus Code Predicted Failure

Rate (FIT)
Equipment Controller TSS-100 EC100 2817
Equipment Controller TSS-100C EC100C 2817
Fan Unit TSS-100 High Performance FAN100 3156
Fan Unit TSS-100C High Performance FAN100C 3156
TSS-100 4FANS Fan Unit TSS-100 4FANS TBD
TSS-100C 4FANS Fan Unit TSS-100C 4FANS TBD
Power Supply with Switch (ETSI) POW100 1282
Power Supply without Switch (ETSI) POW100NS 1282
Termination Bus (Front Access) TBF 281
Termination Bus (TSS-100C) TB100C 362
Top Rack Unit TRU 178
TSS-100 Front Access Shelf (ETSI) S100F 3219
TSS-100 Compact Shelf S100C 2107
Universal Matrix TSS-100 MT100 5818
Universal Matrix TSS-100C MT100C 4393
63-Port E1/DS1 Multiplexer 63E1DS1M TBD
56-Port E1/DS1 Multiplexer 56PDS1 2329
28-Port E1 Access E1UAC 3501
28-Port E1/DS1 Access (D-sub connector E1DS1BAC 2165
interface)1

Card Apparatus Code Predicted Failure

Rate (FIT)
28-Port E1/DS1 Access Protection (D-sub E1DS1PAC 281
connector interface)2
24-Port E3/DS3/EC1 Multiplexer + TMUX E3DS3TM 2728
12-Port E3/DS3/EC1 Access Protection DS3PRAC 344
12-Port E3 Access 12XE3AC 1583
Combo PDH ASYMRTM TBD
32xDS1/E1 Access Module E1DS1BAC TBD
32xDS1/E1 Protection Access E1DS1PAC TBD
32xE1 Access Module E1UAC TBD
16xSTM1 EL Access Protection Module SEPAC TBD
8-Port STM-1/OC-3/STM-4/OC-12 8PSO 2520
4-Port STM-16/OC-48 4P2G5SO 2667
1-Port STM-64/OC-192 1P10GSOE 3697
Multirate STM1/4/16 port MRSOE 752
10G Packet Transport Processor PP10G 1692
10G Packet Processor 4XGE PP10G 5852
8XGE Packet Expander Access 8XGEEA 1692
8XGE Synchronous Ethernet Packet Expander 8XGEEA 1392
Access
1X10GE Packet Expander Access 10GEEA 2766
1x10GbE Packet Module - Half Slot PP10GEHS TBD
1x10Gb Packet Module - Half Slot PP10GHS TBD
24 x Fast Ethernet Electrical Ports Packet PE24XFEA TBD
Expander
OMDX 8100 L1 DWDM (FOADM) OMDX8100 TBD
OMDX 8100 L2 DWDM (FOADM) OMDX8100 TBD
OMDX 8 L2 DWDM Access OMDX8A TBD
2F 8CH MDX2 1471-1611 CMDX8 TBD
CWDM Mux/Demux with 8 channels CMDX8A TBD
(Equipment Type)
Optical Booster BST10GA TBD

Card Apparatus Code Predicted Failure

Rate (FIT)
Optical Pre- Amplifier PRE10GA TBD

Notes:
1. The 8DG25556AAXX E1DS1BAC (D-sub connector interface) replaces the discontinued
8DG02672AAXX 28XDS1AC card (SCSI connector interface).
2. The 8DG25562AAXX E1DS1PAC (D-sub connector interface) replaces the discontinued
8DG02874AAX DS1PRAC card (SCSI connector interface).
3. The 8DG09099AAXX PP10G replaces the 8DG02652AAXX PP10G. The
8DG02652AAXX PP10G is being discontinued. The 8DG09099AAXX and
8DG02652AAXX PP10G are supported in Release 3.1; however, the 8DG02652AAXX
PP10G is not supported in Release 4.0 and later releases.

SFP/XFP failure rates

The following table provides failure-rate predictions for all SFP/XFP modules.
These failure rates were determined per Telcordia ® SR-332.
Important! Failure-rate predictions are estimates; actual values may vary.

Table 9-2 SFP/XFP failure rates

SFP/XFP Predicted Failure Rate

(FIT)
STM-1 Electrical SFP 250
STM-1/OC-3 SFPs 250
STM-4/OC-12 SFPs 250
STM-16/OC-48 SFPs 250
100BASE-X SFPs 250
1000BASE-X SFPs 250
1000BASE-X Bidirectional SFPs 250
1000BASE-T Electrical SFPs 250
STM-64/OC-192 and 10GbE XFPs 750
10GbE XFPs 750
STM-64/OC-192 DWDM XFPs 750
STM-n/OC-n CWDM SFPs 250

SFP/XFP Predicted Failure Rate

(FIT)
STM-64/OC-192 CWDM XFPs 750

Conformance statements
Interference information
Alcatel-Lucent 1850 TSS-100 and TSS-100C have been tested and found to comply with
the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules for
unintentional radiators and to the reference harmonized standards for the European EMC
directive 2004/108/EC such as the EN 300386 V1.5.1 (Ed. 2010), Rules for transmission
equipment, operating in environment "TELECOMMUNICATION CENTRES". The
emission requirements for “TELECOMMUNICATION CENTRES” are according to
EN55022 (Ed. 2006) + A1 (Ed. 2007), Class A Rules. The products also comply with
CISPR22 Ed. 2008 Class A Rules.
These limits provide reasonable protection against harmful interference when the
equipment is operated in a commercial environment. If the equipment is not installed and
used in accordance with the guidelines in this document, the equipment may cause
harmful interference to radio communications. Operation of this equipment in a
residential area is likely to cause harmful interference, in which case the user will be
required to correct the interference at the expense of the user.
The following warning applies to the EN55022 and CISPR22 standards:
Warning
This is a class A product. In a domestic environment this product may cause radio
interference in which case the user may be required to take adequate measures.

Quality certifications
Quality Management System
The Alcatel-Lucent 1850 TSS-100 adheres to the Alcatel-Lucent Quality Management
System (ALU QMS) as described in the OMSN North America (NA) Product Realization
(PR) Quality Manual.
The ALU QMS enables Alcatel-Lucent to demonstrate a global approach for quality
management, deploy common processes, share lessons learned for improving efficiency
and customer satisfaction, and achieve consolidated registration to international
standards.

TL 9000
TL 9000 is a telecommunications industry-specific set of requirements and measurements
for software, hardware and services. TL 9000 is built on existing industry standards,
including ISO 9001. Conformance to TL 9000 constitutes conformance to corresponding
ISO 9001 requirements. TL 9000 consolidates various industry requirements and
customer requests for measurements; it reduces problems caused by multiple
requirements and audits; and it standardizes reporting and use of supplier performance
data via defined measurements. TL 9000 requires well-documented, implemented
controls for design development, production, delivery, installation, and service. The
primary purpose of TL 9000 is to ensure that manufacturers produce products with
consistently high levels of quality and service.

Warranty
Hardware warranty
Alcatel-Lucent provides a one year hardware warranty on the Alcatel-Lucent
1850 TSS-100, effective from the date the unit is shipped.

Hardware failure emergencies

In the event of a service outage or failure during the initial installation and turn-up of the
Alcatel-Lucent 1850 TSS-100, go to Global Reverse Supply Chain web site
(http://esupply.web.lucent.com/grsc/). The instructions and contacts for various global
locations are listed under, “Returns Information” in the upper right part of the page.

Software warranty
Alcatel-Lucent offers a 90-day warranty for defect resolution. All warranties pertain to the
deployment of a release and do not apply to individual software licenses.
Alcatel-Lucent's warranty on any software release will not exceed 90 days for defect
resolution. All warranties pertain to the deployment of a release and do not apply to
individual software licenses.
For more warranty information, contact your local Alcatel-Lucent account executive.

Eco-environmental statements
Overview
The statements that follow are the eco-environmental statements that apply to
Alcatel-Lucent 1850 TSS-100 when deployed in the European Union, China, Canada, and
the United States.

Packaging collection and recovery requirements

Countries, states, localities, or other jurisdictions may require that systems be established
for the return and/or collection of packaging waste from the consumer or other end user,
or from the waste stream. Additionally, reuse, recovery and/or recycling targets for the
return and/or collection of the packaging waste may be established.
For more information regarding collection and recovery of packaging and packaging
waste within specific jurisdictions, contact the Alcatel-Lucent Environment, Health and
Safety organization or Alcatel-Lucent Hazardous Waste Center technical support at (888)
539-2783.

Material content compliance

European Union RoHS
European Union (EU) Directive 2002/95/EC, “Restriction of the use of certain Hazardous
Substances” (RoHS), restricts the use of lead, mercury, cadmium, hexavalent chromium,
and certain flame retardants in electrical and electronic equipment. This Directive applies
to electrical and electronic products placed on the EU market after 1 July 2006, with

Recycling / take-back / disposal of products

Electronic products bearing or referencing the symbols shown below shall be collected
and treated at the end of their useful life, in compliance with applicable European Union
and other local legislation. They shall not be disposed of as part of unsorted municipal
waste. Due to materials that may be contained in the product and batteries, such as heavy
metals, the environment and human health may be negatively impacted as a result of
inappropriate disposal.

Note 2: For batteries put on the market in the European Union, a chemical symbol Hg
(mercury), Cd (cadmium), or Pb (lead), or a combination of those symbols, beneath the
cross-out wheeled bin indicates that the battery contains the corresponding heavy metals.

Moreover, in compliance with legal requirements and contractual agreements, where

applicable, Alcatel-Lucent will offer to provide for the collection and treatment of
Alcatel-Lucent products bearing the logo at the end of their useful life, or products
displaced by Alcatel-Lucent equipment offers.
For information regarding take-back of equipment by Alcatel-Lucent, or for more
information regarding the requirements for recycling/disposal of a product, please contact
your Alcatel-Lucent account manager. Visit the Alcatel-Lucent Take-Back
(http://www.alcatel-lucent.com/product_takeback) web page, or contact Alcatel-Lucent
Takeback Support (mailto:[email protected]). For technical information on
product treatment, consult the Alcatel-Lucent Recycling Information (http://www.alcatel-
lucent.com/product_recycling) web page.

Overview
Purpose
This section contains the technical specifications for the Alcatel-Lucent 1850 TSS-100.
For detailed specifications relating to signal, alarm, and control interfaces, refer to the
Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and TSS-100C) Release 4.1
(ETSI) Engineering Rules.

Contents

Physical design specifications 10-2

Power and weight specifications 10-3
Electrical interface specifications 10-4
Optical units interface characteristics 10-5
Ethernet interface specifications 10-33
Control interface specifications 10-35

Physical design specifications

Equipment rack specifications

Item Characteristics
Description Unequal-flange earthquake racks that provide mounting space
for shelves in areas where zone 4 earthquake compliance is
necessary
Rack Height 2200 mm
Rack Width 600 mm
Rack Depth 300 mm
Matrix capacity 100 Gb/s STS-1 cross-connect capacity per shelf
I/O capacity 96 STM-1 s, 96 STM-4 s, 40 STM1-16 s, 8 STM1-64 s, 144
DS3s, or 392 E1s per shelf
Alarm interface Dedicated Sub-D connector interface
Input voltage -48 V dc (nominal)

Shelf dimensions

Shelf Dimensions
Alcatel-Lucent 1850 TSS-100 489.5 mm (19.27 in.) wide
front access shelf (global) 620.0 mm (24.41 in.) high
288.0 mm (11.34 in.) deep
Alcatel-Lucent 1850 TSS-100 470.5 mm (18.52 in.) wide
rear access shelf (ANSI only) 443.3 mm (17.45 in.) high
493.9 mm (19.45 in.) deep
Alcatel-Lucent 1850 TSS-100C 531.0 mm (20.90 in.) wide
compact shelf (ETSI only) 398.0 mm (15.67 in.) high
294.0 mm (11.57 in.) deep

Environmental condition specifications

Item Operating Non-Operating

Ambient temperature -40 °C to 65 °C -40 °C to 70 °C
(-40 °F to 149 °F) (-40 °F to 158 °F)

Item Operating Non-Operating

Relative humidity 5 to 85% 5 to 85%
(without condensation) (without condensation)
Altitude -60 to 1800 m -60 to 1800 m
Cooling Forced air
Vibration and shock Earthquake requirements
Duty cycle Continuous, unattended

Power and weight specifications

Primary power interface specifications

Item Characteristics
Location:
PDU-Quad A power in (APWR)
B power in (BPWR)
Separate power return (GND)
Top of rack CO rack ground
Function Separates office primary power and ground from rack
Input voltage:
-48 V (nominal) systems -37 to -72 Vdc
Low input voltage does not damage the equipment. The
unit will shut down when the voltage reaches -37Vdc
(±1.0Vdc) for more than 100ms.
Isolation Positive primary power return is isolated from CO
ground.
Input power Power consumption varies with system size, fill, and
options provided.
Power consumption (maximum):
Rack (1 fully equipped shelf, 1600 W
PDU-Quad, fans)
Rack (2 fully equipped shelves, 3200 W
PDU-Quad, fans)

Rack Weight (kg)

Shelf (with fan) 50
Rack (empty) 70
PDU (in Optinex rack) 3

Electrical interface specifications

E1 interface specifications

Item Characteristics
Location Transmit and receive Sub-D 78 connectors on the
E1DS1BAC module and 32 75Ω transmit and receive
connectors (64 total) on the E1UAC module
Function Couples the incoming and outgoing E1 channels into and out
of the Alcatel-Lucent 1850 TSS-100 shelf
Capacity 1 to 28 full-duplex E1 ports per E1DS1BAC module and
E1UAC module
Frequency 2.048 Mb/s ±50 ppm
Line code HDB3, Framed, Multiframed (CRC enabled), and Unframed
formats are supported.
Line impedance 75 Ω unbalanced (E1UAC), or 120 Ω (E1DS1BAC) ±5%,
balanced
Level:
Input @ 1024 kHz 0 to 2.37V (E1UAC connectors)
0 to 3V (E1DS1BAC connectors)
Output @ 1024 kHz 0 to 2.37V (E1UAC connectors)
0 to 3V (E1DS1BAC connectors)
Output Complies with G.703 for electrical characteristics and G.704
for frame format.
Cable type 28-pair, 120Ω shielded (E1DS1BAC)
Individual 75Ω coax cables (E1UAC)
Maximum cable attenuation 6dB @ 1024 KHz

Optical units interface characteristics

STM-1 interface characteristics

Item Characteristics
Location Optical connectors on SFPs. Connectors are mounted on
front panel of modules.
Function Couples STM-1 optical data into and out of shelf.
Capacity 1 STM-1 per SFP
Frequency 155.52 Mb/s
Line code Nonreturn-to-Zero (NRZ)
Format Meets Telcordia GR-253-CORE
Optical transmitter:
Extinction ratio (logic 0 to 1) SS-11: 8.2 dB
SL-11: 10 dB
SL-12: 10 dB
Center wavelength SS-11: 1310
SL-11: 1310
SL-12: 1550
RMS spectral width IR SS-11: 7.7 nm
SL-11: 3 nm
SL-12: NA (SLM)
Input cable Single-mode fiber
Output cable Single-mode fiber
Mating connector type LC

STM-4 interface specifications

Item Characteristics
Location Optical connectors on SFPs. Connectors are mounted on
front panel of modules.
Function Couples STM-4 optical data into and out of shelf.
Capacity 1 STM-4 per SFP
Frequency 622.08 Mb/s
Line code Nonreturn-to-zero (NRZ)
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C 10-5
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Technical specifications Optical units interface characteristics

Item Characteristics
Format Telcordia GR-253-CORE requirement
Input Cable Single-mode fiber
Output Cable 5D Single-mode fiber with 3.0 in. bending radius
Optical transmitter:
Extinction ratio (logic 0 to 1) SS-41: 8.2 dB
SL-41: 10 dB
SL-42: 10 dB
Center wavelength SS-41: 1310 nm
SL-41: 1310 nm
SL-42: 1550 nm
RMS spectral width IR SS-41: 4.0 nm
SL-41: NA (SLM)
SL-42: NA (SLM)

STM-16 interface specifications

Item Characteristics
Location Optical connectors on SFPs. Connectors are mounted on
front panel of modules.
Function Couples STM-16 optical data into and out of shelf.
Capacity One STM-16 per SFP
Frequency 2.488 Gb/s
Line code Nonreturn-to-zero (NRZ)
Format Telcordia GR-253-CORE requirement
Input Cable Single-mode fiber
Output Cable 5D Single-mode fiber with 1.0 in. bending radius
Optical transmitter:
Extinction ratio (logic 0 to 1) SI-161 8.2 dB
SS-161 8.2 dB
SL-161 8.2 dB
SL-162 8.2 dB

Item Characteristics
Center wavelength SI-161 1310 nm
SS-161 1310 nm
SL-161 1310 nm
SL-162 1550 nm
RMS spectral width IR SI-161 4 nm
SS-161 NA (SLM)
SL-161 NA (SLM)
SL-162 NA (SLM)
Mating connector type LC

STM-64 interface specifications

Item Characteristics
Location Optical connectors on XFPs. Connectors are mounted on
front panel of modules.
Function Couples STM-64 optical data into and out of shelf.
Capacity One STM-64 per XFP.
Frequency 9.95 Gb/s
Line code Nonreturn-to-zero (NRZ)
Input Cable Single-mode fiber
Output Cable 5D single-mode fiber with 3.0 in. bending radius
Optical transmitter
Extinction ratio (logic 0 to 1) XI-641: 1310 nm
LS-642: 1550 nm
Center wavelength XI-641: 1310 nm
LS-642: 1550 nm
RMS spectral width IR XI-641: NA (SLM)
LS-642: NA (SLM)
Mating connector type LC

Signal Type Module TransmitterTransmitter Output Receiver Sensitivity

Reach Power (dBm) (dBm)
Minimum Maximum Minimum Maximum
STM-1 SS-11 IR -15.0 -8.0 -30.0 -8.0
STM-1 SL-11 LR -5.0 0.0 -34.0 -10.0
STM-1 SL-12 LR -5.0 0.0 -34.0 -10.0
STM-4 SS-41 IR -15.0 -8.0 -28.0 -8.0
STM-4 SL-41 LR -3.0 2.0 -28.0 -8.0
STM-4 SL-42 LR -3.0 2.0 -28.0 -8.0
STM-16 SI-161 SR -10.0 3.0 -19.0 3.0
STM-16 SS-161 IR -5.0 0.0 -19.0 0.0
STM-16 SL-161 LR -2.0 3.0 -27.0 -9.0
STM-16 SL-162 LR -2.0 3.0 -28.0 -9.0
STM-64 XI-641 SR -6.0 -1.0 -11.0 0.5
STM-64 XS-642 IR -1.0 2.0 -14.0 -1.0
(XFP)
STM-64 XS-642 IR -1.0 2.0 -14.0 -1.0
(XFP-E)
STM-64 XP1L1-2D2 LR -1.0 2.0 -24.0 -7.0
(XFP-E)

1P10GSO (STM-64/OC-192) optical interface characteristics

Optical Interface Specification

Type of fiber 9/125 μm SMF, in accordance with ITU-T G.652, G.653, G.654, G.655
Connector type LC (on XFP module)
Optical bit rate 9.95328 Gbps (OC-192 / STM-64)

Optical Interface Specification

Optical interface Telcordia GR-253-CORE SR-1 OC192, IR-2 OC192, LR2 OC192
type (in ITU-T G.691 I-64.1, S-64.2b, G.693 VSR 2000, G.959.1 P1L1-2D2
accordance with
DWDM interface for long haul w/ APD detector. Both fixed XFPs (@100
the XFP module
GHz grid spacing) and tunable XFPs (@50 GHz grid spacing) are
plugged on)
supported
ITU-T G.695 C64L1-2D2 Long haul CWDM w/ APD detector
Wavelength range 2nd window for SR-1 OC192, I–64.1 and VSR 2000
3rd window for IR-2 OC192, S–64.2b, LR2 OC192, P1L1-2D2, CWDM
and DWDM
Other interfaces Refer to “B&W XFPs optical characteristics” (p. 10-25), “CWDM XFPs
characteristics optical characteristics” (p. 10-29) and “DWDM XFPs optical
characteristics” (p. 10-27) for XFP details.

4P2G5SO (STM-16/OC-48) optical interfaces characteristics

Optical Interface Specification

Type of fiber 9/125 μm SMF, in accordance with ITU-T G.652, G.653, G.654, G.655
Connector type LC (on SFP module)
Optical bit rate 2.488 Gbps (STM-16 / OC-48)
Optical interface Telcordia GR-253-CORE SR-1 OC48, IR-1 OC48, LR-1 OC48, LR-2
type (in accordance OC48
with the SFP ITU–T G.957 I–16.1, S-16.1, L–16.1, L–16.2
module plugged
ITU-T G.695 C8L1-1D2, Long haul CWDM w/ APD detector
on)
ITU-T G.695 C8S1-1D2, Short haul CWDM w/ PIN detector
DWDM interface for long haul w/ APD detector
Wavelength range 2nd window for SR-1 OC48/I–16.1, IR-1 OC48/S-16.1, LR-1
OC48/L-16.1
3rd window for LR-2 OC48/L-16.2, DWDM and CWDM (PIN/APD)
Other interfaces Refer to “B&W SFPs optical characteristics” (p. 10-10), “DWDM SFPs
characteristics optical characteristics” (p. 10-23) and “CWDM SFPs optical
characteristics” (p. 10-24) for SFP details

Optical Interface Specification

Type of optical fiber 9/125 μm SMF, 50/125 μm MMF, 62.5/125 μm MMF, in accordance
with ITU-T G.652, G.653, G.654, G.655
Connector type LC (on SFP module)
Optical bit rate 155.520 Mbps (STM-1 / OC-3)
622.080 Mbps (STM-4 / OC-12)
Optical interface type (in Telcordia GR-253-CORE IR-1 OC3, LR-1 OC3, LR-2 OC3, IR-1
accordance with the SFP OC12, LR-1 OC12, LR-2 OC12
module plugged on) ITU–T G.957 S–1.1, L-1.1, L-1.2, S-4.1, L-4.1, L-4.2
Wavelength range 2nd window for IR-1 OC3/S–1.1, LR-1 OC3/L-1.1, IR-1
OC12/S-4.1, LR-1 OC12/L-4.1
3rd window for LR-2 OC3/L-1.2 and LR-2 OC12/L-4.2
Other interfaces Refer to “B&W SFPs optical characteristics” (p. 10-10) for SFP
characteristics details

B&W SFPs optical characteristics

B&W dual fiber monodirectional SFPs optical characteristics

Table 10-1 STM-1/OC-3 monodir SFPs optical characteristics

ETSI STM-1 S-1.1 STM-1 L-1.1 STM-1 L-1.2

Parameter Unit
ANSI IR-1 OC-3 LR-1 OC-3 LR-2 OC-3
Addressed wavelength 1261 ⇒ 1360 1270 ⇒ 1360 1480 ⇒ 1580 nm
Min. launched power -15 -5 -5 dBm
Max. launched power -8 0 0 dBm
Allowed bit rates 100⇒155.520 2.048⇒155.520 155.520 Mbps
Min. extinction ratio 8.2 10 10 dB
Spectral Max. -20 dB bandwidth NA 1 note 1 1 nm
width Max. RMS width 7.7 3 note 2 NA nm
Minimum SMSR NA 30 if SLM laser 30 dB
Max. chromatic dispersion -100 ⇒ +100 -250 ⇒ +250 1900 ps/nm
-10
Min. sensitivity, @ BER=1E -28 -34 -34 dBm
Min. overload -8 -10 -10 dBm
Max. optical path penalty 1 1 1 dB

ETSI STM-1 S-1.1 STM-1 L-1.1 STM-1 L-1.2

Parameter Unit
ANSI IR-1 OC-3 LR-1 OC-3 LR-2 OC-3
Max. receiver reflectance -14 -14 -25 dB
Optical connector (Tx/Rx) LC LC LC
Fibre type SMF SMF SMF
Acronym SS-11 SL-11 SL-12
Equipped on refer to Figure 4-7, “SFP Modules - view” (p. 4-43)

Notes:
1. If SLM laser
2. If MLM laser

Table 10-2 STM-4/OC-12 monodir SFPs optical characteristics

ETSI STM-4 S-4.1 STM-4 L-4.1 STM-4 L-4.2

Parameter Unit
ANSI IR-1 OC-12 LR-1 OC-12 LR-2 OC-12
Addressed wavelength 1274 ⇒ 1355 1280 ⇒ 1335 1480 ⇒ 1580 nm
Min. launched power -15 -3 -3 dBm
Max. launched power -8 +2 +2 dBm
Allowed bit rates 622.080 622.080 622.080 Mbps
Min. extintion ratio 8.2 10 10 dB
Spectral Max. -20dB bandwidth NA 1 1 nm
width Max. RMS width 2.5 NA NA nm
Minimum SMSR NA 30 30 dB
Max. chromatic dispersion -100 ⇒ +100 -250 ⇒ +250 1900 ps/nm
Min. sensitivity, @ BER=1E-10 -28 -28 -28 dBm
Min. overload -8 -8 -8 dBm
Max. optical path penalty 1 1 1 dB
Max. receiver reflectance -14 -14 -27 dB
Optical connector (Tx/Rx) LC LC LC
Fiber type SMF SMF SMF
Acronym SS-41 SL-41 SL-42
Equipped on Refer to Figure 4-7, “SFP Modules - view” (p. 4-43).

Table 10-3 STM-16/OC-48 monodir SFPs optical characteristics

ETSI Interface STM-16 I-16.1 STM-16 S-16.1

Parameter Unit
ANSI Interface SR-1 OC-48 IR-1 OC-48
Addressed wavelength 1270 ⇒ 1360 1270 ⇒ 1360 nm
Min. launched power -10 -5 dBm
Max. launched power -3 0 dBm
Allowed bit rates 2.48832 2.125; 2.48832 Gbps
Min. extinction ratio 8.2 8.2 dB
Spectral Max. -20dB bandwidth NA 1 nm
width Max. RMS width 4 NA nm
Minimum SMSR NA 30 dB
Max. chromatic dispersion -12 ⇒ +12 -100 ⇒ +100 ps/nm
Min. sensitivity, @ BER=1E-10 -18 -18 dBm
Min. overload -3 0 dBm
Max. optical path penalty 1 1 dB
Max. receiver reflectance -27 -27 dB
Optical connector (Tx/Rx) / Fibre type LC / SMF
Acronym SI-161 SS-161
Equipped on See Figure 4-7, “SFP Modules - view” (p. 4-43).

Table 10-4 STM-16/OC-48 long haul monodir SFPs optical characteristics

ETSI STM-16 L-16.1 STM-16 L-16.2

Parameter Unit
ANSI LR-1 OC-48 LR-2 OC-48
Addressed wavelength 1280 ⇒ 1335 1500 ⇒ 1580 nm
Min. launched power -2 -2 dBm
Max. launched power +2 +2 dBm
Allowed bit rates 2.48832 2.48832 Gbps
Min. extinction ratio 8.2 8.2 dB
Spectral Max. -20dB bandwidth (nm) 1 1 nm
width Max. RMS width (nm) NA NA nm
Minimum SMSR 30 30 dB
Max. chromatic dispersion -250 ⇒ +250 +1600 ps/nm

ETSI STM-16 L-16.1 STM-16 L-16.2

Parameter Unit
ANSI LR-1 OC-48 LR-2 OC-48
Min. sensitivity, @ BER=1E-10 -27 -28 dBm
Min. overload -8 -8 dBm
Max. optical path penalty 1 2 dB
Max. receiver reflectance -27 -27 dB
Optical connector (Tx/Rx) / Fibre type LC / SMF
Acronym SL-161 SL-162
Equipped on See Figure 4-7, “SFP Modules - view” (p. 4-43).

Table 10-5 Multirate monodir SFPs optical characteristics

ETSI S-16.1 Multirate Multiformat

Parameter Unit
ANSI IR-1 OC-48 Multirate Multiformat
Addressed wavelength 1290 ⇒ 1330 nm
Min. launched power -5 dBm
Max. launched power 0 dBm
Allowed bit rates 100 ⇒ 2700 Mbps
For bit rates > 2.125 Gbps = 8.2
Min. extinction ratio dB
For bit rates < 2.125 Gbps = 9
Spectral Max. -20 dB bandwidth (nm) 1 nm
width Max. RMS width (nm) NA nm
Minimum SMSR 30 dB
Max. chromatic dispersion -100 ⇒ +100 ps/nm
-10
Min. sensitivity, @ BER=1E -18 dBm
Min. overload 0 dBm
Max. optical path penalty 1 dB
Max. receiver reflectance -27 dB
Optical connector (Tx/Rx) / Fibre type LC / SMF
Acronym SS-161AR
Equipped on See Figure 4-7, “SFP Modules - view” (p. 4-43).

Table 10-6 FE monodir SFPs optical characteristics

Parameter 100BaseFX (FE) 100BaseLX (FE) Unit

Addressed wavelength 1270 ⇒ 1380 1260 ⇒ 1360 nm
Min. launched power -20 -15 dBm
Max. launched power -14 -8 dBm
Allowed bit rates 125; 155 125 Mbps
Min. extinction ratio 10 5 dB
Spectral Max. -20 dB bandwidth NA NA nm
width Max. RMS width 74 7.7 nm
Minimum SMSR - - dB
Max. chromatic dispersion 288 - ps/nm
Min. sensitivity, @ BER=1E-10 w/ fiber -31 -26 dBm
Min. sensitivity, @ BER=1E-12 w/ fiber -29 -25 dBm
Min. overload -14 -8 dBm
Max. optical path penalty - - dB
Max. receiver reflectance -12 -12 dB
Optical connector (Tx/Rx) LC/PC
Fiber type 9/125 μm SMF
100FXETH / 100B-LX /
Acronym / Interface type
100Base-FX 100Base-LX
Equipped on See Figure 4-7, “SFP Modules - view” (p. 4-43).

Table 10-7 GE monodir SFPs (SX, LX) optical characteristics

1 GE 1 GE
Parameter Unit
1000Base-SX 1000Base-LX/LH (10)
Addressed wavelength 820 ⇒ 860 1270 ⇒ 1355 nm
Min. launched power -9.5 -11 dBm
Max. launched power -4 -3 dBm
Allowed bit rates 1.250 1.250 Gbps
Min. extinction ratio 9.0 9.0 dB
Max. -20 dB
Spectral NA NA nm
bandwidth
width
Max. RMS width 0.85 4 nm
....................................................................................................................................................................................................................................
10-14 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Technical specifications Optical units interface characteristics

1 GE 1 GE
Parameter Unit
1000Base-SX 1000Base-LX/LH (10)
Minimum SMSR NA NA dB
Max. chromatic dispersion - - ps/nm
-12
Min. sensitivity, @ BER=1E -17 -19 dBm
Min. overload 0 -3 dBm
Max. optical path penalty - - dB
Max. receiver reflectance -12 -12 dB
Optical connector (Tx/Rx) LC LC
50/125 μm 10 km 9/125 μm SMF
MMF-550m
Fiber type 50/125 μm MMF-550m
62.5/125 μm
MMF-275m 62.5/125 μm MMF-550m

Acronym ANY-DATAS ANY-DATAS

Interface type 1000Base-SX 1000Base-LX
Equipped on See Figure 4-7, “SFP Modules - view” (p. 4-43).

Table 10-8 GE monodir SFPs (VX, ZX) optical characteristics

1 GE 1 GE
Parameter Unit
1000Base-VX 1000Base-ZX
Addressed wavelength 1280 ⇒ 1335 1540 ⇒ 1570 nm
Min. launched power -5 0 dBm
Max. launched power 0 +5 dBm
Allowed bit rates 1.250 1.250 Gbps
Min. extinction ratio 9.0 9.0 dB
Spectral Max. -20 dB bandwidth 1 1 nm
width Max. RMS width NA NA nm
Minimum SMSR 30 30 dB
Max. chromatic dispersion ±256 1200 ps/nm
-12
Min. sensitivity, @ BER=1E -24 -24 dBm
Min. overload -3 0 dBm
Max. optical path penalty 1 2 dB

1 GE 1 GE
Parameter Unit
1000Base-VX 1000Base-ZX
Max. receiver reflectance -12 -12 dB
Optical connector (Tx/Rx) LC LC
Fiber type 9/125 μm SMF
Acronym ANY-DATAS ANY-DATAS
Interface type 1000Base-VX 1000Base-ZX
See Figure 4-7, “SFP Modules - view”
Equipped on
(p. 4-43).

B&W single fiber bidirectional SFPs optical characteristics

Table 10-9 100BX / STM-1 / OC-3, 20Km bidir SFPs optical characteristics

FE, STM-1/OC-3, 20Km FE, STM-1/OC-3, 20Km

Parameter Unit
Downstream Upstream
Target distance 20 20 Km
Bit rate 125 ± 50ppm; 155.520 ± 20ppm Mbps
Transmitter at reference point TP2
Source type MLM MLM
Operating wavelength 1480 ⇒ 1580 1260 ⇒ 1360 nm
Min. launched power -14 -14 dBm
Max. launched power -8 -8 dBm
Min. extinction ratio 8.2 8.2 dB
Spectral Max. RMS
3 7.7 nm
width width
Eye mask definition IEEE 802.3ah-2004, ITU-T G.957, Telcordia GR-253-CORE
Optical return loss
12 12 dB
tolerance
Optical path between TP2 and TP3
Max. CD 400 ± 128 ps/nm
Attenuation range 0 ⇒ 15 0 ⇒ 15 dB
Max. discrete reflect.
NA NA dB
between TP2 and TP3
Receiver at reference point TP3

FE, STM-1/OC-3, 20Km FE, STM-1/OC-3, 20Km

Parameter Unit
Downstream Upstream
Operating wavelength 1260 ⇒ 1360 1480 ⇒ 1500 nm
Min. sensitivity, @
-30 -30 dBm
BER=1E-12
Min. overload -8 -8 dBm
Max. opt. path penalty 1 1 dB
Max. receiver reflectance
-12 -12 dB
at TP3
Optical connector LC LC
Fiber type 9/125 μm SMF 9/125 μm SMF
Acronym 100BX-20D 100BX-20U
100BASE-BX-20-D, STM-1 / 100BASE-BX-20-U, STM-1
Interface type
OC-3 - 20Km Downstream / OC-3 - 20Km Upstream
Equipped on refer to Figure 4-7, “SFP Modules - view” (p. 4-43)

Table 10-10 100BX / STM-1 / OC-3, 40Km bidir SFPs optical characteristics

FE, STM-1/OC-3, 40Km FE, STM-1/OC-3, 40Km

Parameter Unit
Downstream Upstream
Target distance 40 40 Km
Bit rate 125 ± 50ppm; 155.520 ± 20ppm Mbps
Transmitter at reference point TP2
Source type SLM MLM SLM
Operating wavelength 1480 ⇒ 1580 1260 ⇒ 1360 nm
Min. launched power -5 -5 dBm
Max. launched power 0 0 dBm
Min. extinction ratio 9 9 dB
Max. -20 dB
Spec- 1 1 nm
bandwidth
tral
width Max. RMS
NA 3 NA nm
width
Eye mask definition IEEE 802.3ah-2004, ITU-T G.957, Telcordia GR-253-CORE

FE, STM-1/OC-3, 40Km FE, STM-1/OC-3, 40Km

Parameter Unit
Downstream Upstream
Optical return loss
20 20 dB
tolerance
Optical path between TP2 and TP3
Max. CD 800 ± 246 ps/nm
Attenuation range 3 ⇒ 26 3 ⇒ 26 dB
Max. discrete reflect.
NA NA dB
between TP2 and TP3
Receiver at reference point TP3
Operating wavelength 1260 ⇒ 1360 1480 ⇒ 1500 nm
Min. sensitivity, @
-32 -32 dBm
BER=1E-12
Min. overload -3 -3 dBm
Max. opt. path penalty 1 1 dB
Max. receiver
-12 -12 dB
reflectance at TP3
Optical connector LC LC
Fiber type 9/125 μm SMF 9/125 μm SMF
Acronym 100BX-40D 100BX-40U
100BASE-BX-40-D, STM-1 / 100BASE-BX-40-U, STM-1
Interface type
OC-3 - 40Km Downstream / OC-3 - 40Km Upstream
Equipped on refer to Figure 4-7, “SFP Modules - view” (p. 4-43)

Table 10-11 1000BX / STM-4 / OC-12 20Km bidir SFPs optical characteristics

GE, STM-4/OC-12, 20Km GE, STM-4/OC-12, 20Km

Parameter Unit
Downstream Upstream
Target distance 20 20 Km
Bit rate 1,250 ± 100ppm; 622.080 ± 20ppm Mbps
Transmitter at reference point TP2
Source type SLM MLM SLM
Operating wavelength 1480 ⇒ 1500 1260 ⇒ 1360 nm

GE, STM-4/OC-12, 20Km GE, STM-4/OC-12, 20Km

Parameter Unit
Downstream Upstream
Min. launched power -7 -7 dBm
Max. launched power -2 -2 dBm
Min. extinction ratio 9 9 dB
Max. -20 dB
Spec- 1 NA 1 nm
bandwidth
tral
width Max. RMS
NA 3 NA nm
width
Eye mask definition IEEE 802.3ah-2004, ITU-T G.957, Telcordia GR-253-CORE
Optical return loss
12 12 dB
tolerance
Optical path between TP2 and TP3
Max. CD 350 ± 128 ps/nm
Attenuation range 0 ⇒ 15 0 ⇒ 15 dB
Max. discrete reflect.
NA NA dB
between TP2 and TP3
Receiver at reference point TP3
Operating wavelength 1260 ⇒ 1360 1480 ⇒ 1500 nm
Min. sensitivity, @
-23 -23 dBm
BER=1E-12
Min. overload -2 -2 dBm
Max. opt. path penalty 1 1 dB
Max. receiver
-12 -12 dB
reflectance at TP3
Optical connector LC LC
Fiber type 9/125 μm SMF 9/125 μm SMF
Acronym 1000BX-20D 1000BX-20U
1000BASE-BX-20-U,
1000BASE-BX-20-D, STM-4
Interface type STM-4 / OC-12 - 20Km
/ OC-12 - 20Km Downstream
Upstream
Equipped on refer to Figure 4-7, “SFP Modules - view” (p. 4-43)

Table 10-12 1000BX / STM-4 / OC-12 40Km bidir SFPs optical characteristics

GE, STM-4/OC-12, 40Km GE, STM-4/OC-12, 40Km

Parameter Unit
Downstream Upstream
Target distance 40 40 Km
Bit rate 1,250 ± 100ppm; 622.080 ± 20ppm Mbps
Transmitter at reference point TP2
Source type SLM MLM SLM
Operating wavelength 1480 ⇒ 1500 1260 ⇒ 1360 nm
Min. launched power -3 -3 dBm
Max. launched power +2 +2 dBm
Min. extinction ratio 9 9 dB
Spectral Max. -20 dB
1 1 nm
width bandwidth
Eye mask definition IEEE 802.3ah-2004, ITU-T G.957, Telcordia GR-253-CORE
Optical return loss
20 20 dB
tolerance
Optical path between TP2 and TP3
Max. CD 700 ± 256 ps/nm
Attenuation range 5 ⇒ 21 5 ⇒ 21 dB
Max. discrete reflect.
-25 -25 dB
between TP2 and TP3
Receiver at reference point TP3
Operating wavelength 1260 ⇒ 1360 1480 ⇒ 1500 nm
Min. sensitivity, @
-25 -25 dBm
BER=1E-12
Min. overload -3 -3 dBm
Max. opt. path penalty 1 1 dB
Max. receiver reflectance
-12 -12 dB
at TP3
Optical connector LC LC
Fiber type 9/125 μm SMF 9/125 μm SMF
Acronym 1000BX-40D 1000BX-40U

GE, STM-4/OC-12, 40Km GE, STM-4/OC-12, 40Km

Parameter Unit
Downstream Upstream
1000BASE-BX-40-U,
1000BASE-BX-40-D, STM-4
Interface type STM-4 / OC-12 - 40Km
/ OC-12 - 40Km Downstream
Upstream
Equipped on refer to Figure 4-7, “SFP Modules - view” (p. 4-43)

Table 10-13 STM-16/OC-48 15Km bidir SFPs optical characteristics

STM-16/OC-48, 15Km STM-16/OC-48, 15Km

Parameter Unit
Downstream Upstream
Target distance 15 15 Km
Bit rate 2.48832 ± 20ppm; 2.666 ± 20ppm Gbps
Transmitter at reference point TP2
Source type SLM SLM
Operating wavelength 1480 ⇒ 1580 1260 ⇒ 1360 nm
Min. launched power -5 -5 dBm
Max. launched power 0 0 dBm
Min. extinction ratio 8.2 8.2 dB
Spectral Max. -20dB
1 1 nm
width bandwidth
Eye mask definition ITU-T G.957, Telcordia GR-253-CORE
Optical return loss
24 24 dB
tolerance
Optical path between TP2 and TP3
Max. CD 300 ± 96 ps/nm
Attenuation range 0 ⇒ 13 0 ⇒ 13 dB
Max. discrete reflect.
-27 -27 dB
between TP2 and TP3
Receiver at reference point TP3
Operating wavelength 1260 ⇒ 1360 1480 ⇒ 1580 nm
Min. sensitivity, @
-19 -19 dBm
BER=1E-10
Min. overload 0 0 dBm

STM-16/OC-48, 15Km STM-16/OC-48, 15Km

Parameter Unit
Downstream Upstream
Max. opt. path penalty 1 1 dB
Max. receiver reflectance
-27 -27 dB
at TP3
Optical connector LC LC
Fiber type 9/125 μm SMF 9/125 μm SMF
Acronym SS-16D SS-16U
STM-16 / OC-48 - 15Km STM-16 / OC-48 - 15Km
Interface type
Downstream Upstream
Equipped on refer to Figure 4-7, “SFP Modules - view” (p. 4-43)

Table 10-14 STM-16/OC-48 40Km bidir SFPs optical characteristics

STM-16/OC-48, 40Km STM-16/OC-48, 40Km

Parameter Unit
Downstream Upstream
Target distance 40 40 Km
Bit rate 2.48832 ± 20ppm; 2.666 ± 20ppm Gbps
Transmitter at reference point TP2
Source type SLM SLM
Operating wavelength 1480 ⇒ 1500 1260 ⇒ 1360 nm
Min. launched power -2 -2 dBm
Max. launched power +3 +3 dBm
Min. extinction ratio 8.2 8.2 dB
Spectral Max. -20 dB
1 1 nm
width bandwidth
Eye mask definition ITU-T G.957, Telcordia GR-253-CORE
Optical return loss
24 24 dB
tolerance
Optical path between TP2 and TP3
Max. CD 700 ± 250 ps/nm
Attenuation range 11 ⇒ 24 11 ⇒ 24 dB
Max. discrete reflect.
-27 -27 dB
between TP2 and TP3

STM-16/OC-48, 40Km STM-16/OC-48, 40Km

Parameter Unit
Downstream Upstream
Receiver at reference point TP3
Operating wavelength 1260 ⇒ 1360 1480 ⇒ 1500 nm
Min. sensitivity, @
-27 -27 dBm
BER=1E-10
Min. overload -8 -8 dBm
Max. opt. path penalty 1 1 dB
Max. receiver
-27 -27 dB
reflectance at TP3
Optical connector LC LC
Fiber type 9/125 μm SMF 9/125 μm SMF
Acronym SL-16D SL-16U
STM-16 / OC-48 - 40Km STM-16 / OC-48 - 40Km
Interface type
Downstream Upstream
Equipped on refer to Figure 4-7, “SFP Modules - view” (p. 4-43)

DWDM SFPs optical characteristics

Table 10-15 DWDM SFPs optical characteristics

Parameter APD DWDM SFP for Long Haul Unit

1553.33 nm (193.000 THz) = CH 30
Addressed wavelengths 1552.52 nm (193.100 THz) = CH 31
100-GHz grid, in accordance with ITU-T G.694.1
Min. launched power 0.0 dBm
Max. launched power +4.0 dBm
Maximum wavelength
± 100 ppm
deviation EOL
Allowed bit rates 0.1 ⇒ 2.7 (1.25G and 2.488G are supported) Gbps
Min. extinction ratio 8.2 dB
Max. -15 dB bandwidth 0.16 GHz
Minimum SMSR 30 dB
Max. chromatic dispersion 2400 ps/nm

Parameter APD DWDM SFP for Long Haul Unit

Min. sensitivity @ BER= -30 @ 2400 ps/nm
dBm
1E-4 w/o ASE noise -32 @ 0 ps/nm
13 @ 2400 ps/nm dB/0.1
Min. OSNR @ BER=1E–4
12.5 @ 0 ps/nm nm

Min. sensitivity @ BER= -26 @ 2400 ps/nm

dBm
1E–12 -28 @ 0 ps/nm
Min. OSNR @ BER= 19 @ 1600 ps/nm dB/0.1
1E–12 18 @ 0 ps/nm nm
Min. overload -8 dBm
Max. receiver reflectance -27 dB
Optical connector (Tx/Rx) LC
Fiber type SMF
Acronym SL-162CD
Interface type APD DWDM for long haul
Equipped on See Figure 4-6, “XFP modules and adapter” (p. 4-41).

CWDM SFPs optical characteristics

Table 10-16 CWDM SFPs optical characteristics

CWDM SFP module type

Parameter Unit
APD CWDM - long haul PIN CWDM - short haul
1471, 1491, 1511, 1531, 1551, 1571, 1591, 1611,
Addressed wavelength nm
in accordance with ITU-T G.694.2
Min. launched power 0 0 dBm
Max. launched power +5.0 +5.0 dBm
Allowed bit rates 2 ⇒ 2700 (1,25M and 2,488M are supported) Mbps
Min. extintion ratio 8.2 8.2 dB
Max. -20dB bandwidth 1 1 nm
Minimum SMSR 30 30 dB

CWDM SFP module type

Parameter Unit
APD CWDM - long haul PIN CWDM - short haul
1600 @ 1611nm 1000 @ 1611nm
1600 @ 1591nm 900 @ 1591nm
1500 @ 1571nm 900 @ 1571nm
1400 @ 1551nm 900 @ 1551nm
Max. chromatic dispersion ps/nm
1400 @ 1531nm 800 @ 1531nm
1300 @ 1511nm 800 @ 1511nm
1200 @ 1491nm 700 @ 1491nm
1100 @ 1471nm 700 @ 1471nm
Min. sensitivity, @
-28 -18 dBm
BER=1E-10
Min. overload -9 0 dBm
Max. optical path penalty 2 1 dB
Max. receiver reflectance -27 -27 dB
Optical connector (Tx/Rx) LC LC
Fiber type SMF SMF
Acronym SL162C SS162C
APD CWDM interface for PIN CWDM interface for
Interface type long haul (ITU-T G.695 - short haul (ITU-T G.695 -
C8L1-1D2) C8S1-1D2)
Equipped on See Figure 4-7, “SFP Modules - view” (p. 4-43).

B&W XFPs optical characteristics

Table 10-17 B&W XFPs optical characteristics (up to 10 Km reach)

10G XFP ETSI 10G Base-S I-64.1 / 10G Base-L

Unit
parameters ANSI 10G Base-S SR-1 OC192 / 10G Base-L
Addressed wavelength 840 ⇒ 860 1290 ⇒ 1330 nm
Min. launched power -7.3 -6.0 dBm
Max. launched power -1.0 -1.0 dBm
Allowed bit rates 10.3125 9.95328; 10.3125; 10.709225 Gbps
Min. extinction ratio 3.0 6.0 dB

10G XFP ETSI 10G Base-S I-64.1 / 10G Base-L

Unit
parameters ANSI 10G Base-S SR-1 OC192 / 10G Base-L
See IEEE 802.3ae
Spectral width Max. -20dB
Triple Tradeoff 1.0 nm
bandwidth
Curves (TTC)
Minimum SMSR - 30 dB
Max. chromatic dispersion - 60 ps/nm
Min. sensitivity, @
-9.9 -11 dBm
BER=1E-12
Stressed sensitivity -7.5 - dBm
Min. overload -1.0 0.5 dBm
Max. optical path penalty - 1.0 dB
Max. receiver reflectance -12 -14 dB
Optical connector LC LC
Fibre type MMF SMF
Acronym ANY-DATAX XI-641/ANY-DATAX
Equipped on See Figure 4-6, “XFP modules and adapter” (p. 4-41).

Table 10-18 B&W XFPs optical characteristics (40/80 Km reach)

10G XFP ETSI Interface S-64.2b / 10G Base-E P1L1-2D2

Unit
parameters ANSI Interface IR-2 OC192 / 10G Base-E LR2 OC-192
Addressed wavelength 1530 ⇒ 1565 1530 ⇒ 1565 nm
Min. launched power -1.0 0 dBm
Max. launched power +2.0 +4.0 dBm
Allowed bit rates 9.95328; 10.3125; 10.709225 Gbps
Min. extinction ratio 8.2 9.0 dB
Spectral width Max. -20dB
0.25 0.25 nm
bandwidth
Minimum SMSR 30 30 dB
Max. chromatic dispersion 800 1600 ps/nm
Min. sensitivity, @ BER=1E-12 -14 -24 dBm
Min. overload -1 -7 dBm

10G XFP ETSI Interface S-64.2b / 10G Base-E P1L1-2D2

Unit
parameters ANSI Interface IR-2 OC192 / 10G Base-E LR2 OC-192
Max. optical path penalty 2 2 dB
Max. receiver reflectance -27 -27 dB
Optical connector (Tx/Rx) LC LC
Fibre type SMF SMF
XP1L12D2/ANY-
Acronym XS-642/ANY-DATAX
DATAX
Equipped on See Figure 4-6, “XFP modules and adapter” (p. 4-41).

DWDM XFPs optical characteristics

Table 10-19 DWDM XFPs optical characteristics

10G XFP Parameter APD DWDM XFP for Long Haul Unit
1529,55 nm (196.00 THz) ⇒ 1561,42 nm (192.00
Addressed wavelengths THz)
100-GHz grid, in accordance with ITU-T G.694.1
Min. launched power -2.0 dBm
Max. launched power +3.0 dBm
Maximum wavelength
± 100 ppm
deviation EOL
Allowed bit rates 9.95328; 10.3125; 10.709; 11.095728 Gbps
Min. extinction ratio 9.0 dB
Max. -15 dB bandwidth ±8 GHz
Minimum SMSR 30 dB
Max. chromatic dispersion 1600 ps/nm
Min. sensitivity @ BER= -25 @ 1300 ps/nm
dBm
1E-4 w/o ASE noise -23 @ 1600 ps/nm
17 @ 1300 ps/nm dB/0.1
Min. OSNR @ BER=1E–4
19 @ 1600 ps/nm nm
Min. sensitivity @ BER=
-22 @ 1300 ps/nm dBm
1E–12 up to 10.3125 Gbps

10G XFP Parameter APD DWDM XFP for Long Haul Unit
Min. OSNR @ BER= dB/0.1
25 @ 1600 ps/nm
1E–12 up to 10.3125 Gbps nm
Min. overload -8 dBm
Max. receiver reflectance -27 dB
Optical connector (Tx/Rx) LC
Fiber type SMF
Acronym XL-642C
Interface type APD DWDM for long haul (ITU-T G.698.2 - DW100U-2AXC)
Equipped on See Figure 4-6, “XFP modules and adapter” (p. 4-41).

Table 10-20 DWDM XFPs (tunable - 50GHz grid spacing) optical characteristics

10G XFP Parameter APD DWDM XFP for Long Haul Unit
1529,16 nm (196.050 THz) ⇒ 1568,36 nm (191.150
Addressed wavelengths THz)
50-GHz grid, in accordance with ITU-T G.694.1
Min. launched power 0.0 dBm
Max. launched power +4.0 dBm
Maximum wavelength
± 20 ppm
deviation EOL
Allowed bit rates 9.95328; 10.3125; 10.709; 11.095728 Gbps
Min. extinction ratio 10.0 dB
Max. -15 dB bandwidth ± 15 GHz
Minimum SMSR 30 dB
Max. chromatic dispersion 1300 ps/nm
Min. sensitivity @ BER=
-27 @ 1300 ps/nm dBm
1E-4 w/o ASE noise
dB/0.1
Min. OSNR @ BER=1E–4 17.5 @ 1300 ps/nm
nm
Min. sensitivity @ BER=
-20 @ 1300 ps/nm dBm
1E–10
Min. overload -8 dBm
Max. receiver reflectance -27 dB

10G XFP Parameter APD DWDM XFP for Long Haul Unit
Optical connector (Tx/Rx) LC
Fiber type SMF
Acronym XL-642CT
Interface type APD DWDM for long haul (SFF8477)
Equipped on See Figure 4-6, “XFP modules and adapter” (p. 4-41).

CWDM XFPs optical characteristics

Table 10-21 CWDM XFPs optical characteristics

10G XFP Parameter APD CWDM XFP for Long Haul Unit
Addressed wavelength 1471, 1491, 1511, 1531, 1551, 1571, 1591, 1611, nm
in accordance with ITU-T G.694.2
Min. launched power +1.0 dBm
Max. launched power +5.0 dBm
Allowed bit rates 9.95328; 10.3125; 10.709; 11.095728 Gbps
Min. extintion ratio 9.0 dB
Max. -20dB bandwidth 0.25 nm
Minimum SMSR 30 dB
Max. chromatic dispersion 1400 @ 1611nm ps/nm
1319 @ 1591nm
1238 @ 1571nm
1159 @ 1551nm
1079 @ 1531nm
1000 @ 1511nm
921 @ 1491nm
841 @ 1471nm
Min. sensitivity, @ -24.0 dBm
BER=1E-12
Min. overload -8.0 dBm
Max. optical path penalty +2.5 dB
Max. receiver reflectance -27 dB

10G XFP Parameter APD CWDM XFP for Long Haul Unit
Optical connector (Tx/Rx) LC
Fiber type SMF
Acronym XL-642C
Interface type APD CWDM interface for long haul (ITU-T G.695 - C64L1-2D2)
Equipped on See Figure 4-6, “XFP modules and adapter” (p. 4-41).

CWDM multiplexers / OADM optical characteristics

CMDX8: two fibres 8 CH MDX2

CMDX8 optical characteristics Unit

Fibre type 9/125 μm SMF
Connector type MU
Isolation (adjacent channels) min. 40 dB
Isolation (non-adjacent channels) min. 45 dB
PDL max. 0.25 dB
MUX side - Insertion losses
CH1 IN ⇒ LINE TX OUT (aggregate) - 1471 nm max. 0.9 dB
CH2 IN ⇒ LINE TX OUT (aggregate) - 1491 nm max. 1.2 dB
CH3 IN ⇒ LINE TX OUT (aggregate) - 1511 nm max. 1.5 dB
CH4 IN ⇒ LINE TX OUT (aggregate) - 1531 nm max. 1.8 dB
CH5 IN ⇒ LINE TX OUT (aggregate) - 1551 nm max. 2.1 dB
CH6 IN ⇒ LINE TX OUT (aggregate) - 1571 nm max. 2.4 dB
CH7 IN ⇒ LINE TX OUT (aggregate) - 1591 nm max. 2.7 dB
CH8 IN ⇒ LINE TX OUT (aggregate) - 1611 nm max. 3.0 dB
Channel passband at -0.5 dB (include channel Centre 14 nm
wavelength in -6 / +8 range
DEMUX side - Insertion losses
LINE RX IN (aggregate) ⇒ CH1 OUT - 1471 nm max. 1.4 dB
LINE RX IN (aggregate) ⇒ CH2 OUT - 1491 nm max. 3.5 dB
LINE RX IN (aggregate) ⇒ CH3 OUT - 1511 nm max. 3.2 dB
LINE RX IN (aggregate) ⇒ CH4 OUT - 1531 nm max. 2.9 dB

CMDX8 optical characteristics Unit

LINE RX IN (aggregate) ⇒ CH5 OUT - 1551 nm max. 2.6 dB
LINE RX IN (aggregate) ⇒ CH6 OUT - 1571 nm max. 2.3 dB
LINE RX IN (aggregate) ⇒ CH7 OUT - 1591 nm max. 2.0 dB
LINE RX IN (aggregate) ⇒ CH8 OUT - 1611 nm max. 1.7 dB
Channel passband at -0.5 dB (include channel centre 14 nm
wavelength in -6 / +8 range

DWDM multiplexers / OADM / line amplifiers optical characteristics

OMDX8100: 8-channel DWDM mux/demux optical characteristics

OMDX8100 (L1 and L2 bands) optical characteristics

Fiber type 9/125 μm SMF
Connector type MU/SPC
Tributary channels L1 and L2 bands
frequencies and
wavelengths
End-to-end single channel 7.65 dB max
insertion loss
Polarization dependent loss 0.30 dB max, within the channel passband
Polarization mode 0.30 ps max, within the channel passband
dispersion
Return Loss 40 dB min, including connectors, ports terminated
MUX side - Insertion losses
Input power -27 ⇒ +15 dBm, at one tributary input
Insertion Loss:
• Single channel 3.75 dB max.
• Extra Band 1.5 dB max, across all channel centres
Net bandwidth @ -0.5 dB 45 GHz, with respect to the band nominal centre frequency (u
nom)
Net bandwidth @ -3.0 dB 72 GHz, with respect to the band nominal centre frequency (u
nom)
Channel pass-band 44 GHz
DEMUX side - Insertion losses

OMDX8100 (L1 and L2 bands) optical characteristics

Input power -25 ⇒ +15 dBm, at one tributary input
Insertion Loss:
Single channel 3.75 dB max.
Extra Band 1.5 dB max, across all channel centres
Net bandwidth @ -0.5 dB 20 GHz, with respect to the band nominal centre frequency (u
nom)
Net bandwidth @ -3.0 dB 34 GHz, with respect to the band nominal centre frequency (u
nom)
Adjacent channel isolation 23 dB, with respect to the band nominal centre frequency (u
nom)
Non-Adjacent channel 30 dB, with respect to the band nominal centre frequency (u
isolation nom)
Directivity 40 dB, including connectors

BOOST10G (optical booster) optical characteristics

BOOST10G optical characteristics

Fiber type Single-mode (SMF)
Connector type LC/PC
Wavelength range 1530 ⇒ 1565 nm
Target Wavelength 1550.116 nm (CH 34, 193.400 THz)
Optical input power -7 ⇒ +4 dBm
EOL Optical output power +10 dBm
ULH Max. CD 3200 ps/nm - ULH applications, used together with Preamplifier
ULH Max. CD per Km 18.3 ps/nm - ULH applications, used together with Preamplifier
ULH span budget 33 dB ⇒ 44 dB
ULH max. link length 160 Km

PRE10G (optical preamplifier) optical characteristics

PRE10G optical characteristics

Fiber type Single-mode (SMF)
Connector type LC/PC

PRE10G optical characteristics

Wavelength range 1528 ⇒ 1562 nm
Target Wavelength 1550.116 nm (CH 34, 193.400 THz)
Optical input power -35 ⇒ -8 dBm
EOL Optical output power -5 dBm
ULH Max. CD 3200 nm - ULH applications, used together with the Booster
ULH Max. CD per Km 18.3 ps/nm
ULH span budget 33 dB ⇒ 44 dB
ULH max. link length 160 Km
VLH Max. CD 2400 nm - VLH applications, used without Booster (stand alone)
VLH Max. CD per Km 16.85 to 18.3 ps/nm
VLH span budget 22 dB ⇒ 33 dB
VLH max. link length 120 Km

Ethernet interface specifications

GbE interface specifications

Item Characteristics
Location Optical connectors on SFPs. Connectors are mounted on
front panel of main and access modules.
Function Couples GigaBit Ethernet optical data into and out of shelf
Capacity One GE per SFP
Frequency 1 Gb/s
Line code Nonreturn-to-zero (NRZ)
Format IEEE 802.3
Input Cable Multi mode for 1000BASE-SX and single mode for
1000BASE-LX and 1000BASE-ZX
Output Cable Multi mode
Optical transmitter:
Extinction ratio (logic 0 to 1) 9 dB
Center wavelength 850 nm (1000BASE-SX), 1300 nm (1000BASE-LX), 1550
nm (1000BASE-ZX)

Item Characteristics
RMS spectral width IR 0.85 nm (1000BASE-SX), 4 nm (1000BASE-LX), 1 nm
(1000BASE-ZX)
Mating connector type LC

10GbE interface specifications

Item Characteristics
Location Optical connectors on XFPs. Connectors are mounted on front
panel of access modules.
Function Couples 10 GigaBit Ethernet optical data into and out of shelf
Capacity One 10GE per XFP
Frequency 10 Gb/s
Line code Nonreturn-to-zero (NRZ)
Format IEEE 802.3
Input Cable Multi mode
Output Cable Multi mode
Mating connector type LC

Ethernet transmission and receiver levels

Signal Type Module Transmitter Transmitter Output Receiver Sensitivity

Reach Power (dBm) (dBm)
Minimum Maximum Minimum Maximum
1GE 1000BASE-SX SR -8.5 -1.0 -19.0 -1.0
1GE 1000BASE-LX IR -8.0 -4.0 -21.5 -2.0
1GE 1000BASE-ZX LR 1.0 4.0 -26.0 1.0
10GE 10GEBASE-SR SR -6.3 -2.0 -12.1 0.0
10GE 10GBASE-LR IR -4.0 -2.0 -13.0 1.5
10GE 10GBASE-ER LR 0.0 1.5 -16.0 0.0

Control interface specifications

Management interface specifications

Item Characteristics
ISPB RC2 bus Parallel bus that implements register access
interface from the MT100 to all I/O modules
Internal LAN Implements the message interface
SPI bus Serial Peripheral and Inventory bus; used by
SLC microprocessors to access remote
inventory data, serial devices such as
EEPROMs, and serially controlled parallel I/O
ports
IPL interface Inter Processor Link; an interface used to
control warm/hot standby functions
ISC bus Internal Serial Control bus; provides the serial
link to a serial EEPROM or flash on the bus
termination, where the equipment local
configuration and the MAC address data are
stored
Hw_config Interface for FPGA firmware downloads
Internal USB interface Provides hardware support to the disk
redundancy application
OS interface Provides the connection between the NE and
the OS
DS interface Provides the connection between the NE and
drop shelves
F interface An RJ-45 (RS-232) connector that is used to
provide craft terminal interface.
OS aux interface An additional communication interface for
message exchange between the NE and a
remote OS station
DBG interface Supports application SW debug activities
External USB interface Allows connection of a memory device so that
an emergency boot of the system can be made

Overview
Purpose
This appendix provides reference material for this document.

Contents

Revision history A-1

Revision history
Purpose
This topic describes the revisions to this document.

List of revisions
The revision history of this document is shown in the following table.

Location Revision Issue number

Issue 3
Chapter 4, “Product Added the physical dimensions Issue 3, March 2010
description” (mm/inches) of the Alcatel-Lucent
1850 Transport Service Switch (TSS-100
and TSS-100C) shelves.
Revised the E1UAC circuit pack
information to state that the circuit pack
provides 75-ohm mini 1.0/2.3 coaxial
faceplate connectors for customer E1
signals.

Location Revision Issue number

Chapter 8, “Product Removed the outdated Worldwide Services Issue 3, March 2010
support” information to comply with internal
customer documentation content standards.
Chapter 10, “Technical Added the physical dimensions Issue 3, March 2010
specifications” (mm/inches) of the Alcatel-Lucent
1850 Transport Service Switch (TSS-100
and TSS-100C) shelves.
Appendix B, Technical Removed the outdated technical support Issue 3, March 2010
support information to comply with internal
customer documentation content standards.
Appendix C, “Unit Added the physical dimensions Issue 3, March 2010
data sheets” (mm/inches) of the Alcatel-Lucent
1850 Transport Service Switch (TSS-100
and TSS-100C) shelves.
Revised the E1UAC circuit pack
information to state that the circuit pack
provides 75-ohm mini 1.0/2.3 coaxial
faceplate connectors for customer E1
signals.
Issue 2
Throughout the Changed titles of document; added Issue 2, December
document TSS-100C. 2009
The Alcatel-Lucent 1850 TSS-100C
Compact Shelf is supported for ETSI
applications only; it is not supported for
ANSI applications.

Overview
Purpose
This section describes the Ethernet implementation for the Alcatel-Lucent 1850 TSS-100.

Contents

Ethernet over SDH B-1

Quality of service B-6
Ethernet Services B-11

Ethernet over SDH

General
In general, Ethernet packets cannot be transported efficiently across SDH networks
because bandwidth is wasted when mapping them into SDH VTs. Therefore special
techniques have been developed to improve the efficiency of Ethernet over SDH (EoS)
mapping.
Virtual concatenation (VCAT) is one of them. Alcatel-Lucent 1850 TSS-100 supports
VCAT.

Virtual concatenation (VCAT)

Virtual concatenation (VCAT) is standardized in ANSI T1.105 and ITU-T G.707.
Alcatel-Lucent 1850 TSS-100 supports high-order ( VC-4) and low-order ( VC-3/TU-3
and VC-12/TU-12 ) Virtual Concatenation Groups. All members of a Virtual
Concatenation group (VCG) travel through the network as individual Synchronous
Payload Envelops (SPEs) and therefore may take different paths, although they are

Link capacity adjustment scheme (LCAS)

The Link Capacity Adjustment Scheme ( LCAS) is standardized in ITU G.7042/Y.1305.
Along with virtual concatenation, LCAS allows dynamic adjustments in the amount of
bandwidth used for a virtual concatenated channel. Signaling messages are exchanged
within the SONET/SDH overhead to change the number of tributaries being used by a
Virtually Concatenated Group (VCG). The capability to change the amount of bandwidth
allows the provider to act more flexibly because bandwidth can be adjusted based on new
services, time-of-day demands, and seasonal fluctuations.
LCAS can also support fault tolerance and protection since it uses a protocol that can
detect a failed tributary and automatically remove it from the VCG.
The next figure shows an example of dynamic bandwidth adjustment.

Figure B-1 Dynamic bandwidth adjustment

Figure B-2 GFP frame format

A. Original Ethernet Frame B. GFP Frame
Octets Octets

2 Pay Load Indicator

Core
7 Header
Preamble 2 cHEC

2 Type
Payload
Header
1 Start of Frame Delimiter (SFD) 2 tHEC

6 Destination Address (DA)

6 Source Address (SA)

0 or 4 Stacked VLAN TAG1

0 or 4 802.1Q VLAN TAG1 Raw Ethernet Frame

Payload
2 Length/Type

Data and Pad

4 Frame Check Sequence

Note: 1 - May not be present

MA-DMX-344

Table B-1 GFP frame format details

Section Field Description

Core Header Payload Indicator (PLI) Binary number representing
the number of octets in the
GFP payload.
Core Header Error Control CRC-16 checksum that
(cHEC) protects the integrity of the
contents of the Core Header.
Payload Header Type The type of information
contained in the Payload field.
The value is 01hex.
Type Header Error Control CRC-16 checksum that
(tHEC) protects the integrity of the
contents of the Type Field.
Payload The raw Ethernet Frame (that
is, the original Ethernet Frame
without the Preamble and
SFD.

In the opposite direction when the GFP Mapper receives a GFP frame from the Virtual
Concatenator, it removes the Core Header and, using the cHEC field, performs a Header
Error Check. If the header is correct, the payload area of the GFP is then de-scrambled
and the Type field and tHEC in the GFP header are checked for correctness. The Ethernet
frame is extracted and the Preamble and SFD are added.
The GFP mapper at the far end of the network inserts idle GFP frames when there are no
Ethernet frames to send. The near end GFP Mapper discards any idle GFP frames it
receives over the SDH network. The idle GFP frames are not forwarded to the Ethernet
Switch.
The GFP Mapper contains GFP queues that are used to store Ethernet frames while they
are being processed.
The Generic Framing Procedure is defined in ITU-T G.7041/Y.1303 and ANSI T1X1.105
Sections 7.3.2 and 7.3.3.

Example
An example of Ethernet aggregation using high-order VCAT ( VC3) is shown in the
following figure.

Figure B-3 Ethernet aggregation using high-order ( VC3) virtual concatenation

Packet classification
Alcatel-Lucent 1850 TSS-100 supports packets to be classified for the following:
• Ingress port — Alcatel-Lucent 1850 TSS-100 supports the classification of incoming
packets (Ethernet tagged, untagged, and MPLS) for forwarding, based on their ingress
port (UNI / NNI / Virtual Ethernet interface).
• VLAN tag priority bits — Alcatel-Lucent 1850 TSS-100 supports the classification of
incoming Ethernet frames to be forwarded, based on Priority information decoded
from Priority bits contained into VLAN tag, according to the IEEE 802.1Q std.
• VLAN ID — Alcatel-Lucent 1850 TSS-100 supports the classification of incoming
Ethernet frames to be forwarded, based on VLAN ID, contained into VLAN tag.

Quality of service
Overview
The Alcatel-Lucent 1850 TSS-100 supports the capability to discard all packets whose
rate or size are not compliant with the configured values of parameters.

Single rate token bucket (ingress policing)

Alcatel-Lucent 1850 TSS-100 supports metering, policing, and marking in compliance
with IETF RFC 2697 (single-rate three-color marker). The Single Rate Token Bucket is
useful for ingress policing, where only the length, not the peak rate, of the burst
determines service eligibility.
Alcatel-Lucent 1850 TSS-100 can meter the rate and the burst size of incoming packets
and mark them with respect the following provisioned parameters:
• Committed Information Rate (CIR), [bytes/sec]
• Committed Burst Size (CBS), [bytes]
• Peak Information Rate (PIR) [bytes/sec]
• Peak Burst Size (PBS), [bytes]
• Color Mode (CM)
Metering may be done in color-blind mode. In this case any color assignment of the
incoming packet stream performed by a preceding entity is ignored, and the packet is
forwarded, based on the marking value from policing algorithm. Metering can also be in
color-aware mode. In this case the color of the incoming packet stream is taken into
account for the consequent marking function.
In color-blind metering mode, the packet will be marked red, yellow, or green, according
to its rate and burst size characteristics.
In color-aware metering mode, the packet will be re-colored, with its incoming color (if
present), if the rate and burst size parameters measured are consistent with that value. If
the rate and burst size parameters measured on incoming yellow or green packets are not
consistent with those values, these packets will be re-colored to a lower priority. In no
case are incoming packet marked with a color that promotes them to a higher priority.

Dual rate token bucket (ingress policing)

The System shall support metering, policing and marking in compliance with IETF RFC
2698 (two rate three color marker).
The System shall implement the capability to measure the rate and the burst size of
incoming packets with respect the following provisioned parameters:
• Committed Information Rate (CIR), [bytes/sec]
• Committed Burst Size (CBS), [bytes]
• Peak Information Rate (PIR)
• Peak Burst Size (PBS)
• Color Mode (CM)
Metering may be done in color-blind mode. In this case a the color assigned to the
incoming packet stream by a preceding entity is ignored and considered as uncolored. The
packet will be forwarded by the system according to the marking value resulting from
policing algorithm. It may also be realized in color-aware mode in which case the color of
the incoming packet stream is taken into account for the consequent marking function.
The marking will (re) color the packet stream with one of the three following values:
• Green, if the rate of the incoming packet is ≤ CIR at a given observation time 'tj', also
considering the contribution of previous packet observed at time 'tj-1';
• Yellow, if the rate of the incoming packet is > CIR and ≤ PIR at a given observation
time 'tj', also considering the contribution of previous packet observed at time 'tj-1';
• Red, if the rate of the incoming packet is > PIR at a given observation time 'tj' also
considering the contribution of previous packet observed at time 'tj-1'.
Note: Packets re-colored red are discarded.
In color-blind metering mode, the packet will be marked, either red, yellow, or green,
according to its rate/burst size characteristics.

IETF compliant metering, policing, and marking

Alcatel-Lucent 1850 TSS-100 supports the metering, policy and marking algorithms
specified by IETF (see “Single rate token bucket (ingress policing)” (p. B-6) and “Dual
rate token bucket (ingress policing)” (p. B-7) features).
The traffic parameters defined by IETF, provide operators and service providers with
quantitative and qualitative characterizations of the service they are providing to a
customer (including CoS scope).
Alcatel-Lucent 1850 TSS-100 supports the following service level information to define
the compliance of traffic to a specific bandwidth profile for 'Service Level Agreement'
compliance.
• Color-blind traffic metering, policing, and marking — The color value assigned to the
incoming packet, external to the NE is ignored by ignoring the PRI bits in VLAN Tag
of Ethernet packet and EXP bits in the header of MPLS packet.
• Color-aware traffic metering, policing and marking — The color value assigned to the
incoming packet, external to the NE is used, keeping the incoming value of PRI bits
in VLAN Tag of Ethernet packet and of EXP bits in the header of MPLS packet.
• Color-aware ETH frame priority bits detection (pre 802.1ad) — The color value
encoded in PRI bits within VLAN Tag, is used for classification, metering, policing,
and marking.
• Out-of-profile traffic dropping — The capability to discard all packets whose rate or
size are not compliant with the configured values for parameters, defining the
Bandwidth Profile, according to IETF or MEF specifications.
• Rate control for multicast frames — Bandwidth can be limited for multicast frames
generated when unknown MAC DA address frames are received, also known as
flooding. Limiting is performed at ingress. frames in excess with respect to the
defined bandwidth are discarded.
• Oversubscription — The System manages prioritized control of Data traffic. Traffic is
admitted or discarded, according to Pre-Classifier blocks located before the
Rate-controlled Dropper/Meter functional blocks.
Both ordered Pre-Classifier blocks and Dropper/Meter functional blocks are managed
according to parameters below on per-port basis:
– Selective control packets, recognized from the Pre-Classifier according to
Spanning Tree BPDUs, Layer 2 Control frames, IGMP frames, or VRRP frames.
– Fractional Port rate
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Ethernet Quality of service

Packet scheduling and congestion

Alcatel-Lucent 1850 TSS-100 supports Weighted Random Early Detection (W-RED) and
strict priority scheduling, also referred to as Head of Line (HOL), for dealing with
scheduling and congestion.
W-RED
W-RED is a packet enqueuing mode, that discards packets randomly based on queue
occupation.
As shown in the following example, a minimum and maximum threshold (Min th and
Max th) may be assigned for packets marked yellow and green entering the queue.
For occupancy within the lower threshold (Min th), the discard probability is zero, i.e. the
packets are forwarded.
For occupancy between the two thresholds (between Min th and Max th), the discard
probability rises linearly towards a maximum probability (Max Pd), i.e. the probability of
discard is related to the rate and burst size. Different slopes may be configured on flow
base, in order to differentiate the discarding probability among flows accessing the queue.
This behavior is referred to as 'Weighted'.
For occupancy above the higher threshold (Max th), packets are discarded (Pd= 1).

Figure B-4 W-RED thresholds

Discard
Probability
1

Max Pd

Min “Yel” Max “Yel” Min “Gre” Max “Gre” 100%

Th Th Th Th Average queue
occupancy

The following example shows the application of W-RED algorithm to a packet stream
with packets marked green and yellow entering a generic queue buffer. It illustrates that,
according to the queue occupancy, both yellow and green packets may experience the
discarding.
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Ethernet Quality of service

Figure B-5 W-RED queueing

Packet stream incoming to the queue
Buffer Size (100%)
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

Min Y th Max Y th Min G th Max G th

Packets entering
the queue buffer 1 2 3 4 5 6 8 9 10 13 14 15
Generic queue #n

7 11 12 16

Discarded packets

Head of Line (HOL)/strict priority scheduling

Alcatel-Lucent 1850 TSS-100 supports packet scheduling based on strict priority
assignment to the different queues (HOL). This technique implies that the de-queuing
phase is performed according to the priority level assigned to each queue. Until packets
are present on the highest priority queue, the packets enqueued on lowest priority queues
will not be forwarded. This method provides prioritized bandwidth assignment for
specific queues.

Class of service (CoS)

Alcatel-Lucent 1850 TSS-100 also supports enhanced QoS and traffic management with
the DiffServ approach, providing forwarding classes (CoS) mapped onto queues:
• Guaranteed Class Of Service (CoS) (IEEE 802.1D) with equal CIR and PIR (all
Green), associated to real-time applications which requires very low delay, jitter and
loss
• Best Effort Class Of Service (CoS) (IEEE 802.1D) with null CIR (all Yellow)
associated to not real time applications and managed through two levels of frame drop
probability.
• Regulated Class Of Service (CoS) (IEEE 802.1D) with non-zero CIR and PIR (Green
and Yellow) associated to not real time applications and managed through two levels
of frame drop probability.
• Queue scheduling discipline based on Strict Priority (the 2 highest queues)
• Weighted Fair Queuing (the 6 lowest queues) methods
• 3 scheduling priority levels: High, Medium and Low priority
• 3-tier QOS: per service (Virtual Transport logical path), per class, per Port
(hierarchical shaping)

Ethernet Services
Overview
Alcatel-Lucent 1850 TSS-100 supports the following Ethernet services, in accordance
with ITU-T G.8011.1 and G.8011.2:
• Ethernet private line and virtual private line
• Ethernet private LAN and virtual private LAN
• Ethernet bridging and virtual bridging
• Ethernet aggregation and virtual aggregation

Ethernet private line

Alcatel-Lucent 1850 TSS-100 supports ITU-T Ethernet Private Line (EPL) service in
compliance with ITU-T G.8011.1. This service defines a point-to-point communication
that does not share physical resources across the network with other traffic or lines.
Frames entering one UNI are delivered directly to another designated UNI.
Due to the dedicated communication between UNI's, there is no need for MAC address
learning. Classification for each instance of this service is port-based. Incoming Ethernet
frames, supporting Q-VLAN, are always transported end-to-end transparently.
Specifically, Layer-2 control frames are always tunneled, except for Pause frames.
Because bandwidth is not shared with other Ethernet flows, it is guaranteed.

Ethernet virtual private line

Alcatel-Lucent 1850 TSS-100 supports ITU-T Ethernet Virtual Private Line (EVPL)
service in compliance with ITU-T G.8011.2.
This service identifies a point-to-point communication that shares physical resources
across the network with other lines. Frames incoming one UNI are delivered to the other
UNI and vice-versa.
As with Ethernet private line, there is no need for MAC address learning. Classification
for each instance of this service is based on Port and/or Q-VLAN ID. Incoming Ethernet
frames, supporting Q-VLAN, are transported end-to-end transparently, in case of a
non-service-delimiting application.
The Q-VLAN Tag may be popped or pushed, respectively at the ingress or egress UNI, in
case of a service-delimiting application.
Different CoS are considered according to the VLAN PRI bits value.

Ethernet virtual private LAN

Alcatel-Lucent 1850 TSS-100 supports ITU-T Ethernet Virtual Private LAN (EVPLAN)
service. This service defines multipoint-to-multipoint communication that shares physical
resources across the network with other LAN's.
Frames incoming one UNI may be delivered to:
• A specific destination UNI, when MAC destination address is known
• All other UNI's, if MAC destination address is unknown
• A group of UNI's (multicasting)
• All UNI's (broadcasting)
MAC address learning and MAC destination address forwarding are required. Service
classification may be based on the Port and/or on Q-VLAN ID. In the case of a
non-delimiting application, incoming Ethernet frames, supporting the Q-VLAN Tag, are
transported end-to-end in transparent way.

Ethernet virtual bridging

Alcatel-Lucent 1850 TSS-100 supports Ethernet Virtual LAN Bridging in compliance
with IEEE 802.1Q.
This standard, extends the concepts and mechanisms introduced by IEEE 802.1D for
physical LAN bridging It defines an architecture for the interconnection of 'virtual' LANs
within a network. VLAN technology allows for the separation of the physical network
into logical LANs (Virtual LANs). It also limits the broadcast domain to the users
belonging to the VLAN.

Limit MAC table size per service

Alcatel-Lucent 1850 TSS-100 supports the capability to limit the amount of MAC
addresses per each VLAN up to a configurable value. The parameter specifying the
maximum number of MAC Addresses per each VLAN is configured from Management
Operator and propagated to all the boards.
It also supports partitioning 'per service' of the Filtering Database in order to avoid its
unrequired entries due to intrusion of unexpected services When the size limit of the
Filtering Database configured for that VLAN is exceeded, the management operator can
define the behavior of the database to avoid database overload.
Note: Not more then one Dynamic Filtering entry should be allowed in IVL Filtering
Database for a given MAC address. This entry must be automatically removed after a
specified time.

Ethernet provider bridging (802.1ad)

Alcatel-Lucent 1850 TSS-100 supports Provider Bridging on an Ethernet Virtual Bridge
Local Area network, in compliance with IEEE 802.1ad .
IEEE 802.1ad is a draft amendment to the 802.1Q. It specifies changes that enable a
Service Provider to use a common infrastructure of Bridges and LANs to provide the
equivalent of separate LANs, Bridged Local Area networks, or Virtual Bridged Local
Area networks to separate customers.
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Ethernet Ethernet Services

E-line (MEF)
Alcatel-Lucent 1850 TSS-100 supports E-line service as defined in the Metropolitan
Ethernet Forum (MEF) 10 standard reference. This service addresses an Ethernet
point-to-point application. From the customer point of view an Ethernet Virtual
Connection (EVC) is specified between different UNI's. A frame sent to an EVC from the
ingress UNI can be delivered to the egress UNI.

EVC

Point point-to to-point EVCs

Both tagged and untagged Ethernet frames may be processed at the border NE of the
provider network. In tagged Ethernet frames, the VLAN ID field is considered as the
CE-VLAN ID (Customer Edge). CE-VLAN ID / EVC mapping is defined at each UNI.
In both untagged and priority tagged frames (frames where VLAN PRI bits value is
significant), a CE-VLAN ID is assigned to each UNI. All untagged frames, priority
tagged frames, and frames tagged with that CE-VLAN ID are mapped to the same EVC.

47 EVC
EVC
1343
EVC
Untagged and
priority tagged UNI

E-LAN service (MEF)

Alcatel-Lucent 1850 TSS-100 supports E-LAN service as defined in the MEF 10 standard
reference. This service addresses an Ethernet multipoint-to-multipoint application. From
the customer point of view, an Ethernet Virtual Connection (EVC) is specified between
different UNI's.

Multipoint multipoint-to to- multipoint EVCs

Both untagged and tagged Ethernet frames may be processed at the border NE of the
provider network. In tagged Ethernet frames, the VLAN ID field is considered as the
CE-VLAN ID (Customer Edge). CE-VLAN ID / EVC mapping is defined at each UNI.
In both untagged and priority tagged frames (frames where VLAN PRI bits value is
significant), a CE-VLAN ID is assigned to each UNI: all untagged frames, priority tagged
frames, and frames tagged with that CE-VLAN ID are mapped to the same EVC.
CE-VLAN ID may have a local UNI significance or an end-to-end significance. In the
end-to-end meaning, the CE-VLAN ID preservation attribute applies and the mapping for
the EVC must be identical on all the UNIs.

EVC
47 EVC 47
Untagged and
priority tagged
EVC
1343
UNI A UNI B

MEF E-line and E-LAN aggregation

Alcatel-Lucent 1850 TSS-100 supports multiple EVCs on a single UNI (Service
Multiplexing), both for E-Line and E-LAN services, in compliance with MEF 10 standard
reference.
The capability to map more than one CEVLAN ID to the same EVC at the UNI
(Bundling) is also supported. When bundling is used, the CE-VLAN ID preservation
attribute must apply and the list of CE-VLAN IDs mapped to the EVC must be identical
on all UNIs. All-to-One Bundling supports all the CE-VLAN IDs mapped into a single
EVC at the UNI.

EVC
A C
EVC

EVC

Spanning tree protocols

Alcatel-Lucent 1850 TSS-100 supports Rapid Spanning Tree (RSTP) and Multiple
Spanning Tree (MSTP) protocols as described below.
Rapid spanning tree protocol (RSTP)
Alcatel-Lucent 1850 TSS-100 supports the Rapid Spanning Tree Protocol algorithm in
compliance with IEEE 802.1D.
RSTP operates in Bridged Local Area Networks comprised of individual point-to-point or
shared-media LANs, connected by Bridges operating RSTP, MSTP (IEEE 802.1Q), or
STP.
The RSTP configures the Port State of each port on the bridges in the Bridged Local Area
Network. Bridge Ports are selected to forward or discard frames, to provide an active
fully (spanning) and simply (tree) connected topology.
The configured topology provides symmetric connectivity. Frames transmitted between
any station 'A' and station 'B' traverse the same Bridge Ports in both directions. A frame’s
source address is learned and used to select the path for subsequent frames addressed to
that source.
RSTP further ensures that loops in the topology do not occur if the network is
re-configured in response to the failure, removal, or addition of a network component,
and that erroneous information is removed from the Filtering Database after
re-configuration.

Root ports
Designated ports
Alternate ports Designated Bridge Designated Bridge
Back-up ports for LAN A for LAN B
Blocked ports
Packets 1
BPDU only
2
Root Bridge
LAN A LAN B

1 Designated Bridge 1
for LAN C

2 2
3 3
LAN E

Designated Bridge
for LAN D

LAN C
LAN D
2
3 1
Designated Bridge
for LAN E

1
2
Root Bridge LAN B
LAN A

1 1
Port up dated to
Designated role
by RSTP
2 2
3 3
LAN E

LAN C
LAN D
2
3 1
Port up dated to
Alternate role
by RSTP

Multiple spanning tree protocol (MSTP)

Alcatel-Lucent 1850 TSS-100 supports the Multiple Spanning Tree Protocol algorithm in
compliance with IEEE 802.1Q.
MSTP, like STP and RSTP, provides spanning and tree connectivity for frames assigned
to any VLAN throughout a Bridged Local Area network, comprised of interconnected
Bridges operating MSTP, STP, or RSTP (IEEE 802.1D).
MSTP allows frames assigned to different VLANs to follow separate paths, based on an
independent Multiple Spanning Tree Instance (MSTI), within Multiple Spanning Tree
(MST) Regions composed of LANs and/or MST Bridges. These Regions, and other
Bridges and LANs, are connected into a single Common Spanning Tree (CST).

Root ports
Designated ports
CIST/MSTI Regional Root Alternate ports
CIST Root Packets
Region5 Region1 BPDU only
LAN A
LAN B
LAN E

LAN D
LAN C
CIST Regional Root
LAN G
LAN H LAN I

Region2 LAN J
LAN F
LAN M
LAN K
LAN N LAN L

LAN O

LAN P
CIST/MSTI Regional Root
LAN T
LAN S
LAN R
LAN Q Region4
Region3

MSTI Regional Root

MSTP is able to provide for fault tolerance by automatic re-configuration of the spanning
tree topology as a result of Bridge failure or a breakdown in a data path, within the
confines of the available Bridged Local Area network components, and for the automatic
accommodation of any Bridge or Bridge Port added to the network without the formation
of transient data loops.

MAC auto-learning and aging

Alcatel-Lucent 1850 TSS-100 supports the capability to recover the MAC address from
each frame received at a given UNI/NNI interface (MAC auto-learning), and associate it
with parameters within a Filtering Database specific interface (UNI/NNI). Mac
auto-learning can be disabled on a per-port and per-service basis.
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Ethernet Ethernet Services

DA=A, port=1

1 2

3
A->E A->E

A->E

DA=A, port=1 DA=A, port=1 DA=A, port=3

3 1 3

1 2 2 3 1 2
A->E A->E A->E A->E A->E A->E

A B C D E F

DA=A, port=1
DA=E, port=2

1 2

3
E->A
E->A

DA=A, port=1 DA=A, port=3

DA=E, port=3 DA=E, port=1
3 1 3

1 2 2 3 1 2
E->A E->A

A B C D E F

MAC destination address static configuration

Alcatel-Lucent 1850 TSS-100 supports the capability to configure a static MAC
destination address (DA) through an NMS for a specific Ethernet frame. This capability
supports both Unicast and Multicast entries.
The maximum number of static entries is 512 for Unicast MAC DA and 512 for Multicast
MAC DA.
Note: No more than one Dynamic Filtering Entry can be created in IVL Filtering
Database for a given MAC Address. This entry will be automatically removed after a
specified time (Ageing Time) has elapsed since the entry was created or last updated.

....................................................................................................................................................................................................................................
MAC “black hole” forwarding prevention
The Alcatel-Lucent 1850 TSS-100 supports MAC “Black-Hole” function with
automatically MAC @ table flushing. This means flushing of MAC table entries on a
remote NE upon network failure event thus preventing traffic forwarding to a (wrong)
black hole port until MAC aging time is expired and a new learning process takes place.
MAC “Black-Hole” forwarding prevention applies in all network configurations where an
interconnection function is involved for a ring closure or a protected access.
Typical application scenarios:
• Interconnection with ERP ring supporting RPS OAM packets
• Interconnection with CE supporting 1:1 port protection.
The system supports:
• local MAC@table flushing upon a LOS has been detected
• ”MAC flushing indication” generation, upon a LOS has been detected
• ”MAC flushing indication” forwarding, when receiving a failure detection from
remote node
• local MAC@table flushing action upon detection (snooping) the ”MAC flushing
indication” coming from remote nodes
This allows to perform, both locally and remotely, a re-learning that allows to avoid the
“MAC black-holing”. The equipment supports ”MAC flushing propagation indication”
associated with T-MPLS/MPLS-TP networks (in case of both VPLS and H-VPLS
schemes). The flushing action must be completed within 250ms.
The following optimization applicable to single node scenarios is supported:
• ”MAC flushing indication” upon a local LOS has been detected, is not sent in case of
single node interconnection, because of there is no need of re-convergence of the
other nodes
• ”MAC flushing indication” is not forwarded when receiving a failure detection from
remote node.
MAC@table flushing indication
It is the ability to detect MAC@ flushing packets encapsulated in the Tunnel from the
ring area, and to trigger the MAC@ flushing mechanism. When the ”MAC flushing
indication” is configured and enabled, the system is able to:
• detect the ”MAC flushing indication” coming from remote nodes (snooping)
• propagate the received ”MAC flushing indication” to other nodes
• generate the ”MAC flushing indication” in front of failures locally detected
MAC Access Control List management (MAC ACL)

Service delimiting
As Provider Bridge, Alcatel-Lucent 1850 TSS-100 supports non-service-delimiting and
service-delimiting VLAN TAG headers at both UNI and ETH-IWI Provider Bridge
interfaces.
Encapsulation and de-encapsulation actions apply to incoming service-delimiting
C-VLAN TAG headers at the Provider Bridge UNI Interface, and incoming
service-delimiting P-VLAN TAG headers at the Provider Bridge ETH-IWI Interface.
De-encapsulation is on a per flow basis. All flows inside the same logical <incoming
interface, VID> pair support either VLAN TAG preservation or removal for up to 8
de-encapsulation actions on a per <incoming interface, VID> basis.
Encapsulation is on a per flow basis, supporting up to 8 different encapsulation actions on
a per < outgoing interface, S-VID> basis.
Alcatel-Lucent 1850 TSS-100 supports the following:
• Ingress outer VLAN Swap – to “swap” (i.e., single VLAN tag Pop + Push) the outer
VLAN tag ID of an incoming Ethernet frame.
Single VLAN tag “push” operation, associated to each output ETS-Flow can be
performed for any server layer type such as Ethernet, VPLS, PW, PB)
• MAC Address learning per-VLAN — The capability to allocate learned MAC
addresses by dedicating a specific portion of the Filtering Database to each VLAN
This feature, known as Independent VLAN Learning (IVL), is used to ensure that
address information learned in one VLAN is not shared with other VLANs.
• Ethernet Unicast traffic Forwarding — Support for unicast forwarding of Ethernet
frames, based on MAC Destination Address and/or VLAN ID. The frame is then
forwarded through the network to the specified MAC DA.

Overview
Purpose
This appendix provides data for the individual components of the Alcatel-Lucent
1850 TSS-100.
For detailed specifications relating to signal, alarm, and control interfaces, refer to the
Alcatel-Lucent 1850 Transport Service Switch (TSS-100 and TSS-100C) Release 4.1
(ETSI) Engineering Rules.

Contents

ETSI rack hardware C-3

Alcatel-Lucent 1850 TSS-100 Shelf, Front Access C-5
Alcatel-Lucent 1850 TSS-100C Compact Shelf C-11
Top Rack Unit (TRU) ETSI with Bypass-Extension C-14
Equipment Controller TSS-100 (EC100) C-18
Equipment Controller TSS-100C (EC100C) C-21
Equipment Controller High Capacity (EC100A) C-24
Fan Unit TSS-100 High Performance (FAN100) C-28
Fan Unit TSS-100C High Performance (FAN100C) C-32
Universal Matrix TSS-100 (MT100) C-34
Universal Matrix TSS-100C (MT100C) C-38
Power Supply (POW100/POW100NS) C-42
Termination Bus (TBF/TBR/TB100C) C-46
63-Port E1/DS1 Multiplexer (63E1DS1M) C-48
56-Port E1/DS1 Multiplexer (E1DS1M) C-52

28-Port E1 Access (E1UAC) C-56

32-Port E1/DS1 Access (E1DS1BAC) C-61
32-Port E1/DS1 Access Protection (E1DS1PAC) C-64
32-Port E1 Access (E1UAC and E1DS1PAC) C-67
24-Port E3/DS3/EC1 Multiplexer + TMUX (E3DS3TM) C-72
12-Port E3 Access (12XE3A) C-76
6-Port DS3 Access (6XDS3AC) C-79
12-Port E3/DS3/EC1 Access Protection (E3DS3PAC) C-82
Combo PDH card (ASYMRTM) C-85
16x-Port STM-1 electrical access (16XSEA) C-88
16x-Port STM-1 protection access (SEPAC) C-90
8-Port STM-1/OC-3/STM-4/OC-12 (8PSO -8×155/622M sync optical/8XSOA) C-92
4-Port STM-16/OC-48 (4P2G5SO)(4×2.5G sync optical) C-98
8-port STM-1/STM-4/4-port STM-16 Multirate Synch (MRSOE) C-104
1-Port STM-64/OC-192 (1P10GSO) (1×10G sync optical) C-109
10G Packet Transport Processor (PP10G) C-116
1xGbE Packet Processor - Half Slot (PP10GHS) C-119
24xE/FE Electrical Packet Expander (PE24XFE) C-122
24XFE Packet Expander Access (PE24XFEA) C-126
8XGE Packet Expander Access (8XGEEA) C-130
8XGE Synchronous Ethernet Packet Expander Access (8XGEEA) C-132
1X10GE Packet Expander Access (10GEEA) C-135
Booster Amplifier - BST10GA C-138
PRE10GA - PRE-AMPLIFIER (Single channel) C-142
CWDM 4/8ch Mux/Demux (CMDX8) C-145
DWDM units C-147
STM-1 electrical SFP (S1E) C-154
STM-1/OC-3 SFPs C-156
STM-4/OC-12 SFPs C-160
STM-16/OC-48 SFPs C-164
100BASE-X SFPs C-169
1000BASE-X SFPs C-172
SFP 1000BASE-T electrical (ETHMR) (EL TRX SFP ETH MULTIRATE RJ45) C-181
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C-2 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets Overview

STM-64/OC-192 and 10GbE XFPs C-184

STM-64/OC-192 XFP-Es C-190
10GBASE-S XFP (Short Haul, 850 nm) (OPTO TRX XFP 10Gb) C-193
XFP-E adapter C-198
DWDM XFPs C-200
CWDM SFPs C-205
CWDM XFPs C-209

ETSI rack hardware

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
3AL92149AA TSS Rack w/TRU NA NA NA Active
3AN44815AA Optinex Rack w/TRU NA NA NA Active

Features and application notes

• Equipped with up to twoAlcatel-Lucent 1850 TSS-100 front access shelves or up to
three or four Alcatel-Lucent 1850 TSS-100C compact shelves with or without the
Integrated Top Rack Unit respectively.
• Provides integrated fiber management to manage customer interface connectivity
• Is constructed with EMI/RFI shielding.
For more information about the Alcatel-Lucent 1850 TSS-100 front access shelf, refer to
“Alcatel-Lucent 1850 TSS-100 Shelf, Front Access” (p. C-5). For more information about
the Alcatel-Lucent 1850 TSS-100C compact shelf, refer to “Alcatel-Lucent
1850 TSS-100C Compact Shelf” (p. C-11).

Description
The rack structure consists of two extruded sides secured to the upper and lower sides by
means of screws. It is 220cm high, 60cm wide, and 30cm deep. The rack is illustrated in
Figure C-1, “ETSI rack with integrated TRU” (p. C-4).
This illustration shows the following:
1. Openings for the transit of the cables inside the rack (two at the head and two at the
base of the rack)
2. The rack head (top)

Figure C-1 ETSI rack with integrated TRU

Alcatel-Lucent 1850 TSS-100 Shelf, Front Access

Part Number/ Name CLEI ECI/Bar Code CPR Status

Mnemonic
8DG25686ABXX1 Alcatel-Lucent TBS TBS TBS Active
1850 TSS-100
S100F Shelf, Front
Access, New
Edition
8DG25686AAXX2 Alcatel-Lucent NGMLD00CRA 454578 209515 Active
1850 TSS-100
S100F Shelf, Front
Access

Notes:
1. The new edition of the Front Access shelf, code 8DG25686ABXX, must be used with the new power filters:
8DG26182AAXX or 8DG26182ABXX.
2. The original Front Access shelf, code 8DG25686AAXX, must be used with the original power filters:
8DG02607ACXX or 8DG02607ADXX.

Important! The shelf front cover (8DG03034AAXX) is ordered separately.

Features and application notes

• Provides 12 I/O slots:
– 8 I/O slots supporting up to 10 Gb/s throughput and
– 4 I/O slots supporting up to 5 Gb/s throughput
• Supports 100 Gb/s redundant matrix switching
• Mounts in a 23-inch unequal-flange earthquake rack or in a 19-inch rack
• Occupies 14 Electronic Industries Association (EIA) vertical rack spacing increments
• Is constructed with EMI/RFI shielding.

Figure C-2 Alcatel-Lucent 1850 TSS-100 Shelf (Front Access)

AN416 AN408 M20302 M20303 M20203 M20205 M20204 AN410

AN417 AN409 AN411

Terminal Battery A Terminal Battery B

850-0102-1
190707

Connectors
The Alcatel-Lucent 1850 TSS-100 shelf Common Part Interface (CPI) has the following
connectors (see figure above).

Item Function
M20200 RJ45 connector for step-up A signals.
M20201 9-pin Sub-D female connector for SYNC 1.
M20202 15-pin female Sub-D connector for remote alarms.
M20203 15-pin female Sub-D connector for shelf identifier.
M20204 9-pin female Sub-D connector for SYNC 2.
M20205 RJ45 connector for step-up B signals.
M20300 25-pin female Sub-D connector for housekeeping.
M20301 9-pin male Sub-D connector for rack lamps.
M20302 25-pin female Sub-D connector for auxiliary channel.
M20303 9-pin female Sub-D connector for rack lamps.
TERMINAL BATTERY A A-power and A-return M5 metalized holes for connection of
two-hole lugs.
TERMINAL BATTERY B B-power, B-return, and ground M5 metalized holes for connection
of two-hole lugs.

The following figure shows the module complement of the basic area and access area that
contains the plug-in- equipment (refer to Table 6-1, “Traffic and access area card
complement” (p. 6-2)).
....................................................................................................................................................................................................................................
C-8 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets Alcatel-Lucent 1850 TSS-100 Shelf, Front Access

Figure C-4 Alcatel-Lucent 1850 TSS-100 Shelf (Front Access)

Access area

EC100
25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

Fan
Sh ID HK

POW100(P)
Basic area
_
MT100 (P)
EC100 (P)

10G slot
10G slot

10G slot
10G slot
10G slot
10G slot
10G slot
10G slot

5G slot
5G slot
5G slot

MT100
5G slot
EC100

18
POW100
_

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

newgraphic4a

The following table shows the relationships between basic slots and access slots for E1,
E3 applications. Refer to the appropriate unit data sheet for detailed information.

Table C-1 Front access shelf: Relationships between slots for E1/ E3 applications

Basic Slot Corresponding Access Slots

5 25, 26
6 27, 28
7 29, 30
8 31, 32
11 33, 34

Basic Slot Corresponding Access Slots

12 35, 36
13 37, 38
14 39, 40

The following table shows the relationships between basic slots and access slots for data
applications. Refer to the appropriate unit data sheet for detailed information.

Table C-2 Front access shelf: Relationships between slots for data applications

Basic Slot Corresponding Access Slots

3, 4 (10G slots) 25, 26
5, 6 (10G slots) 27, 28
7, 8 (5G slots) 29, 30
11, 12 (5G slots) 35, 36
13, 14 (10G slots) 37, 38
15, 16 (10G slots) 39, 40

Functional overview
The front-access shelf houses modules that support SDH and data applications. The shelf
is divided into two areas: the basic area and the access area. The basic area has 18 slots. It
has SDH and data port slots, Universal Matrix (MT100) slots, Equipment Controller
(EC100/EC100A) slots, and Power Supply (POW100/POW100NS) slots.

SDH and data port slots are:

159mm (6.26 in.) high, 206mm (8.11 in.) deep, and 22.9mm (0.90 in) wide.
MT100 slots are:
159mm (6.26 in.) high, 206mm (8.11 in.) deep, and 45.7mm (1.80 in.) wide.
EC100/EC100A slots are:
159mm (6.26 in.) high, 206mm (8.11 in.) deep, and 25.4mm (1.00 in.) wide.
POW100/POW100NS slots are:
72.1mm (2.84 in.) high, 207.5mm (8.17 in.) deep, and 30.5mm (1.20 in.) wide.

Alcatel-Lucent 1850 TSS-100C Compact Shelf

Part Number/ Name CLEI ECI/Bar Code CPR Status

Mnemonic
8DG25826ABXX1 Alcatel-Lucent TBS TBS TBS Active
1850 TSS-100
S100C Compact Shelf,
New Edition
8DG25826AAXX2 Alcatel-Lucent NGM3Y00HRA 459915 213259 Active
1850 TSS-100
S100C Compact Shelf

Important! The shelf front cover (8DG03004AAXX) is ordered separately.

Features and application notes

• Supports up to 10 Gb/s throughput for each slot
• Supports 60-Gb/s redundant matrix switching
• Mounts in a 21-inch ETSI rack 300 mm deep
• Occupies 10 Electronic Industries Association (EIA) vertical rack spacing increments
• Is constructed with EMI/RFI shielding.
• ETSI applications only. ANSI applications of the Alcatel-Lucent 1850 TSS-100C
shelf are not supported in this release.

Description
The Alcatel-Lucent 1850 TSS-100C shelf houses equipment that performs control,
matrix, and I/O functions. The shelf consists of top, bottom, rear, and side panels; card
guides; and a printed circuit backplane. Equipment connections are through connectors on
the backplane.
The shelf cover is designed to be used with LC fiber straight connectors and 90-degree
connectors.
The Alcatel-Lucent 1850 TSS-100C compact shelf (ETSI only) is 531.0 mm (20.90 in.)
wide, 398.0 mm (15.67 in.) high, and 294.0 mm (11.57 in.) deep.
Mounting flanges on each side of the shelf secure it to the rack. A rack holds up to three
or four Alcatel-Lucent 1850 TSS-100C compact shelves with or without the Integrated
Top Rack Unit respectively.

Slots
The following figure shows the traffic and access slots.

Figure C-5 Alcatel-Lucent 1850 TSS-100C Shelf

FAN100C PWR
14

PSF B
PSF A
HK/Alm/Lamp Access FAN Tray
connectors
12 11Power HK sync
HK/Alm/lamps
B
A

Batt A

SU
S
aux sync
Batt B
connectors connectors

MT100C (P)
EC100C (P)
10G Slot
10G Slot

10G Slot
10G Slot
10G Slot
10G Slot
MT100C
EC100C

Access
Access
Access
Access
Access
Access
Access
Access
Ac

Ac
Ac

Ac
1 2 3 4 5 6 7 8 9 10 15 16 17 18 19 20 21 22

6 Traffic Slots 8 Access Slots

STM1/4/16/64 E1/E3
E1/E3 10/100 FE
GE GE/10GE
TSS-100C

The following table shows the relationships between basic slots and access slots for
E1/E3 applications. Refer to the appropriate unit data sheet for detailed information.

Table C-3 Compact shelf: Relationships between slots for data applications

Basic Slot Corresponding Access Slots

3, 4 (10G slot) 21, 22
7, 8 (10G slot) 19, 20
9, 10 (10G slot) 17, 18

The following table shows the relationships between basic slots and access slots for data
applications. Refer to the appropriate unit data sheet for detailed information.

Table C-4 Compact shelf: Relationships between slots and access for E1/ E3
applications

Basic Slot Corresponding Access Slots

3, 4 (10G slot) 21, 22
7, 8 (10G slot) 19, 20
9, 10 (10G slot) 17, 18

Top Rack Unit (TRU) ETSI with Bypass-Extension

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
3AL91622AB Top Rack Unit with Active
TRU Bypass-Extension

Figure C-6 TRU front view

Description of bypass extension

The Bypass Extension acts as an interface between the local power supplies and the
installed shelves. The distributed voltage may be either 48V or 60V. The extension bypass
functions as a pass through as illustrated in Figure C-7, “Power pass-through of bypass

Figure C-7 Power pass-through of bypass units

The extension bypass extension units always work in pairs with one powered from battery
A, and the other one powered from battery B. It is not possible to use a single extension
bypass.
The following are the components and symbols found on the front cover panel:
• Two manual vertical lever-type ON/OFF fuse breakers located on the negative line.
The switch is ON when the switch lever is up.
• A DC/DC symbol in the top right corner
• An ON/OFF symbol near the switches
The Extension Bypass meets the following requirements characteristics:
• Leakage to Ground - In compliance with EN60950 and GR - 1089
• Grounding - In compliance with EN60950 and GR - 1089

Indicators, connectors, and fuses

The TRU has the following indicators.

Table C-5 TRU indicators

Item Function
A1-1, TPA FUSE Red indicator lights when fuse A1-1 blows.
A1-2, TPA FUSE Red indicator lights when fuse A1-2 blows.
A2-1, TPA FUSE Red indicator lights when fuse A2-1 blows.
A2-2, TPA FUSE Red indicator lights when fuse A2-2 blows.
B1-1, TPA FUSE Red indicator lights when fuse B1-1 blows.
B1-2, TPA FUSE Red indicator lights when fuse B1-2 blows.
B2-1, TPA FUSE Red indicator lights when fuse B2-1 blows.
B2-2, TPA FUSE Red indicator lights when fuse B2-2 blows.
A1 POWER Green indicator lights when A1 input power is present.
A2 POWER Green indicator lights when A2 input power is present.
B1 POWER Green indicator lights when B1 input power is present.
B2 POWER Green indicator lights when B2 input power is present.
FUSE ALARM Red indicator lights when a fuse alarm is present.

Equipment Controller TSS-100 (EC100)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG02822ABXX Equipment NGC5AA5FAB 145308 070DVA Active
EC100 Controller

Important! The 8DG2822ABXX EC100 must be installed in your shelf in order to

install Release 4.0. The 8DG2822ABXX EC100 replaces 8DG2822AAXX EC100.
The 8DG2822AAXX EC100 is not supported in Release 4.0 and later.

Features and application notes

• Provides the First-Level Controller (FLC) function
• Provides the Operation, Administration and Maintenance (OAM) functions
• Provides the Control and General Interface (CGI) function
• Provides a mass-storage function, using a 1 GB flash disk (2.5 inch form factor,
44-pin IDE interface)
• Two Equipment Controller TSS-100 (EC100) modules equipped in a shelf provide
redundancy (1:1, non-revertive).

Description
The EC100 is the FLC for the Alcatel-Lucent 1850 TSS-100 shelf. As an FLC, it controls
shelf management and communication. For the Control and General Interface function, it
manages physical interfaces for alarm collection and signaling. It also uses a 1 GB flash
disk to provide mass storage functions.
The EC100 is a solid-state, etched-circuit module that plugs into a card cage. See Figure
C-8, “Equipment Controller TSS-100 (EC100)” (p. C-19) for an outline of the EC100.
At least one EC100 is required for shelf operation. Two EC100s are required for
redundant operation.

Figure C-8 Equipment Controller TSS-100 (EC100)

1
2

EPS
11 R
3
12
4
DOG 5
6
13 CM
7
8
14 9
10
AT AB

17
18

850-0021-1
060906

Indicators and connectors

The EC100 has the following indicators and connectors (see Figure C-8, “Equipment
Controller TSS-100 (EC100)” (p. C-19)):

Connector/Indicator Description
1 Board Status Multicolor LED:
• LED off—Card not equipped or card equipped and not
provisioned
• Green blink—Software boot/self test
• Green—Card properly equipped and provisioned and in
service
• Red—Card failure
2 EPS Multicolor LED:
• Green—EPS configured; card active
• Amber—EPS configured; card standby
• Off—EPS not configured
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C C-19
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets Equipment Controller TSS-100 (EC100)

Connector/Indicator Description
3 RJ-45 Ethernet status
• Green—Interface active, blinks when exchanging packets
• Off—Interface inactive
4 LED always off—Not used
5 Red LED—Critical alarm
6 Red LED—Major alarm
7 Amber LED — Minor alarm
8 LED always off—Not used
9 Red LED—Attended alarm
10 Orange LED—Abnormal condition
11 Reset command key
12 10/100 Ethernet debug RJ-45 connector (factory use only)
13 RS-232 on mUSB debug connector (F interface)
14 Local craft terminal mUSB connector (F interface)
15 Local craft terminal connector (RS-232 F interface)
16 USB interface for external memory device
17 Alarm cut-off key
18 Lamp test key

Functional operation
The EC100 is composed of two boards, a main board and a processor daughter board, and
a mass memory device which is used to store all of the software packages and the
database for the Network Element (NE).
Main board
The main board provides circuits for the following functions:
• Physical layer interface for the different system-related serial communication
channels supported by the FLC function
• Station alarm signaling interfaces for rack lamps, remote alarms, and housekeeping
• Mass storage interface connector
• Module and system identification function
• Module power supply
• Remote Inventory (RI) function

Equipment Controller TSS-100C (EC100C)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG26031ABXX Equipment NGC5ALJFAA 171337 070VHK Active
EC100C Controller

Important! The 8DG26031ABXX EC100C must be installed in your shelf in order to

install Release 4.0. The 8DG26031ABXX EC100C replaces 8DG2822AAXX
EC100C.
The 8DG26031AAXX EC100 is not supported in Release 4.0 and later.

Features and application notes

• Provides the First-Level Controller (FLC) function for the Alcatel-Lucent
1850 TSS-100C shelf
• Provides the Operation, Administration and Maintenance (OAM) functions
• Provides the Control and General Interface (CGI) function
• Provides a mass-storage function, using a 1 GB flash disk (2.5 inch form factor,
44-pin IDE interface)
• Two Equipment Controller TSS-100C (EC100C) cards equipped in a shelf provide
redundancy (1:1, non-revertive).

Figure C-9 Equipment Controller TSS-100C (EC100C)

1
2

EPS
11 R
3
12
4
DOG 5
6
13 CM
7
8
14 9
10
AT AB

17
18

850-0021-1
060906

Connector/Indicator Description
1 Board Status Multicolor LED:
• LED off—Card not equipped or card equipped and not
provisioned
• Green blink—Software boot/self test
• Green—Card properly equipped and provisioned and in
service
• Red—Card failure
2 EPS Multicolor LED:
• Green—EPS configured; card active
• Amber—EPS configured; card standby
• Off—EPS not configured
3 RJ-45 Ethernet status
• Green—Interface active, blinks when exchanging packets
• Off—Interface inactive
4 LED always off—Not used
5 Red LED—Critical alarm
6 Red LED—Major alarm
7 Amber LED - Minor alarm
8 LED always off—Not used
9 Red LED—Attended alarm
10 Orange LED—Abnormal condition
11 Reset command key
12 10/100 Ethernet debug RJ-45 connector (factory use only)
13 RS-232 on mUSB debug connector (F interface)
14 Local craft terminal mUSB connector (F interface)
15 Local craft terminal connector (RS-232 F interface)
16 USB interface for external memory device
17 Alarm cut-off key
18 Lamp test key

Equipment Controller High Capacity (EC100A)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG0822ABXX Equipment TBD TBD TBD Active
EC100A Controller High
Capacity

The EC100A is supported in Release 3.1 and later releases only.

Description
The EC100A is the FLC for the Alcatel-Lucent 1850 TSS-100 front and rear access
shelves. As an FLC, it controls shelf management and communication. For the Control
and General Interface function, it manages physical interfaces for alarm collection and
signaling. The EC100A is equipped with an 8 GB flash disk to provide enhanced mass
storage functions for future use
The EC100A is a solid-state, etched-circuit module that plugs into a card cage. See Figure
C-10, “Equipment Controller High Capacity (EC100A)” (p. C-26) for an outline of the
EC100A.
At least one EC100A is required for shelf operation. Two EC100A cards are required for
redundant operation.

Figure C-10 Equipment Controller High Capacity (EC100A)

1
2

EPS
11 R
3
12
4
DOG 5
6
13 CM
7
8
14 9
10
AT AB

17
18

850-0021-1
060906

Indicators and connectors

The EC100A has the following indicators and connectors (see Figure C-10, “Equipment
Controller High Capacity (EC100A)” (p. C-26)):

Connector/Indicator Description
1 Board Status Multicolor LED:
• LED off—Card not equipped or card equipped and not
provisioned
• Green blink—Software boot/self test
• Green—Card properly equipped and provisioned and in
service
• Red—Card failure
2 EPS Multicolor LED:
• Green—EPS configured; card active
• Amber—EPS configured; card standby
• Off—EPS not configured
....................................................................................................................................................................................................................................
C-26 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets Equipment Controller High Capacity (EC100A)

Connector/Indicator Description
3 RJ-45 Ethernet status
• Green—Interface active, blinks when exchanging packets
• Off—Interface inactive
4 LED always off—Not used
5 Red LED—Critical alarm
6 Red LED—Major alarm
7 Amber LED - Minor alarm
8 LED always off—Not used
9 Red LED—Attended alarm
10 Orange LED—Abnormal condition
11 Reset command key
12 10/100 Ethernet debug RJ-45 connector (factory use only)
13 RS-232 on mUSB debug connector (F interface)
14 Local craft terminal mUSB connector (F interface)
15 Local craft terminal connector (RS-232 F interface)
16 USB interface for external memory device
17 Alarm cut-off key
18 Lamp test key

Functional operation
The EC100A is composed of two boards, a main board and a processor daughter board,
and a mass memory device which is used to store all of the software packages and the
database for the Network Element (NE).
Main board
The main board provides circuits for the following functions:
• Physical layer interface for the different system-related serial communication
channels supported by the FLC function
• Station alarm signaling interfaces for rack lamps, remote alarms, and housekeeping
• Mass storage interface connector
• Module and system identification function
• Module power supply
• Remote Inventory (RI) function

Fan Unit TSS-100 High Performance (FAN100)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG25684AAXX Fan Unit Active
(ETSI)
8DG02609AAXX
(ANSI)
FAN100

Features and application notes

• Provides forced airflow to cool equipment in an Alcatel-Lucent 1850 TSS-100 shelf
• Allows for hot insertion/removal of the Fan Unit TSS-100 High Performance
(FAN100) in the event of a failure
• Contains sensors that determine if Air Movement Unit (AMU) speed is too slow or
stopped
• Has redundant input power feeds such that failure of any single power source does not
disable the FAN100
• Housed in an Alcatel-Lucent 1850 TSS-100 shelf.

Description
The Alcatel-Lucent 1850 TSS-100 shelf uses forced-air cooling provided by the FAN100.
The FAN100 is located at the top of the Alcatel-Lucent 1850 TSS-100 shelf and draws
ambient air into the Alcatel-Lucent 1850 TSS-100 shelf through the bottom of the

Figure C-11 Fan Unit TSS-100 High Performance (FAN100)

Front view
STATUS
FAN
CRITICAL
MAJOR
DO NOT REMOVE
MINOR

Top view

850-0024-1
061907

The FAN100 has two sub-units:

• Fan controller board
• Fan connector board
The fan connector board is connected to the Alcatel-Lucent 1850 TSS-100 shelf
backplane and provides power to all eight AMUs in the FAN100. The fan controller board
is used to change AMU speed and to manage the other functions of the FAN100 (display
rack alarm, manage pilot fuse).

Item Function
FAN Red LED indicates that one ore more Air Movement Units (AMUs) are not
working properly.
STATUS Green LED indicates connection between MT100 (second-level controller)
and FAN100.
CRITICAL LED indicates critical system alarm.
MAJOR LED indicates major system alarm.
MINOR LED indicates minor system alarm.
Front-panel RS-232, 15-pin Sub-D connector for download and monitoring.
connector

Functional overview
The FAN100 is composed of the following:
• Eight AMUs
• Fan controller board—Connected to the backplane and provides power to the eight
AMUs
• Fan connector board—Used to change AMU speed and to manage other functions of
the FAN100, including rack alarm display and pilot fuse management.
The main functions on the FAN100 include:
• Power distribution block—Provides protection and EMI filtering for every AMU. The
board is equipped with two fuses for each AMU to protect the board from fan fail.
The backplane is protected by four fuses.
• Speed control—Three sensors connected with the microcontroller monitor
temperature in the FAN100. This information is used to control the AMU speed.
• Pilot fuse management—Ensures that a minimum current is drawn on each A- and
B-battery input, allowing the pilot fuse in the plant's battery to blow.
• Rack alarm display—Critical, major, and minor alarms are displayed at the front of
the FAN100.

Fan Unit TSS-100C High Performance (FAN100C)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG26082AAXX Fan Unit NGC5ALPFAA 171484 070VJX Active
FAN100C

Features and application notes

• Provides forced airflow to cool equipment in an Alcatel-Lucent 1850 TSS-100C shelf
• Allows for hot insertion/removal of the Fan Unit TSS-100C High Performance
(FAN100C) in the event of a failure
• Contains sensors that determine if Air Movement Unit (AMU) speed is too slow or
stopped
• Has redundant input power feeds such that failure of any single power source does not
disable the FAN100C
• Housed in an Alcatel-Lucent 1850 TSS-100C shelf.

Description
The Alcatel-Lucent 1850 TSS-100C shelf uses forced-air cooling provided by the
removable FAN100C. The FAN100C is located at the top of the Alcatel-Lucent
1850 TSS-100C shelf and draws ambient air into the shelf through the bottom of the
shelf. The air passes through a high dust arresting air filter and over the surfaces of the
modules. The heated air exits the shelf at the top.
To guarantee the proper air cooling of the equipment electronics, dummy cards have to be
installed in shelf slots, that are not populated with real cards.
The FAN100C contains eight multi-speed Air Movement Units (AMUs). The whole
system has been designed to properly work even if one of the AMUs is not working. This
prevents the shelf from overheating if one of the AMUs fails.
Two captive screws fasten the FAN100C to the shelf.
The FAN100C has two sub-units:
• Fan controller board
• Fan connector board
The fan connector board is connected to the shelf backplane and provides power to all
eight AMUs in the FAN100C. The fan controller board is used to change AMU speed and
to manage the other functions of the FAN100C (display rack alarm, manage pilot fuse).

Item Function
FAN Red LED indicates that one ore more Air Movement Units (AMUs) are not
working properly.
STATUS Green LED indicates connection between MT100C (second-level controller)
and FAN100C.
CRITICAL LED indicates critical system alarm.
MAJOR LED indicates major system alarm.
MINOR LED indicates minor system alarm.
Front-panel RS-232, 15-pin Sub-D connector for download and monitoring.
connector

Functional overview
The FAN100C is composed of the following:
• Eight AMUs
• Fan controller board—Connected to the backplane and provides power to the eight
AMUs
• Fan connector board—Used to change AMU speed and to manage other functions of
the FAN100C, including rack alarm display and pilot fuse management.
The main functions on the FAN100C include:
• Power distribution block—Provides protection and EMI filtering for every AMU. The
board is equipped with two fuses for each AMU to protect the board from fan fail.
The backplane is protected by four fuses.
• Speed control—Three sensors connected with the microcontroller monitor
temperature in the FAN100C. This information is used to control the AMU speed.
• Pilot fuse management—Ensures that a minimum current is drawn on each A- and
B-battery input, allowing the pilot fuse in the plant's battery to blow.
• Rack alarm display—Critical, major, and minor alarms are displayed at the front of
the FAN100C.

Universal Matrix TSS-100 (MT100)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG02608ACXX Universal Matrix NGC5AA6FAA 145175 070DXG Active
MT100

Features and application notes

• Provides SDH and agnostic data flow switching capabilities
• Is a two-slot module composed of matrix and Second-Level Controller (SLC)
subassemblies
• Provides shelf controller, Clock Reference Unit (CRU), VC-12 matrix, and VC-3
matrix function for SDH .
• Provides Forward Error Correction (FEC) of the links through the backplane
• Performs payload Performance Monitoring (PM)
• Supports Automatic Protection Switching (APS) when two Universal Matrix (MT100)
modules are equipped
• Provides synchronous clock management.

Description
The Universal Matrix (MT100) receives the signal from the Input/Output (I/O) modules
and performs switching at the VC-12 and VC-3 levels. It also serves as the SLC for the
shelf and provides a Clock Reference Unit.
The MT100 is a solid-state, etched-circuit module that plugs into the card cage. It is 7.01
inches high, 8.86 inches deep, and 1.75 inches wide. See Figure C-12, “Universal Matrix
(MT100)” (p. C-35) for an outline of the MT100.
Two MT100s may be in a shelf, at least one is required. One module is active, and the
other is standby for redundancy.

Figure C-12 Universal Matrix (MT100)

DBG
Port

CT
1

M
2

M
3

DS
4

STATUS

DS
5

EPS

DBG
RS-232

TDM

PKT

850-0034-1
060106

Indicators and connectors

The MT100 has the following indicators and connectors:

Item Function
DBG Ethernet RJ-45 connector; factory use only.
1/CT Ethernet RJ-45 connector; Ethernet interface
to connect point-to-point a single PC running a
CT.
2/M Ethernet RJ-45 connector; redundant
3/M management interfaces (Q-interfaces) to
connect the 1350 OMS or 1340 INC through a
bridged LAN.
4/DS Ethernet RJ-45 connector to connect drop
shelves.
5/DS Ethernet RJ-45 connector to connect drop
shelves.

Item Function
STATUS Green LED indicates MT100 is in service.
Green blink LED indicates the MT100
software is booting/autotesting. Amber blink
LED indicates FPGA download is in progress.
Red LED indicates a card failure. Red blink
LED indicates card misconfigured or card
mismatched. OFF indicates card not equipped,
not provisioned, or out of service.
EPS Green LED indicates MT100 is active. Amber
LED indicates MT100 is standby. Amber blink
LED indicates protection switching is not
configured.
DBG RS-232 Mini USB RS-232 connector; factory use only.

Functional operation
The MT100 supports the following four functions:
• Shelf controller
• Clock Reference Unit (CRU)
• VC-3 matrix
• VC-12 matrix
Shelf controller
The shelf controller function is hosted on the Second Level Controller (SLC)
subassembly and manages the control bus links towards all peripheral units as follows:
• Field-Programmable Gate Array (FPGA) configuration and update
• Alarm collection
• Performance Monitoring (PM) data collection
• Reporting all collected information to the Equipment Controller (EC100/EC100A)
• Management of FastEthernet and Gigabit Ethernet connections.
Clock reference unit (CRU)
The CRU is hosted on the matrix subassembly and is the core of the synchronous
equipment. It locks the local oscillator to the network reference (line or external source)
or works in the holdover or free-running mode. It has the ability to provide

Universal Matrix TSS-100C (MT100C)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG25824ABXX Universal Matrix NGC5GAFAA 165399 070RNY Active
MT100C

Features and application notes

• Provides SDH and agnostic data flow switching capabilities for the Alcatel-Lucent
1850 TSS-100C shelf.
• Is a two-slot module composed of matrix and Second-Level Controller (SLC)
subassemblies
• Provides shelf controller, Clock Reference Unit (CRU), VC-12 matrix, and VC-3
matrix function for SDH.
• Provides Forward Error Correction (FEC) of the links through the backplane
• Performs payload Performance Monitoring (PM)
• Supports Automatic Protection Switching (APS) when two Universal Matrix
(MT100C) modules are equipped
• Provides synchronous clock management.

Description
The Universal Matrix (MT100C) receives the signal from the Input/Output (I/O) modules
and performs switching at the VC-12 and VC-3 levels. It also serves as the SLC for the
shelf and provides a Clock Reference Unit.
The MT100C is a solid-state, etched-circuit module that plugs into the card cage. It is
7.01 inches high, 8.86 inches deep, and 1.75 inches wide. See Figure C-13, “Universal
Matrix TSS-100C (MT100C)” (p. C-39) for an outline of the MT100C.
Two MT100Cs may be in a Alcatel-Lucent 1850 TSS-100C shelf, at least one is required.
One card is active, and the other card is standby for redundancy.

Figure C-13 Universal Matrix TSS-100C (MT100C)

DBG
Port

CT
1

M
2

M
3

DS
4

STATUS

DS
5

EPS

DBG
RS-232

TDM

PKT

850-0034-1
060106

Indicators and connectors

The MT100C has the following indicators and connectors:

Item Function
DBG Ethernet RJ-45 connector; factory use only.
1/CT Ethernet RJ-45 connector; Ethernet interface
to connect point-to-point a single PC running a
CT.
2/M Ethernet RJ-45 connector; redundant
3/M management interfaces (Q-interfaces) to
connect the Alcatel-Lucent 1350 OMS through
a bridged LAN.
4/DS Ethernet RJ-45 connector to connect drop
shelves.
5/DS Ethernet RJ-45 connector to connect drop
shelves.

Item Function
STATUS Green LED indicates MT100C is in service.
Green blink LED indicates the MT100C
software is booting/autotesting. Amber blink
LED indicates FPGA download is in progress.
Red LED indicates a card failure. Red blink
LED indicates card misconfigured or card
mismatched. OFF indicates card not equipped,
not provisioned, or out of service.
EPS Green LED indicates MT100C is active.
Amber LED indicates MT100C is standby.
Amber blink LED indicates protection
switching is not configured.
DBG RS-232 Mini USB RS-232 connector; factory use only.

Functional operation
The MT100C supports the following four functions:
• Shelf controller
• Clock Reference Unit (CRU)
• VC-3 matrix
• VC-12 matrix
Shelf controller
The shelf controller function is hosted on the Second Level Controller (SLC)
subassembly and manages the control bus links towards all peripheral units as follows:
• Field-Programmable Gate Array (FPGA) configuration and update
• Alarm collection
• Performance Monitoring (PM) data collection
• Reporting all collected information to the Equipment Controller
• Management of Fast Ethernet and Gigabit Ethernet connections.
Clock reference unit (CRU)
The CRU is hosted on the matrix subassembly and is the core of the synchronous
equipment. It locks the local oscillator to the network reference (line or external source)
or works in the holdover or free-running mode. It has the ability to provide

Power Supply (POW100/POW100NS)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG26182AAXX1 Power Supply with TBD TBD TBD Active
switch
POW100
8DG02607ACXX2 Power Supply with TBD TBD TBD Active
switch
POW100
8DG26182ABXX1 Power Supply TBD TBD TBD Active
without switch
POW100NS
8DG02607ADXX2 Power Supply TBD TBD TBD Active
without switch
POW100NS

Notes:
1. 8DG26182AAXX and 8DG26182ABXX must be used with the new edition of the Front Access shelf, code
8DG25686ABXX and the new edition of the Compact shelf, code 8DG25826ABXX.
2. 8DG02607ACXX and 8DG02607ADXX must be used with the original Front Access shelf, code
8DG25686AAXX and original Compact shelf, code 8DG25826AAXX.

Features and application notes

• Functions as the interface between the input battery from the Power Distribution Unit,
Quad Input (PDU-Quad) and the Alcatel-Lucent 1850 TSS-100 shelf backplane
• Supplies all modules in the Alcatel-Lucent 1850 TSS-100 shelf with power from the
PDU-Quad and a 3.6 V auxiliary voltage
• Operates in a load-sharing protection scheme when two Power Supply
(POW100/POW100NS) modules are equipped.

Description
The POW100/POW100NS provides a 3.6 V auxiliary voltage and filtered A- and
B-battery power from the PDU-Quad to all modules in the Alcatel-Lucent 1850 TSS-100
shelf. Two POW100/POW100NS cards are required and operated in a load-sharing
protection scheme. The POW100/POW100NS cards are powered from two isolated

Figure C-14 Power Supply (POW100) with switch

DCOC
1
1
STATUS

Auto
ON/OFF

LABEL CLEI CODE

Manual
OFF

BDG02607AA POW100
DC
DC

850-0128-1
062007

Figure C-15 Power Supply (POW100NS) without switch

DCOC
1

1
STATUS
LABEL CLEI CODE

8DG02607AA POW100

DC
DC

850-0129-1
062007

Item Function
DC/DC Two-color LED that indicates the presence of
service voltage
STATUS Two-color LED that provides module status,
including module failure or in-service
“Regional Setting" specific mini-switch in the Switch with one locking lever position in ETSI
front panel -> ANSI transition that sets the correct ETSI or
ANSI voltage thresholds inside the unit.
M9 Backplane connector that provides A- and B-
battery power, 3.6 V service voltage, and
control signal connections

POW100NS: indicators and connectors

The POW100NS has the following indicators and connectors. Refer to Figure C-15,
“Power Supply (POW100NS) without switch” (p. C-43):

Item Function
DC/DC Two-color LED that indicates the presence of
service voltage
STATUS Two-color LED that provides module status,
including module failure or in-service
M9 Backplane connector that provides A- and B-
battery power, 3.6 V service voltage, and
control signal connections

Functional operation
The POW100/POW100NS is composed of the following functional blocks:
• Input filter
• Battery monitor
• Battery distribution
• Battery alarms
• Power monitor
• Spider ASIC and SPI bus
....................................................................................................................................................................................................................................
C-44 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets Power Supply (POW100/POW100NS)

Termination Bus (TBF/TBR/TB100C)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG02849AAXX Termination Bus NGC5ACCFAA 150752 TBD Active
TBF (front access)

8DG25817AAXX Termination Bus TBD TBD TBD Active

TB100C (TSS-100C shelf)

Features and application notes

• Provides the LCI interface
• Equipped as part of theshelf. This part number is provided for replacement purposes.

Connectors
The termination bus has the following connectors:

Item Function
M1 60-pin backplane connector
M2 60-pin backplane connector

Functional operation
The termination bus is composed of the following blocks:
• Spider ASIC
• EEPROM for Remote Inventory (RI)
• LCI interface and EEPROM
• Power supply controls.
Spider ASIC
The Spider ASIC manages SPI buses. SPI is a low-speed serial communication channel
used by the MT100/MT100C Second-Level Controller (SLC) to transfer data to/from
serial devices on different modules in the shelf.
Spider is connected to two SPI buses. One is connected to the copy 0 matrix, and the
other is connected to the copy 1 matrix. Spider reads the ID slot from the backplane,
manages RI, and collects power supply alarms.
EEPROM for remote inventory (RI)
The termination bus has an EEPROM with an RI serial protocol interfaced to Spider. This
memory stores data information for the termination bus, such as code, version, and series.
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C C-47
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets Termination Bus (TBF/TBR/TB100C)

63-Port E1/DS1 Multiplexer (63E1DS1M)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG26156AAXX 63-Port E1/DS1 TBD TBD TBD Active
63E1DS1M Multiplexer

Features and application notes

• Supports up to 63 ports from two 28-Port E1 DS1 Access modules (E1UAC or
E1DS1BAC)
• Performs asynchronous mapping of E1 s into VC12 s
• Operates in a 1:N protection mode with N = 1 to 7
• Provides E1 line termination functions
• Provides alarming, provisioning, connections, maintenance functions, and
Performance Monitoring (PM) on E1 s.
• 63E1DS1M can be installed in
– slot 4 and 27/28 of the Front Access shelf
– slot 10 and 21/22 of the Compact shelf

Description
In this release, the 63-Port E1/DS1 Multiplexer (E1DS1M) accepts customer E1 s from
the E1UAC or E1DS1BAC, provides direct mapping of E1 into VC-n, provides E1 PM,
and clear-channel E1 .
The 63E1DS1M is a solid-state, etched-circuit module that plugs into the card cage. See
the following figure for an outline of the 63E1DS1M.

Figure C-16 63-Port E1/DS1 Multiplexer (63E1DS1M)

Indicators and connectors

The 63E1DS1M has the following indicators and connectors (see Figure C-16, “63-Port
E1/DS1 Multiplexer (63E1DS1M)” (p. C-49)):

Item Function
STATUS Multicolor LED that provides module status, such as module
failure, in-service, update in progress.
EPS Multicolor LED that provides automatic protection switching
status.
M1 Backplane connector that provides power supply from PSFs A and
B and service voltage A and B.
M2 Backplane connector that provides interface for management,
clock, and diagnostic monitoring.
M3 Backplane connector that provides payload interface at 3.2 Gb/s.

....................................................................................................................................................................................................................................
• One small linear LDO regulator to derive +2.5 V (0.9 A) from the +3.3 V rail.
• One small linear LDO regulator to derive +1.8 V (0.7 A) from the +3.3 V rail.
An additional 3.3 V service voltage, which is obtained from a duplicated 3.6 V
(VS3.6VA, VS3.6VB) from the backplane, is used for on-board management circuitry:
Remote Inventory (RI) device, status LEDs, DC/DC control, on-board monitoring, and
Goblin_4G Cpld.
Timing sub-system
A programmable Phase Locked Loop (PLL) is used to provide the correct frequency to
the Temap when the module is working in the optional transmux function. In the standard
E1 mapper mode, this PLL is not used.
Control sub-system
Three types of interfaces are used for communication between the MT100 (second-level
controller) modules and the 63E1DS1M:
• Intra-Shelf Parallel Bus (ISPB)
• Serial Peripheral and Inventory (SPI) bus
• Hardware Configuration (HW_CFG) bus.
The ISPB provides a backplane communication channel between the Second-Level
Controller (SLC) on the MT100 and every transport module in the shelf. Through the
ISPB, the SLC can load configuration settings within the internal registers of the Euclide
ASIC and the Agnesi FPGA, monitor the current status, and collect data for Performance
Monitoring (PM). The ISPB is a synchronous parallel multiplexed bus with 16
addresses/data lines with interrupt and error detection capabilities. The unit selects the
ISPB reference clock under the control of the active SLC.
The SPI bus and Goblin_4G allow the SLC to perform the following tasks:
• Access to/from onboard E2PROM for RI data over the local SPI bus
• Access to/from a dedicated AD converter to collect electric data
• Control card status LEDs
• Program local PLL to generate the frequencies used for the optional transmux
function
• Trim the output voltage of the on-board DC/DC converters.
Through the HW_CFG bus, the SLC can access the HW_CFG bridge function in the
Goblin_4G Cpld. This function is used to grant access to the 64 Mb flash memory device
and to transfer downloaded configuration data from flash memory to Agnesi over the
FPGA's parallel configuration interface. HW_CFG allows remote control of this
download procedure.

56-Port E1/DS1 Multiplexer (E1DS1M)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG02666AAXX 56-Port E1/DS1 NGI7ADFMAA 145187 070DXS Active
E1DS1M Multiplexer

Features and application notes

• Supports up to 56 ports from two 28-Port E1 DS1 Access modules (E1UAC or
E1DS1BAC)
• Performs asynchronous mapping of E1 s into VC12 s
• Operates in a 1:N protection mode with N = 1 to 7
• Provides E1 line termination functions
• Provides alarming, provisioning, connections, maintenance functions, and
Performance Monitoring (PM) on E1 s.

Description
In this release, the 56-Port E1/DS1 Multiplexer (E1DS1M) accepts customer E1 s from
the E1UAC or E1DS1BAC, provides direct mapping of E1 into VC-n, provides E1 PM,
and clear-channel E1 .

Figure C-17 56-Port E1/DS1 Multiplexer (E1DS1M)

Indicators and connectors

The E1DS1M has the following indicators and connectors (see Figure C-17, “56-Port
E1/DS1 Multiplexer (E1DS1M)” (p. C-53)):

....................................................................................................................................................................................................................................
• One small linear LDO regulator to derive +2.5 V (0.9 A) from the +3.3 V rail.
• One small linear LDO regulator to derive +1.8 V (0.7 A) from the +3.3 V rail.
An additional 3.3 V service voltage, which is obtained from a duplicated 3.6 V
(VS3.6VA, VS3.6VB) from the backplane, is used for on-board management circuitry:
Remote Inventory (RI) device, status LEDs, DC/DC control, on-board monitoring, and
Goblin_4G Cpld.
Timing sub-system
A programmable Phase Locked Loop (PLL) is used to provide the correct frequency to
the Temap when the module is working in the optional transmux function. In the standard
E1 mapper mode, this PLL is not used.
Control sub-system
Three types of interfaces are used for communication between the MT100 (second-level
controller) modules and the 56PDS1:
• Intra-Shelf Parallel Bus (ISPB)
• Serial Peripheral and Inventory (SPI) bus
• Hardware Configuration (HW_CFG) bus.
The ISPB provides a backplane communication channel between the Second-Level
Controller (SLC) on the MT100 and every transport module in the shelf. Through the
ISPB, the SLC can load configuration settings within the internal registers of the Euclide
ASIC and the Agnesi FPGA, monitor the current status, and collect data for Performance
Monitoring (PM). The ISPB is a synchronous parallel multiplexed bus with 16
addresses/data lines with interrupt and error detection capabilities. The unit selects the
ISPB reference clock under the control of the active SLC.
The SPI bus and Goblin_4G allow the SLC to perform the following tasks:
• Access to/from onboard E2PROM for RI data over the local SPI bus
• Access to/from a dedicated AD converter to collect electric data
• Control card status LEDs
• Program local PLL to generate the frequencies used for the optional transmux
function
• Trim the output voltage of the on-board DC/DC converters.
Through the HW_CFG bus, the SLC can access the HW_CFG bridge function in the
Goblin_4G Cpld. This function is used to grant access to the 64 Mb flash memory device
and to transfer downloaded configuration data from flash memory to Agnesi over the
FPGA's parallel configuration interface. HW_CFG allows remote control of this
download procedure.

28-Port E1 Access (E1UAC)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG25553AAXX 28-Port E1 Access TBD TBD TBD Active
E1UAC (75Ω)

Features and application notes

• Accepts 28 customer E1signals and routes them to the 56-Port E1/DS1 Multiplexer
(E1DS1M)
• Performs protection switching.

Description
The 28-Port E1 Access (E1UAC) collects 28 E1 customer signals and routes them to the
E1DS1M. It also performs protection switching toward the 28-Port E1/DS1 Access
Protection (E1DS1PAC) in the event of port failure.
The E1UAC is a solid-state, etched-circuit module that plugs into the card cage. See the
following figure for an outline of the E1UAC.

Figure C-18 28-Port E1 Access (E1UAC)

Indicators and connectors

The E1UAC has the following connectors (see Figure C-18, “28-Port E1 Access
(E1UAC)” (p. C-57)):

Item Function
Mini 1.0/2.3 coaxial Faceplate connectors provide connection points for customer E1
faceplate connectors cables (28 Rx and 28 Tx).
M1 Backplane connector that provides service voltage A and B
M2 Backplane connector that provides interface for management and
diagnostic monitoring
M3 Backplane connector that provides payload interface
M4 Backplane connector that provides protection interface

Figure C-19 28-Port E1 Access protection scheme

CABLES TO/FROM
EXTERNAL

E1 SWITCH
COMMANDS BUS
TO OTHER WORKING
E1AU

E1UAC
(WORKING) E1DS1PAC
(PROTECT)

RX E1
PROTECTION
BUS

TX E1
PROTECTION
BUS

E1DS1M E1DS1M
(WORKING) (WORKING)

28port-prot

32-Port E1/DS1 Access (E1DS1BAC)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG25556AAXX 32-Port E1/DS1 TBD TBD TBD Active
E1DS1BAC Access (100/120Ω)

8DG2672AAXX 32-Port DS1 Access NGI7ADGMAA 145188 070DXT Active

32XDS1AC

Important! The 8DG02672AAXX 32XDS1AC card (SCSI connector interface) will

be discontinued and replaced by the 8DG25556AAXX E1DS1BAC (D-sub connector
interface).

Features and application notes

• Accepts 32 customer E1 s and routes them to the 56-Port E1/DS1 Multiplexer
(E1DS1M)
• Performs protection switching.

Description
The 32XDS1AC collects 32 DS1 channels and routes them to the E1DS1M. It also
performs protection switching toward the 32-Port DS1 Access Protection (DS1PRAC) in
the event of port failure.
The E1DS1BAC collects 32 E1/DS1 channels and routes them to the E1DS1M. It also
performs protection switching toward the 32-Port E1/DS1 Access Protection
(E1DS1PAC) in the event of port failure.
The E1DS1BAC is a solid-state, etched-circuit module that plugs into the card cage. See
the following figure for an outline of the E1DS1BAC.

Figure C-20 32-Port E1/DS1 Access (E1DS1BAC)

TX
RX
DS1
850-0056-1
060206

Indicators and connectors

The E1DS1BAC has the following connectors (see Figure C-20, “32-Port E1/DS1 Access
(E1DS1BAC)” (p. C-62)):

Item Function
TX Transmit connector for 32 outgoing customer E1 s
RX Receive connector for 32 incoming customer E1 s
M1 Backplane connector that provides service voltage A and B
M2 Backplane connector that provides interface for management and
diagnostic monitoring

Item Function
M3 Backplane connector that provides payload interface
M4 Backplane connector that provides protection interface

Functional operation
The E1DS1BAC is composed of the following functional blocks:
• Spider ASIC
• DC/DC converters
• 32 RX switches between working and protect ports
• 32 TX switches between working and protect ports
• Voltage presence and temperature sensor
• Remote inventory E2PROM.
Protection scheme
Each E1DS1BAC receives its own switch command from the E1DS1PAC through the
backplane. Based on this command, the RX and TX interfaces are connected to the
working E1DS1M or through the E1DS1PAC to the protect E1DS1M. This is the same
protection scheme as for the E1UAC, see Figure C-19, “28-Port E1 Access protection
scheme” (p. C-59).
Power sub-system
Distributed power supply architecture on the E1DS1BAC consists of an input power stage
and a set of compact DC/DC converters. The input power stage provides circuitry for the
following:
• Fuse protection on both 3.6 V service power supplies
• Perform OR-ing of the 3.6 V service power supply
• Control the in-rush current at the start up.
Different DC/DC converters provide circuitry to generate the following voltages from the
service 3.6 V voltage.
• DC/DC converter step-up to generate +5 V power supply
• Inverting switched capacitor to generate -5 V power supply
• DC/DC converter step-up to generate +12 V power supply.
All three of these power supplies are protected by similar voltages generated by the
E1DS1PAC.

32-Port E1/DS1 Access Protection (E1DS1PAC)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG25562AAXX 32-Port E1/DS1 TBD TBD TBD Active
E1DS1PAC Access Protection

8DG02674AAXX 32-Port DS1 Access NGI7ADHMAA 145189 070DXU Active

DS1PRAC Protection

Important! The 8DG02874AAX DS1PRAC card (SCSI connector interface) will be

discontinued and replaced by the 8DG25562AAXX E1DS1PAC (D-sub connector
interface).

Features and application notes

• DS1PRAC card generates/controls the switch commands for all 32-Port DS1 Access
(32XDS1AC) modules in its protection group
• E1DS1PAC card generates/controls the switch commands for all 32-Port E1/DS1
Access (E1DS1BAC) modules in its protection group

Description
The E1DS1PAC is a solid-state, etched-circuit module that plugs into the card cage. See
Figure C-21, “32-Port E1/DS1 Access Protection (E1DS1PAC)” (p. C-65) for an outline
of the E1DS1PAC.

Figure C-21 32-Port E1/DS1 Access Protection (E1DS1PAC)

DS1

850-0060-1
060606

Item Function
M1 Backplane connector that provides service voltage A and B
M2 Backplane connector that provides interface for management and
diagnostic monitoring
M3 Backplane connector that provides payload interface

Functional operation
The E1DS1PAC is composed of the following functional blocks:
• Spider ASIC
• DC/DC converters
• 32 bridge links between backplane E1/DS1 protection bus and the DS1 link to the
E1DS1M used as a protection port
• Control circuits to generate the seven separate switch commands for each E1DS1BAC
• Voltage presence and temperature sensor
• Remote inventory E2PROM.
Protection scheme
The E1DS1PAC generates seven different and independent hardware switch commands.
Each one of these commands is connected to a different E1DS1BAC. The switch
commands are used to force one of the seven E1DS1BAC modules to switch its traffic to
the E1DS1PAC by means of a backplane E1/DS1 protection bus. The E1DS1PAC then
connects the E1/DS1 protection bus to a protect E1DS1M.
The seven switch commands are generated by the Spider ASIC after a command over the
SPI bus from the MT100/MT100C. Only one switch command can be generated at a time
for 1:7 protection. This is the same protection scheme as for the E1UAC, see Figure C-19,
“28-Port E1 Access protection scheme” (p. C-59)
Power sub-system
Distributed power supply architecture on the E1DS1PAC consists of an input power stage
and a set of compact DC/DC converters. The input power stage provides circuitry for the
following:
• Fuse protection on both 3.6 V service power supplies
• Perform OR-ing of the 3.6 V service power supply
• Control the in-rush current at the start up.

32-Port E1 Access (E1UAC and E1DS1PAC)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG25556ABXX 32-Port E1/DS1 TBD TBD TBD Active
E1UAC 110/120 Access (110/120 Ω)
OHM
8DG25553ABXX 32-Port E1/DS1 TBD TBD TBD Active
E1DS1PAC 75 Access (75Ω)
OHM

Description
The 32-Port E1/DS1 Access (32E1UAC) collects 32 E1 customer signals and routes them
to the E1DS1M. It also performs protection switching toward the 63-Port E1/DS1 Access
Protection (63E1DS1PAC) in the event of port failure.
The 32E1UAC is a solid-state, etched-circuit module that plugs into the card cage. See
the following figure for an outline of the 32E1UAC.

Figure C-22 32-Port E1 Access (32E1UAC)

Item Function
Mini 1.0/2.3 coaxial Faceplate connectors provide connection points for customer E1
faceplate connectors cables (32 Rx and 32 Tx).
M1 Backplane connector that provides service voltage A and B
M2 Backplane connector that provides interface for management and
diagnostic monitoring
M3 Backplane connector that provides payload interface
M4 Backplane connector that provides protection interface

Functional operation
The E1UAC is composed of the following functional blocks:
• Spider ASIC
• DC/DC converters
• 28 RX switches between working and protect ports
• 28 TX switches between working and protect ports
• Voltage presence and temperature sensor
• Remote inventory E2PROM.
Protection scheme
Each E1UAC receives its own switch command from the E1DS1PAC through the
backplane. Based on this command, the RX and TX interfaces are connected to the
working E1DS1M or through the E1DS1PAC to the protect E1DS1M. See Figure C-19,
“28-Port E1 Access protection scheme” (p. C-59) for the protection scheme.

Figure C-23 28-Port E1 Access protection scheme

CABLES TO/FROM
EXTERNAL

E1 SWITCH
COMMANDS BUS
TO OTHER WORKING
E1AU

E1UAC
(WORKING) E1DS1PAC
(PROTECT)

RX E1
PROTECTION
BUS

TX E1
PROTECTION
BUS

E1DS1M E1DS1M
(WORKING) (WORKING)

28port-prot

24-Port E3/DS3/EC1 Multiplexer + TMUX (E3DS3TM)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG02640AAXX 24-Port NGI7ADCMAA 145180 070DXJ Active
E3DS3TM E3/DS3/EC1
Multiplexer +
TMUX

Features and application notes

• Functions as both a ported and a portless DS3 trans-multiplexer
• Provides clear-channel E3/DS3/STS-1
• Provides DS1-level Performance Monitoring (PM)
• Provides E3/DS3/EC1 and DS1 path NE PM and NE/FE conditions
• Operates in a 1:N protection mode for E3/DS3/EC1 with N = 1 to 3
• Provides VT and STS-1 path termination functions, including insertion of DS1 AIS
downstream, and generation RDI-V upstream
• Supports the generation of framed and unframed QRS DS1 signal toward the
customer interface
• Supports Super Frame (D4) and Extended Super Frame (ESF) DS1 Frame formats per
T1.107
• Supports STS-1 or VT1.5 mapped EC1 interfaces
• Supports DS1 loopbacks that allow DS1 channels to be looped back either toward the
E3/DS3/EC1 or VT1.5 signal

Description
The 24-Port E3/DS3/EC1 Multiplexer + TMUX (E3DS3TM) can serve in a ported or
portless mode. In the ported mode, the E3DS3TM accepts customer DS3/EC1 signals
from the 12-Port DS3/EC1 Access (12XDS3AC), provides direct mapping of DS3/EC1
into STS-1, provides DS1 (carried over DS3) PM listening mode, and clear channel DS3.
In the portless mode, the E3DS3TM converts STS-1 signals carrying DS3 into STS-1s
carrying DS1 mapped over VT1.5s.
Note: DS1 to VT mapping is restricted to Floating VT asynchronous per GR253
section 3.4.1.2.
The E3DS3TM is a solid-state, etched-circuit module that plugs into the card cage. See
Figure C-24, “24-Port E3/DS3/EC1 Multiplexer + TMUX (E3DS3TM)” (p. C-73) for an
outline of the E3DS3TM.

Figure C-24 24-Port E3/DS3/EC1 Multiplexer + TMUX (E3DS3TM)

STATUS
EPS
DS3

TMUX

850-0036-1
060106

Indicators and connectors

The E3DS3TM has the following indicators and connectors (see Figure C-24, “24-Port
E3/DS3/EC1 Multiplexer + TMUX (E3DS3TM)” (p. C-73)):

....................................................................................................................................................................................................................................
Power sub-system
Distributed power supply architecture on the E3DS3TM consists of an input power stage
and a set of compact DC/DC converters. The input power stage provides circuitry for the
following:
• Monitor the presence of the battery A/B voltages after the input fuses
• Perform OR-ing of the batteries
• Perform over-voltage and under-voltage protection of 48 V power bus
• Control the in-rush current at the start up
• Perform EMI filtering
• Provide hold-up capabilities to tolerate 48 V micro-interruptions.
The main module power supply voltages are generated as follows:
• Two isolated DC/DC converters derive +3.3 V and +1.2 V operating voltages from the
48 V backplane bus.
• Two small non-isolated step downs obtain +1.2 V from the +3.3 V rail.
• One small linear LDO regulator to derive +1.5 V (1 A) from the +3.3 V rail.
• One small linear LDO regulator to derive +2.5 V (2 A) from the +3.3 V rail.
An additional 3.3 V service voltage, which is obtained from a duplicated 3.6 V (V3A,
V3B) from the backplane, is used for on-board management circuitry: Remote Inventory
(RI) device, status LEDs, and Goblin_4G Cpld.
Timing sub-system
A programmable Phase Locked Loop (PLL) is used to provide the correct frequency to
Temaps and LIUs when the module is working in DS3 mode. This PLL locks to the 38.88
MHz frequency from the CRU and outputs 3 × 44.736 MHz (DS3 rate) for 134.208 MHz
in DS3 mode.
Control sub-system
Three types of interfaces are used for communication between the MT100 (second-level
controller) modules and the E3DS3TM:
• Intra-Shelf Parallel Bus (ISPB)
• Serial Peripheral and Inventory (SPI) bus
• Hardware Configuration (HW_CFG) bus.
The ISPB provides a backplane communication channel between the Second-Level
Controller (SLC) on the MT100/MT100C and every transport module in the shelf.
Through the ISPB, the SLC can load configuration settings within the internal registers of
the Euclide ASIC and the Abel FPGA, monitor the current status, and collect data for
Performance Monitoring (PM). The ISPB is a synchronous parallel multiplexed bus with
16 addresses/data lines with interrupt and error detection capabilities. The unit selects the
ISPB reference clock under the control of the active SLC.
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C C-75
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets 24-Port E3/DS3/EC1 Multiplexer + TMUX (E3DS3TM)

12-Port E3 Access (12XE3A)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG25559AAXX 12-Port E3 Access TBD TBD TBD Active
12XE3A

Description
The 12-Port E3 Access (12XE3A) collects 12 E3 signals and routes them to the
E3DS3TM. It also performs protection switching toward the 12-Port E3/DS3/EC1 Access
Protection (E3DS3PAC) card if a port failure occurs.
The 12XE3A is a solid-state, etched-circuit module that plugs into the card cage. See
Figure C-25, “12-Port E3 Access (12XE3A)” (p. C-77) for an outline of the 12XDS3AC.

Figure C-25 12-Port E3 Access (12XE3A)

RX-1

TX-1
RX-12

TX-12
DS3

850-0044-1
060206

Item Function
RX-1 through RX-12 Mini BNC connectors for E3 input.
TX-1 through TX-12 Mini BNC connectors for E3 output.
M1 Backplane connector that provides service voltage A and B.
M2 Backplane connector that provides interface for management and
diagnostic monitoring.
M3 Backplane connector that provides payload interface.
M4 Backplane connector that provides protection interface.

For connecting and disconnecting the Mini BNC connectors to the high density interface
layout a special extraction and insertion tool is required: The mini BNC removal tool
8DG03061AAXX, refer to the Alcatel-Lucent 1850 Transport Service Switch (TSS-100
and TSS-100C) Release 4.1 (ETSI) Installation and System Turn-Up Guide (ANSI).

Functional operation
The 12XE3A is composed of the following functional blocks:
• Spider ASIC for SPI control
• 7 × 8 channel DS3/STS-1 1:1 transformer
• 6 × 2 channel relay
• 24 × mini BNC
• Temperature sensor
• Remote inventory E2PROM
Power sub-system
The service voltage at 3.3 V, which is obtained from a duplicated 3.6 V voltage (3V6S_A,
3V6S_B) from the backplane, is used for the following on-board management circuitry:
• Spider ASIC
• Remote Inventory (RI) device
• On-board monitoring

6-Port DS3 Access (6XDS3AC)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG25836AAXX 6-Port DS3Access TBD TBD TBD Active
6XDS3AC

Features and application notes

• Accepts 6 customer DS3 signals and routes them to the 12-Port DS3/EC1 Access
(12XDS3AC).
• Performs protection switching

Description
The 6-Port DS3 Access (6DS3AC) collects 6 DS3 signals and routes them to the
12XDS3AC. It also performs protection switching toward the 12-Port E3/DS3/EC1
Access Protection (DS3PRAC) card in the event of port failure.
The 6XDS3AC is a solid-state, etched-circuit module that plugs into the card cage. See
Figure C-26, “6-Port DS3 Access (6XDS3AC)” (p. C-80) for an outline of the
6XDS3AC.

Figure C-26 6-Port DS3 Access (6XDS3AC)

RX-1

TX-1
RX-6

TX-6
DS3
850-0044-1
060206

Indicators and connectors

The 6XDS3AC has the following connectors (see Figure C-26, “6-Port DS3 Access
(6XDS3AC)” (p. C-80)):

Item Function
RX-1 through RX-6 Mini BNC connectors for DSinput.
TX-1 through TX-6 Mini BNC connectors for DS3 output.
M1 Backplane connector that provides service voltage A and B.
M2 Backplane connector that provides interface for management and
diagnostic monitoring.

Item Function
M3 Backplane connector that provides payload interface.
M4 Backplane connector that provides protection interface.

Functional operation
The 6XDS3AC is composed of the following functional blocks (see Figure C-27, “6-Port
DS3 Access (6XDS3AC) functional overview” (p. C-81)):
• Spider ASIC for SPI control
• 7 × 8 channel DS3/STS-1 1:1 transformer
• 3 × 2 channel relay
• 12 × mini BNC
• Temperature sensor
• Remote inventory E2PROM

Figure C-27 6-Port DS3 Access (6XDS3AC) functional overview

TO 12XDS3AC

6XDS3AC

TX BNC RELAY

TO Ds3

RX BNC SPLITTER

6ds3block

Power sub-system
The service voltage at 3.3 V, which is obtained from a duplicated 3.6 V voltage (3V6S_A,
3V6S_B) from the backplane, is used for the following on-board management circuitry:
• Spider ASIC
• Remote Inventory (RI) device
• On-board monitoring
Control sub-system
A Serial Peripheral and Inventory (SPI) bus is used for communication between the
MT100 (second-level controller) modules and the 6XDS3AC. The SPI bus and Spider
ASIC allow the SLC to perform the following tasks:
• Access to/from onboard E2PROM for RI data over the local SPI bus
• Access to the temperature sensor over the local SPI bus

12-Port E3/DS3/EC1 Access Protection (E3DS3PAC)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG02649AAXX 12-Port NGI7ADEMAA 145182 070DXL Active
E3DS3PAC E3/DS3/EC1
Access Protection

Features and application notes

• Collects 36 DS3/EC1 signals from the three 12-Port DS3/EC1 Access (12XDS3AC)
cards and routes them to the 24-Port E3/DS3/EC1 Multiplexer + TMUX (E3DS3TM)
• Performs protection switching

Description
The 12-Port E3/DS3/EC1 Access Protection (E3DS3PAC) card collects 36 DS3/EC1
signals from three 12XDS3AC modules and routes them to the E3DS3TM to support
protection switching in the event of port failure.
The E3DS3PAC is a solid-state, etched-circuit module that plugs into the card cage. See
Figure C-28, “12-Port E3/DS3/EC1 Access Protection (E3DS3PAC)” (p. C-83) for an
outline of the E3DS3PAC.

Figure C-28 12-Port E3/DS3/EC1 Access Protection (E3DS3PAC)

Indicators and connectors

The E3DS3PAC has the following connectors (see Figure C-28, “12-Port E3/DS3/EC1
Access Protection (E3DS3PAC)” (p. C-83)):

Item Function
M1 Backplane connector that provides service voltage A and B.
M2 Backplane connector that provides interface for management and
diagnostic monitoring.
M3 Backplane connector that provides payload interface.
M4 Backplane connector that provides protection interface.

Figure C-29 12-Port E3/DS3/EC1 Access Protection (E3DS3PAC) card protection

scheme
DS3Psw_SA#[1:3]

DS3 DS3P_A DATA BUS

ACCESS
ACCESS [1]

ACCESS [3]
ACCESS [2]

PROTECTION DS3P_B DATA BUS

DS3P_C DATA BUS

DS3 Test

580-0049-1
060206

Figure C-30 12-Port E3/DS3/EC1 Access Protection (E3DS3PAC) control sub-system

LOCAL SPI
E2PROM

A
SPIDER
B

TEMPERATURE
SENSOR

850-0047

Combo PDH card (ASYMRTM)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG25821AAXX Combo PDH Board TBD TBD TBD Active
ASYMRTM

Features and application notes

• Accepts 32 customer E1 s and routes them to the 56-Port E1/DS1 Multiplexer
(56DS1M)
• Accepts 6 customer E3 s and routes them to the 12-Port E3 (12XE3AC) or 12-Port
DS3 (12XDS3ASC)
• Performs protection switching, but operates with 1:3 protection. Only one EQPS
protection group shall be available on the system.

Description
The ASYMRTM collects 32 E1 and 6 E3 channels and routes them to the 56DS1M or
12XDS3ASC. It also performs protection switching in the event of port failure.

Indicators and connectors

The Combo PDH card has the following connectors.

Item Function
TX Transmit connector for 32 outgoing customer E1 s
RX Receive connector for 32 incoming customer E1 s
TX Transmit connector for 6 outgoing customer E3 s
RX Receive connector for 6 incoming customer E3 s
M1 Backplane connector that provides service voltage A and B
M2 Backplane connector that provides interface for management and
diagnostic monitoring
M3 Backplane connector that provides payload interface
M4 Backplane connector that provides protection interface

Functional operation
The ASYMRTM is composed of the following functional blocks:
• Spider ASIC
• DC/DC converters
• 32 RX switches between working and protect ports
• 32 TX switches between working and protect ports
• 6 RX switches between working and protect ports
• 6 TX switches between working and protect ports

....................................................................................................................................................................................................................................
• Voltage presence and temperature sensor
• Remote inventory E2PROM.
Protection scheme
Each ASYMRTM receives its own switch command from the ASYMRTM through the
backplane. Based on this command, the RX and TX interfaces are connected to the
working ASYMRTM or to the protect ASYMRTM..
Power sub-system
Distributed power supply architecture on the ASYMRTM consists of an input power stage
and a set of compact DC/DC converters. The input power stage provides circuitry for the
following:
• Fuse protection on both 3.6 V service power supplies
• Perform OR-ing of the 3.6 V service power supply
• Control the in-rush current at the start up.
Different DC/DC converters provide circuitry to generate the following voltages from the
service 3.6 V voltage.
• DC/DC converter step-up to generate +5 V power supply
• Inverting switched capacitor to generate -5 V power supply
• DC/DC converter step-up to generate +12 V power supply.
All three of these power supplies are protected by similar voltages generated by the
E1DS1PAC.
The service voltage at 3.3 V, which is obtained from a duplicated 3.6 V voltage from the
backplane, is used for the following on-board management circuitry:
• Spider ASIC
• Remote Inventory (RI) device
• On-board monitoring.
Control sub-system
A Serial Peripheral and Inventory (SPI) bus is used for communication between the
MT100/MT100C (second-level controller) modules and the ASYMRTM. The SPI bus
and Spider ASIC allow the SLC to perform the following tasks:
• Access to/from onboard E2PROM for RI data over the local SPI bus
• Access to the temperature sensor over the local SPI bus.
Self-Diagnosis sub-system
The following environmental and electric parameter monitoring capabilities are available
for the ASYMRTM:
• Monitoring of the presence of the three power supply lines generated on the module
• Monitoring of the module temperature through local sensing.
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C C-87
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets 16x-Port STM-1 electrical access (16XSEA)

16x-Port STM-1 electrical access (16XSEA)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG25935AAXX 16-port STM-1 TBD TBD TBD Active
16XSEA electrical access

Features and application notes

• Accepts 16 STM-1e electrical signals via the 16 1.0/2.3 female coax connectors
• 16XSEA can be installed in
– slot 4 of the Front Access shelf
– slot 10 of the Compact shelf

Description
The 16XSEA supports 16 STM-1e signals. It also performs protection switching toward
the 16-Port STM-1e Access Protection (SEPAC) card in the event of port failure.

Indicators and connectors

The 16XSEA has the following connectors.

Item Function
TX 1-16 Transmit - 1.0/2.3 female coax connectors
RX 1-16 Receive - 1.0/2.3 female coax connectors
M1 Backplane connector that provides service voltage A and B
M2 Backplane connector that provides interface for management and
diagnostic monitoring
M3 Backplane connector that provides payload interface
M4 Backplane connector that provides protection interface

Functional operation
The 16XSEA is composed of the following functional blocks:
• DC/DC converters
• Voltage presence and temperature sensor
• Remote inventory E2PROM.

16x-Port STM-1 protection access (SEPAC)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG25929AAXX 16-port STM-1 TBD TBD TBD Active
SEPAC protection access

Features and application notes

• The SEPAC provides protection for up to 16 STM-1e channels from a 16XSEA
• SEPAC can be installed in
– slot 4 of the Front Access shelf
– slot 10 of the Compact shelf

Description
The SEPAC supports 16 STM-1e signals. It performs protection switching from the
16-Port STM-1e Access Protection (16XSEA) card in the event of port failure.

Indicators and connectors

The SEPAC has the following connectors.

Functional operation
The SEPAC is composed of the following functional blocks:
• DC/DC converters
• Voltage presence and temperature sensor
• Remote inventory E2PROM.

8-Port STM-1/OC-3/STM-4/OC-12 (8PSO -8×155/622M sync

optical/8XSOA)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
8DG25932AA 8-Port STM-1/OC-3 NGI7ADBMAA 144377 070DSD Active
8PSO / STM-4/OC-12
(8×155/622M Sync
Optical)
TBD 8-Port STM-1/OC-3 TBD TBD TBD Active
8XSOA / STM-4/OC-12

Features and application notes

This release supports SDH framing. So the 8PSO/8XSOA:
• Provides eight slots, each for one STM-1 or STM-4 SFPs
• Contains circuitry for management, configuration, and control of on-board devices
through backplane SPI, ISPB, and hardware and configuration buses.
• 8PSO/8XSOA can be installed in
– slot 4 and 27 of the Front Access shelf
– slot 10 and 22 of the Compact shelf

Description
The 8-port (8PSO/8XSOA) processes signals from up to eight STM-1 or STM-4 SFP
plug-ins. The 8PSO/8XSOA provides eight slots, each of which hosts an STM-1 or
STM-4 Small Form Factor Plug-in (SFP) optical module. The STM-1 SFP module is
available with three different interfaces, and the STM-4 SFP module is available with
three different interfaces. The 8PSO/8XSOA can host any of these interfaces. The
following STM-1 and STM-4 SFPs are available:
• STM-1 SFP (Intermediate Reach, 1310 nm, DDM) (SS-11), (“STM-1/OC-3 SFPs ”
(p. C-156))
• STM-1 SFP (Long Reach, 1310 nm, DDM) (SL-11), (“STM-1/OC-3 SFPs ”
(p. C-156))
• STM-1 SFP (Long Reach, 1550 nm, DDM) (SL-12), (“STM-1/OC-3 SFPs ”
(p. C-156))
• STM-4 SFP (Intermediate Reach, 1310 nm, DDM) (SS-41), (“STM-4/OC-12 SFPs ”
(p. C-160))

Figure C-31 8-Port STM-1 /STM-4 (8PSO/8XSOA)

Refer to “Equipping rules” (p. C-106) for examples.

Item Function
M2 20-position right-angle connector that connects to an SFP and
provides an electrical interface, 2-wire (I2C) interface for
management and diagnostic monitoring, Laser_off, LOS, and
power supply voltages
M3 20-position right-angle connector that connects to an SFP and
provides an electrical interface, 2-wire (I2C) interface for
management and diagnostic monitoring, Laser_off, LOS, and
power supply voltages
M4 20-position right-angle connector that connects to an SFP and
provides an electrical interface, 2-wire (I2C) interface for
management and diagnostic monitoring, Laser_off, LOS, and
power supply voltages
M5 20-position right-angle connector that connects to an SFP and
provides an electrical interface, 2-wire (I2C) interface for
management and diagnostic monitoring, Laser_off, LOS, and
power supply voltages
M6 20-position right-angle connector that connects to an SFP and
provides an electrical interface, 2-wire (I2C) interface for
management and diagnostic monitoring, Laser_off, LOS, and
power supply voltages
M7 20-position right-angle connector that connects to an SFP and
provides an electrical interface, 2-wire (I2C) interface for
management and diagnostic monitoring, Laser_off, LOS, and
power supply voltages
M8 20-position right-angle connector that connects to an SFP and
provides an electrical interface, 2-wire (I2C) interface for
management and diagnostic monitoring, Laser_off, LOS, and
power supply voltages
M9 20-position right-angle connector that connects to an SFP and
provides an electrical interface, 2-wire (I2C) interface for
management and diagnostic monitoring, Laser_off, LOS, and
power supply voltages
M10 Backplane connector that provides service and battery power
supply interfaces and all low frequency and control interfaces
M15 Backplane connector that provides payload interfaces

Item Function
LED Multicolor LED serves as a visual module status indicator (card
failure, in-service, updating, etc.)

Functional operation
The 8PSO is composed of the following main components:
• Up to eight SFP modules (independent plug-in items)
• Euclide ASIC
• Fermat FPGA
• Two GTLP bidirectional translators for ISPB control bus
• GTLP bidirectional translator for HW_CFG bus
• Goblin_4G Cpld for SPI control bus
• Kyra Cpld for SPI/I2C bridge
• QDR-II SRAM
• Flash memory for Fermat FPGA code
Signal flow from optical line to matrix
The receiver on each SFP performs conversion from an optical STM-1 or STM-4 to an
equivalent electrical signal using differential signaling. The incoming serial data signal is
passed to the Euclide ASIC.
The Euclide ASIC performs the following:
• Performs 3R regeneration
• Recovers frame alignment
• Detects OOF events
• De-scrambles incoming signal
• Performs B1/B2 calculation
• Performs frequency offset adaptation
The data is then passed to the Fermat FPGA where performance monitoring, pointer
processing and justification, and path overhead processing occur.
The Euclide ASIC receives the data again and performs the following before sending the
data through the backplane:
• Backplane framing
• FEC redundancy calculation and insertion
• Scrambling
• Automatic protection switching signal processing

....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C C-95
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets 8-Port STM-1/OC-3/STM-4/OC-12 (8PSO -8×155/622M sync
optical/8XSOA)
....................................................................................................................................................................................................................................
Signal flow from matrix to optical line
The Euclide ASIC receives the data through the backplane and performs the following:
• Backplane alignment
• De-scrambling
• FEC decoding
• Label extraction
• Selection between links from matrix copy 0 and matrix copy 1 for automatic
protection switching
• Overhead and protection channel extraction
• Adaptation from backplane rate to SDH rate
The data is then passed to the Fermat FPGA for path overhead handling, pointer
generation and processing, and performance monitoring.
The Euclide ASIC receives the data again for B1/B2 insertion, scrambling, and frame
alignment word insertion before passing the data to the SFP. The SFP then performs
electrical-to-optical conversion to output an STM-1 or STM-4 signal.
Loopback
For test and maintenance purposes, line-side and equipment-side loopback is supported
on the Fermat FPGA. In both line-side and equipment-side loopbacks, the loop and
continue mode and the loop and send AIS mode are supported.
Power sub-system
Distributed power supply architecture on the 8PSO consists of an input power stage and a
set of compact DC/DC converters. The input power stage provides circuitry for the
following:
• Monitor the presence of the battery A/B voltages after the input fuses
• Perform OR-ing of the batteries
• Perform over-voltage and under-voltage protection of 48 V power bus
• Control the in-rush current at the start up
• Perform EMI filtering
The main module power supply voltages are generated as follows:
• Two isolated DC/DC converters derive +3.3 V and +1.2 V operating voltages from the
48 V backplane bus.
• Two small non-isolated step downs obtain +2.5 V and +1.8 V from the +3.3 V.
An additional 3.3 VS service voltage, which is obtained from a duplicated 3.6 V (V3A,
V3B) from the backplane, is used for on-board SPI circuitry: Remote Inventory (RI)
device, status LEDs, Goblin_4G Cpld, and Kyra Cpld.

....................................................................................................................................................................................................................................
C-96 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets 8-Port STM-1/OC-3/STM-4/OC-12 (8PSO -8×155/622M sync
optical/8XSOA)
....................................................................................................................................................................................................................................
Timing sub-system
Clock management is accomplished by the Euclide ASIC, which performs the following
tasks:
• Synchronization to equipment clock reference T0, selecting between two clocks at
38.88 MHz from the MT100 modules
• Feeding of the selected T0 clock and related synchronism towards Fermat
• Phase comparison to lock the on-board local 622.08 MHz VCXO to the selected T0
timing reference
• Phase comparison to derive the timing reference at 777.6 MHz for the backplane links
• Feeding of E1 timing reference derived by the received optical line signal towards the
equipment clocks
The Fermat FPGA has the following synchronization structure:
• Timing signal at 77.76 MHz, from the Euclide ASIC and related to the overhead
channels, is used as core logic reference.
• Clock signals at 311.04 MHz, from the Euclide ASIC and related to SERDES Framer
Interface-like interfaces (operating in DDR mode), are used to synchronize both input
and output SFI-like sides.
• T0 timing signals coming from equipment clocks are used as reference on DCC
channels.
Control sub-system
Three types of interfaces are used for communication between the MT100 (second-level
controller) modules and the 8PSO:
• Intra-Shelf Parallel Bus (ISPB)
• Serial Peripheral and Inventory (SPI) bus
• Hardware Configuration (HW_CFG) bus
The ISPB provides a backplane communication channel between the Second-Level
Controller (SLC) on the MT100 and every transport module in the shelf. Through the
ISPB, the SLC can load configuration settings within the internal registers of the Euclide
ASIC and the Fermat FPGA, monitor the current status, and collect data for Performance
Monitoring (PM). The ISPB is a synchronous parallel multiplexed bus with 16
addresses/data lines with interrupt and error detection capabilities.
The SPI bus and Goblin_4G allow the SLC to perform the following tasks:
• Gathering of module power supply failure alarms
• Gathering of optical LOS alarms
• Detection of SFP presence
• Access to/from onboard EEPROM for RI data over the local SPI bus
• Access to/from a dedicated AD converter to collect electric data

4-Port STM-16/OC-48 (4P2G5SO)(4×2.5G sync optical)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
3AL92112AA 4-Port NGI7ADAMAA 144376 070DRY Active
4P2G5SO STM-16/OC-48
(4×2.5G Sync
Optical)

Features and application notes

This release supports SDH framing. So the 4P2G5SO:
• Provides four slots, each for one STM-16 SFP
• Contains circuitry for management, configuration, and control of on-board devices
through backplane SPI, ISPB, and hardware and configuration buses

Figure C-32 4-Port STM-16/OC-48 (4P2G5SO)

Functional operation
The 4P2G5SO is composed of the following main components:
• Up to four SFP modules (independent plug-in items)
• Four Clock and Data Recovery (CDR) devices
• Four SERDES devices
• Euclide ASIC
• Fermat FPGA
• Two GTLP bidirectional translators for ISPB control bus
• GTLP bidirectional translator for HW_CFG bus
• Goblin_4G Cpld for SPI control bus
• Kyra Cpld for SPI/I2C bridge
....................................................................................................................................................................................................................................
C-100 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets 4-Port STM-16/OC-48 (4P2G5SO)(4×2.5G sync optical)

8-port STM-1/STM-4/4-port STM-16 Multirate Synch (MRSOE)

General description
The MRSOE unit (8DG25938AA) provides:
• Bi-directional processing of
– up to eight SFP-based STM-1 or STM-4 signals
– up to four SFP-based STM-16 signals.
• Regenerator and multiplex section transport overhead insertion/extraction
• Payload assembly/disassembly at VC4 level
• DCC access and Auxiliary OverHead Channels insertion/extraction
• Loopback testing capability.
• MRSOE can be installed in
– slot 4 and 27 of the Front Access shelf
– slot 10 and 22 of the Compact shelf
Mixed configurations are allowed.
The traffic configuration cannot exceed the maximum backplane throughput per port of
10Gbps.
From an intra-equipment functional viewpoint, this unit assembly carries out its tasks by
working in conjunction with other equipment parts such as:
• Matrix subsystem (two Matrix cards) for payload exchange
• Synchronization subsystem (SETS functions) for reference timings
• Second Level Controller (SLC) for provisioning and alarm management
• EC100/EC100C cards for DCC termination.
• The unit provides Optical Safety support by means of an Automatic Laser Shutdown
(ALS) procedure (refer to ITU-T G.664).

Physical description
MRSOE is a half slot unit consisting of a Front Panel and a Printed-Circuit Board
assembly. The Front Panel includes:
• Eight embedded slots for optical line access via SFP optical transceivers
• A Multicolour LED as visual card status indicator (card failure, in-service,
updating,...)
The printed circuit board assembly houses:
• SDH , synchronization and control circuitries
• DC/DC converters
SFPs
All the physical interfaces are external SFP pluggable modules.
The unit performs an optical to electrical conversion; it is provided with an electrical
backpanel interface and 8 optical interfaces towards the client/line.
The Electrical interface is a bidirectional back panel interface at 12.4 Gbps. It is
cross-connected via Matrix to the electrical interface of any other TDM unit (8PSO,
1P10GSO, 4P25GSO, etc.), to launch the traffic to the client/line.
Each bidirectional Optical interface provides the connection to the client/line via external
SFP modules. Each unit can host up to 8 SFPs.
SFPs are optical transceivers enabling the building of a unit with a client-oriented User
Interface. The optical receiver performs an optical-to-electrical conversion and viceversa
the optical transmitter.
The following SFP modules (and the related interfaces) are supported:
• SS-11 (S-1.1 / IR-1 STM-1), SL-11 (L-1.1 / LR-1 STM-1) and SL-12 (L-1.2 / LR-2
STM-1 are TM-1 B&W monodir SFPs
• SS-41 (S-4.1 / IR-1 STM-4), SL-41 (L-4.1 / LR-1 STM-4) and SL-42 (L-4.2 / LR-2
STM-4) are STM-4 B&W monodir SFPs
• SI-161 (I-16.1 / SR-1 STM-16), SS-161 (S-16.1 / IR-1 STM-16), SL-161 (-16.1 /
LR-1) and SL-162 (L-16.2 / LR-2 STM-16) are STM–16/OC-48 B&W monodir SFPs
• 100BX-20U, 100BX-20D, 100BX-40U, 100BX-40D are STM-1 B&W bidir SFP
(Upstream and Downstream)
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C C-105
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets 8-port STM-1/STM-4/4-port STM-16 Multirate Synch (MRSOE)

Equipping rules
STM-1, STM-4 SFPs can be equipped in any of the 8 positiosn as long the following
rules do not apply
• STM-16 SFPs can be equipped only in positions 0, 2, 4, 6. In the reduced capacity
slots, only position 4 and 6 can be host an STM-16 SFP.
• STM-16 SFPs cannot be used in the in the Access area of a shelf.
• When an STM-16 SFP is used, the following interface in the same area and the two
corresponding interfaces of the access area cannot be configured.
• When STM-1e interfaces are used, no interface is allowed in the corresponding
Basic/Traffic area of the shelf.
Refer to Figure C-4, “Alcatel-Lucent 1850 TSS-100 Shelf (Front Access)”
(p. C-9) andFigure C-5, “Alcatel-Lucent 1850 TSS-100C Shelf” (p. C-13).
Because of these rules, an attempt to enter a facility that cannot be provisioned is denied.

Figure C-33 MRSOE SFP positions

Blank slots in the following examples indicate that no SFP can be installed in that
position. The two tables that follow illustrate 16 different examples of how an MRSOE
could be equipped: eight in the Access area eight in the corresponding Basic/Traffic area.

Table C-6 Position on card in Access area

Position Example
1 2 3 4 5 6 7 8
0 STM- STM- STM- STM-1e
4/STM-1 4/STM-1 4/STM-1
1 STM- STM- STM- STM-1e
4/STM-1 4/STM-1 4/STM-1
2 STM-4/ STM- STM- STM-1e
STM-1 4/STM-1 4/STM-1
3 STM-4/ STM- STM- STM-1e
STM-1 4/STM-1 4/STM-1
4 STM-4/ STM- STM- STM- STM-1e
STM-1 4/STM-1 4/STM-1 4/STM-1
5 STM-4/ STM- STM- STM- STM-1e
STM-1 4/STM-1 4/STM-1 4/STM-1
6 STM-4/ STM- STM- STM- STM- STM-1e
STM-1 4/STM-1 4/STM-1 4/STM-1 4/STM-1
7 STM-4/ STM- STM- STM- STM- STM-1e
STM-1 4/STM-1 4/STM-1 4/STM-1 4/STM-1

Table C-7 Position on card in Basic/Traffic Area

0 STM-16 STM-16 STM-16 STM-16 STM- STM- STM-

4/STM-1 4/STM-1 4/STM-1
1 STM- STM- STM-
4/STM-1 4/STM-1 4/STM-1
2 STM- STM-16 STM-16 STM-16 STM-16 STM- STM-
4/STM-1 4/STM-1 4/STM-1
3 STM- STM- STM-
4/STM-1 4/STM-1 4/STM-1
4 STM- STM- STM-16 STM-16 STM- STM-16 STM-
4/STM-1 4/STM-1 4/STM-1 4/STM-1
5 STM- STM- STM- STM-
4/STM-1 4/STM-1 4/STM-1 4/STM-1
6 STM- STM- STM- STM-16 STM- STM- STM-16
4/STM-1 4/STM-1 4/STM-1 4/STM-1 4/STM-1
7 STM- STM- STM- STM- STM-
4/STM-1 4/STM-1 4/STM-1 4/STM-1 4/STM-1

Loopbacks
Loopback capabilities are supported for test and maintenance purposes. For each STM-1 ,
STM-4 , STM-16 Channel, the unit provides both "Line" side and "Equipment" side
Loopbacks with
• STS-1c/VC4 granularity for STM-1
• 4xSTS-1c/VC4 granularity for STM-4
• 16xVC4 granularity for STM-16STM-16 .
In both "Line side Loopback" and "Equipment side Loopback", the following operating
modes are supported:
• "Loop and continue"
• "Loop and send AIS".
These Loopbacks are controlled via internal control bus.

Power subsystem description

The Power Supply block consist of a battery conditioning stage and of a large number of
isolated DC/DC, POL and LDOs that are used to generate the various card voltages
required from the device onboard. The ±48VA/B voltages presence after the OR diodes
are monitored for the BATTA/B_FAIL alarms.
....................................................................................................................................................................................................................................
C-108 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets 8-port STM-1/STM-4/4-port STM-16 Multirate Synch (MRSOE)

Timing subsystem description

It mainly performs the Synchronization to reference SDH/ Equipment Clock (SEC) T0
and the selection between two clocks at 38.88 MHz (coming from SLC/CRU cards).

Control subsystem description

It is based on the Internal Control Bus. It performs the following main tasks:
• provides a backplane communication channel between Second Level Controller
(SLC) and every Transport card in the same shelf.
• allows the Second Level Controller to load the proper configuration settings on to the
internal registers, to monitor the current status, and to collect data for performance
monitoring
• gathers Port card power supply failure alarms, and the Optical LOS alarm
• detects SFP optical modules presence
• manages SERDES testing loopbacks (Line and Equipment Loopbacks)
• Centering of SERDES elastic store (to carry out during board activation and after
every loop-back activation/deactivation)
• access to/from onboard EEPROM for Remote Inventory data via local SPI Bus
• FPGA download
• manages the Control card status LED
• Gain access of the SFPs Remote Inventory data (serial ID, digital diagnostics).

1-Port STM-64/OC-192 (1P10GSO) (1×10G sync optical)

Part Number/ Name CLEI ECI/Barcode CPR Status

Mnemonic
3AL92111AA 1-Port NGI7AC9MAA 144375 070DRV Active
8DG26141AAXX STM-64/OC-192
(1×10G Sync
1P10GSO
Optical)

Description
The 1-port OC-192 (1P10GSO) processes one STM-64 XFP/XFP-E plug-in. The
1P10GSO provides one slot that hosts an STM-64 10 Gb Small Form Factor Plug-in
(XFP) or XFP-Extended (XFP-E) optical module. The STM-64 XFP/XFP-E module is
available with different interfaces, and the 1P10GSO can host any of these interfaces. The
following STM-64 XFPs/XFP-Es are available:
• STM-64 XFP (Short Reach, 1310 nm) (XI-641), (“STM-64/OC-192 and 10GbE
XFPs” (p. C-184))
• STM-64 XFP-E (Intermediate Reach, 1550 nm) (XS-642-E), (“STM-64/OC-192 and
10GbE XFPs” (p. C-184))
• STM-64 XFP (Intermediate Reach, 1550 nm) (XS-642), (“STM-64/OC-192 and
10GbE XFPs” (p. C-184))
• STM-64 XFP-E (Long Reach, 1550 nm) (XP1L12D2), (“STM-64/OC-192 XFP-Es”
(p. C-190)).
• DWDM XL-642C XFPs (Long Reach, 100GHz spacing WDM grid).
XFPs require an XFP-E adapter (refer to “XFP-E adapter” (p. C-198)).
The 1P10GSO is a solid-state, etched-circuit module that plugs into the card cage. It is
7.01 inches high, 8.86 inches deep, and 0.90 inches wide. See Figure C-34, “1-Port
STM-64/OC-192 (1P10GSO)” (p. C-111) for an outline of the 1P10GSO.
Two 1P10GSOs are required for 1:1 protection switching.

Figure C-34 1-Port STM-64/OC-192 (1P10GSO)

Indicators and connectors

The 1P10GSO has the following indicators and connectors (see Figure C-34, “1-Port
STM-64/OC-192 (1P10GSO)” (p. C-111)):

Item Function
M1 30-position right-angle connector that connects to an XFP/XFP-E
and provides XFI high-speed electrical interface, 2-wire (I2C)
interface for management and diagnostic monitoring, Laser_off,
LOS, and power supply voltages
M2 30-position right-angle connector used by an XFP-E for power
supply voltage
M4 Backplane connector that provides service and battery power
supply interfaces and all low frequency and control interfaces
M5 Backplane connector that provides payload interfaces
LED Multicolor LED serves as a visual module status indicator (card
failure, in-service, updating, etc.)
Push-button switch Push-button switch for manual laser restart
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C C-111
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets 1-Port STM-64/OC-192 (1P10GSO) (1×10G sync optical)

10G Packet Transport Processor (PP10G)

Part Number/ Name CLEI ECI/Bar Code CPR Status

Mnemonic
8DG08099AAXX 10G Packet NGC5AEWFAA 160329 070NNJ Active
PP10G Transport
Processor
8DG09099AAXX 10G Packet TBD TBD TBD Active
PP10G Transport
Processor

Features and application notes

• Physical Coding Sub-layer (PCS) (Auto-Negotiation)
• Management of 10 Gb data traffic, full duplex
• Packet Processing
• SDH Termination
• Virtual concatenation
• Link Capacity Adjustment Scheme (LCAS) (ITU-T G.7042)
• Packet Encapsulation/De-encapsulation
• Support for Jumbo Packets up to 9 KB in both ingress and egress directions
• Flow control (IEEE 802.3x)
• Transparent layer-2 tunneling
• Layer-2 blocking and filtering
• Layer-2 Protocol peering
• Traffic Management
• Interface to the Agnostic Matrix (10 Gb/s).

Description
The 10G Packet Transport Processor is a Layer 2 data aggregator card capable of
switching incoming data from:
• Two access cards (Packed Expander) equipped with eight SFPs or one XFP
• Traffic coming from matrix unit.
The card is able to perform data mapping, allowing interworking between TDM traffic
and packet-based traffic, and providing data encapsulation. Alcatel-Lucent 1850 TSS-100
can host up to six Packet Processor Units.

Indicators and connectors

The PP10G has the following indicators and connectors:

Connector/Indicator Description
1 EPS Multicolor LED:
• Green—EPS configured; card active
• Amber—EPS configured; card standby
• Amber blink—EPS configured but not available
• Off—EPS not configured
2 Board Status Multicolor LED for Ethernet data traffic and for the
status of the board (ST, EPS)
3 The Reset button (R) performs a warm reboot of LDC (local data
controller), without software and FPGA download. The Data
traffic is preserved during this function.
4–Alcatel-Lucent Four optical 1-GbE SFPs
1850 Transport Service
Switch (TSS-100 and
TSS-100C) Release 4.1
(ETSI) Maintenance and
Trouble-Clearing Guide7
8 RJ45 connector for the PQ2 LAN debugger link

Functional operation
The PP10G is one full slot tall and two slots wide. It is made up of a main board (Mother
Board), corresponding to one slot (left), and a daughter board, corresponding to the
second slot (right), which will also host the Local Data Controller (PQII) as a child card.
The two boards communicate via four high-density connectors and one 6 pins power
connector while the microprocessor card is connected to the daughter card with four
dense signal connectors.
A functional block diagram with indication of main external interfaces is shown in the
following figure.

Figure C-35 Functional block diagram

Configuration A

Up to eight Port 1
8xGE
1000BaseT electrical
Packet Expander
or 1GE(3 types) SFPs

Backplane
10G Packet Processor/
10G Packet Transport
Processor
Port 2 (PP10G)
Up to eight
8xGE
1000BaseT electrical
Packet Expander
or 1GE(3 types) SFPs

4 SFPs (R2.1 and later releases)

Configuration B

Up to eight Port 1
8xGE
1000BaseT electrical
Packet Expander
or 1GE(3 types) SFPs

Backplane
10G Packet Processor/
10G Packet Transport
Processor
Port 2 (PP10G)
One 10GE Gigabit
Ethernet optical XFP 1x10GE
(3 types) Packet Expander

4 SFPs (R2.1 and later releases)

Configuration C

One 10GE Gigabit Port 1

Ethernet optical XFP 1x10GE
(3 types) Packet Expander

Backplane
10G Packet Processor/
10G Packet Transport
Processor
Port 2 (PP10G)
One 10GE Gigabit
1x10GE
Ethernet optical XFP
Packet Expander
(3 types)

4 SFPs (R2.1 and later releases)

pp10g

1xGbE Packet Processor - Half Slot (PP10GHS)

Functional description
The 1x10GE Packet Processor - half slot is a layer 2 data packet processor card capable to
collect and switch packets coming from a 10GE XFP module. Each packet processor unit
can process up to 10Gbps data throughput. See Figure C-36, “PP10GHS - block view”
(p. C-119).

Figure C-36 PP10GHS - block view

Figure C-37 1x10GE Packet processor (PP10GHS)

Indicators and connectors

The PP10GHS has the following indicators and connectors.

Connector/Indicator Description
1 For insertion of XFP module sloping of 600

Connector/Indicator Description
1 RJ45 connector for LAN debug interface
• Green – Active
• Yellow – Duplex mode
1 USB B connector for RS232 debug interface
1 Bi-color LED indicating the unit status and the
EPS
1 Green – link-up detection

24xE/FE Electrical Packet Expander (PE24XFE)

Part Number/ Name CLEI ECI/Barcode Status

Mnemonic

8DG26008AAXX 24xE/FE Electrical NGI8AA5EAA 179101 Active

Packet Expander
PE24XFE

Features and application notes

• 24 independent IEEE 802.3-compliant 10BASE-T and 100BASE-TX
• Auto MDIX crossover capabilities
• IEEE802.3u Auto-Negotiation
• 10Gb/s XAUI bus to Network Processor
• Support for Jumbo Packets up to 9.6 KB in both ingress and egress directions
• Support for IEEE 802.3x Full duplex and Flow Control
• Standard Ethernet MAC
• PCS layer

Description
The PE24XFE card works with PP10G card and supports:
• Synchronous Ethernet function (TX SYNC only)
• 10/100 Mb/s Ethernet ports to/from XAUI port (10 Gb/s)
The PE24XFE card receives and sends Ethernet traffic through 24 ports (Ethernet
electrical physical interfaces) allowing the connection to/from a PP10G, by means of an
10 Gigabit Attachment Unit Interface (XAUI), which is part of the 10G Ethernet standard.
Approximate dimension of the card are 223.5mm x 115mm.
....................................................................................................................................................................................................................................
C-122 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets 24xE/FE Electrical Packet Expander (PE24XFE)

Indicators and connectors

Connector/Indicator Description
1 EPS Multicolor LED:
• Green—EPS configured; card active
• Amber—EPS configured; card standby
• Amber blink—EPS configured but not available
• Off—EPS not configured
2 Board Status Multicolor LED for Ethernet data traffic and for the
status of the board (ST, EPS)
3 The Reset button (R) performs a warm reboot of LDC (local data
controller), without software and FPGA download. The Data
traffic is preserved during this function.
4–7 Four optical 1-GbE SFPs
8 RJ45 connector for the PQ2 LAN debugger link

Table C-8 HDXS/RJ-45 cable pinout

Port Name HDXS Pin RJ-45 Pin Function

1 TxP A1 1 Differential Pair for data Tx
TxN A2 2
RxP B2 3 Differential Pair for data Rx
RxN B3 6
2 TxP C1 1 Differential Pair for data Tx
TxN C2 2
RxP D2 3 Differential Pair for data Rx
RxN D3 6
3 TxP E1 1 Differential Pair for data Tx
TxN E2 2
RxP E2 3 Differential Pair for data Rx
RxN E3 6
4 TxP A4 1 Differential Pair for data Tx
TxN A5 2
RxP B5 3 Differential Pair for data Rx
RxN B6 6
5 TxP C4 1 Differential Pair for data Tx
TxN C5 2
RxP D5 3 Differential Pair for data Rx
RxN D6 6
6 TxP E4 1 Differential Pair for data Tx
TxN E5 2
RxP F5 3 Differential Pair for data Rx
RxN F6 6

Port Name HDXS Pin RJ-45 Pin Function

7 TxP A7 1 Differential Pair for data Tx
TxN A8 2
RxP B8 3 Differential Pair for data Rx
RxN B9 6
8 TxP C7 1 Differential Pair for data Tx
TxN C8 2
RxP D8 3 Differential Pair for data Rx
RxN D9 6
9 TxP E7 1 Differential Pair for data Tx
TxN E8 2
RxP F8 3 Differential Pair for data Rx
RxN F9 6
10 TxP E10 1 Differential Pair for data Tx
TxN E11 2
RxP F11 3 Differential Pair for data Rx
RxN F12 6
11 TxP C10 1 Differential Pair for data Tx
TxN C11 2
RxP D11 3 Differential Pair for data Rx
RxN D12 6
12 TxP B10 1 Differential Pair for data Tx
TxN B11 2
RxP A11 3 Differential Pair for data Rx
RxN A12 6

24XFE Packet Expander Access (PE24XFEA)

Part Number/ Mnemonic Name CLEI ECI/Bar CPR Status

Code
8DG26008AAXX 24XFE Packet TBD TBD TBD TBD
PE24XFEA Expander Access

Description
The 24 port Fast Ethernet Access card (24xFE access) card provides the capability of
extending the number of ports running at 100 Mbps. The 24xFE card is connected with a
Data Concentrator through backplane. See Figure C-38, “24xFE Packet Expander - Block
view” (p. C-127).

Figure C-38 24xFE Packet Expander - Block view

Figure C-39 24XFE Packet Expander Access (PE24XFEA)

Indicators and connectors

The PE24XFEA has the following indicators and connectors:

Item Function
2 HDXS type male connectors

8XGE Packet Expander Access (8XGEEA)

Part Number/ Name CLEI ECI/Bar Code CPR Status

Mnemonic
8DG02659AAXX 8XGE Packet NGC5ADNFAA 154874 099999 Active
8XGEEA Expander

Features and application notes

• 8 SFP 10/100/1000BASE-T - 1000BASE-X access (electrical and optical module)
• Local Power supply management
• Local FPGA management
• Pause frame/back pressure management
• Counters management.

Description
The 8XGE Packet Expander Access (8XGEEA) manages independently Gigabit ETH,
1000/100/10BASE-T interfaces. The on board FPGA PPEXT_A performs the MAC line
termination function and sends/receives the packets to the 10G Packet Processor (PP10G)
through a XAUI interface.
The 8XGEEA provides eight slots that host eight GbE SFP modules. The SFP modules
are available with different interfaces, and the 8XGEEA can host the following ones:
• 1000BASE-SX SFP (Short Reach, 850 nm) (GbE SX), “1000BASE-X SFPs ”
(p. C-172)
• 1000BASE-LX SFP (Long Reach, 1310 nm) (GbE LX), “1000BASE-X SFPs ”
(p. C-172)
• 1000BASE-ZX SFP (Extra Long Reach, 1550 nm) (GbE ZX), “1000BASE-X SFPs ”
(p. C-172)
• 1000BASE-T Electrical SFP (MULTIRATE RJ45) (ETHMR), “STM-64/OC-192 and
10GbE XFPs” (p. C-184).
• 100BASE-FX module (part number 1AB357990001)

Figure C-40 8XGE Packet Expander Access (8XGEEA)

Indicators and connectors

The 8XGEEA has the following indicators and connectors:

Item Function
1–8 SFP 10/100/1000BASE-T - 1000BASE-X access

Figure C-41 Functional block diagram

Port 1
SFPs Packet Expander
8xGE or 1x10GE

Backplane
10G Packet Processor/
10G Packet Transport
Processor
(PP10G)
Port 2
SFPs Packet Expander
8xGE or 1x10GE

4 SFPs
(R2.1 and
later Releases)

8XGE Synchronous Ethernet Packet Expander Access (8XGEEA)

Part Number/ Name CLEI ECI/Bar Code CPR Status

Mnemonic
8DG02659ABXX 8XGE TBD TBD TBD Active
8XGEEA Synchronous
Ethernet Packet
Expander

Features and application notes

Figure C-42 8XGE Synchronous Ethernet Packet Expander Access (8XGEEA)

Indicators and connectors

The 8XGEEA has the following indicators and connectors:

Item Function
1–8 SFP 10/100/1000BASE-T - 1000BASE-X access

Functional operation
A functional block diagram with indication of main external interfaces is shown in the
following figure.

Figure C-43 Functional block diagram

Port 1
SFPs Packet Expander
8xGE or 1x10GE

Backplane
10G Packet Processor/
10G Packet Transport
Processor
(PP10G)
Port 2
SFPs Packet Expander
8xGE or 1x10GE

4 SFPs
(R2.1 and
later Releases)

1X10GE Packet Expander Access (10GEEA)

Part Number/ Name CLEI ECI/Bar Code CPR Status

Mnemonic
8DG02662AAXX 1X10GE Packet NGC5ADLFAA 154872 099999 Active
10GEEA Expander

Features and application notes

• One XFP 10GBE access (electrical and optical module)
• Local Power supply management
• Local FPGA management
• Pause frame/back pressure management
• Counters management.

Description
The 1X10GE Packet Expander Access (10GEEA) is able to work in both LAN and WAN
mode. It can be equipped with standard XFP and extended version XFP-E.

Figure C-44 1X10GE Packet Expander Access (10GEEA)

Indicators and connectors

The 10GEEA has the following indicators and connectors:

Item Function
1 Link Activity LED
2 XFP 10GBE

Figure C-45 Functional block diagram

Port 1
SFPs Packet Expander
8xGE or 1x10GE

Backplane
10G Packet Processor/
10G Packet Transport
Processor
(PP10G)
Port 2
SFPs Packet Expander
8xGE or 1x10GE

4 SFPs
(R2.1 and
later Releases)

Booster Amplifier - BST10GA

Part Name CLEI ECI/Bar CPR Status

Number/Mnemonic Code
8DG26022AAXX BST10GA TBD TBD TBD TBD
BST10GA Single Channel
Booster

Figure C-46 BST10GA - block view

Features
The Single Channel Booster board supports the following features:
• A single PCB dimension 1 slot wide and half slot high
• An optical booster, its related central loop equipped on the board
• GOBLIN device for the below functions:
– HW_CFG management. It allows SC to download CERBERO FPGA procedure
remotely
– Monitor's and generate various status and control signals through its ports
– Interface with on-board CERBERO device through board's internal SPI bus
– Interface to on-board EEPROM for remote inventory information through board's
internal SPI bus
– Generate signal's for board status LED reporting
• Provides control loop circuitry for OPA
• Provides DC-DC converters to generate all the required voltages from input 48V DC
• Provides inrush current limiting circuitry on input 48V DC
• Provides CERBERO for control loop
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C C-139
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets Booster Amplifier - BST10GA

Description
The Single-Channel Booster board provides optical amplification for one channel for
100KM Extended Reach or (working with optical pre-amplifier) 120KM Very Long Haul,
or 160KM Ultra Long Haul applications. It also contains circuitry for management,
configuration, and control of onboard devices through backplane SPI bus.

Figure C-47 BST10GA board

Indicators and connectors

The BST10GA front panel provides:

Item Function
2 LC connectors (Tx, Rx)
1 Bi-color LED indicating the unit status
1 Mono-color LED indicating the optical signal LOSon

PRE10GA - PRE-AMPLIFIER (Single channel)

Part Name CLEI ECI/Bar CPR Status

Number/Mnemonic Code
8DG26026AAXX PRE10GA TBD TBD TBD TBD
PRE10GA Single Channel
Pre-Amplifier

Figure C-48 PRE10GA - block view

Features
The PRE10GA supports the following features:
• Single PCB inserted in access slot
• Optical pre-amp, its associated control loop, photo diode, and ASE filter (CH 34)
• A GOBLIN device for following functions:
– HW_CFG management. It allows SC to download the CERBERO FPGA
procedure remotely
– Monitors and generate various status and control signals through its ports

Description
The Single-Channel Pre-Amp board provides optical amplification for one channel (only
DWDM CH34) for 120KM very long haul or 160KM ultra long haul applications (with
or without using Booster unit). It also contains circuitry for management, configuration,
and control of on-board devices through backplane SPI bus. See Figure C-49, “PRE10GA
board” (p. C-144).

Figure C-49 PRE10GA board

Indicators and connectors

PRE10GA front panel provides the following LED:

Item Function
2 LC connectors (Tx, Rx)
1 Bi-color LED indicating unit status
1 Mono-color LED indicating the Loss of Optical Signal (LOS)

CWDM 4/8ch Mux/Demux (CMDX8)

Part Number/ Name CLEI ECI/Bar Code CPR Status

Mnemonic
8DG02614AAXX CWM 4/8ch TBD TBD TBD Active
CMDX8 Mux/Demux

Two fibres 8CH MDX2 - CMDX8 (Mux/Demux)

Refer to next Figure C-50, “CMDX8 block diagram” (p. C-146).
This board performs both the multiplexing and demultiplexing of 8
channels/wavelengths, 20 nm spaced, to/from a fibre, in the unidirectional application
(one fibre per direction).
It is used in Line Terminal and Back-to-back terminal configurations.
The 8-Channel Multiplexer/DemultipleXer unit contains
• one 8:1 CWDM multiplexer
• one 1:8 CWDM demultiplexer.
In transmit direction, the CMDX8 is used to multiplex 8 wavelengths, coming from
CWDM units, into a single output port (LINE TX OUT), to be sent to the line.
In receive direction, the CMDX8 is used to demultiplex the aggregate/multiplexed (8
wavelengths) optical signal coming from the line (LINE RX IN), into 8 WDM output
signals, each one further routed to the appropriate CWDM unit.
In transmit direction, 8 input ports (CH1IN -> CH8 IN) and 1 output port (LINE TX
OUT) for the multiplexer, are provided.
In receive direction, 1 input port (LINE RX OUT) and 8 output ports (CH1OUT -> CH8
OUT) for the demultiplexer, are provided.
5% of the input signal (LINE RX IN) is extracted via a 95:5 SM coupler and sent to a
photodiode. It is then amplified and compared with LOS-threshold, to perform LOS
detection (LOS alarm will be supported in further rel.).
The SPIDER provides the front-end interface to the SPI backpanel bus in order to allow
Second Level Controllers on Matrix boards, to alternatively operate on the bus, to
exchange data with remote devices connected on the local SPI bus, such as Remote
Inventory to save identity information (code identification, serial number..) and ECID to
save board identification and presetting data.
It also drives the hardware failure led.

Figure C-50 CMDX8 block diagram

CH1 1471nm
IN
From CWLA3/CWDM unit

CH2 1491nm
IN
CH3 1511nm
IN
1531nm

To LINE
CH4
IN MUX OUT LINE TX OUT
CH5 1551nm MUX
IN
CH6 1571nm
IN
CH7 1591nm
IN
CH8 1611nm
IN

CH1 1471nm
OUT
CH2 1491nm
To CWLA3/CWDM unit

OUT
CH3 1511nm

From LINE
OUT
CH4 1531nm
OUT DEMUX IN 5:95 LINE RX IN
CH5 1551nm DEMUX
OUT
TAP
CH6 1571nm
OUT
CH7 1591nm
OUT
CH8 1611nm
OUT

FRONT FRONT
REM INV

PANEL PANEL
ECID

LOS
Detector
+3.3V
+5V

LOS
Local SPI Bus

Power AL HWF LED Driver

Supply SPIDER
Slot_ID
C_PRES

+5.5V

SPI_A
+3.6V

SPI_B

BACK PANEL

DWDM units
8-channel DWDM mux/demux - OMDX8100
Refer to Figure C-51, “OMDX8100 block diagram” (p. C-149).
Two types of OMDX8100 are available:
• OMDX8100, operating in L1 band
• OMDX8100, operating in L2 band
The OMDX8100 is a bi-directional unit used, in ingress direction, for multiplexing
• The 8 channels of the related band (L1 or L2) and
• An Extra Band connected to the Extra port input (according to the configuration, it
can be another band, i.e. L2 Band, allowing MUX cascading, or the
express/pass-through channels)
On a single output port to obtain the aggregate signal to be sent to the line. The reverse
operation (demultiplexing) is provided in egress direction.
The unit is used in Line Terminal and OADM configurations.
When provides Line Terminal, the extra port input (MUX input, access side) is usually
used to provide Mux cascading; thus it is connected to the multiplexed output of a
cascaded MUX (and viceversa).
When provides OADM, the extra port input of the MUX can be connected to the extra
port output of the DEMUX on the opposite transmission direction, and viceversa, thus
allowing to pass-through the traffic that is not added and dropped.
These units contain a 9:1 multiplexer, @ 100 GHz grid and a 1:9 demultiplexer, @ 100
GHz grid.
In transmit direction, the 9:1 MUX is used to multiplex
• Eight optical channels, coming from eight transmitters (transponders)
• The Extra Band multiplexed signal, coming from the multiplexed output of a
cascaded Mux (Line Terminal/Back to Back) or the extra output of the opposite
Demux (OADM)
into a single output WDM signal to be sent to the line.
In receive direction, the 1:9 DEMUX is used to demultiplex the WDM signal into
• Eight optical channels outputs, further sent to the eight relative transmitters
(transponders)
• The Extra Band multiplexed signal, further sent to the Line/multiplexed input of a
cascaded Demux (LineTerminal/Back to Back) or the extra input of the opposite Mux
(OADM).
The multiplexer provides 9 input ports, 1 output port and 1 optical output monitor port.
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C C-147
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets DWDM units

....................................................................................................................................................................................................................................
The demultiplexer provides 9 output ports, 1 input port and 1 optical input monitor port.
Each of the nine input ports and the output port of the multiplexer has a tap coupler and a
photo detector to electrically monitor the optical power level. An additional tap coupler is
provided at the output port, allowing optical monitoring by means of a MU/SPC
connector available on the front panel.
The input port of the demultiplexer has a tap coupler and a photo detector to electrically
monitor the optical power level.
The power level alarming functionality is provided.
Brief description of the main features of the board
The OMDX8100 is the 8:1 and 1:8 channel multiplexer and demultiplexer on a 100-GHz
grid.
According to the board type, it supports 8 channels in the L1 or L2 band. Moreover it
includes one port (extra port) to provide
• Capacity upgrade in the Long Band
• OADM, allowing to pass-through the traffic/band(s) that are not added/dropped.
Frequency allocation
The Mux and Demux ports are labelled with the channel centre frequency in THz, e.g.,
the 193.000 label corresponds to the channel centre frequency of 193.000 THz. One label
is used for both Mux and Demux and the Mux ports appear above the Demux ports, on
the front panel.
The order of the ports on the front panel is as follows: uppermost port is the Output
Monitor, then the Input Monitor; below there is the highest frequency Mux and Demux
ports, these descend in frequency (interleaving Mux and Demux ports) with the lowest
frequency towards the bottom of the card, and below the Mux and Demux Extra Ports and
finally there are the Mux and Demux common ports, respectively.
Unit start-up
Initialization
On insertion of the OMDX8100 into the subrack, after unit declaration, the shelf
controller configures the provisionable parameters. Initialization does not exceed 30 s.
Optical level monitors are present at the input and output of the Mux and at the input only
of the Demux and are enabled by the on-board firmware during initialisation.
Unit re-start after replacement
Re-start as for initialisation.
Optical characteristics
Refer to “OMDX8100: 8-channel DWDM mux/demux optical characteristics” (p. 10-31).

Figure C-51 OMDX8100 block diagram

mux/dmux
from other Extra Input 9
port
photo
detector9 Output monitor
Input 1

To LINE
CH1
From tributaries

photo
detector1 9:1 MUX OUT LINE TX OUT
MUX
photo
CH8 detector
Input 8
photo
detector8
mux/dmux
to other

Extra Output 9
port
Input monitor
Output 1
CH1

From LINE
To tributaries

1:9 DEMUX IN LINE RX IN

DEMUX
photo
CH8 detector
Output 8
TEMP SENS
REM INV

ECID

FRONT FRONT
PANEL PANEL

Local SPI Bus

SPIDER

Sel
Gen_APSD
3.6VS_A
3.6VS_B

Slot_ID
SPI_A
SPI_B
C_PRES

_Out

BACK PANEL

Figure C-52 Configuration for ultra long-haul applications

Optical
WDM Module
OPTICAL
I/F
PD ASEfilter Optical
Module
CH34 tuned

Functional description of the unit

Refer to Figure C-53, “BOOST10G block diagram” (p. C-151).
The Optical Booster allows to amplify the outgoing signal to overcome the attenuation of
the fiber span. It consists of a length of Erbium doped fiber, which acts as the gain
medium, optically pumped using diode pump laser(s). The optical signal to be amplified
and the optical pump power are combined in the active fiber section by the
wavelength-selective coupler.
The EDFA controller is responsible for biasing the pump laser diode, maintaining laser
temperature constant (via Temperature Loop) and controlling the output power level (via
Power Loop).
Temperature Loop: the target temperature is digitally set inside the EDFA Controller; it
drives a thermo-electric cooler to stabilize the temperature of the laser diode, according to
the set one.

Figure C-53 BOOST10G block diagram

BOOSTER
Input Power Input Output Output Power

To Mux/Demux/Line
From10G unit

-35 to -8dBm Coupler EDFA Coupler -7dBm

FRONT FRONT
PANEL Input Laser Output PANEL
Photodiode Pump Photodiode

Unit Status LED

Remote Temp Temperature Power Loop
Inventory Sensor Loop +5V +3.3V
DC/DC

-48V +48V
Local In-rush current
Unit Controller EDFA Controller
SPI bus limiting

HW_CFG SPI_a/b VS3.3_a/b Back Panel -VBATT +VBATT

Optical characteristics
Refer to “BOOST10G (optical booster) optical characteristics” (p. 10-32).

Figure C-54 Configuration for very long-haul applications

WDM
Present if
OPTICAL
needed
I/F
DCU PD ASEfilter Optical
CH34 tuned Module
OTU-2, Transponder,..
PRE Amplifier board (PR10G)

Functional description of the unit

Refer to Figure C-55, “PRE10G block diagram” (p. C-154)

....................................................................................................................................................................................................................................
The Optical Pre-Amplifier is used in an optical link to provide a sufficient optical power
level to the optical receivers. It consists of a length of Erbium doped fiber, which acts as
the gain medium, optically pumped using diode pump laser(s). The optical signal to be
amplified and the optical pump power are combined in the active fiber section by the
wavelength-selective coupler.
The EDFA (or Preamplifier block) output is sent to the ASE noise rejection filter, to
suppress the out-of-band noise It is a pass-band filter for the channel 34 (193.400 THz,
1550.116 nm). The ASE Filter output is sent to the output photodiode, to provide the
power loop, described in the following.
The EDFA controller is responsible for biasing the pump laser diode, maintaining laser
temperature constant (via Temperature Loop) and controlling the output power level (via
Power Loop).
Temperature Loop: the target temperature is digitally set inside the EDFA Controller; it
drives a thermo-electric cooler to stabilize the temperature of the laser diode, according to
the set one.
Power Loop: the input and output optical powers are monitored by two photodiodes. They
convert the optical power into proportional current. The input current is used to generate
Laser alarms. The output current is used to manage the Power loop. The EDFA controller
compares the monitored current against the set one and calculates the output current, used
to change the laser pump current so as to maintain a constant output power.
The Unit Controller performs the following main functions:
• Programming Flash by using HW_CFG bus (at 4 MHz)
• To monitor and to generate various status and control signals through its ports
• To interface the onboard EEPROM for remote inventory information through board
internal SPI bus
• To generate unit status signals to manage the related front panel LED.
Power Supply. The unit gets a supply voltage of -48V from the back panel and uses this to
generate the voltages of +5V and +3.3 V on the board. The 1.5V voltages is generated
from the +5V through a step down converter. The -5.2V is generated from the +5V. It is
also provided an inrush current protection circuitry.

From Mux/Demux/Line Figure C-55 PRE10G block diagram

PREAMPLIFIER Output
Input Power Input Output ASE Power
Output

To 10G Unit
Coupler EDFA Coupler Filter
-35 to -8dBm Photodiode -7dBm
(CH34)
FRONT FRONT
PANEL Input Laser PANEL
Photodiode Pump

Unit Status LED

Remote Temp Temperature Power Loop
Inventory Sensor Loop +5V +3.3V
DC/DC

-48V +48V
Local In-rush current
Unit Controller EDFA Controller
SPI bus limiting

HW_CFG SPI_a/b VS3.3_a/b Back Panel -VBATT +VBATT

Optical characteristics
Refer to “PRE10G (optical preamplifier) optical characteristics” (p. 10-32)

STM-1 electrical SFP (S1E)

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB210170001 STM-1 electrical TBD TBD TBD Active
S1E SFP

Features and application notes

• The STM-1 Electrical SFP is an in-service pluggable optical module.
• In this release, it provides an electrical STM-1 interface for an 8-port STM-1/OC-3
/STM-4/OC-12 module (8PSO)
• Provides a custom RJ45 connector with integrated magnetics
• They are compliant with Small Form Factor Plug-in (SFP) Multi-Source Agreement
(MSA)

Functional overview
The electrical STM-1 SFPs interface with the 8PSO through a 2.5 Gb/s data signal line.
All timing, control, and power are provided by the 8PSO in which it is housed (refer to
“8-Port STM-1/OC-3/STM-4/OC-12 (8PSO -8×155/622M sync optical/8XSOA)”
(p. C-92) for information).

Figure C-56 Electrical SFP module

CASE TEMPERATURE
PROBE POINT

850_0110

STM-1/OC-3 SFPs

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB194670004 STM-1/OC-3 SFP NGI7ACZMAA 144100 U73150 Active
SS-11 (Short Haul, 1310
nm)
(OPTO TRX SFP
S-1.1 DDM)
1AB194670005 STM-1/OC-3 SFP NGI7AC0MAA 144103 U73152 Active
SL-11 (Long Haul, 1310
nm)
(OPTO TRX SFP
L-1.1 DDM
EXTEMP)
1AB194670006 STM-1/OC-3 SFP NGI7AC1MAA 144116 U73153 Active
SL-12 (Long Haul, 1550
nm)
(OPTO TRX SFP
L-1.2 DDM
EXTEMP)
1AB194670007 STM-1/OC-3 SFP WMUIAFECAA 146594 U73181 Active
SS-11 (Short Haul, 1310
nm)
(OPTO TRX SFP
S-1.1 DDM
-40/+85 C)

Features and application notes

• The STM-1/OC-3 modules are in-service pluggable optical modules
• In this release, they provide STM-1 interfaces for an 8-port STM-1/OC-3/
STM-4/OC-12 module (8PSO)
• They provide a duplex LC connector
• They are compliant with Small Form Factor Plug-in (SFP) Multi-Source Agreement
(MSA)
• They provide Digital Diagnostic Monitoring (DDM).

Functional overview
The STM-1/OC-3 SFPs interface with the 8PSO through a 2.5 Gb/s data signal line. All
timing, control, and power are provided by the 8PSO in which it is housed (refer to
“8-Port STM-1/OC-3/STM-4/OC-12 (8PSO -8×155/622M sync optical/8XSOA)”
(p. C-92) for information). See Figure C-58, “Optical SFP module block diagram”
(p. C-159) for a block diagram of the SFP.

Figure C-57 Optical SFP module

Output

Input

Optical cables

850-0112-1
051807

SFP Module Acronym Equipped on Card

SS-11 8PSO
SL-11
SL-12
SS-41
SL-41
SL-42

SFP Module Acronym Equipped on Card

SI-161 4P2G5SO
SS-161
SL-161
SL-162
1000BASE-SX 8XGEEA
1000BASE-LX
1000BASE-ZX
ETHMR

On the transmitter side, the STM-1/OC-3 SFPs have an automatic optical output power
control circuit, a laser driver and a laser diode module. The transmitter is based on a
non-cooled DFB laser. The laser safety class for the complete integrated module is class 1
according to IEC 60825. It can manage commands for TX disable and provides a TX fault
alarm.
TX fault indicates a laser fault. The transmitter is not disabled when the TX fault signal is
active. TX disable is an input that is used to shut down the transmitter optical output.
On the receiver side, the STM-1/OC-3 SFPs have a PIN photo detector for
light-to-electrical current conversion and a limiting amplifier. The photo-detected current
is amplified by an electrical circuit that delivers two complementary data signals.

Figure C-58 Optical SFP module block diagram

SFP MODULE HOST MODULE

MONITOR TD+
LD
PIN PD
LASER
DRIVER 100 Ω TD-

VccT VccT
4.7 kΩ 4.7 kΩ TO
TX DISABLE 10 kΩ
AUTOMATIC
POWER CONTROL
TX FAULT
CIRCUIT

(A) TRANSMITTER

PIN PD
RD+
PRE- POST-
AMP AMP 100 Ω
RD-

VccR
4.7 kΩ TO
LOS 10 kΩ

B (RECEIVER)

TEMPERATURE VccT
SUPPLY VOLTAGE DIAGNOSTIC
TX BIAS CURRENT MONITOR
TX OUTPUT POWER 4.7 kΩ TO
RX RECEIVED POWER 10 kΩ
MOD-DEF (0)

MOD-DEF (1)
EEPROM
MOD-DEF (2)

100 Ω

The module provides LOS alarm (loss of input power signal alarm). This output signal
indicates the received optical power is below the worst-case receiver sensitivity (as
defined by the standard in use).
The transceiver has an EEPROM to provide Remote Inventory (RI) information. DDM
supports analog parameter measurements such as temperature, laser bias, and laser power.

STM-4/OC-12 SFPs

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB196360004 STM-4/OC-12 SFP WMUIAFYCAA 146611 U73190 Active
SS-41 (Short Haul, 1310
nm)
(OPTO TRX SFP
S-4.1 DDM)
1AB196360005 STM-4/OC-12 SFP WMUIAFZCAA 146614 Active
SS-41 (Short Haul, 1310
nm)
(OPTO TRX SFP
S-4.1 DDM
-40/+85 C)
1AB196360006 STM-4/OC-12 SFP WMUIAF0CAA 146618 U73192 Active
SL-41 (Long Haul, 1310
nm)
(OPTO TRX SFP
L-4.1 DDM)
1AB196360007 STM-4/OC-12 SFP WMUIAF1CAA 146622 U73193 Active
SL-42 (Long Haul, 1550
nm)
(OPTO TRX SFP
L-4.2 DDM)

Features and application notes

• The STM-4/OC-12 modules are in-service pluggable optical modules
• In this release, they provide an STM-4 interface for an 8-port STM-4/OC-12 module
(8PSO)
• They provide a duplex LC connector
• They are compliant with Small Form Factor Plug-in (SFP) Multi-Source Agreement
(MSA)
• They provide Digital Diagnostic Monitoring (DDM).

Functional overview
The SFP interfaces with the 8PSO through a 2.5 Gb/s data signal line. All timing, control,
and power are provided by the 8PSO in which it is housed (refer to “8-Port
STM-1/OC-3/STM-4/OC-12 (8PSO -8×155/622M sync optical/8XSOA)” (p. C-92) for
information). See Figure C-60, “Optical SFP module block diagram” (p. C-163) for a
block diagram of the SFP.
On the transmitter side, the SFP has an automatic optical output power control circuit, a
laser driver and a laser diode module. The transmitter is based on a non-cooled DFB laser.
The laser safety class for the complete integrated module is class 1 according to IEC
60825. It can manage commands for TX disable and provides a TX fault alarm.

Figure C-59 Optical SFP module

Output

Input

Optical cables

850-0112-1
051807

SFP Module Acronym Equipped on Card

SS-11 8PSO
SL-11
SL-12
SS-41
SL-41
SL-42
SI-161 4P2G5SO
SS-161
SL-161
SL-162
1000BASE-SX 8XGEEA
1000BASE-LX
1000BASE-ZX
ETHMR

TX fault indicates a laser fault. The transmitter is not disabled when the TX fault signal is
active. TX disable is an input that is used to shut down the transmitter optical output.

Figure C-60 Optical SFP module block diagram

SFP MODULE HOST MODULE

MONITOR TD+
LD
PIN PD
LASER
DRIVER 100 Ω TD-

VccT VccT
4.7 kΩ 4.7 kΩ TO
TX DISABLE 10 kΩ
AUTOMATIC
POWER CONTROL
TX FAULT
CIRCUIT

(A) TRANSMITTER

PIN PD
RD+
PRE- POST-
AMP AMP 100 Ω
RD-

VccR
4.7 kΩ TO
LOS 10 kΩ

B (RECEIVER)

TEMPERATURE VccT
SUPPLY VOLTAGE DIAGNOSTIC
TX BIAS CURRENT MONITOR
TX OUTPUT POWER 4.7 kΩ TO
RX RECEIVED POWER 10 kΩ
MOD-DEF (0)

MOD-DEF (1)
EEPROM
MOD-DEF (2)

100 Ω

STM-16/OC-48 SFPs

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB196370005 STM-16/OC-48 NGI7AC2MAA 144117 U73159 Active
SI-161 SFP (Intraoffice,
1310 nm)
(OPTO TRX SFP
I-16.1 DDM)
1AB196370013 STM-16/OC-48 WMUIAF8CAA 146642 U73200 Active
SI-161 SFP (Intraoffice,
1310 nm)
(OPTO TRX SFP
I-16.1 DDM
-40/+185 C)
1AB196370006 STM-16/OC-48 NGI7AC3MAA 144119 U73154 Active
SS-161 SFP (Short Haul,
1310 nm) (OPTO
TRX SFP S-16.1
DDM)
1AB196370010 STM-16/OC-48 WMUIAF5CAA 146629 U73197 Active
SS-161 SFP (Short Haul,
1310 nm) (OPTO
TRX SFP S-16.1
DDM -40/+85C)
1AB196370008 STM-16/OC-48 WMUIAF3CAA 146626 U73195 Active
SL-161 SFP (Long Haul,
1310 nm)
1AB196370009 STM-16/OC-48 WMUIAF4CAA 146627 U73196 Active
SL-162 SFP (Long Haul,
1550 nm)
(OPTO TRX SFP
L-16.2)
1AB196370011 STM-16/OC-48 WMUIAF6CAA 146640 U73198 Active
SL-161 SFP (Long Haul,
1310 nm)
(OPTO TRX SFP
L-16.1 -40/+85C)

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB196370012 STM-16/OC-48 WMUIAF7CAA 146641 U73199 Active
SL-162 SFP (Long Haul,
1550 nm)
(OPTO TRX SFP
L-16.2 -40/+85 C)

Features and application notes

• The STM-16/OC-48 modules are in-service pluggable optical modules
• In this release, they provide an STM-16 interface for a four-port OC-48 module
(4P2G5SO)
• They provide a duplex LC connector
• They are compliant with Small Form Factor Plug-in (SFP) Multi-Source Agreement
(MSA)
• They provide Digital Diagnostic Monitoring (DDM).

Description
The STM-16/OC-48 SFP is installed in one slot of an 4P2G5SO. It provides a duplex LC
connector and the interfaces listed in the table at the beginning of this section. See Figure
C-61, “Optical SFP module” (p. C-166) for an illustration of the STM-16/OC-48 module.

Functional overview
The modules interface with the 4P2G5SO through a 2.5 Gb/s data signal line. All timing,
control, and power are provided by the 4P2G5SO in which it is housed (refer to “4-Port
STM-16/OC-48 (4P2G5SO)(4×2.5G sync optical)” (p. C-98) for information). See Figure
C-62, “Optical SFP module intraoffice and short-haul block diagram” (p. C-167) and
Figure C-63, “Optical SFP module long-haul block diagram” (p. C-168) for a block
diagrams of the modules.
On the transmitter side, the SL-161 and SL-162 Long Haul modules have an automatic
optical output power control circuit, a laser driver, and a laser diode module. The
transmitter is based on a non-cooled DFB laser. The laser safety class for the complete
integrated module is class 1 according to IEC 60825. It can manage commands for TX
disable and provides a TX fault alarm.

Figure C-61 Optical SFP module

Output

Input

Optical cables

850-0112-1
051807

SFP Module Acronym Equipped on Card

SS-11 8PSO
SL-11
SL-12
SS-41
SL-41
SL-42
SI-161 4P2G5SO
SS-161
SL-161
SL-162
1000BASE-SX 8XGEEA
1000BASE-LX
1000BASE-ZX
ETHMR

Figure C-62 Optical SFP module intraoffice and short-haul block diagram
SFP MODULE HOST MODULE

MONITOR TD+
LD
PIN PD
LASER
DRIVER 100 Ω TD-

VccT VccT
4.7 kΩ 4.7 kΩ TO
TX DISABLE 10 kΩ
AUTOMATIC
POWER CONTROL
TX FAULT
CIRCUIT

(A) TRANSMITTER

PIN PD
RD+
PRE- POST-
AMP AMP 100 Ω
RD-

VccR
4.7 kΩ TO
LOS 10 kΩ

B (RECEIVER)

TEMPERATURE VccT
SUPPLY VOLTAGE DIAGNOSTIC
TX BIAS CURRENT MONITOR
TX OUTPUT POWER 4.7 kΩ TO
RX RECEIVED POWER 10 kΩ
MOD-DEF (0)

MOD-DEF (1)
EEPROM
MOD-DEF (2)

100 Ω

Figure C-63 Optical SFP module long-haul block diagram

SFP MODULE HOST MODULE

MONITOR TD+
LD
PIN PD
LASER
DRIVER 100 Ω TD-

VccT VccT
4.7 kΩ 4.7 kΩ TO
TX DISABLE 10 kΩ
AUTOMATIC
POWER CONTROL
TX FAULT
CIRCUIT

(A) TRANSMITTER

VccR

DC-DC
CONVERTER

VccR
APD BIAS 4.7 kΩ TO
CONTROL LOS 10 kΩ
CIRCUIT COMPARATOR

APD
RD+

PRE- POST-
100 Ω
AMP AMP RD-

B (RECEIVER)

VccT

4.7 kΩ TO
MOD-DEF (0) 10 kΩ
MOD-DEF (1)
EEPROM
MOD-DEF (2)

100 Ω

850-0005

Long-haul modules
TX fault indicates a laser fault. The transmitter is not disabled when the TX fault signal is
active. TX disable is an input that is used to shut down the transmitter optical output.
On the receiver side, the SL-161 has an APD photo detector for light-to-electrical current
conversion and a limiting amplifier. The photo-detected current is amplified by an
electrical circuit that delivers two complementary data signals.
....................................................................................................................................................................................................................................
C-168 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets STM-16/OC-48 SFPs

100BASE-X SFPs

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB357990001 SFP 100BASE-FX TBD TBD TBD Active
FX with DDM -40/+85
C
1AB214710001 SFP 100BASE-LX TBD TBD TBD Active
LX -40/+85 C

1AB214710002 SFP 100BASE-LX TBD TBD TBD Active

LX with DDM -40/+85
C

Features and application notes

• The 100BASE SFPs are in-service pluggable optical modules.
• They provide 100BASE interfaces for a 8XGE Packet Expander Access (8XGEEA)
card.
• They provide a duplex LC connector.
• They are compliant with Small Form Factor Plug-in (SFP) Multi-Source Agreement
(MSA).
• The 100BASE-LX DDM SFPs provide Digital Diagnostic Monitoring (DDM).

Description
The 100BASE SFPs are used to provide an optical full duplex bidirectional interfaces
compliant to IEEE 802.3 clause 38.

Figure C-64 Optical SFP module

Output

Input

Optical cables

850-0112-1
051807

Functional overview
On the transmitter side, the 100BASE SFP has an automatic optical output power control
circuit, a laser driver and a laser diode module. The transmitter is based on a non-cooled
DFB laser. The laser safety class for the complete integrated module is class 1 according
to IEC 60825. It can manage commands for TX disable.
On the receiver side, the 100BASE SFP has a PIN photo detector for light-to-electrical
current conversion and a limiting amplifier. The photo-detected current is amplified by an
electrical circuit that delivers two complementary data signals.

Figure C-65 Optical SFP module block diagram

SFP MODULE HOST MODULE

MONITOR TD+
LD
PIN PD
LASER
DRIVER 100 Ω TD-

VccT VccT
4.7 kΩ 4.7 kΩ TO
TX DISABLE 10 kΩ
AUTOMATIC
POWER CONTROL
TX FAULT
CIRCUIT

(A) TRANSMITTER

PIN PD
RD+
PRE- POST-
AMP AMP 100 Ω
RD-

VccR
4.7 kΩ TO
LOS 10 kΩ

B (RECEIVER)

TEMPERATURE VccT
SUPPLY VOLTAGE DIAGNOSTIC
TX BIAS CURRENT MONITOR
TX OUTPUT POWER 4.7 kΩ TO
RX RECEIVED POWER 10 kΩ
MOD-DEF (0)

MOD-DEF (1)
EEPROM
MOD-DEF (2)

100 Ω

The module provides LOS alarm (loss of input power signal alarm). This output signal
indicates the received optical power is below the worst-case receiver sensitivity (as
defined by the standard in use).
The transceiver has an EEPROM to provide Remote Inventory (RI) information. On the
100BASE-LX SFPs, DDM supports analog parameter measurements such as temperature,
laser bias, and laser power.

1000BASE-X SFPs

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB187280033 1000BASE SX SFP WMUIABUCAA 141541 U72993 Active
1000B (Short Haul, 850
nm)
(OPTO TRX SFP
GbE SX DDM)
1AB187280045 SFP GBE SX with NGI7AKRMAA 155988 Active
1000B DDM -40/+85 C
(OPTO TRX SFP
GbE SX DDM)
1AB187280031 1000BASE LX SFP NGI7ACXMAA 144097 U73148 Active
1000B (Long Haul, 1310
nm)
(OPTO TRX SFP
GbE LX DDM)
1AB187280040 SFP GBE LX with WMUIAFCCAA 146592 Active
1000B DDM -40/+85 C
(OPTO TRX SFP
GbE LX DDM)
1AB187280042 SFP GBE ZX with WMUIAFDCAA 146593 Active
1000B DDM -5/+85 C
(OPTO TRX SFP
GbE ZX)
1AB187280046 SFP GBE ZX with NGI7AKSMAA 155997 Active
1000B DDM -40/+85 C
(OPTO TRX SFP
GbE ZX)
1AB376720005 SFP GBE EZX TBD TBD TBD Active
1000B with DDM -5/+70
C
1AB376720004 SFP GBE EZX TBD TBD TBD Active
1000B with DDM -40/+85
C

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB350870001 SFP GBE BX 1310 TBD TBD TBD Active
1000B nm with DDM
-5/+70 C
1AB350870002 SFP GBE BX 1490 TBD TBD TBD Active
1000B nm with DDM
-5/+70 C

Features and application notes

• The 1000BASE SFPs are in-service pluggable optical modules
• They provide a short-haul, long haul, and extra long haul 1000BASE interfaces for a
8XGE Packet Expander Access (8XGEEA)
• They provide a duplex LC connector
• They are compliant with Small Form Factor Plug-in (SFP) Multi-Source Agreement
(MSA)
• The 1000BASE-SX and 1000BASE-LX SFPs provide Digital Diagnostic Monitoring
(DDM).

Description
The 1000BASE SFPs are used to provide an optical full duplex bidirectional interface for
single-mode (1000BASE-ZX and 1000BASE-LX) or multimode (1000BASE-LX and
1000BASE-SX) fibers, compliant to IEEE 802.3 clause 38. In the Alcatel-Lucent
1850 TSS-100 system, one of these SFPs is required on the 8XGE Packet Expander
Access (8XGEEA).

Functional overview
The 1000BASE SFPs interface with the 8XGEEA through a 1.25 Gb/s data signal line.
All timing, control, and power are provided by the pack in which it is housed (refer to
“8XGE Packet Expander Access (8XGEEA)” (p. C-130) and “1X10GE Packet Expander
Access (10GEEA)” (p. C-135) for information). See Figure C-67, “Optical SFP module
block diagram” (p. C-175) for a block diagram of the 1000BASE SFPs.

Figure C-66 Optical SFP module

Output

Input

Optical cables

850-0112-1
051807

SFP Module Acronym Equipped on Card

SS-11 8PSO
SL-11
SL-12
SS-41
SL-41
SL-42
SI-161 4P2G5SO
SS-161
SL-161
SL-162
1000BASE-SX 8XGEEA
1000BASE-LX
1000BASE-ZX
ETHMR

On the transmitter side, the 1000BASE SFP has an automatic optical output power
control circuit, a laser driver and a laser diode module. The transmitter is based on a
non-cooled DFB laser. The laser safety class for the complete integrated module is class 1
according to IEC 60825. It can manage commands for TX disable.
....................................................................................................................................................................................................................................
C-174 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets 1000BASE-X SFPs

Figure C-67 Optical SFP module block diagram

SFP MODULE HOST MODULE

MONITOR TD+
LD
PIN PD
LASER
DRIVER 100 Ω TD-

VccT VccT
4.7 kΩ 4.7 kΩ TO
TX DISABLE 10 kΩ
AUTOMATIC
POWER CONTROL
TX FAULT
CIRCUIT

(A) TRANSMITTER

PIN PD
RD+
PRE- POST-
AMP AMP 100 Ω
RD-

VccR
4.7 kΩ TO
LOS 10 kΩ

B (RECEIVER)

TEMPERATURE VccT
SUPPLY VOLTAGE DIAGNOSTIC
TX BIAS CURRENT MONITOR
TX OUTPUT POWER 4.7 kΩ TO
RX RECEIVED POWER 10 kΩ
MOD-DEF (0)

MOD-DEF (1)
EEPROM
MOD-DEF (2)

100 Ω

The module provides LOS alarm (loss of input power signal alarm). This output signal
indicates the received optical power is below the worst-case receiver sensitivity (as
defined by the standard in use).
The transceiver has an EEPROM to provide Remote Inventory (RI) information. On the
1000BASE-SX and 1000BASE-LX SFPs, DDM supports analog parameter
measurements such as temperature, laser bias, and laser power.

Operating range
The 1000BASE SFPs have the operating ranges described in the following information
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C C-175
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Unit data sheets 1000BASE-X SFPs

Table C-9 Operating range for 1000BASE-SX over each optical fiber type

Fiber Type Modal Bandwidth @ 850 nm Minimum Range (Meters)

(Min. Overfilled Launch)
(MHz · km)
62.5 μm MMF 160 2 to 220
62.5 μm MMF 200 2 to 275
50 μm MMF 400 2 to 500
50 μm MMF 500 2 to 550
10 μm SMF N/A Not supported

The main characteristics of 1000BASE-SX transmitter as defined in the IEEE 802.3

recommendation is shown in the following table:

Table C-10 1000BASE-SX transmit characteristics

Description 62.5 μm 50 μm Unit

MMF MMF
Transmitter type Shortwave Laser
Signaling speed (range) 1.25 ± 100 ppm GBd
Wavelength (λ, range) 770 to 860 nm
Trise/Tfall (max; 20%-80%; λ > 830 nm) 0.26 ns
Trise/Tfall (max; 20%-80%; λ ≤ 830 nm) 0.21 ns
RMS spectral width (max) 0.85 nm
Average launch power (max) See footnote1 dBm
Average launch power (min) -9.5 dBm
Average launch power of OFF transmitter (max)2 -30 dBm
Extinction ratio (min) 9 dB
RIN (max) -117 dB/Hz
Coupled Power Ratio (CPR) (min)3 9 < CPR dB

The main characteristics of 1000BASE-SX receiver as defined in the IEEE 802.3

recommendation is shown in the following table:

Table C-11 1000BASE-SX receive characteristics

Description 62.5 μm 50 μm Unit

MMF MMF
Signaling speed (range) 1.25 ± 100 ppm GBd
Wavelength (λ, range) 770 to 860 nm
Average receive power (max) 0 dBm
Receive sensitivity -17 dBm
Return loss (min) 12 dB
Stressed receive sensitivity1,2 -12.5 -13.5 dBm
Vertical eye-closure penalty3 2.60 2.20 dB
Receive electrical 3 dB upper cutoff frequency 1500 MHz
(max)

Notes:
1. Measured with conformance test signal at TP3 for BER = 10 -12 at the eye center.
2. Measured with a transmit signal having a 9 dB extinction ratio. If another extinction ratio is
used, the stressed receive sensitivity should be corrected for the extinction ratio penalty.
3. Vertical eye-closure penalty is a test condition for measuring stressed receive sensitivity. It is
not a required characteristic of the receiver.

Table C-12 Operating range for 1000BASE-LX over each optical fiber type

Fiber Type Modal Bandwidth @ 1300 nm Minimum Range

(Min. Overfilled Launch) (MHz · (Meters)
km)
62.5 μm MMF 500 2 to 550
50 μm MMF 400 2 to 550
50 μm MMF 500 2 to 550
10 μm SMF N/A 2 to 5000

The main characteristics of 1000BASE-LX transmitter as defined in the IEEE 802.3

recommendation are shown in the following table:

Table C-13 1000BASE-LX transmit characteristics

Description 62.5 μm 50 μm 10 μm Unit

MMF MMF SMF
Transmitter type Longwave Laser
Signaling speed (range) 1.25 ± 100 ppm GBd
Wavelength (λ, range) 1270 to 1355 nm
Trise/Tfall (max; 20%-80%; response time) 0.26 ns
RMS spectral width (max) 4 nm
Average launch power (max) -3 dBm
Average launch power (min) -11.5 -11.5 -11.0 dBm
Average launch power of OFF transmitter -30 dBm
(max)
Extinction ratio (min) 9 dB
RIN (max) -120 dB/Hz
Coupled Power Ratio (CPR)1 28<CPR<40 12<CPR<20 N/A dB

Notes:
1. Due to the dual media (single-mode and multimode) support of the LX transmitter,
fulfillment of this specification requires a single-mode fiber offset-launch mode-conditioning
patch cord. This patch cord is not used for single-mode operation.

Table C-14 1000BASE-LX receive characteristics

Description Value Unit

Signaling speed (range) 1.25 ± 100 ppm GBd
Wavelength (λ, range) 1270 to 1355 nm
Average receive power (max) -3 dBm
Receive sensitivity -19 dBm
Return loss (min) 12 dB
12
Stressed receive sensitivity , -14.4 dBm
Vertical eye-closure penalty3 2.60 dB
Receive electrical 3 dB upper cutoff frequency (max) 1500 MHz

1000BASE-ZX
The main characteristics of 1000BASE-ZX transmitter as defined in the IEEE 802.3
recommendation are shown in the following table:

Table C-15 1000BASE-ZX transmitter side

Parameter Symbol Min Typ. Max. Unit Note

Bit Rate Range 1.25 ± 100 ppm Gb/s
1
Average Output Power to SMF Po 0.0 +5.0 dBm
(enable)
Average Output Power (disable) Pdis -45.0 dBm
Extinction Ratio Er 9.0 dB
Center Wavelength λc 1540 1570 nm
Spectral Width (20 dB down) Dl 1 nm
Side Mode Suppression Ratio SMSR 30 dB
Eye Mask for Optical Output Compliant with IEEE802.3 standard

Parameter Symbol Min Typ. Max. Unit Note

Transmitter Jitter (peak to peak) TjpkT 227 ps 1, 2
Optical Rise / Fall Time tr / tf 260 ps 3
Dispersion Penalty Dp 2.0 dB 4

Notes:
1. Measured at 1250 Mbps, PRBS2 7-1, 50% duty cycle, NRZ.
2. TP2 refers to the compliance point specified in IEEE802.3, section 38.2.1.
3. These are unfiltered 20-80% values.
4. Maximum dispersion values correspond to the approximate worst-case dispersion (to 1280
ps/nm) at 1550 nm.

The main characteristics of 1000BASE-ZX transmitter as defined in the IEEE 802.3

recommendation are shown in the following table:
Table C-16 1000BASE-ZX receiver side

Parameter Symbol Min Typ. Max. Unit Note

Bit Rate Range 1.25 ± 100 ppm Gb/s
Average Output Power to SMF (enable) Po 0.0 +5.0 dBm
Center Wavelength λc 1540 1570 nm

Parameter Symbol Min Typ. Max. Unit Note

Minimum Sensitivity Pmin1 -24 dBm 1,2,3
Pmin2 9.0 -22 dBm 1,2,4
Overload Pmax 0 dBm 1,2
LOS Activation Level PLa -30.0 -24.5 dBm 2
LOS Deactivation Level PLd -29.5 -24.0 dBm
LOS Hysteresis Phys 0.5 6.0 dB
Reflectance REFr -14 -12 dB

Notes:
1. BER=10 -12
2. Measured at 1250 Mbps, PRBS2 7-1, NRZ.
3. back to back
4. with fiber.

SFP 1000BASE-T electrical (ETHMR) (EL TRX SFP ETH

MULTIRATE RJ45)

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB359780001 SFP 1000BASE-T NGI7AKTMAA 156039 U73653 Active
ETHMR Electrical(EL TRX
SFP ETH
MULTIRATE
RJ45)

Features and application notes

• Is an in-service pluggable electrical transceiver module
• Provides an electrical 10/100/1000BASE-T interface for an 8XGE Packet Expander
(8XGEEA)
• Provides a custom RJ45 connector with integrated magnetics
• Is compliant with Small Form Factor Plug-in (SFP) Multi-Source Agreement (MSA).

Functional overview
The electrical 1000BASE-T interfaces with the 8XGEEA through a 1 Gb/s data signal
line. All timing, control, and power are provided by the 8XGEEA in which it is housed
(refer to “8XGE Packet Expander Access (8XGEEA)” (p. C-130) for information). See
Figure C-69, “Electrical SFP module functional diagram” (p. C-184) for a block diagram
of the electrical 1000BASE-T.

Figure C-68 Electrical SFP module

CASE TEMPERATURE
PROBE POINT

850_0110

SFP Module Acronym Equipped on Card

SS-11 8PSO
SL-11
SL-12
SS-41
SL-41
SL-42
SI-161 4P2G5SO
SS-161
SL-161
SL-162
1000BASE-SX 8XGEEA
1000BASE-LX
1000BASE-ZX
ETHMR

Figure C-69 Electrical SFP module functional diagram

STM-64/OC-192 and 10GbE XFPs

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB214540001 STM-64/OC-192 NGI7AC4MAA 144121 U73155 Active
XI-641 XFP (Intraoffice,
1310 nm)XFP
I-64.1/10GBE
BASE L
1AB217280001 STM-64/OC-192 NGI7AC5MAA 144124 U73156 Active
1AB217280004 XFP (Short Haul,
XS-642 1550 nm)(XFP
S-64.2B/10GBE
BASE E)

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB375380005 ALU-XFP 64.2B TBD TBD TBD Active
10GbE E 10GbEth baseE
Extended Range

Features and application notes

The XS-642 and XI-641 provide an intraoffice 1310nm or short haul 1550nm, STM-64
interface for a 1-port STM-64 module (1P10GSO). All XFPs in this section provide short
haul 1550nm (XS-642), intraoffice 1310nm (XI-641), or long haul (10GbE E)
10GBASE-E interfaces for a 1X10GE Packet Expander Access (10GEEA).
In addition, all modules in this section:
• Are in-service pluggable optical modules
• Provide a duplex LC connector
• Are compliant with 10 Gb Small Form Factor Plug-in (XFP) Multi-Source Agreement
(MSA).

Description
The STM-64/OC-192 10 Gb Small Form Factor Plug-ins (XI-641 and XS-642) are
installed in a 1P10GSO. In this release, they provide an STM-64 interface with a duplex
LC connector. See Figure C-70, “Optical XFP module” (p. C-186) for an illustration of
the XI-641.
For data applications, 10 GbE XFPs provide an intraoffice 1310nm (XI-641), 1550nm
short haul (XS-642), or long haul (10GbE E) 10GBASE interface for a 1X10GE Packet
Expander Access (10GEEA). They provide a duplex LC connector and require an XFP-E
adapter to be plugged into the 10GEEA or 1P10GSO.

Functional overview
The STM-64/OC-192 XFPs interface with the 1P10GSO through a 2.5 Gb/s data signal
line. For data applications, they have 10GBASE-E interfaces with the 10GEEA theough a
10Gb/s data signal line. All timing, control, and power are provided by the pack in which
it is housed (refer to “1-Port STM-64/OC-192 (1P10GSO) (1×10G sync optical)”
(p. C-109) and “1X10GE Packet Expander Access (10GEEA)” (p. C-135) for
information). See Figure C-72, “Optical XFP module block diagram” (p. C-187) for a
block diagram of the STM-64/OC-192 XFP.

Figure C-70 Optical XFP module

xfpmodule

Figure C-71 Optical XFP module, extended version

XFP Module Acronym Equipped on Card

XI-641 1P10GSO
XS-642
XS-642-E
XP1L12D2

XFP Module Acronym Equipped on Card

10GbE S 10GEEA
10GbE L
10GbE E

Figure C-72 Optical XFP module block diagram

On the transmitter side, the STM-64/OC-192 XFPs have an automatic optical output
power control circuit, a laser driver and a laser diode module. The laser safety class for
the complete integrated module is class 1 according to IEC 60825. They can manage
commands for TX disable and provide a TX fault alarm.
TX fault indicates a laser fault. The transmitter is not disabled when the TX fault signal is
active. TX disable is an input that is used to shut down the transmitter optical output.
On the receiver side, the STM-64/OC-192 XFPs have a PIN+TIA photo detector for
light-to-electrical current conversion and a limiting amplifier. The photo-detected current
is amplified by an electrical circuit that delivers two complementary data signals.
The modules provide LOS alarm (loss of input power signal alarm). This output signal
indicates the received optical power is below the worst-case receiver sensitivity (as
defined by the standard in use).

Operating range
The operating range of 10GBASE-E interface as defined in the IEEE 802.3
recommendation is 2 m to 30 km.
The main characteristics of 10GBASE-E transmitter as defined in the IEEE 802.3
recommendation are shown in the following table:

Table C-17 10GBASE-E transmit characteristics

Description 10GBASE-LW 10GBASE-LR Unit

Signaling speed (nominal) 9.95328 10.3125 GBd
Signaling speed variation from nominal (max) ± 20 ± 100 ppm
Center wavelength (range) 1530 to 1565 nm
Side Mode Suppression Ratio (min) 30 dB
Average launch power (max) 4.0 dBm
Average launch power1 (min) -4.7 dBm
Launch power (min) in OMA minus TDP2 -2.1 dBm
Optical Modulation Amplitude3 (min) -1.7 dBm
Transmitter and dispersion penalty (max) 3.0 dB
4
Average launch power of OFF transmitter (max) −30 dBm
Extinction ratio (min) 3 dB
RIN12OMA5 (max) −128 dB/Hz
Optical Return Loss Tolerance (max) 21 dB
Transmitter eye mask definition {X1, X2, X3, Y1, Y2, {0.25, 0.40, 0.45, 0.25,
Y3} 0.28, 0.40}

Notes:
1. Average launch power (min) is informative and not the principal indicator of signal
strength. A transmitter with launch power below this value cannot be compliant; however, a
value above this does not ensure compliance.
2. TDP is transmitter and dispersion penalty.
3. Even if the TDP < 0.4 dB, the OMA(min) must exceed this value.
4. Examples of an OFF transmitter are: no power supplied to the PMD, laser shutdown for
safety conditions, activation of a PMD_global_transmit_disable or other optional
transmitter shut down conditions.
5. RIN measurement is made with a return loss at 21 dB.

Table C-18 10GBASE-E receive characteristics

Description 10GBASE-E Unit

Signaling speed (nominal) GBd
10GBASE-ER 10.3125
10GBASE-EW 9.95328
Signaling speed variation from nominal (max) ± 100 ppm
Center wavelength (range) 1530 to 1565 nm
Average receive power (max) -1.0 dBm
Average receive power1 (min) -15.8 dBm
Maximum receive power (for damage) 4.0 dBm
2
Receiver sensitivity (max) in OMA 0.039 (-14.1) mW (dBm)
Receiver Reflectance (max) -26 dB
Stressed receiver sensitivity in OMA3,4(max) 0.074 (-11.3) mW (dBm)
Vertical eye closure penalty5 (min) 2.7 dB
Stressed eye jitter6 (min) 0.3 UI pk-pk
Receive electrical 3 dB upper cutoff frequency (max) 12.3 GHz

Notes:
1. Average receive power (min) is informative and not the principal indicator of signal
strength. A received power below this value cannot be compliant; however, a value above
this does not ensure compliance.
2. Receiver sensitivity is informative.
3. Measured with conformance test signal at TP3 for BER = 10- 12.
4. The stressed sensitivity values in the table are for system level BER measurements which
include the effects of CDR circuits. It is recommended that at least 0.4 dB additional margin
be allocated if component level measurements are made without the effect of CDR circuits
5. Vertical eye closure penalty is a test condition for measuring stressed receiver sensitivity. It
is not a required characteristic of the receiver.
6. Stressed eye jitter is a test condition for measuring stressed receiver sensitivity. It is not a
required characteristic of the receiver.

STM-64/OC-192 XFP-Es

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB253330001 STM-64/OC-192 NGI7AHEMAA 154657 U73595 Active
XP1L12D2 XFP-E (Long Haul,
1550 nm)
(XFP-E P1L1-1D2)

Features and application notes

• The STM-64/OC-192 XFP-Es are in-service pluggable optical modules
• Provide an output distance of 40km (short haul) or 80 km (long haul)
• In this release, they provide a 1550 nm STM-64 interface for a 1-port STM-64
module (1P10GSO)
• Provide two LC connectors
• Are compliant with 10 Gb Small Form Factor Plug-in (XFP) Multi-Source Agreement
(MSA)
• Provide Digital Diagnostic Monitoring (DDM).

Description
The STM-64/OC-192 XFP-Extended (XFP-E) module is installed in a 1P10GSO.
Depending upon the module, they provide a short-haul or long-haul, 1550 nm STM-64
interface with LC connectors. See Figure C-73, “STM-64/OC-192 XFP-E module”
(p. C-191) for an illustration of the XFP-E.

Functional overview
The XFP-E interfaces with the 1P10GSO through a 2.5 Gb/s data signal line. All timing,
control, and power are provided by the 1P10GSO in which it is housed (refer to “1-Port
STM-64/OC-192 (1P10GSO) (1×10G sync optical)” (p. C-109) for information). See
Figure C-74, “STM-64/OC-192 XFP-E module block diagram” (p. C-192) for a block
diagram of the XFP-E.

Figure C-73 STM-64/OC-192 XFP-E module

XFP Module Acronym Equipped on Card

XI-641 1P10GSO
XS-642
XS-642-E
XP1L12D2
10GbE S 10GEEA
10GbE L
10GbE E

The STM-64/OC-192 XFP-Es are 10 Gb/s serial-to-serial transceivers in which the

optical transmitter and receiver are independent. The transmitter receives electrical data
input through a 30-pin pluggable edge connector from the 1P10GSO, performs 3R
regeneration using a CDR, and converts the regenerated signal in the optical data output
using a 1550 nm EA-ILM.

Figure C-74 STM-64/OC-192 XFP-E module block diagram

Through the alarm signals, the STM-64/OC-192 XFP-Es can manage commands for TX
disable and provides a TX fault alarm. TX fault indicates a laser fault. The transmitter is
not disabled when the TX fault signal is active. TX disable is an input that is used to shut
down the transmitter optical output. The module also provides LOS alarm (loss of input
power signal alarm). This output signal indicates the received optical power is below the
worst-case receiver sensitivity (as defined by the standard in use).
DDM supports analog parameter measurements such as temperature, laser bias, and laser
power.

10GBASE-S XFP (Short Haul, 850 nm) (OPTO TRX XFP 10Gb)

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB214540002 XFP (10 NGI7ADWMAA 148159 U73260 Active
10GB GBASE-SR)(OPTO
TRX XFP GbE S)

Features and application notes

• Is an in-service pluggable optical module
• Provides a short-haul, 850 nm 10GBASE-S interface for a 1X10GE Packet Expander
Access (10GEEA)
• Provides a duplex LC connector
• Is compliant with 10 Gb Small Form Factor Plug-in (XFP) Multi-Source Agreement
(MSA).

Description
The 10GBASE-S XFP is used for the serial 10 Gigabit Ethernet short wavelength
interface for multimode fibers operating at 850 nm, in LAN applications. This interface is
specified in IEEE 802.3ae; except for operative rate, the same optical and electrical
characteristics apply to both LAN and WAN applications. In the Alcatel-Lucent
1850 TSS-100 system this XFP is one option of XFPs required on the 10GEEA.

Functional overview
The 10GBASE-S interfaces with the 10GEEA through a 10 Gb/s data signal line. All
timing, control, and power are provided by the pack in which it is housed (refer to “1-Port
STM-64/OC-192 (1P10GSO) (1×10G sync optical)” (p. C-109) for information). See
Figure C-76, “Optical XFP module block diagram” (p. C-195) for a block diagram of the
10GBASE-S.

Figure C-75 Optical XFP module

xfpmodule

XFP Module Acronym Equipped on Card

XI-641
XS-642
1P10GSO
XS-642-E
XP1L12D2
10GbE S
10GbE L 10GEEA
10GbE E

On the transmitter side, the 10GBASE-S XFP has an automatic optical output power
control circuit, a laser driver and a laser diode module. The transmitter is based on a
non-cooled DFB laser. The laser safety class for the complete integrated module is class 1
according to IEC 60825. It can manage commands for TX disable and provides a TX fault
alarm.
TX fault indicates a laser fault. The transmitter is not disabled when the TX fault signal is
active. TX disable is an input that is used to shut down the transmitter optical output.
On the receiver side, the 10GBASE-S XFP has a PIN photo detector for light-to-electrical
current conversion and a limiting amplifier. The photo-detected current is amplified by an
electrical circuit that delivers two complementary data signals.

Figure C-76 Optical XFP module block diagram

Operating range
The operating range of 10GBASE-S interface depending on the type of fiber as defined in
the IEEE 802.3 recommendation is shown in the following table:

Table C-19 Operating range for 10GBASE-S over each optical fiber type

Fiber Type Minimum Modal Bandwidth @ Operating Range

850 nm (MHz · km) (Meters)
62.5 μm MMF 160 2 to 26
200 2 to 33
50 μm MMF 400 2 to 66
500 2 to 82
2000 2 to 300

Table C-20 10GBASE-S transmit characteristics

Description 10GBASE-SW 10GBASE-SR Unit

Signaling speed (nominal) 9.95328 10.3125 GBd
Signaling speed variation from nominal (max) ± 20 ± 100 ppm
Center wavelength (range) 840 to 860
RMS spectral width1 (max) See footnote2
Average launch power (max) See footnote3 dBm
4
Average launch power (min) -7.3 dBm
Launch power (min) in OMA 30
Average launch power of OFF transmitter5 -30 dBm
(max)
Extinction ratio (min) 3 dB
RIN12 OMA (max) -128 dB/Hz
Optical Return Loss Tolerance (max) 12
Encircled flux See footnote6
Transmitter eye mask definition {X1, X2, X3, {0.25, 0.40, 0.45, 0.25, 0.28, 0.40}
Y1, Y2, Y3}
Transmitter and dispersion penalty7(max) 3.9 dB

Notes:
1. RMS spectral width is the standard deviation of the spectrum.
2. Trade-offs are available between spectral width, center wavelength and minimum optical
modulation amplitude. See Figure 52-3 and Table 52-8 in the IEEE 802.3ae std.
recommendation.
3. The 10GBASE-S launch power shall be the lesser of the class 1 safety limit or the average
receive power (max) defined by Table C-21, “10GBASE-S receive characteristics”
(p. C-197).
4. Average launch power (min) is informative and not the principal indicator of signal
strength. A transmitter with launch power below this value cannot be compliant; however, a
value above this does not ensure compliance.
5. Examples of an OFF transmitter are: no power supplied to the PMD, laser shutdown for
safety conditions, activation of a PMD_global_transmit_disable or other optional
transmitter shut down conditions.

The main characteristics of 10GBASE-S receiver as defined in the IEEE 802.3

recommendation are shown in the following table:

Table C-21 10GBASE-S receive characteristics

Description 10GBASE-S Unit

Signaling speed (nominal) 10.3125 GBd
10GBASE-SR 9.95328
10GBASE-SW
Signaling speed variation from nominal (max) ± 100 ppm
Center wavelength (range) 840 to 860 nm
Average receive power1 (max) -1.0 dBm
Average receive power2 (min) -9.9 dBm
Receiver sensitivity (max) in OMA3 0.077 (-11.1) mW (dBm)
Receiver Reflectance (max) -12 dB
45
Stressed receiver sensitivity in OMA , (max) 0.18 (-7.5) mW (dBm)
Vertical eye closure penalty6 (min) 3.5 dB
Stressed eye jitter7 (min) 0.3 UI pk-pk
Receive electrical 3 dB upper cutoff frequency 12.3 GHz
(max)

Notes:
1. The receiver is able to tolerate, without damage, continuous exposure to an optical input
signal having a power level equal to the Average Receive Power (max) plus at least 1 dB.
2. Average receive power (min) is informative and not the principal indicator of signal
strength. A received power below this value cannot be compliant; however, a value above
this does not ensure compliance.
3. Receiver sensitivity is informative.
4. Measured with conformance test signal at TP3 for BER = 10 -12.
5. The stressed sensitivity values in the table are for system level BER measurements which
include the effects of CDR circuits. It is recommended that at least 0.4 dB additional margin
be allocated if component level measurements are made without the effect of CDR circuits

XFP-E adapter

Part Number/ Name CLEI ECI/Bar Code CPR Status

Mnemonic
3AL91721AA XFP-E NA NA NA Active
Adapter

Features and application notes

• Adapts 10 Gb Small Form Factor Plug-ins (XFPs) that are standard Multi-Source
Agreement (MSA) mechanical form factor to the extended mechanical form factor for
use in the 1-Port OC-192 (1P10GSO) module and in the 1X10GE Packet Expander
Access (10GEEA)

Description
The XFP-E adapter is required for an XFP that is standard MSA mechanical form factor.
It adapts an XFP to the extended mechanical form factor so that it can be inserted into the
1P10GSO and into the 10GEEA. See Figure C-77, “XFP-E adapter” (p. C-199) for the
XFP-E adapter.
Refer to Table C-22, “XFPs requiring XFP-E adapter” (p. C-198) for XFPs that require
the XFP-E adapter. See Figure C-78, “XFP insertion into XFP-E adapter” (p. C-200) for
XFP insertion into the XFP-E adapter.
Table C-22 XFPs requiring XFP-E adapter

Name Description Part Number

“STM-64/OC-192 and 10GbE “STM-64/OC-192 XFP (Intraoffice, “1AB214540001” (p. C-184)
XFPs” (p. C-184) 1310 nm)XFP I-64.1/10GBE BASE
L” (p. C-184) (“XI-641” (p. C-184))
“STM-64/OC-192 and 10GbE “STM-64/OC-192 XFP (Short Haul, “1AB217280001” (p. C-184)
XFPs” (p. C-184) 1550 nm)(XFP S-64.2B/10GBE
BASE E)” (p. C-184) (“XS-642”
(p. C-184))

Name Description Part Number

“10GBASE-S XFP (Short “XFP (10 GBASE-SR)(OPTO TRX “1AB214540002” (p. C-193)
Haul, 850 nm) (OPTO TRX XFP GbE S)” (p. C-193) (“10GB”
XFP 10Gb)” (p. C-193) (p. C-193))

Figure C-77 XFP-E adapter

DWDM XFPs

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB356630001 XFP L-64.2 WOTRAP5GAA 152783 TBD Active
XL-642C DWDM (CH
60/1529.55 nm)
1AB356630002 XFP L-64.2 WOTRAP6GAA 152827 TBD Active
XL-642C DWDM (CH
59/1530.33 nm)
1AB356630003 XFP L-64.2 WOTRAP7GAA 152828 TBD Active
XL-642C DWDM (CH
58/1531.12 nm)
1AB356630004 XFP L-64.2 WOTRAP8GAA 152829 TBD Active
XL-642C DWDM (CH
57/1531.90 nm)
1AB356630005 XFP L-64.2 WOTRAP9GAA 152830 TBD Active
XL-642C DWDM (CH
56/1532.68 nm)
1AB356630006 XFP L-64.2 WOTRARAGAA 152831 TBD Active
XL-642C DWDM (CH
55/1533.47 nm)

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB356630007 XFP L-64.2 WOTRARBGAA 152832 TBD Active
XL-642C DWDM (CH
54/1534.25 nm)
1AB356630008 XFP L-64.2 WOTRARCGAA 152833 TBD Active
XL-642C DWDM (CH
53/1535.04 nm)
1AB356630009 XFP L-64.2 WOTRARDGAA 152834 TBD Active
XL-642C DWDM (CH
52/1535.82 nm)
1AB356630010 XFP L-64.2 WOTRAREGAA 152835 TBD Active
XL-642C DWDM (CH
51/1537.40 nm)
1AB356630011 XFP L-64.2 WOTRARFGAA 152836 TBD Active
XL-642C DWDM (CH
50/1537.40 nm)
1AB356630012 XFP L-64.2 WOTRARGGAA 152837 TBD Active
XL-642C DWDM (CH
49/1538.19 nm)
1AB356630013 XFP L-64.2 WOTRARHGAA 152838 TBD Active
XL-642C DWDM (CH
48/1538.98 nm)
1AB356630014 XFP L-64.2 WOTRARJGAA 152839 TBD Active
XL-642C DWDM (CH
47/1539.77 nm)
1AB356630015 XFP L-64.2 WOTRARKGAA 152840 TBD Active
XL-642C DWDM (CH
46/1540.56 nm)
1AB356630016 XFP L-64.2 WOTRARLGAA 152841 TBD Active
XL-642C DWDM (CH
45/1541.35 nm)
1AB356630017 XFP L-64.2 WOTRARMGAA 152842 TBD Active
XL-642C DWDM (CH
44/1542.14 nm)
1AB356630018 XFP L-64.2 WOTRARNGAA 152843 TBD Active
XL-642C DWDM (CH
43/1542.94 nm)

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB356630019 XFP L-64.2 WOTRARPGAA 152844 TBD Active
XL-642C DWDM (CH
42/1543.73 nm)
1AB356630020 XFP L-64.2 WOTRARRGAA 152845 TBD Active
XL-642C DWDM (CH
41/1544.53 nm)
1AB356630021 XFP L-64.2 WOTRARSGAA 152846 TBD Active
XL-642C DWDM (CH
40/1545.32 nm)
1AB356630022 XFP L-64.2 WOTRARTGAA 152847 TBD Active
XL-642C DWDM (CH
39/1546.12 nm)
1AB356630023 XFP L-64.2 WOTRARUGAA 152848 TBD Active
XL-642C DWDM (CH
38/1546.2 nm)
1AB356630024 XFP L-64.2 WOTRARVGAA 152849 TBD Active
XL-642C DWDM (CH
37/1547.72 nm)
1AB356630025 XFP L-64.2 WOTRARWGAA 152850 TBD Active
XL-642C DWDM (CH
36/1548.51 nm)
1AB356630026 XFP L-64.2 WOTRARXGAA 152851 TBD Active
XL-642C DWDM (CH
35/1549.32 nm)
1AB356630027 XFP L-64.2 WOTRARYGAA 152852 TBD Active
XL-642C DWDM (CH
34/1550.12 nm)
1AB356630028 XFP L-64.2 WOTRARZGAA 152853 TBD Active
XL-642C DWDM (CH
33/1550.92 nm)
1AB356630029 XFP L-64.2 WOTRAR0GAA 152854 TBD Active
XL-642C DWDM (CH
32/1551.72 nm)
1AB356630030 XFP L-64.2 WOTRAR1GAA 152855 TBD Active
XL-642C DWDM (CH
31/1552.52 nm)

Part Number/ Name CLEI ECI/Bar CPR Status

Mnemonic Code
1AB356630031 XFP L-64.2 TBD TBD TBD Active
XL-642C DWDM (CH
30/1553.33 nm)
1AB356630032 XFP L-64.2 TBD TBD TBD Active
XL-642C DWDM (CH
29/1554.13 nm)
1AB356630033 XFP L-64.2 TBD TBD TBD Active
XL-642C DWDM (CH
28/1554.94 nm)
1AB356630034 XFP L-64.2 TBD TBD TBD Active
XL-642C DWDM (CH
27/1555.75 nm)
1AB356630035 XFP L-64.2 TBD TBD TBD Active
XL-642C DWDM (CH
26/1556.56 nm)
1AB356630036 XFP L-64.2 TBD TBD TBD Active
XL-642C DWDM (CH
25/1557.36 nm)
1AB356630037 XFP L-64.2 TBD TBD TBD Active
XL-642C DWDM (CH
24/1558.17 nm)
1AB356630038 XFP L-64.2 TBD TBD TBD Active
XL-642C DWDM (CH
23/1558.98 nm)
1AB356630039 XFP L-64.2 TBD TBD TBD Active
XL-642C DWDM (CH
22/1559.79 nm)
1AB356630040 XFP L-64.2 TBD TBD TBD Active
XL-642C DWDM (CH
21/1560.61 nm)
1AB356630041 XFP L-64.2 TBD TBD TBD Active
XL-642C DWDM (CH
20/1561.42 nm)

Features and application notes

• DWDM XFPs are in-service pluggable optical modules
• They provide an STM-64 interface for a 1-port STM-64 module (1P10GSO)

Description
The DWDM XFPs operate in a temperature range of -5 to +70 C with a fine stabilized
DFB LASER that enables a 100GHz spacing WDM grid.
Release-Specific WDM considerations
On Alcatel-Lucent 1850 TSS-100 R4.1, the feasibility and the reliability of the WDM
links cannot be guaranteed with the listed SFP and XFP colored optical modules unless
the WDM network has been designed or checked for each specific application by a WDM
Engineer.
If Alcatel-Lucent WDM Equipment is utilized as the optical layer, please follow the
related installation procedures and network design requirements. If non-Alcatel-Lucent
WDM Equipment is used, the customer is responsible for proper installation and the
reliability of the network.
Only unamplified-DWDM operation is supported in this release as a conventional
point-to-point passive optical link design.
The following basic items should be checked:
1. Channel Plan compatibility and common line rate (NO Forward Error Correction)
2. Optical Filters Characteristics (insertion loss, bandwidth)
3. Span Calculation
4. End of Life Span Margins Requirements
5. In case of optical bypass, the extra filtering insertion loss and the narrowing effects
should be taken into account
Note: Amplified-DWDM Network Design is not supported in this release. The
DWDM XFPs are not yet qualified in presence of Optical Noise (OSNR).

Functional overview
The DWDM XFPs interface with the 1P10GSO through a 2.5 Gb/s data signal line. All
timing, control, and power are provided by the pack in which it is housed (refer to “1-Port
STM-64/OC-192 (1P10GSO) (1×10G sync optical)” (p. C-109) for information).

Figure C-79 Optical XFP module

xfpmodule

TX fault indicates a laser fault. The transmitter is not disabled when the TX fault signal is
active. TX disable is an input that is used to shut down the transmitter optical output.On
the receiver side, the XL-642C has an APD (80 km) photo detector for light-to-electrical
current conversion and a limiting amplifier. The photo-detected current is amplified by an
electrical circuit that delivers two complementary data signals.
The module provides LOS alarm (loss of input power signal alarm). This output signal
indicates the received optical power is below the worst-case receiver sensitivity (as
defined by the standard in use). The transceiver has an EEPROM to provide Remote
Inventory (RI) information.

CWDM SFPs

Part Number/ Name CLEI ECI/Bar Code CPR Status

Mnemonic
1AB196340009 SFP multi-rate up WMUIAFFCAA 146595 TBD Active
SS-162C to S-16.2 CWDM
(CH 47/1470 nm)
1AB196340010 SFP multi-rate up WMUIAFGCAA 146596 TBD Active
SS-162C to S-16.2 CWDM
(CH 49/1490 nm)
1AB196340011 SFP multi-rate up WMUIAFHCAA 146597 TBD Active
SS-162C to S-16.2 CWDM
(CH 51/1510 nm)
1AB196340012 SFP multi-rate up WMUIAFJCAA 146598 TBD Active
SS-162C to S-16.2 CWDM
(CH 53/1530 nm)

Part Number/ Name CLEI ECI/Bar Code CPR Status

Mnemonic
1AB196340013 SFP multi-rate up WMUIAFKCAA 146599 TBD Active
SS-162C to S-16.2 CWDM
(CH 55/1550 nm)
1AB196340014 SFP multi-rate up WMUIAFLCAA 146600 TBD Active
SS-162C to S-16.2 CWDM
(CH 57/1570 nm)
1AB196340015 SFP multi-rate up WMUIAFMCAA 146601 TBD Active
SS-162C to S-16.2 CWDM
(CH 59/1590 nm)
1AB196340016 SFP multi-rate up WMUIAFNCAA 146602 TBD Active
SS-162C to S-16.2 CWDM
(CH 61/1610 nm)
1AB196350026 SFP multi-rate up WMUIAFPCAA 146603 TBD Active
SL-162C to L-16.2
CWDM (CH
46/1470 nm)
1AB196350027 SFP multi-rate up WMUIAFRCAA 146604 TBD Active
SL-162C to L-16.2
CWDM (CH
49/1490 nm)
1AB196350028 SFP multi-rate up WMUIAFSCAA 146605 TBD Active
SL-162C to L-16.2
CWDM (CH
51/1510 nm)
1AB196350029 SFP multi-rate up WMUIAFTCAA 146606 TBD Active
SL-162C to L-16.2
CWDM (CH
53/1530 nm)
1AB196350030 SFP multi-rate up WMUIAFUPCAA 146607 TBD Active
SL-162C to L-16.2
CWDM (CH
55/1550 nm)
1AB196350031 SFP multi-rate up WMUIAFVCAA 146608 TBD Active
SL-162C to L-16.2
CWDM (CH
57/1570 nm)

Part Number/ Name CLEI ECI/Bar Code CPR Status

Mnemonic
1AB196350032 SFP multi-rate up WMUIAFWCAA 146609 TBD Active
SL-162C to L-16.2
CWDM (CH
59/1590 nm)
1AB196350033 SFP multi-rate up WMUIAFXCAA 146610 TBD Active
SL-162C to L-16.2
CWDM (CH
61/1610 nm)

Features and application notes

• CWDM SFPs are in-service pluggable optical modules
• They provide an STM-1 or STM-4 interface for an 8-port STM-1/ STM-4 module
(8PSO), or an STM-16 interface for a 4-port STM-16 module (4P2G5SO)
• They provide a duplex LC connector
• Is compliant with Small Form Factor Plug-in (SFP) Multi-Source Agreement (MSA).

Description
The CWDM SFPs operate in a temperature range of -5 to +70 C with a coarse stabilized
DFB LASER that enables a 20nm spacing WDM grid.
Release-specific WDM considerations
On Alcatel-Lucent 1850 TSS-100 R4.1, the feasibility and the reliability of the WDM
links cannot be guaranteed with the listed SFP and XFP colored optical modules unless
the WDM network has been designed or checked for each specific application by a WDM
Engineer.
If Alcatel-Lucent WDM Equipment is utilized as the optical layer, please follow the
related installation procedures and network design requirements. If non-Alcatel-Lucent
WDM Equipment is used, the customer is responsible for proper installation and the
reliability of the network.
Only unamplified-DWDM operation is supported in this release as a conventional
point-to-point passive optical link design.
The following basic items should be checked:
1. Channel Plan compatibility and common line rate (NO Forward Error Correction)
2. Optical Filters Characteristics (insertion loss, bandwidth)
3. Span Calculation

Functional overview
The modules interface with the 4P2G5SO or 8PSO through a 2.5 Gb/s data signal line.
All timing, control, and power are provided by the 4P2G5SO or 8PSO in which the
module is housed (refer to “4-Port STM-16/OC-48 (4P2G5SO)(4×2.5G sync optical)”
(p. C-98) or “8-Port STM-1/OC-3/STM-4/OC-12 (8PSO -8×155/622M sync
optical/8XSOA)” (p. C-92) for information).

Figure C-80 Optical SFP module

Output

Input

Optical cables

850-0112-1
051807

TX fault indicates a laser fault. The transmitter is not disabled when the TX fault signal is
active. TX disable is an input that is used to shut down the transmitter optical output.
On the receiver side, the SL-162C modules have an APD (80 km) photo detector, and the
SS-162C modules have a PIN (40 km) photo detector for light-to-electrical current
conversion, and a limiting amplifier. The photo-detected current is amplified by an
electrical circuit that delivers two complementary data signals.
The modules provide LOS alarm (loss of input power signal alarm). This output signal
indicates the received optical power is below the worst-case receiver sensitivity (as
defined by the standard in use).

CWDM XFPs

Part Number/ Name CLEI ECI/Bar Code CPR Status

Mnemonic
1AB378370001 ALU XFP TBD TBD TBD Active
XL-642C. CWDM-LH
1471NM
1AB378370002 ALU XFP TBD TBD TBD Active
XL-642C CWDM-LH
1491NM
1AB378370003 ALU XFP TBD TBD TBD Active
XL-642C CWDM-LH
1511NM
1AB378370004 ALU XFP TBD TBD TBD Active
XL-642C CWDM-LH
1531NM
1AB378370005 ALU XFP TBD TBD TBD Active
XL-642C CWDM-LH
1551NM
1AB378370006 ALU XFP TBD TBD TBD Active
XL-642C CWDM-LH
1571NM
1AB378370007 ALU XFP TBD TBD TBD Active
XL-642C CWDM-LH
1591NM
1AB378370008 ALU XFP TBD TBD TBD Active
XL-642C CWDM-LH
1611NM

Features and application notes

• CWDM XFPs are in-service pluggable optical modules
• They provide an STM-64 interface for a 1-port STM-64 module (1P10GSO)
• They provide a duplex LC connector
• They are compliant with 10 Gb Small Form Factor Plug-in (XFP) Multi-Source
Agreement (MSA).

Functional overview
The CWDM XFPs interface with the 1P10GSO through a 2.5 Gb/s data signal line. All
timing, control, and power are provided by the pack in which it is housed (refer to “1-Port
STM-64/OC-192 (1P10GSO) (1×10G sync optical)” (p. C-109) for information).

Figure C-81 Optical XFP module

xfpmodule

Symbols

μm
Micrometer.

Numerics

1:1
A 1:n system where n=1.

1+1, 1p1
Non-expandable protection scheme. Two full-duplex channels: one active, one standby; either can
provide service. Protection switching behavior may be revertive or nonrevertive (normal case).
When active channel fails, traffic is switched to standby channel. In revertive, one channel is the
preferred active; when preferred channel is repaired, traffic switches back to it. In nonrevertive
neither channel is preferred, and switch-back does not occur.

1:n
n main and one standby (or protection). The main channels provide service: If a main channel
fails, the standby channel switches to provide service in place of failed channel. Switching is
revertive, which permits extra traffic to be carried on the standby channel. (For example, when the
main channel is repaired, service will be switched back to it, thus making the standby channel
available to protect a subsequent failure.)

2fblsr
Two-Fiber Bidirectional Line-Switched Ring. See Bidirectional Ring (Bi-Ring)

4fblsr
Four-Fiber Bidirectional Line-Switched Ring. See Bidirectional Ring (Bi-Ring).

802:1e
An IEEE protocol that allows the loading of a file on an NE on a multicast or point-to-point basis.

A ABN
Abnormal alarm.

abt
Abort Output Function.

access identifier (aid)

Specifies the object entity (port or equipment) specified in a TL1 command; used to specify
"object entities" within an NE to which user commands are to be applied. Facilities and signals
are examples of object entities. The term "object entity" is used by Telcordia; it does not mean the
NE is implemented in an object-oriented manner.

ACD
Access Control Domain

ACL
Access Control List

ACM
Administrative Communications Module (module).

ACO
See Alarm Cutoff (ACO).

act
1. Active redundant.
2. Active unit.
3. Active secondary service state; indicates that the entity is capable of being protected and is
currently the active entity.

ACU
Alarm communications unit.

Add-Drop Multiplexer (ADM)

Network elements that provide access to all N, or some subset M of Synchronous Transport
Signal (STS) line signals contained within an OC-N optical channel. (M is a standard hierarchical
level vN.) STSs are added to (inserted) and/or dropped from (extracted) the OC-N signal as it
passes through the ADM. ADMs include linear applications between terminals (referred to as a
Linear ADM or LADM) and ring network applications (referred to as unidirectional ring [uniring]
and bidirectional ring [bi-ring] ADMs). See also Linear Add-Drop Multiplexer (LADM).

addr
Address.

adm
See Add-Drop Multiplexer (ADM).

administrator
A user who has access to all security, system, and database maintenance functions in addition to
standard user capabilities.

ADR
Add-Drop Ring.

AGC
Automatic Gain Control.

AIC
Application Identification Channel. Identifies DS3 frame application (C-bit=1, W23=alternate 0s
and 1s).

AID
See Access Identifier (AID).

AINS
Automatic In-Service.

AINSTH
Automatic In-Service Threshold

AIS
See Alarm Indication Signal (AIS).

AISL
Alarm Indication Signal, Line. See Alarm Indication Signal (AIS).

AISS
AIS Second.

Alarm (ALM)
Binary visual or audible indication of trouble, significant number of irregularities, or failure;
signifies a malfunction or abnormality within the communications equipment; usually classified
as minor, major, or critical.

Alarm Cutoff (ACO)

An ACO silences an office alarm.

Alarm Indication
Indication of upstream transmission span failure. In a network of tandem maintenance spans,
service-affecting failures may occur, which disrupt normal signals and cause the generation of
maintenance alarms.

Alarm Indication Signal (AIS)

Alarm Log
Record of recent alarm events logged for a particular Network Element (NE).

Alarm/Condition Codes*
1. Critical (CR) or (CRI).
2. In service (IS).
3. Maintenance (MAINT) or (MT).
4. Major (MAJ) or (MJ)*.
5. Manual control (ManCont).
6. Manual operation (MAN).
7. Memory administration (MA)*.
8. Minor (MN) or (MIN)*.
9. Out of Service (OOS).
* Also referred to as Severity level or Notification Code.

ALM
See Alarm (ALM).

ALS
Automatic Laser Shutdown.

ALSP
AIS or LOP-Path Second.

Alternate Mark Inversion (AMI)

1. Line coding format in T-1 transmission systems, whereby successive ones (marks) are
alternately inverted (sent with polarity opposite that of the preceding mark).
2. A line code that uses a ternary signal to convey binary digits; successive binary ones are
represented by signal elements normally of alternating, positive/negative polarity but equal in
amplitude, and in which binary zeros are represented by signal elements with zero amplitude
(an AT&T definition).

American National Standards Institute (ANSI)

A standards-setting, non-government organization that develops and publishes standards for
transmission codes, protocols, and high-speed languages for "voluntary" use in the United States.

AMU
Air Movement Unit

ANSI
See American National Standards Institute (ANSI).

AOD
Automatic Offline Diagnostics.

APC
See Angle Polished Connector (APC)

API
Application Programming Interface

Application-Specific Integrated Circuit (ASIC)

A chip built for a specific application and used by manufacturers to consolidate many chips into a
single package, reducing system board size and power consumption. Many video boards and
modems use ASICs. ASICs span Programmable Array Logic (PAL) devices, Electrically
Programmable Logic Devices (ELPDs), Field-Programmable Gate Arrays (PPGAs), standard
cell-based devices, and full custom-designed Integrated Circuits (ICs).

APS
1. Automatic Protection Switching. See Protection Switching (PS).
2. Administrative Processing System.

APSD
Automatic Power Shutdown.

APSI
Automatic Protection Switching Inhibit. See also Protection Switching (PS).

ASIC
See Application-Specific Integrated Circuit (ASIC).

Asynchronous mode
Bytes are sent without clocking information. Each byte is identified by a start bit and terminated
by one or more stop bits.

Asynchronous signal
A digital signal in which there is no common clock. Timing must be recovered from information
sent within signal.

ATAG
Autonomous Message Tag; an automatically generated tag for autonomous reports.

B b/s
See Bits per Second (b/s).

B3ZS
1. Bipolar with 3 Zero Substitution. The line code used in DS3 transmission systems. This code
follows the bipolar rule; however, when three consecutive zeroes occur, the three zeroes are
replaced with a unique code that contains bipolar violations in a defined manner.
2. Bipolar 3-Zero Substitution (DS3/STS1). See also Bipolar Signal.

B8ZS
Bipolar 8-Zero Substitution (DS1). See Bipolar Signal.

BER
See Bit Error Rate (or Ratio) (BER).

BERP
Bit Error Ratio, Path. See Bit Error Rate (or Ratio) (BER).

Bidirectional Coupler (optical)

A device that combines transmit and receive optical signals within a single fiber.

Bidirectional Ring (Bi-Ring)

A Synchronous Optical Network (SONET) ring network configuration in which traffic between
any two nodes flows in a single path between the two nodes. The other path around the ring is
used for protection purposes, providing high reliability. Bi-rings allow reuse of bandwidth around
the ring (unlike a unidirectional ring) but are technically much more complicated to protect.

Bidirectional Switching
The protection switching scheme in which both paths of the duplex channel are switched to the
protection path when either fails.

BIP
See Bit Interleaved Parity-N (BIP-N).

BIP-N
See Bit Interleaved Parity-N (BIP-N).

Bipolar Signal
1. A 3-level digital signal in which logic 1 bits are pulses (typically RZ) which alternate in
polarity, and logic 0 bits are 0 volts. The resulting waveform has a dc level of 0 volts. Also
referred to as AMI.
2. A signal having two non-zero polarities. It must have two-state or three-state binary coding
scheme; is usually symmetrical with respect to zero amplitude.

Bipolar Violation (BPV)

The presence of two consecutive same-polarity one bits on the T carrier line.

BIPS
Bit Interleaved Parity errors, Section. See Parity Bit Interleaved Parity-N (BIP-N).

Bit
Binary digit; smallest unit of data in a data stream. The amount of information obtained by asking
a yes-or-no question; a computational quantity that can take on one of two values: true and false
or 0 and 1; the smallest unit of storage, sufficient to hold one bit. A bit is set if its value is true or
1, and reset or clear if its value is false or 0. Regarding setting and clearing bits: To toggle or
invert a bit changes it (from 0 to 1 or from 1 to 0).

Bit Error Rate (or Ratio) (BER)

Rate at which errors occur in a digital signal divided by the number of transmitted bits. See also
Severely Errored Seconds (SES) and Signal Fail (SF).

Bit Interleaved Parity-N (BIP-N)

Method of error monitoring. If even parity is used, the transmitting equipment generates an N-bit
code over a specified portion of the first bit of all N-bit sequences in the covered portion of the
signal, and the second bit provides even parity over the second bits of all N-bit sequences within
the specified portion, etc. Even parity is generated by setting the BIP-N bits so that there is an
even number of ones in each of all N-bit sequences including the BIP-N.

BITS
See Building Integrated Timing Supply (BITS).

Bits per Second (b/s)

The rate at which data is sent over some communication line. For example, data rate of a modem
is usually measured in kilobits per second.

BITSSYNC
Output synchronization

BKRST
Backup and Restore

BNC
A coaxial connector type commonly known by abbreviation of manufacturer Bayonet-Neill-
Concelman

BPM
Binary Performance Monitoring

BPV
See Bipolar Violation (BPV).

BRDG
Multipoint Data Bridge

Buffer
A temporary storage device that compensates for the difference between data transmission speeds
when transferring data from one device to another

Building Integrated Timing Supply (BITS)

In North America, the clocks that provide and distribute timing to a wire line network lower
levels; known in the rest of the world as Synchronization Supply Unit (SSU).

Byte
A group of eight bits; also called an octet.
...................................................................................................................................................................................................................................

C Card Presence Indicator (CPI)

Indicates presence or absence of a module; provides an interrupt to the shelf processor through the
Serial Communications Interface (SCI) for modules that have a microcontroller; enables shelf
processors to detect removal and/or insertion of any module (or circuit pack) in the shelf. See also
Serial Communications Interface (SCI).

CB
Circuit Breaker (also CKB)

CBIT
Parity monitoring. Select CBIT monitoring when operating with equipment that generates CBIT
parity to monitor signal performance.

CCT
Cross-Connect Type

CDU
Clock Distribution Unit (module)

Central Office (CO)

CEPT
European Conference of Postal Telecommunication

CEV
See Controlled Environmental Vault (CEV).

CFA
Carrier Failure Alarm

CGI
Control and General Interface

Checksum
The sum of a group of data items used for error checking. Checksum is computed by the sending
computer based upon an algorithm that counts the bits going out in a packet. The check digit is
then sent to the other end as the packet tail (or trailer). As the packet is being received, the
receiving computer goes through the same algorithm. If the receiving computer goes through the
same algorithm, and if the check digit it comes up with is the same as the one received, all is well.
Otherwise, it requests the packet be sent again.

CID
1. Calling address Identification
2. Communications Interface Device
3. Connect Identification Device
4. Connection Identifier
5. Craft Interface Device

Circuit Pack
Representation of equipment that can be inserted or assigned to a slot within a shelf

CIT
1. Craft Interface Terminal (also known as user interface terminal)
2. Customer Interface Terminal

CLEI code
Common Language Equipment Identification code (assigned by Telcordia).

CLFI
Common Language Facility Identifier

CLI
Command Line Interface

CLK
Clock

CLLI
Common Language Location Identifier. Indicates the location of circuit packs at a network
element.

CMI
Coded Mark Inversion

CMOS
Complementary Metal-Oxide Semiconductor. High-speed, low-power solid state component.

CO
See Central Office (CO).

COA
Craft Orderwire and Alarms

Code Violation
Violation of a coding rule; for example, the Alternate Mark Inversion (AMI) code is corrupted by
a Bipolar Violation (BPV).

Coding Violation (CV)

1. A violation in the coding of a signal over a digital circuit; the count of BIT-8 errors. See also
Code Violation.
2. Checksum Value. See also Checksum.

Command Language
A set of procedural operators with a related syntax to indicate the functions to be performed by an
operating system.

Commands
Short-term maintenance controls such as loopback and manual switch.

Concatenated Synchronous Transport Signal Level N (STS-Nc)

An STS-N Line layer signal in which the STS envelope capacities from the N STS1s have been
combined to carry an STS-Nc synchronous payload envelope (SPE), which must be transported as
a single entity, not as several separate signals.

Concatenation
A Synchronous Optical Network/Synchronous Digital Hierarchy (SONET/SDH) mechanism for
allocating contiguous bandwidth for transport of a payload greater than Synchronous Transport
Signal Level 1 (STS-1) (the electrical equivalent Optical Carrier Level 1 [OC-1], 51.84 Mb/s; T-3
plus Synchronous Optical Network (SONET) overhead). By using concatenation pointers,
multiple OC-1s can be linked end-to-end to provide contiguous bandwidth. The same approach is
used in higher SONET OC levels. Concatenation applications include bandwidth-intensive video
and high-speed data. See also Synchronous Optical Network (SONET) and Synchronous Digital
Hierarchy (SDH).

Condition Type
Reported fault or event type

Configured size
System configuration size as defined in database

Configuring
The act of defining the features to be contained on a module, shelf, or system.

Controlled Environmental Vault (CEV)

An underground room that houses electronic and/or optical equipment under controlled
temperature and humidity.

CORBA
Common Object Request Broker Architecture

Correlation Tag (CTAG)

All commands issued to the network element using TL1 are given a correlation tag; response to
the command has the same correlation tag.

CPC
See Communication Processor Card (CPC).
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CPI
1. See Card Presence Indicator (CPI).
2. Common Part Interface.

CPU
Central Processing Unit (module)

CR
1. Critical. See also Alarm/Condition Codes.
2. Change Request

CRC
See Cyclic Redundancy Check (CRC).

CRG
Clock Reference Generator

CRI
Critical alarm. See also Alarm/Condition Codes.

Cross-Connect
Connection point for DSX transmit/receive signals with defined characteristics.

CRS
Cross-connect.

CRU
Clock Reference Unit

CT
Craft Terminal.

ctag
See correlation tag (ctag).

CV
See Coding Violation (CV).

CVL
Coding Violation count, Line. See Coding Violation (CV).
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Cyclic Redundancy Check (CRC)

A number derived from a block of data and stored or transmitted with the data to detect any errors
in transmission; similar to a checksum, but more complicated. A CRC is often calculated by
adding words or bytes of the data. The receiving card recalculates the CRC from the data received
and compares it to the value originally transmitted; if the values are different, it indicates a
transmission error. The CRC is called redundant because it adds no significant information to the
transmission itself.

D Data Communications Channel (DCC)

Synchronous Optical Network (SONET) overhead reserved for communication between network
elements. The channel transports signals from one data processing device location to another data
processing device location.

Data Communications Equipment (DCE)

The devices and connections of a communications network that connect the communication
circuit between data source and destination (the Data Terminal Equipment [DTE]). A modem is
the most common DCE. Before data can be transmitted over a modem, the Data Terminal Ready
(DTR) signal must be active. DTR tells the DCE that the DTE is ready to transmit and receive.
DCE and DTE are usually connected by an RS-232 serial line. It is necessary to distinguish these
two devices because their connectors must be wired differently if a "straight-through" cable (pin 1
to pin 1, pin 2 to pin 2, etc.) is used. DCE should have a female connector and should transmit on
pin two and receive on pin three. Many modems are "DTE" according to the original standard.

Data Link (DL)

A Data Link Control Identifier (DLCI) is a channel number is attached to data frames to tell the
network how to route the data.

Data Terminal Equipment (DTE)

A device acting as the source and/or destination of data and controlling the communication
channel; includes terminals, computers, protocol converters, and multiplexers; usually connected
by means of an RS-232 serial line to Data Communication Equipment (DCE), typically a modem.
It is necessary to distinguish these two device types because their connectors must be wired
differently if a "straight-through" cable (pin 1 to pin 1, pin 2 to pin 2 etc.) is used.

dB
See Decibel (dB).

DB
Database

DC
Drop-and-Continue

DCE
1. See Data Communication Equipment (DCE).
2. Data Circuit-terminating Equipment

DCF
Dispersion Compensation Fiber

DCM
Dispersion Compensation Module

DCN
Data Communications Network

DCS
Digital Cross-Connect System

DDM
Digital Diagnostics Monitoring

Decibel (dBm)
A logarithmic expression of the ratio of a given power level relative to 1 milliwatt.

Demux
Demultiplex (-er, -ing).

DEMUX
Demultiplex direction, the tributary output signal, arriving on the optical carrier and leaving
through the tributary (electrical) outbound data stream.

Dense Wavelength Division Multiplex (DWDM)

A high-speed version of Wave Division Multiplex (WDM); increases capacity of Synchronous
Optical Network (SONET) fiber-optic transmission systems through the multiplexing of multiple
wavelengths of light; uses optical channel spacing on the order of 1.6 nm (200 GHz) or better and
is compatible with the International Telecommunications Union (ITU) channel plan.

DHCP
Dynamic Host Configuration Protocol

Direct Entry
Function that enables users to interact with a network element in TL1 form.

Dispersion
Dispersion is the process whereby optical pulses are widened as they travel along an optical fiber.
It is caused by the different wavelength components of a light signal of finite spectral width
traveling down the fiber at different velocities. The effect is a pulse at the terminating end of a
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DL
See Data Link (DL)

DLP
Detail Level Procedure

DMAC
1. Direct Memory Access Control
2. Direct Memory Access Controller

DNS
Domain Naming System. Used in the Internet for translating names of network nodes into
addresses.

Domain
According to Management Information System (MIS) use, domain is the part of a computer
network in which data processing resources are under common control. In Microsoft™
networking, a domain is a collection of computers sharing a common domain database and
security policy that is stored on a Windows NT™ server domain controller. Each domain has a
unique name.

DPLL
Digital Phase-Locked Loop

dri
Dual Ring Interconnect

Drop
Individual connections (sometimes called nodes) on a multipoint (also called multidrop) circuit.

Drop Side Signal

A traffic path connecting to the tributary side of the network element; path can be electrical (such
as DS3 or STS1) or optical (such as OC3 or OC12) and can include Synchronous Optical
Network (SONET) overhead information/access. Specific capabilities and format are product and
feature dependent.

DS0 Path-Terminating Equipment (DS0 PTE)

Network elements that multiplex/demultiplex the DS0 channels. DS0 PTEs interpret and either
modify or create the DS0 signaling information necessary to transport the DS0 channels.

DS0, DS-0
Digital Signal, level 0. a DS0 is 64,000 bits per second (b/s) (64 kilobits), equal to one voice
conversation digitized under Pulse Code Modulation (PCM). Twenty-four DS0s (24 64 kb/s)

DS1
Digital Signal level 1 (1.544 Mb/s). Can contain 24 DS0s.

DS3
Digital Signal level 3 (44.736 Mb/s). Can contain 28 DS01s.

DSP
1. Digital Signal Parameter
2. Digital Signal Processing
3. Domain-Specific Port

DSX
Digital signal cross-connect.

DSx
Digital Signal of an unspecified rate

DSX-1
Digital Signal, level 1 cross-connect

DSX-3
Digital Signal cross-connect point for equipment that generates or uses DS3 signals. This point
has defined waveshapes and voltage levels, in accordance with American National Standard
T1.102.

DTE
See Data Terminal Equipment (DTE).

DWDM
See Dense Wavelength Division Multiplex (DWDM).

DX
Duplex configuration. See Duplex (DX).

E EB
Errored Blocks.

EBC
Errored Block Count

EC
Electrical Container

EDFA
See Erbium-Doped Fiber Amplifier

EEPROM
Electronically Erasable Programmable Read-Only Memory

EIA
Electronic Industries Alliance. A partnership of electronic and high-tech associates and companies
whose mission is to promote the marketing development and competitiveness of the U.S.
high-tech industry through domestic and international policy efforts.

EMA
Element Management Application

Embedded Facility
A lower level (for example, DS1) digital signal transported in a higher level signal. Examples are
a DS1 signal embedded in a DS3, or a DS3 embedded in an STS-1 facility.

EML
1. Element Management Layer
2. Equipment Management Layer

EMS
Element Management System

EOC
Embedded Operations Channel

EOS
Ethernet over SONET

EPROM
Erasable Programmable Read-Only Memory

Equipment (EQPT)
Electronic or mechanical devices at network nodes where end users are connected to
communications network

Erbium-Doped Fiber Amplifier (EDFA)

The dominant method for signal amplification in long-haul lightwave transmission systems.
EDFAs differ from the normal method regenerative or electro-optic repeaters in that light does not
have to be converted to an electrical signal, amplified, then converted back to light. EDFAs are
not frequency dependent, so they allow bandwidth upgrades (within) limits without replacing the
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Errored Second (ES)

A second during which a Coding Violation (CV) occurs.

ES
See Errored Second (ES).

ESD
Electrostatic-Sensitive Device. A circuit component, such as CMOS integrated circuit, that is
prone to damage from static electricity. See also ESS.

ESF
1. Extended Superframe format. DS1 signal framing format consisting of 24 frames. Each frame
contains a payload of 24 channels plus 1 overhead bit.
2. See also Extended Superframe (ESF).

ESL
Errored Second, Line. See Errored Second (ES)

ESP
Errored Second, Path. See Errored Second (ES)

ESS
1. Electrostatic-Sensitive Device. A circuit component, such as CMOS integrated circuit, that is
prone to damage from static electricity. Also ESS.
2. Errored Second, Section. See Errored Second (ES)

ETSI
European Telecommunication Standards Institute

Extended Superframe (ESF)

One of two possible framing patterns for a DS1 signal. ESF has an extra channel that can pass
synchronization messages; the Superframe (SF) cannot.

F FBE
Frame Bit Error. An error on an incoming DS3 signal detected and reported by the performance
monitor.

FC
Failure Count

FC/PC
A specific type of fiber-optic cable connector.

FCP
Failed Count-Path

FDDI
Fiber Distributed Data Interface

FDL
1. Facility Data Link
2. See Frame Data Link (FDL).

FE
1. Far-End
2. Fast Ethernet (10/100 Mbps.)

FEAC
Far-End Alarm and Control. Channel bit used in C-bit formatting for status and control
communications.

FEBE
Far-End Block Error. Channel bit used in C-bit formatting for performance monitoring event.

FEC
Forward Error Correction

FERF
Far-End Receive Failure

FES
Frame Errored Seconds

FFP
Fast Facility Protection. Refers to line facility groups. It also refers to path facility groups which
constitute preferred or alternate paths.

FI
Fault Isolation

Fiber Optic Cable

The core of the fiber optic cable is made of very pure glass; it is surrounded by four protective
layers, given here from the core out: cladding, buffer, dielectric strength member, and the
polyvinyl chloride (PVC) subunit jacket.

Field-Programmable Gate Array (FPGA)

Used on some cards to modify hardware operation through software, rather than physically

FLC
First Level Controller

FLT
Fault

FM
Fault Manager

Format
Refers to basic structure and arrangement or order of elements in a command or data.

FPGA
1. Fused Programmable Gate Array
2. See also Field-Programmable Gate Array (FPGA).

Frame Data Link (FDL)

A message channel in the overhead of a DS1 Extended Superframe (ESF) signal that can relay
clock-quality information.

FTP
File Transfer Protocol. An IP-based file transfer protocol.

FTS
Fiber Transmission System

Full Duplex
1. Independent, simultaneous communication in both directions between two locations.
2. Standard 2-way connection.
...................................................................................................................................................................................................................................

G Gateway Communications Functions

Functions to facilitate operations communications between two communicating entities across
dissimilar subnetworks. Examples include concentration, message routing and relaying (Network
Layer), and application layer protocol conversion and/or message translation. See also Mediation
Functions.

Gb, Gb/s
Gigabits, Gigabits per second

GbE
See Gigabit Ethernet (GigE)

GFP
Generic Framing Procedure. Protocol for mapping packet data into an octet-synchronous transport
such as SONET.

Gigabit Ethernet (GigE)

Input conditioning performed to map Ethernet frames into SONET payload structures.

GigE
See Gigabit Ethernet (GigE)

GND (or Gnd)

Ground

GNE
Gateway Network Element

GOS
Grade of Service

Graphical User Interface (GUI)

This interface supports applications that consist of a series of rectangular presentation regions
called windows. Each window displays another application.

GRD
General Release Document

Grooming
The process of moving traffic from one point to another.

Growth
Increasing system port capacity

GUI
See Graphical User Interface (GUI).

H Half duplex
Standard 1-way connection

Half-Duplex Transmission
A circuit designed for data transmission in both directions, but not at the same time. Telex is an
example of a half-duplex system, as is speaking on with most speaker-phones. Compare with

Head End
The point where the line overhead is inserted. (Tail end describes the point where the line
overhead is terminated.) A central control device required within some Local Area Network/Area
Network (LAN/MAN) systems to provide such centralized functions as remodulation, retiming,
message accountability, contention control, diagnostic control, and access.

HLDOVER
See Holdover.

HO
High-Order, generally referred to as STS-1 level virtually concatenated signals.

Holdover
A mode in which an oscillator that was previously tracking a reference attempts to maintain the
last-known frequency instead of continuing to track. Transition to Holdover could occur for a
variety of reasons, including failure on a reference or a manual switch.

HS
High Speed

Hz
Hertz

I I/O
See Input/Output (I/O).

IBFEC
In-Band Forward Error Correction

IC
Integrated Circuit

ID
Identification

IEEE
Institute of Electrical and Electronics Engineers

IGFET
Insulated Gate Field Effect Transistors

IL
Insertion Loss

IMP
Integrated Multi-protocol

In Service (IS)
An equipment module is available for use by the system. (It may be online or offline.) An
equipped module is either IS or Out of Service (OOS).

In-Service Growth
A feature that enables service providers to install one optical channel initially, then upgrade to
additional optical channels or a mix of data rates. Additional modules may be added one at a time
while the system is in service.

Input/Output (I/O)
Two of the three computer functions; the third is processing. I/O describes the interrelated tasks of
providing information to the computer and providing the results of processing to the user. I/O
devices include keyboards (input) and printers (output). A disk drive is an input and an output
device because it provides information to the computer and receives information from the
computer.

Interleave
1. Transmission of pulses from two or more digital sources in time-division sequence over a
single path.
2. A data communication technique, used in conjunction with error-correcting codes, to reduce
the number of undetected error bursts. In the interleaving process code symbols are reordered
before transmission so that any two successive code symbols are separated by |-1 (| is called
the degree of interleaving). Upon reception, interleaved code symbols are reordered into their
original sequence, effectively spreading or randomizing errors (in time) to enable more
complete correction by a random error-correcting code.
3. Refers to the way a computer writes to and reads from a hard disk.

Intermediate Reach (IR)

Refers to optical sections from a few kilometers (km) to approximately 15 km.

Intermediate System (IS)

Refers to a system that originates and terminates traffic, and forwards traffic to other systems; an
Open Systems Interconnection (OSI) term.

Intermediate System to Intermediate System (IS-IS)

An Open Systems Interconnection (OSI) link-state hierarchical routing protocol, based on
DECnet Phase V routing, whereby intermediate systems (routers) exchange routing information
based on a single metric to determine network topology.

Internet Protocol (IP)

Part of the Transmission Control Protocol/Internet Protocol (TCP/IP) family of protocols
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Internet Protocol (IP) Address

A unique, 32-bit number for a specific transmission control protocol/internet protocol (TCP/IP)
host on the Internet; normally printed in dotted decimal form (for example, 128.126.50.224).
When a domain is assigned a group of numbers by the Internet central registry, it can house one or
several domains and/or hosts. Some IP addresses are reserved for broadcasts in respective
domains. See also Domain.

IOC
Input/Output Conditioner

IOO
OS-OS Interface

IP
1. In Progress
2. See Internet Protocol (IP).

IPCP
Internet Protocol Control Protocol

IR
See Intermediate Reach (IR).

IS
1. See In Service (IS).
2. See Intermediate System (IS).

IS-ANR
In Service-Abnormal

IS-IS
See Intermediate System to Intermediate System (IS-IS).

IS-NR
In Service-Normal

ISLTD
Isolated, fully

ISO
International Standards Organization

ITU
International Telecommunications Union (replaces CCITT)

ITU-T
International Telecommunications Union Telecommunications

IXL
Index Task List

J JFET
Junction Field Effect Transistors

Jitter
Relative phase change between data time slots and clock (timing) pulses. Results in bit errors and,
in voice circuits, noise in telephone circuits. Jitter is cumulative and is primary limitation to
maximum system length, including terminals and repeaters, of a digital transmission system.

K KAM
Keep Alive Message

KAS
Keep Alive Signal

kb/s
Kilobits per second

kHz
KiloHertz

km
Kilometers

L L1
Level 1

L2
1. Level 1 (controller).
2. Layer 2 (Ethernet switching).

LAN
Local Area Network

LAPB
Line Access Procedure, Balanced

LAPD
Link Access Procedure, D-channel

LAPS
Link Access Procedure for SDH

LBO
See Line Buildout (LBO).

LC
A specific type of fiber-optic cable connector.

LCAS
Link Capacity Adjustment Scheme

LCI
Logical Channel Identifier

LCN
1. Local Communications Network, a Local Area Network (LAN).
2. Logical Channel Number.

LCP
Link Control Protocol

LD
Line Driver

LDB
Loop Detection Buffer

LDCC
Line Data Communications Channel

LEC
Local Exchange Carrier

LED
Light-Emitting Diode
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Limited mode
System operating mode that allows access to a limited number of commands. It is primarily used
for database restoration.

Line
A transmission medium, together with the associated Line-Terminating Equipment (LTE),
required to provide the means of transporting information between two consecutive
line-terminating network elements: One originates the line signal, and the other terminates the line
signal. In SONET, the line envelope is a subset of the section envelope.

Line Alarm Indication Signal (AIS) Code

A code generated by Section-Terminating Equipment (STE) upon loss of input signal, loss of
frame, or equipment failure. Line AIS signal maintains operation of downstream regenerators and
prevents generation of unnecessary alarms. At the same time, data and orderwire communication
is retained between the regenerators and downstream Line-Terminating Equipment (LTE).

Line Buildout (LBO)

Equalization pad or artificial line network.

Line Group
Group of Synchronous Optical Network (SONET) signals at an Add/Drop Multiplexer (ADM)
connection.

Line Side Signal

A signal suitable for transmission over outside plant facilities or across an administrative
boundary.

Line-Terminating Equipment (LTE)

Network Elements (NEs) that originate and/or terminate line (OC-N) signals; LTE includes NEs
that originate and/or terminate line signals. LTEs originate, access, modify, and/or terminate the
transport overhead.

Linear Add-Drop Multiplexer (LADM)

Network element in a linear network that provides access to all N, or some subset M (M is a
standard hierarchical level vN), of the STS line signals contained within an OC-N optical channel.
STS signals are added to (inserted) and/or dropped from (extracted) the OC-N signal as it passes
through Add-Drop Multiplexer (ADM).

List Box
Displays a list of choices in the application window of the 1301 Network Manager (NM). A scroll
bar is provided if the box contains more choices than the box can hold. The list box can be a
single- or multiple-selection type.

LMF
Loss of Multiframe
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LOA
Loss of Activity

LOC
Loss of Clock

Location
The physical location (site) of a network device.

LOF
Loss of Frame

Long Reach (LR)

Refers to optical sections of approximately 25 kilometers or more in length and is applicable to all
Synchronous Optical Network (SONET) rates. Compare with Short Reach (SR).

Loopback
A maintenance condition that redirects normal input to output, or vice versa; consists of a
diagnostic test in which the transmitted signal is returned to the sending device after passing
through a data communications link or network, thereby allowing a technician (or built-in
diagnostic circuit) to compare the returned signal with the transmitted signal and determine what
is wrong. Loopbacks are often done by excluding one piece of equipment after another,
eliminating non-problematic equipment to isolate a problem.

LOP
Loss of Pointer

LOS
Loss of Signal

LPF
Low-Pass Filter

LPR
Light Power Received

LPRN
See Light Power Received Normalized (LPRN)

LPT
Light Power Transmitted

LPTA
Line/Path Terminating ASIC

LTE
1. Line-Terminating Element
2. See Line-Terminating Equipment (LTE).
3. Line-terminating equipment (Synchronous Optical Network [SONET]). Asynchronous
Transfer Mode (ATM) equipment, terminating a communications facility using a SONET
Line Transmission Convergence (TC) layer (usually reserved for end user or Local Area
Network [LAN] equipment); does not implement some of the maintenance functions used in
long-haul networks such as termination of path, line, and section overhead.

M MAC
1. Memory Arbitration Circuit
2. Media Access Control. A standard data link layer address that is required for every port of
device that connects to a LAN.

MAJ
Major

MAN
Manual operation

MAU
Medium Attachment Unit

MB
1. Management Information Base
2. MegaByte(s)

Mb/s
Megabits per second

MD
Mediation Device

MDL
Maintenance Data Link. Three bits used as a 28.2 kb/s terminal-to-terminal link identifier. Part of
the overhead in the C-bit parity format.

Mediation Functions
Usually consist of gateway communications functions, but can include information processing
functions. When the two functions are combined, they are often contained in a stand-alone
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MHz
MegaHertz

MIB
Management Information Base

MIC
1. Module Interface Circuit
2. Module Interface Controller

MIN
Minor

MJ
Major

MN
Minor

Modem
Modulator/Demodulator

Modulator/Demodulator (Modem)
A communications device that enables the computer to transmit information over a telephone line.

Module
An independent assembly of electronic components with some distinct function. A module might
contain one, two, three, or more cards. In the past, there was nearly always one card in each
module; therefore, "card" might be used when "module" was actually meant. Even in the case of a
module that contains only one card, the module includes a front panel, ejector handles, etc. that
are mounted on the card. See also Card and Circuit Packs.

MOP
Method of Procedure

MPU
Microprocessor Unit

MRU
Maximum Receive Unit

MTBF
Mean Time Between Failures

MTX
Matrix module

Multiplex (MUX, Mx)

Multiplex direction, the tributary input signal arriving on tributary interface (electrical) and being
multiplexed up onto optical signal, then leaving system. Combining several signals for
transmission on some shared medium; signals are combined at the transmitter by a multiplexer
(MUX) and split up at the receiver by a demultiplexer (DEMUX). The communications channel
can be shared between the independent signals in one of several different ways: Time Division
Multiplexing (TDM), Frequency Division Multiplexing (FDM), and Code Division Multiplexing
(CDM). If the inputs take turns to use the output channel (TDM), the output bandwidth need be
no greater than the maximum bandwidth of any input. If many inputs are active simultaneously,
the output bandwidth must be at least as great as the total bandwidth of all simultaneously active
inputs. In this case the multiplexer is also known as a concentrator.

MUX
See Multiplex (MUX, Mx).

N NA
1. Not Alarmed or No Alarm
2. Not Applicable
3. Not Available, in reference to performance monitoring parameter validity flags.

NAD
Network Access Domain

NAS
North American Standard

NE
1. Near End. See also NEND.
2. Network Element. Can be a switching NE or a transport NE. Cross-connects are transport
NEs.
3. See also Network Element (NE).

NE Configuration
The physical components within a Network Element (NE).

NE Type
The model number of a specific Network Element (NE).

NEC
National Electric Code

NEL
Network Element Layer

NEND
Near End

Network
Database representation of resources allocated to a secondary user. Network may also refer to
physical elements of a communications system; equipment, transmission facilities, and end users.

Network element
A generic piece of equipment (such as a digital cross-connect) that represents a single function in
the system

Network Element (NE)

Configurable transmission controller used as a multiplexer, access node, or Add/Drop multiplexer.

Network entity
Any of the physical devices that make up the communications network

Network facility
Equipment used to connect individual NEs

Network resource
All physical devices, including end equipment, transmission facilities, and end users

Network Service Access Point (NSAP)

The point at which the Open Systems Interconnection (OSI) network service is made available to
a transport entity. NSAPs are identified by OSI network addresses. The NSAP is a generic
standard for a network address consisting of 20 octets. ATM has specified E.164 for public
network addressing and the NSAP address structure for private network addresses.

NLAN
Network Local Area Network

nm
Nanometer

NM
Network Management or Network Manager

NOC
Network Operation Center

Node
A point where transmission lines originate, interconnect, switch, or terminate. Generally consists
of one or more pieces of equipment and is connected to other nodes via network facilities.
Typically provides switching capabilities, multiplexing capabilities, end-point termination or
origination, or other similar networking services. A point in the network where a network element
is physically located (such as a digital cross-connect system)

Nonblocking
A feature that allows any input port to be connected to any output port. Nonblocking switch paths
ensure that a connection can always be established between any two idle ports without
rearranging existing connections.

Nonregenerative
A type of optical amplification whereby the optical signal is amplified without being converted to
an electrical signal and then fed directly to the transmission line (as opposed to regenerative
amplification where the optical signal is first converted into an electrical signal, amplified,
converted back into an optical signal, and then fed to the transmission line).

Nonrevertive
As applied to protection switching, means that service is not automatically reestablished to
previously active device when failure is corrected.

NORM
NORMal

North American AIS

The accepted Alarm Indication Signal (AIS) for use in North American Network, consisting of
alternating 1010 pattern with valid framing and fixed overhead bit content. (Also called Standard
AIS.)

Not Alarmed (NA)

A condition noted on the alarm manager screen, but does not cause an alarm situation to be
recorded.

Not Reported (NR)

A condition that is not reported on any screen.

NR
1. Normal
2. Not Reported
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NSA
Nonservice-Affecting

NSAP
See Network Service Access Point (NSAP).

NTE
Network Terminal Equipment

NTP
Network Time Protocol
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O O-LAN
Office LAN

O-SNCP
Optical Sub-Network Connection Protection

OA
Optical Amplifier

OADM
Optical Add/Drop Multiplexer

OAM&P
Operations, Administration, Maintenance, and Provisioning

OAS
Optical Amplifier Section (per ITU-T G.681)

OC
Optical Carrier

OC-N
Optical Carrier, level N (for high-speed drops)

OC1
Optical Carrier, level 1 (51.84 Mb/s)

OC12
Optical Carrier, level 12 (622.08 Mb/s)

OC12c
Optical Carrier, level 12 (622.08 Mb/s) Concatenated

OC3
Optical Carrier, level 3 (155.52 Mb/s)

OC3c
Optical Carrier, level 3 (155.52 Mb/s) Concatenated

OC48
Optical Carrier, level 48 (2.488 Gb/s)

OC48c
Optical Carrier, level 48 (2.488 Gb/s) Concatenated

OCM
Optical Transceiver

OEM
Original Equipment Manufacturer

OFA
Optical Fiber Amplification

OH
OverHead, Synchronous Optical Network (SONET)

OID
Object Identifier

OOBFEC
Out-of-Band Forward Error Correction

OOF
Out of Frame

OOFP
Out of Frame-Path

OOS
See Out of Service (OOS).

OOS-MA-AS
Out-of-Service-Memory administration-Assigned

Open Systems Interconnection (OSI)

The only internationally accepted framework of standards for communication between different
systems made by different vendors. The primary intent for OSI is to create an open systems
networking environment in which any vendor computer system, connected to any network, can
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Operations Support System (OSS)

Methods and procedures (mechanized or not) that directly support the telecommunications
infrastructure daily operation. The average Local Exchange Carrier (LEC) has hundreds of OSSs,
including automated systems supporting order negotiation, order processing, line assignment, line
testing, and billing.

Operator Action
An operator-initiated action that interferes with the normal mechanism within the product for
response to detected conditions, such as forced switching, inhibited switching, or taking a
working module out of service.

OPS
Operations Processing System

Optical Carrier Level 1 (OC-1)

Optical signal that results from an optical conversion of an electrical STS-1 signal; this signal
forms the basis of the interface.

Optical Carrier Level 12 (OC-12)

Optical signal produced by converting an STS-12 from an electrical signal to an optical signal.

Optical Carrier Level 192 (OC-192)

Optical signal produced by converting an STS-192 from an electrical signal to an optical signal.

Optical Carrier Level 3 (OC-3)

Optical signal produced by converting an STS-3 from an electrical signal to an optical signal.

Optical Carrier Level 48 (OC-48)

Optical signal produced by converting an STS-48 from an electrical signal to an optical signal.

Optical Carrier Level 768 (OC-768)

Optical signal produced by converting an STS-768 from an electrical signal to an optical signal.

Optical Carrier Level N (OC-N)

Optical signal resulting from an optical conversion of an electrical STS-N signal.

Optical Modules
Elements of the system that provide the photonic interface for either transmit or receive functions.

Optical Pulse Distortion/Dispersion

The property of an optical fiber that causes optical signals passing through the fiber to be
bandwidth limited. A received light pulse will be wider than that, that was transmitted; the amount
of this distortion increases with the fiber length.

Order Wire, Orderwire (OW)

1. A circuit used by telephone personnel for fixing, installing, and removing phone lines.
2. Equipment and circuit providing a telephone company the means to establish voice contact
between central office and carrier repeater locations.
3. A Synchronous Optical Network/Synchronous Digital Hierarchy (SONET/SDH) term for a
connection request; consists of one octet contained within the Section Overhead (SOH).

OS
1. Operations System (Also called OSS.)
2. Operating System, as in HP-UX, DOS, or Windows 2000

OSC
1. See Oscillator (OSC).
2. Optical Supervisory Channel.

Oscillator (OSC)
1. A device for generating an analog test signal.
2. An electronic circuit that creates a single-frequency signal.

OSDB
Operations System Database

OSI
See Open Systems Interconnection (OSI).

OSL
Output Subscription Level

OSLINK
Operations System LINK has failed (X.25 link)

OSMINE
Operations Systems Modifications for the Integration of Network Elements.

OSNR
Optical Signal-to-Noise Ratio

OSPORT
Operations System Port

OTDR
Optical Time Domain Reflectometer

OTN
Optical Transport Network

OTS
1. Object Transport Service
2. Optical Transmission Section (per ITU-T G.681)
3. Optical Transport System, a dense WDM system (per AT&T RFP)

Out of Service (OOS)

1. A status indication that function is not being performed by a given circuit pack and it can be
removed for maintenance.
2. An equipped module is OOS when unavailable for system use; module may be OOS for
operator action, equipment failure, diagnostic testing, or family of equipment not carrying
traffic. See also SNOS (Status, Not currently Out of Service).
3. Equipment or channel not carrying traffic.
4. Status indicating that traffic is not being processed by a given module and that the module can
be removed for maintenance.
5. Designation for an inactive address or function.

Overhead
Anything that is not traffic in a digital bit stream. Traffic is the payload, or information being
carried by signal. Overhead is that portion of signal that carries information about timing and
maintenance of signal, but does not carry any portion of information originally sent and meant to
be received at the far end.

OW
See Order Wire, Orderwire (OW).

P Packet Switching
A communications paradigm in which packets (messages or fragments of messages) are
individually routed between nodes, with no previously established communication path. Packets
are routed to their destination through the most expedient route (as determined by some routing
algorithm). Not all packets traveling between the same two hosts, even those from a single
message, will necessarily follow the same route. The destination computer reassembles the
packets into their appropriate sequence. Packet switching optimizes available bandwidth use in a
network and minimizes latency. See also X.25.
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Parameter
An element of a command, which further defines the object of the command or provides data
needed for proper command execution. See individual command descriptions.

Parity Check
A process for detecting whether bits of data (parts of characters) have been altered during
transmission of that data. Data are transmitted as a stream of bits with values of one or zero; for
example, each character of data composed of seven bits has another bit added to it. The value of
that bit is chosen so that either the total number of one bits is always even if Even Parity error
correction is to be obeyed, or always odd if Odd Parity correction is chosen.

Path
1. A path at a given bit rate is a logical connection between the point at which a standard frame
format for the signal is assembled and the point at which the standard frame format for the
signal is disassembled.
2. The route a telecommunications signal follows through a circuit or through the air.

Path command
Any valid connect or disconnect command directed to matrix

Path Overhead (POH)

Synchronous Optical Network (SONET) path overhead assigned to and transported with the
payload until payload is demultiplexed; used for functions necessary to transport the payload, for
example, end-to-end network management. These functions include parity check and trace
capability. POH is not implemented in the SONET Line. See also STS Path Overhead (STS
POH).

Payload Pointer
The pointer that indicates the location of the beginning of the Synchronous Payload Envelope
(SPE).

PBIT
Parity monitoring. Select PBIT monitoring to monitor performance on signals other than CBIT
parity. PBIT is corrected at each DS3 level; therefore, it provides only error monitoring from DS3
electrical interface to DS3 interface.

PCM
1. See Pulse Code Modulation (PCM).
2. PCM is also slang for the Sony F1 format, which stores PCM digital audio on videotape.

PCN
Product Change Notification.

PDN
Public Data Network

PDU
Power Distribution Unit.

Performance Monitoring (PM)

Reports and analyzes deviations from defined parameters, detecting any signal degradation that
could lead to a service-affecting failure; refers to actions that monitor signal integrity and quality
(such as counting parity errors in Synchronous Optical Network [SONET] equipment) and
equipment impairments (such as laser degrade). Nominally includes reporting of values recorded
during monitoring and sending them over a digitally multiplexed transmission channel.

Permanent Virtual Circuit (PVC)

A virtual circuit that is permanently established, saving the time associated with circuit
establishment and tear-down.

PES
Parity Errored Second

Phase-Locked Loop (PLL)

A circuit containing a voltage-controlled oscillator whose phase or frequency can be "steered" to
keep it in sync with a reference source. A PLL circuit is generally used to lock onto and
"up-convert" the frequency of a stable source.

PIB
Product Information Bulletin.

PID
1. Password Identifier
2. Path Identification
3. Product Identifier

Pigtail
A length of optical fiber with one end terminated at a connector and the other end attached to a
light source or detector. The fiber couples light from a source to a connectorized fiber cable or
from a fiber cable to a detector.

PIN
1. Positive Intrinsic Negative. Type of photodetector used to sense lightwave energy then to
convert it to electrical signals.
2. A type of semiconductor diode that has a 3-layer structure composed of P-type, intrinsic type,
and N-type material.

PJN
Pointer Justification Negative

PJP
Pointer Justification Positive

PLD
Programmable Logic Device

PLL
Phase-Locked Loop. See Phase-Locked Loop (PLL).

PLM
Payload Mismatch.

PM
See Performance Monitoring (PM).

PMC
Process Monitory and Control

PMD
Polarization Mode Dispersion

PMV
Performance Monitoring Visualization

PNM
Physical Network Manager

POH
See Path Overhead (POH).

Point of Presence (POP)

1. A physical place within a Local Access and Transport Area (LATA) where a long-distance
carrier or a cellular provider interfaces with the network of the Local Exchange Carrier
(LEC), also called the local telephone company.
2. The point at which the LEC terminates subscriber circuits for cellular phone call,
long-distance dial-up phone call, or leased-line communications.
3. A meet point where Internet Service Providers (ISPs) exchange traffic and routes.

Point-to-Point Protocol (PPP)

A communications protocol; the protocol defined in RFC 1661, the Internet standard for
transmitting network layer datagrams (for example, IP packets) over serial point-to-point links.
PPP is designed to operate over asynchronous connections and bit-oriented synchronous systems.
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Polarization Mode Dispersion (PMD)

Identified around 1990, PMD might become a limiting issue in optical span design now that data
rates are going higher (10 Gb/s and 40 Gb/s), and spans are getting longer. PMD is the dispersion
of an optical signal, caused by the different polarization modes of the optical signal traveling
down a fiber at slightly different velocities. The amount of PMD is statistical in nature and varies
randomly with time. PMD is independent of chromatic dispersion, so a span can be PMD-limited
in distance even in the absence of chromatic dispersion. Due to the random nature of the physical
causes of PMD, it is more difficult to be compensated for, as chromatic dispersion, but newer
techniques are being developed. See also Chromatic Dispersion.

POP
See Point of Presence (POP).

Port
1. A physical connection on a network element that has a specified rate and type of physical
attachment; a connection or socket on the computer. Ports are used for connecting devices
(cables, modems, printers, monitors) to a PC, then sending information from the computer to
the devices. Serial ports (COM 1-COM 4) and parallel ports (LPT1, LPT2) are the most
commonly used.
2. An interface point between the system and its external environment. Can be physical, logical,
or both.

PP
Pointer Procesor

ppm
Parts per million

PPP
Point-to-Point Protocol. See Point-to-Point Protocol (PPP).

PPS
Path Protection Switching. See Protection Switching (PS).

PRBS
Pseudo Random Binary Sequence

PRC
Primary Reference Clock

PRI
1. Primary (alarm)
2. Protection Release Inhibited
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PROT
PROTection

Protection Channel Access (PCA)

The tributary signals carried by the protection channel when it is offline (i.e., not protecting the
working traffic). It is lower priority and will be dropped in favor of the working traffic in the
event of a working channel failure.

Protection Switch Count (PSC)

The Performance Monitoring (PM) parameter used to count the number of protection switches for
a protection group.

Protection Switching (PS)

The automatic Network Element (NE) function that provides recovery of traffic in the event of a
network or equipment failure. Protection may be an individual NE function (as in unidirectional
linear protection or in a unidirectional ring) or a network function (as in bidirectional linear
protection or in a bidirectional ring).

Protection Switching Duration (PSD)

This parameter measures the total time, in seconds, for which service was removed from a given
(nonprotection) line.

Protection Switching Line, Counts

This parameter measures the number of times service switches from a particular working line to a
protection line.

Protocol
A set of rules that govern the interaction of processes or applications in a system or network

PROV
See Provisioning (PROV).

Proxy
Provides protocol conversion between TL1 commands and Common Management Information
Service Element (CMISE) commands.

PRS
Primary Reference System

ps/nm
Picoseconds per nanometer

PSA
Power Supply Alarm

PSCC
Processor Serial Control Circuit

PSD
Protection Switching Duration

PSN
Packet-Switched Network. See Packet Switching. See also X.25.

PST
Primary State

PSU
Power Supply Unit

PSW
Protect Switch

PTE
Path-Terminating Equipment. See also DS0 Path-Terminating Equipment (DS0 PTE).

Pulse Code Modulation (PCM)

A method by which an audio signal is represented as digital data. Virtually all digital audio
systems use PCM.

PVC
1. Permanent Virtual Channel
2. See Permanent Virtual Circuit (PVC).
3. Permanent Virtual Connection (Asynchronous Transfer Mode [ATM] terminology)
4. Polyvinyl Chloride

PWR
1. Power
2. Power converter

PWR1D5/PWRC1D5
Power Supply

Q QoS
Quality of Service

QRSF
Quasi-Random Signal, Framed

QRSS
Quasi-Random Signal Source. Signals used for testing digital circuits, particularly DS-1 (for
example, T-1) circuits.

QRSU
Quasi-Random Signal, Unframed

QTY
Quantity

R RA
Return Authorization

Rack
An assembly of shelves within a standard set of vertical mounting posts or rails (called rack
channels).

RADM
Ring Add-Drop Multiplexer

RADMAP
Remote Alarm Display Map

RAM
See Random Access Memory (RAM).

Random Access Memory (RAM)

The working memory of the card; memory used for storing data temporarily while working on it,
running application programs, etc. "Random access" means that any RAM area can be accessed
directly and immediately. RAM is called volatile memory; information in RAM will disappear if
the power is switched off before it is saved to disk. RAM is used on all downloadable cards to run
the application loads of the cards.

RCC
Relay Contact-closure Control

RCV
Receive module

RDI
Remote Defect Indication
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Redundancy, Redundant
1. That part of any message that may be eliminated without losing important information.
2. Having one or more "backup" systems available in case of failure of the main system.

Remote Defect Indication-Line (RDI-L)

An indication returned to a transmitting Line-Terminating Equipment (LTE) upon receipt of a line
Alarm Indication Signal (AIS) code or detection of an incoming line failure at the receiving LTE.
(Formerly Line Far-end Receive Failure [FERF].)

Revertive
Service is automatically restored to the primary device after failure is corrected.

RFI
1. Radio Frequency Interference.
2. Remote Failure Indicator.

RFS
Remote File Server

RI
Remote Inventory

Ring
A network where the network nodes are interconnected by means of a circular route that may be
broken at any one point without permanently disrupting traffic. Rings are either unidirectional
(uniring) or bidirectional (bi-ring).

Ring Add-Drop Multiplexer (RADM)

Network element in a ring network that provides access to all N, or some subset M (M is a
standard hierarchical level v N), of the STS line signals contained within an OC-N optical
channel. STS signals are added to (inserted) and/or dropped from (extracted) the OC-N signal as it
passes through the ADM. Ring ADMs may be either unidirectional (uniring) or bidirectional
(bi-ring).

RIP
Routing Information Protocol

Route Diversity
A network configuration that provides two connection paths between two points, each physically
separated from the other except at the terminal end points. This method retains service over one of
the routes if the other route is broken (such as when a cable is cut). A route diversity application
can be built using a ring network or a linear network as a basis.

RS-232
An Electronic Industry Association (EIA) data communications standard using serial binary data
interchange standard applicable to interconnection of Data Terminal Equipment (DTE); the most
common asynchronous serial line standard; the EIA equivalent of ITU-T V.24 and V.28. RS-232
specifies connector gender and pin use, but not their physical type (RS-423 specifies the electrical
signals.); 25-way D-type connectors are common but often only three wires are connected: one
ground (pin seven) and one for data in each direction; other pins are mostly related to hardware
handshaking between sender and receiver and to carrier detection on modems, inoperative
circuits, busy conditions etc. The standard classifies equipment as either Data Communications
Equipment (DCE) or Data Terminal Equipment (DTE).

RS-232C
An Electronic Industry Association (EIA) standard applicable to interconnection of Data Terminal
Equipment (DTE) and Data Communication Equipment (DCE) using serial binary data
interchange.

RSP
Rack Status Panel (module)

RT
Remote Terminal

RTC
Real-Time Clock

RTN
Return

RTU
Remote Test Unit

RX
Receive, receiver

RX+TX
Receiver plus Transceiver

S SA
Service-Affecting

SABM
Set Asynchronous Balanced Mode
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SAN
Storage Area Network

SAS
Severe errored frame/Alarm indication signal (SEF/AIS) Second

SB
Short Band (SB). See also Conventional-Band (C-Band).

SBI
Serial Bus Interface

SBS
Stimulated Brillouin Scattering

SCSI
Small Computer System Interface. A bus that links the optical and hard disks to the processor.

SCU
Stratum Clock Unit

SDH
See Synchronous Digital Hierarchy (SDH).

SDMA
Serial Direct Memory Access

SDTH
Signal Degrade Threshold

SEA
Supported Entity Outage

Section
The portion of a transmission facility (including terminating points) between a terminal network
element and a regenerator or between two regenerators. A terminating point is the point after
signal regeneration, where Performance Monitoring (PM) is or can be done. In Synchronous
Optical Network (SONET), the section envelope encompasses the line envelope. See also
Synchronous Payloads.

Section-Terminating Equipment (STE)

Network elements that terminate the Synchronous Optical Network (SONET) physical and
section layers. STE is either a regenerator or part of a Line-Terminating Equipment (LTE). STEs
interpret and either modify or create the section SONET overhead.

SEFS
Severely Errored Frame Seconds

SEMF
Synchronous Equipment Management Function

Seq
Sequence

Service Condition
A data path can be selected as In Service (IS), which is the normal operational state, or
Out-of-Service (OOS) condition, which disables protection switching and alarm and Performance
Monitoring (PM) functions. An OOS data path may or may not be able to carry test traffic,
depending on system configuration.

SESCP
Severely Errored Seconds-CP-bit Path

SESL
Severely Errored Seconds-Line

SESP
Severely Errored Seconds-Path

Session
1. A logical network connection between two addressable units for the exchange of data.
2. A connection between a user and the Network Element (NE). One user can have multiple
sessions. All provisioning operations, queries, and autonomous reports are transported
between the NE and user through a session.

SETG
Synchronous Equipment Timing Group

SETS
Synchronous Equipment Timing Source

Severely Errored Seconds (SES)

Contains more than N Coding Violations (CVs). The value of N with frame size and bit rate
should be chosen to correspond to a Bit Error Ratio (BER) of approximately 10-3, assuming
errors are randomly distributed. This count may be used to determine problems for particular
types of services and/or as a measure of facility outage duration.

SFP
Small Form Factor Plug-in

SFTP
SSH File Transfer Protocol, sometimes referred to as “Secure FTP”, is the practice of tunnelling
FTP through an SSH connection.

Shelf
Basic rack assembly unit; contains subassemblies (usually circuit packs, also referred to as
modules).

Short Band
The shorter wavelength half of the Erbium-Doped Fiber Amplifier (EDFA) amplification window
that is approximately 1530 nm to 1543 nm.

Short Reach (SR)

A Synchronous Optical Network (SONET) term; refers to optical sections of approximately 2
kilometers or less in length. The sections may be interoffice or intraoffice. Compare with Long
Reach (LR).

SID
1. System Identification. A five-digit number assigned to identify the particular cellular carrier
from whom one is obtaining service; identifies "home" system.
2. System Identifier. An alphanumeric designator that uniquely identifies a particular system or
site within the network.
3. Site Identifier

SID/NSAP
See System Identification/Network Service Access Point (SID/NSAP).

Signal Fail (SF)

1. Also known as Loss of Signal (LOS), detection of a LOS, Loss of Frame (LOF), or Loss of
Pointer (LOP) on the lines or on tributaries (for example, OC12s) connected to the system.
2. Threshold value used to compare calculated Bit Error Rate (or Ratio) (BER) value with SF
threshold. If BER value is less than SF threshold, an Excessive BER (EXBER) condition is
declared. See also Bit Error Rate (or Ratio) (BER).

Simplex (SX)
1. Operating a channel in one direction only with no ability to operate in the other direction.
2. One-sided printing.

SLM
Single Longitudinal Mode (laser)

SML
1. Small Machine Language
2. Synchronous Maintenance Link
3. Service Management Layer

SMPS
Switched-Mode Power Supply

SNIDER
Asynchronous ASCII Echoplex Protocol (A trademark of Telcordia.)

SNML
Sub-Network Management Layer

SNMP
Simple Network Management Protocol

Software Generic
A set of files representing a software release for a Network Element

SOH
Section Overhead

SOIC
Small Outline Integrated Circuit

SOM
Second of Minute

SONET
See Synchronous Optical Network (SONET).

Span
1. Refers to the optical fiber(s) connecting one site to another site; that portion of a high-speed
digital system that connects a Central Office (CO) or terminal office to terminal office.
2. Also called a T-Span Line; a repeated outside plant four-wire, two twisted-pair transmission
line.
3. A call center term: the total duration of a schedule from start time to stop time, including all
breaks.

SPI
Serial Peripheral Interface.

SPU
Shelf Processor Unit

SR
See Short Reach (SR).

SRAM
Static Random Access Memory

SRDM
Subrate Digital Multiplexing

SRM
Subrate Multiplexer. See also SM.

SSP
System Status Panel

SST
Secondary State

SSU
1. Subrate Service Unit
2. Synchronization Supply Unit. See also Building Integrated Timing Supply (BITS).

ST
A specific type of fiber-optic cable connector.

STBY
Standby

STC
STS-1 Transport Conditioner

STD
Standard

STE
Section-Terminating Equipment

STM-1
Synchronous Transport Module, level 1
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GL-52 Alcatel-Lucent 1850 TSS-100/TSS-100C
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Issue 1 December 2011
Glossary

STM-4
Synchronous Transport Module, level 4

STM-64
Synchronous Transport Module, level 64

STM-N
Synchronous Transport Module, Level N

STP
STS-1 Transport Protect

STS Envelope Capacity

Bandwidth within and aligned to the Synchronous Transport Signal (STS) frame that carries the
STS Synchronous Payload Envelope (SPE). This bandwidth can be combined from N STS1s to
carry an STS-Nc SPE. See STS Synchronous Payload Envelope (STS SPE).

STS Path Overhead (STS POH)

Nine evenly distributed path overhead bytes per 125 μs starting at the first byte of the
Synchronous Transport Signal Synchronous Payload Envelope (STS SPE); provides for
communication between creation and disassembly points of the STS SPE.

STS Path-Terminating Equipment (STS PTE)

Network elements that multiplex/demultiplex the Synchronous Transport Signal (STS) payload.
STS PTEs interpret and either modify or create the STS Path Overhead (STS POH) necessary to
transport the STS payload.

STS Payload Capacity

The maximum bandwidth within the Synchronous Transport Signal Synchronous Payload
Envelope (STS SPE) available for payload. See also STS Synchronous Payload Envelope (STS
SPE).

STS POH
See STS Path Overhead (STS POH).

STS PTE
See STS Path-Terminating Equipment (STS PTE).

STS Synchronous Payload Envelope (STS SPE)

A 125-μs frame structure composed of Synchronous Transport Signal Path Overhead (STS POH)
and bandwidth for payload. See also STS Path Overhead (STS POH).

STS-1
Synchronous Transport Signal, level 1; the basic logical building block Synchronous Optical
Network (SONET) electrical signal with a rate of 51.84 Mb/s.

STS-12c
Concatenated Synchronous Transport Signal, level 12. A concatenated signal is formed by linking
12 STS-1 signals together, which allows transport of payloads larger than the capacity of an
STS-1. (Payloads larger than one STS-1 are known as superate payloads.) An STS-12c payload
consists of 2349 bytes (3 783).

STS-192
Synchronous Transport Signal, level 192.

STS-3
Synchronous Transport Signal, level 3

STS-3c
Concatenated Synchronous Transport Signal, level 3. A concatenated signal is formed by linking 3
STS-1 signals together, which allows transport of payloads larger than the capacity of an STS-1.
(Payloads larger than one STS-1 are known as superate payloads.) An STS-3c payload consists of
2349 bytes (3 783).

STS-48
Synchronous Transport Signal, level 48.

STS-48c
Concatenated Synchronous Transport Signal, level 48. A concatenated signal is formed by linking
48 STS-1 signals together, which allows transport of payloads larger than the capacity of an
STS-1. (Payloads larger than one STS-1 are known as superate payloads.) An STS-48c payload
consists of 2349 bytes (3 783).

STS-SPE
See STS Synchronous Payload Envelope (STS SPE) and STS Envelope Capacity.

SUD
Software Update Document

Superate Payload
Payload larger than one STS-1.

Superframe (SF)
One possible framing format for a DS1 signal (corresponding to D4). Unlike Extended
Superframe (ESF), there is no sync messaging channel in an SF signal. Compare with Extended
Superframe (ESF).

SVC
Switched Virtual Circuit. See also Virtual Circuit (VC).

Synchronization Supply Unit (SSU)

See Building Integrated Timing Supply (BITS).

Synchronous
The essential characteristic of time scales or signals in which their corresponding significant
instants occur at precisely the same average rate.

Synchronous Digital Hierarchy (SDH)

European set of standard fiber-optic-based serial standards planned for use with Synchronous
Optical Network (SONET) and Asynchronous Transfer Mode (ATM); some SDH and SONET
standards are identical; standardized by the International Telecommunications Union (ITU). See
also Asynchronous Transfer Mode (ATM) and Synchronous Optical Network (SONET).

Synchronous Network
The synchronization of the payloads of a transmission system to a master (network) clock that can
be traced to a reference clock.

Synchronous Optical Network (SONET)

A family of fiber-optic transmission rates (51.84 Mb/s to 13.22 Gb/s), created to provide needed
flexibility to transport many digital signals with different capacities, and to provide a design
standard. SONET is an optical interface standard that allows interworking of transmission
products from multiple vendors; it defines physical interface, optical line rates (optical carrier
[OC] signals), frame format, and an Operations, Administration, Maintenance, and Provisioning
(OAM&P) protocol. A standard for interconnecting digital networks and lightwave systems
agreed upon by most major manufacturers. SONET supports new broadband services, and
enhanced OAM&P. This standard permits connecting SONET-compatible equipment of one
manufacturer to SONET-compatible equipment of another manufacturer on the other end. All
present services, such as DS1s, DS2s, DS3s, LANs, etc., can be brought onto a hub and interfaced
with SONET.

Synchronous Payloads
Payloads derivable from a network transmission signal by removing integral numbers of bits in
every frame; (for example, there are no variable bit stuffing rate adjustments required to fit the
payload in the transmission signal).

Synchronous Signal
A signal associated with a clock, or timing, signal. Clock moves data from one point to another.
NRZ signals are usually synchronous.

Synchronous Transport Module Level 1 (STM-1)

The basic Synchronous Digital Hierarchy (SDH) logical building block electrical signal with a
rate of 155.520 Mb/s. European SDS building block that equates to STS3.

Synchronous Transport Signal Level 1 (STS1)

The basic Synchronous Optical Network (SONET) logical building block electrical signal with a
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Alcatel-Lucent 1850 TSS-100/TSS-100C GL-55
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Glossary

Synchronous Transport Signal Level N (STS-N)

This electrical signal is obtained by byte interleaving N STS1 signals together. The rate of the
STS-N is N times 51.84 Mb/s.

System Identification/Network Service Access Point (SID/NSAP)

An alphanumeric designator that uniquely identifies a particular system or site within a network.
See also Network Service Access Point (NSAP).

T T0
Digital transmission link with a capacity of 64 kb/s (DS0)

T1
1. A collective term referring to the DS1 facility as a whole. Refers to traffic-carrying circuits.
2. Digital transmission link with a capacity of 1.544 Mb/s (DS1)

T3
1. A collective term referring to the DS3 facility as a whole. Refers to traffic-carrying circuits
rather than to modules.
2. Digital transmission link with a capacity of 44.736 Mb/s (DS3)

TAC
Technical Assistance Center

TAP
1. Test Access Port
2. Test Access Path
3. Trouble Analysis Procedures

TAP
Trouble Analysis Procedure.

Target Identifier (TID)

Number that may be null (missing). TIDs identify which network element receives a Transaction
Language 1 (TL1) message.

TARP
Target identifier Address Resolution Protocol

TCA
See Threshold Crossing Alert (TCA).

TDM
1. Time Division Multiplexed
2. See also Time Division Multiplexing (TDM).

TEC
Thermo-Electric Cooler

Terminal
An end point or a device connected to same.

Threshold Crossing Alert (TCA)

Threshold crossing parameters are values assigned to specific types of error conditions. The
values represent the number of times that condition occurs within a 15-minute or 1-day time
frame. If the number of occurrences exceeds the threshold value, a TCA situation displays on the
appropriate Performance Monitoring (PM) screen. See also Performance Monitoring (PM).

TID
See Target Identifier (TID).

TIE
Time Interval Error

Time Division Multiplexing (TDM)

A type of multiplexing where two or more channels of information are transmitted over the same
link by allocating a different time interval ("slot" or "slice") for the transmission of each channel.
(For example: The channels take turns to use the link. Typically a periodic synchronizing signal or
distinguishing identifier is required so the receiver can determine which channel is which. TDM
becomes inefficient when traffic is intermittent because the time slot remains allocated even when
the channel has no data to transmit. Statistical TDM was developed to overcome this problem.

Time Slot
In time division multiplexing or switching, the slot belonging to a voice, data, or video
conversation; it can be occupied with conversation or left blank, but the slot is always present.
The capacity of the switch or the transmission channel can be determined by figuring how many
slots are present.

TIRKS
Trunks Integrated Record Keeping System (A registered trademark of Telcordia.)

TL1
See Transaction Language 1 (TL1).

Transaction Language 1 (TL1)

A Telcordia-specified protocol for communication between network elements; a subset of CCITT
MML Standard.

Transport
Facilities associated with the transmission of OC1 or higher-level signals.

Transport Overhead
The overhead added to Synchronous Transport Signal (STS) Synchronous Payload Envelope
(SPE) for transport; consists of Line and Section overhead.

TS0
Time Slot Zero

TSC
Test Session Controller

TSI
Time Slot Interchange

TSS
Transport service switch

TX
Transmitter, transmit path

U UAP
User Access Privileges

UASCP
Unavailable Seconds-CP-bit Path

UASL
Unavailable Seconds-Line

UASP
Unavailable Seconds-Path

UDS
Unit Data Sheets

UEQ
Unequipped. Equipment entity is not equipped with necessary hardware.

UID
User Identifier

UL
Underwriters Laboratories

Unavailable Seconds (UAS)

The parameter UAS measures the duration for which service was unavailable (in seconds).
Service becomes unavailable if 10 consecutive Severely Errored Seconds (SES) occur. When the
service becomes unavailable, it remains unavailable until 10 consecutive nonseverely errored
seconds.

UNEQ-P
Unequipped-Path

Unequipped Indication
A code that originating equipment places in unequipped channels to indicate to Path-Terminating
Equipment (PTE) that the channel is intentionally unoccupied so that alarms may be inhibited.

Unidirectional Ring (UDR)

Ring networks that send the same traffic over two different routes (for example, counter-rotating
paths) to each node in the network. This allows the node to select one direction or the other for its
own traffic for protection purposes. Rings send all traffic through each node. Rings also permit
add/drop of channels at any node using a T Mux.

Unidirectional Switching
The protection switching scheme whereby the failed path is switched to the protection path, but
the path in the other direction is not switched.

Unprotected Operation
A network element (usually a terminal) where the individual transport element does not provide
traffic protection; a higher network device, such as a cross-connect, provides protection by
moving the traffic from the failed transmission path to other paths in the network.

UPC
A method used to polish the ends of fiber optic cables. This method produces a domed polish that
reduces back reflections up to -55dB.

UPPS
Unidirectional Path Protection Switching

UPSR
Unidirectional Path Switched Ring

USB
Universal Serial Bus

USDB
User Security Database

User Channel
This is allocated to the user for input of information such as data communication for use in
maintenance activities and remoting of alarms external to the span equipment in a proprietary
fashion.

USI
User System Interface. More commonly referred to as Communication Interface Unit (CIU). Also
called CID or CPORT.

USI-LAN
User System Interface-Local Area Network

USM
User Services Manager

V VACM
View Based Access Control Model

VC
1. Virtual Channel
2. Virtual Container
3. See also Virtual Circuit (VC).
4. Virtual Concatenation

VCAT
Virtual Concatenation

VCG
Virtual Concatenation Group

VCN
Virtual Channel Number

VI
Valid Interrupt

Violation Monitoring and Removal (VMR)

Virtual Circuit (VC)

A communications line, voice or data, that appears to the user to be a dedicated point-to-point
circuit. VCs are generally set up on a per call basis and disconnected when the call is ended; VC
concept was first used in data communications with packet switching; VCs have become more
common in ultra-high speed applications; VC is referred to as a logical, rather than physical path
for a call.

VLR
1. Very Long Reach.
2. Visitors Location Register. A wireless telecommunications term; refers to local database
maintained by cellular provider.

VOA
Variable Optical Attenuator

VSCC
Virtual Tributary/Synchronous Transport Signal (level 1) Cross-Connect
...................................................................................................................................................................................................................................

W WAN
Wide-Area Network.

WDM
Wavelength Division Multiplex (-er, -ing).

Workstation (WS)
Any one of a variety of Visual Display Terminals (VDTs), ranging from a simple
keyboard/monitor to an intelligent, processor-controlled VDT.

X X-bits
Two overhead bits per DS3 M-frame used as an alarm channel.

XBP
X-Bit Processing

XFP
10 Gigabit small form factor pluggable

XLR
See Extra Long Reach (XLR)

Z ZIC
Zero Installation Craft interface. An NE-imbedded graphical user interface (GUI) application for
local operation and maintenance.

Numerics unit data sheet, C-109 administration, 5-1, 5-8

1000BASE-SX SFP, C-172 1X10GE Packet Expander Access, security, 5-8
1000BASE-T electrical SFP, C-135
agnostic matrix, 1-3, 1-3, 1-4
C-181 24xE/FE Electrical Packet
alarm and condition types, 5-57
100BASE-FX SFP, C-169 Expander, C-122
alarm severities, 5-57
10G Packet Transport Processor, 4P2G5SO
C-116 alarm severity assignment profiles
protection switching, 5-27
(ASAPs), 2-24
10GBASE-E XFP, C-184 unit data sheet, C-98
alarms
10GBASE-S XFP, C-193 56PDS1
ACO, 5-58
10GbE Ethernet interface unit data sheet, C-52
specifications, 10-34 alarm and condition types,
63E1DS1M 5-57
10GEEA, C-135
unit data sheet, C-48 audible alarms, 5-58
12XDS3AC
6XDS3AC cut-off function, 5-58
protection switching, 5-26
unit data sheet, C-79 housekeeping, 5-57
12XE3A
850 nm, C-172, C-193 reporting, 5-58
protection switching, 5-27
8PSO summary alarms, 5-58
unit data sheet, C-76
protection switching, 5-27 alarms and reports, 5-57
1310 nm, C-156, C-160, C-164
unit data sheet, C-92 ambient temperature, 10-2
1350 OMS, 4-57
8x155/622M sync optical, C-92 applications
1550 nm, C-156, C-160, C-184,
C-190 8XGE Packet Expander, C-130 examples, 6-17, 6-19, 6-20

15-minute register, 5-54 8XGE synchronous ethernet high-end MSPP, 6-20

packet expander, C-132
16XSEA high-end SDH ADM, 6-19
8XGEEA, C-130, C-132
unit data sheet, C-88, C-90 low-end SDH ADM, 6-17
.............................................................
1-day register, 5-54 APS, 5-27
A access-to-access connections, 6-12 architecture
1P10GSO
ACO, 5-58 control complex, 4-55
protection switching, 5-27

C cabling sncp connections, 6-14 DCC connecting OSI rings,

5-23
installation, 6-22 upsr connections, 6-13
DCC IP ring, 5-21
capacity, 1-3 cross-connection features, 1-6
DCC mixed IP/OSI ring, 5-22
card failure rates, 9-3 cross-connections, 6-10
DCC transparency, 5-20
card slots cross-connection examples,
6-11 diagnostics, 5-24
protection, 6-2
one way SNCP autonomous diagnostics, 5-24
working, 6-2
cross-connections, 6-11 DS1 Multiplexer, C-48, C-52
central office battery connections,
one-way cross-connections, DS3 access, C-79
4-60
6-10
circuit packs dual rate token bucket (ingress
two way SNCP policing), B-7
descriptions, 4-1 cross-connections, 6-11
DWDM XFPs, C-200
Class of service (CoS), B-10 two-way cross-connections,
.............................................................
6-10
clock modes, 4-52
cross-connections examples, 6-11 E E-LAN service (MEF), B-15
CMDX, 10-31, C-145

E3DS3TM Ethernet virtual private LAN, loopbacks, 2-22

protection switching, 5-26 B-12 management and operation

Ethernet virtual private line, features, 2-22
unit data sheet, C-72
B-11 multivendor operations
EC100 interworking, 2-28
limit MAC table size, B-13
unit data sheet, C-18 network capabilites, 2-7
MAC auto-learning and aging,
EC100/EC100/EC100A B-22 OAM standards, 2-28
protection switching, 5-25 MAC destination address static OSI seven-layer protocol stack,
EC100A configuration, B-24 2-25

unit data sheet, C-24 MEF E-line and E-LAN PDH cards, 2-3
aggregation, B-16
EC100C PDH interfaces, 2-7
Service delimiting, B-26
unit data sheet, C-21 performance monitoring, 2-23
Spanning tree protocols, B-17
EL TRX SFP ETH multirate RJ45, Proxy ARP, 2-25
C-181 Ethernet transmission and receiver
SDH, 1-5
levels, 10-34
engineering rules, 6-2 SDH interfaces, 2-7
Ethernet virtual bridging, B-13
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C IN-3
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Index

....................................................................................................................................................................................................................................
SDH/SONET cards, 2-2 ............................................................. DCC configurations, 5-21
security, 2-26 L LCAS, B-2, B-2 DCC transparency, 5-20
SFP and XFP modules, 2-6 LDC, 4-56 diagnostics, 5-24
SNMP support, 2-25 Level 2 network engineering, 6-25 loopbacks, 5-15, 5-15
synchronization, 2-29 Level 2 routing guideslines, 6-23 performance monitoring, 5-53
TDM applications, 1-5 limit MAC table size, B-13 protection switching, 5-25
test access conections, 2-23 Line Terminal, C-145, C-147 management interface
specifications, 10-35
TL1 management, 2-24 linear network topology, 3-4
management ports, 4-58
universal switch matrix, 2-7 link aggregation, 5-46
mandatory equipment, 6-2
zero installation craft terminal fast lag, 5-50
(ZIC), 2-24 matrix, 1-3, 1-4
fault signalling, 5-51, 5-53
first level controller, 4-55 MEF E-line and E-LAN
link capacity adjustment scheme, aggregation, B-16
FLC, 4-55 B-2
mesh network topology, 3-6
free-running mode link loopback, 5-62
metering, policing, and marking,
FRNG, 4-52 link OAM, 5-59 B-8
front access shelf configuration, local device controller, 4-56 modules, 6-2
4-2
locked mode, 4-52 monitored parameters, 5-55
.............................................................
login aging, 5-10 MT100
G GbE Ethernet interface
login id, 5-9 management ports, 4-58
specifications, 10-33
long haul, C-156, C-160, C-184, protection switching, 5-26
general features, 1-4
C-190
generic framing procedure, B-3 unit data sheet, C-34
loopback, 5-15, 5-15
GFP, B-3 MT100C
cross-connect loopback, 5-17
glossary, GL-1 unit data sheet, C-38
facility loopback, 5-16
............................................................. .............................................................
oam link, 5-18
H HLDOVR, 4-52 N network configurations, 3-1
terminal loopback, 5-16
holdover mode, 4-52 DCC configurations, 5-21,
tmux DS1, 5-19
5-21
housekeeping, 5-57 .............................................................
network DCC configurations, 5-21
humidity, 10-3
M MAC auto-learning and aging,
network management
............................................................. B-22
ip access, 5-13
I In-band/In-fiber management, 5-6 MAC destination address static
configuration, B-24 T-TD gateway, 5-13
input voltage, 10-3
maintenance, 5-1 network topologies
intraoffice, C-164, C-184
alarms and reports, 5-57 linear, 3-4

DCC, 5-19 mesh, 3-6

....................................................................................................................................................................................................................................
point-to-point, 3-4 OPTO TRX SFP L-4.1 DDM, physical arrangements
C-160
ring, 3-5 cabling, 6-22
OPTO TRX SFP L-4.2 DDM,
NORM, 4-52 physical description, 4-1
C-160
............................................................. physical design specifications,
OPTO TRX SFP S-1.1 DDM,
10-2
O OADM, C-147 C-156
shelf dimensions, 10-2
OAM OPTO TRX SFP S-1.1 DDM
-40/+85 C, C-156 plug-in modules, 4-4
configurations, 5-69
OPTO TRX SFP S-4.1 DDM, point-to-point network topology,
link, 5-59 C-160 3-4
loopback, 5-62 policy
OPTO TRX XFP 10Gb, C-193
service, 5-62 quality, 9-1
OSI level 2 engineering rules and
oam loopback, 5-62 guidelines, 6-25 POW100/POW100NS
OC-192 interface specifications, OSI level 2 routing management,
protection switching, 5-26
10-7 6-23
unit data sheet, C-42
OMDX, 10-31, C-148 .............................................................
power consumption, 10-3
one way SNCP cross-connections, P packet scheduling and congestion,
6-11 B-9 power interface specifications,
10-3
one-way cross-connections, 6-10 part numbers, 6-2
power protection, 4-60
operations, 5-1, 5-2 password, 5-9
power supply, C-42
database management, 5-4 password aging, 5-10
powering, 4-60
In-band/In-fiber management, PE24FEA, C-126
5-6 PP10G, C-116
PE24FEA Packet Expander, C-126
software management, 5-2 PP10GHS, C-119
PE24XFE, C-122
optical receiver levels, 10-8 PP10GHS Packet Module, C-119
performance monitoring, 5-53
optical transmission levels, 10-8 PRE10GA, C-142
1-day register, 5-54
optional equipment, 6-2 PRE10GA Pre-Amplifier, C-142
15-minute register, 5-54
OPTO TRX SFP 100BASE-LX previous register, 5-54
parameters, 5-55
DDM, C-169 primary office power, 4-60
register initialization, 5-54
OPTO TRX SFP GbE SX DDM, product support
C-172 retrieving PM data, 5-55
technical support, 8-1
OPTO TRX SFP I-16.1 DDM, STM-n PM parameters, 5-55
C-164 training, 8-2
storage registers, 5-54
OPTO TRX SFP L-1.1 DDM worldwide services, 8-1
threshold crossing alerts, 5-54
EXTEMP, C-156 product support information, 8-1
threshold registers, 5-54
OPTO TRX SFP L-1.2 DDM protection
EXTEMP, C-156 validity flags, 5-54
equipment, 5-25
VC PM parameters, 5-56
facility, 5-28
....................................................................................................................................................................................................................................
Alcatel-Lucent 1850 TSS-100/TSS-100C IN-5
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Index

....................................................................................................................................................................................................................................
power, 4-60 quality of service event log, 5-13
protection switching, 5-25 Class of service (CoS), B-10 login aging, 5-10
1/,N protection, 5-26 dual rate token bucket (ingress login id, 5-9
policing), B-7
1/1 protection, 5-25 password, 5-9
metering, policing, and
APS, 5-27 password aging, 5-10
marking, B-8
automatic protection switching, user id, 5-10
packet scheduling and
5-27
congestion, B-9 user privilege attributes, 5-9
DS3 multiplexer, 5-26
single rate token bucket user privileges, 5-8
DS3/EC1 access, 5-26 (ingress policing), B-6 user sessions, 5-9
E1 access, 5-26 quality policy, 9-1, 9-1
Service delimiting, B-26
E1/DS1 multiplexer, 5-26 .............................................................
service OAM, 5-62
E3 access, 5-27 R RADIUS, 5-10 services, 8-1
equipment, 5-25 RADIUS authentication for user severities
equipment controller, 5-25 logins, 2-27
critical, 5-57
facility, 5-28 recent register, 5-54
major, 5-57
non-revertive, 5-25 register initialization, 5-54
minor, 5-57
OC-192, 5-27 registers, 5-54
non-alarmed, 5-57
OC-3/OC-12, 5-27 relative humidity, 10-3
SFP
OC-48, 5-27 reliability programs, 9-2
1000BASE-SX, C-172
power supply, 5-26 reporting alarms, 5-58
100BASE-FX, C-169
revertive, 5-26 reports
EL TRX SFP ETH multirate
universal matrix, 5-26 alarm and condition types, RJ45, C-181
5-57
Proxy address resolution protocol OPTO TRX SFP
(Proxy ARP), 2-25 retrieving PM data, 5-55 100BASE-LX DDM, C-169
............................................................. ring network topology, 3-5 OPTO TRX SFP GbE SX
ring pass-through connections, DDM, C-172
Q quality and reliability, 9-1
6-15 OPTO TRX SFP I-16.1 DDM,
card failure rates, 9-3 C-164
.............................................................
failure rates, 9-3 OPTO TRX SFP L-1.1 DDM
S SDH configurations, 3-1
quality certifications, 9-7 EXTEMP, C-156
SDH features, 1-5
quality policy, 9-1 OPTO TRX SFP L-1.2 DDM
second level controller, 4-56 EXTEMP, C-156
reliability programs, 9-2
security, 5-8 OPTO TRX SFP L-4.1 DDM,
SFP/XFP failure rates, 9-5 C-160
auto-logout, 5-12
warranty, 9-7
OPTO TRX SFP L-4.2 DDM,
autonomous messages, 5-13
quality certifications, 9-7 C-160
default user profiles, 5-10
....................................................................................................................................................................................................................................
IN-6 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Index

shelf configuration STM-4 interface specifications, GbE Ethernet interface

10-5 specifications, 10-33
compact shelf, 4-3
STM-4 SFP, C-160 management interface
ETSI rack, 4-4 specifications, 10-35
STM-64 XFP, C-184
front access, 4-2 OC-192 interface
STM-64 XFP-E, C-190 specifications, 10-7
shelf dimensions, 10-2
STM-n PM parameters, 5-55 optical transmission and
shelves, 4-2
storage registers, 5-54 receiver levels, 10-8
short haul, C-156, C-160, C-172,
C-193 Stratum 3 quality, 2-29, 4-50 physical design, 10-2

signal architecture, 4-44 suitcasing training, 8-2 power consumption, 10-3

data transmission architecture, summary alarms, 5-58 power interface specifications,

4-45 10-3
synchronization
EOS mapping, B-1 shelf dimensions, 10-2
BITS, 4-50
TDM transmission STM-1 interface specifications,
clock modes, 4-52
architecture, 4-45 10-5
external building integrated
single rate token bucket (ingress STM-16 interface
timing supply, 4-50
policing), B-6 specifications, 10-6
external line timing, 4-50, 4-50 STM-4 interface specifications,
SLC, 4-56
Stratum 3 quality, 2-29, 4-50 10-5
slot allocation, 6-2
timing protection, 4-51 weight, 10-4
sncp connections, 6-14
weight specifications, 10-4

....................................................................................................................................................................................................................................
technical support, 8-1 56PDS1, C-52 SL-42, C-160
temperature, 10-2 63E1DS1M, C-48 SS-11, C-156
terminal loopback, 5-16 6XDS3AC, C-79 SS-41, C-160
termination bus, C-46 8PSO, C-92 STM-64 XFP, C-184
threshold crossing alerts, 5-54 8XGEEA, C-130, C-132 STM-64 XFP-E, C-190
threshold registers, 5-54 ASYMRTM, C-85 TBF/TBR/TB100C, C-46
time of day settings, 4-52 BST10GA, C-138 TRU, C-14
timing protection, 4-51 CMDX8, C-145 XFP-E adapter, C-198
TODS, 4-52 compact shelf, C-11 unit descriptions, 4-4
top rack unit, C-14 CWDM SFPs, C-205 universal matrix, C-34, C-38
topologies, 3-1 CWDM XFPs, C-209 upsr connections, 6-13
topologies and configurations, 3-1 DWDM XFPs, C-200 user id, 5-10
Data configurations, 3-3 E1DS1BAC, C-61 user logins
network topologies, 3-4 E1DS1PAC, C-64 RADIUS, 5-10
training, 8-2 E1UAC, C-56, C-67 user privilege attributes, 5-9
training registration, 8-2 E3DS3PAC, C-82 user privileges, 5-8
TRU, C-14 E3DS3TM, C-72 user profiles
two way SNCP cross-connections, EC100, C-18 default user profiles, 5-10
6-11
EC100A, C-24 .............................................................
two-way cross-connections, 6-10
EC100C, C-21 V validity flags, 5-54
.............................................................
fan, C-28, C-32 VC PM parameters, 5-56
U unidirectional, C-145 MT100, C-34 VCAT, B-1
unit data sheets MT100C, C-38 virtual concatenation, B-1
1000BASE-SX SFP, C-172 PE24FEA, C-126 voltage, 10-3
1000BASE-T electrical SFP, PE24XFE, C-122 .............................................................
C-181
POW100/POW100NS, C-42
W warranty, 9-7
100BASE-FX SFP, C-169
PP10G, C-116
10GBASE-E XFP, C-184 weight, 10-4
PP10GHS, C-119
10GBASE-S XFP, C-193 weight specifications, 10-4
PRE10GA, C-142
.............................................................
10GEEA, C-135
shelf (front access), C-5
12XE3A, C-76 X XFP
SI-161, C-164
16XSEA, C-88, C-90 OPTO TRX XFP 10Gb, C-193
SL-11, C-156
1P10GSO, C-109 XFP I-64.1/10GBE BASE L,
SL-12, C-156 C-184
4P2G5SO, C-98
SL-41, C-160 XFP-E P1L1-2D2, C-190
....................................................................................................................................................................................................................................
IN-8 Alcatel-Lucent 1850 TSS-100/TSS-100C
8DG26342AAAATQZZA Release 4.1 (ETSI)
Issue 1 December 2011
Index

Z zero installation craft terminal,

4-57
ZIC, 4-57

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