B.E.

Biomedical Engineering (BM)

Bio-MEMS 15BM831
Module -3

Engineering Mechanics for Microsystem Design:

Static Bending of Thin plates –
Circular Plates,
Rectangular Plates,
Square Plates with all Edges Fixed,
Mechanical vibrations – General Formulation,
Resonant Vibration,
Design theory of Accelerometers.

Mr. Hemanth Kumar G

Asst. Prof.
Department of BME
ACSCE, Bangalore 74
 Module -3
Engineering Mechanics for
Microsystems Design
Structural integrity is a primary requirement for any device or engineering
system regardless of its size.

The theories and principles of engineering mechanics are used to assess:

(1) Induced stresses in the microstructure by the intended loading, and

(2) Associated strains ( or deformations) for the dimensional stability, and
the deformation affecting the desired performance by this
microstructural component.
Accurate assessment of stresses and strains are critical in microsystems design not only
for the above two specific purposes, but also is required in the design for signal transduction,
as many signals generated by sensors are related to the stresses and strains Induced by the
input signals.

Mr. Hemanth Kumar G

 Chapter Outline

Static bending of thin plates

Mechanical vibration analysis

Thermomechanical analysis

Fracture mechanics analysis

Thin film mechanics

Overview of finite element analysis

 Mechanical Design of Microstructures
Theoretical Bases:

● Linear theory of elasticity for stress analysis

● Newton’s law for dynamic and vibration analysis

● Fourier law for heat conduction analysis

● Fick’s law for diffusion analysis

● Navier-Stokes equations for fluid dynamics analysis

Mathematical models derived from these physical laws are valid for micro-
components > 1 m.
 Mechanical Design of Microsystems

Common Geometry of MEMS Components

Beams:
Microrelays, gripping arms in a micro tong, beam spring in micro accelerometers

Plates:
● Diaphragms in pressure sensors, plate-spring in microaccelerometers, etc

● Bending induced deformation generates signals for sensors and relays using
beams and plates

Tubes:
Capillary tubes in microfluidic network systems with electro-kinetic pumping
(e.g. electro-osmosis and electrophoresis)

Channels:
Channels of square, rectangular, trapezoidal cross-sections in microfluidic network.

• Component geometry unique to MEMS and microsystems:

Multi-layers with thin films of dissimilar materials
 Recommended Units (SI) and Common Conversion
Between SI and Imperial Units in Computation

Units of physical quantities: Common conversion formulas:

Length: m 1 kg = 9.81 m/s2

Area: m2 1kgf = 9.81 N
Volume: m3 1 µm = 10-6 m
1 Pa = 1 N/m2
Force: N 1 MPa = 106 Pa = 106 N/m2
Weight: N
1 m = 39.37 in = 3.28 ft
Velocity: m/s 1 N = 0.2252 lbf (force)
1 kgf = 2.2 lbf (weight)
Mass: g 1 MPa = 145.05 psi
Mass density: g/cm3

Pressure: Pa
 Static Bending of Thin Plates

We will deal with a situation with thin plates with fixed edges subjected
to laterally applied pressure:
b
My x
Mx P Mx
a

My h
y z
in which, P = applied pressure (MPa)
Mx, My = bending moments about respective y and x-axis (N-m/m)
h = thickness of the plate (m)
The governing differential equation for the induced deflection, w(x,y) of the plate is:
 2 2 2 w 2 w  p
 2  
 x  y 2   x 2   y 2  D (4.1)
  
E h3
with D = flexural rigidity,D  (4.2)
12(1  2)
in which E = Young’s modulus (MPa), and = Poisson’s ratio
 Static Bending of Thin Plates-Cont’d

Once the induced deflection of the plate w(x,y) is obtained from the solution of
the governing differential equation (4.1) with appropriate boundary conditions,
the bending moments and the maximum associated stresses can be computed
by the following expressions:

Bending moments (4.3a,b,c): Bending stresses (4.4a,b,c):

2 w 6(M x)max

2 w 
 ( xx ) max 
M x  D 2  2  h
2
 x y 
6(M y)max
2 w 2 w  ( yy ) max 
M y  D 2   
2  h2
 y x 

6(M xy)max
2 w ( xy ) max 
M xy  D(1 ) h2
 xy
 Special cases of bending of thin plates

Bending of circular plates

r a

Let W = total force acting on the plate, W = (πa)p and m=1/

The maximum stresses in the r and θ-directions are:

3W
( rr )max  3W and ( )
 max
 (4.5a,b)
4 2 4 h2
h
3W
Both these stresses at the center of the plate is:  rr    (4.6)
8 h2
The maximum deflection of the plate occurs at the center of the plate:
3W(m2 1) a2
wmax 
16E m2 h3 (4.7)
 Example 4.1 (p.113)
Determine the minimum thickness of the circular
diaphragm of a micro pressure sensor made of
Silicon as shown in the figure with conditions:

Diameter d = 600 µm; Applied pressure p = 20 MPa

Yield strength of silicon σy = 7000 MPa
E = 190,000 MPa and = 0.25. Pressure loading, p Diaphragm
Solution: Diaphragm thickness, h
3W 3W
( rr ) max 
h Silicon die
 2 4 ( rr) max
 4 h
Constraint base
3W 3W
(  ) max  h
4 h2 4 (  ) max
Use the condition that σrr < σy = 7000 MPa and σθθ < σy = 7000 MPa, and
W = (a2)p = 3.14 x (300 x 10-6)2x (20 x 106) = 5.652 N, we get the minimum thickness
of the “plate” to be:

3x5.652
h 6
 13.887x106 m or 13.887 µm
4x3.14x(7000x10 )
 Special cases of bending of thin plates-Cont’d

Bending of rectangular plates

a
x

y
The maximum stress and deflection in the plate are:

4
pb2 p b
( yy )max   and wmax (4.8 and 4.9)
h 2
E h3

in which coefficients α and β can be obtained from Table 4.1:

a/b 1 1.2 1.4 1.6 1.8 2.0 
 0.0138 0.0188 0.0226 0.0251 0.0267 0.0277 0.0284

 0.3078 0.3834 0.4356 0.4680 0.4872 0.4974 0.5000

Example 4.2 (p.115)
a = 752 µm
A rectangular diaphragm, 13.887 µm thick has the plane
x
dimensions as shown in the figure. The diaphragm is

b = 376 µm
made of silicon. Determine the maximum stress and
deflection when it is subjected to a normal pressure,
P = 20 MPa. All 4 edges of the diaphragm are fixed.

Solution: y

We will first determine α = 0.0277 and β = 0.4974 with a/b = 752/376 = 2.0 from the
Given Table. Thus, from available formulas, we get the maximum stress:

p b2 (20x106 )(376x106)2
( yy) max    0.4974  7292.8x106 Pa
h2 (13.887x 10 6 ) 2
and the maximum deflection:
6  3
0.0277x(20x106)x376x10 
4 3 6
bp pb b  376x10   21.76x
w    3    6  106
m
max
Eh E h  190000x10
6

13.887x10 

at the center (centroid) of the plate

 Special cases of bending of thin plates-Cont’d

Bending of square plates:

a
0.308 p a 2
The maximum stress occurs at the middle of each edge:  max  2
(4.10)
h
0.0138 p a 4
The maximum deflection occurs at the center of the plate: wmax  3
(4.11)
Eh
The stress and strain at the center of the plate are:
1

6 p(m  1) a 2 and   (4.12 and 4.13)
47m h 2 E
Square diaphragm (idealized as a square plate) is the sensing element in
many micro pressure sensors
Example 4.3 (p.116)
a = 532 µm
Determine the maximum stress and deflection in
a square plate made of silicon when is subjected

532 µm
to a pressure loading, p = 20 MPa. The plate has
edge length, a = 532 µm and a thickness,
h = 13.887 µm.

Solution:

From the given formulas, we have the maximum stress to be:

2 6 6 2


0.308 pa 0.308x(20x10 )(532x10 )
   9040x10 6
Pa
max 2 6 2
h (13.887x10 )
and the maximum deflection:
0.0138pa 4 0.0138pa a 3
wmax   Eh3   E h  
0.0138(20x106 )x532x106  532x106 
3

 6

   43x106 m
6 
or wmax = 43 µm
190000x10 13.887x10 
 Geometric effect on plate bending

Comparison of results obtained from Example 4.1, 4.2 and 4.3 for plates made of
silicon having same surface area and thickness, subjecting to the same applied
pressure indicate saignificant difference in the induced maximum stresses and
deflections:
Geometry Maximum Stress (MPa) Maximum Deflection
(µm)

7000 55.97

7293 21.76

9040
43.00
highest stress output

The circular diaphragm is most favored from design engineering point of view.
The square diaphragm has the highest induced stress of all three cases. It is
favored geometry for pressure sensors because the high stresses generated by
applied pressure loading – result in high sensitivity..
Example 4.4 Determine the maximum stress and deflection in a square diaphragm
used in a micro pressure sensor as shown in the figure. The maximum
(p. 118) applied pressure is p = 70 MPa.

Detail of the Silicon die and diaphragm:

Silicon die
783 µm

Diaphragm

783 µm
Uniform pressure
View on Section “A-A” loading: 70 MPa 783 m 266 m
Passage for
Pressurized
Medium 54.74o 480 m Thickness h = 266 µm
1085 m
2500 m
(Pressurized Medium)

Uniform pressure loading

A A By using the formulas for square plates, we get:
0.308x70x10 6 x(783x106 ) 2
Silicon
Wafer
Adhesive Metal
Casing
 max  6 2
 186.81MPa
Thin Silicon Membrane
with signal generators
(266x10 )
Pyrex Glass and interconnect
Constraining
Base
and the maximum deflection:
0.0138x70(783x106 ) 4
wmax    10153x10 11 m
190000(266x106 )3
or 0.1015 µm (downward)
 Mechanical Vibration Analysis
Mechanical vibration principle is used in the design of micro-
accelerometer, which is a common MEMS device for measuring
forces induced by moving devices.

Microaccelerometers are used as the sensors in automobile air bag

deployment systems.

We will outline some key equations involved in mechanical vibration

analysis and show how they can be used in microaccelerometer
design.
Overview of Simple Mechanical Vibration Systems

(a) Free vibration: (b) Damped vibration: (c) Forced vibration:

Circular frequency:
k Spring Force on Mass:
k
 k F(t) =F oSint
m Mass m
Natural frequency: m Damping
X(t)
f 
 Coefficient
2 x c
λ = c/(2m)
X(t) = instantaneous position of the mass, or the displacement of the mass at time t.
X(t) is the solution of the following differential equation with C1 and C2 beingconstants:
d 2 X(t)
m  kX (t) 0 Eq. (4.14) for Case (a) X(t) = C1 cos (t) + C2 sin (t)
d t2

m
d 2 X(t)
d t2
 c
dX (t)
dt
kX (t)  0 Eq. (4.19) for Case (b)
t    t   ) for λ2 - ω2 > 0
2 2 2 2
t
X (t)  e (C1e C2e
X (t)  et (C1  C 2 t) for λ2 - ω2 = 0

X (t)  et C1cos  2  2t  C 2 sin  2  2t  for λ2 - ω2 < 0
d 2 X(t)
kX (t)  F Sin(t) Eq (4.21) for Case(c) X (t) F o 2 Sint  Sint 
    2 
m o
d t2
In a special case of which α = ω Resonant vibration: X (t)  F o Sin t  F o tCost
2
2 2
 A typical µ-accelerometer:
Proof
Example 4.6 (p.121) Mass
Determine the amplitude and frequency of vibration Spring
of a 10-mg mass attached to two springs as shown
in the figure. The mass can vibrate freely without
friction between the rollers and the supporting floor.
Assume that the springs have same spring constant Math Model:
x
k1 = k2=k = 6 x 10-5 N/m in both tension and
compression. The vibration begins with the mass
Spring constant, k1 Spring constant, k2
being pulled to the right with an amount of δ st = 5 µm.
Mass, m
(as induced by acceleration or deceleration)
Solution:

We envisage that the mass in motion is subjected to two spring forces:

One force by stretching the spring (F1 =k1x) + the other by compressing (F2 = k2x).
Also If the spring constants of the two springs are equal, (k1 = k2).
And also each spring has equal magnitudes of its spring constants in tension and
Compression. We will have a situation:
Dynamic force, F

F1 = Spring force, k1X Spring force, k2X = F2

Mass, m

In which F1 = F2 , This is the situation that is called “Vibration with balanced force”
Example 4.6-Cont’d

Since the term kX(t) in the differential equation in Eq. (4.14) represent the “spring force”
acting on the vibrating mass, and the spring force in this case is twice the value.

We may replace the term kX(t) in that equation with (k+k)X(t) or 2kX(t) as:

d 2 X (t)
m 2
 2k X (t)  0
dt
dX (t)
with the conditions: X(0) = δst = 5 µm, and  0 (zero initial velocity)
dt t0

The general solution of the differential equation is: X(t) = C1 cos (ωt) + C2 sin(ωt),
in which C1 = δst = 5 x 10-6 m and C2 = 0 as determined by the two conditions.

Thus, the instantaneous position of the mass is: X(t) = 5x10-6 cos (ωt) meter

The corresponding maximum displacement is Xmax = 5x10-6 m

The circular frequency, ω in this case is:

2k (6 6)x105
   3.464 rad /s
m 105
Microaccelerometers
Micro accelerometers are used to measure the acceleration (or deceleration)
of a moving solid (e.g. a device or a vehicle), and thereby relate the acceleration
to the associated dynamic force using Newton’s 2nd law: F(t) = M a(t), in which
M = mass of the moving solid and a(t) = the acceleration at time t.

An accelerator requires: a proof mass (m), a spring (k), and damping medium (c),
in which k = spring constant and c = damping coefficient.

Early design of microaccelerators have the following configurations:

k
Conventional M
M
accelerometers
k C
Casing Casing
(a) Spring-mass (b) Spring-mass-dashpot

Silicon beam
Piezoresistor
Microaccelerometers k M
M
Fluid: C
Fluid:
Constraint
C base
Casing Casing

(c)Beam-Mass (d) Beam-attached mass

 Design Theory of Accelerometers
In a real-world application, the accelerometer is attached to a moving solid. We realize
that the amplitude of the vibrating proof mass in the accelerometer may not necessarily
be in phase with the amplitude of vibration of the moving solid (the base).
x(t) = the amplitude of vibration of the base

Assume x(t) = X sin(ωt) – a harmonic motion

y(t) = the amplitude of vibration of proof mass
m y in the accelerometer from its initial static
equilibrium position.
k c x z(t) = the relative (or net) motion of the
proof mass, m
Moving (vibrating) Base
Hence z(t) = y(t) – x(t) (4.26)

The governing differential equation for z(t) is:

m&z&(t) cz&(t)  kz(t)  mX  2 Sint (4.29)

Once z(t) is obtained from solving the above equation with appropriate initial conditions,
we may obtain the acceleration of the proof mass in a relative movement as:
d 2 z(t)
&z&(t)
dt 2
 Design Theory of Accelerometers-Cont’d

dz(t)
The solution of z(t) with initial conditions: z(0) = 0 and  0 is:
dt t0
z(t) = Z sin(ωt – Φ) (4.30)

in which the maximum magnitude, Z of z(t) is:

2 X
Z
(4.31a)
 
2
k
2
 c 
  2    
m  m 

where X = maximum amplitude of vibration of the base. The phase angle difference, Φ
between the input motion of x(t) and the relative motion, z(t) is:
c
  tan1 m (4.31b)
k 2

m
Design Theory of Accelerometers-Cont’d

An alternative form for the maximum amplitude of the relative vibration of the proof mass in
the accelerometer, Z is:

Z  2X
2 (4.32a)
  2  
2
 n2  1      2h 
  n  
   n 

where ω = frequency of the vibrating base; ωn is the circular natural frequency of

the accelerometer with:
k
n 
m
The parameter, h = c/cc = the ratio of the damping coefficients of the damping medium
in the micro accelerometer to its critical damping with cc = 2mn

For the case of which the frequency of the vibrating base, ω is much smaller than the
natural frequency of the accelerometer, ωn, i.e. ω << ωn:

Z & abase,max (4.33)

 2n
 Design of Accelerometers

The engineer may follow the following procedure in the design of appropriate
microaccelerometer for a specific application:

(1) Set the target maximum amplitude of vibration, X of the base (e.g., a
vehicle or a machine) and the anticipated frequency of vibration, i.e. ω.

(2) Select the parameters: m, k, c and calculate ωn and h.

(3) Compute the maximum relative amplitude of vibration of the proof mass,
Z using the available formulas.

(4) Check if the computed Z is within the range of measurement of

the intended transducer, e.g. piezoresistors, piezoelectric, etc.

(5) Adjust the parameters in Step (2) if the computed Z is too small to
be measured by the intended transducer.
 Design of Accelerometers-Cont’d
Spring constant of simple beams
Simple beams are commonly used to substitute the coil springs in microaccelerometers.
It is thus necessary to calculate the “equivalent spring constant” of these beam springs.

Since the spring constant of an elastic solid, whether it is a coil spring or other geometry, is
define as k = Force/Deflection (at which the force is applied), we may derive the spring
constant for the three simple beam configurations to be:
L F Appliedforce, F 3EI
k  
Induceddeflection,  L3

F F F

L L L

48EI
k k
192EI
L3 L3
in which E = Young’s modulus; I = section moment of inertia of beam cross-section.
 Design of Accelerometers-Cont’d
Damping coefficients

In microaccelerometers, the friction between the immersed fluid and the contacting
surfaces of the moving proof mass provides damping effect.

There are two types of “damping” induced by this affect:

(a) Squeeze film damping:
(b) Micro damping in shear:
k
M
M
k C
Casing Casing
(a) Spring-mass (b) Spring-mass-dashpot

Silicon beam
Piezoresistor
k M
M
Fluid: C
Fluid: Constraint
C base
Casing Casing

(c)Beam-Mass (d) Beam-attached mass

Numerical values of damping coefficients depend on the geometry of the vibrating

solid components and the fluid that surround them.
Example 4.10 (p.133)

Determine the displacement of the proof mass from its neutral equilibrium
Position of a balanced-force microaccelerometer illustrated below:

The structure of this accelerometer

can be graphically represented below:

Anchors Beam mass, m

Beam springs

Rigid bars

Anchors m
Beam mass 700 m

Beam springs 5 m
“A” “A”
m 600 m
Beam mass 1 m
View “A-A”
Beam springs
With: b = 10-6 m, B = 100x10-6 m, L = 600x10-6 m and Lb = 700x10-6 m, we have
from Example 4.9 the moment of inertia of beam spring cross-section to be:
I = 10.42x10-24 m4

For simply-support beam spring: k = 0.44 N/m, ωn = 23,380 rad/s

For rigidly fixed beam spring: k = 1.76 N/m and ωn = 147,860rad/s

Assume the “rigidly held beam spring case is adopted, the equation of motion of
the proof mass is:
d 2 X t
  2 X t   0
dt 2
with initial conditions: X t  t0  0 initial position

, and dX t   50 km / h  13.8888 m / s initial velocity

dt t0

The solution of the equation of motion with the given initial conditions is:
X t   9.3932x105 Sin147.86t 
leading to X(1 ms) = -2.597x10-5 m or 26 µm opposite to the direction of
deceleration.
(a) Damping coefficient in a squeeze film:

Damping Velocity
y H(t) fluid profile

2L Moving strip with

width 2W

c  16 f  W3 L H 3
W
The damping coefficient can be found to be:
  o
where Ho = nominal thickness of the thin film.  
L
f 
W
The function,   can be obtained by the following Table 4.2:
L 

W W 
f W W 
 f 
L L  L
L 
0 1.00 0.6 0.60
0.1 0.92 0.7 0.55
0.2 0.85 0.8 0.50
0.3 0.78 0.9 0.45
0.4 0.72 1.0 0.41
0.5 0.60
 Example 4.11 (p.136)

Estimate the damping coefficient of a micro accelerometer using

a cantilever beam spring as illustrated.

10 m
1000 m
Ho=20 m
Damping fluid:
Silicone oil 50 m
Ho=20 m m
Mass, m = 10 mg
Beam cross-section

Vibrating Base Frequency,

We have the beam dimensions as: 2L = 1000x10-6 m and 2W = 10x10-6 m

W/L = 0.01 F(W/L) = 0.992 from Table 4.2.

The nominal film thickness, Ho = 20x10-6 m. From Eq. (4.38) we get: c = 8x10-33 N-s/m.
(b) Micro damping in shear:

Damping
Fluid
Velocity profile
Gap, H u(y)

V
Moving mass, m Velocity, V
V

y
Gap, H
Velocity profile
u(y)

The damping coefficient, c may be computed from the following expression:

2 Lb
c  FD  N-s/m (4.43)
V H
where L = length of the beam (m); b = the width of the beam (m); H = gaps (m)
µ = dynamic viscosity of the damping fluid (N-s/m2), see Table below.
 Dynamic Viscosity for Selected Fluids (in 10-6 N-s/m2)
A.Compressible fluids:

0oC 20oC 60oC 100oC 200oC

Air 17.08 18.75 20.00 22.00 25.45

Helium 18.60 19.41 21.18 22.81 26.72

Nitrogen 16.60 17.48 19.22 20.85 24.64

B. Non-compressible fluids:

0oC 20oC 40oC 60oC 80oC

Alcohol 1772.52 1199.87 834.07 591.80 432.26

Kerosene 2959.00 1824.23 1283.18 971.96 780.44
Fresh water 1752.89 1001.65 651.65 463.10 351.00
Silicone 740
oil*
Example 4.12 (p.139)
Estimate the damping coefficient in a balanced-force microaccelerometer as illustrated,
with (a) air, and (b) silicone oil as damping media. The sensor operates at 20oC.
L = 700 m

1 m
Eq. (4.43) is used for the solutions.
A
We have L = 700x10-6 m and b = 5x10-6 m
Beam Mass, m B =100 µm
and the gap, H = 10x10-6 m.
Velocity,v
A View “A-A”
The dynamic viscosities for air and silicone oil
Top View at 20oC may be found from Table 4.3 to be:

µair = 18.75x10-6 N-s/m2, and

Gap, H = 20 m
µsi = 740x10-6 N-s/m2
H (Damping fluid)
Thus, the damping coefficient with air is:


Elevation
2 Lb 2(18.75x106 )(700x106 )(100x106) 12 N-s/m
c air
  2.625x10
H 20x106
and the damping coefficient with silicone oil is:
2  Lb 2(740x106 )(700x106 )(100x106 ) 10 N-s/m
c si
  1.036x10
H 20x106
Example 4.14 Design of an inertia sensor for airbag deployment system in automobiles (p.142)
Two vehicles with respective masses, m1 and m2 traveling in opposite directions at velocities
V1 and V2 as illustrated. Each vehicle is equipped with an inertia sensor (or micro
accelerometer) built with cantilever beam as configured in Example 4.8.

Estimate the deflection of the proof mass in the sensor in vehicle 1 with mass m1,
and also the strain in the two piezoresistors embedded underneath the top and bottom
surfaces of the beam near the support after the two vehicles collide.
V1
V2
m1
m2

m1 = 12,000 Kg, m2 = 8000 Kg; V1 = V2 = 50 Km/h

Solution:
Let us first look into the property of the “beam spring” used in Example 4.8, and have:
(10x106)(50x106)3
I  0.1042x10 18 m4
10 m 12
m
50 m 3(190000x106)(0.1042x1018)
L = 1000 m m = 10 mg k  59.39 N/m
6
(1000x10 ) 3
Cross-section
of the beam
k 59.39
n   2437 Rad/s
m 105
Postulation: The two vehicles will tangle together after the collision, and the entangled
vehicles move at a velocity V as illustrated:
V

m1
m2

Thus, by law of conservation of momentum, we should have the velocity of the entangled
vehicles to be:
 12000x50  8000x50
V  m1V 1 m 2V 2   10 Km/h
m1  m2 12000 8000

The decelerations of the two vehicles are:

X&  V  V 1 for vehicle with m 1, and X&

V  V2 for vehicle with m2
t t
in which ∆t = time required for deceleration.

Let us assume that it takes 0.5 second for vehicle 1 to decelerate from 50 Km/hr to
10 Km/hr after the collision. Thus the time for deceleration of the vehicle m1 is
t = 0.5 second, in the above expressions.
We may thus compute the deceleration of vehicle m1 to be:
(10  50)x10 3
/3600
X& abase   22.22 m/s2
0.5

Let ω = frequency of vibration of the vehicles.

Assume that ω<< ωn, (ωn =the natural frequency of the accelerometer = 2437 rad/s2).

Consequently, we may approximate the amplitude of vibration of the proof mass in the
accelerometer using Eq. (4.33) as:

 22.22 6
Z & abase    3.74x10 m, or 3.74 µm
 2n (2437)2
We thus have the maximum deflection of the cantilever beam of 3.74 µm at the free end in
the accelerometer. The equivalent force acting at the free-end is:

3EIZ 3(1.9x1011 )(0.1042x1018 )(3.74x106 )

F  6 3
 2.2213x10 4 N
L3 (1000x10 )
From which, we may compute the maximum bending moment at the support to be:

Mmax = FL in which L is the length of the beam. The numerical value of Mmax is:
 M max  2.2213x104 x103  2.2213x107 N-m

The corresponding maximum stress,σmax is:

M max C (2.2213x107 )(25x106 )

 max    532.95x10 5 N/m2 or Pa
I 0.1042x10 18

and the corresponding max. strain is obtained by using the Hooke’s law to be:

53.30x105
 max
 max    02.81x10 4
 0.0281%
E 9
190x10

Depending on the transducer used in the microaccelerometer, the maximum stress, σmax
can produce a resistance change in the case of “piezoresistors”. Alternatively, the maximum
strain, εmax will produce a change of voltage if “piezoelectric crystal” is used as the transducer.
(Detail descriptions available in Chapter 7)

Piezoresistor Proof mass

Beam spring
Piezoelectric
Overview of Finite Element Stress Analysis (p.173)

Finite element method (FEM) is a powerful tool in stress analysis of MEMS and
microsystems of complex geometry, loading and boundary conditions.

Commercial FEM codes include: ANSYS, ABAQUS, IntelliSuites, MEMCad, etc.

The essence of FEM is to discretize (divide) a structure made of continuum into a finite
number of “elements” interconnected at “nodes.” Elements are of specific geometry.

One may envisage that smaller and more elements used in the discretized model
produces better results because the model is closer to the original continuum.

Continuum mechanics theories and principles are applied on the individual elements,
and the results from individual elements are “assembled” to give results of the overall
Structure.
 I/O in FEM for Stress Analysis
● Input information to FE analysis:
(1) General information:

 Profile of the structure geometry.

y
 Establish the coordinates:
z
x

y x
r z
x-y for plane
r-z for axi-symmetrical x-y-z for 3-dimensional geometry

(2) Develop FE mesh (i.e. discretizing the structure):

Use automatic mesh generation by commercial codes.

User usually specifies desirable density of nodes and elements in specific regions.
(Place denser and smaller elements in the parts of the structure with abrupt change of
geometry where high stress/strain concentrations exist)
(3) Material property input:

In stress analysis: Young’s modulus, E; Poisson ratio, ; Shear modulus of elasticity, G;

Yield strength, y; Ultimate strength, u.

In heat conduction analysis: Mass density, ; Thermal conductivity, k; Specific heat, c;

Coefficient of linear thermal expansion coefficient, .

(4) Boundary and loading conditions:

In stress analysis: Nodes with constrained displacements (e.g. in x-, y- or z-direction);

Concentrated forces at specified nodes, or pressure at specified element edge surfaces.

In heat conduction analysis: Given temperature at specified nodes, or heat flux at

specified element edge surfaces, or convective or radiative conditions at specified
element surfaces.
● Output from FE analysis
(1)Nodal and element information

Displacements at nodes.

Stresses and strains in each element:

- Normal stress components in x, y and z directions;
- Shear stress components on the xy, xz and yz planes;
- Normal and shear strain components
- Max. and min. principal stress components.
- The von Mises stress defined as:

 
1
 xx   yy 2
  xx   zz 2
 
 yy   2
zz   6 2
xy   2
yz   xz 
2 (4.71)
2
The von Mises stress is used to be the “representative” stress in a multi-axial stress
situation.

It is used to compare with the yield strength, y for plastic yielding, and to u for the
prediction of the rupture of the structure, often with an input safety factor.
Application of FEM in stress analysis of silicon die in a pressure sensor:
by V. Schultz, MS thesis at the MAE Dept., SJSU, June 1999 for LucasNova Sensors
In Fremont, CA. (Supervisor: T.R. Hsu)

Regionfor
FE Model

Silicon diaphragm

Silicon die

Die Attach
View on Section“A-A”

Signal generators
Pyrex Constraint and interconnect
A A
Pressurized Medium

Silicon Metal
Diaphragm Adhesive Casing

Pyrex Glass
Constraining Passage for

Note: Only quarter of the die structure was Base Pressurized

Medium

in the FE model due to symmetry in

geometry, loading and boundary
conditions.
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