SM4TxxAY, SM4TxxCAY

Datasheet

Automotive 400 W TVS in SMA

Features

• AEC-Q101 qualified
• Peak pulse power:
– 400 W (10/1000 μs)
– 2.3 kW (8/20 μs)
• Stand-off voltage range from 5 V to 70 V
• Unidirectional and bidirectional types
• Low leakage current:
– 0.2 µA at 25 °C
– 1 μA at 85 °C
• Operating Tj max: 150 °C
• JEDEC registered package outline
• Resin meets UL94, V0
Product status link

SM4T6V7AY, SM4T6V7CAY,
Complies with the following standards
SM4T7V6AY, SM4T7V6CAY,
SM4T10AY, SM4T10CAY, • ISO 10605, C = 150 pF, R = 330 Ω:
SM4T12AY, SM4T12CAY, – 30 kV (air discharge)
SM4T14AY, SM4T14CAY, – 30 kV (contact discharge)
SM4T15AY, SM4T15CAY,
• ISO 10605, C = 330 pF, R = 330 Ω:
– 30 kV (air discharge)
SM4T18AY, SM4T18CAY,
– 30 kV (contact discharge)
SM4T21AY, SM4T21CAY,
• ISO 7637-2 (not applicable to parts with VRM lower than battery voltage 13.5 V):
SM4T23AY, SM4T23CAY,
– Pulse 1: VS = -150 V
SM4T26AY, SM4T26CAY,
– Pulse 2a: VS = +112 V
SM4T28AY, SM4T28CAY,
– Pulse 3a: VS = -200 V
SM4T30AY, SM4T30CAY,
– Pulse3b: VS = +150 V
SM4T33AY, SM4T33CAY,
SM4T35AY, SM4T35CAY,
Description
SM4T39AY, SM4T39CAY,
SM4T47AY, SM4T47CAY, The SM4TY series are designed to protect sensitive automotive circuits against
SM4T50AY, SM4T50CAY, surges defined in ISO 7637-2 and against electrostatic discharges according to
ISO 10605.
SM4T56AY, SM4T56CAY,
The Planar technology makes it compatible with high-end circuits where low leakage
SM4T68AY, SM4T68CAY, current and high junction temperature are required to provide long term reliability and
SM4T82AY, SM4T82CAY stability. SM4TY devices are packaged in SMA (SMA footprint in accordance with
IPC 7531 standard).

DS6927 - Rev 5 - January 2022 www.st.com

For further information contact your local STMicroelectronics sales office.
 SM4TxxAY, SM4TxxCAY
Characteristics

1 Characteristics

Table 1. Absolute maximum ratings (Tamb = 25 °C)

Symbol Parameter Value Unit

IEC 61000-4-2 (C = 150 pF, R = 330 Ω)

Contact discharge 30
Air discharge 30
VPP Peak pulse voltage kV
ISO10605 (C = 330 pF, R = 330 Ω)
Contact discharge 30
Air discharge 30
PPP Peak pulse power dissipation Tj initial = Tamb 400 W

Tstg Storage temperature range -65 to +150 °C

Tj Operating junction temperature range -55 to +150 °C

TL Maximum lead temperature for soldering during 10 s 260 °C

Figure 1. Electrical characteristics - parameter definitions

Figure 2. Pulse definition for electrical characteristics

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Characteristics

Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified)

10 / 1000 µs 8 / 20µs
IRM max at VRM VBR at IR (1) αT
VCL(2)(3) IPP(4) RD VCL(2)(3) IPP(4) RD
Type
25 °C 85°C Min. Typ. Max. Max. Max. Max. Max. Max.

µA µA V V V V mA V A Ω V A Ω 10-4/°C

SM4T6V7AY/CAY 20 50 5 6.4 6.74 7.1 10 9.2 43.5 0.049 13.4 174 0.036 5.7
SM4T7V6AY/CAY 20 50 6.5 7.2 7.58 8 10 11.2 35.7 0.091 14.5 160 0.041 6.1
SM4T10AY/CAY 20 50 8.5 9.4 9.9 10.4 1 14.4 27.7 0.145 19.5 124 0.073 7.3
SM4T12AY/CAY 0.2 1 10 11.1 11.7 12.3 1 17 23.5 0.201 21.7 106 0.089 7.8
SM4T14AY/CAY 0.2 1 12 13.3 14 14.7 1 19.9 20.1 0.259 25.3 91 0.116 8.3
SM4T15AY/CAY 0.2 1 13 14.4 15.2 16 1 21.5 18.6 0.298 27.2 85 0.132 8.4
SM4T18AY/CAY 0.2 1 15 16.7 17.6 18.5 1 24.4 16.4 0.361 32.5 71 0.197 8.8
SM4T21AY/CAY 0.2 1 18 20.0 21.1 22.2 1 29.2 13.7 0.514 39.3 59 0.291 9.2
SM4T23AY/CAY 0.2 1 20 22.2 23.4 24.6 1 32.4 12.3 0.637 42.8 54 0.338 9.4
SM4T26AY/CAY 0.2 1 22 24.4 25.7 27 1 35.5 11.2 0.760 48.3 48 0.444 9.6
SM4T28AY/CAY 0.2 1 24 26.7 28.1 29.5 1 38.9 10.3 0.912 50 46 0.446 9.6
SM4T30AY/CAY 0.2 1 26 28.9 30.4 31.9 1 42.1 9.5 1.07 53.5 43 0.502 9.7
SM4T33AY/CAY 0.2 1 28 31.1 32.7 34.3 1 45.4 8.8 1.26 59 39 0.632 9.8
SM4T35AY/CAY 0.2 1 30 33.3 35.1 36.9 1 48.4 8.3 1.39 64.3 36 0.762 9.9
SM4T39AY/CAY 0.2 1 33 36.7 38.6 40.5 1 53.3 7.5 1.70 69.7 33 0.884 10
SM4T47AY/CAY 0.2 1 40 44.4 46.7 49 1 64.5 6.2 2.49 84 27 1.30 10.1
SM4T50AY/CAY 0.2 1 43 47.8 50.3 52.8 1 69.4 5.7 2.91 91 25 1.53 10.2
SM4T56AY/CAY 0.2 1 48 53.3 56.1 58.9 1 77.4 5.2 3.56 100 23 1.79 10.3
SM4T68AY/CAY 0.2 1 58 64.4 67.8 71.2 1 93.6 4.3 5.21 121 19 2.62 10.4
SM4T82AY/CAY 0.2 1 70 77.8 81.9 86 1 113 3.5 7.72 146 16 3.75 10.5

1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25))

2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25))
3. To calculate VCL max versus IPPappli: VCLmax = VCL - RD x (IPP - IPPappli) where IPP appli is the surge current in the
application
4. Surge capability given for both directions for unidirectional and bidirectional devices

DS6927 - Rev 5 page 3/14

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Characteristics (curves)

1.1 Characteristics (curves)

Figure 3. Maximum peak power dissipation versus initial Figure 4. Maximum peak pulse power versus exponential
junction temperature pulse duration
PPP (W) PPP (kW)
10
500
Tj initial = 25 °C
10/1000 µs

400

300

200

100

Tj (°C) t p (ms)
0 0.1
0 25 50 75 100 125 150 175 0.01 0.1 1 10

Figure 5. Maximum peak pulse current versus clamping

Figure 6. Dynamic resistance versus pulse duration
voltage
RD (Ω)
IPP (A) 100
1000
8/20 µs

10/1000 µs 10

100

SM4T82AY/CAY
1

SM4T30AY/CAY
10
0.1

SM4T6V7AY/CAY
SM4T6V7A/CAY

SM4T30A/CAY

SM4T82A/CAY

1 0.01

t p (ms)
VCL (V) 0.001
0.1 0.01 0.1 1 10
1 10 100 1000

Figure 7. Junction capacitance versus reverse applied Figure 8. Junction capacitance versus applied voltage
voltage (unidirectional type) (bidirectional type)

C (pF) C (pF)
10000 10000
f = 1 MHz f = 1 MHz
Vosc = 30 mV RMS Vosc = 30 mV RMS
Tj = 25 °C Tj = 25 °C

1000 SM4T6V7AY 1000 SM4T6V7AY

SM4T30AY SM4T30AY
100 100

SM4T82AY SM4T82AY

VR (V) VR (V)
10 10
1 10 100 1000 1 10 100 1000

DS6927 - Rev 5 page 4/14

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Characteristics (curves)

Figure 10. Peak forward voltage drop versus peak forward

Figure 9. Leakage current versus junction temperature
current
IR (nA) IF (A)
1000 100.0
VR = VRM
single pulse

100

10.0
VRM < 10 V
10
Tj = 125 °C
Tj = 25 °C

1 VRM ≥ 10 V 1.0

T j (°C)
0
25 50 75 100 125 150 VF (V)
0.1
0 0.5 1.5 2 2.5 3 3.5

Figure 11. Thermal impedance junction to ambient versus Figure 12. Thermal resistance junction to ambient versus
pulse duration copper area under each lead

Zth(j-a) (°C/W) Rth(j-a) (°C/W)

160
1000
Single pulse on recommended footprint. Single pulse on recommended footprint.
Epoxy printed circuit board FR4, 70 µm Cu thickness 140 Epoxy printed circuit board FR4, 70 µm Cu thickness

120

100
100

80

60
10

40

20
t p (s)
SCu (cm²)
1 0
0.01 0.1 1 10 100 1000 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

Figure 13. ISO7637-2 pulse 1: Vs = -150 V with 12 V Figure 14. ISO7637-2 pulse 2a: Vs = +112 V with 12 V
battery battery

DS6927 - Rev 5 page 5/14

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Characteristics (curves)

Figure 15. ISO7637-2 pulse 3a: Vs = -220 V with 12 V Figure 16. ISO7637-2 pulse 3b: Vs = +150 V with 12 V
battery battery

DS6927 - Rev 5 page 6/14

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Package information

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

2.1 SMA package information

Figure 17. SMA package outline

E1

A1

C A2
L b

Table 3. SMA package mechanical data

Dimensions

Ref. Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.074 0.097

A2 0.05 0.20 0.001 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.005 0.016
D 2.25 2.90 0.088 0.115
E 4.80 5.35 0.188 0.211
E1 3.95 4.60 0.155 0.182
L 0.75 1.50 0.029 0.060

DS6927 - Rev 5 page 7/14

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SMA package information

Figure 18. SMA recommended footprint in mm (inches) Figure 19. SMA marking

1.40 2.63 1.40

(0.055) (0.104) (0.055)

1.64
(0.065)

5.43
(0.214)

Figure 20. Package orientation in reel Figure 21. Tape and reel orientation

Figure 22. 13'' reel dimension values Figure 23. Inner box dimension values

DS6927 - Rev 5 page 8/14

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SMA package information

Figure 24. Tape outline

Table 4. Tape dimension values

Dimensions

Ref. Millimeters

Min. Typ. Max.

D0 1.40 1.50 1.60

D1 1.50
F 5.40 5.50 5.60
K0 2.26 2.36 2.46
P0 3.90 4.00 4.10
P1 3.90 4.00 4.10
P2 1.95 2.00 2.05
W 11.70 12.00 12.30

DS6927 - Rev 5 page 9/14

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Reflow profile

2.2 Reflow profile

Figure 25. ST ECOPACK recommended soldering reflow profile for PCB mounting

Temperature (°C) 240-245 °C

250 -2 °C/s
2 - 3 °C/s

200 60 sec
(90 max) -3 °C/s
150
-6 °C/s
100
0.9 °C/s
50
Time (s)

0 30 60 90 120 150 180 210 240 270 300

Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.

DS6927 - Rev 5 page 10/14

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Application and design guidelines

3 Application and design guidelines

More information is available in the application note AN2689 “Protection of automotive electronics from electrical
hazards, guidelines for design and component selection”.

DS6927 - Rev 5 page 11/14

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Ordering information

4 Ordering information

Table 5. Ordering information

Order code Marking Package Weight Base qty. Delivery mode

SM4TxxAY/CAY(1) See Table 6. Marking. SMA 72 mg 5000 Tape and reel

1. Where xx is nominal value of VBR and A or CA indicates unidirectional or bidirectional version.

Table 6. Marking

Order code Marking Order code Marking

SM4T6V7AY AEY SM4T6V7CAY AAY

SM4T7V6AY DUCY SM4T7V6CAY DBCY
SM4T10AY DUHY SM4T10CAY DBHY
SM4T12AY AXY SM4T12CAY ACY
SM4T14AY DUKY SM4T14CAY DBKY
SM4T15AY BGY SM4T15CAY BHY
SM4T18AY BMY SM4T18CAY AJY
SM4T21AY DUQY SM4T21CAY DBQY
SM4T23AY DURY SM4T23CAY DBRY
SM4T26AY DUSY SM4T26CAY DBSY
SM4T28AY DUTY SM4T28CAY DBTY
SM4T30AY DUUY SM4T30CAY DBUY
SM4T33AY CGY SM4T33CAY CHY
SM4T35AY CKY SM4T35CAY CLY
SM4T39AY CMY SM4T39CAY CNY
SM4T47AY DUZY SM4T47CAY DBZY
SM4T50AY EUAY SM4T50CAY EBAY
SM4T56AY CXY SM4T56CAY CYY
SM4T68AY EUFY SM4T68CAY EBFY
SM4T82AY EUIY SM4T82CAY EBIY

Note: Marking differentiation between unidirectional and bidirectional devices is done with cathode bar.

DS6927 - Rev 5 page 12/14

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Revision history
Table 7. Document revision history

Date Version Changes

08-Sep-2010 1 Initial release.

09-Nov-2011 2 Added order codes in Table 2 and Table 4. Updated Figure 5, 6 and 7.
27-Mar-2012 3 Added footnote on page 1.
05-Oct-2015 4 Updated Table 1.
26-Jan-2022 5 Minor text changes.

DS6927 - Rev 5 page 13/14

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