Republic of Iraq

Ministry of Higher education and Scientific Research

Al-Mustaqbal University College
Air Conditioning and Refrigeration Techniques
Engineering Department

Experimental investigation of new shape of extended

surfaces

Muntadher Shakir Neamah

Alaa Mohammed Abd
Ahmed Riyadh hadi
Karrar Hadi essmaail
Abduallah Hamza Abduallah
Hasaneen Sabah Swadi

Assist lecture Mustafa Mohammed Gabir

Babylon, Iraq

2021 – 2022
 ‫بسم اهلل الرمحن الرحيم‬

‫ين‬‫ذ‬‫ك الَّ ِ‬
‫َ‬ ‫َحسنَهُ ۚ أُوَٰلَئِ‬
‫ْ‬ ‫أ‬ ‫ن‬
‫َ‬ ‫و‬ ‫ع‬‫﴿ الَّ ِذين يَستَ ِمعُو َن الْ َق ْو َل فَ يَتَّبِ‬
‫َ‬ ‫َ‬ ‫ُ‬ ‫َ ْ‬
‫اب﴾‬ ‫اه ُم اللَّهُ ۚ َوأُوَٰلَئِ َ‬
‫ك ُه ْم أُولُو ْاْلَلْبَ ِ‬ ‫َه َد ُ‬

‫صدق اهلل العلي العظيم‬

‫سورة الزمر اية ‪81‬‬
 ‫االهداء‬
‫انى اننبً األمً انذي عهم األمم ‪ ........................‬رسىننا انكزٌم (صهى)‬

‫انى كم عٍه بكج مه خشٍت هللا‬

‫انى كم عٍه باحج ححزس فً سبٍم هللا‬

‫انى انشمىع انمحخزقت ومناهم انعهم ‪ ........................‬اساحذحً االفاضم‬

‫انى روح مه عهمنً االخالص‪ ،‬معهمً األول وقدوحً فً ٌانحٍاة ‪ .....‬واندي‬

‫انى مه غمزحنً بفٍض دعائها‪ ،‬فٍض انحنان ورمز انعطاء ‪ .............‬أمً‬

‫انى انقهىب انخً خفقج عهً خىفا ‪ ........................‬اخىحً واخىاحً‬

‫انى االٌدي انخً امخدث انى واسخنهضخنً ‪ ...................‬اصدقائً االوفٍاء‬

‫وبكم حىاضع ‪ ........................‬اهدي انٍكم ثمزة جهدي هذا‬

Abstract

This study investigated experimentally convection heat transfer coefficient

and heat transfer enhancement by using different pin fins shapes in
rectangular channel with air cross flow. Experimentally, the channel had
duct cross section width (w) of 65 mm, cross section depth (l) of 170 mm
and duct length (L) of 1200 mm. The experimental work covers the
following range: air velocity 0.648 – 1.418 m/s.

Experimental results show that the Nusselt number of cylindrical pin fins
values(30.18)to (33.45) , rectangular pin fins values (28) to (32.8) and cone
pin fins values (30.8) to (34.54)

Experimental investigation done by using rig. Its results showed

that the convection heat transfer coefficient increase with air velocity
increase and fins temperature decreases with air velocity increase.

The pin fins shape effect on heat transfer enhancement. In the present work
shown that cone pine fins were better in heat transfer enhancement than
rectangular and cylindrical pins fins.
 Table of Contents
Section Page
Subject
No. No.
Abstract
Table of Contents
Chapter One : Introduction
1.1 Back round 1
1.2 Heat Sink 4
1.3 Perforated Fins 6
1.4 Heat Transfer Method 7
1-5 Aim of the Present Work 7
1-6 Problem Statement 8
Chapter Two: Literature Review
2.1 General 7
2.2 Plate fin 15
2.3 Pin fin 11
2.4 Perforated fin 15
2.5 Porous fin 16
Chapter Three: Experimental Work
3.1 Calculation procedure 18
3.2 Experimental procedure 18
3.3 model 26
3.4 Nusselt number calculations 27
Chapter Four: Results and Discussion
4.1 General 29
4.2 Heat transfer coefficient 29
4.3 Validation 30
Chapter Five: Conclusions and Recommendations
5.1 Concluding Comments 32
5.2 Conclusions 32
5.3 Recommendations 33
References 35
Chapter One
Introduction
Chapter One Introduction
Chapter One

Introduction

1-1 Back round

The heat conducted through solids, walls or boundaries has to be

continuously dissipated to the surroundings or environment to maintain
the system in steady state conduction. In many engineering applications
large quantities of heat have to be dissipated from small areas. Heat
transfer by convection between a surface and the fluid surroundings it can
be increased by attaching to the surface thin strips of metals called fins.
The fins increase the effective area of the surface thereby increasing the
heat transfer by convection. The fins are also referred as “extended
surfaces”. Fins are manufactured in different geometries, depending up on
the practical applications Most of the engineering problems require high
performance heat transfer components with progressively less weights,
volumes, accommodating shapes and costs. Extended surfaces (fins) are
one of the heat exchanging devices that are employed extensively to
increase heat transfer rates. A pin fin is a cylinder or other shaped
element attached perpendicularly to a wall, with the transfer fluid passing
in cross-flow over the element. The rate of heat transfer depends on the
surface area of the fin. It increases the contact surface area, for example a
heat sink with fins. The heat transferred through the fins provides the
problem of determination of heat flow through a fin requires the
knowledge of temperature distribution through it. This can be obtained by
regarding the fin as a metallic plate connected at its base to a heated wall
and transferring heat to a fluid by convection. The heat flow through the
fin is by conduction.

The heat transferred through the fins provides the problem of

1
Chapter One Introduction
determination of heat flow through a fin requires the knowledge of
temperature distribution through it. This can be obtained by regarding the
fin as a metallic plate connected at its base to a heated wall and
transferring heat to a fluid by convection. The heat flow through the fin is
by conduction.

Thus the temperature distribution in a fin will depend upon the

properties of both the fin material and the surrounding fluid. The
enhancement of heat transfer is an important subject of thermal
engineering. The heat transfer from surface may, in general, be enhanced
by increasing the heat transfer coefficient between a surface and its
surrounding, or by increasing heat transfer area of the surface, or by both.
Extended surfaces that are well known as fins are commonly used to
enhance heat transfer in many industries. Heat transfer rate is increased
by using natural, forced or mixed convection. But now a day’s application
of natural convection to the cooling of electrical and electronic equipment
has received considerable attention over the years. Natural convection
does not require either a fan or a blower, is free of maintenance, has zero
power consumption, is low cost, the noise level is reduced and the
cleanliness of the system is improved. These features of natural
convection cooling play an important role in the electrical and electronic
cooling industry; therefore, natural convection plays an important role in
the design and the performance of the system. Improvements in the
design of natural convective cooling systems are required to deal with the
increased performance of electrical and electronic system.

Various systems of engineering are producing heat throughout their

operation, in the case when such heat isn’t rapidly dissipated to the
surrounding atmosphere, thus might result in that the temperature of
system components is increased, such by-product is resulting in

2
Chapter One Introduction
dangerous problems of overheating in the system and results in failure of
the system, thus the created heat in the system should be rejected to its
surroundings for maintaining the system at desired level of the
temperature to work properly [1]. In addition, the pin fins have various
industry application because of their good heat transfer efficiency, for
instance, in cooling regarding electronic components, heat exchangers, in
cooling regarding gas turbine blades, and so on. [2]. The e-cooling by
natural convection using finned heat sinks was typical practice since it
can be implemented easily, increased reliability and powerless operation
[3]. In addition, the extended Surface (Fins) was utilized in various
applications for increasing heat transfer from surface. Generally, a fin
material is of an elevated thermal conductivity, while fin was exposed to
flowing fluid, that will heat or cool it, with elevated thermal conductivity
which will allow elevated heat to be conducted from a wall through the
fin. Also, the fins were utilized for enhancing the convective heat transfer
in various engineering applications as well as offering considerable ways
to achieve a wide total heat transfer surface area with no utilization of
extreme amounts of the primary surface area. Commonly, fins were
utilized to the management of heat in the electrical appliances like
computer power supplies or sub-station transformers, while other
applications involve cooling of the IC engine, like fins in cars radiators.
Also, the fins were majorly utilized in trailing edges regarding blades of
the gas turbine, aerospace industry and e-cooling Plate fin heat
exchangers are widely used in automobile, aerospace, cryogenic and
chemical industries. They are characterized by high effectiveness. Plate-
fin and tube-fin heat exchangers have found application in a wide variety
of industries. Among them are air separation (production of oxygen,
nitrogen and argon by low temperature distillation of air), petro- chemical
and syngas production, helium and 4 hydrogen liquefiers, oil and gas

3
Chapter One Introduction
processing, automobile radiators and air conditioners, and environment
control and secondary power systems of aircrafts application in a wide
variety of industries. Among them are air separation (production of
oxygen, nitrogen and argon by low temperature distillation of air), petro-
chemical and syngas production, helium and 4 hydrogen liquefiers, oil
and gas processing, automobile radiators and air conditioners, and
environment control and secondary power systems of aircrafts.

These applications cover a wide variety of heat exchange scenarios, such

as:

1- Exchange of heat between gases, liquids or both

2- Condensation, including partial and reflux
3- Boiling
4- Sublimation and
5- Heater cold storage
1-2 Heat Sink

A heat sink can be defined as a device that dissipates heat from any
system resulting lower temperature difference and thermal resistance. The
primary motive of using a heat sink can be classified into:

1. improving the thermal management of system by increasing the heat

dissipation area available and.
2. increasing the functionality and reliability of a system the pin-fin heat
sink is the most promising one due to its capability of dissipating a
high heat flux.
3. These fins may protrude from either a rectangular or cylindrical base.
One of the commonly used heat exchanger fins are the pin fins. Heat
sink for electronics depends on conduction from the electronic
package to the heat sink base, followed by conduction into the

4
Chapter One Introduction
extended surfaces and convection to the cooling fluid. The rate of heat
dissipation depends on the .

(i) temperature distribution in pin-fins and its assembly

(ii) pin-fin geometry

(iii) pin-fin arrangement

(iv) fluid flow rate and

(v) Tip clearance

(vi) fluid flow direction.

The advantages of the pin-fin heat sinks include low thermal

resistance, high heat transfer efficiency, high heat transfer area density,
and its suitability for use with different coolants with little alteration in
the coolant loop. Various types of heat-exchanger fins, ranging from
relatively simple shapes, such as rectangular, cylindrical, annular, tapered
or pin fins, to a combination of different geometries, have been used.
Figure (1-1) presented shapes of pin fins that used in the present work.

Fig. (1-1) shapes of pin fins

5
Chapter One Introduction
Pin-fin heat sinks are also commonly used and have the added
advantage of not requiring specific positioning relative to flow direction.
Pin-fin heat sinks can be manufactured either by starting with a linearly
extruded parallel plate heat sink and then cutting the plates to form the
pins, or by building them using more costly specialized techniques such
as epoxy bonding, brazing and soldering. Figure (1-2) presented different
types of heat sink.

Fig. (1-2) shapes of heat sink

1-3 Perforated Fins
The presence of perforations in the extended surfaces (fins) have
many benefits. that lead to increasing the overall convection area and
good thermal management of the electronics, decreasing the pressure

6
Chapter One Introduction
drop across heat sink, reduction of fin’s weight significantly which leads
to saving material effectively in heat sinks manufacturing as well as
lighter assembly. The use of perforated benefit of Therefore, the present
study is concerned with heat sink systems having perforated pin fin which
are used to dissipate thermal energy from electronic devices.
1-4 Heat Transfer Method

Heat can be transferred in three different modes:

1. Conduction
2. Convection
3. Radiation
All modes of heat transfer require a temperature difference and all
modes range from average high temperature to average low temperature.
1-5 Aim of the Present Work
The main purpose of the present work is to gain a deeper insight
about perforated pin fin heat sink systems through studying temperature
and velocity distribution of four configurations of pin fin heat sinks at
different inlet velocity and heat flux by using experimental and numerical
techniques. that can be achieved through:
1. Experimental investigation of the fluid dynamic and heat transfer
process for perforated fin heat sink.
2. Identifying and studying the effect of variation of the non-
dimensional parameters governing the flow and heat transfer for
perforated fin heat sink.

7
Chapter One Introduction
1-6 Problem Statement

This chapter introduces the topic and explained the motivation for the
work. The following chapters provide background information and
outline the proposed research method as well as present results and
conclusions. Chapter 2 is an extensive review of the research of flow
behavior of fluid flow and perforated pin fins in laminar flows including
those conducted in a backward facing step. Chapter 3 provides a
Experimental procedure and test rig.. Results are shown and discussed in
Chapter 4 followed by summary, conclusions and recommendations in
Chapter 5.

8
Chapter Two
Literature Review
Chapter Two Literature Review

Chapter Two

Literature Review

2-1 General

Fins or extended surfaces are generally used in heat exchangers to

enhance heat transfer between the main surface and ambient fluid.
Various types of simple‐ shaped fins, namely, rectangular, square,
annular, cylindrical, and tapered, have been used with different
geometrical combinations. To satisfy industrial demand, different trials
have also been carried out for designing optimized fins. The optimization
of fins can be performed either by enhancing heat dissipation at an exact
fin weight or by diminishing the weight of the fin by precise heat
dissipation. Recently a notable amount of work on some typical fins, like,
porous fins and perforated fins, has also been carried out. This paper
presents a brief review on heat transfer enhancement using fins of
different types considering variable thermos physical and geometric
parameters, which will also be useful for future use of geometrical
modifications of extended surfaces, based on the cost and availability of
space.

2-2 Plate fin

Park et. Al. [4] introduced a correlation to estimate the Nusselt number
for vibration‐ assisted convection from plate fins arranged vertically. An
experimental investigation was carried out for different frequencies and
amplitudes of forced vibrations. The outcome of this experiment showed
that the Nusselt number for a vibrating fin is normalized to its value for a
static fin and also it is affected effectively by the ratio of the vibrating
speed and the velocity of buoyancy‐ driven flow.

9
Chapter Two Literature Review

Chang and Gwak [5] suggested a new application for a plate‐ fin heat
exchanger with regenerative cryocoolers, which adequately absorb
coolant stream and deliver it to the coldhead of the cryocooler. The
results showed that the plate‐ fin heat exchanger has 30% to 50% more
efficiency in cooling rate than that in the tubular heat exchanger.

Kuchhadiya and Rathod [6] experimentally investigated the thermal

performance of a cross‐ flow plate‐ fin heat exchanger with an offset
strip fin. Values of effectiveness, pressure drop, and heat transfer
coefficient were obtained for different values of inlet pressure and
temperature of hot and cold fluid. Finally, on the basis of these results,
the Colburn factor correlation was developed to predict the heat transfer
coefficient.

Khoshvaght‐ Aliabadi et al [7] compared the hydrothermal performance

between plate fins and pin fins in Nano fluid cooled corrugated miniature
heat sinks. The Reynolds number was considered between 100 and 900
for the experiments on the fabricated corrugated miniature heat sinks.
Outcomes showed that heat transfer of corrugated miniature heat sinks
with plate‐ pin fins is better than that with plate fins. Moreover, the
pressure drop around the plate‐ pin fins is lower in the corrugated
miniature heat sinks for the same heat dissipation.

Haghighi et al [8] analyzed heat transfer enhancement by natural

convection in a new design of plate‐ finned heat sinks. The investigation
6 6
was carried out for Rayleigh numbers from 8 × 10 to 9.5 × 10 where
heat input has been applied as 10 to 120 W. The results showed that heat
sinks with a cubic‐ shaped pin fin have major heat dissipation than that of
plate‐ finned heat sinks. Thermal enhancement of the new design of heat
sinks is also quite higher than that of ordinary pin‐ fins.

10
Chapter Two Literature Review

2-3 Pin fin

Pandit et al [9] investigated the effect of pin‐ fin geometry on heat

transfer performance as well as on the channel height ratio. The study was
concentrated on the procedures for the increment of heat transfer on the
heated region of the thermoelectric generator to enhance the net power
output from the device. The results showed that the diamond‐ shaped pin
fin causes maximum enhancement in the transfer of heat. Obstruction
(50%) in the channel is caused by pin fins due to lesser channel heights,
which give a higher value of heat transfer coefficients.

Ali and Briggs [10] investigated the retention of condensate on pin‐ fin
tubes, where an expression was proposed for the condensate retention
angle on pin‐ fin tubes which were found similar to the measured
retention angles within 15%.

Ali and Abubaker [11] again studied the vapor velocity's impact on
condensate detention in tubes with a horizontal pin fin. Increase in the
velocity of vapor leads to an increase in the retention angle of condensate
when the retention angle was below 90° at a low, approaching zero,
velocity of vapor. Zhang et al [12] analyzed bubble dynamics in nucleate
pool boiling on the microfinned surface. The results showed that the
radius of bubble detachment increases with increasing heat flux.

Cormier et al [13] used an additive manufacturing technique to make

pyramidal pin fins and observed the effects of fin height and density
under forced convection. The results revealed that the increment in fin
height was followed by a corresponding increase in fin density. Guan et al
[14] investigated the hydrodynamics in a bubble column with pin‐ fin
tube materials. The results showed that pin‐ fin tube materials affect the
liquid velocity and gas holdup. Data of the pin fin on tubes reduce the

11
Chapter Two Literature Review

distributor region in the column. Joo and Kim [15] compared the heat
transfer performance between pin and plate fin under free convection. For
optimizing the thermal performance, total heat transfer rate and the
dissipation of heat per unit mass were taken as objective functions. The
outcome of this study revealed that pin‐ fin heat sinks dissipated more
heat per unit mass as compared with plate‐ fin heat sinks. Agrawal et al
[16] experimentally analyzed the heat transfer agitation of passage flow
by surface‐ mounted cylindrical fins as well as active agitation. It was
observed that pin fins cause loss of near‐ wall momentum; however, they
produce significant mixing and three‐ dimensionality of the near‐ surface
flow.

Micheli et al [17] experimentally compared microscaled pin fins and

plate fins under natural convection. The outcome of the experiment
showed that the micropin fins can enhance the thermal performance when
compared with micro‐ plate‐ fin arrays. Moreover, micropin fins have
greater heat transfer coefficients, better material usage, and lesser thermal
resistances. Guan et al[18] worked on the impact of contact angle on flow
resistance decrement in hydrophobic micropin fins. The outcome revealed
that both values of friction factor and pressure drop were decreased with
the increment of angle and the flow rate was increased in elliptical
micropin fins. The performance of a solar still augmented with a pin‐ fin
wick was experimentally investigated by Alaian et al [19] as shown in
Figure 2. Experiments were conducted at a wide range of solar radiation
and ambient temperatures. The results showed that the increase in
distillate changes with ambient conditions. Wan et al [20] completed an
experimental investigation, as well as optimization of a pin‐ finned heat
sink under flow boiling. It has been observed that square micropin fins
showed a maximum rate of boiling heat transfer as compared with

12
Chapter Two Literature Review

circular‐ and diamond‐ shaped micropin fins.

Yang et al [21] identified the uniform design and optimization of the

pin‐ fin heat sink. Their results showed the validity of the regression
model and the effectivity of the optimal parameters. An experimental
investigation on heat transfer performance and pressure drop of
conventionally and additively fabricated pin‐ fin arrays was performed
by Kirsch and Thole.[22] When rough and smooth fin surfaces were
compared, it showed that the rough surface highly affects the friction
factor as well as augments heat transfer rather than smooth pin‐ fin
arrays. Deng et al [23] analyzed the flow‐ boiling improvement of
micro‐ pin–finned structured microchannels. The obtained results
revealed that the structured microchannel showed better flow‐ boiling
heat transfer enhancement than the conventional rectangular
microchannel. Ali and Arshad [24] experimentally investigated the
passive cooling of circular pin‐ fin heat sinks of electronic devices. It was
observed that the finned heat sink with 3 mm thickness showed great
improvement in operation for thermal management, which controls the
temperature of electronic devices. Arshad et al [25] experimentally
explored the influence of the diameter of a circular pin fin on heat transfer
management in electronic equipment. For this study, the diameter of the
pin fin changes from 2 to 4 mm, and results indicated that pin‐ fin heat
sink with 3 mm fin diameter showed the best thermal performance. Zhang
et al [26] established the critical heat flux (CHF) correlation of boiling in
FC‐ 72 with micropin fins for electronics cooling. It was observed that
fin configuration and pitch have significant impacts on CHF and the
boiling heat transfer coefficient. In another experiment they [27],[28]
used the drop tower facility to analyze nucleate boiling heat transfer
experimentally and noticed that the radius of bubble detachment increases

13
Chapter Two Literature Review

with the increase of heat flux. A new model of micro‐ pin‐ fin structure
was established to anticipate the radius of bubble departure on microfin
surface under microgravity. Moreover, a better heat transfer performance
has been observed in micropin fins under microgravity. Additionally,
they[29],[30] have identified the heat transfer characteristics of
submerged jet impingement boiling for air dissolved FC‐ 72 on the
micro‐ pin‐ fin surface and revealed that micro‐ pin–finned surface
showed better heat transfer performance than that of the smooth surface.
Again Kong et al [31] analyzed heat transfer through pool boiling around
the micro‐ pin–finned bistructured surface and noticed that the
bistructured surface improved heat transfer performance in a nucleate
boiling region. Again, heat transfer improvement for pool boiling of FC‐
72 around a mixed‐ wettability surface was investigated by Kong et
al.[32] The results revealed that the mixed‐ wettability surface showed
adequate nucleation sites and enhanced bubble interaction. Liu et al [33]
studied pool‐ boiling heat transfer for N‐ pentane around a
microstructured or nanostructured surface and observed that the heat
transfer coefficient of all micro/nanostructured surfaces increased with
the decrease of CHF. Again Liu et al [34] experimentally investigated the
pool ‐ boiling heat transfer of dissolved FC‐ 72 gas on a structured
surface by using the Hook‐ Back phenomenon. The results revealed that
enhancement of CHF around microstructured or nanos-tructured surface
occurred with the increase in subcooling. Cao et al[35] studied heat
transfer through pool boiling of FC‐ 72 around a pin‐ fin silicon surface
and found the enhancement of heat transfer around the micro‐ pin‐ fin
surface rather than the smooth surface. Zhou et al [36] developed a
bubble dynamics model to anticipate the diameter of bubble departure on
the micro‐ pin‐ fin surface under microgravity. In another experiment

14
Chapter Two Literature Review

Zhang et al [37] experimentally analyzed the improvement of pool‐

boiling heat transfer through micro‐ pin–finned surfaces. The results
showed that cylindrical micro‐ pin‐ fin surfaces had the maximum heat
transfer performance and the minimum superheat in nucleate boiling heat
transfer. On the other hand, Liu et al [38] also studied pool‐ boiling heat
transfer and investigated the CHF mechanism on femtosecond laser
processed surfaces. The study revealed that a small processed surface
showed no enhancement in critical flux but an improvement in heat
transfer coefficient than that of the smooth surface. Zhang et al [39]
further studied heat transfer characteristics for flow boiling of air
dissolved FC‐ 72 through a smooth surface under microgravity, where
they used the drop tower facility again. They observed that pool boiling
around a smooth surface showed less heat transfer than that of flow
boiling in microgravity.

2-4 Perforated fin

Awasarmol and Pise [40] experimentally investigated natural convection

heat transfer enhancement from a perforated rectangular fin array at
different inclinations. Steady‐ state heat transfer from perforated and
solid fin arrays was measured, which is represented in Figure 3. The
results showed that the enhancement of the heat transfer coefficient was
obtained with 12 mm dia-meter perforated fins with an orientation angle
of 45°. Shaeri and Bonner [41] experimentally analyzed laminar forced
convective heat transfer from the laterally perforated finned heat sink.
Outcomes showed that pressure drop was increased in laterally perforated
finned heat sinks due to cavities. Moreover, laterally perforated finned
heat sinks have favorable

thermal management solutions to reduce the thermal resistance and

15
Chapter Two Literature Review

enhance the temperature uniformity through the heat sink. Furthermore,

Shaeri and Bonner [42] studied the thermal performance of a heat sink
with laterally perforated fin for different flow systems. The results
showed that for an optimal range of porosities at a specified perforation
range, the laterally perforated finned heat sink has a lower thermal
resistance at a constant pumping power through the heat sink base.
Sakanova [43] worked on augmentation of heat transfer through
perforated finned heat sink for aircraft. The outcome of this study showed
that when air is used, the rate of heat transfer of perforated finned heat
sink is found to be greater than solid pin‐ fin geometry for laminar as
well as turbulent flow. It also reduced the weight of the heat sink, which
is beneficial for aerospace applications. Tijani and Jaffri [44] worked on
the thermal exploration of perforated pin‐ fins heat sink under the effect
of forced convection. It was observed that perforated pin fins with a heat
sink accelerate the thermal efficiency by 1% to 4% than that of solid pin
fins with a heat sink. Pankaj et al [45] performed an experimental
investigation on free convection in the array of perforated pin fin and
noticed the optimum rate of heat transfer for the perforated fins with 45°
angle as well as 4 mm perforation diameter.

2-5 Porous fin

Park et al.[46] performed the study of the convective heat transfer

coefficient for open‐ cell porous metal fins experimentally at low
Reynolds numbers. The fabrication of porous metal fins was completed
from nickel with various pore densities as well as porosities. An optical
method was used to measure the geometrical parameters of the test
samples.

Bilen et al [47] investigated the influence of aluminum porous fins on

16
Chapter Two Literature Review

heat transfer. It was observed that a higher gap above fins has a
remarkable impression on the Nusselt number whereas a longitudinal fin
pitch has a low effect on it.

Selimefendigil et al [48] modeled and experimentally analyzed a

photovoltaic (PV) module with porous fins. It was noticed that the
performance level increases in porous fins to the PV module.

17
Chapter Three
Experimental Work
Chapter Three Experimental Work

Chapter Three

Experimental Work

3-1 Calculation procedure

The system is analyses based on the performance parameters like h

and averaged Nu. The facility helps in measurement of various thermos
physical properties of the system like system dimensions, the velocity and
the temperature at various points. These quantities forms the basis for
calculation of h and Nu in the system. For the current system (Fig. 1a), at
various inlet flow velocities, with known values of temperature at inlet,
outlet and over the fins, the h is calculated from the thermal energy
balance. In ideal scenario, neglecting any heat loss from the back of the
heater and from the duct walls (Fig. 1a), the rate of heat convection from
the surface of the fin will be equal to the rate of heat carried by the
incoming air. Mathematically, it can be expressed as,

( ) ̇

where the Afin is the wetted surface area of the fin, the Tfin is the average
surface temperature and ̇ V) is the mass flow rate inside the
duct. Considering diameter D of the fin as the characteristic length, the
average Nu is calculated using h L / kf .

3-2 Experimental procedure

Experiments are carried out to understand the performance of a set

of aluminum pipe bundle arranged in a staggered manner. The set-up
consists of a vertical square duct with an axial flow fan placed just below
the outlet temperature sensor. Air enters the duct from the bottom and
leaves it from the top. The fins with the base plate are connected with the

18
Chapter Three Experimental Work

heater unit to supply heat from the bottom of the plate. The removable
set-up of fins with heating unit is placed inside the duct in the test section.
The placement of the fins in the test section provides normal direction of
flow to the incoming fluid. Fixed temperature sensors are provided at the
inlet and the outlet of the duct to measure the temperatures of incoming
and outgoing air, respectively. A portable thermocouple is also provided
to measure the temperature at different locations of the fins. The display
and control unit helps in controlling the speed of the fan and the amount
of supplied heat to the heating unit. Fig (3-1)

1. Air Duct
2. Centrifugal Ventilator
3. Temperature Sensors.
4. Data logger
5. Digital anemometer.
6. Pip bundle heating elements
7. Heater
8. Thermocouple

Fig (3-1) Test rig

19
Chapter Three Experimental Work

1- Air Duct

The vertical air tunnel (duct) of stainless steel of rectangular section (65
x170 mm.) and 1200 mm in length. It is resistant to the corrosion. It is so
constructed that the air temperature and velocity can be readily measured.
This tunnel has a rectangular central opening of 130 x 130 mm., that is
good to insert the different configurations of pin fin arrays (17 pin fin for
each heat sink) of known dimensions. Figure (3-2)

Fig (3-2) Air Duct

2- Centrifugal Ventilator

The air stream passing through the conduct is produced by a centrifugal

ventilator (Power =0.75 kW, Air speed up to 25 m/sec) that draws air
from inside the conduct and expels it outside. The air current through the
ventilator and the conduct is controlled by a speed variator that will let us
control the air volume through the tunnel. Fig (3-3) shows the ventilator
and its support-stands.

20
Chapter Three Experimental Work

Fig (3-3) Centrifugal ventilator

3. Temperature Measurement

A paperless temperature recorder, using SD card to save the data

along with time information is used. It is a real time data logger, saving
the 12 channels temperature. Data was measured along the time
information into the SD memory card. SD capacity: 1 to 16 GB,
RS232/USB computer interface, as shown in figure (3.4 a).

In the present work, 12 channels with type K thermocouples

(chromium--aluminum+) were used. Data logger sampling time range: 1 to
3600 seconds. Thermocouple type K: -100 to 1300 °C. Channel one was
used to measure the temperature of heating water. Channels from number
two to eleven were fixed in different position in the rig pipe to measure
the temperatures of air-water flow at different positions.

Microcomputer circuit provides intelligent function and high

accuracy to present the maximum and minimum readings. Figure (3-4b)
which shows the calibration certificate of temperature recorder device.

21
Chapter Three Experimental Work

Figure (3-4 a) Temperature recorder device.

Figure (3-4 b) Calibration certificate.

4. Calibration of Temperature Recorder Device:

The thermocouples of the data logger are calibrated against a

mercury thermometer. The calibration is performed only for channels 1
and 12. The recorded values of the two devices are shown in table (3-1)
for channel No.1 and table (3-2) for channel No.12. Figures (3.5) and

22
Chapter Three Experimental Work

(3.6) represent the calibration curve of channels No.1 and No.12

respectively.

The other channels from number two to eleven were calibrated by

using the value of accuracy as shown in table (3-1)
for type K thermocouple according to the reading temperature range
to . Then, Appendix (A) shows the values of
instantaneous local temperature calibration for all channels with different
time intervals and distance for two types of flow patterns bubbly and slug
flow.

The local time average temperature is calculated as follow:

∑
………5 (552)
Where (Ti) is the instantaneous local temperature and (n) is the
number of time intervals.

Table (3-1) the temperature values of two devices for channel No.1.

Reads of Data Reads of Thermometer

No.
logger (°C) Device (°C)
1 2.52 22

2 5.5. 5.5.

3 ..52 ..54

4 ..54 .4

5 .55. ..5.

23
Chapter Three Experimental Work

Table (3-2) the temperature values of two devices for channel No.12.

Reads of Data Reads of Thermometer

No.
logger (°C) Device (°C)
1 2255 2.5.
2 5252 5.54
3 ..5. .55.
4 .254 ..
5 ..5. .25.

Fig (3-5) Calibration curve for channel No. 1

24
Chapter Three Experimental Work

Fig (3-6) Calibration curve for channel No. 12

5. Digital Anemometer

It is used to measure the average air velocity at entry and exit of the test
section.

It is a vane-type (model DA40) probe portable anemometer which

provides fast and accurate readings, with digital readability and the
convenience of a remote sensor separately, as shown in Fig (3-7). The
low friction ball bearing design allows free vane movement, resulting in
accuracy at both high and low velocities. The sensitive balanced vane
wheel rotates freely in response to airflows. The accuracy of the
anemometer is (± 1%).

25
Chapter Three Experimental Work

Fig. (3-7) Digital anemometer.

3-3 model

Fig. (3-8), show the lest rig that used in the present work.

26
Chapter Three Experimental Work

Fig. (3-9) Schematic diagram of the Experimental Setup

3-4 Nusselt number calculations

Nusselt number is a measure of the ratio between heat transfer by
convection and heat transfer by conduction alone.

Nu=hD/k

h: convection heat transfer coefficient (w/m2.k)

D: hydraulic diameter (m)

K: thermal conductivity of air (w/m.k)

27
Chapter Three Experimental Work

Table (3-3) shown value of (K) of air at different temperature values

No Temperature K of air
(C) w/m.k
1 22 0.02522
2 23.5 0.02531
3 24 0.02547
D= A/P

A=L*W

A=0.065*0.17=0.01105 m2

P=2(L*W)

P=2(0.065+0.17)=0.47 m

D=0.01105/0.47=0.02354 m

Table (3-4) shown value of( Nusselt number) of different pin fins
shapes

h Dh K air T air Nu
w/m2.k m w/m.k (c)
30 0.02354 0.02522 22 28
Rectangular 33.8 0.02354 0.02531 23.5 31.43
35.5 0.02354 0.02547 24 32.8
32.34 0.02354 0.02522 22 30.18
Cylindrical 35.16 0.02354 0.02531 23.5 32.7
36.2 0.02354 0.02547 24 33.45
33 0.02354 0.02522 22 30.8
Cone 36.9 0.02354 0.02531 23.5 34.31
37.38 0.02354 0.02547 24 34.54

28
 Chapter Four
Results and Discussion
Chapter Four Results and Discussion

4-1 General

To perform the experiment properly, several materials were used.

Aluminum metal was used to construct the pin fin array. One multi meter
was used for measuring current flow through the base, voltage regulator
for regulate voltage supply at a particular heat supply, a data logger for
measuring fin temperature at base and surface at different locations.

4-2 Heat transfer coefficient

Figure (4-1) that it is observed that the convection heat transfer

coefficient increases with the increase of air velocity, as we observed that
the shape (pin fin) used also affects the value of the convection heat
transfer coefficient, so we observed that the value of the heat transfer
coefficient for the shape of the cone is higher than the cylindrical and
higher than the rectangular due to the increase in the surface area of heat
transfer

constant heat flux

38
cone
36
cylinder
h w/m2c

34 rectangular

32

30

28
0.0 0.5 1.0 1.5
Air velocity m/s

Figure (4-1): Variation of heat transfer with a coefficient with air velocity

29
Chapter Four Results and Discussion

Figure (4-2) showen variation fins temperature with air velocity for
different fins shapes. the fine temperature decreases air velocity increate.
the air velocity increase causing dissipation of heat transfer from fins
that’s vendee the fins temperature. also fins shapes has different
temperature arrange shown in figure (4-2). the cone in shape was better
thar other shape.

constant heat flux

32

30

28
TfinoC

26 cone

24 cylinder
rectangular
22
0.0 0.5 1.0 1.5
Air velocity m/s
Figure (4-2): Variation of fin temperature with air velocity.

4-3 Validation

The present work wowld validation with another work tijani taffri (49 )
when validate reswlt of the present work fourd that enhansment in
conveetien heat transfer coefficient abant (6.2% ) far cylindericel fins .

30
Chapter Four Results and Discussion

Table

velocity Present work Tijani & Jaffri

0.648 32.34 30.32
1.024 35.16 34.2
1.418 36.2 35.82

37

36

35

34
h ( W / M2 )

33

32

31

30

29

28

27

Present
Work
Velocity ( m / s )
Fig

31
Chapter Five
Conclusions and
Recommendations
Chapter Five Conclusions and Recommendations

Chapter Five

Conclusions and Recommendations

5-1 Concluding Comments

It is hoped that the information included in the present study will

help engineers to become more familiar with the various options
available through the use of perforation pin fins heat sink systems. The
methods of analysis outlined here, and the correlations included, should
facilitate this although designs can be performed for many types of
systems with the computer approach outlined. Hopefully, designers will
recognize the significant performance improvements possible for many
applications with the use of perforation pin fins heat sink systems.

5-2 Conclusions

In this study, the overall heat transfer, friction factor, thermal

efficiency, overall enhancement ratio, fin effectiveness and thermal
resistance are investigated experimentally and numerically. The effects of
the working fluid flow and horizontal/lateral/vertical perforated pin fin
array on the overall heat transfer, friction factor, thermal efficiency,
overall enhancement ratio, fin effectiveness and thermal resistance are
determined. The conclusions are summarized as:

1- Average Nusselt number increases with increasing perforations like

lateral perforations.
2- Friction factor decreases with increasing contact surface area due to
perforations.
3- HLV perforated pin fin array has a highly thermal dissipated and lower
pressure drop relative to solid and HV perforated pin fin arrays
4- Maximum overall enhancement ratio is obtained with a minimum

32
Chapter Five Conclusions and Recommendations

value of Reynolds number and it is a higher value for HLV perforated

pin fin array.
5- Nusselt number of pins with horizontal/vertical (HV) perforation is
about 11% higher than that for solid pins and with horizontal
/vertical/lateral (HLV) perforation is about 21% higher than that for
the solid pins.
6- Pressure drop with horizontal/vertical (HV) perforation is reduced by
about 23% compared with that in solid pins and with
horizontal/vertical/lateral (HLV) perforation reduced by about 19%
compared with that in solid pins
7- The weight reduction for the single HV perforated pin fin is 15.4%
relative to that in solid pin fin and the weight reduction for the single
HLV pin fin is 21.65 % relative to solid pin fin .That means HLV
perforated pin fin is lighter than solid and HV. HLV perforated pin fin
array. This is achieved in economically.
8- Intensity velocity vectors for HLV pin fin are higher than for HV pin
fin because the lateral perforations provide lower pressure inside the
horizontal perforations and it allows the flow to pass inside it.
9- HLV perforation pin fins gave a higher reduction in surface
temperatures than solid pin fins and HV perforation.
5-3 Recommendations

The recommendations for future research on this topic are as follows:

1.Treating the problem as three dimensional problems and natural

convection, however the gravity of air and mixed convection is
significant and should be taken into account.

2. Considering the time effect and the inclusion of the unsteady-state term
in the governing equation should be considered.

33
Chapter Five Conclusions and Recommendations

3. Studying the same problem experimentally and numerically for the

condition of impingement of flow.

4. Studying the difference between staggered and in-line perforated pin-

fin heat sinks.

5. Studying the optimization of perforated fin spacing and gaps between

heat sinks to maximize heat transfer from an array of heat sinks.

6. Studying the effect of perforation orientation with flow direction to

maximize heat transfer from an array of perforated pin fin heat sinks.

7. Studying Turbulence modelling of pin fin heat sink systems

numerically.

34
References
References

1. A.A. Walunj and D.D. Palande, “Experimental Analysis of Inclined

Narrow Plate-Fins Heat Sink under Natural Convection”, International
Journal of Mechanical Engineering, Vol. 2, No. 6, Pp. 8–13, 2014.
2. S.D. Bahadure and G.D. Gosavi, “Enhancement of Natural
Convection Heat Transfer from Perforated Fin”, International Journal
of Engineering Research, Vol. 3, No. 9, Pp. 531-535, 2014.
3. I. Tari and M. Mehrtash, “Natural convection heat transfer from
horizontal and slightly inclined plate-fin heat sinks”, Applied Thermal
Engineering, Vol. 61, No. 2, Pp. 728–736, 2013.
4. Park KT, Lee JW, Lee MG, Kim HJ, Kim DK. Nusselt number
correlation for vibration‐assisted convection from vertically oriented
plate fins. Int J Heat Mass Transfer. 2014;78:522‐526.
5. Chang HM, Gwak KH. New application of plate‐fin heat exchanger
with regenerative cryocoolers. Cryogenics (Guildf). 2015;70:1‐8.
6. Kuchhadiya BB, Rathod PP. Experimental investigation of thermal
behavior of cross flow plate‐fin heat exchanger with offset strip fin.
Procedia Technol. 2016;23:423‐430.
7. Khoshvaght‐Aliabadi M, Hassani SM, Mazloumi SH. Comparison of
hydrothermal performance between plate fins and plate‐pin fins
subject to nanofluid‐cooled corrugated miniature heat sinks.
Microelectron Reliab. 2017;70:84‐96.
8. Haghighi SS, Goshayeshi HR, Safaei MR. Natural convection heat
transfer enhancement in new designs of plate‐fin based heat sinks. Int
J Heat Mass Transfer. 2018;125:640‐647.
9. Pandit J, Thompson M, Ekkad SV, Huxtable ST. Effect of pin fin to
channel height ratio and pin fin geometry on heat transfer performance
for flow in rectangular channels. Int J Heat Mass Transfer. 2014;77:
359‐368.

35
References

10.Ali HM, Briggs A. An investigation of condensate retention on pin‐fin

tubes. Appl Therm Eng. 2014;63(2): 503‐510.
11.Ali HM, Abubaker M. Effect of vapour velocity on condensate
retention on horizontal pin‐fin tubes. Energy Convers Manage.
2014;86:1001‐1009.
12.Zhang Y, Wei J, Xue Y, Kong X, Zhao J. Bubble dynamics in
nucleate pool boiling on micro‐pin‐finned surfaces in microgravity.
Appl Therm Eng. 2014;70(1):172‐182.
13.Cormier Y, Dupuis P, Farjam A, Corbeil A, Jodoin B. Additive
manufacturing of pyramidal pin fins: height and fin density effects
under forced convection. Int J Heat Mass Transfer. 2014;75:235‐244.
14.Guan X, Gao Y, Tian Z, Wang L, Cheng Y, Li X. Hydrodynamics in
bubble columns with pin‐fin tube internals. Chem Eng Res Des.
2015;102:196‐206.
15.Joo Y, Kim SJ. Comparison of thermal performance between plate‐fin
and pin‐fin heat sinks in natural convection. Int J Heat Mass Transfer.
2015;83:345‐356.
16.Agrawal S, Simon TW, North M, Bissell D, Cui T. Heat transfer
augmentation of a channel flow by active agitation and surface
mounted cylindrical pin fins. Int J Heat Mass Transfer. 2015;87:557‐
567.
17.Micheli L, Reddy KS, Mallick TK. Experimental comparison of
micro‐scaled plate‐fins and pin‐fins under natural convection. Int
Commun Heat Mass Transfer. 2016;75:59‐66.
18.Guan N, Jiang G, Liu Z, Zhang C, Ding N. The impact of contact
angle on flow resistance reduction in hydrophobic micro pin fins. Exp
Therm Fluid Sci. 2016;77:197‐211.
19.Alaian WM, Elnegiry EA, Hamed AM. Experimental investigation on

36
References

the performance of solar still augmented with pin‐finned wick.

Desalination. 2016;379:10‐15.
20.Wan W, Deng D, Huang Q, Zeng T, Huang Y. Experimental study
and optimization of pin fin shapes in flow boiling of micro pin fin heat
sinks. Appl Therm Eng. 2017;114:436‐449.
21.Yang J, Li L, Yang L, Li J. Uniform design for the parameters
optimization of pin‐fins channel heat sink. Appl Therm Eng.
2017;120:289‐297.
22.Kirsch KL, Thole KA. Pressure loss and heat transfer performance for
additively and conventionally manufactured pin fin arrays. Int J Heat
Mass Transfer. 2017;108:2502‐2513.
23.Deng D, Wan W, Qin Y, Zhang J, Chu X. Flow boiling enhancement
of structured microchannels with micro pin fins. Int J Heat Mass
Transfer. 2017;105:338‐349.
24.Ali HM, Arshad A. Experimental investigation of n‐eicosane based
circular pin‐fin heat sinks for passive cooling of electronic devices. Int
J Heat Mass Transfer. 2017;112:649‐661.
25.Arshad A, Ali HM, Khushnood S, Jabbal M. Experimental
investigation of PCM based round pin‐fin heat sinks for thermal
management of electronics: effect of pin‐fin diameter. Int J Heat Mass
Transfer. 2018;117: 861‐872.
26.Zhang Y, Zhou J, Zhou W, Qi B, Wei J. CHF correlation of boiling in
FC‐72 with micro‐pin‐fins for electronics cooling. Appl Therm Eng.
2018;138:494‐500.
27.Zhang Y, Zhao J, Wei J, Xue Y. Nucleate pool boiling heat transfer on
micro‐pin‐finned surface in short‐ term microgravity. Heat Transfer
Eng. 2016;7632:594‐610.
28.Zhang Y, Liu B, Zhao J, Deng Y, Wei J. Experimental study of

37
References

subcooled flow boiling heat transfer on micro ‐pin‐finned surfaces in

short‐term microgravity. Exp Therm Fluid Sci. 2018;97:417‐430.
29.Zhang Y, Wei J, Kong X, Guo L. Confined submerged jet
impingement boiling of boiling of subcooled FC‐ 72 over micro‐pin‐
finned surfaces. Heat Transfer Eng. 2016;7632:269‐278.
30.Zhang Y, Liu B, Wei J, Sundén B, Wu Z. Heat transfer correlations
for jet impingement boiling over micro‐ pin‐finned surface. Int J Heat
Mass Transfer. 2018;126:401‐413.
31.Kong Xo, Zhang Y, Wei J. Experimental study of pool boiling heat
transfer on novel bistructured surfaces based on micro‐pin‐finned
structure. Exp Therm Fluid Sci. 2017;91:9‐19.
32.Kong X, Wei J, Deng Y, Zhang Y. A Study on Enhancement of
Boiling Heat Transfer by Mixed‐wettability Surface. Heat Transfer
Eng. 2018;39:1552‐1561.
https://doi.org/10.1080/01457632.2017.1369845
33.Liu B, Cao Z, Zhang Y, et al. Pool boiling heat transfer of N‐pentane
on micro/nanostructured surfaces. Int J Therm Sci. 2018;130:386‐394.
34.Liu B, Liu J, Zhou J, et al. Experimental study of subcooled boiling
pool heat transfer and its „hook back‟ phenomenon on
micro/nanostructured surfaces. Int Commun Heat Mass Transfer.
2019;100:73‐82.
35.Cao Z, Liu B, Preger C, et al. Pool boiling heat transfer of FC‐72 on
pin‐fin silicon surfaces with nano-particle deposition. Int J Heat Mass
Transfer. 2018;126:1019‐1033.
36.Zhou J, Zhang Y, Wei J. A modified bubble dynamics model for
predicting bubble departure diameter on micro‐pin‐finned surfaces
under microgravity. Appl Therm Eng. 2018;132:450‐462.
37.Zhang Y, Liu B, Liu Y, Yang Y, Wei J. Experimental study on pool

38
References

boiling heat transfer enhancement with micro/nanostructured surfaces.

Interfacial Phenom Heat Transfer. 2019;7(1):19‐31.
38.Liu B, Liu J, Zhang Y, Wei J, Wang W. Experimental and theoretical
study of pool boiling heat transfer and its CHF mechanism on
femtosecond laser processed surfaces. Int J Heat Mass Transfer.
2019;132:259‐270.
39.Zhang Y, Liu B, Zhao J, Deng Y, Wei J. Experimental study of
subcooled flow boiling heat transfer on a smooth surface in short‐term
microgravity. Microgravity Sci Technol. 2018;30:793‐805.
40.Awasarmol UV, Pise AT. An experimental investigation of natural
convection heat transfer enhancement from perforated rectangular fins
array at different inclinations. Exp Therm Fluid Sci. 2015;68:145‐154.
41.Shaeri MR, Bonner R. Laminar forced convection heat transfer from
laterally perforated‐finned heat sinks. Appl Therm Eng.
2017;116:406‐418.
42.Shaeri MR, Bonner R. Heat transfer and pressure drop in laterally
perforated‐finned heat sinks across different flow regimes. Int
Commun Heat Mass Transfer. 2017;87:220‐227.
43.Sakanova A. Heat transfer enhancement of perforated pin heat sink in
future aircraft applications. Appl Therm Eng. 2017;124:315‐326.
44.Tijani AS, Jaffri NB. Thermal analysis of perforated pin‐fins heat sink
under forced convection condition. Procedia Manuf. 2018;24:290‐298.
45.Pankaj S, Santosh B, Kishor K, Sarang J. Experimental investigation
of heat transfer by natural convection with perforated pin fin array.
Procedia Manuf. 2018;20:311‐317.
46.Park SH, Kim TH, Jeong JH. Experiental investigation of the
convective heat transfer coefficient for open‐cell porous metal fins at
low Reynolds numbers. Int J Heat Mass Transfer. 2016;100:608‐614.

39
References

47.Bilen K, Gok S, Olcay AB, Solmus I. Investigation of the effect of

aluminum porous fins on heat transfer. Energy. 2017;138:1187‐1198.
48.Selimefendigil F, Bayrak F, Oztop HF. Experimental analysis and
dynamic modeling of a photovoltaic module with porous fins.
Renewable Energy. 2018;125:193‐205
49.Tijani AS, Jaffri NB. Thermal analysis of perforated pin‐fins heat sink
under forced convection condition. Procedia Manuf. 2018;24:290‐298

convection condition

40
Appendix (A)
 Appendix

Appendix

Table (A-1) shown (h) value at different value of air velocity and various pin fins shapes

rectangular velocity power

h TH T air volt Am(current)
fin m/s w
30 30.86 22 0.648 0.492 12 0.041
33.8 28.85 22 1.024 0.492 12 0.041
35.5 25.99 22 1.418 0.492 12 0.041
cylinder velocity power
h TH T air volt Am(current)
fin m/s w
32.34 28 23.5 0.648 0.492 12 0.041
35.16 26.14 23.5 1.024 0.492 12 0.041
36.2 23.45 23.5 1.418 0.492 12 0.041
velocity power
cone fin h TH T air volt Am(current)
m/s w
33 27 24 0.648 0.492 12 0.041
36.9 24.5 24 1.024 0.492 12 0.041
37.38 22.8 24 1.418 0.492 12 0.041

Table (A-2) shown (Nu) values

Rectangular h Dh K air T air Nu
w/m2.k m w/m.k (c)
30 0.02354 0.02522 22 28
33.8 0.02354 0.02531 23.5 31.43
35.5 0.02354 0.02547 24 32.8
Cylindrical h Dh K air T air Nu
w/m2.k M w/m.k (c)
32.34 0.02354 0.02522 22 30.18
35.16 0.02354 0.02531 23.5 32.7
36.2 0.02354 0.02547 24 33.45
Cone h Dh K air T air Nu
w/m2.k M w/m.k (c)
33 0.02354 0.02522 22 30.8
36.9 0.02354 0.02531 23.5 34.31
37.38 0.02354 0.02547 24 34.54
Table (A-1) and table (A-2) shown calculation values of different types
of pin fins .