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如何推動高速光纖傳輸系統產業化技術 蔡高峰博士20200213

The document discusses high-speed fiber optic transmission systems and industry technology. It provides an overview of key optical and electrical components for different transmission distances, from access/front-haul to core/back-haul and data centers. It also examines the technology gaps that exist and whether companies should buy or develop their own components. Finally, it discusses the possible roadmap for photonic integrated circuit technologies and highlights challenges and areas that Taiwan's optical communications industry needs to breakthrough and strengthen.

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David Tsui
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404 views14 pages

如何推動高速光纖傳輸系統產業化技術 蔡高峰博士20200213

The document discusses high-speed fiber optic transmission systems and industry technology. It provides an overview of key optical and electrical components for different transmission distances, from access/front-haul to core/back-haul and data centers. It also examines the technology gaps that exist and whether companies should buy or develop their own components. Finally, it discusses the possible roadmap for photonic integrated circuit technologies and highlights challenges and areas that Taiwan's optical communications industry needs to breakthrough and strengthen.

Uploaded by

David Tsui
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

如何推動高速光纖傳輸系統

產業化技術
蔡高峰 博士
光通訊聯誼會 前會長

2020.2.13
X-Haul Optics and Electronics…
Access/Front-Haul Aggregation/Mid-Haul Core/Back-Haul +DCI
RU DU CU MEC Data Center
Core

⚫ <10/20Km ⚫ <40Km ⚫ <40-80Km~N*100Km ⚫ 80Km~N*100Km


⚫ Client Side: ⚫ Client Side: ⚫ Client Side: ⚫ Client Side:
➢ eCPRI: 25GE ➢ 10GE/25GE or ➢ 10GE/25GE or ➢ 25GE/50GE/100GE or
➢ CPRI: N*10G/25G, 1*100G ➢ N*25GE/50GE ➢ N*25GE/50GE/100GE ➢ N*100G/400G
⚫ Line Side: ⚫ Line Side: ⚫ Line Side: ⚫ Line Side:
➢ 10/25/100Gbps Grey light, or ➢ 25G/50G/100Gbps Grey ➢ 100G/200Gbps Grey ➢ 200G/400Gbps Grey
➢ N*25G/50Gbps WDM ➢ N*25G/50Gbps WDM ➢ N*100G WDM ➢ N*100G/ 200G/ 400Gbps WDM
Key Optical and Electrical components— Key O E components (O)— ➢ 200Gbps (PAM4): 4DFB-EML/PIN
➢ VCSEL/PIN; (O)FP-DFB/PIN; ➢ 25G: DFB/APD; ➢ 400Gbps (PAM4): 4DFB-EML/4PIN; 8DFB-EML/8PIN
➢ (O)CWDM--DFB/PIN; (C)EML or MZ/PIN; ➢ 50G: DFB/PIN, DFB-EML/PIN OTN(C):
➢ (O)4WDM: DFB/PIN; (O)PAM4: EML/PIN ➢ 50G: DFB-EML/APD, SOA+PIN ➢ PAM4: 2EML(DWDM)/2PIN; DP-QPSK/nQAM: ITLA/PIN

It is Technology Gap. Buy or Develop?


Key Optical components-- Key Electrical components--
➢ 25G SFP28: (IT)VCSEL, DFB, FP, DWDM-LD (Fixed or Tunable), EML or MZ ➢ 25G: DML LDD, TIA, LA, CDR
➢ 100Gbps: (IT)25G-VCSEL, 25G-DFB, 50G-EML, ➢ 100G: 4*25G DML-LDD, TIA. LA, CDR;
➢ 50Gbps: 25G-DFB, or EML, ➢ 100G: 50G EML LDD, TIA, LA, CDR, PAM4 Driver
➢ 200G/400Gbps: 25G-DFB or EML, 50G-DFB or EML ➢ 50G: 25G DML/EML-LDD, TIA, PAM4 Driver
➢ 100G(80Km): 2*50G PAM4 Modulator ➢ 200G/400G: 4/8*25G DML/EML LDD, TIA, PAM4 Driver
➢ 100G (>80km): 100G Coherent engine, ITLA ➢ 100G Coherent: 25G Mod-Driver, Coherent DSP
NG-PON2 Block Diagram w/ WDM-PON
Coherent
XR… <25G LDs are the only building block>
Possible Roadmap of Photonic Integrated Circuits (PICs)Technologies…

PICs
➢ Four major platforms: SiO2, LiNbO3, InP, Silicon Photonics (SiPh)
➢ Benefits:
• Reduction in the power consumption; Real-time monitoring of processes,
• Extremely high sensitivity levels; Miniaturization to be integrated.
➢ Applications:
• Data comm.: 100G to 400G, further to 800/1600G devices in switching and transmission,
• Sensing: LiDAR, Digital Imaging, Fiber Optic Sensors and Bio-Photonics
• Opportunities for Co-Packaging (CPO)
• Offer new manufacturing opportunities on SiPh, Optical Computing and Automotive SoCs

Pluggable On-Board Co-Packaged


Transceivers Optics (COBO) Optics (CPO)
Nature Photonics volume 12, pages447–450 (2018)
A chip-based Optical Frequency Comb source has now been successfully used to send
661 Tbps over 9.6 km of multicore fiber, bringing considerable savings in the energy
consumption and size of data transmission equipment.
台灣光通訊產業須突破與強化之處
台灣產業界現況 期待 挑戰 突破 強化
⚫ 光通速率: 已由 Mbps >> 1.25~10Gbps >> ⚫ 急需學研界在 ≥100Gbps 集成技術高度協助合作
100G~800Gbps >> 1.2~2.4Tbps >>…

技術面 ⚫ 技術: 已由 光電離散式組合 >> 光電子半導體 ⚫ 急需學研界在集成技術高度協助合作


集成 >> 光與電整合封裝 >> … ⚫ 矽集成芯片研發，學業與業界可共同於國際發表成果

市場面 本土市場太有限， ⚫ 美日歐高階產品重於技術論證，急需學研界共同在商


以美歐日為主，中國為輔 品上與國際大廠相當的論證，協助取得生意。以
Amazon, Google, Facebook, Microsoft等四超大型Data
研發面 缺少光通專業人才 (光電子與光子) Center業者為終極目標。
缺少極高頻電路設計人才 (100G~2.4Tbps)
缺少孰悉光通訊協定之韌/軟體人才

人才面 國內大學研究所未在光通信領域培育業界所需人才 ⚫ 政府獨立將光通及光電子產業項目，不再附屬於其他


如5G與光電產業。
⚫ 5年期研發案。增大每期專案補助經費。
⚫ 政府投資與鼓勵研發型民間企業，以集中研發力。

資料來源:傳承光電，2020/1
11
中美貿易戰及病毒對全球光通訊供應鏈的影響

資料來源:電子時報，2020/2
中國光電子器件產業技術發展路線圖

13
資料來源:2018-2022中國光電子器件產業技術發展路線圖，PIDA整理，2017/12
Thanks

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